Contact, inspection tool, inspection device, and method for manufacturing contact

Abstract

Provided are: a contactor which can be manufactured easily; an inspection jig and an inspection device using said contactor; and a method for manufacturing said contactor.　A contactor Pr is provided with a coil spring CS obtained by forming slits SL on a cylindrical body F; and first and second conductors P1, P2. A bottom wall part F4, a first lateral wall part F1, a second lateral wall part F2, and a top wall part F3 are configured such that a cross-sectional shape of the cylindrical body F when viewed in an axial direction becomes rectangular. The slits SL include a first slit SL1, a second slit SL2, a third slit SL3, and a fourth slit SL4. The third slit SL3 is contiguous to the first slit SL1 and the second slit SL2. The fourth slit SL4 is contiguous to the second slit SL2. In a side view of the cylindrical body F, the first slit SL1 and the second slit SL2 each have a rectangular shape. The first conductor P1 is connected to one end part Fx1 of the cylindrical body F. The second conductor P2 is connected to another end part Fx2 of the cylindrical body F.

Description

[Technical field]

[0001] The present invention relates to a contactor used for inspecting an object to be inspected, an inspection tool for bringing the contactor into contact with the object to be inspected, an inspection device including the inspection tool, and a method for manufacturing the contactor. [Background technology]

[0002] Conventionally, a coil spring probe has been known which comprises a contact pin having a contactor that contacts a conductive pad of an object to be measured, and a cylindrical body into which a cylindrical guide extending in a straight line with the contactor of the contact pin is inserted, with part of the peripheral wall of the body being a spring (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-24664 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, the semiconductor substrates and circuit substrates being measured have become increasingly finer. The inspection points on the objects being measured and the pitch between the inspection points have also become smaller. As a result, the diameter of the probes used for inspection has become approximately 0.1 mm.

[0005] However, to reduce the diameter to 0.1 mm using the above-mentioned coil spring probe, it is necessary to manually insert an even thinner cylindrical guide into a cylinder with a diameter of 0.1 mm, which is time-consuming.

[0006] An object of the present invention is to provide a contact that is easy to manufacture, an inspection jig and an inspection device that use the same, and a method for manufacturing the contact. [Means for solving the problem]

[0007] A contact according to one embodiment of the present invention comprises a coil spring having a slit formed in a cylindrical body, a generally rod-shaped first conductor, and a generally rod-shaped second conductor, the cylindrical body comprising a bottom wall portion, a first side wall portion and a second side wall portion each connected to the bottom wall portion, and a top wall portion opposite the bottom wall portion, the bottom wall portion, the first side wall portion, the second side wall portion, and the top wall portion are configured so that the cross-sectional shape of the cylindrical body when viewed in the axial direction is rectangular, the slits include a first slit provided in the first side wall portion, a second slit provided in the second side wall portion, a third slit provided in the top wall portion, and a fourth slit provided in the bottom wall portion, the third slit is connected to the first slit and the second slit, the fourth slit is connected to the second slit, the first slit and the second slit are rectangular in a side view of the cylindrical body, and the first conductor is connected to one end of the cylindrical body and the second conductor is connected to the other end of the cylindrical body.

[0008] Moreover, an inspection jig according to an embodiment of the present invention includes the above-mentioned contact and a support member that supports the contact.

[0009] Moreover, an inspection device according to one example of the present invention includes the above-mentioned inspection jig and an inspection processing unit that inspects the inspection object based on an electrical signal obtained by contacting the contactor with an inspection point provided on the inspection object.

[0010] A method for manufacturing a contact according to an embodiment of the present invention is a method for manufacturing the contact described above, in which the first side wall portion and the second side wall portion are formed after the bottom wall portion is formed. Effect of the Invention

[0011] The contactor, the inspection jig, and the inspection device having such a configuration are easy to manufacture. Furthermore, according to such a manufacturing method, the contactor can be easily manufactured. [Brief description of the drawings]

[0012] [Figure 1]1 is a conceptual diagram illustrating a schematic configuration of an inspection device 1 equipped with a contact Pr according to an embodiment of the present invention. [Diagram 2] 2 is a schematic cross-sectional view showing, in a simplified form, an example of the configuration of the inspection jig 3 shown in FIG. 1. [Diagram 3] 3 is a perspective view showing an example of the configuration of a contact Pr shown in FIG. 2. [Figure 4] 4 is a perspective view showing an example of the configuration of a coil spring CS shown in FIG. 3. [Diagram 5] 4 is a perspective view showing an example of the configuration of a first conductor P1 and a second conductor P2 shown in FIG. 3. FIG. [Figure 6] 11 is an explanatory diagram showing the relative positions of a first conductor P1 and a second conductor P2 when a load is applied to a coil spring CS and the coil spring CS is compressed. FIG. [Figure 7] 7 is a cross-sectional view showing a cross section of the contact Pr shown in FIG. 3 along line VII-VII. [Figure 8] 4 is an explanatory diagram for explaining an example of a manufacturing method of the contact Pr shown in FIG. 3. [Figure 9] 4 is an explanatory diagram for explaining an example of a manufacturing method of the contact Pr shown in FIG. 3. [Figure 10] FIG. 13 is an explanatory diagram showing a case where it is assumed that the first slits SL1 and the second slits SL2 are inclined. [Figure 11] 3 is a schematic cross-sectional view showing a state in which the inspection jig 3 shown in FIG. 2 is attached to a pitch conversion block 35. FIG. [Figure 12] 3 is a schematic cross-sectional view showing an inspection state in which the contact Pr shown in FIG. 2 is pressed against the bump BP. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals are used to denote the same configuration, and the description thereof will be omitted.

[0014] An inspection apparatus 1 shown in FIG. 1 is a semiconductor inspection apparatus for inspecting a circuit formed on a semiconductor wafer 101, which is an example of an object to be inspected.

[0015] In the semiconductor wafer 101, circuits corresponding to a plurality of semiconductor chips are formed on a semiconductor substrate such as silicon. Note that the object to be inspected may be an electronic component such as a semiconductor chip, a CSP (Chip Size Package), or a semiconductor element (IC: Integrated Circuit), or may be any other object that can be subjected to electrical inspection.

[0016] The inspection device is not limited to a semiconductor inspection device, and may be, for example, a substrate inspection device for inspecting a substrate. The substrate to be inspected may be, for example, a printed wiring board, a glass epoxy board, a flexible board, a ceramic multilayer wiring board, a package board for a semiconductor package, an interposer board, a film carrier, or the like, or may be an electrode plate for a display such as a liquid crystal display, an EL (Electro-Luminescence) display, or a touch panel display, or an electrode plate for a touch panel, or may be any of various substrates.

[0017] 1 includes an inspection unit 4, a sample stage 6, and an inspection processing unit 8. A mounting portion 6a on which a semiconductor wafer 101 is placed is provided on the upper surface of the sample stage 6, and the sample stage 6 is configured to fix the semiconductor wafer 101 to be inspected at a predetermined position.

[0018] The placement unit 6a is, for example, movable up and down, so that the semiconductor wafer 101 accommodated in the sample stage 6 can be raised to an inspection position, and the inspected semiconductor wafer 101 can be stored in the sample stage 6. The placement unit 6a is also, for example, capable of rotating the semiconductor wafer 101 to orient the orientation flat in a predetermined direction. The inspection device 1 is also provided with a transport mechanism such as a robot arm (not shown), and the transport mechanism is used to place the semiconductor wafer 101 on the placement unit 6a and to transport the inspected semiconductor wafer 101 out of the placement unit 6a.

[0019] The inspection unit 4 includes an inspection jig 3, a pitch conversion block 35, and a connection plate 37. The inspection jig 3 is a jig for inspecting the semiconductor wafer 101 by bringing a plurality of contacts Pr into contact with the semiconductor wafer 101, and is configured as, for example, a so-called probe card.

[0020] A plurality of chips are formed on the semiconductor wafer 101. A plurality of inspection points such as pads and bumps BP are formed on each chip. The inspection jig 3 holds a plurality of contacts Pr corresponding to a partial region (for example, a region shown by hatching in FIG. 1, hereinafter referred to as the inspection region) of the plurality of chips formed on the semiconductor wafer 101 so as to correspond to each inspection point in the inspection region.

[0021] When the inspection of the inspection area is completed by bringing the contact Pr into contact with each inspection point in the inspection area, the placement unit 6a lowers the semiconductor wafer 101, the sample stage 6 moves in parallel to move the inspection area, and the placement unit 6a raises the semiconductor wafer 101 to bring the contact Pr into contact with a new inspection area to perform the inspection. In this way, the inspection is performed while the inspection area is moved in sequence, thereby performing the inspection of the entire semiconductor wafer 101.

[0022] 1 is an explanatory diagram showing an example of the configuration of the inspection device 1 in a simplified and conceptual manner from the viewpoint of facilitating understanding of the invention, and the number, density, and arrangement of the contacts Pr, as well as the shapes and size ratios of the various parts of the inspection unit 4 and the sample stage 6, are also shown in a simplified and conceptualized manner. For example, from the viewpoint of facilitating understanding of the arrangement of the contacts Pr, the inspection area is shown to be larger than that of a typical semiconductor inspection device, but the inspection area may be smaller or larger.

[0023] The connection plate 37 is configured so that the pitch conversion block 35 can be detachably attached. A plurality of electrodes (not shown) that are connected to the pitch conversion block 35 are formed on the connection plate 37. Each electrode of the connection plate 37 is electrically connected to the inspection processing unit 8 by, for example, a cable or a connection terminal (not shown). The pitch conversion block 35 is a pitch conversion member for converting the interval between the contacts Pr into the electrode pitch of the connection plate 37.

[0024] The inspection jig 3 includes a plurality of contacts Pr each having a tip portion T and a base portion B, which will be described later, and a support member 31 that holds the plurality of contacts Pr with the tip portions T facing the semiconductor wafer 101.

[0025] The pitch conversion block 35 is provided with electrodes 34a (described later) that are in contact with and conductive with the base ends B of the contacts Pr. The inspection unit 4 is provided with a connection circuit (not shown) that electrically connects each contact Pr of the inspection jig 3 to the inspection processing unit 8 via the connection plate 37 and the pitch conversion block 35 and switches the connection.

[0026] This enables the inspection processing unit 8 to supply an inspection signal to any of the contacts Pr and detect a signal from any of the contacts Pr via the connection plate 37 and the pitch conversion block 35.

[0027] The inspection processing unit 8 includes, for example, a power supply circuit, a voltmeter, an ammeter, and a microcomputer. The inspection processing unit 8 controls a drive mechanism (not shown) to move and position the inspection unit 4, and brings each contact Pr into contact with each inspection point on the semiconductor wafer 101. This electrically connects each inspection point to the inspection processing unit 8.

[0028] In the above-mentioned state, the inspection processing unit 8 supplies an inspection current or voltage to each inspection point on the semiconductor wafer 101 via each contact Pr of the inspection jig 3, and performs an inspection of the semiconductor wafer 101 for, for example, breaks or shorts in the circuit pattern based on an electric signal such as a voltage or current obtained from each contact Pr. Alternatively, the inspection processing unit 8 may measure the impedance of the inspection target based on an electric signal such as a voltage or current obtained from each contact Pr by supplying an AC current or voltage to each inspection point.

[0029] 2 is formed by stacking, for example, plate-shaped support plates 311, 312. A plurality of through holes H are formed penetrating the support plates 311, 312. Each through hole H is a rectangular hole having a substantially square cross section perpendicular to the axial direction. A contact Pr is inserted into each through hole H.

[0030] A plurality of insertion holes Hb each having a predetermined diameter are formed in the support plate 312. A support hole Ha having a smaller diameter than the insertion holes Hb is formed in the support plate 311. The insertion holes Hb of the support plate 312 and the support holes Ha of the support plate 311 are connected to each other to form a through hole H.

[0031] The support plate 312 may be formed by stacking a plurality of support plates. Also, instead of the support plate 312, a configuration in which a plurality of support plates are spaced apart from each other and connected by, for example, supports may be used. Also, the support member 31 is not limited to an example in which the plate-like support plates 311, 312 are stacked, and may be formed, for example, by a configuration in which the through hole H is provided in an integrated member.

[0032] A pitch conversion block 35 made of, for example, an insulating resin material is attached to one end of the support plate 312, and the opening of one end of the through hole H is closed by this pitch conversion block 35 (see FIG. 11). Wiring 34 is attached to the pitch conversion block 35 at a position facing the opening of the through hole H so as to pass through the pitch conversion block 35.

[0033] The surface of the pitch conversion block 35 facing the support plate 312 is set to be flush with the end faces of the wires 34. The end faces of the wires 34 are electrodes 34a. Each wire 34 is connected to each electrode of the connection plate 37 while expanding the pitch. The pitch conversion block 35 may be configured using a multilayer wiring board such as MLO (Multi Layer Organic) or MLC (Multi Layer Ceramic) instead of the wires 34.

[0034] Referring to Fig. 3, the contact Pr includes a coil spring CS, a first conductor P1, and a second conductor P2. In each figure, XYZ orthogonal coordinate axes are appropriately shown to clarify the directional relationship. In each figure, the axial direction of the contact Pr (coil spring CS, first conductor P1, and second conductor P2) facing the horizontal direction is the X direction, the direction perpendicular to the X direction and horizontal is the Y direction, and the direction perpendicular to the X and Y directions is the Z direction.

[0035] The coil spring CS, the first conductor P1, and the second conductor P2 are made of a conductive material such as Ni, NiCo, a nickel alloy, Pd, etc. As described later, the first conductor P1 and the second conductor P2 are embedded with a material having a higher conductivity than the above-mentioned Ni, such as copper.

[0036] Referring to FIG. 4, the coil spring CS shown in FIG. 3 is coiled by a slit SL extending spirally along the peripheral wall of a cylindrical body F having a rectangular cylindrical shape in cross section perpendicular to the axial direction.

[0037] The slit SL is formed by connecting a first slit SL1, a third slit SL3, a second slit SL2, and a fourth slit SL4.

[0038] The peripheral wall of the cylindrical body F includes a first side wall portion F1 and a second side wall portion F2 opposed to each other, and a top wall portion F3 and a bottom wall portion F4 extending between the first side wall portion F1 and the second side wall portion F2. That is, the first side wall portion F1 and the second side wall portion F2 are each connected to the bottom wall portion F4. As a result, the bottom wall portion F4, the first side wall portion F1, the second side wall portion F2, and the top wall portion F3 are configured so that the cross-sectional shape of the cylindrical body F when viewed in the axial direction is rectangular.

[0039] The first side wall portion F1, the second side wall portion F2, the top wall portion F3, and the bottom wall portion F4 have a substantially flat shape. The first side wall portion F1 and the second side wall portion F2 extend along the XZ plane. The top wall portion F3 and the bottom wall portion F4 extend along the XY plane.

[0040] The first slit SL1 is formed in the first side wall portion F1 and extends perpendicular to the axial direction. The second slit SL2 is formed in the second side wall portion F2 and extends perpendicular to the axial direction. That is, the first slit SL1 and the second slit SL2 extend along the Z direction. In a side view of the cylindrical body F, the first slit SL1 and the second slit SL2 are rectangular.

[0041] The third slit SL3 is formed in the top wall portion F3 and extends obliquely with respect to the axial direction. The third slit SL3 connects the first slit SL1 and the second slit SL2.

[0042] The fourth slit SL4 is formed in the bottom wall portion F4 and extends at an angle to the axial direction. The fourth slit SL4 connects the second slit SL2 and the first slit SL1. The third slit SL3 and the fourth slit SL4 are perpendicular to the Z direction and are inclined with respect to the X direction and the Y direction.

[0043] The top wall portion F3 and the bottom wall portion F4 have one end provided with a fixing portion Fx1 that is fixed to the first portion P1b. The top wall portion F3 and the bottom wall portion F4 have the other end provided with a fixing portion Fx2 that is fixed to the second portion P2b. The thickness t1 of the fixing portion Fx1 and the thickness t2 of the fixing portion Fx2 are greater than the thickness t3 of the top wall portion F3 and the bottom wall portion F4 near the center of the coil spring CS.

[0044] 5, the first conductor P1 and the second conductor P2 have a generally rod-like shape. The tip of the first conductor P1 becomes a tip portion T of the contact Pr. The tip of the second conductor P2 becomes a base end portion B of the contact Pr.

[0045] The first conductor P1 is configured by connecting a first portion P1b located inside one end side of the coil spring CS and a first protruding portion P1a protruding from one end of the coil spring CS. A fixing region P1c is provided in the first portion P1b near the boundary with the first protruding portion P1a.

[0046] The fixing region P1c is fixed to the fixing portion Fx1 at one end of the coil spring CS shown in Fig. 4. As a result, the portion of the first portion P1b other than the fixing region P1c is formed inside the coil spring CS with a gap corresponding to the difference between the thickness t1 and the thickness t3 from the top wall portion F3 and the bottom wall portion F4. As described later, the coil spring CS and the first conductor P1 are integrally formed. As a result, the coil spring CS and the first conductor P1 are connected in an integral and continuous state at the fixing portion Fx1 and the fixing region P1c.

[0047] The tip of the first part P1b is provided with a first cutout N1 having one side cut out. The first cutout N1 has a substantially flat first contact surface NF1 extending along the axial direction. A first tapered portion TP1 is formed at the tip of the first cutout N1 and continues to the first contact surface NF1. The first tapered portion TP1 is configured to become thinner toward the tip of the first part P1b.

[0048] The first notch N1 is recessed in the Y direction. The first contact surface NF1 extends along the XZ plane. The first tapered portion TP1 extends in the Z direction and is inclined with respect to the X and Y directions in a direction away from the second conductor P2.

[0049] The second conductor P2 is configured by connecting a second portion P2b located inside the other end side of the coil spring CS and a second protruding portion P2a protruding from the other end of the coil spring CS. A fixing region P2c is provided in the second portion P2b near the boundary with the second protruding portion P2a.

[0050] The fixing region P2c is fixed to the fixing portion Fx2 at the other end of the coil spring CS shown in Fig. 4. As a result, the portion of the second portion P2b other than the fixing region P2c is inserted into the coil spring CS with a gap corresponding to the difference between the thickness t2 and the thickness t3 from the top wall portion F3 and the bottom wall portion F4. As described later, the coil spring CS and the second conductor P2 are integrally formed. As a result, the coil spring CS and the second conductor P2 are connected in an integral, continuous state at the fixing portion Fx2 and the fixing region P2c.

[0051] The tip of the second portion P2b is provided with a second cutout N2 having one side cut out. The second cutout N2 has a substantially flat second contact surface NF2 extending along the axial direction. A second tapered portion TP2 is formed at the tip of the second cutout N2 and continues to the second contact surface NF2. The second tapered portion TP2 is configured to become thinner toward the tip of the second portion P2b.

[0052] The second cutout portion N2 is recessed in the Y direction in the opposite direction to the first cutout portion N1. The second contact surface NF2 extends along the XZ plane. The second tapered portion TP2 extends in the Z direction and is inclined with respect to the X and Y directions in a direction away from the first conductor P1.

[0053] The tip end of the second protrusion P2a, i.e., the base end B of the contact Pr, has a center in the Z direction that protrudes further than both sides in the Z direction. The tip end T and the base end B of the contact Pr may be flat, or may have various shapes suitable for contact with the test point or the electrode 34a, such as a crown shape or a cone shape.

[0054] The first conductor P1 has a rectangular cross-sectional shape perpendicular to the axial direction in a portion other than the first notch N1, and the second conductor P2 has a rectangular cross-sectional shape perpendicular to the axial direction in a portion other than the second notch N2. The length of one side of this cross-sectional shape is slightly shorter than the length of one side of the inner wall of the coil spring CS in the cross-sectional shape perpendicular to the axial direction. By making the cross-sectional shape rectangular in this way, the cross-sectional areas of the first conductor P1 and the second conductor P2 can be increased compared to a contact with a circular cross-section, and the electrical resistance of the first conductor P1 and the second conductor P2 can be reduced.

[0055] 5 shows the relative positions of the first conductor P1 and the second conductor P2 when no load is applied to the coil spring CS and the coil spring CS is not compressed. When no load is applied to the coil spring CS, the first contact surface NF1 and the second contact surface NF2 are spaced apart, and the first tapered portion TP1 and the second tapered portion TP2 are disposed facing each other with a space therebetween. The first contact surface NF1 and the second contact surface NF2 are located in the same plane.

[0056] 3, when a load is applied between the tip end T and the base end B, the coil spring CS is compressed. Since the first conductor P1 and the second conductor P2 are fixed to the coil spring CS at fixing regions P1c and P2c, when the coil spring CS is compressed, the first conductor P1 and the second conductor P2 move relatively toward each other in the approaching direction as shown in FIG.

[0057] At this time, the first contact surface NF1 and the second contact surface NF2 are located in the same plane, so that the first contact surface NF1 and the second contact surface NF2 slide against each other. In this way, when a predetermined load is applied to the coil spring CS, the first contact surface NF1 and the second contact surface NF2 come into contact with each other.

[0058] When no load is applied to the coil spring CS, the first taper portion TP1 and the second taper portion TP2 are disposed opposite to each other with a space therebetween, and when the coil spring CS is compressed from this state, the first taper portion TP1 and the second taper portion TP2 guide the relative position of the first contact surface NF1 and the second contact surface NF2 to a slidable position.

[0059] This allows the first contact surface NF1 and the second contact surface NF2 to slide smoothly and contact each other stably, improving the reliability of electrical continuity from the tip end T to the base end B.

[0060] 3, when no load is applied, the total length L of the contact Pr is, for example, about 1.15 mm, and the length Lc of the coil spring CS is, for example, about 0.6 mm. The length L1a of the first protrusion P1a is, for example, about 0.4 mm, and the length L2a of the second protrusion P2a is, for example, about 0.15 mm. The width Wy in the Y direction of the first conductor P1 and the second conductor P2 is, for example, about 0.068 mm, and the width Wz in the Z direction is, for example, about 0.068 mm.

[0061] 4, the coil spring CS has a width Wcy in the Y direction of about 0.1 mm, and a width Wcz in the Z direction of about 0.1 mm. The coil spring CS has a line width Wf along the X direction of about 0.08 mm. The slit SL has a width Ws in the X direction of about 0.04 mm when no load is applied.

[0062] 7, first and second inner conductors P1d and P2d made of a material having a higher conductivity than the material constituting the outer shell are embedded inside the first and second conductors P1 and P2. An outer portion of the first conductor P1 that encloses the first inner conductor P1d corresponds to a first outer conductor P1e. ​​An outer portion of the second conductor P2 that encloses the second inner conductor P2d corresponds to a second outer conductor P2e.

[0063] The first inner conductor P1d is located closer to the center than the first outer conductor P1e when viewed in the axial direction of the cylindrical body F. The second inner conductor P2d is located closer to the center than the second outer conductor P2e when viewed in the axial direction of the cylindrical body F.

[0064] The resistance value of the first and second inner conductors P1d, P2d is lower than the resistance value of the first and second outer conductors P1e, P2e. When the above-mentioned Ni or the like is used for the first and second outer conductors P1e, P2e, the first and second inner conductors P1d, P2d can be made of, for example, copper. This can reduce the electrical resistance of the contact Pr.

[0065] Next, a method for manufacturing the contact Pr according to an embodiment of the present invention will be described. As the method for manufacturing the contact Pr, various manufacturing techniques can be used, such as MEMS (Micro Electro Mechanical Systems) including exposure, plating, polishing, etc., semiconductor manufacturing process, electroforming, and three-dimensional molding using a 3D printer.

[0066] 8, first, Ni or the like is deposited horizontally in a strip shape along the X direction by electroforming or the like until it reaches a thickness t3, and then a plurality of fourth slits SL4 are formed by, for example, etching. As a result, a bottom wall portion F4 is formed horizontally as the first layer L1.

[0067] Next, Ni or the like is laminated on both ends of the bottom wall portion F4 in the X direction and both ends of the bottom wall portion F4 in the Y direction on the first layer L1 until the thickness reaches t1, t2. As a result, the first side wall portion F1 and a part of the second side wall portion F2 and the fixing portions Fx1, Fx2 are formed as the second layer L2.

[0068] Next, Ni or the like is laminated on the second layer L2 to form a part of the first conductor P1 and the second conductor P2, and the first side wall portion F1 and the second side wall portion F2 are grown in the Z direction to form the third layer L3. The first conductor P1 and the second conductor P2 are integrally formed by being connected with the fixing regions P1c and P2c fixed to the fixing portions Fx1 and Fx2.

[0069] Next, Ni or the like is laminated on the third layer L3 to grow the first conductors P1 and the second conductors P2 and the first side wall portion F1 and the second side wall portion F2 in the Z direction. This forms the fourth layer L4-1. In the fourth layer L4-1, the outer edges of the first conductors P1 and the second conductors P2 are raised to form cavities C1 and C2 inside the first conductors P1 and the second conductors P2.

[0070] Next, as the fourth layer L4-2, the cavities C1 and C2 are filled with a material having a higher conductivity than Ni, such as copper. This forms the first and second inner conductors P1d and P2d. The first and second inner conductors P1d and P2d may be, for example, copper used as a sacrificial layer remaining in the cavities C1 and C2.

[0071] 9, Ni or the like is laminated on the fourth layer L4-2 to form the first conductors P1 and the second conductors P2. The first side wall portion F1 and the second side wall portion F2 are grown in the Z direction to form the fifth layer L5.

[0072] Next, Ni or the like is laminated on the fifth layer L5 to form a fixing portion Fx1 on the fixing region P1c of the first conductor P1, and a fixing portion Fx2 on the fixing region P2c of the second conductor P2. The first side wall portion F1 and the second side wall portion F2 are grown in the Z direction. This forms the sixth layer L6. In the sixth layer L6, the first conductor P1 and the second conductor P2 are also integrally formed by being connected with the fixing region P1c and the fixing region P2c fixed to the fixing portions Fx1 and Fx2.

[0073] Next, Ni or the like is laminated on the sixth layer L6 to form the top wall portion F3, thereby forming the seventh layer L7, thereby completing the contact Pr.

[0074] According to the configuration of the contact Pr, by laminating the first layer L1 to the seventh layer L7, it is easy to manufacture the contact Pr in a state where the first portion P1b and the second portion P2b are pre-inserted into the coil spring CS. Therefore, the contact Pr does not require manual insertion of a cylindrical guide into the cylindrical body of a fine coil spring, as in the probe described in Patent Document 1. As a result, the contact Pr is easier to manufacture than the probe described in Patent Document 1.

[0075] According to the above manufacturing method, the first layer L1 to the seventh layer L7 are stacked, and a material such as copper or Ni is stacked vertically on the horizontally formed bottom wall portion F4 to manufacture the contact Pr. In this case, the extending direction of the first slit SL1 and the second slit SL2 coincides with the stacking direction. As a result, the outer edges of the first slit SL1 and the second slit SL2 become smooth, and the strength of the coil spring CS is improved.

[0076] Specifically, if the first slit SL1 and the second slit SL2 were inclined, steps would be formed in each of the first layer L1 to the seventh layer L7, as in the slit SL' shown in FIG. 10. This would result in jagged edges, as in the slit SL'. When jagged edges are formed in this way, the width of the spring portion becomes non-uniform, and the minimum width of the spring portion becomes smaller than when the outer edge of the slit is smooth. Furthermore, the force applied to the spring portion also becomes non-uniform. As a result, the strength of the coil spring CS decreases.

[0077] That is, since the coil spring CS has a first slit SL1 formed in the first side wall portion F1 and extending perpendicular to the axial direction, and a second slit SL2 formed in the second side wall portion F2 and extending perpendicular to the axial direction, the contact Pr can be easily manufactured while suppressing a decrease in the strength of the coil spring CS.

[0078] In the process of laminating the third layer L3 to the fifth layer L5, the first taper portion TP1 and the second taper portion TP2 grow vertically along the surface direction. Therefore, for the same reason as the first slit SL1 and the second slit SL2, the first taper portion TP1 and the second taper portion TP2 are formed smoothly without being jagged.

[0079] As a result, the first tapered portion TP1 and the second tapered portion TP2 can smoothly slide against each other, thereby guiding the first contact surface NF1 and the second contact surface NF2 so that they slide against each other.

[0080] In the contact Pr, the surface direction in which the first tapered portion TP1 and the second tapered portion TP2 extend is along the Z direction and along the direction in which the first slit SL1 and the second slit SL2 extend. As a result, by forming the bottom wall portion F4 horizontally as the first layer L1 and stacking the second layer L2 to the seventh layer L7 thereon, it is possible to simultaneously form the first slit SL1 and the second slit SL2 with smooth outer edges and the smooth and flat first tapered portion TP1 and the second tapered portion TP2.

[0081] Furthermore, since the cross-sectional shapes perpendicular to the axial direction of the first conductor P1, the second conductor P2, and the coil spring CS are approximately rectangular, the wall surfaces of the first conductor P1, the second conductor P2, and the coil spring CS can be formed more smoothly in the process of stacking the first layer L1 to the seventh layer L7, compared to when the cross-sectional shapes are circular.

[0082] Furthermore, if the coil spring CS were structured so that the first tapered portion TP1 and the second tapered portion TP2, or the first contact surface NF1 and the second contact surface NF2, were in contact when no load was applied to the coil spring CS, the first conductor P1 and the second conductor P2 would not be separated and would become one component when the third layer L3 to the fifth layer L5 were stacked.

[0083] However, when no load is applied to the coil spring CS, the first tapered portion TP1 and the second tapered portion TP2 of the contact Pr are disposed facing each other with a space therebetween, and the first contact surface NF1 and the second contact surface NF2 are spaced apart. As a result, when the third layer L3 to the fifth layer L5 are laminated, the first conductor P1 and the second conductor P2 can be manufactured as separate members.

[0084] The contact Pr does not need to include the fixing parts Fx1, Fx2, and does not need to form the second layer L2 and the sixth layer L6. In the third layer L3 to the fifth layer L5, the first side wall part F1 and the second side wall part F2 in the vicinity of both ends of the coil spring CS (parts surrounded by dashed lines in Figs. 8 and 9) may be connected to the first conductor P1 and the second conductor P2.

[0085] 2, before the inspection jig 3 is attached to the pitch conversion block 35, the second conductor P2 slightly protrudes from the support plate 312. Then, as shown in Fig. 11, when the support plate 312 is attached to the pitch conversion block 35, the upper end of the second conductor P2, i.e., the base end B of the contact Pr, is pressed against the electrode 34a of the pitch conversion block 35.

[0086] As a result, the coil spring CS of the contact Pr is compressed and elastically deformed. The second conductor P2 is pushed into the support member 31 against the biasing force of the coil spring CS. Then, the tip end of the second conductor P2, i.e., the base end B, is pressed against the electrode 34a in response to the biasing force of the coil spring CS. As a result, the base end B of the contact Pr and the electrode 34a are maintained in stable conductive contact.

[0087] In this state, it is preferable that the first contact surface NF1 of the first conductor P1 and the second contact surface NF2 of the second conductor P2 are in contact with each other as shown in Fig. 11. Even when the bump BP is not in contact with the contact Pr, the first contact surface NF1 and the second contact surface NF2 are kept in contact with each other, so that the resistance value of the contact Pr from the tip end T to the base end B is stably kept low.

[0088] However, in a state in which the bump BP is not in contact with the contactor Pr, the first contact surface NF1 and the second contact surface NF2 do not necessarily need to be in contact with each other.

[0089] As shown in FIG. 12, when the inspection jig 3 is pressed against the semiconductor wafer 101, the tip portions T of the contacts Pr are pressed against the bumps BP of the semiconductor wafer 101.

[0090] As a result, the coil spring CS of the contact Pr is further compressed and elastically deformed. The first conductor P1 is pressed into the support member 31 against the biasing force of the coil spring CS. Then, the tip of the first conductor P1, i.e., the tip portion T, is pressed against the bump BP in response to the biasing force of the coil spring CS. As a result, the tip portion T of the contact Pr and the bump BP are maintained in a stable conductive contact state.

[0091] In this state, the first contact surface NF1 of the first conductor P1 and the second contact surface NF2 of the second conductor P2 are in contact with each other as shown in Fig. 12. This allows the resistance value of the contact Pr from the tip end T to the base end B to be low during testing.

[0092] The cross-sectional shapes perpendicular to the axial direction of the first conductors P1 and the second conductors P2 are not necessarily limited to rectangular shapes, and may be substantially circular shapes. The planar direction in which the first contact surface NF1 and the second contact surface NF2 extend does not necessarily have to coincide with the direction in which the first slits SL1 and the second slits SL2 extend.

[0093] In addition, the first and second tapered portions TP1 and TP2 do not necessarily have to be formed at the tips of the first and second conductors P1 and P2. The first and second contact surfaces NF1 and NF2 only need to be in contact with each other during inspection, and are not necessarily required to be located in the same plane.

[0094] Furthermore, the contact Pr does not necessarily have to include the second conductor P2. The first conductor P1 does not necessarily have to have the first notch N1.

[0095] That is, a contact according to one embodiment of the present invention comprises a coil spring having a slit formed in a cylindrical body, a generally rod-shaped first conductor, and a generally rod-shaped second conductor, the cylindrical body comprising a bottom wall portion, a first side wall portion and a second side wall portion each connected to the bottom wall portion, and a top wall portion facing the bottom wall portion, the bottom wall portion, the first side wall portion, the second side wall portion, and the top wall portion are configured so that the cross-sectional shape of the cylindrical body when viewed in the axial direction is rectangular, the slits include a first slit provided in the first side wall portion, a second slit provided in the second side wall portion, a third slit provided in the top wall portion, and a fourth slit provided in the bottom wall portion, the third slit is connected to the first slit and the second slit, the fourth slit is connected to the second slit, the first slit and the second slit are rectangular in a side view of the cylindrical body, and the first conductor is connected to one end of the cylindrical body, and the second conductor is connected to the other end of the cylindrical body.

[0096] According to this configuration, the coil spring has a spiral slit along the peripheral wall of the cylindrical body, with the first slit, the third slit, the second slit, and the fourth slit communicating with each other. The spiral slit forms a coil spring with a rectangular cross section perpendicular to the axial direction. A first conductor having a substantially rod shape is connected to one end of the coil spring. The contactor having such a shape can form the first slit and the second slit in the vertical direction along the stacking direction by stacking materials on the bottom wall part with the axial direction of the contactor horizontal. The shape extending along the stacking direction can be smoothly formed. Furthermore, stacking makes it easy to manufacture the coil spring and the first conductor as one unit. Therefore, unlike the probe described in Patent Document 1, the work of manually inserting the contactor into the coil spring is not required, and such a contactor is easy to manufacture.

[0097] Further, the first conductor has a first portion located inside the cylindrical body and a first protruding portion protruding from one end of the cylindrical body, the second conductor has a second portion located inside the cylindrical body and a second protruding portion protruding from the other end of the cylindrical body, the first portion has a first contact surface extending along the axial direction of the cylindrical body, the second portion has a second contact surface located in the same plane as the first contact surface, the first contact surface and the second contact surface are separated when no load is applied to the coil spring, and the first contact surface and the second contact surface come into contact when a load is applied to the coil spring.

[0098] According to this configuration, the first and second contact surfaces are separated when no load is applied to the coil spring, so that when manufacturing the contact by stacking materials, it is easy to manufacture the first conductor and the second conductor as separate members. Also, when a predetermined load is applied to the coil spring, the first and second contact surfaces come into contact with each other, so that the first and second conductors are electrically conductive through surface contact. As a result, the resistance value of the contact from the first conductor to the second conductor is reduced during testing when a load is applied to the contact.

[0099] Further, it is preferable that a surface direction of the first contact surface is perpendicular to a surface direction of the bottom wall portion.

[0100] According to this configuration, the planar direction in which the first and second contact surfaces extend and the direction in which the first and second slits extend can be made to coincide with the stacking direction. When manufactured, it becomes easy to form the first and second contact surfaces smoothly in accordance with the shape of the first and second slits.

[0101] It is also preferable that a first tapered portion is formed in the first portion and a second tapered portion is formed in the second portion, the first tapered portion being configured to become thinner toward the tip of the first portion, and the second tapered portion being configured to become thinner toward the tip of the second portion.

[0102] According to this configuration, when a load is applied to the contact and the coil spring is compressed, the first tapered portion and the second tapered portion can guide the first contact surface and the second contact surface to slide against each other by inclining relative to each other.

[0103] It is also preferable that the portion has a rectangular cross-sectional shape when viewed in the axial direction of the cylindrical body.

[0104] With this configuration, the conductor area of ​​the cross section perpendicular to the axial direction of the first portion can be increased compared to a circular shape, making it easy to reduce the resistance of the contact. Also, when manufacturing the contact by lamination, it becomes easy to form a smooth outer circumferential surface of the first portion.

[0105] Furthermore, it is preferable that the first conductor has a first inner conductor and a first outer conductor, the first inner conductor has a portion that is located closer to the center of the cylindrical body than the first outer conductor when viewed in the axial direction, and the resistance value of the first inner conductor is lower than the resistance value of the first outer conductor.

[0106] According to this configuration, since the first conductor has the first inner conductor having a lower resistance than the first outer conductor, it is easy to reduce the resistance value of the first conductor.

[0107] Moreover, an inspection jig according to an embodiment of the present invention includes the above-mentioned contact and a support member that supports the contact.

[0108] According to this configuration, the inspection jig is constructed using contacts that are easy to manufacture, so that the inspection jig can be easily manufactured.

[0109] Moreover, an inspection device according to one example of the present invention includes the above-mentioned inspection jig and an inspection processing unit that inspects the inspection object based on an electrical signal obtained by contacting the contactor with an inspection point provided on the inspection object.

[0110] According to this configuration, the inspection device is constructed using contacts that are easy to manufacture, so that the inspection device can be easily manufactured.

[0111] A method for manufacturing a contact according to an embodiment of the present invention is a method for manufacturing the contact described above, in which the first side wall portion and the second side wall portion are formed after the bottom wall portion is formed.

[0112] According to this method, the above-mentioned contact can be easily manufactured. [Explanation of symbols]

[0113] 1. Inspection equipment 3 Inspection fixture 4. Inspection Department 6 Sample stage 6a Placement part 8 Inspection processing section 31 Support member 34 Wiring 34a electrode 35 Pitch Conversion Block 37 Connection plate 101 Semiconductor wafer (inspection object) 311,312 Support plate B Proximal end BP Bump (Test Point) C1,C2 cavity F Cylindrical body F1 First side wall part F2 Second side wall part F3 Top wall F4 Bottom wall Fx1, Fx2 fixing part H through hole Ha support hole Hb insertion hole L1 First layer L2 second layer L3 third layer L4-1,L4-2 Fourth layer L5 5th layer L6 6th layer L7 Seventh layer N1 First cutout N2 Second notch NF1 First contact surface NF2 Second contact surface P1 First conductor P1a First protrusion P1b Part 1 P1c,P2c fixed area P1d First inner conductor P1e First outer conductor P2 Second conductor P2a Second protrusion P2b Part 2 P2c fixation area P2d Second inner conductor P2e Second outer conductor Pr contact SL' Slit SL1 First slit SL2 Second slit SL3 Third slit SL4 Fourth slit T tip TP1 First taper section TP2 Second taper section Wcy, Wcz, Ws, Wy, Wz Width Wf Line width

Claims

1. A coil spring having a slit formed in a cylindrical body; A first conductor having a substantially rod shape; A substantially rod-shaped second conductor; The cylindrical body includes a bottom wall portion, a first side wall portion and a second side wall portion each connected to the bottom wall portion, and a top wall portion facing the bottom wall portion, The bottom wall portion, the first side wall portion, the second side wall portion, and the top wall portion are configured so that a cross-sectional shape of the cylindrical body as viewed in the axial direction is rectangular, the slits include a first slit provided in the first side wall portion, a second slit provided in the second side wall portion, a third slit provided in the top wall portion, and a fourth slit provided in the bottom wall portion; the third slit is connected to the first slit and the second slit, The fourth slit is continuous with the second slit, The first conductor is connected to one end of the cylindrical body, The second conductor is connected to the other end of the cylindrical body, The first slit and the second slit extend perpendicular to the axial direction, The third slit and the fourth slit extend obliquely with respect to the axial direction, The contact is formed by stacking in a direction in which the first slit extends.

2. The first conductor is A first portion located inside the cylindrical body; A first protrusion protruding from one end of the cylindrical body, The second conductor is A second portion located inside the cylindrical body; A second protruding portion protruding from the other end of the cylindrical body, The portion includes a first contact surface extending along an axial direction of the cylindrical body, the second portion includes a second contact surface coplanar with the first contact surface; The contactor according to claim 1 , wherein the first contact surface and the second contact surface are spaced apart when no load is applied to the coil spring, and the first contact surface and the second contact surface are in contact when a load is applied to the coil spring.

3. The contact according to claim 2 , wherein a surface direction of the first contact surface is perpendicular to a surface direction of the bottom wall portion.

4. The portion includes a first tapered portion, The second portion is configured with a second tapered portion, The first tapered portion is configured to have a thickness that decreases toward a tip end of the portion, 4. The contact according to claim 2, wherein the second tapered portion is configured so that the thickness thereof decreases toward the tip of the second portion.

5. 5. The contact according to claim 1, wherein at least a portion of the first conductor has a rectangular cross-sectional shape as viewed in the axial direction of the cylindrical body.

6. The first conductor has a first inner conductor and a first outer conductor, the first inner conductor has a portion located closer to a center than the first outer conductor when viewed in the axial direction of the cylindrical body, 6. The contact according to claim 1, wherein a resistance value of the first inner conductor is lower than a resistance value of the first outer conductor.

7. The contact according to any one of claims 1 to 6, and a support member for supporting the contact.

8. The inspection jig according to claim 7 ; an inspection processing unit that inspects the inspection object based on an electrical signal obtained by bringing the contactor into contact with an inspection point provided on the inspection object.

9. A method for manufacturing the contact according to any one of claims 1 to 6, comprising the steps of: A method of manufacturing a contact, comprising forming the bottom wall portion and then forming the first side wall portion and the second side wall portion.

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