Burn-in board and burn-in device

Abstract

To provide a burn-in board with which it is possible to suppress a decrease in the quality of burn-in test, even when the number of sockets increases.SOLUTION: A burn-in board 20 comprises: a substrate 40; a plurality of sockets 70A1 thru 70T20 mounted to the substrate 40; a connector 80 mounted to the substrate 40; and a plurality of wiring systems provided to the substrate 40, for connecting the plurality of sockets 70A1 thru 70T20 and the connector 80. The plurality of wiring systems include first wiring systems 50a1 thru 50h10 for transmitting a first signal, and second wiring systems 60a thru 60p for transmitting a second signal that is different from the first signal, the type of first connection form of the first wiring systems 50a1 thru 50h10 and the type of second connection form of the second wiring systems 60a thru 60p being different from each other.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a burn-in board used in burn-in testing of electronic devices under test (DUTs: Devices Under Test) such as semiconductor integrated circuit elements, and to a burn-in apparatus equipped with the burn-in board. [Background technology]

[0002] A burn-in device is known that includes a burn-in board with multiple sockets to which a DUT can be attached, a burn-in chamber that houses the burn-in board and applies thermal stress to the DUT, and a burn-in controller that inputs and outputs signals to the DUT via the burn-in board (see, for example, Patent Document 1). In this burn-in device, the burn-in board and the burn-in controller are electrically connected by fitting a connector of the burn-in board to a connector of the burn-in chamber. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-025829 A Summary of the Invention [Problem to be solved by the invention]

[0004] The sockets mentioned above are connected to a driver in the burn-in controller via a connector, and signals are input / output from this driver to the DUT. Because the number of drivers is limited, multiple sockets must be connected to the same driver via a wiring system.

[0005] On the other hand, as the number of sockets mounted on a burn-in board increases, the difference in the length of the wiring between the connector and the sockets tends to become larger among the multiple sockets. Depending on the type of signal input / output from the burn-in controller to the DUT, the difference in the length of the wiring between the sockets can affect the quality of the burn-in test.

[0006] Therefore, when the number of sockets on a burn-in board increases, if all wiring systems are made to have the same type of connection, there is a problem that the quality of the burn-in test may decrease depending on the type of signal.

[0007] The problem to be solved by the present invention is to provide a burn-in board and a burn-in device that are capable of suppressing a deterioration in the quality of a burn-in test even when the number of sockets is increased. [Means for solving the problem]

[0008] [1] A burn-in board according to the present invention comprises a substrate, a plurality of sockets mounted on the substrate, a connector mounted on the substrate, and a plurality of wiring systems provided on the substrate and connecting the plurality of sockets and the connector, the plurality of wiring systems including a first wiring system that transmits a first signal and a second wiring system that transmits a second signal different from the first signal, and a first connection type of the first wiring system and a second connection type of the second wiring system are mutually different.

[0009] [2] In the above invention, the first connection form may be a connection form in which a wiring branches off between the connector and the socket and is connected to another connector, and the second connection form may be a connection form in which a wiring does not branch off between the connector and the socket.

[0010] [3] In the above invention, the socket may include first to fourth sockets, and the first wiring system may include a first main line connected to the connector, first and second secondary lines connected to the first main line at a branch point and connected to the first and third sockets, respectively, a first connecting line connecting the first socket and the second socket, and a second connecting line connecting the third socket and the fourth socket.

[0011] [4] In the above invention, the board may have a first end on which the connector is mounted and a second end opposite the first end, the first and second sockets may be aligned along a first direction from the first end to the second end, the third and fourth sockets may be aligned along the first direction, the first and third sockets may be aligned along a second direction substantially perpendicular to the first direction, and the second and fourth sockets may be aligned along the second direction.

[0012] [5] In the above invention, the length of the wiring between the branch point and the first socket and the length of the wiring between the branch point and the third socket may be substantially the same, and the length of the wiring between the branch point and the second socket and the length of the wiring between the branch point and the fourth socket may be substantially the same.

[0013] [6] In the above invention, the sockets may include fifth to seventh sockets, and the second wiring system may be connected to the connector and include a second main line connected to the fifth socket, a third connecting line connecting the fifth socket and the sixth socket, and a fourth connecting line connecting the sixth socket and the seventh socket.

[0014] [7] In the above invention, the substrate may have a first end on which the connector is mounted and a second end opposite the first end, and the fifth to seventh sockets may be arranged in order along a first direction from the first end to the second end.

[0015] [8] In the above invention, the first socket and the fifth socket may be the same socket, and the second socket and the sixth socket may be the same socket.

[0016] [9] In the above invention, the first signal may include an output signal from a DUT electrically connected to the socket, and the second signal may include an input signal to the DUT.

[0017]

[10] A burn-in apparatus according to the present invention is a burn-in apparatus including the burn-in board described above. Effect of the Invention

[0018] According to the present invention, the multiple wiring systems of the burn-in board include a first wiring system that transmits a first signal and a second wiring system that transmits a second signal different from the first signal, and the type of the first connection form of the first wiring system and the type of the second connection form of the second wiring system are different from each other. That is, in the present invention, the type of the connection form of the wiring system is made different depending on the type of signal. As a result, in the present invention, even if the number of sockets on the burn-in board increases, it is possible to suppress a deterioration in the test quality of the burn-in test. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a front view showing a burn-in device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a block diagram showing a system configuration of a burn-in device according to an embodiment of the present invention. [Diagram 3] FIG. 3 is a schematic plan view showing a wiring system of a burn-in board in an embodiment of the present invention. [Figure 4] FIG. 4 is an enlarged view of part IV in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0021] First, the overall configuration of a burn-in apparatus 1 in this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a front view of the burn-in apparatus in this embodiment, and Figure 2 is a block diagram showing the system configuration of the burn-in apparatus in this embodiment.

[0022] The burn-in device 1 in this embodiment is a device for performing a burn-in test, which is a type of screening test for the purpose of extracting initial defects in DUTs such as IC chips and removing initial defective products. As shown in Figures 1 and 2, this burn-in device 1 includes a burn-in chamber 11 capable of accommodating a burn-in board 20, a test power supply 12 that applies a power supply voltage to a DUT 100 (see Figure 2) mounted on the burn-in board 20, and a burn-in controller 13 that inputs and outputs signals to the DUT 100.

[0023] This burn-in apparatus 1 applies a power supply voltage to the DUT 100 and inputs and outputs signals while applying thermal stress (e.g., about -25°C to +125°C) to the DUT 100 mounted on a burn-in board 20 housed in a burn-in chamber 11, thereby screening the DUT 100. The DUT 100 in this embodiment is a memory-based device. Note that the DUT 100 to be tested is not particularly limited, and may be, for example, a logic-based device or a SoC (System on a chip).

[0024] 1, the burn-in chamber 11 has a temperature-controlled room 111 partitioned by a heat-insulating wall or the like, and a door 112 that can open and close the temperature-controlled room 111. A plurality of slots 113 for holding the burn-in boards 20 are provided inside the temperature-controlled room 111. Each slot 113 has a pair of rails 114 that support both the left and right ends of the burn-in board 20. The burn-in board 20 is carried into the temperature-controlled room 111 through the door 112 while sliding on the rails 114. The temperature-controlled room 111 has 24 slots 113 each having a width of 100 mm and a width of 100 mm. 113 There are two rows of burn-in boards, making it possible to accommodate a total of 48 burn-in boards 20.

[0025] In the figure, one door (the door on the right side in the figure) is not shown, and the temperature-controlled chamber 111 is shown in an open state. In contrast, the other door 112 (the door on the left side in the figure) is shown in a closed state, and therefore the 24 rows of slots 113 on the left side in the figure are not shown. In addition, the number and arrangement of the slots 113 (i.e., the number and positional relationship of the burn-in boards 20 accommodated in the temperature-controlled chamber 111) are not limited to the example shown in FIG. 1, and can be set arbitrarily in consideration of test efficiency, etc.

[0026] A connector 115 (see FIG. 2) is provided at the back of each slot 113. The connector 115 is connected to the connector of the burn-in board 20 inserted into the slot 113. 80 It is possible for them to be fitted together.

[0027] 2, this connector 115 is electrically connected to the DUT power supply 12 and the burn-in controller 13. Although only one burn-in board 20 is shown in FIG. 2, in reality, the other burn-in boards 20 are also connected to the DUT power supply 12 and the burn-in controller 13 in a similar manner.

[0028] 1, the burn-in chamber 11 further includes an evaporator 116, a heater 117, and a fan 118. The air in the temperature-constant chamber 111 is circulated by the fan 118, and is cooled by the evaporator 116 and heated by the heater 117, thereby adjusting the temperature in the temperature-constant chamber 111. The operations of the evaporator 116, the heater 117, and the fan 118 are controlled by the burn-in controller 13.

[0029] The DUT power supply 12 is connected to the above connector 115, 80 1 through the burn-in board 20 so as to apply a power supply voltage to each DUT 100 on the burn-in board 20, and is controlled by the burn-in controller 13.

[0030] In addition to controlling the application of voltage to DUT 100, the input and output of signals to DUT 100, and the temperature adjustment within the temperature-controlled chamber 111, the burn-in controller 13 is capable of determining that a DUT that exhibits an abnormal reaction during the burn-in test is defective, storing the serial number of the DUT (for example, corresponding to the number of slot 113 and the position on the burn-in board 20), and feeding back the test results.

[0031] Next, the burn-in board 20 in this embodiment will be described with reference to Fig. 3 and Fig. 4. Fig. 3 is a schematic plan view showing the wiring system of the burn-in board in this embodiment, and Fig. 4 is an enlarged view of part IV in Fig. 3.

[0032] As shown in FIG. 3, the burn-in board 20 in this embodiment includes a wiring board 30 and a plurality of (320 in this example) sockets 70A1 to 70P mounted on the wiring board 30. 20 and a connector 80 mounted on the wiring board 30.

[0033] Socket 70A1~70P 20 The DUT 100 can be attached to each of the sockets 70A1 to 70P. 20These are collectively referred to as sockets 70. The connector 80 is also 30 Substrate 40 At one end (the upper edge in FIG. 3) 41 As described above, the burn-in board 20 can be fitted into the connector 115 provided in the burn-in chamber 11. The burn-in board 20 may also include a reinforcing frame for reinforcing the wiring board 30 and a bottom cover for protecting the back surface of the wiring board.

[0034] The socket 70A1 in this embodiment corresponds to an example of the "first socket" in the present invention, the socket 70A2 in this embodiment corresponds to an example of the "second socket" in the present invention, the socket 70B1 in this embodiment corresponds to an example of the "third socket" in the present invention, and the socket 70B2 in this embodiment corresponds to an example of the "fourth socket" in the present invention. Also, the socket 70A1 in this embodiment corresponds to an example of the "fifth socket" in the present invention, the socket 70A2 corresponds to an example of the "sixth socket" in the present invention, and the socket 70A3 corresponds to an example of the "seventh socket" in the present invention.

[0035] As shown in Fig. 4, each socket 70 has a plurality of contact pins 71 (16 in this example) that come into contact with the terminals of the DUT 100. The plurality of contact pins 71 are arranged in a matrix to correspond to the terminals of the DUT 100. When the DUT 100 is attached to the socket 70 during a burn-in test, the contact pins 71 come into contact with the terminals of the DUT 100, electrically connecting the DUT 100 and the socket 70. Sockets 70A1 to 70P 20 All of them have the same structure.

[0036] The number of contact pins 71 in socket 70 is not particularly limited to the above, and the arrangement of contact pins 71 in socket 70 is not particularly limited to the above.

[0037] As shown in FIG. 3, a plurality of sockets 70A1 to 70P 20 are arranged in a matrix on substrate 40 of wiring board 30.

[0038] More specifically, in this embodiment, twenty sockets 70A1 to 70A are arranged along the first direction on the substrate 40. 20 are arranged as an example, and these sockets 70A1 to 70A 20 The first direction is the direction from the first end of the board 40 to the first end of the board 40. 41 from the first end 41 The second end opposite 42 This corresponds to the -Y direction in the figure. 20 are substantially equally spaced.

[0039] Similarly, twenty sockets 70B1 to 70B arranged in the first direction 20 are lined up in a row, and these sockets 70B1 to 70B 20 A single socket row 75B is constituted by the 20 sockets 70B1 to 70B. 20 In the same manner, each of the other 14 socket rows 75C to 75P is made up of 20 sockets 70 arranged at equal intervals along the first direction.

[0040] These 16 socket rows 75A-75P are aligned in a second direction, which is substantially perpendicular to the first direction (the -Y direction in the figure) and corresponds to the X direction in the figure. The socket rows 75A-75P are aligned at substantially equal intervals.

[0041] In addition, the substrate 40 The number of sockets 70 mounted on the board is not particularly limited to the above. 40 The arrangement of the socket 70 on the upper side is not particularly limited to the above.

[0042] In the present embodiment, wiring board 30 includes the above-mentioned plurality of sockets 70A1 to 70P. 20 As shown in FIG. 3, the wiring board 30 is a printed wiring board on which an electrically insulating substrate 40 and two types of wiring systems 50a1 to 50h are mounted. 10 In this embodiment, wiring board 30 is a multi-layer wiring board, and each of wiring systems 50a1 to 50h 10 , 60a to 60p are formed by wiring patterns and conductive paths such as via holes formed on the substrate 40.

[0043] In this embodiment, the first wiring system 50a1 to 50h 10 The type of connection form of the first wiring system 50a1-50h is different from the type of connection form of the second wiring system 60a-60p. Here, the connection form (Connection form / Connection topology) refers to the form of electrical connection between the connector 80 and the multiple sockets 70 in the wiring board 30, and is expressed by a connection path (positional relationship between the wiring and the branch points) that is configured by combining the wiring that connects the connector 80 and the multiple sockets 70 and the branch points. The types of this connection form can be classified according to the presence or absence of a branch point and the position of the branch point. In this embodiment, the first wiring system 50a1-50h 10 has a connection form having a branch point, whereas second wiring systems 60a-60p have a connection form without a branch point. Note that the number of types of connection forms of the wiring systems in wiring board 30 is not particularly limited, and the wiring board may have wiring systems with three or more types of connection forms.

[0044] First wiring system 50a1 to 50h 10 Since the first wiring system 50a1 has a basically identical configuration, the configuration of the first wiring system 50a1 will be described below as a representative, and the configuration of the other first wiring systems 50a2 to 50h will be described below as a representative. 10Similarly, since the second wiring systems 60a to 60p basically have the same configuration, the configuration of the second wiring system 60a will be representatively described below, and descriptions of the configurations of the other second wiring systems 60b to 60p will be omitted.

[0045] The first wiring system 50a1 has a connection form in which the wiring branches between the connector 80 and the socket 70A1 and has a portion connected to the socket 70B1. Specifically, as shown in Fig. 4, the first wiring system 50a1 includes a main line 51, secondary lines 52 and 53, and connection lines 54 and 55. The main line 51, secondary lines 52 and 53, and connection lines 54 and 55 are formed by a wiring pattern formed on the substrate 40 and conductive paths such as via holes.

[0046] The main line 51 in this embodiment corresponds to an example of a "first main line" in the present invention, the secondary line 52 in this embodiment corresponds to an example of a "first secondary line" in the present invention, the secondary line 53 in this embodiment corresponds to an example of a "second secondary line" in the present invention, the connecting line 54 in this embodiment corresponds to an example of a "first connecting line" in the present invention, and the connecting line 55 in this embodiment corresponds to an example of a "second connecting line" in the present invention.

[0047] One end of the main line 51 is connected to the connector 80. A branch point 511 is provided at the other end of the main line 51, where the main line 51 branches into two sub-lines 52 and 53. One of the sub-lines 52 is connected at its tip to a connection line 54 and also to a socket 70A1. The connection line 54 is connected at its tip to the next socket 70A2. Similarly, the other sub-line 53 is connected at its tip to a connection line 55 and also to a socket 70B1. The connection line 55 is connected at its tip to the next socket 70B2.

[0048] That is, in the first wiring system 50a1, the wiring is branched into two between the connector 80 and the sockets 70A1 and 70B1. In the first wiring system 50a1, the socket 70A1 connected to one of the secondary lines 52 and the socket 70A2 adjacent to the socket 70A1 in the first direction are connected in a daisy chain by a connection line 54. Similarly, in the first wiring system 50a1, the socket 70B1 connected to the other secondary line 53 and the socket 70B2 adjacent to the socket 70B1 in the first direction are connected in a daisy chain by a connection line 55.

[0049] In this embodiment, the length of the secondary line 52 between the branch point 511 and the socket 70A1 is substantially the same as the length of the secondary line 53 between the branch point 511 and the socket 70B1. Therefore, the transmission time of a signal in the socket 70A1 is substantially the same as the transmission time of a signal in the socket 70B1.

[0050] Furthermore, the length of the connection line 54 between the sockets 70A1 and 70A2 is substantially the same as the length of the connection line 55 between the sockets 70B1 and 70B2. Therefore, the total length of the secondary line 52 and the connection line 54 between the branch point 511 and the socket 70A2 is substantially the same as the total length of the secondary line 53 and the connection line 55 between the branch point 511 and the socket 70B2. Therefore, the transmission time of a signal in the socket 70A2 is substantially the same as the transmission time of a signal in the socket 70B2.

[0051] The first wiring system 50a2 also has a wiring system similar to the above-mentioned first wiring system 50a1, and as shown in FIG. 3, connects the connector 80 to four sockets 70A3, 70A4, 70B3, and 70B4.

[0052] Although not specifically shown, the first wiring systems 50a3 to 50a9 also have wiring systems similar to the above-mentioned first wiring system 50a1. The first wiring system 50a3 connects the connector 80 and the four sockets 70A5, 70A6, 70B5, and 70B6. The first wiring system 50a4 connects the connector 80 and the four sockets 70A7, 70A8, 70B7, and 70B8. The first wiring system 50a5 connects the connector 80 and the four sockets 70A9, 70A10, 70B11, and 70B12. 10 ,70B9,70B 10 The first wiring system 50a6 connects the connector 80 and the four sockets 70A 11 ,70A 12 ,70B 11 ,70B 12 The first wiring system 50a7 connects the connector 80 and the four sockets 70A 13 ,70A 14 ,70B 13 ,70B 14 The first wiring system 50a8 connects the connector 80 and the four sockets 70A 15 ,70A 16 ,70B 15 ,70B 16 The first wiring system 50a9 connects the connector 80 and the four sockets 70A 17 ,70A 18 ,70B 17 ,70B 18 and are connected.

[0053] First wiring system 50a 10 The second wiring system 50a1 also has a wiring system similar to the first wiring system 50a1 described above, and includes a connector 80 and four sockets 70A, as shown in FIG. 19 ,70A 20 ,70B 19 ,70B 20 and is connected.

[0054] That is, the first connection configurations 50a1 to 50a2 in which four sockets 70 are connected to the connector 80 for each of the two socket rows 75A and 75B are 10Similarly, in the other socket rows 75C to 75P, ten first connection configurations 50b1 to 50h are provided for every two socket rows. 10 As a result, the burn-in board 20 of this embodiment has 320 sockets 70A1 to 70P. 20 For the 80 first connection configurations 50a1 to 50h 10 It is equipped with:

[0055] In contrast, the second wiring system 60a includes a connector 80 and sockets 70A1 to 70A 20 Specifically, as shown in FIG. 3 and FIG. 4, the second wiring system 60a includes a main line 61a and connection lines 62a1 to 62a 19 The main line 61a and the connection lines 62a1 to 62a 19 is composed of conductive paths such as wiring patterns and via holes formed on the substrate 40.

[0056] The main line 61a in this embodiment corresponds to an example of a "second main line" in the present invention, the connecting line 62a1 in this embodiment corresponds to an example of a "third connecting line" in the present invention, and the connecting line 62a2 in this embodiment corresponds to an example of a "fourth connecting line" in the present invention.

[0057] One end of the main line 61a is connected to the connector 80. The other end of the main line 61a is connected to a connection line 62a1 and is also connected to a socket 70A1. The connection line 62a1 is connected at its tip to the next connection line 62a2 and is also connected to the next socket 70A2. Similarly, the connection lines 62a2 to 62a 18 However, at the tip of the wire, the next connection wire 62a3 to 62a 19 It is connected to the following sockets 70A3 to 70A 19 And the last connection line 62a 19 But at the tip is a 70A socket 20 is connected to

[0058] That is, in the second wiring system 60a, the connector 80 and the sockets 70A1 to 70A 20 In the second wiring system 60a, twenty sockets 70A1 to 70A2 are arranged in a line along the first direction to form a socket row 75A. 20 However, the connection lines 62a1 to 62a 19 are connected in a daisy chain by

[0059] The second wiring system 60b also has a wiring system similar to the above-mentioned second wiring system 60a, and the socket row 75B includes 20 sockets 70B1 to 70B 20 3 and 4, a main line 61b and connecting lines 62b1 to 62b 19 The main line 61b is connected at one end to the connector 80. The other end of the main line 61b is connected to the connection line 62b1 and also to the socket 70B1. The twenty sockets 70B1 to 70B 20 are the connection lines 62b1 to 62b 19 are connected in a daisy chain by

[0060] Similarly, the second wiring systems 60c to 60p have a wiring system similar to the second wiring system 60a described above, and each of the second wiring systems 60c to 60p connects the 20 sockets 70 that make up each of the socket rows 75C to 75P in a daisy chain configuration.

[0061] That is, one second wiring system 60a to 60p is provided for one socket row 75A to 75P. As a result, the burn-in board 20 of this embodiment has 320 sockets 70A1 to 70P. 20 In contrast, the 16 second wiring systems 60a to 60p are provided.

[0062] Each of the first wiring systems 50a1 to 50h 10 are individually connected to the connector 80.10 are connected to separate drivers of the burn-in controller 13 via the connectors 80. For example, as shown in FIG 3, a first wiring system 50a1 is connected to a driver 14b, while another first wiring system 50a2 is connected to a driver 14c different from the driver 14b.

[0063] As shown in FIG. 4, the first wiring system 50a1 is connected to the same contact pin 71a (for example, the contact pin 71a located in the third row and third column in the figure) among the contact pins 71 of the sockets 70A1, 70A2, 70B1, and 70B2. Similarly, the other first wiring systems 50a2 to 50h 10 are also connected to the same contact pin 71a in the socket 70.

[0064] The first wiring system 50a1 to 50h 10 The first signal transmitted between the burn-in controller 13 and the socket 70 via the socket 70 is an input signal input to the DUT 100 electrically connected to the socket 70 and a 100 A specific example of such a first signal is a signal including a signal for writing data to the DUT 100 and a signal for reading data from the DUT 100. This first signal is a signal that requires a high quality waveform, and the fewer the number of sockets connected to one wiring system, the better the signal waveform quality. Therefore, in this embodiment, each of the first wiring systems 50a1 to 50h 10 is connected to only four sockets 70.

[0065] The number of branch points of the first wiring system is not limited to one, and the first wiring system may have multiple branch points. Incidentally, since the higher the signal frequency, the more it affects the waveform quality, it is preferable to have a smaller number of branch points.

[0066] Each of the second wiring systems 60a-60p is also connected independently and individually to a connector 80. Each of the second wiring systems 60a-60p is connected to a different driver of the burn-in controller 13 via the connector 80. For example, as shown in FIG. 3, the second wiring system 60a is connected to a driver 14a, while another second wiring system 60b is connected to a driver 14d different from the driver 14a. The drivers 14a and 14d are different from the drivers 14b and 14c to which the above-mentioned first wiring systems 50a1 and 50a2 are connected.

[0067] As shown in FIG. 4, the second wiring system 60a includes sockets 70A1 to 70A 20 Among the contact pins 71 possessed by the socket 70, the first wiring system 50a is connected to a contact pin 71b (for example, the contact pin 71b located in the second row and second column in the figure) other than the contact pin 71a to which the first wiring system 50a is connected. Similarly, the other second wiring systems 60b to 60p are also connected to the same contact pin 71b in the socket 70.

[0068] The second signal transmitted between the burn-in controller 13 and the socket 70 via the second wiring system 60a includes only an input signal input to the DUT 100 electrically connected to the socket 70. Specific examples of such a second signal include an address signal and a clock signal. Since the second signal does not require a waveform with high quality compared to the first signal, in this embodiment, each of the second wiring systems 60a to 60p is connected to 20 sockets 70.

[0069] The number of sockets 70 connected by one second wiring system is not particularly limited to the above, and can be set according to the required waveform quality, etc. For example, five sockets 70 may be connected in a daisy chain by one second wiring system. Alternatively, ten sockets 70 may be connected in a daisy chain by one second wiring system.

[0070] Although not shown in the figure, the socket 70 has contact pins other than the contact pins 71a and 71b. 71 That is, the wiring system is connected to each of all the contact pins 71 of the socket 70 independently.

[0071] The other wiring system may have the same type of connection as the first or second wiring system described above, or may have a different type of connection from the first and second wiring systems. For example, the other wiring system may have a connection that has a branch point at a position different from that of the first wiring system described above. The connection forms of these other wiring systems can be set according to the required waveform quality, etc.

[0072] Here, for input signals, if the burn-in controller 13 has a timing correction function, the signals can be input to all the DUTs 100 at the same timing by calibrating this timing correction function. On the other hand, for output signals from the DUTs 100, it is difficult to align the timing even with this timing correction function. Therefore, a signal transmission delay time occurs depending on the length of the wiring between the connector and the socket. Note that problems caused by such transmission delay time tend to become more pronounced as the signal frequency becomes higher.

[0073] For this reason, in this embodiment, the first wiring system 50a1 to 50h that transmits the first signal including the output signal is 10 The connection form of the first signal is set to the first connection form having the branch point 511 as described above. This makes it possible to reduce the transmission delay time of the first signal even if the number of sockets 70 on the burn-in board 20 is increased.

[0074] As an example, compared to connecting the four sockets 70A1 to 70A4 in a row in a daisy chain as the number of sockets 70 increases, by replacing sockets 70A3 and 70A4 with sockets 70B1 and 70B2 closer to the connector 80 and connecting the four sockets 70A1, 70A2, 70B1, and 70B2 with the above-mentioned first wiring system 50a1, the length of the wiring from the connector 80 to the sockets 70B1 and 70B2 can be shortened.

[0075] On the other hand, since the second signal does not require a waveform of high quality compared to the first signal, the second wiring system 60a-60p that transmits the second signal is connected in the second connection form having no branch point as described above. This allows the number of sockets 70 connected in a daisy chain to be increased, making it possible to deal with an increase in the number of sockets 70 while the number of drivers is limited.

[0076] Therefore, in this embodiment, by varying the type of connection of the wiring system depending on the type of signal, it is possible to suppress a deterioration in the quality of the burn-in test even if the number of sockets 70 is increased.

[0077] The above-described embodiments are described for the purpose of facilitating understanding of the present invention, and are not described for the purpose of limiting the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0078] For example, the configuration of the burn-in apparatus 1 described above is merely an example and is not particularly limited to the above. For example, the burn-in apparatus 1 described above uses a temperature-controlled room 111 to adjust the temperature of the DUT 100, but is not particularly limited to this. For example, the burn-in apparatus 1 may adjust the temperature of the DUT by contacting a pusher for temperature adjustment with the DUT 100. [Explanation of symbols]

[0079] 1. Burn-in equipment 11…Burn-in chamber 111… Constant temperature room 112…Door 113…Slots 114…Rail 115…Connector 116…Evaporator 117…Heater 118...Fan 12...Test power supply 13…Burn-in controller 14a~14d...Driver 20…Burn-in board 30...Wiring board 40…Substrate 41...End 42...End 50a1~50h 10 …First wiring system 51…Main line 511... Branching point 52,53…Secondary lines 54,55…Connecting wire 60a~60p...Second wiring system 61a,61b…Main line 62a1~62a 19 ,62b1~62b 19 …connecting lines 70,70A1~70P 20 …socket 71, 71a, 71b...Contact pins 75A~75P...Socket row 80…Connector 100…DUT

Claims

1. A substrate, A plurality of sockets mounted on the substrate; A connector mounted on the substrate; a plurality of wiring systems provided on the board and connecting the plurality of sockets and the connector; The plurality of wiring systems include a first wiring system for transmitting a first signal; a second wiring system transmitting a second signal different from the first signal; a first connection form of the first wiring system is a connection form in which a wiring branched between the connector and the socket has a portion connected to another of the sockets, a second connection form of the second wiring system is a connection form in which no wiring branch is provided between the connector and the socket, A burn-in board in which the number of the sockets connected to the first wiring system is smaller than the number of the sockets connected to the second wiring system.

2. 2. The burn-in board of claim 1, The sockets include first to fourth sockets, The first wiring system includes: a first main line connected to the connector; first and second sub-lines connected to the first main line at a branch point and connected to the first and third sockets, respectively; a first connection line connecting the first socket and the second socket; a second connecting line connecting the third socket and the fourth socket.

3. 3. The burn-in board of claim 2, The substrate is a first end having the connector mounted thereon; a second end opposite the first end, the first and second sockets are aligned along a first direction from the first end to the second end, the third and fourth sockets are aligned along the first direction, the first and third sockets are aligned along a second direction perpendicular to the first direction; The second and fourth sockets are aligned along the second direction on the burn-in board.

4. 4. The burn-in board according to claim 2, a length of a wiring between the branch point and the first socket is equal to a length of a wiring between the branch point and the third socket; a burn-in board in which the length of the wiring between the branch point and the second socket is the same as the length of the wiring between the branch point and the fourth socket;

5. The burn-in board according to any one of claims 2 to 4, The sockets include fifth to seventh sockets, The second wiring system includes: a second main line connected to the connector and to the fifth socket; a third connection line connecting the fifth socket and the sixth socket; a fourth connection line connecting the sixth socket and the seventh socket; the first socket and the fifth socket are the same socket, The second socket and the sixth socket are the same socket on the burn-in board.

6. 6. The burn-in board of claim 5, The substrate is a first end having the connector mounted thereon; a second end opposite the first end, The fifth to seventh sockets are arranged in order along a first direction from the first end to the second end of the burn-in board.

7. The burn-in board according to any one of claims 1 to 6, the first signal includes an output signal from a DUT electrically connected to the socket; The second signal includes an input signal to the DUT.

8. A burn-in device comprising the burn-in board according to any one of claims 1 to 7.

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