Electronic component mounting method and electronic component mounting device

Abstract

This electronic part mounting method comprises: a step for applying conductive fluid to planned mounting positions for electrodes of a first electronic part on metallic wiring arranged on a resin layer; a first curing step for curing the applied conductive fluid; a step for applying conductive fluid to a planned mounting position for a part body of the first electronic part on the resin layer and further applying conductive fluid to planned mounting positions for electrodes of a second electronic part on the metallic wiring arranged on the resin layer; a step for contacting the electrodes of the first electronic part with the conductive fluid cured in the first curing step and further contacting the part body of the first electronic part with the conductive fluid applied to the planned mounting position for the part body of the first electronic part, thereby placing the first electronic part; a step for contacting the electrodes of the second electronic part with the conductive fluid applied to the planned mounting positions for the electrodes of the second electronic part, thereby placing the second electronic part; and a second curing step for curing, after the first electronic part and the second electronic part are placed, the conductive fluid applied to the planned mounting position for the part body of the first electronic part and to the planned mounting positions for the electrodes of the second electronic part.

Description

[Technical field]

[0001] The present invention relates to a method for mounting electronic components, in which a conductive fluid is applied to metal wiring arranged on a resin layer, and electronic components are mounted by bringing electrodes into contact with the conductive fluid. [Background technology]

[0002] The following Patent Document describes a technique for mounting an electronic component so as to be electrically connected to metal wiring. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-135410 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to properly mount an electronic component so as to be electrically connected to metal wiring. [Means for solving the problem]

[0005] In order to solve the above problems, the present specification provides a method for manufacturing a semiconductor device, comprising the steps of: applying a conductive fluid to a position on a metal wiring arranged on a resin layer where an electrode of a first electronic component is to be mounted; a first curing step of curing the applied conductive fluid; applying a conductive fluid to a position on the resin layer where a component body of the first electronic component is to be mounted, and applying a conductive fluid to a position on the metal wiring arranged on the resin layer where an electrode of a second electronic component is to be mounted; bringing the electrode of the first electronic component into contact with the conductive fluid cured in the first curing step; Disclosed is a method for mounting electronic components, the method including: a step of placing a first electronic component by contacting the component body of the first electronic component with a conductive fluid applied to a planned mounting position of the component body of a child component; a step of placing the second electronic component by contacting an electrode of the second electronic component with a conductive fluid applied to a planned mounting position of an electrode of the second electronic component; and a second curing step of curing the conductive fluid applied to the planned mounting position of the component body of the first electronic component and the planned mounting position of the electrode of the second electronic component after the first electronic component and the second electronic component have been mounted.

[0006] The present specification also relates to a method for manufacturing a semiconductor device, comprising: an application device for applying a conductive fluid; a curing device for curing the conductive fluid applied by the application device; a mounting device for mounting an electronic component; and a control device, the control device including a step of applying the conductive fluid to a position on a metal wiring arranged on a resin layer where an electrode of a first electronic component is to be mounted; a first curing step of curing the applied conductive fluid; a step of applying the conductive fluid to a position on the resin layer where a component body of the first electronic component is to be mounted, and a step of applying the conductive fluid to a position on the metal wiring arranged on the resin layer where an electrode of a second electronic component is to be mounted; and a step of curing the conductive fluid cured in the first curing step. the step of placing the first electronic component by contacting the electrodes of the first electronic component with a conductive fluid and the component body of the first electronic component with a conductive fluid applied to a planned mounting position of the component body of the first electronic component; the step of placing the second electronic component by contacting the electrodes of the second electronic component with the conductive fluid applied to a planned mounting position of the electrodes of the second electronic component; and a second curing step of curing the conductive fluid applied to the planned mounting position of the component body of the first electronic component and the planned mounting position of the electrodes of the second electronic component after the first electronic component and the second electronic component have been placed. Effect of the Invention

[0007] In the present disclosure, the first electronic component is mounted by contacting the electrodes with the cured conductive fluid and the component body with the uncured conductive fluid. Meanwhile, the second electronic component is mounted by contacting the electrodes with the uncured conductive fluid. In this manner, the first electronic component and the second electronic component are mounted by different methods, thereby improving throughput and allowing the electronic components to be properly mounted on the metal wiring. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing a circuit forming device. [Diagram 2] FIG. 2 is a block diagram showing a control device. [Diagram 3]1 is a cross-sectional view showing a heat-sensitive release film attached onto a base. [Figure 4] FIG. 2 is a cross-sectional view showing a circuit board with a resin laminate formed thereon. [Diagram 5] FIG. 2 is a cross-sectional view showing a circuit board having wiring formed on a resin laminate. [Figure 6] FIG. 2 is a cross-sectional view showing a circuit board in a state in which a resin laminate is further formed on the resin laminate. [Figure 7] 1 is a cross-sectional view showing a circuit board in a state in which a conductive paste is applied onto wiring. [Figure 8] FIG. 2 is a cross-sectional view showing a circuit board on which two electronic components are mounted. [Figure 9] 4 is a cross-sectional view showing a circuit board in a state in which a conductive paste is applied onto wiring and a resin laminate. FIG. [Figure 10] FIG. 2 is a cross-sectional view showing a circuit board on which two electronic components are mounted. [Figure 11] 1 is a cross-sectional view showing a circuit board in a state in which a thermosetting resin has been injected between an upper surface of a resin laminate and a lower surface of a component body of an electronic component. FIG. [Figure 12] 4 is a cross-sectional view showing a circuit board with an electronic component pressed against a resin laminate. FIG. [Figure 13] FIG. 2 is a cross-sectional view showing a circuit board with small electronic components mounted thereon. [Figure 14] FIG. 2 is a cross-sectional view showing a circuit board with small electronic components mounted thereon. [Figure 15] FIG. 2 is a cross-sectional view showing a circuit board on which two electronic components are mounted. [Figure 16] 1 is a cross-sectional view showing a circuit board in a state in which a thermosetting resin has been injected between an upper surface of a resin laminate and a lower surface of a component body of an electronic component. FIG. [Figure 17] 4 is a cross-sectional view showing a circuit board with an electronic component pressed against a resin laminate. FIG. [Figure 18] 1 is a cross-sectional view showing a circuit board in a state in which a conductive paste has been applied to positions where electrodes of a large electronic component are to be attached. [Figure 19]1 is a cross-sectional view showing a circuit board in a state in which a conductive paste has been applied to the component bodies of larger electronic components and to positions where electrodes of smaller electronic components are to be mounted. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] 1 shows a circuit-forming apparatus 10. The circuit-forming apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a fourth modeling unit 25, a compression unit 26, a mounting unit 27, and a control device (see FIG. 2) 28. The conveying device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the compression unit 26, and the mounting unit 27 are disposed on a base 29 of the circuit-forming apparatus 10. The base 29 is generally rectangular in shape, and in the following description, the longitudinal direction of the base 29 is referred to as the X-axis direction, the lateral direction of the base 29 is referred to as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction is referred to as the Z-axis direction.

[0010] The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on a base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. The X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to an arbitrary position in the X-axis direction by the drive of the electromagnetic motor 38. The Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. The stage 52 is held by the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

[0011] The stage 52 has a base 60, a holding device 62, a lifting device (see FIG. 2) 64, and a heater (see FIG. 2) 66. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The substrate is fixedly held by clamping both edges in the X-axis direction of the substrate placed on the base 60 between the holding devices 62. The lifting device 64 is disposed below the base 60, and raises and lowers the base 60. The heater 66 is built into the base 60, and heats the substrate placed on the base 60 to a desired temperature.

[0012] The first modeling unit 22 is a unit that models the wiring of a circuit board, and has a first printing section 72 and a baking section 74. The first printing section 72 has an inkjet head (see FIG. 2) 76 that ejects metal ink in a linear shape. The metal ink is a dispersion of nanometer-sized metal particles, such as silver particles, in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent aggregation in the solvent. The inkjet head 76 ejects the metal ink from multiple nozzles, for example, by a piezo method using a piezoelectric element.

[0013] The baking unit 74 has an infrared irradiation device 78 (see FIG. 2). The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays, and the metal ink irradiated with infrared rays is baked to form wiring. Note that baking of metal ink is a phenomenon in which, by applying energy, the solvent is evaporated and the protective film for the metal particles, i.e., the dispersant is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.

[0014] The second modeling unit 23 is a unit that models a resin layer of a circuit board, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88 that ejects ultraviolet curable resin. The ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 88 may be, for example, a piezo type that uses a piezoelectric element, or a thermal type that heats resin to generate bubbles and ejects the resin from multiple nozzles.

[0015] The curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curing resin discharged by the inkjet head 88, for example, by leveling the surface of the ultraviolet curing resin while scraping off excess resin with a roller or a blade, thereby making the thickness of the ultraviolet curing resin uniform. The irradiation device 92 is equipped with a mercury lamp or LED as a light source, and irradiates the discharged ultraviolet curing resin with ultraviolet rays. This causes the discharged ultraviolet curing resin to harden, forming a resin layer.

[0016] The third modeling unit 24 is a unit that models a connection portion between an electrode of an electronic component and a wiring on a circuit board, and has a third printing unit 100. The third printing unit 100 has a dispenser (see FIG. 2) 106 that dispenses a conductive paste. The conductive paste is a resin that hardens when heated at a relatively low temperature, in which micrometer-sized metal particles are dispersed. The metal particles are in the form of flakes, and the viscosity of the conductive paste is relatively high compared to that of metal ink. The amount of conductive paste dispensed by the dispenser 106 is controlled by the inner diameter of a needle, the pressure during dispensing, and the dispensing time.

[0017] The conductive paste dispensed by the dispenser 106 is heated by the heater 66 built into the base 60, and the resin in the heated conductive paste hardens. At this time, the resin in the conductive paste hardens and shrinks, and the flake-shaped metal particles dispersed in the resin come into contact with each other. This allows the conductive paste to exhibit conductivity. The resin in the conductive paste is an organic adhesive, and exerts adhesive power by hardening when heated.

[0018] The fourth modeling unit 25 is a unit that models resin for fixing electronic components to a circuit board, and has a fourth printing unit 110. The fourth printing unit 110 has a dispenser (see FIG. 2) 116 that dispenses thermosetting resin. Thermosetting resin is resin that hardens when heated. The dispenser 116 is, for example, a piezo type that uses a piezoelectric element. The thermosetting resin dispensed by the dispenser 116 is heated by a heater 66 built into the base 60 and hardens.

[0019] The compression unit 26 is a unit for compressing the circuit board, and has a compression section 120. The compression section 120 has a compression plate (see FIG. 12) 122, a rubber sheet (see FIG. 12) 124, and a cylinder (see FIG. 2) 126. The rubber sheet 124 is made of silicon rubber and has a sheet shape with a plate thickness. The compression plate 122 is made of steel and has a plate shape. The rubber sheet 124 is attached to the lower surface of the compression plate 122, and the compression plate 122 is pressed against the circuit board by the operation of the cylinder 126. As a result, the circuit board is compressed by the compression plate 122 via the rubber sheet 124. The force compressing the board can be controllably changed by controlling the operation of the cylinder 126.

[0020] Furthermore, mounting unit 27 is a unit that mounts electronic components on a circuit board, and has supply section 130 and mounting section 132. Supply section 130 has a plurality of tape feeders (see FIG. 2) 134 that feed taped electronic components one by one, and supplies the electronic components at a supply position. Note that supply section 130 is not limited to tape feeder 134, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Supply section 130 may be configured to include both tape-type and tray-type supply devices, or other types of supply devices.

[0021] The mounting unit 132 has a mounting head (see FIG. 2) 136 and a moving device (see FIG. 2) 138. The mounting head 136 has a suction nozzle (not shown) for suctioning and holding an electronic component. The suction nozzle sucks and holds the electronic component by sucking air when negative pressure is supplied from a positive / negative pressure supplying device (not shown). Then, the positive / negative pressure supplying device supplies a slight positive pressure to the suction nozzle, which releases the electronic component. The moving device 138 moves the mounting head 136 between the supply position of the electronic component by the tape feeder 134 and the board placed on the base 60. As a result, in the mounting unit 132, the electronic component supplied from the tape feeder 134 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.

[0022] 2, the control device 28 includes a controller 140 and a plurality of drive circuits 142. The plurality of drive circuits 142 are connected to the electromagnetic motors 38, 56, the holding device 62, the lifting device 64, the heater 66, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispenser 106, the dispenser 116, the cylinder 126, the tape feeder 134, the mounting head 136, and the moving device 138. The controller 140 includes a CPU, a ROM, a RAM, and the like, and is mainly a computer, and is connected to the plurality of drive circuits 142. As a result, the operations of the conveying device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the compression unit 26, and the mounting unit 27 are controlled by the controller 140.

[0023] In the circuit-forming device 10, a resin laminate is formed on the base 60 by the above-mentioned configuration, and wiring is formed on the upper surface of the resin laminate. Then, the electrodes of the electronic components are electrically connected to the wiring via the conductive paste, and the electronic components are fixed by the resin to form a circuit board.

[0024] Specifically, as shown in FIG. 3, a heat-sensitive release film 150 is first laid on the upper surface of the base 60 of the stage 52. The heat-sensitive release film 150 has adhesiveness and therefore adheres appropriately to the upper surface of the base 60. Then, a circuit board is formed on the heat-sensitive release film 150, and the heat-sensitive release film 150 adheres closely to the base 60, thereby preventing the circuit board from being displaced during circuit formation. The adhesiveness of the heat-sensitive release film 150 decreases when heated. Therefore, after the circuit board is formed on the heat-sensitive release film 150, the heat-sensitive release film 150 can be easily peeled off from the base 60 together with the circuit board formed on the heat-sensitive release film 150 by heating the heat-sensitive release film 150.

[0025] When the heat-sensitive peelable film 150 is laid on the base 60, the stage 52 is moved to below the second modeling unit 23. Then, in the second modeling unit 23, a resin laminate 152 is formed on the heat-sensitive peelable film 150, as shown in Fig. 4. The resin laminate 152 is formed by repeatedly discharging an ultraviolet curing resin from the inkjet head 88 and irradiating the discharged ultraviolet curing resin with ultraviolet rays by the irradiation device 92.

[0026] More specifically, in the second printing section 84 of the second modeling unit 23, the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the upper surface of the heat-sensitive peeling film 150. Then, after the ultraviolet curing resin is ejected in a thin film, the ultraviolet curing resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curing resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of the ultraviolet curing resin with ultraviolet rays. As a result, a thin film resin layer 153 is formed on the heat-sensitive peeling film 150.

[0027] Next, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film resin layer 153. The thin film of ultraviolet curable resin is then flattened by a flattening device 90, and an irradiation device 92 irradiates the ultraviolet curable resin ejected into the thin film with ultraviolet light, thereby laminating a thin film of resin layer 153 on thin film of resin layer 153. In this manner, ejection of ultraviolet curable resin onto thin film of resin layer 153 and irradiation with ultraviolet light are repeated, and a plurality of resin layers 153 are laminated, thereby forming a resin laminate 152.

[0028] Next, when the resin laminate 152 is formed, the stage 52 is moved below the first modeling unit 22. Then, in the first printing section 72 of the first modeling unit 22, the inkjet head 76 ejects the metal ink 160 in a line shape on the upper surface of the resin laminate 152 according to the circuit pattern, as shown in FIG. 5. Next, in the baking section 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates the metal ink 160 ejected according to the circuit pattern with infrared rays. As a result, the metal ink 160 is baked, and the wiring 162 is formed on the upper surface of the resin laminate 152. In FIG. 5, three wirings 162 are formed, and when distinguishing between the three wirings 162, the wiring on the left side in FIG. 5 is described as wiring 162a, the wiring in the center is described as wiring 162b, and the wiring on the right side is described as wiring 162c.

[0029] Next, when the wiring 162 is formed on the resin laminate 152, it is moved below the second modeling unit 23. Then, in the second modeling unit 23, the inkjet head 88 ejects the ultraviolet curing resin in a thin film so that the ends of the three wirings 162 are exposed. Next, when the ultraviolet curing resin is ejected in a thin film, the ultraviolet curing resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curing resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of the ultraviolet curing resin with ultraviolet rays. As a result, a resin layer 156 is formed on the resin laminate 152 as shown in FIG. 6.

[0030] Next, the inkjet head 88 discharges the ultraviolet curing resin in a thin film only on the resin layer 156. That is, the inkjet head 88 discharges the ultraviolet curing resin in a thin film on the resin layer 156 so that the ends of the three wirings 162 are exposed. Then, the thin-film ultraviolet curing resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin discharged in the thin film with ultraviolet light, thereby laminating the resin layer 156 on the resin layer 156. In this way, the discharge of the ultraviolet curing resin on the resin layer 156 and the irradiation of ultraviolet light are repeated, and a plurality of resin layers 156 are laminated, thereby forming a resin laminate 157. As a result, the resin laminate 157 is formed on the resin laminate 152, and the step between the resin laminate 152 and the resin laminate 157 functions as the cavity 154.

[0031] When the resin laminate 157 is formed on the resin laminate 152 in this manner, the stage 52 is moved to below the third modeling unit 24. Then, in the third printing unit 100 of the third modeling unit 24, the dispenser 106 dispenses the conductive paste 166 onto both end portions of the wiring 162b and onto the ends of the wiring 162a and the wiring 162c that face both end portions of the wiring 162b, as shown in FIG.

[0032] In this way, when the conductive paste 166 is discharged onto the end of the wiring 162, in the conventional method, an electronic component is placed on the resin laminate 152 so that the electrodes are in contact with the conductive paste 166, and after the electronic component is placed, the conductive paste 166 is heated and hardened. Specifically, when the conductive paste 166 is discharged onto the end of the wiring 162, the stage 52 is moved below the mounting unit 27. Then, in the mounting unit 27, an electronic component (see FIG. 8) 172 is supplied by the tape feeder 134, and the electronic component 172 is held by the suction nozzle of the mounting head 136. The electronic component 172 is composed of a component body 176 and two electrodes 178 disposed on the lower surface of the component body 176. Then, the mounting head 136 is moved by the moving device 138, and the electronic component 172 held by the suction nozzle is placed on the upper surface of the resin laminate 152 as shown in FIG. 8. In FIG. 8, two electronic components 172 are placed on the upper surface of the resin laminate 152, and the two electronic components 172 are different in size. Therefore, the smaller electronic component is referred to as electronic component 172a, and the larger electronic component is referred to as electronic component 172b. Then, electronic component 172a is placed so that two electrodes 178 of electronic component 172a contact the conductive paste 166 discharged onto the ends of the two wirings 162a and 162b. Also, electronic component 172b is placed so that two electrodes 178 of electronic component 172b contact the conductive paste 166 discharged onto the ends of the two wirings 162b and 162c. Then, when the two electronic components 172a and 172b are placed on the upper surface of the resin laminate 152, the resin laminate 152 is heated to 105 degrees for one hour by heater 66 built in base 60. As a result, the conductive paste 166 is heated through the resin laminate 152 and hardened, thereby exhibiting conductivity, and the electronic components 172 are electrically connected to the wiring.

[0033] In this way, in the conventional method, after the conductive paste 166 is discharged onto the wiring 162, the electronic component 172 is mounted before the conductive paste 166 is hardened. In other words, the electronic component 172 is mounted so that the electrode 178 is in contact with the conductive paste 166 in an unhardened state. Then, the conductive paste 166 in contact with the electrode 178 is heated and hardened. However, the conductivity of the conductive paste decreases when it is deformed or stress is applied during thermal hardening. For this reason, when a circuit board is formed by the conventional method, the conductivity between the wiring 162 and the electrode 178 of the electronic component 172 cannot be adequately ensured.

[0034] In view of this, in the circuit forming apparatus 10, when the conductive paste 166 is discharged onto the end of the wiring 162, the conductive paste 166 is heated and cured before the electronic component 172 is attached, as shown in Fig. 7. In other words, the conductive paste 166 is heated and cured by the heater 66 without being deformed or subjected to stress. This makes it possible to prevent a decrease in conductivity of the conductive paste 166 when it hardens.

[0035] Then, when the conductive paste 166 is cured, in the third printing unit 100, the dispenser 106 dispenses the conductive paste 170 onto the bottom surface of the cavity 154 between the wiring 162a and the wiring 162b, that is, onto the upper surface of the resin laminate 152, and onto the upper surface of the resin laminate 152 between the wiring 162b and the wiring 162c, as shown in FIG. 9. Then, when the conductive paste 170 is dispensed onto the upper surface of the resin laminate 152, the stage 52 is moved below the mounting unit 27 while the conductive paste 170 is not heated and is in an uncured state. In other words, the conductive paste 166 dispensed onto the wiring 162 is heated and cured, but the conductive paste 170 dispensed onto the resin laminate 152 is not heated and is in an uncured state while the stage 52 is moved below the mounting unit 27.

[0036] Then, in the mounting unit 27, the electronic components 172a, b are supplied by the tape feeder 134, and the mounting head 136 and the moving device 138 are operated to mount the electronic components 172a, b on the bottom surface of the cavity 154, that is, on the upper surface of the resin laminate 152. Specifically, as shown in FIG. 10, the electronic component 172a is mounted so that the electrodes 178 come into contact with the conductive paste 166 in a cured state on the wirings 162a, b. At this time, the component body 176 of the electronic component 172a comes into contact with the conductive paste 170 in an uncured state discharged between the wirings 162a, b. Moreover, the electronic component 172b is mounted so that the electrodes 178 come into contact with the conductive paste 166 in a cured state on the wirings 162b, c. At this time, the component body 176 of the electronic component 172b comes into contact with the conductive paste 170 in an uncured state discharged between the wirings 162b, c. That is, conductive paste 166 is dispensed onto the intended position of electrode 178 on wiring 162, and conductive paste 170 is dispensed onto the intended position of component body 176. For this reason, by placing electronic component 172 on resin laminate 152, electrode 178 comes into contact with conductive paste 166 in a cured state on wiring 162, and component body 176 comes into contact with conductive paste 170 in an uncured state.

[0037] In this way, by placing the two electronic components 172a and 172b, the electronic component 172a is electrically connected to the two wirings 162a and 162b, and the electronic component 172b is electrically connected to the two wirings 162b and 162c. However, since the electronic component 172 is mounted so that the electrode 178 contacts the conductive paste 166 in a cured state, the contact area between the electrode 178 and the conductive paste 166 is small at this point. On the other hand, since the component body 176 of the electronic component 172 contacts the conductive paste 170 in an uncured state, the contact area between the component body 176 and the conductive paste 170 becomes somewhat large. Therefore, the electronic component 172 is fixed to the upper surface of the resin laminate 152 at the component body 176 by the adhesive force of the conductive paste 170. Then, the resin laminate 152 is heated at 105 degrees for one hour by the heater 66 built in the base 60. As a result, the conductive paste 170 is heated through the resin laminate 152 and cured.

[0038] Next, the stage 52 is moved below the fourth modeling unit 25. Then, in the fourth printing section 110 of the fourth modeling unit 25, the dispenser 116 dispenses the thermosetting resin 180 between the lower surface of the component body 176 of the electronic component 172 and the upper surface of the resin laminate 152, as shown in FIG. 11. As a result, the thermosetting resin 180 is sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176 of the electronic component 172. That is, the thermosetting resin 180 is sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176. Note that the amount of the thermosetting resin 180 dispensed by the dispenser 116 is controlled so that the thermosetting resin 180 does not protrude from between the upper surface of the resin laminate 152 and the lower surface of the component body 176. Then, the resin laminate 152 is heated to 70 degrees for 30 minutes by the heater 66 built in the base 60. As a result, the thermosetting resin 180 is heated and hardened through the resin laminate 152. Note that the thermosetting resin 180 does not harden completely even when heated at 70 degrees for 30 minutes. Therefore, the thermosetting resin 180 is in a semi-hardened state at this point.

[0039] When the thermosetting resin 180 injected between the upper surface of the resin laminate 152 and the lower surface of the component body 176 is semi-cured in this manner, the stage 52 is moved below the compression unit 26. Then, in the compression section 120 of the compression unit 26, the electronic components 172 mounted on the resin laminate 152 are compressed from above to below by the compression plate 122 via the rubber sheet 124, as shown in FIG. 12. During compression by the compression plate 122, the operation of the cylinder 126 is controlled, and the compression force by the compression plate 122 is set to 200 kgf. The two electronic components 172a, b are mounted in the cavity 154 of the resin laminate 152, but the depth dimension of the cavity 154 is smaller than the height dimension of the two electronic components 172. Therefore, the upper surfaces of the two electronic components 172a, b extend above the cavity 154, and the two electronic components 172 can be compressed from above to below by the compression plate 122. Furthermore, as described above, the sizes of the two electronic components 172 are different, and therefore the height dimensions are also different, but a rubber sheet 124 is attached to the lower surface of the compression plate 122. As a result, when the two electronic components 172a, b are compressed, the rubber sheet 124 elastically deforms, and the two electronic components 172a, b with different height dimensions can be appropriately compressed.

[0040] In addition, while the electronic component is compressed in the compression unit 26, the resin laminate 152 is heated at 85 degrees for 45 minutes by the heater 66 built in the base 60. As a result, the thermosetting resin 180 is heated through the resin laminate 152 and hardened. The thermosetting resin 180 is completely hardened by being heated at 85 degrees for 45 minutes. As a result, the thermosetting resin 180 is completely hardened while being sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176. In addition, as the electronic component 172 is compressed, that is, as the electronic component 172 mounted on the resin laminate 152 is pressed against the resin laminate 152, the conductive paste 166 in contact with the electrode 178 of the electronic component 172 is deformed, and the contact area between the electrode 178 and the conductive paste 166 increases. In particular, the Young's modulus of the conductive paste 166 is low in a hardened state. The Young's modulus is a proportional constant between the amount of strain and stress in the elastic range, and is the ratio of stress to the amount of strain. Therefore, when an object with a high Young's modulus and an object with a low Young's modulus are deformed with the same stress, the object with the low Young's modulus deforms more than the object with the high Young's modulus. In other words, an object with a low Young's modulus is easily deformed. In this way, the conductive paste 166 with a low Young's modulus is deformed by being pressed by the electrode 178, and the contact area between the electrode 178 and the conductive paste 166 increases. This ensures the electrical connection between the electronic component 172 and the wiring 162. In addition, when the electronic component 172 mounted on the resin laminate 152 is pressed against the resin laminate 152, the conductive paste 170 in contact with the component body 176 of the electronic component 172 is also deformed, and the contact area between the component body 176 and the conductive paste 170 also increases. In this way, the contact area between component body 176 and conductive paste 170 is increased, and the adhesive strength of conductive paste 170 allows electronic component 172 to be suitably fixed to resin laminate 152 .

[0041] In this way, the electronic components 172 placed on the upper surface of the resin laminate 152 are electrically connected to the wiring by the conductive paste 166 and are fixed by the adhesive force of the conductive paste 170, so that the circuit board is formed on the heat-sensitive release film 150 on the upper surface of the base 60. Then, in order to peel the heat-sensitive release film 150 from the formed circuit board, the heat-sensitive release film 150 is heated at 130 degrees for one hour by the heater 66 built in the base 60. This reduces the adhesiveness of the heat-sensitive release film 150, so that the circuit board 200 can be easily peeled off from the base 60 together with the heat-sensitive release film 150. Then, the heat-sensitive release film 150 is peeled off from the circuit board, completing the formation of the circuit board.

[0042] By forming a circuit board by such a method, it is possible to appropriately ensure the conductivity between the wiring 162 and the electrode 178 of the electronic component 172, compared to a circuit board formed by a conventional method. In detail, in the conventional method, the conductive paste 166 is discharged onto the wiring 162, the electronic component 172 is mounted so that the conductive paste 166 contacts the electrode 178, and then the conductive paste 166 is heated and cured. In other words, in the conventional method, after the electronic component 172 is mounted, the electronic component is mounted using a process of heating and curing the conductive paste 166 (hereinafter referred to as a "post-curing process").

[0043] On the other hand, in the new method, when the conductive paste 166 is discharged onto the wiring 162, the conductive paste 166 is heated and cured before the electronic component 172 is mounted. That is, in the new method, the electronic component is mounted using a process of heating and curing the conductive paste 166 before the electronic component 172 is mounted (hereinafter, referred to as a "pre-curing process"). In this way, by using the pre-curing process, it is possible to heat and cure the conductive paste 166 without deforming the conductive paste 166 and without applying stress to the conductive paste 166, and it is possible to prevent a decrease in conductivity when the conductive paste 166 is cured. Also, when the pre-curing process is used, the conductive paste 170 is applied to the intended mounting position of the component body 176 before the electronic component 172 is mounted, and the conductive paste 170 is not heated. That is, before the electronic component 172 is mounted, the conductive paste 166 applied to the intended mounting position of the electrode 178 is heated, but the conductive paste 170 applied to the intended mounting position of the component body 176 is not heated. Therefore, when electronic component 172 is mounted, component body 176 comes into contact with uncured conductive paste 170, increasing the contact area between component body 176 and conductive paste 170 to a certain extent. This allows electronic component 172 to be fixed to resin laminate 152 by the adhesive force of conductive paste 170.

[0044] In this way, by mounting the electronic component using the pre-curing process, the conductivity between the wiring 162 and the electrode 178 of the electronic component 172 is appropriately ensured, and the adhesive force of the conductive paste 170 makes it possible to prevent the mounted electronic component from being displaced. However, when the pre-curing process is used, the number of times the conductive paste is discharged increases compared to when the post-curing process is used, and the discharge time of the conductive paste becomes longer. In detail, in the pre-curing process, the conductive paste 166 is applied to the intended mounting positions of the two electrodes 178 of the electronic component 172, and the conductive paste 170 is applied to the intended mounting position of the component body 176 of the electronic component 172. That is, in the pre-curing process, the conductive paste 166 is applied to two locations and the conductive paste 170 is applied to one location, so that the conductive paste is applied to a total of three locations. On the other hand, in the post-curing process, the conductive paste 166 is applied only to the intended mounting positions of the two electrodes 178 of the electronic component 172, so that the conductive paste is applied to two locations. In this way, the number of locations where the conductive paste is dispensed in the pre-curing process is 1.5 times that of the conductive paste dispensed in the post-curing process, so the dispensing time of the conductive paste in the pre-curing process is longer than the dispensing time of the conductive paste in the post-curing process.

[0045] In view of this, in the circuit forming apparatus 10, the post-curing process and the pre-curing process are selectively performed according to the size of the electronic component. In detail, when the conductive paste is deformed or stress is applied during thermal curing, the conductivity of the conductive paste decreases. In addition, the electronic components expand during thermal curing, but the amount of thermal expansion when a small electronic component is heated is less than the amount of thermal expansion when a large electronic component is heated. Therefore, even if the conductive paste is heated with a small electronic component mounted, the stress on the conductive paste is smaller than when the conductive paste is heated with a large electronic component mounted. In other words, when the conductive paste is heated with a small electronic component mounted, the conductive paste does not deform much and only a small stress is applied, so that the conductivity is hardly decreased. Therefore, in the circuit forming apparatus 10, the post-curing process is used when mounting small electronic components that are equal to or smaller than a preset size (hereinafter referred to as the "set size"), and the pre-curing process is used when mounting electronic components that are larger than the set size.

[0046] As the set size, a component size with a maximum length of one side of 1.6 mm is set. Specifically, for example, component sizes include "3216", "2012", "1608", "1005", "0603", etc., and component sizes equal to or smaller than the set size are "1608", "1005", and "0603", while component sizes equal to or larger than the set size are "3216" and "2012". Therefore, the pre-curing process is used when mounting electronic components with component sizes "1608", "1005", and "0603", and the post-curing process is used when mounting electronic components with component sizes "3216" and "2012". The component size of electronic component 172a is equal to or smaller than the set size, and the component size of electronic component 172b is larger than the set size. Therefore, electronic component 172a with a size equal to or smaller than the set size is mounted using the post-curing process, and electronic component 172b with a size larger than the set size is mounted using the pre-curing process.

[0047] Specifically, when the conductive paste 166 is discharged onto the end of the wiring 162 as shown in FIG. 7, the mounting unit 27 places an electronic component 172a having a set size or smaller on the resin laminate 152 as shown in FIG. 13. At this time, the electronic component 172a is placed on the resin laminate 152 so that the uncured conductive paste 166 discharged onto the wiring 162a and wiring 162b comes into contact with the two electrodes. Then, when the electronic component 172a having a set size or smaller is placed on the resin laminate 152, the conductive paste 166 is heated by the heater 66 and cured. Note that the heating by the heater 66 cures not only the conductive paste 166 in contact with the electrode 178 of the electronic component 172a but also the remaining conductive paste 166, i.e., the conductive paste 166 discharged onto the intended mounting position of the electrode 178 of the electronic component 172b.

[0048] When the conductive paste 166 discharged onto the end of the wiring 162 is cured in this manner, the third modeling unit 24 discharges the conductive paste 170 between the wiring 162b and the wiring 162c, that is, onto the intended mounting position of the component body 176 of the electronic component 172b, as shown in FIG. 14. Then, in the mounting unit 27, as shown in FIG. 15, the electronic component 172b larger than the set size is placed on the resin laminate 152. At this time, the conductive paste 166 cured on the wiring 162b and the wiring 162c comes into contact with the electrode 178, and the electronic component 172b is placed on the resin laminate 152 so that the component body 176 comes into contact with the uncured conductive paste 170 discharged onto the resin laminate 152. Then, when the electronic component 172b larger than the set size is placed on the resin laminate 152, the conductive paste 170 is heated by the heater 66 and cured.

[0049] Next, in the fourth modeling unit 25, as shown in Fig. 16, thermosetting resin 180 is injected between the electronic components 172 and the resin laminate 152, and is heated by the heater 66, thereby semi-curing the thermosetting resin 180. Subsequently, in the compression unit 26, as shown in Fig. 17, the electronic components 172 attached to the resin laminate 152 are compressed from above to below by the compression plate 122 via the rubber sheet 124, and is heated by the heater 66, thereby curing the thermosetting resin 180. As a result, a circuit is formed.

[0050] In this way, by mounting electronic components 172a that are equal to or smaller than the set size by the post-curing process and mounting electronic components 172b that are larger than the set size by the pre-curing process, it is possible to reduce the number of locations where the conductive paste is discharged, and the time required to discharge the conductive paste can be shortened. However, even if the time required to discharge the conductive paste can be shortened, there is a risk that the time required to form the circuit cannot be shortened.

[0051] Specifically, when only the pre-curing process is performed regardless of the component size, seven steps are performed from the discharge of the conductive paste 166 onto the wiring 162 to the curing of the thermosetting resin while compressing the electronic component 172. That is, seven steps are performed: the discharge step of the conductive paste 166 onto the wiring 162 (FIG. 7), the curing step of the conductive paste 166 (FIG. 7), the discharge step of the conductive paste 170 (FIG. 9), the step of placing two electronic components (FIG. 10), the curing step of the conductive paste 170 (FIG. 10), the step of injecting the thermosetting resin (FIG. 11), and the step of curing the thermosetting resin while compressing the electronic component (FIG. 12). On the other hand, when the pre-curing process and the post-curing process are selectively performed depending on the component size, eight steps are performed from the discharge of the conductive paste 166 onto the wiring 162 to the curing of the thermosetting resin while compressing the electronic component 172. That is, eight steps are performed: a step of discharging conductive paste 166 onto wiring 162 (FIG. 7), a step of hardening conductive paste 166 (FIG. 7), a step of placing small electronic component 172a (FIG. 13), a step of discharging conductive paste 170 (FIG. 14), a step of placing large electronic component 172b (FIG. 15), a step of hardening conductive paste 170 (FIG. 15), a step of injecting thermosetting resin (FIG. 16), and a step of hardening thermosetting resin while compressing electronic components (FIG. 17). In this way, since the step when the pre-curing process and the post-curing process are selectively performed is one more step than the step when only the pre-curing process is performed, there is a risk that the circuit formation time cannot be shortened even if the conductive paste discharge time can be shortened.

[0052] In view of this, the discharge of conductive paste 166 onto the intended mounting position of the electrode of small electronic component 172a and the discharge of conductive paste 170 onto the intended mounting position of the component body of large electronic component 172b are performed at the same timing, that is, in one process, thereby shortening the circuit formation time. Specifically, when the conductive paste 166 is discharged onto the end of wiring 162, as shown in FIG. 7, the conductive paste 166 is discharged onto both the intended mounting position of electrode 178 of small electronic component 172a and the intended mounting position of electrode 178 of large electronic component 172b in the above description. On the other hand, in order to shorten the circuit formation time, as shown in FIG. 18, the conductive paste 166 is discharged only onto the intended mounting position of electrode 178 of large electronic component 172b, and the conductive paste 166 is not discharged onto the intended mounting position of electrode 178 of small electronic component 172a. Then, when the conductive paste 166 is dispensed only onto the positions where the electrodes 178 of the large electronic component 172b are to be attached, the conductive paste 166 is heated by the heater 66 and hardened.

[0053] Next, as shown in FIG. 19, conductive paste 170 is discharged onto the intended mounting position of component body 176 of large electronic component 172b, and conductive paste 166 is also discharged onto the intended mounting position of electrode 178 of small electronic component 172a. At this point, with respect to the conductive paste discharged onto the intended mounting position of large electronic component 172b, the conductive paste 166 discharged onto the intended mounting position of electrode 178 has hardened, and the conductive paste 170 discharged onto the intended mounting position of component body 176 is unhardened. On the other hand, with respect to the conductive paste discharged onto the intended mounting position of small electronic component 172a, the conductive paste 166 discharged onto the intended mounting position of electrode 178 is unhardened. Then, large electronic component 172b is placed on resin laminate 152 so that electrode 178 contacts hardened conductive paste 166 and component body 176 contacts unhardened conductive paste 170, as shown in FIG. Furthermore, small electronic component 172a is placed on resin laminate 152 such that electrode 178 is in contact with uncured conductive paste 166. Then, uncured conductive paste 166 in contact with electrode 178 of small electronic component 172a and uncured conductive paste 170 in contact with component body 176 of large electronic component 172b are heated by heater 66 and cured.

[0054] 16, thermosetting resin 180 is injected between electronic components 172 and resin laminate 152, and is heated by heater 66, thereby semi-curing thermosetting resin 180. Then, as shown in Fig. 17, electronic components 172 attached to resin laminate 152 are compressed from above to below by compression plate 122 via rubber sheet 124, and are heated by heater 66, thereby curing thermosetting resin 180. As a result, a circuit is formed.

[0055] When the discharge and hardening of the conductive paste, placement of the electronic components, and the like are performed in this order, seven steps are executed from the discharge of the conductive paste 166 onto the wiring 162 to the hardening of the thermosetting resin while compressing the electronic components 172. That is, the following seven steps are executed: a step of discharging the conductive paste 166 onto the planned mounting positions of the electrodes of the large electronic component 172b (FIG. 18), a step of hardening the conductive paste 166 (FIG. 18), a step of discharging the conductive paste onto the planned mounting positions of the component body of the large electronic component 172b and the planned mounting positions of the electrodes of the small electronic component 172a (FIG. 19), a step of placing the two electronic components (FIG. 15), a step of hardening the conductive paste (FIG. 15), a step of injecting the thermosetting resin (FIG. 16), and a step of hardening the thermosetting resin while compressing the electronic components (FIG. 17). In this way, by discharging and curing the conductive paste, placing electronic components, etc., it is possible to make the number of steps when the pre-curing process and the post-curing process are selectively performed the same as the number of steps when only the pre-curing process is performed. This makes it possible to shorten the time required to discharge the conductive paste by reducing the number of places where the conductive paste is discharged, and therefore to shorten the time required to form the circuit.

[0056] 2, the controller 140 of the control device 28 has a first application section 210, a first curing section 212, a second application section 214, a first placement section 216, a second placement section 218, a second curing section 220, an injection section 222, and a compression curing section 224. The first application section 210 is a functional section for discharging the conductive paste 166 to the intended mounting positions of the electrodes of the large electronic component 172b. The first curing section 212 is a functional section for curing the conductive paste 166 discharged to the intended mounting positions of the electrodes of the large electronic component 172b. The second application section 214 is a functional section for discharging the conductive paste to the intended mounting positions of the component body of the large electronic component 172b and the intended mounting positions of the electrodes of the small electronic component 172a. The first placement unit 216 is a functional unit for placing the large electronic component 172b on the resin laminate 152 so that the electrode 178 contacts the cured conductive paste 166 and the component body 176 contacts the uncured conductive paste 170. The second placement unit 218 is a functional unit for placing the small electronic component 172a on the resin laminate 152 so that the electrode 178 contacts the uncured conductive paste 166. The second curing unit 220 is a functional unit for curing the conductive pastes 166, 170 discharged to the component body of the large electronic component 172b and the electrode of the small electronic component 172a at the intended mounting position. The injection unit 222 is a functional unit for injecting a thermosetting resin between the electronic component 172 and the resin laminate 152. The compression curing unit 224 is a functional unit for curing the thermosetting resin while compressing the electronic components.

[0057] In the above embodiment, the circuit forming apparatus 10 is an example of an electronic component mounting apparatus. The control device 28 is an example of a control device. The heater 66 is an example of a curing device. The dispenser 106 is an example of a coating device. The mounting head 136 is an example of a placement device. The resin laminate 152 is an example of a resin layer. The wiring 162 is an example of a metal wiring. The conductive pastes 166 and 170 are an example of a conductive fluid. The electronic component 172a is an example of a second electronic component. The electronic component 172b is an example of a first electronic component. The component body 176 is an example of a component body. The electrode 178 is an example of an electrode. The thermosetting resin 180 is an example of a curable resin.

[0058] The present invention is not limited to the above embodiment, and can be embodied in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the pre-curing process and the post-curing process are selectively performed according to the part size, but the pre-curing process and the post-curing process may be selectively performed according to the characteristics of the part. For example, the expansion coefficient of the material constituting the part may be used as the characteristic of the part, and the post-curing process may be used when the expansion coefficient is equal to or less than a predetermined value, and the pre-curing process may be used when the expansion coefficient is greater than the predetermined value. Also, the number of terminals of the part may be used as the characteristic of the part, and the post-curing process may be used when the number of terminals is equal to or less than a predetermined number, and the pre-curing process may be used when the number of terminals is greater than the predetermined number.

[0059] Furthermore, in the above embodiment, the set size is a component size with a maximum side length of 1.6 mm, however, it is possible to set various numerical values ​​as the set size, such as the total value of two or more sides of a component, the area of ​​the top surface of a component, or the volume of a component, rather than the length of one side of the component.

[0060] In addition, in the above embodiment, the conductive paste 166 is used as the fluid that electrically connects the wiring 162 and the electrode 178 of the electronic component 172, but various fluids can be used as long as they exhibit conductivity.

[0061] In the above embodiment, ultraviolet curable resin and thermosetting resin are used as the curable resin, but two-liquid mixed curable resin, thermoplastic resin, etc. may be used. In the above embodiment, ultraviolet curable resin is used as the resin forming the resin laminate 152, and thermosetting resin is used as the resin fixing the electronic component 172. In other words, the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different curable resins, but the resin forming the resin laminate 152 and the resin fixing the electronic component 172 may be the same curable resin.

[0062] Furthermore, in the above embodiment, the conductive paste is dispensed by the dispenser 106, but it may be transferred by a transfer device or the like. Also, the conductive paste may be printed by screen printing. [Explanation of symbols]

[0063] 10: Circuit forming device (electronic component mounting device) 28: Control device 66: Heater (curing device) 106: Dispenser (applicator) 136: Mounting head (mounting device) 152: Resin laminate (resin layer) 162: Wiring (metal wiring) 166: Conductive paste (conductive fluid) 170: Conductive paste (conductive fluid) 172a: Electronic component (second electronic component) 172b: Electronic component (first electronic component) 176: Component body 178: Electrode 180: Thermosetting resin (curable resin)

Claims

1. applying a conductive fluid to a metal wiring arranged on the resin layer at a position where an electrode of a first electronic component is to be attached; a first curing step of curing the applied conductive fluid; applying a conductive fluid to a position on the resin layer where a component body of the first electronic component is to be mounted, and applying a conductive fluid to a metal wiring arranged on the resin layer where an electrode of a second electronic component is to be mounted; a step of placing the first electronic component by bringing electrodes of the first electronic component into contact with the conductive fluid hardened in the first hardening step and bringing a component body of the first electronic component into contact with the conductive fluid applied to a planned mounting position of the component body of the first electronic component; placing the second electronic component by bringing the electrodes of the second electronic component into contact with a conductive fluid applied to a position where the electrodes of the second electronic component are to be mounted; a second curing step of curing the conductive fluid applied to the intended mounting positions of a component body of the first electronic component and the intended mounting positions of an electrode of the second electronic component after the first electronic component and the second electronic component are placed; An electronic component mounting method comprising:

2. The first electronic component is a larger electronic component than the second electronic component.

2. The electronic component mounting method according to claim 1.

3. The first electronic component is an electronic component having a size larger than a preset electronic component size, and the second electronic component is an electronic component having a size smaller than the preset electronic component size.

3. The electronic component mounting method according to claim 1 or 2.

4. an injection step of injecting a curable resin between the first electronic component and the resin layer and between the second electronic component and the resin layer after the conductive fluid is cured in the second curing step; a third curing step of curing the curable resin while pressing the first electronic component and the second electronic component against the resin layer after the curable resin is injected in the injection step; The electronic component mounting method according to any one of claims 1 to 3, further comprising:

5. An application device that applies a conductive fluid; a curing device that cures the conductive fluid applied by the application device; A placement device for placing electronic components; A control device; Equipped with The control device includes: applying a conductive fluid to a metal wiring arranged on the resin layer at a position where an electrode of a first electronic component is to be attached; a first curing step of curing the applied conductive fluid; applying a conductive fluid to a position on the resin layer where a component body of the first electronic component is to be mounted, and applying a conductive fluid to a metal wiring arranged on the resin layer where an electrode of a second electronic component is to be mounted; a step of placing the first electronic component by bringing electrodes of the first electronic component into contact with the conductive fluid hardened in the first hardening step and bringing a component body of the first electronic component into contact with the conductive fluid applied to a planned mounting position of the component body of the first electronic component; placing the second electronic component by bringing the electrodes of the second electronic component into contact with a conductive fluid applied to a position where the electrodes of the second electronic component are to be attached; a second curing step of curing the conductive fluid applied to the intended mounting positions of a component body of the first electronic component and the intended mounting positions of an electrode of the second electronic component after the first electronic component and the second electronic component are placed; An electronic component placement machine that performs the above steps.

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