Inspection Equipment

Abstract

This inspection device (10) comprises a securing part (200) for securing a semiconductor device (500) that is a DUT, and an antenna part (30) that inspects the semiconductor device (500). The securing part (200) demarcates a hole (210) through which at least part of the semiconductor device (500) is exposed. At least a portion of the inner-side surface of the hole (210) in the securing part (200) has a step section.

Description

[Technical field]

[0001] The present invention relates to an inspection device. [Background technology]

[0002] In recent years, various inspection devices have been developed for inspecting semiconductor devices having antennas. For example, an inspection device as described in Patent Document 1 includes a holding section for holding a semiconductor device, which is a device under test (DUT), and an antenna section for inspecting the DUT. The holding section has a fixing section for fixing the DUT. The fixing section defines a hole for exposing at least a portion of the DUT. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2014 / 136159 Summary of the Invention [Problem to be solved by the invention]

[0004] A part of the radio waves emitted from the DUT may be scattered by the fixed part. In this case, if the inner surface of the hole formed in the fixed part is flat, distortion may occur in the radiation pattern of the radio waves from the DUT.

[0005] One object of the present invention is to reduce distortion of the radiation pattern of radio waves from a DUT. Other objects of the present invention will become apparent from the description of this specification. [Means for solving the problem]

[0006] One aspect of the present invention is a fixing portion for fixing the device to be inspected; an antenna unit for inspecting the device to be inspected; Equipped with the fixing portion defines a hole exposing at least a portion of the device under test; At least a portion of an inner surface of the hole of the fixing portion has a step portion. Effect of the Invention

[0007] According to the above-described aspects of the present invention, it is possible to reduce distortion in the radiation pattern of radio waves from the DUT. [Brief description of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view of an inspection device according to an embodiment. [Diagram 2] FIG. 2 is a perspective view of the upper surface of the holding portion according to the embodiment. [Diagram 3] 1 is a perspective view of a top surface of a semiconductor device; [Figure 4] 13 is a diagram for explaining details of an example of a stepped shape of an inner surface of a hole of a fixing portion. FIG. [Diagram 5] FIG. 11 is a cross-sectional view of an inspection device according to a comparative example. [Figure 6] 4 is a diagram showing a radiation pattern of radio waves from a semiconductor device of the inspection device according to the embodiment; FIG. [Figure 7] 11 is a diagram showing a radiation pattern of radio waves from a semiconductor device of an inspection device according to a comparative example; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0010] In this specification, ordinal numbers such as "first," "second," "third," etc., unless otherwise specified, are used merely to distinguish between similarly named configurations and do not imply any particular characteristics (e.g., order or importance) of the configurations.

[0011] Fig. 1 is a cross-sectional view of an inspection device 10 according to an embodiment. Fig. 2 is a perspective view of the upper surface of a holding unit 20 according to an embodiment. Fig. 3 is a perspective view of the upper surface of a semiconductor device 500.

[0012] In Fig. 1 to Fig. 3, the direction of the arrow indicating the first direction X, the second direction Y, or the third direction Z indicates the positive direction of the direction indicated by the arrow. On the other hand, the opposite direction of the arrow indicating the first direction X, the second direction Y, or the third direction Z indicates the negative direction of the direction indicated by the arrow. Also, the white circle with X indicating the second direction Y indicates that the positive direction of the direction indicated by the white circle with X is the direction from the front to the back of the paper, and the negative direction of the direction indicated by the white circle with X is the direction from the back to the front of the paper. The same applies to Fig. 4 to Fig. 7 described later.

[0013] The first direction X is a direction parallel to the horizontal direction, i.e., a direction perpendicular to the vertical direction. Specifically, the first direction X is a direction parallel to one side of the substantially square semiconductor device 500 described later. The second direction Y is a direction parallel to the horizontal direction and perpendicular to the first direction X. Specifically, the second direction Y is a direction parallel to another side perpendicular to the side parallel to the first direction X of the semiconductor device 500. The third direction Z is a vertical direction and perpendicular to both the first direction X and the second direction Y. The positive direction of the third direction Z is the upward direction in the vertical direction. The negative direction of the third direction Z is the downward direction in the vertical direction.

[0014] 1 is a cross section passing through the center of the inspection device 10 in the second direction Y along a direction perpendicular to the second direction Y. In FIG.

[0015] First, a semiconductor device 500 that is a device under test (DUT) of the testing apparatus 10 will be described with reference to FIG.

[0016] Four antenna elements 510 are provided on the upper surface of the semiconductor device 500. The outer shape of the antenna elements 510 is a plate-like square, but may be a plate-like circular shape or any other shape. The four antenna elements 510 are arranged in a square lattice of two rows and two columns so as to form an array antenna. By controlling the conditions such as the amplitude and phase of the radio wave radiated from each antenna element 510, the radio wave radiated from the semiconductor device 500 can be controlled. The layout of the antenna elements 510 is not limited to the layout according to this embodiment. For example, only one antenna element 510 may be provided on the upper surface of the semiconductor device 500. Also, multiple antenna elements 510 may be arranged in a rectangular lattice. Also, multiple antenna elements 510 may be arranged in a row in one direction. Alternatively, multiple antenna elements 510 may be arranged in a polygonal lattice such as a triangular lattice, a rectangular lattice, or a hexagonal lattice. Alternatively, multiple antenna elements 510 may be arranged in a circular ring or an elliptical ring.

[0017] Next, the inspection device 10 will be described with reference to FIGS.

[0018] The inspection device 10 includes a holding section 20 and an antenna section 30. The holding section 20 holds a semiconductor device 500. The holding section 20 has an inspection board 110, a socket 120, and a fixing section 200. The antenna section 30 inspects the semiconductor device 500.

[0019] The inspection board 110 is, for example, a PCB (Printed Circuit Board). The socket 120 is provided on the upper surface of the inspection board 110. The semiconductor device 500 is mounted on the upper surface of the inspection board 110 via the socket 120. The inspection board 110 and the semiconductor device 500 are electrically connected to each other via the socket 120. A signal input to the inspection board 110 is input to the semiconductor device 500 via the socket 120. Also, a signal output from the semiconductor device 500 is output from the inspection board 110 via the socket 120.

[0020] The fixing part 200 is formed of an insulating material such as resin. The fixing part 200 presses (fixes) the semiconductor device 500 toward the inspection board 110. Specifically, the fixing part 200 has a pressing part 202 that contacts the edge of the upper surface of the semiconductor device 500. By bringing the pressing part 202 into contact with the edge of the upper surface of the semiconductor device 500, the fixing part 200 fixes the semiconductor device 500 in a predetermined position on the socket 120 and presses the semiconductor device 500 toward the socket 120. This ensures contact between the semiconductor device 500 and the socket 120.

[0021] The fixing portion 200 defines a hole 210 that exposes at least a portion of the semiconductor device 500, specifically at least a portion of the top surface of the semiconductor device 500. Radio waves radiated from an antenna element 510 provided on the top surface of the semiconductor device 500 reach the antenna unit 30 via the hole 210. In addition, radio waves radiated from the antenna unit 30 reach the antenna element 510 provided on the top surface of the semiconductor device 500 via the hole 210.

[0022] The antenna section 30 performs an OTA (Over-the-Air) inspection of the semiconductor device 500. The antenna section 30 is disposed above the semiconductor device 500. The antenna section 30 performs at least one of transmitting radio waves to be radiated to the semiconductor device 500 and receiving radio waves radiated from the semiconductor device 500. Specifically, the antenna section 30 is electrically connected to an external measuring device (not shown). Based on a signal input from the external measuring device to the antenna section 30, radio waves are radiated from the antenna section 30 toward the semiconductor device 500. Also, based on the radio waves radiated from the semiconductor device 500 toward the antenna section 30, a signal is output from the antenna section 30 to the external measuring device.

[0023] Next, the hole 210 of the fixing portion 200 will be described in detail with reference to FIGS.

[0024] At least a part of the inner surface of the hole 210 has a step shape in the third direction Z and has a step portion. Specifically, the inner surface of the hole 210 includes a plurality of horizontal surfaces 212 and a plurality of vertical surfaces 214 that form a step shape. When viewed in the depth direction of the hole 210, i.e., the third direction Z, the plurality of horizontal surfaces 212 are arranged concentrically with respect to the center of the hole 210. In addition, the position of each of the plurality of horizontal surfaces 212 in the third direction Z increases with distance from the center of the hole 210. In this embodiment, the portion of the inner surface of the hole 210 from the bottom of the hole 210, i.e., the lower end of the hole 210 on the negative side of the third direction Z, to the opening of the hole 210, i.e., the upper end of the hole 210 on the positive side of the third direction Z, is formed into a four-step step shape. Note that the layout of the step shape and the number of steps of the step shape are not limited to the example according to this embodiment. For example, when viewed in the depth direction of the hole 210, the plurality of horizontal surfaces 212 may be arranged non-concentrically with respect to the center of the hole 210. The number of steps in the staircase shape may be, for example, at least one.

[0025] The radio waves emitted from the semiconductor device 500 may be scattered by the holding part 202 of the fixed part 200. The more components of the radio waves scattered by the holding part 202 that travel vertically in the space above the semiconductor device 500, the greater the distortion that may occur in the radiation pattern of the radio waves from the semiconductor device 500. In this embodiment, as shown in FIG. 5 described later, the components of the radio waves scattered by the holding part 202 that travel vertically in the space above the semiconductor device 500 can be reduced compared to the case where the inner surface of the hole 210K is flat along the third direction Z. That is, in this embodiment, by setting the vertical dimension (dimension in the third direction Z) Δv of each step of the step shape of the inner surface of the hole 210 to an appropriate distance according to the inspection frequency of the semiconductor device 500, the radio waves that travel inside the fixed part 200 and are scattered at both ends of the vertical surface 214 can cancel each other out. This reduces the component of the radio waves scattered by the pressing portion 202 that travels vertically within the space above the semiconductor device 500, compared to when the inner surface of the hole 210K is flat along the third direction Z, as shown in Figure 5 described below, making it easier for the radio waves to travel horizontally within the fixed portion 200.

[0026] In this embodiment, the layout of the step shape on the inner side of the hole 210 is substantially similar to a figure formed by connecting the layout of the multiple antenna elements 510 provided in the semiconductor device 500 with virtual straight lines when viewed from the depth direction of the hole 210. That is, in this embodiment, the layout of the multiple horizontal surfaces 212 of the hole 210 is substantially similar to a figure formed by connecting the multiple antenna elements 510 with virtual straight lines when viewed from the third direction Z. In this case, by setting the horizontal dimension Δh of each step of the step shape on the inner side of the hole 210 to an appropriate distance according to the inspection frequency of the semiconductor device 500, it is possible to make the radio waves scattered at both ends of the horizontal surface 212 cancel each other out. Therefore, compared to a case where the layout of the step shape on the inner side of the hole 210 is not similar to the layout of the multiple antenna elements 510 when viewed from the third direction Z, it is possible to weaken the radio waves scattered by the inner side of the hole 210 of the fixed part 200. However, the layout of the staircase shape on the inner side of the hole 210 as viewed from the third direction Z does not need to be similar to the layout of the multiple antenna elements 510 as long as the horizontal dimension Δh is an appropriate value that produces the above-mentioned effect.

[0027] Fig. 4 is a diagram for explaining details of an example of the step shape of the inner surface of the hole 210 of the fixed part 200. The test board 110 and the antenna part 30 shown in Fig. 1 are not shown in Fig. 4. In addition, in Fig. 4, the electric field distribution Eh indicates the electric field distribution formed by the radio waves traveling horizontally from the center of the hole 210 to the outside inside the fixed part 200. The electric field distribution Ev indicates the electric field distribution formed by the radio waves traveling vertically from the semiconductor device 500 upward in the space above the semiconductor device 500.

[0028] The vertical dimension Δv of each step of the step shape on the inner surface of the hole 210 is determined based on the wavelength λ / (ε r ) 1 / 2The wavelength of the inspection frequency of the semiconductor device 500 can be set to about (2N-1) / 4 times, for example, (2N-1) / 4-1 / 16 times or more and (2N-1) / 4+1 / 16 times or less. Here, λ is the wavelength of the inspection frequency of the semiconductor device 500, and ε r is the relative dielectric constant of the fixed portion 200, and N is an integer equal to or greater than 1. For example, when the inspection frequency of the semiconductor device 500 is 28.5 GHz, ε r When = 3.44 and N = 1, the vertical dimension Δv can be approximately 1.42 mm.

[0029] The horizontal dimension Δh of each step of the staircase shape on the inner surface of the hole 210 can be approximately (2M-1) / 4 times the wavelength λ in air of a radio wave having the inspection frequency of the semiconductor device 500, for example, from (2M-1) / 4-1 / 16 to (2M-1) / 4+1 / 16 times. Here, λ is the wavelength of the inspection frequency of the semiconductor device 500, and M is an integer equal to or greater than 1. For example, when the inspection frequency of the semiconductor device 500 is 28.5 GHz and M=1, the horizontal dimension Δh can be approximately 2.63 mm.

[0030] The vertical dimension Δv is λ / (ε r ) 1 / 2 If the vertical dimension Δv is λ / (ε r ) 1 / 2 Compared to the difference of (2N-1) / 4 times, The radio waves emitted from the semiconductor device 500 and scattered by the pressing portion 202 are This makes it possible to easily separate radio waves radiated from the semiconductor device 500 from the radio waves traveling vertically upward from the semiconductor device 500 within the space above the semiconductor device 500 without being scattered by the pressing portion 202 .

[0031] Specifically, at least a portion of the radio waves radiated from the semiconductor device 500 and traveling through the fixing part 200 from the pressing part 202 has a wavelength λ / (ε r ) 1 / 2 A part of this radio wave branches off toward the upper part inside the fixed part 200 at each step of the staircase shape on the inner surface of the hole 210 and is reflected toward the lower part inside the fixed part 200 by the horizontal surface 212. When the vertical dimension Δv is λ / (ε r ) 1 / 2When the vertical dimension Δv is (2N-1) / 4 times λ / (ε), the radio waves traveling upward in the fixed part 200 at each step of the step shape on the inner surface of the hole 210 and the radio waves reflected by the horizontal surface 212 traveling downward in the fixed part 200 cancel each other out. r ) 1 / 2 When the distance is (2N-1) / 4 times, it is possible to make it easier for the radio waves radiated from the semiconductor device 500 and traveling within the fixed part 200 to travel in the horizontal direction rather than the vertical direction.

[0032] When the lateral dimension Δh is (2M-1) / 4 times λ, it is easier to separate the components of the radio waves radiated from semiconductor device 500 that are scattered at the interface between the inner surface of hole 210 and the air in contact with said inner surface from the radio waves traveling directly vertically upward from semiconductor device 500 through the space above semiconductor device 500, compared to when the lateral dimension Δh is other than (2M-1) / 4 times λ.

[0033] Specifically, at least a part of the radio waves radiated from the semiconductor device 500 and traveling along the interface between the inner surface of the hole 210 in the fixed part 200 and the air in contact with the inner surface is scattered at both ends of the horizontal surface 212. When the horizontal dimension Δh is (2M-1) / 4 times λ, the radio waves scattered at both ends of the horizontal surface 212 cancel each other out. Therefore, when the horizontal dimension Δh is (2M-1) / 4 times λ, it is possible to make it more difficult for the radio waves radiated from the semiconductor device 500 and scattered at the interface between the inner surface of the hole 210 and the air in contact with the inner surface to travel in the vertical direction, compared to when the horizontal dimension Δh is different from (2M-1) / 4 times λ.

[0034] 5 is a cross-sectional view of an inspection device 10K according to a comparative example. The inspection device 10K according to the comparative example is similar to the inspection device 10 according to the embodiment, except for the following points.

[0035] The fixing part 200K of the inspection device 10K according to the comparative example fixes the semiconductor device 500 at a predetermined position on the socket 120 by bringing the pressing part 202K into contact with the edge of the upper surface of the semiconductor device 500, and presses the semiconductor device 500 toward the socket 120. Moreover, the inner surface of the hole 210K of the fixing part 200K of the inspection device 10K according to the comparative example is flat along the third direction Z.

[0036] Fig. 6 is a diagram showing a radiation pattern of radio waves from the semiconductor device 500 of the inspection device 10 according to the embodiment. Fig. 7 is a diagram showing a radiation pattern of radio waves from the semiconductor device 500 of the inspection device 10K according to the comparative example. In Figs. 6 and 7, the numbers on the outside of the circle with the scale indicate the azimuth of the radiation pattern (unit: degree). Furthermore, the numbers written from the center of the circle to the 0 degree direction indicate the gain (unit: dBi). Furthermore, the 0 degree direction of the radiation pattern, i.e., the boresight direction, is the positive direction of the third direction Z.

[0037] As shown in Fig. 7, the radiation pattern according to the comparative example has ripples in the directions of about ±15 degrees. In contrast, as shown in Fig. 6, in the radiation pattern according to the embodiment, the gain is almost constant from the 0 degree direction to the directions of about ±15 degrees. This result suggests that the distortion of the radiation pattern of the semiconductor device 500 is reduced by the stepped shape of the inner surface of the hole 210 of the fixed part 200.

[0038] Although the embodiments of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted.

[0039] Furthermore, these actions have been described as occurring when radio waves are radiated from semiconductor device 500, but similar effects can be obtained when radio waves radiated from antenna portion 30 are received by semiconductor device 500, except that the direction of the radio waves is reversed.

[0040] According to the present specification, the following aspects are provided. (Aspect 1) Aspect 1 is a fixing portion for fixing the device to be inspected; an antenna unit for inspecting the device to be inspected; Equipped with the fixing portion defines a hole exposing at least a portion of the device under test; At least a portion of an inner surface of the hole of the fixing portion has a step portion. According to the first aspect, compared to when the inner surface of the hole is flat along the depth direction of the hole, it is possible to reduce the components of the radio waves scattered by the fixed part that travel from the device under test toward the antenna part in the space between the device under test and the antenna part, and to facilitate the radio waves to travel from the center of the hole to the outside within the fixed part. Therefore, according to the first aspect, it is possible to reduce distortion of the radiation pattern of the radio waves from the device under test, compared to when the inner surface of the hole is flat along the depth direction of the hole. (Aspect 2) Aspect 2 is This is an inspection device as described in aspect 1, wherein the vertical dimension of the step portion of the inner surface of the hole is greater than or equal to (2N-1) / 4-1 / 16 times and less than or equal to (2N-1) / 4+1 / 16 times (N is an integer greater than or equal to 1) the wavelength within the fixed portion of the radio waves having the inspection frequency of the inspected device. According to aspect 2, compared to when the vertical dimension is different from the above value, it is easier to separate radio waves emitted from the inspected device and scattered by the fixed part from radio waves emitted from the inspected device and traveling through the space between the inspected device and the antenna part without being scattered by the fixed part from the radio waves traveling from the inspected device to the antenna part. (Aspect 3) Aspect 3 is The horizontal dimension of the step portion of the inner surface of the hole is (2M-1) / 4-1 / 16 times or more (2M - 3. The inspection device according to claim 1, wherein M is 1) / 4+1 / 16 times or less (M is an integer of 1 or more). According to the third aspect, compared to when the horizontal dimension is different from the above-mentioned values, it is possible to easily separate the components of the radio waves emitted from the inspected device that are scattered at the interface between the inner surface of the hole and the air in contact with said inner surface from the radio waves traveling directly from the inspected device to the antenna unit through the space between the inspected device and the antenna unit. (Aspect 4) Aspect 4 is An inspection device according to any one of aspects 1 to 3, wherein when viewed from the depth direction of the hole, the layout of the step portion on the inner surface of the hole is substantially similar to the layout of a plurality of antenna elements provided in the inspected device. According to aspect 4, by setting the horizontal dimension of the step portion on the inner surface of the hole to an appropriate distance depending on the test frequency of the device under test, the radio waves scattered by the inner surface of the hole of the fixing part can be weakened compared to a case where the layout of the step portion on the inner surface of the hole when viewed from the depth direction of the hole is not similar to the layout of the multiple antenna elements.

[0041] This application claims priority based on Japanese Patent Application No. 2020-143159, filed on August 27, 2020, the disclosure of which is incorporated herein in its entirety. [Explanation of symbols]

[0042] 10 Inspection equipment 10K Inspection Equipment 20 Holding part 30 Antenna section 110 Test board 120 Sockets 200 Fixed part 200K fixed part 202 Clamp 202K Clamp 210 holes 210K hole 212 Horizontal plane 214 Vertical Surface 500 Semiconductor device 510 Antenna Element Eh Electric field distribution Ev Electric field distribution X 1st direction Y 2nd direction Z 3rd direction

Claims

1. a fixing portion for fixing the device to be inspected; an antenna unit for inspecting the device to be inspected; Equipped with the fixing portion defines a hole exposing at least a portion of the device under test; An inspection device, wherein at least a portion of an inner surface of the hole of the fixing portion has a step portion.

2. 2. The inspection device according to claim 1, wherein a vertical dimension of the step portion of the inner surface of the hole is equal to or greater than (2N-1) / 4-1 / 16 times and equal to or less than (2N-1) / 4+1 / 16 times (N is an integer equal to or greater than 1) the wavelength within the fixed portion of a radio wave having an inspection frequency of the inspected device.

3. 3. The inspection device according to claim 1, wherein a horizontal dimension of the step portion of the inner surface of the hole is equal to or greater than (2M-1) / 4-1 / 16 times and equal to or less than (2M-1) / 4+1 / 16 times (M is an integer equal to or greater than 1) the wavelength in air of radio waves having the inspection frequency of the inspected device.

4. An inspection device as described in any one of claims 1 to 3, wherein, when viewed from the depth direction of the hole, the layout of the step portion on the inner surface of the hole is substantially similar to the layout of a plurality of antenna elements provided in the inspected device.

Images