Substrate processing method

Abstract

To shorten the period required for substrate processing.SOLUTION: In a substrate processing method, a flow recipe including a first process recipe for setting the content of a first process to be executed on a substrate, a second process recipe for setting the content of a second process to be executed on the substrate after the first process, and a pre-recipe that sets the content of the preliminary operation for the second process recipe is preset. The first process includes discharging a first chemical solution onto the substrate, the second process includes discharging the first chemical solution onto the substrate, and the preliminary operation includes discharging the first chemical solution. The substrate processing method includes the steps of executing a first process, determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold, and reducing the time of preliminary operation and executing the second process when the period from the end of the first process to the start of the second process is shorter than the first threshold.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present disclosure relates to a method for processing a substrate. [Background technology]

[0002] In the process of manufacturing electronic devices (e.g., semiconductor devices, liquid crystal display devices) using substrates, various processes (hereinafter referred to as "substrate processes") are performed on the substrates. Substrate processes include, for example, so-called single-wafer processes in which processes are performed on substrates one by one. Single-wafer processes include, for example, cleaning processes and etching processes.

[0003] A chemical liquid used in substrate processing (hereinafter also referred to as a "processing liquid") is supplied to the substrate from, for example, a nozzle. To increase the efficiency of the processing, for example, the nozzle is supplied with the processing liquid adjusted (for example, heated) to a temperature suitable for the processing from a pipe. The contents of the substrate processing are determined as a process recipe.

[0004] After the substrate processing is completed, the processing liquid may remain in the nozzle or piping, and the temperature of the remaining processing liquid may become lower than the temperature suitable for processing. The specific gravity of the processing liquid may change due to precipitation of components contained in the processing liquid. Such a phenomenon is likely to cause deterioration of the processing liquid. If a deteriorated processing liquid is used, it is difficult to perform appropriate substrate processing.

[0005] Patent Document 1 proposes performing a pre-dispense operation to discard retained processing liquid as a pre-operation to be performed before substrate processing. The contents of the pre-operation are defined as a pre-recipe. Patent Document 2 proposes a technique to perform substrate processing and a pre-dispense operation for each substrate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2009-231733 A [Patent Document 2] JP 2019-160910 A Summary of the Invention [Problem to be solved by the invention]

[0007] It is assumed that if the period during which the processing liquid remains in the nozzle or piping is short, the processing liquid will not deteriorate to the extent that the substrate processing cannot be performed properly. Even if the substrate processing is performed multiple times discontinuously, if the period during which the substrate processing is not performed is short, the substrate processing will be performed properly even if the period required for the pre-dispense operation (hereinafter also referred to as "pre-processing") is reduced. Reducing the period required for the pre-dispense operation shortens the period required for the substrate processing. The present disclosure provides a simplified substrate processing method. [Means for solving the problem]

[0008] The substrate processing method according to the present disclosure is a substrate processing method in which a flow recipe including a first process recipe for setting a content of a first process to be performed on a substrate, a second process recipe for setting a content of a second process to be performed on the substrate after the first process, and a pre-recipe for setting a content of a preliminary operation for the second process recipe is preset. In a first aspect of the substrate processing method, the first process includes discharging a first chemical liquid onto the substrate, the second process includes discharging the first chemical liquid onto the substrate, and the preliminary operation includes discharging the first chemical liquid.

[0009] A first aspect of this substrate processing method includes a step of performing the first process, a step of determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold value, and, if the result of the determination is positive, a step of reducing a time of the preparatory operation and performing the second process.

[0010] The first step of this substrate processing method 1 The aspect of ,beforeWhen the period from the end of the ejection of the first chemical liquid in the first process to the start of the ejection of the first chemical liquid in the second process is shorter than a second threshold value that is longer than the first threshold value and longer than the first threshold value, the time of the preparatory operation is reduced.

[0011] The first step of this substrate processing method 2 The embodiment is as follows: 1 In this aspect, when the period from the end of the ejection of the first chemical liquid in the first process to the start of the ejection of the first chemical liquid in the second process is longer than a third threshold value that is longer than the second threshold value, the time of the preparatory operation is increased.

[0012] The first step of this substrate processing method 3 The embodiment of the present invention is as follows: a substrate processing method in which a flow recipe including a first process recipe for setting a content of a first process to be performed on a substrate, a second process recipe for setting a content of a second process to be performed on the substrate after the first process, and a pre-recipe for setting a content of a preliminary operation for the second process recipe is set in advance, the first process including a discharge of a first chemical liquid onto the substrate, the second process including a discharge of the first chemical liquid onto the substrate, and the preliminary operation including a discharge of the first chemical liquid, the method comprising: a step of performing the first process; a step of determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold value; and a step of reducing a time of the preliminary operation and performing the second process if a result of the determination is positive; When a time longer than a fourth threshold value, which is longer than the first threshold value, has elapsed after the ejection of the first chemical liquid has ended without the ejection of the first chemical liquid being resumed, the discharge of the first chemical liquid is executed.

[0013] The first step of this substrate processing method 4 The embodiment of the present invention is as follows: a substrate processing method in which a flow recipe including a first process recipe for setting a content of a first process to be performed on a substrate, a second process recipe for setting a content of a second process to be performed on the substrate after the first process, and a pre-recipe for setting a content of a preliminary operation for the second process recipe is set in advance, the first process including a discharge of a first chemical liquid onto the substrate, the second process including a discharge of the first chemical liquid onto the substrate, and the preliminary operation including a discharge of the first chemical liquid, the method comprising: a step of performing the first process; a step of determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold value; and a step of reducing a time of the preliminary operation and performing the second process if a result of the determination is positive; The flow recipe includes N of the first processes corresponding to N of the substrates (N is an integer equal to or greater than 2), and when the first process for the first through (N-1) substrates is completed and the first process for the Nth substrate is initiated, it is determined whether the period from the completion of the Nth first process to the start of the second process is shorter than the first threshold value. Effect of the Invention

[0014] According to the first aspect of the substrate processing method of the present disclosure, the time required for substrate processing is shortened.

[0015] Moreover, This reduces the time required for substrate processing.

[0016] The present disclosure relates to a substrate processing method. 2According to this aspect, the influence of deterioration of the chemical solution on the second process is reduced.

[0017] The present disclosure relates to a substrate processing method. 3 According to this aspect, the influence of deterioration of the chemical solution on subsequent processing is reduced.

[0018] The present disclosure relates to a substrate processing method. 4 According to this aspect, even if the flow recipe is changed during execution, it is possible to appropriately determine whether or not pre-processing is required. [Brief description of the drawings]

[0019] [Figure 1] 1 is a schematic plan view showing an example of a schematic configuration of a substrate processing apparatus; [Diagram 2] FIG. 2 is a schematic diagram illustrating the configuration of one processing unit. [Diagram 3] 3 is a schematic diagram illustrating a configuration of a treatment liquid supply unit; FIG. [Figure 4] 1 is a diagram showing an example of a schematic configuration of a substrate processing system; [Diagram 5] FIG. 2 is a block diagram showing an example of an electrical configuration of a host computer. [Figure 6] 3 is a block diagram showing an example of an electrical configuration of a main body control unit. FIG. [Figure 7] 4 is a block diagram showing an example of an electrical configuration of a fluid management control unit. FIG. [Figure 8] FIG. 13 is a diagram illustrating an example of processing using a processing unit. [Figure 9] 1 is a timing chart conceptually illustrating a flow recipe. [Figure 10] 1 is a timing chart illustrating the contents of a process recipe over time. [Figure 11] 1 is a timing chart illustrating the contents of a process recipe over time. [Figure 12] 1 is a timing chart illustrating the contents of a process recipe over time. [Figure 13]4 is a timing chart illustrating the contents of a pre-recipe over time. [Figure 14] 4 is a timing chart illustrating the contents of a pre-recipe over time. [Figure 15] 4 is a timing chart showing a part of a flow recipe. [Figure 16] 11 is a flowchart illustrating a routine for determining whether pre-processing is required. [Figure 17] 1 is a timing chart showing a substrate processing using a process recipe and a pre-recipe. [Figure 18] 1 is a timing chart showing a substrate processing using a process recipe and a pre-recipe. [Figure 19] 1 is a timing chart showing a substrate processing using a process recipe and a pre-recipe. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] <Points to note in the explanation> Hereinafter, an embodiment will be described with reference to the attached drawings. Note that the drawings are schematic, and for the convenience of explanation, configurations are omitted or simplified as appropriate. Furthermore, the size and positional relationship of the configurations shown in the drawings are not necessarily accurately described, and may be changed as appropriate.

[0021] In the following description, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

[0022] In addition, in the description below, even if ordinal numbers such as "first" or "second" are used, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and are not limited to the ordering that may result from these ordinal numbers.

[0023] Expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) not only strictly indicate the positional relationship, but also indicate a state in which the two are relatively displaced in terms of angle or distance within a range in which a tolerance or similar function is obtained, unless otherwise specified. Expressions indicating an equal state (e.g., "same," "equal," "homogeneous," etc.) not only strictly indicate a state in which the two are quantitatively equal, but also indicate a state in which there is a difference in which a tolerance or similar function is obtained, unless otherwise specified. Expressions indicating a shape (e.g., "square shape" or "cylindrical shape," etc.) not only strictly indicate the shape geometrically, but also indicate a shape having, for example, irregularities or chamfers, within a range in which a similar effect is obtained, unless otherwise specified. The expressions "comprise," "include," "have," "includes," "includes," or "has" a component are not exclusive expressions that exclude the presence of other components. The expression "at least one of A, B, and C" includes A only, B only, C only, any two of A, B, and C, and all of A, B, and C.

[0024] <1-1. Configuration example of substrate processing apparatus> Fig. 1 is a schematic plan view showing an example of a schematic configuration of a substrate processing apparatus 20. In Fig. 1, a direction perpendicular to the paper surface corresponds to a vertical direction with respect to the substrate processing apparatus 20. The substrate processing apparatus 20 performs single-wafer processing, for example, by supplying a processing liquid to a surface of a substrate W. In the following, an example will be described in which a semiconductor substrate (wafer) is used as the substrate W.

[0025] In the following, a substrate processing will be described by taking as an example a cleaning process that uses a processing liquid to remove foreign matter or objects to be removed. Examples of processing liquids that can be used in the cleaning process include a mixture of ammonia and hydrogen peroxide (used in Standard Cleaning 1, which is used in so-called RCA cleaning; hereinafter referred to as "processing liquid SC1"), dilute hydrofluoric acid (HF) diluted with pure water (hereinafter referred to as "processing liquid DHF"), and isopropyl alcohol (hereinafter referred to as "processing liquid IPA").

[0026] In addition to the above examples, other processing liquids may be used in the cleaning process. In addition to the above examples, instead of or together with the cleaning process, for example, an etching process using an etchant, a rinsing process for washing with water, or a coating process for coating a resist may be used.

[0027] The substrate processing apparatus 20 includes load ports LP1, LP2, LP3, and LP4. The number of load ports is not limited to four. Each of the load ports LP1, LP2, LP3, and LP4 functions as a container holding mechanism that holds a carrier C. The carrier C functions as a FOUP (Front Opening Unified Pod) that holds a plurality of substrates W (e.g., 25 substrates W).

[0028] To the load ports LP1, LP2, LP3, and LP4, for example, a carrier C is transported from a carrier storage area 40 by a transport device 30 and placed thereon. When a plurality of substrate processing devices 20 are provided, for example, the transport device 30 transports the carrier C between the substrate processing devices 20.

[0029] The substrate processing apparatus 20 includes six processing units 21. The number of processing units 21 is not limited to six. In the example shown in FIG. 1, three processing units 21 are arranged in a set stacked in the vertical direction. Hereinafter, one set of processing units 21 (here, three processing units 21 arranged in a stacked vertical direction) may be described as one tower 21t. Two towers 21t appear in a plan view.

[0030] The substrate processing apparatus 20 further includes, for example, an indexer robot 91, a center robot 92, a main body control unit 22, storage tanks 261, 262, 263, and 264, a liquid management control unit 24, and a processing liquid supply unit .

[0031] The indexer robot 91, for example, transports substrates W between the load ports LP1, LP2, LP3, LP4 and the center robot 92. The center robot 92 has a function of transporting substrates W, for example, between the indexer robot 91 and the processing units 21. The indexer robot 91 and the center robot 92 function as a transport section 93 that transports multiple substrates W accommodated in the carrier C from the carrier C to each of the processing units 21.

[0032] The main body control unit 22 controls, for example, the operation of each section and the opening and closing of valves provided in the substrate processing apparatus 20. The main body control unit 22 transmits and receives various signals to and from the liquid management control unit 24, for example.

[0033] The storage tanks 261, 262, 263, and 264 store the processing liquid to be supplied to the processing unit 21 in a manner described below. For example, the storage tank 261 stores the processing liquid DHF, the storage tank 262 stores the processing liquid SC1, the storage tank 263 stores the processing liquid IPA, and the storage tank 264 stores any one of the processing liquids DHF, SC1, or IPA. In the following, a case where the processing liquid DHF is stored in the storage tank 264 will be exemplified.

[0034] Reservoir 261, 262, 263, and 264 are each provided with, for example, a sensor 27. The sensor 27 measures physical quantities that indicate the state of the processing liquid, for example, the concentration, the power of hydrogen (pH), and the temperature. 261 , 262, 263, and 264 may each be provided with a mechanism for stirring the processing liquid stored therein.

[0035] The liquid management control unit 24 is, for example, a storage tank 261 By controlling the operation of each part provided in 262, 263, and 264, the storage tank 261 Specifically, the liquid management control unit 24 manages the state of the processing liquid stored in the storage tanks 262, 263, and 264. 261 , 262, 263, and 264, respectively, to obtain signals related to physical quantities that indicate the state of the processing liquid.

[0036] The liquid management control unit 24 transmits and receives various signals to and from, for example, the main body control unit 22. For example, the liquid management control unit 24 transmits to the main body control unit 22 a signal obtained from the sensor 27 or a numerical value indicating a physical quantity recognized from the signal.

[0037] The two processing liquid supply units 28 correspond to the two towers 21t, respectively. The flow rates of the processing liquids in the storage tanks 261, 262, 263, and 264 are controlled by one of the processing liquid supply units 28. Each of the processing liquid supply units 28 supplies the processing liquid to all the processing units 21 included in the corresponding tower 21t via the piping group 35. Under the control of the liquid management control unit 24, the processing liquid supply unit 28 limits the flow rate of the processing liquid as described below.

[0038] The load ports LP1, LP2, LP3, and LP4 function as sections (hereinafter also referred to as "loading / unloading sections") for loading and unloading substrate groups between the substrate processing apparatus 20 and the outside of the substrate processing apparatus 20. Here, a "substrate group" refers to a plurality of substrates that make up one lot.

[0039] 1, the load ports LP1, LP2, LP3, and LP4 are arranged along a first direction DR1 that is perpendicular to the vertical direction (in other words, "horizontal"), and the load ports LP1, LP2, LP3, and LP4 and each of the processing units 21 are spaced apart in a second direction DR2 that is perpendicular to the first direction DR1 and horizontal (and therefore perpendicular to the vertical direction).

[0040] For example, the transport device 30 transports a plurality of substrate groups to the load ports LP1, LP2, LP3, and LP4. In the example of Fig. 1, the transport device 30 is movable, for example, along a first direction DR1 and a second direction DR2. For example, the carriers C each accommodating a plurality of substrates W constituting one substrate group are transported from within the carrier storage area 40 and placed on one of the load ports LP1, LP2, LP3, and LP4.

[0041] The indexer robot 91 has a function of transporting a plurality of substrates W one by one from the carrier C to the center robot 92. The indexer robot 91 has a function of transporting a plurality of substrates W one by one from the center robot 92 to the carrier C.

[0042] The center robot 92 has a function of loading multiple substrates W one by one from the indexer robot 91 to each processing unit 21. The center robot 92 has a function of transporting multiple substrates W one by one from each processing unit 21 to the indexer robot 91. Furthermore, for example, the center robot 92 has a function of transporting substrates W between multiple processing units 21 as necessary.

[0043] For example, the indexer robot 91 has four hands (not shown). Each hand has a function of supporting the substrate W in a horizontal position. The indexer robot 91 has a function of moving the hands in the horizontal and vertical directions. The indexer robot 91 has a function of rotating (spinning) around an axis along the vertical direction, and changing the orientation of the hands by this rotation.

[0044] The indexer robot 91 moves in a first direction DR1 on a path 201 that passes through the transfer position. The transfer position is a position where the indexer robot 91 and the center robot 92 face each other in the second direction DR2 in a plan view.

[0045] The indexer robot 91 has a function of facing its hand to any carrier C and center robot 92. For example, the indexer robot 91 moves its hand to perform a loading operation of loading a substrate W into a carrier C and an unloading operation of unloading the substrate W from the carrier C. For example, the indexer robot 91 cooperates with the center robot 92 to perform a transfer operation of moving the substrate W from one of the indexer robot 91 and the center robot 92 to the other at a transfer position.

[0046] The center robot 92 has, for example, four hands (not shown) like the indexer robot 91. Each of the hands has a function of supporting the substrate W in a horizontal position. The center robot 92 moves the hands, for example, in the horizontal and vertical directions. The center robot 92 rotates (spins) around an axis along, for example, the vertical direction, and the orientation of the hands is changed by this rotation.

[0047] The center robot 92 has a function of facing its hand to any of the processing units 21 and the indexer robot 91. For example, the center robot 92 moves its hand to perform a load operation for loading the substrate W into each processing unit 21 and an unload operation for unloading the substrate W from each processing unit 21. For example, the center robot 92 cooperates with the indexer robot 91 to perform a transfer operation for moving the substrate W from one of the indexer robot 91 and the center robot 92 to the other.

[0048] <1-2. Example of processing unit configuration> Fig. 2 is a schematic diagram illustrating the configuration of one processing unit 21. Fig. 2 is a diagram viewed from a direction perpendicular to the vertical direction. The processing unit 21 is a single-wafer type unit that processes substrates W one by one. The processing unit 21 operates under the control of a main body control unit 22 (see Fig. 1). The main body control unit 22 controls the operation of each part provided in the processing unit 21 and the operation of the processing liquid supply unit 28.

[0049] Each of the processing units 21 includes a chamber 4, a spin chuck 5, nozzles 341, 342, 343, 344, and a guard mechanism 7. The chamber 4 houses the spin chuck 5, the processing liquid supply mechanism 6, the nozzles 341, 342, 343, 344, and the guard mechanism 7.

[0050] The spin chuck 5 functions as a substrate holding mechanism that holds one substrate W in a horizontal position within the chamber 4. The spin chuck 5 rotates the substrate W about a substrate rotation axis A1 that is parallel to the vertical direction. For example, the center of the substrate W is located on the substrate rotation axis A1. The guard mechanism 7 surrounds the spin chuck 5 about the substrate rotation axis A1.

[0051] The nozzles 341, 342, and 343 supply the processing liquid to a vertically upper surface (hereinafter also referred to as the “upper surface”) Wu of the substrate W held on the spin chuck 5. The nozzle 344 supplies the processing liquid to a vertically lower surface (hereinafter also referred to as the “lower surface”) Wb of the substrate W held on the spin chuck 5.

[0052] The spin chuck 5 includes a spin base 11, a spin shaft 14, and a spin motor 15. The spin base 11 is disk-shaped and is held in a horizontal position. The outer diameter of the spin base 11 is smaller than the diameter of the substrate W. The spin base 11 has a function of adsorbing and holding the substrate W using, for example, a vacuum chuck (not shown). With the lower surface Wb of the substrate W adsorbed to the upper surface of the spin base 11, the substrate W is held horizontally.

[0053] The center line of the spin base 11 is positioned on the substrate rotation axis A1. The spin base 11 rotates the substrate W around the substrate rotation axis A1.

[0054] The spin shaft 14 extends vertically downward from the center of the spin base 11. The nozzle 344 is provided on the inside of the spin shaft 14, for example.

[0055] The spin motor 15 rotates the spin shaft 14, and thus the spin base 11 rotates around the substrate rotation axis A1, for example, in a counterclockwise direction R as viewed vertically downward. Dr When the spin motor 15 rotates the spin shaft 14 while the substrate W is attracted to the spin base 11, the substrate W rotates together with the spin base 11 around the substrate rotation axis A1.

[0056] Nozzle 341 is connected to pipe 351. Nozzle 342 is connected to pipe 352. Nozzle 343 is connected to pipe 353. Nozzle 344 is connected to pipe 354. Pipes 351, 352, 353, and 354 form pipe group 35 (see FIG. 1).

[0057] A valve 361 is inserted in the pipe 351. A valve 362 is inserted in the pipe 352. A valve 363 is inserted in the pipe 353. A valve 364 is inserted in the pipe 354. The valves 361, 362, 363, and 364 are housed in a processing liquid supply unit 28. One processing liquid supply unit 28 is responsible for three processing units 21 that constitute one tower 21t. Therefore, three valves each of the valves 361, 362, 363, and 364 are housed in each processing liquid supply unit 28.

[0058] The pipe 351 is connected to the storage tank 261 via a valve 361. The pipe 352 is connected to the storage tank 262 via a valve 362. The pipe 353 is connected to the storage tank 263 via a valve 363. The pipe 354 is connected to the storage tank 264 via a valve 364.

[0059] When the valve 361 is opened, the processing liquid DHF supplied from the pipe 351 to the nozzle 341 is discharged downward from the nozzle 341. When the valve 361 is closed, the discharge of the processing liquid DHF from the nozzle 341 is stopped.

[0060] When the valve 362 is opened, the processing liquid SC1 supplied from the pipe 352 to the nozzle 342 is discharged downward from the nozzle 342. When the valve 362 is closed, the discharge of the processing liquid SC1 from the nozzle 342 stops.

[0061] When the valve 363 is opened, the processing liquid IPA supplied from the pipe 353 to the nozzle 343 is discharged downward from the nozzle 343. When the valve 363 is closed, the discharge of the processing liquid IPA from the nozzle 343 stops.

[0062] When the valve 364 is opened, the processing liquid DHF supplied from the pipe 354 to the nozzle 344 is discharged upward from the nozzle 344. When the valve 364 is closed, the discharge of the processing liquid DHF from the nozzle 344 is stopped.

[0063] The processing unit 21 includes nozzle moving devices 371, 372, and 373. The nozzle moving device 371 moves the nozzle 341, the nozzle moving device 372 moves the nozzle 342, and the nozzle moving device 373 moves the nozzle 343.

[0064] For example, the nozzle 341 functions as a scan nozzle that ejects the processing liquid DHF while the landing position of the processing liquid DHF moves between the center and the periphery of the upper surface Wu. The nozzle 341 may eject the processing liquid DHF while the landing position of the processing liquid DHF on the upper surface Wu is fixed.

[0065] For example, the nozzle 342 functions as a scan nozzle that ejects the processing liquid SC1 while the landing position of the processing liquid SC1 moves between the center and the periphery of the upper surface Wu. The nozzle 342 may eject the processing liquid SC1 while the landing position of the processing liquid SC1 on the upper surface Wu is fixed.

[0066] For example, the nozzle 343 functions as a scan nozzle that ejects the processing liquid IPA while the landing position of the processing liquid IPA moves between the center and the periphery of the upper surface Wu. The nozzle 343 may eject the processing liquid IPA while the landing position of the processing liquid IPA on the upper surface Wu is fixed.

[0067] The processing unit 21 includes a lower surface nozzle 44, a purge pipe 45, and a purge valve 46. The lower surface nozzle 44 ejects a gas, for example, nitrogen gas, toward the vicinity of the periphery of the lower surface Wb. The purge pipe 45 is connected to the lower surface nozzle 44. The purge valve 46 is inserted in the purge pipe 45. The nitrogen gas is supplied to the purge pipe 45 by, for example, an air supply facility (not shown) provided in a factory in which the substrate processing system 1 is installed.

[0068] The discharge of nitrogen gas from the lower surface nozzle 44 onto the lower surface Wb contributes to preventing the processing liquids DHF, SC1, and IPA discharged onto the upper surface Wu from flowing around onto the lower surface Wb.

[0069] The processing unit 21 may include a film thickness meter. The film thickness meter measures a predetermined film thickness on the upper surface Wu. For example, an optical interference type film thickness meter is used as the film thickness meter. The film thickness meter is moved, for example, above the substrate W by a configuration similar to the nozzle moving device 371.

[0070] The processing unit 21 includes a guard lifting device 55 and a guard mechanism 7. The guard mechanism 7 is located outward (in a direction away from the substrate rotation axis A1) from the substrate W held by the spin chuck 5, and limits the range into which the processing liquids DHF, SC1, and IPA splash from the substrate W. For example, the guard mechanism 7 includes guards 71, 72, and 73, walls 74, 75, and 76, and a bottom 77.

[0071] Wall 76 surrounds spin chuck 5. Wall 75 surrounds spin chuck 5 and wall 76. Wall 74 surrounds walls 75, 76 and spin chuck 5. Bottom 77 connects and fixes the vertically lower ends of each of walls 74, 75, 76 to the outer periphery of spin chuck 5.

[0072] Guard 71 is movable in the vertical direction while being sandwiched between walls 74 and 75. Guard 72 is movable in the vertical direction while being sandwiched between walls 75 and 76. Guard 73 is movable in the vertical direction while being sandwiched between wall 76 and spin chuck 5. Guard lifting device 55 has the function of moving guards 71, 72, and 73 in the vertical direction.

[0073] For example, the end of guard 71 on the substrate rotation axis A1 side extends vertically downward and faces the end of guard 73 on the substrate rotation axis A1 side along the vertical direction, closer to the substrate rotation axis A1 side than the end of guard 72 on the substrate rotation axis A1 side.

[0074] In pre-processing, the cup 70 receives the processing liquid DHF from the nozzle 341, the processing liquid SC1 from the nozzle 342, and the processing liquid IPA from the nozzle 343. The nozzle movement devices 371, 372, and 373 contribute to the operation of moving the nozzles 341, 342, and 343 vertically above the cup 70, respectively, to eject the processing liquids DHF, SC1, and IPA into the cup 70. The ejection of the processing liquid DHF into the cup 70 is also referred to below as the discharge of the processing liquid DHF. The same applies to the processing liquids SC1 and IPA.

[0075] A cup 70 may be provided for each of the processing liquids DHF, SC1, and IPA. For example, the nozzles 341, 342, and 343 wait at different positions away from the spin chuck 5 in a plan view when the processing liquids DHF, SC1, and IPA are not discharged onto the upper surface Wu. For example, the cups 70 corresponding to the processing liquids DHF, SC1, and IPA are disposed vertically below the waiting positions of the nozzles 341, 342, and 343, respectively.

[0076] <1-3. Configuration example of processing liquid supply unit> Fig. 3 is a schematic diagram illustrating a configuration of the processing liquid supply part 28. The processing liquid supply part 28 includes pipes 331, 332, 333, and 334, pumps 81, 82, 83, and 84, and valves 361, 362, 363, and 364. Fig. 3 also illustrates three processing units 21 included in a tower 21t, and storage tanks 261, 262, 263, and 264, which are connected to the processing liquid supply part 28 by a pipe group 35.

[0077] The valves 361, 362, 363, and 364 are provided for each processing unit 21. The piping group 35 includes piping 351, 352, 353, and 354 for the three processing units 21, and is connected between the tower 21t and the processing liquid supply unit 28 (see also FIG. 1).

[0078] The pipe 331 is connected to the storage tank 261, and the processing liquid DHF flows in and out of the storage tank 261 via the pipe 331. A pump 81 is inserted in the pipe 331. The pump 81 causes the processing liquid DHF to flow in the pipe 331 in the direction of the arrow, circulating the processing liquid DHF between the pipe 331 and the storage tank 261.

[0079] The pipe 332 is connected to the storage tank 262, and the processing liquid SC1 flows in and out of the storage tank 262 via the pipe 332. A pump 82 is inserted in the pipe 332. The pump 82 causes the processing liquid SC1 to flow in the pipe 332 in the direction of the arrow, circulating the processing liquid SC1 between the pipe 332 and the storage tank 262.

[0080] The pipe 333 is connected to the storage tank 263, and the processing liquid IPA flows in and out of the storage tank 263 via the pipe 333. A pump 83 is inserted in the pipe 333. The pump 83 causes the processing liquid IPA to flow in the pipe 333 in the direction of the arrow, circulating the processing liquid IPA between the pipe 333 and the storage tank 263.

[0081] The pipe 334 is connected to the storage tank 264, and the processing liquid DHF flows in and out of the storage tank 264 via the pipe 334. A pump 84 is inserted in the pipe 334. The pump 84 causes the processing liquid SC1 to flow in the pipe 334 in the direction of the arrow, circulating the processing liquid DHF between the pipe 334 and the storage tank 264.

[0082] The circulation of the processing liquid DHF through the pipes 331 and 334, the circulation of the processing liquid SC1 through the pipe 332, and the circulation of the processing liquid IPA through the pipe 333 may all be referred to as "tower circulation" below.

[0083] Pipes 351 of all processing units 21 are connected to pipes 331. Pipes 352 of all processing units 21 are connected to pipes 332. Pipes 353 of all processing units 21 are connected to pipes 333. Pipes 354 of all processing units 21 are connected to pipes 334. In Fig. 3, connections between pipes are indicated by black circles. Pipes that are shown crossing each other without black circles are not connected to each other.

[0084] Through a pipe 351 having an open valve 361 inserted therein, the processing liquid DHF branched off from the tower circulation in the pipe 331 is supplied to a nozzle 341. Through a pipe 352 having an open valve 362 inserted therein, the processing liquid SC1 branched off from the tower circulation in the pipe 332 is supplied to a nozzle 342. Through a pipe 353 having an open valve 363 inserted therein, the processing liquid IPA branched off from the tower circulation in the pipe 333 is supplied to a nozzle 343. Through a pipe 354 having an open valve 364 inserted therein, the processing liquid DHF branched off from the tower circulation in the pipe 334 is supplied to a nozzle 344.

[0085] The presence or absence of tower circulation does not depend on the opening or closing of valves 361, 362, 363, and 364. Even if the temperatures of pipes 351, 352, 353, and 354 in processing unit 21 drop, the temperatures of processing liquids DHF, SC1, and IPA circulating in the tower are appropriately maintained.

[0086] When the valves 361, 362, 363, and 364 are closed, the processing liquid is stagnated in the pipes 351, 352, 353, and 354, respectively. If the processing liquid is stagnated for a long period of time, deterioration of the processing liquid may occur. For example, changes in the temperature, concentration, and composition of the processing liquid may occur.

[0087] Whether or not pre-processing is required is determined based on the period during which the processing liquid remains in a certain nozzle. For example, even if both of the nozzles 341 and 344 have the function of ejecting the processing liquid DHF, the necessity of pre-processing is determined based on the period during which the processing liquid DHF is not ejected from each of the nozzles 341 and 344. From this perspective, in order to avoid complicating the explanation, the following explanation will be given while ignoring the ejection of the processing liquid DHF from the nozzle 344.

[0088] <1-4. Example of substrate processing system configuration> 4 is a diagram showing an example of a schematic configuration of the substrate processing system 1. The substrate processing system 1 includes a host computer 10 in addition to the above-described substrate processing apparatus 20 and transport apparatus 30. The host computer 10, the substrate processing apparatus 20, and the transport apparatus 30 are communicatively connected via, for example, a communication line 50. For the communication line 50, for example, one or both of a wired line and a wireless line are adopted.

[0089] There may be provided a plurality of substrate processing apparatuses 20. In this case, the host computer 10 has a function of managing the plurality of substrate processing apparatuses 20 in an integrated manner.

[0090] <1-5. Host computer configuration example> 5 is a block diagram showing an example of the electrical configuration of the host computer 10. The host computer 10 is realized, for example, by a computer, and includes a communication unit 101, an input unit 102, an output unit 103, a storage unit 104, a control unit 105, and a drive 106, which are connected via a bus line Bu1.

[0091] The communication unit 101 has a function as a transmitter capable of transmitting signals to each substrate processing apparatus 20 and the transport apparatus 30 via the communication line 50. The communication unit 101 has a function as a receiver capable of receiving signals from each substrate processing apparatus 20 and the transport apparatus 30 via the communication line 50.

[0092] For example, a signal corresponding to the action of a user who uses the host computer 10 can be input to the input unit 102. The input unit 102 can include, for example, an operation unit, a microphone, and various sensors.

[0093] The output unit 103 has a function of outputting various information, for example, and may include a display unit and a speaker, for example.

[0094] The storage unit 104 has a function of storing various information, for example. The storage unit 104 is composed of a storage medium, such as a hard disk and a flash memory. The storage unit 104 stores various information, for example, including a program Pg1 and information PP1 about a processing plan. The information PP1 indicates, for example, the timing of executing a plurality of consecutive substrate processes for a group of substrates. The storage unit 104 may include a memory 105b, which will be described later.

[0095] The control unit 105 includes, for example, an arithmetic processing unit 105a that functions as a processor and a memory 105b that temporarily stores information. For example, a central processing unit (CPU) is used for the arithmetic processing unit 105a. For example, a random access memory (RAM) is used for the memory 105b. For example, the arithmetic processing unit 105a reads and executes a program Pg1 stored in the storage unit 104, thereby implementing the functions of the host computer 10. Various pieces of information temporarily obtained by various types of information processing in the control unit 105 are stored, for example, appropriately in the memory 105b.

[0096] For example, a portable storage medium RM1 is detachably attached to the drive 106. For example, in a state in which the storage medium RM1 is attached to the drive 106, data is exchanged between the storage medium RM1 and the control unit 105. For example, when the storage medium RM1 storing the program Pg1 is attached to the drive 106, the program Pg1 is read from the storage medium RM1 and stored in the storage unit 104.

[0097] <1-6. Example of main control unit configuration> 6 is a block diagram showing an example of the electrical configuration of the body control unit 22. The body control unit 22 is realized, for example, by a computer, and includes a communication unit 221, an input unit 222, an output unit 223, a storage unit 224, a control unit 225, and a drive 226, which are connected via a bus line Bu2.

[0098] The communication unit 221 has a function as a transmitter capable of transmitting signals to the host computer 10 via the communication line 50, for example. The communication unit 221 has a function as a receiver capable of receiving signals from the host computer 10 via the communication line 50, for example. The communication unit 221 can further transmit and receive signals to and from the liquid management control unit 24 via wiring such as a cable.

[0099] To the input unit 222, for example, a signal corresponding to an action of a user who uses the substrate processing apparatus 20 can be input. The input unit 222 can include, for example, an operation unit, a microphone, various sensors, and the like, similar to the input unit 102 described above.

[0100] The output unit 223 has a function of outputting various information, for example. The output unit 223 may include a display unit, a speaker, and the like, similar to the output unit 103.

[0101] The storage unit 224 has a function of storing various information, for example. The storage unit 224 may be configured with a storage medium such as a hard disk and a flash memory. The storage unit 224 may store, for example, a program Pg2 and various information Dt2. The storage unit 224 may include a memory 225b described later.

[0102] The program Pg2 includes, for example, a flow recipe. The flow recipe includes a process recipe that defines the contents of the substrate processing and a pre-recipe that defines the contents of the pre-processing. The flow recipe is set in common for a group of multiple substrates W, for example, multiple substrates W accommodated in the same carrier C.

[0103] The control unit 225 includes, for example, an arithmetic processing unit 225a that functions as a processor and a memory 225b that temporarily stores information. For example, a CPU is used for the arithmetic processing unit 225a. For example, a RAM is used for the memory 225b. For example, a program Pg2 stored in the storage unit 224 is read and executed in the arithmetic processing unit 225a, thereby implementing the functions of the main body control unit 22. Various pieces of information temporarily obtained by various types of information processing in the control unit 225 are stored, for example, appropriately in the memory 225b.

[0104] The drive 226 is, for example, a portion into which a portable storage medium RM2 is detachably attached. In the drive 226, for example, when the storage medium RM2 is attached, data can be exchanged between the storage medium RM2 and the control unit 225. For example, when the storage medium RM2 storing the program Pg2 is attached to the drive 226, the program Pg2 is read from the storage medium RM2 and stored in the storage unit 224.

[0105] <1-7. Example of liquid management control unit configuration> 7 is a block diagram showing an example of the electrical configuration of liquid management control unit 24. Like the above-mentioned main body control unit 22, liquid management control unit 24 is realized by a computer or the like, and includes a communication unit 241, an input unit 242, an output unit 243, a storage unit 244, a control unit 245, and a drive 246, which are connected via a bus line Bu3.

[0106] The communication section 241 can transmit and receive signals to and from the body control unit 22 via wiring such as a cable.

[0107] To the input unit 242, for example, a signal corresponding to an action of a user who uses the substrate processing apparatus 20 can be input. The input unit 242 can include, for example, an operation unit, a microphone, various sensors, and the like, similar to the input unit 102 described above.

[0108] The output unit 243 has a function of outputting various information, for example. The output unit 243 may include a display unit, a speaker, and the like, similar to the output unit 103.

[0109] The storage unit 244 has a function of storing various information, for example. The storage unit 244 may be configured with a storage medium such as a hard disk and a flash memory, similar to the storage unit 224. The storage unit 244 may store, for example, a program Pg3 and various information Dt3. The storage unit 244 may include a memory 245b, which will be described later.

[0110] The program Pg3 includes, for example, a process recipe and a pre-recipe, and includes, for example, the type and amount of treatment liquid required to be discharged for each process recipe, and the type and amount of treatment liquid required to be discharged for each pre-recipe.

[0111] The control unit 245 includes, for example, an arithmetic processing unit 245a that functions as a processor and a memory 245b that temporarily stores information. For example, a CPU is applied to the arithmetic processing unit 245a. For example, a RAM is applied to the memory 245b. In the arithmetic processing unit 245a, for example, a program Pg3 stored in the storage unit 244 is read and executed, thereby realizing the function of the liquid management control unit 24. Various information temporarily obtained by various information processing in the control unit 245 is stored, for example, appropriately in the memory 245b.

[0112] The drive 246 is, for example, a portion to which a portable storage medium RM3 can be attached and detached. In the drive 246, for example, when the storage medium RM3 is attached, data can be exchanged between the storage medium RM3 and the control unit 245. For example, when the storage medium RM3 storing the program Pg3 is attached to the drive 246, the program Pg3 is read from the storage medium RM3 and stored in the storage unit 244.

[0113] <1-8. Processing using a processing unit> <1-8-1. Overall processing> Fig. 8 is a diagram showing an example of processing using the processing unit 21. Fig. 8 corresponds to a plurality of substrate processings of the same type and one pre-processing. Fig. 8 illustrates substrate processing and pre-processing performed on a group of a plurality of substrates W, for example, a plurality of substrates W accommodated in the same carrier C. The processing illustrated in Fig. 8 includes steps S1 to S6.

[0114] The substrate processing and pre-processing are realized by controlling the operation of each part by the main body control unit 22 and the liquid management control unit 24. Here, the description will be focused on one processing unit 21 of the substrate processing apparatus 20.

[0115] In step S1, the substrate W is loaded into the processing unit 21. Specifically, the substrate W is loaded into the chamber 4 by the center robot 92 and placed on the spin base 11. The main body control unit 22 causes the substrate W to be held on the spin base 11 in a substantially horizontal position by the vacuum chuck.

[0116] After the substrate W is held on the spin base 11, a chemical liquid process is performed on the upper surface Wu in step S2. The chemical liquid process is, for example, a cleaning process in which processing liquids DHF and SC1 are successively discharged onto the upper surface Wu (hereinafter referred to as a "first cleaning process"). Alternatively, the chemical liquid process is, for example, a cleaning process in which processing liquid SC1 is discharged onto the upper surface Wu (hereinafter referred to as a "second cleaning process"). Alternatively, the chemical liquid process is, for example, a cleaning process in which processing liquids DHF and IPA are successively discharged onto the upper surface Wu (hereinafter referred to as a "third cleaning process").

[0117] In the first cleaning process, a rinse process may be performed between the discharge of the processing liquid DHF and the discharge of the processing liquid SC1. In either or both of the first cleaning process and the second cleaning process, a rinse process may be performed after the discharge of the processing liquid SC1. In the third cleaning process, a rinse process may be performed between the discharge of the processing liquid DHF and the discharge of the processing liquid IPA. In the third cleaning process, a rinse process may be performed after the discharge of the processing liquid IPA.

[0118] These rinsing processes utilize, for example, the ejection of deionized water for cleaning (hereinafter referred to as "deionized water DIW") onto the upper surface Wu, or the ejection onto both the upper surface Wu and the lower surface Wb. The nozzles used to eject the deionized water DIW may be shared with, for example, the nozzles 341, 342, 343, and 344, or may be provided in combination with, or may be provided independently. In this embodiment, the rinsing process will be omitted for the sake of simplicity.

[0119] In this chemical liquid treatment, the main body control unit 22 controls the spin motor 15 to rotate the spin base 11 around the substrate rotation axis A1. This rotation rotates the substrate W. When step S2 is performed, the rotation speed of the spin base 11 may be changed or the rotation may be stopped.

[0120] When the first cleaning process is performed in step S2, the body control unit 22 controls the nozzle moving devices 371, 372 to cause the nozzles 341, 342 to perform a predetermined movement. The liquid management control unit 24 controls the valves 361, 362 to discharge predetermined amounts of the processing liquids DHF, SC1 from the nozzles 341, 342, respectively, toward the upper surface Wu in this order.

[0121] When the first cleaning process is performed, the main body control unit 22 controls the nozzle moving device 373 to move the nozzle 343 to the standby position. When the first cleaning process is performed, the liquid management control unit 24 closes the valve 363.

[0122] When the second cleaning process is performed in step S2, the body control unit 22 controls the nozzle moving device 372 to perform a predetermined movement of the nozzle 342. The liquid management control unit 24 controls the valve 362 to discharge a predetermined amount of the processing liquid SC1 from the nozzle 342 toward the upper surface Wu.

[0123] When the second cleaning process is performed, the main body control unit 22 controls the nozzle moving devices 371 and 373 to move the nozzles 341 and 343 to their respective standby positions. When the second cleaning process is performed, the liquid management control unit 24 closes the valves 361 and 363.

[0124] When the third cleaning process is performed in step S2, the body control unit 22 controls the nozzle moving devices 371 and 373 to move the nozzles 341 and 343 in a predetermined manner. The liquid management control unit 24 controls the valves 361 and 363 to discharge predetermined amounts of the processing liquids DHF and IPA from the nozzles 341 and 343, respectively, toward the upper surface Wu in this order.

[0125] When the third cleaning process is performed, the main body control unit 22 controls the nozzle moving device 372 to move the nozzle 342 to the standby position. When the third cleaning process is performed, the liquid management control unit 24 closes the valve 362.

[0126] When step S2 is performed, the main body control unit 22 may control the purge valve 46 to discharge nitrogen gas onto the lower surface Wb from the lower surface nozzle 44. The nitrogen gas reduces or suppresses the processing solutions DHF and SC1 discharged onto the upper surface Wu from flowing around to the lower surface Wb.

[0127] For example, in the first cleaning process and the third cleaning process, the processing liquid DHF is discharged onto the upper surface Wu and the processing liquid DHF is discharged onto the lower surface Wb. At this time, the liquid management control unit 24 controls the valves 361 and 364 to discharge a predetermined amount of the processing liquid DHF from the nozzles 341 and 344 onto the upper surface Wu and the lower surface Wb, respectively.

[0128] When step S2 is performed, the main body control unit 22 controls the guard lifting device 55 to change the relative positions of the guards 71, 72, 73 with respect to the substrate W in the up-down direction.

[0129] For example, when all of the top plates of the guards 71, 72, and 73 are positioned above the upper surface Wu and the side of the guard 71 faces the upper surface Wu in the horizontal direction, the processing liquid that is ejected onto the upper surface Wu and splashes from the upper surface Wu is guided to the bottom 77 between the wall 76 and the spin chuck 5.

[0130] For example, when all the top plates of guards 71, 72 are positioned above the upper surface Wu, the top plate of guard 73 is positioned below the lower surface Wb, and the side of guard 72 faces the upper surface Wu in the horizontal direction, the processing liquid that is ejected onto the upper surface Wu and splashes from the upper surface Wu is guided to the bottom 77 between wall 75 and wall 76.

[0131] For example, when the top plate of guard 71 is positioned above the upper surface Wu and the top plates of both guards 72 and 73 are positioned below the lower surface Wb, and the side of guard 71 faces upper surface Wu in the horizontal direction, the processing liquid that is ejected onto upper surface Wu and splashes from upper surface Wu is guided to bottom 77 between wall 74 and wall 75.

[0132] The processing liquids are guided to different regions for each type by appropriately combining the timing at which the processing liquids are discharged from the nozzles 341, 342, 343, respectively, and the relative positions of the guards 71, 72, 73 in the up-down direction with respect to the substrate W. Such guidance contributes to the recovery of each type of processing liquid.

[0133] Step S2 is performed for each substrate W. The substrate W that has been subjected to the chemical processing in step S2 is unloaded in step S3. Specifically, the main body control unit 22 releases the vacuum chuck on the spin base 11. The processed substrate W is removed from the spin base 11 by the center robot 92, and unloaded from the chamber 4.

[0134] After step S3 is executed, step S4 is executed. In step S4, it is determined whether or not there is a next substrate W to be processed in the processing unit 21. For example, the main body control unit 22 refers to the flow recipe and determines whether or not there is a "next substrate" among the multiple substrates accommodated in one carrier C.

[0135] If the determination result in step S4 is positive (if the "next substrate W" exists), the process returns to step S1. If the determination result in step S4 is negative (if the "next substrate W" does not exist), the process proceeds to step S5.

[0136] In step S5, it is determined whether pre-processing is necessary. As will be described later, in the flow recipe, pre-processing is generally performed, but pre-processing is omitted as an exception. A flowchart for determining whether pre-processing is necessary will be described later.

[0137] When the result of the determination in step S5 is positive (i.e., when it is determined that pre-processing is necessary), pre-processing is executed in step S6. When the result of the determination in step S5 is negative (i.e., when it is determined that pre-processing is unnecessary) and after step S6 is executed, the process shown in FIG. 8 ends.

[0138] <1-8-2. Example of a flow recipe> 9 conceptually illustrates a flow recipe as a timing chart. The flow recipe includes process recipe groups J1, J2, and J3 and pre-recipes Pr1, Pr2, and Pr3. Based on the flow recipe, processing is performed on multiple substrates W (25 substrates in this case) stored in the same carrier C.

[0139] Process recipe group J1 includes process recipes J1(1) to J1(25). Process recipe group J2 includes process recipes J2(1) to J2(25). Process recipe group J3 includes process recipes J3(1) to J3(25). Numbers enclosed in parentheses are integers from 1 to 25, and correspond to the 25 substrates W stored in the same carrier C. In the following, substrate W(k) refers to the kth substrate W (k=1 to 25) stored in the same carrier C. The kth substrate is the target of substrate processing based on process recipes J1(k), J2(k), and J3(k).

[0140] The flow recipe specifies the following steps in the order: pre-recipe Pr1, process recipe J1(1), ... J1(25), pre-recipe Pr2, process recipe J2(1), ... J2(25), pre-recipe Pr3, process recipe J3(1), ... J3(25).

[0141] 10 is a timing chart illustrating the contents of the process recipe J1(k) over time. The process recipe J1(k) sets the contents of the first cleaning process for the substrate W(k). The process recipe J1(k) includes a load recipe J10(k), discharge recipes J11(k), J12(k), and unload recipe J14(k). The load recipe J10(k), discharge recipes J11(k), J12(k), and unload recipe J14(k) are adopted in this order, and the processes set by each recipe are executed.

[0142] The loading recipe J10(k) sets the process for loading the substrate W(k). In accordance with the loading recipe J10(k), the substrate W(k) is removed from the carrier C and placed on the spin chuck 5. After the substrate W(k) is placed on the spin chuck 5, the process set by the discharge recipe J11(k) is executed.

[0143] The discharge recipe J11(k) sets a process of discharging the processing liquid DHF onto the upper surface Wu of the substrate W(k). Hereinafter, the discharge of the processing liquid DHF is also referred to as discharge P(1).

[0144] After discharge P(1) according to the discharge recipe J11(k) is completed, a process set by the discharge recipe J12(k) is executed. The discharge recipe J12(k) sets a process of discharging the processing liquid SC1 onto the upper surface Wu of the substrate W(k). Hereinafter, the discharge of the processing liquid SC1 is also referred to as discharge P(2).

[0145] After discharge P(2) according to the discharge recipe J12(k) is completed, the process set by the unloading recipe J14(k) is executed. The unloading recipe J14(k) sets the process of unloading the substrate W(k). In accordance with the unloading recipe J14(k), the substrate W(k) is removed from the spin chuck 5 and loaded into the carrier C.

[0146] 11 is a timing chart illustrating the contents of the process recipe J2(k) over time. The process recipe J2(k) sets the contents of the second cleaning process for the substrate W(k). The process recipe J2(k) includes a load recipe J20(k), a discharge recipe J22(k), and an unload recipe J24(k). The load recipe J20(k), the discharge recipe J22(k), and the unload recipe J24(k) are adopted in this order, and the processes set by each of them are executed.

[0147] The loading recipe J20(k) sets the process for loading the substrate W(k). In accordance with the loading recipe J20(k), the substrate W(k) is removed from the carrier C and placed on the spin chuck 5. After the substrate W(k) is placed on the spin chuck 5, the process set by the discharge recipe J22(k) is executed.

[0148] The discharge recipe J22(k) sets a discharge P(2) onto the upper surface Wu of the substrate W(k). Hereinafter, the discharge of the processing liquid DHF is also referred to as a discharge P(2).

[0149] After discharge P(2) according to the discharge recipe J22(k) is completed, the process set by the unloading recipe J24(k) is executed. The unloading recipe J24(k) sets the process of unloading the substrate W(k). In accordance with the unloading recipe J24(k), the substrate W(k) is removed from the spin chuck 5 and loaded into the carrier C.

[0150] 12 is a timing chart illustrating the content of the process recipe J3(k) over time. The process recipe J3(k) sets the content of the third cleaning process for the substrate W(k). The process recipe J3(k) includes a load recipe J30(k), discharge recipes J31(k), J33(k), and unload recipe J34(k). The load recipe J30(k), discharge recipes J31(k), J33(k), and unload recipe J34(k) are adopted in this order, and the processes set by each of them are executed.

[0151] The loading recipe J30(k) sets the process for loading the substrate W(k). In accordance with the loading recipe J30(k), the substrate W(k) is removed from the carrier C and placed on the spin chuck 5. After the substrate W(k) is placed on the spin chuck 5, the process set by the discharge recipe J31(k) is executed.

[0152] The discharge recipe J31(k) sets discharge (1) onto the upper surface Wu of the substrate W(k). After discharge P(1) according to the discharge recipe J31(k) is completed, the process set by the discharge recipe J33(k) is executed. The discharge recipe J33(k) sets a process of discharging the processing liquid IPA onto the upper surface Wu of the substrate W(k). Hereinafter, the discharge of the processing liquid IPA is also referred to as discharge P(3).

[0153] After discharge P(3) according to the discharge recipe J33(k) is completed, the process set by the unloading recipe J34(k) is executed. The unloading recipe J34(k) sets the process of unloading the substrate W(k). In accordance with the unloading recipe J34(k), the substrate W(k) is removed from the spin chuck 5 and loaded into the carrier C.

[0154] Step S1 shown in Fig. 8 corresponds to carry-in recipes J10(1) to J10(25), J20(1) to J20(25), and J30(1) to J30(25). Step S2 shown in Fig. 8 corresponds to discharge recipes J11(1) to J11(25), J12(1) to J12(25), J22(1) to J22(25), J31(1) to J31(25), and J33(1) to J33(25). Step S3 shown in Fig. 8 corresponds to carry-out recipes J14(1) to J14(25), J24(1) to J24(25), and J34(1) to J34(25).

[0155] For example, if the case where pre-processing is omitted is not taken into consideration as described below, step S5 can be excluded from the flowchart in Fig. 8. In this case, for example, step S1 is executed according to the loading recipe J10(k), step S2 is executed according to the discharge recipes J11(k) and J12(k), and step S3 is executed according to the unloading recipe J14(k). If k<25, step S1 is executed again via step S4. If k=25, step S6 is executed according to the pre-recipe Pr2 via step S4.

[0156] Alternatively, step S1 is executed according to the loading recipe J20(k), step S2 is executed according to the discharge recipe J22(k), and step S3 is executed according to the unloading recipe J24(k). If k<25, step S1 is executed again via step S4. If k=25, step S4 is executed via step S6 according to the pre-recipe Pr3.

[0157] Pre-recipe Pr1 sets a preliminary operation for discharge P(1) and P(2) performed in process recipe group J1. Pre-recipe Pr2 sets a preliminary operation for discharge P(2) performed in process recipe group J2. Pre-recipe Pr3 sets a preliminary operation for discharge P(1) and P(3) performed in process recipe group J3. These preliminary operations correspond to the pre-operations described above.

[0158] 13 is a timing chart illustrating the contents of the pre-recipe Pr1 over time. The pre-recipe Pr1 corresponds to pre-processing for the processing liquids DHF and SC1. The pre-recipe Pr1 includes discharge recipes Pr11 and Pr12, which are adopted in this order. The discharge recipe Pr11 sets the discharge P(1) to the cup 70. The discharge recipe Pr12 sets the discharge P(2) to the cup 70.

[0159] The pre-recipe Pr2 corresponds to a pre-processing for the processing liquid SC1. The pre-recipe Pr2 sets the discharge P(2) into the cup 70.

[0160] 14 is a timing chart illustrating the contents of the pre-recipe Pr3 over time. The pre-recipe Pr3 corresponds to pre-processing for the processing liquids DHF and IPA. The pre-recipe Pr3 includes discharge recipes Pr31 and Pr33, which are adopted in this order. The discharge recipe Pr31 sets the discharge P(1) to the cup 70. The discharge recipe Pr33 sets the discharge P(3) to the cup 70.

[0161] The time required for execution of any of the processes set by the flow recipes, namely, the load recipes J10(k), J20(k), and J30(k), the discharge recipes J11(k), J12(k), J22(k), J31(k), J33(k), Pr11, Pr12, Pr31, and Pr33, the unloading recipes J14(k), J24(k), and J34(k), and the pre-recipe Pr2, is set in advance in each recipe.

[0162] <1-8-3. Deciding whether pre-processing is necessary> In this embodiment, when the time during which the processing liquid to be pre-processed is not discharged is shorter than a predetermined threshold, it is determined that the pre-processing is unnecessary, thereby shortening the period required for substrate processing, which contributes to simplifying the substrate processing method.

[0163] Hereinafter, the process of determining whether or not the pre-processing set by the pre-recipe Pr2 is necessary will be described first, and then the process of determining whether or not the pre-processing set by the pre-recipe Pr3 is necessary will be described.

[0164] 15 shows a timing chart of discharge recipes J11(24) to J22(1), which are part of the flow recipes. Time t11e(k) is the time when the substrate processing set by the discharge recipe J11(k) ends, more specifically, the time when the discharge P(1) onto the upper surface Wu of the substrate W(k) ends. Time t12s(k) is the time when the substrate processing set by the discharge recipe J12(k) starts, more specifically, the time when the discharge P(2) onto the upper surface Wu of the substrate W(k) starts.

[0165] For simplicity, FIG. 15 shows time t11e(k) and time t12s(k) as being the same time, but more accurately, time t11e(k) precedes time t12s(k).

[0166] Time t12e(k) is the time when the substrate processing set by the discharge recipe J12(k) ends, more specifically, the time when the discharge P(2) onto the upper surface Wu of the substrate W(k) ends. Time t10(k) is the time when the processing set by the loading recipe J10(k) starts, more specifically, the time when the substrate W(k) is loaded.

[0167] Fig. 16 is a flow chart illustrating a routine for determining whether pre-processing is necessary. In the figure and below, this routine is abbreviated as "pre-processing necessity determination routine." The pre-processing necessity determination routine is realized by the main body control unit 22 and the liquid management control unit 24 controlling the operation of each part.

[0168] The result of the determination made by the routine for determining whether or not pre-processing is required is used as the result of the determination made in step S5 shown in Fig. 8. The routine for determining whether or not pre-processing is required is not a substitute for step S5, nor does it provide details of step S5.

[0169] In the pre-processing necessity determination routine, step S51 is a process for determining whether or not discharge P(j) has started, where parameter j is either 1 or 2, and the pre-processing necessity determination routine is adopted for each parameter j.

[0170] A first pre-processing necessity determination routine is executed for ejection recipes Pr11 and Pr31 that set pre-processing for the processing liquid DHF, and a second pre-processing necessity determination routine is executed for ejection recipe Pr12 that sets pre-processing for the processing liquid SC1.

[0171] If the determination result in step S51 is negative, step S55 is executed, which will be described later.

[0172] If the determination result in step S51 is positive, step S52 is executed. Step S52 is a process of ending the count value M(j), which will be described later, and resetting the count value M(j).

[0173] The count value M(j) collectively indicates the count values ​​M(1) and M(2). The count value M(j) is a value that is increased by counting in the routine for determining whether the jth pre-processing is necessary. The count value M(j) indicates the time since the discharge P(j) ended.

[0174] 15, time t12s(24) is the time when discharge P(2) set by discharge recipe J12(24) starts. At time t12s(24), the determination in step S51 becomes positive, and the count value M(2) is reset in step S52.

[0175] In FIG. 15, the square on the dashed line C2 indicates the time point when the count value M(2) ends and is reset in the routine for determining whether or not the second pre-processing is required (the time point when step S52 is executed).

[0176] After step S52 is executed, step S53 is executed. Step S53 is a process for determining whether or not the discharge P(j) has ended. If the determination result of step S53 is negative, step S53 is executed repeatedly. If the determination result of step S53 is positive, step S54 is executed. Step S54 is a process for starting counting the count value M(j).

[0177] 15, time t12e(24) is the time when discharge P(2) set by the discharge recipe J12(24) ends. At time t12e(24), the determination in step S53 becomes positive, and counting of the count value M(2) is started in step S54.

[0178] In FIG. 15, the black circle on the dashed line C2 indicates the time point at which counting of the count value M(2) starts in the routine for determining whether or not the second pre-processing is required (the time point at which step S54 is executed).

[0179] Time t11e(24) is the time when discharge P(1) set by discharge recipe J11(24) ends. Discharge P(1) is executed before time t11e(24), and step S52 in the routine for determining whether or not the first pre-processing is required is executed before time t11e(24). At time t11e(24), the determination in step S53 becomes positive, and counting of count value M(1) is started in step S54.

[0180] The black circle on the broken line C1 indicates the time point at which counting of the count value M(1) starts in the routine for determining whether or not the first pre-processing is required (the time point at which step S54 is executed).

[0181] After counting is started in step S54, step S55 is executed. Step S55 is a process for judging whether the count value M(j) is less than a predetermined value M0(j). The predetermined value M0(j) corresponds to a period during which a state in which ejection P(j) is not performed is permitted to continue. If the state in which ejection P(j) is not performed is shorter than the time corresponding to the predetermined value M0(j), pre-processing for ejection P(j) is not necessary.

[0182] If the determination result in step S55 is negative, the count value M(j) is equal to or greater than the predetermined value M0(j), and steps S50 and S59 are executed. Step S50 is a process of ending the counting of the count value M(j) and resetting the count value M(j). In step S59, it is determined that pre-processing is necessary. After steps S50 and S59 are executed, the routine for determining whether pre-processing is necessary is terminated.

[0183] When the determination result in step S55 is positive, the count value M(j) is less than the predetermined value M0(j), and step S56 is executed. In step S56, it is determined whether or not the substrate We has been loaded into the chamber 4. The substrate We is the substrate W that is subjected to the substrate processing set by the last process recipe among the process recipes belonging to the same process recipe group, among the substrates W stored in the same carrier C. In this case, since 25 substrates W are stored in the same carrier C, the substrate We refers to the substrate W(25).

[0184] Before time t10 (25), the result of the determination in step S56 is negative, and step S51 is executed again without determining whether pre-processing is necessary.

[0185] When step S56 is executed after time t10 (25), the determination result in step S56 becomes positive, and step S57 is executed.

[0186] In step S57, the time from the end of discharge P(j) to the substrate We until discharge P(j) is performed again is estimated, and the necessity of pre-processing is judged based on the estimated time and the time equivalent to a predetermined value M0(j). Specifically, it is judged whether the count value M(j) is less than the value (M0(j)-R(j)).

[0187] Regarding the routine for determining whether the second pre-processing is necessary, step S57 will be described with reference to Fig. 15. According to the flow recipe, after time t10(25), the processes set by the loading recipe J10(25), the discharge recipes J11(25), J12(25), the unloading recipe J14(25), the pre-recipe Pr2, and the loading recipe J20(1) are executed, and then the discharge P(2) based on the discharge recipe J22(1) is executed.

[0188] When it is expected that processing corresponding to each of the unloading recipe J14(25) and the loading recipe J20(1) will be executed before the time corresponding to the predetermined value M0(2) elapses after time t12e(25), it is assumed that pre-processing based on the pre-recipe Pr2 is unnecessary.

[0189] The count value M(2) is reset at time t12e(24). The count value M(2) at time t10(25) corresponds to the time during which the process set by the unloading recipe J14(25) is executed. This time is assumed to be equal to the time from the end of the discharge P(2) at time t12e(25) to the end of the unloading of the substrate We according to the unloading recipe J14(25).

[0190] If the result of adding the count value M(2) at time t10(25) to the count value corresponding to the time required for processing set by the loading recipe J20(1) is less than a predetermined value M0(2), it is assumed that pre-processing based on the pre-recipe Pr2 is not necessary.

[0191] A count value corresponding to the time required for processing set by the loading recipe J20(1) is used as the value R(2). When the substrate We is loaded into the chamber 4 and the determination result in step S56 becomes positive, if the count value M(2) is less than the value (M0(2)-R(2)), the determination result in step S57 becomes positive. At this time, it is determined in step S58 that pre-processing, specifically, pre-processing set by the pre-recipe Pr2, is not required.

[0192] If the count value M(2) is equal to or greater than the value (M0(2)-R(2)), it is assumed that the time corresponding to the predetermined value M0(2) will elapse when the processes corresponding to the unloading recipe J14(25) and the loading recipe J20(1) are executed after time t12e(25). At this time, the determination result in step S57 becomes negative, and it is determined in step S59 that pre-processing, specifically, pre-processing set by the pre-recipe Pr2, is required.

[0193] Fig. 17 is a timing chart showing the substrate processing when step S59 is executed in the routine for determining whether the second pre-processing is necessary, using the process recipe and the pre-recipe. The determination result in step S5 of Fig. 8 is positive, and the pre-processing set by the pre-recipe Pr2 corresponding to step S6 is executed. The pre-processing starts at time t2s and ends at time t2e.

[0194] Thereafter, the flowchart of FIG. 8 is executed again in accordance with the process recipe group J2, and the routine for determining whether or not pre-processing is required is executed again in accordance with step S5.

[0195] Time t22s(k) is the time when the substrate processing set by the discharge recipe J22(k) starts, more specifically, the time when the discharge P(2) onto the upper surface Wu of the substrate W(k) starts. Time t22e(k) is the time when the substrate processing set by the discharge recipe J22(k) ends, more specifically, the time when the discharge P(2) onto the upper surface Wu of the substrate W(k) ends.

[0196] Time t20(25) is the time for the process set by the loading recipe J20(25), specifically, the time for loading the substrate W(25) (which is also the substrate We).

[0197] Fig. 18 is a timing chart showing the substrate processing when step S58 is executed in the routine for determining whether the second pre-processing is necessary, using the process recipe and the pre-recipes. The determination result in step S5 of Fig. 8 is negative, and step S6 is not executed. After the substrate We is unloaded based on the unloading recipe J14 (25), the flowchart of Fig. 8 is executed again in accordance with the process recipe group J2.

[0198] Time tr31s is the time when discharge P(1) set by discharge recipe Pr31 starts. Time tr31e is the time when discharge P(1) set by discharge recipe Pr31 ends. Time tr33s is the time when discharge P(3) set by discharge recipe Pr33 starts. Time tr33e is the time when discharge P(3) set by discharge recipe Pr33 ends. For simplicity, times tr31e and tr33s are shown to be the same in FIG. 18, but to be precise, time tr31e precedes time tr33s.

[0199] Time t31s(k) is the time when discharge P(1) set by the discharge recipe J31(k) starts. Time t31e is the time when discharge P(1) set by the discharge recipe J31(k) ends. Time t33s(k) is the time when discharge P(1) set by the discharge recipe J33(k) starts. For simplicity, times t31e(k) and t33s(k) are shown as being the same in FIG. 18, but to be precise, time t31e precedes time t33s.

[0200] 15, in the routine for determining whether or not the first pre-processing is required, counting of the count value M(1) starts at time t11e (24) (see step S54 in FIG. 16), and at time t10 (25), the determination is made in step S57.

[0201] 9, 11, 12, and 17, except for the pre-processing set by the pre-recipe Pr3, after the discharge P(1) based on the discharge recipe J11(25) ends, a state in which the discharge P(1) is not executed continues until the discharge P(1) based on the discharge recipe J31(1) starts. During this period, the processes set by the discharge recipe J12(25), the unloading recipe J14(25), the pre-recipe Pr2, the process recipe group J2, and the load recipe J30(1) (hereinafter tentatively referred to as the "first intermediate processing group") are executed.

[0202] While the first intermediate process group is being executed, discharge P(1) does not start, so step S52 is not executed, steps S51, S55, and S56 are repeatedly executed, and the count value M(1) continues to increase.

[0203] The need for pre-processing set by pre-recipe Pr3 is determined based on whether the period during which the first intermediate processing group is being performed is longer than the period during which the state in which no discharge P(1) is performed is permitted to continue (this corresponds to a predetermined value M0(1)).

[0204] After the counting of the count value M(1) starts at time t11e(24) (see the black circle on the dashed line C1 in FIG. 15), the result of the determination in step S56 becomes positive at time t10(25), and step S57 is executed.

[0205] 17 and 18, if the sum of the count value M(1) at time t10(25) and the count value corresponding to the time for which the processes set by the process recipe J1(25), the pre-recipe Pr2, the process recipe group J2, and the loading recipe J30(1) (hereinafter tentatively referred to as the "second intermediate process group") are performed is smaller than a predetermined value M0(1), then pre-processing of the processing liquid DHF is unnecessary. From this perspective, the count value corresponding to the total time for which the second intermediate process group is performed is adopted as the value R(1).

[0206] If the determination result of step S57 is positive, the process proceeds to step S58, where it is determined that the pre-processing set by the discharge recipe Pr31 of the pre-recipe Pr3 is unnecessary. If the determination result of step S57 is negative, the process proceeds to step S59, where it is determined that the pre-processing set by the pre-recipe Pr3 is necessary.

[0207] Specifically, the second pre-processing necessity determination routine does not determine the necessity of the entire pre-processing set by the pre-recipe Pr3. Therefore, the determination result of step S5 in FIG. 8 is affirmative, and step S6 is executed. The pre-processing executed in step S6 is the discharge P(3) set by the discharge recipe Pr33. This can be seen as a reduction in the pre-processing. FIG. 19 shows, as a timing chart, the substrate processing when the discharge recipe Pr31 is omitted, using the process recipe and the pre-recipe.

[0208] Even in this case, the period required for substrate processing is shortened compared to the case where the result of the determination in step S57 in the routine for determining whether the second pre-processing is required is negative, and such a reduction contributes to the simplification of the substrate processing method.

[0209] <1-8-4. Timing of deciding whether pre-processing is necessary> For each recipe included in the flow recipe, the time required for executing the process set by each recipe is set in advance. Therefore, at the beginning of the substrate processing based on the flow recipe, it may be determined whether or not pre-processing is required. Based on the result of the determination, non-execution of pre-processing (e.g. non-execution of pre-processing set by pre-recipe Pr2) or partial non-execution of pre-processing (reduced pre-processing: for example non-execution of discharge P(1) set by discharge recipe Pr31) may be realized.

[0210] However, it is also assumed that the flow recipe may be changed during its execution. It is also assumed that processing may be performed for a time different from that set in the flow recipe due to processing statuses among the multiple processing units 21. In such cases, the necessity of pre-processing determined at the beginning of substrate processing based on the flow recipe may no longer be appropriate.

[0211] In the above example, in the first cleaning process, the necessity of pre-processing is determined using the count value at the timing when the substrate We is carried into the chamber 4, specifically, at time t10 (25). Determining the necessity of pre-processing at such a timing contributes to appropriately determining the necessity of pre-processing even in the case assumed above.

[0212] <2. General Description> The above-described embodiment can be generally described as follows: In the substrate processing method according to the present disclosure, the flow recipe is preset. The flow recipe includes a first process recipe, a second process recipe, and a pre-recipe.

[0213] In the embodiment, referring to FIG. 9, process recipes J1(1) to J1(25) are exemplified as the first process recipe.

[0214] The second process recipe is exemplified by process recipes J2(1) to J2(25), and the pre-recipe is exemplified by pre-recipe Pr2. Alternatively, the second process recipe is exemplified by process recipes J3(1) to J3(25), and the pre-recipe is exemplified by pre-recipe Pr3.

[0215] The first process recipe sets the contents of a first process to be performed on a substrate. In the embodiment, referring to FIG. 10, the process recipe J1(k) sets the discharges P(1) and P(2) to be performed on the substrate W(k). More specifically, the process recipe J1(k) includes discharge recipes J11(k) and J12(k), which respectively set the discharges P(1) and P(2) to be performed on the substrate W(k). The first process includes the discharge P(1) of the processing liquid DHF to the substrate W(k). The first process includes the discharge P(2) of the processing liquid SC1 to the substrate W(k).

[0216] The second process recipe defines the content of a second process to be performed on the substrate after the first process, and the pre-recipe defines the content of a preliminary operation for the second process recipe.

[0217] In the embodiment, referring to Fig. 11, the process recipe J2(k) sets the discharge P(2) to be performed on the substrate W(k). More specifically, the process recipe J2(k) includes a discharge recipe J22(k), which sets the discharge P(2) to be performed on the substrate W(k). The second process includes the discharge P(2) of the processing liquid SC1 to the substrate W(k). The pre-recipe Pr2 sets the contents of a preparatory operation for the process recipe J2(k). The preparatory operation includes the discharge of the processing liquid SC1.

[0218] 12, in an embodiment, process recipe J3(k) sets discharges P(1) and P(3) to be executed on substrate W(k). More specifically, process recipe J3(k) includes discharge recipes J31(k) and J33(k), which set discharges P(1) and P(3) to be executed on substrate W(k), respectively.

[0219] The second process includes a discharge P(1) of the processing liquid DHF onto the substrate W. The second process includes a discharge P(3) of the processing liquid IPA onto the substrate W. The pre-recipe Pr3 sets the contents of the preliminary operation for the process recipe group J3. The pre-recipe Pr3 includes a discharge recipe Pr31, and the preliminary operation set by the discharge recipe Pr31 includes the discharge of the processing liquid DHF. The pre-recipe Pr3 includes a discharge recipe Pr33, and the preliminary operation set by the discharge recipe Pr33 includes the discharge of the processing liquid IPA.

[0220] Both the first process and the second process include dispensing a first chemical liquid onto the substrate W. Here, the first chemical liquid may be assumed to be a processing liquid SC1, the first process is set by the dispensing recipe J12(1) to J12(25), the preliminary operation is set by the dispensing recipe Pr12, and the second process is set by the dispensing recipe J22(1) to J22(25). Alternatively, the first chemical liquid may be assumed to be a processing liquid DHF, the first process is set by the dispensing recipe J11(1) to J11(25), the preliminary operation is set by the dispensing recipe Pr31, and the second process is set by the dispensing recipe J31(1) to J31(25).

[0221] If the period from the end of the first process to the start of the second process is shorter than the first threshold, the time of the preparatory operation is reduced and the second process is performed. When the processing liquid SC1 is assumed to be the first chemical liquid, the first process ends with the end of the discharge recipe J12(25) and the second process starts with the start of the discharge recipe J22(1). The period during which the state in which discharge P(2) is not performed is permitted to continue is assumed to be the first threshold. If the period from time t12e(25) to time t22s(1) is shorter than the first threshold, the pre-operation set by the pre-recipe Pr2 is omitted. The predetermined value M0(2) is a count value equivalent to the first threshold.

[0222] When the processing liquid SC1 is assumed to be the first chemical liquid, the time for the preparatory operation is reduced to substantially zero.

[0223] When the processing liquid DHF is assumed as the first chemical liquid, the first process ends with the end of the discharge recipe J11(25), and the second process starts with the start of the discharge recipe J31(1). The period during which the state in which discharge P(1) is not performed is permitted to continue is assumed as the first threshold. If the period from time t11e(25) to time t31s(1) is shorter than the first threshold, the pre-operation set by the discharge recipe Pr31 in the pre-recipe Pr3 is omitted. The predetermined value M0(1) is a count value equivalent to the first threshold.

[0224] When the processing liquid DHF is assumed to be the first chemical liquid, the time for the preparatory operation is reduced by the time required for the pre-operation set by the discharge recipe Pr31.

[0225] The substrate processing method includes a step of performing a first process (for example, the first process is set by a process recipe set J1) and a step of determining whether or not a period from the end of the first process to the start of a second process is shorter than a first threshold value (such a determination is realized by, for example, steps S55, S56, S57, S58, S59, and step S5). The judgment If the result of the judgment is positive, the step of reducing the time of the pre-operation and executing the second process is included.

[0226] Considering the processing liquid SC1, the second process includes the discharge P(2). At this time, the necessity of the pre-processing set by the pre-recipe Pr2 is judged, and if the result of the above judgment is affirmative, the pre-processing is omitted. This omission can be said to be an extreme reduction in the time required for the pre-processing.

[0227] Considering the processing liquid DHF, the second process includes discharge P(1). At this time, the necessity of pre-processing set by the discharge recipe Pr31 is judged, and if the result of the above judgment is affirmative, the pre-processing is omitted. The omission can be said to be a reduction in the time required for the pre-processing set by the pre-recipe Pr3.

[0228] However, when the processing liquid SC1 is assumed as the first chemical liquid, in the embodiment, the period from time t12e(25) to time t22s(1) is estimated at time t10(25), so the value R(2) described using step S57 is used. When the processing liquid DHF is assumed as the first chemical liquid, in the embodiment, the period from time t11e(25) to time t31s(1) is estimated at time t10(25), so the value R(1) described using step S57 is used.

[0229] In other words, the flow recipe includes N first processes corresponding to N substrates W(1)-W(N) (N is an integer equal to or greater than 2: the integer 25 in this embodiment). When the first process for substrates W(1)-W(N-1) ends and the first process for substrate W(N) starts, it is determined whether the period from the end of the first process to the start of the second process is shorter than a first threshold value.

[0230] <3. Transformation> <3-1. First transformation> Even if the period from the end of the discharge of the first chemical liquid in the first process to the start of the discharge of the first chemical liquid in the second process exceeds the first threshold, if the degree of deterioration is small, the degree of deterioration of the first chemical liquid is also considered to be low. Below, a description will be given in which a second threshold value longer than the first threshold value is introduced.

[0231] In accordance with the embodiment, if it is estimated that the period from time t12e(25) to time t22s(1) exceeds the period during which the state in which discharge P(2) is not performed is permitted by time δ2 (>0), it is considered that the deterioration of the treatment liquid SC1 is small if the time δ2 is short. Therefore, the second threshold value may be set to be larger than the first threshold value for discharge P(2) to reduce the time of the pre-operation set by the discharge recipe Pr12.

[0232] Alternatively, if it is estimated that the period from time t11e(25) to time t31s(1) exceeds the period during which no discharge P(1) is permitted by time δ1 (>0), it is considered that the deterioration of the treatment liquid DHF is small if the time δ1 is short. Therefore, the second threshold value may be set to be larger than the first threshold value for discharge P(1) to reduce the time of the pre-operation set by the discharge recipe Pr31.

[0233] The reduction in the time required for the pre-operation contributes to a reduction in the period required for substrate processing. The reduction in the time required for the pre-operation is achieved by controlling the operation of each part by the main body control unit 22 and the liquid management control unit 24 when step S6 is executed, for example.

[0234] <3-2. Second transformation> If the period from the end of the discharge of the first chemical liquid in the first process to the start of the discharge of the first chemical liquid in the second process exceeds the first threshold, and if the degree of deterioration is large, the degree of deterioration of the first chemical liquid is also considered to be large. Below, a description will be given in which a third threshold value longer than the second threshold value is introduced.

[0235] If it is estimated that the period from time t12e(25) to time t22s(1) greatly exceeds the period during which the state in which discharge P(3) is not performed is permitted, the deterioration of the treatment liquid SC1 is also considered to be significant. Therefore, the third threshold value may be set to be greater than the second threshold value for discharge P(2) to increase the time of the pre-operation set by the discharge recipe Pr12.

[0236] Alternatively, if it is estimated that the period from time t11e(25) to time t31s(1) greatly exceeds the period during which the state in which discharge P(1) is not performed is permitted, it is considered that the deterioration of the processing liquid DHF is also significant. Therefore, the third threshold value may be set to be greater than the second threshold value for discharge P(1) to increase the time of the pre-operation set by the discharge recipe Pr31.

[0237] Such an increase in the time of the pre-operation contributes to reducing the influence of deterioration of the first chemical liquid on the second process. Such an increase in the time of the pre-operation is realized by controlling the operation of each part by the main body control unit 22 and the liquid management control unit 24 when step S6 is executed, for example.

[0238] <3-3.Third transformation> The discharge of the first chemical liquid may be performed when a time longer than a fourth threshold value, which is longer than the first threshold value, has elapsed after the discharge of the first chemical liquid has ended without the discharge of the first chemical liquid being resumed.

[0239] example For example, if the discharge P(2) does not resume even after a time longer than the fourth threshold has elapsed since the discharge recipe J12(25) ended, the treatment liquid SC1 is discharged.

[0240] example For example, if the discharge P(1) does not resume even after a time longer than the fourth threshold has elapsed since the discharge recipe J11(25) ended, the treatment liquid DHF is discharged.

[0241] For example, if the discharge P(3) does not resume even after a time longer than the fourth threshold has elapsed since the discharge recipe J33(25) ended, the treatment liquid IPA is discharged.

[0242] The discharge of the processing solution according to the third modification enhances the effect of reducing the influence of deterioration of the chemical solution on subsequent processing.

[0243] The embodiments and modifications disclosed herein are merely examples, and the substrate processing method is not limited to the above-described contents. For example, all or part of the embodiments and modifications can be appropriately combined. [Explanation of symbols]

[0244] DHF, IPA, SC1 processing solution J1, J2, J3 process recipe group J1(1)~J1(25),J1(k),J2(1)~J2(25),J2(k),J3(1)~J3(25),J3(k) Process recipes J11(1)~J11(25),J11(k),J12(1)~J12(25),J12(k),J22(1)~J22(25),J22(k),J31(1)~J31(25),J31(k),J33(1)~J33(25),J33(k),Pr11,Pr12,Pr31,Pr33 Discharge Recipe M Count Value M0 predetermined value P(1),P(2),P(3) Discharge S1, S2, S3, S4, S5, S6, S50, S51, S52, S53, S54, S55, S56, S57, S58, S59 Steps W substrate t11e(24),t12s(24),t12e(24),t10(25),t11s(25),t11e(25),t12s(25),t12e(25),t2s,t2e,t22s(1),t22e(1),t2 2s(24),t22e(24),t20(25),t22s(25),t22e(25),tr31s,tr31e,tr33s,tr33e,t31s(1),t31e(1),t33s(1),t33e(1) time

Claims

1. a first process recipe that sets the content of a first process to be performed on the substrate; a second process recipe that sets a content of a second process to be performed on the substrate after the first process; a pre-recipe for setting the contents of a preliminary operation for the second process recipe; A substrate processing method, comprising: the first process includes dispensing a first chemical onto the substrate; the second process includes discharging the first chemical onto the substrate; The preliminary operation includes discharging the first chemical solution, performing the first process; determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold; If the result of the determination is positive, reducing the time of the preparatory movement and executing the second process. Equipped with a substrate processing method, wherein a time for the preparatory operation is reduced when a period from the end of the discharge of the first chemical liquid in the first process to the start of the discharge of the first chemical liquid in the second process is shorter than a second threshold value longer than the first threshold value and longer than the first threshold value.

2. 2. The substrate processing method of claim 1, wherein a time period of the preparatory operation is increased when a period from the end of the discharge of the first chemical liquid in the first process to the start of the discharge of the first chemical liquid in the second process is longer than a third threshold value that is longer than the second threshold value.

3. A first process recipe that sets the content of a first process to be performed on a substrate; a second process recipe that sets a content of a second process to be performed on the substrate after the first process; a pre-recipe for setting the contents of a preliminary operation for the second process recipe; A substrate processing method, comprising: the first process includes dispensing a first chemical onto the substrate; the second process includes discharging the first chemical onto the substrate; The preliminary operation includes discharging the first chemical solution, performing the first process; determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold; If the result of the determination is positive, reducing the time of the preparatory movement and executing the second process. Equipped with A substrate processing method, wherein the discharge of the first chemical liquid is performed when a time longer than a fourth threshold value longer than the first threshold value has elapsed after the discharge of the first chemical liquid has been completed without the discharge of the first chemical liquid being resumed.

4. A first process recipe that sets the content of a first process to be performed on a substrate; a second process recipe that sets a content of a second process to be performed on the substrate after the first process; a pre-recipe for setting the contents of a preliminary operation for the second process recipe; A substrate processing method, comprising: the first process includes dispensing a first chemical onto the substrate; the second process includes discharging the first chemical onto the substrate; The preliminary operation includes discharging the first chemical solution, performing the first process; determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold; If the result of the determination is positive, reducing the time of the preparatory movement and executing the second process. Equipped with the flow recipe includes N first processes corresponding to N substrates (N is an integer equal to or greater than 2), A substrate processing method, comprising: determining, at a point in time when the first processing is completed for a first to (N-1)th substrate and the first processing is started for an Nth substrate, whether or not a period from the completion of the Nth first processing to the start of the second processing is shorter than the first threshold value.

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