Semiconductor manufacturing apparatus and chip handling method

Abstract

To provide a semiconductor manufacturing apparatus and a chip handling method that can achieve both lateral retention and high cleanliness.SOLUTION: A semiconductor manufacturing apparatus 100 has a workpiece 101 having a plurality of pressure holes 112 for jetting gas and a plurality of suction holes 113 for suctioning gas and handling a semiconductor chip 200 through air, and the suction holes 113 are provided at least at a position adjacent to an edge of the workpiece 101 and as far as possible above an apex of the workpiece 101.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a semiconductor manufacturing apparatus and a chip handling method. [Background technology]

[0002] In conventional semiconductor mounting processes, the height of the bumps was tolerated by inserting an encapsulating material between the chip and the wafer, but the demand for higher density mounting has created a need for a direct bonding process that does not use bumps.

[0003] With this technology, functional groups are exposed by activating the surface using plasma or other methods, and then the functional groups bond to each other, resulting in a stronger structure with no gaps and no need for height, enabling higher-density mounting.

[0004] However, since the activated surface requires extremely high precision in terms of flatness and high cleanliness, various methods are being considered, such as separating the surface into trays in advance, subjecting it to plasma treatment, and then treating the surface all at once with WoW.

[0005] However, these methods are significantly different from current bonding methods, and production takes a long time.

[0006] Therefore, in order to enable the conventional flip-chip bonding method in which a diced chip is picked up and handed over to a bonding head, a method of adsorbing an activated chip without contact has been investigated.

[0007] Patent Document 1 describes a non-contact conveying method using porous pressure and suction, while Patent Document 2 describes a non-contact conveying method using ultrasonic waves and suction.

[0008] Although it is possible to pick up the chip without contact, it is difficult to hold it in the lateral direction, so a method is generally used in which a pin or claw is used to position a component so that it acts as a stopper even if the chip moves in the lateral direction.

[0009] On the other hand, as mentioned above, high cleanliness is required, and so pins or fingernails come into contact with the diced edge of the chip, causing particle generation. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] JP 2016-121015 A [Patent Document 2] International Publication No. 2018 / 099615 Summary of the Invention [Problem to be solved by the invention]

[0011] Thus, there is a demand for chip handling that can hold the chips in the lateral direction while maintaining a high level of cleanliness. [Means for solving the problem]

[0012] In one embodiment, a semiconductor manufacturing apparatus has a plurality of pressurization holes for spraying gas and a plurality of suction holes for sucking the gas, and is equipped with a workpiece for handling a semiconductor chip via the gas, and the suction holes are provided at least at positions adjacent to the edges of the workpiece and as close to the apex of the workpiece as possible.

[0013] According to one embodiment of the semiconductor manufacturing apparatus, both lateral holding and high cleanliness can be achieved.

[0014] The semiconductor manufacturing apparatus of one embodiment may include a pressurizing section connected to the pressurizing hole for sending out a gas, and a suction section connected to the suction hole for sucking in the gas.

[0015] According to one embodiment of the semiconductor manufacturing apparatus, the apparatus itself can supply and suck gas without connecting external supply means and suction means.

[0016] In one embodiment, the semiconductor manufacturing apparatus may be configured so that a total cross-sectional area of ​​the plurality of suction holes is larger than a total cross-sectional area of ​​the plurality of pressurizing holes.

[0017] According to one embodiment of the semiconductor manufacturing apparatus, the suction pressure is always higher than the pressure of the hole simply by the shape of the hole, and gas is continuously discharged for floating, so that particles from the outside can be prevented from entering.

[0018] In one embodiment of the semiconductor manufacturing apparatus, the suction holes may be further provided at positions adjacent to the sides of chips of a plurality of chip sizes and as close to the apex of the chip as possible, so that the suction holes that suck in gas differ depending on the chip size.

[0019] According to one embodiment of the semiconductor manufacturing apparatus, a plurality of chip sizes can be handled.

[0020] One embodiment of the chip handling method has a workpiece having a plurality of pressurization holes for spraying gas and a plurality of suction holes for sucking in the gas, and uses a workpiece that handles a semiconductor chip via the gas to spray gas from the pressurization holes and suck in gas from the suction holes, and the suction holes are provided at positions adjacent to the edges of the workpiece and as close to the apex of the workpiece as possible.

[0021] According to one embodiment of the chip handling method, it is possible to achieve both lateral holding and high cleanliness. Effect of the Invention

[0022] According to the semiconductor manufacturing apparatus and chip handling method of the present invention, it is possible to achieve both lateral holding and high cleanliness. [Brief description of the drawings]

[0023] [Figure 1] 1 is a diagram showing a schematic configuration of a semiconductor device according to a first embodiment; [Diagram 2] FIG. 2 is a diagram showing an example in which the semiconductor device according to the first embodiment adsorbs a chip; [Diagram 3] FIG. 2 is a diagram showing an example in which the semiconductor device according to the first embodiment adsorbs a chip; [Figure 4] FIG. 2 is a diagram showing an example of a workpiece of the semiconductor manufacturing apparatus according to the first embodiment. [Diagram 5] FIG. 2 is a diagram showing an example of a workpiece of the semiconductor manufacturing apparatus according to the first embodiment. [Figure 6] FIG. 2 is a diagram showing an example of a workpiece of the semiconductor manufacturing apparatus according to the first embodiment. [Figure 7] FIG. 2 is a diagram showing an example of a workpiece of the semiconductor manufacturing apparatus according to the first embodiment. [Figure 8] FIG. 11 is a diagram showing an example of a workpiece of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 9] FIG. 13 is a diagram showing a schematic configuration of a semiconductor device according to a second embodiment. [Figure 10] FIG. 13 is a diagram showing an example of a workpiece of a semiconductor manufacturing apparatus according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] (Embodiment 1) Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a diagram showing a schematic configuration of a semiconductor device according to embodiment 1. In Fig. 1, a semiconductor manufacturing apparatus 100 includes a workpiece 101, a pressure applying unit 102, and a suction unit 103.

[0025] The workpiece 101 has at least one flat surface for handling the chip 200. The workpiece 101 corresponds to the shape of the chip 200 to be handled. The workpiece 101 also has a plurality of pressurizing holes 112 and a plurality of suction holes 113 on this flat surface.

[0026] The pressurizing hole 112 is a hole for ejecting gas onto the surface side of the workpiece 101 where the chip 200 is handled. The pressurizing hole 112 is desirably disposed near the suction hole 113. The size of the pressurizing hole 112 is desirably a hole size of 50 μm or less.

[0027] The suction hole 113 is a hole that sucks in gas from the surface side of the workpiece 101 where the chip 200 is handled. The suction hole 113 is provided at a position adjacent to the side of the surface of the workpiece 101 and as close to the apex of the surface of the workpiece 101 as possible. In other words, the position of the suction hole 113 is a position that does not protrude from the chip size for the chip 200 that is non-contact-adsorbed. The suction hole 113 may be provided at a position other than the above. For example, it may be provided at the center of the surface of the workpiece 101. The size of the suction hole 113 is preferably 0.5 mm, for example. The detailed position of the suction hole 113 will be described later. It is desirable that the total cross-sectional area of ​​the multiple suction holes 131 is greater than the total cross-sectional area of ​​the multiple pressurizing holes 112.

[0028] The pressurizing unit 102 is connected to the pressurizing hole 112 and sends out gas. The pressurizing unit 102 may be composed of, for example, a cylinder filled with an inert gas such as nitrogen, a regulator, a flow control valve, and piping. The pressurizing unit 102 may also be composed of, for example, a pump and piping. The pressure setting of the pressurizing unit 102 is preferably, for example, 0.2 MPa to 0.6 MPa.

[0029] The suction unit 103 is connected to the suction hole 113 and sucks in the gas. For example, the suction unit 103 may be composed of a pump and piping. The suction of the suction unit 103 is preferably 83 kPa to 70 kPa.

[0030] With the above-described configuration, the semiconductor manufacturing apparatus 100 can lift the chip 200 at a fixed distance from the workpiece 101 by using the suction force that performs vacuum suction from the suction holes 113 arranged on the workpiece 101 and pressure from the pressure holes 112 that are evenly arranged around the vacuum suction holes.

[0031] Next, a principle of holding the position of the chip 200 while adsorbing the chip 200 to the workpiece 101 in a non-contact manner will be described. Fig. 2 is a diagram showing an example in which the semiconductor device according to the first embodiment adsorbs a chip.

[0032] 2, when the tip 200 is positioned along the center of the workpiece 101, the gas ejected from the pressurizing holes 112 is sucked into the suction holes 113. Also, the surrounding gas is sucked into the suction holes 113 from the side ends of the tip 200. Since the flow of the sucked gas is balanced between the ends, the tip 200 is adsorbed to the workpiece 101 and does not shift position.

[0033] Next, a case will be described where the chip 200 is displaced from the workpiece 101. Fig. 3 is a diagram showing an example in which the semiconductor device according to the first embodiment adsorbs a chip.

[0034] As shown in Fig. 3, when the tip 200 is misaligned from the workpiece 101, a part of the suction hole 113 is not covered by the tip 200 and is exposed. When the suction hole 113-1 is exposed as shown in Fig. 3, the gas near the suction hole 113-1 is sucked in. As a result, the gas flows faster near the suction hole 113-1 and the pressure is lower than the surrounding area. Therefore, the tip 200 moves in the direction of lower pressure. In other words, the tip 200 moves in the direction of covering the exposed top surface of the suction hole 113-1.

[0035] The position of the chip 200 is maintained by the above principle. Next, an example of the shape of the workpiece 101 will be described. FIG. 4 is a diagram showing an example of a workpiece of the semiconductor manufacturing apparatus according to the first embodiment. FIG. 4 shows an example in which the surface shape of the workpiece 101 for handling the chip 200 is rectangular. As shown in FIG. 4, the suction holes 113 are provided in positions adjacent to the sides of the surface of the workpiece 101 and as close to the vertices of the surface of the workpiece 101 as possible. The suction holes 113 are also provided at the center of the rectangle in addition to the vertices. A large number of pressurizing holes 112 are provided in any position of the workpiece 101.

[0036] The suction holes 113 may be provided at positions adjacent to the sides of the surface and at positions other than the vertices of the surface of the workpiece 101 as far as possible. Fig. 5 is a diagram showing an example of a workpiece of the semiconductor manufacturing apparatus according to the first embodiment. In Fig. 5, the suction holes 113 are provided at the positions of the sides in addition to the positions in Fig. 4.

[0037] Moreover, the shape of the workpiece 101 may be triangular. Fig. 6 is a diagram showing an example of a workpiece of the semiconductor manufacturing apparatus according to the first embodiment. Fig. 6 shows an example in which the surface shape for handling the chip 200 is triangular.

[0038] Moreover, the shape of the work 101 may be a pentagon. Fig. 7 is a diagram showing an example of a work of the semiconductor manufacturing apparatus according to the first embodiment. Fig. 7 shows an example in which the surface shape for handling the chip 200 is a pentagon.

[0039] 4 to 7, for the sake of convenience, regular polygons are shown as examples, but the lengths of the sides do not have to be equal. Also, the present invention may be applied to asymmetric polygons.

[0040] As described above, the tip 200 can be applied to the workpiece 101 that corresponds to various shapes of the tip 200.

[0041] Next, an example of a handling operation using the semiconductor manufacturing equipment 100 will be described.

[0042] When picking up from a diced wafer with a flip chip head, the flip chip head having the work 101 is brought close, and an ejector pin or the like is used to lift up individual chip pieces from below the wafer. By operating both the pressure unit 102 and the suction unit 103, the chip is simultaneously pressed and sucked by the flip chip head, and is adsorbed to the work 101 at the optimum position (approximately 5 μm to 200 μm).

[0043] After suction, the head is turned over for a flip operation and moved to the suction position of the bonding head.

[0044] Then, once the chip has been adsorbed by the bonding head, the pressure and suction on the flip chip head side are stopped.

[0045] Thus, according to the semiconductor manufacturing apparatus of the first embodiment, it is possible to automatically suppress lateral positional deviation while performing non-contact suction. Also, according to the semiconductor manufacturing apparatus of the first embodiment, it is possible to automatically correct deviation in the rotational direction while performing non-contact suction. Furthermore, according to the semiconductor manufacturing apparatus of the first embodiment, it is possible to change the shape of the held chip by changing the layout of the suction holes and pressure holes. And, according to the semiconductor manufacturing apparatus of the first embodiment, the suction pressure is always higher and compressed air is continuously discharged for floating, so no particles can enter from the outside.

[0046] (Embodiment 2) In the second embodiment, a semiconductor manufacturing apparatus capable of handling a plurality of chip sizes will be described. Fig. 8 is a diagram showing an example of a workpiece of the semiconductor manufacturing apparatus according to the second embodiment.

[0047] 8, the work 801 has a work area 801-1 and a work area 801-2. The work area 801-2 is an area located outside the work area 801-1.

[0048] The work area 801-1 has a plurality of pressurizing holes 812 and a plurality of suction holes 813. The work area 801-2 has a plurality of pressurizing holes 822 and a plurality of suction holes 823.

[0049] When handling a chip whose size corresponds to the work area 801-1, gas is ejected from the multiple pressurizing holes 812 and gas is sucked from the multiple suction holes 813.

[0050] When handling a chip whose size corresponds to the work area 801-2, gas is ejected from the multiple pressurizing holes 812 and 822, and gas is sucked from the multiple suction holes 813 and 823.

[0051] Fig. 9 is a diagram showing a schematic configuration of a semiconductor device according to embodiment 2. In Fig. 9, a semiconductor manufacturing apparatus 800 includes a workpiece 801, pressure applying units 102-1 and 102-2, and suction units 103-1 and 103-2.

[0052] The workpiece 801 is the workpiece described in Fig. 8. The pressure applying units 102-1 and 102-2 have the same configuration as the pressure applying unit 102 in the first embodiment. The suction units 103-1 and 103-2 have the same configuration as the suction unit 103 in the first embodiment.

[0053] When handling a chip whose size corresponds to the work area 801-1, the pressure unit 102-1 and the suction unit 103-1 are operated, and the pressure unit 102-2 and the suction unit 103-2 are not operated.

[0054] When handling a chip whose size corresponds to the work area 801-2, the pressure units 102-1 and 102-2 and the suction units 103-1 and 103-2 are operated.

[0055] These operations are controlled by a controller (not shown).

[0056] In this way, the semiconductor manufacturing apparatus of the second embodiment can handle a variety of chip sizes.

[0057] In the above-mentioned second embodiment, a form in which a plurality of pressurizing sections and suction sections are provided has been described, but a single pressurizing section and suction section may be connected to a plurality of pressurizing holes 812 and 822 via valves, and a single decompression section may be connected to a plurality of suction holes 813 and 823 via valves. The pressurizing hole for ejecting gas and the suction hole for sucking gas may be selected by opening and closing the valve.

[0058] The present invention is not limited to the above-mentioned embodiment, and can be modified as appropriate without departing from the spirit of the present invention. For example, in the above-mentioned embodiment, the gas may be not only air, but also a single component gas such as nitrogen, or a mixed gas. For example, an inert gas is preferable as the gas.

[0059] Furthermore, the cross-sectional shape of the suction holes and the pressurizing holes is not limited to the circle shown in the above embodiment, but may be any shape such as an ellipse or a polygon.

[0060] Moreover, the pressurizing hole 112 and the suction hole 113 are arranged at a position corresponding to the chip to be handled, and may be located inside the position of the size of the workpiece 101. Fig. 10 is a diagram showing an example of a workpiece of a semiconductor manufacturing apparatus according to another embodiment. As shown in Fig. 10, the workpiece 101 is smaller than the chip 1001 to be handled. And the pressurizing hole 112 and the suction hole 113 are arranged at a position corresponding to the chip 1001 to be handled. [Explanation of symbols]

[0061] 100 Semiconductor manufacturing equipment 101,801 Work 102 Pressurizing section 103 Suction part 112,812,822 Pressure hole 113,813,823 Suction hole 200 chips 801-1, 801-2 Work area

Claims

1. a workpiece having a plurality of pressurizing holes for ejecting a gas and a plurality of suction holes for sucking the gas, the workpiece handling a semiconductor chip via the gas; The suction holes are provided at least at positions adjacent to the sides of the workpiece and as close to the vertices of the workpiece as possible, The suction holes are further provided at positions adjacent to the sides of the chips of a plurality of chip sizes and as close to the apex of the chips as possible, and the number of suction holes for sucking gas varies depending on the chip size; In the semiconductor manufacturing apparatus, the pressurizing hole and the suction hole are disposed on the same plane.

2. A pressurizing part that is connected to the pressurizing hole and delivers gas; 2. The semiconductor manufacturing apparatus according to claim 1, further comprising a suction unit connected to the suction hole for sucking in gas.

3. 3. The semiconductor manufacturing apparatus according to claim 1, wherein a total cross-sectional area of ​​said plurality of suction holes is greater than a total cross-sectional area of ​​said plurality of pressurizing holes.

4. A semiconductor manufacturing apparatus as described in claim 1, wherein the workpiece is capable of mounting the semiconductor chip on the same plane.

5. A semiconductor manufacturing apparatus as described in claim 1, wherein the semiconductor chip can be lifted from the workpiece by balancing the suction force through the suction hole and the pressure through the pressure hole.

6. A semiconductor manufacturing apparatus as described in claim 5, wherein the cross-sectional area of ​​the suction hole is larger than the cross-sectional area of ​​the pressurization hole.

7. A semiconductor manufacturing apparatus as described in claim 1, wherein the number of pressurizing holes for spraying gas varies depending on the chip size.

8. A chip handling method comprising: a workpiece having a plurality of pressurizing holes for ejecting a gas and a plurality of suction holes for sucking the gas; and using the workpiece to handle a semiconductor chip via the gas, the method ejects the gas from the pressurizing holes and sucks the gas from the suction holes, The suction hole is provided at a position adjacent to the side of the workpiece and as close to the vertex of the workpiece as possible, The suction holes are further provided at positions adjacent to the sides of the chips of a plurality of chip sizes and as close to the apex of the chips as possible, and the number of suction holes for sucking gas varies depending on the chip size; A chip handling method, wherein the pressurizing hole and the suction hole are arranged on the same plane.

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