Thermal conductors, heat spreaders and heat dissipation structures

Abstract

To provide a thermal conductor capable of forming a heat flow path between adjacent diamonds. [Solution] A thermal conductor 100 of the present invention has a diamond-containing metal layer 20 containing a plurality of diamonds 40 arranged in one layer and a metal 42 that fixes the diamonds 40. The diamonds 40 are polyhedrons with octahedrons or more, and adjacent diamonds 40 are in face-to-face contact with each other, and the diamonds 40 are arranged so that an end 40B of each diamond 40 on one face 20B of the diamond-containing metal layer 20 forms an apex or edge.

Description

[Technical field]

[0001] The present invention relates to a thermal conductor and a heat spreader, and also to a heat dissipation structure including the heat spreader. [Background technology]

[0002] It is known that diamond, which has excellent thermal conductivity, is used to improve the performance of heat sinks and heat spreaders.For example, Patent Document 1 discloses an insulating and heat transfer structure that includes an insulating layer and a high thermal conductor layer arranged on both sides of the insulating layer, and the insulating layer has a bonding layer and insulating and highly thermally conductive hard particles protruding from the high thermal conductor layer, characterized in that a particle group in which the insulating and highly thermally conductive hard particles are arranged at equal intervals in one direction in the in-plane direction of the bonding layer, is arranged at equal intervals in a plurality of groups in the in-plane direction in a different direction, and diamond is described as one of the insulating and highly thermally conductive hard particles. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-214492 A Summary of the Invention [Problem to be solved by the invention]

[0004] By using a structure with a layer of diamonds between the heat source and the heat sink, the heat flow path (vertical route) from the heat source to the heat sink can be improved. However, in the structure of Patent Document 1, the diamonds are spaced apart and there is no heat transfer between the diamonds (horizontal route), so it cannot be said that the heat transfer performance of diamonds is fully utilized.

[0005] In view of the above, an object of the present invention is to provide a thermal conductor and a heat spreader capable of forming a heat flow path between adjacent diamonds, and to provide a heat dissipation structure including the heat spreader. [Means for solving the problem]

[0006] The thermal conductor of the present invention is a thermal conductor having a diamond-containing metal layer containing a plurality of diamonds arranged in a layer and a metal that fixes the diamonds, wherein the diamonds are polyhedrons with octahedrons or greater, adjacent diamonds are in face-to-face contact, and the diamonds are arranged so that the ends of the diamonds on one face side of the diamond-containing metal layer form vertices or edges.

[0007] In this way, by using diamonds with octahedrons or more and arranging the diamonds in a single layer so that the apexes or ridges (hereinafter, "apexes or ridges" are referred to as "edges") of the diamonds are at the ends of one side of the diamond-containing metal layer, it is possible to make the layer thinner and to easily form a structure in which adjacent diamonds face each other, and due to the close contact, the area of ​​face-to-face contact between adjacent diamonds increases. As a result, by forming heat flow paths (horizontal routes) between the diamonds in addition to the heat flow paths (vertical routes) from the heat source, heat can be diffused more widely, and the heat transfer performance of the diamonds can be fully demonstrated.

[0008] Furthermore, with this configuration, adjacent diamonds are likely to come into surface contact with each other regardless of the shape or alignment of the orientation of the diamonds, which increases the freedom in the shape of the diamonds used and therefore increases the freedom in production.

[0009] In addition, "apex" is a point shared by three or more ridges (sides) of a diamond, and "ridge line" is a line connecting the apex and apex of a diamond. In addition, in this application, "end" means the part farthest from the center in the thickness direction. For example, "end of one surface side of diamond-containing metal layer of diamond" means the part farthest from the center in the thickness direction of diamond-containing metal layer in diamond-containing metal layer, and when the apex of diamond is the part farthest in the direction of one surface of diamond-containing metal layer, the end of one surface side of diamond-containing metal layer of diamond is an apex, when the ridge line of diamond is the part farthest in the direction of one surface of diamond-containing metal layer, the end of one surface side of diamond-containing metal layer of diamond is a ridge line, and when the surface of diamond is the part farthest in the direction of one surface of diamond-containing metal layer, the end of one surface side of diamond-containing metal layer of diamond is a surface.

[0010] It is also preferable that the volume ratio of the diamond in the diamond-containing metal layer is 50% or more. By increasing the diamond packing rate in this way, adjacent diamonds come into contact with each other more easily, and more heat flow paths (lateral routes) can be formed between the diamonds, thereby further increasing thermal conductivity.

[0011] In the thermoelectric element of the present invention, the diamond is preferably a truncated octahedron or a hexagonal octahedron. By using diamonds of this shape, when the diamonds are arranged so that the ends of the diamonds on one side of the diamond-containing metal layer form an edge portion, the diamonds can be arranged at a higher density, further increasing the heat flow paths between the diamonds.

[0012] The heat conductor of the present invention may comprise a heat conductive member having a flat surface, and the diamond-containing metal layer is disposed on at least one surface side of the flat surface. By combining the heat conductive member in this way, the degree of freedom in designing the shape of the heat conductor can be increased.

[0013] The thermal conductor of the present invention can be used as a heat spreader. That is, the heat spreader of the present invention is made of the thermal conductor of the present invention.

[0014] The heat spreader of the present invention can be incorporated into a heat dissipation structure, which includes the heat spreader of the present invention disposed on and thermally connected to a heat source, and a heat sink disposed on and thermally connected to the heat spreader. By incorporating the heat spreader of the present invention in this manner, heat that has flowed into the heat spreader from a heat source can be efficiently conducted from the heat spreader to a heat sink, resulting in a heat dissipation structure with excellent heat dissipation properties. Effect of the Invention

[0015] According to the present invention, there are provided a thermal conductor and a heat spreader capable of forming a heat flow path between adjacent diamonds, and a heat dissipation structure including the heat spreader. [Brief description of the drawings]

[0016] [Figure 1] FIG. 2 is a schematic diagram of a thermal conductor according to an embodiment of the present invention. [Diagram 2] 2A to 2C are diagrams for explaining a method for producing the thermal conductor of FIG. 1. [Diagram 3] FIG. 13 is a diagram for explaining the difference that occurs depending on how diamonds are arranged. [Figure 4] FIG. 4 is a schematic diagram of a thermal conductor according to another embodiment of the present invention. [Diagram 5] FIG. 4 is a schematic diagram of a thermal conductor according to another embodiment of the present invention. [Figure 6] FIG. 4 is a schematic diagram of a thermal conductor according to another embodiment of the present invention. [Figure 7] 1 is a schematic diagram of a heat dissipation structure according to an embodiment of the present invention. [Figure 8] 8 is a diagram for explaining the configuration of the heat dissipation structure of FIG. 7 in more detail. [Figure 9] FIG. 4 is a schematic diagram of a heat dissipation structure according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, the embodiment of the present invention will be described in detail with reference to Figs. 1 to 9. However, the description of the constituent elements described below is one example (representative example) of the embodiment of the present invention, and the present invention is not limited to the following content as long as the gist of the present invention is not changed. In addition, when the expression "-" is used in this specification, it is used as an expression including the numerical value or physical property value before and after it. In addition, the same reference numerals are used for the parts common to Figs. 1 to 9, and the description will be omitted.

[0018] <Embodiment 1> Fig. 1 is a schematic diagram of a thermal conductor 100 according to the present invention. The thermal conductor 100 shown in Fig. 1 is a plate-shaped body made of a diamond-containing metal layer 20 that includes a plurality of diamonds 40 arranged in one layer and a metal 42 that fixes the diamonds 40 in place.

[0019] In the diamond-containing metal layer 20, the diamond 40 is a truncated octahedron. The diamond 40 is arranged so that the end 40B on the face 20B side, which is one face of the diamond-containing metal layer 20, is on the face 20B, and the end 40B is an edge part. That is, only the edge part of the diamond 40 contacts the face 20B of the diamond-containing metal layer 20. Also, only the edge part of the diamond 40 contacts the other face (the face opposite to the face 20B) of the diamond-containing layer 20. Also, the adjacent diamonds 40 are in face contact with each other. At this time, by making the hexagonal faces of the diamond 40 face contact with each other, the contact area in the lateral direction can be made large.

[0020] Furthermore, the volume ratio of diamond 40 in diamond-containing metal layer 20 is 50% or more (for example, 50% to 80%). The volume ratio of diamond 40 is a value obtained by dividing the volume of diamond 40, which is obtained by dividing the mass of diamond 40 by the specific gravity of diamond 40, by the volume of diamond-containing metal layer 20.

[0021] (Production Example 1) The thermal conductor of the present invention can be obtained, for example, by a method having a step of arranging a plurality of diamonds in a layer on a substrate with the edges of the diamonds facing the substrate, and a step of plating the substrate on which the diamonds are arranged to form a plating layer.

[0022] The thermal conductor 100 can be obtained, for example, by a method having the steps of arranging a plurality of diamonds 40 in a layer on a substrate 44 with the edges of the diamonds 40 facing the substrate 44, plating the substrate 44 on which the diamonds 40 are arranged to form a diamond-containing metal layer 20, as shown in FIG. 2, and separating the substrate 44 and the diamond-containing metal layer 20.

[0023] In the method shown in Fig. 2, first, diamonds 40 are filled onto a substrate 44 while being vibrated, and the diamonds 40 are arranged at high density with their edges facing down, with the diamonds 40 in surface contact with adjacent diamonds 40 (Fig. 2(A)). In this case, the end of the diamond 40 on the substrate 44 side is the end 40B of the diamond 40. For example, metals such as stainless steel, copper, aluminum, steel, cemented carbide, molybdenum, molybdenum alloy, cermet, and titanium, ceramics, plastics, etc. are used as the substrate 44.

[0024] The diamond 40 is preferably selected from those having an average grain size of 35 μm to 1000 μm. The ratio of diamonds 40 having a grain size within ±15% of the average grain size is preferably 90% or more, more preferably 93% or more, and even more preferably 95% or more. By using diamonds 40 having a uniform grain size, it is easy to form a structure in which diamonds 40 are arranged at a higher density with the edge of the diamond 40 facing the substrate. This average grain size is the average grain size of 100 diamonds 40, and the grain size of each diamond 40 is the average value of the long and short sides of the circumscribing rectangle. In addition, when calculating this average grain size, the ratio of diamonds 40 having a grain size within ±15% of the average grain size described below can also be obtained.

[0025] Next, a metal 42 is deposited on the substrate 44 by plating, and the diamond 40 is fixed by the metal 42 to form a diamond-containing metal layer 20 on the substrate 44 (FIG. 2(B)). The metal 42 is preferably nickel or an alloy thereof, and examples thereof include Ni, Ni-S alloy, Ni-P alloy, Ni-B alloy, and Ni-Co alloy.

[0026] In FIG. 2(B), the plating is performed up to the top of the diamond 40, but the plating is not limited thereto. The plating may be performed so that the edge of the diamond 40 protrudes without plating up to the top of the diamond 40, and the diamond-containing metal layer 20 may have a structure in which the diamond 40 protrudes from the other surface 20S. The plating may be formed thick and polished after plating to adjust the volume ratio of the diamond 40 in the diamond-containing metal layer 20 to 50% or more, but considering productivity, it is preferable to plate so that the volume ratio of the diamond 40 in the diamond-containing metal layer 20 is 50% or more. Considering the stability and productivity of the fixed diamond 40, the plating thickness is preferably about 35 to 95% of the average particle diameter of the diamond 40.

[0027] After the plating process, the substrate 44 and the diamond-containing metal layer 20 are separated to obtain a plate-shaped diamond-containing metal layer 20 (FIG. 2(C)).

[0028] As described below, the diamond-containing metal layer 20 may be used without being separated from the substrate 44, and when the thermal conductor 100 is combined with another member such as a heat sink, the thermal conductor 100 may be formed directly on the other member.

[0029] In addition, the diamonds 40 arranged on the diamond-containing metal layer 20 may mostly have end portions 40B that are edges, and may also include some end portions 40B that are faces. The ratio of diamonds 40 whose end portions 40B are edges and that are in face contact with adjacent diamonds 40 is, specifically, 50% or more of the diamonds contained in the diamond-containing metal layer 20, preferably 60% or more, more preferably 70% or more, and even more preferably 80% or more. The shape of the end portions 40B of the diamonds and the presence or absence of face contact with adjacent diamonds can be determined, for example, by observing the diamond-containing metal layer 20 with a microscope, and can be evaluated by exposing the diamonds 40 on the front or back side and then observing with a microscope as necessary.

[0030] In addition, in the thermal conductor 100, the diamond is a truncated octahedron, but in the thermal conductor of the present invention, the shape of the diamond is not limited to this, and may be any shape greater than or equal to an octahedron. As shown in FIG. 3, in a structure in which the diamonds 46 are arranged in a single layer with the face S facing the face B1 on which the diamonds 46 are arranged (FIG. 3(A)), point contact (area surrounded by dotted lines in the figure) between adjacent diamonds 46 is easy to occur. In contrast, by forming a structure in which the diamonds 46 are arranged in a single layer with the edge part E facing the face B1 (FIG. 3(B)), it is possible to form a configuration in which surface contact (area surrounded by dotted lines in the figure) between adjacent diamonds 46 is easy to occur regardless of the shape and orientation of the diamonds 46. Furthermore, by arranging the diamonds densely as in the thermal conductor of the present invention, there is also a conforming action due to the density, and surface contact with a large contact area between adjacent diamonds can be expected. Therefore, restrictions on the shape of the diamonds used can be relaxed, and a heat flow path (lateral route) to adjacent diamonds can be firmly formed while increasing productivity.

[0031] From the viewpoint of facilitating the achievement of a higher density arrangement of diamonds, the diamonds are preferably in the form of a truncated octahedron or a hexagonal octahedron.

[0032] <Embodiment 2> Fig. 4 is a schematic diagram of a heat conductor 110 according to the present invention. The heat conductor 110 shown in Fig. 4 comprises a heat conductive member 50 having a flat surface 50X, and a diamond-containing metal layer 20 arranged on one surface of the flat surface 50X. The diamond-containing metal layer 20 has the same configuration as the diamond-containing metal layer 20 of the heat conductor 100, and is arranged so that the end 40B of the diamond 40 is the end of the diamond 40 on the flat surface 50X side. That is, a plurality of diamonds 40 are arranged in a single layer with their edges facing the flat surface 50X side.

[0033] The heat conductive member 50 is a member formed of a material having heat conductivity, and has a flat portion 50X having a surface parallel to the surface 20B of the diamond-containing metal layer 20. In the heat conductor 110, the heat conductive member 50 is a plate-shaped member consisting of the flat portion 50X, but the shape of the heat conductive member 50 is not particularly limited. The heat conductive member 50 has a flat portion and a wall portion for surrounding a heat source, and may be a box-shaped frame (see FIG. 6) with one side open. When the heat conductive member is a box-shaped frame, the diamond-containing metal layer may be provided on the side opposite the heat source side of the flat portion, or on the heat source side of the flat portion.

[0034] The diamond-containing metal layer 20 and the heat conductive member 50 are bonded and thermally connected. This bonding may be performed by bonding the diamond-containing metal layer 20 and the flat surface portion 50X of the heat conductive member 50 using a thermally conductive adhesive such as thermally conductive grease or a heat dissipating gap filler, or by directly forming the diamond-containing metal layer 20 on the flat surface portion 50X of the heat conductive member 50.

[0035] (Production Example 2-1) An example of a method using a thermally conductive adhesive is to obtain a diamond-containing metal layer 20 in the same manner as in Production Example 1, and then superimpose and bond the flat portion 50X of the thermally conductive member 50 and the surface 20B (the surface facing the substrate 44) of the diamond-containing metal layer 20 together with a thermally conductive adhesive.

[0036] (Production Example 2-2) An example of a method for directly forming the diamond-containing metal layer 20 on the flat portion 50X of the heat conductive member 50 is to use the heat conductive member 50 as the substrate 44 and to fill with diamond 40 in Production Example 1 and perform plating treatment.

[0037] In addition, in the heat conductor 110, the diamond-containing metal layer 20 is disposed on the flat surface 50X of the heat conductive member 50 so that the end of the diamond 40 on the flat surface 50X side becomes the end 40B, but is not limited thereto. The heat conductor of the present invention may be configured such that the diamond-containing metal layer 20 is disposed on the flat surface 50X of the heat conductive member 50 so that the end of the diamond 40 on the opposite side to the flat surface 50X side becomes the end 40B. A heat conductor having such a structure can be obtained by bonding the flat surface 50X and the other surface 20S of the diamond-containing metal layer 20 with an adhesive, instead of bonding the flat surface 50X and one surface 20B of the diamond-containing metal layer 20 with an adhesive in the manufacturing example 2-1.

[0038] <Embodiment 3> Fig. 5 is a schematic diagram of a heat conductor 120 according to the present invention. The heat conductor 120 shown in Fig. 5 comprises a diamond-containing metal layer 21, a heat conductive member 50 having a flat surface 50X arranged on the diamond-containing metal layer 21, and a diamond-containing metal layer 22 arranged on the flat surface 50X of the heat conductive member 50. The diamond-containing metal layers 21 and 22 have the same configuration as the diamond-containing metal layer 20 of the heat conductor 100, and the diamond-containing layer 21 is arranged so that the end of the diamond 40 on the flat surface 50X side becomes the end 40B of the diamond-containing metal layer 20, and the diamond-containing metal layer 22 is arranged so that the end of the diamond 40 on the opposite side to the flat surface 50X side becomes the end 40B of the diamond-containing metal layer 20. The diamond-containing metal layers 21 and 22 are joined to the heat conductive member 50 and thermally connected.

[0039] The method for bonding the diamond-containing metal layer 21 and the heat conductive member 50 may be the same as or different from the method for bonding the diamond-containing metal layer 22 and the heat conductive member 50. The heat conductor 120 can be manufactured by appropriately selecting the method of Manufacturing Example 1, Manufacturing Example 2-1, Manufacturing Example 2-2, etc. according to the direction of the end 40B of the diamond 40, and these manufacturing methods may be combined.

[0040] <Embodiment 4> FIG. 6 is a schematic diagram of a heat conductor 130 according to the present invention. The heat conductor 130 shown in FIG. 6 includes a box-shaped heat conductive member 52, a plate-shaped heat conductive member 53, a diamond-containing metal layer 23, a plate-shaped heat conductive member 54, and a diamond-containing metal layer 24. The heat conductive member 52 is a member formed of a material having heat conductivity, and has a flat portion 52X and a wall portion 52Y for surrounding a heat source, and is a box-shaped frame with one side open. The heat conductive members 53 and 54 are plate-shaped members formed of a material having heat conductivity, and the heat conductive member 53 is disposed on one side of the flat portion 52X of the heat conductive member 52, and the heat conductive member 54 is disposed on the other side of the flat portion 52X of the heat conductive member 52. The diamond-containing metal layer 23 is disposed on the opposite side of the heat conductive member 53 from the flat surface 52X, and the diamond-containing metal layer 24 is disposed on the opposite side of the heat conductive member 54 from the flat surface 52X. These members are thermally connected. The diamond-containing metal layers 23 and 24 have the same configuration as the diamond-containing metal layer 20 of the heat conductor 100, and the diamond-containing metal layer 23 is disposed so that the end of the diamond 40 on the heat conductive member 53 side becomes the end 40B of the diamond-containing metal layer 20, and the diamond-containing metal layer 24 is disposed so that the end of the diamond 40 on the heat conductive member 54 side becomes the end 40B of the diamond-containing metal layer 20.

[0041] (Production Example 4) The thermal conductor 130 can be obtained, for example, by bonding a thermally conductive member 53 having a diamond-containing metal layer 23 formed thereon to one surface of a flat portion 52X of the thermally conductive member 52, and bonding a thermally conductive member 54 having a diamond-containing metal layer 24 formed thereon to the other surface of the flat portion 52X of the thermally conductive member 52. Specifically, first, the thermally conductive member 53 is used as the substrate 44 to obtain a thermally conductive member 53 having a diamond-containing metal layer 23 formed thereon. Separately, the thermally conductive member 54 is used as the substrate 44 to obtain a thermally conductive member 54 having a diamond-containing metal layer 24 formed thereon. Next, one surface of the flat portion 52X of the thermally conductive member 52 is bonded to the thermally conductive member 53, and the other surface of the flat portion 52X of the thermally conductive member 52 is bonded to the thermally conductive member 54 using a thermally conductive adhesive.

[0042] The orientation of the diamond-containing metal layers 21-24 is not limited to the above configuration. When the heat conductor of the present invention has a configuration in which diamond-containing metal layers are arranged on both sides of the flat surface of the heat conductive member, the diamond-containing metal layers may each independently have a plurality of diamonds arranged in a single layer with their edges facing the flat surface side of the heat conductive member, or may have their edges facing the opposite side to the flat surface side.

[0043] <Embodiment 5> The thermal conductor of the present invention can be used as a heat spreader, and can be combined with a heat dissipation member such as a heat sink to form a heat dissipation structure for dissipating heat from a heat source.

[0044] 7 is a schematic diagram of a heat dissipation structure 200 according to the present invention. The heat dissipation structure 200 shown in FIG. 7 includes a heat spreader 10 disposed on a heat source 1, and a heat sink 3 disposed on the heat spreader 10.

[0045] The heat sink 3 is a member including a base 30 having a surface 30S facing the heat source 1 and a plurality of heat dissipation fins (not shown) erected on the surface of the base 30 opposite the surface 30S, but the shape of the heat sink is not limited thereto. The heat spreader 10 is a member disposed between the heat source 1 and the surface 30S of the base 30 of the heat sink 3. The heat spreader 10 is a thermal conductor of the present invention. By thermally connecting the heat source 1, the heat spreader 10, and the heat sink 3, the heat of the heat source 1 can be transferred from the heat spreader 10 to the heat sink 3 and released to the outside from the heat sink 3.

[0046] For example, the heat dissipation structure 200 may have a structure such as a heat dissipation structure 200a shown in FIG. 8(A), in which the heat spreader 10 is a diamond-containing metal layer 20 (thermal conductor 100) and is joined to a heat source 1 with an adhesive 5 (adhesive having thermal conductivity), and a heat sink 3 joined to the heat spreader 10 with the adhesive 5.

[0047] 8(B), the heat dissipation structure 200 can be a structure including a heat spreader 10 which is a thermal conductor including a heat conductive member 50 having a planar portion 50X, a diamond-containing metal layer 20 bonded to one surface of the planar portion 50X of the heat conductive member 50 with an adhesive 5, and a diamond-containing metal layer 20 bonded to the other surface of the planar portion 50X of the heat conductive member 50 with an adhesive 5, a heat spreader 10 bonded to a heat source 1 with an adhesive 5, and a heat sink 3 bonded to the heat spreader 10 with an adhesive 5.

[0048] 8(C) and 8(D), the heat dissipation structure 200 may have a configuration in which the diamond-containing metal layer of the thermal conductor of the present invention is formed directly on the heat sink 3. This allows the diamond-containing metal layer to be bonded by electrodeposition.

[0049] The heat dissipation structure 200c shown in Fig. 8(C) has a structure in which the diamond-containing metal layer 20, which is bonded to the heat source 1 by an adhesive 5, is formed directly on the heat sink 3. In this case, the diamond-containing metal layer 20 is the heat spreader 10. In the heat dissipation structure 200c, the heat sink 3 is used as the substrate 44, and after the diamond-containing metal layer 20 is formed directly on the surface 30S of the heat sink 3, the heat sink 3 and the diamond-containing metal layer 20 are used without being separated.

[0050] The heat dissipation structure 200d shown in FIG. 8(D) is a structure including a heat sink 3, a diamond-containing metal layer 20 formed directly on the heat sink 3, a heat conductive member 50 bonded to the diamond-containing metal layer 20 by an adhesive 5, and a diamond-containing metal layer 20 formed directly on the heat conductive member 50, and the diamond-containing metal layer 20 formed directly on the heat conductive member 50 is bonded to the heat source 1 by the adhesive 5. In this case, the laminated portion of the diamond-containing metal layer 20, the heat conductive member 50, and the diamond-containing metal layer 20 is the heat spreader 10. The heat dissipation structure 200d can be obtained by the following method. First, the heat sink 3 is used as a substrate 44, and diamonds are arranged so that their edges face the surface 30S of the heat sink 3, and a plating process is performed to form the diamond-containing metal layer 20. Separately from this, diamonds are arranged so that their edges face one surface of the flat surface portion 50X of the heat conductive member 50, and a plating process is performed to form the diamond-containing metal layer 20. Then, the diamond-containing metal layer 20 formed on the heat sink 3 and the heat conductive member 50 are joined with an adhesive 5 .

[0051] <Embodiment 6> The heat dissipation structure of the present invention can be incorporated into electronic devices, etc. Fig. 9 shows an example in which a heat dissipation structure 210 is incorporated as a heat dissipation structure for a CPU die.

[0052] The heat dissipation structure 210 shown in FIG. 9 includes a heat conductor 140, which is a heat spreader, and a heat sink 3. The heat conductor 140 includes a copper plate 70 on which a diamond-containing metal layer 25 is formed, and a box-shaped heat conductive member 52. The diamond-containing metal layer 25 includes a plurality of diamonds 48 arranged in one layer and a metal 42 for fixing the diamonds 48. The diamonds 48 are polyhedrons with octahedrons or more and are in surface contact with adjacent diamonds 48. The diamonds 48 are arranged so that the end 48B of one surface side (copper plate 70 side) of the diamond-containing metal layer 25 of the diamond 48 becomes a vertex or a ridge. The copper plate 70 on which the diamond-containing metal layer 25 is formed is bonded to both sides of the flat surface portion 52X of the heat conductive member 52 via a thermally conductive adhesive 5. The heat sink 3 is bonded to the diamond-containing metal layer 25 located outside the flat surface portion 52X of the heat conductive member 52 by the adhesive 5.

[0053] When used as a heat dissipation structure for the CPU die 1a, the heat dissipation structure 210 is placed on the package substrate 7 so that the wall portion 52Y of the thermally conductive member 52 surrounds the CPU die 1a, and the thermal conductor 140 and the CPU die 1a are bonded together with the adhesive 5. [Industrial Applicability]

[0054] INDUSTRIAL APPLICABILITY The present invention can be used in the field of electronic devices and the like as a thermal conductor for effectively dissipating heat used in heat sinks, heat spreaders, and the like, and is therefore industrially useful. [Explanation of symbols]

[0055] 1 Heat source 1a CPU die 3. Heat sink 5. Glue 7 Package Substrate 10 Heat spreader 20, 21, 22, 23, 24, 25 Diamond-containing metal layer 20S, 20B, 30S, B1 side 30 Base 40, 46, 48 Diamond 40B, 48B end 42 metal 44 Substrate 50, 52, 53, 54 Thermally conductive member 50X, 52X flat section 52Y wall 70 Copper plate 100, 110, 120, 130, 140 Thermal Conductor 200, 200a, 200b, 200c, 200d, 210 Heat dissipation structure

Claims

1. A heat conductor having a diamond-containing metal layer including a plurality of diamonds arranged in a layer and a metal for fixing the diamonds, the diamond is an octahedral or higher polyhedron, and adjacent diamonds are in face contact with each other; A heat conductor, wherein the diamond is arranged so that an end of the diamond on one surface side of the diamond-containing metal layer forms an apex or a ridge line.

2. 2. The thermal conductor according to claim 1, wherein the volume percentage of diamond in the diamond-containing metal layer is 50% or more.

3. The thermal conductor of claim 1 , wherein the diamond is a truncated octahedron or a hexacahedron.

4. a thermally conductive member having a planar portion; 2. The heat conductor according to claim 1, further comprising: the diamond-containing metal layer disposed on at least one surface side of the flat portion.

5. A heat spreader comprising the thermal conductor according to any one of claims 1 to 4.

6. The heat spreader of claim 5 disposed on and thermally bonded to a heat source; a heat sink disposed on and thermally joined to the heat spreader.

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