Electronic component packages, electronic components, and oscillators

Abstract

To provide a package for an electronic component having high airtightness, an electronic component, and an oscillator.SOLUTION: A package 10 for an electronic component comprises: a lid 9; a first layer 1; a second layer 2 that is arranged between the first layer 1 and the lid 9 and constitutes a first frame body 11; a third layer 3 that is arranged between the second layer 2 and the lid 9 and constitutes a second frame body 21; a joint member 50 that joins the third layer 3 and the lid 9 to each other; and via wiring 25 that is electrically connected with the lid 9 and penetrates the second frame body 21. When R1 is an inner diameter of a first corner part 12 of the first frame body 11, and R2 is an inner diameter of a second corner part 22 of the second frame body 21 overlapping the first corner part 12 in plan view, R1<R2. An inside surface 23 of the second corner part 22 overhangs from an inside surface 13 of the first corner part 12 in cross-sectional view.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electronic component package, an electronic component, and an oscillator. [Background technology]

[0002] For example, Patent Document 1 discloses an electronic component package including a base having a rectangular shape in plan view and a rectangular cover formed with a sealing material, the base having a recess and a frame-shaped second insulating layer laminated on the top of a flat first insulating layer, and a frame-shaped third insulating layer laminated on the second insulating layer. The base has four corners of the inner circumference of the second insulating layer that protrude toward the inside of the recess and are exposed in plan view. This allows the molten sealing material to remain in the exposed area due to surface tension even if the molten sealing material flows down along the inner wall toward the bottom surface of the base, making it difficult for the molten sealing material to flow further down to the bottom surface of the base, thereby ensuring reliable airtight sealing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-60260 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the electronic component package described in Patent Document 1 has a problem in that the molten sealing material flows along the electrodes on the inner wall up to the exposed portion when viewed in a plan view, which may result in a shortage of sealing material in the sealed area, resulting in reduced airtightness. [Means for solving the problem]

[0005] The package for electronic components includes a lid, a first layer, a second layer disposed between the first layer and the lid and constituting a first frame body, a third layer disposed between the second layer and the lid and constituting a second frame body, a joining member for joining the third layer and the lid, and a via wiring electrically connected to the lid and penetrating the second frame body. When the inner diameter of the first corner portion of the first frame body is R1 and the inner diameter of the second corner portion of the second frame body overlapping the first corner portion in plan view is R2, R1 < R2, and the inner side surface of the second corner portion protrudes from the inner side surface of the first corner portion in cross-sectional view.

[0006] The electronic component includes the package for electronic components described above and an integrated circuit element housed in the package for electronic components.

[0007] The oscillator includes the package for electronic components described above, a vibrator housed in the package for electronic components, and an integrated circuit element including an oscillation circuit for oscillating the vibrator.

Brief Description of Drawings

[0008] [Figure 1] The plan view which shows schematic structure of the electronic component provided with the package for electronic components which concerns on 1st Embodiment. [Diagram 2] The cross-sectional view taken along line A-A in FIG. 1. [Diagram 3] The cross-sectional view taken along line B-B in FIG. 1. [Figure 4] The plan view which shows schematic structure of the electronic component provided with the package for electronic components which concerns on 2nd Embodiment. [Diagram 5] The cross-sectional view taken along line C-C in FIG. 4.

Modes for Carrying Out the Invention

[0009] 1. First Embodiment First, as an electronic component 100 including the package 10 for electronic components according to the first embodiment, an oscillator 200 that houses an integrated circuit element 30 and a vibrator 40 will be taken as an example, and will be described with reference to FIGS. 1, 2, and 3. In FIG. 1, for convenience of explanation of the internal configuration of the oscillator 200 and the electronic component package 10, the lid 9 and the resonator 40 are removed. For convenience of explanation, the following figures show three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis. The direction along the X-axis is called the "X-direction", the direction along the Y-axis is called the "Y-direction", and the direction along the Z-axis is called the "Z-direction". The arrow side of each axis is also called the "plus side", and the opposite side to the arrow is also called the "minus side". The plus side of the Z direction is also called the "upper" and the minus side of the Z direction is also called the "lower".

[0010] As shown in FIGS. 1, 2, and 3, the oscillator 200 has an integrated circuit element 30, a resonator 40, and an electronic component package 10 that houses the integrated circuit element 30 and the resonator 40. The electronic component package 10 has a base 4, a lid 9 that forms an internal space S between the base 4, and a bonding member 50 that bonds the base 4 and the lid 9, and accommodates an integrated circuit element 30 and an oscillator 40 within the internal space S.

[0011] The base 4 has a rectangular shape when viewed in a plane from the Z direction, and comprises a flat first layer 1, a second layer 2 arranged between the first layer 1 and the lid 9 and constituting a first frame body 11, and a third layer 3 arranged between the second layer 2 and the lid 9 and constituting a second frame body 21, and is formed by stacking the second layer 2 on top of the first layer 1 and the third layer 3 on top of the second layer 2.

[0012] The first layer 1 has electrodes 5 and 6 formed on the surface facing the integrated circuit element 30, which electrically connect and fix the integrated circuit element 30 via a bonding member 51 such as a gold bump. Also, on the surface opposite to the surface on which the electrodes 5 and 6 are formed, an external terminal 7 for outputting an output signal of the integrated circuit element 30 to the outside and an external terminal 7 electrically connected to the lid 9 via the electrode 5 and serving as a ground electrode are formed. In addition, the first layer 1 has a plurality of via wirings 8 formed therein, which penetrate the top and bottom surfaces of the first layer 1 and electrically connect the electrodes 5 and 6 to the external terminals 7. Also, the via wiring is a through hole that penetrates the top and bottom surfaces of the layer and is filled with a conductive material. The electrodes 5 are electrically connected to the integrated circuit element 30 and side wiring 15 (described later), and are provided at corners of the mounting area of ​​the first layer 1 defined by the first frame 11. More specifically, the electrodes 5 are provided in an area contacting a first corner portion 12 of the first frame 11.

[0013] The second layer 2 is provided with an opening 18 for forming the first frame 11, and an internal terminal 17 is formed on the surface facing the vibrator 40, electrically connecting and fixing the vibrator 40 via a bonding member 52 such as a conductive adhesive. In addition, a plurality of via wirings 16 are formed in the second layer 2, penetrating the upper and lower surfaces of the second layer 2, and electrically connecting the internal terminal 17 and the electrode 6 formed on the first layer 1. Four corners including the first corner 12 in the opening 18 of the first frame 11 are provided with corners having an inner diameter R1. In addition, as shown in FIG. 2, a side wiring 15 is formed on the inner surface 13, which is the side surface of the first corner 12, and is electrically connected to the electrode 5 formed on the first layer 1 and a via wiring 25 provided on the second frame 21 described later. In this embodiment, the side wiring 15 is formed on the inner surface 13 of the first corner portion 12, but this is not limited to this and it may be formed on the outer surface, which is the side surface of the first corner portion 12 opposite the integrated circuit element 30.

[0014] Furthermore, the thickness H1 which is the dimension in the Z direction of the second layer 2 is greater than the thickness H2 which is the dimension in the Z direction of the integrated circuit element 30. Therefore, a larger-sized integrated circuit element 30 can be accommodated in the opening 18 for constituting the first frame 11 of the second layer 2, compared to a case in which the thickness H1 of the second layer 2 is smaller than the thickness H2 of the integrated circuit element 30.

[0015] In the third layer 3, an opening 26 for forming a second frame body 21 is provided at a position overlapping with the opening 18 of the second layer 2 in a plan view from the Z direction. Further, the opening 26 of the third layer 3 is formed such that the minus side in the X direction is wider than the opening 18 of the second layer 2. Therefore, the internal terminal 17 for fixing the vibrator 40 is exposed, and the vibrator 40 can be fixed on the internal terminal 17 before being sealed with the lid 9. At four corner portions including the second corner portion 22 in the opening 26 of the second frame body 21, corner portions with an inner diameter R2 are provided.

[0016] Also, in the third layer 3, in the vicinity of the second corner portion 22, a via wiring 25 penetrating the upper and lower surfaces of the third layer 3 is formed at a position in contact with the first corner portion 12 of the second layer 2. The via wiring 25 is electrically connected to the lid 9 via a joining member 50 and is electrically connected to a side surface wiring 15 provided on the inner side surface 13 of the first corner portion 12 of the second layer 2.

[0017] Also, as shown in FIG. 1, in a plan view from the Z direction, the relationship between the inner diameter R2 of the second corner portion 22 of the second frame body 21 and the inner diameter R1 of the first corner portion 12 of the first frame body 11 is R1 < R2. That is, the inner diameter R2 of the second corner portion 22 of the second frame body 21 is larger than the inner diameter R1 of the first corner portion 12 of the first frame body 11. Therefore, as shown in FIG. 2, the inner side surface 23 of the second corner portion 22 protrudes in the minus X direction from the inner side surface 13 of the first corner portion 12 in a cross-sectional view from the Y direction. Specifically, the length L2 from the outer side surface of the second frame body 21 to the inner side surface 23 of the second corner portion 22 is larger than the length L1 from the outer side surface of the first frame body 11 to the inner side surface 13 of the first corner portion 12.

[0018] 3, in the base 4 of the electronic component package 10, the first frame 11 forming the second layer 2 has a first straight portion 14 extending from the first corner portion 12 in the negative X direction, and the second frame 21 forming the third layer 3 has a second straight portion 24 extending from the second corner portion 22 in the negative X direction and overlapping with the first straight portion 14 in a plan view, and the width W1 of the first straight portion 14 is the same as the width W2 of the second straight portion 24. In addition, the width of the straight portion of the first frame 11 extending from the first corner portion 12 in the positive Y direction is the same as the width of the straight portion extending from the second corner portion 22 of the second frame 21 in the positive Y direction. Furthermore, the width of the straight portion extending in the negative X direction from the corner portion of the first frame 11 symmetrical to the first corner portion 12 of the first frame 11 is the same as the width of the straight portion extending in the negative X direction from the corner portion of the second frame 21 symmetrical to the second corner portion 22 of the second frame 21 in the negative X direction. In this manner, by making the widths of the straight portions of the first frame 11 and the second frame 21 constituting the base 4 the same, the mechanical strength of the base 4 can be increased.

[0019] As materials for the first layer 1, second layer 2, and third layer 3 constituting the base 4, various ceramics such as oxide-based ceramics, nitride-based ceramics, and carbide-based ceramics are suitable, and a silicon substrate, a glass substrate, etc. may also be used.

[0020] The lid 9 is a rectangular flat plate in plan view from the Z direction, and is joined to the upper surface of the base 4 via a joining member 50. As a result, an airtight internal space S is formed between the base 4 and the lid 9, and the integrated circuit element 30 and the vibrator 40 are housed in this internal space S. The internal space S is in a reduced pressure state, preferably in a state closer to a vacuum. This reduces viscous resistance, improving the oscillation characteristics of the vibrator 40. The lid 9 is preferably made of a material such as a conductive metal, which can shield the integrated circuit element 30 and the vibrator 40 from noise such as electromagnetic waves from the outside.

[0021] The bonding member 50 is a solder or the like containing an alloy of Au and Sn. By containing an alloy of Au and Sn, the melting point temperature becomes high, and the influence of heat when the electronic component package 10 is mounted on a printed circuit board or the like can be reduced.

[0022] The integrated circuit element 30 housed in the internal space S includes an oscillation circuit 31 that causes the oscillator 40 to oscillate. The oscillator circuit 31 is electrically connected to the oscillator 40, amplifies the output signal of the oscillator 40, and feeds back the amplified signal to the oscillator 40, thereby causing the oscillator 40 to oscillate.

[0023] The vibrator 40 contained in the internal space S has a vibration substrate 41, an excitation electrode 42 that vibrates the vibration substrate 41, an electrode pad 43 that outputs a vibration signal to the outside and fixes the vibrator 40 to the electronic component package 10, and a lead electrode (not shown) that electrically connects the excitation electrode 42 and the electrode pad 43.

[0024] The vibrator 40 is fixed onto an internal terminal 17 formed on the upper surface of the second layer 2 of the electronic component package 10 via a bonding member 52 such as a conductive adhesive. Note that the state in which the vibrator 40 is fixed to the electronic component package 10 means that the internal terminal 17 formed on the upper surface of the second layer 2 of the electronic component package 10 and the electrode pad 43 formed on the vibrating substrate 41 of the vibrator 40 are mechanically and electrically bonded via the bonding member 52. Note that an AT-cut quartz crystal substrate, an SC-cut quartz crystal substrate, a BT-cut quartz crystal substrate, or the like is used as the vibrating substrate 41.

[0025] Furthermore, by equipping the integrated circuit element 30 of the oscillator 200 of this embodiment with a temperature compensation circuit and a temperature sensor, the influence of external temperature changes can be suppressed, and the oscillator can be used as a temperature compensated crystal oscillator (TCXO) that outputs a highly accurate oscillation frequency.

[0026] As described above, the electronic component package 10 and the oscillator 200 as the electronic component 100 of this embodiment are electrically connected to the lid 9 and are provided with via wiring 25 that penetrates the second frame 21. Therefore, the bonding material 50 that bonds the third layer 3 and the lid 9 flows along the inner surface 23 of the second frame 21 and does not flow into the electronic component package 10. As a result, there is no shortage of the bonding material 50 that serves as a sealant in the sealed area, and a decrease in airtightness can be reduced.

[0027] In addition, the inner surface 13 of the first corner portion 12 of the first frame body 11 is recessed more than the inner surface 23 of the second corner portion 22 of the second frame body 21, the inner diameter R1 of the first corner portion 12 is smaller than the inner diameter R2 of the second corner portion 22, and further, the thickness H1 of the second layer 2 that constitutes the first frame body 11 is larger than the thickness H2 of the integrated circuit element 30, so that a larger-sized integrated circuit element 30 can be accommodated within the electronic component package 10.

[0028] 2. Second embodiment Next, as an example of an electronic component 100a including an electronic component package 10a according to the second embodiment, an oscillator 200a that houses a first integrated circuit element 30a, a second integrated circuit element 34, a heater 36, and a vibrator 40 will be described with reference to Figures 4 and 5. In FIG. 4, for the convenience of explaining the internal configuration of the oscillator 200a and the electronic component package 10a, the lid 9 and the resonator 40 are removed.

[0029] The electronic component package 10a and oscillator 200a of this embodiment are similar to the electronic component package 10 and oscillator 200 of the first embodiment, except that the structure of the electronic component package 10a is different from that of the electronic component package 10 of the first embodiment, and compared to the oscillator 200 of the first embodiment, a first integrated circuit element 30a, a second integrated circuit element 34, and a heater 36 are housed in the electronic component package 10a instead of the integrated circuit element 30. The following description will focus on the differences from the first embodiment described above, and similar items will be denoted by the same reference numerals and their description will be omitted.

[0030] 4 and 5, oscillator 200a has a first integrated circuit element 30a, a second integrated circuit element 34, a heater 36, a resonator 40, and an electronic component package 10a that houses first integrated circuit element 30a, second integrated circuit element 34, heater 36, and resonator 40. Note that oscillator 200a of this embodiment corresponds to an oven-controlled crystal oscillator (OCXO) that is equipped with heater 36 and uses electronic component package 10a as a thermostatic oven.

[0031] The electronic component package 10a has a base 4a having a first internal space S1 and a second internal space S2, a lid 9 that seals the first internal space S1, and a bonding member 50 that bonds the base 4a and the lid 9, and accommodates a first integrated circuit element 30a, a heater 36, and a vibrator 40 in the first internal space S1, and accommodates a second integrated circuit element 34 in the second internal space S2.

[0032] In the base 4a, a first internal space S1 is formed by laminating a first layer 1, a second layer 2 having an opening 18 which becomes the first frame 11, and a third layer 3 having an opening 26 which becomes the second frame 21, and a second internal space S2 is formed by laminating a fourth layer 14a having an opening 37a which becomes the third frame 31a on the surface opposite to the surface on which the second layer 2 of the first layer 1 is laminated. In addition, an external terminal 7a for outputting an oscillation frequency is formed on the surface of the fourth layer 14a opposite to the surface on which the first layer 1 is laminated.

[0033] The first integrated circuit element 30a accommodated in the first internal space S1 includes an oscillator circuit 31, a temperature compensation circuit 32, and a temperature sensor 33.

[0034] The oscillator circuit 31 is electrically connected to the oscillator 40, amplifies the output signal of the oscillator 40, and feeds back the amplified signal to the oscillator 40, thereby causing the oscillator 40 to oscillate.

[0035] The temperature compensation circuit 32 performs temperature compensation based on temperature information output from the temperature sensor 33 so that the frequency fluctuation of the oscillation signal of the oscillation circuit 31 is smaller than the frequency temperature characteristic of the resonator 40 itself. This makes it possible to exhibit excellent temperature characteristics. Note that the temperature compensation circuit 32 may be, for example, one that adjusts the oscillation frequency of the oscillation circuit 31 by adjusting the capacitance of a variable capacitance circuit connected to the oscillation circuit 31, or one that adjusts the frequency of the output signal of the oscillation circuit 31 by a PLL (Phase Locked Loop) circuit or a direct digital synthesizer circuit.

[0036] The temperature sensor 33 is an element that detects temperature, and can be formed by providing a Si diode or a PNP transistor in the first integrated circuit element 30a.

[0037] The heater 36 housed in the first internal space S1 is used to maintain a constant temperature inside the first internal space S1 housing the vibrator 40. The heater 36 is formed on the upper surface of the first layer 1 and is fixed onto an electrode 6 electrically connected to the temperature control circuit 35 of the second integrated circuit element 34 via a bonding member 53 such as a metal bump.

[0038] The second integrated circuit element 34 accommodated in the second internal space S2 has a temperature control circuit 35 that controls the temperature of the heater 36, and is fixed onto the electrodes 5a, 6a formed on the underside of the first layer 1 via bonding members 54 such as metal bumps.

[0039] The temperature control circuit 35 is a circuit for keeping the vibrator 40 at a constant temperature by controlling the amount of current flowing through the heater 36 based on the temperature information output from the temperature sensor 33. For example, the temperature control circuit 35 controls so that a desired current flows through the heater 36 when the current temperature determined from the output signal of the temperature sensor 33 is lower than a set reference temperature, and so that no current flows through the heater 36 when the current temperature is higher than the reference temperature.

[0040] Also, for example, the temperature control circuit 35 may control the amount of current flowing through the heater 36 to increase or decrease depending on the difference between the current temperature and the reference temperature. Here, the temperature sensor 33 serves as both a temperature sensor for the temperature compensation circuit 32 and a temperature sensor for the temperature control circuit 35. This reduces the number of components, and allows the oscillator 200a to be made more compact. However, this is not limiting, and a temperature sensor for the temperature compensation circuit 32 and a temperature sensor for the temperature control circuit 35 may be provided separately.

[0041] With this configuration, it is possible to obtain an oscillator 200a that suppresses the effects of external temperature and outputs a highly accurate oscillation frequency, thereby obtaining effects similar to those of the electronic component package 10 or oscillator 200 of the first embodiment. [Explanation of symbols]

[0042] 1...first layer, 2...second layer, 3...third layer, 4,4a...base, 5,5a,6,6a...electrodes, 7,7a...external terminal, 8...via wiring, 9...lid, 10,10a...package for electronic components, 11...first frame, 12...first corner portion, 13...inner surface, 14...first straight portion, 14a...fourth layer, 15...side surface wiring, 16...via wiring, 17...internal terminal, 18...opening, 21...second frame, 22...second corner portion, 23...inner surface, 24...second straight portion, 25...via wiring, 26...opening, 30...integrated circuit element, 30a... First integrated circuit element, 31...oscillator circuit, 31a...third frame, 32...temperature compensation circuit, 33...temperature sensor, 34...second integrated circuit element, 35...temperature control circuit, 36...heater, 37a...opening, 40...vibrator, 41...vibration substrate, 42...excitation electrode, 43...electrode pad, 50, 51, 52, 53, 54...jointing member, 100, 100a...electronic component, 200, 200a...oscillator, H1, H2...thickness, R1, R2...inner diameter, L1, L2...length, S...internal space, S1...first internal space, S2...second internal space, W1, W2...width.

Claims

1. Lid and A first layer; a second layer disposed between the first layer and the lid and constituting a first frame; a third layer disposed between the second layer and the lid and constituting a second frame; a bonding member that bonds the third layer and the lid; a via wiring electrically connected to the lid and penetrating the second frame; The inner diameter of the first corner portion of the first frame is R1, and the inner diameter of the first corner portion overlaps with the first corner portion in a plan view. When the inner diameter of the second corner portion of the second frame is R2, R1<R2; The inner surface of the second corner portion protrudes beyond the inner surface of the first corner portion in a cross-sectional view. 、 the first frame body has a first straight portion extending from the first corner portion, The second frame body extends from the second corner portion and overlaps with the first straight portion in a plan view. A second straight portion The width of the first straight portion and the width of the second straight portion are the same. Package for electronic components.

2. The first frame further includes a side wiring electrically connected to the via wiring and provided on a side surface of the first frame. do, 2. The electronic component package of claim 1.

3. The side wiring is provided on an inner surface of the first frame.

3. The electronic component package of claim 2.

4. The joining member contains an alloy of Au and Sn.

4. The electronic component package according to claim 1.

5. An electronic component package according to any one of claims 1 to 4; an integrated circuit element housed in the electronic component package; Electronic components.

6. the electronic component package has electrodes electrically connected to the integrated circuit element, The electrodes are provided at corners of the mounting area of ​​the first layer defined by the first frame. There are The electronic component according to claim 5 .

7. the thickness of the second layer is greater than the thickness of the integrated circuit element; The electronic component according to claim 5 or 6.

8. An electronic component package according to any one of claims 1 to 4; a vibrator housed in the electronic component package; and and an integrated circuit element including an oscillator circuit for oscillating the oscillator. Oscillator.

9. the thickness of the second layer is greater than the thickness of the integrated circuit element; 9. The oscillator according to claim 8.

Images