Electronic component mounting method, display device, and circuit board

Abstract

To provide a mount method for an electronic component in which the yield can be improved, a display device, and a circuit board.SOLUTION: In a mount method for an electronic component, a work WK including a circuit board CB including an insulating substrate 10 with a first surface 10A, a terminal part 11 existing on the first surface side, and a spacer SP, and a wafer WF including a sapphire substrate 20 with a second surface 20A and an electronic component LED existing on the second surface side is placed between a stage ST and a pressing jig 41 so that the first surface and the second surface face each other, the pressing jig is brought into contact with a part of the sapphire substrate, a load is applied to a contact part between a part of an upper surface of the spacer and the second surface, the sapphire substrate is pressed toward the circuit board with the pressing jig, the other part of the upper surface of the spacer and the second surface are brought into contact with each other, and the sapphire substrate is flattened.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] An embodiment of the present invention relates to a mounting method for electronic components, a display device, and a circuit board. [Background technology]

[0002] Generally, LED display devices using light emitting diodes (LEDs), which are self-emitting elements, are well known, but in recent years, display devices using tiny diode elements called micro LEDs have been developed as higher definition display devices. Unlike conventional liquid crystal display devices and organic EL display devices, micro LED display devices are formed by mounting a large number of chip-shaped micro LEDs in the display area, making it easy to achieve both high definition and large size, and are attracting attention as next-generation display devices.

[0003] A method using laser lift off (LLO) is known as a method for mounting a large number of chip-shaped micro LEDs in a display area. Multiple micro LEDs are formed on a sapphire substrate before being mounted in the display area. However, when the micro LEDs are peeled off from the sapphire substrate by LLO, if the sapphire substrate is warped, there is a risk that the laser light will not be irradiated at the desired position. To solve this problem, a method is known in which the entire surface of the sapphire substrate is pressed against the substrate to flatten the warp of the sapphire substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-83280 A [Patent Document 2] U.S. Pat. No. 1,077,0426 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present embodiment is to provide a mounting method for electronic components, a display device, and a circuit board that can improve the yield. [Means for solving the problem]

[0006] According to the present embodiment, there is provided a method for mounting electronic components, comprising: placing a workpiece including an insulating substrate having a first surface, a circuit board including a terminal portion and a spacer located on the first surface side, a sapphire substrate having a second surface, and a wafer including electronic components located on the second surface side between a stage and a pressure jig such that the first surface and the second surface face each other; bringing the pressure jig into contact with a part of the sapphire substrate; applying a load to a contact portion between a part of an upper surface of the spacer and the second surface; pressing the sapphire substrate toward the circuit board with the pressure jig; bringing another part of the upper surface of the spacer into contact with the second surface; flattening the sapphire substrate; irradiating the workpiece with a first laser beam through a window portion of the pressure jig; bonding the electronic components to the circuit board; irradiating the workpiece with a second laser beam having a wavelength band different from that of the first laser beam through the window portion; peeling off the electronic components from the sapphire substrate; and separating the pressure jig from the sapphire substrate.

[0007] According to this embodiment, there is provided a display device comprising an insulating substrate having a first surface, a spacer located on the first surface side and having a plurality of holes, and a plurality of electronic components located on the first surface side and within the holes, wherein the spacer is formed of aluminum oxide.

[0008] According to this embodiment, a circuit board is provided comprising an insulating substrate having a first surface, a spacer located on the first surface side and having a plurality of holes, and a plurality of terminal portions located on the first surface side and within the holes, the spacer being formed of aluminum oxide. [Brief description of the drawings]

[0009] [Figure 1]FIG. 1 is a perspective view that illustrates a schematic configuration of a display device. [Diagram 2] FIG. 2 is a cross-sectional view that illustrates a schematic configuration of the circuit board. [Diagram 3] FIG. 3 is a cross-sectional view that illustrates a schematic configuration of the wafer. [Figure 4] FIG. 4 is a diagram showing a first step of the mounting method according to this embodiment. [Diagram 5] FIG. 5 is a diagram showing a second step of the mounting method according to this embodiment. [Figure 6] FIG. 6 is a diagram showing a third step of the mounting method according to this embodiment. [Figure 7] FIG. 7 is a diagram showing a fourth step of the mounting method according to this embodiment. [Figure 8] FIG. 8 is a diagram showing a fifth step of the mounting method according to this embodiment. [Figure 9] FIG. 9 is a diagram showing a sixth step of the mounting method according to this embodiment. [Figure 10] FIG. 10 is a cross-sectional view that illustrates a schematic configuration of a display panel. [Figure 11] FIG. 11 is a plan view showing the circuit board and wafer according to the present embodiment. [Figure 12] FIG. 12 is a plan view showing a display panel according to the present embodiment. [Figure 13] FIG. 13 is a plan view showing a circuit board and a wafer according to a first modified example. [Figure 14] FIG. 14 is a plan view showing a display panel according to a first modified example. [Figure 15] FIG. 15 is a plan view showing a circuit board and a wafer according to a second modified example. [Figure 16] FIG. 16 is a plan view showing a display panel according to a second modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the present embodiment will be described with reference to the drawings. Note that the disclosure is merely an example, and those who are skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, the drawings may be schematic in terms of width, thickness, shape, etc. of each part compared to the actual embodiment in order to make the explanation clearer, but they are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and each figure, components that perform the same or similar functions as those described above with respect to the previous figures are given the same reference numerals, and duplicate detailed explanations may be omitted as appropriate.

[0011] FIG. 1 is a perspective view illustrating a schematic configuration of the display device DSP. In this specification, the first direction X, the second direction Y, and the third direction Z are defined as shown in the figure. The second direction Y is a direction perpendicular to the first direction X, and the third direction Z is a direction perpendicular to the first direction X and the second direction Y. The first direction X and the second direction Y intersect perpendicularly, but may intersect at an angle other than perpendicular. In this specification, the direction toward the tip of the arrow indicating the third direction Z is referred to as "up", and the direction in the opposite direction from the tip of the arrow is referred to as "down". In addition, it is assumed that there is an observation position at the tip side of the arrow indicating the third direction Z for observing the display device DSP, the manufacturing device, etc., and the view from this observation position toward the XY plane defined by the first direction X and the second direction Y is referred to as planar view.

[0012] In this specification, an LED chip (light emitting element) used in a display device DSP will be described as an example of the electronic component. Hereinafter, in this specification, a case will be described in which the display device DSP is a micro LED display device using micro LEDs that are self-luminous elements. As shown in FIG. 1, the display device DSP includes a display panel PNL, printed circuit boards PCB1 and PCB2, and a driving IC chip 2.

[0013] In one example, the display panel PNL is rectangular. In the illustrated example, the short side EX of the display panel PNL is parallel to the first direction X, and the long side EY of the display panel PNL is parallel to the second direction Y. The third direction Z corresponds to the thickness direction of the display panel PNL. The main surface of the display panel PNL is parallel to the XY plane defined by the first direction X and the second direction Y. The display panel PNL has a display area DA and a non-display area NDA outside the display area DA. In the illustrated example, the non-display area NDA surrounds the display area DA. The display panel PNL has a terminal area MT in the non-display area NDA. The terminal area MT is provided along the short side EX of the display panel PNL and includes a terminal for electrically connecting the display panel PNL to an external device or the like.

[0014] The display area DA is an area for displaying an image, and includes a plurality of pixels PX arranged in a matrix, for example. The pixels PX include light-emitting elements (micro LEDs) and switching elements for driving the light-emitting elements.

[0015] The printed circuit board PCB1 is mounted on the terminal area MT and is electrically connected to the display panel PNL. The printed circuit board PCB1 is, for example, a flexible printed circuit board. The printed circuit board PCB2 is, for example, connected to the printed circuit board PCB1 below the printed circuit board PCB1. The printed circuit board PCB2 is, for example, a rigid printed circuit board.

[0016] The driving IC chip 2 is mounted on the printed circuit board PCB1. The driving IC chip 2 may be mounted under the printed circuit board PCB1, in the non-display area NDA of the display panel PNL, or on the printed circuit board PCB2. The driving IC chip 2 is connected to a control board (not shown), for example, via the printed circuit boards PCB1 and PCB2. The driving IC chip 2 drives a plurality of pixels PX based on a video signal output from the control board, and executes control to display an image on the display panel PNL.

[0017] In the following, a method for mounting the light-emitting element LED on the circuit board CB that is the base board of the display panel PNL described above will be described. More specifically, a method for peeling the light-emitting element LED from the wafer WF shown in FIG. 3 by laser lift-off (LLO) and mounting it on the circuit board CB shown in FIG. 2 will be described.

[0018] First, the configurations of the circuit board CB and the wafer WF will be described with reference to FIGS.

[0019] FIG. 2 is a cross-sectional view that illustrates a schematic configuration of the circuit board CB. The circuit board CB includes an insulating substrate 10, a plurality of terminal portions 11, a plurality of joining members 12, and a spacer SP.

[0020] The insulating substrate 10 is, for example, a glass substrate or a flexible resin substrate, and has a surface (first surface) 10A and a surface 10B opposite to surface 10A. Although not shown, switching elements and various wiring patterns for driving the light-emitting element LED are formed on the insulating substrate 10. The switching elements are thin-film transistors, and the circuit board CB is sometimes called an array board or a backplane board.

[0021] The multiple terminal portions 11 are located on the surface 10A side of the insulating substrate 10. Each terminal portion 11 is composed of a pair of a first electrode 11A and a second electrode 11B. The terminal portions 11 are formed in the same number as the light-emitting elements LED mounted on the display device DSP, for example. The terminal portions 11 are formed of, for example, a metal material such as Al (aluminum), Ti (titanium), Mo (molybdenum), W (tungsten), or a laminate of these metal materials.

[0022] The multiple bonding members 12 are disposed on the terminal portion 11. One bonding member 12 is composed of a pair of a first bonding member 12A and a second bonding member 12B. The first bonding member 12A is located on the first electrode 11A. The second bonding member 12B is located on the second electrode 11B. The bonding member 12 is a member for bonding the terminal portion 11 and a terminal portion 22 of the light-emitting element LED described later. Although details will be described later, the bonding member 12 is formed of a metal material that is heated and melted by laser ablation when irradiated with laser light in a wavelength band of 400 nm to 3000 nm, and is formed of a metal material such as Sn (tin) or Ag (silver). The bonding member 12 may be called a solder member. In the illustrated example, the bonding member 12 is provided on the terminal portion 11, but may be provided on the terminal portion 22 of the light-emitting element LED described later.

[0023] The spacer SP is located on the surface 10A side of the insulating substrate 10. The spacer SP is integrally formed as described later in FIG. 11, and has a plurality of holes HL. The spacer SP is made of, for example, Al2O3 (aluminum oxide). The plurality of terminals 11 are each located in the hole HL.

[0024] FIG. 3 is a cross-sectional view that illustrates a schematic configuration of the wafer WF. The wafer WF includes a sapphire substrate 20 and a plurality of light-emitting elements (electronic components) LEDs. The sapphire substrate 20 has a surface (second surface) 20A and a surface 20B opposite to the surface 20A. The sapphire substrate 20 is made of Al2O3.

[0025] The plurality of light-emitting elements LED are located on the surface 20A side of the sapphire substrate 20. The light-emitting element LED includes a light-emitting layer 21 and a terminal portion 22.

[0026] The light emitting layer 21 is fixed to the surface 20A of the sapphire substrate 20 via a release layer (not shown). The terminal portion 22 is disposed on the light emitting layer 21. One terminal portion 22 is composed of a pair of a first electrode 22A and a second electrode 22B. One of the first electrode 22A and the second electrode 22B corresponds to an anode electrode, and the other corresponds to a cathode electrode. The terminal portion 22 is bonded to the terminal portion 11 by a bonding member 12 disposed on the circuit board CB side, and is electrically connected to the terminal portion 11. The terminal portion 22 may be called a bump.

[0027] Next, a method for mounting the light-emitting element LED on the circuit board CB will be described with reference to Fig. 4 to Fig. 9. Hereinafter, in this specification, the above-mentioned circuit board CB and wafer WF stacked together will be referred to as a workpiece WK.

[0028] 4 is a diagram showing a first step of the mounting method according to this embodiment. The first step shows a step of placing the workpiece WK on the stage ST. Note that the terminal portion 11 and the bonding member 12 of the circuit board CB and the light-emitting element LED of the wafer WF are each shown as a simplified layer.

[0029] First, there will be described the configuration of the mounting apparatus 100. The mounting apparatus 100 is an apparatus for mounting light-emitting elements LED on the wafer WF onto a circuit board CB.

[0030] The mounting apparatus 100 includes a stage ST on which a workpiece is placed, a pressure jig 41, a laser device 60, and a drive unit DR. The stage ST has a support surface STA that supports a workpiece.

[0031] The pressurizing jig 41 faces the stage ST in the third direction Z. The pressurizing jig 41 is configured to pressurize the workpiece WK between the stage ST. The pressurizing jig 41 has a window portion 41A facing the support surface STA in the third direction Z. The window portion 41A is formed of, for example, a transparent material and transmits laser light.

[0032] The laser device 60 includes a first laser light source LS1, a second laser light source LS2, an optical system OS, and a laser head 60A. The first laser light source LS1 emits a first laser light LZ1. The second laser light source LS2 emits a second laser light LZ2 (see FIGS. 7 and 8). The optical system OS has, for example, a mirror that adjusts the optical paths of the first laser light LZ1 and the second laser light LZ2. The laser device 60 emits the first laser light LZ1 and the second laser light LZ2 from the laser head 60A.

[0033] The driving unit DR includes a first driving unit DR1 that controls the driving of the pressurizing jig 41, and a second driving unit DR2 that controls the driving of the laser device 60. The first driving unit DR1 moves the pressurizing jig 41 in a vertical direction V relative to the support surface STA. Here, the vertical direction V is a direction parallel to the third direction Z. The second driving unit DR2 causes the laser device 60 to emit a first laser beam LZ1 and a second laser beam LZ2. In addition, the second driving unit DR2 moves, for example, the laser head 60A.

[0034] Here, the first step will be described. The workpiece WK, which is composed of a circuit board CB and a wafer WF stacked on top of each other, is placed between the stage ST and the pressure jig 41. The pressure jig 41 may be placed on the workpiece WK after the workpiece WK is placed on the stage ST. The circuit board CB and the wafer WF are stacked such that the surface 10A of the insulating substrate 10 faces the surface 20A of the sapphire substrate 20. The surface 10B of the insulating substrate 10 is in contact with the support surface STA. The surface 20B of the sapphire substrate 20 faces the pressure jig 41. When the workpiece WK is placed on the stage ST, the circuit board CB and the wafer WF are aligned.

[0035] In this embodiment, it is assumed that the wafer WF is warped. That is, a gap GP is partially generated between the circuit board CB and the wafer WF. In the illustrated example, the gap GP increases toward the peripheral portion CA of the workpiece WK. On the other hand, at the center portion MA of the workpiece WK, the circuit board CB and the wafer WF are in contact with each other.

[0036] 5 is a diagram showing a second step of the mounting method according to this embodiment. The second step shows a step of bringing a pressurizing jig 41 into contact with the workpiece WK on the stage ST. The first driving unit DR1 moves the pressure jig 41 in the vertical direction V toward the stage ST and brings it into contact with a part of the sapphire substrate 20. The first driving unit DR1 further pressurizes the sapphire substrate 20 toward the circuit board CB with the pressure jig 41, and applies a load to the contact portion between a part of the upper surface US of the spacer SP and the surface 20A. At this time, the other part of the upper surface US of the spacer SP is separated from the surface 20A. Also, at the center MA of the workpiece WK, the terminal portion 22 of the light-emitting element LED is in contact with the bonding member 12 or slightly crushes the bonding member 12.

[0037] The height HS of the spacer SP is formed to be equal to or smaller than the total thickness of the terminal portion 11, the bonding member 12, the terminal portion 22, and the light emitting layer 21. If the height HS is smaller than the total thickness of the above-mentioned members, the bonding member 12 will be slightly crushed from its original shape when the sapphire substrate 20 is pressed by the pressing jig 41.

[0038] 6 is a diagram showing a third step of the mounting method according to this embodiment. The third step shows a step of pressing the workpiece WK toward the stage ST by the pressing jig 41. The first driving unit DR1 moves the pressure jig 41 in the vertical direction V toward the stage ST. That is, the first driving unit DR1 presses the sapphire substrate 20 toward the circuit board CB from the state shown in FIG. 5 by the pressure jig 41. This flattens the sapphire substrate 20. At this time, the light emitting element LED is accommodated in the hole HL. Also, the other part of the upper surface US of the spacer SP, which was separated in FIG. 5, is brought into contact with the surface 20A. For example, the entire surface of the upper surface US of the spacer SP is in contact with the surface 20A. The pressure jig 41 fixes the workpiece WK between the stage ST. The workpiece WK is fixed in a state in which the terminal portion 11 of the circuit board CB and the terminal portion 22 of the wafer WF are overlapped. The window portion 41A is in contact with the surface 20B of the sapphire substrate 20. In this manner, by correcting the warp of the sapphire substrate 20 and tightly bonding the circuit board CB and the wafer WF, the light emitting element LED can be made bondable to the circuit board CB.

[0039] For example, in the process of planarizing the sapphire substrate 20, the position where the circuit board CB and the wafer WF first come into contact as shown in Fig. 5 is subjected to the largest load, which may result in excessive crushing of the terminal portion 11, the bonding member 12, and the terminal portion 22. This may also result in a short circuit.

[0040] According to this embodiment, the upper surface US of the spacer SP comes into contact with the surface 20A. Therefore, the abutting portion of the upper surface US of the spacer SP and the surface 20A receives the load, and the load applied to the terminal portion 11, the bonding member 12, and the terminal portion 22 can be reduced. In other words, the terminal portion 11, the bonding member 12, and the terminal portion 22 can be prevented from being excessively crushed by the load, and the occurrence of a short circuit can be prevented. Therefore, the manufacturing yield can be improved.

[0041] Moreover, the rigidity of the spacers SP is equal to or greater than that of the sapphire substrate 20. As a result, the spacers SP are not deformed even when a load for correcting the warp of the sapphire substrate 20 is applied thereto.

[0042] 7 is a diagram showing a fourth step of the mounting method according to this embodiment. The fourth step shows a step of irradiating the first laser light LZ1 onto the workpiece WK. The second driving unit DR2 drives the laser device 60 to emit the first laser light LZ1 from the laser head 60A. The laser device 60 irradiates the first laser light LZ1 to the workpiece WK through the window 41A of the pressure jig 41, and bonds the light-emitting element LED to the circuit board CB. That is, the terminal portion 11 of the circuit board CB and the terminal portion 22 of the wafer WF are bonded to each other by heating and melting the bonding member 12 by laser ablation. More specifically, the first electrode 22A is bonded to the first electrode 11A by the first bonding member 12A. Also, the second electrode 22B is bonded to the second electrode 11B by the second bonding member 12B. The wavelength band of the first laser light LZ1 is 400 nm to 3000 nm.

[0043] 8 is a diagram showing a fifth step of the mounting method according to this embodiment. The fifth step shows a step of irradiating the second laser light LZ2 onto the workpiece WK. The second driving section DR2 drives the laser device 60 to emit the second laser light LZ2 from the laser head 60A. The laser device 60 irradiates the second laser light LZ2 to the workpiece WK through the window portion 41A of the pressure jig 41, and peels off the light-emitting element LED from the sapphire substrate 20. That is, a peeling layer (not shown) that fixes the light-emitting element LED to the sapphire substrate 20 is sublimated by laser ablation and peeled off from the sapphire substrate 20. The second laser light LZ2 has a wavelength band different from that of the first laser light LZ1. The wavelength band of the second laser light LZ2 is 200 nm to 366 nm.

[0044] 9 is a diagram showing a sixth step of the mounting method according to this embodiment. The sixth step shows a step of moving the pressurizing jig 41. The first driving unit DR1 moves the pressurizing jig 41 in the vertical direction V to separate it from the sapphire substrate 20. That is, the pressurizing jig 41 moves in the vertical direction V to the side away from the stage ST. As the pressurizing jig 41 is separated from the workpiece WK, the warped state of the sapphire substrate 20 returns to the state shown in FIG. 4. As shown in the figure, the light-emitting element LED is separated from the sapphire substrate 20.

[0045] Fig. 10 is a cross-sectional view showing a schematic configuration of the display panel PNL. Fig. 10 shows a display panel PNL manufactured by mounting light-emitting elements LED on the circuit board CB shown in Fig. 2 using the wafer WF shown in Fig. 3. The display panel PNL includes an insulating substrate 10 having a surface 10A, a spacer SP located on the surface 10A side and having a plurality of holes HL, and a plurality of light-emitting elements LED located on the surface 10A side and in the holes HL. The display panel PNL also includes the above-mentioned first electrode 11A, second electrode 11B, first bonding member 12A, and second bonding member 12B.

[0046] The upper surface US of the spacer SP and the upper surface LU of the light-emitting element LED are located on the same plane. The upper surface LU of the light-emitting element LED corresponds to, for example, a light-emitting surface from which light is emitted. The first electrode 22A of the light-emitting element LED is connected to the first electrode 11A via a first bonding member 12A. The second electrode 22B of the light-emitting element LED is connected to the second electrode 11B via a second bonding member 12B.

[0047] The display panel PNL may include an adhesive layer that covers the spacers SP, the light-emitting elements LED, and the like, and an insulating substrate that covers the adhesive layer. The adhesive layer is formed of, for example, OCA (Optical Clear Adhesive) or OCR (Optical Clear Resin). The display panel PNL may also include a resin layer that covers the spacers SP, the light-emitting elements LED, and the like.

[0048] Fig. 11 is a plan view showing a circuit board CB and a wafer WF according to this embodiment. Fig. 11(a) shows the circuit board CB. Fig. 11(b) shows the wafer WF. A light-emitting element LED is mounted on the circuit board CB shown in Fig. 11(a) using the wafer WF shown in Fig. 11(b).

[0049] As shown in FIG. 11(a), the circuit board CB has a rectangular outer shape. That is, the insulating substrate 10 has a rectangular outer shape. The spacer SP has a lattice shape in a plan view. The spacer SP includes a plurality of first portions SP1 extending in a first direction X and arranged in a second direction Y, and a plurality of second portions SP2 extending in the second direction Y and arranged in the first direction X. One hole HL corresponds to a space surrounded by two adjacent first portions SP1 and two adjacent second portions SP2. The plurality of holes HL are arranged in a matrix shape in the first direction X and the second direction Y. The plurality of holes HL are arranged in the first direction X with a pitch PT1 and arranged in the second direction Y with a pitch PT2. In the illustrated example, one terminal portion 11 is located in one hole portion HL. As described above, one terminal portion 11 is composed of one pair of a first electrode 11A and a second electrode 11B.

[0050] 11(b), the wafer WF has a circular outer shape. In other words, the sapphire substrate 20 has a circular outer shape. The light-emitting elements LED are arranged in a matrix in the first direction X and the second direction Y. The light-emitting elements LED are arranged in the first direction X with a pitch PT3, and in the second direction Y with a pitch PT4. The pitch PT3 is equal to the pitch PT1 of the holes HL. The pitch PT4 is equal to the pitch PT2 of the holes HL.

[0051] 6, when the sapphire substrate 20 is flattened, one light-emitting element LED is accommodated in one hole HL. Then, one light-emitting element LED is mounted in almost every hole HL. Note that the planar shapes of the circuit board CB and the wafer WF are not limited to the above examples.

[0052] Fig. 12 is a plan view showing a display panel PNL according to the present embodiment. Fig. 12 shows a display panel PNL manufactured by mounting light-emitting elements LED on a circuit board CB shown in Fig. 11(a) using the wafer WF shown in Fig. 11(b). One light-emitting element LED is mounted in each of the holes HL. One light-emitting element LED is surrounded by two adjacent first portions SP1 and two adjacent second portions SP2.

[0053] In the above example, one wafer WF is used for one circuit board CB, but if the area of ​​the circuit board CB corresponds to the area of ​​multiple wafers WF, the light-emitting elements LED are mounted while exchanging the wafer WF. Also, when mounting light-emitting elements LED of different luminescent colors such as red, green, and blue, mounting may be performed from each wafer WF equipped with the light-emitting elements LED of each color.

[0054] Fig. 13 is a plan view showing a circuit board CB and a wafer WF according to a first modified example. Fig. 13(a) shows the circuit board CB. Fig. 13(b) shows the wafer WF. A light-emitting element LED is mounted on the circuit board CB shown in Fig. 13(a) using the wafer WF shown in Fig. 13(b). The configuration of the wafer WF shown in Fig. 13(b) is the same as the configuration of the wafer WF shown in Fig. 11(b).

[0055] The circuit board CB shown in Fig. 13(a) differs from the circuit board CB shown in Fig. 11(a) in that it is provided with holes HL in which no terminal portion 11 is arranged. The multiple holes HL include a first hole portion HL1 and a second hole portion HL2. The terminal portion 11 is located in the first hole portion HL1, but not in the second hole portion HL2. In the illustrated example, the terminal portion 11 is provided in every other hole portion HL in the first direction X, and in every other hole portion HL in the second direction Y.

[0056] 6, when the sapphire substrate 20 is planarized, one light-emitting element LED is accommodated in one hole HL. Then, one light-emitting element LED is mounted only in the hole HL where the terminal portion 11 is located. The light-emitting element LED that is not used for mounting is not peeled off from the wafer WF. In this way, by providing the hole HL at the position corresponding to the light-emitting element LED that is not mounted, it is possible to prevent the light-emitting element LED from hitting the spacer SP.

[0057] Fig. 14 is a plan view showing a display panel PNL according to a first modified example. Fig. 14 shows a display panel PNL manufactured by mounting light-emitting elements LED on a circuit board CB shown in Fig. 13(a) using the wafer WF shown in Fig. 13(b). The light-emitting element LED is located in the first hole HL1, but not in the second hole HL2. In the illustrated example, the light-emitting element LED is provided in every other hole HL in the first direction X, and in every other hole HL in the second direction Y. Note that the layout of the hole HL in which the light-emitting element LED is arranged and the hole HL in which the light-emitting element LED is not arranged is not limited to this example. In addition, other electronic components such as optical sensors may be arranged in the hole HL in which the light-emitting element LED is not arranged.

[0058] Fig. 15 is a plan view showing a circuit board CB and a wafer WF according to a second modified example. Fig. 15(a) shows the circuit board CB. Fig. 15(b) shows the wafer WF. A light-emitting element LED is mounted on the circuit board CB shown in Fig. 15(a) using the wafer WF shown in Fig. 15(b). The configuration of the wafer WF shown in Fig. 15(b) is the same as the configuration of the wafer WF shown in Fig. 11(b).

[0059] The circuit board CB shown in Fig. 15(a) differs from the circuit board CB shown in Fig. 11(a) in that the second portion SP2 of the spacer SP is not formed. That is, the spacer SP has a plurality of first portions SP1 extending in the first direction X and aligned in the second direction Y. The plurality of holes HL extend in the first direction X and are aligned in the second direction Y. Furthermore, a plurality of terminal portions 11 are located in one hole HL.

[0060] 6, a plurality of light-emitting elements LED are accommodated in one hole HL when the sapphire substrate 20 is planarized. Then, a plurality of light-emitting elements LED are mounted in one hole HL.

[0061] Fig. 16 is a plan view showing a display panel PNL according to a second modified example. Fig. 16 shows a display panel PNL manufactured by mounting light-emitting elements LED on a circuit board CB shown in Fig. 15(a) using the wafer WF shown in Fig. 15(b). A plurality of light-emitting elements LED are positioned in one hole HL. In the illustrated example, the hole HL extends in the first direction X, but may extend in the second direction Y. In other words, the first portion SP1 of the spacer SP may not be formed, and only the second portion SP2 may be formed.

[0062] As described above, according to the present embodiment, it is possible to obtain a mounting method for electronic components, a display device, and a circuit board that can improve the yield. In this specification, a light-emitting element has been described as an example of an electronic component, but this embodiment can also be applied to electronic components other than a light-emitting element.

[0063] In addition, although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0064] DSP: display device, CB: circuit board, WF: wafer, 10...insulating substrate, 20...sapphire substrate, 10A, 10B, 20A, 20B... surface, LED... light emitting element, 11...Terminal portion, SP...Spacer, HL...Hole portion, WK: Work, ST: Stage, 41: Pressure jig, US, LU...top surface, 41A...window portion, LZ1...first laser beam, LZ2...second laser beam.

Claims

1. a workpiece including an insulating substrate having a first surface, a circuit board including a terminal portion and a spacer located on the first surface side, a sapphire substrate having a second surface, and a wafer including electronic components located on the second surface side, is placed between a stage and a pressure jig such that the first surface and the second surface face each other; bringing the pressurizing jig into contact with a portion of the sapphire substrate and applying a load to a contact portion between a portion of the upper surface of the spacer and the second surface; the pressure jig presses the sapphire substrate against the circuit board, bringing another portion of the top surface of the spacer into contact with the second surface, and flattening the sapphire substrate; A first laser beam is irradiated onto the workpiece through a window portion of the pressure jig to bond the electronic component to the circuit board; A second laser beam having a wavelength band different from that of the first laser beam is irradiated onto the workpiece through the window portion, and the electronic component is peeled off from the sapphire substrate. and separating the pressure jig from the sapphire substrate.

2. 2. The electronic component mounting method according to claim 1, wherein when the pressure jig is brought into contact with a portion of the sapphire substrate and a load is applied to the contact portion between the portion of the upper surface of the spacer and the second surface, another portion of the upper surface of the spacer is spaced apart from the second surface.

3. 3. The method for mounting an electronic component according to claim 1, wherein when the sapphire substrate is planarized, the entire upper surface of the spacer comes into contact with the second surface.

4. The spacer has a plurality of holes, 4. The method for mounting an electronic component according to claim 1, wherein the electronic component is placed in the hole when the sapphire substrate is pressed against the circuit board by the pressure jig.

5. 5. The electronic component mounting method according to claim 1, wherein the rigidity of the spacer is equal to or greater than the rigidity of the sapphire substrate.

6. an insulating substrate having a first surface; a spacer located on the first surface side and having a plurality of holes; a plurality of electronic components located on the first surface side and in the hole, The spacer is formed of aluminum oxide, A display device, wherein an upper surface of the spacer and an upper surface of the electronic component are located on the same plane.

7. The display device according to claim 6 , wherein the spacers are in a lattice shape in a plan view.

8. The plurality of holes include a first hole and a second hole, The display device according to claim 6 , wherein the electronic component is located in the first hole portion and is not located in the second hole portion.

9. The display device according to claim 6 , wherein a plurality of the electronic components are positioned in one of the holes.

10. an insulating substrate having a first surface; a spacer located on the first surface side and having a plurality of holes; a plurality of terminal portions located on the first surface side and within the hole portions, the spacer is formed of aluminum oxide; The plurality of holes include a first hole and a second hole, The terminal portion is located in the first hole portion and is not located in the second hole portion.

11. The circuit board according to claim 10 , wherein the spacer has a lattice shape in a plan view.

12. The circuit board according to claim 11 , wherein a plurality of the terminals are located in one of the holes.

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