Power Conversion Equipment

Abstract

The present invention comprises: a plurality of switching elements 4; a plurality of gate drivers IC5 that separately control the driving of the plurality of switching elements 4; and a substrate 1 on which the plurality of gate drivers IC5 are mounted. The substrate 1 has a base material 2 and an electroconductive section 3. The electroconductive section 3 includes a main-surface electroconductive layer 31 and a back-surface electroconductive layer 32. The main-surface electroconductive layer 31 includes: a first connection section 311 that is the connection location with a control signal output terminal 51 of a gate driver IC5; a second connection section 312 that is the connection location with a gate electrode 411 of a switching element 4; and a first wiring section 313 interposed between the first connection section 311 and the second connection section 312. The present invention further comprises at least one main-surface-side first electronic component 61 constituting a circuit portion that is mounted on the main-surface side and connects the first connection section 311 and the second connection section 312 with the first wiring section 313, an electroconductive member that passes through the base material 2 in the thickness direction not being connected to the first wiring section 313. Due to this configuration, it is possible to achieve increased drive control speed.

Description

[Technical field]

[0001] The present disclosure relates to a power conversion device. [Background technology]

[0002] Various power conversion devices equipped with switching elements such as MOSFETs have been proposed. Patent Document 1 discloses an example of a conventional power conversion device. In the power conversion device, input power is converted and output according to a control signal input to the switching element. Applications of such power conversion devices include, for example, motor drive power supplies. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-243839 A Summary of the Invention [Problem to be solved by the invention]

[0004] Power conversion devices are required to operate at even higher speeds (higher frequencies of control signals).

[0005] The present disclosure has been made in light of the above-mentioned circumstances, and an object of the present disclosure is to provide a power conversion device capable of achieving high-speed drive control. [Means for solving the problem]

[0006] A power conversion device provided by the present disclosure includes: a plurality of switching elements, each having a gate electrode, a source electrode, and a drain electrode; a plurality of gate driver ICs that individually drive and control the plurality of switching elements; and a substrate on which the plurality of gate driver ICs are mounted, the substrate having an insulating base material having a main surface and a back surface facing opposite each other in a thickness direction; and a conductive portion supported by the base material, the conductive portion including a main surface conductive layer disposed on the main surface and a back surface conductive layer disposed on the back surface, the main surface conductive layer including a first connection portion which is a connection portion with a control signal output terminal of the gate driver IC, a second connection portion which is a connection portion with the gate electrode of the switching element, and a first wiring portion interposed between the first connection portion and the second connection portion, the power conversion device further including one or more main surface side first electronic components mounted on the main surface side and constituting a circuit portion connecting the first connection portion and the second connection portion together with the first wiring portion, and a conductive member penetrating the substrate in the thickness direction is not connected to the first wiring portion. Effect of the Invention

[0007] According to the power conversion device of the present disclosure, it is possible to increase the speed of drive control.

[0008] Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing a power conversion device according to a first embodiment of the present disclosure. [Diagram 2] FIG. 2 is a diagram illustrating an example of a circuit configuration of the power conversion device according to the first embodiment of the present disclosure. [Diagram 3] FIG. 3 is a plan view of a main portion showing the power conversion device according to the first embodiment of the present disclosure. [Figure 4] FIG. 4 is a plan view of a main portion showing the power conversion device according to the first embodiment of the present disclosure. [Diagram 5]FIG. 5 is a plan view of a main portion showing the power conversion device according to the first embodiment of the present disclosure. [Figure 6] FIG. 6 is a plan view of a main portion showing the power conversion device according to the first embodiment of the present disclosure. [Figure 7] FIG. 7 is an enlarged cross-sectional view of a main part showing a substrate of the power conversion device according to the first embodiment of the present disclosure. [Figure 8] FIG. 8 is a diagram illustrating an example of a circuit configuration of a power conversion device according to the first embodiment of the present disclosure. [Figure 9] FIG. 9 is an enlarged plan view of a main portion showing the power conversion device according to the first embodiment of the present disclosure. [Figure 10] FIG. 10 is an enlarged plan view of a main portion showing the power conversion device according to the first embodiment of the present disclosure. [Figure 11] FIG. 11 is an enlarged perspective view of a main part showing the power conversion device according to the first embodiment of the present disclosure. [Figure 12] FIG. 12 is an enlarged cross-sectional view of a main portion showing the power conversion device according to the first embodiment of the present disclosure. [Figure 13] FIG. 13 is a diagram illustrating an example of a circuit configuration of a power conversion device according to the first embodiment of the present disclosure. [Figure 14] FIG. 14 is a plan view showing a power conversion device according to the second embodiment of the present disclosure. [Figure 15] FIG. 15 is a plan view of a main part showing a power conversion device according to a second embodiment of the present disclosure. [Figure 16] FIG. 16 is a plan view of a main part showing a power conversion device according to a second embodiment of the present disclosure. [Figure 17] FIG. 17 is a plan view of a main part showing a power conversion device according to the second embodiment of the present disclosure. [Figure 18] FIG. 18 is a plan view showing a first modified example of the power conversion device according to the second embodiment of the present disclosure. [Figure 19] FIG. 19 is a plan view showing a second modified example of the power conversion device according to the second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings.

[0011] The terms "first," "second," "third," etc. in this disclosure are used merely for identification purposes and are not necessarily intended to dictate any ordering of their objects.

[0012] First Embodiment 1 to 13 show a power conversion device according to a first embodiment of the present disclosure. The power conversion device A1 of this embodiment includes a substrate 1, a power module 40, a plurality of gate driver ICs 5, and a plurality of electronic components 6. The power conversion device A1 is a device that converts input power using the switching function of the power module 40 and then outputs the converted power. The use of the power conversion device A1 is not limited in any way, and in this embodiment, an example will be described in which input power is converted into three-phase AC power for driving a motor.

[0013] FIG. 1 is a plan view showing the power converter A1. FIG. 2 is a diagram showing an example of a circuit configuration of the power converter A1. FIG. 3 is a plan view of a main part showing the power converter A1. FIG. 4 is a plan view of a main part showing the power converter A1. FIG. 5 is a plan view of a main part showing the power converter A1. FIG. 6 is a plan view of a main part showing the power converter A1. FIG. 7 is an enlarged cross-sectional view of a main part showing a board of the power converter A1. FIG. 8 is a diagram showing an example of a circuit configuration of the power converter A1. FIG. 9 is an enlarged plan view of a main part showing the power converter A1. FIG. 10 is an enlarged cross-sectional view of a main part showing the power converter A1. FIG. 11 is an enlarged perspective view of a main part showing the power converter A1. FIG. 12 is an enlarged cross-sectional view of a main part showing the power converter A1. FIG. 13 is a diagram showing an example of a circuit configuration of the power converter A1. The z direction in the figure corresponds to the thickness direction of the present disclosure. FIG. 3 omits the power module 40 for ease of understanding. Fig. 4 shows a first intermediate conductive layer 33 and a second layer 22, which will be described later. Fig. 5 shows a second intermediate conductive layer 34 and a third layer 23, which will be described later. Fig. 6 shows a rear surface conductive layer 32 and a third layer 23 (rear surface 2b), which will be described later, with the left-right direction (x direction) of the paper reversed for ease of understanding.

[0014] <Power Module 40> The power module 40 is a module that performs a switching function to realize a power conversion function. As shown in Fig. 1 and Fig. 2, the power module 40 of this embodiment has a plurality of switching elements 4, a plurality of gate terminals 41, a positive input terminal 42, a negative input terminal 43, output terminals 44, 45, 46, and a sealing resin 49.

[0015] The multiple switching elements 4 perform a switching function for converting DC power input from a positive input terminal 42 and a negative input terminal 43 into three-phase AC power output from output terminals 44, 45, and 46. In this embodiment, the power module 40 includes six switching elements 4A, 4B, 4C, 4D, 4E, and 4F. The switching elements 4A, 4B, and 4C form an upper arm of a half-bridge circuit, and the switching elements 4D, 4E, and 4F form a lower arm.

[0016] The specific configuration of the switching element 4 is not limited, and in this embodiment, a SiC-MOSFET formed using a semiconductor substrate material mainly composed of SiC is adopted. The switching element 4 has a gate electrode GP, a source electrode SP, and a drain electrode DP.

[0017] The multiple gate terminals 41 are terminals that receive control signals (gate drive signals) input to the multiple switching elements 4. In this embodiment, six gate terminals 41A, 41B, 41C, 41D, 41E, and 41F are provided corresponding to the six switching elements 4A, 4B, 4C, 4D, 4E, and 4F.

[0018] The sealing resin 49 covers the multiple switching elements 4 and is made of insulating resin such as black epoxy resin. The power module 40 may also include a heat dissipation member (not shown) a part of which is exposed from the sealing resin 49. This heat dissipation member is for dissipating heat from the multiple switching elements 4 to the outside of the power module 40, and is in close contact with or bonded to, for example, a heat sink (not shown).

[0019] It should be noted that the power conversion device of the present disclosure is not limited to a configuration in which the six switching elements 4A, 4B, 4C, 4D, 4E, and 4F are built into the power module 40, and may be configured, for example, in which the six switching elements 4A, 4B, 4C, 4D, 4E, and 4F are individually mounted directly on the substrate 1.

[0020] <Multiple gate driver IC5> The multiple gate driver ICs 5 are ICs that drive and control the multiple switching elements 4. In this embodiment, six gate driver ICs 5A, 5B, 5C, 5D, 5E, and 5F are provided corresponding to the six switching elements 4A, 4B, 4C, 4D, 4E, and 4F. Note that the number of gate driver ICs 5 is not limited to the same as the number of switching elements 4, and may be, for example, a gate driver IC5 for three switching elements 4A, 4B, and 4C that constitute an upper arm, and a gate driver IC5 for three switching elements 4D, 4E, and 4F that constitute a lower arm.

[0021] As shown in Figures 2, 8 and 13, the gate driver IC5 of this embodiment has a control signal output terminal 51, a Miller clamp terminal 52, an output side (secondary side) ground terminal 53, an analog power supply input terminal 54, an input side (primary side) ground terminal 55 and a digital signal input terminal 56, and may have other input terminals and output terminals as appropriate.

[0022] The control signal output terminal 51 is a terminal for outputting a control signal to be input to the gate electrode GP (gate terminal 41) of the switching element 4. The Miller clamp terminal 52 is a terminal for configuring a Miller clamp circuit. The output side (secondary side) ground terminal 53 is a terminal connected to ground. The analog power supply input terminal 54 is an input terminal to which an analog power supply is connected. The input side (primary side) ground terminal 55 is a terminal connected to the ground wiring of the analog power supply. The digital signal input terminal 56 is a terminal to which a digital signal is input from a microcomputer or the like to which the power conversion device A1 is connected. Note that the drive circuit including the gate driver IC5 is preferably configured such that the output side (secondary side) ground terminal 53 and the input side (primary side) ground terminal 55 are insulated from each other. Such a configuration may be realized by using a transformer (not shown) provided outside the gate driver IC5, or may be configured to have an insulating transformer structure in the gate driver IC5. In this embodiment, the gate driver IC5 has an insulating transformer structure.

[0023] <Substrate 1> The substrate 1 is mounted with a power module 40, a plurality of gate driver ICs 5, and a plurality of electronic components 6. The substrate 1 of this embodiment has a base material 2 and a conductive portion 3.

[0024] FIG. 7 shows a part of the substrate 1. The base material 2 has a main surface 2a and a back surface 2b. The main surface 2a and the back surface 2b face in opposite directions in the z direction. The base material 2 has a first layer 21, a second layer 22 and a third layer 23. The first layer 21, the second layer 22 and the third layer 23 are stacked on top of each other in this order in the z direction. One side of the first layer 21 constitutes the main surface 2a. One side of the second layer 22 constitutes the back surface 2b. The material of the base material 2 (the first layer 21, the second layer 22 and the third layer 23) is not limited in any way and may be made of an insulating material such as glass epoxy resin, for example.

[0025] In the present embodiment, an opening 29 is formed in the base material 2. The opening 29 penetrates the base material 2 (the first layer 21, the second layer 22, and the third layer 23) in the z direction. The opening 29 is used, for example, to fix the power module 40 to the substrate 1 or a heat dissipation member (not shown) such as a heat sink.

[0026] The conductive section 3 is supported by the substrate 2, and constitutes a conductive path between the power module 40, the plurality of gate driver ICs 5, and the plurality of electronic components 6. As shown in Fig. 7, the conductive section 3 of this embodiment has a main surface conductive layer 31, a back surface conductive layer 32, a first intermediate conductive layer 33, and a second intermediate conductive layer 34. The main surface conductive layer 31, the back surface conductive layer 32, the first intermediate conductive layer 33, and the second intermediate conductive layer 34 are made of a metal such as Cu, Ni, Au, or the like, and are formed by, for example, plating.

[0027] The main surface conductive layer 31 is disposed on the main surface 2a. The back surface conductive layer 32 is disposed on the back surface 2b. The first intermediate conductive layer 33 is disposed between the main surface conductive layer 31 and the back surface conductive layer 32 in the z direction, and in this embodiment, is disposed between the first layer 21 and the second layer 22. The second intermediate conductive layer 34 is disposed between the first intermediate conductive layer 33 and the back surface conductive layer 32 in the z direction, and in this embodiment, is disposed between the second layer 22 and the third layer 23. The conductive portion 3 also has a plurality of through conductive portions 35. The through conductive portions 35 are conductive portions that penetrate any one or all of the first layer 21, the second layer 22, and the third layer 23, and appropriately conduct the main surface conductive layer 31, the back surface conductive layer 32, the first intermediate conductive layer 33, and the second intermediate conductive layer 34 at appropriate locations.

[0028] There are no limitations on the thickness relationships between the first layer 21, the second layer 22, and the third layer 23 and the main surface conductive layer 31, the back surface conductive layer 32, the first intermediate conductive layer 33, and the first intermediate conductive layer 34. As an example of these thicknesses, the thickness t01 of the main surface conductive layer 31 is 50 μm to 123 μm, the thickness t02 of the back surface conductive layer 32 is 50 μm to 123 μm, the thickness t03 of the first intermediate conductive layer 33 is 50 μm to 107 μm, and the thickness t04 of the second intermediate conductive layer 34 is 50 μm to 107 μm. The thickness t11 of the first layer 21 (the distance between the main surface conductive layer 31 and the first intermediate conductive layer 33) is 90 μm to 200 μm, the thickness t12 of the second layer 22 (the distance between the first intermediate conductive layer 33 and the second intermediate conductive layer 34) is 200 μm to 850 μm, and the thickness t13 of the third layer 23 (the distance between the second intermediate conductive layer 34 and the back surface conductive layer 32) is 90 μm to 200 μm. As a preferable example of the thickness relationship, the thickness t03 is thinner than the thicknesses t01 and t02. The thickness t11 is thinner than the thicknesses t01 and t03. The thickness t04 is thinner than the thicknesses t01 and t02. The thickness t13 is thinner than the thicknesses t02 and t04. The thickness t12 is thicker than any of the thicknesses t01, t02, t03, t04, t11, and t13.

[0029] As shown in Figures 1 to 3, the substrate 1 of this embodiment has a plurality of external power supply terminals 10, a plurality of external control terminals 11, an external positive input terminal 12, an external negative input terminal 13, external output terminals 14, 15, 16, a plurality of internal control terminals 110, an internal positive input terminal 120, an internal negative input terminal 130 and internal output terminals 140, 150, 160.

[0030] The multiple external power supply terminals 10 are terminals connected to a control power supply and a ground line. The multiple external control terminals 11 are terminals connected to, for example, a pulse signal generator, a microcomputer, etc. In the illustrated example, the multiple terminals 10 and external control terminals 11 are disposed at positions near one side in the y direction of the substrate 2, near both sides in the x direction of the substrate 2, and near one side in the y direction.

[0031] The external positive input terminal 12 is a terminal connected to the positive pole of a DC power supply. The external negative input terminal 13 is a terminal connected to the negative pole of a DC power supply. In the illustrated example, the external positive input terminal 12 and the external negative input terminal 13 are disposed closer to the other side in the y direction of the substrate 2. The external output terminals 14, 15, and 16 are terminals respectively connected to, for example, the U phase, V phase, and W phase of a motor, which is an external load. In the illustrated example, the external output terminals 14, 15, and 16 are disposed closer to one side in the x direction of the substrate 2 and closer to the other side in the y direction.

[0032] The multiple internal control terminals 110 are terminals for transmitting drive signals to the power module 40. In this embodiment, six internal control terminals 110A, 110B, 110C, 110D, 110E, and 110F are provided, and six gate terminals 41A, 41B, 41C, 41D, 41E, and 41F of the power module 40 are individually connected to the internal control terminals 110A, 110B, 110C, 110D, 110E, and 110F. In the illustrated example, the six internal control terminals 110A, 110B, 110C, 110D, 110E, and 110F are arranged around the opening 29.

[0033] The internal positive input terminal 120, the internal negative input terminal 130, and the internal output terminals 140, 150, and 160 are terminals that are individually connected to the positive input terminal 42, the negative input terminal 43, and the output terminals 44, 45, and 46 of the power module 40. In the illustrated example, the internal positive input terminal 120, the internal negative input terminal 130, and the internal output terminals 140, 150, and 160 are arranged around the power module 20, and are arranged on the opposite side of the opening 29 in the y direction from the six internal control terminals 110A, 110B, 110C, 110D, 110E, and 110F.

[0034] The main surface conductive layer 31 includes a plurality of wiring portions and the like on the main surface 2a, and constitutes conductive paths leading to a plurality of gate driver ICs 5, a plurality of electronic components 6, and the like. The main surface conductive layer 31 constitutes, for example, conductive paths between the external power supply terminal 10 or the external control terminal 11 and the gate driver ICs 5 or the electronic components 6, and conductive paths connecting the external positive electrode side input terminal 12 and the positive electrode side input terminal 42. The main surface conductive layer 31 of this embodiment also includes a first connection portion 311, a second connection portion 312, a first wiring portion 313, a second wiring portion 314, and a third connection portion 315, as shown in Figs. 8 and 9.

[0035] 8 and 9 show elements related to one gate driver IC5. In the power conversion device A1 of this embodiment, six gate driver ICs 5 are provided, and thus six similar wiring configurations are provided. The first connection portion 311 is a portion connected to the control signal output terminal 51 of the gate driver IC5. The second connection portion 312 is a portion connected to the gate electrode GP of the switching element 4, and in this embodiment, the internal control terminal 110 connected to the gate terminal 41 of the power module 40 constitutes the second connection portion 312. The first wiring portion 313 is a wiring portion interposed between the first connection portion 311 and the second connection portion 312. A conductive member such as the through conductive portion 35 penetrating the base material 2 (all or any of the first layer 21, the second layer 22, and the third layer 23) in the z direction is not connected to the first wiring portion 313.

[0036] The third connection portion 315 is a portion that is connected to the Miller clamp terminal 52 of the gate driver IC 5. The second wiring portion 314 is a wiring portion that is interposed between the third connection portion 315 and the second connection portion 312. The second wiring portion 314 is not connected to a conductive member that penetrates the base material 2 (all or any of the first layer 21, the second layer 22, and the third layer 23) in the z direction, such as the penetrating conductive portion 35.

[0037] The back surface conductive layer 32 includes a plurality of wiring portions and the like on the back surface 2b as shown in Fig. 6. The main surface conductive layer 31 configures, for example, conductive paths and the like that individually connect the external output terminals 14, 15, and 16 and the internal output terminals 140, 150, and 160. In addition, the back surface conductive layer 32 of this embodiment includes a fourth connection portion 320, a third wiring portion 321, and a fourth wiring portion 322 as shown in Figs. 8 and 10.

[0038] The fourth connection portion 320 is a portion connected to the second connection portion 312, and in this embodiment, is configured by the internal control terminal 110 together with the second connection portion 312. The third wiring portion 321 is a wiring portion that is electrically connected to the second connection portion 312 via the fourth connection portion 320. The fourth wiring portion 322 is a wiring portion that is connected to ground.

[0039] The first intermediate conductive layer 33 is disposed between the first layer 21 and the second layer 22, and is appropriately conductive to appropriate locations of the main surface conductive layer 31, the back surface conductive layer 32, and the second intermediate conductive layer 34 by through-hole conductive portions 35. As shown in Fig. 4, the first intermediate conductive layer 33 of this embodiment has a first ground pattern portion 331. The first ground pattern portion 331 is a pattern portion connected to ground, and is disposed toward one side of the substrate 2 in the y direction.

[0040] The second intermediate conductive layer 34 is disposed between the second layer 22 and the third layer 23, and is appropriately electrically connected to the main surface conductive layer 31, the back surface conductive layer 32, and the first intermediate conductive layer 33 at appropriate positions by the through conductive portion 35. As shown in FIG. 5, the second intermediate conductive layer 34 of this embodiment has a second ground pattern portion 341 and a power supply pattern portion 342. The second ground pattern portion 341 is a pattern portion connected to the ground and is disposed toward one side of the substrate 2 in the y direction. The second ground pattern portion 341 almost overlaps with the first ground pattern portion 331 when viewed along the z direction. The power supply pattern portion 342 is a portion connected to the power supply and, in the illustrated example, is a linear portion along the periphery of the second ground pattern portion 341. The second ground pattern portion 341 overlaps with the first ground pattern portion 331 when viewed along the z direction.

[0041] 3 to 6, 10 and 11, in this embodiment, main surface conductive layer 31 has first input pattern portion 319, back surface conductive layer 32 has second input pattern portion 329, first intermediate conductive layer 33 has third input pattern portion 339, and second intermediate conductive layer 34 has fourth input pattern portion 349. Furthermore, conductive portion 3 has penetrating conductive members 38 in addition to a plurality of penetrating conductive portions 35.

[0042] The first input pattern section 319 is connected to the external negative input terminal 13. The second input pattern section 329, the third input pattern section 339, and the fourth input pattern section 349 are connected to the internal negative input terminal 130. The first input pattern section 319, the second input pattern section 329, the third input pattern section 339, and the fourth input pattern section 349 overlap each other when viewed along the z direction. In the illustrated example, the second input pattern section 329, the third input pattern section 339, and the fourth input pattern section 349 are each substantially rectangular, and their shapes, sizes, and arrangements in the x direction and y direction are substantially the same. The first input pattern section 319 has a smaller y direction dimension than the second input pattern section 329, the third input pattern section 339, and the fourth input pattern section 349.

[0043] The portions of the second input pattern portion 329, the third input pattern portion 339, and the fourth input pattern portion 349 that protrude from the first input pattern portion 319 as viewed along the z direction are connected to each other by a plurality of through conductive portions 35. The through conductive member 38 penetrates the base material 2 in the z direction and connects the first input pattern portion 319, the second input pattern portion 329, the third input pattern portion 339, and the fourth input pattern portion 349 to each other. The specific configuration of the through conductive member 38 is not limited in any way, and may be configured by a screw, for example. In this embodiment, the electrical resistance of the plurality of through conductive portions 35 is smaller than the electrical resistance of the through conductive member 38. In addition, the portion of the through conductive member 38 that is sandwiched between the first input pattern portion 319 and the third input pattern portion 339 constitutes a shunt resistor portion 381.

[0044] <Multiple electronic components 6> The electronic components 6 are electronic components for making the power conversion device A1 function, and may be, for example, resistors, capacitors, diodes, coil components, or the like. In this embodiment, the electronic components 6 include first main surface electronic components 61, second main surface electronic components 62, and back surface electronic components 63. The first main surface electronic components 61 and second main surface electronic components 62 are mounted on the main surface 2a side of the substrate 2, as shown in FIG. 1. The back surface electronic components 63 are mounted on the back surface 2b side of the substrate 2, as shown in FIG. 6.

[0045] As shown in FIG. 8 and FIG. 9, the plurality of main surface side first electronic components 61 include a main surface side first electronic component 611, a main surface side first electronic component 612, and a main surface side first electronic component 613. The main surface side first electronic component 611, the main surface side first electronic component 612, and the main surface side first electronic component 613, together with the first wiring portion 313, constitute a circuit portion connecting the first connection portion 311 and the second connection portion 312. In the illustrated example, the main surface side first electronic component 611 is a resistor interposed between the first connection portion 311 and the second connection portion 312. The main surface side first electronic component 612 and the main surface side first electronic component 613 are in parallel to the main surface side first electronic component 611 and are connected in series to each other. The main surface side first electronic component 612 is, for example, a resistor, and the main surface side first electronic component 613 is, for example, a Schottky barrier diode.

[0046] 8 and 9, the main surface side second electronic component 62, together with the second wiring portion 314, constitutes a circuit portion that connects the third connection portion 315 and the second connection portion 312. The main surface side second electronic component 62 is, for example, a resistor.

[0047] 8 and 10, the multiple back side electronic components 63 are electrically connected to the third wiring portion 321 and the fourth wiring portion 322. In the illustrated example, the multiple back side electronic components 63 include a back side electronic component 631, a back side electronic component 632, and a back side electronic component 633. The back side electronic component 631, the back side electronic component 632, and the back side electronic component 633 are connected in parallel with each other. The back side electronic component 631 is, for example, a resistor. The back side electronic component 632 is, for example, a capacitor. The back side electronic component 633 is, for example, a Schottky barrier diode.

[0048] In this embodiment, the circuit configuration is as shown in Fig. 13. That is, the conductive portion 3 has an analog ground wiring portion 391 and a digital ground wiring portion 392 shown in Figs. 1 and 13. The analog ground wiring portion 391 is connected to a ground terminal. The digital ground wiring portion 392 is a wiring portion that forms a ground for a digital signal input to the digital signal input terminal 56. The analog ground wiring portion 391 and the digital ground wiring portion 392 are connected by the coil component 69 shown in Figs. 1 and 13.

[0049] Next, the operation of the power conversion device A1 will be described.

[0050] According to this embodiment, as shown in Figs. 8 and 9, the first wiring portion 313 interposed between the first connection portion 311 and the second connection portion 312 is not connected to a conductive member penetrating in the z direction. Therefore, it is possible to reduce the inductance of the path through which the control signal (drive signal) from the control signal output terminal 51 of the gate driver IC 5 is input to the gate electrode GP of the switching element 4. This makes it possible to speed up the drive control of the switching element 4 (increase the frequency of the drive signal). As a result, while the practical range of the drive frequency in the conventional technology was at most several tens of kHz, according to this embodiment, it is possible to increase the drive frequency beyond several tens of kHz to approximately several hundreds of kHz, and the temporal change in current and voltage can change by several A / ns or several tens of V / ns.

[0051] 8 and 9, the second wiring portion 314 interposed between the first connection portion 311 and the second connection portion 312 is not connected to a conductive member penetrating in the z direction. This makes it possible to reduce the inductance of the Miller clamp circuit. This makes it possible to speed up the drive control of the switching element 4 (increase the frequency of the drive signal).

[0052] 8 and 10, the back side electronic components 631, 632, and 633 form a protection circuit. Although these back side electronic components 631, 632, and 633 are electrically connected to the second connection portion 312, they do not need to be electrically arranged between the first connection portion 311 and the second connection portion 312, or between the third connection portion 315 and the second connection portion 312. For this reason, by connecting the back side electronic components 631, 632, and 633 to the third wiring portion 321 and the fourth wiring portion 322 on the back surface 2b side without directly connecting them to the first wiring portion 313 and the second wiring portion 314, it is possible to reduce the inductance of the conductive path between the first connection portion 311 and the third connection portion 315 and the second connection portion 312 while ensuring appropriate protection.

[0053] 7, the thickness t11 of the first layer 21 (the distance between the main surface conductive layer 31 and the first intermediate conductive layer 33) is smaller than the thickness t01 of the main surface conductive layer 31 and the thickness t03 of the first intermediate conductive layer 33. This makes it possible to reduce the inductance of the conduction path formed by the main surface conductive layer 31, the first intermediate conductive layer 33, and the through conductive portion 35, which is preferable for increasing the speed of drive control of the switching element 4 (increasing the frequency of the drive signal).

[0054] Furthermore, the thickness t13 of the third layer 23 (the distance between the back surface conductive layer 32 and the second intermediate conductive layer 34) is smaller than the thickness t02 of the back surface conductive layer 32 and the thickness t04 of the second intermediate conductive layer 34. This makes it possible to reduce the inductance of the conduction path formed by the back surface conductive layer 32, the second intermediate conductive layer 34, and the through conductive portion 35, which is preferable for increasing the speed of drive control of the switching element 4 (increasing the frequency of the drive signal).

[0055] The first ground pattern portion 331 shown in Fig. 4 and the power supply pattern portion 342 shown in Fig. 5 are portions with significantly different potentials and a significantly large potential difference, and overlap each other when viewed along the z direction. However, the thickness t12 of the second layer 22 is greater than any of the thicknesses t01, t02, t03, t04, t11, and t13. This makes it possible to prevent the first ground pattern portion 331, the power supply pattern portion 342, and the second layer 22 from forming an electrical structure similar to a capacitor and unintentionally having electrostatic capacitance.

[0056] As shown in FIG. 3 to FIG. 6, FIG. 10 and FIG. 11, the conduction path between the external positive electrode side input terminal 12 and the external negative electrode side input terminal 13 is composed of the first input pattern portion 319, the second input pattern portion 329, the third input pattern portion 339, the fourth input pattern portion 349, the plurality of through conductive portions 35 and the through conductive member 38. The plurality of through conductive portions 35 mutually connect the third input pattern portion 339, the fourth input pattern portion 349 and the second input pattern portion 329, and have a smaller electrical resistance than the through conductive member 38. As a result, the plurality of through conductive portions 35 become the main conduction path of the current between the second input pattern portion 329 and the third input pattern portion 339, and the current flowing through the through conductive member 38 can be suppressed. Then, between the first input pattern portion 319 and the third input pattern portion 339, only the shunt resistor portion 381 formed by a part of the through conductive member 38 becomes the conduction path. This makes it possible to use the shunt resistor section 381 to more accurately measure the value of the current flowing through the external positive input terminal 12 and the external negative input terminal 13 .

[0057] 13, analog ground wiring section 391 and digital ground wiring section 392 are connected via coil component 69. This makes it possible for high-frequency noise components that may be present in digital ground wiring section 392 to be blocked by coil component 69, and the potential of analog ground wiring section 391 can be made more stable.

[0058] <Second embodiment> Fig. 14 to Fig. 17 show a power conversion device A2 according to a second embodiment of the present disclosure. Fig. 14 is a plan view showing the power conversion device A2. Fig. 15 to Fig. 17 are plan views of the main part showing the power conversion device A2. Fig. 17, like Fig. 6, is shown with the left-right direction (x direction) of the paper reversed for ease of understanding.

[0059] The power converter A2 of this embodiment differs from the power converter A1 in the configurations or arrangements of the external positive input terminal 12, the external negative input terminal 13 and the external output terminals 14, 15, 16.

[0060] In this embodiment, the external positive input terminal 12 and the external negative input terminal 13 include a through hole provided at the other end in the y direction (the lower end in FIG. 14) of the substrate 2. The shape of this through hole is not limited in any way, and is circular in the illustrated example.

[0061] The external output terminal 14 and the external output terminal 15 are disposed closer to one side of the substrate 2 in the x direction and closer to the other side in the y direction. The external output terminal 16 is disposed closer to the other side of the substrate 2 in the x direction and closer to the other side in the y direction. That is, in this embodiment, the external output terminal 14, the external output terminal 15, and the external output terminal 16 are disposed separately in the x direction.

[0062] The opening 29 of the base material 2 has a shape different from that of the opening 29 in the power converter A1. The opening 29 in this embodiment is formed by two circular through holes.

[0063] In addition, in this embodiment, due to differences in the configuration or arrangement of the external positive electrode side input terminal 12, the external negative electrode side input terminal 13 and the external output terminals 14, 15, 16, and for other purposes, the configurations of the main surface conductive layer 31, the back surface conductive layer 32, the first intermediate conductive layer 33 and the second intermediate conductive layer 34 of the conductive portion 3 differ from those of the above-mentioned embodiment.

[0064] As shown in FIG. 14, main surface conductive layer 31 has relay pattern portion 317, fifth input pattern portion 318 and first input pattern portion 319.

[0065] The relay pattern portion 317 is connected to the internal negative input terminal 130 and is electrically connected to the negative input terminal 43 of the switching element 4. The relay pattern portion 317 is arranged away from the first input pattern portion 319 on one side in the y direction. The relay pattern portion 317 and the first input pattern portion 319 are arranged across a gap extending in the x direction. The relay pattern portion 317 has a smaller dimension in the x direction than the first input pattern portion 319. The relay pattern portion 317 has a smaller dimension in the y direction than the first input pattern portion 319. The relay pattern portion 317 has a smaller area than the first input pattern portion 319.

[0066] The fifth input pattern portion 318 is a portion connected to the external positive electrode side input terminal 12. The fifth input pattern portion 318 is disposed on one side in the x direction with respect to the first input pattern portion 319. The fifth input pattern portion 318 has a wide width portion 3181 and a narrow width portion 3182. The wide width portion 3181 is a portion having a wide width in the x direction and is connected to the external positive electrode side input terminal 12. The narrow width portion 3182 is a portion having a narrower width in the x direction than the wide width portion 3181. The narrow width portion 3182 extends from the wide width portion 3181 to one side in the y direction. The narrow width portion 3182 is connected to the internal positive electrode side input terminal 120 and is conductive to the positive electrode side input terminal 42 of the switching element 4.

[0067] As shown in FIG. 17, the back surface conductive layer 32 has a sixth input pattern portion 327, a relay pattern portion 328, a second input pattern portion 329, and wiring portions 3234, 3235, and 3236.

[0068] The relay pattern portion 328 is electrically connected to the relay pattern portion 317 of the main surface conductive layer 31 via the through conductive portion 35. The relay pattern portion 328 is electrically connected to the through conductive member 38. As a result, the relay pattern portion 328 is electrically connected to the first input pattern portion 319 via the through conductive member 38.

[0069] The second input pattern portion 329 is connected to the external negative input terminal 13. The second input pattern portion 329 is electrically connected to the first input pattern portion 319 via a plurality of through-hole conductive portions .

[0070] The sixth input pattern portion 327 is connected to the external positive input terminal 12, and is disposed on one side in the x-direction with respect to the second input pattern portion 329. The sixth input pattern portion 327 is provided in a shape, size and position such that most of it overlaps with the wide portion 3181 of the fifth input pattern portion 318 of the main surface conductive layer 31 when viewed along the z-direction.

[0071] The wiring portion 3234 is connected to the external output terminal 14 and the internal output terminal 140. The wiring portion 3234 has a narrow width in a direction perpendicular to the current path. When viewed along the z direction, the wiring portion 3234 intersects with the narrow portion 3182 of the fifth input pattern portion 318 of the main surface conductive layer 31 and is spaced apart from the wide portion 3181. The wiring portion 3234 is also spaced apart from the sixth input pattern portion 327.

[0072] The wiring portion 3235 is connected to the external output terminal 15 and the internal output terminal 150. The wiring portion 3235 has a narrow width in a direction perpendicular to the current path. The wiring portion 3235 does not overlap with the fifth input pattern portion 318 when viewed along the z direction.

[0073] The wiring portion 3236 is connected to the external output terminal 16 and the internal output terminal 160. The wiring portion 3236 has a narrow width in a direction perpendicular to the current path. The wiring portion 3236 does not overlap with the relay pattern portion 317 when viewed along the z direction.

[0074] 15, the first intermediate conductive layer 33 has a third input pattern portion 339. The third input pattern portion 339 is connected to the penetrating conductive member .

[0075] 16, the second intermediate conductive layer has a fourth input pattern portion 349. The fourth input pattern portion 349 is connected to the penetrating conductive member .

[0076] In the present embodiment, the penetrating conductive member 38 also constitutes a shunt resistor portion 381.

[0077] This embodiment also enables high-speed drive control. As shown in Fig. 14 and Fig. 17, a path including a through conductive member 38 is formed between the internal negative electrode side input terminal 130 and the external negative electrode side input terminal 13. This makes it possible to measure the current value using the shunt resistor 381, as described in the power conversion device A1.

[0078] In this embodiment, the relay pattern portion 317 connected to the internal negative input terminal 130 and the first input pattern portion 319 connected to the external negative input terminal 13 are arranged with a gap therebetween. For example, in the power conversion device A21 as a first modified example shown in FIG. 18, the relay pattern portion 317 and the first input pattern portion 319 are conductively joined by the solder 91. As a result, the path between the internal negative input terminal 130 (negative input terminal 43) and the external negative input terminal 13 is configured such that the path including the shunt resistor portion 381 and the path including the solder 91 are connected in parallel. In general, the resistance value of the solder 91 is smaller than the resistance value of the shunt resistor portion 381. Therefore, the solder 91 forms a circuit bypassing the shunt resistor portion 381. As a result, when the user of the power conversion device A21 does not use the shunt resistor portion 381, it is possible to further reduce the resistance and inductance of the current path.

[0079] 19, a shunt resistor 68 is connected to the relay pattern section 317 and the first input pattern section 319. As a result, the path between the internal negative input terminal 130 (negative input terminal 43) and the external negative input terminal 13 is configured such that a path including the shunt resistor section 381 and a path including the shunt resistor 68 are connected in parallel. By appropriately setting the specifications such as the resistance value of the shunt resistor 68, it is possible to measure the current value under different conditions from the measurement of the current value using only the shunt resistor section 381.

[0080] 17, the wiring portion 3234 intersects with the narrow width portion 3182 when viewed along the z direction. Both the wiring portion 3234 and the narrow width portion 3182 are configured as portions having a narrow width. This makes it possible to reduce parasitic capacitance caused by the wiring portion 3234 and the narrow width portion 3182 overlapping each other. This makes it possible to further improve the operating characteristics of the power conversion device A2.

[0081] By arranging the external output terminal 16 on the opposite side in the x direction to the external output terminals 14 and 15, it is possible to prevent the wiring portion 3236 from overlapping with the relay pattern portion 317 and the fifth input pattern portion 318 when viewed along the z direction. Furthermore, by arranging the external output terminal 15 on one side in the y direction relative to the external output terminal 14, it is possible to prevent the wiring portion 3235 from overlapping with the fifth input pattern portion 318 when viewed along the z direction. These also make it possible to further improve the operating characteristics of the power conversion device A2.

[0082] The power conversion device according to the present disclosure is not limited to the above-described embodiment. The specific configuration of each part of the power conversion device according to the present disclosure can be freely designed in various ways.

[0083] [Appendix 1] a plurality of switching elements each having a gate electrode, a source electrode and a drain electrode; a plurality of gate driver ICs that individually drive and control the plurality of switching elements; a substrate on which the plurality of gate driver ICs are mounted; The substrate includes an insulating base material having a main surface and a back surface facing opposite to each other in a thickness direction, and a conductive portion supported by the base material, the conductive portion includes a main surface conductive layer disposed on the main surface and a back surface conductive layer disposed on the back surface, the main surface conductive layer includes a first connection portion which is a connection portion with a control signal output terminal of the gate driver IC, a second connection portion which is a connection portion with the gate electrode of the switching element, and a first wiring portion interposed between the first connection portion and the second connection portion; and one or more first electronic components mounted on the main surface side and constituting a circuit portion connecting the first connection portion and the second connection portion together with the first wiring portion. A power conversion device, wherein a conductive member penetrating the base material in the thickness direction is not connected to the first wiring portion. [Appendix 2] The power conversion device described in Appendix 1, wherein the conductive portion has a first intermediate conductive layer located between the main surface conductive layer and the back surface conductive layer in the thickness direction. [Appendix 3] The power conversion device described in Appendix 2, wherein a thickness of the first intermediate conductive layer is thinner than thicknesses of the main surface conductive layer and the back surface conductive layer. [Appendix 4] The power conversion device described in Appendix 2 or 3, wherein the distance between the main surface conductive layer and the first intermediate conductive layer is smaller than the thicknesses of the main surface conductive layer and the first intermediate conductive layer. [Appendix 5] A power conversion device described in any one of Appendix 2 to 4, wherein the conductive portion has a second intermediate conductive layer located between the first intermediate conductive layer and the back conductive layer in the thickness direction. [Appendix 6] The power conversion device described in Appendix 5, wherein a thickness of the second intermediate conductive layer is thinner than a thickness of the main surface conductive layer and the back surface conductive layer. [Appendix 7] The power conversion device described in Appendix 5 or 6, wherein a distance between the back conductive layer and the second intermediate conductive layer is smaller than a thickness of the back conductive layer and the second intermediate conductive layer. [Appendix 8] A power conversion device described in any of Appendix 5 to 7, wherein the distance between the first intermediate conductive layer and the second intermediate conductive layer is greater than the thicknesses of the main surface conductive layer, the back surface conductive layer, the first intermediate conductive layer, and the second intermediate conductive layer. [Appendix 9] 9. The power conversion device according to claim 5, wherein the first intermediate conductive layer includes a first ground pattern portion connected to a ground wiring. [Appendix 10] The power conversion device described in Appendix 9, wherein the second intermediate conductive layer includes a second ground pattern portion connected to a ground wiring. [Appendix 11] the second intermediate conductive layer includes a power supply pattern portion connected to a power supply wiring; 11. The power conversion device according to claim 10, wherein the power supply pattern portion overlaps with the first ground pattern portion when viewed along the thickness direction. [Appendix 12] the main surface conductive layer includes a third connection portion which is a connection portion with a Miller clamp terminal of the gate driver IC, and a second wiring portion interposed between the third connection portion and the second connection portion, and one or more second main surface electronic components mounted on the main surface and constituting a circuit portion connecting the third connection portion and the second connection portion together with the second wiring portion. 12. The power conversion device according to claim 5, wherein a conductive member penetrating the base material in the thickness direction is not connected to the second wiring portion. [Appendix 13] the back surface conductive layer includes a third wiring portion that is electrically connected to the second connection portion and a fourth wiring portion that is connected to a ground wiring; 13. The power conversion device according to any one of appendixes 5 to 12, further comprising one or more back-side electronic components mounted on the back side and electrically connected to the third wiring portion and the fourth wiring portion. [Appendix 14] the main surface conductive layer includes a first input pattern portion that is electrically connected to an external positive input terminal, the back surface conductive layer includes a second input pattern portion connected to an internal negative input terminal of an upper arm circuit and a lower arm circuit formed by the switching element, the first intermediate conductive layer includes a third input pattern portion, the second intermediate conductive layer includes a fourth input pattern portion, the first input pattern portion, the second input pattern portion, the third input pattern portion, and the fourth input pattern portion overlap one another when viewed along the thickness direction, 14. The power conversion device according to any one of claims 5 to 13, wherein the conductive portion has a through conductive portion that mutually connects the second input pattern portion, the third input pattern portion, and the fourth input pattern portion, and a shunt resistor portion that connects the first input pattern portion and the second input pattern portion. [Appendix 15] The conductive portion is A plurality of the through conductive parts; a through conductive member that penetrates the first input pattern portion, the second input pattern portion, the third input pattern portion, and the fourth input pattern portion to interconnect them, and a portion of which constitutes the shunt resistor portion. [Appendix 16] 16. The power conversion device according to claim 15, wherein the electrical resistance of the plurality of through conductive parts is smaller than the electrical resistance of the through conductive member. [Appendix 17] the gate driver IC has an analog power supply input terminal, a ground terminal, and a digital signal input terminal; The conductive portion is an analog ground wiring section connected to the ground terminal; a digital ground wiring section connected to the analog ground wiring section via a coil component; 17. A power conversion device according to any one of claims 1 to 16, comprising: [Appendix 18] 18. The power conversion device according to any one of claims 1 to 17, wherein the switching element is a SiC-MOSFET.

Claims

1. a plurality of switching elements each having a gate electrode, a source electrode and a drain electrode; a plurality of gate driver ICs that individually drive and control the plurality of switching elements; a substrate on which the plurality of gate driver ICs are mounted; The substrate includes an insulating base material having a main surface and a back surface facing opposite to each other in a thickness direction, and a conductive portion supported by the base material, the conductive portion includes a main surface conductive layer disposed on the main surface and a back surface conductive layer disposed on the back surface, the main surface conductive layer includes a first connection portion which is a connection portion with a control signal output terminal of the gate driver IC, a second connection portion which is a connection portion with the gate electrode of the switching element, and a first wiring portion interposed between the first connection portion and the second connection portion; one or more first electronic components mounted on the main surface side and constituting a circuit portion connecting the first connection portion and the second connection portion together with the first wiring portion, A power conversion device, wherein a conductive member penetrating the base material in the thickness direction is not connected to the first wiring portion.

2. The power conversion device according to claim 1 , wherein the conductive portion has a first intermediate conductive layer located between the main surface conductive layer and the back surface conductive layer in the thickness direction.

3. The power conversion device according to claim 2 , wherein a thickness of the first intermediate conductive layer is smaller than thicknesses of the main surface conductive layer and the back surface conductive layer.

4. The power conversion device according to claim 2 , wherein a distance between the main surface conductive layer and the first intermediate conductive layer is smaller than thicknesses of the main surface conductive layer and the first intermediate conductive layer.

5. 5 . The power conversion device according to claim 2 , wherein the conductive portion has a second intermediate conductive layer located between the first intermediate conductive layer and the back surface conductive layer in the thickness direction.

6. The power conversion device according to claim 5 , wherein a thickness of the second intermediate conductive layer is smaller than a thickness of the main surface conductive layer and a thickness of the back surface conductive layer.

7. The power conversion device according to claim 5 , wherein a distance between the back surface conductive layer and the second intermediate conductive layer is smaller than thicknesses of the back surface conductive layer and the second intermediate conductive layer.

8. A power conversion device as described in any one of claims 5 to 7, wherein the distance between the first intermediate conductive layer and the second intermediate conductive layer is greater than the thicknesses of the main surface conductive layer, the back surface conductive layer, the first intermediate conductive layer and the second intermediate conductive layer.

9. 9. The power converter according to claim 5, wherein the first intermediate conductive layer includes a first ground pattern portion connected to a ground wiring.

10. The power conversion device according to claim 9 , wherein the second intermediate conductive layer includes a second ground pattern portion connected to a ground wiring.

11. the second intermediate conductive layer includes a power supply pattern portion connected to a power supply wiring; The power conversion device according to claim 10 , wherein the power supply pattern portion overlaps with the first ground pattern portion when viewed along the thickness direction.

12. the main surface conductive layer includes a third connection portion which is a connection portion with a Miller clamp terminal of the gate driver IC, and a second wiring portion interposed between the third connection portion and the second connection portion, and one or more second main surface side electronic components mounted on the main surface side and constituting a circuit portion connecting the third connection portion and the second connection portion together with the second wiring portion, The power conversion device according to claim 5 , wherein a conductive member penetrating through the base material in the thickness direction is not connected to the second wiring portion.

13. the back surface conductive layer includes a third wiring portion that is electrically connected to the second connection portion and a fourth wiring portion that is connected to a ground wiring; The power conversion device according to claim 5 , further comprising one or more back-side electronic components mounted on the back surface side and electrically connected to the third wiring portion and the fourth wiring portion.

14. the main surface conductive layer includes a first input pattern portion that is electrically connected to an external positive input terminal, the back surface conductive layer includes a second input pattern portion connected to an internal negative input terminal of an upper arm circuit and a lower arm circuit formed by the switching element, the first intermediate conductive layer includes a third input pattern portion, the second intermediate conductive layer includes a fourth input pattern portion, the first input pattern portion, the second input pattern portion, the third input pattern portion, and the fourth input pattern portion overlap one another when viewed along the thickness direction, 14. The power conversion device according to claim 5, wherein the conductive portion has a through conductive portion that mutually conducts the second input pattern portion, the third input pattern portion, and the fourth input pattern portion, and a shunt resistor portion that conducts electricity between the first input pattern portion and the second input pattern portion.

15. The conductive portion is A plurality of the through conductive parts; 15. The power conversion device according to claim 14, further comprising: a through conductive member that penetrates the first input pattern portion, the second input pattern portion, the third input pattern portion, and the fourth input pattern portion to interconnect them, and a portion of which constitutes the shunt resistor portion.

16. The power conversion device according to claim 15 , wherein an electrical resistance of the plurality of penetrating conductive parts is smaller than an electrical resistance of the penetrating conductive member.

17. the gate driver IC has an analog power supply input terminal, a ground terminal, and a digital signal input terminal; The conductive portion is an analog ground wiring section connected to the ground terminal; a digital ground wiring section connected to the analog ground wiring section via a coil component; 17. The power converter according to claim 1, further comprising:

18. The power conversion device according to any one of claims 1 to 17, wherein the switching element is a SiC-MOSFET.

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