Transfer device and transfer method

Abstract

To provide a transfer device and a transfer method, capable of improving the precision level of transfer process by dropping a chip in a correct position, and also capable of separately driving a stage supporting a substrate to be transferred and a stage supporting a transfer substrate, respectively, thereby achieving a reduction in process time.SOLUTION: A transfer device for transferring a chip given to a transfer substrate onto a substrate to be transferred includes: a first stage capable of supporting the substrate to be transferred; a second stage capable of supporting the transfer substrate so as to face and separate from the substrate to be transferred; a laser irradiation part arranged such that at least a part thereof is apart from the second stage in a direction where the transfer substrate and the substrate to be transferred face each other so that the transfer substrate can be irradiated with a laser beam; and a move part supporting the laser irradiation part and capable of moving the laser irradiation part in the state of emitting a laser beam.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a transfer device and a transfer method, and more particularly to a transfer device and a transfer method capable of dropping a chip at an accurate position to improve the precision of a transfer process. [Background technology]

[0002] Generally, a micro light emitting diode (LED) is a light emitting diode with a side size of 100 μm or less. Because of its small size, the micro light emitting diode generates less heat and consumes less power than a general light emitting diode, and is also highly energy efficient.

[0003] In order to apply this type of micro LED to a display device, a technology is used to transfer a chip with a micro LED to each pixel of a substrate for a display panel. The transfer is a process in which a chip formed on a wafer is irradiated with a laser beam and dropped onto the glass below the wafer.

[0004] However, it is difficult to align the wafer and the glass, and there is a risk of misalignment between the wafer and the glass during the transfer process, which can lead to the chip being transferred to an incorrect position and causing defects. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Korean Patent Publication No. 2019-0079147 Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention provides an imprinting apparatus and an imprinting method that can drop a chip at a precise position to improve the precision of the imprinting process.

[0007] The present invention provides a transfer apparatus and a transfer method capable of shortening process time by separately driving a stage supporting a transfer substrate and a stage supporting a transfer substrate. [Means for solving the problem]

[0008] The transfer apparatus of the present invention is a transfer apparatus that transfers a chip provided on a transfer substrate to a transferee substrate, and includes a first stage capable of supporting the transferee substrate, a second stage capable of supporting the transfer substrate so as to face away from the transferee substrate, a laser irradiation unit that is arranged at least a portion of which is separated from the second stage in a direction in which the transfer substrate and the transferee substrate face each other so that a laser beam can be irradiated onto the transfer substrate, and a moving unit that supports the laser irradiation unit and can move the laser irradiation unit in a state in which it is irradiating a laser beam.

[0009] The moving section includes a path member extending in a direction intersecting the direction in which the transfer substrate and the transferred substrate face each other, and a moving member connected to the laser irradiation section and arranged so as to be freely movable in a straight line along the extension direction of the path member.

[0010] The transfer device further includes a first drive unit that supports the first stage and can move the first stage in a plurality of directions, and a second drive unit that supports the second stage and can move the second stage along a plurality of directions separately from the first stage.

[0011] The laser irradiation unit includes a laser generator capable of generating a laser beam, an angle adjuster disposed between the laser generator and the second stage and capable of adjusting the direction in which the laser beam is irradiated, a shape adjuster disposed between the laser generator and the angle adjuster and capable of adjusting the shape of the laser beam irradiated to the transfer substrate, and a housing movable by the moving unit while supporting the laser generator, the angle adjuster and the shape adjuster.

[0012] The shape adjuster includes a mask member having a plurality of pattern holes, and a selection member that supports the mask member and can move the mask member in a plurality of directions so as to select a pattern hole through which the laser beam should pass among the plurality of pattern holes.

[0013] The transfer device further includes an alignment hole provided in the mask member, and an imaging unit arranged to image the shape and position at which the laser beam passing through the alignment hole is irradiated onto at least one of the transfer substrate and the transferred substrate, and an alignment unit connected to the imaging unit and configured to adjust the alignment between the transfer substrate and the transferred substrate in accordance with the shape and position at which the laser beam passing through the alignment hole is irradiated.

[0014] The second stage can move in and out of the space between the laser irradiation unit and the first stage, and the alignment unit can adjust the alignment of the transferred substrate after adjusting the alignment of the transferred substrate.

[0015] The area of ​​the transferred substrate is formed to be larger than the area of ​​the transfer substrate, A portion of the laser beam passing through the alignment hole can be irradiated onto the transfer substrate, and another portion can pass through a second stage and be irradiated onto the transfer substrate.

[0016] The transfer method of the present invention includes the steps of supporting a transferee substrate on a first stage, supporting a transfer substrate having a chip provided thereon on a second stage and positioning it facing the transferee substrate, irradiating the transfer substrate with a laser beam while moving a laser irradiation unit that irradiates the laser beam, and dropping the chip provided on the transfer substrate by the laser beam to transfer it to the transferee substrate.

[0017] The chips are arranged in multiple numbers in an array on the transfer substrate, and the step of irradiating a laser beam while moving the laser irradiation unit includes a step of generating a laser beam and a step of moving the laser irradiation unit linearly along one direction.

[0018] The step of linearly moving the laser irradiation unit includes the step of irradiating the transfer substrate with a laser beam in accordance with the time at which the laser beam moving along one direction reaches each of the chips spaced apart in the one direction.

[0019] the step of supporting the transferred substrate on the first stage includes the steps of irradiating the transferred substrate with an alignment laser, and adjusting the alignment of the transferred substrate by moving the first stage in accordance with at least one of a shape and a position to be irradiated with the alignment laser; The step of supporting the transfer substrate having a chip attached thereto on the second stage includes the steps of irradiating the transfer substrate with an alignment laser, and moving the second stage in accordance with at least one of the shape and the position where the alignment laser is irradiated to adjust the alignment of the transfer substrate.

[0020] The step of adjusting the alignment according to the shape irradiated by the aligning laser includes a step of adjusting the horizontal alignment of the transfer substrate or the transferred substrate so that the shape of the aligning laser is not displayed distortedly on the transfer substrate or the transferred substrate.

[0021] A mark is formed on the transfer substrate and the transfer substrate, The procedure for adjusting the alignment condition according to the position where the aligning laser is irradiated includes: The method includes a step of adjusting the alignment on the plane of the transfer substrate or the transfer substrate so that the mark corresponds to the position where the aligning laser is irradiated.

[0022] the step of supporting the transfer substrate on which the chip is attached on the second stage includes the step of moving the second stage between the laser irradiation unit and the first stage; The procedure of adjusting the alignment of the transferred substrate is performed before the second stage is moved to a position between the laser irradiation unit and the first stage.

[0023] The step of irradiating the alignment laser includes the steps of generating a plurality of alignment lasers, and irradiating some of the plurality of alignment lasers onto the transfer substrate and the other part of the alignment lasers onto the transfer substrate by passing them through a second stage. Effect of the Invention

[0024] According to an embodiment of the present invention, during the transfer process, the irradiation position of the laser beam can be finely adjusted to drop the chip accurately at a preset position, thereby improving the precision of the transfer process and improving the quality of the product manufactured by the process.

[0025] Furthermore, according to the embodiment of the present invention, the stage supporting the transferred substrate and the stage supporting the transfer substrate can be driven separately, which shortens the time required to transport the transferred substrate and the transfer substrate to the position where the transfer process is performed, thereby improving the efficiency of the process. [Brief description of the drawings]

[0026] [Figure 1] FIG. 2 is a perspective view showing a transfer device according to an embodiment of the present invention. [Diagram 2]FIG. 2 is a perspective view showing the structure of a first stage and a first drive unit according to the embodiment of the present invention. [Diagram 3] FIG. 4 is a perspective view showing the structure of a second stage and a second drive unit according to the embodiment of the present invention. [Figure 4] 2 is a cross-sectional view showing a structure of a laser irradiation unit according to the embodiment of the present invention. FIG. [Diagram 5] FIG. 4 is a perspective view showing a structure of a shape adjusting part according to an embodiment of the present invention. [Figure 6] 1A and 1B are diagrams showing a structure for aligning a transfer substrate according to an embodiment of the present invention; [Figure 7] 3A and 3B are diagrams illustrating the structure of a laser irradiation unit and a moving unit according to the embodiment of the present invention. [Figure 8] 4 is a flowchart illustrating a transfer method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Hereinafter, the embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. These embodiments are provided merely to complete the disclosure of the present invention and to fully inform those skilled in the art of the scope of the invention. In describing the present invention, the same reference numerals are used for the same components, and the drawings may be partially exaggerated in size to accurately describe the embodiments of the present invention, and the same numerals in the drawings indicate the same components.

[0028] Fig. 1 is a perspective view showing a transfer device according to an embodiment of the present invention, Fig. 2 is a perspective view showing a structure of a first stage and a first drive unit according to an embodiment of the present invention, and Fig. 3 is a perspective view showing a structure of a second stage and a second drive unit according to an embodiment of the present invention. The transfer device according to the embodiment of the present invention will be described below.

[0029] 1 to 3, a transfer apparatus according to an embodiment of the present invention is a transfer apparatus that transfers a chip attached to a transfer substrate to a transferee substrate. The transfer apparatus 100 includes a first stage 110, a second stage 120, a laser irradiation unit 130, and a moving unit 140.

[0030] In this case, the chips may be micro light emitting diodes (LEDs). The transfer substrate W may be a wafer on which a plurality of chips are arranged and attached in an array. The chips may be directly formed on the transfer substrate W, or chips formed on another substrate may be attached to the transfer substrate W. This makes it possible to provide the chips on the transfer substrate W. The transferred substrate G may be glass. However, the materials of the transfer substrate W and the transferred substrate G are not limited to these and can be changed in various ways.

[0031] 2, the first stage 110 serves to support the transferred substrate G. For example, the first stage 110 may be formed in a square plate shape. This allows the transferred substrate G to be placed on and supported by the upper surface of the first stage 110.

[0032] Also, the area of ​​the upper surface of the first stage 110 may be formed to be larger than the area of ​​the lower surface of the transferred substrate G. This allows the entire lower surface of the transferred substrate G to be stably placed in contact with the upper surface of the first stage G. However, the structure and shape of the first stage 110 are not limited thereto and can be modified in various ways.

[0033] 3, the second stage 120 serves to support the transfer substrate W. The second stage 120 may be disposed above the first stage 110 and away from the first stage 110 so as to face the first stage 110. Therefore, when the transfer substrate W is supported on the second stage 120, the transfer substrate W can face the transferred substrate G placed on the first stage 110 at a distance in the vertical direction. This makes it possible to dispose the upper surface of the transferred substrate G and the lower surface of the transfer substrate W so as to face each other.

[0034] Furthermore, the second stage 120 may be formed in a square plate shape. An opening may be provided in the center of the second stage 120. The area of ​​the second stage 120 may be formed to be larger than the area of ​​the transfer substrate W, and the area of ​​the opening may be formed to be smaller than the area of ​​the transfer substrate W. Therefore, the transfer substrate W can touch the second stage 120 without passing through the opening.

[0035] At this time, a suction device (not shown) may be provided under the second stage 120. The suction device may be disposed so as to enclose at least a portion of the periphery of the opening. The transfer substrate W may be supported by being sucked to the lower part of the second stage 120 by the suction device, and a portion of the upper surface of the transfer substrate W may be exposed to the outside through the opening of the second stage 120. Therefore, the laser irradiation unit 130 disposed above the second stage 120 can irradiate the upper surface of the transfer substrate W with a laser beam through the opening. However, the shape of the second stage 120 and the method of supporting the transfer substrate W are not limited to this at all and can be changed in various ways.

[0036] Meanwhile, the transfer device 100 may further include a first driving unit 150 and a second driving unit 160. The first driving unit 150 and the second driving unit 160 allow the first stage 110 and the second stage 120 to move separately from each other.

[0037] 2, the first driving unit 150 may be connected to the first stage 110. The first driving unit 150 supports the first stage 110 and can move the first stage 110 in a plurality of directions. The first driving unit 150 may include a first front-rear rail 151, a first front-rear driving member 152, a first left-right rail 153, a first left-right driving member 154, a first up-down driving member 155, and a first rotating member (not shown).

[0038] The first front-rear rail 151 may extend in the front-rear direction. The first front-rear rail 151 forms a path along which the first front-rear drive member 152 moves. The first front-rear rail 151 may be provided in a pair and separated from each other in the left-right direction.

[0039] The first front-rear drive member 152 may be arranged so as to be movable on the first front-rear rail 151. The first front-rear drive member 152 can move in the front-rear direction along the extension direction of the first front-rear rail 151. The first front-rear drive member 152 may be arranged in a pair and arranged so as to be freely movable on each of the pair of first front-rear rails 151. Therefore, the first left-right rail 153 can be arranged on the pair of first front-rear drive members 152 and stably supported.

[0040] The first left-right rail 153 may extend in a left-right direction intersecting with the extension direction of the first front-rear direction. The first left-right rail 153 forms a path along which the first left-right driving member 154 moves. The first left-right rail 153 may be disposed on and supported by the first front-rear driving member 152. For example, the extension length of the first left-right rail 153 in the left-right direction may be equal to or greater than the length by which the first front-rear driving member 152 separates. This allows each of the two ends of the first left-right rail 153 to be supported by the first front-rear driving member 152. Therefore, if the first front-rear driving member 152 moves in the front-rear direction, the first left-right rail 153 can also move forward and backward.

[0041] The first left-right driving member 154 may be disposed so as to be movable on the first left-right rail 153. The first left-right driving member 154 can move left and right along the extension direction of the first left-right rail 153. Since the first left-right driving member 154 is supported by the first left-right rail 153, when the first left-right rail 153 moves forward and backward by the first front-back driving member 152, the first left-right driving member 154 can also move forward and backward.

[0042] The first vertical driving member 155 may be disposed on the first horizontal driving member 154. The first vertical driving member 155 may have a lower end connected to the first horizontal driving member 154 and an upper end connected to the first stage 110. At least a portion of the first vertical driving member 155 can expand and contract vertically. Therefore, the first stage 110 can move up and down by operating the first vertical driving member 155.

[0043] Also, a plurality of first vertical driving members 155 may be provided. The first vertical driving members 155 may be connected to different portions of the lower part of the first stage 110. Therefore, if the heights of the first vertical driving members 155 are adjusted to be different from each other, the gradient of the first stage 110 can be adjusted.

[0044] At this time, since the first vertical driving member 155 is supported by the first horizontal driving member 154, when the first horizontal driving member 154 moves left and right, the first vertical driving member 155 and the first stage 110 can also move left and right together. When the first horizontal driving member 154 moves forward and backward by the first front-rear driving member 152, the first vertical driving member 155 and the first stage 110 can also move forward and backward together. Therefore, the position of the transferred substrate G placed on the first stage 110 can be adjusted in a plurality of directions.

[0045] The first rotating member may be disposed on the first vertical driving member 155. The first rotating member can rotate the first vertical driving member 155. Therefore, when the first rotating member rotates the first vertical driving member 155, the first stage 110 can rotate. Therefore, the transferred substrate G placed on the first stage 110 can also rotate together. However, the structure in which the components of the first driving unit 150 operate and the method of connecting them to each other are not limited to this at all and can be changed in various ways.

[0046] 3, the second driving unit 160 may be connected to the second stage 120. The second driving unit 160 supports the second stage 120 and can move the second stage 120 along a plurality of directions separately from the first stage 110. The second driving unit 160 may include a second front-rear rail 161, a second front-rear driving member 162, a second left-right rail 163, a second left-right driving member (not shown), a second up-down driving member (not shown), and a second rotating member (not shown).

[0047] The second front-rear rail 161 may extend in the front-rear direction. The second front-rear rail 161 forms a path along which the second front-rear drive member 162 moves. The second front-rear rails 161 may be arranged in a pair and spaced apart from each other in the left-right direction. For example, the distance between the pair of second front-rear rails 161 may be greater than the distance between the pair of first front-rear rails 151. Thus, the first front-rear rail 151 can be located between the second front-rear rails 161.

[0048] In this case, the upper surface of the second front-rear rail 161 may be located higher than the upper surface of the first front-rear rail 151. Therefore, the second front-rear rail 161 allows the second stage 120 to be located higher than the first stage 110. However, the structure of the second front-rear rail 161 is not limited to this and can be modified in various ways.

[0049] The second front-rear drive member 162 may be arranged so as to be movable on the second front-rear rail 161. The second front-rear drive member 162 can move in the front-rear direction along the extension direction of the second front-rear rail 161. The second front-rear drive member 162 may be arranged in a pair and arranged so as to be freely movable on each of the pair of second front-rear rails 161. Therefore, the second left-right rail 163 can be arranged on the pair of second front-rear drive members 162 and stably supported.

[0050] The second left-right rail 163 may extend in a left-right direction intersecting with the extension direction of the second front-rear direction. The second left-right rail 163 forms a path along which the second left-right driving member moves. The second left-right rail 163 may be disposed on and supported by the second front-rear driving member 162. For example, the extension length of the second left-right rail 163 in the left-right direction may be equal to or greater than the distance between the second front-rear driving members 162. Therefore, each of the two ends of the second left-right rail 163 can be supported by the second front-rear driving member 162. Therefore, if the second front-rear driving member 162 moves in the front-rear direction, the second left-right rail 163 can also move forward and backward.

[0051] Furthermore, a hole may be formed in the center of the second left and right rails 163. This allows the transfer substrate W adsorbed to the second stage 120 to be positioned so as to directly face the transferred substrate G below through the hole formed in the second left and right rails 163. However, the structure and shape of the second left and right rails 163 are not limited to this at all and can be modified in various ways.

[0052] The second left-right driving member may be disposed so as to be movable on the second left-right rail 163. The second left-right driving member can move left and right along the extension direction of the second left-right rail 163. Since the second left-right driving member is supported by the second left-right rail 163, when the second left-right rail 163 moves forward and backward by the second front-rear driving member 162, the second left-right driving member can also move forward and backward.

[0053] Furthermore, a hole may be formed in the center of the second horizontal driving member. This allows the transfer substrate W adsorbed to the second stage 120 to be disposed so as to directly face the lower transferred substrate G through the hole formed in the second horizontal driving member. However, the structure and shape of the second horizontal driving member are not limited to this and can be modified in various ways.

[0054] The second vertical driving member may be disposed between the second left-right driving member and the second stage 120. The second vertical driving member may have a lower end connected to an upper surface of the second left-right driving member and an upper end connected to a lower surface of the second stage 120. At least a portion of the second vertical driving member can expand and contract vertically. Therefore, the second stage 120 can move up and down by operating the second vertical driving member.

[0055] Also, a plurality of second vertical driving members may be provided, and the second vertical driving members may be connected to different portions of the lower part of the second stage 120, respectively. Therefore, if the heights of the second vertical driving members are adjusted to be different from each other, the gradient of the second stage 120 can be adjusted.

[0056] At this time, since the second vertical driving member is supported by the second horizontal driving member, when the second horizontal driving member moves left and right, the second vertical driving member and the second stage 120 can also move left and right together. When the second horizontal driving member moves forward and backward by the second front-rear driving member 162, the second vertical driving member and the second stage 120 can also move forward and backward together. Therefore, the position of the transfer substrate W adsorbed to the second stage 120 can be adjusted in a plurality of directions.

[0057] The second rotating member may be disposed on the second vertical driving member. The second rotating member can rotate the second vertical driving member. Therefore, when the second rotating member rotates the second vertical driving member, the second stage 120 can rotate. Therefore, the transfer substrate W adsorbed to the second stage 120 can also rotate together. However, the structure in which the components of the second driving unit 160 operate and the method of connecting them to each other are not limited to this at all and can be variously changed.

[0058] In this way, the first stage 110 and the second stage 120 can move separately. Therefore, when the operation of making the first stage 110 support the transferred substrate W and the operation of making the second stage 120 support the transfer substrate W are performed, the first stage 110 and the second stage 120 can move separately. This shortens the time required to transport the transferred substrate G and the transfer substrate W to the process position, thereby improving the efficiency of the process.

[0059] Furthermore, since the first stage 110 and the second stage 120 move separately, it is possible to separately adjust the alignment of the transfer substrate W and the transferred substrate G. Therefore, if the alignment of at least one of the transfer substrate W and the transferred substrate G is poor, it is possible to easily adjust the alignment by the amount of the poor alignment.

[0060] Fig. 4 is a cross-sectional view showing the structure of a laser irradiation unit according to an embodiment of the present invention, Fig. 5 is a perspective view showing the structure of a shape control unit according to an embodiment of the present invention, and Fig. 6 is a diagram showing a structure for aligning a transfer substrate according to an embodiment of the present invention. The laser irradiation unit according to an embodiment of the present invention will be described in detail below.

[0061] 4, the laser irradiation unit 130 may be disposed at least partially above the second stage 120 in a direction in which the transferred substrate G and the transfer substrate W face each other (or in the vertical direction). Therefore, the position of the laser irradiation unit 130 can be adjusted separately from the first stage 110 or the second stage 120, and the laser irradiation unit 130 can irradiate a laser beam to the transfer substrate W supported by the second stage 120. The laser irradiation unit 130 includes a laser generator 131, an angle adjuster 132, a shape adjuster 133, and a housing 134.

[0062] The laser generator 131 serves to generate a laser beam. When the laser generator 131 generates a laser beam, the laser beam can be shaped into a line beam extending in the left-right direction using an optical element (not shown).

[0063] The angle adjuster 132 may be disposed between the laser generator 131 and the second stage 120. The angle adjuster 132 may be a mirror that reflects the laser beam. That is, the angle adjuster 132 can adjust the direction in which the laser beam is irradiated. This allows the laser beam moving in the forward and backward directions inside the housing 134 to be reflected by the angle adjuster 132 and irradiated downward. This allows the laser beam to be irradiated to the second stage 120 side below the laser irradiation unit 130.

[0064] The shape adjuster 133 may be disposed between the laser generator 131 and the angle adjuster 132. Therefore, the shape adjuster 133 allows the line-shaped laser beam moving from the laser generator 131 to the angle adjuster 132 to pass through the shape adjuster 133. Therefore, the shape of the line-shaped laser beam passing through the shape adjuster 133 can be adjusted and irradiated onto the transfer substrate W. The shape adjuster 133 may be provided with a mask member 133a and a selection member 133b as shown in FIG.

[0065] The mask member 133a may be formed in a plate shape and may have a plurality of pattern holes h1 through which the laser beam can pass. A part of the laser beam that moves from the laser generator 131 to the mask member 133a passes through the pattern hole h1, and another part may not pass through the mask member 133a. Therefore, the shape of the laser beam irradiated to the transfer substrate W can have a pattern following the shape of the pattern hole h1. Therefore, the line-shaped laser beam can be irradiated to the transfer substrate W in a plurality of dots separated from each other in the left-right direction by the mask member 133a.

[0066] At this time, the pattern holes h1 may have different shapes and sizes depending on the position. For example, pattern holes h1 of the same shape may be arranged apart in the left-right direction to form a line, or lines having pattern holes h1 of different shapes and sizes may be arranged apart in the up-down direction. Therefore, a line beam-like laser beam extending in the left-right direction can pass through one of the lines of the mask member 133a. Therefore, the shape and size of the laser beam irradiated to the transfer substrate W can be determined according to the shape and size of the pattern holes h1 in the line of the mask member 133a.

[0067] On the other hand, the mask member 133a may further include an alignment hole h2. The alignment holes h2 may be provided in multiple numbers. The pattern hole h1 may be disposed in the center of the mask member 133a, and the alignment holes h2 may be disposed in multiple numbers and disposed in an outer portion that envelops the center of the mask member 133a. The alignment hole h2 may be formed in a cross shape. Therefore, the laser beam passing through the alignment hole h2 can be displayed as an alignment laser in a cross shape on the surface of the transfer substrate W or the transferee substrate G. Therefore, the alignment between the transfer substrate W and the transferee substrate G can be adjusted by using the shape or position where the alignment laser is displayed as a guide. However, the shape of the alignment hole h2 is not limited to this and can be changed in various ways.

[0068] The selection member 133b may support the mask member 133a. The selection member 133b may move the mask member 133a in multiple directions so that a line of the mask member 133a through which the laser beam should pass can be selected from among the multiple pattern holes h1. The selection member 133b may select the pattern hole h1 through which the laser beam should pass in accordance with the shape, size, or left-right arrangement of the chip attached to the transfer substrate W.

[0069] For example, the selection member 133b may include a front-rear drive body, a left-right drive body, an up-down drive body, and a rotation drive body. Therefore, the selection member 133b can adjust the up-down direction, front-rear direction, left-right direction, gradient, etc. of the mask member 133a. If the position of the mask member 133a is adjusted, the pattern hole h1 of the line through which the laser beam should pass is selected, and the shape or size of the laser beam can be selected.

[0070] The housing 134 has an internal space in which the laser generator 131, the angle adjuster 132, and the shape adjuster 133 are housed and supported. The housing 134 is connected to the moving part 140, and can be moved as a whole by the moving part 140. Therefore, when the housing 134 moves, the laser generator 131, the angle adjuster 132, and the shape adjuster 133 can all move together.

[0071] Furthermore, the housing 134 may be disposed above the second stage 120. The housing 134 may extend in the front-rear direction. The laser generator 131, the shape adjuster 133, and the angle adjuster 132 may be spaced apart in the front-rear direction inside the housing 134. Therefore, the laser beam generated by the laser generator 131 can move in the front-rear direction inside the housing 134.

[0072] In this case, an opening may be formed in a portion of the housing 134 facing the second stage 120. This allows the laser beam reflected by the angle adjuster 132 to be irradiated onto the second stage 120 side through the opening. However, the structure and shape of the housing 134 are not limited to this at all and can be modified in various ways.

[0073] 6, the transfer device 100 may further include an imaging unit 180 and an alignment unit 190. Using the imaging unit 180 and the alignment unit 190, an operation of adjusting the alignment between the transfer substrate W and the transferred substrate G can be performed.

[0074] The photographing unit 180 may be a camera. The photographing unit 180 may be located above the second stage 120. Therefore, the photographing unit 180 can photograph the laser beam irradiated onto the surface of the transfer substrate G or the transferred substrate W. Therefore, the photographing unit 180 can confirm the position and shape of the laser beam irradiated onto the transfer substrate G or the transferred substrate W.

[0075] The aligning unit 190 is connected to the photographing unit 180. The aligning unit 190 can adjust the alignment between the transfer substrate W and the transferred substrate G according to the shape and position at which the laser beam passing through the aligning hole h2 is irradiated onto the transfer substrate W or the transferred substrate G.

[0076] For example, when adjusting the alignment condition according to the shape of the aligning laser irradiation, the shape of the aligning laser irradiation may be checked. Therefore, if the cross-shaped aligning laser shape is distorted, it can be determined that the horizontality of the transfer substrate W or the transferee substrate G is poor. Therefore, the horizontality of the first stage 110 or the second stage 120 can be adjusted to adjust the horizontal alignment condition of the transferee substrate G or the transfer substrate W so that the aligning laser shape is not displayed distorted.

[0077] On the other hand, when adjusting the degree of alignment according to the position where the aligning laser is irradiated, the position where the aligning laser is irradiated may be checked. A mark corresponding to the shape of the aligning laser may be formed on the transfer substrate W and the transferred substrate G. Therefore, if the position of the aligning laser and the position of the mark do not correspond to each other (or are not aligned), it can be determined that the degree of alignment of the transfer substrate W or the transferred substrate G on the XY plane is poor. Therefore, the first stage 110 or the second stage 120 can be moved in the front-back and left-right directions to adjust the degree of alignment on the plane of the transfer substrate W or the transferred substrate G so that the mark corresponds to (or is aligned with) the position where the aligning laser is irradiated.

[0078] At this time, the second stage 120 can also be moved in and out of the space between the laser irradiation unit 130 and the first stage 110 by the second driving unit 160. If the second stage 120 is located between the laser irradiation unit 130 and the first stage 110, there is a risk that the aligning laser will not be able to irradiate the transferred substrate G on the first stage 110. Therefore, the aligning unit 190 can adjust the alignment of the transferred substrate G in a state in which the second stage 120 is moved outside the space between the laser irradiation unit 130 and the first stage 110, and then move the second stage 120 between the laser irradiation unit 130 and the first stage 110 to adjust the alignment of the transfer substrate W.

[0079] Alternatively, the area of ​​the transferred substrate G may be formed larger than the area of ​​the transfer substrate W. A transmission window (not shown) may be formed in the second stage 120 so that the aligning laser can pass through. The transmission window may be arranged so as to enclose at least a part of the outer periphery of the transfer substrate W. This allows some of the multiple aligning lasers to be irradiated onto the transfer substrate W, and the other parts to pass through the second stage 120 and be irradiated onto the transferred substrate G. This allows the alignment between the transfer substrate W and the transferred substrate G to be adjusted simultaneously.

[0080] 7 is a diagram showing the structure of a laser irradiation unit and a moving unit according to an embodiment of the present invention. The moving unit according to the embodiment of the present invention will be described in detail below.

[0081] 4 and 7, the moving unit 140 may support the laser irradiation unit 130. The moving unit 140 may move the laser irradiation unit 130 in a state of irradiating the laser beam to adjust the position where the laser beam is irradiated. Therefore, in a state where the first stage 110 and the second stage 120 are stopped, the positions of the transfer substrate W and the transferred substrate G can be fixed, and the moving unit 140 can move the laser irradiation unit 130 to scan the transfer substrate W with the laser beam. The moving unit 140 includes a path member 141 and a moving member 142.

[0082] The path member 141 may extend in a direction (or a front-rear direction) intersecting with the direction (or the up-down direction) in which the transfer substrate W and the transferred substrate G face each other. The path member 141 forms a path along which the moving member 142 moves. The path members 141 may be arranged in a pair and separated from each other in the left-right direction.

[0083] In this case, the moving unit 140 may further include a support member 143. The support member 143 may be spaced above the second stage 120. The path member 141 may be disposed on the support member 143. An opening may be formed in a portion of the support member 143 facing the second stage 120. Therefore, the laser beam generated in the laser irradiation unit 130 can be irradiated onto the transfer substrate W through the opening formed in the support member 143.

[0084] The moving member 142 may be connected to the housing 134 of the laser irradiation unit 130 to support the laser irradiation unit 130. The moving member 142 may be disposed on the path member 141 so as to be linearly movable in the extension direction of the path member 141 (or the front-rear direction). Therefore, if the moving member 142 moves in the front-rear direction, the laser irradiation unit 130 supported by the moving member 142 can also move linearly in the front-rear direction. Therefore, the position where the laser beam is irradiated can be adjusted in the front-rear direction by moving the laser irradiation unit 130 without adjusting the positions of the first stage 110 and the second stage 120.

[0085] Furthermore, the moving member 142 may float and move above the path member 141. For example, the moving member 142 may float above the path member 141 by an air bearing system or a magnetic levitation system. Therefore, when the moving member 142 moves above the path member 141, friction can be prevented from occurring, and the moving member 142 can be accurately moved to a desired position, so that the position at which the laser irradiation unit 130 irradiates the laser beam on the transfer substrate W can be accurately adjusted.

[0086] In this way, since the first stage 110 and the second stage 120 are fixed, the accuracy of the transfer process is improved compared to when the stage is moved to adjust the position where the laser beam is irradiated. That is, if the stage is moved, when the chip falls from the transfer substrate W, the position of the transferred substrate G facing the transfer substrate W may change, causing the chip to move out of its fixed position and fall in another position. If the first stage 110 and the second stage 120 are fixed, the positions of the transfer substrate W and the transferred substrate G do not change, so the chip can be accurately dropped in the desired position.

[0087] Furthermore, since the moving unit 140 moves the entire laser irradiation unit 130, the same light quantity and focusing can be maintained even if the irradiation position of the laser beam on the transfer substrate W changes. This prevents the conditions of the laser beam irradiated on the transfer substrate W from differing from region to region, thereby improving the precision of the process.

[0088] 8 is a flowchart showing a transfer method according to an embodiment of the present invention. The transfer method according to the embodiment of the present invention will be described below.

[0089] The transfer method according to the embodiment of the present invention is a method of transferring a chip provided on a transfer substrate to a transferee substrate. Referring to Fig. 8, the transfer method includes a procedure (S110) of supporting the transferee substrate on a first stage, a procedure (S120) of supporting the transfer substrate on which the chip is attached on a second stage and positioning it so as to face the transferee substrate, a procedure (S130) of irradiating the transfer substrate with a laser beam while moving a laser irradiation unit that irradiates the laser beam, and a procedure (S140) of dropping the chip attached to the transfer substrate with the laser beam and transferring it to the transferee substrate.

[0090] 1 to 7, first, an operation may be performed to adjust the alignment of the laser beam irradiated by the laser irradiation unit 130. A reference substrate (not shown) may be prepared in advance below the laser irradiation unit 130. After the reference substrate is irradiated with the laser beam and the shape and position of the laser beam are confirmed, the operation of any one of the laser generator 131, shape adjuster 133, and angle adjuster 132 may be controlled to adjust the light amount of the laser beam and perform operations such as focusing.

[0091] Next, the transferred substrate G may be supported on the first stage 110. That is, the operation of the first driving unit 150 may be controlled to move the first stage 110 to a position to which the transferred substrate G is to be carried, and the transferred substrate G may be placed on the first stage 110.

[0092] At this time, the alignment of the transferred substrate G may be adjusted primarily. For example, the peripheral area of ​​the transferred substrate G may be photographed, and it may be visually confirmed whether the transferred substrate G is misaligned on the first stage 110. If it is determined that the position of the transferred substrate G is misaligned from the fixed position, the placement position of the transferred substrate G on the first stage 110 on the XY plane may be adjusted.

[0093] When the transferred substrate G is placed on the first stage 110, the operation of the first driving unit 150 may be controlled to move the first stage 110 to the lower side (or to the process position) of the laser irradiation unit 130. Therefore, the transferred substrate G placed on the first stage 110 can be positioned to face the laser irradiation unit 130.

[0094] At this time, the degree of alignment of the transferred substrate G may be secondarily adjusted. For example, an aligning laser may be irradiated onto the transferred substrate G. Then, the first stage 110 may be moved according to at least one of the shape and the position where the aligning laser is irradiated onto the transferred substrate G by the imaging unit 180, thereby accurately adjusting the degree of alignment of the transferred substrate G.

[0095] When adjusting the alignment condition according to the shape of the align laser irradiation, the shape of the align laser irradiation on the transfer substrate G may be checked. Therefore, if the cross-shaped align laser shape is distorted, it can be determined that the horizontality of the transfer substrate G is poor. Therefore, the horizontality of the first stage 110 can be adjusted to adjust the horizontal alignment of the transfer substrate G so that the align laser shape is not displayed distorted.

[0096] At this time, if the shape of the alignment hole h2 is cross-shaped, it is easy to check the horizontal alignment of the transferred substrate G. That is, if the transferred substrate G is misaligned (if the transferred substrate G is tilted), it is easy to check that the shape of the align laser displayed on the surface of the transferred substrate G is distorted. Conversely, if the shape of the align laser is displayed normally, it is easy to determine that the horizontality of the transferred substrate G is normal.

[0097] When adjusting the degree of alignment according to the position where the align laser is irradiated, the position where the align laser is irradiated on the transferred substrate G may be checked. A mark corresponding to the shape of the align laser may be formed on the transferred substrate G. Therefore, if the position of the align laser and the position of the mark do not correspond to each other (or do not match), it can be determined that the degree of alignment of the transferred substrate G on the XY plane is poor. Therefore, the degree of alignment on the plane of the transferred substrate G can be adjusted by moving the first stage 110 in the forward / backward and left / right directions so that the mark corresponds to (or matches) the position where the align laser is irradiated.

[0098] Next, the transfer substrate W with the chips attached thereto may be supported by the second stage 120. That is, the operation of the second driving unit 160 may be controlled to move the second stage 120 to a position to which the transfer substrate W is to be carried, and the transfer substrate W may be adsorbed to the second stage 120.

[0099] At this time, the alignment of the transfer substrate W may be adjusted primarily. For example, the transfer substrate W may be formed in a circular shape and may have a groove engraved on its periphery. Therefore, the position of the groove engraved on the transfer substrate W may be photographed, and it may be visually confirmed whether the groove is located at the rear end of the transfer substrate W. If the groove is located in another place, it may be determined that the position of the transfer substrate W is deviated from the fixed position. Therefore, after adjusting the position of the groove of the transfer substrate W to the fixed position, the transfer substrate W may be adsorbed to the lower part of the second stage 120.

[0100] Once the transfer substrate W is adsorbed to the second stage 120, the second stage 120 may be moved between the laser irradiation unit 130 and the first stage 110. Therefore, the second stage 120 can be moved to a position facing the first stage 110, and the transfer substrate W can be positioned to face the transferred substrate G.

[0101] At this time, after adjusting the alignment of the transferred substrate G, the second stage 120 may move between the laser irradiation unit 130 and the first stage 110. Therefore, before the second stage 120 closes the space between the laser irradiation unit 130 and the first stage 110, the transferred substrate G is irradiated with an aligning laser, so that the alignment of the transferred substrate G can be adjusted.

[0102] Once the movement of the second stage 120 is completed, the alignment of the transfer substrate W may be secondarily adjusted. For example, an alignment laser may be irradiated onto the transfer substrate W. Then, the second stage 120 may be moved according to at least one of the shape and the position where the alignment laser is irradiated onto the transfer substrate W by the imaging unit 180, thereby accurately adjusting the alignment of the transfer substrate W.

[0103] When adjusting the alignment condition according to the shape of the align laser irradiation, the shape of the align laser irradiation on the transfer substrate W may be checked. Therefore, if the cross-shaped shape of the align laser is distorted, it can be determined that the horizontality of the transfer substrate W is poor. Therefore, the horizontality of the second stage 120 can be adjusted to adjust the horizontal alignment condition of the transfer substrate W so that the shape of the align laser is not displayed distorted.

[0104] At this time, if the shape of the alignment hole h2 is cross-shaped, it is easy to check the horizontal alignment of the transfer substrate W. That is, if the transfer substrate W is misaligned (if the transferred substrate G is tilted), it is easy to check that the shape of the alignment laser displayed on the surface of the transfer substrate W is distorted. Conversely, if the shape of the alignment laser is displayed normally, it is easy to determine that the horizontality of the transfer substrate W is normal.

[0105] When adjusting the degree of alignment according to the position where the align laser is irradiated, the position where the align laser is irradiated on the transfer substrate W may be checked. A mark corresponding to the shape of the align laser may be formed on the transfer substrate W. Therefore, if the position of the align laser and the position of the mark do not correspond to each other (or do not match), it can be determined that the degree of alignment of the transfer substrate W on the XY plane is poor. Therefore, the degree of alignment on the plane of the transfer substrate W can be adjusted by moving the second stage 120 in the forward / backward and left / right directions so that the mark corresponds to (or matches) the position where the align laser is irradiated.

[0106] In this manner, the alignment of the transferred substrate G and the transfer substrate W is adjusted similarly using the align laser as a guide. Thus, the alignment of the transferred substrate G and the transfer substrate W is performed.

[0107] On the other hand, a secondary adjustment of the alignment of the transferred substrate G and the transfer substrate W may be performed in parallel. That is, after the first stage 110 and the second stage 120 are moved to the lower side of the laser irradiation unit 130, a plurality of aligning lasers may be generated. A portion of the plurality of aligning lasers may be irradiated onto the transfer substrate, and another portion may be irradiated onto the transferred substrate G through a transmission window arranged on the second stage 120. Therefore, after checking the alignment of the transferred substrate G and the transfer substrate W using the aligning lasers irradiated onto each of the transferred substrate G and the transfer substrate W, if the alignment is poor, the respective alignments can be adjusted. Therefore, the alignment of the transferred substrate G and the transfer substrate W can be adjusted simultaneously to shorten the time required for the process.

[0108] Furthermore, when adjusting the alignment of the transferred substrate G and the transfer substrate W in parallel, the operation of placing the transfer substrate G on the first stage 110 and the operation of adsorbing the transferred substrate G to the second stage 120 may be performed in parallel. This makes it possible to shorten the time required for the operation of placing the substrates on the stages.

[0109] Next, the laser beam may be irradiated onto the transfer substrate W while moving the laser irradiation unit 130 that irradiates the laser beam. That is, since the first stage 110 and the second stage 120 are not moved, the laser irradiation unit 130 can be moved to scan the transfer substrate W with the laser beam while the positions of the transferred substrate G and the transfer substrate W are fixed. Therefore, after the positional alignment of the transferred substrate G and the transfer substrate W is adjusted, it is possible to prevent the positional deviation between the transferred substrate G and the transfer substrate W caused by the movement of the stage.

[0110] At this time, the chips may be provided in a number of chips and arranged in an array on the transfer substrate W. A line-shaped laser beam flows into the shape adjuster 133, which may change the shape of the line beam to a number of dots spaced apart in the direction in which the line beam extends (or in the left-right direction) and irradiate the transfer substrate W. That is, the laser beam may be irradiated in accordance with the positions of the chips spaced apart in the left-right direction. Therefore, by moving the laser irradiation unit 130 linearly along a direction intersecting the extension direction of the line beam (or in the front-back direction), it becomes possible to irradiate the entire chips arranged in an array with the laser beam.

[0111] Furthermore, the laser generator 131 may irradiate the transfer substrate W with a laser beam in accordance with the time at which the laser beam moving in the front-rear direction reaches each of the chips spaced apart in the front-rear direction.

[0112] For example, the laser beam may be generated according to a predetermined cycle. Therefore, when the laser beam scans the transfer substrate W, the laser beam may be irradiated at the position where the chip is arranged, and the laser beam may not be irradiated at the position where the chip is not arranged. Therefore, it is possible to irradiate the laser beam only at the position where the chip is arranged.

[0113] Alternatively, a circuit breaker (not shown) may be provided in the moving path of the laser beam. Therefore, while the laser generator 131 generates a laser beam, the circuit breaker continuously opens and closes the moving path of the laser beam, so that when the laser beam scans the transfer substrate W, the laser beam is irradiated at the position where the chip is arranged and is not irradiated at the position where the chip is not arranged. Therefore, it becomes possible to irradiate the laser beam only at the position where the chip is located.

[0114] At this time, since the laser irradiation unit 130 irradiates the laser beam while moving as a whole, it is possible to irradiate the entire area of ​​the transfer substrate W with a laser beam adjusted to the same light amount and focused in the same manner. Therefore, it is possible to prevent some chips from not being detached from the transfer substrate W due to differences in the light amount and focusing of the laser beam.

[0115] The laser beam irradiated to the transfer substrate W may cause the chip provided on the transfer substrate W to drop and transfer to the transferee substrate G. That is, the laser beam may apply thermal energy to the bonding surface between the transfer substrate W and the chip to separate the transfer substrate W and the chip. Thus, the chip is separated from the transfer substrate W and can drop onto the transferee substrate G. Since the alignment between the transfer substrate W and the transferee substrate G is adjusted, the chip separated from the transfer substrate W can drop accurately at a predetermined position on the transferee substrate G.

[0116] At this time, a thin film layer (not shown) of a bonding material may be provided on the upper surface of the transferred substrate G so that the transferred substrate G and the chip can be electrically connected while being bonded together. For example, the thin film layer of the bonding material may be an anisotropically conductive film (ACF) layer. The thin film layer of the bonding material may have a large number of conductive particles dispersed therein and may have a certain adhesiveness. Therefore, the chip that is detached from the transfer substrate W and falls can be attached to the upper part of the transferred substrate G.

[0117] Once all the chips on the transfer substrate W have been transferred to the transferee substrate G, the transferee substrate G may be transported to a location where a subsequent process is performed. In the subsequent process, a laser beam is used to apply heat to the bonding surface between the chips transferred to the transferee substrate W and the transferee substrate G. Thus, the thin film layer of bonding material arranged on the transferee substrate G and the chips are bonded together, and they can be electrically connected.

[0118] In this way, when performing the transfer process, the irradiation position of the laser beam may be finely adjusted using the moving part 140 while the transfer substrate W and the transferred substrate G are fixed. This makes it possible to prevent the first stage 110 and the second stage 120 from moving during the transfer process, thereby preventing the positions of the transferred substrate G and the transfer substrate W from fluctuating. This makes it possible to accurately drop the chip at a predetermined position on the transferred substrate G, thereby improving the precision of the transfer process.

[0119] In the above detailed description of the present invention, specific embodiments have been described, but various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below, but also by equivalents to the claims. [Explanation of symbols]

[0120] 100: Transfer device 110: First Stage 120: Second Stage 130: Laser irradiation unit 140: Mobile section 150: First drive unit 160: Second drive unit 180: Photography Department 190: Alignment Department

Claims

1. A transfer apparatus that transfers a chip provided on a transfer substrate to a transfer substrate, comprising: A first stage capable of supporting the transfer substrate; a second stage capable of supporting the transfer substrate so as to face and separate from the transferee substrate; a laser irradiation unit that is disposed such that at least a portion of the laser irradiation unit is separated from the second stage in a direction in which the transfer substrate and the transferred substrate face each other so that the laser irradiation unit can irradiate the transfer substrate with a laser beam; a moving unit that supports the laser irradiation unit and can move the laser irradiation unit in a state in which the laser irradiation unit is irradiated with a laser beam; Equipped with The laser irradiation unit is a laser generator capable of generating a laser beam; an angle adjuster disposed between the laser generator and the second stage, capable of adjusting a direction in which the laser beam is irradiated; a shape adjuster disposed between the laser generator and the angle adjuster, the shape adjuster being capable of adjusting the shape of the laser beam irradiated onto the transfer substrate; a housing that is movable by the moving unit while supporting the laser generator, the angle adjuster and the shape adjuster; A transfer device comprising:

2. The moving unit is a path member extending in a direction intersecting a direction in which the transfer substrate and the transferred substrate face each other; a moving member connected to the laser irradiation unit and arranged so as to be linearly movable along an extension direction of the path member; The transfer device according to claim 1 .

3. a first drive unit that supports the first stage and can move the first stage in a plurality of directions; a second driving unit that supports the second stage and can move the second stage along a plurality of directions separately from the first stage; The transfer device according to claim 1 or 2, further comprising:

4. The shape adjuster is a mask member having a plurality of pattern holes; a selection member that supports the mask member and that can move the mask member in a plurality of directions so that a pattern hole through which a laser beam is to pass can be selected from a plurality of pattern holes; The transfer device according to claim 1 .

5. The mask member further includes an alignment hole; an imaging unit arranged to image a shape and a position of a laser beam passing through the align hole on at least one of the transfer substrate and the transferred substrate; an alignment unit connected to the imaging unit and adjusting the alignment of the transfer substrate and the transferred substrate in accordance with a shape and a position of the laser beam passing through the alignment hole; The transfer device according to claim 4 .

6. The second stage may be moved into and out of a space between the laser irradiation unit and the first stage, The transfer apparatus according to claim 5 , wherein the aligning unit adjusts the alignment of the transfer substrate after adjusting the alignment of the transferee substrate.

7. The area of ​​the transferred substrate is formed to be larger than the area of ​​the transfer substrate, 6. The transfer apparatus according to claim 5, wherein a portion of the laser beam passing through the alignment hole is irradiated onto the transfer substrate, and another portion passes through the second stage and is irradiated onto the transfer substrate.

8. A step of supporting a transfer substrate on a first stage; a step of supporting the transfer substrate on which the chip is provided on a second stage and positioning the transfer substrate so as to face the transfer substrate; a step of irradiating the transfer substrate with a laser beam while moving a laser irradiation unit that irradiates the laser beam; a step of dropping the chip provided on the transfer substrate by a laser beam and transferring it onto the transfer substrate; Including, The laser irradiation unit is a laser generator capable of generating a laser beam; an angle adjuster disposed between the laser generator and the second stage, capable of adjusting a direction in which the laser beam is irradiated; a shape adjuster disposed between the laser generator and the angle adjuster, the shape adjuster being capable of adjusting the shape of the laser beam irradiated onto the transfer substrate; a housing that is movable by a moving section while supporting the laser generator, the angle adjuster and the shape adjuster; Equipped with The procedure of irradiating a laser beam while moving the laser irradiation unit includes: generating a laser beam from the laser generator; a step of the moving unit linearly moving the entire laser irradiation unit along one direction; A transfer method comprising:

9. The transfer method according to claim 8 , wherein the chips are arranged in a plurality of chips in an array on the transfer substrate.

10. The step of linearly moving the laser irradiation unit includes:

10. The transfer method according to claim 9, further comprising the step of irradiating the transfer substrate with a laser beam in time with which a laser beam moving in one direction reaches each of the chips spaced apart in the one direction.

11. The step of supporting the transfer substrate on the first stage includes the steps of: a step of irradiating the transfer substrate with an alignment laser, and a step of adjusting the alignment of the transfer substrate by moving the first stage in accordance with at least one of a shape and a position to be irradiated with the alignment laser, The step of supporting the transfer substrate having the chip attached thereto on the second stage includes: The transfer method according to any one of claims 8 to 10, comprising: a step of irradiating the transfer substrate with an alignment laser; and a step of adjusting the alignment of the transfer substrate by moving the second stage in accordance with at least one of the shape and position to which the alignment laser is irradiated.

12. The procedure for adjusting the alignment condition according to the shape to be irradiated with the aligning laser includes: The method of claim 11 , further comprising the step of adjusting the horizontal alignment of the transfer substrate or the transferee substrate so that the shape of the align laser is not distortedly displayed on the transfer substrate or the transferee substrate.

13. A mark is formed on the transfer substrate and the transfer substrate, The procedure for adjusting the alignment condition according to the position where the aligning laser is irradiated includes:

13. The transfer method according to claim 11, further comprising a step of adjusting the alignment of the transfer substrate or the transferee substrate on a plane such that the mark corresponds to a position where the aligning laser is irradiated.

14. the step of supporting the transfer substrate on which the chip is attached on the second stage includes the step of moving the second stage between the laser irradiation unit and the first stage; 14. The transfer method according to claim 11, wherein the step of adjusting the alignment of the transferred substrate is performed before the second stage is moved to a position between the laser irradiation unit and the first stage.

15. The step of irradiating the alignment laser includes: generating a plurality of said aligned lasers; a step of irradiating some of the plurality of aligning lasers onto the transfer substrate and irradiating the other part of the plurality of aligning lasers onto the transfer substrate by passing the other part through the second stage; The method of claim 11 , further comprising:

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