Method and computer program for identifying factors limiting plating equipment throughput - Patents.com

Abstract

To identify a factor limiting throughput of a plating apparatus.SOLUTION: A method for identifying a factor limiting throughput of a plating apparatus is provided. The method includes the steps of: creating a time chart representing processing schedules of a plurality of processing units and one or more transfer devices; calculating at least one of a working rate and a degree of freedom of extraction regarding factors of the plurality of processing units and the one or more transfer devices based on the time chart, the extraction freedom degree representing a freedom degree of timing when a processed substrate can be extracted from one of the processing units; and displaying the at least calculated one of the working rate and the degree of freedom of extraction, for each factor of the plurality of processing units and the one or more transfer devices.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a method and computer program for identifying factors limiting throughput of a plating apparatus. [Background technology]

[0002] A plating apparatus is equipped with various processing units for processing substrates and one or more transport devices for transporting the substrates. In both the design and operation stages of a plating apparatus, it is an important issue to improve the number of substrates that the plating apparatus can process per unit time, i.e., throughput. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6262137 Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 discloses a method for calculating the availability of a substrate processing apparatus, but does not mention calculating the availability of each element of the substrate processing apparatus.

[0005] In addition, for example, an engineer with specialized knowledge would run a simulation of a series of operations in a plating device and check the operating status of each element based on the results of the simulation. However, with this method, it takes time to identify the areas that affect throughput, and there are only a limited number of people who can perform this analysis. [Means for solving the problem]

[0006] [Form 1] According to Form 1, there is provided a method for identifying elements among the processing units and the transport devices that limit the throughput of the entire plating apparatus in a plating apparatus having a plurality of processing units for processing substrates and one or more transport devices for transporting the substrates, the method including the steps of: inputting a set of plating processing conditions; creating a time chart representing a processing schedule of the plurality of processing units and the one or more transport devices based on the set of plating processing conditions; calculating at least one of an operating rate and a degree of freedom of removal for each element of the plurality of processing units and the one or more transport devices based on the time chart, wherein the degree of freedom of removal represents the degree of freedom of timing at which the processed substrate can be removed from one of the processing units; and displaying at least one of the calculated operating rate and degree of freedom of removal for each element of the plurality of processing units and the one or more transport devices.

[0007] [Mode 2] According to mode 2, in the method of mode 1, the operating rate of the processing unit is calculated based on the sum of a substrate processing time required to process the substrate in the processing unit and a substrate transport time required for the one or more transport devices to transport the substrate between the processing unit and other processing units.

[0008] [Mode 3] According to mode 3, in the method of mode 2, the substrate transport time is a time from starting to take out the substrate from the processing unit to completing to put the substrate into the processing unit following the processing unit, and a time from starting to take out the substrate from the processing unit preceding the processing unit to completing to put the substrate into the processing unit following the processing unit. This includes the time from when the removal of the substrate begins to when the next substrate is completely placed in the processing unit.

[0009] [Mode 4] According to mode 4, in the method of mode 3, the substrate transport time further includes a time for the one or more transport devices to move from the subsequent processing unit to the previous processing unit.

[0010] [Mode 5] According to mode 5, in the method of any one of modes 1 to 4, the availability of the transport device is calculated based on the sum of the time during which the transport device transports the substrate.

[0011] [Mode 6] According to mode 6, in any one of the methods of modes 1 to 5, the degree of freedom for removal of the processing unit is calculated based on a substrate waiting time from when processing of the substrate is completed in the processing unit until when the substrate can be removed from the processing unit.

[0012] [Mode 7] According to mode 7, in the method of mode 6, the degree of freedom for removal of the processing unit is calculated based on the difference between the maximum value and the minimum value of the substrate waiting time of the processing unit in the time chart.

[0013] [Mode 8] According to mode 8, in the method of any one of modes 1 to 7, the time chart includes information regarding the timing at which each of the plurality of processing units starts and ends processing of the substrate.

[0014] [Mode 9] According to mode 9, in any one of the methods of modes 1 to 8, the time chart includes information regarding the start and end timings of each movement of the one or more transport devices from one processing unit to another processing unit.

[0015] [Form 10] According to form 10, in the method of form 9, the time chart includes information regarding the timing at which the one or more transport devices start and end the operation of removing the substrate from one of the processing units, and information regarding the timing at which the one or more transport devices start and end the operation of storing the substrate in the other processing unit.

[0016] [Mode 11] According to mode 11, in the method of any one of modes 1 to 10, the operating rate and removal flexibility are displayed for each element of the plating apparatus using a heat map or a brightness map.

[0017] [Mode 12] According to mode 12, in a plating apparatus having a plurality of processing units for processing substrates and one or more transport devices for transporting the substrates, a computer program for identifying elements among the processing units and the transport devices that limit the throughput of the entire plating apparatus is configured to cause a computer processor to execute the steps of: receiving an input of a set of plating processing conditions; creating a time chart representing a processing schedule of the plurality of processing units and the one or more transport devices based on the set of plating processing conditions; calculating at least one of an operating rate and a degree of freedom for removal for each element of the plurality of processing units and the one or more transport devices based on the time chart, wherein the degree of freedom for removal represents a degree of freedom for a timing at which the processed substrate can be removed from one of the processing units; and displaying at least one of the calculated operating rate and degree of freedom for removal for each element of the plurality of processing units and the one or more transport devices on a display unit. A computer program is provided. [Brief description of the drawings]

[0018] [Figure 1] 1 is an overall layout diagram of a plating apparatus according to an embodiment of the present invention; [Diagram 2] 1 is a block diagram of an exemplary data processing apparatus for implementing a method according to an embodiment of the present invention; [Diagram 3] 1 is a diagram showing an overview of data processing in a data processing device according to an embodiment of the present invention; [Figure 4] 3 shows an example of a time chart according to an embodiment of the present invention. [Diagram 5]5 is a schematic diagram showing the relationship between each processing unit of the plating apparatus and each transport device in the example of the time chart of FIG. 4. [Figure 6] 5 is a diagram in which the movement of the transport device is indicated by arrows on the time chart of FIG. 4. [Figure 7] 5 is a diagram illustrating each time used in calculating the availability rate in the time chart of FIG. 4. [Figure 8] FIG. 13 is a diagram showing another example of a time chart for explaining the degree of freedom of removal. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals and redundant description will be omitted.

[0020] 1 is an overall layout diagram of a plating apparatus 100 according to one embodiment of the present invention. The plating apparatus 100 is broadly divided into a load / unload module 110 that loads a substrate onto a substrate holder (not shown) or unloads a substrate from the substrate holder, a processing module 120 that processes the substrate, and a cleaning module 50a. The processing module 120 further includes a pre-processing / post-processing module 120A that performs pre-processing and post-processing of the substrate, and a plating processing module 120B that performs plating processing on the substrate.

[0021] The load / unload module 110 has a handling stage 26, a substrate transport device 27, and a fixing station 29. As an example, in this embodiment, the load / unload module 110 has two handling stages 26, a handling stage 26A for loading that handles substrates before processing, and a handling stage 26B for unloading that handles substrates after processing. In this embodiment, the handling stage 26A for loading and the handling stage 26B for unloading have the same configuration, and are arranged in a direction 180° different from each other. Note that the handling stage 26 is not limited to one provided with the handling stages 26A and 26B for loading and unloading, and may be used without being distinguished as being for loading and unloading. In this embodiment, the load / unload module 110 has two fixing stations 29. The two fixing stations 29 are the same mechanism, and the one that is free (the one not handling substrates) is used. Depending on the space available in the plating apparatus 100, one handling stage 26 and three or more fixing stations 29 may be provided.

[0022] Substrates are transported from a plurality of cassette tables 25 (three in FIG. 1 as an example) to the handling stage 26 (handling stage 26A for loading) by the robot 24. The cassette table 25 is provided with a cassette 25a in which the substrates are accommodated. The cassette is, for example, a FOUP. The handling stage 26 is configured to adjust (align) the position and orientation of the substrate placed thereon. A substrate transport device 27 is disposed between the handling stage 26 and the fixing station 29 for transporting the substrate therebetween. The substrate transport device 27 is configured to transport the substrates between the handling stage 26 and the fixing station 29. 9 and the cleaning module 50a. A stocker 30 for accommodating substrate holders is provided near the fixing station 29.

[0023] The cleaning module 50a has a cleaning device 50 that cleans and dries the substrate after plating. The substrate transport device 27 is configured to transport the substrate after plating to the cleaning device 50 and remove the cleaned substrate from the cleaning device 50. Then, the cleaned substrate is delivered to the handling stage 26 (handling stage 26B for unloading) by the substrate transport device 27 and returned to the cassette 25a via the robot 24.

[0024] The pre-treatment / post-treatment module 120A includes a pre-wet tank 32, a pre-soak tank 33, a pre-rinse tank 34, a blow tank 35, and a rinse tank 36. In the pre-wet tank 32, the substrate is immersed in pure water. In the pre-soak tank 33, an oxide film on the surface of a conductive layer such as a seed layer formed on the surface of the substrate is etched away. In the pre-rinse tank 34, the substrate after pre-soaking is washed with a cleaning liquid (pure water, etc.) together with the substrate holder. In the blow tank 35, the substrate after washing is drained. In the rinse tank 36, the substrate after plating is washed with a cleaning liquid together with the substrate holder. Note that the configuration of the pre-treatment / post-treatment module 120A of the plating apparatus 100 is merely an example, and the configuration of the pre-treatment / post-treatment module 120A of the plating apparatus 100 is not limited, and other configurations may be adopted.

[0025] The plating module 120B is configured, for example, by housing a plurality of plating tanks 39 inside an overflow tank 38. Each plating tank 39 is configured to house one substrate therein and to perform plating such as copper plating on the substrate surface by immersing the substrate in the plating solution held therein.

[0026] The plating apparatus 100 has a transporter 37, which is located to the side of the pre-treatment / post-treatment module 120A and the plating module 120B and transports the substrate holder together with the substrate, and which employs, for example, a linear motor system. The transporter 37 is configured to transport the substrate holder among the fixing station 29, the stocker 30, the pre-wet tank 32, the pre-soak tank 33, the pre-rinse tank 34, the blow tank 35, the rinse tank 36, and the plating tank 39.

[0027] An example of a series of plating processes performed by the plating apparatus 100 will be described. First, the robot 24 takes out one substrate from the cassette 25a mounted on the cassette table 25, and transports the substrate to the handling stage 26 (handling stage 26A for loading). The handling stage 26 adjusts the position and orientation of the transported substrate to a predetermined position and orientation. The substrate whose position and orientation have been adjusted on the handling stage 26 is transported to the fixing station 29 by the substrate transport device 27.

[0028] Meanwhile, the substrate holder housed in the stocker 30 is transported by the transporter 37 to the fixing station 29 and placed horizontally on the fixing station 29. Then, the substrate transported by the substrate transport device 27 is placed on the substrate holder in this state, and the substrate and the substrate holder are connected.

[0029] Next, the substrate holder holding the substrate is gripped by transporter 37 and stored in pre-wet tank 32. Next, the substrate holder holding the substrate treated in pre-wet tank 32 is transported by transporter 37 to pre-soak tank 33, where the oxide film on the substrate is etched. Subsequently, the substrate holder holding the substrate is transported to pre-rinse tank 34, where the surface of the substrate is rinsed with pure water stored in pre-rinse tank 34.

[0030] The substrate holder holding the substrate after the water rinsing is transported by the transporter 37 from the pre-rinse tank 34 to the plating module 120B and stored in the plating tank 39 filled with plating solution. The transporter 37 sequentially repeats the above procedure to sequentially store the substrate holders holding the substrate in each plating tank 39 of the plating module 120B.

[0031] In each plating tank 39, plating voltage is applied between an anode (not shown) in the plating tank 39 and the substrate, thereby plating the surface of the substrate.

[0032] After plating is completed, the substrate holder holding the plated substrate is grasped by the transporter 37 and transported to the rinse tank 36, where the substrate surface is washed with the pure water by immersing it in the pure water contained in the rinse tank 36. Next, the substrate holder is transported by the transporter 37 to the blow tank 35, where water droplets adhering to the substrate holder are removed by blowing air or the like. Thereafter, the substrate holder is transported by the transporter 37 to the fixing station 29.

[0033] In the fixing station 29, the processed substrate is removed from the substrate holder by the substrate transport device 27 and transported to the cleaning device 50 in the cleaning module 50a. The cleaning device 50 cleans and dries the substrate after plating. The dried substrate is transferred to the handling stage 26 (handling stage 26B for unloading) by the substrate transport device 27 and returned to the cassette 25a by the robot 24.

[0034] FIG. 2 is a block diagram of an exemplary data processing device 200 for implementing a method according to an embodiment of the present invention. FIG. 3 is a diagram showing an overview of data processing in the exemplary data processing device 200 of FIG. 2. The data processing device 200 may be a computer of various forms, such as a desktop computer, a notebook computer, or a server on a network. As shown in the figure, the data processing device 200 includes a processor 202, a memory 204, a database 206, an input interface 208, and a display 210. The database 206 and the display 210 may be external devices connected to the data processing device 200 via a network or a communication cable. The memory 204 stores a computer program 205 configured to be able to implement a method according to an embodiment of the present invention. The processor 202 reads out the computer program 205 from the memory 204 and executes it. As a result, the method according to an embodiment of the present invention is implemented in the data processing device 200.

[0035] The data processing device 200 also includes a timetable generating unit 212, a timechart generating unit 214, an operating rate calculating unit 216, a degree of freedom of removal calculating unit 218, and a screen output unit 220. Each of these units may be a functional block embodied by the processor 202 executing the computer program 205. The timetable generating unit 212, the timechart generating unit 214, the operating rate calculating unit 216, the degree of freedom of removal calculating unit 218, and the screen output unit 220 are configured to operate in cooperation with each other to implement a method according to one embodiment of the present invention.

[0036] The timetable generating unit 212 is configured to generate a timetable representing a processing schedule of the transport devices (e.g., the robot 24, the substrate transport device 27, and the transporter 37 shown in FIG. 1) equipped in the plating apparatus 100 based on the plating process parameters. The plating process parameters used in generating the timetable include information relating to the configuration of the plating apparatus 100 and information relating to the process conditions. This information may be stored in advance in the database 206, for example, and input from the database 206 to the timetable generating unit 212. Alternatively, part of this information may be input by the user of the plating apparatus 100 via the input interface 208. Information relating to the configuration of the plating apparatus 100 may be, for example, information relating to the processing units (e.g., the robot 24, the substrate transport device 27, and the transporter 37 shown in FIG. 1) equipped in the plating apparatus 100. The information includes information on the arrangement of the pre-wet tank 32, the pre-soak tank 33, the pre-rinse tank 34, the blow tank 35, the rinse tank 36, and the plurality of plating tanks 39) and the transport device, the operation time required for the transport device to store / remove the substrate to be processed from / to each processing unit, the movement time required for the transport device to move between each processing unit, the movement range of each transport device, the order in which the substrate is processed in the plurality of processing units, and the time limit for which the substrate processed in the processing unit can wait in the processing unit. The information on the process conditions of the plating apparatus 100 includes the processing time set as the time for processing the substrate in each processing unit. The timetable generating unit 212 can create a timetable indicating the timing at which each transport device transports the substrate from which processing unit to which processing unit by using these various plating processing parameters.

[0037] The time chart generating unit 214 is configured to generate a time chart for the plating apparatus 100 based on the time table generated in the time table generating unit 212. The time chart for the plating apparatus 100 includes a processing schedule for each processing unit in addition to a processing schedule for the transport device. Although the time table generating unit 212 and the time chart generating unit 214 are shown as separate elements in Figures 2 and 3, the time table generating unit 212 and the time chart generating unit 214 may be configured as a single integrated element to generate a time chart directly from plating process parameters.

[0038] 4 shows an example of the created time chart. In this example, the plating apparatus 100 includes four processing units, namely, unit U1, unit U2, unit U3, and unit U4, and three transfer devices, namely, transfer device T1, transfer device T2, and transfer device T3. The units U1, U2, U3, and U4 may correspond to, for example, any of the pre-wet tank 32, the pre-soak tank 33, the pre-rinse tank 34, the blow tank 35, the rinse tank 36, and the plating tank 39 in FIG. 1. Also, for example, the transfer devices T1, T2, and T3 may correspond to any of the robot 24, the substrate transfer device 27, and the transporter 37 in FIG. 1.

[0039] 5 is a schematic diagram showing the relationship between each processing unit and each transport device of the plating apparatus 100 in the example of the time chart of FIG. 4. The transport device T1 transports the substrate W (for example, from another processing unit not shown in FIG. 5) to the unit U1 and stores it in the unit U1. The substrate W is processed in the unit U1. When the processing in the unit U1 is completed, the transport device T2 removes the substrate W from the unit U1, transports it to the unit U2, and stores it in the unit U2. The substrate W is processed in the unit U2. Similarly, the substrate W is transported by the transport device T2 to the unit U3 and the unit U4 in sequence, and is processed in the unit U3 and the unit U4. When the processing in the unit U4 is completed, the transport device T3 removes the substrate W from the unit U4 and transports it to a subsequent processing unit (not shown).

[0040] Fig. 6 is a diagram in which the movement (movement path) of the transport device 2 is written with arrows on the time chart of Fig. 4. Note that Figs. 4 to 6 show the actual configuration of the plating apparatus 100 in a simplified form for the convenience of explanation and ease of understanding. Of course, the number and arrangement of each processing unit and transport device in these figures can be appropriately modified to match the actual configuration of the plating apparatus 100.

[0041] 4 to 6, the processing schedule of each processing unit and each transport device of plating apparatus 100 depicted in this exemplary time chart will be described in detail. This time chart shows how each processing unit processes five substrates W0', W0, W1, W2, and W3 that are continuously loaded in sequence, with substrates preceding and succeeding these five substrates not shown.

[0042] The transport device T1 transports the substrate W1 (from a unit not shown) to the unit U1 and stores it in the unit U1 (reference S1 in FIG. 6). The unit U1 processes the substrate W1 (reference S2). When the processing of the substrate W1 in the unit U1 is completed, the transport device T2 removes the substrate W1 from the unit U1, transports it to the unit U2, and stores it in the unit U2 (reference S3). The unit U2 processes the substrate W1 (reference S4). Furthermore, at the timing when the transport device T2 moves from the unit U1 to the unit U2, the transport device T1 transports the next substrate W2 to the unit U1 and stores it in the unit U1 (reference S5). The unit U1 processes the substrate W2 in the same manner (reference S6).

[0043] Meanwhile, after transport device T2 transports substrate W1 to unit U2, it then moves to unit U3 to receive substrate W0, which has already been processed in unit U3 (reference S7). At this time, the processed substrate W0 waits in unit U3 from the time substrate W0 is processed in unit U3 until transport device T2 arrives at unit U3. This is shown as a blank space in the time chart. When transport device T2 arrives at unit U3, it removes substrate W0 from unit U3, transports it to unit U4, and stores it in unit U4 (reference S8). Unit U4 processes substrate W0 (reference S9).

[0044] After transporting substrate W0 to unit U4, transport device T2 then moves to unit U2 (reference S10). As already indicated by reference S4, unit U2 processes substrate W1. When processing of substrate W1 is completed in unit U2, transport device T2 removes substrate W1 from unit U2, transports it to unit U3, and stores it in unit U3 (reference S11). Unit U3 processes substrate W1 (reference S12).

[0045] After transporting the substrate W1 to the unit U3, the transport device T2 then moves to the unit U1 (reference S13). The unit U1 is processing the second substrate W2 (reference S6 above), and when the processing of the substrate W2 in the unit U1 is completed, the transport device T2 removes the substrate W2 from the unit U1 and transports it to the unit U2 (reference S14). Thereafter, the same processing is repeated for the substrate W2 in each unit.

[0046] In unit U4, the previous substrate W0 is being processed (reference S9 above), and transport device T3 moves to unit U4 in advance (reference S15) in time with the completion of processing of substrate W0 in unit U4. When processing of substrate W0 in unit U4 is completed, transport device T3 removes substrate W0 from unit U4 and transports it to a subsequent unit (not shown) (reference S16). Thereafter, unit U4 is in a standby state (blank portion of the time chart) until transport device T2 starts transporting the next substrate (substrate W1) from unit U3 to unit U4.

[0047] Returning to FIGS. 2 and 3, the operation rate calculation unit 216 is configured to calculate the operation rate of each processing unit and each transport device of the plating apparatus 100 based on the time chart created by the time chart generation unit 214. The operation rate of each processing unit or transport device can be defined as the ratio of the time involved in the operation of the processing unit or transport device to the total operation time of the plating apparatus 100. The "total operation time of the plating apparatus 100" may be, for example, the total time required from the start of processing of the first substrate among multiple substrates to be processed by the plating apparatus 100 to the end of processing of the last substrate. Alternatively, as in the example of the time chart in FIG. 4, when the processing schedule of a certain group of consecutive substrates is repeated periodically (i.e., when the processing schedule of each processing unit and transport device for a certain number of consecutive N substrates and the processing schedule of each processing unit and transport device for the subsequent N substrates have the same pattern), the "total operation time of the plating apparatus 100" may be defined as the time of such one cycle.

[0048] The "time involved in the operation of a processing unit" is defined as, for example, the sum of i) a substrate processing time ΔTA required to process a substrate W in the processing unit, and ii) a substrate transport time ΔTB required by a transport device to transport a substrate W between the processing unit and another processing unit. The substrate transport time ΔTB may include at least one of ii-1) a time ΔTB1 from the start of removing a processed substrate W from the processing unit to the completion of storing the substrate W in the processing unit following the processing unit, ii-2) a time ΔTB2 for the transport device to move (from any processing unit) to the processing unit preceding the processing unit, and ii-3) a time ΔTB3 from the start of removing a next substrate W from the processing unit preceding the processing unit to the completion of storing the next substrate W in the processing unit. The times ΔTB1 and ΔTB3 may each be the sum of the time required for the transport device to remove the substrate W from the processing unit, the time to transport the removed substrate W to the next processing unit, and the time to store the transported substrate W in the processing unit. During time ΔTB2, the transport device moves between the processing units without gripping the substrate, but since this movement is in preparation for supplying the next substrate to the processing unit being calculated, it is reasonable to include this time ΔTB2 in the substrate transport time ΔTB.

[0049] The "time involved in the operation of the transport device" can be defined as, for example, the sum of iii) the time ΔTC during which the transport device transports the substrate W, and iv) the time ΔTD during which the transport device moves between processing units without gripping the substrate W. The time ΔTC may be the total value of the time it takes for the transport device to remove the substrate W from the processing unit, the time it takes to transport the removed substrate W to the next processing unit, and the time it takes to store the transported substrate W in the processing unit. Note that the time ΔTD in iv) is the same as the time ΔTB2 in ii-2) above. As described above, even if the transport device is not gripping the substrate W, this movement is for preparation for the next operation of transporting the substrate, so it is appropriate to include it in the "time involved in the operation".

[0050] Fig. 7 illustrates the above times ΔTA, ΔTB1, ΔTB2, ΔTB3, ΔTC, and ΔTD used in the calculation of the utilization rate in the time chart of Fig. 4. In the example of the time chart of Fig. 4, in which the processing schedule of a group of continuous substrates is repeated cyclically, the times ΔTA, ΔTB1, ΔTB2, ΔTB3, ΔTC, and ΔTD may be calculated for one period of the repetition.

[0051] As can be seen from the above definition of availability and from FIG. 7, in this example of the time chart, the availability of units U1 and U2 is calculated to be 100%. As for units U3 and U4, the sum of times ΔTA, ΔTB1, ΔTB2, and ΔTB3 is shorter than the time ΔT of one cycle, so the availability is less than 100% (e.g., 60 to 90%). Also, while the availability of transport device T2 is calculated to be 100%, the availability of transport devices T1 and T3 is less than 100% (e.g., 20 to 40%).

[0052] In this manner, the operation rate calculation unit 216 calculates the operation rates of the processing units and transport devices of the plating apparatus 100. By looking at these operation rate values, it is possible to identify which of the various elements (processing units and transport devices) of the plating apparatus 100 are affecting the throughput of the plating apparatus 100.

[0053] 2 and 3, the removal freedom calculation unit 218 is configured to calculate the removal freedom of each processing unit of the plating apparatus 100 based on the time chart created by the time chart generation unit 214. In order to maximize the throughput of the entire plating apparatus 100, it is important to increase the operation rate of the processing unit with the lowest throughput among the multiple processing units of the plating apparatus 100 as much as possible. To achieve this, It is necessary to adjust the processing schedule of each element of the plating apparatus 100 so that at the timing when the processing of the substrate is completed in a processing unit having a throughput (e.g., unit U4), the processed substrate is removed from that processing unit, and the next substrate is then transported from the preceding processing unit (e.g., unit U3) and stored in that processing unit (unit U4). At this time, in the preceding processing unit (unit U3), the processed substrate is not removed immediately even after processing is completed, but is kept waiting in that processing unit for a while until the above timing. In this way, the degree to which the timing of removing the processed substrate from each processing unit can be adjusted is defined as the degree of freedom in removal.

[0054] FIG. 8 is a diagram showing another example of a time chart for more specifically explaining the degree of freedom of removal. In this example, the plating apparatus 100 is provided with six processing units, namely, unit U1A, unit U1B, unit U2A, unit U2B, unit U3, and unit U4. Note that the transport device is omitted in FIG. 8. Unit U1A and unit U1B are processing units that perform the same processing (e.g., presoak processing) and constitute the first unit group. Unit U2A and unit U2B are processing units that perform the same processing (e.g., plating processing) and constitute the second unit group. The third unit group and the fourth unit group each consist of only one processing unit (unit U3, unit U4). The substrate is transported and processed in the order of the first unit group, the second unit group, the third unit group, and the fourth unit group. In the first unit group and the second unit group, one of the two units included in each group (e.g., the vacant unit) is used to process the substrate.

[0055] A specific example of the degree of freedom of removal will be described with reference to Fig. 8, focusing on unit U3. Substrate W1 is transported from unit U2A to unit U3 and stored in unit U3 (reference S21). Substrate W1 is processed in unit U3 (reference S22). When the processing of substrate W1 is completed in unit U3, removal of the previous substrate W0 from the subsequent unit U4 (reference S23) has not been completed, so substrate W1 waits in unit U3 (blank portion). This waiting time, i.e., the time length of the blank portion, is defined as ΔT W1 When removal of the substrate W0 from the subsequent unit U4 is completed, removal of the substrate W1 from unit U3 becomes possible, and the substrate W1 is removed from unit U3, transported to unit U4, and stored in unit U4 (reference S24). The substrate W1 is processed in unit U4 (reference S25), and then removed from unit U4 (reference S26).

[0056] Meanwhile, in unit U2B, processing of the second substrate W2 has been completed, but this substrate W2 waits in unit U2B (blank area) until removal of substrate W1 from unit U3 (reference number S24 above) is completed. Once removal of substrate W1 from unit U3 is completed, substrate W2 is removed from unit U2B and transported to unit U3, where it is stored (reference number S27). Substrate W2 is processed in unit U3 (reference number S28).

[0057] As in the case of the substrate W1 described above, when the processing of the substrate W2 is completed in the unit U3, the substrate W1 immediately preceding the substrate W1 is being processed in the subsequent unit U4 (reference S25) and has not yet been removed, so the substrate W2 waits in the unit U3 (blank portion). This waiting time is the same as the waiting time ΔT W1 Different time length ΔT W2 After the removal of the substrate W1 from the subsequent unit U4 is completed, the substrate W2 is removed from the unit U3 and transported to the unit U4 and stored in the unit U4 (reference S29). The substrate W2 is processed in the unit U4 (reference S30).

[0058] Thereafter, the substrates W3, W4, W5, ... are processed in the same manner. The time ΔT Wi (i=1, 2, 3, ...) varies for each substrate depending on the relative time relationship between the substrate processing in unit U3 and the substrate processing in unit U4. This waiting time for each board, ΔT Wi The fluctuation range of represents the adjustment range of the timing of removing the substrate from the processing unit (here, unit U3), that is, the "removal degree of freedom". Therefore, the removal degree of freedom of a certain processing unit (for example, unit U3) is determined by the waiting time ΔT Wi For example, the degree of freedom of removal can be defined for each processing unit as Freedom of removal = (waiting time ΔT Wi Maximum value of - waiting time ΔT Wi (minimum of 100 seconds) / (maximum wait time) Here, the “maximum waiting time” may be defined as, for example, the waiting time ΔT Wi It may be a maximum value of.

[0059] In this manner, the degree of freedom of removal calculation unit 218 calculates the degree of freedom of removal for each processing unit of the plating apparatus 100. The smaller the degree of freedom of removal, the lower the degree of adjustment of the timing of removing the substrate from the processing unit (e.g., unit U3), and in such a case, it becomes difficult to achieve a high operating rate in the subsequent processing unit (e.g., unit U4). Therefore, by looking at the value of the degree of freedom of removal for each processing unit, it is possible to identify which processing unit is hindering the improvement of the throughput of the plating apparatus 100.

[0060] 2 and 3, the screen output unit 220 generates a GUI (Graphical User Interface) screen based on the operating rates of each processing unit and transport device and the degree of freedom of removal of each processing unit calculated as described above, and outputs the GUI screen to the display 210. For example, the GUI screen can be created by superimposing an image (e.g., a heat map or a brightness map) that visually represents the calculated operating rates or degree of freedom of removal of each element of the plating apparatus 100 on a schematic image (e.g., as shown in FIG. 1) of the plating apparatus 100. A user of the plating apparatus 100 can check the level of the operating rate or degree of freedom of removal of each element through the GUI screen displayed on the display 210, and can take measures such as reviewing the plating process recipe or process conditions as necessary.

[0061] Although the embodiments of the present invention have been described above based on several examples, the above-mentioned embodiments of the present invention are intended to facilitate understanding of the present invention and do not limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes its equivalents. Furthermore, any combination or omission of each component described in the claims and specification is possible within the scope of solving at least a part of the above-mentioned problems or achieving at least a part of the effects. [Explanation of symbols]

[0062] 24 Robot 25 Cassette Table 25a cassette 26 Handling Stage 27 Substrate transport device 29 Fixing Station 30 Stocker 32 Pre-wet tank 33 Presoak tank 34 Pre-rinse tank 35 Blow tank 36 Rinse tank 37 Transporter 38 Overflow tank 39 Plating tank 50 Cleaning Equipment 50a Cleaning Module 100 Plating equipment 110 Load / Unload Module 120 Processing Module 120A Pre-treatment / Post-treatment Module 120B Plating Module 200 Data processing device 202 Processor 204 Memory 205 Computer Programs 206 Database 208 Input Interface 210 Display 212 Timetable Generation Unit 214 Time chart generation section 216 Operating Rate Calculation Unit 218 Removal freedom calculation section 220 Screen Output Unit

Claims

1. 1. A method for identifying factors among a plurality of processing units and one or more transport devices that transport substrates in a plating apparatus, the method comprising: inputting a set of plating process conditions; creating a time chart representing a processing schedule for the plurality of processing units and the one or more transport devices based on the set of plating processing conditions; a step of calculating at least one of an operation rate and a degree of freedom of removal for each element of the plurality of processing units and the one or more transport devices based on the time chart, the degree of freedom of removal representing a degree of freedom of timing at which the processed substrate can be removed from one of the processing units; displaying at least one of the calculated operation rate and the degree of freedom of removal for each of the plurality of processing units and the one or more transport devices; The method includes:

2. 2. The method according to claim 1, wherein the utilization rate of the processing unit is calculated based on the sum of a substrate processing time required to process the substrate in the processing unit and a substrate transport time required for the one or more transport devices to transport the substrate between the processing unit and other processing units.

3. The method according to claim 2, wherein the substrate transport time includes the time from starting to remove a substrate from the processing unit to completing to store the substrate in a processing unit following the processing unit, and the time from starting to remove a next substrate from a processing unit preceding the processing unit to completing to store the next substrate in the processing unit.

4. The method of claim 3 , wherein the substrate transport time further includes a time for the one or more transport devices to move from the downstream processing unit to the upstream processing unit.

5. The method according to claim 1 , wherein the utilization rate of the transport device is calculated based on a sum of the time during which the transport device transports the substrate.

6. The method according to claim 1 , wherein the degree of freedom for removal of the processing unit is calculated based on a substrate waiting time from when processing of the substrate is completed in the processing unit until when the substrate can be removed from the processing unit.

7. The method according to claim 6 , wherein the degree of freedom for removing the processing unit is calculated based on a difference between a maximum value and a minimum value of the substrate waiting time of the processing unit in the time chart.

8. The method according to claim 1 , wherein the time chart includes information regarding a timing at which each of the plurality of processing units starts and finishes processing the substrate.

9. The method according to claim 1 , wherein the timing chart comprises information regarding the start and end timing of each movement of the one or more transport devices from one processing unit to another processing unit.

10. The time chart includes information regarding a timing at which the one or more transport devices start and finish an operation of removing the substrate from the one processing unit; and The method according to claim 9 , further comprising information regarding a timing at which the one or more transport devices start and finish an operation of storing the substrate in the other processing unit.

11. The method of claim 1 , wherein the utilization rate and removal latitude are displayed for each element of the plating apparatus using a heat map or intensity map.

12. 1. A plating apparatus including a plurality of processing units for processing substrates and one or a plurality of transport devices for transporting the substrates, comprising: a computer program for identifying an element that limits an overall throughput of the plating apparatus among the processing units and the transport devices, the computer program comprising: receiving an input of a set of plating process conditions; creating a time chart representing a processing schedule for the plurality of processing units and the one or more transport devices based on the set of plating processing conditions; a step of calculating at least one of an operation rate and a degree of freedom of removal for each element of the plurality of processing units and the one or more transport devices based on the time chart, the degree of freedom of removal representing a degree of freedom of timing at which the processed substrate can be removed from one of the processing units; displaying at least one of the calculated operation rate and the degree of freedom of removal on a display unit for each of the plurality of processing units and the one or more transport devices; A computer program configured to cause a processor of a computer to execute the following:

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