Facets of a single transfer chamber for multi-wafer spacing

Abstract

Embodiments of the present disclosure are directed to a load lock chamber and a method of using the load lock chamber. The load lock chamber includes a middle section, an upper section coupled to the middle section, and a lower section coupled to the middle section. A slit valve in a facet on an outer surface of the middle section provides an opening for accessing the intermediate volume from outside the load lock.

Description

[Technical field]

[0001]

[0001] FIELD OF THE DISCLOSURE

[0001] Embodiments of the present disclosure relate generally to semiconductor manufacturing equipment. More particularly, embodiments of the present disclosure relate to a transfer chamber for semiconductor manufacturing. [Background technology]

[0002]

[0002] Large multi-chamber processing tools, also called cluster tools, are commonly used in semiconductor manufacturing. Typically, multiple process chambers are arranged around a central transfer station. To perform a given process on a substrate, a robot in the central transfer station moves the substrate between the various process chambers in a coordinated sequence. The process chambers commonly used in cluster tools include, for example, atomic layer deposition (ALD) chambers, chemical vapor deposition (CVD) chambers, physical vapor deposition (PVD) chambers, etching chambers, conditioning chambers, treatment chambers, heating chambers, etc.

[0003]

[0003] Often, the wafer handling requirements for a process require additional wafer chamber space (e.g., for load locks, heating stations, cooling stations, or combination function stations) to meet throughput or process requirements. Thus, there is a need for an apparatus and method for increasing the number of available substrate processing stations without increasing the overall footprint of a cluster tool. Summary of the Invention

[0004]

[0004] One or more embodiments of the present disclosure are directed to a load lock chamber comprising a middle section, an upper section, and a lower section. The middle section has an inner surface encompassing a middle space and an outer surface with a first middle facet configured to be coupled to a cluster tool. The first middle facet has a slit valve opening providing access to the middle space through the outer surface. The upper section is disposed along an axis of the chamber and coupled to an upper portion of the middle section. The upper section has an inner surface encompassing an upper space. The upper section is separable from the middle section by an upper movable partition. The lower section is disposed along an axis of the chamber and coupled to a lower portion of the middle section. The lower section has an inner surface encompassing a lower space and is separable from the middle section by a lower movable partition.

[0005]

[0005] A further embodiment of the present disclosure is directed to a processing method, the method comprising: generating a process environment in an intermediate space of a intermediate section of a load lock chamber having an intermediate section, an upper section, and a lower section arranged along an axis of the load lock chamber, the upper section being coupled to an upper part of the intermediate section, the lower section being coupled to a lower part of the intermediate section, the upper section being separable from the intermediate section by an upper movable partition, and the lower section being separable from the intermediate section by a lower movable partition; generating a process environment in an upper space of the upper section, the upper space having an upper substrate support coupled to an upper motor, the upper motor being configured to move the upper substrate support between the upper space and the intermediate space; opening the upper partition to allow the upper substrate support to move between the upper space and the intermediate space; moving the upper substrate support from the upper space to the intermediate space or from the intermediate space to the upper space; the lower space having a lower substrate support coupled to a lower motor configured to move the lower substrate support between the lower space and the intermediate space; opening the lower partition to allow the lower substrate support to move between the lower space and the intermediate space; moving the lower substrate support from the lower space to the intermediate space or from the intermediate space to the lower space; closing the lower partition to isolate the lower space from the intermediate space; opening a slit valve in a facet of an outer surface of the intermediate section to allow access to the intermediate space through the outer surface; accessing the intermediate space through the slit valve in the outer surface to move a substrate between the intermediate space and outside of the load lock chamber; and closing the slit valve in the facet of the outer surface of the intermediate section to isolate the intermediate space from the outer surface.

[0006] Further embodiments of the present disclosure are directed to a non-transitory computer readable medium having instructions which, when executed by a controller of a load lock chamber, cause the load lock chamber to perform operations of generating a process environment in one or more of an intermediate space, an upper space, or a lower space of the load lock chamber, opening and closing one or more of an upper partition or a lower partition to enable and / or prevent movement between the upper space and / or the lower space and the intermediate space, moving one or more of an upper substrate support or a lower substrate support between the upper space and the intermediate space or between the lower space and the intermediate space, opening and closing one or more slit valves in one or more facets of the intermediate section, upper section, or lower section, and accessing one or more of the intermediate space, upper space, or lower space through a slit valve.

[0007]

[0007] In order to allow the above-mentioned features of the present disclosure to be understood in detail, the present disclosure briefly summarized above will be more particularly described with reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings show only typical embodiments of the present disclosure, and therefore should not be considered as limiting the scope of the present disclosure, since the present disclosure may admit of other equally effective embodiments. [Brief description of the drawings]

[0008] [Figure 1] 1 illustrates a cluster tool in accordance with one or more embodiments of the present disclosure. [Diagram 2]

[0009] 1 shows a schematic cross-sectional view of a load lock chamber in accordance with one or more embodiments of the present disclosure. [Diagram 3]

[0010] FIG. 2 illustrates an isometric view of a load lock chamber in accordance with one or more embodiments of the present disclosure. [Figure 4]

[0011] FIG. 2 illustrates an isometric view of a load lock chamber in accordance with one or more embodiments of the present disclosure. [Diagram 5]

[0012] FIG. 2 illustrates an isometric view of a load lock chamber in accordance with one or more embodiments of the present disclosure. [Figure 5A]

[0013] 1 illustrates an isometric view of a substrate support for use with a load lock chamber in accordance with one or more embodiments of the present disclosure. [Figure 6A]

[0014] 6A-6C show cross-sectional schematic views of a load lock chamber in use in accordance with one or more embodiments of the present disclosure. [Figure 6B] 6A-6C show cross-sectional schematic views of a load lock chamber in use in accordance with one or more embodiments of the present disclosure. [Figure 6C] 6A-6C show cross-sectional schematic views of a load lock chamber in use in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009]

[0015] Before describing certain example embodiments of the present disclosure, it is to be understood that the present disclosure is not limited to the details of construction or process steps set forth in the following description as being capable of other embodiments and of being practiced or carried out in various ways.

[0010]

[0016] The term "substrate" as used herein and in the appended claims refers to a surface or a portion of a surface on which a process acts. It will also be appreciated by those skilled in the art that when reference is made to a substrate, it may refer to only a portion of the substrate unless the context clearly indicates otherwise. Furthermore, when reference is made to deposition on a substrate, it may refer to both a bare substrate and a substrate on which one or more films or features have been deposited or formed.

[0011]

[0017] As used herein, "substrate" refers to any substrate or material surface formed on a substrate on which a film treatment is performed during a manufacturing process. For example, substrate surfaces on which treatment may be performed include materials such as silicon, silicon oxide, strained silicon, silicon-on-insulator (SOI), carbon-doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials, depending on the application. Substrates include, but are not limited to, semiconductor wafers. Substrates may be exposed to pretreatment processes to polish, etch, reduce, oxidize, hydroxylate, anneal, UV cure, electron beam (e-beam) cure, and / or bake the substrate surface. In addition to performing film treatments directly on the substrate surface itself, the present disclosure may also perform any of the disclosed film treatment steps on an underlying layer formed on the substrate, as described in more detail below, and the term "substrate surface" is intended to include such underlying layers as the context indicates. Thus, for example, if a film / layer or partial film / layer is being deposited on a substrate surface, the exposed surface of the newly deposited film / layer becomes the substrate surface.

[0012]

[0018] FIG. 1 illustrates a cluster tool 100 for semiconductor manufacturing processes. The illustrated cluster tool 100 includes at least one central transfer station 121, 131 having multiple sides. In the illustrated embodiment, the cluster tool 100 includes a first central transfer station 121 and a second central transfer station 131. The term "central" as used in this manner does not imply a specific location; rather, the term refers to a general description of the components to which two or more chambers are coupled and through which substrates pass during processing. Each central transfer station 121, 131 includes at least one robot 125, 135 disposed therein. The robot 125, 135 is configured to move at least one robot blade 126, 136 and the wafer 101 to each side of the central transfer station 121, 131. Each side of the central transfer station 121, 131 has at least one chamber coupled thereto.

[0013]

[0019] The illustrated cluster tool 100 includes multiple processing chambers 102, 104, 106, 110, 112, 114, 116, and 118, also referred to as process stations, coupled to a central transfer station. The various processing chambers provide separate processing regions isolated from adjacent processing stations. The processing chambers can be any chamber including, but not limited to, a pre-clean chamber, a buffer chamber, a transfer space(s), a wafer orienter / degassing chamber, a cryogenic cool-down chamber, a deposition chamber, an annealing chamber, an etching chamber, and a crystallization agent removal chamber. The particular arrangement of process chambers and components may vary depending on the cluster tool and should not be construed as limiting the scope of the present disclosure.

[0014]

[0020] The deposition chamber in some embodiments comprises one or more of an atomic layer deposition chamber, a plasma enhanced atomic layer deposition chamber, a chemical vapor deposition chamber, a plasma enhanced chemical vapor deposition chamber, or a physical deposition chamber. In some embodiments, the cluster tool 100 includes a pre-clean chamber coupled to the central transfer station.

[0015]

[0021] 1, a factory interface 150 is coupled to the front of the cluster tool 100. The factory interface 150 includes a loading chamber 154 and an unloading chamber 156 on the front side 151 of the factory interface 150. Although the loading chamber 154 is shown on the left and the unloading chamber 156 is shown on the right, one of ordinary skill in the art will appreciate that this is merely representative of one possible configuration.

[0016]

[0022] The size and shape of the loading chamber 154 and the unloading chamber 156 can vary depending on, for example, the substrate being processed in the cluster tool 100. In the illustrated embodiment, the loading chamber 154 and the unloading chamber 156 are sized to hold a wafer cassette with multiple wafers disposed within the cassette.

[0017]

[0023] A robot 152 is in the factory interface 150 and is configured to move between the loading chamber 154 and the unloading chamber 156. The robot 152 is configured to transfer the wafer 101 from a cassette in the loading chamber 154 through the factory interface 150 to the load lock chamber 160. The robot 152 is also configured to transfer the wafer 101 from the load lock chamber 162 through the factory interface 150 to a cassette in the unloading chamber 156. As will be appreciated by those skilled in the art, the factory interface 150 can include multiple robots 152. For example, the factory interface 150 can include a first robot that transfers wafers between the loading chamber 154 and the load lock chamber 160 and a second robot that transfers wafers 101 between the load lock chamber 162 and the unloading chamber 156.

[0018]

[0024] The illustrated cluster tool 100 has a first section 120 and a second section 130. The first section 120 is coupled to the factory interface 150 through load lock chambers 160, 162. The first section 120 includes a first transfer chamber 121 with at least one robot 125 disposed therein. The robot 125 is also referred to as a robotic wafer transfer mechanism. The first transfer chamber 121 is centrally positioned with respect to the load lock chambers 160, 162, the process chambers 102, 104, 116, 118, and the buffer chambers 122, 124. The robot 125 in some embodiments is a multi-arm robot capable of independently moving multiple wafers at a time. In some embodiments, the first transfer chamber 121 includes multiple robotic wafer transfer mechanisms. The robot 125 in the first transfer chamber 121 is configured to move wafers between chambers around the first transfer chamber 121. Individual wafers are supported on a wafer transport blade positioned at the distal end of the first robotic mechanism.

[0019]

[0025] After processing the wafer in the first section 120, the wafer may move through a pass-through chamber to the second section 130. For example, the chambers 122, 124 may be unidirectional or bidirectional pass-through chambers. The pass-through chambers 122, 124 may be used, for example, to cryo-cool the wafer before processing in the second section 130 or to allow for wafer cooling or post-processing before returning to the first section 120.

[0020]

[0026] A system controller 190 communicates with the first robot 125, the second robot 135, the first plurality of processing chambers 102, 104, 116, 118, and the second plurality of processing chambers 106, 110, 112, 114. The system controller 190 may be any suitable component capable of controlling the processing chambers and robots. For example, the system controller 190 may be a computer including a central processing unit, memory, suitable circuitry, and storage.

[0021]

[0027] The processes may generally be stored in the memory of the system controller 190 as software routines that, when executed by a processor, cause the process chamber to perform the processes of the present disclosure. The software routines may also be stored and / or executed by a second processor (not shown) located remotely from the hardware controlled by the processor. Some or all of the methods of the present disclosure may also be performed in hardware. Thus, the processes may be implemented in software and executed in hardware using a computer system, for example, as an application specific integrated circuit or other type of hardware implementation, or as a combination of software and hardware. The software routines, when executed by a processor, transform a general-purpose computer into a special-purpose computer (controller) that controls the operation of the chamber so that processing is performed.

[0022]

[0028] One or more embodiments of the present disclosure are directed to an apparatus and method that allows a facet of a single transfer chamber of a cluster tool to accommodate multiple wafer spaces. In some embodiments, the multiple wafer spaces are used as load locks, heating spaces, cooling spaces, combinations of these functions, etc. This can be accomplished without requiring additional Z-axis motion from the vacuum robot (as the wafer chamber spaces provide this).

[0023]

[0029] The disclosed embodiments allow for the modification of existing systems without the need to modify the decompression robot Z-axis, transfer chamber space, etc. Some embodiments provide the ability to double the number of ware chamber spaces for an existing number of transfer chamber facets, an existing decompression robot Z-axis, and an existing transfer chamber; typically, only two load lock facets (each with a single ware transfer surface for the decompression robot) are provided; with this approach, the number of load lock facets can be doubled without modifying the single ware transfer surface, the Z-axis robot, etc.

[0024]

[0030] Some embodiments of the present disclosure provide an apparatus that creates three spaces at each load lock facet (upper, middle, and lower spaces). In some embodiments, the apparatus is referred to as a load lock chamber. Those skilled in the art will understand that this term is used to describe the claimed apparatus because the middle space can act similarly to a load lock chamber. The middle space interacts with the transfer chamber and the upper and lower spaces. In some embodiments, the upper and lower spaces interact with the middle space, which interacts with the factory interface (FI).

[0025]

[0031] Spatially relative terms, such as "below," "lower," "lower side," "up," "above," "upper," and the like, may be used herein to facilitate describing the relationship of one element or feature to another element(s) or feature(s) as depicted in the drawings. It should be understood that the spatially relative terms are intended to encompass various orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if a device in the drawings were turned over, an element described as "below" or "below" the other element or feature would be oriented "above" the other element or feature. Thus, the exemplary term "below" may include both an orientation above and below. The device may be otherwise oriented (rotated 10 degrees or to other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0026]

[0032] In an exemplary embodiment, the wafer moves from the FI through the upper or lower space into the mainframe. The upper or lower space is pumped down to a desired vacuum level. Once that vacuum level is achieved, a large door between the intermediate space and the upper or lower space opens. This allows the wafer to be moved into the intermediate space. The vacuum robot in the transfer chamber can interact with the wafer once it has been moved into this intermediate space. While the upper space is interacting with the transfer chamber (through the intermediate space), the lower space can interact with the FI and can be pumped or vented, heated or cooled, etc. This can be done at a different pressure than the upper and intermediate spaces (which are now a single space because the door between the upper and intermediate spaces is open). The spaces can be adjusted to accommodate whatever number of wafers is selected.

[0027]

[0033] In some embodiments, heating and / or cooling stations are integrated into the volume. In some embodiments, heating and / or cooling is built into the substrate supports in the upper and lower volumes. Some embodiments have variable pitch load locks to accommodate multiple wafers.

[0028]

[0034] 2-5 illustrate one or more embodiments of a load lock chamber 200. Figure 2 illustrates a schematic cross-sectional view of the load lock chamber 200. The shading used in the figures is intended to help distinguish components and should not be construed as limiting a particular material of construction.

[0029]

[0035] 2 and 3, there is shown one or more embodiments of a load lock chamber 200. The mid-section 220 of the load lock chamber 200 has an inner surface 222 and an outer surface 224 that define a wall thickness of the mid-section. The inner surface 222 contains an intermediate space 226.

[0030]

[0036] The outer surface 224 has a first intermediate facet 228. When used in this manner, the term "facet" refers to a portion of the subject device having a shaped surface configured to interact with a surface of another component. For example, the facet shown in FIG. 3 is flat and couples to a flat surface on the exterior of the second central transfer station 131, as shown in FIG. 1. The first intermediate facet 228 is configured to couple with the cluster tool 100 and has a slit valve opening 229. The slit valve opening 229 provides access to the intermediate space 226 through the outer surface 224 and walls of the intermediate section 220.

[0031]

[0037] The load lock chamber 200 has an axis 205 that is vertically oriented for purposes of explanation only. Components described using vertical descriptors (e.g., above, upper, lower, underneath) are spaced apart along the axis 205. In some embodiments, the axis 205 is referred to as the Z-axis. In some embodiments, the axis 205 is said to extend along a first direction. Those skilled in the art will recognize that the use of spatial direction language does not imply a fixed orientation in space.

[0032]

[0038] The load lock chamber 200 includes an upper section 240 disposed along axis 205 above the middle section 220. The upper section 240 is coupled to an upper portion 221 of the middle section 220. In one embodiment shown, the upper section 240 couples to the upper portion 221 of the middle section 220 through an upper partition section, as described further below. In some embodiments, the upper section 240 couples directly to the upper portion 221 of the middle section 220 without an intervening section.

[0033]

[0039] The upper section 240 has an inner surface 242 and an outer surface 244 that define a wall thickness of the upper section 240. The inner surface 242 encompasses an upper space 246. The boundary of the upper space 246 relative to the middle space 226 is not particularly limited in the absence of a physical barrier therebetween. When a physical barrier, such as a partition 235, is disposed between the upper space 246 and the middle space 226, the physical barrier defines the boundary between the upper space 246 and the middle space 226.

[0034]

[0040] The upper section 240 can be separated from the middle section 220 by the upper movable partition 235. Stated another way, in some embodiments, the upper space 246 can be separated from the middle space 226 by the upper movable partition 235.

[0035]

[0041] In some embodiments, an upper movable partition 235 resides within an upper partition section 230 of the load lock chamber 200. The upper partition section 230 has an inner surface 232 and an outer surface 234. The inner surface 232 encompasses an upper partition space 236. The movable upper partition 235 resides within the upper partition space 236.

[0036]

[0042] In some embodiments, the upper partition section 230 includes an upper partition actuator 238. The upper partition actuator 238 may be any suitable actuator / motor known to one of ordinary skill in the art for use in a reduced pressure processing chamber configured to move the partition 235. In some embodiments, the upper partition actuator 238 is configured to move the upper partition 235 from a sealed position (as shown in FIG. 2) between the middle section 220 and the upper section 240 to an open position (as shown in FIG. 6A) in which the partition 235 does not form a boundary to the upper space 246 or the middle space 226.

[0037]

[0043] In some embodiments, the upper partition section 230 has an extension 237 that extends horizontally relative to the axis 205. For example, the extension 237 of the upper partition section 230 of some embodiments is in an X-Y plane perpendicular to the axis 205. In some embodiments, an upper partition actuator moves the upper partition 235 at an angle in the range of 80 degrees to 110 degrees relative to the chamber axis 205. Those skilled in the art will recognize that the upper partition can move in either direction relative to the chamber axis 205 depending on the orientation of the load lock chamber 200. For example, the direction of movement of the upper partition in the illustrated drawings may be opposite to the mirror image components.

[0038]

[0044] In some embodiments, the upper partition actuator 238 is configured to move the upper partition 235 into the extension portion 237. When in the extension portion 237, the upper partition 235 is in an open position.

[0039]

[0045] The load lock chamber 200 includes a lower section 260 disposed along the axis 205 below the middle section 220. Stated another way, in some embodiments, the lower section 260 is on the side of the middle section 220 opposite the upper section 240 along the chamber axis 205. The lower section 260 is coupled to a lower portion 223 of the middle section 220. In one embodiment shown, the lower section 260 couples to the lower portion 223 of the middle section 220 via a lower partition section 250, as described further below. In some embodiments, the lower section 260 couples directly to the lower portion 223 of the middle section 220 without an intervening section.

[0040]

[0046] The lower section 260 has an inner surface 262 and an outer surface 264 that define a wall thickness of the lower section 260. The inner surface 262 encompasses a lower space 266. The boundary of the lower space 266 relative to the intermediate space 226 is not particularly limited in the absence of a physical barrier therebetween. When a physical barrier, such as a partition 255, is disposed between the lower space 266 and the intermediate space 226, the physical barrier defines the boundary between the lower space 266 and the intermediate space 226.

[0041]

[0047] The lower section 260 can be isolated from the middle section 220 by the lower movable partition 255. Stated another way, in some embodiments, the lower space 266 can be isolated from the middle space 226 by the lower movable partition 255.

[0042]

[0048] In some embodiments, a lower movable partition 255 is located within a lower partition section 250 of the load lock chamber 200. The lower partition section 250 has an inner surface 252 and an outer surface 254. The inner surface 252 contains a lower partition space 256. The movable lower partition 255 is located within the lower partition space 256.

[0043]

[0049] In some embodiments, the lower partition section 250 includes a lower partition actuator 258. The lower partition actuator 258 may be any suitable actuator / motor known to one of ordinary skill in the art for use in a reduced pressure processing chamber configured to move the partition 255. In some embodiments, the lower partition actuator 258 is configured to move the lower partition 255 from a sealed position (as shown in FIG. 2) between the middle section 220 and the lower section 260 to an open position (as shown in FIG. 6C) in which the partition 255 does not form a boundary to the lower space 266 or the middle space 226.

[0044]

[0050] In some embodiments, the lower partition portion 250 has an extension portion 257 that extends horizontally relative to the axis 205. For example, the extension portion 257 of the lower partition portion 250 of some embodiments lies in an X-Y plane perpendicular to the axis 205. In some embodiments, a lower partition actuator 258 moves the lower partition 255 at an angle relative to the chamber axis 205 within a range of 80 degrees to 110 degrees.

[0045]

[0051] In some embodiments, the lower partition actuator 258 is configured to move the lower partition 255 into the extension portion 257. When in the extension portion 257, the lower partition 255 is in an open position.

[0046]

[0052] The upper substrate support 270 is positioned within the upper section 240 and is movable to the middle section 220 when the upper partition 235 is in the open position. In some embodiments, an upper motor 272 (shown in FIG. 3 ) is coupled to the upper section 240. The upper motor 272 is configured to move the upper substrate support 270 between the upper section 240 and the middle section 220 along the chamber axis 205. The upper motor 272 in FIG. 3 is coupled to the upper section 240 via an upper piston 274. The upper motor 272 includes a motor, gas pressure, hydraulic pressure, or other component capable of moving the upper substrate support 270 along the chamber axis 205.

[0047]

[0053] The lower substrate support 280 is positioned within the lower section 260 and is movable to the middle section 220 when the lower partition 255 is in the open position. In some embodiments, a lower motor 282 (shown in FIG. 3 ) is coupled to the lower section 260. The lower motor 282 is configured to move the lower substrate support 280 between the lower section 260 and the middle section 220 along the chamber axis 205. The lower motor 282 in FIG. 3 is coupled to the lower section 260 via a lower piston 284. The lower motor 282 includes a motor, gas pressure, hydraulic pressure, or other components capable of moving the lower substrate support 280 along the chamber axis 205.

[0048]

[0054] 4, some embodiments of the load lock chamber 200 include a second intermediate facet 328 on the outer surface 224 of the middle section 220. The second intermediate facet 328 has a second slit valve opening 329 providing access to the intermediate space 226 through the outer surface 224 and wall of the middle section 220.

[0049]

[0055] In one embodiment shown, the second intermediate facet 328 is approximately 90 degrees about the chamber axis 205 from the first intermediate facet 228. In some embodiments, the plane formed by the second intermediate facet 328 is at an angle within a range of 15 degrees to 180 degrees about the chamber axis 205 from the first intermediate facet 228.

[0050]

[0056] In some embodiments, the second intermediate facet 328 is configured to be coupled to a second facet of a cluster tool. For example, referring to FIG. 1, the second intermediate facet 328 of the load lock chamber 200 faces the side of the processing chamber 110 and forms a connection to the processing chamber 110. In some embodiments, the load lock chamber 200 is in place of the buffer chamber 122 and / or the buffer chamber 124 between the first section 120 and the second section 130 of the cluster tool 100. In some such embodiments, the load lock chamber 200 has a first intermediate facet 228 coupled to the first central transfer station 121 and a second intermediate facet 328 coupled to the second central transfer station 131.

[0051]

[0057] In some embodiments, the second intermediate facet 328 is configured for atmospheric pressure operation. For example, the second intermediate facet 328 in some embodiments is configured as a factory interface for the mid section 220 to allow for movement of wafers into and out of the cluster tool 100.

[0052]

[0058] 4, one or more of the upper section 240 or the lower section 260 includes a facet 348, 368 for interacting with another component. In some embodiments, the outer surface 244 of the upper section 240 has an upper facet 348, and an upper slit valve opening 349 provides access to the upper space 246 through the outer surface 244 and wall of the upper section 240.

[0053]

[0059] In some embodiments, the upper facet 348 is configured for atmospheric pressure operation. In some embodiments, the upper facet 348 is configured as a factory interface for the upper section 240 to allow for movement of wear in and out of the cluster tool 100.

[0054]

[0060] In some embodiments, the outer surface 264 of the lower section 260 has a lower facet 368 and a lower slit valve opening 369 provides access to the lower space 266 through the outer surface 264 and the wall of the lower section 260.

[0055]

[0061] In some embodiments, the lower facet 368 is configured for atmospheric pressure operation. In some embodiments, the lower facet 368 is configured as a factory interface for the lower section 260 to allow for movement of wafers in and out of the cluster tool 100.

[0056]

[0062] 5 illustrates one embodiment of a load lock chamber 200 comprising a middle section 220 having a first middle facet 228 and a second middle facet 328. The walls of the upper section 240 and the lower section 260 have been omitted to illustrate the substrate supports 270, 280 coupled to the pistons 274, 284.

[0057]

[0063] The upper substrate support 270 and the lower substrate support 280 may be the same type of support system or may be different. FIG. 5A illustrates the upper substrate support 270 in accordance with one or more embodiments of the present disclosure. The wafer 101 is illustrated in phantom to show the orientation in which the substrate would be supported. Those skilled in the art will appreciate that the lower substrate support 280 may be of the same configuration as illustrated in FIG. 5A and that the embodiments described herein with respect to the upper substrate support 270 are applicable to the lower substrate support 280.

[0058]

[0064] In some embodiments, the upper substrate support 270 comprises a number of support beams 311 spaced apart around the chamber axis 205. Each of the support beams 311 has a number of support fingers 314 extending inwardly therefrom. The support fingers are spaced apart along the chamber axis 205 such that the substrate 101 may be supported on a support surface 316 of the support fingers 314 of each support beam 311.

[0059]

[0065] In some embodiments, the substrate support comprises multiple heating and / or cooling plates 318. In the embodiment shown in Figure 5A, for purposes of illustration, only one heating and / or cooling plate 318 is shown. However, one skilled in the art will appreciate that multiple heating and / or cooling plates 318, similar to the support fingers 314, can be spaced apart along the chamber axis 205.

[0060]

[0066] Some embodiments of the cluster tool 100 include a controller 190 configured to perform one or more operations to operate the load lock chamber 200, as shown in Figure 1. In some embodiments, the controller 190 is configured to perform one or more of opening and closing the partitions 235, 255, actuating the motors 272, 282 to move the substrate supports 270, 280, opening and closing one or more slit valves 229, 329, 349, 369, opening and closing one or more atmospheric interfaces, heating the substrate support, cooling the substrate support, and enabling gas flow into and out of the load lock chamber 200, the middle section 220, the upper section 240, and / or the lower section 260, individually.

[0061]

[0067] 6A-6C illustrate a method of using the load lock chamber 200. In FIG. 6A, the upper partition 235 is moved into the upper partition extension 237, thereby joining the middle space 226 and the upper space 246. The upper substrate support 270 is moved into the mid section 220, thereby allowing the substrate to be accessed through the slit valve 229.

[0062]

[0068] Prior to opening the upper partition 235, process environments are generated in the middle section 220 (middle space 226) and the upper section (upper space 246). The process environments in the middle space 226 and upper space 246 are sufficiently similar so that opening the partition 235 does not result in unintended gas phase reactions.

[0063]

[0069] After the use, removal, or addition of substrates to the upper substrate support 270 is completed, the upper substrate support 270 is moved to the upper space 246 of the upper section 240. As shown in FIG. 6B, the movable upper partition 235 is moved to a closed position to isolate the upper space 246 from the intermediate space 226.

[0064]

[0070] In the configuration of FIG. 6B, each of the middle section 220, the upper section 240, and the lower section 260 can have the same or different process environments. In some embodiments, one or more of the upper section 240 or the lower section 260 has process conditions for processing a substrate, heating a substrate, cooling a substrate, reacting with a film on a substrate, depositing a film on a substrate, and / or etching a film on a substrate. The upper section 240 and / or the lower section 260 can be used as a process chamber for any suitable process. In some embodiments, when the substrate supports 270, 280 are in the middle space 226, the middle section 220 is used as a process chamber as described above.

[0065]

[0071] In some embodiments, the isolated intermediate space 226 is modified to approximate the process conditions produced in the lower section 260. The movable lower partition 255 can then be moved to an open position, as shown in FIG. 6C. The lower substrate support 280 can then be moved into the intermediate section 220.

[0066]

[0072] Some embodiments of the method of operation include generating a process environment in an upper space of an upper section, the upper space having an upper substrate support coupled to an upper motor configured to move the upper substrate support between the upper space and the intermediate space; opening an upper partition to allow the upper substrate support to move between the upper space and the intermediate space; moving the upper substrate support from the upper space to the intermediate space or from the intermediate space to the upper space; closing the upper partition to isolate the upper space from the intermediate space; generating a process environment in a lower space of a lower section, the lower space having a lower substrate support coupled to a lower motor configured to move the lower substrate support between the lower space and the intermediate space; the intermediate space; opening the lower partition to allow the lower substrate support to move between the lower space and the intermediate space; moving the lower substrate support from the lower space to the intermediate space or from the intermediate space to the lower space; closing the lower partition to isolate the lower space from the intermediate space; opening a slit valve in a facet of the outer surface of the intermediate section to allow access to the intermediate space through the outer surface; accessing the intermediate space through the slit valve in the outer surface to move the substrate between the intermediate space and outside of the load lock chamber; and / or closing the slit valve in the facet of the outer surface of the intermediate section to isolate the intermediate space from the outer surface.

[0067]

[0073] One or more embodiments of the present disclosure are directed to a non-transitory computer readable medium that includes instructions that, when executed by a controller of a load lock chamber, cause the load lock chamber to perform operations of generating a process environment in one or more of an intermediate space, an upper space, or a lower space of the load lock chamber, opening and closing one or more of an upper partition or a lower partition to enable and / or prevent movement between the upper space and / or the lower space and the intermediate space, moving one or more of an upper substrate support or a lower substrate support between the upper space and the intermediate space or between the lower space and the intermediate space, opening and closing one or more slit valves in one or more facets of the intermediate section, upper section, or lower section, and accessing one or more of the intermediate space, upper space, or lower space through a slit valve.

[0068]

[0074] In the context of describing the materials and methods described herein (particularly in the context of the claims below), the use of the terms "a" and "an" as well as "the" and similar referents are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. Recitation of ranges of values ​​herein is merely intended to serve as a shorthand method of individually referring to each individual value falling within the range, unless otherwise indicated herein, and each individual value is incorporated into the specification as if it were individually recited herein. All methods described herein may be performed in any suitable order, unless otherwise indicated herein or clearly contradicted by context. The use of any and all examples or exemplary language (e.g., "such as") provided herein is intended merely to better describe the materials and methods and does not limit the scope, unless otherwise claimed. No language in the specification should be construed as indicating any element not claimed as essential to the practice of the disclosed materials and methods.

[0069]

[0075] References throughout this specification to "one embodiment," "certain embodiment," "one or more embodiments," or "an embodiment" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment is included in at least one embodiment of the disclosure. Thus, the appearances of "in one or more embodiments," "in a particular embodiment," "in one embodiment," or "in an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment of the disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0070]

[0076] Although the disclosure herein has been described with reference to specific embodiments, it should be understood that these embodiments are merely illustrative of the principles and applications of the disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed method and apparatus without departing from the spirit and scope of the disclosure. Thus, it is intended that the present invention cover such modifications and variations as come within the scope of the appended claims and their equivalents.

Claims

1. A load lock chamber comprising: an intermediate section having an inner surface containing an intermediate space and an outer surface with a first intermediate facet configured to couple to a cluster tool, the first intermediate facet having a slit valve opening providing access to the intermediate space through the outer surface; an upper section disposed along the axis of the chamber and connected to a top of the middle section, the upper section having an inner surface enclosing an upper space and separable from the middle section by an upper movable partition; a lower section disposed along the axis of the chamber and connected to a lower portion of the middle section, the lower section having an inner surface enclosing a lower space and separable from the middle section by a lower movable partition; the upper movable partition is in an upper partition section and the lower movable partition is in a lower partition section, the upper partition section and the lower partition section extending horizontally with respect to an axis of the chamber; A load lock chamber, wherein the upper partition section comprises an upper moveable partition actuator configured to move the upper moveable partition from a sealed position between the middle section and the upper section to an open position.

2. 2. The load lock chamber of claim 1, wherein the upper movable partition actuator moves the upper movable partition at an angle in the range of 80 degrees to 110 degrees relative to an axis of the chamber.

3. 2. The load lock chamber of claim 1, wherein the lower partition section comprises a lower moveable partition actuator configured to move the lower moveable partition from a sealed position between the middle section and the lower section to an open position.

4. 4. The load lock chamber of claim 3, wherein the lower movable partition actuator moves the lower movable partition at an angle in the range of 80 degrees to 110 degrees relative to an axis of the chamber.

5. 10. The load lock chamber of claim 1, further comprising an upper motor coupled to the upper section, the upper motor configured to move an upper substrate support between the upper section and the middle section along an axis of the chamber.

6. 6. The load lock chamber of claim 5, wherein the upper substrate support comprises a plurality of support beams spaced apart about an axis of the chamber, each of the support beams having a plurality of support fingers extending inwardly therefrom and spaced apart along an axis of the chamber such that a substrate may be supported on support fingers from each of the support beams.

7. 6. The load lock chamber of claim 5, wherein the upper substrate support comprises a plurality of heating and / or cooling plates spaced along an axis of the chamber, each of the heating and / or cooling plates configured to support a substrate.

8. 10. The load lock chamber of claim 1, further comprising a lower motor coupled to the lower section, the lower motor configured to move a lower substrate support between the lower section and the middle section along an axis of the chamber.

9. 9. The load lock chamber of claim 8, wherein the lower substrate support comprises a plurality of support beams spaced apart about an axis of the chamber, each of the support beams having a plurality of support fingers extending inwardly therefrom and spaced apart along an axis of the chamber such that a substrate may be supported on support fingers from each of the support beams.

10. 9. The load lock chamber of claim 8, wherein the lower substrate support comprises a plurality of heating and / or cooling plates spaced along an axis of the chamber, each of the heating and / or cooling plates configured to support a substrate.

11. A load lock chamber comprising: an intermediate section having an inner surface containing an intermediate space and an outer surface with a first intermediate facet configured to couple to a cluster tool, the first intermediate facet having a slit valve opening providing access to the intermediate space through the outer surface; an upper section disposed along the axis of the chamber and connected to a top of the middle section, the upper section having an inner surface enclosing an upper space and separable from the middle section by an upper movable partition; a lower section disposed along the axis of the chamber and connected to a lower portion of the middle section, the lower section having an inner surface enclosing a lower space and separable from the middle section by a lower movable partition; the outer surface of the intermediate section further comprising a second intermediate facet having a second slit valve opening therethrough providing access to the intermediate space.

12. The load lock chamber of claim 11 , wherein the second intermediate facet is configured to be coupled to a second facet of the cluster tool.

13. The load lock chamber of claim 11 , wherein the second middle facet is configured for atmospheric pressure operation to act as a mid-section factory interface.

14. 2. The load lock chamber of claim 1, wherein the outer surface of the upper section comprises an upper facet having an upper slit valve opening providing access to the upper volume through the outer surface.

15. 2. The load lock chamber of claim 1, wherein the outer surface of the lower section comprises a lower facet having a lower slit valve opening providing access to the lower volume through the outer surface.

16. 10. The load lock chamber of claim 1, further comprising a controller configured to perform one or more of: opening and closing the upper and lower movable partitions; actuating a motor to move a substrate support; opening and closing one or more slit valves; and opening and closing one or more atmospheric interfaces.

17. generating a process environment in an intermediate space of a middle section of a load lock chamber having a middle section, an upper section, and a lower section arranged along an axis of the load lock chamber, the upper section being connected to an upper portion of the middle section, the lower section being connected to a lower portion of the middle section, the upper section being separable from the middle section by an upper movable partition, and the lower section being separable from the middle section by a lower movable partition; generating a process environment in an upper space of the upper section, the upper space having an upper substrate support coupled to an upper motor and an upper movable partition in an upper partition section extending horizontally relative to the axis of the load lock chamber, the upper motor configured to move the upper substrate support between the upper space and the intermediate space, the upper partition section comprising an upper movable partition actuator configured to move the upper movable partition from a sealed position between the intermediate section and the upper section to an open position; opening the upper movable partition to allow the upper substrate support to move between the upper space and the intermediate space; moving the upper substrate support from the upper space to the intermediate space or from the intermediate space to the upper space; closing the upper movable partition to isolate the upper space from the middle space; generating a process environment in a lower space of the lower section, the lower space having a lower substrate support coupled to a lower motor, the lower motor configured to move the lower substrate support between the lower space and the intermediate space; opening the lower movable partition to allow the lower substrate support to move between the lower space and the intermediate space; moving the lower substrate support from the lower space to the intermediate space or from the intermediate space to the lower space; closing the lower movable partition to isolate the lower space from the intermediate space; opening a slit valve in a facet of the outer surface of the intermediate section to allow access to the intermediate space through the outer surface; accessing the intermediate space through the slit valve in the outer surface for moving a substrate between the intermediate space and a space outside the load lock chamber; and and closing the slit valve in the facet of the outer surface of the intermediate section to isolate the intermediate space from the outer surface.

18. 1. A semiconductor manufacturing chamber comprising: a mid-section including an intermediate space; an upper section connected to an upper portion of the intermediate section and including an upper space; an upper partition section between the middle section and the upper section, the upper partition section having an upper movable partition therein for isolating the upper space from the middle space; a lower section connected to a lower portion of the intermediate section and including a lower space; a lower partition section between the middle section and the lower section, the lower partition section having a lower movable partition therein for isolating the lower space from the middle space; Equipped with the upper and lower partition sections extend horizontally relative to an axis of the semiconductor manufacturing chamber; 1. A semiconductor manufacturing chamber, wherein the upper partition section comprises an upper moveable partition actuator configured to move the upper moveable partition from a sealed position between the middle section and the upper section to an open position.

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