Spectroscopic module and method for manufacturing the same

Abstract

The spectroscopic module includes a support having a bottom wall and a side wall surrounding a space on one side of the bottom wall; a spectroscopic section provided on one side of the bottom wall and having a plurality of grating grooves; a photodetector element attached to the side wall so as to face the spectroscopic section across the space and having a plurality of photodetection channels; and a wiring unit provided on the surface of the support along the surface opposite the space of the support and having a plurality of first terminals electrically connected to the photodetector element, a plurality of second terminals facing the plurality of first terminals respectively and joined to the plurality of first terminals respectively, and a plurality of third terminals electrically connected to the plurality of second terminals respectively.

Description

[Technical field]

[0001] The present disclosure relates to a spectroscopic module and a method for manufacturing a spectroscopic module. [Background technology]

[0002] A spectroscopic module is known that includes a light-transmitting member, a spectroscopic module having a spectroscopic section and a light detection element that are provided in the light-transmitting member so as to face each other via the light-transmitting member, a package that houses the spectroscopic module, and a lead that is provided in the package and is electrically connected to the light detection element (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-210416 A Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned spectroscopic module may be mounted on a rigid wiring board for use. In this case, the package may be distorted due to stress generated during mounting, or due to thermal distortion generated in the rigid wiring board after mounting. However, in the above-mentioned spectroscopic module, the spectroscopic unit and the photodetector are provided on the light-transmitting member so as to face each other via the light-transmitting member, so that even if the package is distorted, the relationship between the positions (coordinates) of the multiple photodetection channels of the photodetector and the peak wavelength of the light incident on each of the multiple photodetection channels (hereinafter, sometimes simply referred to as the "relationship between the photodetection channel and the peak wavelength") is unlikely to shift.

[0005] In contrast, in a spectroscopic module in which the spectroscopic section and the photodetector are configured to face each other across a space, particularly in a spectroscopic module in which a support that defines the space is configured to support the spectroscopic section and the photodetector, if the support is distorted during or after mounting on the rigid wiring board, a shift in the positional relationship between the spectroscopic section and the photodetector is likely to occur, and therefore a shift in the relationship between the photodetection channel and the peak wavelength is also likely to occur.

[0006] Therefore, an object of the present disclosure is to provide a spectroscopic module that can reliably suppress a decrease in detection accuracy in a configuration in which a spectroscopic section and a photodetector face each other across a space, and a method for manufacturing such a spectroscopic module. [Means for solving the problem]

[0007] A spectroscopy module according to one aspect of the present disclosure comprises a support having a bottom wall and a side wall surrounding a space on one side of the bottom wall, a spectroscopic section provided on one side of the bottom wall and having a plurality of grating grooves, a light detection element having a plurality of light detection channels and attached to the side wall so as to face the spectroscopic section across the space, and a wiring unit provided on a surface of the support along a surface of the support opposite the space and having a plurality of first terminals electrically connected to the light detection element, a plurality of second terminals facing the plurality of first terminals respectively and joined to the plurality of first terminals respectively, and a plurality of third terminals electrically connected to the plurality of second terminals respectively.

[0008] In the spectroscopic module according to one aspect of the present disclosure, a plurality of first terminals electrically connected to the light detection element are provided on the surface of the support, and a plurality of second terminals of the wiring unit face the plurality of first terminals, respectively, and are joined to the plurality of first terminals. For example, in a configuration in which a plurality of terminals of a rigid wiring board are joined to the plurality of first terminals, the support may be distorted due to stress generated during the joining, or the support may be distorted due to thermal distortion generated in the rigid wiring board after the joining, which may cause a shift in the positional relationship between the spectroscopic unit and the light detection element, and a shift in the relationship between the light detection channel and the peak wavelength. In contrast, in the spectroscopic module according to one aspect of the present disclosure, the electrical connection between the light detection element and the rigid wiring board can be realized via the wiring unit, so that a shift in the relationship between the light detection channel and the peak wavelength can be suppressed. Thus, according to the spectroscopic module according to one aspect of the present disclosure, a decrease in detection accuracy can be reliably suppressed in a configuration in which the spectroscopic unit and the light detection element face each other via a space.

[0009] In the spectroscopy module according to one aspect of the present disclosure, the first terminals may be provided in a flat region having the largest area among a plurality of flat regions constituting the surface of the support, thereby improving the degree of freedom in the shape of each of the first terminals and the arrangement of the first terminals, and realizing a reliable connection between the first terminal and the second terminal facing each other.

[0010] In the spectroscopy module according to one aspect of the present disclosure, the first terminals may be provided on a surface of the support opposite to the space in the sidewall. By making the surface opposite to the space in the sidewall wider, it is possible to improve the degree of freedom in the shape of each first terminal and the arrangement of the first terminals, and to realize a reliable connection between the first terminal and the second terminal facing each other.

[0011] In the spectroscopic module according to one aspect of the present disclosure, the multiple first terminals may be provided in a region on the surface of the sidewall portion that extends in a second direction, which is a direction perpendicular to a first direction in which the spectroscopic portion and the photodetector face each other and in which the multiple grating grooves are arranged, as a longitudinal direction. By widening the region that extends in the second direction as a longitudinal direction, it is possible to improve the degree of freedom in the shape of each first terminal and the arrangement of the multiple first terminals, and to realize reliable bonding between the first terminal and the second terminal that face each other.

[0012] In the spectroscopy module according to one aspect of the present disclosure, the first terminals and the second terminals that face each other may be joined to each other via a joining member, thereby realizing reliable joining of the first terminals and the second terminals that face each other.

[0013] In the spectroscopy module according to the first aspect of the present disclosure, the joining member may be a solder layer, which makes it possible to easily achieve a reliable joining between the first terminal and the second terminal facing each other.

[0014] In the spectroscopy module according to one aspect of the present disclosure, the joining member may hold a gap formed between the support and the wiring unit, whereby even if the wiring unit is deformed, the effect of the deformation is mitigated in the gap between the support and the wiring unit, thereby making it possible to suppress deviation in the relationship between the light detection channel and the peak wavelength caused by deformation of the support.

[0015] In the spectroscopic module according to one aspect of the present disclosure, each of the first terminals may be a circular electrode pad, whereby even if the wiring unit is deformed, stress concentration caused by the deformation is alleviated in each of the first terminals, thereby making it possible to suppress deviation in the relationship between the light detection channel and the peak wavelength caused by the deformation of the support.

[0016] In the spectroscopy module according to one aspect of the present disclosure, each of the second terminals may be a circular electrode pad, whereby even if the wiring unit is deformed, stress concentration caused by the deformation is alleviated in each of the second terminals, thereby making it possible to suppress deviation in the relationship between the light detection channel and the peak wavelength caused by the deformation of the support.

[0017] In the spectroscopic module according to one aspect of the present disclosure, the third terminals may be configured as connectors, which can prevent the support from being thermally affected when connecting the wiring unit to a rigid wiring board, for example, thereby making it possible to suppress deviation in the relationship between the light detection channel and the peak wavelength.

[0018] In the spectroscopy module according to one aspect of the present disclosure, the wiring unit may be configured with a flexible wiring board. This makes it difficult for stress concentration due to deformation of the wiring unit to occur on the support, so that it is possible to suppress deviation in the relationship between the light detection channel and the peak wavelength due to deformation of the support. In addition, since the difference in thermal expansion coefficient between the wiring unit and the support is absorbed by the flexibility of the wiring unit, it is possible to suppress deviation in the relationship between the light detection channel and the peak wavelength even if the temperature of the usage environment changes.

[0019] In the spectroscopic module according to one aspect of the present disclosure, the wiring unit may further include a plurality of wirings respectively connecting the plurality of second terminals and the plurality of third terminals, and a support substrate, and the bending strength of the support substrate may be smaller than the bending strength of the support body. This makes it difficult for stress concentration due to deformation to occur in the support body even if the wiring unit is deformed, and therefore makes it possible to suppress deviation in the relationship between the light detection channel and the peak wavelength due to deformation of the support body.

[0020] The spectroscopic module according to an aspect of the present disclosure may further include a rigid wiring board to which the plurality of third terminals are connected, thereby making it possible to realize electrical connection between the light detection element and the rigid wiring board while reliably suppressing a decrease in detection accuracy in a configuration in which the spectroscopic unit and the light detection element face each other across a space.

[0021] A method for manufacturing a spectroscopy module according to one aspect of the present disclosure includes a first step of preparing a spectroscope including a support having a bottom wall and a sidewall surrounding a space on one side of the bottom wall, a spectroscopic section provided on one side of the bottom wall and having a plurality of grating grooves, a light detection element having a plurality of light detection channels and attached to the sidewall so as to face the spectroscopic section across the space, and a plurality of first terminals provided on a surface of the support along the surface of the support and electrically connected to the light detection element; a second step of preparing a wiring unit having a plurality of second terminals and a plurality of third terminals each electrically connected to the plurality of second terminals; a third step of, after the first and second steps, placing the plurality of first terminals and the plurality of second terminals opposite each other and joining the mutually opposing first terminals and second terminals to each other; and a fourth step of, after the third step, acquiring a relationship between the positions of each of the plurality of light detection channels and the peak wavelength of light incident on each of the plurality of light detection channels.

[0022] For example, if the opposing first and second terminals are joined together after the relationship between the light detection channel and the peak wavelength is obtained, the support may be distorted due to stress generated during the joining, which may cause a deviation in the obtained relationship. In contrast, in the manufacturing method for a spectroscopy module according to one aspect of the present disclosure, the relationship between the light detection channel and the peak wavelength is obtained after the opposing first and second terminals are joined together. Therefore, according to the manufacturing method for a spectroscopy module according to one aspect of the present disclosure, spectroscopic analysis is performed based on the obtained relationship, and thereby it is possible to reliably suppress a decrease in detection accuracy in the manufactured spectroscopy module.

[0023] A method for manufacturing a spectroscopy module according to one aspect of the present disclosure includes a first step of preparing a spectroscope including a support having a bottom wall and a sidewall surrounding a space on one side of the bottom wall, a spectroscopic section provided on one side of the bottom wall and having a plurality of grating grooves, a light detection element attached to the sidewall so as to face the spectroscopic section across the space and having a plurality of light detection channels, and a plurality of first terminals provided on a surface of the support along the surface of the support and electrically connected to the light detection element; a second step of preparing a wiring unit having a plurality of second terminals and a plurality of third terminals respectively electrically connected to the plurality of second terminals, and providing a bonding member on each of the plurality of second terminals by heat treatment; and a third step of, after the first step and the second step, placing the plurality of first terminals and the plurality of second terminals opposite each other, and bonding the opposing first terminals and second terminals to each other via the bonding member by heat treatment.

[0024] For example, if a bonding member is provided to each of the multiple first terminals by heat treatment, and the opposing first terminals and second terminals are bonded to each other via the bonding member by heat treatment, the support is thermally affected twice, which may increase the deviation in the relationship between the light detection channel and the peak wavelength. In contrast, in the manufacturing method for a spectroscopy module according to one aspect of the present disclosure, a bonding member is provided to each of the multiple second terminals by heat treatment, and the opposing first terminals and second terminals are bonded to each other via the bonding member by heat treatment, so the support is only thermally affected once. Therefore, according to the manufacturing method for a spectroscopy module according to one aspect of the present disclosure, it is possible to suppress deviations in the relationship between the light detection channel and the peak wavelength, and reliably suppress deterioration in detection accuracy in the manufactured spectroscopy module.

[0025] In the method for manufacturing a spectroscopy module according to one aspect of the present disclosure, a plurality of interconnected wiring units may be prepared in the second step, and the plurality of wiring units to which the spectroscopes are attached may be separated from each other after the third step, thereby enabling a plurality of spectroscopy modules to be manufactured efficiently. Effect of the Invention

[0026] According to the present disclosure, it is possible to provide a spectroscopic module that can reliably suppress a decrease in detection accuracy in a configuration in which a spectroscopic section and a photodetector face each other across a space, and a method for manufacturing such a spectroscopic module. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1 is a perspective view of a spectroscopic module according to an embodiment. [Diagram 2] FIG. 2 is a perspective view of the spectrometer shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view of the spectroscope taken along line III-III shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the spectrometer taken along line IV-IV shown in FIG. [Diagram 5] FIG. 5 is a cross-sectional view of the spectroscope taken along line VV shown in FIG. [Figure 6] FIG. 6 is a plan view of the wiring unit shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view of a portion of the spectroscopic module taken along line VII-VII shown in FIG. [Figure 8] FIG. 8 is a diagram showing a step of a method for manufacturing the spectroscopic module shown in FIG. [Figure 9] FIG. 9 is a diagram showing a step of a method for manufacturing the spectroscopic module shown in FIG. [Figure 10] FIG. 10 is a diagram showing a step of a method for manufacturing the spectroscopic module shown in FIG. [Figure 11] FIG. 11 is a diagram showing a step of a method for manufacturing the spectroscopic module shown in FIG. [Figure 12] FIG. 12 is a perspective view of a spectroscopic module according to a modified example. [Figure 13] FIG. 13 is a cross-sectional view of a portion of a spectroscopic module according to a modified example. [Figure 14] FIG. 14 is a cross-sectional view of a modified spectroscope. [Figure 15] FIG. 15 is a perspective view of a spectroscopic module according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or corresponding parts are denoted by the same reference numerals, and duplicated explanations will be omitted. [Spectroscopic module configuration]

[0029] As shown in FIG. 1, the spectrometer module 100 includes a spectrometer 1 and a wiring unit 200. As shown in FIGS. 1 and 2, in the spectrometer 1, a box-shaped package 2 is configured by a support 10 and a cover 20. The support 10 is configured as a molded interconnect device (MID), and is provided with a plurality of wirings 11. As an example, the spectrometer 1 has a rectangular parallelepiped shape with lengths in each of the X-axis direction, Y-axis direction (direction perpendicular to the X-axis direction), and Z-axis direction (direction perpendicular to the X-axis and Y-axis directions) of 15 mm or less. In particular, the spectrometer 1 is thinned to a length in the Y-axis direction of about several mm.

[0030] 3 and 4, the package 2 includes a light detection element 30, a resin layer 40, and a reflective layer 50. The reflective layer 50 includes a first reflecting section 51 and a spectroscopic section 52. The light detection element 30 includes a light passing section 31, a second reflecting section 32, a light detection section 33, and a zero-order light capture section 34. The light passing section 31, the first reflecting section 51, the second reflecting section 32, the spectroscopic section 52, the light detection section 33, and the zero-order light capture section 34 are aligned on the same straight line parallel to the X-axis direction when viewed from the optical axis direction of the light L1 passing through the light passing section 31 (i.e., the Z-axis direction).

[0031] In the spectrometer 1, the light L1 passing through the light passing section 31 is reflected by the first reflecting section 51, and the light L1 reflected by the first reflecting section 51 is reflected by the second reflecting section 32. The light L1 reflected by the second reflecting section 32 is split and reflected by the spectroscopic section 52. Of the light split and reflected by the spectroscopic section 52, the light L2 other than the zero-order light L0 heading toward the light detecting section 33 is incident on the light detecting section 33 and detected by the light detecting section 33, and the zero-order light L0 is incident on the zero-order light capturing section 34 and captured by the zero-order light capturing section 34. The optical path of the light L1 from the light passing section 31 to the spectroscopic section 52, the optical path of the light L2 from the spectroscopic section 52 to the light detecting section 33, and the optical path of the zero-order light L0 from the spectroscopic section 52 to the zero-order light capturing section 34 are formed in the space S within the package 2.

[0032] The support 10 has a bottom wall portion 12 and a side wall portion 13. A recess 14 and peripheral portions 15, 16 are provided on the surface of the bottom wall portion 12 on the side of the space S. The side wall portion 13 is disposed on the side where the recess 14 opens with respect to the bottom wall portion 12. The side wall portion 13 surrounds the space S on one side of the bottom wall portion 12. In this embodiment, the side wall portion 13 has a rectangular frame shape surrounding the recess 14 and the peripheral portions 15, 16 when viewed from the Z-axis direction. More specifically, the side wall portion 13 has a pair of first side walls 17 and a pair of second side walls 18. When viewed from the Z-axis direction, the pair of first side walls 17 face each other in the X-axis direction with the recess 14 and the peripheral portions 15, 16 sandwiched therebetween. When viewed from the Z-axis direction, the pair of second side walls 18 face each other in the Y-axis direction with the recess 14 and the peripheral portions 15, 16 sandwiched therebetween. The bottom wall portion 12 and the side wall portion 13 are integrally formed from resin.

[0033] The side wall 13 is provided with a first widening portion 13a and a second widening portion 13b. The first widening portion 13a is a step portion in which the space S is widened only in the X-axis direction on the side opposite the bottom wall 12. The second widening portion 13b is a step portion in which the first widening portion 13a is widened in each of the X-axis direction and the Y-axis direction on the side opposite the bottom wall 12. One end of each wiring 11 is disposed as a terminal 11a on the first widening portion 13a. Each wiring 11 extends from the first widening portion 13a through the second widening portion 13b and the outer surface of the first side wall 17 to the outer surface 18b of one of the second side walls 18 (see FIG. 2). The outer surface 18b is a part of the surface of the side wall 13 opposite the space S of the support 10, and is a region extending in the X-axis direction as the longitudinal direction on the surface of the side wall 13 opposite the space S. The other end of each wire 11 is disposed on the outer surface 18b as a terminal (first terminal) 11b.

[0034] The wiring 11 and the multiple terminals 11b are provided on the surface of the support 10 so as to extend along the surface of the support 10 (in this embodiment, the outer surface 18b). Each terminal 11b is a circular electrode pad. The multiple terminals 11b are electrically connected to the light detection element 30, as described below. The outer surface 18b on which the multiple terminals 11b are provided is the flat region with the largest area among multiple flat regions constituting the surface of the support 10 opposite the space S.

[0035] As shown in Figures 3, 4, and 5, when viewed from the Z-axis direction, the length of the recess 14 in the X-axis direction is greater than the length of the recess 14 in the Y-axis direction. The recess 14 includes an inner surface 14a that is a concave curved surface. The inner surface 14a has a shape in which both sides of a part of a sphere (spherical cap) are cut off by a plane parallel to the ZX plane. In this way, the inner surface 14a is curved in a curved shape in both the X-axis direction and the Y-axis direction. In other words, the inner surface 14a is curved in a curved shape when viewed from both the Y-axis direction (see Figure 3) and the X-axis direction (see Figure 4).

[0036] Each of the peripheral parts 15 and 16 is adjacent to the recess 14 in the X-axis direction. When viewed from the Z-axis direction, the peripheral part 15 is located on one first side wall 17 side (one side in the X-axis direction) of the recess 14. When viewed from the Z-axis direction, the peripheral part 16 is located on the other first side wall 17 side (the other side in the X-axis direction) of the recess 14. When viewed from the Z-axis direction, the area of ​​the peripheral part 15 is larger than the area of ​​the peripheral part 16. In the spectrometer 1, the area of ​​the peripheral part 16 is narrowed to such an extent that the outer edge of the inner surface 14a of the recess 14 contacts the inner surface 17a of the other first side wall 17 when viewed from the Z-axis direction. The peripheral part 15 includes an inclined surface 15a. The inclined surface 15a is inclined so that the more it is away from the recess 14 along the X-axis direction, the more it is away from the light detection element 30 along the Z-axis direction.

[0037] The shapes of the recess 14 and the peripheral parts 15, 16 are determined by the shape of the support 10. That is, the recess 14 and the peripheral parts 15, 16 are defined only by the support 10. The inner surface 14a of the recess 14 and the inner surface 17a of one of the first side walls 17 are connected to each other via the peripheral part 15 (i.e., physically separated from each other). The inner surface 14a of the recess 14 and the inner surface 17a of the other first side wall 17 are connected to each other via the peripheral part 16 (i.e., physically separated from each other). The inner surface 14a of the recess 14 and the inner surface 18a of each of the second side walls 18 are connected to each other via an intersection line between surfaces (corners, bends, etc.). In this way, the inner surface 14a of the recess 14 and each of the inner surfaces 17a, 18a of the side wall parts 13 are connected to each other in a discontinuous state (a state physically separated from each other, a state connected to each other via an intersection line between surfaces, etc.). When viewed from the Z-axis direction, a boundary line 19 between the recess 14 and the peripheral portion 15 adjacent to each other in the X-axis direction crosses the bottom wall portion 12 along the Y-axis direction (see FIG. 5). In other words, both ends of the boundary line 19 reach the inner surface 18a of each second side wall 18.

[0038] As shown in FIG. 3 and FIG. 4, the light detection element 30 has a substrate 35. The substrate 35 is formed in a rectangular plate shape using a semiconductor material such as silicon. The light passing section 31 is a slit provided in the substrate 35, and extends in the Y-axis direction. The zero-order light capture section 34 is a slit provided in the substrate 35, and is located between the light passing section 31 and the light detection section 33 when viewed from the Z-axis direction, and extends in the Y-axis direction. The end of the light passing section 31 on the incident side of the light L1 is flared toward the incident side of the light L1 in each of the X-axis direction and the Y-axis direction. The end of the zero-order light capture section 34 on the opposite side to the incident side of the zero-order light L0 is flared toward the opposite side to the incident side of the zero-order light L0 in each of the X-axis direction and the Y-axis direction. By configuring the zero-order light L0 to be obliquely incident on the zero-order light capture section 34, it is possible to more reliably suppress the zero-order light L0 incident on the zero-order light capture section 34 from returning to the space S.

[0039] The second reflecting section 32 is provided in a region between the light passing section 31 and the zero-order light capturing section 34 on the surface 35a on the space S side of the substrate 35. The second reflecting section 32 is, for example, a metal film such as Al or Au, and functions as a plane mirror.

[0040] The light detection unit 33 is provided on a surface 35a of the substrate 35. More specifically, the light detection unit 33 is not attached to the substrate 35, but is built into the substrate 35 made of a semiconductor material. That is, the light detection unit 33 is configured by a plurality of photodiodes formed by a first conductive type region in the substrate 35 made of a semiconductor material and a second conductive type region provided in the first conductive type region. The light detection unit 33 is configured as, for example, a photodiode array, a C-MOS image sensor, a CCD image sensor, or the like, and has a plurality of light detection channels 33a arranged in the X-axis direction. Light L2 having different wavelengths is made incident on each light detection channel 33a of the light detection unit 33. A plurality of terminals 36 for inputting and outputting electrical signals to and from the light detection unit 33 are provided on the surface 35a of the substrate 35. The light detection unit 33 may be configured as a front-illuminated photodiode or a back-illuminated photodiode. When the light detection unit 33 is configured as a back-illuminated photodiode, a plurality of terminals 36 are provided on the surface opposite to the surface 35a of the substrate 35, and in this case, each terminal 36 is electrically connected to the terminal 11a of the corresponding wiring 11 by wire bonding.

[0041] The light detection element 30 is disposed in the first widened portion 13a of the side wall portion 13. The terminal 36 of the light detection element 30 and the terminal 11a of the wiring 11, which face each other in the first widened portion 13a, are connected to each other by a solder layer 3. As an example, the terminal 36 of the light detection element 30 and the terminal 11a of the wiring 11, which face each other, are connected to each other by a solder layer 3 formed on the surface of the terminal 36 via a plating layer of a base (Ni-Au, Ni-Pd-Au, etc.). In this case, in the spectrometer 1, the light detection element 30 and the side wall portion 13 are fixed to each other by the solder layer 3, and the light detection unit 33 of the light detection element 30 and the multiple wirings 11 are electrically connected. Between the light detection element 30 and the first widened portion 13a, a reinforcing member 7 made of, for example, resin is disposed so as to cover the connection portion between the terminal 36 of the light detection element 30 and the terminal 11a of the wiring 11, which face each other. In this manner, the light detection element 30 is attached to the side wall portion 13 surrounding the space S when viewed from the Z-axis direction. That is, the light detection element 30 is attached to the side wall portion 13 so as to face the recess 14 across the space S (i.e., so as to face the spectroscopic section 52). Note that in the spectrometer 1, the Z-axis direction is a first direction in which the spectroscopic section 52 and the light detection element 30 face each other.

[0042] The resin layer 40 is disposed on the inner surface 14a of the recess 14. The resin layer 40 is formed by pressing a molding die against a resin material (e.g., optical resins for replicas, such as photocurable epoxy resin, acrylic resin, fluorine-based resin, silicone, and organic-inorganic hybrid resin) that is a molding material, and curing the resin material in this state (e.g., photocuring with UV light or the like, heat curing, etc.).

[0043] A grating pattern 41 is provided in a region of the resin layer 40 that is biased toward the peripheral portion 15 side (one side in the X-axis direction) with respect to the center of the recess 14 when viewed from the Z-axis direction. The grating pattern 41 corresponds to, for example, a blazed grating with a sawtooth cross section, a binary grating with a rectangular cross section, or a holographic grating with a sinusoidal cross section.

[0044] The resin layer 40 is away from the inner surface 17a of one first side wall 17 (the first side wall 17 on the left side in FIG. 3) and is in contact with the inner surface 17a of the other first side wall 17 (the first side wall 17 on the right side in FIG. 3), the inner surface 18a of one second side wall 18, and the inner surface 18a of the other second side wall 18. The resin layer 40 spreads along the inner surface 17a of the other first side wall 17, the inner surface 18a of one second side wall 18, and the inner surface 18a of the other second side wall 18, so as to creep up the inner surfaces 17a, 18a from the inner surface 14a.

[0045] The thickness of the resin layer 40 in the Z-axis direction is greater in the portion 43 in contact with the inner surface 17a and the portion 44 in contact with the inner surface 18a than in the portion 42 disposed on the inner surface 14a. That is, the "thickness H2 along the Z-axis direction" of the portion 43 of the resin layer 40 in contact with the inner surface 17a and the "thickness H3 along the Z-axis direction" of the portion 44 of the resin layer 40 in contact with the inner surface 18a are greater than the "thickness H1 along the Z-axis direction" of the portion 42 of the resin layer 40 disposed on the inner surface 14a. As an example, H1 is about several μm to 80 μm (the minimum value is a thickness that can cover the surface roughness of the support 10), and H2 and H3 are each about several hundred μm.

[0046] The resin layer 40 reaches onto the inclined surface 15a of the peripheral portion 15. The thickness of the resin layer 40 in the Z-axis direction is greater in a portion 45 that reaches the peripheral portion 15 than in a portion 42 that is disposed on the inner surface 14a. In other words, the "thickness H4 along the Z-axis direction" of the portion 45 of the resin layer 40 that reaches the peripheral portion 15 is greater than the "thickness H1 along the Z-axis direction" of the portion 42 of the resin layer 40 that is disposed on the inner surface 14a. As an example, H4 is about several hundred μm.

[0047] Here, when the "thickness along the Z-axis direction" varies in each of the portions 42, 43, 44, 45, the average value of the thickness in each of the portions 42, 43, 44, 45 can be regarded as the "thickness along the Z-axis direction" of each of the portions 42, 43, 44, 45. The "thickness along the direction perpendicular to the inner surface 17a" of the portion 43 in contact with the inner surface 17a, the "thickness along the direction perpendicular to the inner surface 18a" of the portion 44 in contact with the inner surface 18a, and the "thickness along the direction perpendicular to the inclined surface 15a" of the portion 45 reaching the peripheral portion 15 are also larger than the "thickness along the direction perpendicular to the inner surface 14a" of the portion 42 disposed on the inner surface 14a. The resin layer 40 as described above is formed in a continuous state.

[0048] The reflective layer 50 is disposed on the resin layer 40. The reflective layer 50 is, for example, a metal film such as Al or Au. A region of the reflective layer 50 facing the light passing section 31 of the light detection element 30 in the Z-axis direction is a first reflective section 51 that functions as a concave mirror. The first reflective section 51 is disposed on the inner surface 14a of the recess 14, and is biased toward the peripheral section 16 side (the other side in the X-axis direction) with respect to the center of the recess 14 when viewed from the Z-axis direction. A region of the reflective layer 50 that covers the grating pattern 41 of the resin layer 40 is a spectroscopic section 52 that functions as a reflective grating. The spectroscopic section 52 is disposed on the inner surface 14a of the recess 14, and is biased toward the peripheral section 15 side (one side in the X-axis direction) with respect to the center of the recess 14 when viewed from the Z-axis direction. In this way, the first reflective section 51 and the spectroscopic section 52 are provided in the resin layer 40 on the inner surface 14a of the recess 14. That is, the spectroscopic section 52 is provided on one side of the bottom wall section 12 so as to face the light detection element 30 with the space S interposed therebetween.

[0049] The grating grooves 52a of the spectroscopic section 52 have a shape that follows the shape of the grating pattern 41. The grating grooves 52a are aligned in the X-axis direction when viewed from the Z-axis direction, and are curved in a curved shape (for example, a circular arc convex toward the peripheral section 15 side) on the same side when viewed from the Z-axis direction (see FIG. 5). In the spectrometer 1, the X-axis direction is a second direction that is perpendicular to the first direction and in which the grating grooves 52a are aligned, and the Y-axis direction is a third direction that is perpendicular to the first and second directions.

[0050] The reflective layer 50 covers, of the resin layer 40, the entire portion 42 (including the grating pattern 41) disposed on the inner surface 14a of the recess 14, the entire portion 43 in contact with the inner surface 17a of the other first side wall 17, the entire portion 44 in contact with the inner surface 18a of each second side wall 18, and a part of the portion 45 extending to the peripheral portion 15. In other words, the reflective layer 50 constituting the first reflecting section 51 and the spectroscopic section 52 is disposed on the resin layer 40 in a continuous state.

[0051] The cover 20 has a light transmitting member 21 and a light shielding film 22. The light transmitting member 21 is made of a material that transmits light L1, such as quartz, borosilicate glass (BK7), Pyrex (registered trademark) glass, Kovar glass, etc., and has a rectangular plate shape. The light shielding film 22 is provided on a surface 21a of the light transmitting member 21 on the space S side. The light shielding film 22 is provided with a light passing opening 22a so as to face the light passing portion 31 of the light detection element 30 in the Z-axis direction. The light passing opening 22a is a slit provided in the light shielding film 22, and extends in the Y-axis direction.

[0052] In addition, when detecting infrared rays, silicon, germanium, etc. are also effective as the material of the light transmitting member 21. In addition, the light transmitting member 21 may be coated with an AR (Anti Reflection) coating or may have a filter function that transmits only light of a predetermined wavelength. In addition, for example, black resist, Al, etc. can be used as the material of the light shielding film 22. However, from the viewpoint of suppressing the return of the zero-order light L0 incident on the zero-order light capture unit 34 to the space S, black resist is effective as the material of the light shielding film 22. As an example, the light shielding film 22 may be a composite film including an Al layer covering the surface 21a of the light transmitting member 21 and a black resist layer provided at least in a region of the Al layer facing the zero-order light capture unit 34. That is, in the composite film, the Al layer and the black resist layer are laminated in this order on the space S side of the light transmitting member 21.

[0053] The cover 20 is disposed on the second widened portion 13b of the side wall portion 13. A sealing member 4 made of, for example, resin, solder, or the like is disposed between the cover 20 and the second widened portion 13b. In the spectrometer 1, the sealing member 4 fixes the cover 20 and the side wall portion 13 to each other and hermetically seals the space S.

[0054] 1 and 6, the wiring unit 200 has a support substrate 201, a plurality of terminals (second terminals) 202, a plurality of terminals (third terminals) 203, and a plurality of wirings 204. The support substrate 201 is a flexible substrate, and is formed in a film shape from, for example, an insulating resin. In this embodiment, the bending strength of the support substrate 201 is smaller than the bending strength of the support body 10. The plurality of terminals 202, the plurality of terminals 203, and the plurality of wirings 204 are provided on the support substrate 201.

[0055] The support substrate 201 has a first portion 211, a second portion 212, and a third portion 213. The first portion 211 is a portion in which a plurality of terminals 202 are provided. The second portion 212 is a portion in which a plurality of terminals 203 are provided. The third portion 213 is a portion located between the first portion 211 and the second portion 212. The width of the first portion 211 in a width direction (in the present embodiment, the X-axis direction) perpendicular to the length direction in which the first portion 211 and the second portion 212 are aligned is larger than the width of the second portion 212 in the width direction. The width of the third portion 213 in the width direction changes from the width of the second portion 212 to the width of the first portion 211. That is, the width of the third portion 213 in the width direction becomes larger as it approaches the first portion 211. The length of the first portion 211 in the length direction in which the first portion 211 and the second portion 212 are aligned (in this embodiment, the Z-axis direction) is greater than the length of the second portion 212 in the length direction.

[0056] As shown in FIG. 7, the multiple terminals 202 are arranged on the surface 201a of the support substrate 201 facing the support 10 so as to face the multiple terminals 11b provided on the surface of the support 10, respectively. Each terminal 202 is a circular electrode pad. The mutually facing terminals 11b and terminals 202 are joined to each other via a joining member 205. In this embodiment, the joining member 205 is a solder layer. The joining member 205 holds a gap (for example, a gap of about 100 μm) formed between the support substrate 10 and the wiring unit 200 (specifically, between the outer surface 18b of one of the second side walls 18 and the surface 201a of the support substrate 201). The gap is a space in which no resin or the like is arranged.

[0057] As shown in FIG. 1 and FIG. 6, the terminals 203 are configured as a connector 206. In this embodiment, the connector 206 is disposed on the opposite side of the outer surface 18b of one of the second side walls 18 from the incident side of the light L1 in the Z-axis direction. The wirings 204 extend across the first portion 211, the second portion 212, and the third portion 213 so as to connect the terminals 202 and the terminals 203, respectively. That is, the terminals 203 are electrically connected to the terminals 202, respectively. Note that the smaller the width of the second portion 212, the smaller the connection portion with the connection destination becomes, and the more unnecessary space can be reduced. To realize such a configuration, it is preferable that the width (width in the X-axis direction) of each wiring 204 is larger than the distance (distance in the X-axis direction) between adjacent wirings 204 at least in the second portion 212. In addition, in third portion 213, the total value of the widths (widths in the X-axis direction) of multiple wirings 204 is preferably 60% or more of the maximum width (maximum width in the X-axis direction) of third portion 213. In the example shown in Fig. 6, the number of wirings 204 is eight, but the number of wirings 204 may be any number as long as it is multiple (two or more), and may be nine or more. However, in consideration of miniaturization, durability, and the like, the number of wirings 204 is preferably ten or less.

[0058] The spectrometer 1 is disposed along the outer edge of the first portion 211 opposite to the second portion 212. When viewed from the Y-axis direction, the first portion 211 includes the spectrometer 1, and extends so as to protrude (project) from the spectrometer 1 toward the second portion 212. The connector 206 is disposed along the outer edge of the second portion 212 opposite to the first portion 211. When viewed from the Y-axis direction, the second portion 212 includes the connector 206, and extends so as to protrude (project) from the connector 206 toward the first portion 211.

[0059] In the spectroscopic module 100, when viewed from the Y-axis direction, the first portion 211 overlaps at least with the space S of the spectrometer 1, and the multiple terminals 11b and the multiple terminals 202 are joined to each other in the area where the first portion 211 and the spectrometer 1 overlap. In this embodiment, the multiple terminals 11b are arranged to surround the space S when viewed from the Y-axis direction, and a portion of each terminal 11b overlaps with the bottom wall portion 12, the pair of first side walls 17, and the photodetector element 30 when viewed from the Y-axis direction. In the spectroscopic module 100, when viewed from the Y-axis direction, the first portion 211 does not protrude (project) from the spectrometer 1 on any side other than the second portion 212 side.

[0060] In this embodiment, the wiring unit 200 is configured by a flexible wiring board. That is, the wiring unit 200 can be repeatedly deformed (bent or twisted), and has the property of maintaining its electrical characteristics even when deformed. In the spectroscopic module 100, the connector 206 of the wiring unit 200 is connected to, for example, an external rigid wiring board, so that an electrical signal is input / output to / from the light detection unit 33 of the light detection element 30 via the wiring unit 200 and the multiple wires 11. [Spectroscopic module manufacturing method]

[0061] The above-mentioned spectrometer 1 is prepared (first step). Meanwhile, as shown in FIG. 8, the above-mentioned wiring unit 200 is prepared, and as shown in FIG. 9, a bonding member 205 is provided on each terminal 202 by printing solder paste and performing heat treatment such as temporary fixing of solder balls (second step). In this embodiment, a plurality of wiring units 200 connected to each other are prepared. The plurality of wiring units 200 are connected to each other via a frame portion 207 formed integrally with a support substrate 201. The order of performing the first step and the second step is not particularly limited.

[0062] Next, the spectrometer 1 is placed on each wiring unit 200 (i.e., the multiple terminals 11b and the multiple terminals 202 are made to face each other) so that the mutually facing terminals 11b and 202 face each other via the bonding member 205 (see FIG. 7), and the mutually facing terminals 11b and 202 are bonded to each other via the bonding member 205 by reflow (i.e., by heat treatment) as shown in FIG. 10 (third step). At this time, since the size and weight of the spectrometer 1 are small, the spectrometer 1 is self-aligned with respect to the wiring unit 200 so that the mutually facing terminals 11b and 202 coincide with each other due to the tension of the molten bonding member 205. Next, as shown in FIG. 11, the multiple wiring units 200 to which the spectrometers 1 are attached are cut out from the frame portion 207 and separated from each other.

[0063] Next, in each spectroscopic module 100, the relationship between the position (coordinates) of each light detection channel 33a and the peak wavelength of the light L2 incident on each light detection channel 33a (hereinafter, sometimes simply referred to as the "relationship between the light detection channel 33a and the peak wavelength") is acquired (fourth step). Specifically, light having a known peak wavelength is incident on the spectroscopic module 100, and the position of the light detection channel 33a at which the detection value reaches its peak is acquired. This is performed for a plurality of known peak wavelengths, and an approximation equation (for example, a fifth-order polynomial) indicating the relationship between the light detection channel 33a and the peak wavelength is acquired. When performing spectroscopic analysis using the spectroscopic module 100, the acquired approximation equation is used. [Action and Effects]

[0064] In the spectroscopic module 100, a plurality of terminals 11b electrically connected to the light detection element 30 are provided on the surface of the support 10, and a plurality of terminals 202 of the wiring unit 200 face the plurality of terminals 11b, respectively, and are joined to the plurality of terminals 11b. For example, in a configuration in which a plurality of terminals of a rigid wiring board are joined to the plurality of terminals 11b, respectively, the support 10 may be distorted due to stress generated during the joining, or the support 10 may be distorted due to thermal distortion generated in the rigid wiring board after joining, which may cause a shift in the positional relationship between the spectroscopic unit 52 and the light detection element 30, and a shift in the relationship between the light detection channel 33a and the peak wavelength. In contrast, in the spectroscopic module 100, the electrical connection between the light detection element 30 and the rigid wiring board can be realized via the wiring unit 200, so that a shift in the relationship between the light detection channel 33a and the peak wavelength can be suppressed. Therefore, according to the spectroscopic module 100, in a configuration in which the spectroscopic section 52 and the photodetector 30 face each other with the space S interposed therebetween, it is possible to reliably suppress a decrease in detection accuracy.

[0065] In the spectroscopic module 100, the support 10 has a bottom wall 12 on which the spectroscopic unit 52 is provided, and a side wall 13 on which the light detection element 30 is attached so that the spectroscopic unit 52 and the light detection element 30 face each other via the space S. This allows the spectroscopic unit 52 and the light detection element 30 to be stably supported, and the space S including the optical path from the outside to the spectroscopic unit 52 and the optical path from the spectroscopic unit 52 to the light detection element 30 can be easily formed. In this manner, in a configuration in which the optical path from the outside to the spectroscopic unit 52 and the optical path from the spectroscopic unit 52 to the light detection element 30 are formed in the space S, the relationship between the light detection channel 33a and the peak wavelength is likely to be shifted, so the above-mentioned configuration of the spectroscopic module 100 is particularly effective. Also, even in a configuration in which the support 10 defining the space S is formed of resin, the relationship between the light detection channel 33a and the peak wavelength is likely to be shifted, so the above-mentioned configuration of the spectroscopic module 100 is particularly effective.

[0066] Furthermore, in the spectroscopic module 100, the multiple terminals 11b are provided in a flat region with the largest area (in this embodiment, the outer surface 18b of one of the second side walls 18) among multiple flat regions that form the surface of the support 10. This improves the degree of freedom in the shape of each terminal 11b and the arrangement of the multiple terminals 11b, and also makes it possible to realize reliable bonding between the terminals 11b and the terminal 202 that face each other.

[0067] Furthermore, in the spectroscopic module 100, the multiple terminals 11b are provided on the surface of the support 10 opposite the space S in the side wall portion 13 (in this embodiment, the outer surface 18b of one of the second side walls 18). By making the surface opposite the space S in the side wall portion 13 wider, it is possible to improve the degree of freedom in the shape of each terminal 11b and the arrangement of the multiple terminals 11b, and to realize reliable bonding between the terminals 11b and the terminal 202 facing each other.

[0068] Furthermore, in the spectroscopic module 100, the multiple terminals 11b are provided in an area (in this embodiment, the outer surface 18b of one of the second side walls 18) that extends in the X-axis direction, which is the direction in which the multiple grating grooves 52a are arranged, on the surface of the side wall portion 13. By making the area that extends in the X-axis direction the longitudinal direction wider, it is possible to improve the degree of freedom in the shape of each terminal 11b and the arrangement of the multiple terminals 11b, and to realize reliable bonding between the terminals 11b and the terminal 202 that face each other.

[0069] Moreover, in the spectroscopic module 100, the terminals 11b and the terminals 202 facing each other are joined to each other via the joining member 205. This makes it possible to realize reliable joining of the terminals 11b and the terminals 202 facing each other.

[0070] Furthermore, in the spectroscopic module 100, the joining member 205 is a solder layer, which makes it possible to easily achieve a reliable joining between the terminal 11b and the terminal 202 that face each other.

[0071] Moreover, in the spectroscopic module 100, the joint member 205 holds the gap formed between the support 10 and the wiring unit 200. As a result, even if the wiring unit 200 is deformed, the influence of the deformation is mitigated in the gap between the support 10 and the wiring unit 200, so that it is possible to suppress the occurrence of a deviation in the relationship between the light detection channel 33a and the peak wavelength due to the deformation of the support 10. In particular, when the wiring unit 200 is made of a flexible wiring board or when the bending strength of the support board 201 of the wiring unit 200 is smaller than the bending strength of the support 10, the wiring unit 200 is likely to deform. Therefore, a configuration in which a gap, which is a space, is formed between the support 10 and the wiring unit 200 is extremely effective as a configuration capable of mitigating the influence of the wiring unit 200.

[0072] Moreover, in the spectroscopic module 100, each of the multiple terminals 11b is a circular electrode pad. As a result, even if the wiring unit 200 is deformed, the stress concentration caused by the deformation is alleviated in each terminal 11b, so that it is possible to suppress the occurrence of a deviation in the relationship between the light detection channel 33a and the peak wavelength caused by the deformation of the support 10. Furthermore, the influence of the stress generated when the mutually opposing terminals 11b and terminal 202 are joined is also alleviated in each terminal 11b, so that it is possible to suppress the occurrence of a deviation in the relationship between the light detection channel 33a and the peak wavelength caused by the influence of the stress generated during joining.

[0073] Moreover, in the spectroscopic module 100, each of the multiple terminals 202 is a circular electrode pad. As a result, even if the wiring unit 200 is deformed, stress concentration caused by the deformation is alleviated in each terminal 202, so that it is possible to suppress a deviation in the relationship between the light detection channel 33a and the peak wavelength caused by the deformation of the support 10. Furthermore, the influence of stress generated when the mutually opposing terminals 11b and 202 are joined is also alleviated in each terminal 202, so that it is possible to suppress a deviation in the relationship between the light detection channel 33a and the peak wavelength caused by the influence of stress generated during joining.

[0074] Furthermore, in the spectroscopic module 100, the multiple terminals 203 are configured as connectors. This prevents the support 10 from being thermally affected when connecting the wiring unit 200 to a rigid wiring board, for example, and thus makes it possible to suppress deviations in the relationship between the light detection channel 33a and the peak wavelength.

[0075] Moreover, in the spectroscopic module 100, the wiring unit 200 is configured by a flexible wiring board. As a result, even if the wiring unit 200 is deformed, stress concentration due to the deformation is unlikely to occur on the support 10, so that it is possible to suppress the occurrence of a deviation in the relationship between the light detection channel 33a and the peak wavelength due to the deformation of the support 10. Furthermore, since the difference in the thermal expansion coefficient between the wiring unit 200 and the support 10 is absorbed by the flexibility of the wiring unit 200, it is possible to suppress the occurrence of a deviation in the relationship between the light detection channel 33a and the peak wavelength even if the temperature of the usage environment changes. Furthermore, since the stress is absorbed by the flexibility of the wiring unit 200, it is possible to stabilize the bonding between the terminal 11b and the terminal 202 facing each other, and it is also possible to reduce the residual stress occurring when the terminal 11b and the terminal 202 facing each other are bonded. Furthermore, it is possible to install the spectrometer 1 so that it faces in a desired direction.

[0076] As described above, in the case of the spectrometer 1 miniaturized to a side length of 15 mm or less (particularly, the spectrometer 1 thinned to a length of several mm in the Y-axis direction), high accuracy is required for the orientation and position of the spectrometer 1 relative to the installation target. In addition, if the installation target is deformed, there is a concern that the relationship between the light detection channel 33a and the peak wavelength may be shifted due to the deformation. In view of this situation, for the spectrometer 1 as described above, when the electrode pads provided on the surface of the support 10 are joined to the electrode pads of the wiring board, a rigid wiring board that is difficult to deform is selected as the wiring board, and a flexible wiring board that is easily deformed is not selected. In the spectroscopic module 100, the wiring unit 200 made of a flexible wiring board is deliberately adopted, thereby making it possible to achieve the high accuracy required for the orientation and position of the spectrometer 1 relative to the installation target, and to suppress the shift that occurs in the relationship between the light detection channel 33a and the peak wavelength.

[0077] In addition, in the spectroscopic module 100, the bending strength of the support substrate 201 of the wiring unit 200 is smaller than the bending strength of the support 10. As a result, even if the wiring unit 200 is deformed, stress concentration due to the deformation is unlikely to occur in the support 10, so that it is possible to suppress the occurrence of a deviation in the relationship between the light detection channel 33a and the peak wavelength due to the deformation of the support 10. In addition, since the difference in the thermal expansion coefficient between the wiring unit 200 and the support 10 is absorbed by the flexibility of the wiring unit 200, it is possible to suppress the occurrence of a deviation in the relationship between the light detection channel 33a and the peak wavelength even if the temperature of the usage environment changes. In addition, since the stress is absorbed by the flexibility of the wiring unit 200, it is possible to stabilize the bonding between the terminals 11b and 202 facing each other, and it is also possible to reduce the residual stress occurring when the terminals 11b and 202 facing each other are bonded.

[0078] In the spectroscopic module 100, the support substrate 201 of the wiring unit 200 has a first portion 211 provided with a plurality of terminals 202, a second portion 212 provided with a plurality of terminals 203, and a third portion 213 located between the first portion 211 and the second portion 212, and the width of the third portion 213 in a width direction perpendicular to the length direction in which the first portion 211 and the second portion 212 are arranged increases as it approaches the first portion 211. As a result, even if an external force is applied to the second portion 212, the external force is absorbed by the third portion 213, and therefore the influence of the external force on the support 10 of the spectrometer 1 can be suppressed. In addition, since the third portion 213 is provided on the support substrate 201 of the wiring unit 200, stress concentration at the connector 206 is also suppressed. Furthermore, since the length of the second portion 212 in the length direction in which the first portion 211 and the second portion 212 are aligned is smaller than the length of the first portion 211 in the length direction, the spectroscopy module 100 using the support substrate 201 of the wiring unit 200 can be easily handled. If the length of the second portion 212 in the length direction in which the first portion 211 and the second portion 212 are aligned is smaller than the sum of the length of the first portion 211 in the length direction and the length of the third portion 213 in the length direction, the spectroscopy module 100 using the support substrate 201 of the wiring unit 200 can be easily handled.

[0079] As described above, when the spectrometer 1 is miniaturized to a side length of 15 mm or less, being able to grip the support substrate 201 of the wiring unit 200 in handling the spectroscopic module 100 is extremely effective, regardless of whether the third portion 213 is provided on the support substrate 201 of the wiring unit 200. In particular, when the third portion 213 is provided on the support substrate 201 of the wiring unit 200, the spectroscopic module 100 can be handled without touching the wiring 204 of the wiring unit 200 and the spectrometer 1.

[0080] In addition, in the spectroscopic module 100, when viewed from the Y-axis direction, the first portion 211 overlaps at least with the space S of the spectrometer 1, and the multiple terminals 11b and the multiple terminals 202 are joined to each other in the area where the first portion 211 and the spectrometer 1 overlap. This prevents the wiring unit 200 from being accidentally bent by the weight of the spectrometer 1 when the support substrate 201 of the wiring unit 200 is gripped during handling of the spectroscopic module 100, improving the handleability of the spectroscopic module 100. Furthermore, in this embodiment, when viewed from the Y-axis direction, the multiple terminals 11b are arranged to surround the space S, and when viewed from the Y-axis direction, at least a portion of each terminal 11b overlaps with the bottom wall portion 12, the pair of first side walls 17, and the photodetector element 30. This prevents the support 10 from being distorted due to stress generated during and after bonding of the mutually opposing terminals 11b and the terminals 202.

[0081] In addition, in the spectroscopic module 100, when viewed from the Y-axis direction, the first portion 211 does not protrude (does not protrude) on any side other than the second portion 212 side with respect to the spectrometer 1. If the first portion 211 protrudes significantly on any side other than the second portion 212 side with respect to the spectrometer 1, for example, the protruding portion may come into contact with some member, which may cause an extra load to be applied to the spectroscopic module 100 or may cause the spectroscopic module 100 to be difficult to handle. In contrast, in the spectroscopic module 100, since the first portion 211 does not protrude on any side other than the second portion 212 side with respect to the spectrometer 1, such a situation is suppressed. Note that even if the first portion 211 protrudes on any side other than the second portion 212 side with respect to the spectrometer 1 when viewed from the Y-axis direction, the above-mentioned situation is sufficiently suppressed as long as the area of ​​the protruding region is smaller than the area of ​​the region where the first portion 211 and the spectrometer 1 overlap when viewed from the Y-axis direction.

[0082] Furthermore, the manufacturing method of the spectroscopic module 100 provides the following actions and effects. For example, if the opposing terminals 11b and 202 are joined to each other after the relationship between the light detection channel 33a and the peak wavelength is obtained, the support 10 may be distorted due to stress or the like that occurs during the joining, which may cause a deviation in the obtained relationship. In contrast, in the manufacturing method of the spectroscopic module 100, the opposing terminals 11b and 202 are joined to each other, and then the relationship between the light detection channel 33a and the peak wavelength is obtained. Therefore, according to the manufacturing method of the spectroscopic module 100, spectroscopic analysis is performed based on the obtained relationship, so that it is possible to reliably suppress a decrease in detection accuracy in the manufactured spectroscopic module 100.

[0083] Furthermore, for example, if the bonding member 205 is provided to each of the multiple terminals 11b by heat treatment and the opposing terminals 11b and 202 are bonded to each other via the bonding member 205 by heat treatment, the support 10 is thermally affected twice, which may increase the deviation in the relationship between the light detection channel 33a and the peak wavelength. In contrast, in the manufacturing method for the spectroscopic module 100, the bonding member 205 is provided to each of the multiple terminals 202 by heat treatment and the opposing terminals 11b and 202 are bonded to each other via the bonding member 205 by heat treatment, so that the thermal effect on the support 10 is only once. Therefore, according to the manufacturing method for the spectroscopic module 100, it is possible to suppress deviation in the relationship between the light detection channel 33a and the peak wavelength and reliably suppress deterioration in the detection accuracy in the manufactured spectroscopic module 100.

[0084] In addition, in the method of manufacturing the spectroscopic module 100, a plurality of interconnected wiring units 200 are prepared, and after mutually opposing terminals 11b and terminals 202 are joined, the plurality of wiring units 200 to which the spectrometers 1 are attached are separated from each other. This allows a plurality of spectroscopic modules 100 to be manufactured efficiently. [Variations]

[0085] The present disclosure is not limited to the above-described embodiment. For example, as shown in (a) of FIG. 12, the wiring unit 200 may be provided with an attachment portion 208 for installing the spectrometer 1. In the wiring unit 200 shown in (a) of FIG. 12, a pair of attachment portions 208 is provided on both sides in the X-axis direction with respect to the outer surface 18b of one of the second side walls 18. The pair of attachment portions 208 are integrally formed with the support substrate 201, and each attachment portion 208 is provided with a hole 208a through which a bolt for installing the spectrometer 1 passes. Also, as shown in (b) of FIG. 12, in the wiring unit 200, the connector 206 may be disposed on one side in the X-axis direction with respect to the outer surface 18b of one of the second side walls 18. That is, the position of the multiple terminals 203 with respect to the spectrometer 1 is not limited to that described above. The wiring unit 200 shown in Figures 12(a) and (b) also has a first part 211, a second part 212, and a third part 213, similar to the wiring unit 200 shown in Figure 1. Therefore, similar to the wiring unit 200 shown in Figure 1, the influence of an external force applied to the second part 212 on the support 10 of the spectrometer 1 is suppressed, stress concentration at the connector 206 is suppressed, and further, handling of the spectroscopic module 100 using the support substrate 201 of the wiring unit 200 is facilitated.

[0086] Also, for example, by changing conditions such as the load on the joining member 205 during bonding, the side of the joining member 205 becomes a convex curved surface, or the gap between the support 10 and the wiring unit 200 becomes large, as shown in (a) of FIG. 13. When the side of the joining member 205 is a convex curved surface, the stress generated during and after bonding of the mutually opposing terminals 11b and 202 is alleviated in the joining member 205, and distortion of the support 10 is suppressed. Note that, when bonding the mutually opposing terminals 11b and 202, a force may be applied to press the spectrometer 1 toward the wiring unit 200. For example, by adjusting the magnitude of the force, the shape of the side of the joining member 205, the size of the gap between the support 10 and the wiring unit 200, and the like can be adjusted. Also, as shown in (b) of FIG. 13, the mutually opposing terminals 11b and 202 may be bonded to each other via a joining member 205 made of a solder ball with a core. In this case, by adjusting the size of the core, it is possible to adjust the size of the gap between the support 10 and the wiring unit 200. Note that as the core of the cored solder ball, for example, a metal core made of copper or the like, a resin core, or the like is used.

[0087] Also, the support substrate 201 may have the first portion 211 and the second portion 212, but may not have the third portion 213. In that case, for example, the second portion 212 is directly connected to the first portion 211. Also, the multiple terminals 203 and the multiple wirings 204 may be disposed on the back surface (opposite surface to the front surface 201a) of the support substrate 201. Also, only the multiple terminals 203 may be disposed on the back surface (opposite surface to the front surface 201a) of the support substrate 201. Although it is preferable that the length of the wirings 204 is short, in a configuration in which the multiple terminals 203 are disposed on the front surface 201a of the support substrate 201, the length of the wirings 204 may have to be long due to layout reasons of the spectrometer 1, etc. On the other hand, in a configuration in which the multiple terminals 203 are disposed on the back surface (opposite surface to the front surface 201a) of the support substrate 201, it may be possible to realize a desired layout while shortening the length of the wirings 204. Furthermore, the width of the first portion 211 in the direction in which each wiring 204 extends (the Z-axis direction in the above embodiment) may be equal to or less than the width of the spectrometer 1 in that direction. Even in this case, the support substrate 201 may not have the third portion 213, and the second portion 212 may be directly connected to the first portion 211. Furthermore, the second portion 212 may have a flat plate shape as in the above embodiment, or may have a curved shape.

[0088] 14, in the first widened portion 13a where the light detection element 30 is disposed, the side surface 13a2 of the first widened portion 13a may be inclined to form an obtuse angle with the bottom surface 13a1 of the first widened portion 13a. In the second widened portion 13b where the cover 20 is disposed, the side surface 13b2 of the second widened portion 13b may be inclined to form an obtuse angle with the bottom surface 13b1 of the second widened portion 13b. This allows the wiring 11 to be easily and accurately routed. Also, the stress generated in the wiring 11 can be reduced.

[0089] A reinforcing member 7 made of resin may be filled between the side surface 13a2 of the first widening portion 13a and the light detection element 30. Since the reinforcing member 7 easily enters the gap due to the inclination of the side surface 13a2, the support of the light detection element 30 can be more sufficiently reinforced and the airtightness of the part can be more sufficiently ensured. Furthermore, due to a synergistic effect with the arrangement of the bumps 61 described later, the positional deviation of the light detection element 30 in the X-axis direction (the second direction in which the multiple grating grooves 52a of the spectroscopic unit 52 are arranged) can be more reliably suppressed. Furthermore, a sealing member 4 made of resin may be filled between the side surface 13b2 of the second widening portion 13b and the cover 20. Since the sealing member 4 easily enters the gap due to the inclination of the side surface 13b2, the support of the cover 20 can be more sufficiently reinforced and the airtightness of the part can be more sufficiently ensured. The airtightness may be ensured by filling a reinforcing member 7 made of resin between the side surface 13a2 of the first widened portion 13a and the light detection element 30, or by filling a sealing member 4 made of resin between the side surface 13b2 of the second widened portion 13b and the cover 20, or by both of them. Airtightness may also be ensured by a configuration other than these airtight configurations (such as housing the spectrometer 1 in a separate package and making the inside of the package airtight).

[0090] 14, at least a region 10a1 in which the wiring 11 is arranged, of the end face 10a of the support 10 opposite the bottom wall 12, may be located closer to the bottom wall 12 than the surface 20a of the cover 20 opposite the bottom wall 12. This can prevent the wiring 11 from contacting other members when the spectrometer 1 is mounted. Also, the length of the wiring 11 can be reduced. The entire end face 10a of the support 10 may be located closer to the bottom wall 12 than the surface 20a of the cover 20.

[0091] 14, the cover 20 and the light detection element 30 may be spaced apart from each other. In this way, the space between the cover 20 and the light detection element 30 can confine stray light, thereby making it possible to more reliably remove the stray light.

[0092] Moreover, the thermal expansion coefficient of the support 10 in the X-axis direction (the second direction in which the grating grooves 52a of the spectroscopic section 52 are arranged) is equal to or less than the thermal expansion coefficient of the support 10 in the Y-axis direction (the third direction perpendicular to the first direction in which the recess 14 and the photodetector 30 face each other and perpendicular to the second direction) (it is more preferable that the thermal expansion coefficient of the support 10 in the X-axis direction is smaller than the thermal expansion coefficient of the support 10 in the Y-axis direction). In other words, when the thermal expansion coefficient of the support 10 in the X-axis direction is α and the thermal expansion coefficient of the support 10 in the Y-axis direction is β, the relationship α≦β is satisfied (it is more preferable that the relationship α<β is satisfied). This makes it possible to suppress the positional relationship between the grating grooves 52a in the spectroscopic section 52 and the photodetector channels 33a in the photodetector section 33 of the photodetector 30 from being shifted due to the thermal expansion of the support 10.

[0093] 14, one terminal 36 of the photodetector 30 and one terminal 11a of the wiring 11 facing each other are connected to each other by a plurality of bumps 61 made of, for example, Au, solder, or the like, and the plurality of bumps 61 may be arranged along the X-axis direction (the second direction in which the plurality of grating grooves 52a of the spectroscopic section 52 are arranged). A plurality of such sets of one terminal 36, one terminal 11a, and the plurality of bumps 61 may be provided in the Y-axis direction. This can prevent the positional relationship between the plurality of grating grooves 52a in the spectroscopic section 52 and the plurality of photodetection channels 33a in the photodetector section 33 of the photodetector 30 from being displaced due to, for example, thermal expansion of the support 10. In addition, by arranging the bumps 61 two-dimensionally, there is more space available than when the bumps 61 are arranged in a row, so that the area of ​​each terminal 36 can be sufficiently secured.

[0094] Moreover, the first widened portion 13a may be a step portion in which the space S (a space in which the optical path of the light L1 from the light passing portion 31 to the spectroscopic portion 52, the optical path of the light L2 from the spectroscopic portion 52 to the light detection portion 33, and the optical path of the zero-order light L0 from the spectroscopic portion 52 to the zero-order light capture portion 34 are formed) is widened in at least one direction (for example, the X-axis direction) on the opposite side to the bottom wall portion 12, and may be configured in one step or multiple steps. Similarly, the second widened portion 13b may be a step portion in which the first widened portion 13a is widened in at least one direction (for example, the X-axis direction) on the opposite side to the bottom wall portion 12, and may be configured in one step or multiple steps. When the light detection unit 33 is configured as a back-illuminated photodiode and multiple terminals 36 are provided on the surface opposite to the surface 35a of the substrate 35, and each terminal 36 is electrically connected to the terminal 11a of the corresponding wiring 11 by wire bonding, the terminal 11a of each wiring 11 may be arranged in a stage of the first widening portion 13a which is configured in multiple stages, other than the stage in which the light detection element 30 is arranged (a stage that is outer and upper than the stage in which the light detection element 30 is arranged).

[0095] Furthermore, the support 10 is not limited to being made of resin, and may be made of ceramics such as AlN and Al2O3, or molding glass. The shape of the support 10 is not limited to being rectangular, and may be, for example, a shape with a curved surface on the outer surface. The shape of the side wall portion 13 is not limited to being rectangular and annular, and may be annular, as long as it is an annular shape surrounding the recess 14 when viewed from the Z-axis direction.

[0096] Furthermore, as long as the light detection element 30 has the light detection section 33, it does not have to have the light passing section 31, the second reflecting section 32, and the zero-order light capturing section 34. The light detection element 30 may be attached to the side wall section 13 via a member separate from the side wall section 13. The spectroscopic section 52 may be configured as a spectroscopic element and attached to the support body 10.

[0097] Moreover, the multiple terminals 11b may be provided in a region other than the outer surface 18b of one of the second side walls 18, as long as it is on the surface of the support 10. The term "terminal" is a general term for a portion where a connection with another member is performed, and may not be an end of a wiring, and may not be wider than the wiring. That is, the position and shape of the terminals 11b are not limited to those shown in FIG. 2. In addition, in the above embodiment, the multiple terminals 11b are arranged so as to surround the space S when viewed from the Y-axis direction, and a portion of each terminal 11b overlaps with the bottom wall portion 12, the pair of first side walls 17, and the light detection element 30 when viewed from the Y-axis direction, but the position of the terminals 11b is not limited to such a case. For example, for at least a portion of the multiple terminals 11b, the entire terminals 11b may overlap with the bottom wall portion 12, the pair of first side walls 17, and the light detection element 30 when viewed from the Y-axis direction, or the entire terminals 11b may overlap with the space S when viewed from the Y-axis direction. In addition, the mutually opposing terminals 11b and 202 may be joined to each other via a joining member (e.g., a conductive adhesive that can be joined at room temperature) other than the joining member 205 (e.g., a solder paste, a solder ball, a solder ball with a core, etc.) that can be joined by heat treatment.

[0098] Furthermore, the spectrometer 1 may not include the first reflecting section 51 and the second reflecting section 32, and the light L1 passing through the light passing section 31 may be split and reflected by the spectroscopic section 52, and the light L2 split and reflected by the spectroscopic section 52 may be incident on the light detecting section 33 and detected by the light detecting section 33. Furthermore, in the spectrometer 1, the space S may not be hermetically sealed, for example, by providing a gap in a portion between the cover 20 and the side wall section 13.

[0099] 15, the spectroscopic module 100 may further include a rigid wiring board 300 to which a plurality of terminals 203 of the wiring unit 200 are connected. In this case, in a configuration in which the spectroscopic section 52 and the photodetector 30 face each other via a space S, it is possible to reliably suppress a decrease in detection accuracy while realizing electrical connection between the photodetector 30 and the rigid wiring board 300.

[0100] Furthermore, the components of the spectroscopic module 100 are not limited to the examples of materials and shapes described above, and various materials and shapes can be applied. Furthermore, each component in one embodiment or modification described above can be arbitrarily applied to each component in another embodiment or modification. [Explanation of symbols]

[0101] 1...spectroscope, 10...support, 11b...terminal (first terminal), 12...bottom wall portion, 13...side wall portion, 18b...outer surface (surface), 30...photodetector element, 33a...photodetection channel, 52...spectroscope portion, 52a...grating groove, 100...spectroscope module, 200...wiring unit, 201...support substrate, 202...terminal (second terminal), 203...terminal (third terminal), 204...wiring, 205...joint member, 300...rigid wiring board, S...space.

Claims

1. a support having a bottom wall and a side wall enclosing a space on one side of the bottom wall; a spectroscopic unit provided on the one side of the bottom wall portion and having a plurality of grating grooves; a light detection element attached to the side wall portion so as to face the spectroscopic unit across the space, the light detection element having a plurality of light detection channels; a plurality of first terminals provided on the surface of the support member opposite to the space, the first terminals being electrically connected to the light detection elements; a wiring unit including a plurality of second terminals facing the plurality of first terminals, respectively, and joined to the plurality of first terminals, a plurality of third terminals electrically connected to the plurality of second terminals, respectively, and a support substrate on which the plurality of second terminals and the plurality of third terminals are provided, Among the plurality of first terminals and the plurality of second terminals, the first terminals and the second terminals facing each other are joined to each other via a joining member, The wiring unit is configured such that the support substrate is a flexible wiring substrate having flexibility, the supporting substrate includes a first portion in which the plurality of second terminals are provided, a second portion in which the plurality of third terminals are provided, and a third portion located between the first portion and the second portion, A spectroscopic module, wherein the width of the first portion is greater than the width of the second portion.

2. The spectroscopy module according to claim 1 , wherein the first terminals are provided on a flat region having a largest area among a plurality of flat regions constituting the surface of the support body.

3. The spectroscopy module according to claim 1 , wherein the first terminals are provided on a surface of the support body opposite to the space in the side wall portion.

4. 4. The spectroscopic module according to claim 3, wherein the plurality of first terminals are provided in a region of the surface of the side wall portion that extends in a second direction, the second direction being perpendicular to a first direction in which the spectroscopic section and the light detection element face each other and in which the plurality of grating grooves are arranged.

5. 5. The spectroscopic module according to claim 1, wherein the joining member is a solder layer.

6. 6. The spectroscopy module according to claim 1, wherein the joining member holds a gap formed between the support body and the wiring unit.

7. 7. The spectroscopy module according to claim 1, wherein each of the plurality of first terminals is a circular electrode pad.

8. 8. The spectroscopy module according to claim 1, wherein each of the second terminals is a circular electrode pad.

9. The spectroscopy module according to claim 1 , wherein the third terminals are configured as connectors.

10. the wiring unit further includes a plurality of wirings respectively connecting the second terminals and the third terminals; 10. The spectroscopic module according to claim 1, wherein the support substrate has a bending strength smaller than a bending strength of the support body.

11. The spectroscopy module according to claim 1 , further comprising a rigid wiring board to which the third terminals are connected.

12. A method for manufacturing the spectroscopic module according to any one of claims 1 to 11, comprising: a first step of preparing a spectrometer including: a support having a bottom wall and a side wall surrounding a space on one side of the bottom wall; a spectroscopic section provided on the one side of the bottom wall and having a plurality of grating grooves; a light detection element having a plurality of light detection channels and attached to the side wall so as to face the spectroscopic section across the space; and a plurality of first terminals provided on the surface of the support along a surface of the support opposite to the space and electrically connected to the light detection element; a second step of preparing a wiring unit including a plurality of second terminals and a plurality of third terminals electrically connected to the plurality of second terminals, respectively, and including a flexible wiring substrate; a third step of, after the first step and the second step, placing the plurality of first terminals and the plurality of second terminals opposite each other via a joining member and joining the mutually opposing first terminals and second terminals to each other via the joining member; a fourth step of acquiring, after the third step, a relationship between the position of each of the plurality of light detection channels and a peak wavelength of light incident on each of the plurality of light detection channels.

13. A method for manufacturing the spectroscopic module according to any one of claims 1 to 11, comprising: a first step of preparing a spectrometer including: a support having a bottom wall and a side wall surrounding a space on one side of the bottom wall; a spectroscopic section provided on the one side of the bottom wall and having a plurality of grating grooves; a light detection element having a plurality of light detection channels and attached to the side wall so as to face the spectroscopic section across the space; and a plurality of first terminals provided on the surface of the support along a surface of the support opposite to the space and electrically connected to the light detection element; a second step of preparing a wiring unit including a flexible wiring substrate, the wiring unit having a plurality of second terminals and a plurality of third terminals electrically connected to the plurality of second terminals, respectively, and providing a bonding member to each of the plurality of second terminals by heat treatment; and a third step, after the first step and the second step, of opposing the plurality of first terminals and the plurality of second terminals to each other, and bonding the opposing first terminals and second terminals to each other via the bonding member by heat treatment.

14. In the second step, a plurality of the wiring units connected to each other are prepared, The method for manufacturing a spectroscopy module according to claim 13 , further comprising the step of separating the wiring units to which the spectroscopes are attached from one another after the third step.

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