Printed Circuit Board Module

Abstract

The printed circuit board module includes a first printed circuit board; a second printed circuit board disposed on one side of the first printed circuit board; a third printed circuit board disposed on the other side of the first printed circuit board; and a core extending through the first printed circuit board to the third printed circuit board; the second printed circuit board includes a first coil, and the third printed circuit board includes a second coil, and the cross-sectional areas of the second printed circuit board and the third printed circuit board are smaller than the cross-sectional area of ​​the first printed circuit board.

Description

[Technical field]

[0001] The present embodiment relates to a printed circuit board module. [Background technology]

[0002] The following description is intended to provide background information for the present embodiment only and is not intended to describe the prior art.

[0003] The most common electrical systems in an automobile are the engine electrical systems (starting system, ignition system, charging system) and lighting systems, but in recent years, as vehicles have become more electronically controlled, there has been a trend toward many systems, including the sash electrical system, being made electrically-operated.

[0004] Various electrical equipment installed in automobiles, such as lamps, audio, heaters, and air conditioners, are powered by the battery when the vehicle is stopped, and by a generator when the vehicle is running; at this time, the generating capacity of the 14V system power supply is used at the normal power supply voltage.

[0005] In recent years, with the development of the information technology industry, various new technologies (motorized power steering, Internet, etc.) aimed at increasing the convenience of automobiles have been integrated into vehicles, and it is expected that the development of new technologies that can make the most of current automobile systems will continue in the future.

[0006] Regardless of whether they are soft or hard-powered, hybrid electric vehicles (HEVs) are equipped with a low voltage DC-DC converter to supply 12V to electrical loads. Also, the DC-DC converter, which acts as a generator (alternator) in a regular gasoline vehicle, steps down the high voltage of the main battery (usually a high voltage battery of 144V or more) and supplies 12V to electrical loads.

[0007] A DC-DC converter is an electronic circuit device that converts a DC power source of one voltage into a DC power source of another voltage, and is used in a variety of fields such as television receivers and automotive electrical equipment.

[0008] The converter may have an outer shape defined by a housing. A number of components for driving may be disposed within the housing. The number of components may include a printed circuit board. One or more electronic components for driving may be disposed on an upper surface or a lower surface of the printed circuit board. For example, the electronic components may include an inductor and a transformer.

[0009] Such a power supply device is composed of an iron core and a wire-wound element disposed around a core, so that the height of the entire part is formed to be higher than other parts, which causes a problem of narrowing the space inside the housing.

[0010] Specifically, the coil placement area is limited for each layer of the printed circuit board, and when the printed circuit board is constructed in multiple layers, the manufacturing cost of the module increases. In addition, the increase in the coil placement area increases the capacitance component, which causes resonance with parasitic components, which is disadvantageous in terms of electromagnetic waves. In addition, it is difficult to secure a leakage inductor because of the high magnetic coupling through the core. Summary of the Invention [Problem to be solved by the invention]

[0011] This embodiment provides a printed circuit board module that allows components to be miniaturized, thereby making it possible to secure a larger space within the housing. [Means for solving the problem]

[0012] In one embodiment, a printed circuit board module includes a first printed circuit board; a second printed circuit board disposed on one side of the first printed circuit board; a third printed circuit board disposed on the other side of the first printed circuit board; and a core extending through the first printed circuit board to the third printed circuit board; the second printed circuit board includes a first coil, and the third printed circuit board includes a second coil, and a cross-sectional area of ​​the second printed circuit board and the third printed circuit board is smaller than a cross-sectional area of ​​the first printed circuit board.

[0013] The first printed circuit board may also include a first hole and a second hole into which a portion of the core is inserted.

[0014] Also, the second printed circuit board may be disposed between the first hole and the second hole.

[0015] Also, the first coil may include a plurality of first metal patterns, and the second coil may include a plurality of second metal patterns.

[0016] Also, the core may include a first core and a second core, the first core may extend through a first printed circuit board, and the second core may extend through a second printed circuit board.

[0017] Also, the first core and the second core may each be arranged in a plurality of pieces.

[0018] Also, an insulating layer may be included between the first printed circuit board and the second printed circuit board or between the first printed circuit board and the third printed circuit board.

[0019] The insulating layer may also include an air gap. Also, the first core may contact an upper surface and a side surface of the second printed circuit board, and the second core may contact a lower surface and a side surface of the third printed circuit board.

[0020] In another embodiment, a printed circuit board module includes a first printed circuit board having a first opening; a second printed circuit board disposed on one side of the first printed circuit board and having a second opening; a third printed circuit board disposed on the other side of the first printed circuit board and having a third opening; and a core at least partially penetrating the second opening and the third opening; wherein the second printed circuit board and the third printed circuit board include coils, and a length of a long side of the core is longer than a length of at least one side of the second printed circuit board or the third printed circuit board. Effect of the Invention

[0021] According to the present invention, the main printed circuit board and the second printed circuit board are constructed in multiple layers, which makes it possible to secure a large space for forming metal patterns, and has the advantage of reducing the manufacturing cost compared to a main printed circuit board constructed in multiple layers. [Brief description of the drawings]

[0022] [Figure 1] 1 is a perspective view of a printed circuit board module according to a first embodiment of the present invention; [Diagram 2] 1 is a cross-sectional view of a printed circuit board module according to a first embodiment of the present invention. [Diagram 3] 1 is an exploded perspective view of a printed circuit board module according to a first embodiment of the present invention; [Figure 4] FIG. 1 is a plan view of a metal pattern according to a first embodiment of the present invention. [Diagram 5] FIG. 5 is a cross-sectional view of a printed circuit board module according to a second embodiment of the present invention. [Figure 6] 3 is a cross-sectional view of a printed circuit board module according to a third embodiment of the present invention; [Figure 7] FIG. 10 is a cross-sectional view of a printed circuit board module according to a fourth embodiment of the present invention. [Figure 8] FIG. 13 is a cross-sectional view of a printed circuit board module according to a fifth embodiment of the present invention. [Figure 9] FIG. 13 is a cross-sectional view of a printed circuit board module according to a sixth embodiment of the present invention. [Figure 10]FIG. 13 is a cross-sectional view of a printed circuit board module according to a seventh embodiment of the present invention. [Figure 11] FIG. 13 is a cross-sectional view of a printed circuit board module according to an eighth embodiment of the present invention. [Figure 12] FIG. 13 is a cross-sectional view of a printed circuit board module according to a ninth embodiment of the present invention. [Figure 13] FIG. 23 is a cross-sectional view of a printed circuit board module according to a tenth embodiment of the present invention. [Figure 14] FIG. 23 is a cross-sectional view of a printed circuit board module according to an eleventh embodiment of the present invention. [Figure 15] FIG. 23 is a cross-sectional view of a printed circuit board module according to a twelfth embodiment of the present invention. [Figure 16] FIG. 23 is a cross-sectional view of a printed circuit board module according to a thirteenth embodiment of the present invention. [Figure 17] 14 is a cross-sectional view of a printed circuit board module according to a fourteenth embodiment of the present invention. [Figure 18] FIG. 23 is a cross-sectional view of a printed circuit board module according to a fifteenth embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in

[0024] However, the technical concept of the present invention is not limited to the embodiments described, but can be realized in various different forms, and one or more of the components of the embodiments can be selectively combined or substituted within the scope of the technical concept of the present invention.

[0025] Furthermore, unless otherwise clearly and specifically defined, terms (including technical and scientific terms) used in the embodiments of the present invention are to be interpreted as meanings that can be commonly understood by a person having ordinary knowledge in the technical field to which the present invention belongs, and commonly used terms such as predefined terms should be interpreted in light of the contextual meaning of the relevant art.

[0026] In addition, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention. In this specification, the singular form can include the plural form unless otherwise specified in the text, and when it is described as "A and (and) at least one (or more) of B and C", it can include one or more of all combinations that A, B, and C can be combined.

[0027] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of embodiments of the present invention.

[0028] Such terms are used to distinguish a component from another component, and are not intended to limit the nature, order, or sequence of the components.

[0029] Furthermore, when a component is described as being 'coupled', 'coupled' or 'connected' to another component, this includes not only the case where the component is directly coupled, coupled or connected to the other component, but also the case where the component is 'coupled', 'coupled' or 'connected' by another component between the component and the other component.

[0030] In addition, when described as being formed or disposed "above (above) or below (below)" each component, the above (above) or below (below) includes not only the case where two components are in direct contact with each other, but also the case where one or more additional components are formed or disposed between the two components. In addition, when described as "above (above) or below (below)", it can include not only the upper direction but also the lower direction based on one component.

[0031] The converter according to this embodiment is an electrical device installed in an automobile, and refers to an electronic circuit device that converts a power source of one voltage into a power source of another voltage. In one example, the converter may be a DC-DC converter. However, the configuration according to this embodiment is not limited thereto, and the printed circuit board module according to this embodiment may be applied to various electrical devices.

[0032] In addition, the converter according to the present embodiment may have an outer shape defined by a housing, and an internal space may be defined within the housing to accommodate the printed circuit board module according to the present embodiment.

[0033] FIG. 1 is an oblique view of a printed circuit board module according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the printed circuit board module according to the first embodiment of the present invention, FIG. 3 is an exploded oblique view of the printed circuit board module according to the first embodiment of the present invention, and FIG. 4 is a plan view of a metal pattern according to the first embodiment of the present invention.

[0034] 1 to 4, a printed circuit board module 100 according to a first embodiment of the present invention may include a first printed circuit board 110, a second printed circuit board 120 and a core .

[0035] The first printed circuit board 110 may be formed in a plate shape. One or more electronic components 112 for driving may be disposed on an upper surface or a lower surface of the first printed circuit board 110. The electronic components 112 may be provided in plurality and disposed spaced apart from each other.

[0036] The first printed circuit board 110 may be a double-sided printed circuit board, with second printed circuit boards 120 and 140, a core 130, and a number of electronic components 112 disposed on the upper and lower surfaces, respectively.

[0037] A primary metal pattern (not shown) may be wound on an upper surface or a lower surface of the first printed circuit board 110. The primary metal pattern may be formed in a coil shape on a surface of the first printed circuit board 110.

[0038] The second printed circuit boards 120 and 140 may be disposed on one side or the other side of the first printed circuit board 110. The second printed circuit boards 120 and 140 may include an upper printed circuit board 120 disposed on an upper side of the first printed circuit board 110 and a lower printed circuit board 140 disposed on a lower side of the first printed circuit board 110. The second printed circuit boards 120 and 140 may be formed to have a smaller cross-sectional area than the first printed circuit board 110.

[0039] The upper printed circuit board 120 may be referred to as a second printed circuit board 120, and the lower printed circuit board 140 may be referred to as a third printed circuit board 140. The second printed circuit board 120 and the third printed circuit board 140 may have the same area.

[0040] A secondary metal pattern 122 may be wound on the surface of the second printed circuit boards 120 and 140. The secondary metal pattern may be wound on the surface of the second printed circuit boards 120 and 140 in the form of a coil.

[0041] In other words, a first coil may be formed on the second printed circuit board 120, and a second coil may be formed on the third printed circuit board 140. The first coil may include a plurality of first metal patterns. The second coil may include a plurality of second metal patterns.

[0042] The first metal pattern may include a primary coil having a first voltage, and the second metal pattern may include a secondary coil separated from the primary coil and having a second voltage.

[0043] As shown in FIG. 3, the primary metal pattern or the secondary metal pattern 122 may be spirally wound on the surface of the first printed circuit board 110 or the second printed circuit board 120, 140, respectively.

[0044] The second printed circuit boards 120 and 140 may be formed in multiple layers. The upper printed circuit board 120 and the lower printed circuit board 140 may each be provided in a plurality of pieces and stacked in a vertical direction. More specifically, the upper printed circuit board 120 disposed on the first printed circuit board 110 may be realized as two or more pieces. In addition, the secondary metal pattern 122 may be disposed on a surface of each of the upper printed circuit boards 120.

[0045] When the second printed circuit boards 120 and 140 are realized in a multi-layer, the metal patterns disposed on the surfaces of the second printed circuit boards 120 and 140 may be connected to conductors via through holes.

[0046] Meanwhile, in this embodiment, a first metal pattern is disposed on the first printed circuit board 110, and a second metal pattern is disposed on the second printed circuit boards 120 and 140, but this is not limited thereto, and a first metal pattern may be disposed on the second printed circuit boards 120 and 140, and a second metal pattern may be disposed on the first printed circuit board 110. Also, a metal pattern may not be disposed on the first printed circuit board 110 from the beginning. In this case, both the first metal pattern and the second metal pattern may be disposed on the second printed circuit boards 120 and 140.

[0047] Meanwhile, the primary metal pattern and the secondary metal pattern may be realized as metal pattern layers having an inductance component on the first printed circuit board 110 and the second printed circuit boards 120 and 140, respectively. In addition, the metal pattern layers having an inductance component may be provided with a metal material having high conductivity to efficiently and smoothly output the transformed power signal.

[0048] The core 130 may be coupled to the first to third printed circuit boards 110, 120, and 140 so as to penetrate therethrough. The first printed circuit board 110 may be formed with a first opening 118 and a hole 119 into which at least a portion of the core 130 may be inserted. The holes 119 may be provided in a plurality of numbers and may be arranged to face each other with respect to the first opening 118. The holes 119 may include a first hole and a second hole. At least a portion of the core 130 may be inserted into each of the first hole and the second hole.

[0049] The second printed circuit board 120 and the third printed circuit board 140 may be disposed between the first hole and the second hole.

[0050] The cross-sectional area of ​​the hole 119 may be smaller than the cross-sectional area of ​​the first opening 118 .

[0051] Meanwhile, a second opening 129 and a third opening 149 may be formed in the second printed circuit board 120 and the third printed circuit board 140 in an area facing the first opening 118 in a vertical direction, respectively. Thus, the core 130 may be coupled such that at least a portion thereof passes through the first opening 118, the second opening 129, and the third opening 149. The first to third openings 118, 129, and 149 may be disposed facing each other in a vertical direction and have the same size.

[0052] The core 130 may be disposed on the surfaces of the second printed circuit boards 120 and 140 to induce the formation of a magnetic field. The core 130 may be disposed on the upper surface of the upper printed circuit board 120 or the lower surface of the lower printed circuit board 140. The core 130 may be in a form that surrounds the first printed circuit board 110 and the second printed circuit boards 120 and 140 that form the first metal pattern and the second metal pattern from the outside. The metal pattern 122 disposed on the surfaces of the second printed circuit boards 120 and 140 may be disposed to surround the core 130. In one example, the core 130 may be a ferrite core.

[0053] The core 130 may be provided in a plurality. The core 130 may include a first core and a second core. The first core may contact an upper surface and a side surface of the second printed circuit board 120. The second core may contact a lower surface and a side surface of the third printed circuit board 140.

[0054] The first core and the second core may each be arranged in a plurality of pieces (see FIG. 10).

[0055] Meanwhile, the length of the long side of the core 130 may be longer than the length of at least one side of the second printed circuit board 120 or the third printed circuit board 130 .

[0056] According to the above-mentioned structure, the second printed circuit board in addition to the main printed circuit board can be formed in multiple layers, so that space for forming metal patterns can be secured, and there is an advantage that the manufacturing cost can be reduced compared to when the main printed circuit board is formed in multiple layers.

[0057] FIG. 5 is a cross-sectional view of a printed circuit board module according to a second embodiment of the present invention.

[0058] Referring to FIG. 5, a printed circuit board module 200 according to a second embodiment of the present invention may include a first printed circuit board 210, a second printed circuit board 220, an upper core 230 and a lower core 240.

[0059] The first printed circuit board 210 may be formed in a plate shape. One or more electronic components for driving may be disposed on an upper surface or a lower surface of the first printed circuit board 210. A plurality of electronic components may be provided and disposed spaced apart from each other.

[0060] The first printed circuit board 210 may be a double-sided printed circuit board, with a second printed circuit board 220, cores 230 and 240, and a number of electronic components disposed on the top and bottom surfaces, respectively.

[0061] A primary metal pattern (not shown) may be wound on an upper surface or a lower surface of the first printed circuit board 210. The primary metal pattern may be formed in a coil shape on a surface of the first printed circuit board 210.

[0062] A second printed circuit board 220 may be disposed on an upper surface of the first printed circuit board 210. The cross-sectional area of ​​the second printed circuit board 220 may be smaller than the cross-sectional area of ​​the first printed circuit board 210.

[0063] A secondary metal pattern may be wound on a surface of the second printed circuit board 220. The secondary metal pattern may be wound in a coil shape on the surface of the second printed circuit board 220. The secondary metal pattern may be wound in a spiral shape on the surface of the second printed circuit board 220.

[0064] The second printed circuit board 220 may be formed in multiple layers. The second printed circuit board 220 disposed on the second printed circuit board 220 may be realized as two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the second printed circuit boards 220.

[0065] When the second printed circuit board 220 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 220 may be connected to conductors via through holes.

[0066] The upper core 230 may be disposed on an upper surface of the second printed circuit board 220. The upper core 230 may be disposed on a surface of the second printed circuit board 220 to induce formation of a magnetic field. The upper core 230 may be combined in a form that wraps the secondary metal pattern from the outside.

[0067] The upper core 230 may be coupled to the second printed circuit board 220 so as to penetrate therethrough.

[0068] The lower core 240 may be disposed on a lower surface of the first printed circuit board 210. The lower core 240 may be disposed on a lower surface of the first printed circuit board 210 to induce formation of a magnetic field. The lower core 240 may be coupled to the primary metal pattern in a form that surrounds the primary metal pattern from the outside.

[0069] The lower core 240 may be coupled to the first printed circuit board 110 so as to penetrate therethrough.

[0070] The upper core 230 and the lower core 240 may be ferrite cores.

[0071] The first printed circuit board 210 and the second printed circuit board 220 may be rivet-connected. The first printed circuit board 210 and the second printed circuit board 220 may each have a hole through which the rivet 250 passes. The upper and lower ends of the rivet 250 may have locking portions 252 and 254 having a larger cross-sectional area than other regions so as to lock the rivet to the lower surface of the first printed circuit board 210 and the upper surface of the second printed circuit board 220, respectively. With the above structure, the first printed circuit board 210 and the second printed circuit board 220 may be firmly connected to each other.

[0072] Also, the first printed circuit board 210 and the second printed circuit board 220 may be electrically connected via the rivet 250. In this case, the upper and lower ends of the rivet 250 may be mounted on the lower surface of the first printed circuit board 210 or the upper surface of the second printed circuit board 220, respectively.

[0073] FIG. 6 is a cross-sectional view of a printed circuit board module according to a third embodiment of the present invention.

[0074] Referring to FIG. 6, a printed circuit board module 300 according to a third embodiment of the present invention may include a first printed circuit board 310 , a second printed circuit board 320 , a third printed circuit board 330 , an upper core 340 and a lower core 350 .

[0075] The first printed circuit board 310 may be formed in a plate shape. One or more electronic components for driving may be disposed on an upper surface or a lower surface of the first printed circuit board 310. A plurality of electronic components may be provided and disposed spaced apart from each other.

[0076] The first printed circuit board 310 may be a double-sided printed circuit board, with a second printed circuit board 320, a lower core 350, and a number of electronic components disposed on the upper and lower surfaces, respectively.

[0077] A primary metal pattern (not shown) may be wound on an upper surface or a lower surface of the first printed circuit board 310. The primary metal pattern may be formed in a coil shape on a surface of the first printed circuit board 310.

[0078] A second printed circuit board 320 may be disposed on an upper surface of the first printed circuit board 310. The cross-sectional area of ​​the second printed circuit board 320 may be smaller than the cross-sectional area of ​​the first printed circuit board 310.

[0079] A secondary metal pattern may be wound on a surface of the second printed circuit board 320. The secondary metal pattern may be wound in a coil shape on the surface of the second printed circuit board 320. The secondary metal pattern may be wound in a spiral shape on the surface of the second printed circuit board 320.

[0080] The second printed circuit board 320 may be formed in multiple layers. The second printed circuit board 320 disposed on the second printed circuit board 320 may be realized as two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the second printed circuit boards 320.

[0081] When the second printed circuit board 320 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 320 may be connected to conductors via through holes.

[0082] A third printed circuit board 330 may be disposed on an upper surface of the second printed circuit board 320. The cross-sectional area of ​​the third printed circuit board 330 may be smaller than the cross-sectional area of ​​the first printed circuit board 310. The cross-sectional area of ​​the third printed circuit board 330 may correspond to the cross-sectional area of ​​the second printed circuit board 320.

[0083] A secondary metal pattern may be wound on a surface of the third printed circuit board 330. The secondary metal pattern may be wound in a coil shape on the surface of the third printed circuit board 330. The secondary metal pattern may be wound in a spiral shape on the surface of the third printed circuit board 330.

[0084] The third printed circuit board 330 may be formed in multiple layers. The third printed circuit board 330 disposed on the third printed circuit board 330 may be realized as two or more sheets. Also, the secondary metal pattern may be disposed on a surface of each of the third printed circuit boards 330.

[0085] When the third printed circuit board 330 is realized in a multi-layer, the metal patterns disposed on the surface of the third printed circuit board 330 may be connected to conductors via through holes.

[0086] In addition, the metal pattern of the third printed circuit board 330 and the metal pattern of the second printed circuit board 320 may be connected to an interconnect via a through hole.

[0087] The upper core 340 may be disposed on an upper surface of the third printed circuit board 330. The upper core 340 may be disposed on a surface of the third printed circuit board 330 to induce formation of a magnetic field. The upper core 340 may be combined in a form that wraps the secondary metal pattern from the outside.

[0088] The lower core 350 may be disposed on a lower surface of the first printed circuit board 310. The lower core 350 may be disposed on a lower surface of the first printed circuit board 310 to induce the formation of a magnetic field. The lower core 350 may be coupled to the primary metal pattern in a form that surrounds the primary metal pattern from the outside.

[0089] The upper core 340 and the lower core 350 may be ferrite cores.

[0090] The first printed circuit board 310, the second printed circuit board 320, and the third printed circuit board 330 may be rivet-coupled. The first printed circuit board 310, the second printed circuit board 320, and the third printed circuit board 330 may each have a hole formed therein so that a rivet 360 passes through. The upper and lower ends of the rivet 360 may have locking portions 362 and 364 having a larger cross-sectional area than other regions so as to lock the rivet to the lower surface of the first printed circuit board 310 and the upper surface of the first printed circuit board 330, respectively. With the above structure, the first printed circuit board 310, the second printed circuit board 320, and the third printed circuit board 330 may be firmly coupled to each other.

[0091] In addition, the first printed circuit board 310, the second printed circuit board 320, and the third printed circuit board 330 may be electrically connected through the rivet 360. In this case, the upper and lower ends of the rivet 360 may be mounted on the lower surface of the first printed circuit board 310 or the upper surface of the third printed circuit board 330, respectively.

[0092] FIG. 7 is a cross-sectional view of a printed circuit board module according to a fourth embodiment of the present invention.

[0093] Referring to FIG. 7, a printed circuit board module 400 according to a fourth embodiment of the present invention may include a first printed circuit board 410 , a second printed circuit board 420 , a third printed circuit board 430 and a core 440 .

[0094] The first printed circuit board 410 may be formed in a plate shape. One or more electronic components for driving may be disposed on an upper surface or a lower surface of the first printed circuit board 410. A plurality of electronic components may be provided and disposed spaced apart from each other.

[0095] The first printed circuit board 410 may be configured as a double-sided printed circuit board, with a second printed circuit board 420 and a third printed circuit board 430 disposed on the upper and lower surfaces, respectively.

[0096] A primary metal pattern (not shown) may be wound on an upper surface or a lower surface of the first printed circuit board 410. The primary metal pattern may be formed on a surface of the printed circuit board 410 in a coil shape.

[0097] A second printed circuit board 420 may be disposed on an upper surface of the first printed circuit board 410. The second printed circuit board 420 may be formed to have a smaller cross-sectional area than the first printed circuit board 410.

[0098] A secondary metal pattern may be wound on a surface of the second printed circuit board 420. The secondary metal pattern may be wound in a coil shape on the surface of the second printed circuit board 420. The secondary metal pattern may be wound in a spiral shape on the surface of the second printed circuit board 420.

[0099] The second printed circuit board 420 may be formed in multiple layers. The multi-layer second printed circuit board 420 may be stacked in a vertical direction. More specifically, the second printed circuit board 420 disposed on the first printed circuit board 410 may be realized as two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the second printed circuit boards 420.

[0100] When the second printed circuit board 420 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 420 may be connected to conductors via through holes.

[0101] A third printed circuit board 430 may be disposed on a lower surface of the first printed circuit board 410. The third printed circuit board 430 may be formed to have a smaller cross-sectional area than the first printed circuit board 410.

[0102] A secondary metal pattern may be wound on a surface of the third printed circuit board 430. The secondary metal pattern may be wound in a coil shape on the surface of the third printed circuit board 430. The secondary metal pattern may be wound in a spiral shape on the surface of the third printed circuit board 430.

[0103] The third printed circuit board 430 may be formed in multiple layers. The multi-layer third printed circuit board 430 may be stacked in a vertical direction. More specifically, the third printed circuit board 420 disposed on the lower surface of the first printed circuit board 410 may be realized in two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the third printed circuit boards 430.

[0104] When the third printed circuit board 430 is realized in a multi-layer, the metal patterns disposed on the surface of the third printed circuit board 430 may be connected to conductors via through holes.

[0105] The second printed circuit board 420 and the third printed circuit board 430 may be disposed to face each other with respect to the first printed circuit board 410 .

[0106] The core 440 may include an upper core and a lower core. The upper core may be disposed on an upper surface of the second printed circuit board 420. The upper core may be disposed on a surface of the second printed circuit board 420 to induce formation of a magnetic field. The upper core may be coupled to the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0107] The lower core may be disposed on a lower surface of the third printed circuit board 430. The lower core may be disposed on a lower surface of the third printed circuit board 430 to induce formation of a magnetic field. The lower core may be coupled to the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0108] The upper core and the lower core may be ferrite cores. The first printed circuit board 410, the second printed circuit board 420, and the third printed circuit board 430 may be coupled to each other via coupling means, and the second printed circuit board 420 and the third printed circuit board 430 may include coupling parts coupled to the coupling means.

[0109] In detail, the first printed circuit board 410, the second printed circuit board 420, and the third printed circuit board 430 may be rivet-coupled. The first printed circuit board 410, the second printed circuit board 420, and the third printed circuit board 430 may each have a hole formed therein so that the rivet 450 passes through. The upper and lower ends of the rivet 450 may have engagement portions 452, 454 formed with a larger cross-sectional area than other regions so as to be engaged with the upper surface of the second printed circuit board 420 and the lower surface of the third printed circuit board 430, respectively. With the above structure, the first printed circuit board 410, the second printed circuit board 420, and the third printed circuit board 430 may be firmly coupled.

[0110] Also, the first printed circuit board 410, the second printed circuit board 420, and the third printed circuit board 430 may be electrically connected through the rivet 450. In this case, the upper and lower ends of the rivet 450 may be mounted on the lower surface of the third printed circuit board 430 or the upper surface of the second printed circuit board 420, respectively.

[0111] FIG. 8 is a cross-sectional view of a printed circuit board module according to a fifth embodiment of the present invention.

[0112] Referring to FIG. 8, a printed circuit board module 500 according to a fifth embodiment of the present invention may include a first printed circuit board 510 , a second printed circuit board 520 , a third printed circuit board 530 and a core 560 .

[0113] The first printed circuit board 510 may be formed in a plate shape. One or more electronic components for driving may be disposed on an upper surface or a lower surface of the first printed circuit board 510. A plurality of electronic components may be provided and disposed spaced apart from each other.

[0114] The first printed circuit board 510 may be configured as a double-sided printed circuit board, with a second printed circuit board 520 and a third printed circuit board 530 disposed on the upper and lower surfaces, respectively.

[0115] A primary metal pattern (not shown) may be wound on an upper or lower surface of the first printed circuit board 510. The primary metal pattern may be formed on the surface of the printed circuit board 510 in the form of a coil.

[0116] A second printed circuit board 520 may be disposed on an upper surface of the first printed circuit board 510. The second printed circuit board 520 may be formed to have a smaller cross-sectional area than the first printed circuit board 510.

[0117] A secondary metal pattern may be wound on a surface of the second printed circuit board 520. The secondary metal pattern may be wound in a coil shape on the surface of the second printed circuit board 520. The secondary metal pattern may be wound in a spiral shape on the surface of the second printed circuit board 520.

[0118] The second printed circuit board 520 may be formed in multiple layers. The multi-layer second printed circuit board 520 may be stacked in a vertical direction. More specifically, the second printed circuit board 520 disposed on the first printed circuit board 510 may be realized by two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the second printed circuit boards 520. The second printed circuit board 520 may include a 2-1 printed circuit board 522 disposed on an upper surface of the first printed circuit board 510, and a 2-2 printed circuit board 524 disposed on an upper surface of the 2-1 printed circuit board 522.

[0119] When the second printed circuit board 520 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 520 may be connected to conductors via through holes.

[0120] A third printed circuit board 530 may be disposed on a lower surface of the first printed circuit board 510. The third printed circuit board 530 may be formed to have a smaller cross-sectional area than the first printed circuit board 510.

[0121] A secondary metal pattern may be wound on a surface of the third printed circuit board 530. The secondary metal pattern may be wound in a coil shape on the surface of the third printed circuit board 530. The secondary metal pattern may be wound in a spiral shape on the surface of the third printed circuit board 530.

[0122] The third printed circuit board 530 may be formed in multiple layers. The multi-layer third printed circuit board 530 may be stacked in a vertical direction. More specifically, the third printed circuit board 530 disposed on the lower surface of the first printed circuit board 510 may be realized by two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the third printed circuit boards 530. The third printed circuit board 530 may include a 3-1 printed circuit board 532 disposed on the lower surface of the first printed circuit board 510 and a 3-2 printed circuit board 534 disposed on the lower surface of the 3-1 printed circuit board 532.

[0123] When the third printed circuit board 530 is realized in a multi-layer, the metal patterns disposed on the surface of the third printed circuit board 530 may be connected to conductors via through holes.

[0124] The second printed circuit board 520 and the third printed circuit board 530 may be disposed to face each other with respect to the first printed circuit board 410 .

[0125] The core 560 may include an upper core and a lower core. The upper core may be disposed on an upper surface of the second printed circuit board 520. The upper core may be disposed on a surface of the second printed circuit board 520 to induce formation of a magnetic field. The upper core may be coupled to the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0126] The lower core may be disposed on a lower surface of the third printed circuit board 530. The lower core may be disposed on a lower surface of the third printed circuit board 530 to induce formation of a magnetic field. The lower core may be coupled to the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0127] The upper core and the lower core may be ferrite cores. The first printed circuit board 510, the second printed circuit board 520, and the third printed circuit board 530 may be rivet-coupled. The first printed circuit board 510, the second printed circuit board 520, and the third printed circuit board 530 may each have a hole through which the rivet 550 passes. The upper and lower ends of the rivet 550 may have engagement portions 552 and 554 having a larger cross-sectional area than other regions so as to be engaged with the upper surface of the second printed circuit board 520 and the lower surface of the third printed circuit board 530, respectively. With the above structure, the first printed circuit board 510, the second printed circuit board 520, and the third printed circuit board 530 may be firmly coupled.

[0128] The rivets 550 may be provided in a plurality and spaced apart from each other.

[0129] Also, the first printed circuit board 510, the second printed circuit board 520, and the third printed circuit board 530 may be electrically connected through the rivet 550. In this case, the upper and lower ends of the rivet 550 may be mounted on the lower surface of the third printed circuit board 530 or the upper surface of the second printed circuit board 520, respectively.

[0130] FIG. 9 is a cross-sectional view of a printed circuit board module according to a sixth embodiment of the present invention.

[0131] Referring to FIG. 9, a printed circuit board module 600 according to a sixth embodiment of the present invention may include a first printed circuit board 610 , a second printed circuit board 620 , a third printed circuit board 630 and a core 640 .

[0132] The first printed circuit board 610 may be formed in a plate shape. One or more electronic components for driving may be disposed on an upper surface or a lower surface of the first printed circuit board 610. A plurality of electronic components may be provided and disposed spaced apart from each other.

[0133] The first printed circuit board 610 may be configured as a double-sided printed circuit board, with a second printed circuit board 620 and a third printed circuit board 630 disposed on the upper and lower surfaces, respectively.

[0134] A primary metal pattern (not shown) may be wound on an upper or lower surface of the first printed circuit board 610. The primary metal pattern may be formed on a surface of the printed circuit board 610 in the form of a coil.

[0135] A second printed circuit board 620 may be disposed on an upper surface of the first printed circuit board 610. The second printed circuit board 620 may be formed to have a smaller cross-sectional area than the first printed circuit board 610.

[0136] A secondary metal pattern may be wound on a surface of the second printed circuit board 620. The secondary metal pattern may be wound in a coil shape on the surface of the second printed circuit board 620. The secondary metal pattern may be wound in a spiral shape on the surface of the second printed circuit board 620.

[0137] The second printed circuit board 620 may be formed in multiple layers. The multi-layer second printed circuit board 620 may be stacked in a vertical direction. More specifically, the second printed circuit board 620 disposed on the first printed circuit board 610 may be realized by two or more sheets. The secondary metal pattern may be disposed on a surface of each of the second printed circuit boards 620. The second printed circuit board 620 may include a 2-1 printed circuit board 622 disposed on an upper surface of the first printed circuit board 610 and a 2-2 printed circuit board 624 disposed on an upper surface of the 2-1 printed circuit board 622.

[0138] When the second printed circuit board 620 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 620 may be connected to conductors via through holes.

[0139] A third printed circuit board 630 may be disposed on a lower surface of the first printed circuit board 610. The third printed circuit board 630 may be formed to have a smaller cross-sectional area than the first printed circuit board 610.

[0140] A secondary metal pattern may be wound on a surface of the third printed circuit board 630. The secondary metal pattern may be wound in a coil shape on the surface of the third printed circuit board 630. The secondary metal pattern may be wound in a spiral shape on the surface of the third printed circuit board 630.

[0141] The third printed circuit board 630 may be formed in multiple layers. The multi-layer third printed circuit board 630 may be stacked in a vertical direction. More specifically, the third printed circuit board 630 disposed on the lower surface of the first printed circuit board 610 may be realized in two or more sheets. The secondary metal pattern may be disposed on a surface of each of the third printed circuit boards 630. The number of layers of the third printed circuit board 630 may be less than the number of layers of the second printed circuit board 620. In one example, the second printed circuit board 620 may be realized in two sheets, and the third printed circuit board 630 may be realized in one sheet.

[0142] The core 640 may include an upper core and a lower core. The upper core may be disposed on an upper surface of the second printed circuit board 620. The upper core may be disposed on a surface of the second printed circuit board 620 to induce the formation of a magnetic field. The upper core may be combined with the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0143] The lower core may be disposed on a lower surface of the third printed circuit board 630. The lower core may be disposed on a lower surface of the third printed circuit board 630 to induce the formation of a magnetic field. The lower core may be coupled to the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0144] The upper core and the lower core may be ferrite cores. The first printed circuit board 610, the second printed circuit board 620, and the third printed circuit board 630 may be rivet-connected. The first printed circuit board 610, the second printed circuit board 620, and the third printed circuit board 630 may each have a hole through which the rivet 650 passes. The upper and lower ends of the rivet 650 may have locking portions 652, 654 having a larger cross-sectional area than other regions so as to be locked to the upper surface of the second printed circuit board 620 and the lower surface of the third printed circuit board 630, respectively. With the above structure, the first printed circuit board 610, the second printed circuit board 620, and the third printed circuit board 630 may be firmly connected to each other.

[0145] The rivets 650 may be provided in a plurality and spaced apart from each other.

[0146] Also, the first printed circuit board 610, the second printed circuit board 620, and the third printed circuit board 630 may be electrically connected through the rivet 650. In this case, the upper and lower ends of the rivet 650 may be mounted on the lower surface of the third printed circuit board 630 or the upper surface of the second printed circuit board 620, respectively.

[0147] FIG. 10 is a cross-sectional view of a printed circuit board module according to a seventh embodiment of the present invention.

[0148] Referring to FIG. 10, a printed circuit board module 700 according to a seventh embodiment of the present invention may include a first printed circuit board 710 , a second printed circuit board 720 , a third printed circuit board 730 and a core 750 .

[0149] The first printed circuit board 710 may be formed in a plate shape. One or more electronic components for driving may be disposed on an upper surface or a lower surface of the first printed circuit board 710. A plurality of electronic components may be provided and disposed spaced apart from each other.

[0150] The first printed circuit board 710 may be a double-sided printed circuit board, with a second printed circuit board 720 and a third printed circuit board 730 disposed on the top and bottom surfaces, respectively.

[0151] A primary metal pattern (not shown) may be wound on an upper or lower surface of the first printed circuit board 710. The primary metal pattern may be formed in a coil shape on the surface of the first printed circuit board 710.

[0152] A second printed circuit board 720 may be disposed on an upper surface of the first printed circuit board 710. The second printed circuit board 720 may be formed to have a smaller cross-sectional area than the first printed circuit board 710.

[0153] A secondary metal pattern may be wound on a surface of the second printed circuit board 720. The secondary metal pattern may be wound in a coil shape on a surface of the second printed circuit board 720.

[0154] The second printed circuit board 720 may be formed in multiple layers. A plurality of second printed circuit boards 720 may be provided and stacked vertically. More specifically, the second printed circuit board 720 disposed on the first printed circuit board 710 may be realized as two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the second printed circuit boards 720.

[0155] When the second printed circuit board 720 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 720 may be connected to conductors via through holes.

[0156] A third printed circuit board 730 may be disposed on a lower surface of the first printed circuit board 710. The second printed circuit board 730 may be formed to have a smaller cross-sectional area than the first printed circuit board 710.

[0157] A secondary metal pattern may be wound on a surface of the third printed circuit board 730. The secondary metal pattern may be wound in a coil shape on a surface of the second printed circuit board 730.

[0158] The second printed circuit board 730 may be formed in multiple layers. A plurality of second printed circuit boards 730 may be provided and stacked in a vertical direction. More specifically, the third printed circuit board 730 disposed under the first printed circuit board 710 may be realized as two or more boards. In addition, the secondary metal pattern may be disposed on a surface of each of the third printed circuit boards 730.

[0159] When the third printed circuit board 730 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 730 may be connected to conductors via through holes.

[0160] The core 750 may include an upper core and a lower core. The upper core may be disposed on an upper surface of the second printed circuit board 720. The upper core may be disposed on a surface of the second printed circuit board 720 to induce the formation of a magnetic field. The upper core may be coupled to the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0161] The lower core may be disposed on a lower surface of the third printed circuit board 730. The lower core may be disposed on a lower surface of the third printed circuit board 730 to induce the formation of a magnetic field. The lower core may be coupled to the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0162] The upper core and the lower core may be ferrite cores. The upper core and the lower core may each be provided in a plurality and spaced apart from each other. For example, a first upper core 752 and a second upper core 754 may be disposed on an upper surface of the second printed circuit board 720. Also, a first lower core 752 and a second lower core 754 may be disposed on a lower surface of the third printed circuit board 730.

[0163] FIG. 11 is a cross-sectional view of a printed circuit board module according to an eighth embodiment of the present invention.

[0164] Referring to FIG. 11, a printed circuit board module 800 according to an eighth embodiment of the present invention may include a first printed circuit board 810 , a second printed circuit board 820 , a third printed circuit board 830 , an insulating layer 860 and a core 750 .

[0165] The first printed circuit board 810 may be formed in a plate shape. One or more electronic components for driving may be disposed on an upper surface or a lower surface of the first printed circuit board 810. A plurality of electronic components may be provided and disposed spaced apart from each other.

[0166] The first printed circuit board 810 may be a double-sided printed circuit board, with a second printed circuit board 820 and a third printed circuit board 830 disposed on the top and bottom surfaces, respectively.

[0167] A primary metal pattern (not shown) may be wound on an upper or lower surface of the first printed circuit board 810. The primary metal pattern may be formed on the surface of the first printed circuit board 810 in a coil shape.

[0168] A second printed circuit board 820 may be disposed on an upper surface of the first printed circuit board 810. The second printed circuit board 820 may be formed to have a smaller cross-sectional area than the first printed circuit board 810.

[0169] A secondary metal pattern may be wound on a surface of the second printed circuit board 820. The secondary metal pattern may be wound on a surface of the second printed circuit board 820 in a coil shape.

[0170] The second printed circuit board 820 may be formed in multiple layers. A plurality of second printed circuit boards 820 may be provided and stacked vertically. More specifically, the second printed circuit board 820 disposed on the first printed circuit board 810 may be realized as two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the second printed circuit boards 820.

[0171] When the second printed circuit board 820 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 820 may be connected to conductors via through holes.

[0172] A third printed circuit board 830 may be disposed under the first printed circuit board 810. The second printed circuit board 830 may be formed to have a smaller cross-sectional area than the first printed circuit board 810.

[0173] A secondary metal pattern may be wound on a surface of the third printed circuit board 830. The secondary metal pattern may be wound on a surface of the second printed circuit board 830 in a coil shape.

[0174] The second printed circuit board 830 may be formed in multiple layers. A plurality of second printed circuit boards 830 may be provided and stacked in the vertical direction. More specifically, the third printed circuit board 830 disposed on the lower surface of the first printed circuit board 810 may be realized as two or more sheets. In addition, the secondary metal pattern may be disposed on a surface of each of the third printed circuit boards 830.

[0175] When the third printed circuit board 830 is realized in a multi-layer, the metal patterns disposed on the surface of the second printed circuit board 830 may be connected to conductors via through holes.

[0176] The core 750 may include an upper core and a lower core. The upper core may be disposed on an upper surface of the second printed circuit board 820. The upper core may be disposed on a surface of the second printed circuit board 820 to induce the formation of a magnetic field. The upper core may be combined with the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0177] The lower core may be disposed on a lower surface of the third printed circuit board 830. The lower core may be disposed on a lower surface of the third printed circuit board 830 to induce the formation of a magnetic field. The lower core may be coupled to the secondary metal pattern in a form that surrounds the secondary metal pattern from the outside.

[0178] The upper core and the lower core may be ferrite cores. The insulating layer 860 may be disposed between the first printed circuit board 810 and the second printed circuit board 820 or between the first printed circuit board 810 and the third printed circuit board 820. The insulating layer 860 may be formed of an insulating material. For example, the insulating layer 810 may be made of a resin or plastic material. This allows a plurality of printed circuit boards to be insulated from each other.

[0179] Alternatively, the insulating layer 860 may be an air gap separating the first printed circuit board 810 and the second printed circuit board 820 or the first printed circuit board 810 and the third printed circuit board 820 .

[0180] FIG. 12 is a cross-sectional view of a printed circuit board module according to a ninth embodiment of the present invention.

[0181] In this embodiment, the structures and functions of the first printed circuit board, the second printed circuit board, the core and the insulating layer are the same as those of the previous embodiment.

[0182] Referring to FIG. 12, the printed circuit board module 900 of this embodiment may include a first printed circuit board 910, a second printed circuit board 920 arranged on the top of the first printed circuit board 910, an insulating layer 930 arranged between the first printed circuit board 910 and the second printed circuit board 920, and a core 940 arranged on the top surface of the second printed circuit board 920 and the bottom surface of the first printed circuit board 940.

[0183] In this embodiment, the first printed circuit board 910 , the insulating layer 930 and the second printed circuit board 920 may be interconnected via a rivet 950 .

[0184] The first printed circuit board 910, the second printed circuit board 920, and the insulating layer 930 may each have a hole through which the rivet 950 passes. The upper and lower ends of the rivet 950 may each have locking portions 952, 954 having a larger cross-sectional area than other regions so as to be locked to the upper surface of the second printed circuit board 920 and the lower surface of the first printed circuit board 910. With the above structure, the first printed circuit board 910, the second printed circuit board 920, and the insulating layer 930 may be firmly fixed in their combined state.

[0185] The rivets 950 may be provided in a plurality and spaced apart from each other.

[0186] Also, the first printed circuit board 910 and the second printed circuit board 920 may be electrically connected through the rivet 950. In this case, the upper and lower ends of the rivet 950 may be mounted on the lower surface of the first printed circuit board 910 or the upper surface of the second printed circuit board 920, respectively.

[0187] FIG. 13 is a cross-sectional view of a printed circuit board module according to a tenth embodiment of the present invention.

[0188] In this embodiment, the structures and functions of the first printed circuit board, the second printed circuit board, the core and the insulating layer are the same as those of the previous embodiment.

[0189] Referring to FIG. 13, the printed circuit board module 1000 of this embodiment may include a first printed circuit board 1010, a second printed circuit board 1020 arranged on the upper part of the first printed circuit board 1010, an upper core 1050 arranged on the upper part of the second printed circuit board 1020, a lower core 1060 arranged on the lower part of the first printed circuit board 1010, a first insulating layer 1030 arranged between the upper core 1050 and the second printed circuit board 1020, and a second insulating layer 1040 arranged between the first printed circuit board 1010 and the lower core 1060.

[0190] The first insulating layer 1030 may be disposed on an upper surface of the second printed circuit board 1020. The cross-sectional shape of the first insulating layer 1030 may correspond to the cross-sectional shape of the second printed circuit board 1020. The cross-sectional shape of the second insulating layer 1040 may correspond to the cross-sectional shape of the first insulating layer 1030.

[0191] In this embodiment, the first printed circuit board 1010 , the first insulating layer 1030 , the second insulating layer 1040 and the second printed circuit board 1020 may be interconnected via a rivet 1070 .

[0192] The first printed circuit board 1010, the second printed circuit board 1020, the first insulating layer 1030, and the second insulating layer 1040 may each have a hole formed therein so that a rivet 1070 can penetrate therethrough. The upper and lower ends of the rivet 1070 may each have engagement portions 1072 and 1074 having a larger cross-sectional area than other regions so as to be engaged with the upper surface of the first insulating layer 1030 and the lower surface of the second insulating layer 1040, respectively.

[0193] FIG. 14 is a cross-sectional view of a printed circuit board module according to an eleventh embodiment of the present invention.

[0194] In this embodiment, the structures and functions of the first printed circuit board, the second printed circuit board, the core and the insulating layer are the same as those of the previous embodiment.

[0195] Referring to FIG. 14, the printed circuit board module 1100 of this embodiment may include a first printed circuit board 1110, a second printed circuit board 1120 arranged on the upper part of the first printed circuit board 1120, an upper core 1160 arranged on the upper part of the second printed circuit board 1120, a lower core 1170 arranged on the lower part of the first printed circuit board 1110, a first insulating layer 1130 arranged between the first printed circuit board 1110 and the second printed circuit board 1120, a second insulating layer 1140 arranged between the upper core 1160 and the second printed circuit board 1120, and a third insulating layer 1150 arranged between the first printed circuit board 1110 and the lower core 1170.

[0196] The first insulating layer 1130 may be disposed on an upper surface of the first printed circuit board 1110. The cross-sectional shape of the first insulating layer 1130 may correspond to the cross-sectional shape of the second printed circuit board 1120.

[0197] The second insulating layer 1140 may be disposed on an upper surface of the second printed circuit board 1120. The cross-sectional shape of the second insulating layer 1140 may correspond to the cross-sectional shape of the first insulating layer 1130.

[0198] The third insulating layer 1150 may be disposed on a lower surface of the first printed circuit board 1110. The cross-sectional shape of the third insulating layer 1150 may correspond to the cross-sectional shape of the first insulating layer 1130 or the second insulating layer 1140.

[0199] In this embodiment, the first printed circuit board 1110 , the first insulating layer 1130 , the second insulating layer 1040 , the third insulating layer 1150 and the second printed circuit board 1120 may be interconnected via a rivet 1180 .

[0200] The first printed circuit board 1110, the first insulating layer 1130, the second insulating layer 1040, the third insulating layer 1150 and the second printed circuit board 1120 may each have a hole formed therethrough for a rivet 1180 to pass therethrough. The upper and lower ends of the rivet 1180 may have engagement portions 1182 and 1184 having a larger cross-sectional area than other regions so as to be engaged with the upper surface of the second insulating layer 1140 and the lower surface of the third insulating layer 1150, respectively.

[0201] FIG. 15 is a cross-sectional view of a printed circuit board module according to a twelfth embodiment of the present invention.

[0202] In this embodiment, the configurations and functions of the first printed circuit board and the second printed circuit board are the same as those of the previous embodiment.

[0203] The printed circuit board module 1300 of this embodiment may include a first printed circuit board 1310, a second printed circuit board 1320 arranged on an upper surface of the first printed circuit board 1310, an upper core 1330 arranged on the upper surface of the second printed circuit board 1320, and a lower core 1340 arranged on a lower surface of the first printed circuit board 1310.

[0204] The first printed circuit board 1310 and the second printed circuit board 1320 may be riveted together via a rivet 1350 .

[0205] In this embodiment, at least one electronic component 1322 for driving may be disposed on the second printed circuit board 1320. The electronic component 1322 may be disposed on an end region of the outer surface of the second printed circuit board 1320 separated from the metal pattern.

[0206] FIG. 16 is a cross-sectional view of a printed circuit board module according to a thirteenth embodiment of the present invention.

[0207] In this embodiment, the configurations and functions of the first printed circuit board and the second printed circuit board are the same as those of the previous embodiment.

[0208] The printed circuit board module 1400 of this embodiment may include a first printed circuit board 1410, a second printed circuit board 1420 arranged on the top of the first printed circuit board 1410, an upper core 1430 arranged on the upper surface of the second printed circuit board 1420, and a lower core 1440 arranged on the lower surface of the first printed circuit board 1410.

[0209] In addition, the printed circuit board module 1400 of this embodiment may include an insulating layer 1430 disposed between the first printed circuit board 1410 and the second printed circuit board 1420 to insulate the first printed circuit board 1410 and the second printed circuit board 1420 from each other.

[0210] The first printed circuit board 1410 , the second printed circuit board 1420 and the insulating layer 1430 may be riveted together via a rivet 1460 .

[0211] In this embodiment, at least one electronic component 1422 for driving may be disposed on the second printed circuit board 1420. The electronic component 1422 may be disposed on an end region of the outer surface of the second printed circuit board 1420 separated from the metal pattern.

[0212] FIG. 17 is a cross-sectional view of a printed circuit board module according to a fourteenth embodiment of the present invention.

[0213] In this embodiment, the configurations and functions of the first printed circuit board and the second printed circuit board are the same as those of the previous embodiment.

[0214] The printed circuit board 1500 according to this embodiment may include a first printed circuit board 1510 and a second printed circuit board 1520 disposed on an upper surface of the first printed circuit board 1510. An upper core 1530 and a lower core 1540 may be disposed on an upper surface of the second printed circuit board 1520 and a lower surface of the first printed circuit board 1510, respectively.

[0215] The first printed circuit board 1510 may be a double-sided printed circuit board, and a first electronic component 1512 and a second electronic component 1514 may be disposed on the upper and lower surfaces of the first printed circuit board 1510, respectively.

[0216] The printed circuit board module 1500 according to this embodiment can be disposed within a housing.

[0217] An inner surface of the housing may be formed with a protrusion 1620 for supporting at least a portion of a lower surface of the first printed circuit board 1510. The protrusion 1620 may be disposed to protrude inward from other regions of the inner surface of the housing. In one example, an upper surface of the protrusion 1620 may support a lower surface of the first printed circuit board 1510. An upper surface of the protrusion 1620 may contact a lower surface of the first printed circuit board 1510.

[0218] Also, a heat dissipation pad 1610 may be disposed between the inner surface of the housing and the first electronic component 1512 or between the inner surface of the housing and the second electronic component 1514. One side of the heat dissipation pad 1610 contacts the first electronic component 1512 or the second electronic component 1514 and the other side contacts the inner surface of the housing, so that the heat generated from the first electronic component 1512 or the second electronic component 1514 can be transferred to the housing.

[0219] The first printed circuit board 1510 and the second printed circuit board 1520 may be connected to each other through a rivet. The first printed circuit board 1510 and the housing may be connected to each other through a rivet. In this case, the rivet may be disposed so that at least a portion thereof penetrates the first printed circuit board 1510, and at least another portion thereof may penetrate the housing and protrude to the outside.

[0220] FIG. 18 is a cross-sectional view of a printed circuit board module according to a fifteenth embodiment of the present invention.

[0221] In this embodiment, the configurations and functions of the first printed circuit board, the second printed circuit board, the upper core and the lower core are the same as those of the previous embodiment.

[0222] Referring to FIG. 18, a printed circuit board module 1700 of this embodiment may include a first printed circuit board 1710, a second printed circuit board 1720 on which the first printed circuit board 1710 is arranged, a lower core 1740 arranged on the lower surface of the first printed circuit board 1710, and an upper core 1730 arranged on the upper surface of the second printed circuit board 1730.

[0223] The first printed circuit board 1710 and the second printed circuit board 1720 may be interconnected via a rivet 1750. The first printed circuit board 1710 and the second printed circuit board 1720 may have holes formed therein through which the rivets 1750 may pass.

[0224] The rivets 1750 may be provided in a plurality and spaced apart from one another, in one example, four rivets 1750 may be provided and spaced apart from one another.

[0225] As the number of rivets 1750 increases, heat generated in the first printed circuit board 1710 and the second printed circuit board 1720 can be easily dissipated to the outside.

[0226] Although all components constituting the embodiments of the present invention have been described as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. In other words, all components may be selectively combined and operated in combination within the scope of the present invention. In addition, the terms 'comprise', 'comprise', 'have', etc. described above mean that the relevant components may be present, unless otherwise specified to the contrary, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical and scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless otherwise defined. Terms commonly used, such as predefined terms, should be interpreted as being consistent with the contextual meaning of the relevant art, and should not be interpreted as being ideal or overly formal unless expressly defined in the present invention.

[0227] The above description is merely illustrative of the technical idea of ​​the present invention, and various modifications and distortions may be made by those skilled in the art to which the present invention pertains, without departing from the essential characteristics of the present invention. Therefore, the embodiments set forth in the present invention are for illustrative purposes only and are not intended to limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by such embodiments. The scope of protection of the present invention should be interpreted according to the claims below, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

Claims

1. A first printed circuit board; a second printed circuit board disposed on one side of the first printed circuit board; a third printed circuit board disposed on the other side of the first printed circuit board; a core passing through the first printed circuit board to the third printed circuit board; the second printed circuit board includes a first coil; the third printed circuit board includes a second coil; an area of ​​a surface of the second printed circuit board facing the first printed circuit board is smaller than an area of ​​a surface of the first printed circuit board facing the second printed circuit board, and an area of ​​a surface of the third printed circuit board facing the first printed circuit board is smaller than an area of ​​a surface of the first printed circuit board facing the third printed circuit board; the first printed circuit board includes a first hole and a second hole into which the core is inserted, the second printed circuit board and the third printed circuit board are disposed between the first hole and the second hole, the first printed circuit board, the second printed circuit board, and the third printed circuit board each include a hole; a rivet passing through said hole; the first printed circuit board, the second printed circuit board, and the third printed circuit board are electrically connected to each other via the rivet; The upper and lower ends of the rivet are provided with locking portions for locking the upper surface of the second printed circuit board and the lower surface of the third printed circuit board. Printed circuit board module.

2. 2. The printed circuit board module of claim 1, wherein a surface of said second printed circuit board facing said first printed circuit board and a surface of said third printed circuit board facing said first printed circuit board have the same area.

3. the first coil includes a plurality of first metal patterns; 3. The printed circuit board module of claim 1, wherein the second coil comprises a plurality of second metal patterns.

4. The core includes a first core and a second core, The first core passes through the first printed circuit board, 4. The printed circuit board module of claim 1, wherein the second core penetrates the second printed circuit board.

5. The printed circuit board module of claim 4 , wherein the first cores and the second cores are each arranged in a plurality of pieces.

6. 6. The printed circuit board module of claim 1, further comprising an insulating layer between the first and second printed circuit boards or between the first and third printed circuit boards.

7. The printed circuit board module of claim 6 , wherein the insulating layer includes an air gap.

8. The first core is in contact with the top and side surfaces of the second printed circuit board, The printed circuit board module of claim 4 , wherein the second core contacts a bottom surface and a side surface of the third printed circuit board.

9. a first printed circuit board having a first opening; a second printed circuit board disposed on one side of the first printed circuit board, the second printed circuit board having a second opening; a third printed circuit board disposed on the other side of the first printed circuit board, the third printed circuit board having a third opening; a core extending at least partially through the second opening and the third opening; the second printed circuit board and the third printed circuit board each include a coil; the second printed circuit board, the third printed circuit board, and the core each have a rectangular shape when viewed in a plane, a length of a long side of the rectangle of the core is longer than a length of at least one side of the rectangle of the second printed circuit board or the third printed circuit board; the first printed circuit board, the second printed circuit board, and the third printed circuit board each include a hole; a rivet passing through said hole; the first printed circuit board, the second printed circuit board, and the third printed circuit board are electrically connected to each other via the rivet; The upper and lower ends of the rivet are provided with locking portions for locking the upper surface of the second printed circuit board and the lower surface of the third printed circuit board. Printed circuit board module.

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