FLEXIBLE COMPONENTS FOR SEMICONDUCTOR PROCESSING SYSTEMS - Patent application

Abstract

An exemplary substrate processing system may include a chamber body defining a transfer region. The system may include a first lid plate mounted on the chamber body along a first surface of the first lid plate. The first lid plate may define a plurality of openings therethrough. The system may include a plurality of lid stacks equal to the number of openings in the plurality of openings. The plurality of lid stacks may at least partially define a plurality of processing regions vertically offset from the transfer region. The system may include a second lid plate coupled to the plurality of lid stacks. The plurality of lid stacks may be disposed between the first and second lid plates. Components of each lid stack of the plurality of lid stacks may be coupled to the second lid plate.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of and priority to U.S. patent application Ser. No. 16 / 856,262, entitled "Compliance Components for Semiconductor Processing SYSTEM," filed April 23, 2020, the entire contents of which are incorporated by reference herein.

[0002]

[0002] The present technology relates to semiconductor processing equipment. [Background technology]

[0003]

[0003] Semiconductor processing systems often utilize cluster tools to integrate several process chambers. This configuration may facilitate the execution of several consecutive processing operations without removing the substrate from the controlled processing environment, or allow the same process to be performed on multiple substrates at once in different chambers. These chambers may include, for example, degassing chambers, pre-treatment chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etch chambers, metrology chambers, and other chambers. The combination of chambers in the cluster tool, as well as the operating conditions and parameters under which these chambers are run, are selected to produce a particular structure using a particular process recipe and process flow.

[0004]

[0004] Some processing systems may include multiple process and transfer regions connected to each other. The process regions may have individual stack components that may all be machined prior to manufacturing the system. Machine tolerances may affect the bonding of components when vacuum is pulled on the system, resulting in leakage in some scenarios.

[0005]

[0005] Thus, there is a need for improved systems and components that can be used to create sealed regions in semiconductor processing chambers and systems. These and other needs are addressed by the present technique. Summary of the Invention

[0006]

[0006] An exemplary substrate processing system may include a chamber body defining a transfer region. The system may include a first lid plate mounted on the chamber body along a first surface of the first lid plate. The first lid plate may define a plurality of openings through the first lid plate. The system may include a plurality of lid stacks equal to a number of openings of the plurality of openings. The plurality of lid stacks may at least partially define a plurality of processing regions vertically offset from the transfer region. The system may include a second lid plate coupled to the plurality of lid stacks. The plurality of lid stacks may be disposed between the first lid plate and the second lid plate. A component of each lid stack of the plurality of lid stacks may be coupled to the second lid plate.

[0007]

[0007] In some embodiments, the system may include a plurality of substrate supports disposed about a transfer region. Each substrate support of the plurality of substrate supports may be translatable vertically along a central axis of the substrate support between a first position and a second position. The first lid plate may further define a recessed ledge around each opening of the plurality of openings in a second surface of the first lid plate opposite the first surface of the first lid plate. Each lid stack of the plurality of lid stacks may be mounted on the first lid plate to contact a respective recessed ledge defined in the second surface of the first lid plate. The transfer region may include a transfer device rotatable about a central axis and configured to engage a substrate and transfer the substrate between the plurality of substrate supports in the transfer region. The second lid plate may define a plurality of openings through the second lid plate. Each opening of the plurality of openings may access a lid stack of the plurality of lid stacks. The substrate processing system may also include a plurality of output manifolds. Each output manifold of the plurality of output manifolds is disposed within a respective one of a plurality of openings defined through the second lid plate.

[0008]

[0008] Each lid stack component of the plurality of lid stacks coupled to the second lid plate may be characterized by a first surface facing the second lid plate and a second surface opposite the first surface. The system may include a first O-ring disposed on the first surface of each lid stack component of the plurality of lid stacks coupled to the second lid plate. Each first O-ring may engage a corresponding output manifold. Each lid stack component of the plurality of lid stacks may be coupled to the second lid plate at multiple locations using multiple engagement devices. Each engagement device may include a bolt extending through each lid stack component and engaging the second lid plate. The device may include a washer seated on the bolt and a spring engaging the washer at a first end of the spring and engaging the each lid stack component at a second end opposite the first end of the spring. Each engagement device may include a clip extending around the bolt. The clip may be sized to seat the washer along a first surface of the washer when the bolt is disengaged from the second lid plate. A gap may be maintained between the clip and the washer when the bolt is engaged to the second lid plate. The clip of each engagement device may be a first clip, and each engagement device may also include a second clip extending around the bolt. Each second clip may be sized to seat on the washer along a second surface of the washer when the bolt is disengaged from the second lid plate.

[0009]

[0009] Some embodiments of the present technology may include a substrate processing system. The system may include a chamber body defining a transfer region. The system may include a first lid plate mounted on the chamber body along a first surface of the first lid plate. The first lid plate may define a plurality of openings through the first lid plate. The system may include a plurality of lid stacks equal to a number of openings of the plurality of openings. The plurality of lid stacks may at least partially define a plurality of processing regions vertically offset from the transfer region. Each lid stack of the plurality of lid stacks may include a gas box. The system may include a second lid plate coupled to the plurality of lid stacks. The plurality of lid stacks may be disposed between the first lid plate and the second lid plate. The gas box of each lid stack of the plurality of lid stacks may be coupled to the second lid plate by a plurality of engagement devices. Each engagement device may include a spring that compressively engages the gas box to the second lid plate.

[0010] In some embodiments, each engagement device may include a shoulder bolt extending through the gas box and engaging the second lid plate. A shank of the shoulder bolt may seat on the second lid plate when the shoulder bolt is fully engaged with the second lid plate. Each engagement device may include a washer seated on the shoulder bolt at a head of the shoulder bolt around the shank. Each engagement device may include a spring that engages the washer at a first end of the spring and engages the gas box at a second end of the spring opposite the first end of the spring. Each engagement device may include a clip disposed within the gas box around the shoulder bolt. The clip may be sized to seat the washer along a first surface of the washer when the shoulder bolt is disengaged from the second lid plate. A gap may be maintained between the clip and the washer when the shank of the shoulder bolt seats on the second lid plate. The system may include a transfer device disposed in the transfer region and rotatable about a central axis. The transfer device may be configured to engage a substrate and transfer the substrate between a plurality of substrate supports in the transfer region. The second lid plate may define a plurality of openings through the second lid plate. Each opening of the plurality of openings may access a lid stack of the plurality of lid stacks. The substrate processing system may include a plurality of output manifolds. Each output manifold of the plurality of output manifolds is disposed within a respective opening of the plurality of openings defined through the second lid plate. The system may include a remote plasma unit mounted on the second lid plate, the remote plasma unit fluidly coupled to each output manifold of the plurality of output manifolds.

[0011]

[0011] Some embodiments of the present technology may include a gas box assembly. The assembly may include a gas box characterized by a first surface and a second surface opposite the first surface. A recess may be defined in the gas box from the second surface and an opening may be defined through the first surface, the opening accessing the recess. The assembly may include a first clip seated in the gas box within the recess. The assembly may include a bolt disposed in the recess, the bolt extending through an opening defined in the first surface of the gas box. The assembly may include a washer extending around the bolt, the washer being disposed between the first clip and the first surface of the gas box. The assembly may include a second clip extending around the bolt, the second clip being disposed between the washer and the first surface of the gas box. The assembly may include a spring disposed within the recess, the spring engaging the washer at a first end of the spring and engaging the gas box at a second end of the spring opposite the first end of the spring.

[0012]

[0012] Such techniques may provide numerous advantages over conventional systems and techniques. For example, the engagement device may facilitate the creation of sufficient compression for a sealing gasket used in the system. Additionally, the engagement device may balance gap formation on multiple sides of the chamber components to ensure proper sealing during processing. These and other embodiments, along with their many advantages and features, are described in more detail in the following description and accompanying drawings.

[0013]

[0013] A further understanding of the nature and advantages of the disclosed technology may be realized by reference to the remaining portions of the specification and the drawings. [Brief description of the drawings]

[0014] [Figure 1A]

[0014] A schematic top view of an exemplary processing tool according to some embodiments of the present technique is shown. [Figure 1B]

[0015] 1 shows a schematic partial cross-sectional view of an exemplary processing system in accordance with some embodiments of the present technique. [Diagram 2]

[0016] 1 depicts a schematic isometric view of a transfer section of an exemplary substrate processing system, in accordance with some embodiments of the present technique; [Diagram 3]

[0017] 1 shows a schematic partial cross-sectional view of an exemplary system layout of an exemplary substrate processing system, in accordance with some embodiments of the present technique; [Figure 4]

[0018] 1 shows a schematic cross-sectional view of an exemplary system layout of an exemplary substrate processing system, in accordance with some embodiments of the present technique; [Diagram 5]

[0019] 1 shows a schematic bottom view of a lid stack component of an exemplary substrate processing system, in accordance with some embodiments of the present technique; [Figure 6]

[0020] 1A-1D show schematic cross-sectional partial views of component assemblies according to some embodiments of the present technology; [Figure 7]

[0021] 1A-1D show schematic cross-sectional partial views of component assemblies according to some embodiments of the present technology; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015]

[0022] Some of the drawings are included as schematic diagrams. It is understood that the drawings are for illustrative purposes and should not be considered to be to scale or proportion unless specifically stated. Furthermore, as schematic diagrams, the drawings are provided to aid in understanding and may not include all aspects or information compared to realistic depictions and may include material that is emphasized for illustrative purposes.

[0016]

[0023] In the accompanying drawings, similar components and / or features may have the same reference numerals. Furthermore, various components of the same type may be distinguished according to the reference numerals, with a letter distinguishing between the similar components. If only a first reference numeral is used in this specification, the description is applicable to any of the similar components having the same first reference numeral, regardless of the letter.

[0017]

[0024] Substrate processing may include time-consuming operations to add, remove, or otherwise modify material on a wafer or semiconductor substrate. Efficient movement of substrates may reduce queue times and improve substrate throughput. To increase the number of substrates processed in the cluster tool, additional chambers may be incorporated on the mainframe. Although transfer robots and processing chambers can be continually added by lengthening the tool, this may become spatially inefficient as the footprint of the cluster tool expands. Thus, the present technology may include cluster tools with an increased number of processing chambers within a defined footprint. To accommodate the limited footprint around the transfer robot, the technology may increase the number of processing chambers laterally outward from the robot. For example, some conventional cluster tools may include one or two processing chambers arranged around a section of the transfer robot located in the center to maximize the number of chambers radially around the robot. The present technology may extend this concept by incorporating additional chambers laterally outward as another row or group of chambers. For example, the techniques may be applied to a cluster tool that includes three, four, five, six, or more processing chambers accessible at each of one or more robot access locations.

[0018]

[0025] As additional process locations are added, accessing these locations from a central robot may no longer be feasible without additional transfer capabilities at each location. Conventional techniques may include a wafer carrier on which the substrate remains seated during the transition. However, the wafer carrier may contribute to thermal non-uniformities and particle contamination on the substrate. The present technique overcomes these problems by incorporating a transfer section vertically aligned with the processing chamber region and a carousel or transfer device that may operate in cooperation with the central robot to access the additional wafer locations. The substrate support may then translate vertically between the transfer region and the processing region to deliver the substrate for processing.

[0019]

[0026] Each individual processing location may include a separate lid stack to provide improved, more uniform delivery of processing precursors to the separate processing regions. Although each lid stack may include substantially identical components, machining and manufacturing tolerances may result in differences in component flatness, thickness, or other component properties. Some of these tolerance non-uniformities can be accommodated by gaskets or O-rings placed between each lid stack component, but certain scenarios may produce one or more lid stack sets that have height differences from others that cannot be accommodated by O-rings. The present technology overcomes these issues by incorporating one or more engagement devices that control the gap distance between the components of the system while ensuring flexibility with the properties of the O-rings and component construction.

[0020]

[0027] While the remaining disclosure will routinely identify specific structures, such as a four-position transfer region, in which the present structures and methods may be employed, it will be readily understood that the engagement devices or components may equally be employed in any number of other systems or chambers, as well as any other devices in which multiple components may be joined or coupled. Thus, the present technology should not be considered limited to use with any particular chamber alone. Additionally, to provide a foundation for the present technology, an exemplary tool system will be described, but it should be understood that the present technology may be incorporated into any number of semiconductor processing chambers and tools that may benefit from some or all of the operations and systems described.

[0021]

[0028] 1A shows a top view of one embodiment of a deposition, etch, bake, and cure chamber substrate processing tool or processing system 100 in accordance with some embodiments of the present technique. In the figure, a set of front-opening unified pods 102 deliver substrates of various sizes that are received in a factory interface 103 by robotic arms 104a and 104b and placed in a load lock or low pressure holding area 106. The substrates are then delivered to one of the substrate processing regions 108 and placed in a chamber system or quad section 109a-c. The chamber systems or quad sections 109a-c may each be a substrate processing system having a transfer region fluidly coupled to multiple processing regions 108. Although a quad system is illustrated, it should be understood that standalone chambers, twin chambers, and platforms incorporating other multiple chamber systems are equally encompassed by the present technique. A second robot arm 110 housed in a transfer chamber 112 may be used to transfer substrate wafers from the holding area 106 to the quad section 109 and vice versa. The second robot arm 110 may be housed in a transfer chamber to which each of the quad sections or processing systems may be connected. Each substrate processing region 108 may be provided to perform a number of substrate processing operations, including any number of deposition processes, including cyclical layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition, as well as etching, pre-cleaning, annealing, plasma treatment, degassing, orientation, and other substrate processes.

[0022]

[0029] Each quad section 109 may include a transfer region that may receive substrates from and deliver substrates to the second robot arm 110. The transfer region of the chamber system may be aligned with a transfer chamber having the second robot arm 110. In some embodiments, the transfer region may be laterally accessible to a robot. In a subsequent operation, components of the transfer section may translate the substrate vertically into the overlapping processing regions 108. Similarly, the transfer region may also be operable to rotate the substrate between positions within each transfer region. The substrate processing regions 108 may include any number of system components for depositing, annealing, curing, and / or etching a material film on a substrate or wafer. In one configuration, two sets of processing regions, such as those in quad sections 109a and 109b, may be used to deposit material on a substrate, and a third set of processing chambers, such as those in quad section 109c, may be used to cure, anneal, or treat the deposited film. In another configuration, all three sets of chambers, such as all twelve chambers shown, may be configured to deposit and / or cure a film on a substrate.

[0023]

[0030] As shown in the drawings, the second robot arm 110 may include two arms for simultaneously delivering and / or retrieving multiple substrates. For example, each quad section 109 may include two accesses 107 along a surface of the transfer region housing, which may be aligned laterally with the second robot arm. The accesses may be defined along a surface adjacent to the transfer chamber 112. In some embodiments, as shown, the first access may be aligned with a first substrate support of the multiple substrate supports of the quad section. Additionally, the second access may be aligned with a second substrate support of the multiple substrate supports of the quad section. In some embodiments, the first substrate support may be adjacent to the second substrate support, and the two substrate supports may define a first row of substrate supports. As shown in the illustrated configuration, the second row of substrate supports may be located laterally outward from the transfer chamber 112 and aft of the first row of substrate supports. The two arms of the second robot arm 110 may be spaced apart to allow the two arms to simultaneously enter a quad section or chamber system to deliver or retrieve one or two substrates to a substrate support in the transfer region.

[0024]

[0031] Any one or more of the transfer regions described may be incorporated into additional chambers separate from the fabrication system illustrated in various embodiments. It should be understood that additional configurations of deposition, etching, annealing, and curing chambers for material films are contemplated by the processing system 100. Additionally, any number of other processing systems may be utilized with the present techniques, which may incorporate a transfer system for performing any of the specific operations, such as substrate transfer. In some embodiments, a processing system may provide access to multiple processing chamber regions while maintaining reduced pressure environments in various sections, such as the holding and transfer areas described above, allowing operations to be performed in multiple chambers while maintaining a specific reduced pressure environment between discrete processes.

[0025]

[0032] FIG. 1B shows a schematic cross-sectional elevation view of one embodiment of an exemplary processing tool, such as through a chamber system, according to some embodiments of the present technique. FIG. 1B may show a cross-sectional view through any two adjacent processing regions 108 in any quad section 109. The elevation view may show the configuration or fluid coupling of one or more processing regions 108 and a transfer region 120. For example, a continuous transfer region 120 may be defined by a transfer region housing 125. The housing may define an open interior space in which several substrate supports 130 may be disposed. For example, as shown in FIG. 1A, an exemplary processing system may include a plurality of substrate supports 130, four or more, distributed within the housing around the transfer region. The substrate supports may be pedestals as shown, although several other configurations may be used. In some embodiments, the pedestal may be vertically translatable between the transfer region 120 and a processing region overlapping the transfer region. The substrate support may be vertically translatable along a central axis of the substrate support along a path between a first position and a second position within the chamber system. Thus, in some embodiments, each substrate support 130 may be axially aligned with an overlapping processing region 108 defined by one or more chamber components.

[0026]

[0033] The open transfer region may provide a transfer device 135, such as a carousel, with the ability to engage and move a substrate, including rotating it between various substrate supports. The transfer device 135 may be rotatable about a central axis. This allows the substrate to be positioned for processing in any of the processing regions 108 in the processing system. The transfer device 135 may include one or more end effectors that may engage the substrate from above, below, or at the outer edge of the substrate to move it around the substrate support. The transfer device may receive a substrate from a transfer chamber robot, such as the robot 110 described above. The transfer device may then rotate the substrate to an alternate substrate support to facilitate delivery of an additional substrate.

[0027]

[0034] Once positioned and awaiting processing, the transfer device may position an end effector or arm between the substrate supports. This allows the substrate support to be lifted past the transfer device 135 and deliver the substrate into the processing region 108. The processing region 108 may be vertically offset from the transfer region. For example, as shown, the substrate support 130b may deliver the substrate into the processing region 108b, while the substrate support 130a may deliver the substrate into the processing region 108a. This may be done with the other two substrate supports and processing regions, as well as additional substrate supports and processing regions in embodiments where additional processing regions are included. In this configuration, when the substrate support is operably engaged to process the substrate, such as in the second position, it may at least partially define the processing region 108 from below, and the processing region may be axially aligned with the associated substrate support. The processing region may be defined from above by the face plate 140, as well as other lid stack components. In some embodiments, each processing region may have an individual lid stack component, while in some embodiments, multiple components may house multiple processing regions 108. Based on this configuration, in some embodiments, each processing region 108 may be fluidly coupled to the transfer region while being fluidly isolated from above from each other processing region within the chamber system or quad section.

[0028]

[0035] In some embodiments, the face plate 140 may act as an electrode of the system for generating a local plasma in the processing region 108. As shown, each processing region may utilize or incorporate a separate face plate. For example, face plate 140a may be included to define processing region 108a from above, and face plate 140b may be included to define processing region 108b from above. In some embodiments, the substrate support may act as a companion electrode for generating a capacitively coupled plasma between the face plate and the substrate support. The pumping liner 145 may at least partially define the processing region 108 radially or laterally, depending on the spatial geometry. Again, a separate pumping liner may be utilized for each processing region. For example, pumping liner 145a may at least partially define processing region 108a radially, and pumping liner 145b may at least partially define processing region 108b radially. A blocker plate 150 may be disposed between the lid 155 and the face plate 140 in some embodiments, and again, a separate blocker plate may be included to facilitate fluid distribution within each processing region. For example, blocker plate 150a may be included for distribution directed toward processing region 108a, and blocker plate 150b may be included for distribution directed toward processing region 108b.

[0029]

[0036] The lid 155 may be a separate component for each processing region or may include one or more common features. The lid 155 may be one of two separate lid plates of the system in some embodiments. For example, a first lid plate 158 may be placed on top of the transfer region housing 125. The transfer region housing may define an open space and the first lid plate 158 may include several openings that separate the overlapping space into specific processing regions via the lid plate. In some embodiments as shown, the lid 155 may be a second lid plate and may be a single component that defines multiple openings 160 for fluid supply to the individual processing regions. For example, the lid 155 may define a first opening 160a for fluid supply to processing region 108a and the lid 155 may define a second opening 160b for fluid supply to processing region 108b. Additional openings may be defined for additional processing regions within each section, if included. In some embodiments, each quad section 109 or section of multiple processing regions that may receive more or less than four substrates may include one or more remote plasma units 165 for delivering plasma effluents into the processing chambers. In some embodiments, individual plasma units may be incorporated for each chamber processing region, while in some embodiments, fewer remote plasma units may be used. For example, as shown, a single remote plasma unit 165 may be used for multiple chambers, such as two, three, four, or more, up to all the chambers for a particular quad section. Piping may extend from the remote plasma unit 165 to each opening 160 for delivery of plasma effluents for processing or cleaning in embodiments of the present technique.

[0030]

[0037] In some embodiments, a purge channel 170 may extend through the transfer region housing proximate or near each substrate support 130. For example, multiple purge channels may extend through the transfer region housing to provide fluid access for a fluidly coupled purge gas to be provided into the transfer region. The number of purge channels may be the same or different (including more or less) than the number of substrate supports in the processing system. For example, the purge channel 170 may extend through the transfer region housing below each substrate support. Two substrate supports 130 are illustrated, where a first purge gas channel 170a may extend through the housing proximate to the substrate support 130a and a second purge gas channel 170b may extend through the housing proximate to the substrate support 130b. It should be understood that any additional substrate supports may similarly have plumbed purge channels extending through the transfer region housing to provide purge gas into the transfer region.

[0031]

[0038] When a purge gas is delivered through one or more of the purge channels, the purge gas may be exhausted through the pumping liner 145 as well. The pumping liner 145 may provide an exhaust path from the processing system. As a result, in some embodiments, both the process precursors and the purge gas may be exhausted through the pumping liner. The purge gas may flow upward to an associated pumping liner, for example, purge gas flowed through purge channel 170b may be exhausted from the processing system from pumping liner 145b.

[0032]

[0039] As described above, the processing system 100, more specifically a quad section or chamber system incorporated in the processing system 100 or other processing systems, may include a transfer section disposed below the illustrated processing chamber region. FIG. 2 shows a schematic isometric view of the transfer section of an exemplary chamber system 200 according to some embodiments of the present technique. FIG. 2 may show further aspects or variations of aspects of the transfer region 120 described above, which may include any of the components or features described above. The illustrated system may include a transfer region housing 205 that defines a transfer region in which some components may be included. The transfer region may further be at least partially defined from above by a processing chamber or processing region fluidly coupled to the transfer region, such as the processing chamber region 108 shown in the quad section 109 of FIG. 1A. A sidewall of the transfer region housing may define one or more access locations 207. As described above, substrates may be delivered and retrieved through the one or more access locations 207, such as by the second robot arm 110. The access locations 207 may be slit valves or other sealable access locations, which in some embodiments include doors or other sealing mechanisms to provide an airtight environment within the transport region housing 205. Although illustrated as having two such access locations 207, it should be understood that in some embodiments only a single access location 207 may be included, as well as multiple access locations on multiple sides of the transport region housing. It should also be understood that the illustrated transport section may be sized to accommodate any substrate size, including 200 mm, 300 mm, 450 mm, or larger or smaller substrates, including substrates characterized by any number of dimensions or shapes.

[0033]

[0040] Within the transfer region housing 205, there may be multiple substrate supports 210 arranged around the volume of the transfer region. Although four substrate supports are shown, it should be understood that any number of substrate supports are similarly encompassed by embodiments of the present technology. For example, according to embodiments of the present technology, three or more, four or more, five or more, six or more, eight or more, or more substrate supports 210 may be housed within the transfer region. The second robot arm 110 may deliver substrates to one or both of the substrate supports 210a or 210b through the access 207. Similarly, the second robot arm 110 may retrieve substrates from these locations. Lift pins 212 may protrude from the substrate support 210 to allow the robot to access underneath the substrate. In some embodiments, the lift pins may be fixed on the substrate support, or the substrate support may retract downward, or the lift pins may further rise or fall through the substrate support. The substrate support 210 may be vertically translatable and, in some embodiments, may extend to a processing chamber region of the substrate processing system, such as processing chamber region 108 , disposed above the transfer region housing 205 .

[0034]

[0041] The transfer region housing 205 may provide access 215 for an alignment system. This may include an aligner, which may extend through an opening in the transfer region housing as shown, and may work in conjunction with a laser, camera, or monitoring device projecting or transmitting through an adjacent opening to determine whether the translating substrate is properly aligned. The transfer region housing 205 may also include a transfer device 220, which may be operated in several ways to position and move the substrate between the various substrate supports. In one embodiment, the transfer device 220 may move the substrate on the substrate supports 210a and 210b to the substrate supports 210c and 210d. This may allow additional substrates to be delivered into the transfer chamber. Further transfer operations may include rotating the substrate between the substrate supports for further processing in the overlapping processing regions.

[0035]

[0042] The transfer apparatus 220 may include a central hub 225 that may include one or more shafts extending into the transfer chamber. An end effector 235 may be coupled to the shaft. The end effector 235 may include multiple arms 237 extending radially or laterally outward from the central hub. Although the arms are shown having a central body extending therefrom, in various embodiments, the end effector may further include separate arms each coupled to a shaft or central hub. Any number of arms may be included in embodiments of the present technology. In some embodiments, the number of arms 237 may be similar to or equal to the number of substrate supports 210 included in the chamber. Thus, as shown, for four substrate supports, the transfer apparatus 220 may include four arms extending from the end effector. The arms may be characterized by any number of shapes and profiles, such as linear or arcuate profiles, as well as any number of distal profiles including hooks, rings, forks, or other designs for supporting and / or providing access to the substrate, such as for alignment or engagement.

[0036]

[0043] The end effector 235 or components or portions of the end effector may be used to contact the substrate during transfer or movement. These components as well as the end effector may be made of or include a number of materials, including conductive and / or insulating materials. The materials may be coated or plated in some embodiments to withstand contact with precursors or other chemicals that may be transferred into the transfer chamber from overlapping processing chambers.

[0037]

[0044] Additionally, materials may be provided or selected to withstand other environmental characteristics such as temperature. In some embodiments, the substrate support may be operable to heat a substrate disposed thereon. The substrate support may be configured to raise the temperature of the surface or substrate to temperatures of about 100° C. or higher, about 200° C. or higher, about 300° C. or higher, about 400° C. or higher, about 500° C. or higher, about 600° C. or higher, about 700° C. or higher, about 800° C. or higher, or higher. Any of these temperatures may be maintained during operation, and thus components of the transfer apparatus 220 may be exposed to any of these recited or included temperatures. As a result, in some embodiments, any of the materials may be selected to accommodate these temperature regimes, and may include materials such as ceramics and metals, which may be characterized by relatively low coefficients of thermal expansion or other beneficial properties.

[0038]

[0045] The component joints may also be adapted for operation in high temperature and / or corrosive environments. For example, if the end effector and end are each ceramic, the joints may include press joints, snap joints, or other joints that may not include additional materials such as bolts that expand and contract with temperature and may cause the ceramic to crack. In some embodiments, the end may be continuous with the end effector or may be monolithically formed with the end effector. Any number of other materials that may facilitate operation or resistance during operation may be utilized and are also encompassed by the present technology.

[0039]

[0046] FIG. 3 shows a schematic partial cross-sectional view of an exemplary substrate processing system arrangement 300 according to some embodiments of the present technique. The drawing may show aspects of the processing system and components described above, and may show additional aspects of the system. The drawing may show a simplified version of the system with some components removed to facilitate illustrating the coupling of the lid stack components. It should be understood that the processing system 300 may include any aspect of any portion of the processing system described or illustrated elsewhere, and may show aspects of a lid stack incorporated with any of the systems described elsewhere. For example, the processing system 300 may show a portion of the system overlying the transfer region of the chamber, and may show components disposed on the chamber body that define the transfer region as described above. It should be understood that any components described above may still be incorporated, including the transfer region and any components described above for systems including the components of the processing system 300.

[0040]

[0047] As previously described, a multi-chamber system may include an individual lid stack for each processing region. The processing system 300 may show a diagram of two lid stacks that may be part of a multi-chamber system including two, three, four, five, six, or more processing chamber sections. As previously described, one or more lid plates may include an individual lid stack for each processing region. For example, as shown, the processing system 300 may include a first lid plate 305. The first lid plate 305 may be or include any embodiment of the lid plate 158 described above. For example, the first lid plate 305 may be a single lid plate that may be mounted on the transfer region housing or the chamber body, as previously described. The first lid plate 305 may be mounted on the housing along a first surface of the lid plate. The lid plate 305 may define a number of openings 306 through the lid plate to allow vertical translation of the substrate into the defined processing region, as previously described.

[0041]

[0048] A first lid plate 305 may have a plurality of lid stacks 310 disposed thereon, as described above. In some embodiments, the first lid plate 305 may define a recessed ledge 307 extending from a second surface of the first lid plate 305 opposite the first surface. The recessed ledge 307 may extend around each opening 306 of the plurality of openings. Each individual lid stack 310 may be disposed on a respective recessed ledge 307, as shown. The plurality of lid stacks 310 may include a number of lid stacks equal to the number of openings of the plurality of openings defined through the first lid plate. The lid stacks may at least partially define a plurality of processing regions vertically offset from the transfer region, as described above. Although two openings 306 and two lid stacks 310 are shown, it should be understood that the processing system 300 may include any number of lid stacks in embodiments encompassed by the present technology.

[0042]

[0049] The lid stack, in an embodiment, may include any number of components and may include any of the components described above. For example, the lid stack components may include a liner plate 312, a pumping liner 314, a face plate 316, and a blocker plate 318. The face plate 316 and the blocker plate 318 may define a number of openings for distributing process precursors to a processing region defined from above by the face plate 316 and at least partially radially defined by the pumping liner 314. A substrate support translated toward the face plate through a corresponding opening 306 in the first lid plate 305 may at least partially define the processing region from below.

[0043]

[0050] Extending above the lid stack 310 may be a second lid plate 320. The second lid plate 320 may extend completely over each lid stack of the processing system and may provide access to individual processing regions via a number of openings 321 defined through the second lid plate 320. Each opening 321 may provide fluid access to an individual lid stack, and the openings 321 may be axially aligned with a corresponding lid stack and / or substrate support, as previously illustrated. Disposed within the openings through the second lid plate 320 may be an output manifold 322. The output manifold may be at least partially disposed within the openings through the second lid plate 320 and may be at least partially mounted on the second lid plate, as illustrated. The output manifold may be fluidly coupled to one or more precursor sources and may provide fluid access from a remote plasma source, as previously described. An individual remote plasma source may be coupled to each output manifold, or one or more remote plasma sources may be coupled to multiple output manifolds, as described above.

[0044]

[0051] The multiple lid stack components 310 may be placed together and may or may not be mechanically coupled together. For example, an elastomeric element such as a gasket or O-ring may be disposed between each plate as shown. The elastomeric element may seat within a groove or channel formed along the adjacent surfaces of the plates. In some embodiments as shown, the elastomeric element may be vertically aligned to limit or prevent any cantilever effect of the arrangement when a vacuum is pulled on the chamber. To facilitate sealing of the second lid plate 320 with the lid stack, in some embodiments, at least one component of each lid stack of the multiple lid stacks may be coupled to the second lid plate 320.

[0045]

[0052] As shown in the drawings, at least one lid stack component, which in some embodiments may be a gas box 325, may be coupled to the backside of the second lid plate 320 as shown. The output manifold may be mounted on a first surface of the top lid, along with the remote plasma source in some embodiments, while the gas box may be coupled to a second surface of the second lid plate opposite the first surface. In some embodiments, a flange may extend from the first surface of the gas box 325, which may be positioned to contact the second lid plate. In some embodiments, as described further below, a recessed pocket may extend from the second surface of the gas box 325, which may be mounted on the blocker plate 318 as shown. Any number of lid stack components may be coupled to the second lid plate 320, and any number of other lid stack components may be mounted on or coupled to the first lid plate 305. In some embodiments, only a single plate, which may be the top plate of the lid stack, which may be the gas box 325 , may be coupled to the second lid plate 320 .

[0046]

[0053] As previously discussed, each lid stack 310 may include the same components, all of which may be manufactured in a similar manner. However, machine tolerances may cause inconsistencies between components, which may affect the flatness of any component, including the second lid plate. In addition, the tolerances may affect the thickness of the components. Any inconsistencies will likely be relatively evenly distributed between the components of the various lid stacks, but in some scenarios, compounding effects may cause one lid stack to be offset from one or more other lid stacks. Because the second lid plate 320 may be relatively planar with respect to each of the multiple lid stacks, the offsets may cause gaps to form within one lid stack.

[0047]

[0054] FIG. 3 illustrates a scenario in which tolerances may be concentrated within one lid stack 310. It may form a gap between the gas box 325 and the second lid plate 320. Although the gap may be relatively small, such as less than 1 mm, or about 0.5 mm or less, this may be enough to cause a leak in the system. For example, an elastomeric element or O-ring 330 may be seated or disposed between the gas box 325 and the second lid plate 320. As shown, the O-ring is disposed between the output manifold 322 and the gas box, which may form a vacuum seal through the fluid path between the components. To ensure an adequate seal, the O-ring may be seated to provide a certain compression based on the cross-sectional diameter of the components. For example, the O-ring 330 may be characterized by a cross-sectional diameter of about 10 mm or less, about 7 mm or less, about 5 mm or less, or less. Gaps caused by tolerance issues may be characterized by a distance of about 1 mm or less, and may be about 0.7 mm or less, about 0.6 mm or less, about 0.5 mm or less, or even less.

[0048]

[0055] Accommodating this gap may be done in multiple ways. In that case, the lid stack 310 has multiple components mounted on the first lid plate 305 and one or more components coupled to the second lid plate 320. For example, if the second lid plate 320 is fully mounted against the gas box 325, a larger compression may be applied on the O-ring 330. That may limit or prevent any leakage between the components. However, a gap may then be formed between the gas box 325 and the blocker plate 318. This may cause the system to leak when vacuum is pulled on the system. Thus, the gas box 325 or any components coupled to the second lid plate 320 may not be coupled as tightly with the second lid plate. Since component mating consistency can affect system performance, step bolts, such as shoulder bolts, or bolts containing sleeves or bushings may be included to secure the gas box 325 to the second lid plate 320 to ensure a more distributed gap between the second lid plate and the gas box, and between the blocker plate and the gas box. However, because of the elastomeric elements between the gas box and the second lid plate, compensating for the gap with shoulder bolts may force the gas box away from the second lid plate when vacuum is pulled on the system and not enough compression may occur on the O-ring 330. For example, a 7 mm O-ring may require about 10% or more, about 12% or more, about 15% or more, or more compression depending on the material and other properties of the O-ring to ensure deflection to create a proper seal. When vacuum is pulled and the gas box 325 may be pulled away from the second lid plate, the weight of the components on that lid plate and the vacuum force may not maintain enough compression of the O-ring.

[0049]

[0056] When a vacuum is pulled on the system, the vacuum may apply a force to the shoulder bolt 335 in the opposite direction from the coupling with the second lid plate. This may reduce the force against the gas box and distribute a larger gap between the gas box 325 and the second lid plate 320. For example, other lid stack components may be pulled down toward the first lid plate. This may further compress the O-ring between these components to ensure a proper seal. The gas box 325 or other components may be bolted to the second lid plate in the opposite direction to the pull of the vacuum on the system, thus applying a force against the bolt force and reducing the compression of the O-ring 330 when the vacuum is pulled in the opposite direction. Since a larger gap is distributed between the gas box and the second lid plate and there may not be other counteracting forces, the compression of the O-ring 330 may be reduced even as the O-ring between the gas box and the blocker plate is more fully compressed. As a larger complete gap occurs at the interface between the gas box and the second lid plate, the compression of the O-ring may decrease to about 15% or less, about 10% or less, about 7% or less, about 6% or less, about 5% or less, or less, resulting in system leakage. The present technology may overcome this problem by providing an engagement device to generate a reaction force against the gas box and the O-ring. This may limit the gap in the second lid plate when vacuum is pulled.

[0050]

[0057] FIG. 4 shows a schematic cross-sectional view of an exemplary substrate processing system 300 arrangement according to some embodiments of the present technique. The drawing may have the same components as FIG. 3 and may include any features, components, or characteristics of any components or aspects of any of the systems previously described. FIG. 4 may show the incorporation of an engagement device 405, which may provide a counteracting force against the bolts 335 and against the vacuum drawn on the system to press the gas box 325 against the second lid plate 320 and reduce or control any gap between the components. An exemplary engagement device will be described in more detail below and may include a spring that operates to provide a force returning the gas box towards the second lid plate 320. The bolts 335, or any other coupling device, may generate a specific position of the gas box relative to the second lid plate 320 or may ensure a reference amount of compression before drawing a vacuum on the system, ensuring a specific compression on the O-ring 330. When the vacuum is released, the compression on the O-ring may decrease, possibly causing the system to leak, as well as at O-ring 330. However, further compression may occur at the O-ring between the gas box and the blocker plate.

[0051]

[0058] An embodiment of the present technology incorporating an engagement device on each bolt connecting the gas box 325 to the second lid plate 320 may at least partially compensate for the vacuum effect by engaging the gas box 325 and forcing the gas box toward the second lid plate 320 at least some amount. The engagement device may include any number of components, and in some embodiments may include the bolts 335, as described below. However, the engagement device may include at least one spring component or compression element that may generate a reaction force when compressed. As a result, when a vacuum is pulled on the system and a force is applied on each component of the lid stack toward the pumping liner or lower lid plate, the engagement device may provide a reaction force on one or more components of the gas box or lid stack connected to the second lid plate. This may reduce or limit the effect of the vacuum reducing the compression of the O-ring 330.

[0052]

[0059] FIG. 4 illustrates an embodiment including a flange or lip extending around the gas box, allowing the mating surface of the bolt extending upward through the gas box to couple the component to the second lid plate, according to some embodiments of the present technique. Further embodiments may include one or more recesses or gaps formed in the gas box, within which an engagement device according to some embodiments of the present technique may be located. FIG. 5 illustrates a schematic bottom view of a lid stack component 500 of an exemplary substrate processing system, according to some embodiments of the present technique. The lid stack component 500 may be or include any component of a lid stack that may be coupled to a second lid plate, as described above. For example, the lid stack component 500 may be a gas box, any of the gas boxes as described above, or may include any feature or characteristic of a gas box or any other lid stack component described above. The bottom view may show a second surface 505 of the exemplary gas box, and the first surface opposite the second surface 505 may be bonded to or with a second lid plate, as previously described. The structure may show a groove or trench 508 within which an O-ring or other element may be seated, which may facilitate sealing between the component and any other lid stack plates, such as the blocker plate previously described, or other components to which the gas box may be joined.

[0053]

[0060] The lid stack component 500 may also define one or more recesses 510, including multiple recesses around the component. The recesses may extend from the second surface 505 toward the first surface opposite the second surface 505, but may not extend completely through the thickness of the component. An opening 512 may extend from the recess 510 through the first surface and may be sized or shaped to receive a bolt or coupling component used to join the component 500 to the second lid plate, as previously illustrated. The recesses may be characterized by any shape or geometry, and in some embodiments, the recesses may be substantially or completely cylindrical, as illustrated. The recesses may also at least partially intersect the outer radial edge of the component, as illustrated, which may provide additional access from the radial edge of the gas box, as well as from below the gas box, such as at the second surface. As a result, the component 500 may be characterized by an incomplete outer radial edge. It may exhibit a break at each recess providing access to the recess along the outer radial edge of the component.

[0054]

[0061] It should be understood that any other geometry of the components may also be encompassed by embodiments of the present technology and include any of the features or characteristics described. Any number of recesses and corresponding engagement devices may be included in embodiments of the present technology. The distribution may be equal between any two recesses, although in some embodiments the distance may be offset. However, the distribution may be at least partially balanced around the component and may include multiple aspects of symmetry of distribution as shown. It should be understood that the configuration shown is merely one example, and any number of other arrangements are encompassed by the present technology as well.

[0055]

[0062] Referring to FIG. 6, a schematic cross-sectional partial view of a component assembly 600, including, in some embodiments of the present technology, a gas box assembly or the like, is shown. The component assembly 600 may be included with any of the systems described above and may be a gas box of any of the systems described above. A component 605 of the assembly may be or may include any component that may be engaged with another component of the system. The other component includes a second lid plate 610, which may include any aspect of a second lid plate as described above. It should be understood that the drawing is not limited to any particular component, but may encompass any two components that may be joined together with an engagement device. The component 605 may be a gas box or other lid stack component. The component 605 may include one or more recesses defined around the periphery of the component, such as the recess 510 illustrated above. A partial cross-section through the recess 615 is illustrated and may include an engagement device 620. Any number of engagement devices may be included with a component according to an embodiment of the present technology.

[0056]

[0063] The component 605 may be characterized by a first surface 607 that may be adjacent to the second lid plate 610. The component may be further characterized by a second surface 609 that may be the surface opposite the first surface. A recess 615 may be formed from the second surface 609 and may extend at least partially through the thickness of the component towards the first surface 607. In some embodiments, the recess may not extend all the way through the first surface 607. An opening 617 may be formed from the first surface 607 and may provide access to the recess 615. In some embodiments, the opening may be characterized by a diameter that is smaller than the diameter of the recess, and the opening 617 may be characterized by a diameter configured to receive a coupler, such as a bolt, through the opening to engage the second lid plate 610. As discussed above, the recess 615 may at least partially intersect a radial edge 619 of the component 605 and may provide radial access to the recess as shown. An engagement device 620 may be seated or disposed within the recess, the aspect of which may extend at least partially outwardly to or beyond the radial edge 619 of the component 605 .

[0057]

[0064] An engagement device 620 according to some embodiments of the present technology may include one or more features configured to generate a reaction force in a direction opposite to a vacuum or other force applied to the component 605, as described above. The engagement device 620 may include a number of components operatively coupled to apply a force to the component 605 toward the second lid plate 610. The engagement device 620 may or may not include a bolt 625, among other things, against which the force may be applied, although in some embodiments, the engagement device 620 may include a bolt 625. The bolt 625 may extend through the recess 615 and the opening 617 to engage the second lid plate 610, as shown. The bolt may include a head 626 characterized by a larger diameter than the shaft of the bolt, and the head 626 may reside within the recess 615 when engaged with the second lid plate 610.

[0058]

[0065] While illustrated as a bolt, it should be understood that any of a variety of couplers may be used in embodiments of the technology, including screws or other connectors or components that may join two components. In some embodiments, the bolt may be threaded at least partially along the shaft, such as at the end distal to the head 626. The bolt may also define a step 627 proximate the distal end of the bolt. This step 627 may provide a landing where the bolt may seat against the second lid plate 610. The step 627 may be part of a sleeve or bushing disposed around the bolt, or may be part of the bolt. For example, in some embodiments, the bolt 625 may be a shoulder bolt or step bolt, which may form a step in the shaft portion as shown.

[0059]

[0066] The engagement device may include a disk, such as washer 630. The washer may be annular in some embodiments and may be characterized by an annular inner diameter and an annular outer diameter. The inner annular diameter may be larger than the shaft diameter of the bolt, and may be larger than the diameter of the bushing or shoulder portion of the bolt, as shown. The outer annular diameter may be equal to or smaller than the recess diameter. The washer may be any substantially flat disk capable of distributing forces over a larger area, and may be a flat washer or a fender washer, as well as any other type of washer or disk. The washer may seat on the bolt and contact the head 626 of the bolt while the bolt is engaged to the second lid plate 610.

[0060]

[0067] The engagement arrangement may also include a spring 635 or compressible device that may engage the washer 630 at a first end of the spring, as well as the component 605 at a second end of the spring, as shown, and may extend at least partially around the bolt. The spring may engage the component 605 along an inner surface of a recess. The inner surface of the recess may be a surface that is substantially parallel to the first surface 607 of the component. The first end of the spring may seat on the washer 630. As a result, when the bolt 625 is engaged to the second lid plate 610, the washer may compress the spring, which may then exert a force on the component 605 in a direction toward the second lid plate 610. When a vacuum is drawn on the system, a force may be generated in the opposite direction, and the spring may at least partially resist this force, facilitating maintaining proper compression of the O-ring, as previously described. The springs may be configured such that when compressed, they generate an amount of outward force to improve compression of the O-ring but not overcome the competing vacuum force that could otherwise increase the gap between component 605 and an underlying component such as a blocker plate as described above.

[0061]

[0068] Thus, in some embodiments, the spring 635 may be configured to provide an outward force of about 100N or more, about 200N or more, about 300N or more, about 400N or more, about 500N or more, or more. In some embodiments, multiple engagement devices may be included to provide a total force less than a force that can overcome the vacuum force and gravity due to the weight of the upper layer components. For example, in some embodiments, the total force exerted by the multiple engagement devices may be about 5000N or less, about 4000N or less, about 3500N or less, about 3000N or less, about 2800N or less, about 2600N or less, about 2400N or less, about 2200N or less, about 2000N or less, or less. Any type of spring or compressible structure may be used as the spring 635, which may generate an amount of force when compressed. The springs may include leaf springs, compression springs, wave springs, or any other type of spring. In some embodiments, wave springs may be utilized as shown, depending on the range of expansion and force required for the components.

[0062]

[0069] By utilizing the springs described and configured above, the engagement on an O-ring, such as O-ring 330 described above, may be increased to provide a compression of about 15% or more, and may provide a compression of about 18% or more, about 20% or more, about 22% or more, about 24% or more, about 26% or more, about 28% or more, or more, but may be limited to ensure sufficient compression of the component with the underlying components, such as between the gas box and the blocker plate. As a result, compression may be maintained at about 30% or less before a vacuum is pulled on the system. When a vacuum is pulled that may reduce the compression of the O-ring based on the components being pulled away from the second lid plate, the counter force applied by the springs may ensure that the compression of the O-ring remains about 10% or more, and may ensure that the compression remains about 12% or more, about 14% or more, about 16% or more, about 18% or more, about 20% or more, or more.

[0063]

[0070] The engagement device may include further components to maintain the engagement device in the recess. For example, a first clip 640 may be included in the recess to provide a stop for the component of the engagement device. For example, a groove or channel may be formed around the component 605 in the recess, and the first clip 640, e.g., a c-clip, or a retainer or spring clip, may be seated in the groove. The first clip 640 may be sized to extend within the recess to engage a first surface of the washer 630 opposite the second surface of the washer 630 that contacts the spring 635 when the bolt 625 is withdrawn from the second lid plate 610. An outer annular edge of the washer 630 may at least partially seat on the clip to ensure that the component is retained in the recess when disengaged from the second lid plate. FIG. 6 shows a configuration in which the bolt is engaged to the second lid plate 610. When fully engaged with the lid plate, as shown, a gap may be maintained between the washer 630 and the clip 640. If the washer remained in contact with the clip during engagement because the clip was seated within the component 605, the spring would effectively apply a force in both directions to the component as it was pulled into the washer, essentially countering any force in the direction of the second lid plate. Thus, as shown, a gap may be maintained between the washer and the clip when the bolt is engaged into the second lid plate, and this gap may be greater than the distance the spring would pull the component back toward the second lid plate.

[0064]

[0071] The engagement device may include a second clip 645 in some embodiments. The second clip 645 may seat in a groove that extends around the shaft or shoulder portion of the bolt 625. The second clip may be sized to have an outer diameter larger than the inner annular diameter of the washer 630. Thus, when the bolt 625 is disengaged from the second lid plate 610, the second clip 645 may seat on the second surface of the washer, ensuring that the bolt is at least partially retained within the recess 615 for subsequent engagement. The second clip 645 may be any type of clip similar to the first clip 640. Additionally, in embodiments, the groove on the shaft of the bolt in which the clip may seat may be spaced along the axis to ensure that the bolt can be fully removed from the second lid plate 610 before the second clip engages the washer. The groove may also be spaced along the shaft to ensure that the clip does not contact the component 605. For example, when the bolt is engaged with the second lid plate 610, the second clip may be spaced apart from the gas box a first distance that may be greater than the adjustment distance when vacuum is pulled on the system.

[0065]

[0072] Because the bolt 625 is engaged with the second lid plate 610, the bolt and corresponding second clip do not move relative to the second lid plate when a vacuum is pulled on the system. However, a component 605, such as the gas box, may be at least partially pulled away from the second lid plate as described above. The second clip may therefore be spaced apart to ensure that its position exceeds the change in position of the component after a vacuum is pulled on the system. For example, in some embodiments, a groove may be spaced on the bolt relative to the position of the bolt entering the opening 617 to ensure a clearance of a particular distance plus an additional amount to accommodate the tolerance clearance accepted by the component. In one example where the tolerance clearance may be approximately 0.5 mm as described above, a groove may be formed along the shaft of the bolt to ensure that the second clip is at least 1 mm from the gas box before a vacuum is pulled on the system. Meanwhile, the bolt may still be fully pulled out of the second lid plate before the second clip contacts the washer. Thus, in some embodiments, the groove may be twice the distance of the tolerance spacing being addressed, or may be the tolerance spacing plus some additional spacing, such as about 0.5 mm or more, about 1 mm or more, about 1.5 mm or more, about 2 mm or more, or more.

[0066]

[0073] FIG. 7 shows a schematic cross-sectional partial view of a component assembly 600 according to some embodiments of the present technology, and may illustrate the assembly when the bolt 625 is removed from the second lid plate 610. As shown, the bolt 625 is completely removed from the second lid plate 610, which allows the bolt to drop and the spring 635 to expand. The spring may expand until the washer 630 seats on the first clip 640 as shown, and the bolt 625 may drop until the second clip 645 seats on the washer 630. As a result, the component remains in the recess, facilitating subsequent re-installation. By utilizing an engagement device according to embodiments of the present technology, tolerance gaps introduced by manufacturing may be controlled to limit or prevent sealing problems during operation of the system.

[0067]

[0074] In the foregoing description, for purposes of explanation, numerous details are presented in order to facilitate an understanding of various embodiments of the present technology. However, it will be apparent to one skilled in the art that certain embodiments may be practiced without some of these details, or with additional details.

[0068]

[0075] Although several embodiments have been disclosed, those skilled in the art will recognize that various modifications, alternative structures, and equivalents can be used without departing from the spirit of the embodiments. Moreover, some well-known processes and elements have not been described to avoid unnecessarily obscuring the present technology. Thus, the above description should not be construed as limiting the scope of the present technology. Furthermore, although a method or process may be described sequentially or stepwise, it should be understood that the steps may be performed simultaneously or in a different order than described.

[0069]

[0076] Where a range of values ​​is given, each intervening value between the upper and lower limits of that range is specifically disclosed to the smallest unit of the lower limit, unless the context clearly indicates otherwise. Any smaller ranges between any stated or unstated intervening value in a stated range, as well as any other stated or intervening value in that stated range, are also included. The upper and lower limits of these smaller ranges may be individually included or excluded from the range, and each range in which either, neither or both limits are included in the smaller ranges is also encompassed within the scope of this technology, subject to any specifically excluded limits in the stated range. Where a stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included.

[0070]

[0077] As used in this specification and claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to a "shaft" includes a plurality of such shafts, a reference to an "aperture" includes a reference to one or more connectors and equivalents thereof known to those skilled in the art, and so forth.

[0071]

[0078] Additionally, the terms "comprise(s)", "comprising", "contain(s)", "containing", "include(s)", and "including", when used in this specification and claims, are intended to specify the presence of stated features, integers, components, or steps, but do not exclude the presence or addition of one or more other features, integers, components, steps, operations, or groups.

Claims

1. 1. A substrate processing system, comprising: a chamber body defining a transfer region; a first lid plate disposed on the chamber body along a first surface of the first lid plate, the first lid plate defining a plurality of openings therethrough; a number of lid stacks equal to a number of openings of the plurality of openings defined through the first lid plate, the plurality of lid stacks at least partially defining a plurality of processing regions vertically offset from the transfer region; and a second lid plate coupled to the plurality of lid stacks, the plurality of lid stacks being disposed between the first lid plate and the second lid plate, and components of each lid stack of the plurality of lid stacks being coupled to the second lid plate.

2. 2. The substrate processing system of claim 1, further comprising a plurality of substrate supports disposed about the transfer region, each substrate support of the plurality of substrate supports being vertically translatable along a central axis of the substrate support between a first position and a second position.

3. 2. The substrate processing system of claim 1, wherein the first lid plate further defines a recessed ledge around each opening of the plurality of openings in a second surface of the first lid plate opposite the first surface of the first lid plate, and each lid stack of the plurality of lid stacks mounted on the first lid plate rests on a respective recessed ledge defined in the second surface of the first lid plate.

4. 10. The substrate processing system of claim 1, wherein the transfer region comprises a transfer device rotatable about a central axis and configured to engage a substrate and transfer the substrate between a plurality of substrate supports in the transfer region.

5. the second lid plate defines a plurality of openings therethrough, each opening of the plurality of openings accessing a lid stack of the plurality of lid stacks, and the substrate processing system further comprises:

2. The substrate processing system of claim 1, further comprising a plurality of output manifolds, each output manifold of the plurality of output manifolds disposed within a respective one of the plurality of openings defined through the second lid plate.

6. 6. The substrate processing system of claim 5, wherein the component of each lid stack of the plurality of lid stacks coupled to the second lid plate is characterized by a first surface facing the second lid plate and a second surface opposite the first surface.

7. 7. The substrate processing system of claim 6, further comprising a first O-ring disposed on the first surface of the component of each lid stack of the plurality of lid stacks coupled to the second lid plate, each first O-ring engaging a corresponding output manifold.

8. The component of each lid stack of the plurality of lid stacks is coupled to the second lid plate at a plurality of locations using a plurality of engagement devices, each engagement device comprising: a bolt extending through the components of each lid stack and engaging the second lid plate; a washer seated on the bolt; and 8. The substrate processing system of claim 7, comprising a spring that engages the washer at a first end of the spring and engages the component of each lid stack at a second end of the spring opposite the first end.

9. 9. The substrate processing system of claim 8, wherein each engagement device further comprises a clip extending around the bolt, the clip sized to seat the washer along a first surface of the washer when the bolt is disengaged from the second lid plate.

10. The substrate processing system of claim 9 , wherein a gap is maintained between the clip and the washer when the bolt engages the second lid plate.

11. 10. The substrate processing system of claim 9, wherein the clip of each engagement device is a first clip, and each engagement device further comprises a second clip extending around the bolt.

12. 12. The substrate processing system of claim 11, wherein each second clip is sized to seat on the washer along a second surface of the washer when the bolt is disengaged from the second lid plate.

13. 1. A substrate processing system, comprising: a chamber body defining a transfer region; a first lid plate disposed on the chamber body along a first surface of the first lid plate, the first lid plate defining a plurality of openings therethrough; a plurality of lid stacks equal to a number of openings in the plurality of openings, at least partially defining a plurality of processing regions vertically offset from the transfer region, each lid stack of the plurality of lid stacks comprising a gas box; and a second lid plate coupled to the plurality of lid stacks, the plurality of lid stacks being disposed between the first lid plate and the second lid plate, the gas box of each lid stack of the plurality of lid stacks being coupled to the second lid plate by a plurality of engagement devices, each engagement device comprising a spring that compressively engages the gas box to the second lid plate.

14. Each engagement device is a stepped bolt extending through the gas box and engaging the second lid plate, the shank of the stepped bolt seating on the second lid plate when the stepped bolt is fully engaged with the second lid plate; a washer that seats on the shoulder bolt at the head of the shoulder bolt around the shank; and 14. The substrate processing system of claim 13, further comprising a spring that engages the washer at a first end of the spring and engages the gas box at a second end of the spring opposite the first end of the spring.

15. 15. The substrate processing system of claim 14, wherein each engagement device further comprises a clip disposed within the gas box around the shoulder bolt, the clip sized to seat the washer along a first surface of the washer when the shoulder bolt is disengaged from the second lid plate.

16. 16. The substrate processing system of claim 15, wherein a gap is maintained between the clip and the washer when the shank of the shoulder bolt is seated on the second lid plate.

17. 14. The substrate processing system of claim 13, further comprising a transfer device disposed within the transfer region and rotatable about a central axis, the transfer device configured to engage a substrate and transfer the substrate between a plurality of substrate supports within the transfer region.

18. the second lid plate defines a plurality of openings therethrough, each opening of the plurality of openings accessing a lid stack of the plurality of lid stacks, and the substrate processing system further comprises:

14. The substrate processing system of claim 13, further comprising a plurality of output manifolds, each output manifold of the plurality of output manifolds disposed within a respective one of the plurality of openings defined through the second lid plate.

19. 20. The substrate processing system of claim 18, further comprising a remote plasma unit mounted on said second lid plate and fluidly coupled to each output manifold of said plurality of output manifolds.

20. 1. A gas box assembly comprising: a gas box characterized by a first surface and a second surface opposite the first surface, a recess defined in the gas box from the second surface, and an opening accessing the recess defined through the first surface; a first clip seated within the gas box within the recess; a bolt disposed in the recess and extending through the opening defined in the first surface of the gas box; a washer extending around the bolt and disposed between the first clip and the first surface of the gas box; a second clip extending around the bolt and disposed between the washer and the first surface of the gas box; and a gas box assembly comprising: a spring disposed within the recess, the spring engaging the washer at a first end of the spring and engaging the gas box at a second end of the spring opposite the first end of the spring.

Images