Drawing apparatus, drawing method, and manufacturing method of laminated substrate, and program

JP7642384B2Active Publication Date: 2025-03-10SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
JP2021010364
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-01-26
Publication Date
2025-03-10
Estimated Expiration
2041-01-26

AI Technical Summary

Benefits of technology

【0018】 本発明によれば、下図形および上図形の一方図形に対して変形処理が行われており、他方図形に対して変形処理が行われていない、または、異なる変形処理が行われている描画データを適切に生成することができる。

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Abstract

To appropriately generate drawing data.SOLUTION: A drawing device includes: a drawing unit for drawing a pattern on a substrate; and a drawing data generation part 42 for generating drawing data used in drawing of the pattern in the drawing unit. Design data indicating the pattern to be drawn on the substrate includes a lower figure that is a pattern region, and an upper figure superposed on the lower figure. The drawing data generation part 42 subjects the one figure of the lower figure and the upper figure to deformation processing, and generates drawing data by superposing the deformed one figure on the other figure that is not subjected to deformation processing or the other figure that has been subjected to deformation processing different from that of the one figure. Thereby, it is possible to appropriately generate the drawing data in which the one figure of the lower figure and the upper figure has been subjected to the deformation processing, and the other figure has not been subjected to the deformation processing or has been subjected to the different deformation processing.SELECTED DRAWING: Figure 3
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Description

[Technical field]

[0001] The present invention relates to a drawing apparatus, a drawing method, a manufacturing method for a multilayer substrate, and a program. [Background technology]

[0002] Conventionally, a drawing device that draws a pattern on a photosensitive material on a substrate without using a mask has been put to practical use. In the drawing device, drawing data used for drawing a pattern is generated by RIP processing design data, which is vector data created using CAD or the like, and the pattern is drawn based on the drawing data. In addition, in the device of Patent Document 1, when an image indicated by image information is recorded on a recording medium that is deformed after recording of the image, the image information is converted so that the image on the recording medium after the deformation has the same shape as the image indicated by the image information. Then, based on the converted image information, an image is recorded on the recording medium before the deformation.

[0003] Recently, ultra-high multi-layer boards (hereinafter referred to as "laminate boards") in which many boards are stacked have been manufactured. In manufacturing laminate boards, a circuit pattern is drawn on each of a plurality of boards, and the circuit pattern is formed by performing processes such as development and etching. Next, holes are formed in each board, and then the plurality of boards are stacked. The stacked plurality of boards are attached to a mold. The plurality of boards have a plurality of holes that are continuous in the stacking direction, and a bonding process is performed on the plurality of boards with positioning reference pins included in the mold inserted into the plurality of holes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2005-157326 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in a laminated board, since each board is thin, the board expands and contracts during the joining process, and the size of the board varies from the size in the design data. The expansion / contraction rate (scale) of the board differs depending on the position in the stacking direction, for example. Therefore, it is conceivable to perform a deformation process (correction) on the drawing data based on the expansion / contraction rate predicted for the board so that the circuit pattern on each board in the laminated board approaches the design data, and then draw the circuit pattern on the board. Meanwhile, on each board, a reference pin mark indicating the position where the hole should be formed is also drawn. In this case, the design data includes, in addition to a lower figure indicating the circuit pattern, an upper figure superimposed on the lower figure and indicating the reference pin mark. In effect, the drawing data becomes raster data indicating an image in which the upper figure is superimposed on the lower figure.

[0006] Here, if the drawing data is deformed based on the expansion / contraction rate of the board as described above, the positions of the holes in the stacked boards will be misaligned, and the reference pins will not be able to be properly inserted into the holes. In order to align the positions of the holes in the stacked boards, the reference pin marks must be in the same positions in the design data, the drawing data, and the pattern formed on the board. Therefore, a method is required to properly generate drawing data in which the circuit pattern, which is the lower figure, is deformed without moving the reference pin mark, which is the upper figure (i.e., no deformation process is performed on the reference pin mark). Depending on the use of the board, there is a possibility that drawing data in which the upper figure is deformed differently from the lower figure, and further drawing data in which no deformation process is performed on the lower figure and the upper figure is deformed, may be required.

[0007] The present invention has been made in consideration of the above-mentioned problems, and aims to appropriately generate drawing data in which transformation processing has been performed on one of the lower and upper figures, and no transformation processing has been performed on the other figure, or a different transformation processing has been performed on the other figure. [Means for solving the problem]

[0008] The invention described in claim 1 is a drawing device for drawing a pattern, comprising: a drawing unit for drawing a pattern on a substrate; and a drawing data generation unit for generating drawing data used for drawing the pattern in the drawing unit, wherein design data indicating a pattern to be drawn on the substrate includes a lower figure which is a pattern area, and an upper figure which is superimposed on the lower figure, and the drawing data generation unit generates a drawing data for one of the lower figure and the upper figure. , according to the deformation of the substrate The drawing data is generated by performing a transformation process and overlaying the one graphic after transformation with another graphic that has not been transformed, or with the other graphic that has been transformed in a manner different from that of the one graphic, and in generating the drawing data in the drawing data generation unit, a lower graphic image, which is raster data representing the lower graphic, and an upper graphic image, which is raster data representing the upper graphic, are used.

[0010] The invention described in claim 2 is Draw a pattern 1. A drawing device, comprising: a drawing unit that draws a pattern on a substrate; and a drawing data generation unit that generates drawing data used for drawing the pattern in the drawing unit, wherein design data indicating a pattern to be drawn on the substrate is a lower figure that is a pattern area and is superimposed on the lower figure; Pattern area The above figure and A background graphic that is a non-pattern area that is superimposed on the lower graphic and surrounds the upper graphic. the drawing data generating unit performs a transformation process on one of the lower and upper graphics, and generates the drawing data by superimposing the one graphic after transformation on the other graphic that is not transformed or the other graphic that has been transformed differently from the one graphic, and the generation of the drawing data by the drawing data generating unit includes a lower graphic image which is raster data representing the lower graphic, and an upper graphic image which is raster data representing the upper graphic, A background graphic image which is raster data showing the background graphic. and is used do.

[0011] Claim 3 The invention described in claim 1 or 2 wherein each of the lower graphic image and the upper graphic image is run-length compressed data.

[0012] Claim 4 The invention described in Draw a pattern 1. A drawing device, comprising: a drawing unit that draws a pattern on a substrate; and a drawing data generation unit that generates drawing data used for drawing the pattern in the drawing unit,the drawing unit includes a stage that holds the substrate, a head that draws a pattern on the substrate on the stage, a moving mechanism that moves the stage relatively to the head, a drawing control unit that performs drawing on the substrate by controlling the head and the moving mechanism, and an imaging unit that captures an image of an alignment mark formed on the substrate on the stage to obtain an image; design data indicating a pattern to be drawn on the substrate includes a lower figure which is a pattern area, and an upper figure which is superimposed on the lower figure; The drawing data generation unit, based on the position of the alignment mark indicated by the captured image, The lower figure and the upper figure On the other hand, the transformation process is performed on the shape The drawing data is generated by superimposing the one graphic after transformation on the other graphic that is not transformed or the other graphic that is transformed in a manner different from that of the one graphic. .

[0013] Claim 5 The invention described in Draw a pattern 1. A drawing device, comprising: a drawing unit which draws a pattern on a substrate; and a drawing data generation unit which generates drawing data used for drawing the pattern in the drawing unit, wherein design data indicating a pattern to be drawn on the substrate includes a lower figure which is a pattern area, and an upper figure which is overlaid on the lower figure, and the drawing data generation unit performs a transformation process on one of the lower figure and the upper figure, and generates the drawing data by overlaying the one figure after transformation with the other figure which is not transformed or the other figure which has been transformed differently from the one figure; The substrate is one of a plurality of substrates included in a laminated substrate, the upper figure indicates a position used for aligning the substrate relative to other substrates in the manufacture of the laminated substrate, and no deformation processing is performed on the upper figure in the generation of the drawing data.

[0014] Claim 6 The invention described in claim 5 In the drawing apparatus according to the present invention, the drawing data generating unit performs a deformation process on the lower figure in accordance with deformation of the substrate that is expected to occur during the manufacture of the multilayer substrate.

[0015] The invention described in claim 7 is a drawing method for drawing a pattern, comprising the steps of: (a) preparing design data indicating a pattern to be drawn on a substrate, the design data including a lower figure which is a pattern region, and an upper figure which is superimposed on the lower figure; and (b) performing a step of ... , according to the deformation of the substrateThe method includes a step of generating drawing data by performing a deformation process and overlaying the one graphic after deformation with another graphic that has not been subjected to the deformation process, or the other graphic that has been subjected to a deformation process different from that of the one graphic; and a step of drawing a pattern on the substrate by a drawing unit using the drawing data, wherein in step b), a lower graphic image, which is raster data representing the lower graphic, and an upper graphic image, which is raster data representing the upper graphic, are used. The invention described in claim 8 is a drawing method for drawing a pattern, comprising: a) a step of preparing design data indicating a pattern to be drawn on a substrate, the design data including a lower figure which is a pattern area, and an upper figure which is to be overlaid on the lower figure; b) a step of performing a deformation process on one of the lower figure and the upper figure, and generating drawing data by overlaying the one figure after deformation with the other figure which is not subjected to the deformation process, or the other figure which has been subjected to a deformation process different from that of the one figure; and c) a step of drawing a pattern on the substrate by a drawing unit using the drawing data, the drawing unit comprising: a stage which holds the substrate, a head which draws a pattern on the substrate on the stage, a moving mechanism which moves the stage relatively to the head, a drawing control unit which performs drawing on the substrate by controlling the head and the moving mechanism, and an imaging unit which images an alignment mark formed on the substrate on the stage and obtains the captured image, and in the step b), the deformation process is performed on the one figure based on the position of the alignment mark indicated in the captured image. The invention described in claim 9 is a drawing method for drawing a pattern, comprising: a) a step of preparing design data indicating a pattern to be drawn on a substrate, and including a lower figure which is a pattern area, and an upper figure which is to be overlaid on the lower figure; b) a step of generating drawing data by performing a deformation process on one of the lower figure and the upper figure, and overlaying the one figure after deformation with the other figure which is not subjected to the deformation process, or the other figure which has been subjected to a deformation process different from that of the one figure; and c) a step of drawing a pattern on the substrate by a drawing unit using the drawing data, wherein the substrate is one of a plurality of substrates included in a laminated substrate, the upper figure indicates a position used for aligning the substrate with other substrates in manufacturing the laminated substrate, and in the step b), no deformation process is performed on the upper figure.

[0016] Claim 10 The invention described in is a method for manufacturing a laminated substrate, a) preparing design data indicating a pattern to be drawn on a substrate, the design data including a lower figure which is a pattern region, and an upper figure which is to be overlaid on the lower figure; b) performing a transformation process on one of the lower figure and the upper figure, and overlaying the transformed one figure with the other figure which is not transformed, or the other figure which has been transformed differently from the one figure, to generate transformation data; and c) using the transformation data to draw a pattern on the substrate by a transformation unit. The pattern was drawn using the drawing method The above The method includes the steps of: stacking a plurality of substrates including a substrate; and performing a bonding process on the plurality of substrates in a state in which a plurality of holes, including a hole formed in the substrate at a position indicated by the upper figure, are continuous in the stacking direction in the stacked plurality of substrates and reference pins are inserted into the plurality of holes, and in step b) of the drawing method, no deformation process is performed on the upper figure.

[0017] The invention described in claim 11 is a program for causing a computer to generate drawing data used for drawing a pattern, and execution of the program by a computer includes the steps of: a) preparing design data indicating a pattern to be drawn on a substrate, the design data including a lower figure which is a pattern region, and an upper figure which is to be overlaid on the lower figure; and b) performing a step of ... , according to the deformation of the substrateA process is executed in which a transformation process is performed, and drawing data is generated by overlaying the transformed one graphic with another graphic that has not been transformed, or the other graphic that has been transformed in a manner different from that of the one graphic, and in the b) process, a lower graphic image, which is raster data representing the lower graphic, and an upper graphic image, which is raster data representing the upper graphic, are used. The invention described in claim 12 is a program for causing a computer to generate drawing data used for drawing a pattern, wherein execution of the program by a computer causes the computer to execute the following steps: a) preparing design data indicating a pattern to be drawn on a substrate, and including a lower figure which is a pattern area, and an upper figure which is to be overlaid on the lower figure; and b) performing a deformation process on one of the lower figure and the upper figure, and generating drawing data by overlaying the one figure after deformation with the other figure which is not subjected to the deformation process, or the other figure which has been subjected to a deformation process different from that of the one figure. A drawing unit used for drawing the pattern on the substrate includes a stage which holds the substrate, a head which draws a pattern on the substrate on the stage, a moving mechanism which moves the stage relatively to the head, a drawing control unit which performs drawing on the substrate by controlling the head and the moving mechanism, and an imaging unit which images an alignment mark formed on the substrate on the stage and obtains the captured image, and in the step b), a deformation process is performed on the one figure based on the position of the alignment mark indicated in the captured image. The invention described in claim 13 is a program for causing a computer to generate drawing data used for drawing a pattern, wherein execution of the program by a computer causes the computer to execute the following steps: a) preparing design data indicating a pattern to be drawn on a substrate, and including a lower figure which is a pattern area, and an upper figure which is to be overlaid on the lower figure; and b) performing a deformation process on one of the lower figure and the upper figure, and generating drawing data by overlaying the one figure after deformation with the other figure which is not subjected to deformation process, or the other figure which has been subjected to a deformation process different from that of the one figure, wherein the substrate is one of a plurality of substrates included in a laminated substrate, the upper figure indicates a position which is used for aligning the substrate with other substrates in manufacturing the laminated substrate, and in the step b), no deformation process is performed on the upper figure. Effect of the Invention

[0018] According to the present invention, it is possible to appropriately generate drawing data in which a transformation process has been performed on one of the lower and upper figures, and no transformation process has been performed on the other figure, or a different transformation process has been performed on the other figure. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a perspective view showing a configuration of a drawing device. [Diagram 2] FIG. 1 illustrates a configuration of a computer. [Diagram 3] FIG. 4 is a block diagram showing the functions of a control unit. [Figure 4] 1A to 1C are diagrams for explaining the manufacture of a laminated substrate. [Diagram 5] 1A to 1C are diagrams illustrating a manufacturing flow of a laminated substrate. [Figure 6] FIG. 2 is a diagram showing a drawing flow in the drawing device. [Figure 7] FIG. [Figure 8] FIG. 2 is a diagram showing a part of a pattern indicated by design data. [Figure 9]FIG. [Figure 10] FIG. [Figure 11] FIG. [Figure 12] FIG. 13 is a diagram in which the entire graphic image and the upper region image are superimposed. [Figure 13] FIG. [Figure 14] FIG. 13 is a diagram in which the upper graphic image and the upper region image are superimposed. [Figure 15] FIG. 13 is a diagram showing a background graphic image. [Figure 16] FIG. 13 is a diagram in which a transformed geometric image and a background geometric image are superimposed. [Figure 17] FIG. [Figure 18] FIG. 13 is a diagram showing the intermediate composite image and the upper graphic image superimposed on each other. [Figure 19] FIG. 13 is a diagram showing a drawing image. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Fig. 1 is a perspective view showing a configuration of a drawing device 1 according to an embodiment of the present invention. In Fig. 1, three mutually orthogonal directions are indicated by arrows as an X direction, a Y direction, and a Z direction. In the example shown in Fig. 1, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction.

[0021] The drawing device 1 is a direct drawing device that draws a pattern by irradiating a photosensitive material on a substrate 9 with spatially modulated light and scanning the irradiated area of ​​the light on the substrate 9. The substrate 9 is, for example, a plate-like member having a substantially rectangular shape in a plan view. The substrate 9 is, for example, a flexible printed wiring board. On the substrate 9, a resist film formed of a photosensitive material is provided on a copper layer. In the drawing device 1, a circuit pattern is drawn on the resist film of the substrate 9. In a post-process, processing such as development and etching is performed, and the substrate 9 on which the circuit pattern is formed is obtained.

[0022] The drawing apparatus 1 includes a stage 21, a stage moving mechanism 22, a stage lifting mechanism 23, a drawing unit 3, an imaging unit 5, and a control unit 4. The control unit 4 controls the stage moving mechanism 22, the stage lifting mechanism 23, the drawing unit 3, the imaging unit 5, etc. The stage 21 is a substantially flat plate-shaped holding unit that holds the horizontal substrate 9 from below, below the drawing unit 3 (i.e., on the (-Z) side). The main surface (hereinafter referred to as "upper surface 91") on the (+Z) side of the substrate 9 placed on the stage 21 is substantially perpendicular to the Z direction and substantially parallel to the X and Y directions.

[0023] The stage lifting mechanism 23 moves the stage 21 in the Z direction. The stage moving mechanism 22 moves the stage 21 in the horizontal direction relative to the drawing unit 3. In the example shown in FIG. 1, the stage moving mechanism 22 moves the stage 21 in the Y direction together with the stage lifting mechanism 23. In other words, the stage moving mechanism 22 moves the stage 21 in a direction approximately parallel to the upper surface 91 of the substrate 9. For example, the stage moving mechanism 22 is a moving mechanism that moves the stage 21 linearly along a guide rail, and a linear servo motor is used as a driving source. This allows the stage 21 to move with high precision. A ball screw with a motor attached may be used as a driving source for the stage moving mechanism 22. The drawing device 1 may be provided with a rotation mechanism that rotates the stage 21 in a circumferential direction around a rotation axis extending in the Z direction. Also, the drawing device 1 may omit the stage lifting mechanism 23.

[0024] The drawing unit 3 includes a plurality of heads 31 (five in the example shown in FIG. 1) arranged in the X and Y directions. The plurality of heads 31 are supported above the stage 21 by a head support unit 19 provided across the stage 21. Each head 31 includes a light source and a light modulation unit. For example, a DMD (digital mirror device) in which a plurality of micromirrors are arranged two-dimensionally is used as the light modulation unit. The light modulation unit may be a modulator in which a plurality of light modulation elements are arranged one-dimensionally. The plurality of heads 31 have approximately the same structure.

[0025] In the drawing device 1, modulated (i.e., spatially modulated) light is irradiated onto an upper surface 91 of a substrate 9 from multiple heads 31 of a drawing unit 3, and the substrate 9 is moved in the Y direction by a stage moving mechanism 22. As a result, the irradiation area of ​​light from the multiple heads 31 is scanned in the Y direction on the substrate 9, and a circuit pattern is drawn on the substrate 9. In the following description, the Y direction is also referred to as the "scanning direction" and the X direction is also referred to as the "width direction".

[0026] 1, drawing on the substrate 9 is performed by a so-called single-pass method. Specifically, the stage moving mechanism 22 moves the stage 21 in the Y direction relative to the multiple heads 31, and the light irradiation areas from the multiple heads 31 scan the upper surface 91 of the substrate 9 in the Y direction (i.e., the scanning direction) only once. This completes drawing of the circuit pattern on the substrate 9. Note that the drawing device 1 may be provided with a sub-scanning mechanism that moves the stage 21 or the heads 31 in the X direction, and drawing on the substrate 9 may be performed by a so-called multi-pass method.

[0027] The imaging unit 5 has a plurality of cameras 51 (e.g., CCD cameras). The plurality of cameras 51 are supported above the stage 21 by the head support unit 19, similar to the head 31. The plurality of cameras 51 are arranged at intervals in the width direction. In the example of FIG. 1, two cameras 51 are provided on each side of the drawing unit 3 in the width direction. Each camera 51 captures an image of the substrate 9 on the stage 21 to obtain data of the captured image. Note that the number and arrangement of the cameras 51 may be changed in various ways.

[0028] 2 is a diagram showing the configuration of the computer 11. The computer 11 has a configuration of a general computer system including a CPU 111 that performs various arithmetic processing, a ROM 112 that stores a basic program, and a RAM 113 that stores various information. The computer 11 further includes a fixed disk 114 that stores information, a display unit 115 that displays various information, a keyboard 116a and a mouse 116b that accept input from an operator as an input unit 116, a read / write device 118 that reads information from a computer-readable recording medium 12 such as an optical disk, a magnetic disk, or a magneto-optical disk, and writes information to the recording medium 12, and a communication unit 119 that communicates with each component of the drawing device 1.

[0029] In computer 11, program 120 is read in advance from recording medium 12 via read / write device 118 and stored in fixed disk 114. Program 120 may be stored in fixed disk 114 via a network. CPU 111 executes arithmetic processing in accordance with program 120 while using RAM 113 and fixed disk 114 (i.e., computer executes the program), whereby computer 11 functions as control unit 4 in drawing device 1 of FIG. 1. Control unit 4 may be constructed of a dedicated electric circuit, or may partially utilize a dedicated electric circuit. Control unit 4 may be realized by a plurality of computers working together, in which case the plurality of computers may be provided in locations remote from one another.

[0030] FIG. 3 is a block diagram showing the functions of the control unit 4 realized by the computer 11. FIG. 3 also shows configurations other than the control unit 4. The control unit 4 includes a storage unit 41, a drawing data generation unit 42, and a drawing control unit 43. The storage unit 41 is mainly realized by the RAM 113 and the fixed disk 114, and stores various information such as design data. The design data indicates an image of a circuit pattern to be drawn on the substrate 9. The drawing data generation unit 42 is mainly realized by the CPU 111, and generates drawing data (described later) used for drawing a pattern. The drawing control unit 43 is mainly realized by the CPU 111, and controls the stage moving mechanism 22 and the head 31 of the drawing unit 3 based on the drawing data, thereby executing drawing on the substrate 9.

[0031] Here, a laminated substrate manufactured using the substrate 9 will be described. FIG. 4 is a diagram for explaining the manufacture of the laminated substrate 90, and FIG. 5 is a diagram showing the manufacturing flow of the laminated substrate 90. The laminated substrate 90 is an ultra-high multi-layer substrate in which a plurality of substrates 900 (for example, 80 to 100 substrates) are laminated. In FIG. 4, the number of substrates 900 is drawn smaller than in reality. Typically, the substrates 900 are approximately the same size. The substrate 9 on which a circuit pattern is drawn by the drawing apparatus 1 is one of the substrates 900 included in the laminated substrate 90. The laminated substrate 90 may include two or more substrates 9 on which a circuit pattern is drawn by the drawing apparatus 1.

[0032] In manufacturing the laminated substrate 90, a plurality of substrates 900 each having a circuit pattern formed thereon are prepared and laminated (step S1). For example, a circuit pattern is drawn on each substrate 900 each having a copper layer with a resist film thereon, and then the substrates 900 each having a circuit pattern formed thereon are prepared by performing processes such as development and etching. The substrates 900 are laminated in a predetermined order.

[0033] Here, on each substrate 900, a plurality of marks indicating positions where holes 901 should be formed are formed together with a circuit pattern, and before stacking the substrates 900, holes 901 are formed at the positions of the marks using a drill or the like. Since reference pins 81, which will be described later, are inserted into the holes 901, these marks will be referred to as "reference pin marks" hereinafter. The positions of the reference pin marks relative to a predetermined reference position (e.g., the center) on the substrate 900 are the same for the substrates 900. Therefore, in the substrates 900 that are stacked, the plurality of holes 901 are continuous in the stacking direction (the up-down direction in FIG. 4).

[0034] A reference pin 81 for positioning included in the mold 80 is inserted into the plurality of continuous holes 901. The mold 80 also includes an upper mold 82 and a lower mold 83, which are arranged on both sides of the plurality of substrates 900 in the stacking direction. Both ends of the plurality of reference pins 81 are supported by the upper mold 82 and the lower mold 83. Two hot plates 84 are provided on both outer sides of the upper mold 82 and the lower mold 83 in the stacking direction. The two hot plates 84 are heated to a predetermined temperature. With the reference pins 81 inserted into the plurality of holes 901, the plurality of substrates 900 are heat-pressed in the stacking direction via the two hot plates 84 (see arrow A1 in FIG. 4). In this way, the plurality of substrates 900 are subjected to a bonding process, whereby the plurality of substrates 900 are bonded to each other, and the laminated substrate 90 is manufactured (step S2).

[0035] In one example of the laminated substrate 90, each substrate 900 shrinks slightly overall due to the influence of heat during bonding. The shrinkage rate differs depending on the position of the substrate 900 in the stacking direction. In manufacturing the laminated substrate 90, the shrinkage rates of the substrates 900 arranged at each position in the stacking direction are acquired in advance as stacking deformation information by experiment or empirical means. The stacking deformation information of the substrates 9 is stored in the drawing data generating unit 42 in FIG. 3.

[0036] Next, the flow of drawing in the drawing device 1 will be described with reference to Fig. 6. In the drawing device 1, design data indicating a pattern to be drawn on the substrate 9 is stored and prepared in the storage unit 41 (step S11). The design data in this embodiment is CAD (Computer-Aided Design) data, and is vector data including a plurality of figures (objects). Details of the design data will be described later.

[0037] 1, a substrate 9 to be processed is placed and held on the stage 21. The substrate 9 moves below the imaging unit 5 as the stage 21 moves, and an image of an upper surface 91 of the substrate 9 is captured by the multiple cameras 51.

[0038] FIG. 7 is a diagram showing an upper surface 91 of the substrate 9. A plurality of alignment marks 911 are formed on the upper surface 91 of the substrate 9. The alignment marks 911 may be a part of a through hole, wiring, or the like that is provided in advance on the substrate 9. The alignment marks 911 can be observed through a resist film, and each camera 51 acquires (data of) an image of the alignment marks 911. In the example of FIG. 7, a plurality of alignment marks 911 are provided at both ends in the scanning direction (Y direction). Therefore, as the stage moving mechanism 22 moves the substrate 9 in the scanning direction, the plurality of alignment marks 911 at both ends of the substrate 9 are imaged by the plurality of cameras 51.

[0039] The multiple captured images are input to the control unit 4. The control unit 4 determines the positions (relative positions with respect to a reference position) of the multiple alignment marks 911 on the substrate 9 on the stage 21 from the multiple captured images. The control unit 4 also prestores the positions of the multiple alignment marks 911 on an ideal substrate (substrate 9 on which no deformation occurs) and compares them with the positions of the alignment marks 911 on the actual substrate 9. In this way, writing deformation information indicating deformation of the substrate 9 during drawing of the pattern is acquired (step S12). The deformation of the substrate 9 is, for example, expansion / contraction or distortion occurring on the substrate 9 due to a previous process performed on the substrate 9. The writing deformation information indicating deformation of the substrate 9 is output to the writing data generation unit 42 in FIG. 3.

[0040] The drawing data generating unit 42 generates drawing data used for drawing a pattern from the design data (step S13). The process of generating drawing data from design data will be described in detail later. The drawing data generated by the drawing data generating unit 42 is sent to the drawing control unit 43. Then, the drawing control unit 43 controls the stage moving mechanism 22 and the head 31 of the drawing unit 3 based on the drawing data, thereby drawing a pattern on the substrate 9 (step S14). In the drawing device 1, a pattern is drawn on the substrate 9 by a drawing unit mainly composed of the stage 21, the head 31, the stage moving mechanism 22, the drawing control unit 43, and the imaging unit 5.

[0041] Next, a process of generating drawing data from design data will be described. FIG. 8 is a diagram showing a part of a pattern indicated by the design data. The design data includes a lower figure and an upper figure superimposed on the lower figure. The lower figure is a pattern area (positive polarity area) indicating the circuit pattern 71 to be drawn on the board 9. The upper figure is a pattern area indicating the reference pin mark 76 described above. The reference pin mark 76 is superimposed on the circuit pattern 71. The design data further includes a background figure superimposed on the lower figure and surrounding the periphery of the upper figure. The background figure is a non-pattern area (negative polarity area) indicating a peripheral area 77 of the reference pin mark 76 (hereinafter referred to as the "mark peripheral area 77"). The mark peripheral area 77 is superimposed on the circuit pattern 71. In an image indicated by the design data, an area of ​​the circuit pattern 71 that overlaps with the mark peripheral area 77 becomes a non-pattern area.

[0042] In the design data in this processing example, different attribute information is assigned to the lower figure, the upper figure, and the background figure, and the lower figure can be distinguished from the upper figure and the background figure using the attribute information. In other words, in this processing example, the same attribute information is assigned to the upper figure and the background figure, and the two cannot be distinguished using the attribute information. As will be described later, different attribute information may be assigned to the upper figure and the background figure. In FIG. 8, the circuit pattern 71 and the reference pin mark 76, i.e., the pattern area, are marked with parallel oblique lines (similarly in FIG. 9 to FIG. 19 described later). In addition, the outer edge of the mark surrounding area 77 is indicated by a thin dashed line.

[0043] The drawing data generating unit 42 performs RIP processing on the design data to generate raster data indicating a lower figure, and an upper figure and a background figure superimposed on the lower figure. The raster data indicates a binary image 61 (hereinafter referred to as "all figure image 61") in which a reference pin mark 76 and a mark surrounding area 77 are superimposed on a circuit pattern 71, as shown in FIG. The all figure image 61 may be a multi-value image (similar to other images). In the actual drawing device 1, the all figure image 61 is run-length compressed data, that is, run-length data. The run-length data indicates a position (change point) at which light irradiation on the substrate 9 is switched ON / OFF in drawing a pattern.

[0044] Moreover, raster data showing the lower figure is generated by RIP processing the design data excluding the upper figure and the background figure. The raster data shows a binary image 62 of the circuit pattern 71 (hereinafter referred to as "lower figure image 62") as shown in FIG. 10. The lower figure image 62 is also run-length compressed data. Furthermore, the upper figure and the background figure are extracted from the design data, and all the extracted figures are set as a pattern area, and RIP processing is performed to generate raster data showing the area of ​​the upper figure and the background figure. The raster data shows a binary image 62 (hereinafter referred to as "upper area image 63") with both the reference pin mark 76 and the mark surrounding area 77 as a pattern area as shown in FIG. 11. The upper area image 63 is also run-length compressed data. In FIG. 11, the outer edge of the reference pin mark 76 is shown by a thin dashed line.

[0045] Typically, in the drawing data generating unit 42, immediately after the design data is stored in the storage unit 41 in step S11 of Fig. 6, the entire graphic image 61, the lower graphic image 62, and the upper region image 63 are generated. It is preferable that the generation of the entire graphic image 61, the lower graphic image 62, and the upper region image 63 is completed when the substrate 9 is placed on the stage 21. By performing the RIP process, which takes a certain amount of time, in advance, it becomes possible to start drawing a pattern in a short time after the substrate 9 is placed on the stage 21.

[0046] Next, as shown in Fig. 12, when the entire graphic image 61 (see Fig. 9) and the upper region image 63 (see Fig. 11) are superimposed, the region that is the pattern region in both images (the region cross-hatched in Fig. 12) is extracted. In other words, the entire graphic image 61 and the upper region image 63 are ANDed. As a result, as shown in Fig. 13, an upper graphic image 64 showing the reference pin mark 76 as the pattern region is generated. Note that, when different attribute information is assigned to the upper graphic and the background graphic in the design data, the upper graphic image 64 may be generated by RIP processing the upper graphic extracted from the design data.

[0047] When the upper graphic image 64 is generated, as shown in FIG. 14, when the upper graphic image 64 and the upper region image 63 (see FIG. 11) are superimposed, a region that is a pattern region in only one of the images (a region with parallel diagonal lines in FIG. 14 excluding a cross-hatched region) is extracted. In other words, the upper graphic image 64 and the upper region image 63 are XORed. As a result, as shown in FIG. 15, a background graphic image 65 showing the mark surrounding region 77 as a pattern region is generated. Note that, when different attribute information is assigned to the upper graphic and the background graphic in the design data, the background graphic image 65 may be generated by RIP processing the background graphic extracted from the design data. It is preferable that the generation of the upper graphic image 64 and the background graphic image 65 is completed when the substrate 9 is placed on the stage 21.

[0048] Next, a deformation process is performed on the lower graphic image 62 in Fig. 10. At this time, preferably, a plurality of drawing blocks arranged in a matrix in two mutually orthogonal directions are set on the upper surface 91 of the substrate 9, and when the above-mentioned RIP process is performed, each image is divided into a plurality of drawing data elements (so-called mesh data) corresponding to the plurality of drawing blocks. The drawing data generating unit 42 performs the deformation process by moving the positions of the plurality of drawing data elements in the lower graphic image 62, that is, by moving the drawing positions of the plurality of drawing blocks on the substrate 9. Of course, the deformation process may be performed by other methods.

[0049] In this embodiment, the deformation process is performed based on the deformation information at the time of drawing. As described above, the deformation information at the time of drawing indicates the difference between the position of the alignment mark 911 on an ideal board (board 9 on which deformation does not occur) and the position of the alignment mark 911 on the actual board 9. Furthermore, the lower graphic image 62 indicates the circuit pattern 71 that matches the ideal board. Therefore, by referring to the deformation information at the time of drawing, the lower graphic image 62 is deformed (corrected) in accordance with the deformation of the board 9, and a deformed lower graphic image that indicates the circuit pattern after deformation is generated. Note that the board 9 in FIG. 7 in which the alignment marks 911 are provided at the four corners is merely an example, and the alignment marks 911 may be provided at any desired position. Furthermore, a plurality of individual piece regions may be set on the upper surface 91, and the deformation process of the lower graphic image 62 based on the deformation information at the time of drawing may be performed for each individual piece region.

[0050] The deformation process may be performed based on the above-mentioned deformation information at the time of lamination. In this case, for example, a process of enlarging or reducing the entire lower graphic image 62 with the reference position as the center is performed. In the example of FIG. 4, since the substrate 9 shrinks slightly during the manufacture of the laminated substrate 90, a deformation process of enlarging the lower graphic image 62 is performed so that a pattern according to the design data is formed on the substrate 9 after shrinkage. As a result, a deformed lower graphic image showing the enlarged circuit pattern is generated. The deformation process may be performed based on both the deformation information at the time of drawing and the deformation information at the time of lamination. In this case, for example, a deformation process of enlarging or reducing the entire lower graphic image after deformation based on the deformation information at the time of drawing is further performed based on the deformation information at the time of lamination. In the drawing device 1, a deformation process of the lower graphic image 62 may be performed based on information other than the deformation information at the time of drawing and the deformation information at the time of lamination.

[0051] Next, as shown in FIG. 16, when the transformed lower pattern image showing the transformed circuit pattern 71a and the background pattern image 65 (see FIG. 15) on which no transformation processing has been performed are superimposed, the area in the pattern area of ​​the transformed lower pattern image that overlaps with the pattern area of ​​the background pattern image 65 (i.e., the area where the transformed circuit pattern 71a and the mark surrounding area 77 overlap, and the area cross-hatched in FIG. 16) is converted into a non-pattern area. As a result, as shown in FIG. 17, an intermediate composite image 66 is generated that shows the area of ​​the transformed circuit pattern 71a excluding the mark surrounding area 77 as a pattern area. The intermediate composite image 66 shows an image in which the background pattern on which no transformation processing has been performed is superimposed on the transformed lower pattern. Note that in FIG. 16 and FIG. 17, the circuit pattern 71a has moved to the right due to the transformation processing of the lower pattern image 62.

[0052] Thereafter, as shown in FIG. 18, when the intermediate composite image 66 and the upper graphic image 64 (see FIG. 13) that has not been subjected to the transformation process are superimposed, a region that is a pattern region in one or both images (any of the regions with parallel diagonal lines in FIG. 18) is extracted. In other words, the intermediate composite image 66 and the upper graphic image 64 are OR (logical sum) composited. As a result, the drawing image 67 shown in FIG. 19, that is, the drawing data, is generated. The drawing image 67 shows an image in which the reference pin mark 76, which is a pattern region, and the mark surrounding region 77, which is a non-pattern region, are superimposed on the transformed circuit pattern 71a. In other words, the drawing image 67 shows an image in which the upper graphic and background graphic that have not been subjected to the transformation process are superimposed on the transformed lower graphic.

[0053] As described above, in the drawing device 1, design data indicating a pattern to be drawn on the substrate 9 is prepared. The design data includes a lower figure which is a pattern area, an upper figure which is a pattern area overlaid on the lower figure, and a background figure which is a non-pattern area overlaid on the lower figure and surrounds the periphery of the upper figure. The drawing data generating unit 42 performs a transformation process on the lower figure, and generates drawing data by overlaying the upper figure and background figure which are not transformed on the transformed lower figure. This makes it possible to appropriately generate drawing data in which the lower figure has been transformed and the upper figure and background figure have not been transformed.

[0054] As described above, the upper figure indicates a position (reference pin mark 76 in the above example) used for aligning the substrate 9 with respect to the other substrate 900 in the manufacture of the laminated substrate 90. In the drawing device 1, since no deformation process is performed on the upper figure, the position used for alignment is prevented from shifting from the position indicated by the design data. This makes it possible to prevent the position of the substrate 9 from shifting in the manufacture of the laminated substrate 90, and as a result, the laminated substrate 90 can be manufactured appropriately. Preferably, the drawing data generating unit 42 performs a deformation process on the lower figure in accordance with the deformation of the substrate 9 that is expected to occur during the manufacture of the laminated substrate 90. This makes it possible to approximate the circuit pattern on the substrate 9 corresponding to the lower figure in the laminated substrate 90 to the design data.

[0055] However, the raster data (run-length data in this embodiment) generated from the design data cannot include information about overlapping of figures, unlike the design data. Therefore, it is impossible to specify the area of ​​the circuit pattern 71 or the area of ​​the reference pin mark 76 only from the whole figure image 61 of FIG. 9. Therefore, for example, it is conceivable to perform a transformation process on the circuit pattern 71 by separately specifying the area of ​​the circuit pattern 71 in the whole figure image 61. However, since the whole figure image 61 loses information on the part of the circuit pattern 71 (lower figure) that overlaps with the reference pin mark 76 and the mark surrounding area 77 (upper figure and background image), even if the part of the circuit pattern 71 does not overlap with the reference pin mark 76 and the mark surrounding area 77 due to the transformation process, the part cannot be properly reproduced.

[0056] In response to this, the drawing data generating unit 42 generates drawing data using a lower graphic image 62, which is raster data showing the lower graphic, an upper graphic image 64, which is raster data showing the upper graphic, and a background graphic image 65, which is raster data showing the background graphic. This allows the part of the lower graphic that does not overlap with the upper graphic and the background graphic due to the transformation process to be properly reproduced in the drawing data, and allows drawing data to be generated with high accuracy. The background graphic image may be the upper region image 63 in FIG. 11, which shows both the reference pin mark 76 and the mark surrounding region 77 as pattern regions. In the above processing example, the lower graphic image 62, the upper graphic image 64, and the background graphic image 65 are run-length data, but they do not necessarily have to be run-length data.

[0057] In the drawing data generating unit 42, in the design data (vector data) including the lower figure, the upper figure, and the background figure, a transformation process may be performed on the lower figure. In this case, the drawing data is generated by RIP processing the transformed design data showing an image in which the upper figure and the background figure that have not been transformed are superimposed on the transformed lower figure. This makes it possible to appropriately generate drawing data in which the transformation process has been performed on the lower figure and the upper figure and the background figure have not been transformed.

[0058] However, since the RIP process requires a certain amount of time, in order to start drawing a pattern in a short time after the substrate 9 is placed on the stage 21, it is preferable that the RIP process is completed when the substrate 9 is placed on the stage 21. On the other hand, in a preferable process in the drawing device 1, a deformation process is performed on the lower figure based on the position of the alignment mark 911 of the actual substrate 9 shown in the captured image. In this case, if the above-mentioned method of performing a deformation process on the lower figure in the design data is adopted, the deformation process is performed on the lower figure after the captured image is acquired, and then the RIP process is performed, so that it is not possible to start drawing a pattern in a short time after the substrate 9 is placed on the stage 21. Therefore, in order to start drawing a pattern in a short time after the substrate 9 is placed on the stage 21, it is preferable to generate drawing data using the lower figure image 62, the upper figure image 64, and the background figure image 65 as described above.

[0059] The above-described drawing apparatus 1, drawing method, and manufacturing method of the laminated substrate 90 can be modified in various ways.

[0060] Depending on the pattern to be drawn on the substrate 9, the background figure may be omitted from the design data. In this case, the drawing data generating unit 42 generates drawing data using a lower figure image, which is raster data showing a lower figure, and an upper figure image, which is raster data showing an upper figure. The upper figure may be a non-patterned area. That is, the design data may include a lower figure, which is a patterned area, and an upper figure, which is a non-patterned area.

[0061] In the drawing device 1, the upper figure may be subjected to a transformation process different from that of the lower figure. Also, the upper figure may be subjected to a transformation process without the lower figure being subjected to a transformation process. As described above, the drawing data generating unit 42 performs a transformation process on one of the lower figure and the upper figure, and generates drawing data by superimposing the other figure after transformation on the other figure that is not subjected to the transformation process or the other figure that has been subjected to a transformation process different from that of the one figure. This makes it possible to appropriately generate drawing data in which one of the lower figure and the upper figure has been subjected to a transformation process and the other figure has not been subjected to a transformation process or has been subjected to a different transformation process.

[0062] In the design data, the overlapping relationship (vertical relationship) between the upper and lower features may be expressed by arranging both features on different image layers.

[0063] The moving mechanism in the imaging apparatus 1 can have various structures as long as the stage 21 moves relative to the head 31. For example, the stage 21 may be fixed and the head 31 may move in the Y direction. Alternatively, both the head 31 and the stage 21 may move.

[0064] In the drawing apparatus 1, the drawing unit that draws a pattern on the substrate 9 may be one that draws a pattern using an electron beam or the like, or one that draws a pattern using an inkjet.

[0065] The imaging apparatus 1 may be used for purposes other than the manufacture of the laminated substrate 90. The substrate 9 on which the pattern is drawn may be a semiconductor substrate, a glass substrate, or the like, other than a printed wiring board.

[0066] The configurations in the above-described embodiment and each of the modified examples may be combined as appropriate as long as they are not mutually inconsistent. [Explanation of symbols]

[0067] 1 Drawing device 5. Imaging unit 9,900 boards 11. Computers 21 Stage 22 Stage movement mechanism 31 Head 42 Drawing data generation unit 43 Drawing control section 62 Lower figure image 64 Top Graphic Image 65 Background Graphic Images 67 Drawing images 71,71a Circuit pattern 76 Reference pin mark 77 Area around the mark 81 Reference pin 90 Multilayer Board 120 Programs 901 (Platform) Hole 911 Alignment Mark S1, S2, S11~S14 steps

Claims

1. A drawing apparatus for drawing a pattern, comprising: a drawing unit for drawing a pattern on a substrate; a writing data generation unit that generates writing data used for writing a pattern in the writing unit; Equipped with design data indicating a pattern to be drawn on the substrate includes a lower figure which is a pattern area, and an upper figure which is superimposed on the lower figure; the drawing data generating unit performs a deformation process on one of the lower figure and the upper figure in accordance with the deformation of the board, and generates the drawing data by superimposing the one figure after deformation on the other figure that is not subjected to the deformation process or the other figure that has been subjected to a deformation process different from that of the one figure; a lower graphic image which is raster data representing the lower graphic and an upper graphic image which is raster data representing the upper graphic are used in generating the drawing data in the drawing data generating section.

2. A drawing apparatus for drawing a pattern, comprising: a drawing unit for drawing a pattern on a substrate; a writing data generation unit that generates writing data used for writing a pattern in the writing unit; Equipped with design data indicating a pattern to be drawn on the substrate includes a lower figure which is a pattern area, an upper figure which is a pattern area and is superimposed on the lower figure, and a background figure which is a non-pattern area and is superimposed on the lower figure and surrounds the periphery of the upper figure; the drawing data generating unit performs a transformation process on one of the lower and upper figures, and generates the drawing data by superimposing the one figure after transformation on the other figure that is not transformed or the other figure that has been transformed in a manner different from that of the one figure; A drawing device characterized in that, in generating the drawing data in the drawing data generation unit, a lower graphic image which is raster data indicating the lower graphic, an upper graphic image which is raster data indicating the upper graphic, and a background graphic image which is raster data indicating the background graphic are used.

3. 3. The drawing device according to claim 1, A drawing device, characterized in that each of the lower graphic image and the upper graphic image is run-length compressed data.

4. A drawing apparatus for drawing a pattern, comprising: a drawing unit for drawing a pattern on a substrate; a writing data generation unit that generates writing data used for writing a pattern in the writing unit; Equipped with The rendering unit: a stage for holding the substrate; a head for drawing a pattern on the substrate on the stage; a moving mechanism for moving the stage relative to the head; a drawing control unit that controls the head and the moving mechanism to perform drawing on the substrate; an imaging unit that captures an image of an alignment mark formed on the substrate on the stage and acquires a captured image; Equipped with design data indicating a pattern to be drawn on the substrate includes a lower figure which is a pattern area, and an upper figure which is superimposed on the lower figure; A drawing device characterized in that the drawing data generation unit performs a deformation process on one of the lower and upper figures based on the position of the alignment mark shown in the captured image, and generates the drawing data by overlaying the one figure after deformation with the other figure that is not subjected to deformation processing, or the other figure that has been subjected to a deformation process different from that of the one figure.

5. A drawing apparatus for drawing a pattern, comprising: a drawing unit for drawing a pattern on a substrate; a writing data generation unit that generates writing data used for writing a pattern in the writing unit; Equipped with design data indicating a pattern to be drawn on the substrate includes a lower figure which is a pattern area, and an upper figure which is superimposed on the lower figure; the drawing data generating unit performs a transformation process on one of the lower and upper figures, and generates the drawing data by superimposing the one figure after transformation on the other figure that is not transformed or the other figure that has been transformed in a manner different from that of the one figure; the substrate is one of a plurality of substrates included in a laminate substrate, the upper figure indicates a position used for aligning the substrate with respect to other substrates in manufacturing the laminate substrate; The drawing device according to claim 1, wherein the drawing data is generated without performing any transformation process on the upper figure.

6. The drawing device according to claim 5, a drawing data generating unit for generating a drawing data for the lower figure, the drawing data generating unit performing a deformation process on the lower figure in accordance with deformation of the substrate that is expected to occur during the manufacture of the laminated substrate.

7. A method for drawing a pattern, comprising the steps of: a) preparing design data indicating a pattern to be written on a substrate, the design data including a lower figure which is a pattern area, and an upper figure which is to be superimposed on the lower figure; b) performing a transformation process on one of the lower and upper figures in accordance with the transformation of the board, and generating drawing data by superimposing the transformed one figure on the other figure that is not transformed or the other figure that has been transformed in a different way from the one figure; c) drawing a pattern on the substrate by a drawing unit using the drawing data; Equipped with A drawing method, characterized in that in the step b), a lower graphic image which is raster data showing the lower graphic and an upper graphic image which is raster data showing the upper graphic are used.

8. A method for drawing a pattern, comprising the steps of: a) preparing design data indicating a pattern to be written on a substrate, the design data including a lower figure which is a pattern area, and an upper figure which is to be superimposed on the lower figure; b) performing a transformation process on one of the lower and upper figures, and generating drawing data by superimposing the transformed one figure on the other figure that is not transformed or on the other figure that has been transformed in a manner different from that of the one figure; c) drawing a pattern on the substrate by a drawing unit using the drawing data; Equipped with The rendering unit: a stage for holding the substrate; a head for drawing a pattern on the substrate on the stage; a moving mechanism for moving the stage relative to the head; a drawing control unit that controls the head and the moving mechanism to perform drawing on the substrate; an imaging unit that captures an image of an alignment mark formed on the substrate on the stage and acquires a captured image; Equipped with The drawing method, wherein in the step b), a deformation process is performed on the one figure based on the position of the alignment mark shown in the captured image.

9. A method for drawing a pattern, comprising the steps of: a) preparing design data indicating a pattern to be written on a substrate, the design data including a lower figure which is a pattern area, and an upper figure which is to be superimposed on the lower figure; b) performing a transformation process on one of the lower and upper figures, and generating drawing data by superimposing the transformed one figure on the other figure that is not transformed or on the other figure that has been transformed in a manner different from that of the one figure; c) drawing a pattern on the substrate by a drawing unit using the drawing data; Equipped with the substrate is one of a plurality of substrates included in a laminate substrate, the upper figure indicates a position used for aligning the substrate with respect to other substrates in manufacturing the laminate substrate; A drawing method, characterized in that in the step b), no transformation process is performed on the upper figure.

10. A method for manufacturing a laminated substrate, comprising the steps of: A method for drawing a pattern, comprising: The drawing method comprises: a) preparing design data indicating a pattern to be written on a substrate, the design data including a lower figure which is a pattern area, and an upper figure which is to be superimposed on the lower figure; b) performing a transformation process on one of the lower and upper figures, and generating drawing data by superimposing the transformed one figure on the other figure that is not transformed or on the other figure that has been transformed in a manner different from that of the one figure; c) drawing a pattern on the substrate by a drawing unit using the drawing data; Equipped with The method for producing the laminated substrate comprises: stacking a plurality of substrates including the substrate on which a pattern has been drawn by the drawing method; a step of performing a bonding process on the plurality of substrates in a state in which a plurality of holes, including a hole formed in the substrate at a position indicated by the figure, are continuous in a stacking direction in the plurality of substrates that are stacked, and a reference pin is inserted into the plurality of holes; Equipped with 2. The method for producing a laminated substrate, wherein in the step b) of the drawing method, no deformation processing is performed on the upper figure.

11. A program for causing a computer to generate drawing data used for drawing a pattern, the program being executed by a computer, the program causing the computer to: a) preparing design data indicating a pattern to be written on a substrate, the design data including a lower figure which is a pattern area, and an upper figure which is to be superimposed on the lower figure; b) performing a transformation process on one of the lower and upper figures in accordance with the transformation of the board, and generating drawing data by superimposing the transformed one figure on the other figure that is not transformed or the other figure that has been transformed in a different way from the one figure; Run the command, A program characterized in that in the step b), a lower graphic image which is raster data showing the lower graphic and an upper graphic image which is raster data showing the upper graphic are used.

12. A program for causing a computer to generate drawing data used for drawing a pattern, the program being executed by a computer, the program causing the computer to: a) preparing design data indicating a pattern to be written on a substrate, the design data including a lower figure which is a pattern area, and an upper figure which is to be superimposed on the lower figure; b) performing a transformation process on one of the lower and upper figures, and generating drawing data by superimposing the transformed one figure on the other figure that is not transformed or on the other figure that has been transformed in a manner different from that of the one figure; Run the command, a drawing unit used for drawing a pattern on the substrate, a stage for holding the substrate; a head for drawing a pattern on the substrate on the stage; a moving mechanism for moving the stage relative to the head; a drawing control unit that controls the head and the moving mechanism to perform drawing on the substrate; an imaging unit that captures an image of an alignment mark formed on the substrate on the stage and acquires a captured image; Equipped with a program for performing a transformation process on the one figure based on a position of the alignment mark shown in the captured image in the step b).

13. A program for causing a computer to generate drawing data used for drawing a pattern, the program being executed by a computer, the program causing the computer to: a) preparing design data indicating a pattern to be written on a substrate, the design data including a lower figure which is a pattern area, and an upper figure which is to be superimposed on the lower figure; b) performing a transformation process on one of the lower and upper figures, and generating drawing data by superimposing the transformed one figure on the other figure that is not transformed or on the other figure that has been transformed in a manner different from that of the one figure; Run the command, the substrate is one of a plurality of substrates included in a laminate substrate, the upper figure indicates a position used for aligning the substrate with respect to other substrates in manufacturing the laminate substrate; The program, wherein in the step b), no transformation process is performed on the upper figure.

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