Method for manufacturing deposition mask

Abstract

To provide a method for producing a vapor deposition mask with high reliability.SOLUTION: A method for producing a vapor deposition mask includes bonding, to a first face 10 of a frame 10 having an opening, a first adhesive layer 26 so as to cover the opening, selectively exposing part of the first adhesive layer 26 overlapping the frame 10 along at least the inner edge of the frame 10 in plan view, bonding a first substrate to the exposed first adhesive layer 26, and developing part of the first adhesive layer 26 with the frame 10 as a mask. The first adhesive layer 26 may be a dry film resist.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] An embodiment of the present invention relates to a method for manufacturing a deposition mask. [Background technology]

[0002] In recent years, organic EL display devices using organic EL elements as light-emitting elements have become known. The organic EL elements have a layer containing an organic EL material (hereinafter referred to as "organic EL layer") between an anode electrode and a cathode electrode. The organic EL layer includes functional layers such as a light-emitting layer, an electron injection layer, and a hole injection layer. The organic EL elements can emit light of various wavelengths by selecting the organic materials that make up the functional layers.

[0003] The vacuum deposition method is used to form thin films for organic EL elements made of low molecular weight compounds. In this method, the deposition material is heated by a heater in a vacuum to sublimate it, and then deposited (deposited) on the surface of the substrate to form a thin film. At this time, a mask (deposition mask) with many fine opening patterns is used to form a highly precise thin film pattern.

[0004] Deposition masks are divided into fine metal masks (FMM), which form an opening pattern by etching, and electro-fine forming masks (EFM), which form an opening pattern by electroforming (electrical casting). For example, Patent Document 1 discloses a method in which a mask body having a high-definition opening pattern is formed by electroforming, and the formed mask body is fixed to a frame by electroforming. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2017-210633 A Summary of the Invention [Problem to be solved by the invention]

[0006] When electroforming is used to form a metal layer constituting a deposition mask as in the technique described in Patent Document 1, the shape of the metal layer is affected by the shape of the matrix from which metal ions are precipitated. Therefore, if there is a shape defect in the matrix, the metal layer formed by electroforming also has a shape defect. Therefore, the shape defect of the matrix when forming a deposition mask using electroforming may impair the reliability of the deposition mask.

[0007] An object of one embodiment of the present invention is to provide a method for manufacturing a highly reliable deposition mask. Specifically, an object of one embodiment of the present invention is to reduce shape defects of a holding frame when forming a deposition mask by using an electroforming technique. [Means for solving the problem]

[0008] A method for manufacturing a deposition mask in one embodiment of the present invention includes adhering a first adhesive layer to a first surface of a frame body having an opening so as to cover the opening, selectively exposing a portion of the first adhesive layer that overlaps with the frame body along at least an inner edge of the frame body in a planar view, adhering a first substrate to the exposed first adhesive layer, and developing a portion of the first adhesive layer using the frame body as a mask. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view illustrating a configuration of a deposition mask according to a first embodiment of the present invention. [Diagram 2] 1 is a cross-sectional view showing a configuration of a deposition mask according to a first embodiment of the present invention. [Diagram 3] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 4] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Diagram 5] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 6]5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 7] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 8] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 9] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 10] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 11] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 12] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 13] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 14] 5A to 5C are diagrams illustrating a manufacturing method of a holding frame in the deposition mask according to the first embodiment of the present invention. [Figure 15] 1A to 1C are cross-sectional views showing a method for manufacturing the deposition mask according to the first embodiment of the present invention. [Figure 16] 1A to 1C are cross-sectional views showing a method for manufacturing the deposition mask according to the first embodiment of the present invention. [Figure 17] 1A to 1C are cross-sectional views showing a method for manufacturing the deposition mask according to the first embodiment of the present invention. [Figure 18] 1A to 1C are cross-sectional views showing a method for manufacturing the deposition mask according to the first embodiment of the present invention. [Figure 19] 1A to 1C are cross-sectional views showing a method for manufacturing the deposition mask according to the first embodiment of the present invention. [Figure 20] 1A to 1C are cross-sectional views showing a method for manufacturing the deposition mask according to the first embodiment of the present invention. [Figure 21] 1A to 1C are cross-sectional views showing a method for manufacturing the deposition mask according to the first embodiment of the present invention. [Figure 22] 1A to 1C are diagrams illustrating a part of a manufacturing method of a deposition mask of a comparative example. [Figure 23] 1A to 1C are diagrams illustrating a part of a manufacturing method of a deposition mask of a comparative example. [Figure 24] 1A to 1C are diagrams illustrating a part of a manufacturing method of a deposition mask of a comparative example. [Diagram 25] FIG. 11 is a plan view showing a configuration of a deposition mask according to a second embodiment of the present invention. [Figure 26] FIG. 4 is a cross-sectional view showing a configuration of a deposition mask according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention can be implemented in various forms without departing from the gist of the present invention, and should not be interpreted as being limited to the description of the embodiments exemplified below. In the drawings, the width, thickness, shape, etc. of each part may be shown diagrammatically compared to the actual form in order to make the explanation clearer, but these are merely examples and do not limit the interpretation of the present invention. In this specification and each drawing, elements having the same functions as those described with respect to the previous drawings may be given the same reference numerals, and duplicate explanations may be omitted.

[0011] In this specification and claims, multiple elements formed by processing a film such as etching may be described as elements having different functions or roles. These multiple elements are composed of the same layer structure and the same material, and are described as elements in the same layer.

[0012] In this specification and the claims, when describing an aspect in which a structure is placed on top of another structure, the term "on top" is used, unless otherwise specified, to include both a case in which another structure is placed directly on top of a structure so as to be in contact with the structure, and a case in which another structure is placed above a structure via yet another structure.

[0013] In this specification, unless otherwise specified, expressions such as "α includes A, B, or C," "α includes any one of A, B, and C," and "α includes one selected from the group consisting of A, B, and C" do not exclude cases where α includes multiple combinations of A to C. Furthermore, these expressions do not exclude cases where α includes other elements.

[0014] First embodiment [Configuration of deposition mask] Fig. 1 is a plan view showing a configuration of a deposition mask 100 in a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing a configuration of the deposition mask 100 in a first embodiment of the present invention. Specifically, the cross-sectional view shown in Fig. 2 shows a cross section along a line segment A-A' in Fig. 1. As shown in Figs. 1 and 2, the deposition mask 100 has a thin-film mask portion 110 formed by electroforming (electrical casting), a holding frame 120 that holds the mask portion 110, and a connection portion 130 that connects the mask portion 110 and the holding frame 120.

[0015] The mask section 110 has a plurality of panel regions 115. When evaporating the organic EL material, a substrate (not shown) is arranged so that the display region of the organic EL display device overlaps with each panel region 115. A plurality of openings 111 are provided in each panel region 115 in accordance with the pixel pitch of the organic EL display device. Regions of the mask section 110 other than the openings 111 are referred to as non-openings 112. The non-openings 112 are regions surrounding each opening 111. The non-openings 112 correspond to portions of each panel region 115 that block the evaporation material.

[0016] During deposition, the deposition mask 100 and the substrate to be deposited are aligned so that a deposition region (a region where a thin film is to be formed) of the substrate to be deposited overlaps with the opening 111, and a non-deposition region of the substrate to be deposited overlaps with the non-opening 112. Vapor of the deposition material passes through the opening 111 and reaches the substrate to be deposited, whereby the deposition material is deposited in the deposition region to form a thin film.

[0017] The holding frame 120 is provided on the outer periphery of the mask section 110 so as to surround a plurality of panel regions 115 of the mask section 110 in a plan view. That is, the holding frame 120 functions as a member that holds the thin-film-like mask section 110. Note that in FIG. 1, the holding frame 120 is provided only on the outer periphery of the mask section 110. However, this is not limiting, and the holding frame 120 may be provided in a lattice shape.

[0018] The connection portion 130 is a member that connects the mask portion 110 and the holding frame 120. In the deposition mask 100 of the present embodiment, the mask portion 110 and the holding frame 120 are connected via the connection portion 130. That is, as shown in FIG. 2, the mask portion 110 and the holding frame 120 are not directly connected to each other.

[0019] In the above configuration, the mask portion 110 is composed of a thin-film plating layer. The mask portion 110 of this embodiment is a thin film formed by electroplating. The thickness d1 of the mask portion 110 is, for example, 3 μm or more and 20 μm or less (preferably, 5 μm or more and 10 μm or less). In this embodiment, the thickness of the mask portion 110 is 5 μm. The holding frame 120 is composed of an alloy such as invar. Invar alloys have a small thermal expansion coefficient at room temperature, and therefore have the advantage of being less likely to cause stress to the mask portion 110. The thickness d2 of the holding frame 120 is, for example, 0.5 mm or more and 1.5 mm or less (preferably, 0.8 mm or more and 1.2 mm or less). In this embodiment, the thickness of the holding frame 120 is 1 mm.

[0020] In this embodiment, invar is used as the metal material constituting the mask section 110, the holding frame 120, and the connection section 130. Invar has a smaller thermal expansion coefficient at room temperature and at the temperature during the process of forming the organic EL element than nickel, and is close to the thermal expansion coefficient of glass. Therefore, by using invar as the material constituting the deposition mask 100, the influence of thermal expansion between the mask section 110 and the glass substrate can be suppressed in the manufacturing process of the deposition mask 100 described later. Also, during deposition, there is an advantage that the deviation due to thermal expansion between the deposition mask and the deposition target substrate (usually a glass substrate is used) is reduced, improving the positional accuracy of deposition. However, this is not limited to this example, and other materials other than invar may be used as long as they have a coefficient close to the thermal expansion coefficient of glass. Also, the holding frame 120 may be made of a metal material different from that of the mask section 110 and the connection section 130.

[0021] [Method of manufacturing deposition mask 100] A method for manufacturing the deposition mask 100 of the present embodiment will be described in detail with reference to the drawings. Figures 3 to 14 are diagrams illustrating a method for manufacturing the holding frame 120 of the deposition mask 100 of the first embodiment of the present invention.

[0022] 3 shows a state in which the frame body 10 is adhered onto the substrate 32 via the adhesive layer 22 during the manufacturing process of the holding frame 120. The cross-sectional view shown in FIG. 4 shows a schematic cross-section taken along line segment B-B' in FIG. 3. The substrate 32 functions as a support substrate for fixing the frame body 10. In this embodiment, a SUS substrate is used as the substrate 32. However, the present invention is not limited to this example, and the substrate 32 may be made of any material as long as it is a substrate capable of supporting the frame body 10.

[0023] In this embodiment, a film made of photosensitive resin is used as the adhesive layer 22. Specifically, a film-like material called dry film resist (DFR) is used as the adhesive layer 22. The dry film resist has a structure in which a film-like photosensitive resin (UV curing resin) is sandwiched between a protective film and a base film. Since the unexposed photosensitive resin has adhesive properties, the photosensitive resin can be used as an adhesive layer by peeling off each film. In this embodiment, the frame body 10 is bonded to the substrate 32 using the adhesive properties of the unexposed photosensitive resin. The thickness of the adhesive layer 22 is preferably 80 μm or more and 120 μm or less. In this embodiment, the thickness of the adhesive layer 22 is 100 μm.

[0024] The frame body 10 corresponds to the main body portion of the holding frame 120 shown in Figs. 1 and 2. As shown in Fig. 3, the frame body 10 has a rectangular outer shape and has an opening 15 on the inside. That is, the frame body 10 has a shape like a picture frame. As described above, in this embodiment, the frame body 10 is a metal member made of Invar. In the following description, of the main surfaces of the frame body 10 shown in Fig. 4, the surface farther from the adhesive layer 22 is referred to as the first surface 10a, and the surface closer to the adhesive layer 22 is referred to as the second surface 10b.

[0025] After the frame body 10 is bonded to the substrate 32, a part of the adhesive layer 22 is developed using the frame body 10 as a mask, as shown in Fig. 5. Specifically, the adhesive layer 22 is immersed in a developer and dissolved, thereby selectively removing the adhesive layer 22 from the portion that does not overlap with the frame body 10. After the adhesive layer 22 is selectively removed, the substrate 32 is removed, as shown in Fig. 6. The substrate 32 is removed by mechanically peeling the substrate 32 from the frame body 10. By the process shown in Figs. 5 and 6, a state in which the adhesive layer 22 is selectively provided only on the second surface 10b of the frame body 10 can be obtained.

[0026] 7, the entire surface of the adhesive layer 22 is irradiated with UV light (ultraviolet light) 42 to expose the adhesive layer 22. As a result, the adhesive layer 22 is polymerized and changed into a cured resin layer 22a. The cured resin layer 22a is resistant to a developer and does not have adhesiveness. In this embodiment, the cured resin layer 22a functions as a protective layer that protects the second surface 10b of the frame body 10.

[0027] After the cured resin layer 22a is formed on the second surface 10b of the frame body 10, the frame body 10 is then bonded to the substrate 34 via the adhesive layer 24 as shown in FIG. 8. Then, the adhesive layer 26 is bonded to the first surface 10a of the frame body 10. The adhesive layer 26 is placed on the frame body 10 and bonded to cover the opening 15. The substrate 34 is made of a SUS substrate, similar to the substrate 32. The adhesive layer 24 and the adhesive layer 26 are made of a dry film resist (specifically, a photosensitive resin film), similar to the adhesive layer 22. At this point, a base film may be left on the side of the adhesive layer 26 that does not face the first surface 10a of the frame body 10, that is, the upper surface in FIG. 8. The thickness of the adhesive layer 26 provided on the first surface 10a of the frame body 10 may be thinner than the thickness of the adhesive layer 22 provided on the second surface 10b of the frame body 10.

[0028] FIG. 9 shows a state in which the adhesive layer 26 is bonded onto the frame body 10 in the manufacturing process of the holding frame 120. The cross-sectional view shown in FIG. 10 is a schematic cross-section taken along the line C-C' in FIG. 9. In this embodiment, as shown in FIGS. 9 and 10, UV light 44 is irradiated along the frame body 10 to selectively expose a part of the adhesive layer 26. Specifically, a part of the adhesive layer 26 that overlaps with the frame body 10 is selectively exposed along the outer edge 10c and the inner edge 10d of the frame body 10 in a plan view. As a result, an exposed cured resin region 26a is formed in the adhesive layer 26. That is, as shown in FIG. 10, the cured resin region 26a is formed overlapping the end of the frame body 10. Note that, in this embodiment, an example in which the exposure process is performed along the outer edge 10c and the inner edge 10d of the frame body 10 has been shown, but the present invention is not limited to this example, and the exposure process may be performed along at least the inner edge 10d of the frame body 10.

[0029] In this embodiment, in order to selectively expose a portion of the adhesive layer 26, it is preferable to irradiate the UV light 44 by a direct writing method. This allows the UV light 44 to be directly irradiated along the frame body 10. In this embodiment, the UV light 44 is irradiated to a portion of the adhesive layer 26 that overlaps with the frame body 10 and is located within a range of 50 μm to 100 μm from the edge (outer edge or inner edge) of the frame body 10. However, the range to which the UV light 44 is irradiated may be appropriately determined taking into consideration the width of the frame body 10.

[0030] The exposure amount of the UV light 44 in the process shown in Fig. 10 is preferably smaller than the exposure amount of the UV light 42 in the process shown in Fig. 7. Specifically, the exposure amount of the UV light 44 is preferably 1 / 100 to 1 / 10 of the exposure amount of the UV light 42. For example, the exposure amount of the UV light 44 is 5 mJ / cm 2 More than 50mJ / cm 2 Less than or equal to 5 mJ / cm 2 More than 30mJ / cm 2 As described below, the adhesive layer 26 needs to maintain its adhesive force when the holding frame 120 is bonded to the mask part 110. Therefore, it is desirable to suppress the exposure amount of the UV light 44 in the process shown in Fig. 10 as much as possible so that the adhesive force remains in the cured resin region 26a.

[0031] In addition, in FIG. 10, the cured resin region 26a is shown to have a boundary along the outer edge 10c and the inner edge 10d of the holding frame 10, but is not limited to this shape. For example, the cured resin region 26a may be formed to slightly protrude in a region that does not overlap with the holding frame. Conversely, the boundary between the cured resin region 26a and the unexposed adhesive layer 26 may be located slightly inside the outer edge 10c and the inner edge 10d of the holding frame. The cured resin region 26 may be formed over the entire region in the thickness direction of the adhesive layer 26 in the vicinity of the outer edge 10c and the inner edge 10d of the holding frame 10. In addition, the unexposed adhesive layer 26 may be located in a region that overlaps with the holding frame 10 and between the cured resin regions 26a provided in the vicinity of the outer edge 10c and the inner edge 10d of the holding frame 10.

[0032] Next, as shown in Fig. 11, a substrate 36 is bonded to the adhesive layer 26. A SUS substrate is used as the substrate 36, similar to the substrate 32. The cured resin region 26a of the adhesive layer 26 loses its adhesiveness due to exposure, but the portion other than the cured resin region 26a (unexposed portion) maintains its adhesiveness. Therefore, the unexposed portion of the adhesive layer 26 can be used to bond the substrate 36 to the frame body 10.

[0033] After the substrate 36 is adhered to the frame body 10, the substrate 34 and the adhesive layer 24 are removed, as shown in Fig. 12. The substrate 36 is removed by mechanically peeling the substrate 36 and the adhesive layer 24 from the frame body 10.

[0034] After removing the substrate 36 and the adhesive layer 24, as shown in Fig. 13, a part of the adhesive layer 26 is developed using the frame body 10 as a mask. Specifically, the adhesive layer 26 is immersed in a developer to dissolve it, thereby selectively removing the adhesive layer 26 from the part that does not overlap with the frame body 10. At this time, the cured resin region 26a of the adhesive layer 26 is not dissolved by the developer, so that etching in the lateral direction by the developer can be prevented. After development, the cured resin region 26a and the unexposed portion 26b of the adhesive layer 26 remain in the part where the frame body 10 and the substrate 36 overlap in a plan view.

[0035] After the adhesive layer 26 is selectively removed, the substrate 36 is removed as shown in Fig. 14. The substrate 36 is removed by mechanically peeling the substrate 36 from the frame body 10. This results in a state in which the adhesive layer 26 is selectively provided on the first surface 10a of the frame body 10. As shown in Fig. 7, a cured resin layer 22a is provided on the second surface 10b of the frame body 10.

[0036] The manufacturing process described above completes the holding frame 120. The holding frame 120 has the same shape as the frame body 10 shown in Fig. 3. That is, the holding frame 120 has a rectangular outer shape and has an opening 15 on the inside.

[0037] Next, a method for manufacturing the deposition mask 100 using the above-described holding frame 120 will be described with reference to FIGS.

[0038] 15 to 21 are diagrams illustrating a method for manufacturing the deposition mask 100 according to the first embodiment of the present invention. First, as shown in FIG.

[0039] In this embodiment, a SUS substrate is used as the substrate 200. However, the present invention is not limited to this example, and the substrate 200 may be a glass substrate or a ceramic substrate.

[0040] The seed layer 210 is a metal layer provided for growing a plating layer. In this embodiment, a nickel alloy (specifically, Invar) is used as the material for the plating layer 230 described later, so a metal layer containing copper (Cu) is used as the seed layer 210. However, the present invention is not limited to this example, and other metal layers may be used as long as they can function as a seed layer.

[0041] The seed layer 210 may be formed by using a sputtering method or a CVD (Chemical Vapor Deposition) method. The seed layer 210 may have a thickness that ensures the electrical conductivity required for growing the plating layer 230 described below. For example, the seed layer 210 may have a thickness in the range of 50 nm to 500 nm.

[0042] The resist mask 220 is formed by applying a photosensitive resin material onto the seed layer 210, followed by exposure and development (etching) processes. The region where the resist mask 220 is formed corresponds to the region where the multiple openings 111 of the mask portion 110 shown in FIGS. 1 and 2 are provided. In this embodiment, exposure and etching are performed so that the sidewalls of the resist mask 220 are tapered. Specifically, as shown in FIG. 15, the resist mask 220 in cross-sectional view has a narrower width in the portion closer to the seed layer 210.

[0043] 16, a plating layer 230 is formed in an area where the resist mask 220 is not disposed. That is, the area where the plating layer 230 is formed corresponds to an area where the non-openings 112 of the mask portion 110 shown in FIGS. 1 and 2 are provided. In this embodiment, before the plating layer 230 is formed, a pretreatment is performed on the surface of the seed layer 210 using a mold release agent. As the mold release agent, for example, Nikkanontack (registered trademark) by Nippon Chemical Industry Co., Ltd. may be used.

[0044] In this embodiment, the plating layer 230 is a metal layer made of a nickel alloy (specifically, Invar). In this embodiment, electroplating is performed by passing a current through the seed layer 210 in an aqueous solution containing metal ions of the nickel alloy. When the seed layer 210 is passed through, the plating layer 230 is formed on the surface of the seed layer 210. The thickness of the plating layer 230 can be adjusted by controlling the time of electroplating. In this embodiment, the thickness of the plating layer 230 is adjusted in the range of 3 μm to 20 μm. Specifically, in this embodiment, the thickness of the plating layer 230 is set to 5 μm. The thickness of the plating layer 230 determines the thickness of the mask portion 110 shown in FIG. 1 and FIG. 2. In this embodiment, an example in which the plating layer 230 is formed of Invar has been shown, but the present invention is not limited to this example, and other metal materials may be used as long as they are usable for electroplating.

[0045] After forming the plating layer 230, the resist mask 220 is removed as shown in Fig. 17. By removing the resist mask 220, the openings 111 shown in Fig. 1 and Fig. 2 are formed in the plating layer 230. That is, the plating layer 230 remaining in the state shown in Fig. 17 corresponds to the non-openings 112 in Fig. 1 and Fig. 2. That is, in the state shown in Fig. 17, a mask portion 110 having the openings 111 and the non-openings 112 is formed.

[0046] Next, the holding frame 120 is placed on a part of the non-opening portion 112 (a part not used as the mask portion 110). Although not shown in FIG. 17, the holding frame 120 has an adhesive layer 26 on the first surface 10a of the frame main body 10, and a cured resin layer 22a on the second surface 10b of the frame main body 10, as shown in FIG. 14. The holding frame 120 is adhered onto the non-opening portion 112 by utilizing the adhesive force of the adhesive layer 26. The holding frame 120 is placed so as to surround the mask portion 110, as shown in FIG.

[0047] 18, a resist mask 240 is formed on the mask portion 110 and the holding frame 120. The resist mask 240 is formed by applying a photosensitive resin material onto the mask portion 110 and the holding frame 120, and then performing an exposure process and a development (etching) process. The region where the resist mask 240 is formed is a region other than the region where the connection portion 130 shown in FIGS. 1 and 2 is provided.

[0048] Next, as shown in FIG. 19, the connection portion 130 is formed in the region where the resist mask 240 is not arranged. The connection portion 130 is formed by electroplating. Specifically, the connection portion 130 is selectively formed in the region where the resist mask 240 is not arranged, using the holding frame 120, the non-opening portion 112, and the seed layer 210 as a seed layer. Therefore, as shown in FIG. 19, the connection portion 130 is formed from the side wall of the holding frame 120 across the mask portion 110. After the formation of the connection portion 130 is completed, the resist mask 240 is removed.

[0049] In this embodiment, the connection portion 130 is continuously formed from the side wall of the holding frame 120 to the top of the mask portion 110. This allows the holding frame 120 and the mask portion 110 to be connected via the connection portion 130. An opening 113 provided in a portion of the mask portion 110 that overlaps with the connection portion 130 serves to physically separate the mask portion 110 and the holding frame 120, and to improve the adhesion between the mask portion 110 and the connection portion 130.

[0050] In this embodiment, the connection part 130 is formed of a plating layer (metal layer) made of a nickel alloy (specifically, Invar). In this embodiment, the thickness of the connection part 130 is adjusted in the range of 50 nm to 200 nm. In this embodiment, an example in which the connection part 130 is made of Invar has been shown, but the present invention is not limited to this example, and other metal materials may be used as long as they are materials that can be used for electroplating.

[0051] After the connection portion 130 is formed, the substrate 200 is then removed as shown in Fig. 20. Specifically, the holding frame 120 is fixed by suction or the like, and then the substrate 200 is removed by mechanically peeling the substrate 200 from the mask portion 110, the holding frame 120, and the connection portion 130. At this time, the seed layer 210 and a part of the mask portion 110 (non-opening portion 112 overlapping the holding frame 120) are removed together with the substrate 200.

[0052] Through the above manufacturing process, a deposition mask 100 having a cross-sectional structure shown in Fig. 21 is completed. As shown in Fig. 21, the deposition mask 100 of the present embodiment has a structure in which a thin mask portion 110 is connected to a holding frame 120 via a connection portion 130.

[0053] As mentioned above, mask portion 110 and connection portion 130 are formed by electroplating, which imparts conductivity to seed layer 210. However, if substrate 200 itself is made of a conductive material or if at least the surface of substrate 200 is conductive, seed layer 210 does not need to be provided.

[0054] On the other hand, the seed layer 210 may be provided as a buffer layer to prevent the mask portion 110 from being damaged due to mechanical action when the mask portion 110 is peeled off from the substrate 200 .

[0055] [Explanation of Comparative Example] Fig. 22 is a diagram showing a part of a method for manufacturing a deposition mask of a comparative example. The process shown in Fig. 22 corresponds to the process shown in Fig. 13 of the above-mentioned embodiment. That is, Fig. 22 shows a process of developing a part of the adhesive layer 26 using the frame body 10 as a mask. Here, in the comparative example, the process shown in Fig. 10 in the above-mentioned embodiment is omitted. That is, in the comparative example, the exposure process for the part of the adhesive layer 26 described with reference to Fig. 10 is not performed, and the entire adhesive layer 26 is unexposed.

[0056] In the process shown in FIG. 22, during development, the developer dissolves the adhesive layer 26 isotropically, so that etching also progresses in the lateral direction. Furthermore, if the adhesion between the adhesive layer 26 and the substrate 36 is insufficient, the developer may penetrate into the interface where the adhesive layer 26 and the substrate 36 contact each other. In this case, as shown in the enlarged view within the framed area in FIG. 22, a wedge-shaped recess 20 is formed between the adhesive layer 26 and the substrate 36. In other words, the adhesive layer 26 remains on the first surface 10a of the frame body 10 in a shape in which the thickness becomes thinner toward the end.

[0057] 23 and 24 are diagrams showing a part of a method for manufacturing a deposition mask of a comparative example. Specifically, Fig. 23 and Fig. 24 show a part of a method for manufacturing a deposition mask using a holding frame 125 manufactured through the process shown in Fig. 22. The process shown in Fig. 23 corresponds to the process shown in Fig. 19 of the above-mentioned embodiment. That is, Fig. 23 shows a process for forming a connection portion 135 between the holding frame 125 and the mask portion 110 by electroplating.

[0058] As described with reference to FIG. 22, the holding frame 125 has a shape in which the adhesive layer 26 becomes thinner toward the end. Therefore, when the adhesive layer 26 is used to adhere the holding frame 125 to the non-opening 112 of the mask part 110, a gap is generated between the adhesive layer 26 and the non-opening 112. Therefore, when the connection part 135 is formed by electroplating, a plating layer is also formed in the gap. As a result, a protrusion 135a is formed inside the gap, protruding from the connection part 135 downward of the holding frame 125.

[0059] The process shown in Fig. 24 corresponds to the process shown in Fig. 20 of the above-mentioned embodiment. That is, Fig. 24 shows a process of removing the substrate 200 by peeling the substrate 200 from the mask portion 110, the holding frame 125, and the connection portion 135. In this process, the seed layer 210, a part of the mask portion 110 (non-opening portion 112 overlapping with the holding frame 120), and the adhesive layer 26 are removed together with the substrate 200.

[0060] At this time, when the substrate 200 is mechanically peeled off, the adhesive layer 26 is caught by the protruding portion 135a shown in FIG. 23, and the protruding portion 135a is deformed. Therefore, for example, as shown in the enlarged view within the framed line in FIG. 24, the deformed protruding portion 135a may protrude in an unintended direction. In the example shown in FIG. 24, the deformed protruding portion 135a may protrude below the contact surface 110a of the mask portion 110 that contacts the deposition target (for example, a display panel under manufacture). In other words, if such a protruding portion 135a is left, the protruding portion 135a may scratch the non-deposition target when the deposition mask and the deposition target are superimposed.

[0061] In addition, a process for removing the protrusion 135a can be added to the manufacturing process of the deposition mask. However, adding a process for removing the protrusion 135a increases the number of processes and the lead time of the entire manufacturing process. Furthermore, there is a risk that the deposition mask may be damaged during the process for removing the protrusion 135a.

[0062] The manufacturing method of the deposition mask 100 of this embodiment is different from the manufacturing method of the deposition mask described as the comparative example in that the adhesive layer 26 disposed on the first surface 10a of the frame body 10 does not have a shape in which the thickness decreases toward the end. That is, according to the manufacturing method of the deposition mask 100 shown in this embodiment, it is possible to prevent the formation of a protrusion when forming the connection portion 130.

[0063] Specifically, in the method for manufacturing the deposition mask 100 of the present embodiment, as shown in Fig. 10, a part of the adhesive layer 26 overlapping with the frame body 10 is selectively exposed along the outer edge 10c and the inner edge 10d of the frame body 10 in a plan view. This forms a cured resin region 26a at the end of the adhesive layer 26. This cured resin region 26a prevents etching in the lateral direction in the development process shown in Fig. 13, and therefore it is possible to prevent the shape of the adhesive layer 26 from being changed.

[0064] As described above, according to the manufacturing method of the deposition mask 100 of the present embodiment, when the connection portion 130 is formed, it is possible to prevent the formation of a protrusion protruding from the connection portion 130. Therefore, when the substrate 200 is finally peeled off from the mask portion 110, the holding frame 120, and the connection portion 130, the formation of a protrusion as shown in the comparative example is prevented. In this way, according to the manufacturing method of the deposition mask 100 of the present embodiment, it is possible to manufacture a deposition mask with high reliability.

[0065] Second Embodiment In this embodiment, a deposition mask 100A having a different configuration from that of the first embodiment will be described. FIG. 25 is a plan view showing the configuration of the deposition mask 100A in the second embodiment of the present invention. FIG. 26 is a cross-sectional view showing the configuration of the deposition mask 100A in the second embodiment of the present invention. The deposition mask 100A in this embodiment has the same structure as the deposition mask 100 in the first embodiment except that the arrangement of the holding frame 120 and the connection portion 130 is different. Therefore, the same elements as those in the first embodiment are denoted by the same reference numerals and detailed description thereof will be omitted.

[0066] 25 and 26, in the deposition mask 100A, the holding frame 120 is provided in a lattice shape on the mask portion 110. That is, the mask portion 110 is supported by the holding frame 120 provided in a lattice shape. As in the first embodiment, the mask portion 110 is connected to the holding frame 120 via a connection portion 130.

[0067] As described above, in this embodiment, a lattice-shaped metal member is used as the holding frame 120, rather than a rectangular metal member. Therefore, the effect on the mask portion 110 when removing the substrate 200 can be reduced more than in the first embodiment.

[0068] The above-described embodiments of the present invention may be combined as appropriate as long as they are not mutually inconsistent. A method for manufacturing a deposition mask according to any of the embodiments may be implemented by a person skilled in the art by adding or deleting components or modifying the design, or by adding or omitting a step or modifying conditions, as appropriate, as long as the method includes the gist of the present invention.

[0069] Furthermore, even if there are other effects and advantages different from those brought about by the aspects of each of the above-mentioned embodiments, those that are clear from the description in this specification or that can be easily predicted by a person skilled in the art are naturally understood to be brought about by the present invention. [Explanation of symbols]

[0070] 10...frame body, 10a...first surface, 10b...second surface, 10c...outer edge, 10d...inner edge, 15...opening, 20...recess, 22, 24, 26...adhesive layer, 22a...cured resin layer, 26a...cured resin area, 26b...unexposed area, 32, 34, 36...substrate, 42, 44...UV light, 100, 100A...evaporation mask, 110...mask portion, 110a...contact surface, 111...opening, 112...non-opening, 115...panel area, 120, 125...holding frame, 130, 135...connection portion, 135a...protruding portion, 200...substrate, 210...seed layer, 220...resist mask, 230...plating layer, 240...resist mask

Claims

1. a first adhesive layer is adhered to a first surface of a frame body having an opening so as to cover the opening; Selectively exposing a portion of the first adhesive layer that overlaps with the frame body along at least an inner edge of the frame body in a plan view; A first substrate is bonded to the exposed first adhesive layer; developing a portion of the first adhesive layer using the frame body as a mask; forming a mask portion having a plurality of openings on a support substrate by electroplating; The frame body is adhered onto the mask portion via the first adhesive layer; forming a connection portion that connects the mask portion and the frame body to each other by electroplating; removing the support substrate and the first adhesive layer.

2. The method for manufacturing a deposition mask according to claim 1 , wherein the first adhesive layer is made of a photosensitive resin.

3. The method for manufacturing a deposition mask according to claim 1 , wherein the part of the first adhesive layer is a part that overlaps with the frame body and is located within a range of 50 μm to 100 μm from an edge of the frame body.

4. The method for manufacturing a deposition mask according to claim 1 , wherein selectively exposing a portion of the first adhesive layer includes irradiating the portion with ultraviolet light by a direct writing method.

5. The method for manufacturing a deposition mask according to claim 1 , further comprising selectively exposing a portion of the first adhesive layer that overlaps with the frame body along an outer edge of the frame body in a plan view.

6. Before bonding the first adhesive layer to the first surface of the frame body, a second substrate is bonded to a second surface of the frame body opposite to the first surface via a second adhesive layer so as to cover the opening; developing a portion of the second adhesive layer using the frame body as a mask; The method for producing a deposition mask according to claim 1 , further comprising exposing the second adhesive layer to light after removing the second substrate.

7. The method for manufacturing a deposition mask according to claim 6 , wherein the second adhesive layer is made of a photosensitive resin.

8. The method for manufacturing a deposition mask according to claim 6 , wherein exposing the second adhesive layer includes irradiating an entire surface of the second adhesive layer with ultraviolet light.

9. The method for manufacturing a deposition mask according to claim 6 , wherein an exposure amount when the part of the first adhesive layer is selectively exposed is 1 / 100 to 1 / 10 of an exposure amount when the second adhesive layer is exposed.

10. The exposure dose when a portion of the first adhesive layer is selectively exposed is 5 mJ / cm 2 50mJ or more / cm 2 The method for producing a deposition mask according to claim 6 , wherein:

11. The method for manufacturing a deposition mask according to claim 6 , wherein a thickness of the first adhesive layer is smaller than a thickness of the second adhesive layer.

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