Electronic Circuits and Circuit Boards

By designing a specific wire structure on the circuit board and changing the band characteristics of the EBG structure using the length and connection method of the wire, the problem of difficulty in dynamically adjusting the noise reduction band in the prior art is solved, and flexible adjustment and effective suppression of the noise band are achieved.

JP7658132B2Active Publication Date: 2025-04-08FUJIFILM BUSINESS INNOVATION CORP
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Patent Information

Application Number
JP2021049376
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-03-24
Publication Date
2025-04-08
Estimated Expiration
2041-03-24

AI Technical Summary

Technical Problem

The prior art is difficult to realize that the electronic circuit itself changes the noise reduction frequency band to adapt to the noise frequency changes in different environments.

Method used

By designing specific wire structures on the circuit board, including wire posts and wires at the open ends, the length and connection of these wires are used to change the frequency band characteristics of the EBG structure, thereby achieving dynamic adjustment of the noise band.

Benefits of technology

The electronic circuit itself has realized the ability to change the noise reduction frequency band, adapt to the noise frequency changes in different environments, and improves the flexibility and effectiveness of noise suppression.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide an electronic circuit capable of changing a noise reduction frequency band of the electronic circuit, in which electromagnetic wave noise is reduced, by the electronic circuit itself, and a circuit board.SOLUTION: A circuit board 10 has a ground 11, a stub 13 and a via 12 formed. The stub 13 is constituted as a first conductor line 131 and a second conductor line 132. The first conductor line 131 has one end part 131a connected to the via 12, and also has an end part 131b, apart from the via 12, opened. At this end part 131b, a pad 21 for connection with the second conductor line 132 is formed. The second conductor line 132 has one end part 132a located in proximity to the end part 131b of the first conductor line 131. The second line 132 has both end parts 132a, 132b opened. Further, a pad 22 for connection with the first conductor line 131 is formed at the end part 132a of the second conductor line 132.SELECTED DRAWING: Figure 5
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Description

[Technical field]

[0001] The present invention relates to electronic circuits and circuit boards. [Background technology]

[0002] A technique is known for suppressing the propagation of electromagnetic noise by using an EBG (Electromagnetic Band Gap) structure formed on a circuit board.

[0003] For example, Patent Document 1 discloses an EBG structure that employs a spiral shape to achieve miniaturization.

[0004] Furthermore, Patent Document 2 discloses an EBG structure in which island conductors are formed to impart capacitance and thereby widen the frequency band in which noise is reduced.

[0005] Moreover, Patent Document 3 discloses an EBG structure in which adjacent small metal plates are connected via a capacitor to reduce power consumption.

[0006] Furthermore, Cited Document 4 proposes placing a circuit board equipped with an EBG structure and a shielding case around the circuit board, and changing the shielding case to one with a different shape to change the frequency band for noise reduction. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2014-197877 A [Patent Document 2] International Publication No. 2014 / 006796 [Patent Document 3] JP 2008-288770 A [Patent Document 4] JP 2015-179699 A Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide an electronic circuit that can change the noise reduction frequency band of the electronic circuit that reduces electromagnetic noise by itself, and a circuit board on which the electronic circuit is mounted. [Means for solving the problem]

[0009] First aspect The invention relates to a conductor post extending in a stacking direction and connected to a ground of a first layer of a plurality of conductor layers stacked at a distance from each other; a first conductor line that is connected to the conductor rod in a second layer different from the first layer among the plurality of conductor layers, extends in a strip shape, and has an open end at an end remote from the conductor rod; a second conductor line extending in a strip shape in any one of the plurality of conductor layers; the first conductor line and the second conductor line each have at least one adjacent portion constituting a pair of adjacent portions that are adjacent to each other and connectable to each other; an electronic circuit, characterized in that a first end of the second conductor line, which is away from the adjacent portion formed on the second conductor line, is an open end.

[0010] Second aspect The invention according to the present invention is characterized in that the adjacent portion is Conductive Layer The insulating layer is formed on the surface layer of the insulating layer or extends to the surface layer in the lamination direction. First aspect 2 is an electronic circuit according to the present invention.

[0011] Third aspect The present invention is characterized in that the pair of adjacent portions are short-circuited to each other. Second aspect 2 is an electronic circuit according to the present invention.

[0012] Fourth Aspect The present invention is characterized in that the first conductor line is a conductor line having an end portion other than the open end connected to the conductor pole. First aspect from Third aspect Of Any one of the following 2 is an electronic circuit according to the present invention.

[0013] Fifth Aspect The present invention is characterized in that the adjacent portion of the first conductor line is formed at the open end of the first conductor line. Fourth Aspect 2 is an electronic circuit according to the present invention.

[0014] Sixth Aspect The present invention is characterized in that the adjacent portion of the second conductor line is formed at a second end portion different from the first end portion of the second conductor line. Fifth Aspect 2 is an electronic circuit according to the present invention.

[0015] Seventh Aspect The present invention is characterized in that the second conductor line extends in a shape that follows the shape in which the first conductor line extends. Sixth Aspect 2 is an electronic circuit according to the present invention.

[0016] Eighth Aspect The present invention is characterized in that both the first conductor line and the conductor line formed by combining the first conductor line and the second conductor line when connected to the first conductor line are conductor lines that extend while bending continuously or intermittently in the same rotational direction from one end to the other end. Seventh Aspect 2 is an electronic circuit according to the present invention.

[0017] Ninth Aspect The invention relates to First aspect from Eighth Aspect Of Any one of the following 2. A circuit board comprising the electronic circuit according to claim 1 mounted thereon.

[0018] Tenth Aspect The present invention is characterized in that a plurality of the electronic circuits are mounted. Ninth Aspect 2. The circuit board according to claim 1 . Effect of the Invention

[0019] First aspect Electronic circuits and Ninth Aspect , Tenth Aspect According to the circuit board, it is possible to change the frequency band in which the propagation of electromagnetic noise is suppressed by the electronic circuit itself.

[0020] Second aspect According to this electronic component, the adjacent portions can be connected to each other more easily than in a case where the adjacent portions are not present on the surface layer.

[0021] Third aspect According to this electronic component, the conductor line length can be changed simply.

[0022] Fourth Aspect According to this electronic component, for the same conductor line length, it is possible to minimize the frequency band in which the propagation of electromagnetic noise is suppressed.

[0023] Fifth Aspect According to the electronic component of No. 6, it is effective in lowering the frequency band in which the propagation of electromagnetic noise is suppressed.

[0024] Seventh Aspect According to the electronic component, by connecting adjacent portions to each other, it is possible to lower the frequency band in which the propagation of electromagnetic noise is suppressed while suppressing changes in the frequency characteristic pattern.

[0025] Eighth Aspect The electronic component of this invention is smaller in size than electronic components having a shape other than a spiral shape.

[0026] Ninth Aspect , Tenth Aspect According to the circuit board, it is possible to change the frequency band in which the propagation of electromagnetic noise is suppressed by the electronic circuit itself. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1 is a schematic diagram showing an example of one unit circuit constituting a conventional EBG structure. [Diagram 2] This is a distributed constant circuit that is the equivalent circuit of the EBG structure. [Diagram 3] FIG. 13 is a diagram showing frequency characteristics of admittance Y. [Figure 4] 1A to 1C are schematic diagrams showing EBG structures of various shapes. [Diagram 5] 1 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a first embodiment of the present invention. [Figure 6] FIG. 11 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a second embodiment of the present invention. [Figure 7] FIG. 13 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a third embodiment of the present invention. [Figure 8] FIG. 13 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a fourth embodiment of the present invention. [Figure 9] FIG. 13 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a fifth embodiment of the present invention. [Figure 10] 13A and 13B are diagrams illustrating an embodiment having a conductor line having a shape other than a spiral shape. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Here, we will first explain the EBG structure (Electromagnetic Band Gap Structure). The EBG structure is a periodic structure with a frequency band (band gap) that suppresses the propagation of electromagnetic waves. By forming an EBG structure near an electronic circuit that emits electromagnetic noise on a circuit board, the propagation of the electromagnetic noise emitted from the electronic circuit is suppressed.

[0029] FIG. 1 is a schematic diagram showing an example of one unit circuit constituting a conventional EBG structure.

[0030] Here, a circuit board having multiple conductor layers is used, and the first of the multiple layers is a ground 11. A conductor column called a via 12 is formed here, which is connected to the first layer, the ground 11, and extends in the stacking direction. A conductor line called a stub 13 is formed here, which extends in a spiral shape in a second layer different from the first layer. One end 13a of the stub 13 is connected to the via 12. An end 13b of the stub 13, which is away from the via 12, is an open end that is not directly connected to other conductors. An EBG structure is formed by arranging a plurality of unit structures such as those shown in FIG. 1 on a circuit board.

[0031] 1 is not a spiral shape made up of curves, but a conductor line that extends from one end connected to via 12 to the other end while bending intermittently in the same rotational direction. Specifically, stub 13 is a conductor line that extends while bending intermittently at 90° increments in the same rotational direction. Here, the term "spiral shape" includes not only a spiral shape made up of a continuous curve, but also a shape that extends while bending intermittently, for example, at 45° or 90° increments.

[0032] Figure 2 shows a distributed constant circuit that is an equivalent circuit of the EBG structure.

[0033] The equivalent circuit of the EBG structure is expressed as the distributed constant circuit shown in Figure 2. Here, inductance L1 and capacitance C1 are the inductance and capacitance of the transmission line, respectively. Of these, inductance L1 is not very related to the frequency characteristics that suppress electromagnetic noise radio waves, while the part surrounded by the dashed line is related to those frequency characteristics. The admittance Y of the part surrounded by the dashed line is given by

[0034]

number

[0035] Fig. 3 is a diagram showing the frequency characteristics of admittance Y. The vertical axis of Fig. 3 represents the imaginary component Im(Y) of admittance Y, and the horizontal axis represents frequency (GHz).

[0036] The region where Im(Y) is negative, shown by hatching in Fig. 3, is called the inductance region, and the positive region is called the capacitance region. In this EBG structure, the propagation of electromagnetic noise of frequencies within the inductance region, i.e., the frequency region where Im(Y) is negative, is suppressed. Here, the frequency region where Im(Y) is negative is related to the length of stub 13, and the longer the length of stub 13, the more the frequency characteristic pattern shifts to the lower frequency side, and the shorter the length of stub 13, the more the frequency characteristic pattern shifts to the higher frequency side.

[0037] FIG. 4 is a schematic diagram showing EBG structures of various shapes.

[0038] Figure 4(A) shows an EBG structure in which multiple units each having the spiral-shaped stub 13 described above are arranged. As in Figure 1, the stub 13 shown here is a conductor line that extends from one end connected to the via 12 to the other end while intermittently bending at 90° in the same direction of rotation, but the EBG structure can be formed in any spiral shape as long as it is a spiral shape as defined above.

[0039] 4B shows an EBG structure in which a plurality of units each having a so-called meander-shaped stub 13 that extends back and forth from side to side are arranged. In this Fig. 5B, a meander shape is shown in which the direction of extension is reversed by bending twice at 90° in the same rotation direction, but the present invention is not limited to this. For example, the shape may be reversed while drawing a curve, or the shape may be reversed by bending four times at 45°. One end 13a of the stub 13 of each unit is connected to the via 12 of each unit. Each stub 13 extends in a meander shape, and the end 13b on the side away from the via 12 is an open end.

[0040] 4(C) shows an EBG structure in which multiple units are arranged, each having a linearly extending stub 13. One end 13a of the stub 13 of each unit is connected to the via 12 of each unit. Each stub 13 extends linearly, and the end 13b on the side away from the via 12 is an open end.

[0041] As shown in these examples, stubs 13 of various shapes can be used in the EBG structure. However, the length from the point where stub 13 is connected to via 12 to the open end is related to the frequency of the noise whose propagation is suppressed, and a long stub is required to suppress low-frequency noise. Therefore, in order to suppress low-frequency noise, it is advantageous in terms of miniaturization to form stub 13 in a spiral shape with one end 13a connected to via 12.

[0042] Based on the above explanation of the EBG structure, an embodiment of the present invention will be described below.

[0043] Fig. 5 is a diagram showing one unit circuit of an EBG structure constituting an electronic circuit according to a first embodiment of the present invention. In this embodiment, the EBG structure is formed by arranging a plurality of units shown in Fig. 5 on a circuit board.

[0044] Here, as in the conventional example shown in FIG. 1, a circuit board 10 having a plurality of conductor layers is adopted, and the first layer of the plurality of layers is the ground 11. Here, a conductor column called a via 12 is formed, which is connected to the first layer, the ground 11, and extends in the stacking direction. Here, a conductor line called a stub 13 is formed in a second layer different from the first layer, and extends in a spiral shape. In this embodiment, a surface layer formed on the surface of the circuit board 10 is adopted as the second layer. In this embodiment, a spiral shape that extends while changing direction by 90° is adopted as the conductor line. However, it is not limited to a spiral shape that extends while changing direction by 90°, and it is sufficient that the conductor line extends while bending continuously or intermittently in the same rotation direction from one end to the other end as defined above.

[0045] The stub 13 is composed of a first conductor line 131 and a second conductor line 132 .

[0046] One end 131a of the first conductor line 131 is connected to the via 12 and extends in a spiral shape toward the other end. An end 131b of the first conductor line 131 away from the via 12 is open, that is, an open end that is not directly connected to another conductor. A pad 21 for connection to a second conductor line is formed on this end 131b.

[0047] Moreover, one end 132a of the second conductor line 132 is located close to end 131b of the first conductor line 131 on the side farther from the via 12, and extends in a shape inheriting the spiral shape of the first conductor line 131. That is, the shape of the first conductor line 131 and the second conductor line 132 combined is also a spiral shape that is a direct extension of the spiral shape of the first conductor line 131. Both ends 132a, 132b of the second conductor line 132 are open ends. Furthermore, a pad 22 for connection to the first conductor line 131 is formed on end 132a of the second conductor line 132 close to end 131b of the first conductor line 131.

[0048] Further, a protective film (not shown) called a resist is formed on the surface of the circuit board 10, but the protective film is not formed around the pads 21 and 22. In Fig. 5, the areas where the protective film is not formed are indicated by ovals. This allows the pads 21 and 22 to be connected as necessary even after the circuit board 10 is fabricated. The pads 21 and 22 correspond to an example of a pair of adjacent portions according to the present invention.

[0049] The noise reduction frequency where propagation is suppressed in the EBG structure is roughly

[0050]

number

[0051] In this embodiment, when pad 21 and pad 22 are not connected, only first conductor line 131 acts as a stub, and when pad 21 and pad 22 are connected, the combined conductor line of first conductor line and second conductor line 132 acts as a stub. That is, according to this embodiment, after circuit board 10 is manufactured, the frequency of noise can be changed to one that suppresses propagation.

[0052] This is effective, for example, in cases where the frequency of noise emitted from a noise-generating circuit incorporated on circuit board 10 varies depending on how the circuit is used, which is determined when circuit board 10 is incorporated into an apparatus (not shown), or where the noise frequency changes due to aging after use.

[0053] Here, the pads 21 and 22 may be connected by, for example, a jumper wire or a passive component for shorting. Alternatively, they may be connected by using a passive component including inductance, capacitance, or the like.

[0054] Fig. 6 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a second embodiment of the present invention. In this embodiment, the EBG structure is formed by arranging a plurality of units shown in Fig. 6 on a circuit board.

[0055] The stub 13 shown in FIG. 6 is composed of a first conductor line 131, a second conductor line 132, and further a third conductor line 133.

[0056] One end 131a of the first conductor line 131 is connected to the via 12 and extends in a spiral shape toward the other end. An end 131b of the first conductor line 131 away from the via 12 is open, that is, an open end that is not directly connected to another conductor. A pad 21 for connection to a second conductor line is formed on this end 131b.

[0057] Moreover, one end 132a of the second conductor line 132 is located close to the end 131b of the first conductor line 131 that is farther from the via 12, and extends in a shape that inherits the spiral shape of the first conductor line 131. That is, the shape of the first conductor line 131 and the second conductor line 132 combined is also a spiral shape that is a direct extension of the spiral shape of the first conductor line 131. Both ends 132a, 132b of the second conductor line 132 are open ends. Moreover, a pad 22 for connection with the first conductor line 131 is formed on the end 132a of the second conductor line 132 that is close to the end 131b of the first conductor line 131. Furthermore, a pad 23 for connection with the third conductor line 133 is formed on the other end 132b of the second conductor line 132.

[0058] Moreover, one end 133a of third conductor line 133 is located close to end 132b of second conductor line 132 on the side away from pad 21 of first conductor line 131, and extends in a shape that inherits the spiral shapes of first conductor line 131 and second conductor line 132. In other words, the shape of first conductor line 131, second conductor line 132, and further third conductor line 133 combined is also a spiral shape that is a direct extension of the spiral shape formed by first conductor line 131 and second conductor line 132. Like second conductor line 132, both ends 133a, 133b of third conductor line 133 are open ends. Furthermore, at end 133a of third conductor line 133 close to end 132b of second conductor line 132, pad 24 for connection to second conductor line 132 is formed.

[0059] In addition, a protective film (not shown) called a resist is formed on the surface of the circuit board 10, but the protective film is not formed around the pads 21 and 22, and around the pads 23 and 24. In Fig. 6, the areas where the protective film is not formed are indicated by ovals. This allows the pads 21 and 22, and the pads 23 and 24 to be connected as necessary even after the circuit board 10 is produced.

[0060] In this embodiment, when pad 21 and pad 22 are not connected, only first conductor line 131 acts as stub 13, and when pad 21 and pad 22 are connected, a conductor line combining first conductor line and second conductor line 132 acts as stub 13. Furthermore, when pad 23 and pad 24 are connected in addition to connecting pad 21 and pad 22, a conductor line combining first conductor line, second conductor line 132, and third conductor line 133 acts as stub 13. That is, according to this embodiment, after circuit board 10 is produced, the frequency of noise to be suppressed from propagating can be changed in two stages.

[0061] 7 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a third embodiment of the present invention. In this embodiment, the EBG structure is formed by arranging a plurality of units shown in FIG. 7 on a circuit board.

[0062] The circuit shown in FIG. 7 is a circuit in which some parts have been added to the circuit shown in FIG. 5, and therefore a duplicate description of the contents described with reference to FIG. 5 will be omitted here.

[0063] 7 has the same configuration as the circuit shown in Fig. 5, but also has pads 25 and 26 formed adjacent to first conductor line 131 and second conductor line 132. No protective film is formed around pads 25 and 26.

[0064] 7, when neither pad 21 nor pad 22, nor pad 25 nor pad 26, is connected, only first conductor line 131 acts as stub 13. When pad 21 and pad 22 are connected, stub 13 is formed with a length equal to the combined length of first conductor line 131 and second conductor line 132. When pad 25 and pad 26 are connected, a conductor line appears that is shorter than the overall length of first conductor line 131 from via 12 to end 132b of second conductor line 132. As a result, compared to when only first conductor line 131 acts as stub 13, connecting pad 21 and pad 22 can lower the noise reduction frequency to the low frequency side, or connecting pad 25 and pad 26 can add a noise reduction effect on the high frequency side.

[0065] Fig. 8 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a fourth embodiment of the present invention. In this embodiment, the EBG structure is formed by arranging a plurality of units shown in Fig. 8 on a circuit board.

[0066] In explaining FIG. 8, only the differences from FIG. 7 will be explained.

[0067] In the circuit shown in Fig. 7, pads 25 and 26 are formed adjacent to each other on first conductor line 131 and second conductor line 132, but in the circuit shown in Fig. 8, pads 27 and 28 are formed adjacent to each other across first conductor line 131. No protective film is formed around pad 27 and pad 28.

[0068] In the example shown in FIG. 8, when pad 27 and pad 28 are connected, an even shorter stub appears than when pad 25 and pad 26 in FIG. 7 are connected, and it is possible to provide an even greater effect of reducing noise on the high frequency side than when pad 25 and pad 26 in FIG. 7 are connected.

[0069] Fig. 9 is a diagram showing a circuit for one unit of an EBG structure constituting an electronic circuit according to a fifth embodiment of the present invention. In this embodiment, the EBG structure is formed by arranging a plurality of units shown in Fig. 9 on a circuit board.

[0070] Here, differences from the example shown in FIG. 5 will be described.

[0071] In the example shown in FIG. 5 (and FIGS. 6 to 8), the conductor line constituting stub 13 is present on the surface layer of circuit board 10, but in FIG. 9, the conductor line is formed not on the surface layer but inside circuit board 10, for example on the second conductor layer. For this reason, vias 31, 32 are also formed at end 131b of first conductor line 131 away from via 12, and at end 132a of second conductor line 132 near end 131b of first conductor line 131. Via 31 is connected to end 131b of first conductor line 131 and to pad 21 formed on the surface layer. In addition, , B The via 32 is connected to an end 132a of the second conductor line 132 and is also connected to a pad 22 formed on the surface layer. However, these vias 31 and 32 are not connected to the ground 11.

[0072] As shown in this example, the conductor lines do not necessarily have to be formed on the surface layer. They may also be conductor lines that are connected by vias and extend across multiple layers. However, it is preferable that the conductor lines are connected to the surface layer in order to connect with each other.

[0073] So far, an EBG structure having a spiral-shaped conductor line has been described, but the EBG structure in the present invention does not necessarily have to have a spiral-shaped conductor line.

[0074] FIG. 10 is a diagram showing an embodiment having a conductor line with a shape other than a spiral shape.

[0075] FIG. 10A shows an example of an EBG structure having a meandering conductor line.

[0076] The stub 13 is composed of a first conductor line 131 and a second conductor line 132 .

[0077] One end 131a of the first conductor line 131 is connected to the via 12 and extends in a meandering shape toward the other end. An end 131b of the first conductor line 131 away from the via 12 is open, that is, an open end that is not directly connected to another conductor. A pad 21 for connection to a second conductor line is formed on this end 131b.

[0078] Moreover, one end 132a of the second conductor line 132 is located close to end 131b of the first conductor line 131 on the side farther from the via 12, and extends in a shape that inherits the meandering shape of the first conductor line 131. That is, the combined shape of the first conductor line 131 and the second conductor line 132 is also a meandering shape that is a direct extension of the meandering shape of the first conductor line 131. Both ends 132a, 132b of the second conductor line 132 are open ends. Furthermore, a pad 22 for connection to the first conductor line 131 is formed on end 132a of the second conductor line 132 close to end 131b of the first conductor line 131.

[0079] Further, a protective film (not shown) called a resist is formed on the surface of the circuit board 10, but the protective film is not formed around the pads 21 and 22.

[0080] FIG. 10B shows an example of an EBG structure having a linear conductor line.

[0081] The stub 13 is composed of a first conductor line 131 and a second conductor line 132 .

[0082] One end 131a of the first conductor line 131 is connected to the via 12 and extends linearly toward the other end. An end 131b of the first conductor line 131 away from the via 12 is open, that is, an open end that is not directly connected to another conductor. A pad 21 for connection to a second conductor line is formed on this end 131b.

[0083] Moreover, one end 132a of the second conductor line 132 is located close to end 131b of the first conductor line 131 on the side farther from the via 12, and extends in a shape that inherits the linear shape of the first conductor line 131. That is, the shape of the first conductor line 131 and the second conductor line 132 combined is also a linear shape that is a direct extension of the linear shape of the first conductor line 131. Both ends 132a, 132b of the second conductor line 132 are open ends. Furthermore, a pad 22 for connection to the first conductor line 131 is formed on end 132a of the second conductor line 132 close to end 131b of the first conductor line 131.

[0084] Further, a protective film (not shown) called a resist is formed on the surface of the circuit board 10, but the protective film is not formed around the pads 21 and 22.

[0085] FIG. 10(C) shows an EBG structure that is similar to the EBG structure in FIG. 10(B).

[0086] In FIG. 10C, second conductor line 132 is not formed on the extension of the straight line shape of first conductor line 131, but at a slightly shifted position.

[0087] As shown in this example, second conductor line 132 does not necessarily need to extend in a shape that inherits the shape in which first conductor line 131 extends, and can be designed freely. [Explanation of symbols]

[0088] 10 Circuit Board 11 Grand 12 Via 13 Stub 21,22,23,24,25,26,27,28 Pads 31,32 Via 131 First conductor line 131a, 131b Ends of the first conductor line 132 Second conductor line 132a, 132b Ends of second conductor lines 133 3rd conductor line 133a, 133b Ends of third conductor lines

Claims

1. a conductor post extending in a stacking direction and connected to a ground of a first layer of the plurality of conductor layers stacked at a distance from each other; a first conductor line that is connected to the conductor pillar in a second layer different from the first layer among the plurality of conductor layers, extends in a strip shape, and has an open end at an end remote from the conductor pillar; a second conductor line extending in a strip shape in any one of the plurality of conductor layers; the first conductor line and the second conductor line each have one adjacent portion constituting at least a pair of adjacent portions that are adjacent to each other and connectable therebetween; the one adjacent portion of the first conductor line is located between a connection point to the conductor post and the open end, a first end of the second conductor line, the first end being away from the adjacent portion formed on the second conductor line, the first end being an open end.

2. 2. The electronic circuit according to claim 1, wherein the adjacent portion is formed on a surface layer of the plurality of conductor layers or extends to the surface layer in the stacking direction.

3. 3. The electronic circuit according to claim 2, wherein the pair of adjacent portions are shorted to each other.

4. 4. The electronic circuit according to claim 1, wherein the first conductor line is a conductor line having an end portion other than the open end connected to the conductor post.

5. the first conductor line has a plurality of adjacent portions including the adjacent portion, 5. The electronic circuit according to claim 4, wherein at least one of the plurality of adjacent portions is formed at the open end of the first conductor line.

6. 6. The electronic circuit according to claim 5, wherein the adjacent portion of the second conductor line is formed at a second end different from the first end of the second conductor line.

7. The second conductor line has a plurality of adjacent portions including the adjacent portion, 7. The electronic circuit of claim 6, wherein at least one of the plurality of adjacent portions is located between the first end and the second end.

8. 7. The electronic circuit according to claim 6, wherein the second conductor line extends in a shape that follows the shape in which the first conductor line extends.

9. 9. The electronic circuit according to claim 8, wherein both the first conductor line and the conductor line formed by combining the first conductor line and the second conductor line when connected to the first conductor line are conductor lines that extend while bending continuously or intermittently in the same rotational direction from one end to the other end.

10. A circuit board having the electronic circuit according to any one of claims 1 to 9 mounted thereon.

11. The circuit board according to claim 10, wherein a plurality of the electronic circuits are mounted on the circuit board.

Citation Information

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