ALIGNMENT APPARATUS, FILM FORMING APPARATUS, ALIGNMENT METHOD, FILM FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

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By releasing the periphery of the daughter board before the daughter board comes into contact with the mask, the bending deformation problem caused by its own weight during Align is solved, and efficient alignment and high-quality film formation are achieved.

JP7660365B2Active Publication Date: 2025-04-11CANON TOKKI CORP

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Patent Information

Application Number: JP2020195151
Authority / Receiving Office: JP · JP
Patent Type: Patents
Current Assignee / Owner
Filing Date: 2020-11-25
Publication Date: 2025-04-11
Estimated Expiration: 2040-11-25

AI Technical Summary

Technical Problem

When manufacturing large and thin daughter boards, the bending caused by the weight of the daughter board causes the daughter board to deform when Aligning on the mask, resulting in a decrease in the adhesion between the mask and the daughter board, causing problems such as blurring of the film.

Method used

By releasing the periphery of the daughter board before it comes into contact with the mask, the daughter board is allowed to expand outward due to the mask pressure, thereby eliminating the bending deformation of the daughter board and making precise alignment when re-climbing the daughter board.

Benefits of technology

It effectively reduces the alignment time between the daughter board and the mask, and improves the adhesion between the daughter board and the mask, avoiding film blur and other quality problems.

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Abstract

To provide an alignment device that can shorten a time required for alignment.SOLUTION: An alignment device includes substrate holding means having a pressing portion that presses a supporting portion and a peripheral portion of a substrate, driving means that puts the substrate in a state in which the substrate is pressed and pinched or in a state in which the pinching is released, mask holding means, moving means that moves at least one of the substrate holding means and the mask holding means and changes the relative distance between the substrate and the mask, and position adjustment means that adjusts the relative position of the substrate and mask in a plane. The position adjustment means performs first position adjustment when the relative distance between the substrate and the mask is a first distance, and performs second position adjustment when the relative distance between the substrate and the mask is a shorter second distance after the first position adjustment, and at least a part of the substrate is in contact with the mask and the substrate is separated before the first position adjustment.SELECTED DRAWING: Figure 4

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Description

[Technical Field]

[0001] The present invention relates to an alignment apparatus, a film formation apparatus, an alignment method, a film formation method, and a method for manufacturing an electronic device. [Background technology]

[0002] Display devices such as organic electroluminescence (EL) display devices and liquid crystal display devices are widely used. Among them, organic EL display devices that use an EL display as a panel display have excellent characteristics such as response speed, viewing angle, and thinness, and are suitable for use in monitors, televisions, smartphones, etc.

[0003] In the manufacturing process of such panel displays, the substrate and mask are often aligned, and film materials are deposited on the substrate through the mask. For example, in the case of organic EL displays, a mask with a pixel pattern formed thereon is aligned with the substrate in a film deposition device, and organic or metal materials are deposited through the mask to form functional layers and electrode metal layers in the desired patterns at the desired positions on the substrate. Typically, alignment is performed by clamping the periphery of the substrate and moving the substrate within a plane while keeping the substrate and mask surfaces parallel.

[0004] Patent Document 1 (International Publication No. 2017 / 222009) discloses a technology for performing alignment by moving a substrate, whose peripheral edge is clamped above a mask placed on a mask table, relative to the mask. Patent Document 1 describes a two-stage alignment process: a first alignment (rough alignment) that roughly aligns the substrate, and a second alignment (fine alignment) that provides high accuracy. Between the first and second alignments, the substrate is released from the clamping while still in contact with the mask, thereby correcting distortion of the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2017 / 222009 Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, substrates have become larger and thinner, increasing the impact of substrate warping due to their own weight. Furthermore, because the film formation area is located in the center of the substrate, the substrate can only be clamped at its peripheral edge. Therefore, when the substrate is placed on a mask with its peripheral edge (e.g., a pair of opposing sides) clamped by a substrate holding device, the substrate's central portion, which is bent due to its own weight, comes into contact with the mask, preventing free movement and causing distortion of the substrate. This distortion creates a gap between the mask and the substrate, reducing the adhesion between the mask and the substrate, resulting in film blurring and other problems. Releasing the clamping of the substrate while it is still in contact with the mask eliminates the substrate distortion and improves the adhesion between the mask and the substrate.

[0007] However, on the other hand, a problem has been found in that this method may result in misalignment of the substrate. Patent Document 1 does not disclose releasing the substrate while it is in contact with the mask before the first alignment among the multiple alignments performed, or before the first alignment performed after the substrate is carried in. Patent Document 1 does not disclose releasing the substrate while it is in contact with the mask until the relative positional relationship between the substrate and the mask has been adjusted by alignment. In this state, the peripheral edge of the substrate is released from clamping. The operation of releasing the peripheral edge of the substrate may be performed multiple times, but the amount of substrate misalignment the first time is generally large. Therefore, in the method described in Patent Document 1, the position of the substrate may change from the position adjusted by alignment, and as a result, the alignment time may be long.

[0008] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an alignment apparatus that can reduce the time required for alignment. [Means for solving the problem]

[0009] The present invention employs the following configuration: a substrate holding means having a support portion that supports a peripheral edge portion of the substrate and a pressing portion that faces the support portion and presses the peripheral edge portion; a driving means for driving the pressing portion so as to be in a pressing state in which the pressing portion presses the peripheral edge portion or in a spaced state in which the pressing portion is spaced from the substrate; a mask holding means for holding a mask; a position adjusting means for adjusting a relative position between the substrate and the mask in a plane along the film-forming surface of the substrate; a moving means for moving at least one of the substrate holding means and the mask holding means so as to change the relative distance between the substrate and the mask in a direction intersecting the plane; It is equipped with The position adjustment means the moving means moves the film forming surface of the substrate in a plane along the film forming surface of the substrate while the relative distance between the substrate and the mask is set to a first distance. The support portion and the pressing portion in the pressed state are sandwiched between the support portion and the pressing portion. performing a first position adjustment for adjusting the relative positions of the substrate and the mask; After the first position adjustment, the moving means moves the substrate and the mask to a second distance that is shorter than the first distance, and the moving means moves the substrate and the mask to a plane along the film-forming surface of the substrate. The support portion and the pressing portion in the pressed state are sandwiched between the support portion and the pressing portion. a second position adjustment for adjusting the relative positions of the substrate and the mask; Before the first position adjustment, at least a part of the substrate is in contact with the mask, and the pressing portion is in the separated state. The substrate, which is subjected to stress from the mask, expands toward the peripheral edge, and the peripheral edge of the substrate escapes outward. The moving means changes the relative distance between the substrate and the mask, and the driving means moves the pressing portion. In the separated state Drive After at least a portion of the substrate is in contact with the mask and the pressing portion is in the separated state, the driving means drives the pressing portion to the pressing state. The alignment device is characterized by the above.

[0010] The present invention also employs the following configuration: a substrate holding means having a support portion that supports a peripheral edge portion of the substrate and a pressing portion that faces the support portion and presses the peripheral edge portion; a driving means for driving the pressing portion so as to be in a pressing state in which the pressing portion presses the peripheral edge portion or in a spaced state in which the pressing portion is spaced from the substrate; a mask holding means for holding a mask; In a plane along the film-forming surface of the substrate, The support portion and the pressing portion in the pressed state are sandwiched between the support portion and the pressing portion. a position adjusting means for adjusting the relative positions of the substrate and the mask; a moving means for moving at least one of the substrate holding means and the mask holding means so as to change the relative distance between the substrate and the mask in a direction intersecting the plane; It is equipped with At least a part of the substrate comes into contact with the mask during the period from when the substrate is supported by the support portion until the position adjustment means performs the first position adjustment, and the pressing portion From the pressed state In the separated state The substrate, which is subjected to stress from the mask, expands toward the peripheral edge, and the peripheral edge of the substrate escapes outward. The moving means changes the relative distance between the substrate and the mask, and the driving means drives the pressing unit so that After at least a portion of the substrate is in contact with the mask and the pressing portion is in the separated state, the driving means drives the pressing portion to the pressing state. do The alignment device is characterized by the above.

[0011] The present invention also employs the following configuration: a substrate holding means having a support portion that supports a peripheral edge portion of the substrate and a pressing portion that faces the support portion and presses the peripheral edge portion; a driving means for driving the pressing portion so as to be in a pressing state in which the pressing portion presses the peripheral edge portion or in a spaced state in which the pressing portion is spaced from the substrate; a mask holding means for holding a mask; a position adjusting means for adjusting a relative position between the substrate and the mask in a plane along the film-forming surface of the substrate; a moving means for moving at least one of the substrate holding means and the mask holding means so as to change the relative distance between the substrate and the mask in a direction intersecting the plane; An alignment method using an alignment apparatus comprising: a first pressing step in which the driving means drives the pressing unit to press the substrate, which has been carried into the alignment device and supported by the supporting unit; After the first pressing step, at least a part of the substrate is in contact with the mask, and the pressing portion is in the separated state. The substrate, which is subjected to stress from the mask, expands toward the peripheral edge, and the peripheral edge of the substrate escapes outward. a contact step in which the moving means changes the relative distance between the substrate and the mask and the driving means drives the pressing unit so that the substrate and the mask are brought into contact with each other; a second pressing step in which, after the contact step, the driving means drives the pressing portion to place the substrate in a pressed state; and After the second pressing step, the position adjustment by the position adjusting means is started. The alignment method is characterized by the above.

[0012] The present invention also employs the following configuration: a substrate holding means having a support portion that supports a peripheral edge portion of the substrate and a pressing portion that faces the support portion and presses the peripheral edge portion; a driving means for driving the pressing portion so as to be in a pressing state in which the pressing portion presses the peripheral edge portion or in a spaced state in which the pressing portion is spaced from the substrate; a mask holding means for holding a mask; a position adjusting means for adjusting a relative position between the substrate and the mask in a plane along the film-forming surface of the substrate; a moving means for moving at least one of the substrate holding means and the mask holding means so as to change the relative distance between the substrate and the mask in a direction intersecting the plane; An alignment method using an alignment apparatus comprising: the moving means changing the relative distance between the substrate and the mask; a step in which the driving means drives the pressing portion; and The changing step and the driving step are performed during the period from when the substrate is supported by the support portion until the position adjustment means performs the first position adjustment, so that at least a part of the substrate is in contact with the mask and the pressing portion is in the separated state. The substrate, which is subjected to stress from the mask, expands toward the peripheral edge, and the peripheral edge of the substrate escapes outward. It is something Then, the driving means drives the pressing portion to press the substrate. The alignment method is characterized by the above. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide an alignment apparatus that can reduce the time required for alignment. [Brief explanation of the drawings]

[0014] [Figure 1] Schematic diagram of an electronic device manufacturing line including a film deposition device [Figure 2] Cross-sectional view showing the internal configuration of a film forming apparatus [Figure 3] FIG. 1 is a perspective view showing a substrate clamping device in a film forming apparatus; [Figure 4] Flow diagram showing the processing flow in the first embodiment [Figure 5] 1 is a cross-sectional view showing a state when a substrate is carried in according to the first embodiment; [Figure 6] 1 is a cross-sectional view showing an alignment state in Example 1. [Figure 7] 4 is a cross-sectional view illustrating the alignment state in the first embodiment; FIG. [Figure 8] Continuing cross-sectional views showing the alignment state in Example 1. [Figure 9] 10 is a cross-sectional view showing the alignment state in Example 2. [Figure 10] 10 is a cross-sectional view illustrating the alignment state in the second embodiment; FIG. [Figure 11] 10 is a cross-sectional view showing the alignment state in Example 3. [Figure 12] A diagram explaining a method for manufacturing an electronic device. DETAILED DESCRIPTION OF THE INVENTION

[0015] Preferred embodiments of the present invention will be described below with reference to the drawings. However, the following description merely exemplifies preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Furthermore, unless otherwise specified, the hardware and software configurations, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the device in the following description are not intended to limit the scope of the present invention.

[0016] When forming a film of a desired pattern on a substrate, a mask with a mask pattern that matches the shape of the film is used. By using multiple masks, each layer can be configured as desired. In order to form a film at the desired position on the substrate, the relative positions of the substrate and the mask must be aligned with high precision.

[0017] The present invention is suitable for use in a configuration for aligning a substrate and a mask as described above. Therefore, the present invention can be understood as an alignment apparatus or an alignment method for a substrate and a mask. The present invention can also be understood as a film formation apparatus or a film formation method using such an alignment apparatus or alignment method. The present invention can also be understood as an electronic device manufacturing apparatus or a method for manufacturing an electronic device using such a film formation apparatus or film formation method. The present invention can also be understood as a control method for each of the above apparatuses.

[0018] The present invention is preferably applicable to forming a thin film material layer of a desired pattern on the surface of a substrate through a mask. Any substrate material can be used, such as glass, resin, metal, or silicon. Any film-forming material can be used, such as organic materials or inorganic materials (metals or metal oxides). The technology of the present invention is typically applied to manufacturing equipment for electronic devices and optical components. It is particularly suitable for organic electronic devices such as organic EL displays, organic EL display devices using such displays, thin-film solar cells, and organic CMOS image sensors. However, the application of the present invention is not limited to this.

[0019] Example 1 (Electronic device manufacturing line) Figure 1 is a plan view showing a schematic configuration of a manufacturing line for electronic devices. Such a manufacturing line can be said to be a film formation system that includes a film formation device. Here, we will explain a manufacturing line for organic EL displays. When manufacturing organic EL displays, a substrate of a specified size is brought into the manufacturing line, and after the organic EL and metal layers are formed, post-processing steps such as cutting the substrate are carried out.

[0020] As shown in FIG. 1, a film formation cluster 1 of the production line includes a transfer chamber 130 arranged in the center, and a film formation chamber 110 and a mask stock chamber 120 arranged around the transfer chamber 130. The film formation chamber 110 includes a film formation device, and performs film formation processing on the substrate 10. The mask stock chamber 120 stores masks before and after use. A transfer robot 140 installed in the transfer chamber 130 transfers the substrate 10 and the mask 220 into and out of the transfer chamber 130. The transfer robot 140 is, for example, a robot having a robot hand attached to an articulated arm that holds the substrate 10 and the mask 220.

[0021] The pass chamber 150 transports the substrate 10 flowing from the upstream side in the substrate transport direction to the transfer chamber 130. The buffer chamber 160 transports the substrate 10, for which film formation processing in the transfer chamber 130 has been completed, to another film formation cluster downstream. The transfer robot 140 receives the substrate 10 from the pass chamber 150 and transports it to one of the multiple film formation chambers 110. The transfer robot 140 also receives the substrate 10, for which film formation processing has been completed, from the film formation chamber 110 and transports it to the buffer chamber 160. A turning chamber 170, which changes the direction of the substrate 10, is provided further upstream from the pass chamber 150 and further downstream from the buffer chamber 160. Each chamber, such as the film formation chamber 110, mask stock chamber 120, transfer chamber 130, buffer chamber 160, and turning chamber 170, is maintained in a high vacuum state during the manufacturing process of an organic EL display panel.

[0022] (Film forming equipment) 2 is a cross-sectional view showing the configuration of the film formation apparatus. Each of the multiple film formation chambers 110 is provided with a film formation apparatus 108 (also called a vapor deposition apparatus). The film formation apparatus 108 performs a series of film formation processes, such as transferring the substrate 10 to and from the transfer robot 140, aligning the substrate 10 to adjust the relative positional relationship between the substrate 10 and the mask 220, fixing the substrate 10 on the mask, and forming a film (vapor deposition).

[0023] In the following description, an XYZ Cartesian coordinate system is used, with the vertical direction being the Z direction. In the XYZ Cartesian coordinate system, when the substrate is fixed so as to be parallel to a horizontal plane (XY plane) during film formation, the direction in which one pair of opposing sides of the rectangular substrate 10 extends is the X direction, and the direction in which the other pair of sides extends is the Y direction. The rotation angle around the Z axis is represented by θ.

[0024] The film forming apparatus 108 has a vacuum chamber 200. The interior of the vacuum chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. Inside the vacuum chamber 200, a substrate holding unit 210, a mask 220, a mask table 221, a cooling plate 230, and an evaporation source 240 are provided.

[0025] The substrate holding unit 210 (substrate holding means) functions as a holder for supporting the substrate 10 received from the transfer robot 140. The mask 220 is, for example, a metal mask, and has an opening pattern corresponding to the thin film pattern to be formed on the substrate. The mask 220 is placed on a frame-shaped mask stage 221 (mask holding means), which is a mask supporting unit. In the configuration of this embodiment, the substrate 10 is positioned and supported on the mask, and then film formation is performed.

[0026] The cooling plate 230 (cooling unit) is a plate-like member that contacts the surface of the substrate 10 opposite to the surface that contacts the mask 220 (the surface on which the film is to be formed) during film formation, and suppresses the temperature rise of the substrate 10 during film formation. The cooling plate 230 cools the substrate 10, thereby suppressing alteration and deterioration of the organic material. The cooling plate 230 may also function as a magnetic plate. The magnetic plate is a member that attracts the mask 220 by magnetic force, thereby increasing the adhesion between the substrate 10 and the mask 220 during film formation. Note that in order to increase the adhesion between the substrate 10 and the mask 220, the substrate holding unit 210 may hold both the substrate 10 and the mask 220 and bring them into close contact with each other using an actuator or the like.

[0027] The evaporation source 240 includes a container such as a crucible for accommodating an evaporation material, a heater, a shutter, a driving mechanism, and an evaporation rate monitor. Here, an evaporation apparatus using the evaporation source 240 as the film formation source is shown, but the present invention is not limited to this. For example, the film formation apparatus 108 may be a sputtering apparatus using a sputtering target as the film formation source.

[0028] A substrate Z actuator 250, a clamp Z actuator 251, and a cooling plate Z actuator 252 are provided on the upper outside of the vacuum chamber 200. Each actuator is composed of, for example, a motor and a ball screw, a motor and a linear guide, etc. An alignment stage 280 is also provided on the upper outside of the vacuum chamber 200.

[0029] The substrate Z actuator 250 (movement means) drives the entire substrate holding unit 210 in the Z-axis direction to raise and lower it. This changes the relative distance between the substrate 10 and the mask 220 in a direction intersecting the plane along the film-forming surface of the substrate 10 (the intersecting direction, typically a direction perpendicular to the plane of the film-forming surface of the substrate 10). The clamp Z actuator 251 (drive means) drives the pressing tool of the substrate holding unit 210 to open and close it.

[0030] The cooling plate Z actuator 252 (cooling drive means) drives the cooling plate 230 to raise and lower it. Before film formation, the cooling plate Z actuator 252 lowers the cooling plate 230 so that it contacts the surface of the substrate 10 opposite the surface on which the film is to be formed. The cooling plate 230 holds down the substrate 10 during film formation, which has the secondary effect of preventing misalignment even when the peripheral edge of the substrate 10 is not clamped. The timing and distance for lowering the cooling plate 230 are not limited as long as they do not interfere with the movement of the substrate 10, and it is sufficient that the cooling plate 230 can contact the substrate 10 during film formation. Furthermore, the cooling plate 230 does not necessarily need to be moved all at once. For example, the cooling plate 230 may be lowered to a certain extent during the first alignment without contacting the substrate 10, and then brought into contact with the substrate 10 before film formation begins after the second alignment.

[0031] (Configuration for alignment) The alignment stage 280 is an alignment device that moves the substrate 10 in the X and Y directions and rotates it in the θ direction to change its position relative to the mask 220. The alignment stage 280 is a position adjustment means that adjusts the relative position of the substrate 10 and the mask 220 in a plane along the film formation surface of the substrate 10. The alignment stage 280 includes a chamber fixing part 281 that is connected to and fixed in the vacuum chamber 200, an actuator part 282 for X, Y, and θ movement, and a connection part 283 that is connected to the substrate holding unit 210. The alignment stage 280 and the substrate holding unit 210 may be considered as a combination of the alignment device. Alternatively, the alignment device may be considered as the alignment stage 280, the substrate holding unit 210, and a control part 270.

[0032] The actuator section 282 may be an actuator in which an X actuator, a Y actuator, and a θ actuator are stacked. Alternatively, a UVW type actuator in which multiple actuators work together may be used. Regardless of the type of actuator section 282, it is driven in accordance with control signals sent from the control section 270 to move the substrate 10 in the X and Y directions and rotate it in the θ direction. The control signals indicate the amount of operation of each XYθ actuator in the case of a stacked type actuator, and indicate the amount of operation of each UVW actuator in the case of a UVW type actuator.

[0033] The alignment stage 280 moves the substrate holding unit 210 in the XYθ directions. Note that, although this embodiment is configured to adjust the position of the substrate 10, it may also be configured to adjust the position of the mask 220, or to adjust the positions of both the substrate 10 and the mask 220, as long as the substrate 10 and the mask 220 can be aligned relative to each other.

[0034] At the top outside of the vacuum chamber 200, a first camera is installed to perform optical imaging and generate image data. The vacuum chamber 200 is provided with a first camera 260 (rough alignment camera) and a second camera 261 (fine alignment camera). The first camera 260 and the second camera 261 capture images through windows provided in the vacuum chamber 200. A vacuum-sealed window is used to maintain airtightness inside the chamber. When two-stage alignment is performed as in this embodiment, a first alignment (rough alignment, first position adjustment) is performed first using the first camera 260, which is a low-resolution but wide-field-of-view camera for rough alignment. Then, a second alignment (fine alignment, second position adjustment) is performed using the second camera 261, which is a narrow-field-of-view but high-resolution camera for fine alignment.

[0035] In this embodiment, the first camera 260 is installed at a position where it can capture images of the central portions of the substrate 10 and the mask 220. The imaging area of the first camera 260 includes the first substrate alignment mark 103 on the substrate surface and the first mask alignment mark on the mask surface. The second camera 261 is installed at a position where it can capture images of the corners of the substrate 10 and the mask 220 arranged at the film formation position. The imaging area of the second camera 261 includes the second substrate alignment mark 104 on the substrate surface and the second mask alignment mark on the mask surface. In this embodiment, four second cameras 261 are provided to correspond to the four corners of the substrate 10 and the mask 220. However, the number and locations of the alignment marks, and the number, locations, and types of cameras are not limited to this example.

[0036] During the first alignment, the control unit 270 analyzes image data captured by the first camera 260 and acquires position information of the first substrate alignment mark and the first mask alignment mark using techniques such as pattern matching. The control unit 270 calculates the X and Y directions, distance, and angle θ for moving the substrate 10 based on the amount of misalignment between the first substrate alignment mark and the first mask alignment mark. The control unit 270 then converts the calculated amount of movement into drive amounts for the stepping motors, servo motors, etc. provided in each actuator of the alignment stage 280, and generates control signals.

[0037] Similarly, during the second alignment, the control unit 270 analyzes the image data captured by the second camera 261, obtains position information of the second substrate alignment mark and the second mask alignment mark, and calculates the direction, distance, and angle to move the substrate 10.

[0038] Typically, substrate alignment marks are formed on the substrate by photolithography, and mask alignment marks are formed on the mask by machining. However, the mark formation method is not limited to these and can be selected depending on the material and purpose. In addition, the shape and size of the marks can be set depending on the camera performance and image analysis capabilities.

[0039] The control unit 270 also performs various other controls, such as alignment control by controlling the operation of each actuator of the actuator unit 282, control of loading and unloading of the substrate 10 and mask 220, and film formation control. The control unit 270 can be configured, for example, by a computer having a processor, memory, storage, I / O, and the like. In this case, the functions of the control unit 270 are realized by the processor executing a program stored in the memory or storage. The computer may be a general-purpose personal computer, an embedded computer, or a PLC (programmable logic controller). Alternatively, some or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or FPGA. Note that a control unit 270 may be provided for each film formation apparatus, or one control unit 270 may control multiple film formation apparatuses.

[0040] (Substrate holding unit) An example of the configuration of the substrate holding unit 210 will be described with reference to the perspective view of Fig. 3. The substrate holding unit 210 is a support provided with a plurality of supports 300 (supporting portions) that support each side of the substrate 10. The clamping member 303 includes a holding frame 301 and a plurality of pressing tools 302 (pressing portions) that sandwich the substrate 10 between the holding frame 301 and the supports 300. A pair of supports 300 and pressing tools 302 constitutes a clamping mechanism 305. When driven by the clamp Z actuator 251, the pressing tools 302 are driven to a pressing state in which they face the corresponding supports 300 and press the peripheral portion of the substrate 10, or a separated state in which they are separated from the substrate 10. However, the number and arrangement of the clamping mechanisms 305 are not limited to this, and it is sufficient that when driven by the clamp Z actuator 251, they can be placed in a state in which they press and hold the substrate 10 (pressing state) or a state in which the pressure on the substrate 10 is released and the substrate 10 is released (separated state). In this specification, the substrate 10 is also expressed as being in a pressed state or a separated state, corresponding to the pressed state and separated state of the pressing tools 302, respectively. In this embodiment, even when the pressure is released, as long as the substrate 10 is placed on and supported by the support 300, it is possible to move the substrate 10 in the Z direction or the XY direction, or rotate it in the θ direction.

[0041] The alignment stage 280 transmits a driving force to the substrate holding unit 210 supporting the substrate 10, thereby adjusting the relative position of the substrate 10 with respect to the mask 220. When moving the substrate 10 in the Z direction, the substrate Z actuator 250 is driven to move the substrate holding unit 210, thereby raising and lowering the substrate 10. This brings the substrate 10 and the mask 220 closer to or farther apart. When moving the substrate 10 in the XY direction or rotating it in the θ direction, the alignment stage 280 moves the substrate 10 translationally in the XY directions or rotates it in the θ direction. During alignment, the substrate 10 moves within the XY plane on which the substrate is disposed, which is approximately parallel to the plane on which the mask is disposed. In other words, when moving the substrate 10 in the XY direction or rotating it in the θ direction, the distance between the substrate 10 and the mask 220 in the Z direction does not change, but the position of the substrate 10 changes within the XY plane. This allows the substrate 10 and the mask 220 to be aligned in-plane.

[0042] (Processing flow) The process flow will be explained with reference to the drawings. FIG. 4 is a flow diagram showing the steps of the alignment process for the substrate 10 and the mask 220. FIGS. 5 to 8 are cross-sectional views that schematically show the alignment-related configuration inside the film formation apparatus, showing the changes in state as the flow progresses. This flow explains how the substrate 10 and the mask 220 are aligned in the film formation chamber 110. Note that the first camera 260, the second camera 261, the cooling plate 230, and the transfer robot 140 are shown only when necessary for explanation.

[0043] FIG. 5 is a simplified cross-sectional view showing the interior of a film formation chamber. For ease of explanation, the Z-direction height h of the substrate 10 relative to the mask 220 inside the film formation chamber (the height of the supported peripheral edge of the substrate when the substrate 10 is bent or when a portion of the substrate 10 is in contact with the mask) is defined as follows: The contact height at which the substrate 10 is in close contact with the mask 220 placed on the mask stage 221 is defined as h0. Film formation is also performed at height h0. The acceptance height when the substrate 10 is loaded is defined as hc. The height at which the first alignment is performed is defined as hr. The Z-direction distance between the substrate 10 and the mask 220 at height hr is defined as the first distance. The height at which imaging for the second alignment is performed is defined as hf1. The height at which XYθ movement for the second alignment is performed is defined as hf2. hf2 is set so that the substrate 10 does not come into contact with the mask 220 even when it is hanging down. The distance in the Z direction between the substrate 10 and the mask 220 at the height hf2 is defined as a second distance.

[0044] This flow starts from a state in which the mask 220 is carried in from the mask stock chamber 120 and placed on the mask table 221. In step S101, the transfer robot 140 carries the substrate 10 from the pass chamber 150 into the film formation chamber 110. The transfer robot 140 places the peripheral portion (edge) of the substrate 10 on the support 300, and then retreats from the film formation chamber 110. As a result, as shown in FIG. 6(a), the substrate 10 is supported by the support 300 at the receiving height hc. When the peripheral portion of the substrate 10 is placed on the support 300, the support 300 reaches the receiving height hc of the substrate 10. In this embodiment, clamping by the pressing tool 302 is not performed in this step.

[0045] In step S102, the substrate Z actuator is driven to lower the substrate holding unit 210 with the substrate 10 placed on the support 300. At this time, the Z direction distance between the support surface of the support 300 and the surface (top surface) of the mask 220 is shorter than the hanging distance of the substrate 10 from the support surface at the center of the substrate. As a result, as shown in FIG. 6(b), at least a portion of the substrate 10 comes into contact with the mask 220. The contact between the substrate 10 and the mask 220 here may be such that the center of the substrate 10 comes into contact with the mask 220 as shown in FIG. 6(b), or the substrate 10 may be lowered to a contact distance d0 so that the entire surface of the substrate 10 comes into contact with the mask 220. Alternatively, the state may be intermediate between the state shown in FIG. 6(b) and the contact state.

[0046] In this embodiment, the clamp Z actuator 251 maintains the pressing tool 300 in a spaced state from the time the support tool 300 supports the substrate 10 loaded into the film formation chamber 110 until the substrate Z actuator brings at least a portion of the substrate 10 into contact with the mask 220. Therefore, as shown in FIG. 6B, the peripheral edge of the substrate 10 is in an unclamped spaced state. Therefore, when the substrate 10, which had been bent under its own weight, returns to a flat state due to stress from the mask 220, the peripheral edge of the substrate 10 moves outward. This prevents the substrate 10 from being deformed by unnecessary force, thereby improving the adhesion between the substrate 10 and the mask 220. Furthermore, when the substrate 10 is brought into contact with the mask 220 again after being spaced from the mask 220, the amount of positional deviation of the substrate 10 is reduced.

[0047] In step S103, the clamp Z actuator 251 drives the pressing tool 300 to the pressing state. That is, the pressing tool 302 of the substrate holding unit moves downward, and the peripheral edge of the substrate is clamped between the pressing tool 302 and the support tool 300, so that the substrate 10 is in the clamped state as shown in FIG. 6(c).

[0048] In step S104, the substrate Z actuator is driven to raise the substrate holding unit 210 clamping the substrate 10, and move the substrate 10 to a first alignment height hr. Then, the first alignment is performed. That is, with the substrate 10 moved to the height hr as shown in FIG. 7(a), the first camera 260 captures images of the alignment marks provided in the centers of the substrate 10 and the mask 220.

[0049] The control unit 270 analyzes the image and calculates the amount of misalignment based on the distance and angle between the alignment marks on the substrate 10 and the mask 220. Then, as shown in FIG. 7(b), the alignment stage 280 moves the substrate 10 in the XY direction and rotates it by θ to roughly correct the misalignment. After the operation of the alignment stage 280 is completed, the first camera 260 captures an image of the alignment mark again, and the control unit 270 determines whether the amount of misalignment between the marks exceeds a predetermined threshold. If it does exceed the threshold, the alignment stage 280 performs alignment again. By repeating this alignment process until the amount of misalignment falls within the threshold, the first alignment is completed.

[0050] In step S105, the substrate Z actuator is driven to lower the substrate holding unit 210 clamping the substrate 10, and move the substrate 10 to a height hf1. Then, the second camera 261 captures images of the substrate 10 and the alignment marks provided at the corners of the mask 220.

[0051] In step S106, as shown in FIG. 8(a), the substrate Z actuator is driven to raise the substrate holding unit 210 clamping the substrate 10, and move the substrate 10 to a height hf2. The control unit 270 analyzes the image taken at the height hf1 and determines the height of the substrate 10. and calculates the amount of misalignment of the alignment marks on the mask 220. Then, the alignment stage 280 moves the substrate 10 in the XY directions and rotates it by θ. In the case of the second alignment, the movement of the substrate 10 to height hf2, operation by the alignment stage 280, movement of the substrate 10 to height hf1, and image capture by the second camera 261 and calculation of the amount of misalignment are repeated until the amount of misalignment falls within a predetermined threshold range. This allows the misalignment to be precisely corrected.

[0052] When the second alignment brings the amount of misalignment between the substrate 10 and the mask 220 within the threshold, the process proceeds to step S107. The substrate Z actuator is driven to lower the substrate holding unit 210 clamping the substrate 10, and move the substrate 10 to a height h0. As a result, the height of the substrate 10 supported on the support surface of the support tool 300 matches the height of the mask 220, as shown in FIG. 8(b). After this step, alignment accuracy measurement before film formation may be performed. For example, the alignment marks at the corners of the substrate 10 and the mask 220 are imaged using the second camera 261, and the amount of misalignment is compared with a predetermined threshold to determine whether it is within an allowable range. If it is outside the allowable range, the process proceeds to the second alignment again.

[0053] In step S108, the cooling plate Z actuator 252 is driven to lower the cooling plate 230 and bring it into close contact with the substrate 10. This completes the alignment process between the substrate 10 and the mask 220 and the process of placing the substrate 10 on the mask 220. The evaporation source 240 is then heated, causing the film-forming material to fly and adhere to the substrate 10 through the mask 220, thereby forming a film corresponding to the mask pattern on the underside of the substrate 10. After film formation is complete, the transfer robot 140 carries out the substrate 10 on which the film has been formed. The film deposition in step 108 is performed while the clamp Z actuator 251 maintains the pressing tool 300 in a pressing state. If at least a portion of the substrate 10 (typically, the central portion of the substrate 10 bent by its own weight) is in contact with the mask 220 and the clamp on the peripheral edge of the substrate is released before the alignment process starts, film deposition while maintaining the pressing state reduces mask misalignment during film deposition. Note that, as a modified example described later, the film deposition in step 108 may be performed while the clamp Z actuator 251 maintains the pressing tool 300 in a separated state.

[0054] According to the above series of steps, before the start of the alignment process, at least a portion of the substrate 10 (typically, the central portion of the substrate 10 bent under its own weight) comes into contact with the mask 220, and the clamping of the substrate peripheral portion is released. Then, the extension of the substrate 10 due to the stress from the mask 220 proceeds to the substrate peripheral portion without being hindered by the substrate holding unit 210. This allows the substrate 10 to be aligned well with the mask 220. By clamping the substrate peripheral portion in this state, the degree of contact between the substrate 10 and the mask 220 is improved in subsequent processes.

[0055] While releasing and clamping the peripheral edge of the substrate has the effect of removing distortion from the substrate 10, it can also change the position of the substrate 10, resulting in a longer alignment time. However, in this embodiment, after the substrate peripheral edge is re-gripped, the first alignment, which involves a large movement distance of the substrate 10, is performed, so that the change in position of the substrate 10 can be quickly absorbed and the alignment time can be shortened. As described above, the alignment apparatus of this embodiment can shorten the alignment time without reducing the effect of improving the adhesion between the substrate 10 and the mask 220. Therefore, good film formation without film blurring or the like, in which distortion of the substrate 10 is eliminated, can be achieved with high productivity.

[0056] <Example 2> Next, an alignment process of Example 2 will be described. In Example 2, after the substrate 10 is carried in, the clamp Z actuator 251 puts the pressing tool 300 into a pressing state. The second embodiment differs from the first embodiment. The same reference numerals are used to designate parts common to the first embodiment, and the description will be simplified.

[0057] The state of the substrate loading described with reference to Fig. 5 is the same as in Example 1. Next, in this example, as shown in Fig. 9(a), the pressing tool 302 of the substrate holding unit moves downward, and the peripheral edge of the substrate is sandwiched between the pressing tool 302 and the support tool 300, thereby clamping the substrate 10 (first pressing step).

[0058] Next, the substrate Z actuator is driven to lower the substrate holding unit 210 with the substrate 10 clamped thereon. Therefore, the substrate 10 can move downward in a stable manner without swinging, etc. Then, as shown in FIG. 9(b), the descent of the substrate 10 is stopped shortly before the hanging portion of the substrate 10 comes into contact with the mask 220.

[0059] 10(a), the pressing tool 302 of the substrate holding unit moves upward, releasing the clamp on the substrate 10. As a result, the peripheral edge of the substrate is placed on the support tool 300, and the substrate is placed in a unclamped, separated state. The separated substrate 10 hangs down due to its own weight, and its center comes into contact with the mask 220. Alternatively, if the height of the substrate 10 is such that it will not come into contact with the mask 220 even if it sags under its own weight, the substrate Z actuator may lower the substrate holding unit 210 again so that the center of the substrate comes into contact with the mask 220.

[0060] 10(b), at least a portion of the substrate 10 and the mask 220 come into contact with each other, and the peripheral edge of the substrate is in a separated state where it is not clamped (contact step). As a result, the substrate 10 receives stress from the mask 220 and expands toward the peripheral edge, causing the peripheral edge of the substrate 10 to move outward. As a result, distortion of the substrate 10 is eliminated, and the degree of adhesion between the substrate 10 and the mask 220 is improved. As in Example 1, only a portion of the substrate 10 and the mask 220 may be in contact with each other, or the entire surface of the substrate 10 and the mask 220 may be in contact with each other.

[0061] The subsequent processes are the same as those in Example 1. That is, the peripheral edge of the substrate is clamped (second pressing step) as shown in Fig. 6(c), and the first alignment and the second alignment are performed as shown in Figs. 7 and 8, and then the film formation process is performed.

[0062] Therefore, according to this embodiment, distortion of the substrate 10 can be eliminated by re-gripping (releasing and clamping) the peripheral edge of the substrate, and variations in the position of the substrate due to re-gripping can be absorbed by the first alignment. Therefore, the time required for alignment can be shortened without reducing the effect of improving the adhesion between the substrate 10 and the mask 220. Therefore, good film formation without film blurring or the like, in which distortion of the substrate 10 is eliminated, can be achieved with high productivity.

[0063] Example 3 Next, an alignment process of Example 3 will be described. Example 3 differs from Example 2 in that, after at least a portion of the substrate 10 contacts the mask 220, the clamp Z actuator 251 drives the pressing tool 300 from the pressing state to the separated state. Portions common to the above-described examples are given the same reference numerals, and the description will be simplified.

[0064] The state of the substrate loading described with reference to Fig. 5 is the same as in Example 1. Then, as in Example 2 shown in Fig. 9(a), the pressing tool 302 of the substrate holding unit moves downward to clamp the substrate 10 (first pressing step).

[0065] Next, in the third embodiment, the substrate Z actuator is driven to clamp the substrate 10. The substrate holding unit 210 is then lowered, so that at least a portion of the substrate 10 comes into contact with the mask 220, as shown in FIG.

[0066] 11(b), the pressing tool 302 of the substrate holding unit 210 moves upward, releasing the clamp on the substrate 10. As a result, at least a portion of the substrate 10 and the mask 220 come into contact with each other, and the peripheral edge of the substrate is in a separated state where it is not clamped (contact step). Therefore, the substrate 10, which is subjected to stress from the mask 220, stretches toward the peripheral edge, and the peripheral edge of the substrate 10 moves outward. As a result, the distortion of the substrate 10 is eliminated, and the degree of adhesion between the substrate 10 and the mask 220 is improved.

[0067] The subsequent processes are the same as those in Examples 1 and 2. That is, as shown in Fig. 6(c), the peripheral edge of the substrate is clamped (second pressing step), and after the first alignment and the second alignment are performed as shown in Figs. 7 and 8, a film formation process is performed.

[0068] Therefore, according to this embodiment, distortion of the substrate 10 can be eliminated by re-gripping (releasing and clamping) the peripheral edge of the substrate, and variations in the position of the substrate due to re-gripping can be absorbed by the first alignment. Therefore, the time required for alignment can be shortened without reducing the effect of improving the adhesion between the substrate 10 and the mask 220. Therefore, good film formation without film blurring or the like, in which distortion of the substrate 10 is eliminated, can be achieved with high productivity.

[0069] <Variation 1> In the above-described embodiments, after the distortion is eliminated by re-gripping the substrate, the substrate holding unit 210 clamps the peripheral edge of the substrate, and then the first alignment and the second alignment are performed while maintaining the clamped state. However, the present invention is not limited to this.

[0070] In this modification, the peripheral edge of the substrate is released and clamped while at least a portion of the substrate 10 is in contact with the mask 220, even between the first alignment and the second alignment. For example, in the case of Example 1 described in the flow of FIG. 4, after the first alignment is performed in step S104, the substrate Z actuator is driven to lower the substrate holding unit 210 with the substrate 10 clamped thereon, so that a portion of the substrate 10 comes into contact with the mask 220. Then, the clamping of the substrate by the substrate holding unit 210 is released. As a result, the substrate 10, which is subjected to stress from the mask 220, stretches toward the peripheral edge. Then, the substrate is clamped again.

[0071] According to this modification, it is possible to further improve the degree of adhesion between the substrate 10 and the mask 220. It is also possible to eliminate distortion of the substrate that occurs during the first alignment, etc. The process of this modification can be applied not only to the first embodiment but also to the second and third embodiments.

[0072] <Variation 2> In the above-described embodiments, even after the alignment is completed, the film formation process is carried out while the substrate holding unit 210 keeps clamping the peripheral edge of the substrate, but the present invention is not limited to this.

[0073] In this modification, after the second alignment is completed, the substrate holding unit 210 releases the clamp on the peripheral edge of the substrate. Then, the substrate Z actuator is driven to lower the substrate holding unit 210, and the substrate 10 is lowered to a contact height d0 with the mask 220, thereby placing the substrate 10 on the mask 220. During this placement, the peripheral edge of the substrate 10, which has been released from the clamp, moves outward, so that the substrate 10 extends along the mask 220. As a result, for example, bending of the substrate 10 that occurred during the second alignment can be eliminated, and the degree of contact between the substrate 10 and the mask 220 can be further improved. Next, the cooling plate 230 is brought into contact with the substrate 10, and film formation is performed using the evaporation source 240. At this time, the cooling plate 230 prevents the substrate 10 from shifting in position. Therefore, film formation can be performed with high precision.

[0074] In this modified example, rather than completely releasing the clamps, some of the clamps (for example, when clamping two opposing sides of the substrate 10, the clamp on one side) may be released, or the clamping force of the pressing tool 302 may be weakened.

[0075] <Variation 3> In the above embodiments, the mask 220 is fixed, the substrate 10 is moved in the Z direction to change the height, and the position is adjusted by moving in the XY direction and rotating in θ in a plane. However, the present invention is not limited to this.

[0076] For example, the substrate 10 may be fixed in a chamber, and a film forming apparatus 108 may be used that raises and lowers the mask 220. In this case, a substrate holding means that supports the substrate 10 is fixed in the Z direction, and a mask holding means that holds and raises and lowers the mask 220 is provided. Alternatively, for example, both the substrate 10 and the mask 220 may be movable.

[0077] Even in these cases, the degree of adhesion between the substrate 10 and the mask 220 can be increased by ensuring that at least a portion of the substrate 10 is in contact with the mask 220 and that the clamping of the peripheral edge of the substrate is released before the first alignment begins.

[0078] Example 4 (Method of manufacturing organic electronic devices) In this example, an example of a method for manufacturing an organic electronic device using a film formation apparatus equipped with an alignment apparatus will be described. Below, as an example of an organic electronic device, the configuration and manufacturing method of an organic EL display device will be illustrated. First, the organic EL display device to be manufactured will be described. Figure 12(a) is an overall view of an organic EL display device 60, and Figure 12(b) shows the cross-sectional structure of one pixel.

[0079] As shown in FIG. 12(a), a display area 61 of an organic EL display device 60 has a plurality of pixels 62, each of which includes a plurality of light-emitting elements, arranged in a matrix. Each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the term "pixel" here refers to the smallest unit that allows a desired color to be displayed in the display area 61. In the organic EL display device shown in this figure, each pixel 62 is configured by a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B, which emit light different from one another. The pixel 62 is often configured by a combination of red, green, and blue light-emitting elements, but may also be a combination of yellow, cyan, and white light-emitting elements, and is not particularly limited as long as it is of at least one color.

[0080] Fig. 12(b) is a partial cross-sectional schematic diagram taken along line AB in Fig. 12(a). The pixel 62 has an organic EL element on a substrate 10, the organic EL element including a first electrode (anode) 64, a hole transport layer 65, one of light-emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68. Of these, the hole transport layer 65, the light-emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In this embodiment, the light-emitting layer 66R is an organic EL layer that emits red light, the light-emitting layer 66G is an organic EL layer that emits green light, and the light-emitting layer 66B is an organic EL layer that emits blue light.

[0081] The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The first electrode 64 is formed separately for each light-emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light-emitting elements 62R, 62G, and 62B, or may be formed for each light-emitting element. Note that the first electrode 64 and the second electrode 68 may be damaged by foreign matter. To prevent short circuits due to moisture and oxygen, an insulating layer 69 is provided between the first electrodes 64. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer P is provided to protect the organic EL element from moisture and oxygen.

[0082] Next, an example of a method for manufacturing an organic EL display device as an electronic device will be specifically described. First, a substrate 10 on which a circuit (not shown) for driving the organic EL display device and a first electrode 64 are formed is prepared.

[0083] Next, acrylic resin is formed by spin coating on the substrate 10 on which the first electrode 64 has been formed, and the acrylic resin is patterned by lithography so as to form an opening in the portion where the first electrode 64 has been formed, thereby forming an insulating layer 69. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0084] Next, the substrate 10 with the patterned insulating layer 69 is carried into a first film formation apparatus, the substrate is held by a substrate holding unit, and a hole transport layer 65 is formed as a common layer on the first electrode 64 in the display area. The hole transport layer 65 is formed by vacuum evaporation. In practice, the hole transport layer 65 is formed to be larger than the display area 61, so a high-resolution mask is not required. Here, the film formation apparatus used in this step and in forming each of the following layers is the film formation apparatus described in any of the above embodiments.

[0085] Next, the substrate 10 on which the hole transport layer 65 has been formed is carried into a second film formation apparatus and held by a substrate holding unit. The substrate and a mask are aligned, the substrate is placed on the mask, and a red-emitting light-emitting layer 66R is formed on the portion of the substrate 10 where the red-emitting element is to be disposed. According to this example, the mask and the substrate can be properly aligned, allowing for highly accurate film formation.

[0086] Similar to the formation of the light-emitting layer 66R, a green-emitting light-emitting layer 66G is formed by a third film-forming apparatus, and then a blue-emitting light-emitting layer 66B is formed by a fourth film-forming apparatus. After the formation of the light-emitting layers 66R, 66G, and 66B is completed, an electron transport layer 67 is formed over the entire display area 61 by a fifth film-forming apparatus. The electron transport layer 67 is formed as a layer common to the three light-emitting layers 66R, 66G, and 66B.

[0087] The substrate on which the electron transport layer 67 has been formed is transferred to a sputtering device, where the second electrode 68 is formed, and then transferred to a plasma CVD device where the protective layer P is formed, thereby completing the organic EL display device 60.

[0088] If the substrate 10 on which the insulating layer 69 has been patterned is exposed to an atmosphere containing moisture or oxygen after being carried into the film-forming apparatus until the formation of the protective layer P is completed, the light-emitting layer made of an organic EL material may be deteriorated by the moisture or oxygen. Therefore, in this example, the substrate is carried in and out of the film-forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0089] According to the alignment apparatus, film formation apparatus, or method for manufacturing an electronic device of this embodiment, the alignment time required is shortened while the accuracy of aligning the substrate and mask during film formation is improved, thereby enabling good film formation. [Explanation of symbols]

[0090] 210: substrate holding unit, 221: mask table, 250: substrate Z actuator, 251: clamp Z actuator, 280: alignment stage, 300: support tool, 302: pressing tool

Claims

1. a substrate holding means having a support portion for supporting a peripheral portion of the substrate and a pressing portion for pressing the peripheral portion in opposition to the support portion; a driving means for driving the pressing portion so as to be in a pressing state in which the pressing portion presses the peripheral portion or in a spaced state in which the pressing portion is spaced from the substrate; A mask holding means for holding a mask; a position adjusting means for adjusting a relative position between the substrate and the mask in a plane along a film-forming surface of the substrate; a moving means for moving at least one of the substrate holding means and the mask holding means so as to change a relative distance between the substrate and the mask in a direction intersecting the plane; It is equipped with The position adjustment means is a first position adjustment is performed by the moving means to adjust the relative positions of the substrate and the mask, which are sandwiched between the supporting portion and the pressing portion in the pressing state, in a plane along the deposition surface of the substrate, with the relative distance between the substrate and the mask being a first distance; after the first position adjustment, the moving means performs a second position adjustment to adjust the relative positions of the substrate and the mask, which are held by the supporting portion and the pressing portion in the pressing state, in a plane along a film formation surface of the substrate, with the relative distance between the substrate and the mask being set to a second distance shorter than the first distance, Prior to the first position adjustment, at least a portion of the substrate is in contact with the mask and the pressing portion is in the separated state, and the substrate, which has received stress from the mask, expands toward its peripheral portion, and the moving means changes the relative distance between the substrate and the mask so that the peripheral portion of the substrate moves outward, and the driving means drives the pressing portion to the separated state, and after at least a portion of the substrate is in contact with the mask and the pressing portion is in the separated state, the driving means drives the pressing portion to the pressing state. An alignment apparatus comprising:

2. The driving means maintains the pressing portion in the separated state from when the supporting portion supports the substrate carried into the alignment device until when the moving means brings at least a portion of the substrate into contact with the mask.