Manufacturing method of plunger

By embedding conductive materials into the base material to form contact points, columnar parts and receiving parts, the problem of difficult piston miniaturization in miniaturized electronic devices is solved, and the effect of more detailed piston manufacturing and reducing manufacturing costs is achieved.

JP7660569B2Active Publication Date: 2025-04-11YOKOWO CO LTD
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Patent Information

Application Number
JP2022531763
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-06-22
Filing Date
2021-06-11
Publication Date
2025-04-11
Estimated Expiration
2041-06-11

AI Technical Summary

Technical Problem

As electronic devices are miniaturized, inspection devices require fine pistons to be placed at high density, which makes it difficult to miniaturize pistons formed by polishing.

Method used

A more detailed piston is made by embedding the first conductive material into a contact point formed in the groove in the base material, the second conductive material embedded in the formed columnar portion in the opening above the first conductive material, and the third conductive material embedded in the formed receiving portion in the opening above the second conductive material.

Benefits of technology

The piston is miniaturized, while reducing manufacturing costs and improving structural flexibility.

✦ Generated by Eureka AI based on patent content.

Smart Images

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Patent Text Reader

Abstract

A first plunger (110) is provided with a first tip contactor (112), a first columnar section (114), and a first receiving section (116). The first tip contactor (112) is formed by embedding a first conducting material in a recess (602A) provided to a metal base material (600A). The first columnar part (114) is provided to a first resist film (610) formed on the metal base material (600A), and is formed by embedding the first conducting material in a first opening (612) positioned above the recess (602A). The first receiving section (116) is provided to a second resist film (620) formed on the first resist film (610), and is formed by embedding a third conducting material in an opening (622) positioned above the first opening (612).
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Description

[Technical field]

[0001] The present invention relates to a plunger and a method for manufacturing a plunger. [Background technology]

[0002] Various inspection devices have been developed for inspecting the characteristics of electronic devices such as integrated circuits (ICs). As described in Patent Document 1, the inspection device includes a plunger. In Patent Document 1, the plunger includes a tip contact and a columnar portion connected to the tip contact. The tip contact is formed by polishing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-25737 A Summary of the Invention [Problem to be solved by the invention]

[0004] As electronic devices become smaller, inspection equipment is required to have fine plungers arranged at high density. For example, when the tip contacts are formed by polishing as described in Patent Document 1, it can be difficult to miniaturize the plungers.

[0005] One example of the object of the present invention is to miniaturize the plunger. Other objects of the present invention will become apparent from the description of this specification. [Means for solving the problem]

[0006] One aspect of the present invention is a tip contact formed by embedding a first conductive material in a recess provided in a substrate; a columnar portion provided in a first resist film formed on the base material and formed by filling a first opening located above the recess with a second conductive material; a receiving portion provided in a second resist film formed on the first resist film, the receiving portion being formed by filling a second opening located above the first opening with a third conductive material; A plunger comprising:

[0007] Another aspect of the present invention is Filling a recess in a substrate with a first conductive material; filling a first opening, which is provided in a first resist film formed on the base material and is located above the recess, with a second conductive material; a step of filling a second opening, the second opening being located above the first opening, with a third conductive material; The present invention relates to a method for manufacturing a plunger. Effect of the Invention

[0008] According to the above-described aspect of the present invention, the plunger can be made fine. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a perspective cross-sectional view showing details of the inspection device according to the first embodiment. [Diagram 2] 5A to 5C are cross-sectional views for illustrating a manufacturing method of the first plunger according to the first embodiment. [Diagram 3] 5A to 5C are cross-sectional views for illustrating a manufacturing method of the first plunger according to the first embodiment. [Figure 4] 5A to 5C are cross-sectional views for illustrating a manufacturing method of the first plunger according to the first embodiment. [Diagram 5] 5A to 5C are cross-sectional views for illustrating a manufacturing method of the first plunger according to the first embodiment. [Figure 6] 5A to 5C are cross-sectional views for illustrating a manufacturing method of the first plunger according to the first embodiment. [Figure 7] 5A to 5C are cross-sectional views for illustrating a manufacturing method of the first plunger according to the first embodiment. [Figure 8]10A to 10C are cross-sectional views for illustrating a method for manufacturing the first plunger according to the second embodiment. [Figure 9] 13A to 13C are cross-sectional views for explaining a method for manufacturing the first plunger according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0011] In this specification, ordinal numbers such as "first," "second," and "third" are used merely to distinguish between components with similar names, unless otherwise specified, and do not refer to any particular characteristics of the components, such as order or importance.

[0012] (Embodiment 1) FIG. 1 is a perspective cross-sectional view showing details of an inspection device 10 according to the first embodiment.

[0013] 1, the direction indicated by the arrow showing the vertical direction Z is the upward direction of the vertical direction Z. The opposite direction to the direction indicated by the arrow showing the vertical direction Z is the downward direction of the vertical direction Z.

[0014] The inspection device 10 includes a first elastomer 100, a plurality of first plungers 110, a plurality of second plungers 120, a first pin plate 130, and a second pin plate 140. Each of the first plungers 110 includes a first tip contactor 112, a first columnar portion 114, and a first receiving portion 116. Each of the second plungers 120 includes a second tip contactor 122, a second columnar portion 124, and a second receiving portion 126. At least a portion of the first elastomer 100, such as the periphery of a hole 102 described below, a conductive film 104 described below, each of the first plungers 110, and each of the second plungers 120 function as a probe. Each of the first plungers 110 and each of the second plungers 120 is biased in the vertical direction Z by at least a portion of the first elastomer 100, such as the periphery of the hole 102.

[0015] The first elastomer 100 has a sheet shape. In one example, the first elastomer 100 is made of a polymer material having elasticity, such as silicone, polyimide, styrene butadiene rubber (SBR), or the like.

[0016] The first elastomer 100 defines a plurality of holes 102 extending through the first elastomer 100 along the vertical direction Z.

[0017] A conductive film 104 is formed on the inner wall of each hole 102. In one example, the conductive film 104 includes at least one metal selected from the group consisting of nickel, copper, and gold. For example, the conductive film 104 is a multi-layer film of these metals.

[0018] Each hole 102 is hollow. In this case, compared to a case where the conductive film 104 is formed on the inner wall of the hole 102 and the hole 102 is solid (the hole 102 is filled), the material and process for making the hole 102 solid are not required, and the manufacturing cost of the inspection device 10 can be reduced.

[0019] The first plunger 110 is located below the first elastomer 100. The first plunger 110 overlaps the first elastomer 100 in the vertical direction Z. Specifically, the first plunger 110 overlaps the hole 102 in the vertical direction Z. Therefore, the first plunger 110 can be biased by the first elastomer 100 in a direction away from the second plunger 120, that is, downward. The first plunger 110 is also electrically connected to the conductive film 104. Therefore, the first plunger 110 can be electrically connected to the second plunger 120 via the conductive film 104. If the first plunger 110 does not overlap the hole 102 in the vertical direction Z, it is necessary to provide an electrical path, such as a conductive material embedded in the first elastomer 100 as a separate entity from the conductive film 104, for the first plunger 110 to be electrically connected to the conductive film 104. However, when the first plunger 110 overlaps with the hole 102 in the vertical direction Z, the first plunger 110 can be directly connected to the conductive film 104 without going through an electrical path such as a conductive material embedded in the first elastomer 100. Therefore, compared to the case where the electrical path is provided, materials and processes for manufacturing the electrical path itself are not required, and the manufacturing cost of the inspection device 10 can be reduced. Note that the first plunger 110 may be offset from the hole 102 in a direction perpendicular to the vertical direction Z. Even in this case, the first plunger 110 can be connected to the conductive film 104 through an electrical path such as a conductive material embedded in the first elastomer 100.

[0020] The first tip contact 112 includes a metal, such as at least one selected from the group consisting of rhodium, ruthenium, iridium, tungsten, and tantalum.

[0021] The width of the first tip contactor 112 narrows from the base end to the tip end of the first tip contactor 112. The first tip contactor 112 is a pyramid such as a circular cone or a pyramid, and has a tapered shape from the base end to the tip end of the first tip contactor 112. The tip of the first tip contactor 112 has a flat surface of, for example, 1 μm or more and 20 μm or less. However, the shape of the tip of the first tip contactor 112 is not limited to this example.

[0022] The first columnar section 114 includes a metal, for example, at least one selected from the group consisting of copper and nickel.

[0023] The first columnar portion 114 is connected to the base end of the first tip contact 112. The first tip contact 112 and the first columnar portion 114 may be integral or separate. The height of the first columnar portion 114 is, for example, 5 μm or more and 300 μm or less. The first columnar portion 114 is a columnar body such as a circular cylinder or a rectangular pillar. When the first columnar portion 114 is a cylinder, the diameter of the first columnar portion 114 is, for example, 20 μm or more and 500 μm or less. However, the shape of the first columnar portion 114 is not limited to this example.

[0024] The first receiving portion 116 includes a metal, for example, at least one selected from the group consisting of copper and nickel.

[0025] The first receiving portion 116 is connected to the end of the first columnar portion 114 opposite to the first tip contact 112. The first columnar portion 114 and the first receiving portion 116 may be integral with each other or may be separate bodies. The first receiving portion 116 has a width greater than that of the first columnar portion 114. The thickness of the first receiving portion 116 is, for example, not less than 5 μm and not more than 200 μm. The upper surface of the first receiving portion 116 is flat. However, at least one protrusion may be formed on the upper surface of the first receiving portion 116.

[0026] The first pin plate 130 is made of, for example, polyimide, liquid crystal polymer, a glass substrate, or the like.

[0027] The first pin plate 130 defines a plurality of first through holes 132. A plurality of first plungers 110 are inserted into each of the plurality of first through holes 132. The plurality of first plungers 110 can be arranged at a minute pitch (narrow pitch), for example, not less than 10 μm and not more than 500 μm.

[0028] At least a portion of the first tip contactor 112 is exposed from the lower end of the first through hole 132 of the first pin plate 130. At least a portion of the first columnar portion 114 penetrates the first through hole 132. The first receiving portion 116 is located between the upper surface of the first pin plate 130 and the lower surface of the first elastomer 100. The width of the first receiving portion 116 in the left-right direction in the figure is wider than the width of the first through hole 132 in the left-right direction in the figure. Therefore, the first receiving portion 116 is caught on the peripheral portion of the opening end of the first through hole 132 on the upper surface of the first pin plate 130. In this case, even if the first plunger 110 is urged downward by the first elastomer 100, it is possible to prevent the first receiving portion 116 from slipping out of the first pin plate 130 below through the first through hole 132. Therefore, compared to a case where there is no first receiving portion 116, even if the length of the first plunger 110 (the length of the first columnar portion 114) is shortened, the first plunger 110 is less likely to slip out below the first pin plate 130. The length of the first plunger 110 can be shortened, and the first plunger 110 can be applied to inspections in the high frequency band of 1 GHz or more and 100 GHz or less.

[0029] The second plunger 120 is located above the first elastomer 100. The second plunger 120 overlaps with the first elastomer 100 in the vertical direction Z. Specifically, the second plunger 120 overlaps with the hole 102 in the vertical direction Z. Therefore, the second plunger 120 can be biased by the first elastomer 100 in a direction away from the first plunger 110, that is, upward. The second plunger 120 is electrically connected to the conductive film 104. Therefore, the second plunger 120 can be electrically connected to the first plunger 110 via the conductive film 104. If the second plunger 120 does not overlap with the hole 102 in the vertical direction Z, the second plunger 120 is electrically connected to the conductive film 104, and therefore, an electrical path such as a conductive material embedded in the first elastomer 100 as a separate entity from the conductive film 104 must be provided. However, when the second plunger 120 overlaps with the hole 102 in the vertical direction Z, the second plunger 120 can be directly connected to the conductive film 104 without passing through an electrical path such as a conductive material embedded in the first elastomer 100. Therefore, compared to the case where the electrical path is provided, materials and processes for manufacturing the electrical path itself are not required, and the manufacturing cost of the inspection device 10 can be reduced. Note that the second plunger 120 may be offset from the hole 102 in a direction perpendicular to the vertical direction Z. Even in this case, the second plunger 120 can be connected to the conductive film 104 via an electrical path such as a conductive material embedded in the first elastomer 100.

[0030] The second pin plate 140 defines a plurality of second through holes 142. Similarly to the plurality of first plungers 110 and the first pin plate 130, a plurality of second plungers 120 are inserted into each of the plurality of second through holes 142.

[0031] According to this embodiment, compared to the case where the plunger is biased by a spring, the first elastomer 100 plays the role of the spring's expansion and contraction, and the conductive film 104 plays the role of the spring's conduction. ShortIn order to achieve this, it is necessary to shorten the free length of the spring. However, in this case, it is difficult to obtain a sufficient stroke. In contrast, in this embodiment, there is no need to use a spring. Therefore, compared to the case where the plunger is biased by a spring, it is possible to shorten the natural length of the probe while obtaining a sufficient stroke.

[0032] In this embodiment, the first plunger 110 and the second plunger 120 overlap with the first elastomer 100 in the vertical direction Z. However, the first elastomer 100 and the second plunger 120 may overlap with the first elastomer 100 in a direction different from the vertical direction Z.

[0033] 2 to 7 are cross-sectional views for explaining the manufacturing method of the first plunger 110 according to embodiment 1. In Fig. 2 to Fig. 7, a normal direction Z1 of the surface of the metal base 600A on which the recess 602A is formed is shown.

[0034] 2 to 7, a method for manufacturing the first plunger 110 will be described. The second plunger 120 can also be manufactured in the same manner as described below.

[0035] First, as shown in Fig. 2, a recess 602A is formed in a metal base material 600A. The width of the recess 602A narrows from the opening end to the bottom end of the recess 602A. The recess 602A has a tapered shape. The metal base material 600A is, for example, a copper plate. The recess 602A is formed in the metal base material 600A by, for example, a punch or a press.

[0036] Next, as shown in FIG. 3, a first resist film 610 is formed on the metal substrate 600A. A first opening 612 is provided in the first resist film 610. The first opening 612 overlaps with the recess 602A in the normal direction Z1. The width of the first opening 612 is wider than the width of the opening end of the recess 602A. That is, the width of the first columnar section 114 may differ from the width of the base end of the first tip contact 112 due to the tolerance between the width of the first opening 612 and the width of the opening end of the recess 602A. However, the width of the first columnar section 114 may be equal to the width of the base end of the first tip contact 112. That is, the width of the first opening 612 may be equal to the width of the opening end of the recess 602A.

[0037] Next, as shown in FIG. 4, a first conductive material that will become the first tip contact 112 is formed by plating, thereby filling the recess 602A with the first conductive material. As a result, the first tip contact 112 is formed in the recess 602A. Therefore, the first tip contact 112 has a plating layer. Next, the thickness of the first resist film 610 is further increased. Next, a second conductive material that will become the first columnar section 114 is formed by plating, thereby filling the first opening 612 with the second conductive material. As a result, the first columnar section 114 is formed in the first opening 612. Therefore, the first columnar section 114 has a plating layer.

[0038] Next, as shown in FIG. 5, a first seed layer 116a is formed on the first columnar section 114 and the first resist film 610.

[0039] 6, a second resist film 620 is formed on the first resist film 610. A second opening 622 is provided in the second resist film 620. The second opening 622 overlaps with the first opening 612 in the normal direction Z1. The width of the second opening 622 is wider (larger) than the width of the first opening 612.

[0040] 7, a third conductive material that becomes the first plating layer 116b is formed by plating, thereby filling the second opening 622 with the third conductive material. This forms the first receiving portion 116 in the second opening 622. In this case, the first receiving portion 116 is formed simultaneously as a plurality of layers including the first seed layer 116a and the first plating layer 116b.

[0041] Next, the first resist film 610 and the second resist film 620 are removed by, for example, a chemical treatment. Next, the first plunger 110 is removed from the metal base material 600A. Next, if necessary, the tip of the first tip contactor 112 is processed by, for example, machining to form a flat surface. The flat surface of the tip of the first tip contactor 112 may be formed by adjusting the shape of the bottom end of the recessed portion 602A of the metal base material 600A.

[0042] According to this embodiment, the first tip contactor 112 can be formed using the recess 602A of the metal base material 600A as a mold. The first columnar section 114 can be formed using the first opening 612 of the first resist film 610 as a mold. The first receiving section 116 can be formed using the second opening 622 of the second resist film 620 as a mold. Therefore, the first plunger 110 can be made finer than when the first tip contactor 112 is formed by polishing. According to this embodiment, the first plunger 110 can be manufactured at a lower cost than when the first tip contactor 112 is formed by polishing. Furthermore, according to this embodiment, the degree of freedom of the structure of the first plunger 110 can be increased compared to when the first tip contactor 112 is formed by polishing.

[0043] (Embodiment 2) 8 is a cross-sectional view for explaining a manufacturing method of the first plunger 110 according to embodiment 2. The method according to embodiment 2 is similar to the method according to embodiment 1, except for the following points.

[0044] In this embodiment, the first plunger 110 is manufactured as follows.

[0045] First, as shown in Fig. 8, a recess 602B is formed in a semiconductor base material 600B. The semiconductor base material 600B is, for example, a silicon substrate. The recess 602B is formed by, for example, anisotropic etching.

[0046] The subsequent steps are similar to those described with reference to FIGS. 3 to 7 in the first embodiment.

[0047] In general, the flatness of the surface of the semiconductor base 600B according to the second embodiment is higher than that of the metal base 600A according to the first embodiment. Therefore, in the second embodiment, the first tip contactor 112 can be formed using the recess 602B provided on the surface having such high flatness as a mold. Therefore, compared to the first embodiment, the second embodiment can be more suitable for mass production of the first plunger 110.

[0048] (Embodiment 3) 9 is a cross-sectional view for explaining a manufacturing method of the first plunger 110 according to embodiment 3. The method according to embodiment 3 is similar to the method according to embodiment 1, except for the following points.

[0049] In this embodiment, the first plunger 110 is manufactured as follows.

[0050] First, as shown in Fig. 9, a recess 602C is formed in a resin base material 600C. The resin base material 600C is, for example, polyimide or liquid crystal polymer. The recess 602C is formed, for example, by machining. Next, a seed layer 604C is formed on the inner wall of the recess 602C. The seed layer 604C is provided for depositing a first conductive material, which becomes the first tip contact 112, by plating.

[0051] The following steps are the same as those in the embodiment. 1 The steps are the same as those described with reference to FIGS.

[0052] In general, the resin base 600C according to embodiment 3 is softer than the metal base 600A according to embodiment 1. Therefore, in the resin base 600C according to embodiment 3, it may be easier to form recesses compared to the metal base 600A according to embodiment 1.

[0053] Although the embodiments of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted.

[0054] According to the present specification, the following aspects are provided. (Aspect 1-1) Aspect 1-1 is a tip contact formed by embedding a first conductive material in a recess provided in a substrate; a columnar portion provided in a first resist film formed on the base material and formed by filling a first opening located above the recess with a second conductive material; a receiving portion provided in a second resist film formed on the first resist film, the receiving portion being formed by filling a second opening located above the first opening with a third conductive material; A plunger comprising: According to aspect 1-1, the tip contactor can be formed using the recess of the base material as a mold. The columnar portion can be formed using the first opening of the first resist film as a mold. The receiving portion can be formed using the second opening of the second resist film as a mold. Therefore, the plunger can be made finer than when the tip contactor is formed by polishing. (Aspect 1-2) Aspect 1-2 is The plunger according to aspect 1-1, wherein the width of the columnar portion is different from the width of the base end of the tip contact. According to aspect 1-2, the width of the columnar portion is different from the width of the base end of the tip contactor due to the tolerance between the width of the opening end of the recess of the substrate for forming the tip contactor and the width of the opening of the resist for forming the columnar portion. By making the width of the columnar portion different from the width of the base end of the tip contactor, it is possible to prevent the plunger from falling off the inspection device. (Aspects 1-3) Aspects 1-3 are The plunger according to aspect 1-1 or 1-2, wherein the receiving portion has a plurality of layers. Aspects 1- According to No. 3, the receiving portion is formed by forming a plating layer on a seed layer, whereby the receiving portion has a plurality of layers including the seed layer and the plating layer. (Aspect 2-1) Aspect 2-1 is Filling a recess in a substrate with a first conductive material; filling a first opening, the first opening being provided in a first resist film formed on the base material and positioned above the recess, with a second conductive material; a step of filling a second opening, the second opening being located above the first opening, with a third conductive material; The present invention relates to a method for manufacturing a plunger. According to aspect 2-1, the tip contactor can be formed from a first conductive material using the recess of the substrate as a mold. The columnar portion can be formed from a second conductive material using the first opening of the first resist film as a mold. The receiving portion can be formed from a third conductive material using the second opening of the second resist film as a mold. Therefore, the plunger can be made finer than when the tip contactor is formed by polishing. (Aspect 2-2) In aspect 2-2, A method for manufacturing a plunger according to aspect 2-1, wherein a width of the first opening is different from a width of an opening end of the recess. According to aspect 2-2, the width of the columnar portion can be made different from the width of the base end of the tip contactor. By making the width of the columnar portion different from the width of the base end of the tip contactor, it is possible to prevent the plunger from falling off the inspection device. (Aspect 2-3) In aspect 2-3, A method for manufacturing a plunger according to aspect 2-1 or 2-2, wherein the third conductive material is formed on a seed layer. According to the aspect 2-3, the receiving portion can be formed by forming a plating layer on the seed layer. (Aspect 3-1) Aspect 3-1 is a tip contact having a first plating layer that narrows from a base end to a tip end; a columnar portion having a second plating layer connected to the base end of the tip contact; a receiving portion connected to an end of the columnar portion opposite to the tip contact and having a third plating layer having a width wider than a width of the columnar portion; The plunger comprises: According to aspect 3-1, the tip contactor can be formed using the recess of the base material as a mold. The columnar portion can be formed using the first opening of the first resist film as a mold. The receiving portion can be formed using the second opening of the second resist film as a mold. Therefore, the plunger can be made finer than when the tip contactor is formed by polishing. (Aspect 3-2) In aspect 3-2, The plunger according to aspect 3-1, wherein a width of the columnar portion is different from a width of the base end of the tip contact. According to aspect 3-2, the width of the columnar portion is different from the width of the base end of the tip contactor due to the tolerance between the width of the opening end of the recess of the substrate for forming the tip contactor and the width of the opening of the resist for forming the columnar portion. By making the width of the columnar portion different from the width of the base end of the tip contactor, it is possible to prevent the plunger from falling off the inspection device. (Aspect 3-3) Aspect 3-3 is The plunger according to aspect 3-1 or 3-2, wherein the receiving portion has multiple layers. According to aspect 3-3, the receiving portion is formed by forming a third plating layer on the seed layer, whereby the receiving portion has a plurality of layers including the seed layer and the third plating layer.

[0055] This application claims priority based on Japanese Patent Application No. 2020-106766, filed on June 22, 2020, the disclosure of which is incorporated herein in its entirety. [Explanation of symbols]

[0056] 10 Inspection equipment 100 First elastomer 102 holes 104 Conductive film 110 First plunger 112 1st tip contact 114 1st columnar part 116 First receiving part 116a First seed layer 116b First plating layer 120 Second plunger 122 2nd tip contact 124 Second columnar part 126 Second receiving part 130 First pin plate 132 First through hole 140 2nd pin plate 142 Second Through Hole 600A Metallic Substrate 600B Semiconductor Substrate 600C resin base material 602A Recess 602B Recess 602C Recess 604C Seed layer 610 First resist film 612 First Opening 620 Second resist film 622 Second Opening Z vertical direction Z1 normal direction

Claims

1. A method for manufacturing a plunger that is inserted into a through hole defined by a pin plate and is electrically connected to a conductive film formed on an inner wall of the hole defined by a first elastomer, comprising the steps of: Filling a recess in a substrate with a first conductive material; filling a first opening, the first opening being provided in a first resist film formed on the base material and located above the recess, with a second conductive material; a step of filling a second opening, the second opening being provided in a second resist film formed on the first resist film, with a third conductive material to form a receiving portion in the second opening, the second opening being located above the first opening; Equipped with The width of the receiving portion is wider than the width of the through hole, A method for manufacturing a plunger, wherein the receiving portion is located between the first elastomer and the pin plate.

2. The method for manufacturing a plunger according to claim 1 , wherein a width of the first opening is different from a width of an open end of the recess.

3. The method of claim 1 or 2, wherein the third conductive material is formed on a seed layer.

4. The method for manufacturing a plunger according to any one of claims 1 to 3, wherein a width of the receiving portion is larger than a width of the hole of the first elastomer.

Citation Information

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