Composite probe, probe attachment method, and probe card manufacturing method
By using a synthetic probe, the guide hole of the second guide plate is first inserted by a collar rod, and then the probe body is inserted into the guide hole of the first guide plate, the problem of difficulty in inserting the probe in the prior art is solved, and the stable installation and efficient manufacturing of the probe are achieved.
Patent Information
- Application Number
- JP2024507322
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-03-16
- Publication Date
- 2025-04-14
- Estimated Expiration
- 2042-03-16
AI Technical Summary
The prior art is difficult to effectively insert probes with curvature or deformed during manufacturing into guide holes in two or more guide plates, resulting in difficulty in insertion and risk of probe damage.
A composite probe is used, which includes a probe body and a leader rod with a linear shape. The leader rod is first inserted into the guide hole of the second guide plate, and then the probe body is inserted into the guide hole of the first guide plate, and finally the collar rod is separated from the probe body, thereby achieving stable installation of the probe.
Through the design of synthetic probes, the process of inserting the probe into the guide plate is simplified, avoiding positional offset and damage caused by posture changes during the insertion process, and improving the reliability and efficiency of probe installation.
Smart Images

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Abstract
Description
[Technical field]
[0001] The present invention relates to a composite probe, a method for attaching a probe, and a method for manufacturing a probe card, and more specifically, to a composite probe for attaching a probe to a guide unit composed of two or more guide plates, a method for attaching a probe using the composite probe, and a method for manufacturing a probe card that includes the attachment method. [Background technology]
[0002] A probe card is an inspection device used to inspect the electrical characteristics of semiconductor devices formed on a semiconductor wafer, and has a large number of probes provided on a wiring board, each of which is brought into contact with an electrode terminal on the semiconductor wafer.
[0003] A probe card is composed of a guide unit that supports the probes and a wiring board to which the guide unit is attached. The guide unit is composed of two or more guide plates arranged in parallel at a specified distance apart, and the probes are inserted sequentially into the guide holes of these guide plates and supported so as to be movable up and down. The probe card is manufactured by attaching the guide unit that houses the probes to the wiring board.
[0004] When a probe is inserted sequentially through the guide holes of two or more guide plates, it is relatively easy to insert the probe through the guide hole of the first guide plate, but it is not easy to insert the probe through the guide holes of the second and subsequent guide plates. In particular, when the probe has a curved portion, it is not easy to insert the probe through two or more guide plates.
[0005] 14 is a diagram showing how the probe 50 is attached to the guide unit 30. The guide unit 30 includes an upper guide plate 301 and a lower guide plate 302 spaced apart from each other, with the upper guide plate 301 provided with an upper guide hole 311 and the lower guide plate 302 provided with a lower guide hole 312.
[0006] When the probe 50, which is inserted successively into the upper guide hole 311 and the lower guide hole 312, has a curved portion 503, the attitude of the probe 50 changes when the curved portion 503 passes through the upper guide hole 311, causing the positional deviation of the tip of the probe 50. For this reason, it is not easy to insert the tip of the probe 50 into the lower guide hole 312, and if an attempt is made to forcibly insert the tip, there is a risk that the probe will be damaged or deformed. Note that the same problem occurs not only when the probe 50 has the curved portion 503, but also when the probe 50 is warped during the manufacturing process.
[0007] A method has been proposed in the prior art in which a removable tab is connected to a probe and the tab is grasped with a grasping tool (for example, Patent Document 1), but this does not solve the problems that arise when the posture of the probe changes when the probe is inserted through two or more guide plates. [Prior art documents] [Patent documents]
[0008] [Patent Document 1] JP 2014-16205 A Summary of the Invention [Problem to be solved by the invention]
[0009] The present invention has been made in view of the above circumstances, and has an object to facilitate insertion of a probe into two or more guide plates. In particular, it has an object to provide a composite probe that can be easily attached to a guide unit. It also has an object to provide a probe attachment method for attaching a probe to a guide unit using a composite probe. It also has an object to provide a probe card manufacturing method for manufacturing a probe card using a composite probe. [Means for solving the problem]
[0010] A composite probe according to a first embodiment of the present invention includes a probe body that is accommodated in a guide unit for a probe card, the probe body being composed of a first guide plate and a second guide plate that are spaced apart from each other, and is supported by a first guide hole of the first guide plate and a second guide hole of the second guide plate, and a leader rod that has a substantially linear shape and has one end connected to the probe body, is inserted into the first guide hole before the probe body, and is detachable from the probe body after passing through the second guide hole. a first rod having a substantially linear shape supported in the first guide hole, a second rod having a substantially linear shape supported in the second guide hole, and a curved portion disposed between the first guide plate and the second guide plate and connecting the first rod and the second rod, wherein the leader rod is connected to a tip of the second rod coaxially with the second rod, and the total length of the leader rod and the second rod is longer than the distance between non-facing surfaces of the first guide plate and the second guide plate. By adopting such a configuration, A probe having a curved portion is provided as a probe body constituting a composite probe together with a leader rod, and the leader rod can be inserted into the second guide hole before the curved portion is inserted into the first guide hole, and the probe having the curved portion can be inserted into the guide unit. The installation work can be simplified.
[0011] Second In addition to the above configuration, the composite probe according to the embodiment of the present invention further comprises: Distance between non-facing surfaces By adopting such a configuration, the leader rod can be inserted into the second guide hole before the connecting portion connecting the probe body and the leader rod reaches the first guide hole. This makes it possible to suppress breakage of the connecting portion before the leader rod is inserted into the second guide hole, and makes it easier to attach the probe to the guide unit.
[0012] Third In addition to the above configuration, the composite probe according to the embodiment of the present invention is configured so that the length of the leader rod is equal to or greater than the length of the probe body. By adopting such a configuration, as long as the probe body is an attachable guide unit, the leader rod can be inserted into the second guide hole before the connecting portion connecting the probe body and the leader rod reaches the first guide hole, regardless of the spacing between the first guide plate and the second guide plate.
[0013] FourthIn addition to the above configuration, the composite probe according to the embodiment of the present invention has the leader rod and the second rod which are metal layers laminated in sequence by plating and are joined at an interface substantially parallel to the lamination direction. By adopting such a configuration, the leader rod can be easily separated from the probe body.
[0014] Fifth In addition to the above configuration, the composite probe according to the embodiment of the present invention further includes a connecting portion that connects the leader rod and the second rod, and the connecting portion is The metal layer is laminated by plating, and is configured so that the thickness in the lamination direction is smaller than that of the leader rod and the second rod.
[0015] Sixth A method for attaching a probe according to an embodiment of the present invention is a method for attaching a probe to a guide unit for a probe card, the guide unit comprising a first guide plate and a second guide plate arranged apart from each other, comprising the steps of: a probe body including a first rod supported in a first guide hole of the first guide plate, a second rod supported in a second guide hole of the second guide plate, and a curved portion disposed between the first guide plate and the second guide plate and connecting the first rod and the second rod; and a leader rod connected to a tip of the probe body; Using a composite probe comprising: The leader rod The first guide plate is inserted before the probe body. The above A step of inserting the leader rod into a first guide hole, and Before the curved portion is inserted into the first guide hole, The second guide plate The above and a step of further inserting the leader rod into a second guide hole, and a step of separating the leader rod from the probe body while the probe body is supported by the first guide hole and the second guide hole. Has a curved portion The probe is provided as a probe body which, together with a leader rod, constitutes a composite probe; The leader rod can be inserted into the second guide hole before the curved portion is inserted into the first guide hole, and the curved portion is This facilitates the attachment of the probe to the guide unit.
[0016] Seventh A method for manufacturing a probe card according to an embodiment of the present invention includes the steps of attaching a probe to the guide unit by using the above-mentioned probe attachment method, and attaching the guide unit to which the probe is attached to a wiring board. By adopting such a configuration, it is possible to facilitate the manufacture of the probe card. Effect of the Invention
[0017] According to the present invention, it is possible to facilitate insertion of a probe into two or more guide plates. In particular, it is possible to provide a composite probe that can be easily attached to a guide unit. It is also possible to provide a probe attachment method that can easily attach a probe to a guide unit. It is also an object of the present invention to provide a probe card manufacturing method that can easily manufacture a probe card. [Brief description of the drawings]
[0018] [Figure 1] 1 is a diagram showing an example of a configuration of a composite probe 60 according to a first embodiment of the present invention. [Diagram 2] 13A to 13C are diagrams showing an example of a method for attaching a probe 50 to a guide unit 30 using a composite probe 60. [Diagram 3] FIG. 1 shows the guide unit 30 with all required probes 50 attached. [Figure 4] FIG. 2 is a diagram showing a probe card 1 to which a guide unit 30 is attached. [Diagram 5] 1 is a diagram showing an example of a detailed configuration of a composite probe 60, illustrating the appearance of a connecting portion 630. FIG. [Figure 6] FIG. 11 is a diagram showing an example of a configuration of a composite probe 61 according to a second embodiment of the present invention. [Figure 7] FIG. 11 is a diagram showing an example of a configuration of a composite probe 62 according to a third embodiment of the present invention. [Figure 8] FIG. 13 is a diagram showing an example of a detailed configuration of a composite probe 63 according to a fourth embodiment of the present invention, illustrating the appearance of a connecting portion 630. [Figure 9] 11A to 11C are diagrams showing an example of a method for manufacturing a composite probe 63. [Figure 10] FIG. 13 is a diagram showing an example of a detailed configuration of a composite probe 64 according to a fifth embodiment of the present invention, illustrating the appearance of a connecting portion 630. [Figure 11] 11A to 11C are diagrams showing an example of a method for manufacturing a composite probe 64. [Figure 12] FIG. 13 is a diagram showing an example of a detailed configuration of a composite probe 65 according to a sixth embodiment of the present invention, illustrating the appearance of a connecting portion 630. [Figure 13] 13A to 13C are diagrams showing an example of a method for manufacturing a composite probe 65. [Figure 14] 1A and 1B are diagrams showing a state in which a probe 50 is attached to a guide unit 30 by a conventional method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] Embodiment 1 (1) Composite Probe 60 FIG. 1 is a diagram showing an example of a configuration of a composite probe 60 according to a first embodiment of the present invention, and shows an example of a state in which a probe 50 is attached to a guide unit 30 using the composite probe 60. As shown in FIG.
[0020] The composite probe 60 is configured by connecting a leader rod 610 to one end of a probe body 600. The probe body 600 corresponds to the probe 50 attached to the guide unit 30. The leader rod 610 is a leader that is inserted into the guide holes 311, 312 of the guide unit 30 prior to the probe body 600. After the probe body 600 is inserted into the guide holes 311, 312 following the leader rod 610, the leader rod 610 is separated from the probe body 600 to obtain the probe 50 attached to the guide unit 30.
[0021] (2) Guide unit 30 The guide unit 30 includes two guide plates 301, 302 that support the probe 50, and a connecting spacer 303 that connects these guide plates 301, 302 to each other.
[0022] The upper guide plate 301 is a plate-like member, such as a ceramic plate, in which two or more upper guide holes 311 are formed. The upper guide hole 311 is a hole that penetrates the upper guide plate 301 in the plate thickness direction, through which the probe 50 is inserted and which supports the vicinity of the upper end of the probe 50.
[0023] The lower guide plate 302 is a plate-like member, such as a ceramic plate, in which two or more lower guide holes 312 are formed, and is arranged to face the lower surface of the upper guide plate 301 by the connecting spacer 303. The lower guide plate 302 is arranged below the upper guide plate 301 so as to be parallel to the upper guide plate 301 at a predetermined distance. The lower guide hole 312 is a hole that penetrates the lower guide plate 302 in the plate thickness direction, through which the probe 50 is inserted, and supports the vicinity of the lower end of the probe 50 so that it can move up and down. Note that the upper guide hole 311 and the lower guide hole 312 through which the same probe 50 is inserted are desirably arranged to face each other in a direction perpendicular to the guide plates 301 and 302 in order to facilitate the insertion of the leader rod 610, but the present invention is not limited to such a configuration.
[0024] (3) Probe 50 (probe body 600) The probe 50 is a vertical probe that extends in a direction substantially perpendicular to the guide plates 301, 302. The probe 50 is made of a conductive material having an elongated shape. The material of the probe 50 is a metal material having both good elasticity and conductive properties, such as a nickel (Ni) alloy or a palladium (Pd) alloy. The probe 50 may be made of only a single conductive material, but may also be made of two or more conductive materials. For example, gold (Au), copper (Cu), or the like, which have particularly high conductive properties, may be used in part.
[0025] The probe 50 includes an upper rod 501, a lower rod 502, a curved portion 503, and a stopper 510. The upper rod 501 and the lower rod 502 are connected via the curved portion 503. The stopper 510 is provided on the upper rod 501.
[0026] Upper rod 501 has a substantially linear shape, is inserted into upper guide hole 311, and is supported by upper guide plate 301. An upper end of upper rod 501 protrudes upward from guide unit 30, while a lower end of upper rod 501 is connected to curved portion 503 within guide unit 30.
[0027] Lower rod 502 has a substantially linear shape, is inserted into lower guide hole 312, and is supported by lower guide plate 302. The lower end of lower rod 502 protrudes downward from guide unit 30, while the upper end of lower rod 502 is connected to curved portion 503 within guide unit 30. Note that, although an example in which lower rod 502 is coaxial with upper rod 501 is shown in the figure, the present invention is not limited to only this configuration.
[0028] The curved portion 503 has a curved shape and is elastically deformed by pressure received from the test object during testing. The curved portion 503 is buckled and deformed by external force received from the test object, thereby allowing the probe 50 to elastically contact the test object. Furthermore, by providing the curved portion 503, the portion and direction of deformation of the probe 50 can be predefined, thereby preventing contact between adjacently arranged probes 50.
[0029] The stopper 510 is a protrusion provided on the side surface of the upper rod 501, and the stopper 510 is engaged with the upper surface of the upper guide plate 301, thereby preventing the probe 50 from falling off the guide unit 30. Since the probe main body 600 is the same as the probe 50, the same reference numerals are used for corresponding configurations, and duplicated explanations will be omitted.
[0030] (4) Leader Rod 610 Leader rod 610 is inserted into guide holes 311, 312 prior to probe body 600, and serves to facilitate insertion of probe body 600 into guide holes 311, 312. Leader rod 610 has a substantially linear shape, and the upper end of leader rod 610 is connected to the lower end of probe body 600, i.e., the lower end of lower rod 502.
[0031] The maximum cross-sectional area of leader rod 610 is desirably smaller than the maximum cross-sectional area of lower rod 502. Additionally, leader rod 610 is desirably coaxial with lower rod 502. That is, when viewed from the axial direction, the cross section of leader rod 610 is desirably located within the contour of the cross section of lower rod 502. Additionally, the material of leader rod 610 may be the same as that of probe body 600, or may be a different material.
[0032] The tip portion 620 of the leader rod 610 has a tapered shape with a cross-sectional area decreasing toward the tip. By making the lower end of the leader rod 610 tapered, it is possible to facilitate insertion of the leader rod 610 into the guide holes 311, 312.
[0033] The leader rod 610 is connected to the probe body 600 at a connecting portion 630. It is desirable that the connecting portion 630 does not break when the composite probe 60 is inserted into the guide unit 30, but can easily break when the entire leader rod 610 passes through the guide unit 30 and protrudes from the guide unit 30. For example, by providing an appropriate notch, the connecting portion 630 can be easily broken after the leader rod 610 has passed through without breaking when the composite probe 60 is inserted.
[0034] (5) How to install the probe 50 2 is a diagram showing an example of a method for attaching a probe 50, in which (a) to (c) are shown in chronological order the steps of attaching the probe 50 to the guide unit 30 using a composite probe 60. The probe attachment step shown in the diagram is part of the manufacturing process of the probe card, and is also part of the repair process of the probe card in which a damaged probe 50 is replaced.
[0035] (a) in the figure shows the same state as in Figure 1, focusing on the composite probe 60, and shows the state in which the leader rod 610 is inserted into the upper guide hole 311 and then into the lower guide hole 312.
[0036] FIG. 1B shows a state in which leader rod 610 is separated when the entire leader rod 610 protrudes downward below lower guide plate 302. Leader rod 610 is separated, for example, by application of an external force in the bending direction, or by irradiation with laser light.
[0037] If the sum of length L1 of leader rod 610 and length L2 of lower rod 502 is longer than distance L3 of the non-opposing surfaces of guide plates 301, 302, curved portion 503 is inserted into upper guide hole 311, and tip portion 620 of leader rod 610 is inserted into lower guide hole 312 before the posture of composite probe 60 changes. Therefore, tip portion 620 of leader rod 610 can be inserted into lower guide hole 312 without being affected by curved portion 503. Note that distance L3 of the non-opposing surfaces of guide plates 301, 302 refers to the distance between the upper surface of upper guide plate 301 and the lower surface of lower guide plate 302.
[0038] FIG. 1C shows the state after the leader rod 610 has been cut off. Only the probe body 600 remains in the guide unit 30, the stopper 510 is engaged with the upper guide plate 301, the upper rod 501 is supported by the upper guide plate 301, and the lower rod 502 is supported by the lower guide plate 302. In other words, the probe 50 attached to the guide unit 30 is obtained.
[0039] (6) Probe card 1 Fig. 3 is a diagram showing a guide unit 30 to which all necessary probes 50 are attached. Fig. 4 is a diagram showing a probe card 1 to which the guide unit 30 of Fig. 3 is attached, and shows a cross section of the probe card 1 arranged horizontally in a wafer prober, cut along a vertical plane.
[0040] The probe card 1 is attached to the card holder 20 so that the installation surface of the probes 50 faces the semiconductor wafer 211 on the stage 21, and by moving the stage 21 up and down, the probes 50 can be brought into contact with the electrode terminals 212 on the semiconductor wafer 211. The probe card 1 is composed of a main substrate 10, a reinforcing plate 103, a guide unit 30, and two or more probes 50.
[0041] The main substrate 10 is a wiring substrate that is detachably attached to a wafer prober, and is horizontally disposed with the outer periphery of its lower surface supported by a card holder 20 of the wafer prober. A reinforcing plate 103 is attached to the center of the upper surface of the main substrate 10, and two or more external terminals 101 to which signal terminals of a tester device (not shown) are connected are provided on the outer periphery. Two or more probe electrodes 102 to which probes 50 are connected are provided in the center of the lower surface, and the probe electrodes 102 and the external terminals 101 are electrically connected to each other via the main substrate 10.
[0042] The guide unit 30 is a support member for the probes 50 that supports two or more probes 50 so that they can move up and down and positions them in a horizontal plane, and is attached so as to face the lower surface of the main board 10 via the attachment spacer 40. In other words, the upper guide plate 301 is disposed below the main board 10 so as to be parallel to the main board 10 at a predetermined distance.
[0043] The probe 50 has a shape extending in a direction intersecting with the main substrate 10, and both its upper and lower ends protrude from the guide unit 30. The upper end of the probe 50 is connected to the probe electrode 102, and the lower end of the probe 50 can be brought into contact with an electrode terminal 212 on the object to be tested.
[0044] (7) Connecting part 630 5 is a diagram showing an example of a detailed configuration of the composite probe 60, showing the appearance of the connecting part 630. In the diagram, (a) is a perspective view of the connecting part 630, (b) is a front view when facing the stacking surface, and (c) is a side view of the composite probe 60 in the width direction.
[0045] A pair of cutouts 631 are formed in the connecting portion 630, and are narrower in width and smaller in cross-sectional area than the probe body 600 and the leader rod 610. The pair of cutouts 631 are, for example, wedge-shaped with apexes facing each other, and are formed on opposing side surfaces of the composite probe 60 having a rectangular cross section.
[0046] The composite probe 60 is formed by laminating metal materials by plating. The lamination direction D is perpendicular to the axial direction A of the composite probe 60, and the lamination surface is perpendicular to the lamination direction D. In this specification, the size of the composite probe 60 in the lamination direction D is called the thickness, and the size in the direction intersecting both the lamination direction D and the axial direction A is called the width. The pair of cutouts 631 are recesses formed on a pair of side surfaces facing each other in the width direction of the composite probe 60, and can be realized as a pattern on the lamination surface. The tapered shape of the tip 620 of the leader rod 610 can also be realized as a similar pattern.
[0047] Probe body 600 and leader rod 610 are laminated and formed at the same time in the same lamination process. That is, probe body 600 and leader rod 610 are made of the same material and are integrally formed. In this case, probe body 600 and leader rod 610 are firmly connected, but by providing cutout portion 631 of appropriate shape and size, it is possible to realize connecting portion 630 that does not break when composite probe 60 is inserted, and can be easily broken after that, when the entire leader rod 610 has passed through guide unit 30.
[0048] In the present embodiment, an example has been described in which probe body 600 and leader rod 610 are made of the same material and are integrally formed, but composite probe 60 according to the present invention is not limited to this configuration. For example, even if probe body 600 and leader rod 610 are made of different materials or are laminated in sequence in different lamination processes, a configuration in which notch 631 is provided can be adopted if the two are firmly connected.
[0049] Further, in this embodiment, an example in which the cutout portion 631 is wedge-shaped has been described, but the cutout portion 631 according to the present invention is not limited to this configuration and can be in any shape.
[0050] Embodiment 2 Fig. 6 is a diagram showing an example of a configuration of a composite probe 61 according to a second embodiment of the present invention. The composite probe 61 is different from the composite probe 60 (first embodiment) in Fig. 2 in the length of the leader rod 610. The other configurations are the same as those of the composite probe 60, so a duplicated description will be omitted.
[0051] Length L1 of leader rod 610 is configured to be longer than distance L3 between non-opposing surfaces of guide plates 301, 302. By employing such a configuration, tip portion 620 is inserted into lower guide hole 312 before connecting portion 630 is inserted into upper guide hole 311. Therefore, it is possible to suppress breaking of connecting portion 630 before leader rod 610 is inserted into lower guide hole 312. Even if lower rod 502 is curved or leader rod 610 is not coaxial with lower rod 502, insertion of composite probe 61 can be facilitated as long as leader rod 610 has a linear shape.
[0052] Furthermore, it is more desirable that length L1 of leader rod 610 is equal to or greater than length L4 of probe body 600. Since length L4 of probe body 600 is greater than distance L3 between non-opposing surfaces of guide plates 301, 302, if length L1 of leader rod 610 is equal to or greater than length L4 of probe body 600, regardless of distance L3 between non-opposing surfaces of guide plates 301, 302 actually used, length L1 of leader rod 610 can be made greater than distance L3 between non-opposing surfaces of guide plates 301, 302, facilitating insertion of composite probe 61. Note that length L4 of probe body 600 refers to the linear distance between both ends.
[0053] Embodiment 3 In embodiment 1, an example of a composite probe 60 inserted into the guide unit 30 from the upper guide plate 301 side was described, but in this embodiment, a composite probe 62 inserted into the guide unit 30 from the lower guide plate 302 side will be described.
[0054] 7 is a diagram showing one configuration example of a composite probe 62 according to the third embodiment of the present invention, in which (a) to (c) chronologically show the process of attaching a probe 50 to a guide unit 30 using the composite probe 62. Note that the probe attachment process shown in the diagram is part of the manufacturing process of a probe card, and is also part of the probe card repair process for replacing a damaged probe 50.
[0055] Composite probe 62 differs from composite probe 60 (embodiment 1) in that leader rod 610 is connected to the upper end of probe body 600 and stopper 510 can pass through guide holes 311, 312 from the bottom to the top. Other configurations are the same as those of composite probe 60, so duplicated explanations will be omitted.
[0056] The leader rod 610 is connected to the upper end of the upper rod 501. The maximum cross-sectional area of the leader rod 610 is preferably smaller than the maximum cross-sectional area of the upper rod 501 excluding the stopper 510. In addition, the leader rod 610 is preferably coaxial with the upper rod 501. In other words, when viewed from the axial direction, the cross section of the leader rod 610 is preferably located within the contour of the cross section of the upper rod 501.
[0057] The stopper 510 is configured to be able to pass through the guide holes 311, 312 upward, but unable to pass through them downward. For example, the stopper 510 is made of an elastically deformable member extending obliquely downward from the side surface of the upper rod 501, and when inserted into the guide holes 311, 312 from below, the stopper 510 can pass through the guide holes 311, 312 while elastically deforming so as to reduce the amount of protrusion, whereas when inserted into the guide holes 311, 312 from above, the stopper 510 elastically deforms so as to increase the amount of protrusion, and unable to pass through the guide holes 311, 312. Therefore, the stopper 510 that has passed through the upper guide hole 311 upward is engaged with the upper surface of the upper guide plate 301.
[0058] FIG. 1(a) shows a state in which leader rod 610 is inserted through lower guide hole 312 and then through upper guide hole 311.
[0059] FIG. 1B shows a state in which leader rod 610 is separated when the entire leader rod 610 protrudes above upper guide plate 301. Leader rod 610 is separated, for example, by application of an external force in the bending direction, or by irradiation with laser light.
[0060] In the present embodiment, an example has been described in which stopper 510 is provided on upper rod 501 and engages with the upper surface of upper guide plate 301, but the present invention is not limited to this configuration. For example, a configuration may be adopted in which stopper 510 is provided on lower rod 502, passes upward only through lower guide hole 312, and engages with the upper surface of lower guide plate 302.
[0061] FIG. 1C shows the state after the leader rod 610 has been cut off. Only the probe body 600 remains in the guide unit 30, the stopper 510 is engaged with the upper guide plate 301, the upper rod 501 is supported by the upper guide plate 301, and the lower rod 502 is supported by the lower guide plate 302. In other words, the probe 50 attached to the guide unit 30 is obtained.
[0062] Embodiment 4 In the first embodiment, an example has been described in which the notch 631 is provided in the connecting portion 630. In contrast, in the present embodiment, a case will be described in which the probe body 600 and the leader rod 610 are joined at an interface in the connecting portion 630.
[0063] 8 is a diagram showing an example of a detailed configuration of a composite probe 63 according to the fourth embodiment of the present invention, showing the appearance of a connecting part 630. In the diagram, (a) is a perspective view of the connecting part 630, (b) is a front view when facing the stacking surface, and (c) is a side view of the composite probe 63 in the width direction.
[0064] 5 (Embodiment 1), the composite probe 63 differs only in the configuration of the connecting portion 630. The other configurations are the same, so duplicated explanations will be omitted.
[0065] A joint surface 632 of the probe body 600 and the leader rod 610 is formed in the connecting portion 630. The probe body 600 and the leader rod 610 are both metal layers formed by plating, but are formed sequentially in different lamination processes and are joined to each other at an interface (joint surface 632) perpendicular to the axial direction A of the leader rod 610.
[0066] When the joint surface 632 of two metal layers that are not stacked simultaneously is parallel to the stacking direction D, the joining force at the joint surface is weaker than when it is parallel to the stacking surface. For this reason, by forming the probe body 600 and the leader rod 610 sequentially and joining them at an interface parallel to the stacking direction D, when an external force is applied, it becomes easy to break the joint surface 632 and separate the leader rod 610 from the probe body 600.
[0067] 9 is a diagram showing an example of a method for manufacturing a composite probe 63, in which (a) to (e) chronologically show the main steps constituting the manufacturing process of the composite probe 63. The composite probe 63 is manufactured using an electroplating method. First, a probe body 600 is formed by electroplating on a probe formation substrate 700 (FIG. 9(a)). The probe body 600 is patterned to be composed of an upper rod 501, a lower rod 502, and a curved portion 503.
[0068] Next, photoresist 701 is formed. After being formed on the entire surface of substrate 700, photoresist 701 is selectively exposed and developed to form opening 702 in an area corresponding to leader rod 610 (FIG. 9(b)). By forming opening 702, the end face of probe body 600 and substrate 700 are exposed.
[0069] Next, a metal layer 703 is formed in the opening 702 by electroplating (FIG. 9(c)). After that, a polishing process is performed to flatten the laminated surface, and a metal layer 703 having the same thickness as the probe body 600 and bonded to the end surface of the probe body 600 is obtained. This metal layer 703 becomes the leader rod 610 (FIG. 9(d)). After that, the photoresist is removed and the composite probe 63 is obtained by separating it from the substrate 700 (FIG. 9(e)).
[0070] In the present embodiment, a method for manufacturing a composite probe in which leader rod 610 is formed after probe body 600 has been described, but the present invention is not limited to such a manufacturing method. For example, a configuration in which probe body 600 is formed after leader rod 610 is formed may also be employed.
[0071] Embodiment 5. In the first embodiment, an example of connecting part 630 in which notch 631 is provided on a side surface in the width direction is described. In contrast, in the present embodiment, a connecting part 630 in which notch 635 is further provided on the stacking surface is described.
[0072] 10 is a diagram showing an example of a detailed configuration of a composite probe 64 according to the fifth embodiment of the present invention, showing the appearance of a connecting part 630. In the diagram, (a) and (b) are perspective views of the connecting part 630 seen from different directions, and (c) is a side view showing the side surface in the width direction.
[0073] 5 (Embodiment 1), the composite probe 64 differs only in the configuration of the connecting portion 630. The other configurations are the same, so duplicated explanations will be omitted.
[0074] The connecting portion 630 is composed of a connecting tip 633 that connects the probe body 600 and the leader rod 610. The probe body 600 and the leader rod 610 are arranged apart in the axial direction A, and one end of the connecting tip 633 is connected to the probe body 600, and the other end is connected to the leader rod 610. The connecting tip 633, the probe body 600, and the leader rod 610 are joined at interfaces parallel to the layered surface, and therefore are firmly connected at the interfaces so as not to break easily.
[0075] The width of connecting tip 633 is the same as the width of probe body 600 and leader rod 610, but a pair of notches 634 are formed on a pair of side surfaces facing each other in the width direction of connecting tip 633. The shape and formation method of notches 634 are similar to those of notches 631 in FIG. 5 (embodiment 1).
[0076] Furthermore, the thickness of connecting tip 633 is thinner than the thicknesses of probe body 600 and leader rod 610. For this reason, notch 635 is also formed in the layered surface between probe body 600 and leader rod 610. Notch 635 is a recess in the layered surface formed by the step between connecting tip 633 and probe body 600 and leader rod 610.
[0077] By adopting such a configuration, the cross-sectional area of connecting portion 630 is narrowed in the width direction by notch portion 634 and in the thickness direction by notch portion 635, so that connecting portion 630 can be easily broken.
[0078] The connecting tip 633 is firmly connected to the probe body 600 and the leader rod 610, while by providing cutout portions 634, 635 of appropriate shape and size, it is possible to realize a connecting portion 630 that will not break when the composite probe 60 is inserted, but can be easily broken after the entire leader rod 610 has passed through the guide unit 30.
[0079] 11 is a diagram showing an example of a method for manufacturing a composite probe 64, in which (a) to (e) show the main steps constituting the manufacturing process of the composite probe 64 in chronological order. The composite probe 64 is manufactured using an electroplating method. First, a linked tip 633 is formed by electroplating on a probe formation substrate 700 (FIG. 11(a)). The linked tip 633 is patterned to have a pair of cutout portions 634.
[0080] Next, photoresist 711 is formed. After being formed on the entire surface of substrate 700, photoresist 711 is selectively exposed and developed to form openings 712 in areas corresponding to probe body 600 and leader rod 610 (FIG. 11(b)). By forming openings 712, the upper surfaces of both ends of linking chip 633 and substrate 700 are exposed.
[0081] Next, a metal layer 713 is formed in the opening 712 by electroplating (FIG. 11(c)). After that, a polishing process is performed to flatten the laminated surface, and two metal layers 713 having a thickness greater than that of the connecting chip 633 and bonded to the upper surfaces of both ends of the connecting chip 633 are obtained. These metal layers 713 become the probe body 600 and the leader rod 610 (FIG. 11(d)). After that, the photoresist 711 is removed, and the composite probe 64 is obtained by separating it from the substrate 700 (FIG. 11(e)).
[0082] In the present embodiment, an example of the connecting portion 630 having the notch portion 634 on the side surface in the width direction and the notch portion 635 on the stacking surface has been described, but the present invention is not limited to this configuration. For example, the connecting portion 630 may be configured to have only the notch portion 635 on the stacking surface.
[0083] In addition, in the present embodiment, an example has been described in which the width of connecting tip 633 is the same as the width of probe body 600 and leader rod 610, but the present invention is not limited to this configuration. For example, the width of connecting tip 633 may be smaller than the width of probe body 600 and leader rod 610.
[0084] Embodiment 6 In the fourth embodiment, an example of a connecting portion 630 in which a probe body 600 and a leader rod 610 are joined at an interface has been described. In the fifth embodiment, an example of a connecting portion 630 in which a probe body 600 and a leader rod 610 are connected by a connecting chip 633 has been described. In the present embodiment, a connecting portion 630 in which these are combined will be described.
[0085] 12 is a diagram showing an example of a detailed configuration of a composite probe 65 according to the sixth embodiment of the present invention, showing the appearance of a connecting part 630. In the diagram, (a) and (b) are perspective views of the connecting part 630 seen from different directions, and (c) is a side view showing the side surface in the width direction.
[0086] 5 (Embodiment 1), the composite probe 65 differs only in the configuration of the connecting portion 630. The other configurations are the same, so duplicated explanations will be omitted.
[0087] The connecting portion 630 includes a joining surface 632 between the probe body 600 and the leader rod 610, and a connecting tip 633 that connects the probe body 600 and the leader rod 610. The joining surface 632 and the connecting tip 633 are formed at different positions in the thickness direction of the connecting portion 630. In (a) and (c) of the figures, the joining surface 632 is provided on the upper side, and the connecting tip 633 is provided on the lower side.
[0088] Both the probe body 600 and the leader rod 610 are metal layers formed by plating, but they are formed sequentially in different lamination processes and are joined to each other at an interface (joint surface 632) perpendicular to the lamination surface. Therefore, the joining force is weaker than that of a joint surface parallel to the lamination surface. Therefore, when an external force is applied, it is easy to break the joint surface 632 and separate the leader rod 610 from the probe body 600.
[0089] Furthermore, probe body 600 and leader rod 610 are connected via connecting tip 633. Connecting tip 633, probe body 600, and leader rod 610 are joined at interfaces parallel to the layered surface, and are therefore firmly connected so as not to break easily.
[0090] The width of connecting tip 633 is the same as the width of probe body 600 and leader rod 610, but a pair of notches 634 are formed on a pair of side surfaces facing each other in the width direction of connecting tip 633. The shape and formation method of notches 634 are similar to those of notches 631 in FIG. 5 (embodiment 1). In addition, the thickness of connecting tip 633 is thinner than the thicknesses of probe body 600 and leader rod 610. Therefore, the cross-sectional area of connecting tip 633 is smaller than the cross-sectional areas of probe body 600 and leader rod 610. Furthermore, the width is narrowed by notches 634, and the minimum cross-sectional area becomes even smaller, allowing connecting tip 633 to be easily broken.
[0091] Therefore, by aligning the positions of the joint surface 632 and the cutout portion 634 in the axial direction A, it is possible to cause the joint surface 632 to break at that position when an external force is applied. Since the joint surface 632 and the connecting tip 633 are provided in the connecting portion 630 of the composite probe 65, it is possible to realize the connecting portion 630 that does not break when the composite probe 65 is inserted into the guide unit 30 and that can be easily broken after the entire leader rod 610 has passed through.
[0092] FIG. 13 is a diagram showing an example of a method for manufacturing a composite probe 65, in which (a) to (f) show the main steps constituting the manufacturing process of the composite probe 65 in chronological order. The composite probe 65 is manufactured using an electroplating method. First, a linked tip 633 is formed by electroplating on a probe formation substrate 700 (FIG. 13(a)). The linked tip 633 is patterned to have a pair of cutout portions 634.
[0093] Next, a photoresist 721 is formed. The photoresist 721 is formed on the entire surface of the substrate 700, and then selectively exposed and developed to form an opening 722 in a region corresponding to the probe body 600. In the opening 722, the left half of the upper surface of the linking tip 633 and a part of the substrate 700 are exposed. Then, a metal layer 723 is formed in the opening 722 by electroplating (FIG. 13(b)).
[0094] Next, a polishing process is performed to flatten the laminated surface, and a metal layer 723 is obtained that is bonded to the left half of the upper surface of the connecting chip 633 (FIG. 13(c)). This metal layer 723 becomes the probe body 600 equipped with the upper rod 501, the lower rod 502, and the curved portion 503 by patterning the photoresist 721.
[0095] Thereafter, photoresist 721 is removed, and then photoresist 724 is formed. Photoresist 724 is formed over the entire surface of substrate 700, and then selectively exposed and developed, forming opening 725 in an area corresponding to leader rod 610. In opening 725, the right half of the upper surface of linking chip 633 and a part of substrate 700 are exposed. Then, metal layer 726 is formed in opening 725 by electroplating (FIG. 13(d)).
[0096] Next, a polishing process is performed to flatten the laminated surface, and metal layer 726 is obtained that is bonded to the right half of the upper surface of linking chip 633 and also bonded to probe body 600 at bonding surface 632 (FIG. 13(e)). This metal layer 726 becomes leader rod 610.
[0097] Thereafter, the photoresist 724 is removed, and then the composite probe 65 is obtained by separating it from the substrate 700 (FIG. 13(f)).
[0098] In the present embodiment, an example has been described in which the width of connecting tip 633 is the same as the width of probe body 600 and leader rod 610, but the width of connecting tip 633 may be smaller than the width of probe body 600 and leader rod 610. Also, an example of a manufacturing method for a composite probe in which leader rod 610 is formed after probe body 600 has been described, but probe body 600 may be formed after leader rod 610 is formed.
[0099] Furthermore, the probe attachment method according to the present invention can be applied not only to the manufacture of the probe card 1 but also to the repair of the probe card 1 for replacing a damaged probe 50. When repairing the probe card 1, the length of the probe 50 may be reduced due to wear. For this reason, it is desirable to measure the length of the probe 50 at the time of repair, and to repair the probe card 1, use a composite probe 60 whose length L4 of the probe body 600 matches the measured length.
[0100] In this case, it is desirable to use a composite probe set consisting of two or more composite probes 60 having different lengths L4 of the probe main body 600. By measuring the length of the probe 50 and selecting an appropriate composite probe 60 from the composite probe set, the probe card 1 can be repaired quickly.
[0101] It is desirable that the composite probes 60 constituting the composite probe set have the same overall length, for example, the sum of the length L4 of the probe body 600 and the length L1 of the leader rod 610. By making the overall lengths of the composite probes 60 the same, the storage and transportation of the composite probe set becomes easy and the manufacturing cost can be reduced. For example, when the manufacturing method shown in FIG. 9 is adopted, if the length of the probe body 600 is different, the mask pattern used in the manufacturing process (a) is also different. However, by making the overall lengths of the composite probes 60 the same, the same mask pattern can be used in the manufacturing process (b) and thereafter, and the manufacturing cost can be reduced. [Explanation of symbols]
[0102] 1 Probe card 10 Main Board 101 External terminal 102 Probe electrode 103 Reinforcement plate 20 Card Holder 21 Stage 211 Semiconductor Wafer 212 Electrode terminal 30 Guide unit 301 Upper guide plate 302 Lower guide plate 303 Connecting spacer 311 Upper guide hole 312 Lower guide hole 40 Mounting spacer 50 Probes 501 Upper Rod 502 Lower Rod 503 Curved section 510 Stopper 60~65 Composite probe 600 Probe Body 610 Leader Rod 620 Tip 630 Connection section 631,634,635 Cutout 632 Joint surface 633 Connected Chip 700 Substrates 701,711,721,724 Photoresist 702,712,722,725 aperture 703,713,723,726 metal layer
Claims
1. a probe body accommodated in a guide unit for a probe card, the guide unit comprising a first guide plate and a second guide plate spaced apart from each other, and supported by a first guide hole of the first guide plate and a second guide hole of the second guide plate; a leader rod having a substantially linear shape and one end connected to the probe body, the leader rod being inserted through the first guide hole prior to the probe body, and being detachable from the probe body after passing through the second guide hole, The probe body includes: a first rod having a substantially linear shape and supported in the first guide hole; a second rod having a substantially linear shape and supported in the second guide hole; a curved portion disposed between the first guide plate and the second guide plate and connecting the first rod and the second rod, The leader rod is coaxial with the second rod and connected to a tip of the second rod, A composite probe, characterized in that a total length of said leader rod and said second rod is longer than a distance between non-opposing surfaces of said first guide plate and said second guide plate.
2. 2. The composite probe according to claim 1, wherein the leader rod is longer than the distance between non-opposing surfaces of the first guide plate and the second guide plate.
3. 2. The combination probe of claim 1, wherein the length of the leader rod is equal to or greater than the length of the probe body.
4. The composite probe according to any one of claims 1 to 3, characterized in that the leader rod and the second rod are metal layers laminated in sequence by a plating method and are joined at an interface approximately parallel to the lamination direction.
5. A connecting portion is provided to connect the leader rod and the second rod, The composite probe according to any one of claims 1 to 3, characterized in that the connecting portion is a metal layer laminated by a plating method, and the thickness in the lamination direction is smaller than those of the leader rod and the second rod.
6. A method for attaching a probe to a guide unit for a probe card, the guide unit comprising a first guide plate and a second guide plate arranged apart from each other, comprising the steps of: a composite probe including a first rod supported in a first guide hole of the first guide plate, a second rod supported in a second guide hole of the second guide plate, a probe body disposed between the first guide plate and the second guide plate and including a curved portion connecting the first rod and the second rod, and a leader rod connected to a tip of the probe body, inserting the leader rod into the first guide hole of the first guide plate prior to the probe body; a step of further inserting the leader rod inserted into the first guide hole into the second guide hole of the second guide plate before the curved portion is inserted into the first guide hole; and separating the leader rod from the probe body while the probe body is supported by the first guide hole and the second guide hole.
7. Attaching a probe to the guide unit using the probe attachment method according to claim 6; and attaching the guide unit to which the probes are attached to a wiring board.
Citation Information
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