Coil parts

Abstract

To provide a coil component that can easily remove noise. [Solution] A coil device according to one aspect of the present invention includes a main body, a support substrate embedded in the main body, a coil section disposed on at least one surface of the support substrate, with both ends exposed on the surface of the main body, a noise elimination section disposed on at least one surface of the support substrate, spaced apart from the coil section, forming an open loop, and with one end exposed on the surface of the main body, an insulating layer disposed between the coil section and the noise elimination section, first and second external electrodes disposed on the surface of the main body and respectively connected to both ends of the coil section, and a third external electrode disposed on the surface of the main body and connected to one end of the noise elimination section.

Description

[Technical field]

[0001] The present invention relates to a coil component. [Background technology]

[0002] An inductor, which is one type of coil component, is a typical passive electronic component used in electronic devices along with a resistor and a capacitor.

[0003] As electronic devices become increasingly more powerful and smaller, the number of electronic components used therein is increasing and becoming smaller.

[0004] For the reasons mentioned above, there is a gradually increasing need to eliminate noise such as EMI (Electro Magnetic Interference) from coil components. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Korean Patent Publication No. 10-2017-0026135 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a coil component that can easily remove noise. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided a coil component including: a main body; a support substrate embedded in the main body; a coil portion disposed on at least one surface of the support substrate, with both ends exposed on a surface of the main body; a noise elimination portion disposed on at least one surface of the support substrate, spaced apart from the coil portion to form an open loop, with one end exposed on a surface of the main body; an insulating layer disposed between the coil portion and the noise elimination portion; first and second external electrodes disposed on the surface of the main body and respectively connected to both ends of the coil portion; and a third external electrode disposed on the surface of the main body and connected to one end of the noise elimination portion. Effect of the Invention

[0008] According to the embodiment of the present invention, noise can be easily removed. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram illustrating a coil device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a diagram illustrating a schematic view of the state of FIG. 1 as viewed from above. [Diagram 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] FIG. 2 is a cross-sectional view taken along line II-II' in FIG. [Diagram 5] FIG. 2 is a diagram roughly illustrating a coil device according to a modified example of the first embodiment of the present invention, the diagram corresponding to a cross section taken along line II-II' in FIG. [Figure 6] FIG. 2 is a diagram roughly illustrating a coil device according to another modified example of the first embodiment of the present invention, the diagram corresponding to a cross section taken along line II-II' in FIG. [Figure 7] FIG. 2 is a diagram roughly illustrating a coil device according to still another modified example of the first embodiment of the present invention, the diagram corresponding to a cross section taken along line II-II' in FIG. [Figure 8] FIG. 13 is a diagram illustrating a coil device according to a second embodiment of the present invention. [Figure 9]FIG. 9 is a diagram illustrating a schematic view of FIG. 8 as viewed from above. [Figure 10] 9 is a cross-sectional view taken along line III-III' in FIG. 8. [Figure 11] FIG. 9 is a cross-sectional view taken along line IV-IV' in FIG. [Figure 12] 9 is a diagram roughly illustrating a coil device according to a modified example of the second embodiment of the present invention, the diagram corresponding to a cross section taken along line IV-IV' in FIG. 8. FIG. [Figure 13] 10 is a diagram roughly illustrating a coil device according to another modified example of the second embodiment of the present invention, the diagram corresponding to a cross section taken along line IV-IV' in FIG. [Figure 14] 10 is a diagram roughly illustrating a coil device according to still another modified example of the second embodiment of the present invention, the diagram corresponding to a cross section taken along line IV-IV' in FIG. [Figure 15] FIG. 11 is a diagram showing the signal transfer characteristics (S-parameters) of a conventional coil component. [Figure 16] FIG. 4 is a diagram showing the signal transfer characteristics (S-parameters) of the coil component according to the first embodiment of the present invention. [Figure 17] FIG. 11 is a diagram showing the signal transfer characteristics (S-parameters) of the coil component according to the second embodiment of the present invention. [Figure 18] FIG. 13 is a diagram showing the signal transfer characteristics (S-parameters) of a coil component including a noise removal unit in a closed-loop configuration. [Figure 19] FIG. 11 is a diagram illustrating a coil device according to a third embodiment of the present invention. [Figure 20] 20 is a diagram showing a cross section taken along line VV' in FIG. 19. FIG. [Figure 21] FIG. 20 is a diagram roughly illustrating a coil device according to a modified example of the third embodiment of the present invention, the diagram corresponding to a cross section taken along line VV' in FIG. 19. [Figure 22] FIG. 13 is a diagram illustrating a coil device according to a fourth embodiment of the present invention. [Diagram 23] 23 is a cross-sectional view taken along line VI-VI' in FIG. 22. [Figure 24] 23 is a cross-sectional view taken along line VII-VII' in FIG. 22. [Diagram 25] 13 is a diagram illustrating a schematic connection relationship between a support substrate, a coil unit, and a noise removing unit applied to a fourth embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The terms used in this specification are merely used to describe certain embodiments and are not intended to limit the present invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this specification, the terms "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and should be understood not to preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. In addition, in the entire specification, "on" means to be located above or below the target part, and does not necessarily mean to be located on the upper side based on the direction of gravity.

[0011] Furthermore, the term "bonding" is used as a concept that does not only mean a case where the components are in direct physical contact with each other in the contact relationship between the components, but also includes a case where another component is interposed between the components and the components are in contact with each other.

[0012] The sizes and thicknesses of the components shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited to those shown in the drawings.

[0013] In the drawings, the X direction may be defined as a first direction or length direction, the Y direction may be defined as a second direction or width direction, and the Z direction may be defined as a third direction or thickness direction.

[0014] Hereinafter, a coil device according to an embodiment of the present invention will be described with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same reference numerals are used to refer to the same or corresponding components, and duplicated description thereof will be omitted.

[0015] Various kinds of electronic components are used in electronic devices, and various kinds of coil components can be appropriately used between such electronic components for the purpose of removing noise or the like.

[0016] That is, the coil components of electronic devices can be used as power inductors, high frequency inductors, general beads, high frequency beads (GHz beads), common mode filters, and the like.

[0017] (First embodiment and its modified examples) Fig. 1 is a diagram showing a coil device according to a first embodiment of the present invention, Fig. 2 is a diagram showing a state seen from the top of Fig. 1, Fig. 3 is a diagram showing a cross section taken along line I-I' in Fig. 1, and Fig. 4 is a diagram showing a cross section taken along line II-II' in Fig. 1. Meanwhile, in Fig. 1, an insulating layer applied to this embodiment is not shown in order to more clearly illustrate the coupling between other components.

[0018] 1 to 4, a coil device 1000 according to a first embodiment of the present invention includes a main body 100, a supporting substrate 200, a coil portion 300, insulating layers 410, 420, a noise elimination portion 500, and first to fourth external electrodes 610, 620, 630, 640, and may further include an insulating film IF.

[0019] The main body 100 forms the exterior of the coil device 1000 according to this embodiment, and has the coil portion 300 embedded therein.

[0020] The main body 100 may be formed generally in the shape of a hexahedron.

[0021] 1, the main body 100 includes a first surface 101 and a second surface 102 facing each other in a length direction X, a third surface 103 and a fourth surface 104 facing each other in a width direction Y, and a fifth surface 105 and a sixth surface 106 facing each other in a thickness direction Z. The first to fourth surfaces 101, 102, 103, and 104 of the main body 100 correspond to the walls of the main body 100 connecting the fifth surface 105 and the sixth surface 106 of the main body 100. Hereinafter, both end surfaces of the main body 100 may refer to the first surface 101 and the second surface 102 of the main body, and both side surfaces of the main body 100 may refer to the third surface 103 and the fourth surface 104 of the main body. In addition, one surface and the other surface of the main body 100 may refer to the sixth surface 106 and the fifth surface 105 of the main body 100, respectively.

[0022] The body 100 may be exemplarily formed so that the coil device 1000 according to this embodiment having external electrodes 610, 620, 630, and 640, which will be described later, has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. Meanwhile, the above values ​​are merely design values ​​that do not reflect process errors, and therefore, it can be said that the range of the present invention is within the scope of the present invention up to the range that can be recognized as a process error.

[0023] The main body 100 may include a magnetic material and a resin. Specifically, the main body 100 may be formed by laminating one or more layers of a magnetic composite sheet including a resin and a magnetic material dispersed in the resin. However, the main body 100 may have other structures in addition to the structure in which the magnetic material is dispersed in the resin. For example, the main body 100 may be made of a magnetic material such as ferrite.

[0024] The magnetic material can be a ferrite or metallic magnetic powder.

[0025] The ferrite powder may be at least one of spinel-type ferrites such as Mg-Zn-, Mn-Zn-, Mn-Mg-, Cu-Zn-, Mg-Mn-Sr-, and Ni-Zn-based ferrites, hexagonal-type ferrites such as Ba-Zn-, Ba-Mg-, Ba-Ni-, Ba-Co-, and Ba-Ni-Co-based ferrites, garnet-type ferrites such as Y-based ferrites, and Li-based ferrites.

[0026] The metal magnetic powder may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic powder may be at least one of pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder, and Fe-Cr-Al alloy powder.

[0027] The metal magnetic powder can be amorphous or crystalline. For example, the metal magnetic powder may be Fe-Si-B-Cr based amorphous alloy powder, but is not necessarily limited thereto.

[0028] The ferrite and metal magnetic powder may each have an average diameter of about 0.1 μm to 30 μm, but is not limited to this.

[0029] The main body 100 may include two or more types of magnetic materials dispersed in a resin. Here, different types of magnetic materials means that the magnetic materials dispersed in the resin are distinguished from each other in at least one of the average diameter, composition, crystallinity, and shape.

[0030] The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like, either alone or in combination.

[0031] The main body 100 includes a coil unit 300 (described later) and a core 110 that penetrates the support substrate 200. The core 110 may be formed by filling the through-hole of the coil unit 300 with a magnetic composite sheet, but is not limited thereto.

[0032] The support substrate 200 is embedded in the main body 100. The support substrate 200 supports a coil portion 300, which will be described later.

[0033] The support substrate 200 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as a polyimide, or a photosensitive insulating resin, or may be formed of an insulating material including such an insulating resin and a reinforcing material such as glass fiber or an inorganic filler. As an example, the support substrate 200 may be formed of an insulating material such as a prepreg, an Ajinomoto Build-up Film (ABF), FR-4, a Bismaleimide Triazine (BT) resin, a Photo Imageable Dielectric (PID), a Copper Clad Laminate (CCL), etc., but is not limited thereto.

[0034] As the inorganic filler, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0035] When the support substrate 200 is made of an insulating material containing a reinforcing material, the support substrate 200 can provide better rigidity. When the support substrate 200 is made of an insulating material not containing glass fiber, the support substrate 200 is advantageous in reducing the overall thickness of the coil portion 300.

[0036] The coil unit 300 is embedded in the body 100 to exhibit the characteristics of a coil component. For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil unit 300 can stabilize the power supply of an electronic device by storing an electric field as a magnetic field and maintaining an output voltage.

[0037] The coil unit 300 is formed on at least one of both surfaces of the support substrate 200 and has at least one turn. In this embodiment, the coil unit 300 includes first and second coil patterns 311 and 312 formed on both surfaces of the support substrate 200 facing each other in the thickness direction Z of the main body 100, and a via 320 penetrating the support substrate 200 to connect the first and second coil patterns 311 and 312 to each other.

[0038] Each of the first coil pattern 311 and the second coil pattern 312 may have a planar spiral shape having at least one turn formed around the core 110. As an example, based on the direction of FIG. 3, the first coil pattern 311 may have at least one turn formed around the core 110 on the lower surface of the support substrate 200, and the second coil pattern 312 may have at least one turn formed around the core 110 on the upper surface of the support substrate 200.

[0039] Ends of the first and second coil patterns 311, 312 are respectively connected to first and second external electrodes 610, 620, which will be described later. That is, as an example, an end of the first coil pattern 311 is extended to be exposed to a first surface 101 of the body 100, and an end of the second coil pattern 312 is extended to be exposed to a second surface 102 of the body 100, so that they can be in contact with and connected to the first and second external electrodes 610, 620 formed on the first and second surfaces 101, 102 of the body 100, respectively. In this case, the coil patterns 311, 312 including the ends may each be formed integrally.

[0040] At least one of the coil patterns 311, 312 and the via 320 may include at least one conductive layer.

[0041] As an example, when the second coil pattern 312 and the vias 320 are formed on the other side of the support substrate 200 by plating, the second coil pattern 312 and the vias 320 may each include a seed layer and an electrolytic plating layer. The seed layer may be formed by a vapor deposition method such as electroless plating or sputtering. The seed layer and the electrolytic plating layer may each have a single layer structure or a multilayer structure. The multilayer electrolytic plating layer may be formed in a conformal film structure in which one electrolytic plating layer is covered by the other electrolytic plating layer, or may be formed in a shape in which one electrolytic plating layer is laminated only on one surface of one electrolytic plating layer. The seed layer of the second coil pattern 312 and the seed layer of the vias 320 may be formed integrally so that no boundary is formed between them, but the present invention is not limited thereto. The electrolytic plating layer of the second coil pattern 312 and the electrolytic plating layer of the vias 320 may be formed integrally so that no boundary is formed between them, but the present invention is not limited thereto.

[0042] As another example, in the case where the first coil pattern 311 arranged on the lower surface side of the support substrate 200 and the second coil pattern 312 arranged on the upper surface side of the support substrate 200 are separately formed and then collectively laminated on the support substrate 200 to form the coil unit 300, the via 320 may include a high melting point metal layer and a low melting point metal layer having a melting point lower than that of the high melting point metal layer. Here, the low melting point metal layer may be formed of solder containing lead (Pb) and / or tin (Sn). At least a portion of the low melting point metal layer may melt due to pressure and temperature during the collectively lamination. As a result, an intermetallic compound layer (IMC layer) may be formed at least in a portion of the boundary between the low melting point metal layer and the second coil pattern 312 and the boundary between the low melting point metal layer and the high melting point metal layer.

[0043] As an example, the coil patterns 311 and 312 may be formed to protrude from the lower surface and the upper surface of the support substrate 200, respectively, based on the directions of FIGS. 3 and 4. As another example, based on the directions of FIGS. 3 and 4, the first coil pattern 311 may be formed to protrude from the lower surface of the support substrate 200, and the second coil pattern 312 may be embedded in the support substrate 200, and the upper surface of the second coil pattern 312 may be exposed to the upper surface of the support substrate 200. In this case, a recess may be formed in the upper surface of the second coil pattern 312, and the upper surface of the support substrate 200 and the upper surface of the second coil pattern 312 may not be located on the same plane. As another example, based on the directions of FIGS. 3 and 4, the second coil pattern 312 may be formed to protrude from the upper surface of the support substrate 200, and the first coil pattern 311 may be embedded in the lower surface of the support substrate 200, and exposed to the lower surface of the support substrate 200. In this case, a recess is formed in the lower surface of the first coil pattern 311, and the lower surface of the support substrate 200 and the lower surface of the first coil pattern 311 do not need to be located on the same plane.

[0044] The coil patterns 311, 312 and the vias 320 may each be formed of a conductive material such as, but not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof.

[0045] The insulating film IF is formed along the surfaces of the first coil pattern 311, the support substrate 200, and the second coil pattern 312. The insulating film IF is for protecting and insulating the coil patterns 311 and 312, and includes a known insulating material such as parylene. The insulating material included in the insulating film IF may be any material and is not particularly limited. The insulating film IF may be formed by a method such as vapor phase deposition, but is not limited thereto. In this embodiment, since insulating layers 410 and 420, which will be described later, are formed in the insulating film IF, the insulating film IF is disposed between the support substrate 200 and the insulating layers 410 and 420, and between the coil patterns 311 and 312 and the insulating layers 410 and 420.

[0046] The insulating layers 410 and 420 are disposed between the coil unit 300 and the noise removal unit 500 described below. For example, as shown in Figures 3 and 4, in this embodiment, the first insulating layer 410 is disposed on the first coil pattern 311 and between the first coil pattern 311 and the first noise removal pattern 510. The second insulating layer 420 may be disposed on the second coil pattern 312 and between the second coil pattern 312 and the second noise removal pattern 520.

[0047] The insulating layers 410 and 420 may be formed by laminating insulating films on both sides of the support substrate 200 on which the coil unit 300 and the insulating film IF described below are formed. The insulating film may be a general non-photosensitive insulating film such as ABF (Ajinomoto Build-up Film) or prepreg, or a photosensitive insulating film such as a dry film or PID. The insulating layers 410 and 420 function as a dielectric layer together with the insulating film IF by capacitively coupling the coil patterns 311 and 312 of the coil unit 300 and the noise removal patterns 510 and 520 of the noise removal unit 500 to each other.

[0048] The noise elimination unit 500 is disposed in the main body 100 to remove noise transmitted to the components and / or generated from the components to a mounting board. Specifically, the noise elimination unit 500 is embedded in the main body 100 and disposed on the coil unit 300 to form an open-loop, and one end is exposed to the surface of the main body 100. In this embodiment, the first noise elimination pattern 510 is disposed on the first insulating layer 410 and disposed on the first coil pattern 311, and the second noise elimination pattern 520 is disposed on the second insulating layer 420 and disposed on the second coil pattern 312. The noise elimination unit 500 including the first and second noise elimination patterns 510 and 520 is capacitively coupled to the coil unit 300 via the insulating layers 410 and 420.

[0049] The noise removal part 500 forms an open loop. More specifically, the first and second noise removal patterns 510 and 520 are disposed such that one end of each of the first and second noise removal patterns 510 and 520 is extended from one end exposed to the third surface of the main body 100 and the other end is spaced apart from the other end. Thus, in this embodiment, the first and second noise removal patterns 510 and 520 may be formed in an annular shape with slits S formed in shapes corresponding to the first and second coil patterns 311 and 312, respectively.

[0050] The first and second noise removal patterns 510 and 520 are disposed to correspond to the region where the coil unit 300 is disposed. As an example, referring to FIG. 1, FIG. 2, and FIG. 4, the line width of the region of the second noise removal pattern 520 disposed on the third surface 103 side of the main body 100 may have a value similar to the distance between the innermost turn and the outermost turn of the region of the second coil pattern 312 disposed on the third surface 103 side. Since the noise removal part 500 is disposed in the region corresponding to the coil unit 300, it is possible to easily remove noise and minimize the reduction of the magnetic material in the main body 100. As a result, it is possible to minimize the deterioration of the characteristics of the part due to the reduction of the magnetic material.

[0051] One end of the noise elimination unit 500 is exposed to the third surface 103, which is the surface of the main body 100. One end of the noise elimination unit 500 may be in contact with and connected to a third external electrode 630 (described later) disposed on the third surface 103 of the main body 100. Specifically, in this embodiment, one end of each of the first and second noise elimination patterns 510 and 520 is exposed to the third surface 103 of the main body 100 and is all connected to the third external electrode 630. The third external electrode 630 may be connected to the ground of a mounting substrate when the coil device 1000 according to this embodiment is mounted on a mounting substrate or the like, or may be connected to the ground of an electronic component package when the coil device 1000 according to this embodiment is packaged in an electronic component package. In this embodiment, the coil device 1000 may include a fourth external electrode 640 disposed on the fourth surface 104 of the main body 100. In this embodiment, the fourth external electrode 640 may be used as a non-contact terminal and connected to the ground of a mounting substrate or the like, or may be connected to the ground of the package.

[0052] The noise removal patterns 510 and 520 may be formed of a conductive material such as, but not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof. The noise removal patterns 510 and 520 and the slits S may be formed by at least one of, but not limited to, an electroless plating method, an electrolytic plating method, a vapor deposition method such as sputtering, and an etching method.

[0053] The first and second external electrodes 610 and 620 are disposed on the first and second surfaces 101 and 102 of the body 100, respectively, and are connected to the first and second coil patterns 311 and 312, respectively. That is, the first external electrode 610 is disposed on the first surface 101 of the body 100, and is in contact with and connected to an end of the first coil pattern 311 exposed on the first surface 101 of the body 100. The second external electrode 620 is disposed on the second surface 102 of the body 100, and is in contact with and connected to an end of the second coil pattern 312 exposed on the second surface 102 of the body 100. The first and second external electrodes 610 and 620 may be formed to extend from the first and second surfaces 101 and 102 of the body 100 to a sixth surface of the body 100, respectively. Also, the first and second external electrodes 610 and 620 may be formed to extend from the first and second surfaces 101 and 102 of the body 100 to parts of the third, fourth, and fifth surfaces 103, 104, and 105 of the body 100, respectively. However, the shapes of the first and second external electrodes 610 and 620 shown in FIG. 1 and the like are merely exemplary, and the external electrodes 610 and 620 may be variously modified to have a shape that does not extend to parts of the third, fourth, and fifth surfaces 103, 104, and 105 of the body 100, i.e., an L-shape.

[0054] When the coil device 1000 according to this embodiment is mounted on a mounting substrate such as a printed circuit board, the first and second external electrodes 610, 620 electrically connect the coil device 1000 to the mounting substrate. As an example, the coil device 1000 according to this embodiment may be mounted such that the sixth surface 106 of the body 100 faces an upper surface of the printed circuit board, and the external electrodes 610, 620 extended to the sixth surface 106 of the body 100 may be electrically connected to a connection portion of the printed circuit board by a conductive connecting member such as solder.

[0055] The first to fourth external electrodes 610, 620, 630, 640 may include at least one of a conductive resin layer and an electrolytic plating layer. The conductive resin layer may be formed by paste printing or the like, and may include at least one conductive metal selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag), and a thermosetting resin. The electrolytic plating layer may include at least one selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

[0056] Fig. 15 is a diagram showing the signal transfer characteristic (S-parameter) of a conventional coil component, Fig. 16 is a diagram showing the signal transfer characteristic (S-parameter) of a coil component according to a first embodiment of the present invention, and Fig. 18 is a diagram showing the signal transfer characteristic (S-parameter) of a coil component including a closed-loop type noise elimination unit. In each of Figs. 15, 16, and 18, the solid lines indicate the input reflection coefficient, i.e., S 11 The dotted line shows the transmission coefficient from the input end to the output end, i.e., S 2115 shows that, unlike this embodiment, a conventional coil component that does not have a noise removal section formed therein passes DC to low-frequency signals relatively smoothly, but the noise removal effect drops sharply at frequencies above the self-resonance frequency (SRF). In contrast, as shown in FIG. 16, the coil component 1000 according to this embodiment passes DC to low-frequency signals relatively smoothly like the conventional coil component, but can effectively block unnecessary high-frequency noises higher than this frequency, as compared to the conventional coil component. On the other hand, as shown in FIG. 18, when the noise removal section forms a closed loop, unlike this embodiment, it cannot remove noise to the outside, and as a result, the noise removal effect is relatively low.

[0057] FIG. 5 is a schematic diagram of a coil device according to one modified example of the first embodiment of the present invention, and corresponds to the cross section taken along line II-II' in FIG. 1; FIG. 6 is a schematic diagram of a coil device according to another modified example of the first embodiment of the present invention, and corresponds to the cross section taken along line II-II' in FIG. 1; and FIG. 7 is a schematic diagram of a coil device according to yet another modified example of the first embodiment of the present invention, and corresponds to the cross section taken along line II-II' in FIG. 1.

[0058] 5, in the case of the modification of this embodiment, one end of the first noise removal pattern 510 is exposed to the fourth surface 104 of the body 100, and one end of the second noise removal pattern 520 is exposed to the third surface 103 of the body 100. One end of the first noise removal pattern 510 is in contact with a fourth external electrode 640 disposed on the fourth surface 104 of the body 100, and one end of the second noise removal pattern 520 is in contact with a third external electrode 630 disposed on the third surface 103 of the body 100. As a result, in this modification, noise can be removed even if one of the third and fourth external electrodes 630 and 640 connected to the ground of a mounting board or the like is not connected to the mounting board.

[0059] 6, in another modified example of this embodiment, the noise elimination units 500, 520 may be disposed only on the second coil pattern 312. When the need for the noise elimination units is relatively low, the noise elimination units may be selectively formed only on one of both sides of the support substrate 200, thereby reducing material costs, and the proportion of magnetic material may be relatively increased within components of the same size, thereby improving the characteristics of the components.

[0060] 7, in another modification of the present embodiment, the insulating film IF may be formed along the surfaces of the support substrate 200, the coil patterns 311, 312, the insulating layers 410, 420, and the noise removal patterns 510, 520. This modification is different from the embodiment of the present invention in terms of the time point at which the insulating film IF is formed. That is, in this modification, the coil patterns 311, 312, the insulating layers 410, 420, and the noise removal patterns 510, 520 are formed on the support substrate 200, and then trimming is performed, and the insulating film IF is formed after the trimming. This modification is different from the embodiment of the present invention in terms of the number of trimming processes being reduced.

[0061] (Second embodiment and its modified example) Fig. 8 is a diagram showing a coil device according to a second embodiment of the present invention, Fig. 9 is a diagram showing a state of Fig. 8 seen from above, Fig. 10 is a diagram showing a cross section taken along line III-III' in Fig. 8, and Fig. 11 is a diagram showing a cross section taken along line IV-IV' in Fig. 8. Meanwhile, in Fig. 8, an insulating layer applied to this embodiment is not shown in order to more clearly illustrate the coupling between other components.

[0062] 1 to 4 and 8 to 11, coil device 2000 according to the present embodiment is different from coil device 1000 according to the first embodiment of the present invention in the shape of noise elimination unit 500. Therefore, in describing this embodiment, only noise elimination unit 500 that is different from the first embodiment of the present invention will be described. The description of the first embodiment of the present invention can be applied to the remaining configuration of this embodiment as it is.

[0063] 8 to 11, the noise removal unit 500 applied to this embodiment is formed in a planar spiral shape. That is, the first and second noise removal patterns 510 and 520 are each formed in a planar spiral shape. Thus, the first and second noise removal patterns 510 and 520 may have a plurality of turns, similar to the first and second coil patterns 311 and 312, respectively.

[0064] In this case, the coil unit 300 and the noise removal unit 500 may have the same winding direction from the innermost turn to the outermost turn. As an example, when viewed from the top of FIG. 8 based on the direction of FIG. 8, the winding direction from the innermost turn to the outermost turn of the second coil pattern 312 may be the same as the winding direction from the innermost turn to the outermost turn of the second noise removal pattern 520. Also, when viewed from the bottom of FIG. 8 based on the direction of FIG. 8, the winding direction from the innermost turn to the outermost turn of the first coil pattern 311 may be the same as the winding direction from the innermost turn to the outermost turn of the first noise removal pattern 510. If the winding directions of the first and second noise removal patterns 510 and 520 and the first and second coil patterns 311 and 312 are different from each other, the noise removal effect may be reduced.

[0065] 17 is a diagram showing the signal transfer characteristics (S-parameters) of the coil component according to the second embodiment of the present invention. In FIG. 17, the solid line indicates the input reflection coefficient, i.e., S 11 The dotted line shows the transmission coefficient from the input end to the output end, i.e., S 2115 shows that, unlike the present embodiment, a conventional coil component that does not have a noise removal section formed therein smoothly passes signals from DC to relatively low frequencies, but the noise removal effect drops sharply at frequencies above the self-resonance frequency (SRF). In contrast, as shown in FIG. 17, the coil component 2000 according to the present embodiment passes signals from DC to low frequencies relatively smoothly, as with the conventional coil component, but can effectively block unnecessary high-frequency noises above that frequency, as compared with the conventional coil component. On the other hand, as shown in FIG. 18, when the noise removal section forms a closed loop, unlike the present embodiment, it is not possible to remove noise to the outside, and as a result, the noise removal effect is relatively low.

[0066] FIG. 12 is a schematic diagram of a coil device according to a modified example of the second embodiment of the present invention, and corresponds to the cross section taken along line IV-IV' in FIG. 8; FIG. 13 is a schematic diagram of a coil device according to another modified example of the second embodiment of the present invention, and corresponds to the cross section taken along line IV-IV' in FIG. 8; and FIG. 14 is a schematic diagram of a coil device according to yet another modified example of the second embodiment of the present invention, and corresponds to the cross section taken along line IV-IV' in FIG. 8.

[0067] 12, in the case of the modification of this embodiment, one end of the first noise removal pattern 510 is exposed to the fourth surface 104 of the body 100, and one end of the second noise removal pattern 520 is exposed to the third surface 103 of the body 100. One end of the first noise removal pattern 510 is in contact with a fourth external electrode 640 disposed on the fourth surface 104 of the body 100, and one end of the second noise removal pattern 520 is in contact with a third external electrode 630 disposed on the third surface 103 of the body 100. As a result, in the case of this modification, noise can be removed even if one of the third and fourth external electrodes 630 and 640 connected to the ground of a mounting board or the like is not connected to the mounting board.

[0068] 13, in another modified example of this embodiment, the noise elimination units 500, 520 may be disposed only on the second coil pattern 312. When the need for the noise elimination units is relatively low, the noise elimination units may be selectively formed only on one of both surfaces of the support substrate 200, thereby reducing material costs, and the proportion of magnetic material may be relatively increased within components of the same size, thereby improving the characteristics of the components.

[0069] 14, in the case of yet another modification of this embodiment, the insulating film IF may be formed along the surfaces of the support substrate 200, the coil patterns 311, 312, the insulating layers 410, 420, and the noise removal patterns 510, 520. This modification is different from the embodiment of the present invention in terms of the time point at which the insulating film IF is formed. That is, in the case of this modification, the coil patterns 311, 312, the insulating layers 410, 420, and the noise removal patterns 510, 520 are formed on the support substrate 200, and then trimming is performed, and the insulating film IF is formed after the trimming. This modification is different from the embodiment of the present invention in terms of the number of trimming processes being reduced.

[0070] (Third embodiment and its modified examples) Fig. 19 is a diagram showing a coil device according to a third embodiment of the present invention, and Fig. 20 is a diagram showing a cross section taken along line V-V' in Fig. 19. Meanwhile, in Fig. 19, an insulating layer applied to this embodiment is not shown in order to more clearly show the coupling between other components.

[0071] 1 to 4 and 19 to 20, coil device 3000 according to this embodiment is different from coil device 1000 according to the first embodiment of the present invention in the shapes of third and fourth external electrodes 630, 640. Therefore, in describing this embodiment, only the third and fourth external electrodes 630, 640 that are different from the first embodiment of the present invention will be described. The description of the first embodiment of the present invention can be applied to the remaining configuration of this embodiment as it is.

[0072] 19 and 20, the third and fourth external electrodes 630 and 640 applied to this embodiment are connected to each other on the sixth surface 106 of the body 100.

[0073] Specifically, an end of the third external electrode 630 extending to the sixth surface 106 of the body 100 and an end of the fourth external electrode 640 extending to the sixth surface 106 of the body 100 are contacted and connected. When the coil device 3000 according to this embodiment is mounted on a mounting substrate such as a printed circuit board, the sixth surface 106 of the body 100 serves as a mounting surface. Meanwhile, a plurality of signal pads and a plurality of ground pads may be formed on the surface of the mounting substrate for connecting components and the like. In this embodiment, the third and fourth external electrodes 630 and 640 are formed in a shape connected to each other on the sixth surface 106 of the body 100, so that the ground pads of the mounting substrate and the noise removal patterns 510 and 520 can be more easily connected. That is, the ease of the mounting process can be increased.

[0074] FIG. 21 is a diagram illustrating a coil device according to a modified example of the third embodiment of the present invention, and corresponds to a cross section taken along line VV' in FIG.

[0075] 21, the third and fourth external electrodes 630, 640 applied to this modified example are formed to surround the third, sixth, fourth, and fifth surfaces 103, 106, 104, and 105 of the main body 100. In this modified example, the third and fourth external electrodes 630, 640 connected to the noise removal patterns 510, 520 can be easily formed on the surface of the main body 100. That is, the third and fourth external electrodes 630, 640 can be easily formed by a printing method such as screen printing. Alternatively, even if the third and fourth external electrodes 630, 640 are formed by a plating method, the third and fourth external electrodes 630, 640 can be easily formed by relatively simply patterning a plating resist.

[0076] On the other hand, although not shown, this embodiment can also be modified in the same manner as the modified example of the first embodiment of the present invention.

[0077] (Fourth Example) Fig. 22 is a schematic diagram of a coil device according to a fourth embodiment of the present invention, Fig. 23 is a diagram showing a cross section taken along line VI-VI' in Fig. 22, Fig. 24 is a diagram showing a cross section taken along line VII-VII' in Fig. 22, and Fig. 25 is a diagram showing a schematic connection relationship between a support substrate, a coil unit, and a noise elimination unit applied to the fourth embodiment of the present invention. Meanwhile, in Figs. 22 and 25, in order to more clearly show the connection between other components, the insulating layer applied to this embodiment is not shown.

[0078] 1 to 4 and 22 to 25, the coil device 4000 according to this embodiment is different from the coil device 1000 according to the first embodiment of the present invention in the arrangement of the coil section 300 and the noise elimination section 500. Therefore, in describing this embodiment, only the arrangement of the coil section 300 and the noise elimination section 500 that differs from the first embodiment of the present invention will be described. The description of the first embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0079] 22 to 25, the noise removing section 500 applied to this embodiment is disposed between the coil section 300 and the supporting substrate 200. As shown in FIG.

[0080] 22 to 25, the first noise removal pattern 510 is formed in contact with the lower surface of the support substrate 200, the first coil pattern 311 is disposed on the first noise removal pattern 510, and a first insulating layer 410 is disposed between the first noise removal pattern 510 and the first coil pattern 311 to electrically insulate the first noise removal pattern 510 and the first coil pattern 311 from each other. The second noise removal pattern 520 is formed in contact with the upper surface of the support substrate 200, the second coil pattern 312 is disposed on the second noise removal pattern 520, and a second insulating layer 420 is disposed between the second noise removal pattern 520 and the second coil pattern 312 to electrically insulate the second noise removal pattern 520 and the second coil pattern 312 from each other. The vias 320 connecting the first and second coil patterns 311, 312 to each other include a first via 321 penetrating the support substrate 200, a second via 322 penetrating the first insulating layer 410, and a third via penetrating the second insulating layer 420. The second and third vias 322, 323 penetrate the first and second insulating layers 410, 420 and are respectively in contact with and connected to both ends of the first via 311. In addition, the second and third vias 322, 323 are spaced apart from the first and second noise removal patterns 510, 520.

[0081] The first to third vias 321, 322, 323 may be formed in different processes, and a boundary may be formed between them. The first to third vias 321, 322, 323 may be formed in the same process, and may be formed integrally with each other. In the former case, the second via 322 penetrating the first insulating layer 410 is formed such that the seed layer covers one end of the first via 321 penetrating the support substrate 200. The third via 323 penetrating the second insulating layer 420 is formed such that the seed layer covers the other end of the first via 321 penetrating the support substrate 200. As a result, the seed layers of the second and third vias 322, 323 are interposed between the electrolytic plating layers of the first to third vias 321, 322, 333, and a boundary is formed between the electrolytic plating layers of the first to third vias 321, 322, 323. In the latter case, a seed layer may be formed on the inner wall of a via hole penetrating the first insulating layer 410, the support substrate 200, and the second insulating layer 420, and then the via hole may be filled with an electrolytic plating layer. In this case, the first to third vias 321, 322, and 323 may be distinguished by their arrangement regions, not by their interfaces, as in the former case. Meanwhile, in the former and latter cases, the seed layer and electrolytic plating layer of the second via 322 may be formed integrally with the seed layer and electrolytic plating layer of the first coil pattern 311, respectively, but are not limited thereto. Similarly, the seed layer and electrolytic plating layer of the third via 323 may be formed integrally with the seed layer and electrolytic plating layer of the second coil pattern 312, respectively, but are not limited thereto.

[0082] Meanwhile, Fig. 24 shows that the diameters of the second and third vias 322, 323 are the same at the top and bottom, but the scope of the present invention is not limited thereto. As another non-limiting example, depending on the method of forming via holes in the first and second insulating layers 410, 420 for forming the second and third vias 322, 323, the second and third vias 322, 323 may be formed in a shape in which the diameter decreases along a direction from one side of the first and second insulating layers 410, 420 in contact with the first and second coil patterns 311, 312 toward the first and second insulating layers 410, 420 in contact with the support substrate 200. Also, Fig. 24 shows that both ends of the first via 321 directly contact one end of each of the second and third vias 322, 323 along the thickness direction Z of the main body 100, but the scope of the present invention is not limited thereto. As another non-limiting example, via pads spaced apart from the first and second noise removal patterns 510 and 520 may be formed on both sides of the support substrate 200, and the first to third vias 321, 322, and 323 may be connected to each other by contacting the via pads. When the via pads are formed, the connection reliability between the first to third vias 321, 322, and 323 may be ensured. The diameter of the via pads may be larger than the diameter of the ends of the second and third vias that contact the via pads, but is not limited thereto. In addition, although FIG. 24 shows that the centers of the first to third vias 321, 322, and 323 are aligned with each other, the scope of the present invention is not limited thereto, and the via 320 may be formed in the form of a staggered via in which the centers of the first to third vias 321, 322, and 323 are not aligned with each other.

[0083] In this embodiment, unlike other embodiments of the present invention, the noise elimination portion 500 is first formed on the support substrate 200, and then the coil portion 300 is formed thereon. Since the coil portion 300 has a relatively high aspect ratio, even if the insulating layers 410, 420 are interposed thereon, it may be difficult to flatten the surfaces of the insulating layers 410, 420, and as a result, it may be difficult to form the noise elimination portion 500 on the insulating layers 410, 420. This embodiment solves the above-mentioned problem by first forming the noise elimination portion 500, which has a relatively simple pattern shape and a low aspect ratio, on the support substrate 200.

[0084] On the other hand, although not shown, this embodiment can also be modified in the same manner as the modified example of the first embodiment of the present invention.

[0085] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. [Item 1] The main body, A support substrate embedded in the body; a first coil pattern disposed on one surface of the support substrate, one end of which is exposed on a surface of the main body; and a second coil pattern disposed on the other surface of the support substrate, one end of which is exposed on a surface of the main body; a first noise removal pattern spaced apart from the first coil pattern, disposed on an opposite side of the first coil pattern from a side where the support substrate is disposed in a thickness direction of the main body, forming an open loop, and one end of the first noise removal pattern exposed on a surface of the main body; and a second noise removal pattern spaced apart from the second coil pattern, disposed on an opposite side of the second coil pattern from a side where the support substrate is disposed in a thickness direction of the main body, forming an open loop, and one end of the second noise removal pattern exposed on a surface of the main body. a first external electrode disposed on a surface of the body and connected to the one end of the first coil pattern, and a second external electrode disposed on a surface of the body and connected to the one end of the second coil pattern; a third external electrode disposed on a surface of the body and connected to the one end of the first noise removal pattern or the one end of the second noise removal pattern; Including coil components. [Item 2] The first noise removal pattern is formed in a ring shape with a slit, the one end of the first noise removal pattern protrudes from an end portion on an outer circumferential side of the first noise removal pattern in a radial direction of the first noise removal pattern formed in the annular shape, 2. The coil component according to item 1. [Item 3] the slit is formed in the radial direction from an inner circumferential end to an outer circumferential end of the first noise removal pattern formed in an annular shape, When viewed in a thickness direction of the main body, one side of the one end of the first noise removal pattern is disposed on an extension line of one of two opposing sides of the slit. 3. The coil component according to item 2. [Item 4] the main body includes a core that penetrates the support substrate, the first coil pattern, the second coil pattern, the first noise removal pattern, and the second noise removal pattern, a width of the core from the first noise removing pattern on one side of the core to the first noise removing pattern on the other side in a direction along a main surface of the supporting substrate is larger than a width of the core from the first coil pattern on one side of the core to the first coil pattern on the other side; 4. The coil component according to any one of items 1 to 3. [Item 5] the first coil pattern and the first noise removal pattern are formed in a planar spiral shape with the core as an axis, In a cross section in a thickness direction of the main body, a plurality of the first coil patterns and a plurality of the first noise removal patterns are arranged on one side of the core in a direction along a main surface of the support substrate, the plurality of first coil patterns and a plurality of the first noise removal patterns being aligned in a direction along a main surface of the support substrate; When viewed in a thickness direction of the main body, at least a portion of one of the first noise removal patterns overlaps with at least a portion of each of the plurality of first coil patterns. 5. The coil component according to item 4. [Item 6] 6. The coil component according to item 5, wherein the number of the first coil patterns arranged on the one side of the core is different from the number of the first noise removal patterns. [Item 7] 7. The coil component according to claim 6, wherein the number of the first noise removal patterns arranged on the one side of the core is smaller than the number of the first coil patterns arranged on the one side of the core. [Item 8] 8. The coil component according to claim 5, wherein a width of one of the first coil patterns and a width of one of the first noise removal patterns in a direction along a main surface of the supporting substrate are different. [Item 9] 9. The coil component according to item 8, wherein a width of one of the first noise removal patterns in a direction along the main surface of the support substrate is larger than a width of one of the first coil patterns in the direction along the main surface of the support substrate. [Explanation of symbols]

[0086] 100 Body 110 cores 200 Support substrate 300 Coil section 311, 312 coil pattern 320, 321, 322, 323 via 410, 420 Insulating layer 500 Noise Reduction Section 510, 520 Noise Reduction Pattern 610, 620, 630, 640 external electrode IF insulating film S slit 1000, 2000, 3000, 4000 Coil parts

Claims

1. The main body, A support substrate embedded in the body; a first coil pattern disposed on one surface of the support substrate, one end of which is exposed on a surface of the main body; and a second coil pattern disposed on the other surface of the support substrate, one end of which is exposed on the surface of the main body; a first noise removal pattern spaced apart from the first coil pattern, disposed on an opposite side of the first coil pattern from a side where the support substrate is disposed in a thickness direction of the main body, forming an open loop, and one end of the first noise removal pattern exposed to a surface of the main body; and a second noise removal pattern spaced apart from the second coil pattern, disposed on an opposite side of the second coil pattern from a side where the support substrate is disposed in a thickness direction of the main body, forming an open loop, and one end of the second noise removal pattern exposed to a surface of the main body. a first insulating layer provided between a first end of the first coil pattern on a side opposite to the support substrate in a thickness direction of the support substrate and the first noise removal pattern, the first insulating layer being continuous from the first end to the first noise removal pattern in the thickness direction; a second insulating layer provided between a second end of the second coil pattern on a side opposite to the supporting substrate in the thickness direction and the second noise removal pattern, the second insulating layer being continuous from the second end to the second noise removal pattern in the thickness direction; a first external electrode disposed on a surface of the body and connected to the one end of the first coil pattern, and a second external electrode disposed on a surface of the body and connected to the one end of the second coil pattern; a third external electrode disposed on a surface of the body and connected to the one end of the first noise removal pattern or the one end of the second noise removal pattern; an insulating film formed along a surface of the first coil pattern, a surface of the second coil pattern, a surface of the first insulating layer, a surface of the second insulating layer, a surface of the first noise removing pattern, and a surface of the second noise removing pattern; Including, the first coil pattern and the first noise removal pattern are formed in a planar spiral shape in an in-plane direction of a main surface of the support substrate, the first coil pattern has a plurality of first coil turns, and the first noise reduction pattern has a plurality of first noise reduction turns; a winding direction from an innermost turn to an outermost turn in the plurality of first coil turns is the same as a winding direction from an innermost turn to an outermost turn in the plurality of first noise elimination turns; Coil parts.

2. The second coil pattern and the second noise removal pattern are formed in a planar spiral shape in an in-plane direction of the main surface of the support substrate, the second coil pattern has a plurality of second coil turns, and the second noise reduction pattern has a plurality of second noise reduction turns; a winding direction from an innermost turn to an outermost turn in the plurality of second coil turns is the same as a winding direction from an innermost turn to an outermost turn in the plurality of second noise elimination turns. The coil component according to claim 1 .

3. A body, A support substrate embedded in the body; a first coil pattern disposed on one surface of the support substrate, one end of which is exposed on a surface of the main body; and a second coil pattern disposed on the other surface of the support substrate, one end of which is exposed on the surface of the main body; a first noise removal pattern spaced apart from the first coil pattern, disposed on an opposite side of the first coil pattern from a side where the support substrate is disposed in a thickness direction of the main body, forming an open loop, and one end of the first noise removal pattern exposed to a surface of the main body; and a second noise removal pattern spaced apart from the second coil pattern, disposed on an opposite side of the second coil pattern from a side where the support substrate is disposed in a thickness direction of the main body, forming an open loop, and one end of the second noise removal pattern exposed to a surface of the main body. a first insulating layer provided between a first end of the first coil pattern on a side opposite to the support substrate in a thickness direction of the support substrate and the first noise removal pattern, the first insulating layer being continuous from the first end to the first noise removal pattern in the thickness direction; a first external electrode disposed on a surface of the body and connected to the one end of the first coil pattern, and a second external electrode disposed on a surface of the body and connected to the one end of the second coil pattern; a third external electrode disposed on a surface of the body and connected to the one end of the first noise removal pattern or the one end of the second noise removal pattern; Including, the first coil pattern and the first noise removal pattern are formed in a planar spiral shape in an in-plane direction of a main surface of the support substrate, the first coil pattern has a plurality of first coil turns, and the first noise reduction pattern has a plurality of first noise reduction turns; a winding direction from an innermost turn to an outermost turn in the plurality of first coil turns is the same as a winding direction from an innermost turn to an outermost turn in the plurality of first noise elimination turns; The number of turns in the plurality of first coil turns is different from the number of turns in the plurality of first noise removal turns. Coil parts.

4. The coil component according to claim 3 , wherein a number of the turns in the first plurality of noise elimination turns is less than a number of the turns in the first plurality of coil turns.

5. 5. The coil component according to claim 3, wherein a width of one of the plurality of first coil turns is different from a width of one of the plurality of first noise removal turns in a direction along a main surface of the support substrate.

6. 6. The coil component according to claim 5, wherein in a direction along a main surface of the support substrate, a width of one of the plurality of first noise elimination turns is greater than a width of one of the plurality of first coil turns.

7. further comprising a second insulating layer provided between a second end of the second coil pattern opposite the support substrate in the thickness direction and the second noise removal pattern so as to be continuous from the second end to the second noise removal pattern in the thickness direction; the second coil pattern and the second noise removal pattern are formed in a planar spiral shape in an in-plane direction of a main surface of the support substrate, the second coil pattern has a plurality of second coil turns, and the second noise reduction pattern has a plurality of second noise reduction turns; a winding direction from an innermost turn to an outermost turn in the plurality of second coil turns is the same as a winding direction from an innermost turn to an outermost turn in the plurality of second noise elimination turns. The coil component according to claim 3 .

8. 8. The coil component according to claim 2 or 7, wherein, when viewed in a direction from the second coil pattern to the first coil pattern, a winding direction from the innermost turn to the outermost turn in the plurality of first coil turns and the plurality of first noise elimination turns is opposite to a winding direction from the innermost turn to the outermost turn in the plurality of second coil turns and the plurality of second noise elimination turns.

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