Component mounting device and component mounting method

Abstract

To provide a component mounting apparatus and the like capable of suppressing production time loss.SOLUTION: A component mounting apparatus 1 is a component mounting apparatus 1 for mounting a component onto a circuit board 3 including: a first suction nozzle 15b1 for sucking a component; a second suction nozzle 15b2 that is placed alongside the first suction nozzle 15b1 for sucking the component; and a measurement unit (flow sensor 16) that measures a flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2. The measurement unit is configured to measure airflow through the second suction nozzle 15b2 not sucking component while the first suction nozzle 15b1 is performing a component mounting operation to the circuit board 3.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a component mounting device and a component mounting method.

Background Art

[0002] In conventional Patent Document 1, after imaging the suction surface of a suction nozzle in advance with a camera and then carrying out a printed circuit board, the suction surface of the suction nozzle is imaged again with a camera after production, and by comparing the imaged images, a component mounting device for determining the presence or absence of an abnormality in the suction surface is disclosed.

[0003] Also, in conventional Patent Document 2, when a suction nozzle is defective during production, the air flow rate of the suction nozzle is measured by a flow rate measurement unit without performing a component suction operation, and the measured value is taken into a control unit, thereby determining the quality of the suction nozzle, and a component mounting device for replacing it with a new suction nozzle by a nozzle replacement unit only when it is determined to be defective two or more times continuously is disclosed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the component mounting device of Patent Document 1, since the suction surface of the suction nozzle is imaged again with a camera after production to determine the presence or absence of an abnormality in the suction surface of the suction nozzle, it takes time outside of production.

[0006] Furthermore, in the component mounting device described in Patent Document 2, the tip of the suction nozzle is moved to the measurement block during production before the airflow rate of the suction nozzle is measured. Even in this case, time is required to allow the suction nozzle to access the measurement block.

[0007] Therefore, the purpose of this disclosure is to provide a component mounting device and a component mounting method that can suppress the occurrence of time losses in production. [Means for solving the problem]

[0008] A component mounting device according to one aspect of the present disclosure is a component mounting device for mounting a component to a substrate, comprising: a first suction nozzle for adsorbing a component; a second suction nozzle for adsorbing a component, provided alongside the first suction nozzle; and a measuring unit for measuring the flow rate of air flowing through the first suction nozzle or the second suction nozzle, wherein the measuring unit measures the flow rate of air flowing through the second suction nozzle, which is not adsorbing a component, while the first suction nozzle is performing the operation of mounting a component to the substrate. [Effects of the Invention]

[0009] The component mounting apparatus and component mounting method of this disclosure can suppress the occurrence of time losses in production. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a plan view showing a component mounting device according to an embodiment. [Figure 2] Figure 2 is a perspective view showing a mounting head used in a component mounting device according to an embodiment. [Figure 3] Figure 3 is a block diagram showing the configuration of the vacuum suction system and the air blow system in the component mounting device according to the embodiment. [Figure 4] Figure 4 is a block diagram showing the configuration of the control system of a component mounting device according to an embodiment. [Figure 5] Figure 5 is a flowchart showing the processing operation of the component mounting device according to the embodiment. [Figure 6] Figure 6 is a plan view showing how the suction nozzle of the component mounting device according to the embodiment passes above the component recognition camera. [Figure 7] Figure 7 shows the relationship between time and flow rate when a component is adsorbed to the tip of the adsorption nozzle and when no component is adsorbed. [Figure 8] Figure 8 shows the relationship between time and flow rate when switching from vacuum flow rate to blowdown flow rate. [Figure 9] Figure 9 shows the relationship between time and flow rate in vacuum flow rate or blowdown flow rate. [Figure 10] Figure 10 shows an image of a normal adsorption nozzle with an adsorption surface, and its brightness distribution diagram. [Figure 11] Figure 11 shows an image of an adsorption nozzle exhibiting abnormalities on its adsorption surface, as well as its brightness distribution diagram. [Modes for carrying out the invention]

[0011] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit this disclosure. Furthermore, any components in the following embodiments that are not described in an independent claim will be described as optional components.

[0012] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. Also, the same reference numerals are used for the same components in each figure. In addition, expressions such as "approximately horizontal" are used in the following embodiments. For example, "approximately horizontal" does not only mean perfectly horizontal, but also substantially horizontal, that is, including an error of, for example, a few percent. Furthermore, "approximately horizontal" means horizontal to the extent that the effects of this disclosure can be achieved. The same applies to other expressions using "approximately".

[0013] In the following embodiments, the substrate transfer direction is defined as the X-axis direction (the left-right direction in FIG. 1), the direction that is orthogonal to the substrate transfer direction and parallel to the horizontal plane is defined as the Y-axis direction, and the direction that is orthogonal to the X-axis direction and the Y-axis direction is defined as the Z-axis direction (the up-down direction).

[0014] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0015] (Embodiment) <Configuration: Component Mounting Device 1> FIG. 1 is a plan view of a component mounting device 1 according to an embodiment.

[0016] As shown in FIG. 1, in the component mounting device 1, a component (electronic component) can be mounted (assembled) at a predetermined position on a substrate 3 to manufacture an assembled substrate. Note that in the component mounting device 1, components other than electronic components can also be mounted on the mounting objects.

[0017] The component mounting device 1 of the present embodiment includes a base 1a, a substrate transfer unit 2, a component supply unit 4, a Y-axis beam 6, an X-axis beam 7, a mounting head 8, a component recognition camera 11, a component waste box 10, and a substrate recognition camera 12.

[0018] The base 1a can arrange the substrate 3, the substrate transfer unit 2, etc. On the upper surface of the base 1a, a substrate transfer unit 2 extending along the X-axis direction is disposed.

[0019] The substrate transfer unit 2 positions and holds the substrate 3 at the assembly work position by transferring the substrate 3 received from an upstream device. Component supply units 4 are respectively arranged on both sides in the Y-axis direction with respect to the substrate transfer unit 2.

[0020] The component supply unit 4 is a structure for supplying components to the mounting head 8, or in other words, for the mounting head 8 to pick up components. Multiple tape feeders 5 are mounted side by side in the component supply unit 4. The tape feeders 5 feed the carrier tape holding the components in a pitch, so that the mounting head 8, which constitutes the component mounting mechanism, can position the components at the mounting location.

[0021] Furthermore, a long Y-axis beam 6 is positioned approximately horizontally along the Y-axis direction at one end of the upper surface of the base 1a on the X-axis positive side. A pair of long X-axis beams 7 are slidably mounted on the Y-axis beam 6 along the Y-axis direction.

[0022] One of the pair of X-axis beams 7 is positioned on the Y-axis positive side relative to the substrate transport unit 2, and the other of the pair of X-axis beams 7 is positioned on the Y-axis negative side relative to the substrate transport unit 2. Furthermore, the pair of X-axis beams 7 are positioned substantially horizontally along the X-axis direction.

[0023] The pair of X-axis beams 7 can be moved in the Y-axis direction by a linear drive mechanism of the Y-axis beam 6. A mounting head 8 is slidably attached to each of the pair of X-axis beams 7.

[0024] The mounting head 8 has multiple nozzle units 9. Furthermore, the mounting head 8 can move along the X-axis direction by a linear drive mechanism provided by the X-axis beam 7.

[0025] Driven by the linear drive mechanism, the X-axis beam 7 and the mounting head 8 move freely in the XY plane. The mounting head 8 uses multiple suction nozzles 15 provided on the nozzle unit 9 to vacuum-suction (suction) components from the tape feeders 5 located in each component supply unit 4, and moves above the substrate 3 to mount the components in the mounting positions on the substrate 3.

[0026] Furthermore, a component recognition camera 11 and a component waste box 10 are positioned between the substrate transport unit 2 and each component supply unit 4 on the base 1a. As the mounting head 8, which has taken a component from the component supply unit 4, passes above the component recognition camera 11, the component recognition camera 11 captures an image of the component being held by either the first suction nozzle 15b1 or the second suction nozzle 15b2 of the multiple suction nozzles 15 attached to the mounting head 8 at the imaging timing when the mounting head 8 passes by. Therefore, the component recognition camera 11 can recognize the component being held by either the first suction nozzle 15b1 or the second suction nozzle 15b2 of the multiple suction nozzles 15.

[0027] The part disposal box 10 is located on the path that the mounting head 8 passes above the part recognition camera 11, and is arranged adjacent to the part recognition camera 11 along the X-axis. The mounting head 8, having picked up a part, can discard the part when it is positioned above the part disposal box 10.

[0028] Furthermore, when the first suction nozzle 15b1 is holding a part and the second suction nozzle 15b2 is not holding a part, and the first suction nozzle 15b1 and the second suction nozzle 15b2 pass above the part recognition camera 11, the part recognition camera 11 recognizes the part held by the first suction nozzle 15b1 and the tip 15a of the second suction nozzle 15b2. The part recognition camera 11 recognizes the tip 15a of the second suction nozzle 15b2 as either the suction surface 15a1 of the second suction nozzle 15b2 or the length of the second suction nozzle 15b2. In other words, the part recognition camera 11 can perform both planar (two-dimensional) and three-dimensional recognition. In this embodiment, the second suction nozzle 15b2 is provided alongside the first suction nozzle 15b1. The first suction nozzle 15b1 and the second suction nozzle 15b2 are sometimes collectively referred to as the suction nozzle 15. The component recognition camera 11 is an example of a recognition unit.

[0029] Furthermore, the first suction nozzle 15b1 and the second suction nozzle 15b2 can attract (vacuum attract) parts and separate the attracted parts. In addition to vacuum attracting, the first suction nozzle 15b1 and the second suction nozzle 15b2 can also blow.

[0030] Furthermore, the second suction nozzle 15b2 may not be used for component suction during certain mounting turns. This allows the component recognition camera 11 to determine whether or not the tip 15a of the second suction nozzle 15b2 is the object to be recognized.

[0031] Furthermore, when the component recognition camera 11 recognizes a component adsorbed by the first suction nozzle 15b1 and the tip 15a of the second suction nozzle 15b2, the component recognition camera 11 recognizes the component under first illumination conditions and the tip 15a under second illumination conditions different from the first illumination conditions. In other words, the component recognition camera 11 has an illumination unit that illuminates the component and the tip 15a of the suction nozzle 15, and an illumination control unit that controls the emission of light from the illumination unit based on the imaging timing. The component recognition camera 11 can recognize a component by having the illumination control unit illuminate the component adsorbed by the first suction nozzle 15b1 under first illumination conditions based on the imaging timing of the component recognition camera 11. Also, the component recognition camera 11 can recognize the tip 15a of the second suction nozzle 15b2 by having the illumination control unit illuminate the tip 15a of the second suction nozzle 15b2 under second illumination conditions based on the imaging timing of the component recognition camera 11. The first illumination conditions are illumination conditions for recognizing a component, and are light with a predetermined irradiation angle. The lighting control unit can switch lighting conditions by changing the brightness of the light irradiated onto the component, the irradiation angle, or the type of lighting (e.g., transmitted illumination and reflected illumination). Here, the first lighting condition is a lighting condition that allows the component to be recognized, for example, a lighting condition in which light with a predetermined irradiation angle is irradiated onto the component. The second lighting condition is a lighting condition that allows the tip portion 15a to be recognized, for example, a lighting condition in which light is irradiated perpendicularly to the tip portion 15a.

[0032] A substrate recognition camera 12 is positioned on the lower side of the X-axis beam 7 and moves integrally with the mounting head 8 on the coupling plate 8a to which the mounting head 8 is attached. The substrate recognition camera 12 is positioned on the coupling plate 8a with its imaging direction facing downwards. By moving the mounting head 8 above the substrate 3 held by the substrate transport unit 2, the substrate recognition camera 12 captures position recognition marks on the substrate 3, etc., and after component mounting, moves above the substrate 3 to capture images of the components mounted on the substrate 3.

[0033] By performing image recognition processing on the image data acquired by the component recognition camera 11 and the substrate recognition camera 12, the mounting head 8 can detect positional misalignment of the component held by the suction nozzle 15 and positional misalignment of the substrate 3 held by the substrate transport unit 2. During the component mounting operation, the mounting head 8 takes these positional misalignments into account, corrects the position, and mounts the component to the mounting position on the substrate 3.

[0034] Next, the mounting head 8 will be described using Figures 1 and 2. Figure 2 is a perspective view showing the mounting head 8 used in the component mounting device 1 according to the embodiment.

[0035] As shown in Figures 1 and 2, the mounting head 8 is mounted on the X-axis beam 7 via a coupling plate 8a. The mounting head 8 is arranged with multiple nozzle units 9 side by side. Each nozzle unit 9 is positioned so that a nozzle shaft 13 extends downward from a nozzle drive unit 9a. Multiple suction nozzles 15 are detachably mounted on a nozzle mounting section 14 connected to the lower end of the nozzle shaft 13. Each nozzle drive unit 9a has a nozzle lifting mechanism that raises and lowers a lifting shaft connected to the nozzle shaft 13 using a linear motor. When the nozzle drive unit 9a is driven, the multiple suction nozzles 15 mounted on the nozzle mounting section 14 move up and down individually. Thus, the mounting head 8 has multiple nozzle units 9, a nozzle drive unit 9a, a nozzle shaft 13, a nozzle mounting section 14, and suction nozzles 15. The mounting head 8 has multiple nozzle units 9, multiple nozzle drive units 9a, multiple nozzle shafts 13, multiple nozzle mounting parts 14, and multiple suction nozzles 15. Unless otherwise specified, the description will focus on one nozzle unit 9, one nozzle drive unit 9a, one nozzle shaft 13, one nozzle mounting part 14, and one suction nozzle 15.

[0036] Multiple types of suction nozzles 15 are available depending on the size and shape of the part to be vacuum-suctioned. For example, for larger parts, a suction nozzle 15 with a larger suction surface 15a1 at the lower end of the suction nozzle 15 (as shown in Figure 3) is used.

[0037] Furthermore, the mounting head 8 is available in multiple types depending on the type of suction nozzle 15 to be attached. For example, when attaching a large suction nozzle 15 for picking up large parts, a mounting head 8 with a large nozzle unit 9 is used.

[0038] Next, the vacuum suction system and the air blow system will be explained using Figures 1 to 3. Figure 3 is a block diagram showing the configuration of the vacuum suction system and the air blow system in the component mounting device 1 according to the embodiment.

[0039] As shown in Figures 1-3, the nozzle shaft 13 is inserted through the nozzle mounting section 14 and communicates with the suction nozzle 15. A flow path hole provided inside the nozzle shaft 13 is connected to the output path 17 via a flow sensor 16. In other words, the suction hole of the nozzle shaft 13 and the output path 17 are connected to the output port A1 of the switching valve 18 via the flow sensor 16 and the output path 17, forming a suction / air blow circuit that connects the switching valve 18 and the suction nozzle 15.

[0040] The flow sensor 16 measures the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2. In other words, the flow sensor 16 measures the flow rate of air flowing inside a predetermined suction nozzle 15 in a plurality of suction nozzles 15. For example, the flow sensor 16 measures the flow rate of air in two directions: the positive direction, where air flows out from the flow sensor 16 towards the nozzle axis 13 (arrow a), and the negative direction, where air flows in from the nozzle axis 13 towards the flow sensor 16 (arrow b). In other words, the flow sensor 16 measures the vacuum flow rate when the suction nozzle 15 is sucking air, or the blow-out flow rate when the suction nozzle 15 is blowing air.

[0041] Furthermore, the flow sensor 16 can measure the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2 at the following times. For example, the flow sensor 16 measures the flow rate of air flowing through the second suction nozzle 15b2, which is not holding a component, while the first suction nozzle 15b1 is performing the component mounting operation on the substrate 3. In other words, the flow sensor 16 uses the idle time of the second suction nozzle 15b2, which is not holding a component, to measure the flow rate of air flowing inside the second suction nozzle 15b2. The flow sensor 16 also measures the flow rate of air flowing through the second suction nozzle 15b2, which is not holding a component, after the second suction nozzle 15b2 has mounted a component to the substrate 3 (after the mounting operation is completed). In addition, if the determination unit 25 determines that no component is held by the second suction nozzle 15b2, the flow sensor 16 measures the flow rate of air flowing through the second suction nozzle 15b2.

[0042] The flow sensor 16 outputs the measurement results of the suction flow rate and the blow-out flow rate to the determination unit 25 of the nozzle control unit 23. The flow sensor 16 is an example of a measurement unit.

[0043] The switching valve 18 is composed of a solenoid valve or the like, having two input ports P1 and P2 and an output port A1. The switching valve 18 can be switched by an external selection signal between a state in which the path from input port P1 to output port A1 is open and a state in which the path from input port P2 to output port A1 is open. Input port P1 of the switching valve 18 is connected to the vacuum pump 19, input port P2 is connected to the output port A2 of the blow valve 20, and output port A1 is connected to the output path 17 leading to the flow sensor 16. The vacuum pump 19 can also generate negative pressure (vacuum).

[0044] The blow valve 20 is composed of a solenoid valve having two input ports P3 and P4 and an output port A2. The blow valve 20 can be switched between a state where the path from input port P3 to output port A2 is open and a state where the path from input port P4 to output port A2 is open, based on an external selection signal. Input port P3 of the blow valve 20 is connected to an air supply source 21, input port P4 to an atmospheric supply source 22, and output port A2 to input port P2 of the switching valve 18. The air supply source 21 can supply positive-pressure air, while the atmospheric supply source 22 can supply atmospheric air. The atmospheric supply source 22 can also be realized by opening input port P4 of the blow valve 20.

[0045] The switching valve 18 and the blow valve 20 are connected to the valve control unit 24 of the nozzle control unit 23. The measurement result of the flow sensor 16 is input to the determination unit 25 of the nozzle control unit 23. The valve memory unit 26 of the nozzle control unit 23 stores timing information for switching the state of the switching valve 18 and the blow valve 20 by the valve control unit 24, timing information for determining whether the air flow rate measured by the flow sensor 16 is normal by the determination unit 25, and a predetermined value (determination value). The nozzle control unit 23 is located on the mounting head 8 and is connected to the device control unit 30 when the mounting head 8 is attached to the coupling plate 8a.

[0046] When the valve control unit 24 controls the switching valve 18 to open the path from the input port P1 to the output port A1 (suction state), the vacuum pump 19 communicates with the suction nozzle 15 via the switching valve 18 and the flow sensor 16, and the suction nozzle 15 performs vacuum suction from the suction surface 15a1 at its lower end.

[0047] When the suction nozzle 15 vacuum-suctions a component while it is in contact with the suction surface 15a1, the component is vacuum-suctioned by the suction nozzle 15. At this time, the air flow rate (vacuum flow rate) measured by the flow sensor 16 becomes virtually zero. When vacuum suction is applied from the suction nozzle 15 while the component is not in contact with the suction surface 15a1, outside air (air) is drawn in from the suction nozzle 15. Therefore, the flow sensor 16 can measure a negative air flow rate.

[0048] When the valve control unit 24 controls the switching valve 18 to open the path from input port P2 to output port A1, and controls the blow valve 20 to open the path from input port P3 to output port A2 (blow state), the air supply source 21 communicates with the suction nozzle 15 via the blow valve 20, switching valve 18, and flow sensor 16, and positive pressure air is discharged from the suction nozzle 15. In other words, the air supply source 21 becomes an air blowing means that discharges positive pressure air from the suction nozzle 15. At this time, the flow rate of positive air is measured by the flow sensor 16.

[0049] When the valve control unit 24 controls the switching valve 18 to open the path from input port P2 to output port A1, and controls the blow valve 20 to open the path from input port P4 to output port A2 (atmospheric pressure state), the air supply source 22 communicates with the adsorption nozzle 15 via the blow valve 20, switching valve 18, and flow sensor 16, and the adsorption nozzle 15 becomes atmospheric pressure. At this time, the air flow rate measured by the flow sensor 16 becomes virtually zero.

[0050] Thus, the switching valve 18 and the blow valve 20 serve as switching means for selectively connecting the vacuum pump 19 and the air supply source 21 to the suction nozzle 15. The flow sensor 16 is interposed in the suction / air blow circuit that connects this switching means (switching valve 18 and blow valve 20) to the suction nozzle 15, and measures the flow rate of air passing through the suction / air blow circuit in both forward and reverse directions.

[0051] The determination unit 25 compares the airflow rate measured by the flow sensor 16 with a predetermined value stored in the valve memory unit 26 to determine whether the airflow rate exceeds the predetermined value. Specifically, the determination unit 25 determines whether a component is being held by the second suction nozzle 15b2 based on the recognition result of the component recognition camera 11.

[0052] For example, the determination unit 25 determines that a part is not being held by the second suction nozzle 15b2 if the flow rate measured by the flow sensor 16 after the second suction nozzle 15b2 has performed the suction operation of the part is greater than or equal to a predetermined value. Conversely, the determination unit 25 determines that a part is being held by the second suction nozzle 15b2 if the flow rate measured by the flow sensor 16 after the second suction nozzle 15b2 has performed the suction operation of the part is less than a predetermined value. The timing of the determination by the determination unit 25 is controlled by the valve control unit 24 based on timing information stored in the valve storage unit 26. The determination result from the determination unit 25 is transmitted to the device control unit 30 via the valve control unit 24.

[0053] Furthermore, if the flow rate is a vacuum flow rate, the determination unit 25 determines whether the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than a first predetermined value. If the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than the first predetermined value, the determination unit 25 determines that the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal. If the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is less than the first predetermined value, the determination unit 25 determines that the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal.

[0054] Furthermore, if the flow rate is the blow-off flow rate, the determination unit 25 determines whether the blow-off flow rate is equal to or greater than the second predetermined value. If the blow-off flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than the second predetermined value, the determination unit 25 determines that the blow-off flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal. If the blow-off flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is less than the second predetermined value, the determination unit 25 determines that the blow-off flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal.

[0055] Furthermore, the determination unit 25 determines whether the second suction nozzle 15b2 is good or bad based on the recognition result of the part recognition camera 11 of the tip portion 15a of the second suction nozzle 15b2. If the determination unit 25 determines that the second suction nozzle 15b2 is abnormal (defective), it outputs a determination result indicating that the second suction nozzle 15b2 is abnormal to the notification unit 34. If the determination unit 25 determines that the second suction nozzle 15b2 is normal (good), it outputs a determination result indicating that the second suction nozzle 15b2 is normal to the notification unit 34.

[0056] Next, the configuration of the component mounting device 1 will be explained using Figures 1 to 4. Figure 4 is a block diagram showing the configuration of the control system of the component mounting device 1 according to an embodiment.

[0057] As shown in Figures 1 to 4, the component mounting device 1 includes a device control unit 30, a device storage unit 31, a substrate transport unit 2, a component supply unit 4, a mounting head 8, a Y-axis beam 6, an X-axis beam 7, a component recognition camera 11, a substrate recognition camera 12, a vacuum pump 19, an air supply source 21, an atmospheric supply source 22, an input unit 32, a display unit 33, and a notification unit 34. The mounting head 8 also includes a nozzle control unit 23.

[0058] The nozzle control unit 23 includes a valve control unit 24, a determination unit 25, and a valve storage unit 26. A flow sensor 16, a switching valve 18, and a blow valve 20 are connected to the nozzle control unit 23.

[0059] The device control unit 30 is a arithmetic processing unit equipped with CPU functionality, and includes an implementation control unit 30a and an error processing unit 30b as internal processing functions. The device storage unit 31 is a storage device that stores production data such as implementation data 31a, valve control data 31b, and judgment control data 31c.

[0060] The mounting data 31a includes information such as the mounting position of components on the substrate 3 and the type of component to be mounted (component name). Based on the mounting data 31a, the mounting control unit 30a controls the substrate transport unit 2, component supply unit 4, mounting head 8, nozzle drive unit 9a, Y-axis beam 6, and X-axis beam 7 to enable the suction nozzle 15 to mount components to the mounting positions on the substrate 3.

[0061] The valve control data 31b stores timing information such as when the valve control unit 24 switches the switching valve 18 and the blow valve 20 when the component vacuum-adsorbed by the suction nozzle 15 is mounted onto the substrate 3.

[0062] The judgment control data 31c stores timing information used by the judgment unit 25 of the nozzle control unit 23 to determine the measurement result of the flow sensor 16, a predetermined value which is a threshold for determining whether the measured air flow rate is normal or not, and so on.

[0063] The timing information of the valve control data 31b, the timing information of the judgment control data 31c, and predetermined values ​​are predetermined based on experiments and experience, according to the type of mounting head 8 (number of nozzle units 9, etc.) and the type of suction nozzle 15 to which the mounting head 8 is attached. Various data corresponding to the configuration of the component mounting device 1, such as the type of mounting head 8 attached to the component mounting device 1 and the type of suction nozzle 15 attached to the nozzle unit 9, are stored by being transferred from the valve control data 31b and judgment control data 31c to the valve storage unit 26 of the nozzle control unit 23.

[0064] The input unit 32 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands or data.

[0065] The display unit 33 is a display device such as a liquid crystal panel, and displays various information such as an operation screen for operation by the input unit 32, as well as images captured by the board recognition camera 12.

[0066] The notification unit 34 is an alarm light, flash lamp, buzzer, etc., and notifies the operator of the operating status of the component mounting device 1, such as any abnormalities. For example, if the vacuum flow rate is determined to be less than a first predetermined value, or if the blow flow rate is determined to be less than a second predetermined value, the notification unit 34 will notify an error. In addition, if the determination unit 25 determines that the second suction nozzle 15b2 is abnormal, the notification unit 34 will notify an error indicating that the second suction nozzle 15b2 is abnormal.

[0067] The abnormality processing unit 30b executes abnormality processing when the determination unit 25 detects an abnormality in the vacuum suction system or the air blow system. Specifically, when an abnormality is detected, the abnormality processing unit 30b has the board recognition camera 12 capture an image of the mounting position of the components mounted on the board 3, and displays the captured image on the display unit 33. Furthermore, the abnormality processing unit 30b activates the notification unit 34 to notify the operator of the abnormality.

[0068] In other words, if the determination unit 25 determines that any of the vacuum pump 19, air supply source 21, switching valve 18, blow valve 20, or suction / air blow circuit is abnormal, the board recognition camera 12 captures an image of the mounting position on the board 3 where the component is expected to have been mounted when the determination unit 25 determined that the component was abnormal. The display unit 33 then displays the image of the position on the board 3 captured by the board recognition camera 12, and the notification unit 34 also notifies the system of the abnormality.

[0069] <Processing Actions> Next, the processing operation of the component mounting device 1 and component mounting method according to this embodiment will be described. Figure 5 is a flowchart showing the processing operation of the component mounting device 1 according to this embodiment. In Figure 5, the nozzle unit 9 is provided with a plurality of suction nozzles 15, but unless otherwise specified, only one of the multiple suction nozzles 15 will be described.

[0070] First, as shown in Figure 5, the determination unit 25 determines whether the suction nozzle 15 of the nozzle unit 9 provided on the mounting head 8 is the suction nozzle 15 to be used in the current mounting turn (S11). For example, the determination unit 25 determines whether the suction nozzle 15 to be used in the current mounting turn is mounted on the nozzle unit 9 based on the production data stored in the device storage unit 31 or the valve storage unit 26.

[0071] Next, the determination unit 25 determines that the suction nozzle 15 to be used in this mounting turn (YES in S11), and the mounting head 8 uses the suction nozzle 15 provided on the nozzle unit 9 to pick up the part from the tape feeder 5 located in the part supply unit 4 (performs a suction operation). At this time, the flow sensor 16 measures the flow rate of the air flowing through the suction nozzle 15 as a confirmation of the flow rate after the part suction operation (S12). The flow sensor 16 outputs the measurement result to the determination unit 25.

[0072] Next, the determination unit 25 obtains the measurement result from the flow sensor 16 and determines whether the flow rate in the adsorption nozzle 15 is normal or not (S13).

[0073] Here, we will explain, using Figure 7, how to determine whether the flow rate in the suction nozzle 15 is normal or not, based on the flow rate check after the component suction operation. Figure 7 shows the relationship between time and flow rate when a component is suctioned to the tip 15a of the suction nozzle 15 (Figure 7a) and when a component is not suctioned (Figure 7b). In Figure 7, the horizontal axis is time and the vertical axis is flow rate.

[0074] As shown by the solid line in Figure 7a, when a component is attracted to the tip 15a of the suction nozzle 15, before the component is attracted, the flow rate is higher than the first predetermined value shown by the dashed line. After the component is attracted, the component covers the opening of the tip 15a, so the flow rate is lower than the first predetermined value shown by the dashed line, and the flow rate is effectively zero. For this reason, before the component is attracted, the determination unit 25 determines that the component is not attracted by the second suction nozzle 15b2 if the flow rate of the suction nozzle 15 (second suction nozzle 15b2) measured by the flow rate sensor 16 is equal to or greater than the first predetermined value. After the component is attracted, the determination unit 25 determines that the component is attracted by the second suction nozzle 15b2 if, for example, the flow rate measured by the flow rate sensor 16 after the second suction nozzle 15b2 has performed the component attraction operation is less than the first predetermined value (the flow rate is effectively zero in Figure 7a). The first predetermined value is an example of a predetermined value.

[0075] However, as shown by the solid line in Figure 7b, the flow rate of the suction nozzle 15 temporarily decreased but then returned to its original flow rate. This means that although the suction nozzle 15 attempted to pick up the part, it failed to pick it up, causing the flow rate to decrease temporarily before returning to normal. In this case, since the flow rate of the second suction nozzle 15b2 is greater than or equal to the first predetermined value, the determination unit 25 determines that the part was not picked up by the second suction nozzle 15b2.

[0076] As explained above, for example, if the determination unit 25 determines that the flow rate in the suction nozzle 15 is normal (YES in S13), the part recognition camera 11 recognizes the part that has been picked up by the first suction nozzle 15b1 among the multiple suction nozzles 15 (S14). In other words, as shown by the solid arrow in Figure 6, the part recognition camera 11 recognizes the part by imaging the part based on the imaging timing, which is the timing when the first suction nozzle 15b1 passes above the part recognition camera 11 with the part held in its grasp. Figure 6 is a plan view showing the suction nozzle 15 of the part mounting device 1 according to the embodiment passing above the part recognition camera 11.

[0077] Next, the part recognition camera 11 determines whether the recognized part is a normal part or not (S15). For example, the part recognition camera 11 determines whether the part is a normal part or not based on whether it is a part based on production data, the orientation of the part, whether the part is damaged or not, whether foreign matter is attached to the part, etc.

[0078] Next, if the part recognition camera 11 determines that the recognized part is a normal part (YES in S15), the determination unit 25 determines whether or not a suction nozzle 15 (first suction nozzle 15b1) with a part already attached is present in the nozzle unit 9 (S16).

[0079] If the determination unit 25 determines that there are no suction nozzles 15 with parts already attached in the nozzle unit 9 (NO in S16), the parts are attached using the suction nozzle 15 holding the parts (S20), and the process proceeds to step S21. For example, if, in this attachment turn, none of the multiple suction nozzles 15 have finished attaching parts, the determination unit 25 determines that there are no suction nozzles 15 with parts already attached.

[0080] On the other hand, if the determination unit 25 determines that there is a suction nozzle 15 with a component already attached in the nozzle unit 9 (YES in S16), the flow sensor 16 measures the vacuum flow rate of the suction nozzle 15 with the component attached, or the blow flow rate of the suction nozzle 15, in parallel with the component attachment by the suction nozzle 15 holding the component (S17).

[0081] Here, the measurement of vacuum flow rate or blowdown flow rate will be explained using Figure 8. Figure 8 is a diagram showing the relationship between time and flow rate when switching from vacuum flow rate to blowdown flow rate. In Figure 8, the horizontal axis is time and the vertical axis is flow rate.

[0082] Normally, the vacuum flow rate is constantly measured, but when measuring the blow flow rate, the switching valve 18 closes the path from input port P1 to output port A1, and then switches to a state where the path from input port P2 to output port A1 is open. As shown in Figures 5 and 8, when the suction nozzle 15 is switched from suction (suction direction) to blow (discharge direction), the flow sensor 16 measures the blow flow rate in the suction nozzle 15. The flow sensor 16 outputs the measurement result of the vacuum flow rate or the blow flow rate to the determination unit 25.

[0083] Next, the determination unit 25 obtains the vacuum flow rate measurement result or the blow flow rate measurement result from the flow sensor 16 and determines whether the flow rate (vacuum flow rate or blow flow rate) of the suction nozzle 15 in step S17 is normal or not (S18).

[0084] For example, in the case of blow flow rate, if the flow rate of the adsorption nozzle 15 is less than the second predetermined value shown by the dashed line, as shown by the dashed line in Figure 8, the determination unit 25 determines that the flow rate is abnormal (not normal) (NO in S18). For example, if the blow flow rate of the adsorption nozzle 15 is less than the second predetermined value shown by the dashed line, the determination unit 25 determines that the flow rate is abnormal, as shown by the dashed line in Figure 8. The same applies to vacuum flow rate. The second predetermined value is just one example of a predetermined value.

[0085] Next, if the answer in step S18 is NO, the notification unit 34 notifies an error indicating that the suction nozzle 15 is malfunctioning (S19). This allows the operator to recognize that the suction nozzle 15 is malfunctioning.

[0086] For example, in the case of blow-flow rate, if the flow rate of the suction nozzle 15 is equal to or greater than the second predetermined value shown by the dashed line, as shown by the solid line in Figure 8, the determination unit 25 determines that the flow rate is normal (YES in S18). For example, if the blow-flow rate of the suction nozzle 15 is equal to or greater than the second predetermined value, the determination unit 25 determines that the flow rate is normal, as shown by the solid line in Figure 8. The same applies to vacuum flow rate.

[0087] As shown in Figure 5, if the answer in step S18 is YES, or if the process proceeds through step S20, the determination unit 25 determines whether the mounting operation of the component onto the substrate 3 has been completed by a normal suction nozzle 15 (S21). A normal suction nozzle 15 is a nozzle capable of properly supplying the component to the substrate 3.

[0088] If the determination unit 25 determines that the mounting operation of the components onto the substrate 3 is not complete (NO in S21), it returns to step S16.

[0089] On the other hand, if the determination unit 25 determines that the operation of mounting components onto the substrate 3 is complete (YES in S21), the component mounting device 1 proceeds to step S22.

[0090] Now, let's return to the explanation for step S15.

[0091] If the part recognition camera 11 determines that the recognized part is an abnormal part (not a normal part) (NO in S15), the determination unit 25 determines whether or not the part is being held by the tip 15a of the suction nozzle 15 (S23).

[0092] As shown in Figure 5, if the determination unit 25 determines that no part is being held by the tip 15a of the suction nozzle 15 (NO in S23), the process proceeds to step S31.

[0093] On the other hand, if the determination unit 25 determines that a component is being held in place by the tip 15a of the suction nozzle 15 (YES in S23), it determines whether the operation of attaching the component to the substrate 3 has been completed by a normal suction nozzle 15 (S24).

[0094] If the determination unit 25 determines that the mounting operation of the components onto the substrate 3 is not complete (NO in S24), it returns to step S24.

[0095] On the other hand, if the determination unit 25 determines that the mounting operation of the components onto the substrate 3 is complete (YES in S24), the flow sensor 16 measures the blow flow rate of the suction nozzle 15 (S25).

[0096] The flow sensor 16 outputs the measurement result of the blowdown flow rate to the determination unit 25.

[0097] If the answer in step S24 is YES, and a part is picked up by the suction nozzle 15 during step S25, a processing operation to discard that part into the waste box may be performed.

[0098] Next, the determination unit 25 obtains the blow flow rate measurement result from the flow sensor 16 and determines whether the blow flow rate of the suction nozzle 15 in step S25 is normal or not (S26).

[0099] Here, we will explain, using Figure 9, how to determine whether the blow flow rate of the suction nozzle 15 is normal or not by measuring the blow flow rate of the suction nozzle 15 while a normal suction nozzle 15 is performing the component mounting operation. Figure 9 is a diagram showing the relationship between time and flow rate for vacuum flow rate (Figure 9b) or blow flow rate (Figure 9a). In Figures 9a and 9b, the horizontal axis is time and the vertical axis is flow rate. In principle, the vacuum flow rate is always ON from component suction until the component is moved to the component waste box, but when checking the blow flow rate, the switching valve 18 is operated to turn the vacuum flow rate OFF and temporarily turn the blow flow rate ON.

[0100] As shown in Figures 5 and 9a, the determination unit 25 determines whether the blow flow rate of the suction nozzle 15, indicated by the dashed line in Figure 9a, is equal to or greater than a second predetermined value. If the blow flow rate of the suction nozzle 15, indicated by the dashed line in Figure 9a, is less than the second predetermined value indicated by the dashed line, deformation of the tip 15a of the suction nozzle 15 or the adhesion of foreign matter is possible. For this reason, if the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is less than the second predetermined value, the determination unit 25 determines that the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal (NO in S26). The notification unit 34 then notifies an error indicating that the suction nozzle 15 is abnormal (S27). This allows the operator to recognize that the suction nozzle 15 is abnormal.

[0101] On the other hand, if the blow flow rate of the suction nozzle 15, shown by the solid line in Figure 9a, is equal to or greater than the predetermined value shown by the dashed line, the tip portion 15a of the suction nozzle 15 is considered normal. Therefore, the determination unit 25 determines that the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal if the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than the second predetermined value (YES in S26). Then, the component mounting device 1 proceeds to step S22.

[0102] Now, let's return to the explanation of steps S11 and S13.

[0103] If the determination unit 25 determines that the suction nozzle 15 is not to be used in the current mounting turn (NO in S11), or if the determination unit 25 determines that the flow rate in the suction nozzle 15 is abnormal (not normal) (NO in S13), the part recognition camera 11 recognizes the tip 15a of the suction nozzle 15. Specifically, at the timing when multiple suction nozzles 15 pass above the part recognition camera 11, the part recognition camera 11 recognizes the tip 15a of the suction nozzle 15 that is not being used, or the tip 15a of the suction nozzle 15 whose flow rate is equal to or greater than a first predetermined value (S28).

[0104] Next, the component recognition camera 11 determines whether the tip portion 15a of the recognized suction nozzle 15 is normal or not (S29).

[0105] Here, we will specifically explain how to determine whether the tip portion 15a of the suction nozzle 15 is normal or not, using Figures 10 and 11. Figure 10 is an image of a suction nozzle 15 with a normal tip portion 15a (Figure 10a) and its brightness distribution diagram (Figure 10b). Figure 11 is an image of a suction nozzle 15 with an abnormal tip portion 15a (Figure 11a) and its brightness distribution diagram (Figure 11b).

[0106] As shown in Figure 10a, image A1 shows the tip 15a of the suction nozzle 15. Line A2 is a straight line representing the set of pixels whose brightness is to be measured. Also, as shown in Figure 10b, waveform B1 represents the brightness distribution of pixels on line A2, and is a graph with the horizontal axis representing the relative position of the tip 15a on line A2 in image A1, and the vertical axis representing brightness.

[0107] First, the component recognition camera 11 pre-images the tip 15a of a normal suction nozzle 15 and pre-stores the captured image in the device storage unit 31. The component recognition camera 11 then re-images the tip 15a of the suction nozzle 15 when the suction nozzle 15 passes above the component recognition camera 11. The component recognition camera 11 compares the image of the tip 15a of the suction nozzle 15 (first image) pre-stored in the device storage unit 31 with the image of the tip 15a of the suction nozzle 15 captured again (second image). For example, if the brightness distribution of the first image at line A2 appears as waveform B1, and the brightness distribution of the second image at line A4 appears as waveform B2, the component recognition camera 11 determines that an abnormality has occurred in the tip 15a because the brightness distribution at location C in Figure 11b is different from the brightness distribution at the same location in Figure 10b. Even if the suction nozzle 15 is determined to be free of abnormalities at its tip 15a, variations in position and brightness are expected to occur during repeated imaging. In this case, a predetermined tolerance range may be set for both position and brightness, and only the tip 15a that falls outside this range may be determined to be abnormal.

[0108] Thus, the component recognition camera 11 determines whether the tip portion 15a of the recognized suction nozzle 15 is normal or not, but this is merely one example and is not limited to the determination means described above.

[0109] If the determination unit 25 determines that the tip 15a of the recognized suction nozzle 15 is abnormal (not normal) (NO in S29), the notification unit 34 notifies an error indicating that the tip 15a of the suction nozzle 15 is abnormal (S30). This allows the operator to recognize that the tip 15a of the suction nozzle 15 is abnormal.

[0110] On the other hand, if the determination unit 25 determines that the tip 15a of the recognized suction nozzle 15 is normal (YES in S29), the flow sensor 16 measures the vacuum flow rate of the suction nozzle 15 whose tip 15a was determined to be normal during the component mounting operation using a normal suction nozzle 15 (S31). The flow sensor 16 outputs the vacuum flow rate measurement result to the determination unit 25.

[0111] Next, the determination unit 25 obtains the vacuum flow rate measurement result from the flow sensor 16 and determines whether the vacuum flow rate of the suction nozzle 15 in step S31 is normal or not (S32).

[0112] Here, we will explain, using Figure 9b, how to determine whether the vacuum flow rate of the suction nozzle 15 is normal or not by measuring the vacuum flow rate of the suction nozzle 15 while the suction nozzle 15 is performing a component mounting operation.

[0113] As shown in Figures 5 and 9b, the determination unit 25 determines whether the vacuum flow rate of the suction nozzle 15 is equal to or greater than a first predetermined value. If the vacuum flow rate of the suction nozzle 15, shown by the dashed line in Figure 9b, is less than the predetermined value shown by the dashed line, deformation of the tip 15a of the suction nozzle 15 or the attachment of foreign matter is possible. For this reason, if the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is less than the first predetermined value, the determination unit 25 determines that the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal (NO in S32). The notification unit 34 then notifies an error indicating that the tip 15a of the suction nozzle 15 is abnormal (S33). This allows the operator to recognize that the tip 15a of the suction nozzle 15 is abnormal.

[0114] On the other hand, if the vacuum flow rate of the suction nozzle 15, shown by the solid line in Figure 9b, is equal to or greater than the predetermined value shown by the dashed line, the tip portion 15a of the suction nozzle 15 is considered to be normal. Therefore, the determination unit 25 determines that the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal if the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than the first predetermined value (YES in S32).

[0115] Next, the determination unit 25 determines whether or not the mounting operation of the component onto the substrate 3 has been completed by a normal suction nozzle 15 (S34).

[0116] The determination unit 25 determines that the mounting operation of the components onto the substrate 3 is not yet complete (NO in S34). The component mounting device 1 then returns to step S34.

[0117] On the other hand, if the determination unit 25 determines that the operation of mounting components onto the substrate 3 is complete (YES in S34), the component mounting device 1 proceeds to step S22.

[0118] As described above, if the answer in step S21 is YES, if the answer in step S26 is YES, or if the answer in step S34 is YES, the component mounting device 1 determines whether or not production is complete (S22).

[0119] If the parts mounting device 1 determines that production is not complete (NO in S22), it returns to step S11.

[0120] On the other hand, if the parts mounting device 1 determines that production is complete (YES in S22), it terminates its processing operation.

[0121] <Effects and Effects> Next, the operation and effects of the component mounting device 1 and component mounting method in this embodiment will be described.

[0122] As described above, the component mounting device 1 of this embodiment is a component mounting device 1 for mounting components to a substrate 3, and comprises a first suction nozzle 15b1 for adsorbing components, a second suction nozzle 15b2 for adsorbing components, provided alongside the first suction nozzle 15b1, and a measuring unit (flow sensor 16) for measuring the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2. The measuring unit measures the flow rate of air flowing through the second suction nozzle 15b2, which is not adsorbing components, while the first suction nozzle 15b1 is performing the component mounting operation on the substrate 3.

[0123] For example, in conventional methods, where the tip of the suction nozzle is moved to a predetermined position during production and the flow rate passing through the inside of the suction nozzle is measured, time is required to access the suction nozzle to the predetermined position, and time is also required to measure the flow rate passing through the inside of the suction nozzle separately. This effectively halts production, which may reduce the productivity of the component mounting equipment.

[0124] However, according to this embodiment, the flow sensor 16 can measure the flow rate of air flowing through the second suction nozzle 15b2, which is not holding a component, while the first suction nozzle 15b1 is performing the component attachment operation to the substrate 3. In other words, the flow sensor 16 can measure the flow rate of air flowing through the second suction nozzle 15b2, which is not holding a component, in parallel with the component attachment operation by the first suction nozzle 15b1 to the substrate 3. Therefore, in this embodiment, there is no need to separately measure the flow rate of air flowing through the second suction nozzle 15b2, as in the conventional method.

[0125] Therefore, this component mounting device 1 can suppress the occurrence of time losses in production. As a result, for example, it is not necessary to stop the component mounting device 1 to measure the airflow rate through the second suction nozzle 15b2, nor is it necessary to take additional time to measure the airflow rate through the second suction nozzle 15b2, thus suppressing a decrease in productivity in the component mounting device 1.

[0126] Furthermore, the component mounting method of this embodiment is a component mounting method in which a component is mounted on a substrate 3 using a component mounting device 1, the component mounting device 1 having a first suction nozzle 15b1 for adsorbing a component and a second suction nozzle 15b2 for adsorbing a component, which is provided alongside the first suction nozzle 15b1.The component mounting method measures the flow rate of air flowing through the second suction nozzle 15b2, which is not adsorbing a component, while the first suction nozzle 15b1 is performing the operation of mounting a component to the substrate 3.

[0127] This method of mounting the parts also produces the same effects as described above.

[0128] Furthermore, in the component mounting device 1 of this embodiment, the flow rate is either the vacuum flow rate or the blow-through flow rate.

[0129] According to this, the flow sensor 16 can measure the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2 that has picked up a part, and can also measure the flow rate of air flowing through the first suction nozzle 15b1 or the second suction nozzle 15b2 that has not picked up a part. This makes it possible, for example, to determine whether or not a part has been picked up by the first suction nozzle 15b1 or the second suction nozzle 15b2, and to determine the state of the first suction nozzle 15b1 or the second suction nozzle 15b2.

[0130] Furthermore, the component mounting device 1 of this embodiment further includes a determination unit 25. When the flow rate is a vacuum flow rate, the determination unit 25 determines whether the vacuum flow rate is equal to or greater than a first predetermined value.

[0131] According to this, the state of the first suction nozzle 15b1 or the second suction nozzle 15b2 can be accurately determined by measuring the airflow rate inside the first suction nozzle 15b1 or the second suction nozzle 15b2. For example, if the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than a first predetermined value, the determination unit 25 determines that the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal (the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal). Also, if the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is less than a first predetermined value, the determination unit 25 can determine that the vacuum flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal (the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal).

[0132] Furthermore, in the component mounting device 1 of this embodiment, if the flow rate is the blow-off flow rate, the determination unit 25 determines whether the blow-off flow rate is equal to or greater than a second predetermined value.

[0133] According to this, by measuring the airflow rate inside the first suction nozzle 15b1 or the second suction nozzle 15b2, it is possible to accurately determine whether a part is being adsorbed by the first suction nozzle 15b1 or the second suction nozzle 15b2. For example, if the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is equal to or greater than a second predetermined value, the determination unit 25 determines that the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal (the first suction nozzle 15b1 or the second suction nozzle 15b2 is normal). Also, if the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is less than a second predetermined value, the determination unit 25 determines that the blow flow rate of the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal (the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal).

[0134] Furthermore, the component mounting device 1 of this embodiment is further equipped with a notification unit 34. If it is determined that the vacuum flow rate is less than a first predetermined value, or if it is determined that the blow-off flow rate is less than a second predetermined value, the notification unit 34 will notify the error.

[0135] If the vacuum flow rate is determined to be less than the first predetermined value, or if the blow flow rate is determined to be less than the second predetermined value, it means that the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal. Therefore, since it is possible to notify that the first suction nozzle 15b1 or the second suction nozzle 15b2 is abnormal (defective), the operator of the parts mounting device 1 can recognize that there is an abnormal first suction nozzle 15b1 or second suction nozzle 15b2 in the parts mounting device 1. Therefore, it becomes possible to take immediate action such as replacing the abnormal first suction nozzle 15b1 or second suction nozzle 15b2. Therefore, it is possible to suppress a decrease in the yield of products in the parts mounting device 1.

[0136] Furthermore, in the component mounting device 1 of this embodiment, the measurement unit measures the flow rate of air flowing through the second suction nozzle 15b2 that is not holding a component after the second suction nozzle 15b2 has mounted a component onto the substrate 3.

[0137] According to this, even if the first suction nozzle 15b1 performs the operation of mounting a component to the substrate 3 after the second suction nozzle 15b2 has mounted the component to the substrate 3, the measurement unit can measure the airflow rate through the second suction nozzle 15b2 in parallel with the mounting operation. Therefore, the component mounting device 1 can further suppress the occurrence of time loss in production.

[0138] Furthermore, the component mounting device 1 of this embodiment further includes a recognition unit (component recognition camera 11) that recognizes a component that has been picked up by the first suction nozzle 15b1 or the second suction nozzle 15b2. The determination unit 25 then determines whether or not a component has been picked up by the second suction nozzle 15b2 based on the recognition result of the recognition unit.

[0139] According to this, it is possible to recognize the part being held by the second suction nozzle 15b2. For this reason, for example, it is possible to determine whether or not the part corresponds to the production data, or whether or not a part is being held by the second suction nozzle 15b2.

[0140] Furthermore, in the component mounting device 1 of this embodiment, if the determination unit 25 determines that no component is being adsorbed by the second suction nozzle 15b2, the measurement unit measures the flow rate of air flowing through the second suction nozzle 15b2.

[0141] According to this, it is possible to determine whether the second suction nozzle 15b2 is functioning normally based on the airflow rate through it. Therefore, if there is an abnormality in the second suction nozzle 15b2, it becomes possible to take immediate action such as replacing the abnormal second suction nozzle 15b2. As a result, it is possible to suppress a decrease in the yield of products in the component mounting device 1.

[0142] (Other variations) The component mounting device and component mounting method relating to this disclosure have been described above based on the embodiments described above, but this disclosure is not limited to these embodiments. Various modifications to the embodiments that a person skilled in the art can conceive of may also be included in the scope of this disclosure, as long as they do not depart from the spirit of this disclosure.

[0143] For example, in the component mounting device and component mounting method according to the above embodiment, the determination of whether the component is normal or not by the component recognition camera, the determination of whether the tip of the suction nozzle is normal or not, etc., may be performed by the determination unit. In this case, the component recognition camera may output image data of the component and the tip of the suction nozzle to the determination unit.

[0144] Furthermore, each part included in the component mounting device and component mounting method according to the above embodiment is typically realized as an LSI, which is an integrated circuit. These may be individually integrated into a single chip, or some or all of them may be integrated into a single chip.

[0145] Furthermore, integrated circuit implementation is not limited to LSIs; it may also be achieved using dedicated circuits or general-purpose processors. Field-Programmable Gate Arrays (FPGAs), which can be programmed after LSI manufacturing, or reconfigurable processors, which allow for the reconfiguration of the connections and settings of circuit cells within the LSI, may also be used.

[0146] In each of the above embodiments, each component may be implemented by dedicated hardware or by executing a software program suitable for each component. Each component may also be implemented by a program execution unit such as a CPU or processor reading and executing a software program recorded on a storage medium such as a hard disk or semiconductor memory.

[0147] Furthermore, all figures used above are illustrative to illustrate the present disclosure, and the embodiments of this disclosure are not limited to the figures exemplified.

[0148] Furthermore, the division of functional blocks in the block diagram is just one example; multiple functional blocks can be implemented as a single functional block, a single functional block can be divided into multiple parts, or some functions can be moved to other functional blocks. In addition, the functions of multiple functional blocks with similar functions can be processed in parallel or time-sharing by a single piece of hardware or software.

[0149] Furthermore, the order in which each step in the flowchart is performed is illustrative for the purpose of specifically illustrating this disclosure, and may be in a different order. Also, some of the above steps may be performed simultaneously (in parallel) with other steps.

[0150] Furthermore, this disclosure also includes forms obtained by applying various modifications to each of the above embodiments that a person skilled in the art could conceive, as well as forms realized by arbitrarily combining the components and functions of each embodiment without departing from the spirit of this disclosure. [Industrial applicability]

[0151] The component mounting apparatus and component mounting method of this disclosure are useful in the field of mounting components onto a substrate. [Explanation of Symbols]

[0152] 1. Component mounting device 3 circuit boards 11. Component recognition camera (recognition unit) 15 Suction nozzle 15a Tip 15b1 First suction nozzle (suction nozzle) 15b2 Second suction nozzle (suction nozzle) 16. Flow sensor (measuring unit) 25 Judgment section 34 Hochi Department

Claims

1. A component mounting device that mounts components on a board, a first suction nozzle for suctioning a component; a second suction nozzle arranged next to the first suction nozzle for suctioning a component; a measuring unit that measures a flow rate of air flowing through the first suction nozzle or the second suction nozzle, the measuring unit measures the flow rate of air flowing through the second suction nozzle that is not suctioning a component while the first suction nozzle is performing an operation of placing a component on the board. Component placement device.

2. The flow rate is a vacuum flow rate or a blow flow rate.

2. The component mounting device according to claim 1.

3. Further comprising a determination unit, When the flow rate is the vacuum flow rate, the determination unit determines whether the vacuum flow rate is equal to or greater than a first predetermined value.

3. The component mounting device according to claim 2.

4. When the flow rate is the blow flow rate, the determination unit determines whether the blow flow rate is equal to or greater than a second predetermined value.

4. The component mounting apparatus according to claim 3.

5. Further provided with a notification unit, When it is determined that the vacuum flow rate is less than the first predetermined value, or when it is determined that the blow flow rate is less than the second predetermined value, the notification unit notifies an error.

5. The component mounting apparatus according to claim 4.

6. the measuring unit measures the flow rate of air flowing through the second suction nozzle when the second suction nozzle is not suctioning a component after the second suction nozzle has placed the component on the board.

6. The component mounting apparatus according to claim 5.

7. a recognition unit that recognizes a component picked up by the first suction nozzle or the second suction nozzle, the determination unit determines whether a component is being picked up by the second suction nozzle based on the recognition result of the recognition unit.

7. The component mounting apparatus according to claim 6.

8. When the determination unit determines that a component is not being sucked by the second suction nozzle, the measurement unit measures the flow rate of air flowing through the second suction nozzle.

8. The component mounting apparatus according to claim 7.

9. A component mounting method for mounting components on a board using a component mounting device, comprising: the component mounting device has a first suction nozzle for suctioning a component, and a second suction nozzle for suctioning a component, the second suction nozzle being arranged alongside the first suction nozzle; The component mounting method includes: measuring a flow rate of air flowing through the second suction nozzle that is not suctioning a component while the first suction nozzle is performing an operation of placing a component on the board; How to install parts.

Images