Pedestal including a pedestal plate for a semiconductor fab tool and method for orienting a pedestal plate - Patents.com

Abstract

A method for positioning substrate processing tools on pedestals in a semiconductor fabrication chamber includes supporting multiple pedestal plates on a pedestal frame including a plurality of support posts. The method further includes determining dimensions of the pedestal plates, determining locations of mounting features on the pedestal plates according to components of the substrate processing tools, machining the mounting features in the pedestal plates based on the determined locations, marking at least one alignment feature on at least one of the pedestal plates, and installing the pedestal frames on a subfloor of the semiconductor fabrication chamber. The support posts of the pedestal frames are positioned such that a weight distribution of the pedestal frames on the subfloor differs from a weight distribution of the substrate processing tools.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Provisional Application No. 62 / 984,122, filed March 2, 2020. The entire disclosures of the above-referenced applications are incorporated herein by reference.

[0002] The present disclosure relates to substrate processing systems and, more particularly, to a pedestal for a semiconductor processing tool. [Background technology]

[0003] The background description provided herein is intended to provide a general overview of the contents of the present disclosure. Work by the currently named inventors within the scope of what is described in this Background section, as well as aspects of the description that may not otherwise be regarded as prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure.

[0004] Substrate processing systems can be used to process substrates, such as semiconductor wafers. Exemplary processes that can be performed on the substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), conductor etching, and / or other etching, deposition, or cleaning processes. The substrate can be placed on a substrate support, such as a pedestal, electrostatic chuck (ESC), or the like, in a processing chamber of the substrate processing system. During etching, a gas mixture including one or more precursors can be introduced into the processing chamber, and a plasma can be used to initiate a chemical reaction. Summary of the Invention

[0005] A method for positioning a substrate processing tool on a pedestal in a semiconductor fabrication chamber includes supporting a plurality of pedestal plates on a pedestal frame including a plurality of support posts. The method further includes determining dimensions of the pedestal plates, determining locations of mounting features of the pedestal plates according to components of the substrate processing tools, machining mounting features in the pedestal plates based on the determined locations, marking at least one alignment feature on at least one of the pedestal plates, and installing the pedestal frames on a subfloor of the semiconductor fabrication chamber. The support posts of the pedestal frames are positioned such that a weight distribution of the pedestal frames on the subfloor is different from a weight distribution of the substrate processing tools. The method further includes installing the pedestal plates on the pedestal frames according to the mounting features and the at least one alignment feature in the pedestal plates.

[0006] In other features, the method further includes mounting the substrate processing tool on the pedestal plate. An overall footprint of the pedestal is greater than an overall footprint of the substrate processing tool. The mounting features include at least one of an access hole for a component of the substrate processing tool and a mounting location for the pedestal plate. The at least one alignment feature includes an axis of the pedestal plate.

[0007] In other features, the method further includes generating a mounting template indicating locations of the mounting features and machining the mounting features in the pedestal plate using the mounting template. The mounting template is a transparent sheet indicating locations of the mounting features. Mounting the pedestal plates includes mounting at least one of the pedestal plates with the at least one alignment feature and mounting the remaining pedestal plates based on the at least one alignment feature. The method further includes orienting the at least one pedestal plate to the at least one alignment feature using an overhead transport system. The method further includes mounting a plurality of substrate processing tools on the pedestal plate.

[0008] A pedestal for supporting a substrate processing tool above a subfloor of a semiconductor fabrication chamber includes a pedestal frame including a plurality of support posts and a plurality of pedestal plates supported on the pedestal frame, wherein an overall footprint of the plurality of pedestal plates is greater than an overall footprint of the substrate processing tool, each of the pedestal plates includes a mounting feature that is positioned according to components of the substrate processing tool, at least one of the pedestal plates includes at least one alignment feature, and the support posts are positioned such that a weight distribution of the pedestal frame on the subfloor is different than a weight distribution of the substrate processing tool.

[0009] In other features, the system includes a pedestal and further includes a substrate processing tool supported on the pedestal. The system further includes a plurality of substrate processing tools supported on the pedestal. The mounting feature includes at least one of an access hole for a component of the substrate processing tool and a mounting location for the pedestal plate. The at least one alignment feature includes an axis of the pedestal plate.

[0010] Other areas of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. [Brief description of the drawings]

[0011] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0012] [Figure 1] FIG. 1 is a perspective view of portions of two tools including an exemplary slide and pivot assembly.

[0013] [Diagram 2] FIG. 2 is a top view of a portion of one of the tools of FIG.

[0014] [Diagram 3] FIG. 3 is a side view of a portion of one of the tools of FIG.

[0015] [Figure 4A] FIG. 4A is a top view of an example of a substrate processing station including a slide and pivot assembly.

[0016] [Figure 4B] FIG. 4B is a simplified cross-sectional view of an example substrate support.

[0017] [Diagram 5] FIG. 5 is a partial cross-sectional side view of a pedestal supporting a substrate processing tool on a pedestal frame according to the present disclosure.

[0018] [Figure 6] FIG. 6 is a plan view showing an access hole pattern and / or mounting pattern of an equipment service area for a substrate processing tool.

[0019] [Figure 7] FIG. 7 is a plan view illustrating multiple pedestal plates supporting a substrate processing tool according to the present disclosure.

[0020] [Figure 8] FIG. 8 is a plan view of adjacent transparent sheets having overlapping portions and registration holes and / or other indicia in accordance with the present disclosure.

[0021] [Figure 9] FIG. 9 is a flow chart of an example of a method for aligning a substrate processing tool in a fab room according to the present disclosure.

[0022] In the drawings, reference numbers may be reused to refer to similar and / or identical elements. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] A semiconductor fabrication (fab) room may include multiple tools, each including multiple substrate processing stations (hereafter referred to as "stations"). Each of the stations may be configured to perform a conductor etch process, a dielectric etch process, or other substrate processing. Due to limited space within the fab room, there is a limited amount of space available to access each of the tools to perform service and / or maintenance on the stations. The tool stations may be arranged in a star pattern or a linear pattern.

[0024] In a star pattern, the stations are arranged around a centrally located substrate transfer module that contains a robot that moves substrates from the load lock chamber to each of the substrate processing stations and back to the load lock. This arrangement of the stations provides some access space between the stations for maintenance and / or service, but the density of the stations is less than that of stations arranged in a linear pattern.

[0025] In a linear pattern, the stations are arranged side by side to form two rows of stations. The rows are located on opposite sides of a substrate transfer module that can operate at atmospheric or vacuum. The linear arrangement allows more stations to be placed within a dedicated footprint, but the linear arrangement limits access to the sides of the stations.

[0026] The stations are designed so that each station fits within the footprint (and vertical columns above the footprint), allowing for tight packaging and a reduction in the overall tool footprint. However, this means that the stations and tools have a high weight per unit area compared to conventional tools. In other words, the components of each station are very densely packed and the weight distributed across the reduced footprint is relatively large. As a result, the removable tiles typically used as fab room floors above the subfloor are structurally insufficient to handle the load.

[0027] The present disclosure relates to a pedestal including a pedestal plate supported by a subfloor frame. A fab tool sits on the pedestal plate. The pedestal plate is machined to include access holes to provide connections to stations from below. The pedestal plate is also machined to include mounting holes to connect to components of the station or tool. The pedestal plate is also marked with alignment features such as a first axis and a second axis that are used to align the tool on the pedestal plate. An overhead transport (OHT) of the fab room is used to align one or more of the plates relative to the fab room. In some examples, a transparent film or sheet with cutouts and / or markings corresponding to the access holes, mounting holes, and / or other features of the pedestal plate is used to align one or more of the pedestal plates. In other examples, a visual template (light or laser template) including cutouts and / or markings can be projected onto one or more of the pedestal plates.

[0028] 1 and 2 show a portion of two tools 100, 102 (one solid line at 100 and the other dashed line at 102) arranged side by side in a fab room. Each of the tools includes two rows of stations (one row is shown for each of the tools). The stations are located adjacent to a substrate transfer module (not shown in FIG. 1 for clarity). The space between the tools 100, 102 is limited. As an example, the width W of the passage between the tools 100, 102 may be 1030 mm. This provides a minimum amount of space between the tools 100, 102 to open the processing chambers of the stations and to gain access to the interior of the processing modules and the corresponding processing chambers.

[0029] The examples described herein include a slide and pivot assembly that can be pulled out and pivoted away from a corresponding processing chamber, allowing service or maintenance to be performed at the passageway. The slide and pivot assembly is configured to repeatedly move from a fully docked state to a fully undocked state and back to the same fully docked location. As an example, the slide and pivot assembly is configured to return the process module bias assembly to a location within ±25 micrometers (μm, referred to as microns) of the fully docked state. The slide and pivot assembly is configured to handle and compensate for the heavy load of the process module bias assembly. An exemplary total weight of the process module bias assembly and corresponding slide and pivot assembly is about 300 kilograms (kg).

[0030] The tools 100, 102 include a Front Opening Unified Pod (FOUP) interface 104, a Front End Equipment Module (EFEM) and load lock 106, a station having a radio frequency generator 107 and a gas box 108, and a power lockout and tagout panel 110. The station further includes a process module bias assembly 112, which includes respective slide and pivot assemblies (shown in FIG. 4).

[0031] Each of the stations, either alone or in combination, may be referred to as a substrate processing system. Each of the stations may be used, for example, to etch a substrate using a radio frequency (RF) plasma. Each station includes a processing chamber, such as an inductively coupled plasma (ICP) chamber or a conductively coupled plasma (CCP) chamber. The stations may perform, for example, a conductive etch or dielectric etch process or other substrate processing.

[0032] 2 shows a plan view of the tool 100. The tool 100 includes a FOUP interface 104, an EFEM and load lock 106, a station 109, and a power lockout and tagout panel 110. The tool has an overall footprint 220. The tool further includes a substrate transfer module 222 for transferring substrates to and from the station 109. The substrate transfer module 222 can include robots 224, 226 and a buffer 228 for temporary storage of substrates. The robots 224, 226 transfer substrates to and from the station 109 and the buffer 228. In some examples, the substrate transfer module 222 operates in vacuum or atmosphere.

[0033] 3 shows a side view of the tool 100. The tool 100 includes a FOUP interface 104, an EFEM and load lock 106, a station 109, and a power lockout and tagout system 110. The station includes an RF generator and gas box (collectively designated 300) and a process module bias assembly having a slide and pivot assembly 112. The RF generator can provide RF power to an electrode on the station's substrate support. The gas box supplies gas to the station's processing chamber. A substrate transfer module 222 is also shown.

[0034] Substrates to be loaded and processed are stored in the FOUP interface 104. The substrates are transferred by robots 224, 226 from the FOUP interface 104 through the EFEM and load locks 106 to the stations 109 via their respective load ports 302. In some examples, an RF generator and gas box 300 is located above the station 109 to provide RF power and process gases for processing modules in the station 109.

[0035] 4A shows a substrate processing station 400 that includes a slide and pivot assembly 402. The slide and pivot assembly 402 allows a process module bias assembly 406 to slide and pivot relative to the remaining components of a processing chamber 404. The slide and pivot assembly 402 allows the process module bias assembly 406 to be pulled out of the processing chamber 404 and pivoted to a predetermined angle (e.g., 115 degrees) relative to the front of the processing chamber 404. The process module bias assembly 406 includes a housing 408 and a portion 410 of a process module that includes a process bias bowl 412. In addition to the process bias bowl 412, the process module may include an electrostatic chuck and / or other substrate support and a top plate assembly as shown in FIG. 4B.

[0036] An exemplary width W of the passage between station 400 and the opposite station is shown to illustrate that the process module bias assembly 406 can slide and pivot within the passage. This provides an open space 414 to the right of the slide and pivot assembly 402 for a technician to access the interior of the process bias bowl 412 and processing chamber 404 for service and maintenance purposes, including wet cleaning. The interior of the process bias bowl 412 and processing chamber 404 are accessed from the right side of the process module bias assembly 406 without obstruction. For example, no slides, rails, and / or other components are located in the open space 414, so that the technician does not obstruct access to the interior of the processing chamber. Although the process module bias assembly 406 is shown to pivot to the left, the slide and pivot assembly may be configured to pivot to the right relative to the processing chamber with the process module and bias assembly extended and mounted to the right side of the processing chamber.

[0037] 4B shows a substrate support 460 that includes a heating layer 470 that includes an electrostatic electrode 472 and / or an RF bias electrode 474. The heating layer 470 may be made of ceramic or other materials and is attached to a base plate 482 by an adhesive layer. The base plate 482 is typically made of aluminum and includes coolant channels 480 and fluid passages 484 and 486 for supplying coolant to and receiving coolant from the base plate 482. The coolant helps to control the temperature of the substrate support and the substrate during processing.

[0038] 5 shows one or more substrate processing tools 510 disposed on one or more pedestals 520 including a plurality of pedestal plates 522. The plurality of pedestal plates 522 are supported by a pedestal frame 524 including a plurality of support columns 526. The pedestal frame 524 is supported by a subfloor 528. In some examples, the one or more substrate processing tools 510 include stations arranged in rows and columns as described above in FIGS. 1-4B. Walkways 530 are located between the one or more substrate processing tools 510.

[0039] A weight-bearing point (e.g., weight-bearing leg, not shown) of each of the tools 510 may typically be positioned toward the sub-floor 528. For example, the sub-floor 528 may be comprised of a number of removable tiles supported on a sub-floor frame, each of which may be configured to support a particular load. As the footprint (area) of each of the tools 510 is reduced, the corresponding weight per unit area increases, and the weight distributed across the reduced footprint becomes relatively larger. Thus, the individual tiles of the sub-floor 528 may not be able to directly support the weight-bearing points of the tools 510.

[0040] The pedestals 520 and columns 526 redistribute the weight of each of the tools 510. In other words, the weight distribution of the pedestals 520 and columns 526 across the sub-floor 528 is different than the weight distribution of the tools 510 themselves. For example, the pedestals 520 redistribute the individual weights of the tools 510 across a larger area of ​​the sub-floor 528 and / or across more tiles of the sub-floor 528. In other words, the overall footprint of the portion of the pedestals 520 below each of the tools 510 is larger than the overall footprint of the tools 510. In some examples, the columns 526 are positioned such that the weight-bearing points of the pedestals 520 are aligned with the sub-floor frame (i.e., the load-bearing components of the sub-floor frame that support the sub-floor 528). In this manner, the support columns 526 are positioned such that the total weight supported by each unit area (e.g., each tile) of the sub-floor 528 beneath the tool 510 is less than the weight associated with a corresponding weight-support point on the tool 510 located directly above the same unit area of ​​the sub-floor 528.

[0041] As can be appreciated, additional equipment that supports the substrate processing tool is located below the substrate processing tool. For example, fluid chillers for heating and / or cooling, gas supply lines, power lines, seismic support frames, and / or other components may need to be connected to the stations of the substrate processing tool through the pedestal 520 and / or the subfloor 528. Access and mounting holes formed on the pedestal plate 522 need to be precisely aligned to allow connections from the stations to the equipment components located below the pedestal plate. Additionally, weight-bearing legs that support the frames of the stations, EFEMs, substrate transfer modules, and other components need to avoid the access and / or mounting holes. Because the substrate processing tool is quite large, small variations in lateral or angular alignment can cause significant misalignment issues.

[0042] An overhead transport (OHT) system 580 in the fab room includes a substrate handling device 590 that can be used to deliver substrates to a substrate processing tool. In some examples, groups of substrates are delivered by the OHT system 580 to the FOUP described above. In some examples, the OHT system 580 includes one or more support frames 582 and a motor and / or drive system (or conveyor) 584 that moves the substrate handling device 590 along the support frames in the first, second, and third directions. A controller 594 generates coordinates for the substrate handling device 590 during operation. In some examples, the coordinates from the OHT system 580 are used to align one or more of the pedestal plates 522. In some examples, the OHT system 580 includes position encoders and / or other sensors to determine the coordinates. In other examples, the position encoders and / or other sensors are omitted and the coordinates are determined in another manner. Although an OHT is shown, a floor-mounted conveyor system can also be used.

[0043] 6 illustrates an equipment service area 600 in which a substrate processing tool is located. Example access hole patterns, mounting locations, and / or weight-bearing frame leg locations are shown for an exemplary tool that includes an EFEM and load lock (generally located at 610), one or more processing stations (generally located at 612), an electrical service panel such as a lockout tagout panel (generally located at 614), and a substrate transfer module (generally located at 618).

[0044] For example, access holes for utility connections are shown at 620. Access holes for forelines, gas lines, electrical lines, and / or fluid lines are generally shown at 624. Locations for weight bearing frame legs are shown at 628. As can be appreciated, the patterns are merely examples and other patterns can be used.

[0045] When the substrate processing tool is assembled, the access holes, mounting locations, etc. on the pedestal plate must be aligned with the components located below the substrate processing tool and the pedestal. Additionally, the substrate processing tool must be positioned relative to the fab room in which it is located.

[0046] 7 illustrates a pedestal 700 including a plurality of pedestal plates 710-1, 710-2, ..., 710-P (collectively pedestal plates 710), where P is an integer greater than 1. As can be seen, a plurality of pedestal holes and mounting patterns 720-1, 720-2, ..., 720-P (collectively pedestal access holes and mounting patterns 720) define access holes, mounting locations, etc., for each of the plurality of pedestal plates 710-1, 710-2, ..., 710-P, respectively. The pedestal access holes and mounting patterns 720 may be projected onto the plurality of pedestal plates 710-1, 710-2, ..., 710-P, respectively, by cutting access holes and / or performing other suitable machining and / or marking.

[0047] In addition to defining the pedestal access holes and mounting pattern 720 for the plurality of pedestal plates 710-1, 710-2, ..., 710-P, a first axis 730 and a second axis 734 are machined, knurled, or otherwise applied to the plurality of pedestal plates 710-1, 710-2, ..., 710-P. In some examples, the first axis 730 and the second axis 734 bisect at a right angle on at least one of the pedestal plates 522 and define an origin. In some examples, at least one of the first axis 730 and the second axis 734 extends across all of the plurality of pedestal plates 710-1, 710-2, ..., 710-P, allowing alignment on one of the axes (such as the second axis 734 in FIG. 7). For example, in FIG. 7, the second axis 734 spans all of the pedestal plates 710.

[0048] In some examples, the first axis 730 (located only on pedestal plate 710-1 in this example) can be aligned using an OHT system typically used to deliver substrates to a substrate processing tool. The remaining pedestal plates 710-2, ..., 710-P can then be placed side-by-side with respect to pedestal plate 710-1. The second axis 734 can be used to align multiple pedestal plates 710-1, ..., 710-P.

[0049] In some examples, the multiple pedestal plates further include mounting holes and / or other indicia (such as an origin mark) located at 770 to allow a laser to be quickly located and oriented at a predetermined location and to allow further alignment of the multiple pedestal plates 710. For example, the access holes and / or other indicia at 770 can be used to directly connect and / or align a laser to the pedestal plate 710-P and / or precisely position a location pin. The laser generates a laser line that can be used to determine an orientation of the pedestal plate 710-P relative to the pedestal plate 710-1 (including the first axis 730). Each of the pedestal plates can include one or more mounting holes and / or other indicia 770.

[0050] 8 illustrates a transparent film or sheet 800 that can be used to further align the base plate 710. For example, the transparent sheet 800 includes a first transparent sheet 820-1, which optionally includes access holes, attachment locations, alignment holes, and / or other indicia (generally identified in simplified form at 806 and further described with additional detail in FIG. 7). In addition, the first transparent sheet 820-1 further includes alignment holes and / or other indicia 826 located in an overlapping portion 821 of the first transparent sheet 820-1.

[0051] In some examples, alignment holes and / or indicia 826 are located at corners of first transparent sheet 820-1 in overlapping portion 821. Similarly, second transparent sheet 820-2 includes access holes and / or indicia 836. In some examples, access holes and / or indicia 836 are also located at corners of second transparent sheet 820-2 in overlapping portion 837.

[0052] After initially positioning at least one of the plurality of base plates 710 using the first axis 730 and the OHT system, the transparent sheet 800 can be used to further align the remaining base plates relative to one another along the second axis 734. The transparent sheet 800 is superimposed on the corresponding base plate 710. When the plurality of base plates are properly aligned, the alignment holes and / or indicia on each of the transparent sheets should also align. If the alignment holes and / or indicia are not aligned, the base plates can be moved until they are aligned. The transparent sheet 800 helps align the base plates 710-2 through 710-P to the base plate 710-1.

[0053] In some examples, the multiple base plates further include access holes and / or indicia at 770 to further enable the laser to be quickly positioned at a predetermined location, orientation, and / or origin, and to allow further relative alignment of the multiple base plates 710.

[0054] 9 illustrates one example of a method 900 for positioning one or more substrate processing tools within a semiconductor fab room. At 910, the arrangement of processing stations and / or support components of the semiconductor processing tools is designed. As part of this process, the number, orientation, and / or size of pedestal plates 710 underlying each of the substrate processing tools is determined. In some examples, the pedestal plates have the same dimensions in one or more directions, although different dimensions can be used.

[0055] At 914, locations of mounting features, such as access holes, mounting locations, etc., are determined for each of the components of the substrate processing tool. The mounting features correspond to connections between the components of the substrate processing tool and components located under the pedestal, under the subfloor, etc. The locations of the access holes, mounting locations, etc. are projected onto each of the pedestal plates 710. At 918, the access hole patterns and / or mounting locations are machined into each of the pedestal plates. At 920, the pedestal plates 710 are marked with a first axis and a second axis. In some examples, one or both of the first axis and the second axis are marked on some or all of the multiple pedestal plates 710. For example, all of the plates in FIG. 7 are marked with the second axis 734 and only one of the plates is marked with the first axis 730. The second axis 734 bisects the first axis 730 at a right angle.

[0056] At 922, a mounting template, such as a transparent film or sheet, is optionally created with an access hole pattern, alignment patterns, etc. printed and / or cut into the mounting template. In some examples, some of the alignment patterns are created in the overlapping portions of the mounting template. In some examples, the mounting template is a visual template that is generated and projected onto one or more of the pedestal plates. For example, a projection device may be positioned at a predetermined calibrated location in the fab room and configured to project light (e.g., visible laser light) onto the pedestal plates in the shape of the mounting template.

[0057] At 930, the pedestal plates are installed on the subfloor frame at their respective locations. At 934, at least one of the first axis or the second axis is aligned to the fab room using an OHT system. For example, the OHT system can be used to move along a predetermined line and / or define a point corresponding to the first axis and / or the second axis. In some examples, the OHT system is used to position and orient a laser that projects onto one or more of the pedestal plates. The pedestal plates are aligned using a laser beam. Once one of the first axis or the second axis is correctly oriented, the remaining pedestal plates can be installed and oriented relative to the established axis. In some examples, a transparent sheet can be used to align one pedestal plate with respect to an adjacent pedestal plate. Additionally, the laser can be positioned using predetermined access holes and / or indicia to generate additional orientation information that allows for alignment of the pedestal plates.

[0058] In some instances, errors may occur in placing the base plates. In other words, there is a shift between the plates along the first axis 730 (e.g., in the x-direction). A laser level is directed across the base plates from the EFEM end of the system. The laser light is calibrated using OHT lines and projected at 90 degrees across locating pins at various heights placed in mounting holes at various locations on the base plates.

[0059] In some instances, errors may occur when machining the base plate, and the transparency sheets described above may be overlaid onto the corresponding base plate, and the alignment holes, mounting holes, access holes, and / or other indicia may be used to determine whether the machining of the base plate was performed correctly.

[0060] In some instances, errors may occur in positioning the EFEM along the second axis 734 (y-direction). The station may be first aligned using the OHT system and a laser level. The EFEM may then be aligned using the station.

[0061] In some examples, errors may occur in positioning the EFEM along the first axis 730 (x-direction). In some examples, the EFEM includes a center mark. A laser level is located on the end of the tool opposite the EFEM. The laser level can be located by one of the mounting holes and / or aligned using other indicia. A laser appears on the EFEM and the relative location of the EFEM can be determined.

[0062] The foregoing description is merely exemplary in nature and is not intended to limit the disclosure, its application, or uses in any way. The broad teachings of the disclosure can be embodied in various forms. Thus, while the disclosure includes specific examples, the true scope of the disclosure should not be limited to such examples, since other modifications will become apparent upon review of the drawings, the specification, and the following claims. It should be understood that one or more steps in a method may be performed in different orders (or simultaneously) without altering the principles of the disclosure. Furthermore, although each embodiment is described above as having certain features, any one or more of these features described with respect to any embodiment of the disclosure can be implemented in other embodiments and / or combined with any features of the other embodiments (even if such combination is not explicitly described). In other words, the described embodiments are not mutually exclusive, and it is within the scope of the disclosure to substitute one or more embodiments for one another.

[0063] Spatial and functional relationships between elements (e.g., modules, circuit elements, semiconductor layers, etc.) are described using various terms such as "connected," "engaged," "coupled," "adjacent," "next to," "on," "above," "below," and "disposed." Also, when a relationship between a first element and a second element is described in the above disclosure, unless expressly described as "direct," the relationship may be a direct relationship in which there are no other intervening elements between the first element and the second element, but may also be an indirect relationship in which there are one or more intervening elements (spatial or functional) between the first element and the second element. As used herein, the phrase at least one of A, B, and C should be interpreted in the sense of a logic (A or B or C) using a non-exclusive logical OR, and not in the sense of "at least one of A, at least one of B, and at least one of C."

Claims

1. 1. A method for positioning a substrate processing tool on a pedestal in a semiconductor fabrication chamber, the pedestal including a plurality of pedestal plates supported by a pedestal frame including a plurality of support posts, the method comprising: determining dimensions of the base plate; determining locations of mounting features of the base plate according to components of the substrate processing tool; machining the mounting feature in the base plate based on the determined location; marking at least one alignment feature on at least one of said base plates; placing the pedestal frame on a subfloor of the semiconductor fabrication chamber, the supports of the pedestal frame being positioned such that a weight distribution of the pedestal frame on the subfloor is different than a weight distribution of the substrate processing tool; using an overhead transportation system to orient the at least one base plate using the at least one alignment feature; installing the base plate on the base frame according to the installation feature and the at least one alignment feature in the base plate; A method comprising:

2. 2. The method of claim 1 , The method further comprising mounting the substrate processing tool on the pedestal plate.

3. 2. The method of claim 1 , A method, wherein an overall footprint of the pedestal is greater than an overall footprint of the substrate processing tool.

4. 2. The method of claim 1 , The method, wherein the mounting features include at least one of an access hole for the component of the substrate processing tool and a mounting location for the base plate.

5. 2. The method of claim 1 , The at least one alignment feature comprises an axis of the base plate.

6. 2. The method of claim 1 , The method further comprising generating a mounting template indicating the locations of the mounting features and machining the mounting features in the base plate using the mounting template.

7. 7. The method of claim 6, The method, wherein the installation template is a transparency indicating the locations of the installation features.

8. 7. The method of claim 6, A method, wherein the installation template is a visual template that is generated and projected onto the base plate indicating the locations of the installation features.

9. 2. The method of claim 1 , The method, wherein installing the base plates includes (i) installing the at least one of the base plates using the at least one alignment feature, and (ii) installing the remaining base plates based on the at least one alignment feature.

10. 2. The method of claim 1 , The method further comprising mounting a plurality of the substrate processing tools on the pedestal plate.

11. 1. A pedestal for supporting a substrate processing tool above a subfloor of a semiconductor fabrication chamber, comprising: A base frame including a plurality of supports; a plurality of pedestal plates supported on the pedestal frame, the plurality of pedestal plates having a total footprint greater than a total footprint of the substrate processing tool; Equipped with each of the base plates includes a mounting feature positioned according to a component of the substrate processing tool; at least one of the base plates includes at least one alignment feature, and the at least one base plate is oriented with the overhead transport system using the at least one alignment feature; the support columns are positioned such that a weight distribution of the pedestal frame on the sub-floor is different from a weight distribution of the substrate processing tool. pedestal.

12. A system comprising the pedestal of claim 11 and further comprising the substrate processing tool supported on the pedestal.

13. 12. The system of claim 11, The system further comprises a plurality of the substrate processing tools supported on the pedestal.

14. 12. The base of claim 11, The mounting features include at least one of an access hole for the component of the substrate processing tool and a mounting location for the base plate.

15. 12. The base of claim 11, The at least one alignment feature includes an axis of the base plate.

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