Photocurable resin composition, optical component, method for manufacturing optical component, light-emitting device, and method for manufacturing light-emitting device

Abstract

To provide a photocurable resin composition that retains its curability and has excellent storageability while containing an ultraviolet absorber.SOLUTION: A photocurable resin composition contains a photopolymerizable compound (A), a photopolymerization initiator (B), an ultraviolet absorber (C), and a sensitizer (D). The photopolymerizable compound (A) contains a monofunctional photopolymerizable compound (A011). The percentage of the monofunctional photopolymerizable compound (A011) relative to the solid content is 10 mass% or more and 40 mass% or less.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a photocurable resin composition, an optical component, a method for manufacturing an optical component, a light-emitting device, and a method for manufacturing a light-emitting device, and more particularly to a photocurable resin composition containing a photopolymerizable compound and a photopolymerization initiator, an optical component made from the photocurable resin composition, a method for manufacturing an optical component using the photocurable resin composition, a light-emitting device including the optical component, and a method for manufacturing a light-emitting device using the photocurable resin composition. [Background technology]

[0002] In a light-emitting device having a light-emitting element such as an organic EL element as a light source, for example, the organic EL element is disposed on a support substrate, a transparent substrate is disposed so as to face the support substrate, and a transparent sealant is filled between the support substrate and the transparent substrate. The sealant is prepared, for example, by an inkjet method.

[0003] For example, Patent Document 1 discloses a sealant for an organic EL display element containing a polymerizable compound, in which 100 parts by weight of the polymerizable compound contain 30 parts by weight or more of a polymerizable compound having a surface tension of 35 mN / m or more at 25°C, the viscosity of the entire sealant for an organic EL display element at 25°C is 5 mPa s or more and 50 mPa s or less, and the surface tension of the entire sealant for an organic EL display element at 25°C is 35 mN / m or less. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2018 / 131553 Summary of the Invention [Problem to be solved by the invention]

[0005] According to research by the inventors, when a light emitting device is used outdoors, the light source, such as a light emitting element, is more likely to deteriorate than when the light emitting device is used indoors.

[0006] Therefore, the inventor conducted his own research to suppress deterioration of the light source, and attempted to prevent ultraviolet rays from reaching the light source by incorporating an ultraviolet absorbing agent into the optical components of the light emitting device.

[0007] However, the inventors have found that if an ultraviolet absorber is used, when an optical component is to be made from a photocurable material, the ultraviolet absorber absorbs light, making it difficult to cure the photocurable material. In addition, the inventors have found that if a sensitizer is used to increase the curability of the photocurable material, the reaction of the photocurable material progresses during storage, causing an increase in viscosity.

[0008] An object of the present invention is to provide a photocurable resin composition which contains an ultraviolet absorber while being resistant to deterioration in curability and having good storage properties, an optical component made from the photocurable resin composition, a method for manufacturing an optical component using the photocurable resin composition, a light-emitting device including the optical component, and a method for manufacturing a light-emitting device using the photocurable resin composition. [Means for solving the problem]

[0009] A photocurable resin composition according to one embodiment of the present invention contains a photopolymerizable compound (A), a photopolymerization initiator (B), an ultraviolet absorber (C), and a sensitizer (D), wherein the photopolymerizable compound (A) contains a monofunctional photopolymerizable compound (A011), and the percentage of the monofunctional photopolymerizable compound (A011) relative to the solid content is 10 mass % or more and 40 mass % or less.

[0010] An optical component according to one aspect of the present invention includes a cured product of the photocurable resin composition.

[0011] A method for producing an optical component according to one aspect of the present invention includes molding the photocurable resin composition by an inkjet method, and then irradiating the photocurable resin composition with light to cure it.

[0012] A light emitting device according to one aspect of the present invention includes a light source and an optical component that transmits light emitted by the light source, the optical component including a cured product of the photocurable resin composition.

[0013] A method for manufacturing a light-emitting device according to one embodiment of the present invention is a method for manufacturing a light-emitting device comprising a light source and an optical component that transmits light emitted by the light source, and includes manufacturing the optical component by a method for manufacturing the optical component. Effect of the Invention

[0014] According to one aspect of the present invention, there are provided a photocurable resin composition that contains an ultraviolet absorber while being resistant to deterioration in curability and having good storage properties, an optical component made from the photocurable resin composition, a method for manufacturing an optical component using the photocurable resin composition, a light-emitting device including the optical component, and a method for manufacturing a light-emitting device using the photocurable resin composition. [Brief description of the drawings]

[0015] [Figure 1] 1 is a schematic cross-sectional view showing a light-emitting device according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, one embodiment of the present invention will be described.

[0017] The photocurable resin composition according to this embodiment (hereinafter also referred to as composition (X)) contains a photopolymerizable compound (A), a photopolymerization initiator (B), an ultraviolet absorber (C), and a sensitizer (D). The photopolymerizable compound (A) contains a monofunctional photopolymerizable compound (A011). The percentage of the monofunctional photopolymerizable compound (A011) relative to the solid content in the composition (X) is 10% by mass or more and 40% by mass or less.

[0018] According to this embodiment, a cured product can be produced by irradiating the composition (X) with light. Although the composition (X) contains the ultraviolet absorber (C), the composition (X) further contains the sensitizer (D), so that good reactivity is easily maintained when the composition (X) is irradiated with light. In addition, the ultraviolet absorber (C) absorbs ultraviolet light, so that the cured product is less likely to transmit ultraviolet light. In addition, since the photopolymerizable compound (A) contains the monofunctional photopolymerizable compound (A011), even if the polymerization reaction of the monofunctional photopolymerizable compound (A011) progresses to some extent, the viscosity of the composition (X) is not likely to fluctuate significantly, so that the viscosity increase of the composition (X) during storage of the composition (X) can be suppressed, that is, the storage stability of the composition (X) is easily improved. In particular, in this embodiment, since the composition (X) contains the sensitizer (D), the reaction of the photopolymerizable compound (A) may be promoted by the sensitizer (D) during storage of the composition (X), but even in such a case, the viscosity increase of the composition (X) is less likely to occur due to the monofunctional photopolymerizable compound (A011). Since the percentage of the monofunctional photopolymerizable compound (A011) relative to the solid content in the composition (X) is 10 mass % or more, the storage stability of the composition (X) is likely to be improved, and since this percentage is 40 mass % or less, the reactivity of the composition (X) is likely to be ensured.

[0019] As a result, in this embodiment, a composition (X) that contains an ultraviolet absorber but is less likely to decrease in curability and has good storage stability can be obtained.

[0020] In this embodiment, the transmittance of light having a wavelength of 400 nm through a 10 μm thick cured product obtained by curing the composition (X) is preferably 30% or less. In this case, the cured product is particularly poor at transmitting ultraviolet light. This transmittance is more preferably 20% or less, and even more preferably 10% or less. The lower this transmittance, the more preferable, and ideally 0%. This low transmittance can be achieved by selecting the ultraviolet absorber (C) and sensitizer (D).

[0021] In this embodiment, the transmittance of light having a wavelength of 430 nm through a 10 μm-thick cured product of the composition (X) is preferably 70% or more. In this case, the cured product is less likely to inhibit the transmission of visible light. Therefore, when the composition (X) is used to prepare an optical component in a light-emitting device, the light-emitting performance of the light-emitting device is less likely to be impaired by the optical component. This transmittance is preferably 80% or more, and more preferably 90% or more. This transmittance can be achieved by selecting the ultraviolet absorber (C) and the sensitizer (D).

[0022] In this embodiment, it is preferable that the composition (X) is curable when the composition (X) is irradiated with light having a peak wavelength of 395 nm. In particular, in this embodiment, a coating film having a thickness of 10 μm is prepared from the composition (X), and the coating film is irradiated with light having a peak wavelength of 395 nm at an irradiation intensity of 3 W / cm. 2 And the cumulative light output is 0.9 J / cm 2 When irradiated under the above conditions, the reaction rate of the photopolymerizable compound (A) in the composition (X) is preferably 80% or more. In this case, even though the composition (X) contains the ultraviolet absorber (C), the composition (X) can be cured by utilizing ultraviolet light having a wavelength of about 395 nm. Such a characteristic can be realized by selecting the sensitizer (D). It is more preferable that the reaction rate is 90% or more.

[0023] These properties of composition (X) and the cured product can be achieved by the composition (X) described in detail below.

[0024] Composition (X) can be used to manufacture optical components, and can also be used to manufacture light-emitting devices equipped with optical components. The use of composition (X) is not limited to the manufacture of optical components, and composition (X) can be used in a variety of applications that utilize the properties of composition (X).

[0025] The composition (X) is preferably molded by an inkjet method. In this case, it is easy to produce a cured product of the composition (X) and an optical component with high positional accuracy. In addition, when the composition (X) is molded by the inkjet method, foreign matter is less likely to be mixed into the composition (X) and its cured product, compared with the case of molding by a printing method involving contact such as a screen printing method, and therefore the yield in manufacturing the optical component is less likely to deteriorate.

[0026] In this embodiment, the viscosity of composition (X) at 25°C is preferably 30 mPa·s or less. In this case, composition (X) is easy to mold, particularly by the inkjet method. It is more preferable that this viscosity is 20 mPa·s or less, and particularly preferable that this viscosity is 15 mPa·s or less. It is also preferable that this viscosity is 1 mPa·s or more, and even more preferable that this viscosity is 5 mPa·s or more.

[0027] It is also preferable that the viscosity of the composition (X) at 40°C is 30 mPa·s or less. In this case, no matter what the viscosity of the composition (X) is at room temperature, it is possible to lower the viscosity by slightly heating the composition (X). Therefore, the composition (X) can be easily molded by heating, particularly by the inkjet method. In addition, since the viscosity of the composition (X) can be lowered without significantly heating the composition (X), it is possible to prevent the composition of the composition (X) from changing due to the volatilization of the components in the composition (X). It is more preferable that the viscosity is 25 mPa·s or less, even more preferable that the viscosity is 20 mPa·s or less, and particularly preferable that the viscosity is 15 mPa·s or less. It is also preferable that the viscosity is 1 mPa·s or more, and more preferably 5 mPa·s or more.

[0028] Such a low viscosity of composition (X) at 25° C. or 40° C. can be realized by the composition of composition (X) described in detail below. The method and conditions for measuring the viscosity of composition (X) at 25° C. and 40° C. will be described in detail in the Examples section below.

[0029] It is preferable that the outgassing rate generated when the cured product of the composition (X) is heated at 100°C for 30 minutes is 300 ppm or less. In this case, outgassing is unlikely to occur from the cured product. Therefore, for example, it is possible to make it difficult for voids due to outgassing to occur in a light-emitting device equipped with an optical component made of the cured product. Therefore, it is difficult for water and oxygen to reach the light-emitting element through the voids, and the light-emitting element is unlikely to deteriorate due to water and oxygen. It is more preferable that the outgassing rate is 100 ppm or less. The method for measuring the outgassing rate will be described in detail in the examples below.

[0030] It is preferable that the composition (X) does not contain a solvent or the content of the solvent is 1% by mass or less. In this case, outgassing derived from the solvent is unlikely to occur from the composition (X) and the cured product of the composition (X). In addition, a drying process for removing the solvent from the composition (X) and the cured product during the production of the optical component and the light emitting device can be eliminated. A drying process for removing the solvent from at least one of the composition (X) and the cured product may be performed. In this case, at least one of the heating temperature and the heating time in the drying process can be reduced. Therefore, outgassing can be unlikely to occur from the optical component without reducing the production efficiency of the optical component and the light emitting device. Furthermore, when the composition (X) is molded, especially by the inkjet method, the thickness is unlikely to decrease due to the evaporation of the solvent from the composition (X) after molding, and therefore the thickness of the optical component is unlikely to decrease. Therefore, the thickness of the optical component can be secured as large as possible while molding by the inkjet method. The content of the solvent is more preferably 0.5% by mass or less, even more preferably 0.3% by mass or less, and particularly preferably 0.1% by mass or less. It is particularly preferred that the composition (X) does not contain a solvent or contains only an unavoidably mixed solvent.

[0031] The glass transition temperature of the cured product of the composition (X) is preferably 75°C or higher. That is, the composition (X) preferably has a property of curing to become a cured product having a glass transition temperature of 75°C or higher. In this case, the cured product can have good heat resistance. Therefore, for example, when the cured product is subjected to a treatment accompanied by a temperature increase, the cured product is not easily deteriorated. Therefore, for example, when an inorganic material layer (e.g., passivation layer 6) that overlaps an optical component is produced by a deposition method such as a plasma CVD method, the optical component is not easily deteriorated even if the optical component is heated. In addition, by increasing the heat resistance, the optical component can be adapted to an in-vehicle application that has strict requirements for heat resistance. The glass transition temperature of the cured product is more preferably 80°C or higher, even more preferably 90°C or higher, and particularly preferably 100°C or higher. This glass transition temperature of the cured product can be realized by the composition of the composition (X) described in detail below.

[0032] The volatility of 20 mg of composition (X) is preferably 40% or less when heated at 100°C for 30 minutes using a thermogravimetric analyzer. The volatility of composition (X) is defined as the percentage of the weight loss of composition (X) after treatment (the difference between the weight of composition (X) before treatment and the weight of composition (X) after treatment) relative to the weight of composition (X) before treatment. In this case, the low volatility of composition (X) can enhance the storage stability of composition (X). In addition, outgassing is less likely to occur from the cured product of composition (X) and optical components. Therefore, voids due to outgassing are further less likely to occur in the light-emitting device. The volatility of composition (X) can be determined by heating 20 mg of composition (X) at 100°C for 30 minutes using a thermogravimetric analyzer and calculating the weight loss of the weight after treatment relative to the weight before treatment. When 20 mg of composition (X) is heated at 100° C. for 30 minutes using a thermogravimetric analyzer, the volatility is more preferably 30% or less, and even more preferably 20% or less. The lower limit of the volatility of composition (X) is not particularly limited, but may be, for example, 0.1% or more.

[0033] The components contained in the composition (X) will be described in more detail below.

[0034] The photopolymerizable compound (A) and the photopolymerization initiator (B) will be described.

[0035] The photopolymerizable compound (A) is a compound capable of undergoing a polymerization reaction upon irradiation with light. The photopolymerizable compound (A) contains, for example, at least one component selected from the group consisting of a monomer, an oligomer, and a prepolymer.

[0036] As described above, the photopolymerizable compound (A) contains a monofunctional photopolymerizable compound (A011) having only one polymerizable functional group, and the percentage of the monofunctional photopolymerizable compound (A011) relative to the solid content in the composition (X) is 10% by mass or more and 40% by mass or less. If this percentage is 10% by mass or more, the storage stability of the composition (X) is more likely to be improved. If this percentage is 40% by mass or less, the reactivity of the composition (X) is more likely to be ensured. This percentage is more preferably 12% by mass or more, and even more preferably 14% by mass or more. Also, this percentage is more preferably 30% by mass or less, and even more preferably 20% by mass or less.

[0037] The photopolymerizable compound (A) may further contain a multifunctional photopolymerizable compound (A012) having two or more polymerizable functional groups. In this case, the reactivity of the composition (X) is increased when the composition (X) is irradiated with light. Therefore, good reactivity can be achieved when the composition (X) is irradiated with light having a wavelength of about 395 nm, and outgassing from the cured product is suppressed.

[0038] The percentage of the polyfunctional photopolymerizable compound (A012) relative to the solid content in the composition (X) is preferably 50% by mass or more. In this case, the reactivity of the composition (X) is more likely to be ensured, and outgassing is less likely to occur. This percentage is more preferably 60% by mass or more, and even more preferably 70% by mass or more. In addition, this percentage is preferably 90% by mass or less. In this case, there is an advantage that the increase in viscosity of the composition (X) during storage of the composition (X) can be suppressed, that is, the storage stability of the composition (X) can be easily improved. There is also an advantage that cure shrinkage can be sufficiently suppressed. This percentage is more preferably 85% by mass or less, and even more preferably 80% by mass or less.

[0039] The photopolymerizable compound (A) preferably contains a compound (A02) having at least one of a -RO- skeleton and a -RN- skeleton. In this case, the ultraviolet absorber (C) and the sensitizer (D) are less likely to bleed out from the cured product. This is presumably because the affinity between the photopolymerizable compound (A) and the ultraviolet absorber (C) and the sensitizer (D) is increased. In each of the -RO- skeleton and the -RN- skeleton, R is a divalent hydrocarbon group such as an alkylene group having 2 or more carbon atoms. If the carbon number of R is 3 or more, a higher effect is likely to be obtained. In addition, the carbon number of R is, for example, 12 or less. However, the -RO- skeleton and the -RN- skeleton that exist in a three-membered ring and the -RO- skeleton and the -RN- skeleton that exist in a four-membered ring are excluded from each of the -RO- skeleton and the -RN- skeleton.

[0040] The percentage of compound (A02) relative to the solid content in composition (X) is preferably 10% by mass or more and 90% by mass or less. If this percentage is 10% by mass or more, bleeding out is less likely to occur. If this percentage is 90% by mass or less, the storage stability of composition (X) is likely to be improved. If this percentage is 30% by mass or more, it is more preferable, and if it is 50% by mass or more, it is even more preferable. Also, if this percentage is 80% by mass or less, it is even more preferable.

[0041] The compound (A02) can contain at least one compound selected from the group consisting of compounds having at least one of a -RO- skeleton and a -RN- skeleton among the compounds described as specific examples of the compounds contained in the photopolymerizable compound (A) described below.

[0042] The photopolymerizable compound (A) contains, for example, at least one of a radically polymerizable compound (A1) and a cationic polymerizable compound (A2). When the photopolymerizable compound (A) contains a radically polymerizable compound (A1), the photopolymerization initiator (B) preferably contains a photoradical polymerization initiator (B1). When the photopolymerizable compound (A) contains a cationic polymerizable compound (A2), the photopolymerization initiator (B) preferably contains a photocationic polymerization initiator (B2) (cationic curing catalyst).

[0043] The case where the photopolymerizable compound (A) contains a radically polymerizable compound (A1) will be described.

[0044] The radical polymerizable compound (A1) contains at least one of an acrylic compound (Y) and a radical polymerizable compound (Z) other than the acrylic compound (Y). The radical polymerizable compound (A1) preferably contains an acrylic compound (Y). The acrylic compound (Y) is a compound having one or more (meth)acryloyl groups in one molecule.

[0045] The viscosity of the entire acrylic compound (Y) at 25°C is preferably 50 mPa·s or less. In this case, the acrylic compound (Y) can particularly reduce the viscosity of the composition (X). The viscosity of the entire acrylic compound (Y) is more preferably 30 mPa·s or less, and particularly preferably 20 mPa·s or less. The viscosity of the entire acrylic compound (Y) is, for example, 3 mPa·s or more.

[0046] It is also preferable that the viscosity of the entire acrylic compound (Y) at 40°C is 50 mPa·s or less. In this case, the acrylic compound (Y) can particularly reduce the viscosity of the composition (X) when heated. It is more preferable that the viscosity of the entire acrylic compound (Y) is 30 mPa·s or less, and particularly preferable that the viscosity is 20 mPa·s or less. Moreover, the viscosity of the entire acrylic compound (Y) is, for example, 3 mPa·s or more.

[0047] The percentage of the component having a boiling point of 270° C. or more in the acrylic compound (Y) is preferably 80% by mass or more. In this case, the storage stability of the composition (X) is particularly unlikely to be impaired, and outgassing from the cured product is particularly unlikely to occur. It is more preferable that the percentage of the component having a boiling point of 280° C. or more in the acrylic compound (Y) is 80% by mass or more.

[0048] The acrylic compound (Y) preferably contains a component having a viscosity of 20 mPa·s or less at 25° C. In this case, the viscosity of the composition (X) can be reduced.

[0049] The proportion of the component having a viscosity of 20 mPa·s or less at 25°C relative to the total amount of the acrylic compound (Y) is preferably 50% by mass or more and 100% by mass or less. In this case, the viscosity of the composition (X) can be particularly reduced, making the composition (X) particularly easy to apply by the inkjet method. This proportion is more preferably 60% by mass or more, and even more preferably 70% by mass or more. In addition, this proportion is more preferably 95% by mass or less, and even more preferably 90% by mass or less.

[0050] The component having a viscosity of 20 mPa·s or less at 25°C preferably contains a compound having a glass transition temperature of 80°C or more. In this case, the glass transition temperature of the cured product can be increased while lowering the viscosity of composition (X). This component more preferably contains a compound having a glass transition temperature of 90°C or more, and even more preferably contains a compound having a glass transition temperature of 100°C or more. There is no upper limit to the glass transition temperature of the compound contained in this component, but it is, for example, 150°C or less.

[0051] Compounds that the acrylic compound (Y) may contain will be described below.

[0052] The acrylic compound (Y) contains at least one of a monofunctional acrylic compound (Y2) having only one (meth)acryloyl group as a radical polymerizable functional group in one molecule, and a polyfunctional acrylic compound (Y1) having two or more radical polymerizable functional groups including a (meth)acryloyl group in one molecule. The monofunctional acrylic compound (Y2) is included in the above-mentioned monofunctional photopolymerizable compound (A011), and the polyfunctional acrylic compound (Y1) is included in the above-mentioned polyfunctional photopolymerizable compound (A012).

[0053] The polyfunctional acrylic compound (Y1) can increase the glass transition temperature of the cured product, and therefore can increase the heat resistance of the cured product. The proportion of the polyfunctional acrylic compound (Y1) is preferably 50% by mass or more and 100% by mass or less based on the total amount of the acrylic compound (Y).

[0054] Examples of the polyfunctional acrylic compound (Y1) include 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol oligoacrylate, diethylene glycol diacrylate, 1,6-hexanediol oligoacrylate, neopentyl glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, cyclohexane dimethanol diacrylate, tricyclodecane dimethanol diacrylate, bisphenol A polyethoxy diacrylate, bisphenol F polyethoxy diacrylate, pentaerythritol tetraacrylate, propoxylated (2) neopentyl glycol diacrylate, trimethylolpropane triacrylate, tris(2-hydroxyethyl)isocyanurate triacrylate, pentaerythritol triacrylate, ethoxylated (3) trimethylol Propane triacrylate, propoxylated (3) glyceryl triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated (4) pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, 2-(2-ethoxyethoxy)ethyl acrylate, hexanediol diacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, tripropylene glycol triacrylate, bispentaerythritol hexaacrylate, ethylene glycol diacrylate, 1,6-hexanediol diacrylate, ethoxylated 1,6-hexanediol diacrylate, polypropylene glycol diacrylate, 1,4-butanediol diacrylate, 1,9-nonanediol diacrylate, tetraethylene glycol diacrylate, 2-n-butyl-2-ethyl-1,3-Propanediol diacrylate, hydroxypivalic acid neopentyl glycol diacrylate, hydroxypivalic acid trimethylolpropane triacrylate, ethoxylated phosphoric acid triacrylate, ethoxylated tripropylene glycol diacrylate, neopentyl glycol modified trimethylolpropane diacrylate, stearic acid modified pentaerythritol diacrylate, tetramethylolpropane triacrylate, tetramethylolmethane triacrylate, caprolactone modified trimethylolpropane triacrylate, propoxylated glyceryl triacrylate, tetramethylolmethane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, dipentaerythritol diacrylate, The composition contains at least one compound selected from the group consisting of erythritol hexaacrylate, caprolactone-modified dipentaerythritol hexaacrylate, dipentaerythritol hydroxypentaacrylate, neopentyl glycol oligoacrylate, trimethylolpropane oligoacrylate, pentaerythritol oligoacrylate, ethoxylated neopentyl glycol di(meth)acrylate, propoxylated neopentyl glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, and 2-(2-vinyloxyethoxy)ethyl acrylate.

[0055] The acrylic equivalent of the polyfunctional acrylic compound (Y1) is preferably 150 g / eq or less, more preferably 90 g / eq or more and 150 g / eq or less. The weight average molecular weight of the polyfunctional acrylic compound (Y1) is, for example, 100 or more and 1000 or less, more preferably 200 or more and 800 or less.

[0056] The polyfunctional acrylic compound (Y1) preferably contains a compound (Y11) having a structure represented by the following formula (200).

[0057] CH2=CR 1 -COO-(R 3 -O)n-CO-CR2 =CH2…(200) In formula (200), R 1 and R 2 Each of the groups is a hydrogen atom or a methyl group, n is an integer of 1 or more, R 3 is an alkylene group having 1 or more carbon atoms, and when n is 2 or more, multiple R 3 may be the same or different from each other.

[0058] R 3 When the number of carbon atoms in R is 2 or more, the compound (Y11) is included in the above-mentioned compound (A02). 3 is preferably an alkylene group having 3 to 6 carbon atoms.

[0059] Compound (Y11) has the structure shown in formula (200), in particular R 3 Since the carbon number of R is 3 or more, it is difficult to increase the affinity of the cured product with water. 3 The number of carbon atoms in is, for example, 1 or more and 15 or less, preferably 3 or more and 15 or less. In addition, the compound (Y11) can increase the glass transition temperature of the cured product by having the structure shown in formula (200), particularly by having two (meth)acryloyl groups in one molecule, and therefore can increase the heat resistance of the cured product. In addition, n in formula (200) is, for example, an integer of 1 or more and 12 or less.

[0060] The compound (Y11) preferably contains a component having a boiling point of 270° C. or higher. That is, the acrylic compound (Y) preferably contains a component having a structure shown in formula (200) and a boiling point of 270° C. or higher. In this case, the acrylic compound (Y) is unlikely to volatilize from the composition (X) during storage of the composition (X) and when the composition (X) is heated. Therefore, the storage stability of the composition (X) is unlikely to be impaired. In addition, even if the compound (Y11) remains unreacted in the cured product of the composition (X), outgassing due to the compound (Y11) is unlikely to occur from the cured product. Therefore, voids due to outgassing are unlikely to occur in the light-emitting device 1. If there are voids in the light-emitting device 1, moisture may penetrate into the light-emitting element 4 through the voids, but if voids are unlikely to occur, moisture is unlikely to penetrate into the light-emitting element 4. The boiling point is a boiling point under normal pressure obtained by converting the boiling point under reduced pressure, and is determined, for example, by the method described in Science of Petroleum, Vol. II, p. 1281 (1938). It is more preferable that the compound (Y11) contains a component having a boiling point of 280° C. or higher.

[0061] The percentage of the compound (Y11) relative to the acrylic compound (Y) is preferably 50% by mass or more. In this case, the storage stability of the composition (X) is effectively improved, the generation of outgassing from the cured product is effectively reduced, and the affinity of the cured product for water is particularly difficult to increase. The percentage of the compound (Y11) relative to the acrylic compound (Y) is, for example, 100% by mass or less, or 95% by mass or less, preferably 80% by mass or less.

[0062] The viscosity of the compound (Y11) at 25°C is preferably 25 mPa·s or less. In this case, the compound (Y11) can reduce the viscosity of the composition (X). The viscosity of the compound (Y11) at 25°C is more preferably 25 mPa·s or less, even more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. The viscosity of the compound (Y11) at 25°C is, for example, 1 mPa·s or more, preferably 3 mPa·s or more, and even more preferably 5 mPa·s or more.

[0063] The compound (Y11) contains, for example, at least one compound selected from the group consisting of alkylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, and alkylene oxide-modified alkylene glycol di(meth)acrylate.

[0064] Alkylene glycol di(meth)acrylate is a compound of formula (200) where n is 1. In this case, R 3 The number of carbon atoms in R is preferably 4 to 12. 3may be linear or branched. In particular, the alkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate, 1,4-butanediol dimethacrylate, 1,3-butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 1,6-hexanediol dimethacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, and 1,12-dodecanediol dimethacrylate. Examples of alkylene glycol di(meth)acrylate include Sartomer's product number SR213, Osaka Organic Chemical Industry's product number V195, Sartomer's product number SR212, Sartomer's product number SR247, Kyoeisha Chemical's product name Light Acrylate NP-A, Sartomer's product number SR238NS, Osaka Organic Chemical Industry's product number V230, Daicel's product number HDDA, Kyoei Chemical Industry's product number 1,6HX-A, Osaka Organic Chemical Industry's product number V260, Kyoei Chemical Industry's product number 1,9-ND-A, Shin-Nakamura Chemical Industry's product number A-NOD-A, Sartomer's product number CD595, Sartomer's product number It is preferable to contain at least one compound selected from the group consisting of SR214NS, Shin-Nakamura Chemical Co., Ltd. product number BD, Sartomer Co., Ltd. product number SR297, Sartomer Co., Ltd. product number SR248, Kyoeisha Chemical Co., Ltd. product name Light Ester NP, Sartomer Co., Ltd. product number SR239NS, Kyoeisha Chemical Co., Ltd. product name Light Ester 1,6HX, Shin-Nakamura Chemical Co., Ltd. product number HD-N, Kyoeisha Chemical Co., Ltd. product name Light Ester 1,9ND, Shin-Nakamura Chemical Co., Ltd. product number NOD-N, Kyoeisha Chemical Co., Ltd. product name Light Ester 1,10DC, Shin-Nakamura Chemical Co., Ltd. product number DOD-N, and Sartomer Co., Ltd. product number SR262.

[0065] Polyalkylene glycol di(meth)acrylate is, for example, a compound represented by formula (200) in which n is 2 or more. n is, for example, 2 to 10, preferably 2 to 7, more preferably 2 to 6, and even more preferably 2 to 3. R 3 The number of carbon atoms is, for example, 2 to 7, and preferably 2 to 5. The larger the number of carbon atoms, the higher the hydrophobicity of the cured product, and the less moisture permeable the cured product becomes. The polyalkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, hexaethylene glycol dimethacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, tripropylene glycol dimethacrylate, tritetramethylene glycol diacrylate, polyethylene glycol 200 dimethacrylate, and polyethylene glycol 200 diacrylate. In addition, the polyalkylene glycol di(meth)acrylate preferably contains at least one compound selected from the group consisting of Sartomer Corporation product number SR230, Sartomer Corporation product number SR508NS, Daicel Corporation product number DPGDA, Sartomer Corporation product number SR306NS, Daicel Corporation product number TPGDA, Osaka Organic Chemical Industry Co., Ltd. product number V310HP, Shin-Nakamura Chemical Co., Ltd. product number APG200, Kyoeisha Chemical Co., Ltd. product name Light Acrylate PTMGA-250, Sartomer Corporation product number SR231NS, Kyoeisha Chemical Co., Ltd. product name Light Ester 2EG, Sartomer Corporation product number SR205NS, Kyoeisha Chemical Co., Ltd. product name Light Ester 3EG, Sartomer Corporation product number SR210NS, Kyoeisha Chemical Co., Ltd. product name Light Ester 4EG, Mitsubishi Chemical Corporation product name Acrylate HX, and Shin-Nakamura Chemical Co., Ltd. product number 3PG.

[0066] The alkylene oxide modified alkylene glycol di(meth)acrylate includes, for example, propylene oxide modified neopentyl glycol. The alkylene oxide modified alkylene glycol di(meth)acrylate includes, for example, EBECRYL145 manufactured by Daicel Corporation.

[0067] When the acrylic compound (Y) contains a compound (Y11) having a structure represented by formula (200), it is preferable that the compound (Y11) does not contain a compound in which the value of n in formula (200) is 5 or more. (R 3 When -O)n is a polyethylene glycol skeleton, it is particularly preferred that the compound (Y11) does not contain a compound having an n value of more than 5 in formula (200). Even when the compound (Y11) contains a compound having an n value of more than 5 in formula (200), the percentage of the compound having an n value of more than 5 in formula (200) relative to the acrylic compound (Y) is preferably 20 mass% or less. Even when the compound (Y11) contains a compound having an n value of more than 5 in formula (200), it is preferable that the compound (Y11) does not contain a compound having an n value of more than 9, and more preferably does not contain a compound having an n value of more than 7. In these cases, the viscosity increase of the composition (X) is particularly unlikely to occur.

[0068] It is particularly preferred that the polyfunctional acrylic compound (Y1) contains a polyalkylene glycol di(meth)acrylate, which has low viscosity and is not easily volatile, and therefore can contribute to lowering the viscosity of the composition (X), improving the storage stability of the composition (X), and reducing outgassing from the cured product.

[0069] When the polyfunctional acrylic compound (Y1) contains polyalkylene glycol di(meth)acrylate, the ratio of the polyalkylene glycol di(meth)acrylate to the acrylic compound (Y) is preferably 40% by mass or more and 80% by mass or less. When the ratio of the polyalkylene glycol di(meth)acrylate is 40% by mass or more, the viscosity of the composition (X) can be effectively reduced. This ratio is more preferably 42% by mass or more and 75% by mass or less, and even more preferably 45% by mass or more and 70% by mass or less.

[0070] The polyfunctional acrylic compound (Y1) may contain a compound having three or more radical polymerizable functional groups, including a (meth)acryloyl group, in one molecule. In this case, the polyfunctional acrylic compound (Y1) may contain at least one selected from the group consisting of trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, and pentaerythritol tetra(meth)acrylate. In this case, the glass transition temperature of the cured product can be particularly increased, and therefore the heat resistance of the cured product can be particularly increased.

[0071] The polyfunctional acrylic compound (Y1) preferably contains pentaerythritol tetra(meth)acrylate. In this case, the glass transition temperature of the cured product can be particularly increased, and the reactivity of the composition (X) can be improved. When the reactivity of the composition (X) is improved, the composition (X) can be easily cured even in an oxygen-containing environment such as the air atmosphere.

[0072] When the polyfunctional acrylic compound (Y1) contains pentaerythritol tetra(meth)acrylate, the ratio of pentaerythritol tetra(meth)acrylate to the acrylic compound (Y) is preferably 0.5% by mass or more and 10% by mass or less. In this case, the composition (X) can achieve both high reactivity and low viscosity. This ratio is more preferably 1% by mass or more and 9% by mass or less, and even more preferably 2% by mass or more and 8% by mass or less.

[0073] The polyfunctional acrylic compound (Y1) may have at least one of a benzene ring, an alicyclic ring, and a polar group. The polar group is, for example, at least one of an OH group and an NHCO group. In this case, the shrinkage during curing of the composition (X) can be particularly reduced. Furthermore, the adhesion between the cured product and inorganic compounds such as silicon nitride and silicon oxide can also be increased. The polyfunctional acrylic compound (Y1) preferably contains at least one compound selected from the group consisting of tricyclodecane dimethanol diacrylate, bisphenol A polyethoxy diacrylate, bisphenol F polyethoxy diacrylate, trimethylolpropane triacrylate, and pentaerythritol triacrylate. These compounds can particularly reduce the shrinkage during curing of the composition (X). Furthermore, these compounds can also increase the adhesion between the cured product and inorganic compounds such as silicon nitride and silicon oxide.

[0074] If the adhesion between the cured product and the inorganic material is increased, when the optical component is overlaid with a film made of an inorganic material (inorganic film) such as a SiN film, high adhesion is likely to be obtained between the optical component and the inorganic film.

[0075] It is particularly preferred that the polyfunctional acrylic compound (Y1) contains polyalkylene glycol di(meth)acrylate and pentaerythritol tetra(meth)acrylate. In this case, the composition (X) has low viscosity and excellent reactivity. Therefore, the composition (X) can be easily cured even in an oxygen-containing environment such as the air atmosphere.

[0076] The acrylic compound (Y) preferably contains a monofunctional acrylic compound (Y2) having only one (meth)acryloyl group as a radical polymerizable functional group in one molecule. The monofunctional acrylic compound (Y2) can suppress shrinkage of the composition (X) during curing.

[0077] When the acrylic compound (Y) contains a monofunctional acrylic compound (Y2), the amount of the monofunctional acrylic compound (Y2) relative to the total amount of the acrylic compound (Y) is preferably more than 0% by mass and less than 50% by mass. If the amount of the monofunctional acrylic compound (Y2) is more than 0% by mass, the shrinkage during curing of the composition (X) can be suppressed. In addition, if the amount of the monofunctional acrylic compound (Y2) is 50% by mass or less, the amount of the polyfunctional acrylic compound (Y1) can be 50% by mass or more, and the heat resistance of the cured product can be particularly improved. It is more preferable that the amount of the monofunctional acrylic compound (Y2) is 5% by mass or more, more preferably 30% by mass or less, and particularly preferably 20% by mass or less.

[0078] Examples of the monofunctional acrylic compound (Y2) include tetrahydrofurfuryl acrylate, isobornyl acrylate, 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate, 2-methoxyethyl acrylate, methoxytriethylene glycol acrylate, 2-ethoxyethyl acrylate, 3-methoxybutyl acrylate, ethoxyethyl acrylate, butoxyethyl acrylate, ethoxydiethylene glycol acrylate, and methacrylate. Toxidixylethyl acrylate, ethyl diglycol acrylate, cyclic trimethylolpropane formal monoacrylate, imide acrylate, isoamyl acrylate, ethoxylated succinic acid acrylate, trifluoroethyl acrylate, ω-carboxypolycaprolactone monoacrylate, cyclohexyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, stearyl acrylate, diethylene glycol monobutyl ether acrylate, lauryl acrylate, isodecyl acrylate, 3,3,5-trimethylcyclohexanol acrylate, isooctyl acrylate, octyl / decyl acrylate, tridecyl acrylate, caprolactone acrylate, ethoxylated (4) nonylphenol acrylate, methoxypolyethylene glycol (350) monoacrylate, methoxypolyethylene glycol (550) monoacrylate, phenoxyethyl acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl acrylate, methylphenoxyethyl acrylate, 4-t-butylcyclohexyl acrylate, caprolactone modified tetrahydrofurfuryl acrylate, tributary The composition contains at least one compound selected from the group consisting of bromophenyl acrylate, ethoxylated tribromophenyl acrylate, 2-phenoxyethyl acrylate, an ethylene oxide adduct of 2-phenoxyethyl acrylate, a propylene oxide adduct of 2-phenoxyethyl acrylate, acryloylmorpholine, morpholin-4-yl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 1,4-cyclohexanedimethanol monoacrylate, 3-methacryloyloxymethylcyclohexene oxide, and 3-acryloyloxymethylcyclohexene oxide.

[0079] The monofunctional acrylic compound (Y2) may contain at least one compound selected from the group consisting of compounds having an alicyclic structure and compounds having a cyclic ether structure.

[0080] The compound having an alicyclic structure contains at least one compound selected from the group consisting of, for example, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 4-t-butylcyclohexyl acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, acryloylmorpholine, 4-yl morpholinate, isobornyl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 1,4-cyclohexanedimethanol monoacrylate.

[0081] The number of ring members in the cyclic ether structure in the compound having a cyclic ether structure is preferably 3 or more, more preferably 3 to 4. The number of carbon atoms contained in the cyclic ether structure is preferably 2 to 9, more preferably 2 to 6. The compound having a cyclic ether structure contains, for example, at least one compound selected from the group consisting of 3-methacryloyloxymethylcyclohexene oxide and 3-acryloyloxymethylcyclohexene oxide.

[0082] The acrylic compound (Y) may contain a compound having silicon in the molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. The compound having silicon in the molecular skeleton contains at least one compound selected from the group consisting of 3-(trimethoxysilyl)propyl acrylate (e.g., product number KBM5103 manufactured by Shin-Etsu Chemical Co., Ltd.) and (meth)acrylic group-containing alkoxysilane oligomer (e.g., product number KR-513 manufactured by Shin-Etsu Chemical Co., Ltd.).

[0083] The acrylic compound (Y) may contain a compound having phosphorus in the molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. The compound having phosphorus in the molecular skeleton includes, for example, acid phosphoxy (meth)acrylate, such as acid phosphoxy polyoxypropylene glycol monomethacrylate.

[0084] The acrylic compound (Y) may contain a compound having nitrogen in the molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. In addition, the reactivity of the acrylic compound (Y) is easily improved, so that outgassing from the cured product is less likely to occur. In particular, the acrylic compound (Y) preferably contains a compound having an -RN- skeleton as a compound contained in the above-mentioned compound (A02). The compound having nitrogen in the molecular skeleton includes at least one compound selected from the group consisting of compounds having a morpholine skeleton, such as acryloylmorpholine and 4-yl morpholine acrylate, diethylacrylamide, dimethylaminopropylacrylamide, and pentamethylpiperidyl methacrylate.

[0085] It is particularly preferred that the acrylic compound (Y) contains a compound having a morpholine skeleton. In this case, the reactivity of the composition (X) can be further improved, and the curability of the composition (X) can be further enhanced even under an air atmosphere. In addition, since the morpholine skeleton contains a -RO- skeleton and a -RN- skeleton, the compound having a morpholine skeleton is included in the above-mentioned compound (A02). It is particularly preferred that the acrylic compound (Y) contains at least one of acryloylmorpholine and morpholin-4-yl acrylate. In this case, the shrinkage during curing of the composition (X) can be suppressed. In addition, the viscosity of acryloylmorpholine and morpholin-4-yl acrylate is low, and therefore these compounds are unlikely to increase the viscosity of the composition (X). Furthermore, these compounds are unlikely to volatilize, and therefore the storage stability of the composition (X) is easily improved.

[0086] The ratio of the compound having a morpholine skeleton to the acrylic compound (Y) is preferably 5% by mass or more and 50% by mass or less. In this case, there is an advantage that outgassing is less likely to occur from the cured product of the composition (X). This ratio is more preferably 7% by mass or more and 45% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less.

[0087] The acrylic compound (Y) may contain a compound having an isobornyl skeleton. The compound having an isobornyl skeleton may contain, for example, one or more compounds selected from the group consisting of isobornyl acrylate and isobornyl methacrylate.

[0088] The acrylic compound (Y) may contain a component consisting of a compound having at least one skeleton selected from the group consisting of a dicyclopentadiene skeleton, a dicyclopentanyl skeleton, a dicyclopentenyl skeleton, and a bisphenol skeleton. Specifically, the acrylic compound (Y) may contain at least one compound selected from the group consisting of, for example, tricyclodecane dimethanol diacrylate, bisphenol A polyethoxy diacrylate, and bisphenol F polyethoxy diacrylate. In this case, the adhesion between the cured product and the inorganic material can be increased.

[0089] The acrylic compound (Y) may contain a compound represented by the following formula (100). In this case, the reactivity of the composition (X) can be increased, and the adhesion between the cured product and the inorganic material can be improved.

[0090] [ka]

[0091] In formula (100), R 0 is H or a methyl group. X is a single bond or a divalent hydrocarbon group. R 1 From R 11 Each of is H, an alkyl group or -R 12 -OH, R 12 is an alkylene group and R 1 From R 11 At least one of the groups is an alkyl group or -R 12 -OH. 1 From R 11 are not chemically bonded to each other. When X is a divalent hydrocarbon group, this compound has a -RO- skeleton and is therefore included in the above-mentioned compound (A02).

[0092] Specifically, for example, the acrylic compound (Y) may contain at least one compound selected from the group consisting of a compound represented by the following formula (110), a compound represented by the following formula (120), and a compound represented by the following formula (130).

[0093] [ka]

[0094] The radical polymerizable compound (A1) may contain a radical polymerizable compound (Z) other than the acrylic compound (Y). The amount of the radical polymerizable compound (Z) relative to the total amount of the acrylic compound (Y) and the radical polymerizable compound (Z) is, for example, 10 mass% or less. The radical polymerizable compound (Z) may contain at least one of a polyfunctional radical polymerizable compound (Z1) having two or more radical polymerizable functional groups in one molecule and a monofunctional radical polymerizable compound (Z2) having only one radical polymerizable functional group in one molecule. The monofunctional radical polymerizable compound (Z2) is included in the above-mentioned monofunctional photopolymerizable compound (A011), and the polyfunctional radical polymerizable compound (Z1) is included in the above-mentioned polyfunctional photopolymerizable compound (A012).

[0095] The polyfunctional radical polymerizable compound (Z1) may contain at least one compound selected from the group consisting of aromatic urethane oligomers, aliphatic urethane oligomers, epoxy acrylate oligomers, polyester acrylate oligomers, and other special oligomers, each having two or more ethylenic double bonds in one molecule. Note that the components that the polyfunctional radical polymerizable compound (Z1) may contain are not limited to those mentioned above. The monofunctional radical polymerizable compound (Z2) contains at least one compound selected from the group consisting of, for example, N-vinylformamide, vinylcaprolactam, vinylpyrrolidone, phenylglycidyl ether, p-tert-butylphenylglycidyl ether, butylglycidyl ether, 2-ethylhexylglycidyl ether, allylglycidyl ether, 1,2-butylene oxide, 1,3-butadiene monoxide, 1,2-epoxydodecane, epichlorohydrin, 1,2-epoxydecane, styrene oxide, cyclohexene oxide, 3-vinylcyclohexene oxide, 4-vinylcyclohexene oxide, N-vinylpyrrolidone and N-vinylcaprolactam. Note that the components that the monofunctional radical polymerizable compound (Z2) can contain are not limited to the above.

[0096] When the radical polymerizable compound (A1) contains a radical polymerizable compound (Z), the radical polymerizable compound (Z) may contain a compound having nitrogen in its molecular skeleton. The compound having nitrogen in its molecular skeleton includes at least one compound selected from the group consisting of N-vinylformamide, N-vinylpyrrolidone, and N-vinylcaprolactam. In this case, the adhesion between the cured product and the inorganic material is improved, similarly to the case where the acrylic compound (Y) contains a compound having nitrogen in its molecular skeleton.

[0097] In other words, the radical polymerizable compound (A1) preferably contains a compound having nitrogen in the molecular skeleton. The compound having nitrogen in the molecular skeleton may contain a compound contained in the acrylic compound (Y) or may contain a compound contained in the radical polymerizable compound (Z). In this case, the adhesion between the cured product and the inorganic material is improved. The ratio of the compound having nitrogen in the molecular skeleton to the entire radical polymerizable compound (A1) is preferably 5% by mass or more and 80% by mass or less. When this ratio is 5% by mass or more, the adhesion between the cured product and the inorganic material is particularly likely to be improved. When this ratio is 80% by mass or less, the compound having nitrogen in the molecular skeleton is less likely to inhibit the storage stability of the composition (X) and is less likely to generate satellites when the composition (X) is sprayed by the inkjet method. Therefore, the inkjet properties of the composition (X) are less likely to be inhibited. Furthermore, outgassing caused by the compound having nitrogen in the molecular skeleton can be less likely to occur. This ratio is more preferably 10% by mass or more and 70% by mass or less, even more preferably 20% by mass or more and 60% by mass or less, and particularly preferably 25% by mass or more and 50% by mass or less.

[0098] The ratio of the total of the monofunctional radically polymerizable compounds in the radically polymerizable compound (A1) (i.e., the total of the monofunctional acrylic compound (Y2) and the monofunctional radically polymerizable compound (Z2)) to the radically polymerizable compound (A1) is preferably 70% by mass or less. In this case, outgassing caused by the monofunctional compounds is less likely to occur. This ratio is more preferably 60% by mass or less, and even more preferably 50% by mass or less.

[0099] The photoradical polymerization initiator (B1) is not particularly limited as long as it is a compound that generates radical species when irradiated with light. The photoradical polymerization initiator (B1) preferably contains a compound that generates radical species when irradiated with light having a peak wavelength of 395 nm.

[0100] The photoradical polymerization initiator (B1) contains at least one compound selected from the group consisting of, for example, aromatic ketones, acylphosphine oxide compounds, aromatic onium salt compounds, organic peroxides, thio compounds (thioxanthone compounds, thiophenyl group-containing compounds, etc.), hexaarylbiimidazole compounds, oxime ester compounds, borate compounds, azinium compounds, metallocene compounds, active ester compounds, compounds having a carbon-halogen bond, and alkylamine compounds.

[0101] The ratio of the photoradical polymerization initiator (B1) to the radical polymerizable compound (A1) is preferably 6% by mass or more. In this case, the composition (X) can have good photocurability and can also have good photocurability under an atmospheric atmosphere. This ratio is more preferably 7% by mass or more, and even more preferably 8% by mass or more. This ratio is, for example, 30% by mass or less, preferably 20% by mass or less, and even more preferably 18% by mass or less.

[0102] The photoradical polymerization initiator (B1) preferably contains a photoradical polymerization initiator (B1) having photobleachability. In this case, the cured product of the composition (X) is likely to have good light transmittance. The ratio of the photoradical polymerization initiator (B1) to the radically polymerizable compound (A1) is preferably 3% by mass or more. This ratio is more preferably 7% by mass or more, and even more preferably 8% by mass or more. In addition, this ratio is, for example, 30% by mass or less, preferably 25% by mass or less, and even more preferably 20% by mass or less.

[0103] The photoradical polymerization initiator (B1) contains, for example, at least one of an acylphosphine oxide-based photoinitiator and a compound having photobleaching properties among oxime ester-based photoinitiators.

[0104] It is also preferable that the photoradical polymerization initiator (B1) contains a component having a sensitizer skeleton in the molecule. The sensitizer skeleton contains, for example, at least one of a 9H-thioxanthen-9-one skeleton and an anthracene skeleton. That is, it is preferable that the photoradical polymerization initiator (B1) contains a component having at least one of a 9H-thioxanthen-9-one skeleton and an anthracene skeleton.

[0105] The photoradical polymerization initiator (B1) preferably contains an oxime ester photoinitiator, regardless of whether it has photobleachability. The oxime ester photoinitiator can improve the curability of the composition (X). Therefore, the composition (X) can be easily cured even in an oxygen-containing environment such as the air atmosphere, and the cured product can be made less likely to produce outgassing.

[0106] In order to prevent contamination of composition (X) and a production apparatus due to generation of decomposition products from composition (X) and to further prevent generation of outgas from the cured product, the oxime ester photoinitiator preferably contains a compound having an aromatic ring, more preferably contains a compound having a condensed ring containing an aromatic ring, and further preferably contains a compound having a condensed ring containing a benzene ring and a heterocycle.

[0107] The oxime ester photoinitiator may contain at least one compound selected from the group consisting of oxime ester photoinitiators described in, for example, 1,2-octadione-1-[4-(phenylthio)-, 2-(o-benzoyloxime)], and ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(o-acetyloxime), and JP 2000-80068 A, JP 2001-233842 A, JP 2010-527339 A, JP 2010-527338 A, JP 2013-041153 A, and JP 2015-93842 A. The oxime ester photoinitiator may contain at least one compound selected from the group consisting of commercially available products Irgacure OXE-02 (manufactured by BASF), Adeka Arcles NCI-831, N-1919 (manufactured by ADEKA Corporation), and TR-PBG-304 (manufactured by Changzhou Strong Electronic New Materials Co., Ltd.), Irgacure OXE-01, Adeka Arcles NCI-930 (manufactured by ADEKA Corporation), TR-PBG-345, and TR-PBG-3057 (all manufactured by Changzhou Strong Electronic New Materials Co., Ltd.), and TR-PBG-365 (manufactured by Changzhou Strong Electronic New Materials Co., Ltd.) and SPI-04 (manufactured by Sanyang Co., Ltd.) having a fluorene skeleton. In particular, it is preferable that the oxime ester photoinitiator contains a compound having a diphenyl sulfide skeleton or a fluorene skeleton, since the cured product is less likely to be colored by photobleaching. It is also preferable that the oxime ester photoinitiator contains a compound having a carbazole skeleton, since the exposure sensitivity is likely to be increased.

[0108] It is also preferred that the oxime ester photoinitiator contains two or more compounds. In this case, for example, by containing two or more compounds having different exposure sensitivity, the amount of the photoradical polymerization initiator (B1) can be reduced while maintaining good exposure sensitivity, so that outgassing from the cured product can be further suppressed.

[0109] The oxime ester compound having photobleachability contains, for example, at least one of the compound represented by the following formula (401) and the compound represented by the following formula (402). Among these, the compound represented by formula (402) has particularly high sensitivity, and therefore is particularly likely to enhance the photocurability of composition (X), and therefore is likely to realize photocurability of composition (X) in the air.

[0110] [ka]

[0111] [ka]

[0112] When the photoradical polymerization initiator (B1) contains an acylphosphine oxide compound, the reactivity of the composition (X) when irradiated with light is likely to be higher, even if the photoradical polymerization initiator (B1) contains an ultraviolet absorber (C), and the reactivity of the composition (X) when irradiated with light, particularly light having a wavelength of 395 nm, is likely to be higher. The percentage of the acylphosphine oxide compound relative to the total photoradical polymerization initiator (B1) is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass or more. The acylphosphine oxide compound contains at least one selected from the group consisting of, for example, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0113] The composition (X) may contain a polymerization accelerator in addition to the photoradical polymerization initiator (B1). The polymerization accelerator contains, for example, an amine compound such as ethyl p-dimethylaminobenzoate, 2-ethylhexyl p-dimethylaminobenzoate, methyl p-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, or butoxyethyl p-dimethylaminobenzoate. Note that the components that the polymerization accelerator can contain are not limited to those mentioned above.

[0114] The cationic polymerizable compound (A2) will be described. When the photopolymerizable compound (A) contains a cationic polymerizable compound (A2), the cationic polymerizable compound (A2) contains, for example, at least one of a polyfunctional cationic polymerizable compound (W1) and a monofunctional cationic polymerizable compound (W2).

[0115] The polyfunctional cationically polymerizable compound (W1) can contain either one or both of a polyfunctional cationically polymerizable compound (W11) having no siloxane skeleton and a polyfunctional cationically polymerizable compound (W12) having a siloxane skeleton.

[0116] The polyfunctional cationically polymerizable compound (W11) does not have a siloxane skeleton and has two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (W11) is preferably 2 to 4, and more preferably 2 to 3.

[0117] The cationically polymerizable functional group is, for example, at least one group selected from the group consisting of a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group.

[0118] The polyfunctional cationically polymerizable compound (W11) contains at least one compound selected from the group consisting of, for example, polyfunctional alicyclic epoxy compounds, polyfunctional heterocyclic epoxy compounds, polyfunctional oxetane compounds, alkylene glycol diglycidyl ethers, and alkylene glycol monovinyl monoglycidyl ethers.

[0119] The polyfunctional alicyclic epoxy compound contains, for example, either one or both of a compound represented by the following formula (1) and a compound represented by the following formula (20).

[0120] [ka]

[0121] In formula (1), R 1 ~R 18 are each independently a hydrogen atom, a halogen atom, or a hydrocarbon group. The number of carbon atoms in the hydrocarbon group is preferably within the range of 1 to 20. Examples of the hydrocarbon group include alkyl groups having 1 to 20 carbon atoms, such as methyl groups, ethyl groups, and propyl groups; alkenyl groups having 2 to 20 carbon atoms, such as vinyl groups and allyl groups; and alkylidene groups having 2 to 20 carbon atoms, such as ethylidene groups and propylidene groups. The hydrocarbon group may contain an oxygen atom or a halogen atom. 1 ~R 18 Each of the is independently preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, and most preferably a hydrogen atom.

[0122] In formula (1), X is a single bond or a divalent organic group. The organic group is, for example, -CO-O-CH2-, and in this case, the compound represented by formula (1) is included in the above-mentioned compound (A02).

[0123] Examples of the compound represented by formula (1) include a compound represented by the following formula (1a) and a compound represented by the following formula (1b).

[0124] [ka]

[0125] [ka]

[0126] [ka]

[0127] In formula (20), R 1 ~R 12 Each of the groups independently represents a hydrogen atom, a halogen atom, or a group having 1 to 10 carbon atoms. The hydrocarbon group having 1 to 20 carbon atoms is, for example, an alkyl group having 1 to 20 carbon atoms, such as a methyl group, an ethyl group, or a propyl group; an alkenyl group having 2 to 20 carbon atoms, such as a vinyl group or an allyl group; or an alkylidene group having 2 to 20 carbon atoms, such as an ethylidene group or a propylidene group. The hydrocarbon group having 1 to 20 carbon atoms may contain an oxygen atom or a halogen atom.

[0128] R 1 ~R 12 Each of these is preferably independently a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms. It is preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom, and most preferably a hydrogen atom.

[0129] An example of the compound represented by formula (20) includes the tetrahydroindene diepoxide represented by formula (20a) below.

[0130] [ka]

[0131] The polyfunctional heterocyclic epoxy compound contains, for example, a trifunctional epoxy compound as shown in the following formula (2).

[0132] [ka]

[0133] The polyfunctional oxetane compound contains, for example, a bifunctional oxetane compound as shown in the following formula (3).

[0134] [ka]

[0135] The alkylene glycol diglycidyl ether contains at least one compound selected from the group consisting of compounds represented by the following formulas (4) to (7).

[0136] [ka]

[0137] [ka]

[0138] [ka]

[0139] [ka]

[0140] The alkylene glycol monovinyl monoglycidyl ether contains, for example, a compound represented by the following formula (8).

[0141] [ka]

[0142] The compounds represented by each of the above formulas (2) to (8) are included in the above-mentioned compound (A02).

[0143] More specifically, the polyfunctional cationically polymerizable compound (W11) may contain at least one component selected from the group consisting of, for example, CELLOXIDE 2021P and CELLOXIDE 8010 manufactured by Daicel, TEPIC-VL manufactured by Nissan Chemical, OXT-221 manufactured by Toagosei, and 1,3-PD-DEP, 1,4-BG-DEP, 1,6-HD-DEP, NPG-DEP, and butylene glycol monovinyl monoglycidyl ether manufactured by Yokkaichi Chemical.

[0144] It is also preferred that the polyfunctional cationically polymerizable compound (W11) contains a polyfunctional alicyclic epoxy compound, in which case the composition (X) can have particularly high cationic polymerization reactivity.

[0145] The polyfunctional alicyclic epoxy compound preferably contains either one or both of the compound represented by formula (1) and the compound represented by formula (20). In this case, the composition (X) can have higher cationic polymerization reactivity.

[0146] When the polyfunctional alicyclic epoxy compound contains a compound represented by formula (1), the compound represented by formula (1) preferably contains a compound represented by formula (1a). In this case, the composition (X) can have a higher cationic polymerization reactivity and a particularly low viscosity.

[0147] In addition, since the compound represented by formula (20) has a low viscosity, the composition (X) can have good photocurability and a particularly low viscosity when the composition (X) contains the compound represented by formula (20). Furthermore, the compound represented by formula (20) has a low viscosity but is not easily volatilized. Therefore, even if the composition (X) contains the compound represented by formula (20), the composition (X) is not easily changed in composition due to the volatilization of the compound represented by formula (20). Therefore, the composition (X) can have a low viscosity without impairing storage stability by containing the compound represented by formula (20).

[0148] The compound represented by formula (20) can be synthesized, for example, by oxidizing a cyclic olefin compound having a tetrahydroindene skeleton with an oxidizing agent.

[0149] The compound represented by formula (20) may contain four stereoisomers based on the stereoconfiguration of the two epoxy rings. The compound represented by formula (20) may contain any of the four stereoisomers. That is, the compound represented by formula (20) may contain at least one component selected from the group consisting of the four stereoisomers. The percentage of the total amount of the exo-endo isomer and the endo-endo isomer among the four stereoisomers in the compound represented by formula (20) is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total amount of the epoxy compound (A1). In this case, the heat resistance of the cured product can be improved. The percentage of a specific stereoisomer in the compound represented by formula (20) can be determined based on the peak area ratio appearing in a chromatogram obtained by gas chromatography.

[0150] In order to reduce the amount of exo-endo isomer and endo-endo isomer in the compound represented by formula (20), an appropriate method can be applied, such as a method of subjecting the compound represented by formula (20) to precision distillation or a method of applying column chromatography using silica gel or the like as a packing material.

[0151] When the composition (X) contains a polyfunctional cationic polymerizable compound (W11), the percentage of the polyfunctional cationic polymerizable compound (W11) relative to the total amount of the resin components is preferably 5% by mass or more and 95% by mass or less. The resin components refer to compounds having cationic polymerizability in the composition (X), and include the polyfunctional cationic polymerizable compound (W1) and the monofunctional cationic polymerizable compound (W2). If the percentage of the polyfunctional cationic polymerizable compound (W11) is 5% by mass or more, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and the cured product can have high strength (hardness). If the percentage of the polyfunctional cationic polymerizable compound (W11) is 95% by mass or less, when the composition (X) contains a moisture absorbent (E), the moisture absorbent (E) can be particularly easily dispersed uniformly in the composition (X). The percentage of the polyfunctional cationic polymerizable compound (W11) is more preferably 12% by mass or more, even more preferably 15% by mass or more, even more preferably 20% by mass or more, and particularly preferably 25% by mass or more. The percentage of the polyfunctional cationic polymerizable compound (W11) is more preferably 85% by mass or less, even more preferably 60% by mass or less. For example, the percentage of the polyfunctional cationic polymerizable compound (W11) is preferably within the range of 20 to 60% by mass.

[0152] When the polyfunctional cationic polymerizable compound (W11) contains a polyfunctional alicyclic epoxy compound, the polyfunctional alicyclic epoxy compound may be a part or the whole of the polyfunctional cationic polymerizable compound (W11). The percentage of the polyfunctional alicyclic epoxy compound to the polyfunctional cationic polymerizable compound (W11) is preferably 15% by mass or more and 100% by mass or less. When this percentage is 15% by mass or more, the polyfunctional alicyclic epoxy compound can particularly contribute to improving the photocurability of the composition (X).

[0153] The polyfunctional cationic polymerizable compound (W12) has a siloxane skeleton and two or more cationic polymerizable functional groups per molecule. The number of cationic polymerizable functional groups per molecule of the polyfunctional cationic polymerizable compound (W12) is preferably 2 to 6, more preferably 2 to 4. The polyfunctional cationic polymerizable compound (W12) can contribute to improving the cationic polymerization reactivity of the composition (X) and can also contribute to improving the heat discoloration resistance of the cured product and optical components. The polyfunctional cationic polymerizable compound (W12) can also contribute to lowering the elastic modulus of the cured product and optical components. When the composition (X) contains a moisture absorbent, the polyfunctional cationic polymerizable compound (W12) can also contribute to improving the dispersibility of the moisture absorbent in the composition (X) and the cured product.

[0154] The polyfunctional cationically polymerizable compound (W12) is preferably a liquid at 25° C. In particular, the viscosity of the polyfunctional cationically polymerizable compound (W12) at 25° C. is preferably within the range of 10 to 300 mPa s. In this case, an increase in the viscosity of the composition (X) can be suppressed.

[0155] The cationically polymerizable functional group contained in the polyfunctional cationically polymerizable compound (W12) is, for example, at least one group selected from the group consisting of an epoxy group, an oxetane group, and a vinyl ether group.

[0156] The siloxane skeleton of the polyfunctional cationic polymerizable compound (W12) may be linear, branched, or cyclic. The number of Si atoms in the siloxane skeleton is preferably within the range of 2 to 14. In this case, the composition (X) can have a particularly low viscosity. The number of Si atoms is more preferably within the range of 2 to 10, even more preferably within the range of 2 to 7, and particularly preferably within the range of 3 to 6.

[0157] The polyfunctional cationically polymerizable compound (W12) contains, for example, at least one of a compound represented by formula (10) and a compound represented by formula (11).

[0158] [ka]

[0159] [ka]

[0160] In each of formulas (10) and (11), R is a single bond or a divalent organic group, and is preferably an alkylene group. Y is a siloxane skeleton, which may be linear, branched, or cyclic, and the number of Si atoms is within the range of 2 to 14. in It is preferable that n is within the range of 2 to 10, more preferably within the range of 2 to 7, and particularly preferably within the range of 3 to 6. n is an integer of 2 or more, and is preferably within the range of 2 to 4.

[0161] More specifically, for example, the polyfunctional cationically polymerizable compound (W12) contains a compound represented by the following formula (10a).

[0162] [ka]

[0163] R in formula (10a) is a single bond or a divalent organic group, and is preferably an alkylene group having 1 to 4 carbon atoms. n in formula (10a) is an integer of 0 or more. n is preferably within the range of 0 to 12, more preferably within the range of 0 to 8, even more preferably within the range of 0 to 5, and particularly preferably within the range of 1 to 4.

[0164] The compound represented by formula (10a) preferably contains a compound represented by formula (30) described below. That is, the polyfunctional cationically polymerizable compound (W12) preferably contains a compound represented by formula (30) below.

[0165] More specifically, the polyfunctional cationically polymerizable compound (W12) preferably contains at least one component selected from the group consisting of product numbers X-40-2669, X-40-2670, X-40-2715, X-40-2732, X-22-169AS, X-22-169B, X-22-2046, X-22-343, X-22-163, and X-22-163B manufactured by Shin-Etsu Chemical Co., Ltd.

[0166] The polyfunctional cationic polymerizable compound (W12) preferably has an alicyclic epoxy structure, and it is particularly preferred that the polyfunctional cationic polymerizable compound (W12) contains a compound represented by formula (10a). The compound represented by formula (10a) can particularly contribute to improving the cationic polymerization reactivity and lowering the viscosity of the composition (X), and can also particularly contribute to improving the heat discoloration resistance and lowering the elastic modulus of the cured product and optical components. When the composition (X) contains a moisture absorbent (E), it can also particularly contribute to improving the dispersibility of the moisture absorbent (E) in the composition (X).

[0167] When the composition (X) contains a polyfunctional cationic polymerizable compound (W12), the percentage of the polyfunctional cationic polymerizable compound (W12) relative to the total amount of the resin components is preferably 5% by mass or more and 95% by mass or less. In this case, when the composition (X) contains a moisture absorbent (E), the dispersibility of the moisture absorbent (E) in the composition (X) and in the cured product is particularly improved, and the composition (X) can have a particularly high photocationic polymerization reactivity.

[0168] The monofunctional cationically polymerizable compound (W2) has only one cationically polymerizable functional group per molecule. The cationically polymerizable functional group is, for example, at least one group selected from the group consisting of an epoxy group, an oxetane group, and a vinyl ether group.

[0169] The viscosity of the monofunctional cationic polymerizable compound (W2) at 25°C is preferably 8 mPa·s or less. In this case, even if the composition (X) does not contain a solvent, the monofunctional cationic polymerizable compound (W2) can reduce the viscosity of the composition (X). In particular, the viscosity of the monofunctional cationic polymerizable compound (W2) at 25°C is preferably within the range of 0.1 to 8 mPa·s.

[0170] The monofunctional cationically polymerizable compound (W2) may contain, for example, at least one compound selected from the group consisting of the compounds represented by the following formulas (12) to (17) and limonene oxide.

[0171] [ka]

[0172] [ka]

[0173] [ka]

[0174] [ka]

[0175] [ka]

[0176] [ka]

[0177] The compounds represented by each of the above formulas (12) to (14), (16) and (17) are included in the above compound (A02).

[0178] The percentage of the monofunctional cationic polymerizable compound (W2) relative to the total amount of the resin components is preferably 5% by mass or more and 50% by mass or less. If the percentage of the monofunctional cationic polymerizable compound (W2) is 5% by mass or more, the viscosity of the composition (X) can be particularly reduced. If the percentage of the monofunctional cationic polymerizable compound (W2) is 50% by mass or less, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and the cured product can have high strength (hardness). The percentage of this monofunctional cationic polymerizable compound (W2) is more preferably 10% by mass or more, and even more preferably 15% by mass or more. The percentage of this monofunctional cationic polymerizable compound (W2) is more preferably 40% by mass or less, even more preferably 35% by mass or less, and particularly preferably 30% by mass or less. If the percentage of the monofunctional cationic polymerizable compound (W2) is particularly 35% by mass or less, the amount of volatilization of the components in the composition (X) during storage of the composition (X) can be effectively reduced, and therefore the properties of the composition (X) are less likely to be impaired even if the composition (X) is stored for a long period of time. Furthermore, the occurrence of tack in the cured product can be particularly suppressed. For example, it is preferable that the percentage of the monofunctional cationic polymerizable compound (W2) is within the range of 10 to 35% by mass.

[0179] In particular, when the composition (X) contains a polyfunctional cationic polymerizable compound (W11) and a polyfunctional cationic polymerizable compound (W12), the percentage of the polyfunctional cationic polymerizable compound (W11) is preferably 30% by mass or more and 60% by mass or less, the percentage of the polyfunctional cationic polymerizable compound (W12) is preferably 15% by mass or more and 30% by mass or less, and the percentage of the monofunctional cationic polymerizable compound (W2) is preferably 15% by mass or more and 40% by mass or less, based on the total amount of the resin components. In this case, the composition (X) can achieve a good balance of good storage stability, low viscosity, and good cationic polymerization reactivity, and further achieve a good balance of excellent transparency (visible light transmittance), excellent hygroscopicity, and high refractive index of the cured product.

[0180] When the cationically polymerizable compound (A2) contains a compound represented by formula (3) and a compound represented by formula (16), by adjusting the ratio of the two, it is possible to appropriately adjust the ease of progress of the curing reaction when preparing a photocured product from the composition (X), while achieving a low viscosity and improved storage stability of the composition (X).

[0181] The amount of the compound represented by formula (16) is appropriately adjusted so that the composition (X) has the above-mentioned properties. For example, the amount of the compound represented by formula (16) is 10% by mass or more and 40% by mass or less based on the total amount of the resin components. % It is preferable that:

[0182] The cationically polymerizable compound (A2) preferably contains a compound (f1) represented by the following formula (30) (hereinafter also referred to as aromatic epoxy compound (f1)).

[0183] [ka]

[0184] In formula (30), X is at least one selected from the group consisting of halogen, H, a hydrocarbon group, and an alkylene glycol group, and when there are multiple Xs in one molecule, they may be the same or different from each other. The hydrocarbon group is, for example, an alkyl group or an aryl group. When X is a hydrocarbon group, the carbon number of X is, for example, in the range of 1 to 10. R is a single bond or a divalent organic group. When R is a divalent organic group, the divalent organic group is, for example, an alkylene group, an oxyalkylene group, a carbonyloxyalkylene group (for example, -CO-O-CH2-), or a -C(Ph)2-O-CH2- group. Y is H or a monovalent organic group. When R is an oxyalkylene group or a carbonyloxyalkylene group, the compound shown in formula (30) is included in the above-mentioned compound (A02). When Y is a monovalent organic group, the monovalent organic group is, for example, an alkyl group or an aryl group.

[0185] When the cationic polymerizable compound (A2) contains an aromatic epoxy compound (f1), the aromatic epoxy compound (f1) has a low viscosity, so that the aromatic epoxy compound (f1) tends to lower the viscosity of the composition (X). In addition, the aromatic epoxy compound (f1) is not easily volatilized, so that even if the composition (X) is stored, the composition (X) is not easily changed in composition due to the volatilization of the aromatic epoxy compound (f1). Therefore, the aromatic epoxy compound (f1) tends to increase the storage stability of the composition (X). In addition, the aromatic epoxy compound (f1) has high reactivity, so that unreacted components are not easily left in the cured product, so that outgassing is not easily generated from the cured product. Furthermore, the aromatic epoxy compound (f1) tends to increase the glass transition temperature of the cured product, so that the heat resistance of the cured product is easily increased.

[0186] Furthermore, the aromatic epoxy compound (f1) is less likely to produce defective droplets called satellites when the composition (X) is discharged by an inkjet method.

[0187] R in formula (30) is preferably a single bond or an alkylene group. When n in formula (30) is 2 or 3, at least one of the multiple R in formula (30) is preferably a single bond or an alkylene group. In these cases, the reactivity of the aromatic epoxy compound (f1) tends to be high, and therefore the curability of the composition (X) tends to be high when the composition (X) is irradiated with ultraviolet light.

[0188] The aromatic epoxy compound (f1) preferably contains at least one compound selected from the group consisting of the compounds represented by the following formulas (301) to (318).

[0189] [ka]

[0190] The compounds represented by the above formulae (306) to (311), (313), and (315) to (318) are included in the above compound (A02).

[0191] In particular, it is preferred that the aromatic epoxy compound (f1) contains at least one component selected from the group consisting of the compounds represented by the formulas (301) to (305), (312), (314), and (318). These compounds tend to have high reactivity because at least one epoxy group (oxirane) in the compound is bonded to a benzene ring via a single bond or an alkylene group, and therefore tend to enhance the curability of the composition (X).

[0192] The percentage of the aromatic epoxy compound (f1) relative to the total amount of the cationic polymerizable compound (A2) is preferably 5% by mass or more. In this case, the above-mentioned effect of the aromatic epoxy compound (f1) is particularly easily obtained. This percentage is also preferably 95% by mass or less. In this case, the storage stability of the composition (X) is easily improved. This percentage is more preferably 10% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

[0193] The cationic polymerizable compound (A2) may contain a compound (f2) having an oxyalkylene skeleton. The oxyalkylene skeleton is a straight-chain skeleton consisting of one or more straight-chain oxyalkylene units. The compound (f2) having an oxyalkylene skeleton is included in the above-mentioned compound (A02).

[0194] When the cationic polymerizable compound (A2) contains the compound (f2), the compound (f2) has a low viscosity, and therefore the compound (f2) tends to lower the viscosity of the composition (X). In addition, the compound (f2) is not easily volatilized, and therefore, even if the composition (X) is stored, the composition (X) is not easily changed in composition due to the volatilization of the aromatic epoxy compound (f1). Therefore, the compound (f2) tends to increase the storage stability of the composition (X).

[0195] In addition, the compound (f2) is less likely to produce defective droplets called satellites when the composition (X) is discharged by the inkjet method. Furthermore, the compound (f2) can make it difficult for satellites to be produced even if the speed of the droplets discharged by the inkjet method is increased. Therefore, although it depends on the inkjet conditions, it is possible to make the discharge speed of the droplets by the inkjet method 4 m / s or more without producing satellites, for example. If the droplet speed can be increased, the trajectory of the droplets is less susceptible to disturbances, so that the dimensional accuracy of the cured product produced from the composition (X) can be improved. Furthermore, as described above, the compound (f2) can increase the storage stability of the composition (X), so that the characteristic of the composition (X) of being less likely to produce satellites is easily maintained even if the composition (X) is stored for a long period of time.

[0196] It is particularly preferable that the oxyalkylene skeleton contains a structure of "-CCO-", that is, an oxyethylene unit. In this case, satellites are particularly unlikely to be generated, and even if the driving frequency is changed when discharging the composition (X) by an inkjet method, satellites are unlikely to be generated. In addition, the compound (f2) is less likely to volatilize and has a lower viscosity, and the affinity (wettability) of the composition (X) to inorganic materials is likely to be increased.

[0197] The number of oxyalkylene units in the oxyalkylene skeleton of compound (f2) is preferably 1 to 8. In this case, compound (f2) tends to have a lower viscosity, so that satellites are particularly unlikely to be generated, and the crosslink density of the cured product tends to be high, so that the glass transition temperature of the cured product tends to be particularly high. The number of oxyalkylene units is more preferably 1 to 6, and even more preferably 1 to 4.

[0198] In addition, the oxyalkylene unit in the oxyalkylene skeleton of the compound (f2) may have a substituent other than hydrogen. For example, the oxyethylene unit contained in the oxyalkylene skeleton may have a structure of "-CH(CH3)-CH2-O-".

[0199] The percentage of the compound (f2) is preferably 10% by mass or more relative to the cationically polymerizable compound (A2). In this case, the inkjet property is good and the wettability to the substrate is good. mass % or less. In this case, the glass transition temperature can be sufficiently increased. This percentage is more preferably 15% by mass or more and 60% by mass or less, and even more preferably 20% by mass or more and 50% by mass or less.

[0200] The compound (f2) contains, for example, at least one compound selected from a compound (f21) having an oxyalkylene skeleton and an epoxy group, and a compound (f22) having an oxyalkylene group and an oxetane group.

[0201] Compound (f21) contains at least one compound selected from the group consisting of, for example, the compound represented by the above formula (1b), the compound represented by formula (4), the compound represented by formula (5), the compound represented by formula (6), the compound represented by formula (7), the compound represented by formula (8), the compound represented by formula (13), the compound represented by formula (14), etc. Note that the components that compound (f21) can contain are not limited to the above.

[0202] Compound (f22) contains at least one compound selected from the group consisting of compounds represented by the above formula (3), compounds represented by formula (12), compounds represented by formula (16), and compounds represented by formula (17). Note that the components that compound (f22) can contain are not limited to the above.

[0203] When the composition (X) contains a cationic polymerizable compound (A2), the composition (X) preferably further contains a sensitizer. In this case, the composition (X) can have particularly high cationic polymerization reactivity. The sensitizer contains, for example, either one or both of 9,10-dibutoxyanthracene and 9,10-diethoxyanthracene. The percentage of the sensitizer relative to the cationic polymerizable compound (A2) is preferably in the range of more than 0 mass% and 1 mass% or less. In this case, the sensitizer is unlikely to inhibit the transparency (visible light transmittance) of the cured product, and therefore the cured product can have good transparency (visible light transmittance).

[0204] When the composition (X) contains a cationic polymerizable compound (A2), the photopolymerization initiator (B) preferably contains a cationic photopolymerization initiator (B2). The cationic photopolymerization initiator (B2) is not particularly limited as long as it is a catalyst that generates a protonic acid or a Lewis acid upon irradiation with light. The cationic photopolymerization initiator (B2) preferably contains a catalyst that generates a protonic acid or a Lewis acid upon irradiation with light having a peak wavelength of 395 nm. The cationic photopolymerization initiator (B2) can contain at least one of an ionic photoacid generating cationic curing catalyst and a nonionic photoacid generating cationic curing catalyst.

[0205] The ionic photoacid generating cationic curing catalyst may contain at least one of onium salts and organometallic complexes. Examples of onium salts include aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts. Examples of organometallic complexes include iron-arene complexes, titanocene complexes, and arylsilanol-aluminum complexes. The ionic photoacid generating cationic curing catalyst may contain at least one of these components.

[0206] The nonionic photoacid generating cationic curing catalyst may contain at least one component selected from the group consisting of nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenolsulfonic acid ester, diazonaphthoquinone, and N-hydroxyimide phosphonate. However, the components that the nonionic photoacid generating cationic curing catalyst may contain are not limited to the above.

[0207] More specific examples of compounds that can contain the photocationic polymerization initiator (B2) include Midori Chemical's DPI series (105, 106, 109, 201, etc.), BI-105, MPI series (103, 105, 106, 109, etc.), BBI series (101, 102, 103, 105, 106, 109, 110, 200, 210, 300, 301, etc.), and TSP series. Series (102, 103, 105, 106, 109, 200, 300, 1000, etc.), HDS-109, MDS series (103, 105, 109, 203, 205, 209, etc.), BDS-109, MNPS-109, DTS series (102, 103, 105, 200, etc.), NDS series (103, 105, 155, 165, etc.), DAM series (1 01, 102, 103, 105, 201, etc.), SI series (105, 106, etc.), PI-106, NDI series (105, 106, 109, 1001, 1004, etc.), PAI series (01, 101, 106, 1001, 1002, 1003, 1004, etc.), MBZ-101, PYR-100, NB series (101, 201, etc.), NAI series Series (100, 1002, 1003, 1004, 101, 105, 106, 109, etc.), TAZ series (100, 101, 102, 103, 104, 107, 108, 109, 110, 113, 114, 118, 122, 123, 203, 204, etc.), NBC-101, ANC-101, TPS-Acetate, DTS-Acetate, Di-Boc Bisphinol A, tert-Butyl lithocholate, tert-Butyl deoxycholate, tert-Butyl cholate, BX, BC-2, MPI-103, BDS-105, TPS-103, NAT-103, BMS-105, and TMS-105; Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, and Cyracure UVI-950 manufactured by Union Carbide Corporation, USA; Irgacure 250, Irgacure 261 and Irgacure 264 from BASF; Ciba-Geigy CG-24-61; ADEKA OPTOMER SP-150, ADEKA OPTOMER SP-151, ADEKA OPTOMER SP-170 and ADEKA OPTOMER SP-171 manufactured by ADEKA Corporation; DAICAT II manufactured by Daicel Corporation; UVAC1590 and UVAC1591 manufactured by Daicel-Cytec Co., Ltd.; CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, and CIT-1682 manufactured by Nippon Soda Co., Ltd.; PI-2074, tetrakis(pentafluorophenyl)borate toluylcumyl iodonium salt, from Rhodia; 3M FFC509; CD-1010, CD-1011 and CD-1012 manufactured by Sartomer, USA; CPI-100P, CPI-101A, CPI-110P, CPI-110A and CPI-210S manufactured by San-Apro Ltd.; and UVI-6992 and UVI-6976 manufactured by The Dow Chemical Company are included. The photocationic polymerization initiator (B2) may contain at least one compound selected from the group consisting of these compounds.

[0208] The cationic photopolymerization initiator (B2) preferably has a triarylsulfonate type cation. In particular, the cationic photopolymerization initiator (B2) preferably contains a salt having at least one cation selected from the group consisting of the cations shown in the following formula (61), the cations shown in the following formula (62), the cations shown in the following formula (63), and the cations shown in the following formula (64). In this case, the cationic photopolymerization initiator (B2) can effectively promote the reaction of the cationic polymerizable compound (A2) when irradiated with light having a peak wavelength of 395 nm.

[0209] [ka]

[0210] [ka]

[0211] [ka]

[0212] [ka]

[0213] It is also preferred that the photocationic polymerization initiator (B2) contains a salt having a (perfluoroalkyl)fluorophosphate anion. In this case, the transparency (visible light transmittance) of the cured product is likely to be increased. The percentage of the salt having a (perfluoroalkyl)fluorophosphate anion relative to the total photocationic polymerization initiator (B2) is preferably 0.1 mass% or more, more preferably 0.5 mass% or more, and even more preferably 0.8 mass% or more.

[0214] The (perfluoroalkyl)fluorophosphate anion is (Rf) n PF 6-n -Rf is a perfluoroalkyl group, and n is any number from 1 to 5. The number of carbon atoms in Rf is, for example, 1 to 3, and when there are multiple Rfs (when n is 2 or more), the Rfs may be the same or different from each other.

[0215] It is also preferred that the salt having a (perfluoroalkyl)fluorophosphate anion has a cation of triarylsulfonate type, ie, is a salt of a cation of triarylsulfonate type with a (perfluoroalkyl)fluorophosphate anion.

[0216] The percentage of the photocationic polymerization initiator (B2) relative to the cationic polymerizable compound (A2) is preferably 1% by mass or more and 4% by mass or less. When this percentage is 1% by mass or more, the composition (X) can have particularly good cationic polymerization reactivity. When this percentage is 4% by mass or less, the composition (X) can have good storage stability, and since it does not contain an excessive amount of the photocationic polymerization initiator (B2), it is possible to reduce the production cost.

[0217] Next, the ultraviolet absorbent (C) will be described. As described above, the ultraviolet absorbent (C) can reduce the ultraviolet transmittance of the cured product. In addition, the ultraviolet absorbent (C) is less likely to block the transmission of visible light than light reflecting materials such as titanium dioxide particles and zinc oxide particles.

[0218] The ultraviolet absorber (C) contains at least one selected from the group consisting of benzotriazole ultraviolet absorbers, benzophenone ultraviolet absorbers, azomethine ultraviolet absorbers, indole ultraviolet absorbers, diazine ultraviolet absorbers, triazine ultraviolet absorbers, pyrazolidinedione ultraviolet absorbers, and ethylene ultraviolet absorbers. In this case, the bleed-out of the ultraviolet absorber (C) is further unlikely to occur, and the ultraviolet transmittance of the cured product is further likely to be reduced.

[0219] The ultraviolet absorber (C) contains at least one of a reactive ultraviolet absorber (C1) and a non-reactive ultraviolet absorber (C2). The reactive ultraviolet absorber (C1) is an ultraviolet absorber that can undergo a polymerization reaction with at least one compound contained in the photopolymerizable compound (A). The non-reactive ultraviolet absorber (C2) is an ultraviolet absorber that does not undergo a polymerization reaction with the photopolymerizable compound (A).

[0220] When the ultraviolet absorber (C) contains a reactive ultraviolet absorber (C1), the ultraviolet absorber (C) is less likely to bleed out from the cured product. This is presumably because the reactive ultraviolet absorber (C1) reacts with the compound in the photopolymerizable compound (A) and is easily incorporated into the polymer skeleton in the cured product.

[0221] The reactive ultraviolet absorber (C1) preferably has a functional group (reactive functional group) that is reactive with a compound contained in the photopolymerizable compound (A). For example, when the photopolymerizable compound (A) contains a radically polymerizable compound, the reactive ultraviolet absorber (C1) preferably has a radically polymerizable functional group as a reactive functional group. The radically polymerizable functional group may be an ethylenically unsaturated group. When the photopolymerizable compound (A) contains a cationic polymerizable compound, the reactive ultraviolet absorber (C1) preferably has a cationic polymerizable functional group as a reactive functional group. The cationic polymerizable functional group includes at least one selected from the group consisting of an epoxy group, an oxetane group, and a vinyl ether group.

[0222] The reactive ultraviolet absorber (C1) contains at least one selected from the group consisting of, for example, benzotriazole-based reactive ultraviolet absorbers, benzophenone-based reactive ultraviolet absorbers, azomethine-based reactive ultraviolet absorbers, indole-based reactive ultraviolet absorbers, diazine-based reactive ultraviolet absorbers, triazine-based reactive ultraviolet absorbers, pyrazolidinedione-based reactive ultraviolet absorbers, and ethylene-based reactive ultraviolet absorbers.

[0223] In particular, it is preferable that the reactive ultraviolet absorber (C1) contains at least one of a benzotriazole-based reactive ultraviolet absorber and a benzophenone-based reactive ultraviolet absorber. In this case, the benzotriazole-based reactive ultraviolet absorber and the benzophenone-based reactive ultraviolet absorber are easy to absorb ultraviolet rays with relatively short wavelengths. Therefore, the cured product is less likely to transmit ultraviolet rays, and the transmission of visible light is less likely to be hindered by the reactive ultraviolet absorber (C1). It is particularly preferable that the reactive ultraviolet absorber (C1) contains a benzotriazole-based reactive ultraviolet absorber. The benzotriazole-based reactive ultraviolet absorber can absorb ultraviolet rays in a relatively wide wavelength range, so the cured product is less likely to transmit ultraviolet rays.

[0224] The benzotriazole-based reactive ultraviolet absorber has, for example, a structure shown in the following formula (80).

[0225] [ka]

[0226] In the above formula (80), the multiple Rs include at least one organic group having a reactive functional group. For example, it is preferable that one R or each of two Rs among the multiple Rs is an organic group having a reactive functional group.

[0227] When the photopolymerizable compound (A) contains a radical polymerizable compound and the reactive functional group is a radical polymerizable functional group, the organic group having the reactive functional group is, for example, an organic group represented by the above formula (81), an organic group represented by the above formula (82), or an organic group represented by the above formula (83). 2 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 3 is a single bond, an alkylene group having 1 to 10 carbon atoms, or an arylene group having 6 to 20 carbon atoms. In the above formula (82), R 4 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms; X 1 is O, S, NH or NR 6and R 6 is an alkyl group having 1 to 5 carbon atoms. In the above formula (83), R 7 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 8 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, R 9 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms; X 2 is O, S, NH or NR 13 , R 13 is an alkyl group having 1 to 5 carbon atoms, and m is a number from 1 to 6.

[0228] When the photopolymerizable compound (A) contains a cationic polymerizable compound and the reactive functional group is a cationic polymerizable functional group, the cationic polymerizable functional group is, for example, at least one group selected from the group consisting of a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group. The organic group having a reactive functional group is, for example, a vinyl ether group.

[0229] Among the multiple R in formula (80), each of the groups (non-reactive groups) other than the organic group having a reactive functional group is, for example, a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and having a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms. In particular, the non-reactive group preferably contains one or more hydroxyl groups. In this case, the photostability of the ultraviolet absorber (C) itself is likely to be improved by intramolecular hydrogen bonding.

[0230] The benzophenone-based reactive ultraviolet absorber has, for example, a structure shown in the following formula (90).

[0231] [ka]

[0232] In the above formula (90), the multiple Rs each include at least one organic group having a reactive functional group. For example, it is preferable that one R or each of two Rs among the multiple Rs is an organic group having a reactive functional group.

[0233] When the photopolymerizable compound (A) contains a radical polymerizable compound and the reactive functional group is a radical polymerizable functional group, the organic group having the reactive functional group is, for example, an organic group represented by the above formula (91), an organic group represented by the above formula (92), or an organic group represented by the above formula (93). 2 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 3 is a single bond, an alkylene group having 1 to 10 carbon atoms, or an arylene group having 6 to 20 carbon atoms. In the above formula (92), R 4 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms; X 1 is O, S, NH or NR 6 and R 6 is an alkyl group having 1 to 5 carbon atoms. In the above formula (93), R 7 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 8 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, R 9 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms; X 2 is O, S, NH or NR 13 , R 13 is an alkyl group having 1 to 5 carbon atoms, and m is a number from 1 to 6.

[0234] When the photopolymerizable compound (A) contains a cationic polymerizable compound and the reactive functional group is a cationic polymerizable functional group, the cationic polymerizable functional group is, for example, at least one group selected from the group consisting of a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group. The organic group having a reactive functional group is, for example, a vinyl ether group.

[0235] Among the multiple R in formula (90), each of the groups (non-reactive groups) other than the organic group having a reactive functional group is, for example, a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and having a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms. It is preferable that the non-reactive group in formula (90) contains a hydroxyl group, and it is particularly preferable that at least two of the non-reactive groups are hydroxyl groups. That is, it is preferable that the benzophenone-based reactive ultraviolet absorber has two or more hydroxyl groups. In this case, the transparency (visible light transmittance) of the cured product is not easily inhibited, and the transmittance of light having a wavelength of 400 nm of the cured product is easily effectively reduced.

[0236] On the other hand, the non-reactive ultraviolet absorber (C2) contains at least one selected from the group consisting of, for example, benzotriazole-based ultraviolet absorbers having no reactive functional groups, benzophenone-based ultraviolet absorbers having no reactive functional groups, azomethine-based ultraviolet absorbers having no reactive functional groups, indole-based ultraviolet absorbers having no reactive functional groups, phthalocyanine-based ultraviolet absorbers having no reactive functional groups, and triazine-based ultraviolet absorbers having no reactive functional groups. The non-reactive ultraviolet absorber (C2) preferably contains at least one selected from the group consisting of triazine-based ultraviolet absorbers, benzotriazole-based ultraviolet absorbers, and benzophenone-based ultraviolet absorbers.

[0237] The benzotriazole-based ultraviolet absorber having no reactive functional group has a structure in which, for example, in the above formula (80), each of the multiple R is a non-reactive group. In this case, each of the multiple R is, for example, a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms.

[0238] The benzophenone-based ultraviolet absorber having no reactive functional group has a structure in which, for example, in the above formula (90), each of the multiple R is a non-reactive group. In this case, each of the multiple R is, for example, a hydrogen atom, a halogen atom, a hydroxyl group, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and a hydroxyl group, an aryl group having 6 to 10 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms.

[0239] The non-reactive ultraviolet absorber (C2) may contain a compound that exhibits ultraviolet absorbing properties when heated, that is, a so-called latent ultraviolet absorber. In this case, the latent ultraviolet absorber does not exhibit ultraviolet absorbing properties in the composition (X), so that the composition (X) is easily cured with ultraviolet rays. In addition, when the cured product is heated, the latent ultraviolet absorber in the cured product exhibits ultraviolet absorbing properties, so that the cured product becomes less likely to transmit ultraviolet rays.

[0240] When the ultraviolet absorber (C) contains a reactive ultraviolet absorber (C1) and a non-reactive ultraviolet absorber (C2), the percentage of the reactive ultraviolet absorber (C1) to the total ultraviolet absorber (C) is preferably 30 mass% or more, more preferably 40 mass% or more, and even more preferably 50 mass% or more. In this case, bleeding out of the ultraviolet absorber (C) from the cured product is more unlikely to occur.

[0241] The ultraviolet absorber (C) preferably contains a compound having a molecular weight of 400 or more. In this case, outgassing is less likely to occur from the cured product. The percentage of the compound having a molecular weight of 400 or more relative to the entire ultraviolet absorber (C) is preferably 3% by mass or more. In this case, there is an advantage that ultraviolet rays can be sufficiently absorbed even in a thin film of 10 μm. This percentage is more preferably 5% by mass or more, and even more preferably 8% by mass or more. In addition, this percentage is preferably 30% by mass or less. In this case, there is an advantage that the inkjet property of the composition (X) is improved and outgassing is reduced. This percentage is more preferably 25% by mass or less, and even more preferably 15% by mass or less.

[0242] The percentage of the ultraviolet absorber (C) is, for example, 1% by mass or more and 25% by mass or less with respect to the entire composition (X). If this percentage is 1% by mass or more, there is an advantage that the cured product is particularly difficult to transmit ultraviolet light. If this percentage is 1% by mass or more, it is more preferable, and if it is 3% by mass or more, it is even more preferable. If this percentage is 25% by mass or less, there is an advantage that the composition (X) has good coatability. If this percentage is 20% by mass or less, it is more preferable, and if it is 15% by mass or less, it is even more preferable.

[0243] The sensitizer (D) will now be described. Since the composition (X) contains the sensitizer (D), as described above, the composition (X) is likely to maintain good reactivity when irradiated with light, even though the composition (X) contains the ultraviolet absorber (C).

[0244] The sensitizer (D) preferably contains an anthracene-based sensitizer. In this case, even when the composition (X) is irradiated with light having a wavelength of about 395 nm, good reactivity is likely to be maintained. The anthracene-based sensitizer contains, for example, a compound having a structure shown in the following formula (70).

[0245] [ka]

[0246] In the above formula (70), each of the multiple R's is independently an organic group having a reactive functional group or a group (non-reactive group) other than an organic group having a reactive functional group, and n is a number from 1 to 6.

[0247] In the case where a plurality of R's include an organic group having a reactive functional group, when the photopolymerizable compound (A) contains a radical polymerizable compound and the reactive functional group is a radical polymerizable functional group, the organic group having the reactive functional group is, for example, an organic group represented by the above formula (72), an organic group represented by the above formula (73), or an organic group represented by the above formula (74). 2 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 3 is a single bond, an alkylene group having 1 to 10 carbon atoms, or an arylene group having 6 to 20 carbon atoms. In the above formula (73), R 4 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms; X 1 is O, S, NH or NR 6 and R 6 is an alkyl group having 1 to 5 carbon atoms. In the above formula (74), R 7 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 8 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms, R 9 is an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 20 carbon atoms; X 2 is O, S, NH or NR 13 , R 13 is an alkyl group having 1 to 5 carbon atoms, and m is a number from 1 to 6.

[0248] When the photopolymerizable compound (A) contains a cationic polymerizable compound and the reactive functional group is a cationic polymerizable functional group, the cationic polymerizable functional group is, for example, at least one group selected from the group consisting of a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group. The organic group having a reactive functional group is, for example, a vinyl ether group.

[0249] The non-reactive group is, for example, a hydrogen atom, a halogen atom, an amino group, a cyano group, a nitro group, or an organic group having no reactive functional group. The organic group having no reactive functional group is, for example, an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms and a hydroxyl group, an aryl group having 6 to 10 carbon atoms, a group represented by the above formula (71), or "-OR 10 " R 10 is an organic group having no reactive group. In the above formula (71), R 11 is an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 20 carbon atoms, or an alkyleneoxy group having 1 to 10 carbon atoms; R 12 is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an alkyloxy group having 1 to 10 carbon atoms. Each of the non-reactive groups is particularly preferably a hydrogen atom, an OH group, a methyl group, or an ethyl group. In this case, the sensitizing effect of the anthracene-based sensitizer is particularly likely to be exhibited, so that the good reactivity of the composition (X) is further likely to be maintained, and the need to use a large amount of the sensitizer is reduced.

[0250] The sensitizer (D) is an anthracene skeleton and a "-OR" bonded to the anthracene skeleton. 10 It is preferable that the anthracene-based sensitizer (D1) contains a group represented by "-OR 10 " is as explained above. As the anthracene-based sensitizer (D1), for example, in the above formula (70), multiple R are "-OR 10 ". When the sensitizer (D) contains an anthracene-based sensitizer (D1), the sensitizing effect of the sensitizer (D) is more easily exhibited, and therefore the good reactivity of the composition (X) is more easily maintained. In addition, the affinity between the sensitizer (D) and the photopolymerizable compound (A) is more easily increased, and therefore, even if the sensitizer (D) does not have a reactive functional group, the sensitizer (D) is less likely to bleed out from the cured product.

[0251] R 10R is, for example, a saturated hydrocarbon group which may contain a non-reactive group. The non-reactive group is, for example, at least one selected from the group consisting of a carbonyl group, an ether bond, an ester bond, and the like. 10 In R, the number of atoms constituting the longest linear chain bonded to O is preferably 1 to 10. 10 In the formula, the number of atoms constituting the longest linear chain bonded to O is preferably 2 or more, more preferably 4 or more, and even more preferably 5 or more. In this case, bleeding out of the sensitizer (D) is further suppressed. In addition, the number of atoms is preferably 8 or less, and even more preferably 6 or less. In this case, the good reactivity of the composition (X) is particularly likely to be maintained.

[0252] The anthracene-based sensitizer (D1) preferably contains, for example, a compound represented by the following formula (701). In formula (701), "-OR 10 " is as explained above. In this case, the sensitizing effect of the sensitizer (D) is more likely to be exhibited, and therefore the good reactivity of the composition (X) is more likely to be maintained. In addition, the affinity between the sensitizer (D) and the photopolymerizable compound (A) is more likely to be increased, and therefore, even if the sensitizer (D) does not have a reactive functional group, the sensitizer (D) is less likely to bleed out from the cured product.

[0253] [ka]

[0254] The compound represented by formula (701) contains at least one selected from the group consisting of a compound represented by the following formula (702), a compound represented by the following formula (703), a compound represented by the following formula (704), and a compound represented by the following formula (705).

[0255] [ka]

[0256] [ka]

[0257] [ka]

[0258] [ka]

[0259] The sensitizer (D) may contain a compound other than an anthracene-based sensitizer. In this case, the sensitizer (D) may contain at least one compound selected from the group consisting of, for example, thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, anthraquinone, 1,2-dihydroxyanthraquinone, 2-ethylanthraquinone, 1,4-diethoxynaphthalene, p-dimethylaminoacetophenone, p-diethylaminoacetophenone, p-dimethylaminobenzophenone, p-diethylaminobenzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, p-dimethylaminobenzaldehyde, and p-diethylaminobenzaldehyde.

[0260] When the sensitizer (D) contains an anthracene-based sensitizer (D1), the percentage of the anthracene-based sensitizer (D1) relative to the entire sensitizer (D) is preferably 50 mass% or more, more preferably 70 mass% or more, and even more preferably 90 mass% or more.

[0261] The percentage of the sensitizer (D) relative to the solid content of the composition (X) is preferably 1.0% by mass or more and 4.5% by mass or less. The solid content refers to the components excluding volatile components such as the solvent in the composition (X). If the percentage is 1.0% by mass or more, the good reactivity of the composition (X) is more likely to be maintained. If the percentage is 4.5% by mass or less, the transparency (visible light transmittance) of the cured product is less likely to be hindered, and outgassing derived from the sensitizer after curing can be reduced. This percentage is more preferably 1.2% by mass or more, and even more preferably 1.5% by mass or more. This percentage is more preferably 4.0% by mass or less, and even more preferably 3.0% by mass or less.

[0262] In addition, the percentage of the sensitizer (D) relative to the total of the ultraviolet absorber (C) and the sensitizer (D) is preferably 3% by mass or more and 70% by mass or less. When this percentage is 3% by mass or more, the good reactivity of the composition (X) is particularly likely to be maintained. When this percentage is 70% by mass or less, the cured product becomes particularly difficult to transmit ultraviolet light, and the storage stability of the composition (X) is particularly likely to be increased. This percentage is more preferably 4% by mass or more, and even more preferably 5% by mass or more. Furthermore, this percentage is more preferably 50% by mass or less, and even more preferably 40% by mass or less.

[0263] The composition (X) may further contain a moisture absorbent (E). When the composition (X) contains the moisture absorbent (E), the cured product of the composition (X) can have moisture absorption properties. Therefore, the encapsulant 5 containing the cured product can further prevent moisture from penetrating into the light emitting element 4 in the light emitting device 1. The average particle size of the moisture absorbent (E) is preferably 200 nm or less. In this case, the cured product can have high transparency (visible light transmittance).

[0264] The moisture absorbent (E) is preferably an inorganic particle having moisture absorbing properties, and preferably contains at least one component selected from the group consisting of zeolite particles, silica gel particles, calcium chloride particles, and titanium oxide nanotube particles. It is particularly preferable that the moisture absorbent (E) contains zeolite particles.

[0265] Zeolite particles having an average particle size of 200 nm or less can be produced, for example, by pulverizing general industrial zeolite. In producing the zeolite particles, the zeolite may be pulverized and then crystallized by hydrothermal synthesis or the like, in which case the zeolite particles can have particularly high hygroscopicity. Examples of the method for producing such zeolite particles are disclosed in JP 2016-69266 A, JP 2013-049602 A, and the like.

[0266] The zeolite particles preferably contain sodium ions. Therefore, the zeolite particles are preferably made of at least one selected from the group consisting of A-type zeolite, X-type zeolite, and Y-type zeolite. It is particularly preferable that the zeolite particles are made of 4A-type zeolite among A-type zeolites. In these cases, the zeolite particles have a crystal structure suitable for adsorbing moisture.

[0267] The pH of the zeolite particles is preferably 7 or more and 10 or less. When the pH of the zeolite particles is 7 or more, the crystals of the zeolite particles are less likely to be destroyed, and therefore the cured product of the composition (X) containing the zeolite particles can have particularly high hygroscopicity. When the pH of the zeolite particles is 10 or less, the zeolite particles are less likely to hinder the curing of the composition (X) when it is cured. The pH of the zeolite particles is a value obtained by heating a dispersion obtained by adding 0.05 g of zeolite particles to 99.95 g of ion-exchanged water at 90°C for 24 hours, and then measuring the pH of the supernatant of the dispersion with a pH meter. Examples of pH meter include a compact pH meter manufactured by Horiba, Ltd. <laquatwin>B-711 can be used.

[0268] The average particle size of the moisture absorbent (E) is preferably 10 nm or more and 200 nm or less. If the average particle size is 200 nm or less, the cured product can have particularly high transparency (visible light transmittance). If the average particle size is 10 nm or more, the moisture absorbent (E) can maintain good moisture absorption. Note that this average particle size is the median diameter calculated from the measurement results by dynamic light scattering method, that is, the cumulative 50% diameter (D50). Note that the Nanotrac Wave series from Microtrack Bell Co., Ltd. can be used as a measuring device.

[0269] The average particle size of the moisture absorbent (E) is preferably 150 nm or less, more preferably 100 nm or less, and particularly preferably 70 nm or less. The average particle size of the moisture absorbent (E) is preferably 20 nm or more, and more preferably 50 nm or more. In this case, the cured product can have particularly good transparency (visible light transmittance) and moisture absorption.

[0270] It is also preferable that the cumulative 90% diameter (D90) of the moisture absorbent (E) is 100 nm or less. In this case, the cured product can have particularly high transparency (visible light transmittance).

[0271] When the composition (X) contains the moisture absorbent (E), the percentage of the moisture absorbent (E) relative to the total amount of the composition (X) is preferably 1% by mass or more and 20% by mass or less. If the percentage of the moisture absorbent (E) is 1% by mass or more, the cured product can have particularly high moisture absorption. If the percentage of the moisture absorbent (E) is 20% by mass or less, the viscosity of the composition (X) can be particularly reduced, and the composition (X) can have a sufficiently low viscosity to be applicable by the inkjet method. The percentage of the moisture absorbent (E) is more preferably 3% by mass or more, and particularly preferably 5% by mass or more. The percentage of the moisture absorbent (E) is more preferably 15% by mass or less, and particularly preferably 13% by mass or less.

[0272] The composition (X) may further contain an inorganic filler other than the moisture absorbent (E). For example, the composition (X) may contain nano-sized high refractive index particles. Examples of high refractive index particles include zirconia particles. When the composition (X) contains high refractive index particles, the refractive index of the cured product can be increased while maintaining good transparency (visible light transmittance) of the cured product. Therefore, when the cured product is applied to an optical component, the extraction efficiency of light that passes through the optical component and is emitted to the outside can be improved. The average particle size of the high refractive index particles is preferably within the range of 5 to 30 nm, and more preferably within the range of 10 to 20 nm.

[0273] The percentage of the high refractive index particles in the composition (X) is appropriately designed so that the cured product has a desired refractive index. In particular, the high refractive index particles are preferably contained in the composition (X) so that the refractive index of the cured product is in the range of 1.45 or more and less than 1.55. In this case, the light extraction efficiency of the light emitting device 1 is particularly improved.

[0274] When the composition (X) contains the moisture absorbent (E), the composition (X) preferably further contains a dispersant (F). In this case, the dispersant (F) can improve the dispersibility of the moisture absorbent (E) in the composition (X). Therefore, the composition (X) is less likely to suffer from an increase in viscosity and a decrease in storage stability due to the moisture absorbent (E).

[0275] The dispersant (F) is a surfactant that can be adsorbed to particles. The dispersant (F) has an adsorption group (generally also called an anchor) that can be adsorbed to particles, and a molecular skeleton (generally also called a tail) that adheres to the particles by the adsorption of the adsorption group to the particles. The dispersant (F) contains at least one component selected from the group consisting of, for example, an acrylic dispersant whose tail is an acrylic molecular chain, a urethane dispersant whose tail is a urethane molecular chain, and a polyester dispersant whose tail is a polyester molecular chain. The adsorption group includes at least one of, for example, a basic polar functional group and an acidic polar functional group. The basic polar functional group includes at least one group selected from the group consisting of, for example, an amino group, an imino group, an amide group, an imide group, and a nitrogen-containing heterocyclic group. The acidic polar functional group includes at least one group selected from the group consisting of, for example, a carboxyl group and a phosphate group. The dispersant (F) may contain at least one compound selected from the group consisting of, for example, the Solsperse series manufactured by Nippon Louvre Resol Co., Ltd., the DISPERBYK series manufactured by BYK-Chemie Japan Co., Ltd., and the AJISPER series manufactured by Ajinomoto Fine-Techno Co., Ltd.

[0276] When the composition (X) contains a moisture absorbent (E), the amount of the dispersant (F) relative to 100 parts by mass of the moisture absorbent (E) is preferably 5 parts by mass or more and 60 parts by mass or less. When the amount of the dispersant (F) is 5 parts by mass or more, the function of the dispersant (F) can be effectively expressed, and when the amount is 60 parts by mass or less, the free molecules of the dispersant (F) in the cured product can be prevented from inhibiting the adhesion between the cured product and the inorganic material member. In addition, the amount of the dispersant (F) is more preferably 15 parts by mass or more, more preferably 50 parts by mass or less, even more preferably 40 parts by mass or less, and particularly preferably 30 parts by mass or less.

[0277] The structure of the light emitting device 1 will be described. The light emitting device 1 includes a light source and an optical component that transmits the light emitted by the light source. For example, the light emitting device 1 includes a light emitting element 4, and a sealant 5 and a passivation layer 6 that cover the light emitting element 4. In this case, the light emitting element 4 is the light source, the sealant 5 is the optical component, and the passivation layer 6 is an inorganic layer. The sealant 5 and the passivation layer 6 overlap each other.

[0278] The light-emitting element 4 includes, for example, a light-emitting diode. The light-emitting diode includes, for example, at least one of an organic EL element (organic light-emitting diode) and a micro light-emitting diode. When the light-emitting element 4 includes an organic light-emitting diode, the light-emitting device 1 including the light-emitting element 4 is, for example, an organic EL display. When the light-emitting element 4 includes a micro light-emitting diode, the light-emitting element The light emitting device 1 equipped with the light emitting diode 4 is, for example, a micro LED display. Note that EL is an abbreviation for electroluminescence.

[0279] An example of the structure of the light emitting device 1 will be described with reference to Fig. 1. This light emitting device 1 is a top emission type. The light emitting device 1 includes a support substrate 2, a transparent substrate 3 that faces the support substrate 2 with a gap therebetween, a light emitting element 4 on the surface of the support substrate 2 that faces the transparent substrate 3, and a passivation layer 6 and a sealing material 5 that cover the light emitting element 4.

[0280] The support substrate 2 is made of, for example, but not limited to, a resin material. The transparent substrate 3 is made of a material having light-transmitting properties. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate. The light-emitting element 4 includes, for example, a pair of electrodes 41, 43 and an organic light-emitting layer 42 between the electrodes 41, 43. The organic light-emitting layer 42 includes, for example, a hole injection layer 421, a hole transport layer 422, an organic light-emitting layer 423, and an electron transport layer 424, which are stacked in the above order.

[0281] The light emitting device 1 includes a plurality of light emitting elements 4, which form an array 9 (hereinafter referred to as element array 9) on a support substrate 2. The element array 9 also includes a partition 7. The partition 7 is located on the support substrate 2 and separates two adjacent light emitting elements 4. The partition 7 is produced, for example, by forming a photosensitive resin material using a photolithography method. The element array 9 also includes connection wiring 8 that electrically connects the electrodes 43 and the electron transport layers 424 of adjacent light emitting elements 4 to each other. The connection wiring 8 is provided on the partition 7.

[0282] The passivation layer 6 is preferably made of silicon nitride or silicon oxide, and is particularly preferably made of silicon nitride. In the example shown in FIG. 1, the passivation layer 6 includes a first passivation layer 61 and a second passivation layer 62. The first passivation layer 61 covers the element array 9 in a state of direct contact with the element array 9, thereby covering the light-emitting element 4. The second passivation layer 62 is disposed on the opposite side of the element array 9 with respect to the first passivation layer 61, and a gap is provided between the second passivation layer 62 and the first passivation layer 61. The sealant 5 is filled between the first passivation layer 61 and the second passivation layer 62. That is, the first passivation layer 61 is interposed between the light-emitting element 4 and the sealant 5 covering the light-emitting element 4.

[0283] Furthermore, a second sealing material 52 is filled between the second passivation layer 62 and the transparent substrate 3. The second sealing material 52 is made of, for example, a transparent resin material. The material of the second sealing material 52 is not particularly limited. The material of the second sealing material 52 may be the same as or different from the sealing material 5.

[0284] A method for producing the encapsulant 5 using the composition (X) and a method for producing the light emitting device 1 will be described.

[0285] In this embodiment, it is preferable to mold the composition (X) by the inkjet method, and then irradiate the composition (X) with ultraviolet light to cure it, thereby producing the encapsulant 5. In this embodiment, the composition (X) can be applied and molded by the inkjet method.

[0286] When applying composition (X) by the inkjet method, in the case where composition (X) has a sufficiently low viscosity at room temperature, for example, a viscosity at 25°C of 30 mPa s or less, particularly 15 mPa s or less, composition (X) can be molded by applying it by the inkjet method without heating.

[0287] When composition (X) has the property of being reduced in viscosity by heating, composition (X) may be heated and then applied and molded by an inkjet method. When composition (X) has a viscosity of 30 mPa·s or less, particularly 15 mPa·s or less at 40°C, composition (X) can be reduced in viscosity by simply heating it slightly, and this reduced-viscosity composition (X) can be discharged by an inkjet method. The heating temperature for composition (X) is, for example, 20°C or higher and 50°C or lower.

[0288] More specifically, for example, first, a support substrate 2 is prepared. On one surface of the support substrate 2, partition walls 7 are fabricated by photolithography using, for example, a photosensitive resin material. Next, a plurality of light-emitting elements 4 are provided on one surface of the support substrate 2. The light-emitting elements 4 can be fabricated by an appropriate method such as a vapor deposition method or a coating method. In particular, it is preferable to fabricate the light-emitting elements 4 by a coating method such as an inkjet method. In this way, an element array 9 is fabricated on the support substrate 2.

[0289] Next, a first passivation layer 61 is provided on the element array 9. The first passivation layer 61 can be formed by a deposition method such as a plasma CVD method.

[0290] Next, the composition (X) is formed on the first passivation layer 61 by, for example, an inkjet method to prepare a coating film. If the inkjet method is used for both the formation of the light emitting element 4 and the application of the composition (X), the production efficiency of the light emitting device 1 can be particularly improved. Next, the coating film of the composition (X) is cured by irradiating it with light to prepare the encapsulant 5.

[0291] The peak wavelength of the light irradiated to the composition (X) is preferably around 395 nm. In this embodiment, the composition (X) is likely to have good curability when irradiated with light having a wavelength of around 395 nm. The peak wavelength of the light irradiated to the composition (X) is, for example, 365 nm or more and 405 nm or less.

[0292] When irradiating the composition (X) with light, the composition (X) may be irradiated with light under an atmosphere containing oxygen, such as an air atmosphere, or may be irradiated with light under an inert atmosphere, such as a nitrogen atmosphere. In this embodiment, as described above, the oxygen ratio of the composition (X) is 75 mass% or less, so that oxygen inhibition is unlikely to occur, even if the photopolymerizable compound (A) contains the radical polymerizable compound (A1). Therefore, even if the composition (X) is irradiated with ultraviolet light under an atmosphere containing oxygen, the composition (X) is easily cured.

[0293] Next, a second passivation layer 62 is provided on the sealing material 5. The second passivation layer 62 can be formed by a deposition method such as a plasma CVD method.

[0294] Next, a photocurable resin material is provided on one surface of the support substrate 2 so as to cover the second passivation layer 62, and then the transparent substrate 3 is placed on the resin material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate.

[0295] Next, ultraviolet light is irradiated from the outside toward the transparent substrate 3. The ultraviolet light passes through the transparent substrate 3 and reaches the photocurable resin material. As a result, the photocurable resin material is cured, and the second sealing material 52 is produced.

[0296] In this embodiment, as described above, it is possible to make it difficult for a decrease in luminous efficiency caused by the passivation layer 6 and the sealing material 5 in the light emitting device 1 to occur.

[0297] The thickness of the sealing material 5 is, for example, 1 μm or more and 50 μm or less. The thickness of the sealing material 5 is more preferably 20 μm or less, and even more preferably 15 μm or less. In this case, by thinning the sealing material 5, the light emitting device 1 can be thinned, and it is also possible to obtain a light emitting device 1 having flexibility. In order to effectively suppress moisture to the light emitting element 4 by the sealing material 5, the thickness of the sealing material 5 is preferably 3 μm or more, more preferably 5 μm or more, and even more preferably 8 μm or more.

[0298] The thickness of the passivation layer 6 overlapping the sealing material 5 is, for example, 0.1 μm or more and 2 μm or less. When the passivation layer 6 includes the first passivation layer 61 and the second passivation layer 62 as described above, it is preferable that the thickness of each of the first passivation layer 61 and the second passivation layer 62 is 0.1 μm or more and 2 μm or less.

[0299] The use of the composition (X) according to this embodiment is not limited to the preparation of the encapsulant 5 for the light-emitting element 4. The composition (X) can be used to prepare various optical components that transmit light emitted by a light source. For example, the optical component may be a color resist. That is, for example, a phosphor may be contained in the composition (X), and a color resist in a color filter may be prepared from this composition (X). This color filter can be provided in a display device such as an organic EL display or a micro LED display, which is a light-emitting device. EXAMPLES

[0300] 1. Preparation of the Composition Compositions of the examples and comparative examples were prepared by mixing the components shown in the table below.

[0301] The details of the components shown in the table are as follows. The viscosity of each component was measured using a rheometer (Anton Paar Japan, model number DHR-2) at a temperature of 25°C and a shear rate of 1000 s -1 The values ​​were measured under the following conditions. -Dicyclopentanyl acrylate: Viscosity 10 mPa·s, has an -RO- structure. -N,N-Dimethylacrylamide: manufactured by KJ Chemicals, product number DMAA, viscosity 1 mPa s, has an -RN- structure. -Urethane acrylate: manufactured by Daicel Allnex, product number KRM9276, viscosity 30 mPa·s, has an -RN- structure. -Acryloylmorpholine: Viscosity 10 mPa·s, has -RO- and -RN- skeletons. -Tripropylene glycol diacrylate: Viscosity 10 mPa·s, has an -RO- structure. -Polyethylene glycol diacrylate: Viscosity 10 mPa·s, has an -RO- structure. -1,9-Nonanediol diacrylate: Viscosity 10 mPa·s, no -RO- skeleton or -RN- skeleton. -VEEA: 2-(2-vinyloxyethoxy)ethyl acrylate, viscosity 4 mPa·s, glass transition temperature 40℃, boiling point 260℃, -RO- available. -Ditrimethylolpropane tetraacrylate: Viscosity 600 mPa·s, no -RO- skeleton or -RN- skeleton. -Celloxide 8010: manufactured by Daicel, product name: Celloxide 8010, compound shown in formula (1a), viscosity: 60 mPa·s, having neither a -RO- structure nor a -RN- structure. -OXT-221: 3-ethyl-3-{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane (compound shown in formula (3)), manufactured by Toagosei Co., Ltd., product number OXT-221, viscosity 12 mP·s, having an -RO- skeleton. -Celloxide 2021P: 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, a compound shown in formula (1b), viscosity 250 mP·s, having an -RO- skeleton. -1,2,7,8-Octane diepoxy: Viscosity 3mP·s, no -RO- or -RN- structure. -X-40-2669: manufactured by Shin-Etsu Chemical, product number X-40-2669, compound shown in formula (10a-1), viscosity 45 mP·s, no -RO- skeleton or -RN- skeleton. -NBB-ME: Manufactured by ENEOS Corporation, product name NBB-ME, viscosity 13 mPa s, no -RO- structure or -RN- structure. -AL-EOX: manufactured by Yokkaichi Chemical, product name AL-EOX, the compound shown in formula (16) (3-allyloxymethyl-3-ethyloxetane), viscosity 2 mPa s, having an -RO- structure. -Ultraviolet absorber 1: A benzotriazole-based ultraviolet reactive absorber having a cationic polymerizable functional group, as shown in the following formula.

[0302] [ka]

[0303] -Ultraviolet absorber 2: A benzophenone-based reactive ultraviolet absorber having two hydroxyl groups and a cationic polymerizable functional group, as shown in the following chemical formula.

[0304] [ka]

[0305] -Ultraviolet light absorber 3: A benzophenone-based ultraviolet light reactive absorber having one hydroxyl group and a cationic polymerizable functional group, as shown in the following formula.

[0306] [ka]

[0307] -Ultraviolet absorber 4: A benzotriazole-based reactive ultraviolet absorber having a radically polymerizable functional group, as shown in the following formula.

[0308] [ka]

[0309] -Ultraviolet absorber 5: A benzophenone-based reactive ultraviolet absorber having two hydroxyl groups and a radically polymerizable functional group, as shown in the following formula.

[0310] [ka]

[0311] -Ultraviolet absorber 6: A benzophenone-based reactive ultraviolet absorber having one hydroxyl group and a radically polymerizable functional group, as shown in the following formula.

[0312] [ka]

[0313] -UV absorber 7: BASF Japan Ltd., product name Tinuvin 970, a triazine-based UV absorber without reactive functional groups. -Ultraviolet absorber 8: Yamada Chemical Industry Co., Ltd., product number FDB-009, a diazine-based ultraviolet absorber having no reactive functional group. -Ultraviolet absorber 9: BONASORB3912, manufactured by Orient Chemical Industries Co., Ltd., an indole-based ultraviolet absorber having no reactive functional groups. -Ultraviolet absorber 10: BONASORB3701, manufactured by Orient Chemical Industries Co., Ltd., an azomethine-based ultraviolet absorber having no reactive functional group. -Ultraviolet absorber 11: ADEKA Corporation, product number LA-46, triazine-based ultraviolet absorber having no reactive functional group, molecular weight 512. -Omnirad TPO H: Manufactured by IGM Resins BV, product name Omnirad TPO H, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, photobleachable. CPI-210S: San-Apro Ltd., product name CPI-210S, a salt of a triarylsulfonate type cation represented by formula (64) and a (perfluoroalkyl)fluorophosphate anion. -UVS-1331: Kawasaki Kasei Chemical Industries, Ltd., product name: Anthracure UVS-1331, shown in formula (701), R 10 All of these anthracene sensitizers contain n-butyl groups. -UVS-107: Kawasaki Kasei Chemical Industries, Ltd., product name: Anthracure UVS-107, shown in formula (701), R 10 All of these are anthracene sensitizers which are isopropyloxycarbonylmethylene.

[0314] 2.Evaluation Test The following evaluation tests were carried out on the examples and comparative examples, and the results are shown in the table below.

[0315] (1) Viscosity The viscosity of the composition was measured using a rheometer (Anton Paar Japan, model number DHR-2) at a temperature of 25 °C and a shear rate of 1000 s -1 The measurements were performed under the following conditions.

[0316] (2) Curability (395nm) The composition was measured with an infrared spectrometer (Agilent Technologies, Model No. Agilent Cary 610 FTIR Microscope System) to obtain an IR spectrum.

[0317] The composition was applied to prepare a coating film having a thickness of 10 μm, and the coating film was irradiated with light having a peak wavelength of 395 nm at an irradiation intensity of 3 W / cm using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD). 2 And the cumulative light output is 0.9 J / cm 2 The composition (cured product) after irradiation with ultraviolet light was then measured using the infrared spectrometer described above to obtain an IR spectrum.

[0318] The peak intensity of the absorption of the reactive functional group was measured in each of the two IR spectra. The reduction rate of the reactive functional group in the composition before and after irradiation with ultraviolet light was calculated using the formula {1-(I0-I1) / I0}×100(%) from the peak intensity I0 for the coating film and the peak intensity I1 for the cured product. The result was taken as the reaction rate.

[0319] In addition, the absorption of reactive functional groups is 885 cm in Examples 1 to 16 and Comparative Examples 1 and 2. -1 In Examples 17 to 36 and Comparative Example 3, the absorption at 810 cm -1 This is the absorption of the acryloyl group that appears in the photo.

[0320] The results were evaluated as follows: A: Over 90%. B: 80% or more, less than 90% C: Less than 80%.

[0321] (3) Inkjet compatibility The composition was placed in the cartridge of an inkjet printer (Fujifilm, Model DMP2831), and droplets of the composition were ejected from the nozzle of the inkjet printer under conditions of a temperature of 30° C. and a frequency of 1 kHz. The droplets were observed with a high-speed camera and evaluated as follows. As a result, the following evaluation was performed: when the droplets did not separate, it was rated as "A"; when the satellites separated from the original droplets and then merged with the original droplets to form a single droplet again, it was rated as "B"; and when the satellites separated from the original droplets and did not merge, it was rated as "C."

[0322] (4) Glass transition temperature The composition was applied to prepare a coating film, and the coating film was irradiated with light having a peak wavelength of 395 nm at an irradiation intensity of 3 W / cm using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD) in an air atmosphere. 2 And the cumulative light output is 1.5J / cm 2 The coating was photocured by irradiating under the conditions of , and a film with a thickness of 500 μm was produced. The glass transition temperature of a sample cut from this film was measured using a viscoelasticity measuring device (manufactured by Hitachi High-Tech Science Corporation, model number DMA7100).

[0323] (5) Transmittance The composition was applied to prepare a coating film, and the coating film was irradiated with light having a peak wavelength of 395 nm using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD) at an irradiation intensity of 3 W / cm. 2 And the cumulative light output is 1.5J / cm 2 The coating was photocured by irradiating it under the above conditions to produce a film with a thickness of 15 μm.

[0324] The transmittance of this film at light wavelengths of 430 nm and 400 nm was measured using a spectrophotometer (manufactured by Nippon Denshoku Industries Co., Ltd., model number SD7000).

[0325] (6) Bleed-out evaluation The composition was applied to prepare a coating film, and the coating film was irradiated with light having a peak wavelength of 395 nm using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD) at an irradiation intensity of 3 W / cm. 2 And the cumulative light output is 1.5J / cm 2 The coating was photocured by irradiating the film under the conditions of 85°C and 85% relative humidity for 500 hours, and then the film was visually observed. The film was rated as A if there were no speckled patterns on the surface, B if speckles were found in some areas such as the film edges, and C if speckles were found over the entire surface.

[0326] (7) Outgassing evaluation The outgassing when the cured product of the composition was heated was sampled by the headspace method and measured by gas chromatography. In detail, 100 mg of the composition was placed in a headspace vial with a volume of 22 mL. Next, the composition was irradiated with light of a peak wavelength of 395 nm at an irradiation intensity of 3 W / cm using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD) in an air atmosphere. 2 And the cumulative light output is 1.5J / cm 2 The composition was cured by irradiating the composition under the conditions of 100°C, and the vial was then sealed. The composition was then heated at 100°C for 30 minutes, and the gas phase in the vial was then introduced into a gas chromatograph for analysis. As a result, the concentration of outgassing generated from the composition was determined based on the peak area of ​​the resulting gas chromatogram. The concentration of outgassing is the volume fraction of outgassing in the gas phase of the vial relative to the volume of the vial (22 mL).

[0327] The outgas concentrations were determined using toluene as a reference substance. Specifically, two reference samples with toluene concentrations of 1000 ppm and 100 ppm were prepared by volatilizing toluene in a vial. Each reference sample was introduced into a gas chromatograph for analysis. From the peak areas of the two chromatograms obtained in this way, the relationship between the peak area and the concentration was determined, and the above outgas concentrations were determined based on these results.

[0328] The results were evaluated as follows: A: Concentration 200ppm or less. B: Concentration more than 200ppm and less than 300ppm. C: Concentration over 300ppm.

[0329] (8) Storage property The composition was stored for 336 hours at 60° C. As a result, the composition was rated as "A" when there was no change in color and viscosity, "B" when at least one of yellowing and gelation was observed, and "C" when the composition did not harden after storage.

[0330] (9) Device evaluation A 30 mm square glass substrate (700 μm thick) with an ITO electrode was washed with acetone and then isopropanol. The following compounds were then deposited in order to form thin films by vacuum deposition to obtain a substrate with a 2 mm square organic EL element consisting of an anode, hole injection layer, hole transport layer, light emitting layer, electron injection layer, and cathode. The composition of each layer is as follows: Anode ITO, anode thickness 150nm Hole injection layer: 4,4',4”-tris{2-naphthyl(phenyl)amino}triphenylamine (2-TNATA) Hole transport layer: N,N'-diphenyl-N,N'-dinaphthylbenzidine (α-NPD) Light-emitting layer: Tris(8-hydroxyquinolinato)aluminum (metal complex material). The thickness of the light-emitting layer is 1000 Å. The light-emitting layer also functions as an electron transport layer. Electron injection layer: Lithium fluoride Cathode Aluminum Film thickness 150nm Thereafter, a mask (cover) having an opening of 10 mm×10 mm was placed so as to cover the organic EL element of 2 mm×2 mm, and a SiN film was formed by plasma CVD.

[0331] Next, the composition was applied to a thickness of 10 μm using an inkjet device under a nitrogen atmosphere so as to cover an organic EL element of 2 mm × 2 mm, and the peak wavelength was 395 nm and the irradiation intensity was 3 W / cm 2 And the cumulative light output is 1.5J / cm 2 The composition was cured under the conditions described above, thereby producing an encapsulant.

[0332] Next, a mask (cover) having an opening of 10 mm×10 mm was placed so as to cover the entire sealing material, and a SiN film was formed by plasma CVD.

[0333] The thickness of the formed SiN film (inorganic film) was about 1 μm. The SiN film was then attached to a 30 mm × 30 mm × 0.7 mmt non-alkali glass (Corning Eagle XG) using a 30 mm × 30 mm × 25 μmt transparent substrate-less double-sided tape to produce an organic EL light-emitting device.

[0334] Immediately after fabrication, the organic EL light-emitting device was exposed to conditions of 85°C and 85% relative humidity for 70 hours, after which a voltage of 6 V was applied, and the light-emitting state of the organic EL element was observed visually and with a microscope, and the diameter of the dark spots was measured.

[0335] The diameter of the dark spots can be regarded as an index for evaluating the degree of penetration of the encapsulant into the pinholes in the passivation layer and the degree to which the moisture in the encapsulant is discharged as outgassing. The diameter of the dark spots was evaluated as "C" for over 50 μm and 300 μm or less, "B" for 50 μm or less, and "A" for the absence of dark spots.

[0336] (10) Device evaluation (Sunshine Weather Meter) The light resistance evaluation test of the device prepared in (9) above was performed using a Sunshine Weather Meter (manufactured by Suga Test Instruments Co., Ltd., model number S80HB) under the conditions of an integrated light intensity of 236 W / m2, a black panel temperature of 63°C, and a test time of 400 hours. As a result, the device was rated as "A" when the luminance of the device was 90% or more compared to the initial value, "B" when it was 80% or more but less than 90%, and "C" when it was less than 80%.

[0337] [Table 1]

[0338] [Table 2]

[0339] [Table 3]

[0340] [Table 4] < / laquatwin>

Claims

1. The composition contains a photopolymerizable compound (A), a photopolymerization initiator (B), an ultraviolet absorber (C), and a sensitizer (D), The photopolymerizable compound (A) contains a monofunctional photopolymerizable compound (A011), the percentage of the monofunctional photopolymerizable compound (A011) relative to the solid content is 10% by mass or more and 40% by mass or less; The photopolymerizable compound (A) contains a cationic polymerizable compound, The photopolymerization initiator (B) contains a salt having a (perfluoroalkyl)fluorophosphate anion. To produce an optical component that transmits light emitted by a light source, Photocurable resin composition.

2. The photopolymerizable compound (A) further contains a polyfunctional photopolymerizable compound (A012), The percentage of the polyfunctional photopolymerizable compound (A012) relative to the solid content is 50% by mass or more. The photocurable resin composition according to claim 1.

3. The ultraviolet absorber (C) contains at least one selected from the group consisting of a benzotriazole-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, an azomethine-based ultraviolet absorber, an indole-based ultraviolet absorber, a diazine-based ultraviolet absorber, a triazine-based ultraviolet absorber, a pyrazolidinedione-based ultraviolet absorber, and an ethylene-based ultraviolet absorber. The photocurable resin composition according to claim 1 or 2.

4. The sensitizer (D) contains an anthracene-based sensitizer. The photocurable resin composition according to claim 1 or 2.

5. The anthracene-based sensitizer has an anthracene skeleton and an —O—R １０ and an anthracene-based sensitizer (D1) having a group represented by The R １０ is an organic group having no reactive group, １０ The number of atoms constituting the longest linear chain bonded to O is 1 to 10. The photocurable resin composition according to claim 4.

6. A coating film having a thickness of 10 μm was prepared from the photocurable resin composition, and the coating film was irradiated with light having a peak wavelength of 395 nm at an irradiation intensity of 3 W / cm. ２ And the cumulative light amount is 0.9 J / cm ２ When the photopolymerizable compound (A) is irradiated under the above conditions, the reaction rate of the photopolymerizable compound (A) is 80% or more. The photocurable resin composition according to claim 1 .

7. A cured product having a thickness of 10 μm obtained by curing the photocurable resin composition has a transmittance of light having a wavelength of 400 nm of 30% or less. The photocurable resin composition according to claim 1 .

8. The transmittance of light having a wavelength of 430 nm of a cured product having a thickness of 10 μm obtained by curing the photocurable resin composition is 70% or more. The photocurable resin composition according to claim 7.

9. The rate of outgassing generated when the cured product of the photocurable resin composition is heated at 100° C. for 30 minutes is 300 ppm or less. The photocurable resin composition according to claim 1 .

10. The photopolymerizable compound (A) contains a radical polymerizable compound, The photopolymerization initiator (B) contains a photopolymerization initiator (B1) having photobleachability. The photocurable resin composition according to claim 1 .

11. The photocurable resin composition according to claim 10, wherein the photopolymerization initiator (B1) contains an acylphosphine oxide-based photopolymerization initiator.

12. The glass transition temperature of the cured product is 75° C. or higher. The photocurable resin composition according to claim 1 .

13. At least one of the viscosity at 25°C and the viscosity at 40°C is 30 mPa·s or less; The photocurable resin composition according to claim 1 .

14. It is formed by ejecting using the inkjet method. The photocurable resin composition according to claim 1 .

15. A cured product of the photocurable resin composition according to any one of claims 1 to 14. Optical components.

16. A method for producing a photocurable resin composition according to any one of claims 1 to 14, comprising molding the photocurable resin composition by an inkjet method, and then irradiating the photocurable resin composition with light to cure it. A method for manufacturing optical components.

17. A light source and an optical component that transmits light emitted by the light source, the optical component including a cured product of the photocurable resin composition according to any one of claims 1 to 14. Light emitting device.

18. A method for manufacturing a light emitting device comprising a light source and an optical component that transmits light emitted by the light source, comprising the steps of: The optical component is manufactured by the method of claim 16. A method for manufacturing a light emitting device.

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