Substrate Processing Equipment

Abstract

To suppress a decrease in throughput caused by substrate transport in a substrate processing apparatus including a processing portion that performs peripheral portion processing and an inspection portion that inspect the peripheral portion of a substrate.SOLUTION: A substrate processing apparatus includes a plurality of first transfer portions, a plurality of second transfer portions, a plurality of processing blocks, a plurality of inspection portions, a plurality of paired inspection portion transport devices, a paired cassette transport device, and an inter-transfer portion transport device. The plurality of blocks, each including one first transfer portion and one inspection portion, the plurality of second transfer portions, and the plurality of paired inspection portion transport devices are stacked in multiple stages corresponding to the plurality of processing blocks. The inter-transfer portion transport device is movable in the vertical direction and can access the second transfer portion corresponding to each processing block.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus. [Background technology]

[0002] 2. Description of the Related Art Conventionally, substrate processing apparatuses have been known that include a processing section for processing the peripheral portion of a substrate such as a silicon wafer or a compound semiconductor wafer.

[0003] In some cases, this type of substrate processing apparatus is provided with an inspection unit that inspects the peripheral edge of the substrate to check whether the peripheral edge of the substrate has been properly processed.

[0004] Patent document 1 discloses a substrate processing apparatus in which the above-mentioned inspection unit is arranged in a transfer station located between a loading / unloading station where substrates are loaded and unloaded into a cassette, and a processing station where edge removal processing is performed. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2019-062011 A Summary of the Invention [Problem to be solved by the invention]

[0006] The present disclosure provides a technique capable of suppressing a decrease in throughput caused by substrate transport in a substrate processing apparatus including a processing section that performs peripheral portion processing and an inspection section that inspects the peripheral portion of a substrate. [Means for solving the problem]

[0007] A substrate processing apparatus according to an embodiment of the present disclosure includes a plurality of first transfer sections, a plurality of second transfer sections, a plurality of processing blocks, a plurality of inspection sections, a plurality of counter-inspection section transport devices, a counter-cassette transport device, and an inter-transfer section transport device. The plurality of first transfer sections are placed with substrates to be transported to and from a cassette capable of accommodating a plurality of substrates. The plurality of second transfer sections are placed with substrates to be transported to and from a processing section that processes a peripheral portion of the substrate. The plurality of processing blocks are stacked in multiple stages, and each includes a processing section and a counter-processing section transport device that transports the substrate between the second transfer section and the processing section. The plurality of inspection sections inspect the processing state of the peripheral portion of the substrate. The counter-inspection section transport device removes the substrate from the second transfer section and transports it to the inspection section, and removes the substrate from the inspection section and transports it to the first transfer section. The counter-cassette transport device transports the substrate between the cassette and the first transfer section. The inter-transportation unit transport device removes the substrate from the first transfer unit and transports it to the second transfer unit. The multiple blocks, each including one first transfer unit and one inspection unit, the multiple second transfer units, and the multiple inter-inspection unit transport devices are stacked in multiple stages corresponding to the multiple processing blocks. The inter-transportation unit transport device is movable in the vertical direction and can access the second transfer unit corresponding to each processing block. Effect of the Invention

[0008] According to the present disclosure, it is possible to improve throughput in a substrate processing apparatus including a processing section that performs peripheral portion processing and an inspection section that inspects the peripheral portion of a substrate. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a layout diagram of a substrate processing system according to a first embodiment, as viewed from above. [Diagram 2] FIG. 2 is a layout diagram of the substrate processing system according to the first embodiment as viewed from the side. [Diagram 3] FIG. 3 is a layout diagram of the substrate processing system according to the first embodiment as viewed from the side. [Figure 4] FIG. 4 is a layout diagram of the substrate processing system according to the first embodiment, as viewed from the rear. [Diagram 5] FIG. 5 is a schematic diagram of the peripheral processing unit. [Figure 6] FIG. 6 is a schematic diagram of the first delivery section and the inspection section as viewed from the side. [Figure 7] FIG. 7 is a schematic diagram of the inspection unit according to the first embodiment as viewed from above. [Figure 8] FIG. 8 is a schematic diagram of the inspection unit according to the first embodiment as viewed from the side. [Figure 9] FIG. 9 is a schematic diagram of the first imaging sub-unit and the second imaging sub-unit as viewed obliquely from above. [Figure 10] FIG. 10 is a schematic diagram of the first imaging sub-unit and the second imaging sub-unit as viewed obliquely from above. [Figure 11] FIG. 11 is a schematic side view of the first imaging sub-unit. [Figure 12] FIG. 12 is a flowchart showing the procedure of the process executed by the substrate processing system according to the first embodiment. [Figure 13] FIG. 13 is a diagram showing a wafer transfer flow in the substrate processing system according to the first embodiment. [Figure 14] FIG. 14 is a diagram showing a wafer transfer flow in the substrate processing system according to the first embodiment. [Figure 15] FIG. 15 is a diagram showing a wafer transfer flow in the substrate processing system according to the first embodiment. [Figure 16] FIG. 16 is a layout diagram of the substrate processing system according to the second embodiment, as viewed from above. [Figure 17] FIG. 17 is a layout diagram of the substrate processing system according to the second embodiment as viewed from the side. [Figure 18] FIG. 18 is a layout diagram of the transfer station of the substrate processing system according to the second embodiment, seen from the rear. [Figure 19] FIG. 19 is a schematic diagram of an inspection unit according to the second embodiment as viewed from above. [Figure 20] FIG. 20 is a schematic diagram of the first passing portion according to the second embodiment as viewed from above. [Figure 21] FIG. 21 is a schematic diagram of the second passing portion according to the second embodiment as viewed from above. [Figure 22] FIG. 22 is a diagram showing a wafer transfer flow in the substrate processing system according to the second embodiment. [Diagram 23] FIG. 23 is a diagram showing a wafer transfer flow in the substrate processing system according to the second embodiment. [Figure 24] FIG. 24 is a diagram showing a wafer transfer flow in the substrate processing system according to the second embodiment. [Diagram 25] FIG. 25 is a layout diagram of the substrate processing system according to the third embodiment, as viewed from above. [Figure 26] FIG. 26 is a layout diagram of the substrate processing system according to the third embodiment as viewed from the side. [Figure 27] FIG. 27 is a layout diagram of the substrate processing system according to the third embodiment as viewed from the side. [Figure 28] FIG. 28 is a diagram showing a wafer transfer flow in the substrate processing system according to the third embodiment. [Figure 29] FIG. 29 is a diagram showing a wafer transfer flow in the substrate processing system according to the third embodiment. [Diagram 30] FIG. 30 is a diagram showing a wafer transfer flow in the substrate processing system according to the first modified example. [Diagram 31] FIG. 31 is a diagram showing a wafer transfer flow in the substrate processing system according to the first modified example. [Diagram 32] FIG. 32 is a cross-sectional view of the full surface inspection unit according to the first modified example, as viewed from above. [Diagram 33] FIG. 33 is a cross-sectional side view of the full surface inspection unit according to the first modified example. [Diagram 34] FIG. 34 is a layout diagram of the substrate processing system according to the second modified example, as viewed from above. [Diagram 35] FIG. 35 is a schematic diagram of a lower surface processing unit according to a second modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a mode for carrying out a substrate processing apparatus according to the present disclosure (hereinafter, referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the present disclosure is not limited to the embodiment. Moreover, each embodiment can be appropriately combined within a range that does not cause a contradiction in the processing contents. Moreover, the same parts in each of the following embodiments are given the same reference numerals, and duplicated explanations will be omitted.

[0011] In addition, in the embodiments described below, expressions such as "constant", "orthogonal", "vertical" and "parallel" may be used, but these expressions do not necessarily mean "constant", "orthogonal", "vertical" and "parallel" strictly. In other words, each of the above expressions allows for deviations due to, for example, manufacturing accuracy and installation accuracy.

[0012] In addition, in the drawings referred to below, for ease of understanding, an orthogonal coordinate system may be shown in which the X-axis, Y-axis, and Z-axis directions are defined as being orthogonal to each other, and the Z-axis positive direction is the vertically upward direction. Also, the direction of rotation about the vertical axis may be referred to as the θ direction.

[0013] (First embodiment) <Configuration of the substrate processing system> First, the configuration of the substrate processing system according to the first embodiment will be described with reference to Figs. 1 to 4. Fig. 1 is a layout diagram of the substrate processing system according to the first embodiment as viewed from above. Figs. 2 and 3 are layout diagrams of the substrate processing system according to the first embodiment as viewed from the side. Fig. 2 omits various transport devices and mainly shows the arrangement of the first delivery section 14, the inspection section 15, and the peripheral processing unit 19. Fig. 3 mainly shows the arrangement of each main transport device. Fig. 4 is a layout diagram of the substrate processing system according to the first embodiment as viewed from the rear.

[0014] As shown in FIG. 1, a substrate processing system 1 according to the first embodiment includes a load / unload station 2 and a processing station 4.

[0015] In the carry-in / out station 2, a substrate such as a semiconductor wafer (hereinafter referred to as a wafer W) is removed from a cassette C and transferred to the processing station 4. Then, in the processing station 4, processing of the wafer W is performed. Specifically, in the processing station 4, peripheral processing is performed to process the peripheral portion of the wafer W.

[0016] Thereafter, the wafer W is transferred from the processing station 4 to the load / unload station 2 and accommodated in the cassette C. At this time, in the load / unload station 2, before the wafer W is accommodated in the cassette C, an inspection process is performed to inspect the peripheral portion of the wafer W to check whether the film on the peripheral portion of the wafer W has been appropriately removed.

[0017] (Loading / unloading station) The loading / unloading station 2 includes a cassette placement section 11 and a transfer chamber 12. On the cassette placement section 11, a plurality of cassettes C are placed, each of which accommodates a plurality of wafers W in a horizontal state.

[0018] The transfer chamber 12 is disposed between the cassette placement section 11 and the processing station 4. As shown in Figs. 1 to 3, the transfer chamber 12 includes a first transfer device 13 (an example of a device for transferring cassettes), a plurality of first delivery sections 14, a plurality of inspection sections 15, and a plurality of second transfer devices 16 (devices for transferring inspection sections).

[0019] The first transfer device 13 transfers wafers W in and out between the cassette C and the first transfer section 14. The first transfer device 13 has a plurality of support sections that support one wafer W from below. For example, the first transfer device 13 has three or more support sections. The first transfer device 13 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and can transfer a plurality of wafers W collectively between the cassette C and the first transfer section 14. As shown in FIG. 3, one first transfer device 13 is disposed in the transfer chamber 12.

[0020] The plurality of first transfer parts 14 receive wafers W to be transferred into or out of the cassette C. That is, the plurality of first transfer parts 14 receive wafers W to be transferred out of the cassette C and wafers W to be transferred into the cassette C. Each of the first transfer parts 14 can accommodate a plurality of wafers W in multiple stages along the vertical direction.

[0021] The inspection units 15 inspect the processing state of the peripheral portion of the wafer W. A specific configuration of the inspection units 15 will be described later.

[0022] One first transfer section 14 and one inspection section 15 are stacked in the height direction. In the substrate processing system 1, blocks including the first transfer section 14 and the inspection section 15 are stacked in stages in the height direction. Specifically, the processing station 4 described later has an upper processing block 4U, a middle processing block 4M, and a lower processing block 4L stacked in multiple stages. The blocks including the first transfer section 14 and the inspection section 15 are arranged at a position corresponding to the upper processing block 4U, and at positions corresponding to the middle processing block 4M and the lower processing block 4L, one each.

[0023] Here, an example is shown in which the inspection unit 15 is disposed below the first delivery unit 14, but the first delivery unit 14 may be disposed below the inspection unit 15.

[0024] The second transfer devices 16 are provided in multiple stages corresponding to the blocks each including a first transfer section 14 and an inspection section 15. Each second transfer device 16 takes out a wafer W from the inspection section 15 arranged in the corresponding block, and carries it into the first transfer section 14 arranged in the corresponding block.

[0025] The second transfer device 16 is disposed to the side of the first transfer section 14. Specifically, the second transfer device 16 is adjacent to the first transfer section 14 in a horizontal direction (Y-axis direction) perpendicular to the arrangement direction (X-axis direction) of the loading / unloading station 2 and the processing station 4. Note that the first transfer device 13 and a third transfer device 18 described later are adjacent to the first transfer section 14 in the X-axis direction.

[0026] The second transfer device 16 has a plurality of support parts that support one wafer W from below. For example, the second transfer device 16 has two support parts and can load and unload the wafer W at each support part. The second transfer device 16 can move in the vertical direction and can transfer the wafer W between the first delivery part 14 and the inspection part 15 that are stacked vertically.

[0027] (Processing Station) 2 to 4, the processing station 4 includes an upper processing block 4U, a middle processing block 4M, and a lower processing block 4L. The upper processing block 4U, middle processing block 4M, and lower processing block 4L are spatially separated by partitions, shutters, or the like, and are arranged side by side in the height direction.

[0028] The upper processing block 4U, the middle processing block 4M and the lower processing block 4L have the same configuration. Specifically, each of the processing blocks 4U, 4M, and 4L includes a transfer chamber 17 and a plurality of peripheral processing units 19, as shown in FIG.

[0029] The transfer chamber 17 is provided adjacent to the transfer chamber 12 of the load-unload station 2. Specifically, the transfer chamber 17 is provided adjacent to the first delivery section 14 arranged in the transfer chamber 12. Furthermore, a plurality of peripheral processing units 19 are arranged on both sides (Y-axis positive direction and Y-axis negative direction) of the transfer chamber 17.

[0030] For example, in the illustrated example, two peripheral processing units 19 are arranged side by side along the X-axis direction on the positive Y-axis side of the transfer chamber 17. In addition, two peripheral processing units 19 are arranged side by side along the X-axis direction on the negative Y-axis side of the transfer chamber 17. Therefore, a total of four peripheral processing units 19 are arranged in each of the upper processing block 4U, middle processing block 4M and lower processing block 4L.

[0031] A third transfer device 18 (an example of a transfer device for a processing section) is disposed in the transfer chamber 17, which transfers the wafer W between the first transfer section 14 and the peripheral processing unit 19. The third transfer device 18 includes a plurality of support sections that support one wafer W from below. For example, the third transfer device 18 includes two support sections, and the wafer W can be transferred in and out for each support section.

[0032] The third transfer device 18 is capable of moving in horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the first transfer section 14 and the peripheral processing unit 19 corresponding to the same processing block 4U, 4M, 4L. The third transfer device 18 according to the first embodiment also transfers the wafer W processed in the peripheral processing unit 19 to the inspection section 15.

[0033] The peripheral portion processing unit 19 performs peripheral portion processing to process the peripheral portion of the wafer W. Specifically, the peripheral portion processing unit 19 performs peripheral portion removal processing to etch away a film from the bevel portion of the wafer W. Here, the bevel portion refers to an inclined portion formed on the edge face of the wafer W and its periphery. The inclined portions are formed on the upper and lower peripheral portions of the wafer W, respectively.

[0034] The edge processing does not necessarily have to be a process for removing a film. For example, the edge processing unit 19 may perform an edge cleaning process for cleaning the bevel portion of the wafer W as the edge processing.

[0035] Here, a configuration example of the peripheral area processing unit 19 will be described with reference to Fig. 5. Fig. 5 is a schematic diagram of the peripheral area processing unit 19.

[0036] As shown in FIG. 5, the edge processing unit 19 includes a chamber 81, a substrate holding mechanism 82, a supply unit 83, and a collection cup 84.

[0037] The chamber 81 accommodates a substrate holding mechanism 82, a supply unit 83, and a collection cup 84. An FFU (Fun Filter Unit) 811 that forms a downflow within the chamber 81 is provided on the ceiling of the chamber 81.

[0038] The substrate holding mechanism 82 includes a holder 821 that holds the wafer W horizontally, a support member 822 that extends vertically and supports the holder 821, and a drive unit 823 that rotates the support member 822 around a vertical axis.

[0039] The holding part 821 is connected to a suction device (not shown) such as a vacuum pump, and horizontally holds the wafer W by utilizing negative pressure generated by the suction device to adsorb the lower surface of the wafer W. As the holding part 821, for example, a porous chuck, an electrostatic chuck, or the like can be used.

[0040] The holder 821 has a suction area having a smaller diameter than the wafer W. This allows a chemical liquid discharged from a lower nozzle 832 of a supply unit 83, which will be described later, to be supplied to the peripheral portion of the lower surface of the wafer W.

[0041] The supply unit 83 includes an upper nozzle 831 and a lower nozzle 832. The upper nozzle 831 is disposed above the wafer W held by the substrate holding mechanism 82, and the lower nozzle 832 is disposed below the wafer W.

[0042] A chemical liquid supply source 73 is connected to the upper nozzle 831 and the lower nozzle 832 via a valve 71 and a flow rate regulator 72. The upper nozzle 831 ejects a chemical liquid such as hydrofluoric acid (HF) or nitric acid (HNO3) supplied from the chemical liquid supply source 73 onto the peripheral portion of the upper surface of the wafer W held by the substrate holding mechanism 82. The lower nozzle 832 ejects the chemical liquid supplied from the chemical liquid supply source 73 onto the peripheral portion of the lower surface of the wafer W held by the substrate holding mechanism 82.

[0043] Furthermore, the supply unit 83 includes a first moving mechanism 833 that moves the upper nozzle 831, and a second moving mechanism 834 that moves the lower nozzle 832. By moving the upper nozzle 831 and the lower nozzle 832 using the first moving mechanism 833 and the second moving mechanism 834, the supply position of the chemical liquid with respect to the wafer W can be changed.

[0044] Recovery cup 84 is disposed so as to surround substrate holding mechanism 82. A drain port 841 for discharging the chemical solution supplied from supply unit 83 to the outside of chamber 81, and an exhaust port 842 for exhausting the atmosphere within chamber 81 are formed at the bottom of recovery cup 84.

[0045] The periphery processing unit 19 is configured as described above, and after the lower surface of the wafer W is suction-held by the holder 821, the wafer W is rotated using the drive unit 823. Then, the periphery processing unit 19 ejects a chemical solution from the upper nozzle 831 toward the upper peripheral portion of the rotating wafer W, and ejects the chemical solution from the lower nozzle 832 toward the lower peripheral portion of the rotating wafer W. This removes a film adhering to the bevel portion of the wafer W. At this time, contaminants such as particles adhering to the bevel portion of the wafer W are also removed together with the film.

[0046] After performing the above-described peripheral portion removal process, the peripheral portion processing unit 19 may perform a rinsing process in which a rinsing liquid such as pure water is discharged from the upper nozzle 831 and the lower nozzle 832 to wash away the chemical liquid remaining on the bevel portion of the wafer W. Furthermore, after the rinsing process, the peripheral portion processing unit 19 may perform a drying process in which the wafer W is dried by rotating the wafer W.

[0047] 1, the substrate processing system 1 includes a control device 6. The control device 6 is, for example, a computer, and includes a control unit 61 and a storage unit 62. The storage unit 62 stores programs that control various processes executed in the substrate processing system 1. The control unit 61 is, for example, a CPU (Central Processing Unit), and controls the operation of the substrate processing system 1 by reading and executing the programs stored in the storage unit 62.

[0048] The above program may be recorded in a computer-readable storage medium and installed from the storage medium into the storage unit 62 of the control device 6. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card. The control unit 61 may be configured only with hardware without using a program.

[0049] In the peripheral edge removal process, a removal width of the film (a width along the radial direction of the wafer W with the outer peripheral edge of the wafer W as one end, hereinafter referred to as the "cut width") is specified. However, for example, if the positions of the upper nozzle 831 and the lower nozzle 832 are not appropriate, the actual cut width may deviate from the specified cut width. Also, if the center of the wafer W is deviated from the center of rotation of the substrate holding mechanism 82, there is a risk of unevenness in the cut width in the circumferential direction of the wafer W. For this reason, the wafer W after the peripheral edge removal process may be photographed by a camera, and an operation may be performed to check whether the peripheral edge removal process has been performed appropriately based on the obtained image.

[0050] In the substrate processing system 1 according to the first embodiment, an inspection section 15 for inspecting the bevel portion of the wafer W after the peripheral edge removal process is provided outside the peripheral edge processing unit 19 and shared by the multiple peripheral edge processing units 19.

[0051] <Testing Department Configuration> Hereinafter, the configuration of the inspection unit 15 according to the first embodiment will be specifically described with reference to FIGS.

[0052] Fig. 6 is a schematic side view of the first delivery section 14 and the inspection section 15. As shown in Fig. 6, the inspection section 15 is provided adjacent to the first delivery section 14 below the first delivery section 14.

[0053] In this manner, by arranging the first passing part 14 and the inspection part 15 so as to be stacked in the height direction, it is possible to suppress an increase in the footprint of the substrate processing system 1. Furthermore, by arranging the inspection part 15 below the first passing part 14, even if dust or the like falls from the inspection part 15, it is possible to suppress the fallen dust or the like from adhering to the wafer W placed on the first passing part 14.

[0054] Fig. 7 is a schematic diagram of the inspection unit 15 according to the first embodiment as viewed from above, and Fig. 8 is a schematic diagram of the inspection unit 15 according to the first embodiment as viewed from the side. Note that in Fig. 8, the notch detection subunit 300 is omitted.

[0055] As shown in FIG. 7, the inspection section 15 includes a base plate 100, a rotating and holding subunit 200 (an example of a rotating and holding section), a notch detection subunit 300 (an example of a detection section), a first imaging subunit 400, and a second imaging subunit 500.

[0056] In the substrate processing system 1 according to the first embodiment, of the first transfer device 13, the second transfer device 16, and the third transfer device , the second transfer device 16 and the third transfer device have access to the inspection unit 15.

[0057] Specifically, the inspection section 15 includes an entrance section 110 and an exit section 120 that open in different directions. The entrance section 110 opens toward the transfer chamber 17, and the exit section 120 opens toward the second transfer device 16. The third transfer device 18 carries the wafer W into the inspection section 15 via the entrance section 110, and the second transfer device 16 carries the wafer W out of the inspection section 15 via the exit section 120.

[0058] The base plate 100 is, for example, a plate-shaped member, and each of the subunits 200 to 500 is provided on the base plate 100 .

[0059] The rotary holding subunit 200 includes a holding table 201 and an actuator 202. The holding table 201 is, for example, a suction chuck that holds the wafer W horizontally by suction or the like. The holding table 201 has a suction area with a smaller diameter than the wafer W. The actuator 202 is, for example, an electric motor, and drives the holding table 201 to rotate.

[0060] The notch detection subunit 300 detects the position of a notch formed in the wafer W. For example, the notch detection subunit 300 has a horizontal groove (not shown). A light emitting element is provided on the lower surface of the horizontal groove, and a light receiving element is provided on the upper surface. When the wafer W is placed on the rotating and holding subunit 200, the light emitted from the light emitting element is blocked by the peripheral edge of the wafer W, and the light receiving element does not receive the light. However, when the notch formed on the peripheral edge of the wafer W comes to a position facing the light emitting element due to rotation by the rotating and holding subunit 200, the light passes through the notch and is received by the light receiving element. This allows the notch detection subunit 300 to detect the position of the notch formed in the wafer W.

[0061] Figures 9 and 10 are schematic diagrams of the first imaging subunit 400 and the second imaging subunit 500 as viewed obliquely from above. Also, Figure 11 is a schematic diagram of the first imaging subunit 400 as viewed from the side, and Figure 11 is a schematic diagram of the illumination module 420 and the mirror member 430 as viewed from the side.

[0062] As shown in FIGS. 7 to 11, the first imaging sub-unit 400 includes a camera 410 (an example of a one-surface imaging section), an illumination module 420, and a mirror member 430.

[0063] The camera 410 includes a lens 411 and an imaging element 412. The optical axis of the camera 410 extends horizontally toward the lighting module 420.

[0064] The illumination module 420 is disposed above the wafer W held on the holder 201. The illumination module 420 includes a light source 421, a light scattering member 422, and a holding member 423.

[0065] The light source 421 includes, for example, a housing 421a and a plurality of LED point light sources 421b (only one of which is shown in FIG. 11) arranged in the housing 421a. The plurality of LED point light sources 421b are arranged in a line along the radial direction of the wafer W.

[0066] Light scattering member 422 is connected to light source 421 so as to overlap light source 421. Light scattering member 422 is formed with through-hole 422a extending in the direction in which light source 421 and light scattering member 422 overlap. The inner wall surface of through-hole 422a is mirror-finished. As a result, when light from light source 421 enters through-hole 422a of light scattering member 422, the incident light is diffused by mirror surface portion 422b in through-hole 422a, generating scattered light.

[0067] Holding member 423 is connected to light scattering member 422 so as to overlap light scattering member 422. Holding member 423 is formed with through hole 423a and cross hole 423b intersecting through hole 423a. Through hole 423a extends in a direction in which light scattering member 422 and holding member 423 overlap. Cross hole 423b communicates with through hole 423a.

[0068] The holding member 423 holds therein a half mirror 424, a cylindrical lens 425, a light diffusion member 426, and a focusing lens 427. The half mirror 424 is disposed at the intersection of the through hole 423a and the cross hole 423b in a state inclined at an angle of 45 degrees with respect to the horizontal direction, as shown in Fig. 11. The half mirror 424 has a rectangular shape.

[0069] Cylindrical lens 425 is disposed between light scattering member 422 and half mirror 424. Cylindrical lens 425 is a convex cylindrical lens that protrudes toward half mirror 424. The axis of cylindrical lens 425 extends in the direction in which multiple LED point light sources 421b are arranged. When scattered light from light scattering member 422 is incident on cylindrical lens 425, the scattered light is expanded along the circumferential direction of the cylindrical surface of cylindrical lens 425.

[0070] The light diffusion member 426 is disposed between the cylindrical lens 425 and the half mirror 424. The light diffusion member 426 is, for example, a rectangular sheet member, and diffuses the light transmitted through the cylindrical lens 425. This causes diffused light to be generated in the light diffusion member 426. For example, the light diffusion member 426 may have an isotropic diffusion function that diffuses the incident light in all directions on the surface of the light diffusion member 426. The light diffusion member 426 may also have an anisotropic diffusion function that diffuses the incident light in the axial direction of the cylindrical lens 425 (a direction perpendicular to the circumferential direction of the cylindrical surface of the cylindrical lens 425).

[0071] The focusing lens 427 is disposed in the cross hole 423b. The focusing lens 427 has a function of changing a combined focal length with the lens 411.

[0072] The mirror member 430 is disposed below the illumination module 420 and reflects light reflected from the edge surface Wc of the wafer W. The mirror member 430 includes a main body 431 and a reflecting surface 432. The main body 431 is formed of, for example, an aluminum block. The reflecting surface 432 faces the edge surface Wc and the peripheral area We of the lower surface Wb of the wafer W held on the holding table 201. The reflecting surface 432 is inclined with respect to the rotation axis of the holding table 201.

[0073] The reflecting surface 432 is a curved surface recessed toward the side from which the edge Wc of the wafer W held on the holding table 201 is released. Therefore, when the edge Wc of the wafer W is reflected on the reflecting surface 432, the mirror image is enlarged compared to the actual image. The radius of curvature of the reflecting surface 432 is, for example, not less than 10 mm and not more than 30 mm. In addition, the opening angle of the reflecting surface 432 (the angle formed by two planes circumscribing the reflecting surface 432) is, for example, not less than 100 degrees and not more than 150 degrees.

[0074] In the illumination module 420, light emitted from a light source 421 is scattered by a light scattering member 422, magnified by a cylindrical lens 425, and further diffused by a light diffusing member 426, and then passes through a half mirror 424 as a whole and is irradiated downward. The diffused light that passes through the half mirror 424 is reflected by a reflecting surface 432 of a mirror member 430 located below the half mirror 424. The reflected light, which is the diffused light reflected by the reflecting surface 432, is irradiated mainly onto the edge surface Wc of the wafer W and the peripheral region Wd on the upper surface Wa side.

[0075] The light reflected from the peripheral region Wd of the upper surface Wa of the wafer W does not head toward the reflecting surface 432 of the mirror member 430, but is reflected again by the half mirror 424, passes through the lens 411 of the camera 410 without passing through the focusing lens 427, and enters the image sensor 412 of the camera 410.

[0076] On the other hand, the light reflected from the edge Wc of the wafer W is successively reflected by the reflecting surface 432 of the mirror member 430 and the half mirror 424 , passes through the focusing lens 427 and the lens 411 of the camera 410 , and enters the imaging element 412 of the camera 410 .

[0077] In this manner, both the reflected light from the peripheral region Wd of the upper surface Wa of the wafer W and the reflected light from the edge surface Wc of the wafer W and the mirror member 430 are input to the imaging element 412 of the camera 410. Therefore, the first imaging subunit 400 can simultaneously capture images of both the peripheral region Wd of the upper surface Wa of the wafer W (a region including the upper surface peripheral portion) and the edge surface Wc of the wafer W.

[0078] Next, there will be described a configuration of the second imaging sub-unit 500. The second imaging sub-unit 500 includes a camera 510 (an example of an other surface side imaging section) and an illumination module 520.

[0079] The camera 510 includes a lens 511 and an imaging element 512. The optical axis of the camera 510 extends horizontally toward the lighting module 520.

[0080] The illumination module 520 is disposed below the illumination module 420 and below the wafer W held on the holding table 201. The illumination module 520 includes a half mirror 521 and a light source (not shown). The half mirror 521 is disposed in a state inclined at an angle of 45 degrees with respect to the horizontal direction, for example. The half mirror 521 has a rectangular shape, for example.

[0081] The light source is located below the half mirror 521. Light emitted from the light source passes entirely through the half mirror 521 and is irradiated upward. The light that has passed through the half mirror 521 passes through the lens 511 of the camera 510 and is incident on the imaging element 512 of the camera 510. That is, the camera 510 can capture an image of the bottom surface Wb of the wafer W present in the irradiation area of ​​the light source via the half mirror 521.

[0082] <Specific Operation of the Substrate Processing System> Next, a specific operation of the substrate processing system 1 according to the first embodiment will be described with reference to Figs. 12 to 15. Fig. 12 is a flow chart showing the procedure of processing executed by the substrate processing system 1 according to the first embodiment. Figs. 13 to 15 are diagrams showing the transfer flow of the wafer W in the substrate processing system 1 according to the first embodiment. In Figs. 13 to 15, the flow of the wafer W is indicated by arrows.

[0083] 12, a loading process is first performed in the substrate processing system 1 (step S101). The loading process is a process of loading the wafer W accommodated in the cassette C into the edge processing unit 19.

[0084] 13, first, the first transfer device 13 takes out a wafer W from the cassette C and stores it in the first transfer section 14. At this time, the first transfer device 13 takes out a plurality of wafers W from the cassette C at once, and stores the taken-out plurality of wafers W at once in the first transfer section 14. Then, the third transfer device 18 takes out the wafer W from the first transfer section 14 and carries it into the peripheral processing unit 19. At this time, the third transfer device 18 may take out a plurality of wafers W (for example, two) from the first transfer section 14, and carry the taken-out plurality of wafers W into the plurality of peripheral processing units 19.

[0085] Next, in the substrate processing system 1, peripheral processing is performed in the peripheral processing unit 19 (step S102). Specifically, in the peripheral processing unit 19, first, the holding part 821 of the substrate holding mechanism 82 holds the wafer W, and the driving part 823 rotates the holding part 821 to rotate the wafer W held by the holding part 821. Next, the first moving mechanism 833 and the second moving mechanism 834 place the upper nozzle 831 and the lower nozzle 832 at predetermined positions above and below the wafer W, respectively.

[0086] Thereafter, the chemical liquid supplied from chemical liquid supply source 73 is supplied from upper nozzle 831 and lower nozzle 832 to the upper and lower peripheral edges of wafer W that is rotating. This removes the film from the bevel portion of wafer W. Thereafter, peripheral edge processing unit 19 performs a rinsing process and a drying process, and stops the rotation of wafer W.

[0087] Next, an inspection process is performed in the substrate processing system 1 (step S103). First, the third transfer device 18 takes out the wafer W from the edge processing unit 19 and carries it into the inspection part 15, as shown in FIG.

[0088] In the inspection unit 15, first, a notch alignment process is performed. The notch alignment process is a process for aligning the position of the notch of the wafer W to a predetermined position. Next, the inspection unit 15 performs an imaging process. The imaging process is a process for imaging the peripheral area Wd and end face Wc of the upper surface Wa of the wafer W and the peripheral area We of the lower surface Wb. The inspection unit 15 images the upper surface peripheral portion, end face, and lower surface peripheral portion of the wafer W over the entire circumference of the wafer W while rotating the wafer W using the rotation holding subunit 200. This allows image data of the upper surface peripheral portion, end face, and lower surface peripheral portion of the wafer W over the entire circumference of the wafer W to be obtained.

[0089] Next, an unloading process is performed in the substrate processing system 1 (step S104). The unloading process is a process of returning the wafer W that has been inspected in the inspection unit 15 to the cassette C.

[0090] Specifically, as shown in Fig. 14, the second transfer device 16 takes out the wafer W from the inspection section 15, and then, as shown in Fig. 15, carries the taken-out wafer W into the first transfer section 14. Thereafter, the first transfer device 13 takes out the wafer W from the first transfer section 14 and stores it in the cassette C. At this time, the first transfer device 13 may take out multiple wafers W placed on the first transfer section 14 at once, and store the taken-out multiple wafers W in the cassette C at once.

[0091] In the substrate processing apparatus of Patent Document 1, a transport device for inspection unit arranged in a processing station transports substrates to and from a processing section and an inspection section. Therefore, the processing load of the transport device for inspection unit is high, and there is a risk that the throughput of processing in the substrate processing apparatus is limited by the transport device for inspection unit.

[0092] In contrast, in the substrate processing system 1 according to the first embodiment, a second transfer device that takes out the wafer W from the inspection unit 15 and carries it into the first transfer unit 14 is provided, thereby reducing the processing load of the third transfer device 18. This makes it possible to prevent the throughput of the substrate processing system 1 from being rate-determined by the third transfer device 18. In other words, the throughput of the substrate processing in the substrate processing system 1 can be improved.

[0093] Second embodiment Next, the configuration of the substrate processing system according to the second embodiment will be described. In the second embodiment, the second transfer device 16 is responsible for not only unloading the wafer W from the inspection section 15 but also loading the wafer W into the inspection section 15. FIG. 16 is a layout diagram of the substrate processing system according to the second embodiment as viewed from above. FIG. 17 is a layout diagram of the substrate processing system according to the second embodiment as viewed from the side. In FIG. 17, various transfer devices are omitted and the arrangement of the first transfer section 14A, the inspection section 15A, the second transfer section 20, and the peripheral processing unit 19 is mainly shown. FIG. 18 is a layout diagram of the transfer station of the substrate processing system according to the second embodiment as viewed from the rear.

[0094] As shown in FIGS. 16 to 18, a substrate processing system 1A according to the second embodiment includes a transfer station 3 between a loading / unloading station 2 and a processing station 4. The transfer station 3 is provided with a transfer station 3a.

[0095] In the delivery station 3, a plurality of second delivery sections 20 are arranged. In addition, in the delivery station 3, a plurality of second transport devices 16A which are an example of an inter-inspection section transport device, and a fourth transport device 21 which is an example of an inter-delivery section transport device are arranged.

[0096] The second transfer part 20 can accommodate a plurality of wafers W, and the wafers W that are transferred to and from the peripheral processing unit 19 are placed on the second transfer part 20. The second transfer part 20 is disposed at a position adjacent to the transfer chamber 17 of the processing station 4. The first transfer part 14A and the second transfer part 20 are disposed along the arrangement direction (X-axis direction) of the loading / unloading station 2, the transfer station 3, and the processing station 4.

[0097] A plurality of (here, three) second transfer sections 20 are stacked in the height direction and correspond to upper processing block 4U, middle processing block 4M and lower processing block 4L, respectively (see FIG. 17). A specific configuration of second transfer section 20 will be described later.

[0098] The second conveying device 16A and the fourth conveying device 21 are disposed between the first conveying section 14A and the second conveying section 20. Specifically, the second conveying device 16A and the fourth conveying device 21 are disposed obliquely rearward as viewed from the first conveying section 14A and obliquely forward as viewed from the second conveying section 20.

[0099] The second transfer device 16A and the fourth transfer device 21 each have a plurality of support parts that support one wafer W from below. For example, the second transfer device 16A has two support parts and can load and unload the wafer W for each support part. On the other hand, the fourth transfer device 21 has more support parts than the second transfer device 16A. For example, the fourth transfer device 21 has five support parts.

[0100] The second transfer device 16A and the fourth transfer device 21 are capable of moving in the vertical direction and rotating around a vertical axis. The second transfer device 16A transfers the wafer W between the second transfer section 20 and the inspection section 15A, and between the inspection section 15A and the first transfer section 14A. The fourth transfer device 21 transfers the wafer W between the first transfer section 14A and the second transfer section 20.

[0101] As shown in FIG. 18, the second transfer devices 16A are stacked in the height direction and correspond to the upper processing block 4U, the middle processing block 4M, and the lower processing block 4L, respectively. On the other hand, only one fourth transfer device 21 is disposed in the delivery station 3 and corresponds to all of the upper processing block 4U, the middle processing block 4M, and the lower processing block 4L. That is, the fourth transfer device 21 can carry the wafer W taken out from the first delivery section 14A into the second delivery section 20 corresponding to any of the upper processing block 4U, the middle processing block 4M, and the lower processing block 4L. The fourth transfer device 21 can take out a plurality of wafers W (for example, five wafers) from the first delivery section 14A at one time and carry the taken out wafers W into the second delivery section 20 at one time.

[0102] The second transfer device 16A accesses the inspection unit 15A at an angle. FIG. 19 is a schematic diagram of the inspection unit 15A according to the second embodiment as viewed from above. As shown in FIG. 19, the inspection unit 15A according to the second embodiment includes a loading / unloading unit 130 that opens toward the second transfer device 16A. Specifically, the loading / unloading unit 130 opens at an angle to the arrangement direction of the loading / unloading station 2, the delivery station 3, and the processing station 4. The second transfer device 16A loads and unloads the wafer W into and from the inspection unit 15A via the loading / unloading unit 130.

[0103] The first delivery section 14A and the second delivery section 20 are configured to be accessible from three different directions. Fig. 20 is a schematic diagram of the first delivery section 14A according to the second embodiment as viewed from above. Fig. 21 is a schematic diagram of the second delivery section 20 according to the second embodiment as viewed from above.

[0104] 20, the first passing section 14A includes, for example, three support members 141. Each support member 141 has a plurality of grooves formed along the height direction, and supports the lower surface of the wafer W in each groove.

[0105] The three support members 141 are disposed, for example, at intervals of 120 degrees. The first transfer device 13, the second transfer device 16A and the fourth transfer device 21 access the first transfer section 14A through a gap between the two support members 141, and carry the wafer W into and out of the first transfer section 14A.

[0106] Specifically, the first conveying device 13 accesses the first transfer section 14A in the arrangement direction (X-axis direction) of the stations 2 to 4 through a carry-in / out section 142 that opens toward the first conveying device 13. The fourth conveying device 21 accesses the first transfer section 14A from an oblique direction through a carry-out section 143 that opens in a direction oblique to the direction in which the carry-in / out section 142 opens (X-axis direction). The second conveying device 16A similarly accesses the first transfer section 14A from an oblique direction through a carry-in section 144 that opens in a direction oblique to the direction in which the carry-in / out section 142 opens (X-axis direction).

[0107] 21 has a similar configuration to the first delivery section 14A. That is, the second delivery section 20 includes three support members 211 arranged at intervals of 120 degrees, and has a carry-in / out section 212, a carry-in section 213, and a carry-out section 214 between each of the support members 211.

[0108] The third transfer device 18 accesses the second transfer section 20 along the arrangement direction of the stations 2 to 4 (X-axis direction) via a loading / unloading section 212 that opens toward the transfer chamber 17 of the processing station 4. The fourth transfer device 21 accesses the second transfer section 20 from an oblique direction via a loading section 213 that opens in a direction oblique to the direction in which the loading / unloading section 212 opens (X-axis direction). The second transfer device 16A similarly accesses the second transfer section 20 from an oblique direction via a unloading section 214 that opens in a direction oblique to the direction in which the loading / unloading section 212 opens (X-axis direction).

[0109] Next, a transfer flow of the wafer W in the substrate processing system 1A according to the second embodiment will be described with reference to Figs. 22 to 24. Figs. 22 to 24 are diagrams showing a transfer flow of the wafer W in the substrate processing system 1A according to the second embodiment. In Figs. 22 to 24, the flow of the wafer W is indicated by arrows. In Figs. 22 and 23, when there are two arrows between processing sections, the first (forward) arrow is indicated by a solid line and the second (return) arrow is indicated by a dashed line. Note that the processing procedure of a series of substrate processing according to the second embodiment is also as shown in Fig. 12, similar to the first embodiment.

[0110] 22, first, the first transfer device 13 takes out the wafers W from the cassette C and carries them into the first transfer section 14A. The first transfer device 13 carries multiple wafers W into the first transfer section 14A all at once. Next, the fourth transfer device 21 takes out the multiple wafers W from the first transfer section 14A all at once and carries them into the second transfer section 20 corresponding to any one of the upper processing block 4U, middle processing block 4M, and lower processing block 4L all at once. The fourth transfer device 21 may switch the destination of the wafers W between the upper processing block 4U, middle processing block 4M, and lower processing block 4L in order.

[0111] Next, the third transfer device 18 takes out the wafer W from the second transfer part 20 and carries it into the peripheral edge processing unit 19, which performs peripheral edge removal processing on the wafer W. When the processing by the peripheral edge processing unit 19 is completed, the third transfer device 18 takes out the wafer W from the peripheral edge processing unit 19 and carries it into the second transfer part 20.

[0112] 23, the second transfer device 16A takes out the wafer W from the second transfer section 20 and carries it into the inspection section 15A, which then performs an inspection process on the wafer W. When the inspection process by the inspection section 15A is completed, the second transfer device 16A takes out the wafer W from the inspection section 15A.

[0113] 24, the second transfer device 16A carries the wafers W into the first transfer section 14A. Then, the first transfer device 13 takes out the wafers W placed on the first transfer section 14A and stores them in a cassette C.

[0114] In this way, according to the substrate processing system 1A of the second embodiment, the processing load of the third transport device 18, which is the processing load required to transport the wafer W into the inspection section 15A and the processing load required to transport the wafer W out of the inspection section 15A, can be reduced.

[0115] Furthermore, in the substrate processing system 1A according to the second embodiment, the fourth transfer device 21 is provided, so that the efficiency of transferring the wafer W from the first transfer part 14A to the second transfer part 20 can be improved.

[0116] Third embodiment Next, the configuration of a substrate processing system according to a third embodiment will be described with reference to Fig. 25 to Fig. 27. Fig. 25 is a layout diagram of the substrate processing system according to the third embodiment as viewed from above. Figs. 26 and 27 are layout diagrams of the substrate processing system according to the third embodiment as viewed from the side.

[0117] As shown in FIGS. 25 to 27, a substrate processing system 1B according to the third embodiment includes a transfer chamber 12 of a carry-in / out station 2, a third transfer section 14_1 and a plurality of fourth transfer sections 14_2.

[0118] The third transfer part 14_1 receives the wafer W before being processed by the peripheral processing unit 19. The third transfer part 14_1 is disposed at a position corresponding to the fourth transfer device 21, specifically, in front of the fourth transfer device 21 (in the positive direction of the X-axis). As shown in FIG. 26, only one third transfer part 14_1 is provided in the transfer chamber 12 of the load-unload station 2.

[0119] The fourth transfer parts 14_2 receive wafers W after being processed by peripheral processing units 19. The fourth transfer parts 14_2 are disposed at positions corresponding to the second transfer devices 16, specifically, in front of each of the second transfer devices 16 (in the positive direction of the X-axis). That is, as shown in Fig. 27, each of the fourth transfer parts 14_2 forms one block together with the inspection part 15, and each block is disposed at a height corresponding to an upper processing block 4U, a middle processing block 4M and a lower processing block 4L.

[0120] Next, a transfer flow of the wafer W in the substrate processing system 1B according to the third embodiment will be described with reference to Figures 28 and 29. Figures 28 and 29 are diagrams showing a transfer flow of the wafer W in the substrate processing system 1B according to the third embodiment.

[0121] 28, first, the first transfer device 13 takes out the wafers W from the cassette C and carries them into the third transfer section 14_1. The first transfer device 13 carries a plurality of wafers W into the third transfer section 14_1 all at once. Next, the fourth transfer device 21 takes out the plurality of wafers W from the third transfer section 14_1 all at once and carries them into the second transfer section 20 corresponding to any one of the upper processing block 4U, the middle processing block 4M, and the lower processing block 4L all at once.

[0122] Next, the third transfer device 18 takes out the wafer W from the second transfer part 20 and carries it into the peripheral edge processing unit 19, which performs peripheral edge removal processing on the wafer W. When the processing by the peripheral edge processing unit 19 is completed, the third transfer device 18 takes out the wafer W from the peripheral edge processing unit 19 and carries it into the second transfer part 20.

[0123] Next, the second transfer device 16 removes the wafer W from the second transfer section 20 and carries it into the inspection section 15, which then performs an inspection process on the wafer W. When the inspection process by the inspection section 15 is completed, the second transfer device 16 removes the wafer W from the inspection section 15.

[0124] 29, the second transfer device 16 carries the wafers W into the fourth transfer section 14_2. Then, the first transfer device 13 takes out the wafers W placed on the fourth transfer section 14_2 and stores them in a cassette C.

[0125] In this manner, according to the substrate processing system 1B of the third embodiment, as in the second embodiment, the processing load of the third transport device 18, which is the processing load required to transport the wafer W into and out of the inspection section 15, can be reduced.

[0126] Furthermore, according to the substrate processing system 1B of the third embodiment, the third transfer device 16 can access the fourth transfer device 14_2 and the fourth transfer device 21 can access the third transfer device 14_1 in parallel by providing the third transfer device 14_1. Therefore, according to the substrate processing system 1B of the third embodiment, it is possible to further improve the throughput.

[0127] (First Modification) In each of the above-described embodiments, an example has been described in which the substrate processing system includes an inspection unit that inspects only the peripheral portion, which is a partial region of the wafer W. However, the substrate processing system may include an inspection unit that inspects the entire surface of the wafer W. This example will be described with reference to FIGS. 30 and 31. FIGS. 30 and 31 are diagrams showing a transfer flow of the wafer W in the substrate processing system according to the first modified example. Note that FIGS. 30 and 31 show, as an example, a case in which the entire surface inspection unit 22 is provided in the substrate processing system 1B according to the second embodiment.

[0128] 30 and 31, the substrate processing system 1C according to the first modified example further includes a full surface inspection unit 22. The full surface inspection unit 22 is disposed, for example, straddling the transfer chamber 12 of the loading / unloading station 2 and the delivery station 3. The full surface inspection unit 22 is also disposed, for example, to the side of the fourth transfer device 21 (the Y-axis positive direction side).

[0129] Here, the configuration of the full surface inspection unit 22 will be described with reference to Fig. 32 and Fig. 33. Fig. 32 is a cross-sectional view of the full surface inspection unit 22 according to the first modified example, as viewed from above. Also, Fig. 33 is a cross-sectional view of the full surface inspection unit 22 according to the first modified example, as viewed from the side.

[0130] 32 and 33, the full surface inspection unit 22 has a casing 51. A holder 52 that holds the wafer W is provided inside the casing 51. The holder 52 is, for example, a vacuum chuck, and holds the central portion of the back surface of the wafer W by suction.

[0131] A guide rail 53 extending along the Y-axis direction is provided on the bottom surface of the casing 51. A drive unit 54 that rotates the holding unit 52 and is movable along the guide rail 53 is provided on the guide rail 53.

[0132] An imaging unit 55 is provided on a side surface inside the casing 51. For example, a wide-angle CCD camera is used as the imaging unit 55. A half mirror 56 is provided near the center of the upper part of the casing 51. The half mirror 56 is provided at a position facing the imaging unit 55 with the mirror surface tilted 45 degrees upward toward the imaging unit 55 from a state in which the mirror surface faces vertically downward.

[0133] An illumination device 57 is provided above the half mirror 56. The half mirror 56 and the illumination device 57 are fixed to the upper surface inside the casing 51. Illumination from the illumination device 57 passes through the half mirror 56 and is directed downward. Therefore, light reflected by an object below the illumination device 57 is further reflected by the half mirror 56 and taken into the imaging unit 55. That is, the imaging unit 55 can capture an image of an object in the area illuminated by the illumination device 57.

[0134] The entire surface inspection unit 22 performs imaging by the imaging unit 55 while moving the holder 52 along the guide rail 53 using the drive unit 54. In this way, the entire surface inspection unit 22 can obtain an image of the entire surface of the wafer W.

[0135] The substrate processing system 1C performs an inspection process using the entire surface inspection part 22 on the wafer W before it is processed by the peripheral processing unit 19 (see FIG. 30). After that, the substrate processing system 1C performs an inspection process using the inspection part 15A on the wafer W after it is processed by the peripheral processing unit 19 (see FIG. 31).

[0136] 30, the first transfer device 13 takes out the wafer W from the cassette C and carries it into the first transfer section 14A. Next, the fourth transfer device 21 takes out the wafer W from the first transfer section 14A and carries it into the full surface inspection section 22, which then performs an inspection process on the wafer W. Specifically, the full surface inspection section 22 captures an image of the entire surface of the wafer W. This makes it possible to grasp the condition of the entire surface of the wafer W before it is processed by the peripheral processing unit 19, such as the presence or absence of particles, the film thickness, and the like.

[0137] When the inspection process by the entire surface inspection section 22 is completed, the fourth transfer device 21 takes out the wafer W from the entire surface inspection section 22 and carries it into the second transfer section 20. Thereafter, as described in the second embodiment, the second transfer device 16A takes out the wafer W after being processed by the peripheral portion processing unit 19 from the second transfer section 20 and carries it into the inspection section 15A, and the inspection section 15A performs the inspection process on the wafer W, as shown in FIG.

[0138] In this manner, the substrate processing system 1C may include an entire surface inspection unit 22 that images the entire surface of the wafer W, in addition to the inspection unit 15A that images only the peripheral portion of the wafer W.

[0139] The full surface inspection unit 22 may be arranged in multiple stages corresponding to the upper processing block 4U, the middle processing block 4M, and the lower processing block 4L. In this case, the fourth transport device 21 may also be arranged in multiple stages. This can improve the throughput.

[0140] Further, although an example has been described here in which the substrate processing system 1C includes both the inspection part 15A and the full surface inspection part 22, the substrate processing system 1C may be configured to include only the full surface inspection part 22. In this case, the full surface inspection part 22 may be disposed, for example, to the side (the Y-axis negative direction side) of the second transfer device 16A, and may perform an inspection process on the wafer W after it has been processed by the periphery processing unit 19.

[0141] (Second Modification) In each of the above-described embodiments, an example has been described in which the substrate processing system includes the peripheral processing unit 19. However, the substrate processing system may include a lower surface processing unit (an example of a lower surface processing section) that processes the entire lower surface of the wafer W, in addition to the peripheral processing unit 19. This example will be described with reference to Figs. 34 and 35. Fig. 34 is a layout diagram of a substrate processing system 1D according to a second modified example, as viewed from above. Also, Fig. 35 is a schematic diagram of the lower surface processing unit according to the second modified example.

[0142] 34, the substrate processing system 1D according to the second modification includes a plurality of periphery processing units 19 and a plurality of lower surface processing units 23 in a processing station 4. Specifically, the periphery processing units 19 and the lower surface processing units 23 are arranged side by side along the X-axis direction on the Y-axis positive side of the transfer chamber 17. Similarly, the periphery processing units 19 and the lower surface processing units 23 are arranged side by side along the X-axis direction on the Y-axis negative side of the transfer chamber 17.

[0143] The lower surface processing unit 23 performs a predetermined process on the lower surface of the wafer W. For example, the lower surface processing unit 23 performs a lower surface removal process (an example of a lower surface process) in which a film is removed from the entire lower surface of the wafer W by etching.

[0144] 35, the lower surface processing unit 23 includes a chamber 91, a substrate holding mechanism 92, a supply unit 93, and a collection cup 94. The chamber 91 houses the substrate holding mechanism 92, the supply unit 93, and the collection cup 94. An FFU 911 that forms a downflow in the chamber 91 is provided on the ceiling of the chamber 91.

[0145] The substrate holding mechanism 92 includes a holding part 921 that holds the wafer W horizontally, a support member 922 that extends in the vertical direction and supports the holding part 921, and a drive part 923 that rotates the support member 922 about a vertical axis. A plurality of holding parts 921a that hold the peripheral part of the wafer W are provided on the upper surface of the holding part 921, and the wafer W is held horizontally by the holding parts 921a while being slightly spaced from the upper surface of the holding part 921.

[0146] Supply unit 93 is inserted through hollow portions of holding unit 921 and support member 922. A flow path extending in the vertical direction is formed inside supply unit 93. A chemical liquid supply source 76 is connected to the flow path via valve 74 and flow rate regulator 75. Supply unit 93 supplies the chemical liquid supplied from chemical liquid supply source 76 to the underside of wafer W.

[0147] Recovery cup 94 is disposed so as to surround substrate holding mechanism 92. At the bottom of recovery cup 94, a drain port 941 for discharging the chemical solution supplied from supply unit 93 to the outside of chamber 91, and an exhaust port 942 for exhausting the atmosphere within chamber 91 are formed.

[0148] The lower surface processing unit 23 is configured as described above, and after the peripheral portion of the wafer W is held by the multiple gripping portions 921a of the holder 921, the wafer W is rotated using the drive portion 923. Then, the lower surface processing unit 23 discharges a chemical solution from the supply portion 93 toward the center of the lower surface of the rotating wafer W. The chemical solution supplied to the center of the lower surface of the wafer W spreads over the entire lower surface of the wafer W as the wafer W rotates. This removes the film from the entire lower surface of the wafer W. At this time, contaminants such as particles adhering to the lower surface of the wafer W are also removed together with the film.

[0149] After performing the above-described lower surface removal process, the lower surface processing unit 23 may perform a rinsing process in which a rinsing liquid such as pure water is discharged from the supply unit 93 to wash away the chemical liquid remaining on the lower surface of the wafer W. After the rinsing process, the lower surface processing unit 23 may perform a drying process in which the wafer W is dried by rotating the wafer W.

[0150] In addition, here, as an example of the lower surface processing, the lower surface processing unit 23 performs a lower surface removal process to remove a film from the entire lower surface of the wafer W, but the lower surface processing does not necessarily have to be a process to remove a film. For example, the lower surface processing unit 23 may perform a lower surface cleaning process to clean the entire lower surface of the wafer W as the lower surface processing.

[0151] In the substrate processing system 1C according to the second modified example, for example, a wafer W that has been processed by the peripheral processing unit 19 is processed by the lower surface processing unit 23. Specifically, the third transfer device 18 removes the wafer W from the peripheral processing unit 19 and loads it into the lower surface processing unit 23. Then, the lower surface processing unit 23 performs a lower surface removal process on the loaded wafer W. Specifically, in the lower surface processing unit 23, first, the holding part 921 of the substrate holding mechanism 92 holds the wafer W, and the driving part 923 rotates the holding part 921 to rotate the wafer W held by the holding part 921.

[0152] Thereafter, the chemical liquid supplied from the chemical liquid supply source 76 is supplied from the supply section 93 to the central portion of the lower surface Wb of the rotating wafer W. The chemical liquid supplied to the central portion of the lower surface Wb of the wafer W spreads over the entire surface of the lower surface Wb as the wafer W rotates. This removes the film from the entire surface of the lower surface Wb of the wafer W. Thereafter, the lower surface processing unit 23 performs a rinsing process and a drying process, and stops the rotation of the wafer W. When the lower surface processing unit 23 completes the lower surface removal process, the third transfer device 18 removes the wafer W from the lower surface processing unit 23 and carries the removed wafer W into the first delivery section 14.

[0153] In this manner, the substrate processing system may include a lower surface processing unit 23 that processes the entire lower surface of the wafer W.

[0154] As described above, the substrate processing apparatus according to the embodiment (for example, the substrate processing system 1, 1A to 1D) includes a processing section (for example, the peripheral processing unit 19), a transfer section (for example, the first transfer section 14, 14A, the second transfer section 20, the third transfer section 14_1, and the fourth transfer section 14_2), a pair processing section transport device (for example, the third transfer device 18), an inspection section (for example, the inspection section 15, 15A), and a pair inspection section transport device (for example, the second transfer device 16, 16A). The processing section processes the peripheral section of a substrate (for example, a wafer W). The substrate is transferred in the transfer section. The pair processing section transport device transfers the substrate between the transfer section and the processing section. The inspection section inspects the processing state of the peripheral section of the substrate. The pair inspection section transport device takes out the substrate from the inspection section and transports it to the transfer section.

[0155] Therefore, according to the substrate processing apparatus of the embodiment, in a substrate processing apparatus equipped with a processing section that performs peripheral processing and an inspection section that inspects the peripheral portion of a substrate, a decrease in throughput caused by substrate transport can be suppressed.

[0156] The pair treatment section transport device may take out the substrate from the treatment section and transport it to the inspection section. In this case, the inspection section (for example, the inspection section 15) may have an entrance section (for example, the entrance section 110) and an exit section (for example, the exit section 120) that open in different directions, and the pair treatment section transport device may transport the substrate via the entrance section, and the pair inspection section transport device (for example, the second transport device 16) may transport the substrate via the exit section.

[0157] This makes it possible to reduce the processing load required for transporting the substrate from the inspection unit to the transfer unit, among the processing loads of the treatment unit transport device.

[0158] The substrate processing apparatus according to the embodiment may include a plurality of processing sections, a plurality of transfer sections (for example, first transfer section 14), a plurality of inspection sections (for example, inspection section 15), a plurality of pair processing section transport devices, and a plurality of pair inspection section transport devices (for example, second transport device 16). In this case, the plurality of processing sections, the plurality of pair processing section transport devices, and the plurality of pair inspection section transport devices may each be stacked in multiple stages. Furthermore, a block including one transfer section and one inspection section may be stacked in the number of stages. Furthermore, the plurality of pair inspection section transport devices may take out substrates from the inspection section of the corresponding block and carry them into the transfer section of that block.

[0159] The multi-stage configuration can improve the throughput of the entire substrate processing apparatus, and the provision of a transport device for the inspection unit corresponding to each stage can suppress a decrease in throughput due to substrate transport.

[0160] The transfer section may include a first transfer section (for example, first transfer section 14A) on which a substrate is placed to be transferred to or from a cassette (for example, cassette C) capable of accommodating a plurality of substrates, and a second transfer section (for example, second transfer section 20) on which a substrate is placed to be transferred to or from a processing section. Furthermore, the substrate processing apparatus according to the embodiment (for example, substrate processing system 1A) may further include a counter-cassette transport device (for example, first transport device 13) that transfers the substrate between the cassette and the first transfer section. In this case, the counter-inspection section transport device may remove the substrate from the second transfer section and transport it to an inspection section (for example, inspection section 15A), and remove the substrate from the inspection section and transport it to the first transfer section.

[0161] This makes it possible to reduce the processing load required for carrying the substrate into the inspection section and carrying the substrate out of the inspection section, among the processing loads of the treatment section transport device.

[0162] The substrate processing apparatus according to the embodiment may further include an inter-transportation section transport device (for example, fourth transport device 21) that removes the substrate from the first transfer section and carries it into the second transfer section. By including the fourth transport device, it is possible to improve the efficiency of transporting the substrate from the first transfer section to the second transfer section.

[0163] The substrate processing apparatus according to the embodiment may include a plurality of processing sections, a plurality of first transfer sections, a plurality of second transfer sections, a plurality of inspection sections, a plurality of paired processing section transport devices, and a plurality of paired inspection section transport devices. In this case, the plurality of processing sections, the plurality of second transfer sections, the plurality of paired processing section transport devices, and the plurality of paired inspection section transport devices may each be stacked in multiple stages. Furthermore, a block including one first transfer section and one inspection section may be stacked in multiple stages. Furthermore, the paired inspection section transport device may correspond to one of the plurality of blocks, and may take out a substrate from the inspection section of the corresponding block and carry it into the first transfer section of the block. Furthermore, the inter-transfer section transport device may correspond to a plurality of first transfer sections and a plurality of second transfer sections.

[0164] The first transfer section may include a third transfer section (for example, the third transfer section 14_1) on which the substrate before being processed by the processing section is placed, and a fourth transfer section (for example, the fourth transfer section 14_2) on which the substrate after being processed by the processing section is placed. In this case, the inter-transfer section transport device may take out the substrate before being processed by the processing section from the third transfer section and transport it to the second transfer section. Also, the counter-inspection section transport device may take out the substrate after being processed by the processing section from the second transfer section and transport it to the fourth transfer section.

[0165] By providing the third transfer section, the access of the inter-inspection section transport device to the fourth transfer section and the access of the inter-transfer section transport device to the third transfer section can be performed in parallel, thereby further improving the throughput.

[0166] The substrate processing apparatus according to the embodiment may include a plurality of processing sections, a plurality of second transfer sections, a plurality of fourth transfer sections, a plurality of inspection sections, a plurality of paired processing section transport devices, and a plurality of paired inspection section transport devices. In this case, the plurality of processing sections, the plurality of second transfer sections, the plurality of paired processing section transport devices, and the plurality of paired inspection section transport devices may each be stacked in multiple stages. Also, a block including one fourth transfer section and one inspection section may be stacked in multiple stages. Also, the paired inspection section transport device may correspond to one of the plurality of blocks, and may take out a substrate from the inspection section of the corresponding block and carry it into the fourth transfer section of the block. Also, the inter-transfer section transport device may take out a substrate from one third transfer section and carry it into any of the plurality of second transfer sections.

[0167] The second transfer section includes a carry-in / out section (for example, carry-in section 212), a carry-in section (for example, carry-in section 213), and an unloading section (for example, carry-out section 214). The carry-in / out section opens toward a transport chamber (for example, transport chamber 17) in which the counter-processor transport device is disposed. The carry-in section opens in a first oblique direction with respect to the direction in which the carry-in / out section opens, and the substrate is loaded by the inter-transfer section transport device. The unloading section opens in a second oblique direction with respect to the direction in which the carry-in / out section opens, and the substrate is unloaded by the counter-inspection section transport device.

[0168] By making the inter-transfer section transport device and the inter-inspection section transport device access the second transfer section in an oblique direction, it is possible to reduce the footprint, which is the area that the substrate processing apparatus occupies on the installation surface.

[0169] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0170] 1: Substrate processing system 2: Loading / unloading station 3: Delivery station 4: Processing station 4U: Upper processing block 4M: Middle processing block 4L: Lower processing block 6: Control device 11: Cassette placement section 12: Transport room 13: First conveying device 14: 1st delivery department 15: Inspection Department 16: Second conveying device 17: Transport room 18: Third conveying device 19: Periphery processing unit 20:Second delivery department 21: Fourth conveying device 22: Full-surface inspection department 23: Lower processing unit C: Cassette W: Wafer

Claims

1. a plurality of first transfer sections on which substrates are placed to be transferred into and out of a cassette capable of accommodating a plurality of substrates; a plurality of second transfer parts on which the substrate is placed when the substrate is transferred to or from a processing part that processes a peripheral portion of the substrate; a plurality of processing blocks stacked in multiple stages, each of the processing blocks including the processing section and a processing section transport device that loads and unloads the substrate between the second interface and the processing section; A plurality of inspection units that inspect a processing state of a peripheral portion of the substrate; a plurality of inspection unit transport devices configured to take out the substrate from the second transfer unit and carry it into the inspection unit, and to take out the substrate from the inspection unit and carry it into the first transfer unit; a cassette transport device that carries in and out the substrate between the cassette and the first transfer part; an inter-transportation unit transport device that removes the substrate from the first transfer unit and carries it into the second transfer unit; Equipped with a plurality of blocks including one of the first transfer units and one of the inspection units, the plurality of second transfer units, and the plurality of paired inspection unit transport devices are stacked in multiple stages corresponding to the plurality of processing blocks, the inter-transportation unit transport device is movable in a vertical direction and is accessible to the second transfer unit corresponding to each of the processing blocks.

2. The second delivery section is a first loading / unloading section that opens toward a transfer chamber in which the treatment section transfer device is disposed; a first loading section that opens in a first oblique direction with respect to a direction in which the first loading / unloading section opens, and into which the inter-transport section transport device loads the substrate; a first unloading section that opens in a second oblique direction with respect to a direction in which the first loading / unloading section opens and through which the substrate is unloaded by the inspection section transport device; The substrate processing apparatus of claim 1 .

3. The first delivery section is a second loading / unloading section that opens toward a transport chamber in which the cassette transport device is disposed; a second unloading section that opens in a third oblique direction with respect to a direction in which the second loading / unloading section opens, and through which the inter-transport section transport device unloads the substrate; a second loading section that opens in a fourth oblique direction with respect to a direction in which the second loading / unloading section opens, and into which the substrate is loaded by the inspection section transport device; The substrate processing apparatus of claim 1 .

4. The first delivery section is a third transfer part on which the substrate is placed before being processed by the processing part; a plurality of fourth transfer parts on which the substrates are placed after being processed by the processing parts; Including, The substrate processing apparatus according to claim 1 , wherein a plurality of blocks each including one of the fourth transfer parts and one of the inspection parts are stacked in multiple stages corresponding to the plurality of processing blocks.

5. the inter-transfer section transport device is accessible to the third transfer section and the second transfer section corresponding to each of the processing blocks; The substrate processing apparatus of claim 4 , wherein the paired inspection unit transport device is accessible to the second transfer unit corresponding to the same processing block, and the fourth transfer unit and the inspection unit included in the block corresponding to the same processing block.

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