Optical Modules

Abstract

This optical module comprises a base member including a first surface, a first semiconductor light-emitting device that is mounted on the first surface and that is configured to emit first light having a first wavelength, a first filter that is mounted on the first surface and that includes a first reflective surface for reflecting the first light, a second semiconductor light-emitting device that is mounted on the first surface and that is configured to emit second light having a second wavelength different from the first wavelength, and a second filter that is mounted on the first surface and that includes a second reflective surface for reflecting the second light, the first light reflected by the first reflective surface passing through the second filter, the first light and the second light being multiplexed due to the second reflective surface reflecting the second light, and, in the direction perpendicular to the first surface, the length of the first filter being different from the length of the second filter.

Description

[Technical field]

[0001] The present disclosure relates to an optical module. This application claims priority to Japanese Application No. 2021-005725, filed on January 18, 2021, and incorporates by reference all of the contents of said Japanese application. [Background technology]

[0002] An optical module including a light-emitting element is known (see, for example, Patent Document 1). The optical module disclosed in Patent Document 1 includes a wavelength-selecting filter that directly receives light from the light-emitting element and selects a wavelength. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-93101 A Summary of the Invention

[0004] An optical module according to an embodiment of the present disclosure includes a base member including a first surface, a first semiconductor light-emitting element mounted on the first surface and configured to emit a first light having a first wavelength, a first filter mounted on the first surface and including a first reflecting surface that reflects the first light, a second semiconductor light-emitting element mounted on the first surface and configured to emit a second light having a second wavelength different from the first wavelength, and a second filter mounted on the first surface and including a second reflecting surface that reflects the second light. The first light reflected by the first reflecting surface passes through the second filter, and the second reflecting surface reflects the second light, thereby multiplexing the first light and the second light. In a direction perpendicular to the first surface, the length of the first filter is different from the length of the second filter.

[0005] An optical module according to another embodiment of the present disclosure includes a base member including a first surface, a first semiconductor light-emitting element mounted on the first surface and configured to emit a first light having a first wavelength, a first filter mounted on the first surface and including a first reflecting surface that reflects the first light, a second semiconductor light-emitting element mounted on the first surface and configured to emit a second light having a second wavelength different from the first wavelength, a second filter mounted on the first surface and including a second reflecting surface that reflects the second light, a third semiconductor light-emitting element mounted on the first surface and configured to emit a third light having a third wavelength different from the first wavelength and the second wavelength, and a second filter mounted on the first surface and including a third reflecting surface that reflects the third light. When viewed in a direction perpendicular to the first surface, the first filter is disposed between the second filter and the third filter. The first light reflected by the first reflecting surface passes through the second filter, the second reflecting surface reflects the second light, and the third light reflected by the third reflecting surface passes through the first filter and the second filter, thereby multiplexing the first light, the second light, and the third light. In a direction perpendicular to the first surface, the length of the first filter is longer than the length of the second filter and the length of the third filter. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic side view showing the appearance of the optical module according to the first embodiment. [Diagram 2] FIG. 2 is a schematic side view of the optical module shown in FIG. 1 with a cap removed. [Diagram 3] FIG. 3 is a schematic plan view of the optical module shown in FIG. [Figure 4] FIG. 4 is an enlarged view showing a part of the optical module shown in FIG. [Diagram 5] FIG. 5 is a schematic plan view showing an enlarged portion of the optical module according to the second embodiment. [Figure 6] FIG. 6 is a schematic perspective view showing an enlarged portion of the optical module according to the third embodiment. [Figure 7]FIG. 7 is a schematic plan view of the optical module shown in FIG. 6, taken along a plane including the cap. [Figure 8] FIG. 8 is a schematic perspective view of the optical module according to the fourth embodiment. [Figure 9] FIG. 9 is a schematic perspective view of the optical module shown in FIG. 8 with the cap removed. [Figure 10] FIG. 10 is a schematic plan view of the optical module shown in FIG. 8, taken along a plane including the cap. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] [Problem that this disclosure aims to solve] An optical module including a plurality of semiconductor light-emitting elements and a filter that multiplexes light emitted from the plurality of semiconductor light-emitting elements can emit light in which light of different wavelengths is multiplexed. Recently, there has been a demand for miniaturization of optical modules. In order to achieve a miniaturized optical module, it is necessary to miniaturize each component that constitutes the optical module. Furthermore, when manufacturing the optical module, it is necessary to precisely position each miniaturized component. However, with the optical module disclosed in Patent Document 1, it may be difficult to meet the demand for miniaturization.

[0008] Therefore, one of the objects is to provide an optical module that can be easily miniaturized.

[0009] [Effects of this disclosure] According to the optical module described above, miniaturization can be easily achieved.

[0010] [Description of the embodiments of the present disclosure] First, the embodiments of the present disclosure will be listed and described. (1) An optical module according to an embodiment of the present disclosure includes a base member including a first surface, a first semiconductor light-emitting element mounted on the first surface and configured to emit a first light having a first wavelength, a first filter mounted on the first surface and including a first reflecting surface that reflects the first light, a second semiconductor light-emitting element mounted on the first surface and configured to emit a second light having a second wavelength different from the first wavelength, and a second filter mounted on the first surface and including a second reflecting surface that reflects the second light. The first light reflected by the first reflecting surface passes through the second filter, and the second reflecting surface reflects the second light, thereby multiplexing the first light and the second light. In a direction perpendicular to the first surface, the length of the first filter is different from the length of the second filter.

[0011] In an optical module, a first semiconductor light-emitting element, a second semiconductor light-emitting element, a first filter, and a second filter are mounted on a first surface of a base member. As an example of a method for manufacturing an optical module, for example, the first filter and the second filter are mounted on the first surface of the base member on which the first semiconductor light-emitting element and the second semiconductor light-emitting element are mounted. At this time, the first filter and the second filter are adhered to the first surface by using an adhesive applied to the first surface. Further, the first filter and the second filter are mounted on the first surface in consideration of the emission direction of the first light emitted from the first semiconductor light-emitting element, the emission direction of the second light emitted from the second semiconductor light-emitting element, and the like. Specifically, using a jig such as tweezers that grip with the filter in between, first, one of the first filter and the second filter is gripped and placed from above the base member so as to be mounted on the first surface of the base member. Next, after removing the jig from the filter, the other filter is gripped by the jig and placed from above the base member so as to mount the other filter on the first surface. Here, when miniaturizing the optical module, as the miniaturization of each component constituting the optical module progresses, the distance between the first filter and the second filter also becomes narrower. Then, when attaching the filter to be mounted later and removing the jig, there is a possibility that the previously mounted filter and the jig interfere with each other. As a result, the position of the previously mounted filter may shift, or the previously mounted filter may be damaged.

[0012] According to the optical module of the present disclosure, the length of the first filter is different from the length of the second filter in the direction perpendicular to the first surface. In such an optical module, the first filter or the second filter is first clamped and held by the above-mentioned jig, and its position is adjusted to mount it at a desired position on the first surface. Next, the longer filter is clamped and held by the jig, and its position is adjusted to mount it at a desired position on the first surface. After mounting, when the jig is removed from the filter, the length of the filter mounted later is longer than the length of the filter mounted earlier, so that the possibility of interference between the filter mounted earlier and the jig can be greatly reduced. Therefore, when mounting a filter later, the possibility of the filter mounted earlier coming into contact with the jig and the position of the filter mounted earlier being shifted or damaged can be greatly reduced. Therefore, the labor required for manufacturing each miniaturized component, such as careful work required when mounting a filter later, can be reduced. As a result, such an optical module makes it easy to achieve miniaturization.

[0013] (2) In the optical module, the first reflecting surface may be located outside the optical path of at least one of the light emitted from the second semiconductor light emitting element and transmitted through the second filter and the light emitted from the first semiconductor light emitting element and reflected by the second filter. With respect to the second light, in the second filter, there is a small amount of light that is not reflected by the second reflecting surface and is partially transmitted through the second filter. In addition, with respect to the first light, in the second filter, there is a small amount of light that is partially reflected from the portion other than the second reflecting surface. When the partially transmitted second light or the partially reflected first light reaches the first reflecting surface of the first filter and is reflected, it may become stray light in the same emission direction as the combined light. Such a situation is not preferable because the stray light may be emitted to the outside of the optical module.

[0014] According to the optical module, the first reflecting surface is located outside the optical path of at least one of the light emitted from the second semiconductor light emitting element and transmitted through the second filter and the light emitted from the first semiconductor light emitting element and reflected by the second filter. Therefore, it is possible to reduce the possibility that the second light emitted from the second semiconductor light emitting element and transmitted through the second filter without being reflected by the second reflecting surface and the first light emitted from the first semiconductor light emitting element and reflected at a portion of the second filter other than the second reflecting surface will reach the first reflecting surface. This reduces the possibility that the second light transmitted through the second filter and the first light reflected by the second filter will be reflected by the first reflecting surface and become stray light. As a result, it is possible to reduce the possibility that the stray light will be emitted to the outside of the optical module.

[0015] (3) In the optical module, the distance between the first filter and the second filter may be 0.1 mm or more and 0.3 mm or less, which ensures that the optical module can be made compact.

[0016] (4) The optical module may further include a lens that converts the spot size of the first light emitted from the first semiconductor light emitting element or the second light emitted from the second semiconductor light emitting element, thereby making it possible to emit the first light or the second light having a desired spot size from the optical module.

[0017] (5) The optical module may further include a mirror driving mechanism that includes a mirror that reflects the light combined by the second filter and scans and emits the light combined by the second filter. Such an optical module can draw characters, figures, and the like by scanning the light combined from the first light and the second light along a desired path.

[0018] (6) In the optical module, the first filter and the second filter may each be plate-shaped. When viewed in a direction perpendicular to the first surface, the length of the first filter in a direction perpendicular to the thickness direction may be shorter than the length of the second filter in a direction perpendicular to the thickness direction. This makes it easy to position the first reflecting surface outside the optical path of at least one of the light emitted from the second semiconductor light-emitting element and transmitted through the second filter and the light emitted from the first semiconductor light-emitting element and reflected by the second filter. This makes it easy to reduce the possibility of stray light being generated.

[0019] (7) An optical module according to another aspect of the present disclosure includes a base member including a first surface, a first semiconductor light-emitting element mounted on the first surface and configured to emit a first light having a first wavelength, a first filter mounted on the first surface and including a first reflecting surface that reflects the first light, a second semiconductor light-emitting element mounted on the first surface and configured to emit a second light having a second wavelength different from the first wavelength, a second filter mounted on the first surface and including a second reflecting surface that reflects the second light, a third semiconductor light-emitting element mounted on the first surface and configured to emit a third light having a third wavelength different from the first wavelength and the second wavelength, and a second filter mounted on the first surface and including a third reflecting surface that reflects the third light. When viewed in a direction perpendicular to the first surface, the first filter is disposed between the second filter and the third filter. The first light reflected by the first reflecting surface passes through the second filter, the second reflecting surface reflects the second light, and the third light reflected by the third reflecting surface passes through the first filter and the second filter, thereby multiplexing the first light, the second light, and the third light. In a direction perpendicular to the first surface, the length of the first filter is longer than the length of the second filter and the length of the third filter.

[0020] In the manufacture of an optical module according to another embodiment of the present disclosure, the above-mentioned jig is used to first pinch and hold a filter shorter than the first filter, i.e., either the second filter or the third filter, in a direction perpendicular to the first surface, and adjust its position to mount it at a desired position on the first surface. Next, another filter shorter than the first filter is pinched and held, and its position is adjusted to mount it at a desired position on the first surface. When the jig is removed from the later-mounted filter, the interval between the second filter and the third filter is relatively large, so that the possibility of interference between the previously-mounted filter and the jig can be greatly reduced. Next, in the direction perpendicular to the first surface, the filter with the longest length, i.e., the first filter, is pinched and held by the jig, and its position is adjusted to mount it at a desired position on the first surface. After mounting, when the jig is removed from the first filter, the length of the later-mounted first filter is longer than the lengths of the previously-mounted second and third filters, so that the possibility of interference between the jig and the second and third filters can be greatly reduced. Therefore, when mounting the first filter, the possibility that the previously mounted second filter and third filter come into contact with the jig, causing the second filter or the third filter to be displaced or damaged, can be greatly reduced. Therefore, it is possible to reduce the labor required for manufacturing each miniaturized component, such as requiring careful work when mounting the first filter later. Therefore, in another aspect of the present disclosure, it is easy to miniaturize an optical module that includes three filters and multiplexes and outputs three light beams with different wavelengths.

[0021] [Details of the embodiment of the present disclosure] Next, an embodiment of an optical module according to the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference characters, and the description thereof will not be repeated.

[0022] (Embodiment 1) The configuration of the optical module according to the first embodiment of the present disclosure will be described. Fig. 1 is a schematic side view showing the appearance of the optical module according to the first embodiment. Fig. 2 is a schematic side view of the optical module shown in Fig. 1 with a cap removed. Fig. 3 is a schematic plan view of the optical module shown in Fig. 2. Fig. 4 is an enlarged view showing a part of the optical module shown in Fig. 3.

[0023] 1, 2, 3 and 4, an optical module 11a according to the first embodiment includes a substrate 12, a base member 13, a cap 14a, a plurality of lead pins 15a, and a light generating unit 20a that generates light.

[0024] The substrate 12 is disk-shaped. The substrate 12 includes a first main surface 12a of the substrate 12 and a second main surface 12b different from the first main surface 12a of the substrate 12. The first main surface 12a and the second main surface 12b are along the XZ plane. The multiple lead pins 15a penetrate from the first main surface 12a to the second main surface 12b. Each of the multiple lead pins 15a is provided to extend in the Y direction. Each of the multiple lead pins 15a is electrically connected to each component constituting the light generating unit 20a described later, such as the first semiconductor light emitting element 41, by wiring or the like (not shown).

[0025] The base member 13 is flat. The base member 13 includes a first surface 13a of the base member 13, a second surface 13b different from the first main surface 13a of the base member 13, and a third surface 13c connected to the first surface 13a and the second surface 13b. The first surface 13a and the second surface 13b are each along the XY plane. The third surface 13c is along the XZ plane. Each component constituting the light forming unit 20a is mounted on the first surface 13a of the base member 13. The base member 13 is disposed so that the third surface 13c is in contact with the first main surface 12a of the substrate 12.

[0026] Cap 14a is a lid welded to substrate 12. Cap 14a is disposed in contact with first main surface 12a so as to cover light forming portion 20a and base member 13. That is, light forming portion 20a and base member 13 are disposed in a space surrounded by substrate 12 and cap 14a. Cap 14a is formed with exit window 14b through which light from light forming portion 20a passes. A transmission plate made of glass and through which light passes is disposed in exit window 14b.

[0027] The light forming unit 20a includes a first base block 21a, a second base block 22a, a third base block 23a, a first semiconductor light emitting element 41 configured to emit a first light having a first wavelength, a second semiconductor light emitting element 42 configured to emit a second light having a second wavelength, a third semiconductor light emitting element 43 configured to emit a third light having a third wavelength, a first filter 61a, and a second filter 71a. The light formed by the light forming unit 20a passes through an emission window 14b and is emitted to the outside of the optical module 11a. Here, the first semiconductor light-emitting element 41 is a green laser diode, the second semiconductor light-emitting element 42 is a blue laser diode, and the third semiconductor light-emitting element 43 is a red laser diode. Thus, the first light having the first wavelength is green light, the second light having the second wavelength is blue light, and the third light having the third wavelength is red light.

[0028] The first base block 21a, the second base block 22a and the third base block 23a are each arranged at intervals on the first surface 13a of the base member 13. The first semiconductor light-emitting element 41 is arranged on the first base block 21a. The second semiconductor light-emitting element 42 is arranged on the second base block 22a. The third semiconductor light-emitting element 43 is arranged on the third base block 23a. The first semiconductor light-emitting element 41, the second semiconductor light-emitting element 42 and the third semiconductor light-emitting element 43 are mounted on the first surface 13a. The emission direction of green light from the first semiconductor light-emitting element 41 and the emission direction of blue light from the second semiconductor light-emitting element 42 are both in the X direction. In other words, the optical axis L of the green light 11 and the optical axis L of the blue light 12 The direction in which the red light is emitted by the third semiconductor light emitting element 43 is the Y direction perpendicular to the direction in which the green light is emitted by the first semiconductor light emitting element 41 and the direction in which the blue light is emitted by the second semiconductor light emitting element 42. That is, the optical axis L of the red light 13 and the optical axis L of the green light 11 and the optical axis L of the blue light 12 are perpendicular to each other.

[0029] The first filter 61a and the second filter 71a are, for example, wavelength selective filters. The first filter 61a and the second filter 71a are dielectric multilayer filters. Red light passes through the first filter 61a, and the first filter 61a reflects green light. Red light and green light pass through the second filter 71a, and the second filter 71a reflects blue light.

[0030] The first filter 61a is flat. The first filter 61a is rectangular when viewed in the thickness direction. The thickness direction of the filter is along the XY plane. The first filter 61a includes a transparent plate-like member 62a and a dielectric multilayer film 63a. The plate-like member 62a is made of glass, specifically, Pyrex (registered trademark), quartz, BK7 (registered trademark), Tempax (registered trademark), or the like. The dielectric multilayer film 63a is provided on one of two surfaces in the thickness direction of the plate-like member 62a. The first filter 61a includes a first reflecting surface 64a, which is the first surface, a second surface 65a different from the first reflecting surface, a third surface 66a, a fourth surface 67a, a fifth surface 68a, and a sixth surface 69a. The third surface 66a, the fourth surface 67a, the fifth surface 68a, and the sixth surface 69a are connected to the first reflecting surface 64a and the second surface 65a, respectively. The third surface 66a and the fourth surface 67a are each along the XY plane. The first reflecting surface 64a and the second surface 65a are parallel. The third surface 66a and the fourth surface 67a are parallel. The fifth surface 68a and the sixth surface 69a are parallel. The fifth surface 68a is a plane perpendicular to the first reflecting surface 64a, the second surface 65a, the third surface 66a, and the fourth surface 67a, respectively. The sixth surface 69a is a plane perpendicular to the first reflecting surface 64a, the second surface 65a, the third surface 66a, and the fourth surface 67a, respectively. The dielectric multilayer film 63a is configured to include a first reflecting surface 64a. The first reflecting surface 64a is a surface that reflects green light, which is a first light having a first wavelength. That is, the first filter 61a includes the first reflecting surface 64a that reflects green light, which is the first light. In addition, red light, which is a third light having a third wavelength, passes through the first filter 61a.

[0031] The second filter 71a is flat. The second filter 71a is rectangular when viewed in the thickness direction. The second filter 71a includes a transparent plate-shaped member 72a and a dielectric multilayer film 73a. The same material as the plate-shaped member 62a is used as the material of the plate-shaped member 72a. The dielectric multilayer film 73a is provided on one of the two surfaces in the thickness direction of the plate-shaped member 72a. The second filter 71a includes a second reflecting surface 74a that is a first surface, a second surface 75a that is different from the first surface, a third surface 76a, a fourth surface 77a, a fifth surface 78a, and a sixth surface 79a. The third surface 76a, the fourth surface 77a, the fifth surface 78a, and the sixth surface 79a are connected to the second reflecting surface 74a and the second surface 75a, respectively. The third surface 76a and the fourth surface 77a are each along the XY plane. The second reflecting surface 74a and the second surface 75a are parallel. The third surface 76a and the fourth surface 77a are parallel. The fifth surface 78a and the sixth surface 79a are parallel. The fifth surface 78a is a plane perpendicular to the second reflecting surface 74a, the second surface 75a, the third surface 76a, and the fourth surface 77a, respectively. The sixth surface 79a is a plane perpendicular to the second reflecting surface 74a, the second surface 75a, the third surface 76a, and the fourth surface 77a, respectively. The dielectric multilayer film 73a is configured to include the second reflecting surface 74a. The second reflecting surface 74a is a surface that reflects blue light, which is the second light having a second wavelength. That is, the second filter 71a includes a second reflecting surface 74a that reflects blue light, which is the second light, and transmits green light, which is the first light, and red light, which is the third light.

[0032] The first filter 61a and the second filter 71a are mounted on the first surface 13a. Specifically, the first filter 61a is disposed so that a fourth surface 67a faces the first surface 13a. The second filter 71a is disposed so that a fourth surface 77a faces the first surface 13a. The first filter 61a and the second filter 71a are attached to the first surface 13a using an adhesive made of an ultraviolet curing resin or the like.

[0033] In the direction perpendicular to the first surface 13a, the length of the first filter 61a is different from the length of the second filter 71a. Specifically, the length H of the first filter 61a, which is the distance between the third surface 66a and the fourth surface 67a of the first filter 61a shown in FIG. 1 is the length H of the second filter 71a, which is the distance between the third surface 76a and the fourth surface 77a of the second filter 71a. 2 In this embodiment, the first filter 61a and the second filter 71a have the same rectangular shape when viewed in the thickness direction, the first filter 61a is attached with its longitudinal direction facing the first surface 13a in a so-called horizontal orientation, and the second filter 71a is attached with its lateral direction facing the first surface 13a in a so-called vertical orientation.

[0034] The first filter 61a is disposed at a position where the first reflecting surface 64a reflects green light and transmits red light. The second filter 71a is disposed at a position where the second reflecting surface 74a reflects blue light and transmits green light and red light. The first reflecting surface 64a of the first filter 61a and the second reflecting surface 74a of the second filter 71a are inclined with respect to the emission direction of the light emitted from the first semiconductor light emitting element 41 and the second semiconductor light emitting element 42, respectively. Specifically, the first reflecting surface 64a of the first filter 61a and the second reflecting surface 74a of the second filter 71a are inclined with respect to the optical axis L of the green light emitted from the first semiconductor light emitting element 41 and the second semiconductor light emitting element 42, respectively. 11 and the optical axis L of the blue light 12 In this embodiment, the first reflective surface 64a of the first filter 61a and the second reflective surface 74a of the second filter 71a are inclined at 45° with respect to the optical axis L of the red light emitted from the third semiconductor light emitting element 43. 13 As a result, the first filter 61a and the second filter 71a combine the light emitted from the first semiconductor light emitting element 41, the second semiconductor light emitting element 42, and the third semiconductor light emitting element 43. The optical axis L of the combined light 14 is configured to pass through the exit window 14b.

[0035] The light emitted from the first semiconductor light emitting element 41, the second semiconductor light emitting element 42, and the third semiconductor light emitting element 43 is diffuse light. The optical path of the light emitted from the second semiconductor light emitting element 42 that diffuses toward the first semiconductor light emitting element 41 is called the optical path L 15 Here, the first reflecting surface 64a is located at the optical path L 15 The blue light emitted from the second semiconductor light emitting element 42 and transmitted through the second filter 71a along the optical path L 16 In this embodiment, the length D of the first filter 61a in a direction perpendicular to the thickness direction of the first filter 61a is 1 is the length D of the second filter 71a in a direction perpendicular to the thickness direction of the second filter 71a. 2 In this way, the optical path L of the blue light emitted from the second semiconductor light emitting element 42 and transmitted through the second filter 71a is shorter than that of the blue light emitting element 42. 16 The first reflecting surface 64a is positioned outside the first reflecting surface 64a.

[0036] In addition, the distance D between the first filter 61a and the second filter 71a 3 In this embodiment, the distance D between the first filter 61a and the second filter 71a is 0.1 mm or more and 0.3 mm or less. 3 is the distance between the first reflecting surface 64a of the first filter 61a and the second surface 75a of the second filter 71a.

[0037] Next, an example of a manufacturing method of the optical module 11a will be briefly described. First, the substrate 12 is prepared, in which the first base block 21a, the second base block 22a, the third base block 23a, the first semiconductor light emitting element 41, the second semiconductor light emitting element 42, and the third semiconductor light emitting element 43 are provided on the base member 13. Then, adhesive is applied to predetermined positions on the first surface 13a of the base member 13, specifically, to desired positions to attach the first filter 61a and the second filter 71a. After that, the first filter 61a and the second filter 71a are attached on the adhesive, and the first filter 61a and the second filter 71a are mounted on the first surface 13a of the base member 13.

[0038] Here, when attaching the first filter 61a and the second filter 71a, first, the length H 2 The second filter 71a having a shorter length is attached first. Here, the upper part of the second filter 71a, i.e., the area close to the third surface 76a, is chucked and lifted by a jig so as to sandwich the upper part of the second filter 71a in the thickness direction of the second filter 71a. Then, the second filter 71a is attached to the attachment position of the second filter 71a. Specifically, the second filter 71a is attached so that the position of the second reflection surface 74a is located at the portion where the blue light emitted by the second semiconductor light emitting element 42 intersects with the green light emitted by the first semiconductor light emitting element 41 and reflected by the first reflection surface 64a, and the red light emitted by the third semiconductor light emitting element 43. After that, the jig is opened in the thickness direction of the second filter 71a, and the jig is removed from the second filter 71a.

[0039] Next, the length H 1 The first filter 61a having a long length is attached. In this case, too, the upper part of the first filter 61a, that is, the area close to the third surface 66a, is chucked and lifted by a jig so as to sandwich the upper part of the first filter 61a in the thickness direction of the first filter 61a. Then, the first filter 61a is attached to the attachment position of the first filter 61a. Specifically, the first filter 61a is attached so that the position of the first reflection surface 64a is located at the portion where the green light emitted by the first semiconductor light emitting element 41 and the red light emitted by the third semiconductor light emitting element 43 intersect. Then, the jig is opened in the thickness direction of the first filter 61a, and the jig is removed from the first filter 61a. Next, after the adhesive is cured, the multiple lead pins 15a are attached to the substrate 12, wiring is performed to the lead pins 15a, and finally the cap 14a is attached. In this manner, the optical module 11a is assembled and manufactured.

[0040] In the optical module 11a, the length H of the first filter 61a in the direction perpendicular to the first surface 13a is 1 is the length H of the second filter 71a 2In the optical module 11a, the above-mentioned jig is used to first clamp and hold the shorter filter, in this case the second filter 71a, of the first filter 61a or the second filter 71a, and adjust its position to mount it at a desired position on the first surface 13a. Next, the longer filter, in this case the first filter 61a, is clamped and held by the jig, and its position is adjusted to mount it at a desired position on the first surface 13a. After mounting, when the jig is removed from the first filter 61a, the length H of the first filter that was mounted last is adjusted. 1 The length H of the second filter 71a, which was installed first, is 2 Since the length of the jig is longer than that of the second filter 71a, the possibility of interference between the first mounted second filter 71a and the jig can be greatly reduced. Therefore, when the first filter 61a is subsequently mounted, the possibility of the first mounted second filter 71a coming into contact with the jig and displacing or damaging the first mounted second filter 71a can be greatly reduced. This can reduce the labor required in manufacturing each miniaturized component, such as the need for careful work when subsequently mounting the first filter 61a. As a result, the optical module 11a makes it easy to achieve miniaturization.

[0041] In the optical module 11a, the second filter 71a includes a second reflecting surface 74a that reflects the blue light, which is the second light emitted from the second semiconductor light emitting element 42. Here, in the second filter 71a, there is a small amount of light that is not reflected by the second reflecting surface 74a and is partially transmitted through the second filter 71a as the blue light, which is the second light. If this partially transmitted blue light reaches the first reflecting surface 64a of the first filter 61a and is reflected, it may become stray light with the same emission direction as the multiplexed light. This situation is not preferable because the stray light may be emitted to the outside of the optical module 11a.

[0042] According to the optical module 11a, the first reflecting surface 64a is 15 The blue light emitted from the second semiconductor light emitting element 42 and transmitted through the second filter 71a along the optical path L 16Since the second reflecting surface 74a is located outside the first reflecting surface 64a, it is possible to reduce the possibility that the blue light that is not reflected by the second reflecting surface 74a and passes through the second filter 71a reaches the first reflecting surface 64a. This reduces the possibility that the blue light that passes through the second filter 71a is reflected by the first reflecting surface 64a and becomes stray light. As a result, it is possible to reduce the possibility that the stray light is emitted to the outside of the optical module 11a.

[0043] In the optical module 11a, the distance D between the first filter 61a and the second filter 71a is 3 The thickness is 0.1 mm or more and 0.3 mm or less. Such an optical module 11a can reliably achieve miniaturization.

[0044] In the optical module 11a, when viewed in a direction perpendicular to the first surface 13a, the length D in the direction perpendicular to the thickness direction of the first filter 61a 1 is the length D of the second filter 71a in a direction perpendicular to the thickness direction of the second filter 71a. 2 Therefore, the optical path L 15 The blue light emitted from the second semiconductor light emitting element 42 and transmitted through the second filter 71a along the optical path L 16 Therefore, it is easy to reduce the possibility of stray light being generated.

[0045] In the above embodiment, the first reflecting surface 64a is located in the optical path L 15 The light emitted from the second semiconductor light emitting element 42 and transmitted through the second filter 71a along the optical path L 16 However, the first reflecting surface 64a is not limited to being located outside the optical path L. 17 The light emitted from the first semiconductor light emitting element 41 and reflected by the second filter 71a along the optical path L 18 The optical path of the light emitted from the first semiconductor light emitting element 41 that is diffused toward the third semiconductor light emitting element 43 is called the optical path L. 17That is, the first reflection surface 64a may be located outside the optical path of at least one of the light emitted from the second semiconductor light emitting element 42 and transmitted through the second filter 71a and the light emitted from the first semiconductor light emitting element 41 and reflected by the second filter 71a. By doing so, it is possible to reduce the possibility that at least one of the blue light, which is the second light emitted from the second semiconductor light emitting element 42 and not reflected by the second reflection surface 74a and transmitted through the second filter 71a, and the green light, which is the first light emitted from the first semiconductor light emitting element 41 and reflected at a portion of the second filter 71a other than the second reflection surface 74a, reaches the first reflection surface 64a. This reduces the possibility that the blue light emitted from the second semiconductor light emitting element 42 and transmitted through the second filter 71a and the green light emitted from the first semiconductor light emitting element 41 and reflected by the second filter 71a are reflected by the first reflection surface 64a and become stray light. As a result, the possibility that stray light is emitted to the outside of the optical module 11a can be reduced.

[0046] (Embodiment 2) Next, another embodiment, embodiment 2, will be described. Fig. 5 is a schematic plan view showing an enlarged portion of an optical module in embodiment 2. The optical module in embodiment 2 differs from embodiment 1 in the configuration of the first filter.

[0047] 5, in light generating unit 20b included in optical module 11b according to the second embodiment, when viewed in a direction perpendicular to first surface 13a (i.e., in the XY plane), length D 4 is the length D of the second filter 71a in a direction perpendicular to the thickness direction of the second filter 71a. 2 The first filter 61b includes a first reflecting surface 64b, which is a first surface, a second surface 65b different from the first surface, a third surface 66b, a fourth surface 67b, a fifth surface 68b, and a sixth surface 69b. 4is the length from the fifth surface 68b to the sixth surface 69b. The dielectric multilayer film 63b included in the first filter 61b is not provided on the entire surface of one of the two surfaces in the thickness direction of the plate-shaped member 62b, but is provided on a part of the surface. Specifically, the first filter 61b includes a plate-shaped member 62b and a dielectric multilayer film 63b. The plate-shaped member 62b includes a region 70b on the first reflecting surface 64b side where the dielectric multilayer film 63b is not formed. The region 70b is a portion where the plate-shaped member 62b is disposed as is, and light is transmitted through the region 70b without being reflected.

[0048] Even with this configuration, the first reflecting surface 64b is aligned along the optical path L of the blue light emitted from the second semiconductor light emitting element 42. 16 Therefore, in the region 70b, the light path L 15 This reduces the possibility that the blue light emitted from the second semiconductor light emitting element 42 along the light guide 41 and transmitted through the second filter 71a reaches the first filter 61b and is reflected by the first filter 61b, thereby reducing the possibility that stray light is generated.

[0049] (Embodiment 3) Next, a third embodiment, which is yet another embodiment, will be described. Fig. 6 is a schematic perspective view showing an enlarged portion of an optical module in the third embodiment. Fig. 7 is a schematic plan view of the optical module shown in Fig. 6 when cut along a plane including the cap. The optical module of the third embodiment differs from that of the first embodiment in that it includes a lens and a TEC (Thermo-Electric Cooler). Note that the cap included in the optical module is not shown in Fig. 6.

[0050] 6 and 7, an optical module 11c according to the third embodiment includes a substrate 16, a base member 17, a cap 18a, a plurality of lead pins 15c, and a light forming portion 20c that forms light.

[0051] The substrate 16 is flat. The substrate 16 includes a first main surface 16a of the substrate 16 and a second main surface 16b different from the first main surface 16a of the substrate 16. The first main surface 16a and the second main surface 16b are along the XY plane. The lead pins 15c penetrate from the first main surface 16a to the second main surface 16b. Each of the lead pins 15c is provided to extend in the Z direction. Each of the lead pins 15c is electrically connected to each component constituting the light generating unit 20c described later, such as the first semiconductor light emitting element 41.

[0052] The base member 17 is flat. The base member 17 includes a first surface 17a of the base member 17 and a second surface 17b different from the first surface 17a of the base member 17. The first surface 17a and the second surface 17b are each along the XY plane. Each component constituting the light forming unit 20c is mounted on the first surface 17a of the base member 17.

[0053] The optical module 11c includes a TEC 31c that is an electronic cooling module. The TEC 31c includes a heat sink 32c, a heat absorption plate 33c, and a plurality of semiconductor pillars 34c. The heat sink 32c and the heat absorption plate 33c are each a flat plate. The heat sink 32c and the heat absorption plate 33c are arranged apart from each other in the thickness direction of the base member 17. The plurality of semiconductor pillars 34c are arranged at intervals from each other. The plurality of semiconductor pillars 34c are attached such that one end is connected to the heat sink 32c and the other end is connected to the heat absorption plate 33c. The TEC 31c is arranged between the substrate 16 and the base member 17. The TEC 31c is arranged such that the first main surface 16a of the substrate 16 and the heat sink 32c are in contact with each other, and the second surface 17b of the base member 17 and the heat absorption plate 33c are in contact with each other. By passing a current through the TEC 31c, heat from the base member 17 is transferred to the substrate 16, and the base member 17 and further each component that constitutes the light generating unit 20c are cooled or otherwise temperature-adjusted.

[0054] The light forming unit 20c includes a first base block 21c, a second base block 22c, a first semiconductor light emitting element 41, a second semiconductor light emitting element 42, a third semiconductor light emitting element 43, a first filter 61a, a second filter 71a, a first lens 51c, a second lens 52c, and a third lens 53c. The first lens 51c is disposed between the first semiconductor light emitting element 41 and the first filter 61a when viewed in the thickness direction of the base member 17. The first lens 51c converts the spot size of the green light, which is the first light emitted from the first semiconductor light emitting element. In this case, the first lens 51c converts the diffused light emitted from the first semiconductor light emitting element 41 into collimated light. The second lens 52c is disposed between the second semiconductor light emitting element 42 and the second filter 71a when viewed in the thickness direction of the base member 17. The second lens 52c converts the spot size of blue light, which is the second light emitted from the second semiconductor light emitting element 42. In this case, the second lens 52c converts the diffused light emitted from the second semiconductor light emitting element 42 into collimated light. The third lens 53c is disposed between the third semiconductor light emitting element 43 and the first filter 61a when viewed in the thickness direction of the base member 17. The third lens 53c converts the spot size of red light, which is the third light emitted from the third semiconductor light emitting element 43. In this case, the third lens 53c converts the diffused light emitted from the third semiconductor light emitting element 43 into collimated light. In this way, green light, blue light, and red light having desired spot sizes can be emitted from the optical module 11c. The light formed by the light forming unit 20c passes through the emission window 18b and is emitted to the outside of the optical module 11c.

[0055] The first base block 21c and the second base block 22c are disposed on the first surface 17a of the base member 17 with a gap therebetween. The first submount 24c and the second submount 25c are disposed on the first base block 21c. The first semiconductor light emitting element 41 is disposed on the first submount 24c. The second semiconductor light emitting element 42 is disposed on the second submount 25c. The third submount 26c is disposed on the second base block 22c. The third semiconductor light emitting element 43 is disposed on the third submount 26c. The first semiconductor light emitting element 41, the second semiconductor light emitting element 42 and the third semiconductor light emitting element 43 are mounted on the first surface 13a. The emission direction of the green light by the first semiconductor light emitting element 41 and the emission direction of the blue light by the second semiconductor light emitting element 42 are both in the X direction. That is, the optical axis L of the green light 31 and the optical axis L of the blue light 32 The direction in which the red light is emitted by the third semiconductor light emitting element 43 is the Y direction perpendicular to the direction in which the green light is emitted by the first semiconductor light emitting element 41 and the direction in which the blue light is emitted by the second semiconductor light emitting element 42. That is, the optical axis L of the red light 33 and the optical axis L of the green light 31 and the optical axis L of the blue light 32 are perpendicular to each other.

[0056] The first filter 61a and the second filter 71a are mounted on the first surface 17a. The first filter 61a and the second filter 71a are attached to the first surface 17a by using an adhesive made of an ultraviolet curing resin or the like.

[0057] The length of the first filter 61a in the direction perpendicular to the first surface 17a is different from the length of the second filter 71a. Specifically, the length of the first filter 61a in the direction perpendicular to the first surface 17a is longer than the length of the second filter 71a in the direction perpendicular to the first surface 17a.

[0058] The first filter 61a is disposed at a position where the first reflecting surface 64a reflects green light and transmits red light. The second filter 71a is disposed at a position where the second reflecting surface 74a reflects blue light and transmits green light and red light. The first reflecting surface 64a of the first filter 61a and the second reflecting surface 74a of the second filter 71a are inclined with respect to the emission direction of the light emitted from the first semiconductor light emitting element 41 and the second semiconductor light emitting element 42, respectively. Specifically, the first reflecting surface 64a of the first filter 61a and the second reflecting surface 74a of the second filter 71a are inclined with respect to the optical axis L of the green light emitted from the first semiconductor light emitting element 41 and the second semiconductor light emitting element 42, respectively. 31 and the optical axis L of the blue light 32 In this embodiment, the first reflective surface 64a of the first filter 61a and the second reflective surface 74a of the second filter 71a are inclined at 45° with respect to the optical axis L of the red light emitted from the third semiconductor light emitting element 43. 33 As a result, the first filter 61a and the second filter 71a combine the light emitted from the first semiconductor light emitting element 41, the second semiconductor light emitting element 42, and the third semiconductor light emitting element 43. The optical axis L of the combined light 34 is configured to pass through the exit window 18b.

[0059] The light emitted from the first semiconductor light emitting element 41, the second semiconductor light emitting element 42, and the third semiconductor light emitting element 43 is diffuse light. The optical path of the light emitted from the first semiconductor light emitting element 41 that diffuses toward the third semiconductor light emitting element 43 is called the optical path L 35 The optical path L 35 The green light emitted from the first semiconductor light emitting element 41 along the optical path L passes through the first lens 51c. 36 Then, the light travels along the optical path L and is reflected by the first reflecting surface 64a of the first filter 61a. 37 Then, the light travels along the light path L 37A small amount of light traveling along the green light ray is reflected by the second surface 75a of the second filter 71a. Here, the first reflecting surface 64a reflects the green light ray that is emitted from the first semiconductor light emitting element 41 and reflected by the second surface 75a of the second filter 71a along the optical path L. 38 In this embodiment, when viewed in a direction perpendicular to the first surface 17a, the length of the first filter 61a in a direction perpendicular to the thickness direction is shorter than the length of the second filter 71a in a direction perpendicular to the thickness direction. By doing so, the optical path L of the green light emitted from the first semiconductor light emitting element 41 and reflected by the second surface 75a of the second filter 71a is 38 The first reflecting surface 64a is configured to be located outside the reflecting surface 64a.

[0060] Next, an example of a manufacturing method of the optical module 11c will be briefly described. First, the TEC 31a is bonded onto the first main surface 16a of the substrate 16. Then, the substrate 16, on which the first base block 21c including the first submount 24c and the second submount 25c, the second base block 22c including the third submount 26c, the first semiconductor light emitting element 41, the second semiconductor light emitting element 42, and the third semiconductor light emitting element 43 are provided on the base member 17, is bonded onto the TEC 31a. Then, adhesive is applied to predetermined positions on the first surface 17a of the base member 17, specifically, to desired positions for attaching the first filter 61a and the second filter 71a. Then, the first filter 61a and the second filter 71a are attached onto the adhesive, and the first filter 61a and the second filter 71a are mounted on the first surface 17a of the base member 17.

[0061] Here, the first filter 61a and the second filter 71a are attached starting from the second filter 71a. Here, the upper part of the second filter 71a is chucked and lifted by a jig so as to sandwich the second filter 71a in the thickness direction. Then, the second filter 71a is attached to the attachment position of the second filter 71a. Specifically, the second filter 71a is attached so that the position of the second reflection surface 74a is located at the intersection of the blue light emitted by the second semiconductor light emitting element 42, the green light emitted by the first semiconductor light emitting element 41 and reflected by the first reflection surface 64a, and the red light emitted by the third semiconductor light emitting element 43. After that, the jig is opened in the thickness direction of the second filter 71a, and the jig is removed from the second filter 71a.

[0062] Next, the first filter 61a is attached. In this case, too, the upper part of the first filter 61a is chucked and lifted by a jig so as to sandwich the upper part of the first filter 61a in the thickness direction. Then, the first filter 61a is attached to the attachment position of the first filter 61a. Specifically, the first filter 61a is attached so that the position of the first reflection surface 64a is located at the portion where the green light emitted by the first semiconductor light emitting element 41 and the red light emitted by the third semiconductor light emitting element 43 intersect. Then, the jig is opened in the thickness direction of the first filter 61a, and the jig is removed from the first filter 61a. Next, the adhesive is hardened. Then, the multiple lead pins 15c are attached to the substrate 16, wiring is performed to the lead pins 15c, and finally, the cap 18a is attached. In this manner, the optical module 11c is assembled and manufactured.

[0063] In the optical module 11c, the length of the first filter 61a is different from the length of the second filter 71a in the direction perpendicular to the first surface 17a. In the optical module 11c, the above-mentioned jig is used to first pinch and hold the shorter filter, in this case the second filter 71a, of the first filter 61a or the second filter 71a, and adjust its position to mount it at a desired position on the first surface 13a. Next, the longer filter, in this case the first filter 61a, is pinched and held by the jig, and its position is adjusted to mount it at a desired position on the first surface 13a. After mounting, when the jig is removed from the first filter 61a, the length of the first filter 61a mounted later is longer than the length of the second filter 71a mounted earlier, so that the possibility of interference between the jig and the second filter 71a mounted earlier can be greatly reduced. Therefore, when the first filter 61a is mounted later, the possibility that the previously mounted second filter 71a comes into contact with the jig, causing the previously mounted second filter 71a to be displaced or damaged, can be greatly reduced. Therefore, it is possible to reduce the labor required for manufacturing each miniaturized component, such as the need for careful work when mounting the first filter 61a later. As a result, the optical module 11c makes it easy to achieve miniaturization.

[0064] In the optical module 11c, the first reflecting surface 64a reflects the green light emitted from the first semiconductor light emitting element 41 and reflected by the second surface 75a of the second filter 71a along the optical path L. 38 Since the light is reflected by a portion of the second filter 71a other than the second reflecting surface 74a, that is, the second surface 75a in this case, the light is reflected along the optical path L. 38 This reduces the possibility that the green light traveling along the second filter 71a reaches the first reflecting surface 64a. This reduces the possibility that the green light reflected by the second filter 71a is reflected by the first reflecting surface 64a and becomes stray light. As a result, it reduces the possibility that the stray light is emitted to the outside of the optical module 11c.

[0065] (Embodiment 4) Next, a fourth embodiment, which is yet another embodiment, will be described. Fig. 8 is a schematic perspective view of an optical module in the fourth embodiment. Fig. 9 is a schematic perspective view of the optical module shown in Fig. 8 with the cap removed. Fig. 10 is a schematic plan view of the optical module shown in Fig. 8 when cut along a plane including the cap. The optical module of the fourth embodiment differs from that of the third embodiment in that it includes a mirror drive mechanism. Note that the cap included in the optical module is not shown in Fig. 9.

[0066] 8, 9, and 10, an optical module 11d according to the fourth embodiment includes a substrate 16, a base member 17, a cap 19a provided with an exit window 19b, a plurality of lead pins 15c, a TEC 31c, and a light forming unit 20d that forms light. Each component constituting the light forming unit 20d is mounted on a first surface 17a of the base member 17.

[0067] The light generating unit 20d includes a first base block 21c, a first semiconductor light emitting element 41, a second semiconductor light emitting element 42, a third semiconductor light emitting element 43, a first filter 61a, a second filter 71a, a third filter 81d, a first lens 51c, a second lens 52c, and a third lens 53c. The first filter 61a has a first reflecting surface 64a that reflects the light path L of the green light emitted from the first semiconductor light emitting element 41 and reflected by the second surface 75a of the second filter 71a. 45 It is positioned to be outside.

[0068] The third filter 81d is, for example, a wavelength selective filter. The third filter 81d is also a dielectric multilayer filter. The third filter 81d reflects red light, which is light having a third wavelength emitted from the third semiconductor light emitting element 43. The third filter 81d is flat. The third filter 81d is rectangular when viewed in the thickness direction. The configuration of the third filter 81d is the same as the configuration of the second filter 71a except for the wavelength of the light reflected, so a description thereof will be omitted.

[0069] The third lens 53c is disposed between the third semiconductor light emitting element 43 and the third filter 81d when viewed in the thickness direction of the base member 17. The third filter 81d is mounted on the first surface 17a. The third filter 81d is attached to the side of the first filter 61a in the X direction. That is, the first filter 61a is disposed between the second filter 71a and the third filter 81d in the X direction. In other words, when viewed in a direction perpendicular to the first surface 17a of the base member 17, the first filter 61a is disposed between the second filter 71a and the third filter 81d. The third filter 81d is attached to the first surface 17a using an adhesive made of an ultraviolet curing resin or the like.

[0070] The first base block 21c is disposed on the first surface 17a of the base member 17. The first submount 24c, the second submount 25c, and the third submount 26c are disposed on the first base block 21c. The first semiconductor light emitting element 41 is disposed on the first submount 24c. The second semiconductor light emitting element 42 is disposed on the second submount 25c. The third semiconductor light emitting element 43 is disposed on the third submount 26c. The first semiconductor light emitting element 41, the second semiconductor light emitting element 42, and the third semiconductor light emitting element 43 are mounted on the first surface 13a. The emission direction of green light by the first semiconductor light emitting element 41, the emission direction of blue light by the second semiconductor light emitting element 42, and the emission direction of red light by the third semiconductor light emitting element 43 are all in the X direction. That is, the optical axis L of the green light 41 and the optical axis L of the blue light 42 and the optical axis L of the red light 43 is parallel.

[0071] In the direction perpendicular to the first surface 17a, the length of the first filter 61a is different from the length of the third filter 81d. Specifically, the length of the first filter 61a in the direction perpendicular to the first surface 17a is longer than the length of the third filter 81d in the direction perpendicular to the first surface 17a. In addition, in this embodiment, the length of the first filter 61a in the direction perpendicular to the first surface 17a is longer than the length of the second filter 71a in the direction perpendicular to the first surface 17a. That is, in the direction perpendicular to the first surface 17a, the length of the first filter 61a is longer than the length of the second filter 71a and the length of the third filter 81d.

[0072] The third filter 81d is disposed at a position where the third reflection surface 84d reflects red light. The third reflection surface 84d of the third filter 81d is inclined with respect to the emission direction of the light emitted from the third semiconductor light emitting element 43. Specifically, the third reflection surface 84d of the third filter 81d is inclined with respect to the optical axis L of the red light emitted from the third semiconductor light emitting element 43. 43 As a result, the first filter 61a and the second filter 71a combine the light emitted from the first semiconductor light emitting element 41, the second semiconductor light emitting element 42, and the third semiconductor light emitting element 43.

[0073] The light forming unit 20d included in the optical module 11d includes a mirror driving mechanism 91d. The mirror driving mechanism 91d includes a mirror 92d that reflects the light combined by the second filter 71a. The mirror driving mechanism 91d is disposed on the TEC 31c. Specifically, the optical axis L 44The mirror drive mechanism 91d is arranged so that the light reflected by the second filter 71a hits the oscillating mirror 92d and is reflected, and the reflected light can be emitted from the exit window 19b. The mirror drive mechanism 91d scans and emits the light combined by the second filter 71a. That is, the light formed by the light forming unit 20d passes through the exit window 19b and is emitted to the outside of the optical module 11d. The optical module 11d can draw characters, figures, and the like by scanning the light combined with the first light (green light), the second light (blue light), and the third light (red light) along a desired path.

[0074] In the optical module 11d, the length of the first filter 61a is different from the length of the second filter 71a in the direction perpendicular to the first surface 17a. In the optical module 11d, the above-mentioned jig is used to first pinch and hold the filter having the shorter length, in this case, either the second filter 71a or the third filter 81d, for example, the second filter 71a, and adjust its position to mount it at a desired position on the first surface 13a. Next, the third filter 81d is pinched and held, and its position is adjusted to mount it at a desired position on the first surface 13a. In this case, when the jig is removed from the third filter 81d after mounting, the interval between the third filter 81d, which is mounted later, and the second filter 71a is large, so that the possibility of interference between the jig and the second filter 71a, which is mounted earlier, can be greatly reduced. Next, the longer filter, in this case the first filter 61a, is clamped by a jig, and its position is adjusted to mount it at a desired position on the first surface 13a. After mounting, when the jig is removed from the first filter 61a, the length of the first filter 61a mounted later is longer than the lengths of the second filter 71a and the third filter 81d mounted earlier, so that the possibility of the first filter 71a and the third filter 81d interfering with the jig can be greatly reduced. Therefore, when mounting the first filter 61a later, the second filter 71a and the third filter 81d mounted earlier come into contact with the jig, and the possibility of the second filter 71a or the third filter 81d mounted earlier being displaced or damaged can be greatly reduced. Therefore, the labor required for manufacturing each miniaturized component, such as careful work required for mounting the first filter 61a later, can be reduced. As a result, the optical module 11d makes it easy to achieve miniaturization.

[0075] In the optical module 11d, the first reflecting surface 64a reflects the green light emitted from the first semiconductor light emitting element 41 and reflected by the second surface 75a of the second filter 71a along the optical path L. 45Since the second filter 71a is located outside the first reflecting surface 64a, the possibility that the green light emitted from the first semiconductor light emitting element 41 and reflected by a portion other than the second reflecting surface 74a of the second filter 71a, in this case the second surface 75a, reaches the first reflecting surface 64a can be reduced. This reduces the possibility that the green light emitted from the first semiconductor light emitting element 41 and reflected by the second filter 71a is reflected by the first reflecting surface 64a and becomes stray light. As a result, the possibility that the stray light is emitted to the outside of the optical module 11d can be reduced.

[0076] (Other embodiments) In the above embodiment, the optical module includes the first semiconductor light emitting element, the second semiconductor light emitting element, and the third semiconductor light emitting element, but this is not limited thereto, and the optical module may be configured not to include the third semiconductor light emitting element. In this case, the combination of the first semiconductor light emitting element and the second semiconductor light emitting element may be such that they emit light of different wavelengths.

[0077] It should be understood that the embodiments disclosed herein are illustrative in all respects and are not limiting in any respect. The scope of the present disclosure is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0078] 11a, 11b, 11c, 11d optical module; 12, 16 substrate; 12a, 16a first main surface; 12b, 16b second main surface; 13, 17 base member; 13a, 17a first surface; 13b, 17b, 65a, 65b, 75a second surface; 13c, 66a, 66b, 76a third surface; 14a, 18a, 19a cap; 14b, 18b, 19b exit window; 15a, 15c lead pin; 20a, 20b, 20c, 20d light forming portion; 21a, 21c first base block; 22a, 22c second base block; 23a third base block; 24c first submount; 25c second submount; 26c third submount, 31c TEC, 32c heat sink, 33c heat absorption plate, 34c semiconductor pillar, 41 first semiconductor light emitting element, 42 second semiconductor light emitting element, 43 third semiconductor light emitting element, 51c first lens, 52c second lens, 53c third lens, 61a, 61b first filter, 62a, 62b, 72a plate-shaped member, 63a, 63b, 73a dielectric multilayer film, 64a, 64b first reflecting surface, 67a, 67b, 77a fourth surface, 68a, 68b, 78a fifth surface, 69a, 69b, 79a sixth surface, 70b region, 71a second filter, 74a second reflecting surface, 81d third filter, 84d third reflecting surface, 91d Mirror drive mechanism, 92d Mirror, D 1 ,D 2 ,D 4, H 1 ,H 2 Length, D 3 spacing, L 11 ,L 12 ,L 13 ,L 14 ,L 31 ,L 32 ,L 33 ,L 34 ,L 41 ,L 42 ,L 43 ,L 44 Optical axis, L 15 ,L 16 ,L 17 ,L 18 ,L 35 ,L 36 ,L 37,L 38 ,L 45 Optical Path

Claims

1. A base member including a first surface, A first semiconductor light-emitting element mounted on the first surface and configured to emit first light having a first wavelength, A first filter mounted on the first surface and including a first reflecting surface for reflecting the first light, A second semiconductor light-emitting element mounted on the first surface and configured to emit second light having a second wavelength different from the first wavelength, A second filter mounted on the first surface and including a second reflecting surface for reflecting the second light, wherein The first light reflected by the first reflecting surface passes through the second filter, and the second reflecting surface reflects the second light, so that the first light and the second light are combined, In a direction perpendicular to the first surface, the length of the first filter is different from the length of the second filter, In a direction perpendicular to the first surface, the height at which the first filter is mounted on the first surface is equal to the height at which the second filter is mounted on the first surface. An optical module.

2. The first reflecting surface is located outside the optical path of at least one of the light that is emitted from the second semiconductor light-emitting element and passes through the second filter and the light that is emitted from the first semiconductor light-emitting element and is reflected by the second filter. The optical module according to Claim 1.

3. The distance between the first filter and the second filter is 0.1 mm or more and 0.3 mm or less. The optical module according to Claim 1 or Claim 2.

4. Further comprising a lens for converting the spot size of the first light emitted from the first semiconductor light-emitting element or the second light emitted from the second semiconductor light-emitting element. The optical module according to any one of Claims 1 to 3.

5. Including a mirror for reflecting the light combined by the second filter, and further comprising a mirror driving mechanism for scanning and emitting the light combined by the second filter. The optical module according to any one of Claims 1 to 4.

6. The first filter and the second filter are each plate-shaped, When viewed in a direction perpendicular to the first surface, the length in a direction perpendicular to the thickness direction of the first filter is shorter than the length in a direction perpendicular to the thickness direction of the second filter. The optical module according to any one of Claims 1 to 5.

7. A base member including a first surface, A first semiconductor light-emitting element mounted on the first surface and emitting first light having a first wavelength; A first filter mounted on the first surface and including a first reflecting surface for reflecting the first light; A second semiconductor light-emitting element mounted on the first surface and emitting second light having a second wavelength different from the first wavelength; A second filter mounted on the first surface and including a second reflecting surface for reflecting the second light; A third semiconductor light-emitting element mounted on the first surface and configured to emit third light having a third wavelength different from the first wavelength and the second wavelength; A third filter mounted on the first surface and including a third reflecting surface for reflecting the third light, and comprising: When viewed in a direction perpendicular to the first surface, the first filter is disposed between the second filter and the third filter; The first light reflected by the first reflecting surface passes through the second filter, the second reflecting surface reflects the second light, and the third light reflected by the third reflecting surface passes through the first filter and the second filter, whereby the first light, the second light, and the third light are multiplexed; An optical module in which, in a direction perpendicular to the first surface, the length of the first filter is longer than the lengths of the second filter and the third filter.

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