Semiconductor laser

Abstract

To provide an optoelectronic semiconductor component that can be efficiently encapsulated and efficiently produced.SOLUTION: A semiconductor laser 1 includes a carrier 2, and an edge-emitting laser diode 3 which is mounted on the carrier 2 and which includes an active region for generating a laser radiation L and a facet 30 with a radiation exit region 31. The semiconductor laser 1 further includes, as a protective cover 4, a lens for collimating the laser radiation. The protective cover 4 is fixed by an adhesive 5 to the facet 30 and to a side face of the carrier 2. A light incident surface 41 is configured to diffuse the laser radiation L reflected at the light incident surface. A roughening part 43 is provided such that the reflected laser radiation does not reach or reaches only attenuated to the radiation exit region 31 and / or a resonator of the laser diode 3 is not disturbed by the reflected laser radiation.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] A semiconductor laser is provided. Additionally, a manufacturing method for an optoelectronic semiconductor component is provided. Summary of the Invention [Problem to be solved by the invention]

[0002] The object achieved is to provide an optoelectronic semiconductor component which can be efficiently encapsulated and which can be efficiently manufactured. [Means for solving the problem]

[0003] This object is achieved, inter alia, by a semiconductor laser and a manufacturing method having the features of the independent claims. Preferred developments are the subject matter of the dependent claims.

[0004] According to at least one embodiment, the semiconductor laser includes a carrier. The carrier may be a so-called submount. The carrier may include a driver that can control the semiconductor laser. Alternatively, the carrier may represent an electronically passive component and be used only as a mounting surface.

[0005] According to at least one embodiment, the semiconductor laser comprises one or more laser diodes, which at least one laser diode is preferably an edge-emitting laser diode, which means, among other things, that the laser radiation generated during operation is emitted in a direction parallel to the active area of ​​the laser diode.

[0006] According to at least one embodiment, the laser diode comprises a facet. The facet is preferably oriented perpendicular or nearly perpendicular to the active region. A radiation exit area is arranged on the facet. Laser radiation generated during operation emerges from the laser diode at the radiation exit area. The radiation exit area is in particular limited to a partial area of ​​the facet and thus to the facet.

[0007] According to at least one embodiment, the semiconductor laser comprises one or more protective covers, in particular exactly one protective cover, which is preferably an optical device for beam shaping or beam deflection, but can also be an optically inactive body such as a disk, for example a plane-parallel plate.

[0008] In particular, the protective cover is preferably a lens designed for collimation or focusing of the generated radiation. The lens may be spherical, aspherical or free-form in shape. Furthermore, cylindrical or semi-cylindrical lenses are possible. The protective cover may be a converging lens. The protective cover may be designed, for example, as a plano-convex or biconvex lens. An embodiment as a Fresnel lens is also possible. Furthermore, the protective cover may be, for example, a prism for beam deflection.

[0009] According to at least one embodiment, the protective cover is made of an inorganic material such as glass or sapphire or SiC. Alternatively, but less preferably, the protective cover is made of an organic material such as a plastic, for example silicone or epoxy or a hybrid material thereof, or a polymer such as polycarbonate. If the protective cover is made of an organic material, this organic material preferably forms the core of the protective cover, which may be covered all around, in particular over the entire surface, by an inorganic protective layer, for example as a diffusion barrier against oxygen and / or water vapor.

[0010] According to at least one embodiment, the semiconductor laser includes an adhesive. The protective cover is attached to the facet and, optionally, to the side of the carrier with the adhesive. The side of the carrier may be oriented parallel or nearly parallel to the facet. The side of the carrier is preferably recessed from the facet along the beam direction of the laser radiation. Thus, the protective cover is preferably attached to the facet and the carrier with an adhesive. The adhesive is preferably an inorganic material, such as glass or at least one metal.

[0011] Alternatively, the adhesive is a plastic such as a silicone, polysiloxane, polysilazane or silicone hybrid material, preferably a low organic plastic. Polysiloxanes are materials in which the -[O-SiR 2 ] n -, and -[NH-SiR 2 ] n -, where different moieties R can be present in each case. Low-organic means, for example, that the proportion of organic components relative to silicones, siloxanes or silazanes does not exceed 30% or 20% by weight and / or, in particular in the case of siloxanes or silazanes, the quotient of the number of carbon-containing moieties R and n is at most 0.75 or 0.25. The mass proportion of organic matter is determined, in particular, by incineration of the material.

[0012] Less preferably, the adhesive may be an organic material such as an epoxy and / or a polymer of carbon-containing structural units.

[0013] According to at least one embodiment, the average distance between the light entrance surface of the protective cover and the facet is at most 5 μm or 15 μm or 30 μm or 60 μm or 0.1 mm, or alternatively, this average distance is at least 0.1 μm or 0.5 μm. The average distance is preferably in the range between 0.5 μm and 5 μm. In other words, the protective cover can be close to the facet.

[0014] According to at least one embodiment, the semiconductor laser is configured to operate in normal atmosphere without additional hermetic sealing, i.e. the sealing and protection of the facet, especially the radiation exit area, is performed by an adhesive together with a protective cover. Due to the adhesive together with the protective cover, the semiconductor laser may preferably be operated in normal ambient air, which may contain an oxygen content in the range of around 21% and water vapor.

[0015] In at least one embodiment, the semiconductor laser includes a carrier and an edge-emitting laser diode mounted on the carrier and including a facet having an active region and an emission exit region for generating laser radiation. The semiconductor laser further includes a protective cover, preferably a lens for collimating the laser radiation. The protective cover is fixed to the facet and the side of the carrier using an adhesive. The average distance between the light entrance surface of the protective cover and the facet is at most 60 μm. The semiconductor laser is configured to operate in normal atmosphere without additional hermetic sealing.

[0016] In particular, semiconductor lasers with high power, for example optical powers of more than 0.2 W or 1 W, emitting at short wavelengths in the near-ultraviolet or blue spectral range must be protected and sealed against environmental influences. To be able to ensure long-term stable operation, the corresponding laser diodes must be operated in a clean, hermetically sealed atmosphere or kept away from any atmosphere.

[0017] In the semiconductor lasers described herein, a cladding near the facet is used to provide a hermetic compartment for the radiation exit area. The seal near the facet formed by a protective cover together with an adhesive allows for the elimination of a hermetically sealed housing that would otherwise be required. As a result, the semiconductor laser can be manufactured more cost-effectively and installed with reduced space requirements.

[0018] The protective cover, especially together with the adhesive, protects the facet against environmental influences and reduces the beam divergence of the laser radiation. Likewise, the use of a protective cover, for example in the form of a lens, leads to an enlargement of the surface on which possible decomposition products can accumulate. Furthermore, the enlargement of the surface of the semiconductor laser exposed to the atmosphere results in a decrease in the optical power density, accompanied by a decrease in the effectiveness of the optical tweezers. In particular, the protective cover prevents the direct accumulation of particles and / or inorganic molecules on the laser facet and the radiation exit area.

[0019] Deposits on the facets can be decomposed and burned out, especially by short-wavelength radiation. Such changes in the area of ​​the facets can reduce the decoupling efficiency of the laser and can lead, for example, to damage to the facet coating due to light absorption in the deposits, which in turn can lead to overheating and thus to the destruction of the entire laser facet area. This is also called optical damage, or COD for short. A protective cover implemented in the facet area prevents particles and / or molecules from depositing on the facets, while at the same time simplifying the construction of the semiconductor laser and reducing the space requirements.

[0020] Furthermore, the divergence of the emitted laser radiation is reduced by the lens close to the facet. Similarly, the electric field strength in the region of the laser beam passing through the atmosphere is reduced. The electric field strength in the diverging beam attracts potential contaminants otherwise in the vicinity of the facet, causing their deposition on the facet corresponding to the optical tweezers. In this way, the reduction in beam divergence directly translates into a reduction in deposition.

[0021] Furthermore, the interface with the atmosphere is enlarged by the protective cover, i.e. preferably by a lens. As a result of the enlargement of the boundary surface, the amount of potential deposits per unit area is reduced. Furthermore, the energy density at this interface is directly reduced with respect to the facet.

[0022] According to at least one embodiment, the laser diode is hermetically sealed by the adhesive and protective cover, i.e., there is no significant exchange of substances such as oxygen or water vapor between the inside and outside of the seal formed from the adhesive together with the protective cover. For example, hermetically sealed means that the laser diode has a leakage rate of at most 5×10, particularly at room temperature. -9 This means that the unit is Pa·m / s.

[0023] According to at least one embodiment, the minimum distance between the protective cover and the facet is 0.1 μm or 0.2 μm. Alternatively or additionally, this minimum distance is at most 10 μm or 5 μm or 3 μm. That is, the minimum distance can be of the order of magnitude of the wavelength of the laser radiation. As a result, the area between the protective cover and the facet can act as an undesirable additional resonator. On the other hand, this small minimum distance results in only a small diffusion cross section occurring towards the radiation exit area, especially through the adhesive.

[0024] According to at least one embodiment, a cavity is formed on the facet in the region of the active region. In plan view of the facet, the cavity is surrounded all around by adhesive. The radiation exit area, through which the laser radiation leaves the laser diode, can therefore be free of adhesive. This does not result in any immediate potentially harmful interaction in the radiation exit area between the laser radiation and the adhesive.

[0025] According to at least one embodiment, the cavity is evacuated or filled with one or more protective gases. The relevant protective gases are, for example, noble gases such as argon or helium or inert gases such as nitrogen. If the cavity is filled with protective gas, the gas pressure in the cavity can be, for example, close to atmospheric pressure at the intended operating temperature of the semiconductor laser, in particular between 0.8 bar and 1.1 bar.

[0026] According to at least one embodiment, the average diameter of the cavities, when viewed in plan view of the facet, is at least 3 μm or 5 μm or 10 μm and / or at most 0.1 mm or 50 μm or 20 μm or 10 μm. In other words, the cavities may be relatively small when viewed in plan view.

[0027] The cavity may be formed rotationally symmetrically relative to the radiation exit area or may extend asymmetrically around the radiation exit area. The distance between the adhesive and the radiation exit area is preferably at least 2 μm or 5 μm or 10 μm.

[0028] According to at least one embodiment, the thickness of the cavity is between 0.5 μm and 20 μm. The thickness of the cavity perpendicular to the facet may correspond to the average distance between the radiation exit area and / or the side surface of the carrier on the one hand and the light entrance surface of the protective cover on the other hand.

[0029] According to at least one embodiment, when viewed in plan view of the facet, the width of the adhesive around the cavity is at least 100% or 150% or 250% of the average diameter of the cavity. Alternatively, or in addition, the width of the adhesive is at least 20 μm or 30 μm or 50 μm and / or at most 0.1 mm or 50 μm or 20 μm.

[0030] According to at least one embodiment, the side walls of the cavity are curved towards the adhesive, for example when viewed in a cross section perpendicular to the facet, the shape of the cavity is biconvex in the radiation exit area, i.e. starting from a maximum extent in the direction parallel to the facet in this cross section, the cavity narrows in the direction towards the facet and towards the light entry surface of the protective cover.

[0031] According to at least one embodiment, the laser radiation passes to the light input surface at a distance from the adhesive, i.e., the laser radiation does not reach the adhesive along the intended path straight from the radiation exit area to the light input surface, although this does not exclude that possibly the laser radiation reflected at the light input surface is guided to the adhesive.

[0032] According to at least one embodiment, the adhesive partially or completely covers the light input surface and optionally the side surface of the carrier, and also directly and immediately over the entire radiation exit area, in other words, a continuous and gap-free connection can be formed only by the adhesive between the facets and the light input surface.

[0033] According to at least one embodiment, the light entrance surface is entirely covered with adhesive. Similarly, the facets may be entirely covered with adhesive. The sides of the carrier are preferably only partially covered with adhesive, but may alternatively be entirely covered with adhesive.

[0034] According to at least one embodiment, the difference in refractive index between the protective cover and the adhesive is at most 0.2 or 0.1 or 0.05 or 0.02. This applies in particular at the wavelength of maximum intensity of the laser radiation at a temperature of 300 K. A correspondingly low refractive index difference can reduce the reflection at the interface between the protective cover and the adhesive.

[0035] According to at least one embodiment, the protective cover is made of at least one of the following materials, glass, sapphire, silicon carbide, or consists of one or more of these materials. The protective cover is preferably made of sapphire.

[0036] According to at least one embodiment, the wavelength of maximum intensity of the laser radiation generated by the laser diode is at least 365 nm or 400 nm. Alternatively, or in addition, the wavelength of maximum intensity is at most 530 nm, 460 nm, or 440 nm. That is, the laser radiation is of a relatively short wavelength.

[0037] According to at least one embodiment, the adhesive consists of one or more metals, in particular solder, in combination with a protective cover and / or a metal layer on the facets and sides to which the solder is applied. Alternatively, at least one glass is used as adhesive.

[0038] The adhesive may be of homogeneous or heterogeneous composition, for example in the case of glass further particles can be introduced into the glass matrix, for example as spacers and / or to set the thermal expansion coefficient.

[0039] According to at least one embodiment, the light entrance surface of the protective cover is provided with a roughening. The light entrance surface is thus designed to diffuse the radiation reflected at the light entrance surface so widely that the reflected laser radiation does not reach the radiation exit area or reaches it only after being attenuated. The feedback from the area between the facet and the protective cover to the resonator of the laser diode can thus be reduced.

[0040] According to at least one embodiment, the light incidence surface is flat. In this case, the light incidence surface is oblique to the facet. For example, the angle between the light incidence surface and the facet is at least 5° or 10°, and / or at most 35° or 25° or 15°. As a result, the laser radiation reflected at the light incidence surface is directed away from the radiation exit area on the facet. The angle is preferably less than the Brewster angle in order to keep the area of ​​diffuse attack on the adhesive low.

[0041] According to at least one embodiment, the protective cover is in the form of a lens and is biconvex, such that the light entrance surface extends in a curved, in particular continuously curved, manner, the maximum curvature of the light entrance surface being preferably arranged outside the optical axis of the laser radiation, so as to redirect any laser radiation possibly reflected at the light entrance surface away from the radiation exit area.

[0042] According to at least one embodiment, the light entrance surface and / or the light exit surface of the protective cover are partially or completely provided with an anti-reflection coating for the laser radiation. In particular, the reflectivity of the light entrance surface for the laser radiation is at most 0.5% or 0.1% or 0.01%. Such an anti-reflection coating can also reduce or prevent feedback from the area between the facet and the protective cover to the resonator of the laser diode.

[0043] According to at least one embodiment, the light exit surface of the protective cover opposite the facet is provided with a catalytic coating, preferably a photocatalytic coating. This coating is designed to remove and / or decompose deposits on the light exit surface using laser radiation. The coating is in particular formed by a metal oxide, such as titanium dioxide or zirconium oxide. Alternatively, the coating is made of at least one metal, such as platinum or palladium or rhodium. In the case of a metal coating for the catalytic coating, the thickness of the coating is preferably at most 10 nm or 5 nm or 3 nm, so that the laser radiation can pass through the catalytic coating without significant losses.

[0044] According to at least one embodiment, the light exit surface of the protective cover is provided with an anti-adhesion coating. The anti-adhesion coating is designed to prevent deposits on the outside of the protective cover. The anti-adhesion coating is, for example, a plastic coating, in particular with a fluorine-carbon compound or a fluorine-silicon compound. The anti-adhesion coating is, for example, a fluorinated or perfluorinated polymer and / or a fluorinated or perfluorinated siloxane or silazane. Preferably, the entire light exit surface is coated accordingly.

[0045] According to at least one embodiment, the active region is arranged on the side of the laser diode facing the carrier. For example, the distance between the active region and the carrier is at most 5 μm, 10 μm, or 3 μm. In contrast, the thickness of the laser diode is, for example, at least 20 μm, 50 μm, or 100 μm, and / or at most 0.5 mm, or 0.2 mm.

[0046] According to at least one embodiment, the facet protrudes beyond the carrier along the direction of the laser radiation, for example the protrusion of the laser diode above the carrier is at least 50 μm or 0.1 mm, or alternatively or additionally at most 0.3 mm or 0.15 mm or 50 μm.

[0047] According to at least one embodiment, the semiconductor laser includes one or more luminescent elements designed for partial or total conversion of the laser radiation and including one or more phosphors.

[0048] In particular, one or more of the following phosphors are used: (Ca,Sr)AlSiN 3 :EU 2+ , Sr(Ca,Sr)Si 2 Al 2 N 6 :EU 2+ , (Sr,Ca)AlSiN 3 * S 2 N 2 O:Eu 2+ , (Ca, Ba, Sr) 2 S 5 N 8 :EU 2+ , (Sr,Ca)[LiAl 3 N 4 ]:EU 2+ Eu 2+ Doped nitrides; general series (Gd, Lu, Tb, Y) 3 (Al, Ga, D) 5 (O,X) 12Garnets from RE, where X=halides, N or divalent elements, D=trivalent or tetravalent elements, RE=rare earth metals, e.g. Lu 3 (Al 1-x Ga x ) 5 O l2 :Ce 3+ , Y 3 (Al 1-x Ga x ) 5 O 12 :Ce 3+ ;(Ca,Sr,Ba)S:Eu 2+ Eu 2+ Doped sulfides; (Ba,Sr,Ca)Si 2 O 2 N 2 :EU 2+ Eu 2+ Doped SiONs; e.g., the series Li x M y Ln z S 12-(m+n) Al (m+n) O n N 16-n SiAlONs from the series Si 6-x Al z O y N 8-y :RE z β-SiAlONs from AE, where RE = rare earth metal; 2-×-a RE x EU a SiO 4-x N x or AE 2-x-a RE x EU a S 1-y O 4-x-2y N X where RE=rare earth metal and AE=alkaline earth metal, etc., or (Ba, Sr, Ca, Mg) 2 SiO 4 :EU 2+ Nitrido orthosilicates such as Ca 8 Mg(SiO 4 ) 4 Cl 2 :EU 2+ Chlorosilicates such as (Sr,Ba,Ca,Mg) 10 (PO4 ) 6 Cl 2 :EU 2+ Chlorophosphates such as BaMgAl 10 O 17 :EU 2+ BaO-MgO-Al etc. 2 O 3 BAM phosphor from the system;M 5 (PO 4 ) 3 (Cl,F):(Eu 2+ ,Sb 2+ ,Mn 2+ ) and other halophosphates; (Sr, Ba, Ca) 5 (PO 4 ) 3 Cl:Eu 2+ SCAP phosphors such as. Furthermore, so-called quantum dots can also be introduced as converter materials. Quantum dots in the form of nanocrystalline materials containing II-VI compounds and / or III-V compounds and / or IV-VI compounds and / or metallic nanocrystals are preferred.

[0049] According to at least one embodiment, the luminescent element is arranged directly on the light exit surface of the protective cover. The light exit surface can be entirely or only partially covered by the luminescent element. In this respect, directly means that the luminescent element touches the light exit surface or only a connection means for attaching the luminescent element is arranged between the light exit surface and the luminescent element. The distance between the luminescent element and the light exit surface is preferably at most 10 μm or 5 μm or 2 μm.

[0050] Furthermore, a manufacturing method for an optoelectronic semiconductor component, such as a semiconductor laser, is provided, and therefore the features relating to the laser diode, the carrier, the protective cover, the luminescent element, the roughening, the anti-reflective coating, the catalytic coating and / or the anti-adhesion coating described above in relation to the semiconductor laser are also disclosed in relation to the manufacturing method and vice versa.

[0051] In at least one embodiment, the manufacturing method for the optoelectronic semiconductor component includes: - providing an optoelectronic semiconductor chip having an active area for generating radiation and a radiation exit area; - subsequently manufacturing a protective cover directly in the radiation exit area, the protective cover being preferably made of glass and manufactured using a hot stamping method, the semiconductor component being designed to operate without additional hermetic sealing in normal atmosphere; Includes.

[0052] In particular, the semiconductor chip is a laser diode as described above, as an alternative to a light emitting diode chip, or LED chip for short. The semiconductor chip is preferably mounted on a carrier. The protective cover can be a lens for collimating radiation, in particular laser radiation.

[0053] According to at least one embodiment of the method, the protective cover is in direct contact with a side surface of the carrier that runs parallel to the facets, preferably with a tolerance of at most 15° or 5°. The facets may be entirely covered by the protective cover, and the side surface of the carrier is partially or entirely covered by the protective cover.

[0054] The semiconductor laser described herein and the manufacturing method described herein will be described in more detail based on exemplary embodiments with reference to the drawings. The same reference numerals in the individual figures indicate the same elements. However, true proportions are not shown in the drawings and the individual elements are illustrated in an exaggerated manner for better understanding. [Brief description of the drawings]

[0055] [Figure 1A] 1 shows a schematic cross-sectional view of an exemplary embodiment of a semiconductor laser described herein. [Figure 1B] 1 shows a schematic plan view of a facet of an embodiment of a semiconductor laser described herein. [Diagram 2]Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Diagram 3] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 4] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Diagram 5] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 6] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 7] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 8] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 9] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 10] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 11] Shows a schematic cross-sectional view of method steps for manufacturing the semiconductor laser and optoelectronic semiconductor components described in this specification. [Figure 12] Shows a schematic cross-sectional view of method steps for manufacturing the semiconductor laser and optoelectronic semiconductor components described in this specification. [Figure 13] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 14] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification. [Figure 15] Shows a schematic cross-sectional view of an exemplary embodiment of the semiconductor laser described in this specification.

Embodiments for Carrying Out the Invention

[0056] 1A shows a cross-sectional view and FIG. 1B shows a plan view of an exemplary embodiment of a semiconductor laser 1. The semiconductor laser 1 is preferably mounted on a heat sink 11, together with which it forms an apparatus 10. The apparatus 10 is typically located in ambient air 12. Thus, the apparatus 10 is not further sealed or hermetically sealed against the ambient air 12.

[0057] The semiconductor laser 1 comprises a carrier 2, in particular a so-called submount. In the carrier 2 a laser diode 3 is arranged for generating laser radiation L. The laser radiation is, for example, blue light. For this purpose the laser diode 3 has an active region 33. The laser radiation L is emitted at a radiation exit region 31 of the active region 33. A preferably planar facet 30 of the laser diode 3 is oriented approximately perpendicular to the active region 33.

[0058] On the facet 30 and on the side surface 20 of the carrier 2 there is an adhesive 5, by means of which a protective cover is fixed. The protective cover is designed as a lens 4, preferably as a spherical lens, and has a light entrance surface 41 facing the facet 30 and a light exit surface 42 remote from the facet 30.

[0059] For example, the elliptical radiation exit area 31 is surrounded all around by adhesive 5 in a closed path in plan view, see Fig. 1B, in which case, for simplicity of illustration, the lens 4 is not shown and the protective cover 4 can be closed conforming to the outer contour of the adhesive 5, as is also possible in all other exemplary embodiments.

[0060] Thus, at the facet 30, the adhesive 5 defines a cavity 6 that is enclosed by a protective cover 4. The cavity 6 is either evacuated or filled with a protective gas. The side wall 65 of the cavity 6 facing the radiation exit area 31 is curved so that, when viewed in cross section, the cavity 6 appears biconvex, see FIG. 1A.

[0061] Viewed from above, the radiation exit area 31 may be centrally arranged in the cavity 6, see FIG. 1B. The adhesive 5 may have different widths in different directions around the radiation exit area 31. The adhesive 5 is preferably thin, whereby the average distance between the facet 30 and the light entrance surface 41 is preferably at most 5 μm. Optionally, an anti-reflection coating 44 for the laser radiation L is arranged on the light entrance surface 41. The same preferably applies to all other exemplary embodiments.

[0062] Using the cavity 6 together with the adhesive 5 and the protective cover 4, the laser diode 3 is encapsulated in close proximity to the facet. This encapsulation protects the radiation exit area 31 of the laser diode 3 from environmental influences and contamination. The encapsulation is therefore locally limited to the area of ​​the laser facet 30 itself and the surrounding mounting surface.

[0063] In the region of the facet 30, the seal forms a cavity 6. The cavity 6 thus formed is hermetically sealed against environmental influences. The optional protective gas or gas mixture can be, for example, H 2 , He, N 2 , He / O 2 During assembly of the protective cover 4, the radiation exit area 31 is set back by the gap of the adhesive 5. There is therefore no physical contact between the encapsulation element formed from the protective cover 4 and the adhesive 5 and the radiation exit area 31, neither during assembly nor during operation of the semiconductor laser 1.

[0064] Due to the encapsulation close to the facets as well as the refractive index jump between the cavity 6 and the protective cover 4, a potential back reflection of the emitted laser radiation L into the resonator of the laser diode 3 can occur, leading to disturbance of the resonator. To suppress this interaction, an anti-reflection coating 44 is provided, in particular for alternative or additional possible prevention of such interactions. See also Figures 2 and 3 below.

[0065] To produce the cavity 6, a ring structure, for example made of glass, is applied to the laser diode 3 and the carrier 2, or alternatively to the protective cover 4, in particular to the light entrance face 41. For bonding to the protective cover 4, the carrier 2 and the laser diode 3 are preferably brought to the required processing temperature. The bonding takes place under the action of temperature and, preferably, pressure.

[0066] Furthermore, it is possible to apply a glass sponge forming an adhesive 5 to the protective cover 4. For this purpose, a glass powder / binder mixture is applied to the protective cover 4 by a process such as printing or dispensing. A downstream temperature treatment, also called necking, removes the binder and sinters the glass powder. The protective cover 4 thus prepared is then applied to the structure of the carrier 2 and the laser diode 3 by means of temperature and, optionally, pressure.

[0067] Alternatively, a glass sponge for the adhesive 5 may be produced by chemical processes. For this purpose, for example, a specially adapted ring structure of glass is applied to the protective cover 4. The glass is preferably segregated into two or more phases by targeted temperature storage on a microscopic scale. One of the phases can be dissolved out of the remaining matrix wet-chemically. As described above, the sponge-like structure thus formed can be mounted on the carrier 2 and / or the laser diode 3 or also on the protective cover 4. The bonding takes place accordingly.

[0068] Furthermore, it is possible, in particular, to apply a structured metallization to the protective cover 4 as well as to the composite of the carrier 2 and the laser diode 3. For the joining, metal joining elements are attached. The joining elements are, for example, solder, metal sponges or prefabricated metal rings. The joining takes place under the action of temperature and, optionally, pressure.

[0069] By forming a microcavity 6 in the region of the radiation exit area 31, there is no mechanical contact between the radiation exit area 31 and the protective cover 4. With this encapsulation close to the chip, a significant miniaturization can be achieved compared to so-called TO housings.

[0070] 2, the protective cover 4 is applied in an oblique manner relative to the laser diode 3. The angle between the light entrance surface 41 and the facet 30 is, for example, 10°.

[0071] The diameter of the protective cover 4, whose light entrance surface 41 is in this case planar and whose light exit surface 42 is hemispherical, is for example between 0.2 mm and 0.8 mm, in particular around 0.4 mm. The same applies to all other exemplary embodiments.

[0072] In other respects, the exemplary embodiment of FIG. 2 preferably corresponds to that of FIG.

[0073] To prevent the influence of reflected laser radiation L, the light incidence surface 41 of the protective cover 4 of the exemplary embodiment of Fig. 3 has a roughening 43. The roughening 43 may be of regular or irregular design. The roughening 43 may extend over the entire light incidence surface 41 or may be limited to a central area of ​​the protective cover 4 allocated to the cavity 6. The average structure size of the roughening 43 is preferably at least 0.2 μm and / or at most 3 μm.

[0074] Possible measures to prevent the influence of back-reflected laser radiation L on the resonator of the laser diode 3 are also explained in connection with FIGS.

[0075] In the left side of Fig. 4 it is shown that the laser radiation R reflected back parallel to the facet 30 can reach the cavity of the laser diode 3. This is prevented by the tilted arrangement of the protective cover 4 relative to the laser diode 3, see the right side of Fig. 4. The angle between the facet 30 and the light entrance surface 41 is preferably between 5° and 15°.

[0076] Figure 5 illustrates that the back reflection R occurring on the left side of Figure 5 is prevented on the right side of Figure 5 by an anti-reflection coating 44. The anti-reflection coating 44 is formed, for example, by an alternating arrangement of layers with high and low refractive index, which is only diagrammatically shown in Figure 5. The anti-reflection coating 44 can be applied to both the light entrance surface 41 and the light exit surface 42, and can thus completely surround the actual body of the protective cover 4. The same is possible for the embodiment of Figure 1.

[0077] 4 and 5 as well, the adhesive 5 completely covers the radiation exit area 31, unlike in the case of Figs. 1 to 3. No cavity is therefore formed. The adhesive 5 is therefore preferably formed to be transparent to the laser radiation L, in particular from glass or from a glass mixture. The adhesive 5 is therefore of inorganic composition, as is possible in all other exemplary embodiments.

[0078] Figure 6 shows that the roughened portion 43 is present on the light incidence surface 41, as in Figure 3. The roughened portion 43 may also only partially cover the light incidence surface 41, deviating from the illustration in Figures 3 and 6. The explanations with reference to Figure 3 and also with reference to Figure 1 apply correspondingly to Figure 6, except for the omission of the cavity.

[0079] As in all other exemplary embodiments, it is possible that the protective cover 4 has straight sides between the light entrance surface 41 and the light exit surface 42, as seen in cross section. The sides represent, for example, cylindrical sides.

[0080] In Fig. 7 it is shown that the light entrance surface 41 is specifically designed to prevent disturbing back reflections. For this purpose the shape of the protective cover 4 is approximately biconvex when viewed in cross section. The area of ​​maximum bulge of the light entrance surface 41 is offset with respect to the active area 33 and thus with respect to the radiation exit area 31, so that the light entrance surface 41 is not oriented parallel to the facets 30 in the radiation exit area 31.

[0081] In the exemplary embodiment of Fig. 8, the adhesive 5 is designed as a refractive index matching layer 47. There is therefore no or only a small refractive index jump, symbolized by the dash-dotted line, between the adhesive 5 and the protective cover 4. Otherwise, the statements made up to this point regarding the exemplary embodiment apply correspondingly.

[0082] In the previous figures, in each case only one measure for preventing back reflections into the resonator of the laser diode 3 is depicted. A combination of these measures may also be performed. For example, a roughening 43 or a curved light input surface 41 may be combined with an inclined arrangement of the light input surface 41. An anti-reflection coating 44 may also be present in each case. In the exemplary embodiments, especially those of figures 5 to 7, a refractive index matching layer 47 may also be used.

[0083] 8, it is possible that the adhesive 5 and the protective cover 4 are the same or very similar materials. However, the processing temperature of the adhesive 5 is preferably lower than that of the protective cover 4.

[0084] By reducing or eliminating the optical interaction between the protective cover 4 and the cavity of the laser diode 3 in the case of a sealing close to the facet, an additional degree of freedom in the design is realized. In particular, a compact design is maintained.

[0085] 9, as may also be the case in all other exemplary embodiments, the laser diode 3 is shown connected to the heat sink 11 via bonding wires 13. As may also be the case in all other exemplary embodiments, the adhesive 5 may reach up to the heat sink 11, in which case it may extend at a distance from the carrier 2, or the carrier 2 may be integrated to the laser diode 3.

[0086] The interface surface accessible to the ambient air 12, from which the laser radiation L is emitted, is significantly increased by the protective cover 4 used close to the facet, resulting in a reduced effect of optical tweezers etc. and a reduced intensity of the laser radiation L at the interface, i.e. the light exit surface 42.

[0087] Otherwise, the descriptions relating to FIGS. 1 to 8 apply correspondingly to FIG.

[0088] 10, the light output surface 42 is preferably completely covered by a photocatalytic coating 45 and / or an anti-adhesion coating 46. The photocatalytic coating 45 is, for example, a thin platinum or titanium dioxide layer. With such a coating 45, the thermodynamic balance between the deposition of contaminants on the light output surface 42 of the protective cover 4 and the decomposition of potential deposits can be shifted in such a way that the accumulation of deposits is ensured to be reduced over the operating period of the semiconductor laser 1.

[0089] By applying the anti-adhesion coating 46, it is possible that no or little accumulation of impurities occurs at the light exit surface 42 and no burn-in of impurities occurs. The anti-adhesion coating 46 is preferably transparent to the laser radiation L. The anti-adhesion coating 46 is formed, for example, by a fluoropolymer such as polytetrafluoroethylene. Other possible materials for the anti-adhesion coating 46 are perylene derivatives such as perylene HT or sulfur compounds such as thiol-RDH or layered structures of carbon nanotubes.

[0090] For example, the semiconductor component of FIG. 9 or 10 is preferably manufactured by bonding the protective cover 4 with a suitable adhesive 5 by a gluing method, optionally with a subsequent heating and / or baking process. Silicone-based adhesives with very high purity and low hydrocarbon content are suitable for bonding the protective cover 4. Any volatile additives present in such adhesives 5 are optionally released by temperature storage, especially in the range of 180° C. to 300° C. Residual hydrocarbons are in turn optionally driven off by a baking process based on conditions defined with respect to the power of the laser radiation L and the environmental temperature.

[0091] Alternatively, it is possible to glue the protective cover 4 using glass as adhesive 5. In this case, preferably a medium melting point glass is used. The glass is applied to one of the two surfaces to be joined or to both surfaces. The glass is preferably applied by liquid dispersion at a temperature range of 300° C. to 450° C. After such a dispensing method, the protective cover 4 is mounted on the facet 30 of the laser diode 3, for example by means of a gripping process, also called pick and place.

[0092] Fig. 11 shows a manufacturing method for an optoelectronic semiconductor component 1, a semiconductor laser 1 manufactured according to Fig. 11. In this case, it is possible to dispense with the adhesive 5 used in connection with Figs. 1 to 10 altogether and still ensure a hermetic sealing of the radiation exit area 31.

[0093] For this purpose, with reference to Fig. 11A, a raw material 48, preferably glass, is applied in liquid form to the facets 30 and / or to the sides 20 of the carrier 2, in particular using a dispensing method. Alternatively, a glass powder, also called slip, is applied, which is preferably applied in a binder solution. The application may be carried out by dispensing, spraying, printing or jetting methods, preferably followed by a temperature storage step for debinding and compaction.

[0094] Alternatively, glass beads are introduced followed by a targeted local temperature treatment for attachment similar to the laser welding process, also called the laser melting process. In the case of laser melting, the shape of the glass droplet can be influenced by targeted adjustment of the energy density distribution in the beam profile, for example local melting with a normal profile or a so-called top hat profile.

[0095] Examples of suitable glass compositions are in particular from the group of optical glasses, in particular glasses with a low glass transition temperature not exceeding 400° C. or glasses with a very low glass transition temperature below 300° C. Such glasses are preferably made of tellurium oxide (Te 2 O 5 , Boron trioxide B 2 O 3 , silica SiO 2 , or bismuth oxide Bi 2 O 3 Suitable glass compositions preferably contain a high proportion of network interrupters, such as ZnO and / or CaO. To stabilize such glass compositions or to keep the tendency to crystallize low, aluminum oxide Al 2 O 3 may be added as an option.

[0096] Such glasses can be used in particular for the adhesive 5 of FIGS. 1 to 3, but also for example for the adhesive 5 of FIGS.

[0097] Alternatively or additionally, the laser diode 3 and / or the carrier 2 with the adhesive 5 applied thereto is heated, in particular until the temperature of the glass is low enough in viscosity for embossing. Preferably, the embossing process using a hot stamping tool 49, which can be heated, see FIG. 11B, is preferably carried out in a 10 4 dPa s to 10 8 dPa s range, preferably 10 4 dPa s to 10 5 It is carried out with a viscosity of 5 adhesives in the range of dPa·s.

[0098] The stamping tool 49 is made, for example, of platinum, gold, a platinum-gold alloy or graphite. Furthermore, hard metal tools 49 are suitable. Examples of these are tungsten carbide or titanium carbide, especially in a cobalt matrix.

[0099] The hot stamping tool 49 may have a coating which prevents adhesion of the adhesive 5. Such coatings are, for example, TiN, AlN and / or TiAlN. Preferably, an embossing tool 49 is used which has a low surface roughness, for example a roughness Ra of at most 100 nm. Surface-coated or surface-compacted graphite is particularly suitable for this purpose.

[0100] The applied protective cover 4 can be used for targeted light beam shaping. Alternatively, the protective cover 4 can be designed as a refractive optic, a diffractive optic, or a combination of both. The optically effective structures of the protective cover 4 can be designed as structures to increase light output. See also FIG. 12.

[0101] 11C illustrates the finished semiconductor component 1. In this case, the entire facet 30 and the entire side surface 20 of the carrier 2 can be covered by the protective cover 4.

[0102] In the method of Fig. 12, the optoelectronic semiconductor chip 3 is an LED chip, preferably having an integrated carrier 2 or alternatively a separate carrier, not shown. Optionally, the semiconductor chip 3 is attached to the carrier 11 via connection means 14, for example glue or solder points. Referring to Fig. 12A, a raw material 48 is applied to the protective cover 4.

[0103] 12B, an embossing process is then performed using an embossing tool 49, thereby obtaining a protective cover 4, for example, improving light output, as illustrated in FIG. 12C. In this way, a protective cover 4 is formed, which includes a roughened portion 43 at the light-emitting surface 42. For this purpose, the refractive index of the protective cover 4 may be similar to that of the semiconductor chip 3, for example, with a refractive index difference of at most 0.3, so that a high refractive index raw material 48 can be used for the protective cover 4.

[0104] In the exemplary embodiment of Fig. 13, the protective cover 4 is designed not as a lens but as a plane-parallel disk: the facets 30 are only partially covered by the adhesive 5 and end flush with the side surfaces 20. The same is possible in all other exemplary embodiments.

[0105] 14, a luminescent element 7, for example in the form of a plane-parallel ceramic plate, is attached to a protective cover 4. Only a connecting means 14, for example a thin layer of silicone adhesive, in particular having a thickness between 0.2 μm and 3 μm, is arranged between the plane-parallel protective cover 4 and the luminescent element 7.

[0106] The at least one phosphor for wavelength conversion may be limited to a region of the luminescent element 7 where the laser radiation L generated during operation impinges on the luminescent element 7. Optionally, a dichroic coating 73 is arranged on the entrance surface 72 of the luminescent element 7 facing the laser diode 3, which is transparent for the laser radiation L but reflects the radiation generated in the luminescent element 7.

[0107] Furthermore, it is possible for the carrier 2 to protrude above the side surface 30. Thus, the protective cover 4 may face away from the carrier and may be oblique to the carrier 2. The same may apply in all other exemplary embodiments.

[0108] 15, there is a luminescent element 7. In this case, the luminescent element 7 is applied directly, in particular over the entire surface of the light exit face 42, preferably with a constant and unchanging thickness.

[0109] Such luminescent elements 7 may also be present, preferably together with a dichroic coating 73, as in all other exemplary embodiments, as described in Figs.

[0110] In the configurations of FIGS. 13 to 15, measures for preventing back reflection into the resonator of the laser diode 3 may also be taken individually or in combination with each other, similarly to the configurations in FIGS.

[0111] Unless otherwise specified, the components shown in the figures follow each other directly in the order specified in each case. Layers that are not in contact in the figures are preferably spaced apart from each other. Where lines are drawn parallel to each other, corresponding surfaces are preferably likewise oriented parallel to each other. Likewise, unless otherwise specified, the relative positions of the components shown in the figures with respect to each other are duly reproduced in the figures.

[0112] The invention described herein is not limited by the specification, which refers to exemplary embodiments, and the invention specifically includes each and every novel feature and every combination of features, including every combination of features recited in the claims, even if that feature or combination itself is not explicitly recited in the claims or embodiments.

[0113] This patent application claims priority to German patent application No. 10 2017 123 798.4, the disclosure content of which is hereby incorporated by reference. [Explanation of symbols]

[0114] 1 Semiconductor lasers and optoelectronic semiconductor components 2. Career 20 Career Aspects 3 Laser diodes and optoelectronic semiconductor chips 30 Facets 31 Radiation exit area 33 Active area 4 Protective cover / lens 41 Light incidence surface 42 Light exit surface 43 Roughened area 44 Anti-reflective coating 45 Photocatalytic coating 46 Anti-adhesion coating 47 Refractive index matching layer 48 Lens materials 49 Hot stamping tools 5. Glue 6 Cavity 65 Cavity sidewall 7 Luminescent Elements 72 Incidence plane 73 Dichroic Coating 10 equipment 11 Heat sink 12 Ambient Air 13 Bonding Wire 14 Connection means L Laser radiation R is the laser radiation reflected at the lens angle between the facet and the light incidence surface

Claims

1. Career (2) and an edge-emitting laser diode (3) mounted on said carrier (2) and having an active region (33) for generating laser radiation (L) and having a facet (30) with a radiation exit region (31); A protective cover (4); an adhesive (5) by which the protective cover (4) is fixed to the facets (30) and to the sides (20) of the carrier (2); A semiconductor laser (1) comprising: the average distance between the light incidence surface (41) of the protective cover (4) and the facet (30) is at most 60 μm; The semiconductor laser (1) is configured to operate in a normal atmosphere without additional hermetic sealing; the light entrance surface (41) is provided with a roughening (43) so that it is configured to diffuse the reflected laser radiation (L) and so that the reflected laser radiation (L) does not reach the radiation exit area (31) or reaches it only attenuated and / or so that the resonator of the laser diode (3) is not disturbed by the reflected laser radiation (L), Semiconductor laser (1).

2. said protective cover (4) being a lens for collimation of said laser radiation (L) and having a minimum distance from said facet (30) of 0.1 μm; a cavity (6) is formed on the facet (30) in the region of the active area (33), said cavity (6) being surrounded all around by said adhesive (5) when viewed in a plan view of the facet (30), whereby the radiation exit area (31) through which the laser radiation (L) leaves the laser diode (3) is free of adhesive (5); A semiconductor laser (1) according to claim 1.

3. The cavity (6) is evacuated or filled with at least one protective gas, the average diameter of said cavities (6), as viewed in plan of said facets (30), is between 3 μm and 100 μm, and the thickness of said cavities (6) is between 0.5 μm and 20 μm, When viewed in plan view of the facet (30), the width of the adhesive (5) around the cavity (6) is at least 150% of the average diameter of the cavity (6) and is also at least 30 μm; 3. A semiconductor laser (1) according to claim 2.

4. said cavity (6) has a side wall (65) curved towards said adhesive (5) such that said cavity (6) has a biconvex shape at said radiation exit area (31) when viewed in a cross section perpendicular to said facets (30); The laser radiation (L) passes at a distance from the adhesive (5) towards the light entrance surface (41), 3. A semiconductor laser (1) according to claim 2.

5. said adhesive (5) directly covers the light entrance surface (41), the side surface (20) and the entire radiation exit area (31), said protective cover (4) being a lens for collimation of the laser radiation (L); the average distance between the light incidence surface (41) and the facet (30) is between 0.2 μm and 15 μm; A semiconductor laser (1) according to claim 1.

6. The entire light incidence surface (41) is covered with the adhesive (5); The refractive index difference between the protective cover (4) and the adhesive (5) at the wavelength of maximum intensity of the laser radiation (L) and at 300 K is at most 0.1; A semiconductor laser (1) according to claim 5.

7. said protective cover (4) comprises or consists of at least one of the following materials: sapphire, SiC; The wavelength of maximum intensity of the laser radiation (L) is between 365 nm and 460 nm, A semiconductor laser (1) according to claim 1 or 2.

8. The adhesive (5) is inorganic and contains or consists of at least one metal and / or at least one glass, A semiconductor laser (1) according to claim 1 or 2.

9. The adhesive (5) contains low-organic silicone, silazane and / or siloxane, or consists of low-organic silicone, silazane and / or siloxane; A semiconductor laser (1) according to claim 1 or 2.

10. the light entrance surface (41) of planar shape is oriented obliquely with respect to the facet (30) such that the laser radiation (L) reflected at the light entrance surface (41) is directed away from the radiation exit area (31) and / or such that the resonator of the laser diode (3) remains undisturbed by the reflected laser radiation (L), the angle (α) between the light incidence surface (41) and the facet (30) is between 5° and 25°; A semiconductor laser (1) according to claim 1 or 2.

11. The protective cover (4) is formed as a biconvex lens, the maximum bulge of the light entrance surface (41) towards the facet (30) is outside the optical axis of the laser radiation (L) so that the laser radiation (L) reflected at the light entrance surface (41) is directed away from the radiation exit area (31) and / or the resonator of the laser diode (3) remains undisturbed by the reflected laser radiation (L), A semiconductor laser (1) according to claim 1 or 2.

12. at least said light entrance surface (41) is provided with an anti-reflection coating (44) for said laser radiation (L) such that said light entrance surface (41) has a reflectivity for said laser radiation (L) of at most 0.5% and / or such that a resonator of said laser diode (3) remains undisturbed by the reflected laser radiation (L), A semiconductor laser (1) according to claim 1 or 2.

13. At least one light exit surface (42) of said protective cover (4) opposite said facet (30) is provided with a photocatalytic coating (45); the photocatalytic coating (45) is configured to remove and / or decompose deposits on the light exit surface (42) using the laser radiation (L); A semiconductor laser (1) according to claim 1 or 2.

14. At least one light exit surface (42) of said protective cover (4) opposite said facet (30) is provided with an anti-adhesion coating (46); The anti-adhesion coating (46) is configured to prevent deposits on the outside of the protective cover (4). A semiconductor laser (1) according to claim 1 or 2.

15. the active region (33) is arranged on a side of the laser diode (3) facing the carrier (2); said facet (30) protruding beyond said carrier (2) along a direction of passage of said laser radiation (L); A semiconductor laser (1) according to claim 1 or 2.

16. said semiconductor laser (1) further comprising a luminescence element (7) for partially converting said laser radiation (L) so as to emit a white mixed light in operation, The luminescent element (7) is arranged directly on the light exit surface (42) of the protective cover (4). A semiconductor laser (1) according to claim 1 or 2.

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