Metal fingerprint authentication card

Abstract

To provide a metallic fingerprint authentication card which can obtain an electric signal advantageous for fingerprint pattern acquisition by bringing a ground pattern formed on a film-like substrate into contact with a metal plate included in a card base material for electric conduction, and in which a circuit configuration in the film-like substrate includes an ESD protection circuit configuration.SOLUTION: There is provided a metallic fingerprint authentication card in which a film-like substrate and a magnetic sheet laminated on the film-like substrate are held by front and back card base materials and integrated. The film-like substrate is mounted with an external connection terminal, an active capacitance type fingerprint sensor, a wiring pattern, a loop antenna circuit for performing non-contact type communication, an IC module and a ground pattern. A spacer for adjusting the height of the ground pattern is provided on the rear surface at the position where the ground pattern of the film-like substrate is arranged, and the metal plate and the ground pattern are brought into contact with each other.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a metal fingerprint authentication card used for credit cards, debit cards, cash cards, access control cards, etc.

Background Art

[0002] In recent years, fingerprint authentication devices such as fingerprint authentication smart cards have begun to spread. Examples of fingerprint authentication smart cards include credit cards and access cards. The fingerprint authentication methods are roughly classified into three types: "capacitive", "optical", and "ultrasonic". Currently, the mainstream fingerprint authentication method is the "capacitive" method.

[0003] A passive capacitive fingerprint sensor measures the capacitance that changes according to the distance between the surface of a finger in contact with a conductive structure arranged near the sensor array and a sensing structure arranged in the sensor array, and detects a fingerprint pattern. When passively reading the capacitance between the surface of the finger and the sensing structure, since a relatively large capacitance is required, the protective layer needs to be made very thin, so it is quite sensitive to scratching and ESD (electrostatic discharge).

[0004] As an active capacitive fingerprint sensor, there is one that supplies an excitation signal to a finger through a conductive structure and measures the charge variation that the sensing structure of the sensor array acquires (see Patent Document 1). Since the potential difference between the surface of the finger touching the sensor array and the sensing structure of the sensor array becomes low for a dry finger, the acquisition sensitivity of the fingerprint pattern becomes low.

[0005] Also, as another active capacitive fingerprint sensor, when supplying an excitation signal to a finger from a sensing electrode, instead of using a conductive drive structure, the low potential (sensor ground) and high potential of the power supply voltage of the sensor are varied with respect to the device reference potential (device ground), and the reference potential (sensor ground) of the sensor array is oscillated with respect to the potential of the finger. When the sensor ground is oscillated, the potential of the sensing structure of the sensor array is oscillated up and down with respect to the device reference potential, and also oscillated up and down with respect to the potential of the finger touching the sensor array. By measuring the variation of the charge carried by the sensing structure due to the change in the voltage between the finger and the sensing structure, the distance between the surface of the finger and the sensing structure can be estimated. In this way, fingerprints can be sensed without a conductive structure for supplying an excitation signal to the finger (see Patent Document 2).

[0006] Since this fingerprint sensing depends on the varying potential of the finger, it is the same for fingers with different potentials and can improve the quality of the fingerprint pattern of dry fingers. Also, the finger can be grounded by the conductive part of the device. Since the amplitude of the finger excitation signal is not limited by the power supply voltage to the sensor array, it becomes possible to use a thicker protective film covering the sensing structure, resulting in a stronger fingerprint sensor.

[0007] Also, in the case of an active capacitive fingerprint sensing system and an electronic device equipped with a conductive housing, by arranging the potential of the conductive housing to be maintained at least intermittently at the reference potential of the electronic device, for example, electrical ground, the conductive housing can satisfy any additional electrical functions of the electronic device while assisting in the acquisition of fingerprint patterns in common mode noise and different electrical characteristics (wet / dry) of the finger. And by providing the housing connection circuit configuration with an ESD protection circuit configuration, it is also possible to prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration or other parts of the metal card.

[0008] Also, it switches between a signal following state in which the potential of the conductive housing is made to follow the finger excitation signal during fingerprint pattern acquisition and a reference potential state in which the potential of the conductive housing is maintained at the reference potential of the electronic device It can be provided with an active circuit configuration that can be controllably replaced. By making the potential of the conductive housing follow the finger excitation signal, the functionality can be enhanced as an active capacitive fingerprint sensing system.

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0010] When mounting the above - mentioned passive capacitive fingerprint sensor on a metal card, Since the capacitance between the surface of the finger and the sensing structure is passively read out, the sensitivity becomes low with a dry finger. Also, since the protective layer of the fingerprint sensor is very thin, there is a problem that it becomes quite sensitive to scratching and ESD. Further, when mounting a passive capacitive fingerprint sensor on a metal card using a metal plate on the front side of the card, in addition to the metal plate which is a part of the metal card around the fingerprint sensor, a conductive finger contact structure for making conductive contact with the user's finger when the fingerprint sensing system is used is required. The conductive finger contact structure needs to be insulated from the metal plate, which has a problem of affecting the design of the card.

[0011] Also, when mounting an active capacitive fingerprint sensor on a metal card, By connecting the ground of the internal circuit to the metal plate serving as the conductive housing, it is advantageous for obtaining the fingerprint pattern in common mode noise and different electrical characteristics of fingers (wet / dry). Furthermore, since the housing connection circuit configuration includes an ESD protection circuit configuration, it is possible to prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration and other parts of the metal card. Also, since there is no need to separately provide a conductive finger contact structure, a more flexible card design can be realized.

[0012] Incidentally, in a non-contact communicable metal card, in order to obtain sufficient power from the antenna, it is preferable to insert a magnetic sheet, such as a ferrite sheet, between the metal plate and the antenna circuit that can suppress eddy currents generated on the metal surface and well focus the magnetic flux from the antenna. In a metal fingerprint authentication card, in order to operate the fingerprint sensor, read, acquire, and collate the user's fingerprint with the registered fingerprint data for authentication, more power is required than in a normal metal card, and for that purpose, it is preferable to insert a magnetic sheet. However, when a magnetic sheet is provided between the film-like substrate on which the antenna circuit is arranged and the metal plate, in order to electrically connect the ground arranged on the same film-like substrate and the metal plate, it is necessary to bring the ground on the film-like substrate and the metal plate into contact and conduct them through a conductor that penetrates the magnetic sheet in some way.

[0013] In view of the above problems, the present invention aims to provide a metal fingerprint authentication card that is advantageous for fingerprint pattern acquisition in common mode noise and different electrical characteristics of fingers (wet / dry) by bringing the ground pattern formed on the film-like substrate into contact with and conducting it to the metal plate serving as the conductive housing, and further can prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration and other parts of the metal card since the circuit configuration inside the film-like substrate includes an ESD protection circuit configuration.

Means for Solving the Problems

[0014] In order to solve the above problems in the present invention, a first aspect of the present invention is a metal fingerprint authentication card integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate with front and back card substrates, wherein at least a part of the front card substrate among the front and back card substrates contains a metal plate, the film-like substrate is provided with an external connection terminal for communicating with an external device, an active capacitance type fingerprint sensor for acquiring fingerprint data of a user, a wiring pattern for connecting each component, a loop antenna circuit for performing non-contact communication, a fingerprint registration unit which is a memory in which the fingerprint data of the user is registered, and a fingerprint collation processing unit for comparing and collating the fingerprint of the user read by the fingerprint sensor and the fingerprint data registered in the fingerprint registration unit, and a ground pattern is mounted, a U-shaped slit is provided in the film-like substrate so as to surround the ground pattern, and an opening is provided in the magnetic sheet at a position where the ground pattern is mounted when laminated on the film-like substrate, a spacer for adjusting the height of the ground pattern may be provided on the back surface of the film-like substrate at the position where the ground pattern is arranged, and the metal plate and the ground pattern may be brought into contact with each other.

[0015] By sandwiching a film-shaped substrate and a magnetic sheet laminated on the film-shaped substrate between front and back card base materials, the layer structure inside the card becomes the front card base material / magnetic sheet / film-shaped substrate / rear card base material. With such a layer structure, in order to directly connect the metal plate contained in the front card base material and the ground pattern mounted on the film-shaped substrate, an opening is provided at the position of the ground pattern of the magnetic sheet, and the upper surface of the ground pattern needs to be exposed on the magnetic sheet. Then, by providing a spacer on the back surface of the film-shaped substrate (the side opposite to the surface with the ground pattern), the height of the ground pattern can be adjusted to make electrical contact with the metal plate. In addition, in order to reduce the influence of the deformation in the height direction of the film-shaped substrate caused by providing the spacer, it is desirable to provide a U-shaped slit around the ground pattern on the film-shaped substrate.

[0016] Also, a second aspect of the present invention is a metal fingerprint authentication card in which a film-shaped substrate and a magnetic sheet laminated on the film-shaped substrate are sandwiched between front and back card base materials and laminated and integrated, at least a part of the front and back card base materials, at least the front card base material, contains a metal plate, the film-shaped substrate is provided with an external connection terminal for communicating with an external device, an active capacitive fingerprint sensor for acquiring a user's fingerprint data, a wiring pattern for connecting each component, a loop antenna circuit for performing non-contact communication, a fingerprint registration unit which is a memory in which the user's fingerprint data is registered, and a fingerprint verification processing unit for comparing and verifying the fingerprint of the user read by the fingerprint sensor and the fingerprint data registered in the fingerprint registration unit, and a ground pattern is mounted, a U-shaped slit is provided on the film-shaped substrate so as to surround the ground pattern, and an opening is provided at the position where the ground pattern is mounted when the magnetic sheet is laminated on the film-shaped substrate, The thickness of the ground pattern itself may be adjusted so that the metal plate and the ground pattern are in contact with each other.

[0017] As another configuration example of directly connecting the metal plate and the ground pattern, the plating thickness for joining the ground pattern can be adjusted so that the metal plate and the ground pattern are brought into contact with each other.

[0018] Further, a third aspect of the present invention is a metal fingerprint authentication card in which a film-like substrate and a magnetic sheet laminated on the film-like substrate are sandwiched between front and back card substrates and laminated to be integrated, wherein at least a part of the front card substrate among the front and back card substrates includes a metal plate, on the film-like substrate, an external connection terminal for communicating with an external device, an active capacitance type fingerprint sensor for acquiring a user's fingerprint data, a wiring pattern for connecting each component, a loop antenna circuit for performing non-contact communication, a fingerprint registration unit which is a memory in which the user's fingerprint data is registered, and an IC module provided with a fingerprint collation processing unit for collating the fingerprint of the user read by the fingerprint sensor and the fingerprint data registered in the fingerprint registration unit, and a ground pattern is mounted, on the film-like substrate, a U-shaped slit is provided so as to surround the ground pattern, and on the magnetic sheet, an opening is provided at a position where the ground pattern is mounted when laminated on the film-like substrate, a metal foil is provided on the back surface of the film-like substrate at the position where the ground pattern is arranged, and the plating thickness of the metal foil may be adjusted so that the metal plate and the ground pattern are brought into contact with each other.

[0019] As another configuration example of directly connecting the metal plate and the ground pattern, a metal foil is provided on the back surface of the film-like substrate at the position where the ground pattern is arranged, and the plating thickness of the metal foil is adjusted so that the metal plate and the ground pattern can be brought into contact with each other.

[0020] Further, a fourth aspect of the present invention is The circuit configuration inside the film-like substrate may include an ESD protection circuit configuration.

[0021] Integrated circuits (ICs) are sensitive to ESD, and the high peak voltage and current of ESD can cause damage to the IC. To protect electrostatic-sensitive ICs from ESD, an ESD protection circuit can be created to prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration or other parts of the metal card by flowing the current to the ground.

Advantages of the Invention

[0022] According to the present invention, by bringing the ground pattern formed on the film-like substrate into close contact with and conducting it to the metal plate serving as the conductive housing, it is advantageous for fingerprint pattern acquisition in common mode noise and different electrical characteristics of fingers (wet / dry). Furthermore, by providing the circuit configuration inside the film-like substrate with an ESD protection circuit configuration, it is possible to provide a metal fingerprint authentication card that can prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration or other parts of the metal card. Since the ground pattern formed on the film-like substrate is used, there is no need to separately provide a conductor that penetrates the magnetic sheet, and the ground of the metal plate and the circuit board can be conducted while suppressing cost and thickness unevenness in the thickness direction of the card. Also, since there is no need to separately provide a conductive finger contact structure, a more flexible card design can be realized.

Brief Description of the Drawings

[0023]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0024] Embodiments of the metal fingerprint authentication card according to the present invention will be described with reference to the drawings. Here, the drawings are schematic, and the relationships of planar dimensions, the ratios of the thicknesses of each layer, etc. are different from the actual ones. Also, the embodiments shown below illustrate configurations for embodying the technical idea of the present invention, and the technical idea of the present invention is not limited to the materials, shapes, structures, etc. of the components being specified as follows.

[0025] <Embodiment 1> (Basic Configuration) FIG. 1 is a plan view showing the metal fingerprint authentication card 1 according to Embodiment 1 of the present invention. An external connection terminal 3 for contact communication and an active capacitive fingerprint sensor 4 that reads fingerprints and acquires fingerprint data are exposed on the base material 2 on the front side of the card. And inside, there is an IC module 5 (see FIG. 2) that stores fingerprint data, collates the fingerprint data generated by the fingerprint sensor 4 with the stored fingerprint data for a user's finger to determine whether they match, and communicates with an external device according to the collation result. In this embodiment, as communication means for communicating with an external device, both contact data communication and non-contact data communication are provided, but only non-contact data communication may be used.

[0026] The base material 2 on the card surface includes a metal plate in which at least a part of the layer is made of a metal material such as stainless steel or titanium with a thickness of 100 to 500 μm. Openings for exposing the external connection terminal substrate 3 and the fingerprint sensor 4 are provided in advance on the metal plate by laser or cutting. The contact terminal 3 and the fingerprint sensor 4 are exposed through the openings of the metal plate on the card surface base material 2. A resin sheet (intermediate resin layer, exterior resin layer) may be provided outside the metal plate, and printing may be applied to the surface of the metal plate or the resin sheet. However, in order to ensure that the metal plate and the user's finger always come into direct contact when the user touches the fingerprint sensor 4, it is necessary to provide a non-printed state or a non-printed area at regular intervals in the area around the fingerprint sensor 4.

[0027] Figure 2 is a plan view showing components mounted on a film-like substrate 10 disposed inside the front and back card base materials. As shown in Figure 2, an external connection terminal 3 for communicating with an external device, a capacitance type fingerprint sensor 4 for reading and acquiring the user's fingerprint data, a fingerprint registration unit which is a memory for registering the user's fingerprint data, and a fingerprint matching processing unit for comparing and matching the fingerprint of the user acquired by the fingerprint sensor with the fingerprint data registered in the fingerprint registration unit are provided in an IC module 5. A wiring pattern 7 for connecting each component and a loop antenna circuit 8 and a ground pattern 6 for performing non-contact communication are provided on the front side surface of the film-like substrate 10 with a conductive bonding material such as solder or ACP.

[0028] The IC module 5 is not exposed on the surface of the card 1 but is included in the card 1. As shown in Figure 5(a), in order to accommodate the IC module 5, a concave cavity is formed in the area of the metal plate located above the IC module 5.

[0029] The film-shaped substrate 10 has circuit patterns formed by etching aluminum, copper, etc. on the front and back of a plastic base material such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyether ether ketone (PEEK), or polyimide (PI). For the loop antenna circuit 8, a copper wire (winding coil), aluminum (etching antenna), etc. are used. The external connection terminal board 3 has copper patterns formed on both sides of a base material such as glass epoxy or polyimide, and those with plating treatments such as nickel, palladium, and gold on the copper patterns are used.

[0030] A U-shaped slit 9 is arranged so as to surround the ground pattern 6 that is connected to the circuit ground and arranged on the front side surface of the film-shaped substrate 10. The ground pattern 6 has a small contact resistance with the metal plate, and preferably has a size of 1 cm or more to ensure more reliable conduction. Also, by arranging it away from the center line of the card 1, it is preferable to minimize the stress applied to the ground pattern 6 portion when the card 1 is bent. 2 The above is preferable.

[0031] FIG. 3 is a diagram showing the magnetic sheet 20 of the present embodiment. By inserting the magnetic sheet 20 between the metal plate 22 (see FIG. 5) included in the card base material 2 on the surface and the film-shaped substrate 10, the generation of eddy currents on the metal surface is suppressed, and by well focusing the magnetic flux from the antenna, the power required for a series of operations of fingerprint authentication (operating the fingerprint sensor, reading and acquiring the user's fingerprint, and collating it with the registered fingerprint data for authentication) can be obtained from non-contact communication. The magnetic sheet 20 is provided with openings (13, 14, 15, 16 respectively) for exposing the external connection terminal board 3, the fingerprint sensor 4, the IC module 5, and the ground pattern 6. The thickness of the magnetic sheet 20 is 50 μm to 200 μm.

[0032] FIG. 4 is a plan view showing a state in which the magnetic sheet 20 is laminated on the film-shaped substrate 10 of the present embodiment. When laminating the magnetic sheet 20 on the film-shaped substrate 10, since each component mounted on the film-shaped substrate 10 is exposed from each opening of the magnetic sheet 20, by adjusting the height of the ground pattern 6 on the film-shaped substrate 10, the metal plate and the ground pattern 6 can be brought into direct contact and electrically connected. Further, by applying an adhesive to both sides of the magnetic sheet 20 during lamination, the adhesion during lamination can be enhanced.

[0033] The laminated product of the magnetic sheet 20 on the film-shaped substrate 10 is sandwiched between a metal plate 22 and an exterior resin such as PI or PET, and laminated by hot pressing to integrate the card base material. Here, instead of lamination by hot pressing, the card base material can also be integrated by cold pressing lamination using a two-component curable resin, a room temperature curable resin, or a UV curable resin. The sheet-shaped card base material integrated by lamination is formed into individual card shapes by laser or cutting.

[0034] Although not shown in the drawings of the present embodiment, by providing an ESD protection circuit configuration in the circuit configuration of the film-shaped substrate 10, it is also possible to prevent electrostatic discharge from damaging the fingerprint sensing circuit configuration and other parts of the metal card.

[0035] (Conductive contact configuration between metal plate and ground pattern) With reference to FIG. 5, a method of electrically connecting the metal plate 22 and the ground pattern 6 by adjusting the height of the ground pattern 6 on the film-shaped substrate 10 will be described.

[0036] FIG. 5(b) is a plan view and a schematic cross-sectional view taken along the Y - Y' plane of the metal fingerprint authentication card. As shown in FIG. 5(b), in the portion of the ground pattern 6, since the ground pattern 6 is exposed from the opening 16 of the magnetic sheet 20, by adjusting the height of the ground pattern 6 with the spacer 30, the metal plate 22 and the ground pattern 6 can be brought into direct contact and electrically connected.

[0037] As a method of electrically contacting the ground pattern 6 and the metal plate 22, as shown in Fig. 5(b), there is a configuration in which a spacer 30 for adjusting the height of the ground pattern is provided on the back surface of the film substrate 10 (the side opposite to the surface where the ground pattern 6 is located). At this time, by providing a U-shaped slit 9 that surrounds the ground pattern 6 in the film substrate 10, the load on the ground pattern 6 against deformation in the height direction can be reduced. When adjusting the height using the spacer 30, the bottom surface positions (connection surfaces with the film substrate 10) of the respective components have different heights, so the circuit on the film substrate 10 is curved in the card thickness direction. At this time, by cutting out the extra portion (such as around the circuit portion) of the film substrate 10 in a U-shape, it becomes possible to reduce the load on the circuit on the film substrate 10 during bending.

[0038] In order to electrically contact the ground pattern 6 on the film substrate 10 with the metal plate 22 it is necessary to form punching holes in the magnetic sheet 20 existing between the two. The size of the punching holes is preferably larger than the outer shape size of the spacer. This is to ensure sufficient space because the film substrate 10 is curved in the height direction due to the installation of the spacer.

[0039] The spacer 30 can take any shape, but the outer diameter size of the spacer 30 is preferably larger than the outer shape size of the ground pattern 6. This is to reduce the influence of stress changes on the film substrate 10 and the ground pattern 6 due to the spacer 30. Since the magnetic sheet 20, the ground pattern 6, the adhesive layer 23, and the metal plate 22 have ductility, the height of the spacer 30 is preferably 150 - 250 μm.

[0040] <Embodiment 2> Next, Embodiment 2 will be described with reference to Fig. 6. Fig. 6 is a schematic cross-sectional view of the metal fingerprint authentication card according to Embodiment 2 in the Y - Y' plane. The (basic configuration) of Embodiment 2 is the same as that of Embodiment 1.

[0041] (Conductive contact configuration between the metal plate and the ground pattern) As a method of conductive contact between the ground pattern 6 and the metal plate 22 in Embodiment 2, as shown in FIG. 6, a configuration is provided in which the thickness of the ground pattern 6 itself is increased by increasing the plating thickness for bonding the ground pattern 6 on the film-like substrate 10. When compared with the configuration in which the spacer 30 of Embodiment 1 is provided, advantages include a small stress change in the film-like substrate 10, small punching holes formed in the magnetic sheet 20, and a small number of manufacturing processes. The demerit is that the cost increases due to the increase in the plating thickness on the circuit. Since the magnetic sheet 20, the adhesive layer 23, and the metal plate 22 have malleability, the thickness of the ground pattern 6 is preferably 200 to 300 μm.

[0042] <Embodiment 3> Next, Embodiment 3 will be described with reference to FIG. 7. FIG. 7 is a schematic cross-sectional view of the metal fingerprint authentication card according to Embodiment 3 taken along the Y - Y' plane. The (basic configuration) of Embodiment 3 is the same as that of Embodiment 1.

[0043] (Conductive contact configuration between the metal plate and the ground pattern) As a method of conductive contact between the ground pattern 6 and the metal plate 22 in Embodiment 3, as shown in FIG. 7, a configuration is provided in which a metal foil 31 for adjusting the height of the ground pattern 6 is provided on the back surface of the film-like substrate 10 (the side opposite to the surface where the ground pattern 6 is located). Since the circuits on the film-like substrate 10 exist on both sides, it is possible to form a metal foil 31 for height adjustment on the surface opposite to the surface where the ground pattern 6 is located as shown in FIG. 7. At this time, a resist layer may be formed on the metal foil 31 on the back surface of the film-like substrate 10. In the configuration of Embodiment 3, a high mounting position accuracy is cited as an advantage compared with the case where the spacer 30 is used. Since the magnetic sheet 20, the adhesive layer 23, and the metal plate 22 have malleability, the total thickness of the ground pattern 6 and the height-adjusting metal foil 31 is preferably 200 to 300 μm.

Example

[0044] Hereinafter, a card example in which the present invention is specifically implemented is shown. Card dimensions: JIS X6301:2005 (ISO / IEC) Long side: 85.47 to 85.72 mm (nominal value 85.6 mm) Thickness: 0.68 to 0.84 mm (nominal value 0.76 mm)

Explanation of symbols

[0045] 1 ··· Metal fingerprint authentication card 2 ··· Surface base material of the metal fingerprint authentication card 3 ··· External connection terminal 4 ··· Active capacitance type fingerprint sensor 5 ··· IC module 6 ··· Ground pattern 7 ··· Wiring pattern 8 ··· Loop antenna circuit 9 ··· Slit (inside the film-like substrate) 10 ··· Film-like substrate 13 ··· Opening for external connection terminal 14 ··· Opening for fingerprint sensor 15 ··· Opening for IC module 16 ··· Ground pattern opening 20 ··· Magnetic sheet 21 ··· Exterior resin layer (surface) 22 ··· Metal plate 23 ··· Adhesive layer 24 ··· Intermediate resin layer 25 ··· Exterior resin layer (back side) 30 ··· Spacer 31 ··· Metal foil

Claims

1. A metal fingerprint authentication card integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate between front and back card substrates, wherein at least a part of the front card substrate of the front and back card substrates contains a metal plate, the film-like substrate is provided with an external connection terminal for communicating with an external device, an active capacitance type fingerprint sensor for acquiring fingerprint data of a user, a wiring pattern for connecting each component, a loop antenna circuit for performing non-contact communication, a fingerprint registration unit which is a memory in which the fingerprint data of the user is registered, and a fingerprint collation processing unit for comparing and collating the fingerprint of the user read by the fingerprint sensor and the fingerprint data registered in the fingerprint registration unit, and a ground pattern is mounted, the film-like substrate is provided with a U-shaped slit so as to surround the ground pattern, and the magnetic sheet is provided with an opening at a position where the ground pattern is mounted when laminated on the film-like substrate, a spacer for adjusting the height of the ground pattern is provided on the back surface of the film-like substrate at the position where the ground pattern is disposed, and the metal plate is brought into contact with the ground pattern. A metal fingerprint authentication card characterized by this.

2. A metal fingerprint authentication card integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate between front and back card substrates, wherein at least a part of the front card substrate of the front and back card substrates contains a metal plate, the film-like substrate is provided with an external connection terminal for communicating with an external device, an active capacitance type fingerprint sensor for acquiring fingerprint data of a user, a wiring pattern for connecting each component, a loop antenna circuit for performing non-contact communication, a fingerprint registration unit which is a memory in which the fingerprint data of the user is registered, and a fingerprint collation processing unit for comparing and collating the fingerprint of the user read by the fingerprint sensor and the fingerprint data registered in the fingerprint registration unit, and a ground pattern is mounted, the film-like substrate is provided with a U-shaped slit so as to surround the ground pattern, and the magnetic sheet is provided with an opening at a position where the ground pattern is mounted when laminated on the film-like substrate, A metal fingerprint authentication card, characterized in that the thickness of the ground pattern itself is adjusted to bring the metal plate into contact with the ground pattern.

3. A metal fingerprint authentication card integrated by sandwiching and laminating a film-like substrate and a magnetic sheet laminated on the film-like substrate with front and back card substrates, wherein at least a part of the front card substrate among the front and back card substrates contains a metal plate, the film-like substrate is provided with an external connection terminal for communicating with an external device, an active capacitance type fingerprint sensor for acquiring fingerprint data of a user, a wiring pattern for connecting each component, a loop antenna circuit for performing non-contact communication, a fingerprint registration unit which is a memory in which the fingerprint data of the user is registered, and an IC module provided with a fingerprint matching processing unit for comparing and matching the fingerprint of the user read by the fingerprint sensor with the fingerprint data registered in the fingerprint registration unit, and a ground pattern is mounted, the film-like substrate is provided with a U-shaped slit so as to surround the ground pattern, and the magnetic sheet is provided with an opening at a position where the ground pattern is mounted when laminated on the film-like substrate, a metal foil is provided on the back surface of the film-like substrate at the position where the ground pattern is arranged, and the metal fingerprint authentication card is characterized in that the plating thickness of the metal foil is adjusted to bring the metal plate into contact with the ground pattern.

4. The metal fingerprint authentication card according to any one of claims 1 to 3, characterized in that the circuit configuration inside the film-like substrate includes an ESD protection circuit configuration. ​

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