Wiring Substrate and Manufacturing Method

Abstract

To facilitate the identification of the front and back surfaces of a wiring board. 【Solution means】A wiring board that is a mirror board, wherein one of the front and back surfaces of the wiring board has a region where an insulating layer of a first color is formed as the outermost layer, and an identification mark where an insulating layer of a second color different from the first color is formed as the outermost layer. In the wiring board, the other surface different from one of the front and back surfaces has a region where an insulating layer of the first color is formed as the outermost layer, and the identification mark is at an end portion of one of the surfaces and is provided in a region where no components are mounted on one of the surfaces.

Description

Technical Field

[0001] The present disclosure relates to a wiring board, a manufacturing method, and the like.

Background Art

[0002] In some cases, it may be difficult to distinguish between the front and back surfaces of a wiring board. Patent Document 1 describes an example of a wiring board that uses different colors for an insulating layer formed as an outermost layer on one surface side of the wiring board and an insulating layer formed as an outermost layer on the other surface side of the wiring board, and identifies the front and back surfaces based on the color difference.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in a mirror mounting board, since the appearance of the front and back surfaces of the printed wiring board is similar, it is more difficult for an operator to distinguish between the front and back surfaces.

[0005] An example of the object of the present disclosure is to provide a wiring board or the like that can facilitate the identification of the front and back surfaces.

Means for Solving the Problems

[0006] A wiring board according to an aspect of the present disclosure is a wiring board that is a mirror board, either the front or back surface has a region where an insulating layer of a first color is formed as the outermost layer and an identification mark where an insulating layer of a second color different from the first color is formed as the outermost layer, the other surface different from the either surface of the front and back surfaces has a region where the insulating layer of the first color is formed as the outermost layer, The identification mark is at the end portion of any one of the surfaces, and is provided in an area where no component is mounted on any one of the surfaces.

[0007] A method for manufacturing a wiring board according to an aspect of the present disclosure is a method for manufacturing a wiring board that is a mirror board, and includes: a step of forming an insulating layer of a first color on a front surface; a step of forming an insulating layer of the first color on a back surface; a step of forming an insulating layer of a second color different from the first color on the front surface; and In the step of forming the insulating layer of the first color on the front surface, the step includes exposure and development so that the insulating layer of the first color is not formed in the area corresponding to the identification mark. In the step of forming the insulating layer of the second color on the front surface, the step includes exposure and development so that the insulating layer of the second color is formed in the area corresponding to the identification mark. The identification mark is at the end of the front surface and is formed in an area where no component is mounted on the front surface.

Advantages of the Invention

[0008] According to the present disclosure, it is possible to facilitate the identification of the front and back surfaces of the wiring board.

Brief Description of the Drawings

[0009]

Figure 1A

Figure 1B

Figure 2

Figure 3A

Figure 3B

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8A

Figure 8B

Figure 9A

Figure 9B

Figure 10

Figure 11

Figure 12

Figure 13A

Figure 13B

Figure 14

Embodiments for Carrying Out the Invention

[0010] Hereinafter, with reference to the drawings, embodiments of a wiring board and a method for manufacturing a wiring board according to the present disclosure will be described in detail. This embodiment does not limit the disclosed technology.

[0011] Here, a mirror mounting substrate is a substrate with the layout of a general printed wiring board as a mirror image. It is used in manufacturing processes where components are mounted on the back side of the wiring board or when required for specific applications. In a surface mount technology (SMT) manufacturing process, components are mounted on the surface, which is the top side of the substrate.

[0012] It is possible to mount components on both sides of a substrate called a mirror mounting substrate. Specifically, the layout and wiring design of a PWB (Printed Wiring Board) are inverted as a mirror image, and components are also mounted on the back side.

[0013] FIG. 1A and FIG. 1B are explanatory diagrams showing an example of a wiring board that is a mirror mounting substrate. In FIG. 1A and FIG. 1B, the entire wiring board 100 is a mirror mounting substrate. For example, in FIG. 1A and FIG. 1B, the entire wiring board 100 has a substrate A and a substrate B. In FIG. 1A and FIG. 1B, the same mounting is performed on the surface 101 of substrate A and the back surface 104 of substrate B, and the same mounting is performed on the back surface 103 of substrate A and the surface 102 of substrate B. Substrate A and substrate B are vertically symmetric with respect to the vertical symmetry axis. Note that when substrate A and substrate B are separated at the center such as the vertical symmetry axis, they become the same product.

[0014] Here, the ink that becomes an insulating film covering the surface of the wiring board is called a solder resist. In reality, the wiring board is covered with a copper foil, and further, the copper foil is covered with a solder resist. Not applying the solder resist is also called resist escape.

[0015] First, before describing specific embodiments, the inventor's consideration of providing an identification mark on either surface to distinguish the front and back surfaces of the wiring board will be explained.

[0016] At the beginning of the process of mounting components on a printed wiring board, the printed wiring board is placed in a board loader. The board loader is a device for automatically supplying a printed wiring board to a machine in a manufacturing line. In some cases, an operator may manually arrange the printed wiring boards on the board loader. When the printed wiring board is a mirror mounting board, since the appearance of the back surface and the front surface is similar, it is difficult for the operator to distinguish them. In such a case, the inventor considered that it is effective to provide an identification mark on either surface. For example, it is desired that the display position of the identification mark be a position where the operator can identify the front and back surfaces of the printed wiring board even when the printed wiring board is arranged on the board loader. For example, when the printed wiring board is arranged in the board loader with the front surface facing up, it was considered to provide an identification mark at the tip portion of the front surface of the printed wiring board in the direction of taking out the printed wiring board from the board loader. For example, a part of the identification mark is formed in a region within 5 millimeters from the end opposite to the insertion direction in which the wiring board is inserted into the board loader. Also, it is desirable that the identification mark has contrast (brightness and darkness) with the portion of the solder resist which is another insulating layer. Even if the printed wiring board is inserted into the board loader with the back surface facing up when it should be inserted with the front surface facing up, if the operator cannot confirm the identification mark of the printed wiring board, the operator can easily notice that the printed wiring board has been erroneously inserted into the board loader with the back surface facing up.

[0017] Multiple methods can be considered for realizing the identification mark depending on the design specifications of the PWB. Here, examples include a method of forming the identification mark by silk screen printing, a method of exposing the copper foil, and the like.

[0018] First, an example in which an identification mark is applied to a printed wiring board by silk screen printing was examined. Silk screen printing is sometimes abbreviated as silk printing. Silk printing on a printed wiring board is used to print identification marks such as letters and symbols on the wiring board.

[0019] FIG. 2 is an explanatory diagram showing an example of an identification mark formed by silk printing. In FIG. 2, the entire wiring board 200 is a mirror wiring board. The wiring board 200 in FIG. 2 further has a discard board 213 provided on the wiring board 100 shown in FIGS. 1A and 1B. The discard board 213 is a board provided by using a V-cut, perforations, etc. with respect to the outer periphery of the portion of the actual wiring board that becomes the product. In FIG. 2, an identification mark 214 is shown by silk printing in the region of the discard board 213 on the surface of the wiring board 200.

[0020] For example, the identification mark 214 is provided within 5 millimeters from the end opposite to the insertion direction d in which the wiring board 200 is inserted into the board loader.

[0021] When silk printing is used, since the identification mark 214 has a thickness, it may affect the soldering process of the components.

[0022] FIG. 3A is an explanatory diagram showing an example of soldering being performed on the wiring board 200 using a solder printing jig. In FIG. 3A, in the wiring board 200, the original board 217 is covered with a copper foil 216. And a green solder resist 215 is formed as the outermost insulating layer on the wiring board 200.

[0023] As shown in FIG. 3A, when components are mounted with solder on this wiring board 200 using a solder printing jig 20. As shown in FIG. 3A, the solder printing jig 20 becomes parallel to the surface of the wiring board 200, and the solder is uniformly pressed.

[0024] FIG. 3B is an explanatory diagram showing an example of soldering being performed on a wiring board 200 having silk printing using a solder printing jig. When components are mounted with solder, since the identification mark 214 by silk printing has a thickness, there is a portion where the solder printing jig 20 does not closely adhere to the wiring board 200. For this reason, uneven application of solder may occur, and the amount of solder may become non-uniform. And the deterioration of product quality may occur.

[0025] Thus, when the identification mark 214 is created by silk printing, there is a possibility that a thickness may be formed on the surface of the wiring board 200. Since it is necessary to suppress the thickness from the surface of the wiring board 200, it is assumed that it is difficult to use silk printing.

[0026] Next, the inventor considered using the copper foil on the surface of the wiring board as the identification mark.

[0027] FIG. 4 is an explanatory diagram showing an example in which the copper foil on the surface of the wiring board is used as the identification mark. The inventor creates a region where no green solder resist is formed in a part of the discard board 313 of the wiring board 300 without using silk printing. This region is the resist escape portion 316 in FIG. 4. Then, the inventor considered using the copper foil 315 on the surface of the wiring board 300 as the identification mark by exposing the copper foil 315 at the resist escape portion 316. As a result, light and dark are formed between the green solder resist and the copper foil 315. Therefore, the copper foil 315 becomes the identification mark.

[0028] FIG. 5 is an explanatory diagram showing an example in which the copper foil touches a non-insulating object. There may be a case where the discard board cannot be used. For this reason, the inventor considered creating the identification mark shown in FIG. 4 inside the product. In such a case, as shown in FIG. 5, the wiring board 400 has a resist escape portion 416 where no green solder resist is formed, similar to FIG. 4. If the exposed copper foil 415 touches a non-insulating object due to the exposure 17 of the exposed signal wiring, a short circuit will occur. Therefore, it is difficult to apply an identification mark using the copper foil 415 inside the product from the viewpoint of safety.

[0029] Therefore, the identification mark using the copper foil can be used as shown in FIG. 4 when a board for supporting the wiring board is provided during product manufacturing called a discard board.

[0030] However, there are requirements such as that silk printing cannot be used in the design specifications of the wiring board and that disposable boards are not used. For this reason, the inventor considered creating an identification mark inside a board that is not a disposable board.

[0031] FIG. 6 is an explanatory diagram showing an example in which an extremely narrow identification mark is created at the end of a board. In FIG. 6, in order to prevent the copper foil inside the wiring board 500 from being exposed, a resist escape portion 518 is formed as an identification mark with a width of about 0.5 millimeters in the copper foil prohibition area at the end of the wiring board 500.

[0032] However, since it is the end of the wiring board 500, although the width is reduced, it is difficult to distinguish between light and dark. For this reason, it is difficult for an operator to find the identification mark, so even though the identification mark is provided, identification becomes difficult.

[0033] FIG. 7 is an explanatory diagram showing an example in which a semicircular notch is created on the end face of a board. Next, as shown in FIG. 7, the inventor considered adding a semicircular notch 19 (groove) with a radius of about 1 millimeter to the end of the wiring board 600. Thereby, an operator can identify the front and back surfaces of the wiring board 600 by checking the notch 19. However, a difference occurs in the outer shape of the product board such as whether there is a notch in the product or not. Also, there may be cases where a notch cannot be added to the wiring board 600 in terms of structural design.

[0034] As described above, the inventor considered various methods. When an effective display cannot be ensured, it takes time to discriminate only by visual inspection by an operator. Therefore, as will be described using the embodiments, the inventor found a wiring board in which an identification mark is formed using an insulating film of a color different from that of the outermost insulating film on any surface of the wiring board.

[0035] (Embodiment) FIG. 8A is an explanatory diagram showing an example of the front surface of a wiring board. FIG. 8B is an explanatory diagram showing an example of the back surface of a wiring board.

[0036] The wiring board 1 shown in FIGS. 8A and 8B is a mirror mounting board. The entire wiring board 1 has an A board and a B board. As described with reference to FIGS. 1A and 1B, FIGS. 8A and 8B are the same in that the same components are mounted on the front surface 11 of the A board and the back surface 14 of the B board, and the same components are mounted on the back surface 13 of the A board and the front surface 12 of the B board. The A board and the B board are vertically symmetric when folded along the vertical symmetry axis.

[0037] In this embodiment, as an example of the mirror mounting board, the wiring board 1 having two boards, an A board and a B board, is taken as an example. For example, identification marks 10 may be provided on a total of four mirror mounting boards, two A boards and two B boards, or identification marks 10 may be provided on a total of six wiring boards, two A boards, two B boards, and two C boards. Thus, the mirror mounting board is a board in which the front and back surfaces have the same component arrangement in a state where a plurality of boards are integrated. Further, the mirror mounting board refers to a board design in which components can be mounted on both sides without changing the arrangement of the manufacturing line. Thus, the wiring board 1 provided with the identification mark 10 is not limited to the examples of FIGS. 8A and 8B.

[0038] In FIGS. 8A and 8B, an insulating layer of a first color is formed as the outermost layer on the front and back surfaces of the A board and the front and back surfaces of the B board. Note that the insulating layer may be called a solder resist. On the front surface 12 of the B board, there is a region where a part of the region where no components are arranged is not covered with the solder resist 5 of the first color.

[0039] Figures 9A and 9B are explanatory diagrams simply showing a method for creating an identification mark. Figures 9A and 9B show the cross-section AA-AA' of Figure 8A. For example, in Figure 9A, a copper foil is covered on a substrate. And the copper foil is covered with a solder resist 5 of a first color. At this time, for Figure 9A, there is a resist escape portion 6 in a part of the cross-section AA-AA'. As shown in Figure 9B, a solder resist 7 of a second color is formed at the resist escape portion 6. This solder resist of the second color becomes the identification mark. As shown in Figure 9B, a solder resist of the second color having the same thickness as the solder resist 5 of the first color is formed. In this way, the solder resist 7 of the second color is also formed as the outermost layer similarly to the solder resist 5 of the first color. That is, as shown in Figure 9A, the solder resist 7 of the second color and the solder resist 5 of the first color are formed in substantially the same plane. Therefore, since the identification mark has no thickness, it is possible to suppress the influence on the soldering process of the component.

[0040] Figure 10 is an explanatory diagram showing an example of a wiring board on which an identification mark is formed. The wiring board 1 is, for example, a mirror wiring board. Either the front surface or the back surface of the wiring board 1 has a region where an insulating layer of a first color is formed as the outermost layer and an identification mark 10 where an insulating layer of a second color different from the first color is formed as the outermost layer. Either one of the front surface and the back surface and the other surface have a region where an insulating layer of a first color is formed as the outermost layer. The identification mark 10 is a portion at the end of either surface and is provided in a region where no component is mounted.

[0041] In Figure 10, the wiring board 1 has a substrate A and a substrate B. An identification mark 10 formed with a solder resist of a second color is provided on the front surface 12 of the substrate B. It is desirable that the first color and the second color are colors such that the operator can distinguish between light and dark to the extent that the identification mark 10 can be confirmed.

[0042] For example, as the first color, green, which is a common solder resist color, can be cited as an example. As the second color that can be distinguished from green, white can be cited as an example. The combination of the first color and the second color is not particularly limited as long as it can be identified by the operator. For example, the first color may be black and the second color may be white. For example, the first color may be black and the second color may be green. For example, the first color may be black and the second color may be yellow.

[0043] White solder resist, yellow solder resist, etc. have a high reflectance of visible light, so they are easy to identify in visual inspection. Thus, a bright-colored solder resist with a high reflectance of visible light may be used as the identification mark 10. That is, for easy identification in visual inspection, the second color, which is the identification mark 10, may be a bright color and the first color may be a dark color. However, the first color may also be a bright color, or the second color may also be a dark color. The designer may use a resist of an appropriate color in consideration of soldering reliability, ease of visual inspection, and device characteristics.

[0044] Also, for example, when the wiring board 1 is a mirror mounting board, even if display by silk printing cannot be performed, a discard board cannot be added, and signal wirings are arranged up to the vicinity of the end face of the wiring board, an identification mark 10 with light and dark can be created. Although the case where the wiring board 1 is a mirror wiring board is cited as an example, the identification mark 10 may be provided not only for the mirror wiring board.

[0045] In FIG. 10, a part of the identification mark 10 is formed in a region within 5 millimeters from the end opposite to the insertion direction d in which the printed wiring board is inserted into the board loader. For example, the reason why the identification mark 10 is set in a region within 5 millimeters from the end of the wiring board 1 is that when the wiring boards are arranged in the board loader, the operator can see the identification mark 10. If the identification mark 10 is provided more than 5 millimeters inside from the end of the wiring board 1, the identification mark 10 may enter the shadow where the wiring boards 1 overlap in the board loader, and thus the operator may not be able to see the identification mark 10. In this way, the region within 5 millimeters is an example of the end portion of the wiring board 1, and the position where the identification mark 10 is arranged may be appropriately determined according to the size of the wiring board 1 and the board loader.

[0046] In FIG. 10, let the size of the identification mark 10 in the insertion direction d be represented by x1, and the size of the identification mark 10 in the direction perpendicular to the insertion direction d be represented by y1. x1 may be, for example, about 3 to 5 millimeters. In particular, it is preferable that x1 is about 5 millimeters. y1 may be about 10 to 20 millimeters. In particular, it is preferable that y1 is about 20 millimeters. For example, when some identification mark is provided by silk printing or the like, the size of the identification mark 10 is preferably 5 millimeters × 20 millimeters or more. However, the region where no components are mounted on the wiring board 1 is narrow. Therefore, when the identification mark 10 is rectangular, for example, if x1 is about 5 millimeters and y1 is about 20 millimeters, it is preferable because the operator can easily see the identification mark 10. Generally, the width capable of forming a resist is 0.3 millimeters or more. Note that the size of the identification mark 10 only needs to be a size that can be identified by the operator and can be appropriately changed according to the position of the components mounted on the wiring board 1 and the like. Also, in FIG. 10, the sides of the identification mark 10 are substantially parallel to the insertion direction d, but are not particularly limited.

[0047] In FIG. 10, the identification mark 10 has, for example, a rectangular shape. For example, it is easier to design a mask for exposure and easier to perform exposure when the identification mark 10 has a linear shape such as a rectangle. In particular, for example, it is better if the identification mark 10 is rectangular such as a rectangle or a quadrilateral. For example, an operation such as arranging the wiring board 1 on the substrate loader is a manual operation, and an identification operation for identifying the front (front) and back of the wiring board 1 is a visual operation. Therefore, it is easy to recognize that the contrast between the identification mark 10 and the first-color solder resist 5 is rectangular. However, the shape of the identification mark 10 is not particularly limited, such as a circle or a triangle. For example, in the rectangle of the identification mark 10 shown in FIG. 10, the side in the loading direction d into the substrate loader is shorter than the side substantially orthogonal to the loading direction d.

[0048] Even if there is a requirement that silk printing cannot be used in the design specifications of the wiring board, according to the wiring board 1, an identification mark 10 that can easily identify the front and back surfaces can be displayed on the wiring board. Further, according to the wiring board 1, the identification mark 10 can be formed with the same thickness as the original outermost insulating film. The original outermost insulating film is, for example, the first-color solder resist 5 in FIGS. 9A and 10. In other words, the original outermost insulating film and the identification mark 10 are formed in substantially the same plane as shown in FIG. 9A. Therefore, even if the identification mark 10 is displayed on the wiring board 1, it is possible to suppress the influence on a soldering process or the like for connecting components to the wiring board 1. Further, even if there is a requirement such that the use of a scrap board is not possible, according to the wiring board 1, the identification mark 10 can be created inside the board.

[0049] FIG. 11 is an explanatory diagram showing an example in which wiring boards with identification marks formed thereon are arranged on a substrate loader. In FIG. 11, the wiring board 1 is simply shown with parts not used in the description omitted. As described above, at the beginning of the process of mounting components on the wiring board 1, the wiring board 1 is loaded onto the substrate loader 15. The substrate loader 15 is a device for automatically supplying a wiring board to a machine in a manufacturing line. There are cases where an operator manually arranges the wiring boards on the substrate loader 15.

[0050] As shown in FIG. 11, the identification mark 10 of the wiring board 1 may be provided at a position visible to the operator even when the wiring boards 1 are arranged in the board loader 15.

[0051] In FIG. 11, five wiring boards 1-1 to 1-5 are arranged in the board loader 15. Identification marks 10-1 to 10-5 are formed on the surfaces of the wiring boards 1-1 to 1-5, respectively. For example, when the wiring board 1 is arranged in the board loader 15 with the surface facing up, the operator can see the identification mark 10 of each wiring board 1.

[0052] FIG. 12 is an explanatory diagram showing another example in which the wiring boards 1 with the identification marks 10 formed thereon are arranged in the board loader 15. Similar to FIG. 11, in FIG. 12, the wiring board 1 is simply shown with parts not used in the description omitted. For example, in FIG. 12, the identification mark 10-4 cannot be seen on the fourth wiring board 1-4 from the top. Therefore, the operator can notice that the fourth wiring board 1-4 has been mistakenly inserted into the board loader 15 with the back side facing up.

[0053] By providing the identification mark 10 on the wiring board 1 as described above, it is possible to facilitate the identification of the front and back surfaces of the wiring board 1. As described above, when the wiring board 1 is a mirror mounting board, the front and back surfaces look similar, so it is difficult for the operator to distinguish between the back and front surfaces. Therefore, the identification mark 10 is particularly useful in a mirror mounting board. In addition, by having the identification mark 10 at a position visible when the wiring board is in the board loader 15, the work efficiency can be improved.

[0054] FIG. 13A is an explanatory diagram showing a process of forming a solder resist of a first color on the back and front surfaces without creating the identification mark 10. Here, green is taken as an example of the first color for explanation.

[0055] For example, in the method of manufacturing a wiring board, a step of forming a green solder resist on the surface is performed (step S11). Next, for example, in the method of manufacturing a wiring board, a step of forming a green solder resist on the back surface is performed (step S12). As a result, solder resists are formed on the outermost layers on both sides.

[0056] FIG. 13B is an explanatory diagram showing a flow when creating the identification mark 10 on the surface. Here, an example where the identification mark 10 is formed on the surface of the wiring board 1 will be described. The first color is green and the second color is white as examples. For example, in the method of manufacturing the wiring board 1, a step of forming a green solder resist 5 on the surface is performed (step S21). Next, for example, in the method of manufacturing the wiring board 1, a step of forming a green solder resist 5 on the back surface is performed (step S22).

[0057] Then, for example, in the method of manufacturing the wiring board 1, a step of forming a white solder resist 7 on the surface is performed (step S23). This concludes the description of the method of manufacturing the wiring board 1.

[0058] As shown in FIG. 13B, after the green solder resist 5 is formed on both sides, the white solder resist 7 may be formed on the surface. As described above, the wiring board 1 with the identification mark 10 as shown in FIG. 10 can be obtained. Thus, in the method of manufacturing the wiring board 1, by adding a step of creating a solder resist to the steps shown in FIG. 13A, the identification mark 10 can be created. Also, in the method of manufacturing the wiring board 1, the thickness of the green solder resist 5 on the surface of the wiring board 1 and the thickness of the white solder resist 7 for the identification mark 10 are formed to be substantially the same.

[0059] After the green solder resist 5 is formed on the front surface, the green solder resist 5 is formed on the back surface, and the white solder resist 7 is formed on the front surface. The order of the steps is cited as an example because it is expected that the current substrate manufacturers will have good work setup efficiency. Note that the order of the steps shown in FIG. 13B is not particularly limited, and the order of the steps may be appropriately changed so that the efficiency of the substrate manufacturer is improved. For example, the green solder resist 5 may be formed on the back surface, the green solder resist 5 may be formed on the front surface, and the white solder resist 7 may be formed on the front surface. For example, the white solder resist 7 may be formed on the front surface, the green solder resist 5 may be formed on the front surface, and the green solder resist 5 may be formed on the back surface.

[0060] FIG. 14 is an explanatory diagram showing the flow of the solder resist formation process. For example, the solder resist formation process, which is each step shown in FIGS. 13A and 13B, will be described in detail.

[0061] In the solder resist formation process, specifically, there are four steps: a coating process (step S31) of applying the solder resist, an exposure process (step S32) of performing exposure, a development process (step S33) of developing, and a stripping process (step S34) of stripping.

[0062] In step S31, in the coating process, the liquid resist is sprayed onto the wiring board.

[0063] In the exposure process in step S32 and the development process in step S33, exposure and development are performed on the formation location using a mask film in the shape of the location where the resist is not formed.

[0064] In the stripping process in step S34, the unnecessary resist that has not been exposed and developed is washed away.

[0065] Here, when the identification mark 10 is formed on the surface of the wiring board 1, in the step of forming the insulating layer of the first color on the surface, the steps of exposure and development are included so that the insulating layer of the first color (solder resist 5) is not formed in the region corresponding to the identification mark 10. And in the step of forming the insulating layer of the second color (solder resist 7) on the surface, the steps of exposure and development are included so that the insulating layer of the second color (solder resist 7) is formed in the region corresponding to the identification mark 10. That is, the mask film for the solder resist 5 of the first color, which is the mask film for the surface, is shaped such that the solder resist 5 of the first color is not formed in the region where the identification mark 10 is formed. The mask film for the white solder resist 7 is shaped such that the solder resist 7 of the second color is formed in the region where the identification mark 10 is formed, and the solder resist 7 of the second color is not formed in the region other than the identification mark 10. Thereby, the two different-color solder resists are prevented from being overcoated. Therefore, the two-color solder resists can be separately applied without increasing the thickness on the surface of the wiring board.

[0066] In addition, in the region where components are arranged, wirings, pads, via holes, etc. also expose from each insulating layer. Since existing technologies may be used for these manufacturing methods, detailed descriptions are omitted.

[0067] Above, the example in which the identification mark 10 is formed on the surface of the wiring board 1, particularly on the surface 12 of the B board, has been described. For example, the identification mark 10 may be formed on the surface 11 of the A board of the wiring board 1. Also, in a mirror mounting board, since the front and back surfaces look the same, the space where the identification mark 10 can be formed is the same on both the front and back surfaces. For example, the identification mark 10 may be formed on the back surface 13 of the A board or the back surface 14 of the B board of the wiring board 1. Also, the wiring board 1 may be a board other than a mirror board. In the case of the wiring board 1 other than the mirror mounting board, which surface of the wiring board 1, the front or the back, the identification mark 10 is formed on may be appropriately determined.

[0068] An example of a method for manufacturing the wiring board 1 when the identification mark 10 is formed on the back surface of the wiring board 1 will be described. For example, in the method for manufacturing the wiring board 1, a step of forming the solder resist 5 of the first color on the back surface is performed. Next, for example, in the method for manufacturing the wiring board 1, a step of forming the solder resist 5 of the first color on the front surface is performed. Then, for example, in the method for manufacturing the wiring board 1, a step of forming the white solder resist 7 on the back surface is performed. When the identification mark 10 is formed on the front surface of the wiring board 1, the step of forming the insulating layer of the first color on the back surface includes a step of exposing and developing so that the insulating layer (solder resist 5) of the first color is not formed in the region corresponding to the identification mark 10. And in the step of forming the insulating layer (solder resist 7) of the second color on the back surface, it includes a step of exposing and developing so that the insulating layer (solder resist 7) of the second color is formed in the region corresponding to the identification mark 10. The mask film for the solder resist of the first color, for the mask film for the back surface, is in a form such that the solder resist 5 of the first color is not formed in the region where the identification mark 10 is formed, similar to the example made on the front surface. The mask film for the solder resist 7 of the second color is in a form such that the solder resist 7 of the second color is formed in the region where the identification mark 10 is formed, and in a form such that the solder resist 7 of the second color is not formed in the region other than the identification mark 10. Thereby, the solder resists of two different colors are prevented from being overcoated.

[0069] Also, for example, in the method for manufacturing the wiring board 1, a step of forming the solder resist 5 of the first color on the front surface is performed. Next, for example, in the method for manufacturing the wiring board 1, a step of forming the solder resist 5 of the first color on the back surface is performed. Then, for example, in the method for manufacturing the wiring board 1, a step of forming the solder resist 7 of the second color on the back surface may be performed.

[0070] Although the present disclosure has been described with reference to the embodiments, the present disclosure is not limited to the above embodiments. The configurations and details of the present disclosure may include embodiments to which various changes understandable by those skilled in the art within the scope of the present disclosure are applied. The present disclosure may include embodiments in which the matters described in this specification are appropriately combined or replaced as necessary. For example, the matters described using a specific embodiment can also be applied to other embodiments as long as no contradiction occurs. For example, although a plurality of operations are described in order in the form of a flowchart, the described order does not limit the order in which the plurality of operations are executed. Therefore, when implementing the embodiment, the order of the plurality of operations can be changed as long as the content is not impaired.

[0071] Some or all of the above embodiments can also be described as follows in the appended claims. However, some or all of the above embodiments are not limited to the following.

[0072] (Appended Claim 1) A wiring board that is a mirror board, Either the front surface or the back surface has a region where an insulating layer of a first color is formed as the outermost layer, and an identification mark where an insulating layer of a second color different from the first color is formed as the outermost layer, The other surface different from either the front surface or the back surface has a region where the insulating layer of the first color is formed as the outermost layer, The identification mark is at an end portion of either surface and is provided in a region where no component is mounted on either surface. Wiring board.

[0073] (Appended Claim 2) The identification mark is provided at a visible position when arranged on a substrate loader. The wiring board according to Appended Claim 1.

[0074] (Appended Claim 3) The end portion of either surface is the end portion opposite to the direction in which it is inserted into the substrate loader. The wiring board according to Appended Claim 1 or 2.

[0075] (Appendix 4) Part of the identification mark is provided in an area within 5 millimeters from the edge of any of the surfaces. The wiring board according to any one of Appendices 1 to 3.

[0076] (Appendix 5) The shape of the identification mark is rectangular. The wiring board according to any one of Appendices 1 to 4.

[0077] (Appendix 6) The second color is lighter than the first color. The wiring board according to any one of Appendices 1 to 5.

[0078] (Appendix 7) The first color is green. The second color is white. The wiring board according to Appendix 6.

[0079] (Appendix 8) Any one of the surfaces is the front surface. The other surface is the back surface. The wiring board according to any one of Appendices 1 to 7.

[0080] (Appendix 9) A method for manufacturing a wiring board that is a mirror board, comprising: A step of forming an insulating layer of a first color on the front surface; A step of forming an insulating layer of the first color on the back surface; A step of forming an insulating layer of a second color different from the first color on the front surface; and In the step of forming the insulating layer of the first color on the front surface, the step includes exposure and development so that the insulating layer of the first color is not formed in the area corresponding to the identification mark. In the step of forming the insulating layer of the second color on the front surface, the step includes exposure and development so that the insulating layer of the second color is formed in the area corresponding to the identification mark. The identification mark is formed at an end of the surface and in an area where components are not mounted on the surface. Method for manufacturing a wiring board.

[0081] (Appendix 10) The identification mark is provided at a visible position when arranged on a substrate loader. Manufacturing method according to Appendix 9.

[0082] (Appendix 11) The end portion of any of the surfaces is the end portion opposite to the direction in which the substrate loader is inserted. Manufacturing method according to Appendix 9 or 10.

[0083] (Appendix 12) Part of the identification mark is provided in an area within 5 millimeters from the end of any of the surfaces. Manufacturing method according to any of Appendices 9 to 11.

[0084] (Appendix 13) The shape of the identification mark is rectangular. Manufacturing method according to any of Appendices 9 to 12.

[0085] (Appendix 14) The second color is lighter than the first color. Manufacturing method according to any of Appendices 9 to 13.

[0086] (Appendix 15) The first color is green. The second color is white. Manufacturing method according to Appendix 14.

[0087] (Appendix 16) Any of the surfaces is the front surface. The other surface is the back surface. Manufacturing method according to any of Appendices 9 to 15.

Explanation of reference signs

[0088] 1, 1-1, 1-2, 1-3, 1-4, 1-5 Wiring Substrate 5 Solder Resist of the First Color 6 Resist Relief Location 7 Solder Resist of the Second Color 10, 10-1, 10-2, 10-3, 10-4 Identification Mark 11 Surface of Substrate A 12 Surface of Substrate B 13 Back Surface of Substrate A 14 Back Surface of Substrate B 15 Substrate Loader 17 Exposed 20 Printing Fixture 100 Wiring Substrate 101 Surface of Substrate A 102 Surface of Substrate B 103 Back Surface of Substrate A 104 Back Surface of Substrate B 200 Wiring Substrate 213 Scrap Substrate 214 Identification Mark 215 Green Solder Resist 216 Copper Foil 217 Substrate 300 Wiring Substrate 313 Scrap Substrate 315 Copper Foil 316 Location 400 Wiring Substrate 415 Copper Foil 416 Location 500 Wiring Substrate 518 Location 600 Wiring Substrate AA-AA’ Cross-Section d Insertion Direction

Claims

1. A wiring substrate that is a mirror substrate, Either the front or back surface has a region in which an insulating layer of a first color is formed as an outermost layer, and an identification mark in which an insulating layer of a second color different from the first color is formed as an outermost layer, the other of the front surface and the back surface, which is different from either one of the front surface and the back surface, has a region in which the insulating layer of the first color is formed as an outermost layer; The identification mark is an edge portion of one of the faces, and is provided in an area of ​​the one of the faces on which no components are mounted. Wiring board.

2. The identification mark is provided at a position that is visible when the substrate is aligned with the substrate loader. The wiring board according to claim 1 .

3. The end portion of the any one of the faces is an end portion opposite to a direction in which the substrate is inserted into the substrate loader. The wiring board according to claim 1 .

4. The identification mark is provided in a portion within 5 mm of an edge of any one of the surfaces. The wiring board according to claim 1 .

5. The shape of the identification mark is rectangular. The wiring board according to claim 1 .

6. The second color is lighter than the first color. The wiring board according to claim 1 .

7. the first color is green; The second color is white. The wiring board according to claim 6 .

8. the any one of the faces is the surface, The other surface is the back surface. The wiring board according to claim 1 .

9. A method for manufacturing a wiring substrate that is a mirror substrate, comprising the steps of: forming an insulating layer of a first color on the surface; forming an insulating layer of a first color on the back surface; forming an insulating layer on the surface, the insulating layer having a second color different from the first color; Equipped with The step of forming the insulating layer of the first color on the surface includes a step of exposing and developing the insulating layer of the first color so that the insulating layer of the first color is not formed in an area corresponding to the identification mark, The step of forming an insulating layer of a second color on the surface includes a step of exposing and developing the insulating layer of the second color in an area corresponding to the identification mark, The identification mark is formed at an edge of the surface, in an area of ​​the surface where no components are mounted. A method for manufacturing a wiring board.

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