Combined dispensing and stamping apparatus and method for applying an adhesive fluid during a bonding process

Abstract

To provide a device for coating an adhesive agent fluid onto a bonding front surface during a bonding process.SOLUTION: A device 200 for coating an adhesive agent fluid onto a bonding front surface during a bonding process, contains a dispensing device 210A; a stamping device 220A; and a switching member 240. Those devices are mounted onto a positioning table 230. The dispensing device can be positioned by the positioning table in order to perform dispensing of the adhesive agent fluid onto the bonding front surface, and the stamping device can be positioned by the positioning table for performing the stamping of the adhesive agent fluid onto the bonding front surface.SELECTED DRAWING: Figure 2A

Description

Technical Field

[0001] The present invention generally relates to the application of an adhesive fluid during a bonding process, and more specifically, to an apparatus and method for applying an adhesive fluid (e.g., epoxy) onto a bonding surface during the bonding of a plurality of semiconductor chips.

Background Art

[0002] One conventional approach for applying an adhesive fluid during a bonding process is to use a dispensing device for dispensing the adhesive fluid onto the bonding surface. This dispensing method is suitable for semiconductor chips or dies having a large size (e.g., a die having a width greater than 1 millimeter (mm)). The reason is that the nozzle tip of a dispensing device that is too small may be prone to adhesion or clogging of residues of the adhesive fluid. Another conventional approach for applying an adhesive fluid during a bonding process is to stamp the adhesive fluid onto the bonding surface by a stamping device. The stamping method is suitable for dies having a smaller size (e.g., a die having a width less than 1 mm). The reason is that when a stamping device is used to apply the adhesive fluid onto the bonding surface of a die having a larger size, the adhesive fluid may block the gaps or slots formed on the stamping tool, which may cause the volume or amount of the adhesive fluid applied onto the bonding surface (e.g., a lead frame or a substrate, etc.) to become inconsistent or uncertain.

[0003] During the multi-chip bonding process, either a dispensing method or a stamping method can be used to apply the adhesive fluid onto the bonding surface according to the die size, and thus, dies having different sizes can be reliably bonded. FIG. 1 is a schematic front view of a conventional apparatus 100 for applying an adhesive fluid during the multi-chip bonding process. As shown in FIG. 1, the conventional apparatus 100 includes a dispensing device 110 and a stamping device 120, which are respectively installed on different positioning tables 110a, 120a. Also, the dispensing device 110 and the stamping device 120 include individual optical systems 111, 121, and the optical systems 111, 121 are mounted on the respective positioning tables 110a, 120a to facilitate the application of the adhesive fluid by the respective devices 110, 120. Since two separate positioning tables and optical systems are included in the apparatus 100, a multi-chip bonding system incorporating this conventional apparatus 100 for applying the adhesive fluid is not space-efficient and is also not cost-efficient. Moreover, additional transition time is required when switching between the two methods for applying the adhesive fluid during the multi-chip bonding process on the bonding surface (i.e., when switching from dispensing to stamping, or vice versa).

[0004] Therefore, it is beneficial to provide a new method and solution for applying an adhesive fluid during the multi-chip bonding process that can overcome at least one of the above-mentioned drawbacks in the conventional apparatus and method. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0005] Accordingly, an object of the present invention is to provide a more cost-effective and space-efficient apparatus and method for applying an adhesive fluid during a multi-chip bonding process. **Means for Solving the Problems**

[0006] According to a first aspect of the present invention, there is provided an apparatus for applying an adhesive fluid onto a bonding surface during a die bonding process. The apparatus includes a positioning table, a dispensing device mounted on the positioning table and configured to be positionable by the positioning table for dispensing the adhesive fluid onto the bonding surface, a stamping device mounted on the positioning table and configured to be positionable by the positioning table for stamping the adhesive fluid onto the bonding surface, wherein the dispensing device and the stamping device are operable to apply the adhesive fluid at different bonding positions on the bonding surface, and a switching member mounted on the positioning table and connected to the stamping device, the switching member being configured to move the stamping device to a first standby position when the dispensing device is operated by the positioning table to dispense the adhesive fluid, and to move the stamping device to a second standby position when the stamping device is operated by the positioning table to stamp the adhesive fluid. It should be noted that "mounted on" in embodiments of the present invention can refer to "mounted directly or indirectly on".

[0007] In some embodiments, the apparatus can further include a container for storing the adhesive fluid, and the stamping device is configured to be positionable by the positioning table to contact the container and receive the adhesive fluid from the container. To further integrate a device for applying the adhesive fluid onto the bonding surface, the apparatus can further include a first mounting frame to which the container is mounted.

[0008] The first mounting frame is connected to the positioning table such that the container is movable together with the positioning table. To ensure a uniform distribution of the adhesive fluid in the container, the apparatus can further include a thickness adjustment member mounted on the first mounting frame for adjusting the thickness of the adhesive fluid in the container.

[0009] In some embodiments, the apparatus further includes a second mounting frame to which the dispensing device is mounted, and the second mounting frame is connected to the positioning table. In other words, the dispensing device is mounted on the positioning table via the second mounting frame and is movable together with the positioning table. In one embodiment, the second mounting frame can include a first mounting member connected to the positioning table and a gripper positioned on the first mounting member, and the dispensing device is mounted on or held by the gripper and is movable together with the positioning table.

[0010] In one embodiment, the switching member is attached to the first mounting member, and both the switching member and the stamping device to which the switching member is connected are movable together with the positioning table. Alternatively, the switching member can be attached to the second mounting member, and both the switching member and the stamping device to which the switching member is connected are movable together with the positioning table.

[0011] In some embodiments, the stamping device includes a stamping tool and a tool holder for releasably gripping the stamping tool. The stamping tool is positionable to pick up the adhesive fluid from the container and to stamp the adhesive fluid onto the bonding surface.

[0012] To facilitate the replacement of the stamping tool mounted on the stamping device, the apparatus can further include a tool bank. The tool bank is configured to include a first holder for releasably holding at least one stamping tool, and the stamping device is operable to pick up the stamping tool from the tool bank by the tool holder before stamping the adhesive fluid onto the bonding surface by the stamping tool.

[0013] In some embodiments, the stamping device can be used to perform level detection by a level detection tool. To facilitate the automatic pickup and return of the level detection tool, the tool bank further includes a second holder for releasably holding the level detection tool, and the stamping device is further operable to pick up the level detection tool from the tool bank by the tool holder and to perform level detection by the level detection tool before the dispensing device is used to dispense the adhesive fluid.

[0014] In some embodiments, the apparatus can further include a first imaging device configured to detect the position of the stamping tool held by the stamping device, whereby the position of the stamping tool is adjustable.

[0015] In some embodiments, the stamping device further includes a force detector configured to detect, during their contact, the force applied onto the bonding surface by a stamping tool or a level detection tool held by the stamping device. In one embodiment, the force detector can include a strain gauge sensor attached to a tool holder.

[0016] After the dispensing device has been used to dispense the adhesive fluid, to prevent the adhesive fluid from leaking onto the bonding surface, the tool holder further includes a third holder for holding a nozzle cover, and the dispensing device is further operable to pick up the nozzle cover from the tool holder to shield the nozzle of the dispensing device.

[0017] In one embodiment, the switching member can include a pneumatic cylinder connected to the stamping device and operable to reciprocate the stamping device between a first standby position and a second standby position.

[0018] The apparatus can further include a second imaging device attached to the dispensing device. The second imaging device is configured to perform a pattern recognition inspection on the electronic package before dispensing the adhesive fluid.

[0019] In some embodiments, the dispensing device is operable to dispense the adhesive fluid over a first bonding position for bonding at least one die having dimensions greater than 1 millimeter, and the stamping device is operable to stamp the adhesive fluid over a second bonding position for bonding at least one die having dimensions greater than 1 millimeter. Large In some embodiments, the dispensing device is operable to dispense the adhesive fluid over a first bonding position for bonding at least one die having dimensions greater than 1 millimeter, and the stamping device is operable to stamp the adhesive fluid over a second bonding position for bonding at least one die having dimensions greater than 1 millimeter. Small In some embodiments, the dispensing device is operable to dispense the adhesive fluid over a first bonding position for bonding at least one die having dimensions greater than 1 millimeter, and the stamping device is operable to stamp the adhesive fluid over a second bonding position for bonding at least one die having dimensions greater than 1 millimeter.

[0020] According to a second aspect of the present invention, there is provided a die bonding system including an apparatus for applying an adhesive fluid onto a bonding surface during a bonding process according to various embodiments of the present invention.

[0021] According to a third aspect of the present invention, there is provided a method for manufacturing a semiconductor device. The method includes positioning a dispensing device mounted on a positioning table so as to dispense an adhesive fluid by the dispensing device at a first bonding position on a bonding surface during a die bonding process, and positioning a stamping device mounted on the positioning table so as to stamp the adhesive fluid by the stamping device at a second bonding position on the bonding surface, wherein a switching member mounted on the positioning table and connected to the stamping device moves the stamping device to a first standby position when the dispensing device is operated by the positioning table to dispense the adhesive fluid, and moves the stamping device to a second standby position when the stamping device is operated by the positioning table to stamp the adhesive fluid, and the method further includes bonding a first semiconductor die at the first bonding position and bonding a second semiconductor die at the second bonding position to form a semiconductor device.

[0022] These and other features, aspects, and advantages will be better understood with reference to the description section, the appended claims, and the accompanying drawings.

[0023] Here, embodiments of the present invention will be described by way of example only with reference to the accompanying drawings.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2A

Figure 2B

Figure 3A

Figure 3B

Figure 3C

Figure 3D

Figure 3E

Figure 3F

Figure 3G

Figure 4

DETAILED DESCRIPTION OF THE INVENTION

[0025] In the drawings, like parts are designated by like reference numerals.

[0026] In a proposed apparatus for applying an adhesive fluid (e.g., epoxy) during a bonding process, the dispensing device and the stamping device are designed to share a common positioning table, are equipped with a common optical system for performing pattern recognition (PR) searches, and the dispensing device and the stamping device are arranged in a more compact manner. This helps to reduce manufacturing costs, space utilization, and transition time when switching the manner of applying the adhesive fluid onto the bonding surface during the bonding process.

[0027] FIG. 2A is a front view of an apparatus 200 for applying an adhesive fluid onto a bonding surface when the apparatus 200 is arranged in a first configuration during a multi-chip bonding process according to one embodiment of the present invention. Referring to FIG. 2A, the apparatus 200 includes a dispensing mechanism 210 (shown inside the left dashed box), a stamping mechanism 220 (shown inside the right dashed box), a positioning table 230, and a switching member 240. The dispensing mechanism 210 and the stamping mechanism 220 are mounted on the positioning table 230, the switching member 240 is mounted on the positioning table 230, and the switching member 240 is also movable together with the positioning table 230. The positioning table 230 can be an XYZ table.

[0028] The dispensing mechanism 210 includes a dispensing device 210A. The dispensing device 210A is mounted on the positioning table 230 and is configured to be positionable by the positioning table 230, and is more than 1 millimeter above a bonding surface (e.g., the surface of a lead frame or a substrate). LargeDispense an adhesive fluid onto a first bonding position for bonding at least one die having dimensions. The stamping mechanism 220 includes a stamping device 220A. The stamping device 220A is configured to be positionable by a positioning table 230 and is more than 1 millimeter above the bonding surface Small Stamp the adhesive fluid onto a second bonding position for bonding at least one die having dimensions. The switching member 240 is coupled or connected to the stamping device 220A and is operable to position the stamping device 220A at different standby positions relative to the dispensing device 210A and to vary the manner in which the adhesive fluid is applied.

[0029] Referring to FIG. 2A, when the apparatus 200 is arranged in the first configuration, the bottom end of the stamping device 220A is positioned at a first standby position P1 by the switching member 240 when the dispensing device 210A is operated by the positioning table 230 to apply the adhesive fluid. In the first configuration, the stamping device 220A is positioned further away from the bonding surface when the dispensing device 210A is positioned by the positioning table 230 to dispense the adhesive fluid onto the bonding surface.

[0030] Figure 2B is a front view of apparatus 200 when apparatus 200 is arranged in a second configuration during a multi-chip bonding process. Referring to Figure 2B, when apparatus 200 is arranged in the second configuration, the bottom end of stamping device 220A is positioned at a second standby position P2 by switching member 240 when stamping device 220A is operated by positioning table 230 to apply an adhesive fluid. In the second configuration, stamping device 220A is positioned closer to the bonding surface when stamping device 220A is positioned by positioning table 230 to stamp an adhesive fluid onto the bonding surface.

[0031] In this embodiment, the first bonding position can be configured to bond at least one die or chip having a width or dimension between 1 mm and 6 mm, and the second bonding position can be configured to bond at least one die or chip having a dimension between 0.25 mm and 1 mm.

[0032] Figure 3A is a front view of the dispensing mechanism 210 according to the embodiment shown in FIGS. 2A and 2B. As shown in FIG. 3A, the dispensing mechanism 210 includes a dispensing device 210A and a mounting frame 210B coupled to the positioning table 230. The dispensing device 210A is mounted on the mounting frame 210B and is adapted to be movable together with the positioning table 230 (i.e., the positioning table 230 is operable to control the movement of the dispensing device 210A). The dispensing device 210A in this embodiment is in the form of a syringe including a container 211, an adapter 212, a nozzle 213, and a locking member 214. The container 211 is configured to hold the adhesive fluid to be dispensed during the dispensing process. The adapter 212 is coupled to the first end of the container 211, surrounds the container 211, and is adapted to connect the container 211 to a dispensing controller (not shown) to provide pressure for pushing the adhesive fluid in the container 211 so that the adhesive fluid is dispensed through the nozzle 213. The locking member 214 is coupled to the second end of the container 211 and is configured to firmly fix the nozzle 213 to the container 211. The dispensing device 210A may further include a nozzle cover 215, which is configured to shield the nozzle 213 and prevent the residual adhesive fluid in the container 211 from leaking onto the bonding surface when the dispensing mechanism 210 is not in use. The mounting frame 210B includes a mounting member 216 (i.e., the first mounting member) and a gripper 217 coupled, connected, or attached to the mounting member 216. The mounting member 216 is coupled or connected to the positioning table 230 and is adapted to be movable together with the positioning table 230. The gripper 217 is positioned on the mounting member 216 by attachment or coupling and is configured to firmly hold the container 211.The mounting member 216 and the gripper 217 can be separate components that are releasably connected or coupled to each other, or can be integrally formed with each other.

[0033] It should be noted that the structures and components of the dispensing device 210A and the mounting frame 210B in this embodiment are for illustrative purposes only and are not intended to limit the scope of the present invention. That is, in other embodiments, the dispensing device 210A and the mounting frame 210B can have different structures and can include different components.

[0034] Figure 3B is a side view of the dispensing device 210A. As shown in Figure 3B, the apparatus 200 further includes an imaging device 250 (e.g., a camera) coupled to the dispensing device 210A. In one embodiment, it is operable to perform a pattern recognition (PR) search over the entire bonding surface before the dispensing device 210A and the stamping device 220A apply the adhesive fluid onto the bonding surface.

[0035] FIG. 3C is a front view of the stamping mechanism 220 according to the embodiment shown in FIGS. 2A and 2B. The stamping mechanism 220 includes a stamping device 220A connected to a switching member 240 and an adhesive-containing device 220B mounted on a positioning table 230. The switching member 240 is mounted on the positioning table 230, and both the switching member 240 and the stamping device 220A are adapted to move together with the positioning table 230. In this embodiment, the switching member 240 is attached or connected to a mounting member 216 of the mounting frame 210B. However, this is for illustrative purposes only. In other embodiments, the switching member 240 can be installed on the positioning table 230 through a separate mounting member or can be connected to the positioning table 230. Accordingly, the dispensing device 210A can be attached to the switching member 240, and the dispensing device 210A, the stamping device 220A, and the switching member 240 are all adapted to move together with the positioning table 230.

[0036] Referring to FIG. 3C, the stamping device 220A includes a stamping tool 221a or a level detection tool 221b, a tool holder 222, and a force detector 223. The tool holder 222 is configured to releasably grip the stamping tool 221a when the stamping tool 221a is used to handle the adhesive fluid, or to releasably grip the level detection tool 221b when the level detection tool 221b is used for level detection during the dispensing process. The force detector 223 is configured to detect the force applied onto the bonding surface by the stamping tool 221a or the level detection tool 221b held by the stamping device 220A during their contact. Specifically, the force detector 223 is operable to detect the stamping force by the stamping tool 221a during the stamping process, or to perform a pick level search, or to perform level detection by the level detection tool 221b during the dispensing process. The detected force value is received by a control system (e.g., a computer) communicatively connected to the device 200, and the control system is used to determine the stamping force or the pick-up level during the stamping process, or to determine the level or encoder value to be used during the dispensing process.

[0037] In this embodiment, the force detector 223 can be in the form of a strain gauge sensor attached to the tool holder 222. During the bonding process, the stamping device 220A can be operated to firmly grip the stamping tool 221a by the tool holder 222 and is adapted to use the stamping tool 221a to apply the adhesive fluid. Also, when the stamping tool 221a is not in use or is not required, for example, when the stamping tool 221a needs to be replaced or when the level detection tool 221b is required to perform a level detection operation, the stamping device 220A can be operated to remove or release the stamping tool 221a. Further, when the dispensing device 210A is used for the adhesive fluid to be dispensed and when the level detection tool 221b is required to perform a level detection on the electronic package, the stamping device 220A can be operated to firmly grip the level detection tool 221b by the tool holder 222, and then, when the level detection tool 221b is not in use or is not required, it can be operated to remove or release the level detection tool 221b.

[0038] The adhesive-containing device 220B includes a container 224 for holding an adhesive fluid that is to be used during the stamping process. The container 224 is connected to or mounted on the positioning table 230 such that the container 224 is movable together with the dispensing table 230 during the application of the adhesive fluid onto the bonding surface. The stamping device 220A is further positionable by the positioning table 230 to pick up the adhesive fluid from the container 224 by the stamping tool 221a before stamping the adhesive fluid onto the bonding surface. It should be noted that the container 224 can be directly or indirectly connected to or mounted on the positioning table 230.

[0039] Still referring to FIG. 3C, the adhesive-containing device 220B can further include a thickness adjustment member configured to adjust the thickness of the adhesive fluid in the container 224 such that the adhesive fluid therein is flattened by a specific thickness. In this embodiment, the thickness adjustment member can include a sweeper 225 for sweeping the adhesive fluid in the container 224 to flatten the surface of the adhesive fluid in the container 224 and a micrometer 226 operable to measure the thickness of the adhesive fluid in the container 224. The adhesive-containing device 220B also includes a mounting frame 227 configured to mount the adhesive-containing device 220B on the positioning table 230 such that the adhesive-containing device 220B is movable together with the positioning table 230. Specifically, as shown in FIG. 3C, the container 224, the sweeper 225, and the micrometer 226 are all attached to a mounting frame 227 that is connected to the positioning table 230.

[0040] Figure 3D is a front view of the switching member 240 according to one embodiment of the present invention. As shown in Figure 3D, the switching member 240 in this embodiment includes a pneumatic cylinder 240A, a solenoid 240B, and an air tube 240C, and the air tube 240C is arranged to connect the pneumatic cylinder 240A and the solenoid 240B. The solenoid 240B can be communicably connected to the control system, and the operation of the switching member 240 is controlled by the control system according to a preset bonding schedule. The pneumatic cylinder 240A is operable to move the stamping device 220A to the first standby position P1 during the dispensing process and to move the stamping device 220A to the second standby position P2 during the stamping process. The air tube 240C is configured to supply compressed air to the pneumatic cylinder 240A. The solenoid 240B is operable to switch the direction of the pneumatic path so as to adjust the moving direction of the pneumatic cylinder 240A. In other words, the control system is configured to control the direction of the pneumatic path by turning the pneumatic solenoid 240B on or off, thereby controlling the moving direction of the pneumatic cylinder 240A. That is, when executing the dispensing process, the pneumatic cylinder 240A is actuated to move upward with respect to the dispensing device 210A to move the stamping device 220A to the first standby position P1, and when executing the stamping process, the pneumatic cylinder 240A is actuated to move downward with respect to the dispensing device 210A to move the stamping device 220A to the second standby position P2.

[0041] According to some embodiments of the present invention, the apparatus 200 can further include a tool bank. FIG. 3E is a front view of the tool bank 260 of the apparatus 200 according to one embodiment of the present invention. The tool bank 260 includes a plurality of holders 261, 262, 263, and the plurality of holders 261, 262, 263 are configured to hold the nozzle cover 215, at least one stamping tool 221a, and at least one level detection tool 221b when they are not in use. As shown in FIG. 3E, in this embodiment, the holder 261 is configured to hold the nozzle cover 215, the holder 262 is configured to hold a plurality of stamping tools 221a, and the holder 263 is configured to hold the level detection tool 221b. In particular, the holder 262 can be configured to hold a larger number of stamping tools in other embodiments. The tool bank 260 can further include an image capturing device 264 (e.g., an up-look camera, etc.), and the image capturing device 264 is configured to detect the position of the stamping tool 221a held by the stamping device 220A and align and adjust the position of the stamping tool 221a when needed (e.g., when the stamping tool 221a is replaced). The tool bank 260 can be installed or mounted on the worktable of the apparatus 200 on which the bonding process is performed. FIG. 3F is a perspective view of the worktable 300 on which the tool bank 260 is mounted. The tool bank 260 can be positioned anywhere on the worktable as long as the positioning table 230 can move the apparatus 200 above the tool bank 260 and install or pick up tools at that location.

[0042] Figure 3G is a front view of an apparatus 200 including a tool bank 260 attached to a work table 300 according to one embodiment of the present invention. Referring to Figure 3G, during the bonding process, the stamping device 220A can be further positioned by a positioning table 230 to pick up the stamping tool 221a from the tool bank 260 by a tool holder 222 before using the stamping tool 221a to stamp an adhesive fluid onto the bonding surface, and to return the stamping tool 221a to the tool bank 260 when the stamping tool 221a is not in use or not needed (for example, when the stamping tool 221a needs to be replaced, or when the level detection tool 221b is required to perform level detection). Also, the stamping device 220A can be positioned by the positioning table 230 to pick up the level detection tool 221b from the tool bank 260 by the tool holder 222 when the level detection tool 221b is required to perform level detection on the bonding surface when the dispensing device 210A is to be used to dispense the adhesive fluid, and to return the level detection tool 221b to the tool bank when the level detection tool 221b is not in use or not needed. In addition, the dispensing device 210A can be further positioned by the positioning table 230 to pick up a nozzle cover 215 from the tool bank 260 to shield the nozzle of the dispensing device 210A to prevent the adhesive fluid from leaking out onto the bonding surface after the dispensing device 210A has finished applying the adhesive fluid onto the bonding surface.

[0043] When device 200 is used to apply an adhesive fluid onto a bonding surface during a multi-chip bonding process, device 200 is communicatively connected to a control system operable to control device 200 to apply the adhesive fluid according to a preset schedule (e.g., a schedule indicating positions and timings for performing a dispensing process by dispensing device 210A and a stamping process by stamping device 220A).

[0044] The proposed device 200 can be included in a die bonding system for manufacturing semiconductor devices. Embodiments of the present invention also provide a method for applying an adhesive fluid onto a bonding surface during a multi-chip bonding process, and a method for manufacturing a semiconductor device including the method for applying the adhesive fluid. The method for applying the adhesive fluid onto the bonding surface includes the following steps: · Positioning dispensing device 210A mounted on positioning table 230 to dispense an adhesive fluid by dispensing device 210A at a first bonding position on the bonding surface during a die bonding process, and · Positioning stamping device 220A mounted on positioning table 230 to stamp the adhesive fluid by stamping device 220A at a second bonding position on the bonding surface, wherein switching member 240 mounted on positioning table 230 and connected to stamping device 220A moves stamping device 220A to a first standby position P1 when dispensing device 210A is operated by positioning table 230 to dispense the adhesive fluid, and moves stamping device 220A to a second standby position P2 when stamping device 220A is operated by positioning table 230 to stamp the adhesive fluid.

[0045] A method for manufacturing a semiconductor device can further include a bonding step for forming a semiconductor device, for example, bonding a first semiconductor die at a first bonding position and bonding a second semiconductor die at a second bonding position to form one or more semiconductor devices.

[0046] FIG. 4 is a flowchart illustrating a method for applying an adhesive fluid onto a bonding surface using an apparatus 200 according to one embodiment of the present invention. In this embodiment, it is assumed that the stamping tool 221a of the apparatus 200 is first firmly held by the tool holder 222 and moved to a second standby position P2 to perform the stamping process. Further, a control system communicably connected to the apparatus 200 receives a preset bonding schedule for performing a dispensing process at a first bonding position on the bonding surface before performing the stamping process at a second bonding position on the bonding surface. The control system is configured to control the movement of the positioning table 230 and the movement of the switching member 240 to perform the dispensing process and the stamping process according to the preset bonding schedule.

[0047] In step 401, the stamping device 220A is operated to return the stamping tool 221a to the tool bank 260 and pick up the level detection tool 221b from the tool bank 260.

[0048] Specifically, the control system controls the positioning table 230 to position the stamping device 220A above the tool bank 260 and return the stamping tool 221a to the tool bank 260. After the stamping tool 221a is released and installed in the tool bank 260, the stamping device 220A is further operated to pick up the level detection tool 221b from the tool bank 260.

[0049] In step 402, the stamping device 220A equipped with the level detection tool 221b is moved downward to perform level detection for the dispensing process.

[0050] Specifically, the stamping device 220A equipped with the level detection tool 221b is moved downward by the positioning table 230 at a constant speed until the contact force detected by the force detector 223 exceeds a predetermined threshold value. The encoder value corresponding to the detected contact force value is recorded by the control system, and this encoder value or level is used for the dispensing process.

[0051] Before performing the level detection, a pad pattern recognition (PR) search can be performed for all units on the bonding surface where the dispensing process and the stamping process will be executed (i.e., at both the first bonding position and the second bonding position on the bonding surface).

[0052] In step 403, the stamping device 220A is moved upward by the switching member 240 until the stamping device 220A is positioned at the first standby position P1 and the dispensing device 210A is positioned closer to the bonding surface. Then, the dispensing table is positioned by the positioning table 230 to dispense the adhesive fluid at the first bonding position on the bonding surface.

[0053] In step 404, the dispensing device 210A is operated to dispense the adhesive fluid at a first bonding position on the bonding surface.

[0054] Before the dispensing process for dispensing the adhesive fluid, if the nozzle 213 is initially shielded by the nozzle cover 215, the method further includes removing the nozzle cover 215 from the dispensing device 210A. Specifically, the step of removing the nozzle cover 215 can include positioning the dispensing device 210A above the tool bank 260 by the positioning table 230 and operating the dispensing device 210A to release the nozzle cover 215 and place it in the tool bank 260.

[0055] In step 405, after the dispensing process is completed, the dispensing device 210A is positioned above the tool bank 260 by the positioning table 230 and is operated to pick up the nozzle cover 215 from the tool bank 260. The nozzle cover 215 is used to shield the nozzle 213 and to prevent the adhesive fluid from leaking onto the bonding surface.

[0056] In step 406, the stamping device 220A is moved downward by the switching member 240 until the stamping device 220A is positioned at a second standby position P2 where the stamping device 220A is positioned closer to the bonding surface. Then, the stamping device 220A is positioned by the positioning table 230 to perform a stamping process at a second bonding position on the bonding surface.

[0057] Specifically, the control system controls the solenoid 240B to switch the direction of the pneumatic path and adjusts the moving direction of the pneumatic cylinder 240A, thereby moving the stamping device 220A to either the first or the second standby position.

[0058] In step 407, the stamping device 220A is moved above the tool bank 260 by the positioning table 230 and is operated to return the level detection tool 221b to the tool bank 260 and to pick up the stamping tool 221a from the tool bank 260.

[0059] In step 408, the stamping device 220A is moved by the positioning table 230 and a pick level search is performed by the stamping tool 221a.

[0060] Specifically, the stamping device 220A equipped with the force detector 223 is moved downward at a constant speed until the force detector 223 detects a trigger force when the stamping tool 221a contacts the bottom surface of the container 224. This pick level search can help ensure that a certain volume of the adhesive fluid is picked up. The reason is that the moving speed of the stamping device 220A and the trigger force of the force detector 223 can be adjusted during the search.

[0061] In step 409, the stamping tool 221a is operated to pick up the adhesive fluid from the container 224 and to stamp the adhesive fluid at a second bonding position on the bonding surface.

[0062] During the stamping process, the force detector 223 detects the stamping force applied by the stamping tool 221a, enabling the control system to monitor the stamping force and determine whether the stamping force exceeds a predetermined threshold or is within an appropriate range. The purpose is to ensure that the adhesive fluid is applied by an appropriate stamping force and to protect the stamping tool 221a from damage caused by the application of excessive stamping force. If a subsequent dispensing process is required after the stamping process, the process then returns to step 401, where the stamping tool 221a is returned to the tool bank 260.

[0063] As can be appreciated from the above description, embodiments of the present invention provide an integrated apparatus for applying an adhesive fluid onto a bonding surface during a multi-chip bonding process. In this apparatus, a dispensing device and a stamping device for applying the adhesive fluid to different bonding positions on the bonding surface are integrated on a common positioning table via a switching member connected to the stamping device. This switching member is operable to move the stamping device to different standby positions relative to the dispensing device and is adapted to automatically switch the manner of applying the adhesive fluid. Since the dispensing device and the stamping device in the proposed apparatus for applying the adhesive fluid share a common positioning table and an optical system (e.g., an image capturing device for performing PR search), the apparatus has a more compact size and lower manufacturing costs. Moreover, the time required to switch the manner of applying the adhesive fluid is significantly reduced compared to the prior art. The reason is that the dispensing device and the stamping device are arranged in a more compact manner, thereby greatly improving the productivity of the bonding process.

[0064] Although the present invention has been described in considerable detail with reference to certain embodiments, other embodiments are possible. Accordingly, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

Explanation of Reference Numerals

[0065] 100 Conventional device 110 Dispensing device 120 Stamping device 111 Optical system 121 Optical system 110a Positioning table 120a Positioning table 200 Device 210 Dispensing mechanism 210A Dispensing device 210B Mounting frame 211 Container 212 Adapter 213 Nozzle 214 Locking member 215 Nozzle cover 216 Mounting member 217 Gripper 220 Stamping mechanism 220A Stamping device 220B Adhesive-containing device 221a Stamping tool 221b Level detection tool 222 Tool holder 223 Force detector 224 Container 225 Sweeper 226 Micrometer 227 Mounting frame 230 Positioning table 240 Switching member 240A Pneumatic cylinder 240B Solenoid 240C Air tube 250 Image capturing device 260 Tool bank 261 Holder 262 Holder 263 Holder 264 Image capturing device 300 Worktable P1 First standby position P2 Second standby position

Claims

1. 1. An apparatus for applying an adhesive fluid onto a bonding surface during a die bonding process, the apparatus comprising: A positioning table; a dispensing device mounted on the positioning table and configured to be positionable by the positioning table to dispense the adhesive fluid onto the bonding surface; a stamping device mounted on the positioning table and configured to be positionable by the positioning table for stamping the adhesive fluid onto the bonding surface, the dispensing device and the stamping device being operable to apply the adhesive fluid to different bonding locations on the bonding surface; a switching member mounted on the positioning table and coupled to the stamping device, the switching member configured to move the stamping device to a first standby position when the dispensing device is operated by the positioning table to dispense the adhesive fluid, and to move the stamping device to a second standby position when the stamping device is operated by the positioning table to stamp the adhesive fluid; a first mounting frame coupled to the positioning table; a container for storing the adhesive fluid to be used in the stamping device, the container being mounted on the first mounting frame, the stamping device being further configured to be positionable by the positioning table to contact the container and receive the adhesive fluid from the container; An apparatus comprising:

2. The apparatus of claim 1 , further comprising a thickness adjustment member mounted on the first mounting frame for adjusting a thickness of the adhesive fluid in the container.

3. The apparatus of claim 1 , further comprising a second mounting frame on which the dispensing device is mounted, the second mounting frame being coupled to the positioning table.

4. The apparatus of claim 3, wherein the second mounting frame includes a first mounting member coupled to the positioning table and a gripper positioned on the first mounting member, the dispensing device being mounted on the gripper.

5. 5. The apparatus of claim 4, wherein the switching member is attached to the first mounting member such that both the switching member and the stamping device to which it is coupled are movable with the positioning table.

6. 5. The apparatus of claim 4, wherein the switching member is attached to a second mounting member such that both the switching member and the stamping device to which it is coupled are movable with the positioning table.

7. The apparatus of claim 1 , wherein the stamping device includes a stamping tool and a tool holder for releasably gripping the stamping tool.

8. 8. The apparatus of claim 7, further comprising a tool bank including a first holder for releasably holding at least one stamping tool, the stamping device being operable to pick up the stamping tool from the tool bank by the tool holder prior to stamping the adhesive fluid onto the bonding surface by the stamping tool.

9. The apparatus of claim 8, wherein the tool bank further includes a second holder for releasably holding a level detection tool, and the stamping device is further operable to pick up the level detection tool from the tool bank by the tool holder and to perform level detection by the level detection tool before the dispensing device is used to dispense the adhesive fluid.

10. 9. The apparatus of claim 8, wherein the tool bank further includes a first image capturing device configured to detect a position of the stamping tool held by the stamping device, whereby the position of the stamping tool is adjustable.

11. 9. The apparatus of claim 8, wherein the stamping device further comprises a force detector configured to detect a force applied by the stamping tool or a level detection tool held by the stamping device onto the bonding surface during contact therebetween.

12. The apparatus of claim 11 , wherein the force detector comprises a strain gauge sensor attached to the tool holder.

13. The apparatus of claim 8, wherein the tool holder further includes a third holder for holding a nozzle cover, and the dispensing device is further operable to pick up the nozzle cover from the tool holder to cover a nozzle of the dispensing device to prevent the adhesive fluid from leaking onto the bonding surface.

14. 2. The apparatus of claim 1, wherein the switching member comprises a pneumatic cylinder coupled to the stamping device and operable to reciprocate the stamping device to the first standby position or the second standby position.

15. The apparatus of claim 1 , further comprising a second image capturing device attached to the dispensing device and configured to perform pattern recognition inspection on the electronic package prior to dispensing the adhesive fluid.

16. 2. The apparatus of claim 1, wherein the dispensing device is operable to dispense the adhesive fluid onto a first bonding location for bonding at least one die having a dimension between 1 millimeter and 6 millimeters, and the stamping device is operable to stamp the adhesive fluid onto a second bonding location for bonding at least one die having a dimension between 0.25 millimeters and 1 millimeter.

17. A die bonding system comprising an apparatus for applying an adhesive fluid onto a bonding surface according to claim 1.

18. 1. A method for manufacturing a semiconductor device, the method comprising: positioning a dispensing device mounted on a positioning table such that the dispensing device dispenses adhesive fluid at a first bonding location above a bonding surface during a die bonding process; using the positioning table to position the stamping device in contact with a container for storing the adhesive fluid to be used in the stamping device to receive the adhesive fluid from the container, the container being mounted on a first mounting frame coupled to the positioning table; positioning the stamping device such that the adhesive fluid is stamped by the stamping device at a second bonding location above the bonding surface; Including, a switching member mounted on the positioning table and coupled to the stamping device, for moving the stamping device to a first standby position when the dispensing device is operated by the positioning table to dispense the adhesive fluid, and for moving the stamping device to a second standby position when the stamping device is operated by the positioning table to stamp the adhesive fluid; The method comprises: Bonding a first semiconductor die at the first bonding location and bonding a second semiconductor die at the second bonding location to form the semiconductor device. The method further comprising:

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