Integrated optical module

Abstract

A mounting surface (26) of a housing (12) of an integrated optical module (101) has a first joining region (15) to which a first joining agent for joining a loading part (6) onto which a plurality of light-emitting elements (1i) are loaded is applied, and a second joining region (16) to which a second joining agent for joining an optical multiplexer (7) is applied. On the mounting surface (26), a joining agent outflow prevention part (27) for preventing the outflow of the joining agents is provided between the first joining region (15) and the second joining region (16). The joining agent outflow prevention part (27) has a section which extends along a direction not orthogonal to but intersecting with the incident direction of an optical signal (2i), and the distance of which from a side of a joining surface of the loading part (6) along the incident direction of the optical signal increases along the direction of the extension. The disposition of this joining agent outflow prevention part (27) prevents mixing of the first joining agent and the second joining agent.

Description

Technical Field

[0001] The present disclosure relates to an integrated optical module.

Background Art

[0002] In recent years, with the expansion of Internet-based services, in order to cope with the rapid increase in information traffic, the introduction of optical fiber communication has been promoted. In optical fiber communication, the demand for optical transmission systems that achieve high-speed and large-capacity transmission is increasing. In particular, the wavelength division multiplexing optical transmission method, in which optical signals of different wavelengths are bundled and transmitted and received through a single optical fiber, is widely adopted. In the wavelength division multiplexing optical transmission method, a plurality of light-emitting elements having different wavelengths and a multiplexer for multiplexing a plurality of optical signals emitted from the plurality of light-emitting elements are incorporated in the same package and installed in an optical transmission device, and an integrated optical module that bundles a plurality of optical signals into a single optical fiber for communication is used. In order to achieve a further increase in the capacity of the optical transmission system, it is necessary to mount a large number of integrated optical modules in the optical transmission device, and miniaturization of the integrated optical module is required to increase the mounting density of components in the optical transmission device. Therefore, the increase in the mounting density within the integrated optical module is also accelerating.

[0003] For example, in Patent Document 1, adjacent light-emitting elements are paired and mounted in proximity on each other's mounting substrates, thereby realizing miniaturization of the multiplexer. This enables miniaturization of the integrated optical module.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In order to miniaturize an integrated optical module, it is preferable to arrange a mounting portion on which a plurality of light-emitting elements are mounted and an optical multiplexer in close proximity to each other. Here, the mounting portion and the optical multiplexer are joined to the mounting surface of the housing by different adhesives. When joining the mounting portion and the optical multiplexer to the joining surface of the housing, if one adhesive flows out and mixes with the other adhesive, the joining property of the other adhesive deteriorates, resulting in an assembly defect of the integrated optical module. Therefore, it is necessary to provide a structure on the mounting surface of the housing to prevent the adhesive from flowing out between the mounting portion and the optical multiplexer. However, even if a blocking structure is provided, the effect of preventing the adhesive from flowing out may not be sufficient in some cases.

[0006] For example, when the blocking structure is formed by laser marks, that is, laser markings drawn on the mounting surface by a laser, the wall surface of the housing becomes an obstacle to the laser markings drawn on the mounting surface of the housing from directly above, so a gap is generated between the housing wall surface and the laser markings. Therefore, there is a risk that one adhesive may flow out from this gap into the region where the other adhesive is applied, and the adhesives may be mixed.

[0007] The present disclosure has been made to solve the above-described problems, and an object thereof is to provide an integrated optical module that prevents the mixing of different adhesives and thereby reduces the assembly defect rate of mounted components.

Means for Solving the Problems

[0008] The integrated optical module disclosed in the present application includes a housing having a mounting surface, a first side wall and a second side wall that are continuous from this mounting surface and face each other, a plurality of light-emitting elements that emit optical signals having different wavelengths respectively, a mounting portion on which the plurality of light-emitting elements are mounted, and an optical multiplexer that multiplexes the plurality of optical signals emitted from the plurality of light-emitting elements, wherein the mounting surface of the housing has a first joining region to which a first adhesive for joining the mounting surface of the housing and the mounting portion is applied, The mounting surface of the housing is joined to the optical multiplexer, and a second bonding region where a second bonding agent having a different material from the first bonding agent is applied region and has The bonding surface of the optical multiplexer that is joined to the mounting surface has a first side parallel to a direction that intersects but is not perpendicular to the incident direction of the plurality of optical signals to the optical multiplexer The bonding surface of the mounting portion that is joined to the mounting surface has a second side facing the first side The mounting portion and the optical multiplexer are arranged between the first side wall and the second side wall such that their respective bonding surfaces do not overlap in the direction facing each other of the first side wall and the second side wall The first side has a distance from the second side along the direction parallel to the incident direction that increases as it advances from the side of the first side wall to the side of the second side wall along the first side On the mounting surface of the housing, a bonding agent outflow prevention portion for preventing the outflow of the bonding agent is provided between the first bonding region and the second bonding region The bonding agent outflow prevention portion has a portion extending along a direction that intersects but is not perpendicular to the incident direction, and is configured such that the distance from the bonding surface of the mounting portion along the direction parallel to the incident direction to the portion increases as it advances from the side of the first side wall to the side of the second side wall along the extending direction of the portion The first bonding agent accumulates between the first bonding region and the second bonding region and a region between the mounting portion and the bonding agent outflow prevention portion expands from an end of the bonding agent outflow prevention portion toward the center, and the bonding agent outflow prevention portion is curved so that the first bonding agent accumulates between the first bonding region and the bonding agent outflow prevention portion It is characterized by this Also, a housing having a mounting surface, a first side wall and a second side wall that are continuous from the mounting surface and face each other a plurality of light emitting elements that emit optical signals having different wavelengths respectively a mounting portion for mounting the plurality of light emitting elements a multiplexer that multiplexes the plurality of optical signals emitted from the plurality of light emitting elements, and the mounting surface of the housing is a first bonding region to which a first bonding agent for bonding the mounting surface of the housing and the mounting portion is applied a second bonding region that bonds the mounting surface of the housing and the multiplexer and to which a second bonding agent having a different material from the first bonding agent is applied a joining surface of the multiplexer joined to the mounting surface has a first side parallel to a direction intersecting but not perpendicular to an incident direction of the plurality of optical signals to the multiplexer a joining surface of the mounting portion joined to the mounting surface has a second side facing the first side the mounting portion and the multiplexer are arranged between the first side wall and the second side wall so that their respective joining surfaces do not overlap in a direction facing each other of the first side wall and the second side wall the first side has a distance from the second side along a direction parallel to the incident direction increasing as it advances from the side of the first side wall to the side of the second side wall along the first side a bonding agent outflow prevention portion for preventing outflow of the bonding agent is provided between the first bonding region and the second bonding region on the mounting surface of the housing the bonding agent outflow prevention portion has a portion extending along a direction intersecting but not perpendicular to the incident direction, and the distance from the joining surface of the mounting portion along a direction parallel to the incident direction to the portion increases as it advances from the side of the first side wall to the side of the second side wall along the extending direction of the portion the first bonding agent accumulates between the first bonding region and the second bonding region the bonding agent outflow prevention portion is configured to be refracted so that the distance increases as it goes toward the second side wall, and the first bonding agent flows and accumulates on the side of the second side wall

Effect of the Invention

[0009] According to the present disclosure, mixing of different adhesives can be prevented, so that it is possible to reduce the defective assembly rate of the mounted components in the integrated optical module.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0011] Embodiment 1. The integrated optical module according to Embodiment 1 will be described with reference to FIGS. 1 to 4.

[0012] FIGS. 1 and 2 are a top view and a side view, respectively, showing the appearance of the integrated optical module 101. However, FIG. 1 shows a state in which the upper part of the housing 12 is removed by the cross-section A-A shown in FIG. 2. FIG. 2 shows a state in which a part of the side wall of the housing 12 is removed by the cross-section B-B shown in FIG. 1.

[0013] As shown in FIGS. 1 and 2, the integrated optical module 101 includes a light-emitting element 1i, a collimating lens 3i, a mounting portion 6, an optical multiplexer 7, a connector 11, a housing 12, a condenser lens 13, and a receptacle 14. The light-emitting element 1i is composed of a semiconductor laser or the like and converts an electrical signal into an optical signal 2i. The collimating lens 3i makes the optical signal 2i emitted from the light-emitting element 1i into parallel light. The mounting portion 6 has a mounting member 4 and a temperature adjustment element 5, and mounts the light-emitting element 1i and the collimating lens 3i. The temperature adjustment element 5 is joined to the housing 12 in a state where the light-emitting element 1i, the collimating lens 3i, and the mounting member 4 are mounted. The temperature adjustment element 5 is composed of a Peltier element or the like and keeps the temperature of the light-emitting element 1i constant. The mounting member 4 is provided on the temperature adjustment element 5, and the light-emitting element 1i and the collimating lens 3i are mounted on its upper surface. The mounting member 4 is formed of a metal block. As will be described later, a plurality of the light-emitting elements 1i and the collimating lenses 3i are provided respectively.

[0014] As a connector 11 for an interface with the outside, it is connected to two FPCs (Flexible Printed Circuits) not shown in the figure, etc. One FPC is for RF (Radio Frequency) connection to transmit high-frequency electrical signals, and the other FPC is for DC (Direct Current) connection to supply power to the light-emitting element 1i, etc. The electrical signal received by the connector 11 is supplied to the light-emitting element 1i. The electrical signal is a signal indicating information transmitted via an optical fiber. The optical multiplexer 7 receives and multiplexes the optical signals 2i respectively emitted from a plurality of light-emitting elements 1i via a plurality of collimating lenses 3i. The housing 12 houses the light-emitting element 1i, the collimating lens 3i, the mounting portion 6, and the optical multiplexer 7 in its sealed interior. The connector 11 is attached to the side wall of the housing 12.

[0015] The receptacle 14 is coupled to the housing 12 and an optical fiber not shown in the figure, and holds a condenser lens 13 inside. The condenser lens 13 condenses the optical signal 2 X emitted from the optical multiplexer 7 onto the receptacle 14. The light condensed by the condenser lens 13 is incident on the optical fiber from the receptacle 14.

[0016] As shown in FIG. 1, the mounting portion 6 mounts a plurality of light-emitting elements 1i that emit optical signals 2i of different wavelengths respectively, and a plurality of collimating lenses 3i that collimate the plurality of optical signals 2i emitted from the plurality of light-emitting elements 1i. The suffix i is a number indicating the lane number (also called the channel number) of the integrated optical module, and in this example, it is 0, 1, 2, or 3. That is, i = 0, 1, 2, 3. The plurality of light-emitting elements 1i are arranged side by side in a direction orthogonal to the direction in which the optical signals are emitted, and the plurality of collimating lenses 3i are also arranged side by side in the same direction as the light-emitting elements 1i.

[0017] FIG. 3 is a top view (a) and a perspective view (b) of the optical multiplexer 7. As shown in FIG. 3, the optical multiplexer 7 includes a filter 8i that transmits the optical signal 2i having the wavelength of lane i and reflects the optical signals 2i having other wavelengths, a mirror 9 located on the side opposite to the filter 8i that reflects the optical signals 2i of all wavelengths, and a holder 10 that fixes the filter 8i and the mirror 9 facing each other on two parallel surfaces. Although a filter 80 for lane 0 may be provided, in this embodiment, a case is shown where three filters 81, 82, and 83 are provided without providing the filter 80.

[0018] The plurality of optical signals 2i travel parallel to each other and enter the optical multiplexer 7. The holder 10 has a shape of a quadrangular prism with a bottom surface being a parallelogram, and has two parallel surfaces, that is, a first surface 21 and a second surface 22, along a direction that intersects but is not orthogonal to the incident direction of the plurality of optical signals 2i. The holder 10 is provided with a cutout portion 25 that penetrates the first surface 21 and the second surface 22 along the incident direction of the optical signal 2i. The cutout portion 25 serves as an optical path of the optical signal. The three filters 81, 82, and 83 are fixed side by side on the first surface 21 on the side receiving the optical signal 2i so as to cover a part of the cutout portion 25. The mirror 9 is fixed to the second surface 22 so as to cover a part of the cutout portion 25.

[0019] The optical signal 20 is reflected by the mirror 9 and enters the filter 81. The filter 81 transmits the optical signal 21 and reflects the incident optical signal 20. As a result, the multiplexed optical signal 2 0、 21 is emitted. The multiplexed optical signal 2 0、 21 is reflected by the mirror 9 and enters the filter 82. The filter 82 transmits the optical signal 22 and reflects the incident optical signal 2 0、 21. As a result, the multiplexed optical signals 20 to 22 are emitted from the filter 82. The multiplexed optical signals 20 to 22 are reflected by the mirror 9 and enter the filter 83. The filter 83 transmits the optical signal 23 and reflects the incident optical signals 20 to 22. As a result, the multiplexed optical signals 20 to 23 are emitted as the optical signal 2 X and.

[0020] Thus, the plurality of optical signals 2i respectively emitted from the plurality of light-emitting elements 1i are incident on the optical multiplexer 7 and multiplexed by multiple reflections between the filter 8i and the mirror 9. A BPF (Band-Pass Filter) or the like is used for the filter 8i. The mirror 9 is formed by vapor deposition of a dielectric multilayer film on a glass substrate or the like.

[0021] Referring to FIGS. 1 and 2 again, the housing 12 is configured by integrating metal and ceramic. The housing 12 has a mounting surface 26 on which the mounting portion 6 and the optical multiplexer 7 are mounted, and side walls that are continuous from the mounting surface 26 and surround the mounting portion 6 and the optical multiplexer 7. Two opposing portions of the side walls are defined as the first side wall 17 and the second side wall 18. The housing 12 and the receptacle 14 are fixed by welding or the like.

[0022] FIG. 4 is a view in which the mounting surface 26 of the housing 12 is extracted from FIG. 1. As shown in FIG. 4, the mounting surface 26 has a first bonding region 15 to which a first bonding agent is applied for bonding the mounting portion 6, and a second bonding region 16 to which a second bonding agent for bonding the optical multiplexer 7 is applied. The first bonding agent and the second bonding agent are applied so as not to overlap each other. The bottom surfaces of the mounting portion 6 and the optical multiplexer 7 are bonded to the mounting surface of the housing 12 as respective bonding surfaces, a first bonding surface 23 and a second bonding surface 24. The mounting portion 6 and the optical multiplexer 7 are arranged close to each other between the first side wall 17 and the second side wall 18 so that the first bonding surface 23 and the second bonding surface 24 do not overlap in the direction facing the first side wall 17 and the second side wall 18. Also, the incident direction of the optical signal 2i to the optical multiplexer 7 is parallel to each surface of the first side wall 17 and the second side wall 18.

[0023] The second bonding surface 24 has a parallelogram shape and has two sides parallel to a direction that intersects but is not orthogonal to the incident direction of the optical signal 2i to the optical multiplexer 7. One of the sides facing the bonding surface of the mounting portion 6 is defined as the first side 19. On the other hand, the first bonding surface 23 has a rectangular shape and has two sides orthogonal to the incident direction of the optical signal 2i to the optical multiplexer 7, and one of the sides facing the first side 19 is defined as the second side 20.

[0024] The first side 19 is such that the distance L1 between the first side and the second side 20 along the direction parallel to the incident direction of the optical signal 2i increases as it proceeds from the side of the first side wall 17 toward the side of the second side wall 18 along the first side. The mounting surface 26 of the housing 12 is made of, for example, metal. On the other hand, the first bonding surface 23 corresponds to the lower surface of the temperature adjustment element 5 and is made of metal. Therefore, solder is used as the first bonding agent. Also, the second bonding surface 24 corresponds to the lower surface of the holder 10 and is made of glass. Therefore, a UV curable adhesive is used as the second bonding agent. Thus, when bonding members of different materials to the mounting surface 26 of the same material, the respective bonding agents are also different.

[0025] Next, the adhesive outflow prevention portion will be described. The adhesive outflow prevention portion is provided on the mounting surface 26 of the housing 12 and prevents the outflow of the adhesive. In this embodiment, the adhesive outflow prevention portion is provided particularly to prevent the first adhesive from eroding into the second bonding region 16 and mixing with the second adhesive. For example, the adhesive outflow prevention portion is a laser marking 27 obtained by irradiating a target portion with laser light to alter the surface state of the target object to be rough. The laser marking 27 is rougher than other portions of the mounting surface 26, so that the adhesive can be repelled. The laser marking 27 is drawn on the mounting surface of the housing 12 from directly above and is provided between the first bonding region 15 and the second bonding region 16 along a direction parallel to the first side 19 of the bonding surface between the mounting surface of the housing 12 and the optical multiplexer 7.

[0026] That is, in the first embodiment, as shown in FIG. 4, the laser marking 27 extends along a direction that intersects but is not orthogonal to the incident direction of the optical signal 2i to the optical multiplexer 7, and the distance L2 between the laser marking 27 along the direction in which it extends and the bonding surface of the mounting portion 6 increases as it proceeds from the side of the first side wall 17 toward the side of the second side wall 18 along the direction parallel to the incident direction of the optical signal.

[0027] For the drawing of the laser marking 27, a laser marking device that irradiates a laser in a direction perpendicular to the mounting surface 26 is used. However, the first side wall 17 and the second side wall 18 act as barriers, making it difficult to irradiate the laser up to the portions in contact with the first side wall 17 and the second side wall 18. Therefore, the laser marking 27 is provided away from the first side wall 17 and the second side wall 18, and a gap where the bonding agent can easily flow is formed between the laser marking 27 and the first side wall 17, and between the laser marking 27 and Second side wall 18 a gap where the bonding agent can easily flow is formed between the laser marking 27 and the first side wall 17, and between the laser marking 27 and

[0028] Note that for the drawing of the laser marking 27, a laser marking device used for engraving the serial number of the integrated optical module 101 or the serial numbers of components such as the housing 12 can be utilized.

[0029] A method of joining components to the housing 12, which is part of the manufacturing method of the integrated optical module 101, will be described. First, the housing 12 with the laser marking 27 applied to the mounting surface 26, the mounting portion 6 on which a plurality of light-emitting elements 1i are mounted, and the wavelength multiplexer 7 are prepared. Then, after pressing the mounting portion 6 with solder, which is the first bonding material, sandwiched between the mounting surface 26, the solder is melted. Due to the melting of the solder, the first bonding region 15 protrudes from the bonding surface of the mounting portion 6. Thereafter, when the solder hardens, the mounting portion 6 is joined to the mounting surface 26. Next, the wavelength multiplexer 7 is pressed with a UV-curable adhesive, which is the second bonding material, sandwiched between the mounting surface 26 on the side opposite to the mounting portion 6 with respect to the laser marking 27. Due to the pressing of the wavelength multiplexer 7, the second bonding region 16 protrudes from the bonding surface of the wavelength multiplexer 7. Then, by irradiating ultraviolet rays, the UV-curable adhesive hardens. Thereby, the wavelength multiplexer 7 is joined to the mounting surface 26. When the first bonding material melts, there is a risk that the first bonding agent may flow out to the other side of the laser marking 27 through the gap between the laser marking 27 and the side wall.

[0030] If the laser marking 27 is drawn along the second side 20 of the first joint surface 23, since the area between the mounting portion 6 and the laser marking 27 on the mounting surface 26 is narrow, the flow of the melted first joint agent concentrates in the gap between the laser marking 27 and the side wall. In particular, the gap generated on the side of the first side wall 17 is close to the second joint region 16, so there is a high possibility that the melted first joint material will flow out from the gap into the second joint region 16, which is the region where the second joint material will be applied later. When the second joint material is applied on the flowed-out first joint material, that is, when the first joint material and the second joint material are mixed, the joint property of the second joint material deteriorates, and it becomes difficult to properly joint the optical multiplexer 7 to the mounting surface 26.

[0031] In contrast, in the first embodiment, the laser marking 27 is drawn parallel to the first side 19 of the second joint surface 24. As a result, the area between the mounting portion 6 and the laser marking 27 expands from the side of the first side wall 17 toward the second side wall 18. The amount of the first joint agent that can be accumulated between the mounting portion 6 and the laser marking 27 increases, and the concentration of the flow of the first joint agent in the gap between the laser marking 27 and the first side wall 17 is alleviated. Therefore, it is possible to suppress the first joint agent from flowing out into the second joint region 16.

[0032] Note that the joint agent outflow prevention portion does not have to be provided parallel to the first side 19 of the second joint surface 24, and the angle between the extending direction of the joint agent outflow prevention portion and the extending direction of the second side 20 may be smaller or larger than the angle between the extending direction of the first side 19 and the extending direction of the second side 20. The joint agent outflow prevention portion has a portion extending along a direction that intersects but is not orthogonal to the incident direction of the optical signal 2i to the optical multiplexer 7, and as the portion advances from the side of the first side wall 17 toward the side of the second side wall 18 along its extending direction, the distance from the joint surface of the mounting portion 6 along the direction parallel to the incident direction increases. As long as the shape is such that the first joint agent can be suppressed from flowing out into the second joint region 16 through the gap between the laser marking 27 and the first side wall 17.

[0033] Embodiment 2. The housing of the integrated optical module in Embodiment 2 will be described with reference to FIG. 5. FIG. 5 shows the mounting surface 26a of the housing 12a included in the integrated optical module of the present embodiment. Referring to FIG. 5, the shape of the laser marking 27a on the mounting surface 26a of the housing 12a is different from that of the mounting surface 26 in FIG. 4. Since the other configurations and functions of the integrated optical module are the same as those of the integrated optical module 101 in Embodiment 1, detailed descriptions will not be repeated.

[0034] In Embodiment 2, the laser marking 27a is provided in a curved shape. As shown in FIG. 5, the laser marking 27a is curved in the incident direction of the optical signal 2i, and the curvature of the laser marking 27a is the largest at a point equidistant from both ends of the laser marking 27a along the laser marking 27a, that is, at the center of the laser marking 27a, and decreases from the center of the laser marking 27a toward both ends. The laser marking 27a has a shape that is line-symmetric with respect to a line passing through the center of the laser marking 27a along the incident direction of the optical signal 2i. The laser marking 27a is provided away from the first side wall 17 and the second side wall 18.

[0035] The portion from the end closest to the first side wall 17 of the laser marking 27a to the center extends along a direction that intersects but is not perpendicular to the incident direction of the optical signal 2i to the optical multiplexer 7 of the optical signal 2i, and as it proceeds from the side of the first side wall 17 to the side of the second side wall 18, the distance L2a from the incident direction to the joint surface of the mounting portion 6 along the parallel direction increases. As a result, the region between the mounting portion 6 and the laser marking 27a expands from the end of the laser marking 27a toward the center. The amount of the first adhesive that can be accumulated between the mounting portion 6 and the laser marking 27a increases, and the concentration of the flow of the first adhesive into the gap between the laser marking 27a and the first side wall 17 is alleviated. Therefore, the outflow of the first adhesive to the second joint region 16 can be suppressed.

[0036] Note that the adhesive outflow prevention part is not limited to the shape of the laser marking 27a shown in FIG. 4. It may be curved in a direction different from the incident direction of the optical signal 2i, and it is not necessary for the curvature to be the largest at the center of the adhesive outflow prevention part. Also, the adhesive outflow prevention part may not have a line-symmetric shape. The curved adhesive outflow prevention part has a portion extending along a direction intersecting but not orthogonal to the incident direction of the optical signal 2i to the optical multiplexer 7 of the optical signal 2i, and as the portion advances from the side of the first side wall 17 to the side of the second side wall 18 along the extending direction of the portion, the distance from the first bonding surface 23 along the direction parallel to the incident direction may increase. Through the gap between the laser marking 27a and the first side wall 17, the outflow of the first adhesive to the second bonding region 16 can be suppressed.

[0037] Embodiment 3. The housing of the integrated optical module in Embodiment 3 will be described with reference to FIG. 6. FIG. 6 shows the mounting surface 26b of the housing 12b included in the integrated optical module of the present embodiment. Referring to FIG. 6, the mounting surface 26b of the housing 12b has a different shape of the laser marking 27b as compared with the mounting surface 26 of FIG. 4. Since the other configurations and functions of the integrated optical module 101 are the same as those of the integrated optical module 101 of Embodiment 1, detailed descriptions will not be repeated.

[0038] In Embodiment 3, the laser marking 27b is drawn to have a portion 28 extending along a direction intersecting but not orthogonal to the incident direction of the optical signal 2i, and another portion 29 that is continuous with the portion 28 and extends refracted in a direction different from the portion 28. That is, as shown in FIG. 6, for the portion 28, the distance L2b between the laser marking 27b along the direction parallel to the incident direction of the optical signal and the first bonding surface 23 increases as it advances from the side of the first side wall 17 to the side of the second side wall 18 along the extending direction of the portion 28. Also, the other portion 29 is parallel to the second side 20 of the first bonding surface 23, and the distance L2b between the laser marking 27b along the direction parallel to the incident direction of the optical signal and the first bonding surface 23 is constant. The laser marking 27b is provided away from the first side wall 17 and the second side wall 18.

[0039] As a result, the area between the loading section 6 and the laser marking 27b expands from the side of the first side wall 17 toward the second side wall 18. The amount of the first bonding agent that can be accumulated between the loading section 6 and the laser marking 27b increases, and the concentration of the flow of the first bonding agent into the gap between the laser marking 27a and the first side wall 17 is alleviated. Therefore, the outflow of the first bonding agent into the second bonding region 16 can be suppressed. Also, another portion 29 parallel to the second side 20 of the first bonding surface 23 can be used as a reference for member arrangement. For example, it serves as an arrangement reference when bonding the temperature adjustment element 5 to the mounting surface 26b.

[0040] In FIG. 6, Portion 28 the angle between the extending direction of [[]] and the extending direction of the second side 20 is larger than the angle between the extending direction of the first side 19 and the extending direction of the second side 20, but it may be smaller or the same. The bonding agent outflow prevention portion extends along a direction that intersects but is not orthogonal to the incident direction of the optical signal 2i into the optical combiner 7 of Portion 28 and has Portion 28 while Portion 28 it may have a shape in which the distance from the first bonding surface 23 along the direction parallel to the incident direction increases as it advances from the side of the first side wall 17 toward the side of the second side wall 18 along the extending direction of [[]]. Through the gap between the laser marking 27b and the first side wall 17, the outflow of the first bonding agent into the second bonding region 16 can be suppressed.

[0041] Embodiment 4. The housing of the integrated optical module in Embodiment 4 will be described with reference to FIG. 7. FIG. 7 shows the mounting surface 26c of the housing 12c included in the integrated optical module of the present embodiment. Referring to FIG. 7, the shape of the laser marking 27c on the mounting surface 26c of the housing 12c is different from that of the mounting surface 26 of the integrated optical module 101 in FIG. 4. Since the other configurations and functions of the integrated optical module are the same as those of the integrated optical module 101 in Embodiment 1, detailed descriptions will not be repeated.

[0042] In Embodiment 4, the laser marking 27c includes a first portion 30 extending along a direction orthogonal to the incident direction of the optical signal 2i, and a second portion 31 provided separately from the first portion 30 and extending along the same direction as the first portion. The laser marking 27c is provided away from the first side wall 17 and the second side wall 18. That is, as shown in FIG. 7, the first portion 30 and the second portion 31 are parallel to the second side 20 of the first joint surface 23, and the distance L2c between the laser marking 27c along the direction parallel to the incident direction of the optical signal and the first joint surface 23 is constant.

[0043] As a result, not only the gap between the laser marking 27c and the first side wall 17, but also the gap between the first portion 30 and the second portion 31 where the distance between the first joint region 15 and the second joint region 16 is large, the first adhesive is induced, so that the concentration of the first adhesive in the gap between the laser marking 27c and the first side wall 17 is alleviated. Therefore, the outflow of the first adhesive into the second joint region 16 can be suppressed. At this time, the gap between the first portion 30 and the second portion 31 is located farther from the first side 19 of the optical multiplexer 7 than the gap between the first portion 30 and the first side wall 17. Therefore, even if the first adhesive flows out from the gap between the first portion 30 and the second portion 31, it is difficult to be mixed into the second adhesive. In FIG. 7, the second portion 31 is arranged on the same straight line as the first portion 30. However, for example, it may be arranged on the side farther from the second joint surface 24 with respect to the first portion 30. Furthermore, it can be used as a reference for member arrangement. For example, it serves as an arrangement reference when joining the temperature adjustment element 5 to the mounting surface 26. First portion 30 and second portion 31 c

[0044] Embodiment 5. ​​The housing of the integrated optical module in Embodiment 5 will be described with reference to FIG. 8. FIG. 8 shows the mounting surface 26d of the housing 12d included in the integrated optical module of this embodiment. Referring to FIG. 8, the mounting surface 26d of the housing 12d has a different shape of the laser marking 27d compared to the mounting surface 26 of FIG. 4. Since the other configurations and functions of the integrated optical module are the same as those in Embodiment 1, detailed descriptions will not be repeated.

[0045] In Embodiment 5, the laser marking 27d has a portion 32 extending along a direction intersecting but not orthogonal to the incident direction of the optical signal, and another portion 33 provided separately from the portion 32. The other portion 33 is drawn so as to extend parallel to the second side 20. That is, as shown in FIG. 8, the portion 32 is drawn parallel to the first side 19 of the second joint surface 24, and the other portion 33 is drawn parallel to the second side 20 of the first joint surface 23. Therefore, the distance L2d between the laser marking 27d along the direction parallel to the incident direction of the optical signal and the first joint surface 23 is Another portion 33 constant in Portion 32 and increases as it proceeds from the side of the first side wall 17 to the side of the second side wall 18 along the extending direction thereof. Both the portion 32 and the other portion 33 are provided away from the first side wall 17 and the second side wall 18, and the portion 32 is disposed closer to the first side wall 17 than the other portion 33. 。

[0046] As a result, the region between the mounting portion 6 and the laser marking 27d expands from the side of the first side wall 17 toward the second side wall 18. The amount of the first adhesive that can be accumulated between the mounting portion 6 and the laser marking 27d increases. In addition, since the first adhesive is guided not only to the gap between the laser marking 27d and the first side wall 17 but also to the gap between the portion 32 and the other portion 33, the concentration of the flow of the first adhesive in the gap between the laser marking 27d and the first side wall 17 is alleviated. Therefore, it is possible to suppress the first adhesive from flowing out to the second joint region 16.

[0047] Also, the region between another portion 33 and the first side 19 of the second joint surface 24 is wider than the portion 32 and the first side 19. Therefore, even if the first bonding agent flows out from the gap between the portion 32 and another portion 33, the first bonding agent can be accumulated in the region between another portion 33 and the first side 19 of the second joint surface 24. Thus, even if the first bonding agent flows out from the gap between the portion 32 and another portion 33, it is difficult for the first bonding agent to be mixed into the second bonding agent. Furthermore, another portion 33 parallel to the second side 20 of the first joint surface 23 can be used as a reference for member arrangement. For example, it serves as an arrangement reference when bonding the temperature adjustment element 5 to the mounting surface 26d.

[0048] Note that the portion 32 does not have to be provided parallel to the first side 19 of the second joint surface 24. The angle between the extending direction of the portion 32 and the extending direction of the second side 20 may be smaller or larger compared to the angle between the extending direction of the first side 19 and the extending direction of the second side 20.

[0049] Embodiment 6. The housing of the integrated optical module in Embodiment 6 will be described with reference to FIG. 9. FIG. 9 shows the mounting surface 26e of the housing 12e included in the integrated optical module of the present embodiment. Referring to FIG. 9, the mounting surface 26e of the housing 12e has a different shape of the laser marking 27e compared to the mounting surface 26 of FIG. 4. Since the other configurations and functions of the integrated optical module are the same as those in Embodiment 1, detailed descriptions will not be repeated.

[0050] In the previous Embodiments 1 to 5, the case where the laser marking as the bonding agent outflow prevention portion is provided away from the first side wall 17 and the second side wall 18 has been shown. However, in Embodiment 6, it may be provided in contact with the first side wall 17 and the second side wall 18 as shown in FIG. 9.

[0051] When the application amount of the first adhesive is large, there is a risk that the first adhesive may jump over the laser marking as an adhesive outflow prevention part. Particularly in the portion of the first side 19 close to the first side wall 17, the distance L1 between the first side 19 and the second side 20 is closer than other portions. If the first adhesive jumps over the laser marking, there is a risk that the first adhesive may be mixed with the second adhesive.

[0052] In Embodiment 6, the region between the mounting portion 6 and the laser marking 27e expands from the side of the first side wall 17 toward the second side wall 18. As a result, the amount of the first adhesive that can be accumulated between the mounting portion 6 and the laser marking 27e increases. Since the first adhesive is guided to the expanded region, it is alleviated that the first adhesive jumps over the laser marking 27e and flows into the second bonding region 16. Therefore, it is possible to suppress the first adhesive from flowing out to the second bonding region 16.

[0053] The above embodiments can also be configured as follows. In Embodiments 1 to 3, an example in which the adhesive outflow prevention part is continuously formed is shown, but the adhesive outflow prevention part may be separately formed. An example of the separated location is, in Embodiments 1 and 2, the central portion located at an equal distance from both ends of the adhesive outflow prevention part along the adhesive outflow prevention part, and in Embodiment 3, the bent portion of the adhesive outflow prevention part.

[0054] Also, in Embodiments 1 to 6, an example in which the adhesive outflow prevention part is formed by laser marking is shown, but the shape of the adhesive outflow prevention part may be a convex portion or a concave portion. The concave portion is formed by etching the mounting surface 26. The convex portion is formed by installing a member on the mounting surface 26.

[0055] In addition, appropriately combining, modifying, or omitting each embodiment is also included in the scope of the technical idea shown in the embodiment.

Explanation of Reference Numerals

[0056] 1i (10, 11, 12, 13) light-emitting element, 2i (20, 21, 22, 23) optical signal, 3i (30, 31, 32, 33) collimating lens, 4 mounting member, 5 temperature adjustment element, 6 mounting portion, 7 optical multiplexer, 8i (80, 81, 82, 83) filter, 9 mirror, 10 holder, 11 connector, 12, 12a, 12b, 12c, 12d, 12e housing, 13 condenser lens, 14 receptacle, 15 first bonding region, 16 second bonding region, 17 first side wall, 18 second side wall, 19 first side, 20 second side, 21 first surface, 22 second surface, 23 first bonding surface, 24 second bonding surface, 25 cutout portion, 26, 26a, 26b, 26c, 26d, 26e mounting surface, 27, 27a, 27b, 27c, 27d, 27e laser marking, 28 portion, 29 another portion, 30 first portion, 31 second portion, 32 portion, 33 another portion, 101 integrated optical module, L1 distance from the second side along the direction parallel to the incident direction of the optical signal, L2, L2a, L2b, L2c, L2d, L2e distance between the laser marking along the direction parallel to the incident direction of the optical signal and the first bonding surface.

Claims

1. A housing (12) having a mounting surface (26), and a first side wall (17) and a second side wall (18) that are continuous from the mounting surface and face each other; A plurality of light emitting elements (1i) that emit optical signals (2i) having different wavelengths respectively; A mounting portion (6) on which the plurality of light emitting elements are mounted; An optical multiplexer (7) that multiplexes the plurality of optical signals emitted from the plurality of light emitting elements, and is provided with; The mounting surface of the housing is A first bonding region (15) to which a first bonding agent for bonding the mounting surface of the housing and the mounting portion is applied; A second bonding region (16) that bonds the mounting surface of the housing and the optical multiplexer and to which a second bonding agent having a different material from the first bonding agent is applied; The bonding surface (24) of the optical multiplexer that bonds to the mounting surface has a first side (19) parallel to a crossing direction that is not orthogonal to the incident direction of the plurality of optical signals to the optical multiplexer; The bonding surface (23) of the mounting portion that bonds to the mounting surface has a second side (20) facing the first side; The mounting portion and the optical multiplexer are disposed between the first side wall and the second side wall so that their respective bonding surfaces do not overlap in the facing direction of the first side wall and the second side wall; The first side has a distance (L1) from the side of the first side wall to the side of the second side wall along the first side and parallel to the incident direction, which increases as it advances along the incident direction; A bonding agent outflow prevention portion (27) for preventing the outflow of the bonding agent is provided between the first bonding region and the second bonding region on the mounting surface of the housing; The bonding agent outflow prevention portion has a portion extending along a crossing direction that is not orthogonal to the incident direction, and the distance (L2) from the bonding surface of the mounting portion along the incident direction to the portion increases as it advances from the side of the first side wall to the side of the second side wall along the extending direction of the portion. It is configured to be; The first bonding agent accumulates between the first bonding region and the second bonding region. An integrated optical module, wherein a region between the mounting portion and the bonding agent outflow prevention portion expands from an end of the bonding agent outflow prevention portion toward the center, and the bonding agent outflow prevention portion is curved so that the first bonding agent accumulates between the first bonding region and the bonding agent outflow prevention portion.

2. A housing (12) having a mounting surface (26), a first side wall (17) and a second side wall (18) that are continuous from the mounting surface and face each other; A plurality of light emitting elements (1i) that emit optical signals (2i) having different wavelengths; A mounting portion (6) for mounting the plurality of light emitting elements; An optical multiplexer (7) that multiplexes the plurality of optical signals emitted from the plurality of light emitting elements, and The mounting surface of the housing is A first bonding region (15) to which a first bonding agent for bonding the mounting surface of the housing and the mounting portion is applied; A second bonding region (16) that bonds the mounting surface of the housing and the optical multiplexer and to which a second bonding agent having a different material from the first bonding agent is applied, and A bonding surface (24) of the optical multiplexer that bonds to the mounting surface has a first side (19) parallel to a direction that intersects and is not orthogonal to an incident direction of the plurality of optical signals to the optical multiplexer; A bonding surface (23) of the mounting portion that bonds to the mounting surface has a second side (20) facing the first side; The mounting portion and the optical multiplexer are arranged between the first side wall and the second side wall so that their respective bonding surfaces do not overlap in a direction facing each other of the first side wall and the second side wall; The first side has a distance (L1) from the side of the first side wall along the first side to the second side along a direction parallel to the incident direction increasing as it proceeds from the side of the first side wall to the side of the second side wall; On the mounting surface of the housing, an adhesive outflow prevention portion (27) for preventing the outflow of the adhesive is provided between the first bonding region and the second bonding region. The adhesive outflow prevention portion has a portion extending along a direction intersecting the incident direction and not perpendicular thereto, and the distance (L2) from the bonding surface of the stacking portion along the direction parallel to the incident direction to the portion increases as it advances from the side of the first side wall to the side of the second side wall along the extending direction of the portion. The first adhesive accumulates between the first bonding region and the second bonding region. The adhesive outflow prevention portion is configured such that the distance (L2) increases as it refracts and heads toward the second side wall, and the first adhesive flows and accumulates on the side of the second side wall. The integrated optical module is characterized by this.

3. The integrated optical module according to claim 1 or claim 2, wherein the adhesive outflow prevention portion is a laser marking.

4. The integrated optical module according to claim 3, wherein the adhesive outflow prevention portion is provided away from the first side wall and the second side wall.

5. The integrated optical module according to claim 1 or claim 2, wherein the first adhesive is solder and the second adhesive is a UV curable adhesive.

6. The optical multiplexer (7) has a plurality of filters (8i), a mirror (9), and a holder (10) for fixing the plurality of filters and the mirror. The integrated optical module according to any one of claims 1 to 5, wherein the plurality of filters and the mirror perform multiplexing of the plurality of optical signals.

7. The integrated optical module according to any one of claims 1 to 6, wherein the stacking portion (6) includes a temperature adjustment element (5).

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