Electronic device

Abstract

To provide an electronic device capable of preventing malfunctions due to metal foreign objects when using a press-fit terminal.SOLUTION: The electronic device includes a circuit board 4 in which electronic components 7 and 8 are mounted and a hole-shaped electrode 10 is provided through which a press-fit terminal 6 for electrical connection is inserted. A male connector housing is arranged independently from the press-fit terminal 6. Also, a solder 14 that at least partially covers the hole-shaped electrode 10 of the circuit board 4 is included. Since the solder 14 at least partially covers the hole-shaped electrode 10 of the circuit board 4, metal foreign objects 15 can be trapped.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic device.

Background Art

[0002] The ECU requires a connector structure that can accommodate a large number of components, and for example, uses terminals called press-fit terminals. ECU is an abbreviation for Electronic Control Unit. When inserting a press-fit terminal into a hole-shaped electrode provided on a substrate from above, there is a risk that the plating applied to the surface of the press-fit terminal will be scraped off. In this case, it is conceivable that metal foreign matter will adhere to the upper part of the substrate. Also, in the lower part of the substrate on the side opposite to the insertion side, it is conceivable that metal foreign matter will remain due to the scraping of the metal plating in the hole-shaped electrode of the substrate.

[0003] It is a known fact that metal foreign matter can cause unexpected failures. To prevent problems caused by metal foreign matter, it is conceivable to prepare additional components to catch the metal foreign matter as in Patent Document 1. As described in Patent Document 1, structures for catching metal foreign matter have been proposed so far, but they have been limited to dealing with those generated in the lower part of the substrate.

[0004] Also, although protective measures such as adding components or resin molding can be taken, they lead to increased costs and a decrease in mounting density. When using normal terminals instead of press-fit terminals to prevent problems caused by metal foreign matter, the terminals cannot be held during reflow, and additional components for holding are likely to be required.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of the present disclosure is to provide an electronic device capable of preventing problems caused by metal foreign matter when press-fit terminals are used.

Means for Solving the Problems

[0007] According to the invention described in claim 1, there is provided a circuit board on which electronic components are mounted and which is provided with hole-shaped electrodes for inserting press-fit terminals for electrical connection, and a housing component for fixing the circuit board. The male connector housing is disposed independently of the press-fit terminals. Further, it includes solder that at least partially covers the hole-shaped electrodes of the circuit board. The solder at least partially covers the hole-shaped electrodes of the circuit board It exists. Or the solder partially covers the periphery of the through-hole of the hole-shaped electrode. Thereby, so that metal foreign matter can be trapped, and problems caused by metal foreign matter can be prevented when press-fit terminals are used.

Brief Description of the Drawings

[0008]

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Embodiments for Carrying Out the Invention

[0009] Hereinafter, several embodiments of the electronic device will be described with reference to the drawings. In each of the embodiments described below, components that perform the same or similar operations are denoted by the same or similar reference numerals, and the description thereof will be omitted as necessary.

[0010] (First Embodiment) The first embodiment will be described with reference to FIGS. 1 to 13. As shown in FIGS. 2 and 3, the electronic device 1 includes a case 2 and a cover 3 as housing components, and a circuit board 4 is assembled inside these case 2 and cover 3. A horizontal connector 5 is mounted on the circuit board 4, and press-fit terminals 6 are fixed to a part of the circuit board 4. Although not shown in FIG. 2, electronic components 7 and 8 such as chip components and semiconductor components are mounted on the first surface 4a and the second surface 4b of the circuit board 4. Refer to FIGS. 1 and 7 to 13 for the electronic components 7 and 8. The case 2 and the cover 3 are made of resin or metal.

[0011] In this embodiment, the case 2 is made of resin integrally formed with a male connector housing 9, and the cover 3 is formed by molding a conductive material into a flat plate shape to hold the ground. The circuit board 4 is made of a printed board or a ceramic board of a predetermined material. The circuit board 4 is configured by applying wiring (not shown) formed on its surface or inside to an insulating base material.

[0012] As shown in FIGS. 2 to 4, the circuit board 4 is disposed on the cover 3, and the case 2 is disposed and assembled so as to cover the upper side of the circuit board 4. At this time, as shown in FIGS. 3 to 5, the press-fit terminals 6 are assembled to the circuit board 4, and the male connector housing 9 is formed in the case 2. Therefore, in this embodiment, the press-fit terminals 6 and the male connector housing 9 are configured independently.

[0013] For convenience of explanation, among the circuit board 4, the upper surface in FIG. 2 is referred to as the first surface 4a, the upper surface in FIG. 3 is referred to as the second surface 4b, and its cross-section is shown in FIG. 1. As shown in FIG. 1, the circuit board 4 is provided with hole electrodes 10 between its two surfaces. The hole electrode 10 is called a through hole and is formed by forming a conductive member on the inner surface of the through hole of the circuit board 4. Note that the through hole of the hole electrode 10 is configured in a circular shape when viewed from above. Thereby, electrical connection can be made across both the first surface 4a and the second surface 4b, and circuit connection can be achieved when electronic components 7 and 8 are mounted on both surfaces respectively. A press-fit terminal 6 serving as a press-in terminal is inserted into the hole electrode 10.

[0014] The press-fit terminal 6 has a conductive metal plating on its exposed surface. The press-fit terminal 6, together with a terminal pin 11 configured in a strip shape, includes a deformation portion 12 provided at the tip so as to be connected to the terminal pin 11 and elastically deform. Further, the press-fit terminal 6 integrally provides a protrusion 13 protruding in the lateral direction at the middle of the strip-shaped terminal pin 11 to the terminal pin 11. When assembling the press-fit terminal 6 to the circuit board 4, the protrusion 13 is held by a jig and inserted into and press-fitted into the hole electrode 10 along the longitudinal direction of the terminal pin 11. The deformation portion 12 is configured in an annular cross-section and has a circular or elliptical cavity inside the annular shape. The outer edge and the inner edge of the deformation portion 12 are both configured in a circular or elliptical shape. The shape of the deformation portion 12 is not limited to the shape of the present embodiment. It may be configured as an action pin, U-shaped, H-shaped, or M-shaped.

[0015] When the deformation portion 12 is inserted into the hole electrode 10 and press-fitted, the deformation portion 12 applies a reaction force to the hole electrode 10 from the inside, so that the cavity inside the deformation portion 12 deforms longitudinally, and the cavity becomes a longitudinally elongated elliptical cross-section. Along with this, the outer edge and the inner edge of the deformation portion 12 both deform into a longitudinally elongated elliptical shape.

[0016] The deformable portion 12 presses outward from the inside of the hole-shaped electrode 10 by point contact or surface contact. As a result, the deformable portion 12 can continuously apply a force outward from the inside of the hole-shaped electrode 10, and the deformable portion 12 can be held inside the hole-shaped electrode 10.

[0017] The deformable portion 12 is configured such that the outer edge height dimension of the ring-shaped portion thereof is higher than the thickness of the circuit board 4. When the deformable portion 12 of the press-fit terminal 6 is inserted into and fixed to the hole-shaped electrode 10, the outer edge of the deformable portion 12 protrudes outward from both surfaces of the circuit board 4.

[0018] Also, as shown in FIG. 1, the solder 14 at least partially covers the hole-shaped electrode 10 of the circuit board 4. However, in the present embodiment, the solder 14 is not printed inside the through hole of the hole-shaped electrode 10 of the circuit board 4, and is formed to cover the hole-shaped electrode 10 above the first surface 4a or below the second surface 4b of the circuit board 4. That is, there is no solder 14 below the first surface 4a and above the second surface 4b of the circuit board 4.

[0019] When the deformable portion 12 of the press-fit terminal 6 is inserted into the through hole of the hole-shaped electrode 10, the conductive member inside the hole-shaped electrode 10 is scraped, and thus, as shown in FIG. 1, metal foreign matter 15 is generated. The metal foreign matter 15 adheres to the inside and outside of the hole-shaped electrode 10, the first surface 4a, and the second surface 4b of the circuit board 4. Therefore, by configuring the solder 14 to at least partially cover the hole-shaped electrode 10 of the circuit board 4, the metal foreign matter 15 can be trapped and configured not to fall from the circuit board 4.

[0020] The following describes the assembly process with reference to FIGS. 6 to 13. First, as shown in FIG. 6, a circuit board 4 with hole-shaped electrodes 10 and 10b is prepared, and solder 14a is printed on the surface electrode 14z formed on the second surface 4b of the circuit board 4. Next, as shown in FIG. 7, electronic components 8 such as chip components are mounted on the surface electrode 14z of the second surface 4b and fixed by reflow. Next, as shown in FIG. 8, the circuit board 4 is turned over so that the first surface 4a faces upward, and solder 14a is printed on the surface electrode 14z formed on the first surface 4a. At this time, as shown in the hole-shaped electrode 10b on the right side of FIG. 8, solder 14b may also be printed inside the through-hole of the hole-shaped electrode 10b.

[0021] Next, as shown in FIG. 9, the press-fit terminal 6 is pushed into the through-hole of the hole-shaped electrode 10 for mounting. At this time, the protrusion 13 provided in the middle of the press-fit terminal 6 is held by a jig (not shown) and pressed against the circuit board 4 side, so that the deformed portion 12 can be press-fitted into the through-hole of the hole-shaped electrode 10. At this time, the deformed portion 12 is just held at the middle position of the hole-shaped electrode 10. Since the press-fit terminal 6 slides along the inside of the hole-shaped electrode 10, as shown in FIG. 9, metal foreign matter 15 protrudes above the first surface 4a and below the second surface 4b of the circuit board 4 from the portion where the press-fit terminal 6 slides.

[0022] Next, as shown in FIG. 10, electronic components 7 such as chip components are mounted on the first surface 4a, and the terminals 5a of the side-out connector 5 are inserted into the through-holes of the hole-shaped electrodes 10b. Although solder 14b is printed on the hole-shaped electrode 10b, since the solder 14b is not fixed, the terminals 5a of the side-out connector 5 can be inserted into the inside of the through-holes of the hole-shaped electrodes 10b.

[0023] Thereafter, as shown in FIG. 11, the electronic component 7 mounted on the first surface 4a of the circuit board 4 and the terminal 5b of the side outlet connector 5 are fixed to the circuit board 4 with solder 14b. At this time, even if the metal foreign matter 15 protrudes above and below the hole-shaped electrode 10, the solder 14 on the first surface 4a and the second surface 4b melts or remelts to capture the metal foreign matter 15 and solidifies along the outer edge of the deformed portion 12 of the press-fit terminal 6, thereby fixing the metal foreign matter 15. In this embodiment, a single-sided reflow form has been described, but a double-sided reflow may also be used.

[0024] Next, as shown in FIG. 12, the assembly of the circuit board 4 with the electronic components 7, 8 and the side outlet connector 5 assembled is assembled to the case 2. At this time, the terminal pins 11 of the press-fit terminal 6 are inserted into the holes 2a pre-processed in the case 2. At this time, the terminal pins 11 of the press-fit terminal 6 can be protected by the male connector housing 9 provided outside the terminal pins 11. Refer to FIG. 13. Also, as shown in FIG. 13, the cover 3 is put on and assembled to the assembly of the circuit board 4 assembled to the case 2. Thereby, the electronic device 1 can be configured as shown in FIGS. 4 and 5.

[0025] <Significance of the Configuration and Manufacturing Method of this Embodiment> According to this embodiment, since the male connector housing 9 and the plurality of terminal pins 11 of the press-fit terminal 6 can be configured independently, it can be configured at low cost without affecting the terminal pitch. Furthermore, there is no need to change from the conventional manufacturing process. Since the solder 14a is printed on the surface electrode 14z around the portion where the terminal pins 11 are inserted and reflowed together with the electronic components 7 and 8 after the press-fit terminal 6 is inserted, the press-fit terminal 6 can be made self-supporting directly on the circuit board 4. Also, it can be configured to trap the metal foreign matter 15 generated from above and below the circuit board 4 and prevent it from falling onto the circuit board 4.

[0026] According to the structure or manufacturing method of this embodiment, there is no need to fix the terminal pins 11 of the press-fit terminal 6 with solder 14 or the like, or even if solder 14 is used, the amount can be reduced. That is, the amount of the reflow solder 14a can be less than the amount of the solder 14a for fixing the terminal pins 11 of the normal press-fit terminal 6. Therefore, the surface electrode 14z on which the solder 14a is placed does not need to be as large as the surface electrode for fixing the normal terminal pins 11 with solder 14. In the configuration of this embodiment, it is possible to suppress the size of the surface electrode 14z from being restricted by the interval of the terminal pins 11 on the circuit board 4. Since the solder 14 around the hole-shaped electrode 10 in this embodiment is not for the purpose of electrical connection, the solder 14 does not have to fill the inside of the through hole of the hole-shaped electrode 10. Also, since the solder 14 is used in the reflow process, the above-described structure can be realized at low cost.

[0027] (Second Embodiment) The second embodiment will be described with reference to FIG. 14. As shown by the longitudinal sectional view in the upper part of FIG. 14, the solder 14 may be printed inside the through hole of the hole-shaped electrode 10 of the circuit board 4. As shown by one manufacturing process in the lower part of FIG. 14, when the solder 14 is printed on the surface electrode 14z of the first surface 4a, the solder 14a can be left inside the through hole of the hole-shaped electrode 10 by simultaneously printing it with respect to the inside of the hole-shaped electrode 10. Then, as shown in the upper part of FIG. 14, the deformed portion 12 of the press-fit terminal 6 is inserted into and press-fitted into the through hole of the hole-shaped electrode 10. Thereby, as shown in the upper part of FIG. 14, the solder 14 can be left inside the hole-shaped electrode 10, and the metal foreign matter 15 can be trapped in the same manner as in the above-described embodiment. Thus, the same operational effects as those of the first embodiment can be obtained.

[0028] (Third Embodiment) The third embodiment will be described with reference to FIGS. 15 to 25. Note that components identical or similar to those of the first embodiment will be described with reference numerals obtained by adding 50 to the corresponding reference numerals of the components of the first embodiment. FIGS. 15 to 17 illustrate the structure of an electronic device 51 including a horizontally projecting and self-standing press-fit terminal 56. As shown in FIG. 16, a circuit board 54 is housed in a case 52, and a horizontally projecting and self-standing L-shaped press-fit terminal 56 is fixed to one end of the circuit board 54.

[0029] In this embodiment, the case 52 and the male connector housing 59 of the press-fit terminal 56 are configured separately. The case 52 is configured in a rectangular box shape with an opening, and a protrusion 52a is integrally formed on the side surface of the rectangular box of the case 52 on the opening side. A boss 52b (see FIGS. 24 and 25) is provided inside the case 52, and the other end of the circuit board 4 is fitted into the boss 52b to fix the circuit board 4 to the case 52.

[0030] On the other hand, as shown in FIGS. 15 to 17, the male connector housing 59 mainly includes a base portion 53c formed in a U-shaped cross section, and a rectangular frame-shaped male connector housing 59 is integrally formed on the base portion 53c. Inside the rectangular frame of the male connector housing 59, holes 53a (see FIG. 25) for inserting the terminal pins 61 of the press-fit terminal 56 are formed in alignment.

[0031] As shown in FIG. 16, the male connector housing 59 is provided with rectangular fixing holes 53b on the upper and lower flat portions of the U-shaped cross section, respectively. The fixing holes 53b are configured to be fixed to the opening side of the case 52 by being fitted into the protrusions 52a provided on the side surface of the case 52. Thereby, the case 52 and the male connector housing 59 can be fixed. At this time, the tip of the terminal pin 61 of the L-shaped press-fit terminal 56 can be projected to the opening side of the male connector housing 59 by inserting the tip of the terminal pin 61 into a plurality of individual holes 53a (see FIG. 25) inside the rectangular frame of the male connector housing 59.

[0032] The following describes the assembly process with reference to FIGS. 18 to 25. First, as shown in FIG. 18, a circuit board 54 with a hole-shaped electrode 60 is prepared, and solder 64a is printed on a surface electrode 64z formed on the second surface 54b of the circuit board 54. Next, as shown in FIG. 19, an electronic component 58 such as a chip component is mounted on the surface electrode 64z of the second surface 54b and reflowed. Next, as shown in FIG. 20, the circuit board 54 is inverted with the first surface 54a facing up, and solder 64a is printed on the surface electrode 64z again.

[0033] Next, as shown in FIG. 21, the deformed portion 62 of the press-fit terminal 56 is pushed into the through-hole of the hole-shaped electrode 60 for mounting. At this time, the protruding portion 63 provided in the middle of the press-fit terminal 56 is held by a jig (not shown) and pressed against the circuit board 54 side, so that the deformed portion 62 can be press-fitted into the hole-shaped electrode 60. At this time, the deformed portion 62 is just held at the middle position of the hole-shaped electrode 60. Since the press-fit terminal 56 slides along the inside of the hole-shaped electrode 60, as shown in FIG. 21, metal foreign matter 65 may protrude above and below the hole-shaped electrode 60 from the portion where the press-fit terminal 56 is sliding.

[0034] Next, as shown in FIG. 22, an electronic component 57 such as a chip component is mounted on the first surface 54a. Then, as shown in FIG. 23, the electronic component 57 mounted on the first surface 54a is fixed to the circuit board 4 with solder 14 by reflowing. At this time, even if the metal foreign matter 65 protrudes above and below the hole-shaped electrode 60, the solder 64 on the first surface 54a and the second surface 54b melts and remelts to capture the metal foreign matter 65 and solidifies along the outer edge of the deformed portion 62 of the press-fit terminal 56, thereby fixing the metal foreign matter 65. As shown in FIG. 23, since the main purpose is to fix the metal foreign matter 65, the solder 14 does not have to contact the deformed portion 62. When the purpose is to fix the metal foreign matter 65 in this way, the amount of the solder 14 can be made smaller than when the purpose is also to fix the press-fit terminal 56. Although FIG. 23 shows that the solder 64 does not contact the deformed portion 62, it may be made to contact. In the present embodiment, a single-sided reflow form is shown, but a double-sided reflow may be used.

[0035] Next, as shown in FIG. 24, an assembly of the circuit board 54 on which the electronic components 57 and 58 and the press-fit terminal 56 are assembled is assembled into the case 52. At this time, the circuit board 54 is fixed by fitting it into a boss 52b pre-processed in the case 52. Also, as shown in FIG. 25, a cover 53 is put on and assembled to the assembly of the circuit board 54 assembled in the case 52. At this time, the terminal pins 61 of the press-fit terminal 56 can be inserted into the hole 53a while being surrounded and protected by the male connector housing 59. Thereby, as shown in FIGS. 15 to 17, the electronic device 51 can be configured. The present embodiment also has the same operational effects as those of the foregoing embodiments.

[0036] (Fourth Embodiment) The fourth embodiment will be described with reference to FIG. 26. In this embodiment, as shown in FIG. 26, the case 73 serving as a housing component and the male connector housing 79 are separately configured, and an example is shown in which the male connector housing 79 is fixed to the circuit board 74. FIG. 26 shows an exploded perspective view seen from above, and the cover 72 serving as a housing component, the circuit board 74, the seal member 100, and the case 73 serving as a housing component are arranged in this order from above. The cover 72 and the case 73 are fixed by screws 101, and the case 73 and the circuit board 74 are also fixed by screws 102.

[0037] The male connector housing 79 is mounted on the circuit board 74. The male connector housing 79 is configured in a rectangular frame shape with an opening on the lower side. Inside the male connector housing 79 fixed to the circuit board 74, the press-fit terminals 6 formed in a strip shape are inserted, and the terminal pins 11 of the press-fit terminals 6 project downward. In this embodiment, an example is illustrated in which the terminal pins 11 of the male connector housing 79 are constituted by the press-fit terminals 6. As shown in this embodiment, it may be applied to a form in which the male connector housing 79 is fixed to the circuit board 74.

[0038] (Fifth Embodiment) The fifth embodiment will be described with reference to FIG. 27. In the first to third examples of FIG. 27, as shown in a top view of the circuit board 4, the solder 14 only needs to partially cover the periphery of the through hole of the hole-shaped electrode 10. As shown in FIG. 27 with the conventional structure as a comparative example, it is normal for a surface electrode 14z to be formed around the hole-shaped electrode 10 through which the terminal pin 11 of the press-fit terminal 6 is inserted, and it is conceivable to place the solder 14 on this surface electrode 14z to trap the metal foreign matter 15. However, in this example, the formation area of the surface electrode 14z becomes wide, and the amount of solder mounted on the surface electrode 14z also increases.

[0039] As shown in the first example of FIG. 27, the surface electrode 14z may be configured in an elliptical shape according to the region capable of trapping the metal foreign object 15. The terminal pin 11 of the press-fit terminal 6 is configured in a rectangular shape when viewed from above. That is, since the cross-sectional shape is rectangular, the portion corresponding to the corner of this rectangular shape often contacts the hole-shaped electrode 10 to generate the metal foreign object 15. For this reason, it is preferable that the surface electrode 14z on which the solder 14 is placed has an elliptical shape with a major axis along the long side of the rectangle of the press-fit terminal 6 when the press-fit terminal 6 is inserted into the through-hole of the hole-shaped electrode 10. Then, the surface electrode 14z can be concentrated at the generation point of the metal foreign object 15, and the formation region of the surface electrode 14z can be made narrower compared to the comparative example.

[0040] When it is only necessary to trap the metal foreign object 15, as shown in the second example of FIG. 27, the surface electrode 14z on which the solder 14 is placed may be configured only at the root portion around the hole-shaped electrode 10. For example, a surface electrode 14z on which the solder 14 is placed in a semi-circular ring shape may be provided only on the side of the rectangular contact point where the terminal pin 11 of the press-fit terminal 6 contacts the hole-shaped electrode 10. Then, the formation region of the surface electrode 14z can be made narrower compared to the comparative example.

[0041] Furthermore, when it is only necessary to trap the metal foreign object 15, as shown in the third example of FIG. 27, it is preferable that the surface electrode 14z on which the solder 14 is placed is partially provided at the portion where the press-fit terminal 6 and the hole-shaped electrode 10 are in point contact among the periphery of the hole-shaped electrode 10. For example, a surface electrode 14z on which the solder 14 is placed radially may be provided starting from the four-point region where the rectangular contact point of the terminal pin 11 of the press-fit terminal 6 contacts. Then, the formation region of the surface electrode 14z can be made narrower compared to the comparative example. The first to third examples according to the fifth embodiment are examples that can be realized at low cost, and by reducing the region of the surface electrode 14z on which the solder 14 is placed, a large mounting area for other electronic components 7, 8, etc. can be secured.

[0042] (Other embodiments) The present invention is not limited to the foregoing embodiments, and for example, the following modifications or extensions are possible. The electronic devices 1 and 51 can be configured as, for example, electronic control devices for vehicles mounted on vehicles. Although the present disclosure has been described in accordance with the foregoing embodiments, it is understood that the present disclosure is not limited to such embodiments and structures. The present disclosure also includes various modifications and modifications within the equivalent scope. In addition, various combinations and forms, and further, other combinations and forms including only one element, more than one element, or less than one element thereof, are within the scope and spirit of the present disclosure.

Explanation of Reference Numerals

[0043] In the drawings, 1 and 51 are electronic devices, 4 and 54 are circuit boards, 2, 52, and 72 are cases (housing components), 3, 53, and 73 are covers (housing components), 14 is solder, 6 and 56 are press-fit terminals, 9 and 59 are male connector housings, and 11 and 61 are terminal pins.

Claims

1. A circuit board (4, 54) on which electronic components are mounted and which is provided with hole electrodes (10, 60) for inserting press-fit terminals (6, 56) for electrical connection, A housing component (2, 3, 52, 53) for fixing the circuit board, A male connector housing (9, 59) disposed independently of the press-fit terminal, and Solder (14, 64) that at least partially covers the hole electrodes of the circuit board, An electronic device in which the solder partially covers the periphery of the through hole of the hole electrode.

2. A circuit board (4, 54) on which electronic components are mounted and which is provided with hole electrodes (10, 60) for inserting press-fit terminals (6, 56) for electrical connection, A housing component (2, 3, 52, 53) for fixing the circuit board, A male connector housing (9, 59) disposed independently of the press-fit terminal, and Solder (14, 64) that at least partially covers the hole electrodes of the circuit board, When the press-fit terminal is rectangular in top view, An electronic device in which a surface electrode on which the solder is placed is formed in an elliptical shape having a major axis along the long side of the rectangle of the press-fit terminal.

3. A circuit board (4, 54) on which electronic components are mounted and which is provided with hole electrodes (10, 60) for inserting press-fit terminals (6, 56) for electrical connection, A housing component (2, 3, 52, 53) for fixing the circuit board, A male connector housing (9, 59) disposed independently of the press-fit terminal, and Solder (14, 64) that at least partially covers the hole electrodes of the circuit board, The surface electrode on which the solder is placed is an electronic device configured only at the base portion around the hole-shaped electrode.

4. A circuit board (4, 54) on which electronic components are mounted and provided with hole-shaped electrodes (10, 60) for inserting press-fit terminals (6, 56) for electrical connection, A housing component (2, 3, 52, 53) for fixing the circuit board, A male connector housing (9, 59) disposed independently of the press-fit terminal, and Solder (14, 64) covering at least partially the hole-shaped electrodes of the circuit board, The surface electrode on which the solder is placed, An electronic device provided partially at a portion where the press-fit terminal and the hole-shaped electrode are in point contact among the periphery of the hole-shaped electrode.

5. The electronic device according to any one of claims 1 to 4, wherein the solder is also printed inside the hole-shaped electrodes of the circuit board.

6. The electronic device according to any one of claims 1 to 5, wherein the housing component and the male connector housing are integrally formed.

7. The housing component and the male connector housing are separately configured, The electronic device according to any one of claims 1 to 5, wherein the housing component and the male connector housing are fixed.

8. The housing component and the male connector housing are separately configured, The electronic device according to any one of claims 1 to 5, wherein the male connector housing is fixed to the circuit board.

9. The electronic device according to any one of claims 1 to 8, wherein the housing component is made of resin or metal.

Images