Organic devices, image forming apparatuses, display devices, photoelectric conversion devices, electronic devices, lighting devices, moving bodies, and wearable devices

Abstract

To provide a technique advantageous for improving the reliability of an organic device.SOLUTION: An organic device includes, on a principal surface of a substrate, a pixel area in which a plurality of pixels each including an organic functional layer are arranged, and a peripheral area including pad electrodes, and has a sealing layer arranged, the sealing layer covering the pixel area and the peripheral area. In the peripheral area, the sealing layer is provided with an opening to expose the pad electrodes. The opening in the sealing layer includes a first part that extends from a top face of the sealing layer toward the pad electrodes, and a second part that, in orthogonal projection onto the principal surface, has its outer edge arranged inside an outer edge of the first part and outer edges of the pad electrodes and opens from a lower end of the first part to the pad electrodes. Conductive particles for electrically connecting to an electrode arranged outside the organic device are arranged on the pad electrodes. The diameter of the conductive particles is larger than the height of the second part.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an organic device, an image forming apparatus, a display device, a photoelectric conversion device, an electronic device, a lighting device, a moving body, and a wearable device.

Background Art

[0002] Organic devices having an organic functional layer containing an organic compound, such as a light-emitting device using an organic electroluminescence film and an imaging device using an organic photoelectric conversion film, are known. Organic compounds are likely to deteriorate in characteristics due to moisture. Patent Document 1 shows that an organic functional layer is sealed using a sealing layer having a laminated structure.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the film thickness of the sealing layer is increased to improve reliability, the step of the opening for exposing the pad electrode in the peripheral region becomes large, and bonding failure may occur in the bonding process for connecting wiring to the pad electrode.

[0005] An object of the present invention is to provide a technique advantageous for improving the reliability of an organic device.

Means for Solving the Problems

[0006] In view of the above problems, an organic device according to an embodiment of the present invention includes a pixel region in which a plurality of pixels including an organic functional layer are arranged on a main surface of a substrate, and a peripheral region including pad electrodes, and is an organic device in which a sealing layer covering the pixel region and the peripheral region is arranged. In the peripheral region, an opening for exposing the pad electrode is provided in the sealing layer. The opening of the sealing layer includes a first portion extending from the upper surface of the sealing layer toward the pad electrode, and in a front projection with respect to the main surface, an outer edge is arranged inside the outer edge of the first portion and the outer edge of the pad electrode, and a second portion opening from the lower end of the first portion to the pad electrode. On the pad electrode, conductive particles for electrically connecting to an electrode arranged outside the organic device are arranged, and a diameter of the conductive particles is larger than a height of the second portion <, the sealing layer includes a first layer and a second layer disposed between the first layer and the main surface and made of a material different from that of the first layer, and an outer edge of the first portion formed by an inner edge of an opening provided in the first layer is disposed outside an outer edge of the pad electrode in a orthographic projection onto the main surface.> It is characterized by this.

Effects of the Invention

[0007] According to the present invention, it is possible to provide a technology advantageous for improving the reliability of an organic device.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

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Figure 12

Mode for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0010] With reference to FIGS. 1 to 3, an organic device according to an embodiment of the present disclosure will be described. FIG. 1 is a plan view showing the structure of an organic device 100 in the present invention. FIG. 2 is a cross-sectional view of the organic device 100 taken along line A-A' in FIG. 1. FIG. 3 is a cross-sectional view of the organic device 100 taken along line B-B' in FIG. 1.

[0011] As shown in FIG. 1, the organic device 100 includes a pixel region 10 in which a plurality of pixels are arranged, and a peripheral region 20 including pad electrodes 30. The pixels arranged in the pixel region 10 include an organic functional layer 211 using an organic light-emitting material or an organic optoelectronic conversion material, and the organic device 100 can function as a light-emitting device including a light-emitting element or an imaging device including an optoelectronic conversion element. The peripheral region 20 may be arranged so as to surround the pixel region 10 as shown in FIG. 1, or may be arranged along one or more sides of the pixel region 10. A circuit for controlling the pixel region 10 or the like may be arranged in the peripheral region 20. The pad electrodes 30 arranged in the peripheral region 20 can be used to exchange signals or the like between the organic device 100 and the outside of the organic device 100. For example, the pad electrodes 30 may be used to output a signal generated in the organic device 100 to the outside, or may be used to input a signal for controlling the organic device 100 from the outside to the organic device 100. Further, for example, the pad electrodes 30 may be used to supply electric power for driving the organic device 100. As the pad electrodes 30, a metal material such as aluminum, silver, an aluminum alloy, a silver alloy, titanium, or titanium nitride can be used.

[0012] As shown in FIGS. 2 and 3, in the organic device 100, an insulating layer 202, a sealing layer 300, and a resin layer 400 are laminated in this order from the side of the main surface 205 of the substrate 201. In the pixel region 10, a lower electrode 210, an organic functional layer 211, and an upper electrode 212 are arranged between the insulating layer 202 and the sealing layer 300. In other words, the insulating layer 202 is arranged between the organic functional layer 211 and the main surface 205 of the substrate 201. Further, in the peripheral region 20, openings for exposing the pad electrodes 30 are provided in the insulating layer 202, the sealing layer 300, and the resin layer 400, respectively. In this specification, the surface of the substrate 201 on which the insulating layer 202, the sealing layer 300, the resin layer 400, etc. are arranged is referred to as the main surface 205.

[0013] The insulating layer 202 is formed using a material having insulating properties. The insulating layer 202 may contain an inorganic material such as a compound containing at least oxygen and silicon, for example, a silicon oxide-based material. Further, for example, it may be formed using an organic material such as a thermosetting resin or a thermoplastic resin. In the present embodiment, the insulating layer 202 is formed using silicon oxide (SiO x ). For example, the insulating layer 202 may be formed by a chemical vapor deposition method (CVD method) using tetraethoxysilane (TEOS). Good coating properties are required for the insulating layer 202, but TEOS can obtain silicon oxide with excellent coating properties by surface reaction via an ethoxy group. Further, compared with the case of forming the insulating layer 202 using monosilane (SiH4) gas having pyrophoricity, TEOS having no pyrophoricity can be safely handled. In order to ensure insulating properties and planarization properties, the thickness of the insulating layer 202 may be 0.5 μm or more and 5.0 μm or less.

[0014] As the substrate 201, an insulating substrate such as glass or resin, a conductive substrate such as aluminum or stainless steel, or a semiconductor substrate such as silicon can be used. An electronic circuit (not shown) such as a transistor or a wiring pattern is disposed between the substrate 201 and the insulating layer 202.

[0015] On the insulating layer 202, in the pixel region 10, a lower electrode 210 is disposed. The lower electrode 210 is connected to an electronic circuit disposed between the substrate 201 and the insulating layer 202 by a plug electrode (not shown) formed of a conductive material such as tungsten. The lower electrode 210 may be a metal material having high conductivity. As the lower electrode 210, for example, a metal material such as aluminum, silver, an aluminum alloy, a silver alloy, titanium, or titanium nitride can be used. In order to reduce current leakage between the electrodes of the lower electrode 210, an insulating layer 213 may be disposed so as to surround the outer edge of the lower electrode 210.

[0016] On top of the organic functional layer 211, an upper electrode 212 is disposed. When the organic functional layer 211 contains an organic light-emitting material, the upper electrode 212 is an electrode that emits the light generated in the organic functional layer 211. Also, when the organic functional layer 211 contains an organic optoelectronic conversion material, the upper electrode 212 is an electrode that transmits the light incident on the organic functional layer 211. In order to utilize a lot of light, a material with high light transmissivity can be used for the upper electrode 212. For the upper electrode 212, a transparent oxide conductive material such as tin oxide, indium oxide, indium tin oxide, or indium zinc oxide may be used. Also, a thin-film metal electrode may be used for the upper electrode 212. In this case, for example, a thin film of gold, platinum, silver, aluminum, chromium, magnesium, or an alloy thereof can be used. When using a thin-film metal electrode, in order to achieve both high conductivity and suppression of light absorption by the metal, the film thickness may be 1 nm or more and 30 nm or less. Also, when using magnesium for the upper electrode 212, since magnesium easily reacts with moisture, it is necessary to suppress the intrusion of moisture, similar to the organic functional layer 211.

[0017] On top of the upper electrode 212, a sealing layer 300 is disposed. In the present embodiment, the sealing layer 300 includes moisture suppression layers 301 and 303 having a lower moisture permeability than the insulating layer 202 from the surface side of the substrate 201. Further, the sealing layer 300 includes a defect suppression layer 302 disposed between the moisture suppression layer 301 and the moisture suppression layer 303 and having a lower defect density than the moisture suppression layer 301. In the present embodiment, the sealing layer 300 has a laminated structure of the moisture suppression layers 301 and 303 with low moisture permeability and the defect suppression layer 302 with extremely high covering property and low defect density, whereby the organic functional layer 211 can be protected from the influence of moisture in the external atmosphere.

[0018] The moisture barrier layers 301 and 303 may contain a compound containing at least nitrogen and silicon, and more specifically, may contain a silicon nitride-based material. For example, the moisture barrier layers 301 and 303 may be so-called nitride films such as silicon nitride (SiN) or silicon oxynitride (SiON) formed by a CVD method. The moisture barrier layers 301 and 303 using silicon nitride or silicon oxynitride formed by the CVD method have an extremely low moisture permeability of about 1×10 -6 g / m 2 ·day. The moisture barrier layers 301 and 303 are not limited to silicon nitride or silicon oxynitride, and any material may be used as long as it has high light transmittance like the upper electrode 212 and is formed so that the moisture permeability is lower than that of the insulating layer 202. For example, the moisture barrier layers 301 and 303 can be formed so that the moisture permeability is 1×10 -5 g / m 2 ·day or less. The moisture barrier layer 301 and the moisture barrier layer 303 may be the same material film layer, for example, both being silicon nitride, or may be different material film layers, such as one being silicon nitride and the other being silicon oxynitride. Also, the film thickness of the moisture barrier layer 301 and the film thickness of the moisture barrier layer 303 may be the same as each other or different from each other.

[0019] The defect suppression layer 302 may contain a compound containing at least oxygen and aluminum, and more specifically, may contain an aluminum oxide-based material. For example, the defect suppression layer 302 may be aluminum oxide formed by an atomic layer deposition method (ALD method). The substrate 201 on which the moisture barrier layer 301 is formed in a film-forming chamber in a vacuum state is placed, trimethylaluminum (TMA) gas is flowed, and TMA is adsorbed on the surface of the moisture barrier layer 301 by one atomic layer. Then, the TMA gas is exhausted from the film-forming chamber. Next, oxygen is supplied and plasma is generated by, for example, applying high-frequency power, and the TMA adsorbed on the surface of the moisture barrier layer 301 is oxidized. Subsequently, the O2 in the film-forming chamber is exhausted. Thereby, an aluminum oxide film of one atomic layer is formed on the surface of the moisture barrier layer 301. By repeating this, the defect suppression layer 302 using aluminum oxide with a desired film thickness can be formed.

[0020] The defect suppression layer 302 formed by ALD method has high film wrapping around the uneven portions and extremely high coverage. Therefore, it has the characteristic that the defect density in the film is lower than that of the thin film formed by sputtering method, CVD method, etc. The ALD method has a long film formation time. Therefore, in order to shorten the tact time for forming the defect suppression layer 302, the defect suppression layer 302 may have a film thickness of several tens of nm to several hundreds of nm. For example, the film thickness of the defect suppression layer 302 may be 10 nm or more and 500 nm or less, or further 50 nm or more and 100 nm or less. In this embodiment, aluminum oxide formed by using the ALD method is used as the defect suppression layer 302, but titanium oxide, zirconium oxide, etc. may also be used. Also, the formation method is not limited to the ALD method, and it is sufficient if the defect suppression layer 302 with high film wrapping around the uneven portions and high coverage can be formed.

[0021] For the resin layer 400, a thermosetting resin, a thermoplastic resin, etc. can be used. For the resin layer 400, for example, a phenol resin, an epoxy resin, a polyimide resin, a polyethylene resin, a polystyrene resin, an acrylic resin, a fluororesin, etc. or a mixed material thereof may be used. Also, a surface treatment for improving the water repellency may be performed on the surface of the resin layer 400. For example, the surface of the resin layer 400 may be roughened by etching treatment, or a fluorine coat may be applied to the surface of the resin layer 400 by performing plasma treatment using a fluorine-based gas on the surface of the resin layer 400.

[0022] The organic device 100 may include a color filter 500 on the encapsulation layer 300. The color filter 500 may include a red transmission filter 501, a green transmission filter 502, and a blue transmission filter 503, which are disposed on a resin layer 400 that also serves as a planarization layer for the color filter 500. A planarization layer (not shown) made of resin may be further disposed on the color filter 500. The process of forming the color filter 500 involves repeating the application of materials and exposure / development for each color filter. In the configuration shown in FIG. 3, the resin layer 400 also serves as a planarization layer for the color filter 500, but a planarization layer (not shown) may be formed on the resin layer 400, and the color filter 500 may be formed thereon. On the other hand, by making the resin layer 400 also serve as a planarization layer, the manufacturing process of the organic device 100 can be simplified and the cost can be reduced.

[0023] Next, the structure around the pad electrode 30 disposed in the peripheral region 20 in the present embodiment will be described in detail. In the peripheral region 20, openings are provided in the insulating layer 202, the encapsulation layer 300, and the resin layer 400 to expose the pad electrode 30. The opening provided in the encapsulation layer 300 includes a portion 601 extending from the upper surface 311 of the encapsulation layer 300 toward the pad electrode 30, and a portion 602 that opens from the lower end 312 of the portion 601 to the pad electrode 30 and whose outer edge is disposed inside the outer edges of the portion 601 and the pad electrode 30 in the orthographic projection onto the main surface 205 of the substrate 201. Thereby, the pad electrode 30 is exposed. As shown in FIGS. 2 and 3, the outer edge of the portion 601 of the pad electrode 30 may be disposed outside the outer edge of the pad electrode 30 in the orthographic projection onto the main surface 205 of the substrate 201. Thus, the opening for exposing the pad electrode 30 in the encapsulation layer 300 has a step including the lower end 312 in the encapsulation layer 300.

[0024] On the exposed pad electrode 30, conductive particles 600 for electrically connecting to an electrode disposed outside the organic device 100 are arranged. Although one conductive particle 600 is shown in FIGS. 2 and 3, actually a large number of conductive particles are arranged. For example, the conductive particles 600 are particles contained in an anisotropic conductive film (ACF), and a flexible cable for electrically connecting the organic device 100 and the outside of the organic device 100 can be connected using the ACF or the like. In the present embodiment, the diameter R of the conductive particles 600 is larger than the height H of the portion 602. Here, the diameter R of the conductive particles 600 can be the average diameter of a plurality of conductive particles contained in the ACF or the like arranged on the pad electrode 30.

[0025] When the thickness of the sealing layer 300 is increased to protect the organic functional layer 211 from moisture or the like, in the peripheral region 20, the step of the opening for exposing the pad electrode 30 becomes large. When the step becomes large, there is a possibility of bonding failure occurring in the bonding process of connecting the wiring to the pad electrode 30. As shown in FIGS. 2 and 3, since the step of the opening for exposing the pad electrode 30 caused by the sealing layer 300 and the resin layer 400 is larger than the diameter R of the conductive particles 600, if the entire opening provided in the sealing layer 300 and the resin layer 400 is arranged inside the outer edge of the pad electrode 30, there is a possibility of bonding failure occurring. Therefore, the opening provided in the sealing layer 300 is divided into a wide portion 601 and a portion 602 so that the step generated in the opening becomes small, and the step (height H) generated by the portion 602 is made small. Thereby, the occurrence of bonding failure in the bonding process of connecting the wiring to the pad electrode 30 can be suppressed.

[0026] In this embodiment, part 601 opens in the moisture suppression layers 301 and 303 and the defect suppression layer 302 of the sealing layer 300, and part 602 opens in the moisture suppression layer 301 and the defect suppression layer 302 of the sealing layer 300. However, it is not limited to this. Part 601 may open in the moisture suppression layers 301 and 303 and the defect suppression layer 302 of the sealing layer 300, and part 602 may open in the moisture suppression layer 301 of the sealing layer 300. Further, as shown in FIGS. 2 and 3, in the orthographic projection onto the main surface 205 of the substrate 201, the outer edge of the opening of the resin layer 400 is arranged outside the outer edge of part 602. In this case, in the orthographic projection onto the main surface 205 of the substrate 201, the outer edge of the opening of the resin layer 400 may be arranged to overlap the outer edge of part 601 of the opening of the sealing layer 300. By aligning the outer edge of the opening of the resin layer 400 with part 601 of the opening of the sealing layer 300, it may be possible to suppress the process steps when forming the opening. Also, the outer edge of the opening of the resin layer 400 may be outside the outer edge of part 601 of the opening of the sealing layer 300.

[0027] In the configuration shown in FIGS. 2 and 3, the sealing layer 300 has a three-layer structure of the moisture suppression layers 301 and 303 and the defect suppression layer 302, but it is not limited to this. For example, the sealing layer 300 may have a single-layer structure using one material. Also, for example, it may have a two-layer structure using different materials. In this case, part 601 of the opening may open in the upper layer and part 602 of the opening may open in the lower layer. Since the materials of the upper layer and the lower layer are different, the process may be facilitated, such as using the lower layer as an etch stopper when etching part 601.

[0028] Further, in the present embodiment, in the orthographic projection onto the main surface 205 of the substrate 201, the outer edge of the opening of the insulating layer 202 is disposed outside the outer edge of the portion 602 of the opening of the sealing layer 300. In other words, a moisture suppression layer 301 is formed so as to cover the outer edge of the opening of the insulating layer 202. The insulating layer 202 made of silicon oxide with a relatively high moisture permeability is not exposed around the pad electrode 30 and is covered with the moisture suppression layer 301 made of a silicon nitride-based material with a low moisture permeability. For example, the moisture permeability of the silicon oxide used for the insulating layer 202 is about 1 to 3 orders of magnitude higher than that of the silicon nitride-based material used for the moisture suppression layer 301. Thereby, it is possible to suppress moisture from penetrating through the insulating layer 202 to the organic functional layer 211.

[0029] Also, in the configuration shown in FIGS. 2 and 3, the opening for exposing the pad electrode 30 of the sealing layer 300 has a two-step structure having one lower end 312 in the sealing layer 300, but is not limited thereto. The opening for exposing the pad electrode 30 of the sealing layer 300 may have three or more steps. For example, a further step may be formed in the portion 601, or a further step may be formed in the portion 602. These steps can be arranged such that the opening gradually widens as it goes from the pad electrode 30 toward the upper surface 311 of the sealing layer 300. In this case, regardless of the number of steps, in the orthographic projection onto the main surface 205 of the substrate 201, if the outer edge of the opening of the insulating layer 202 is disposed outside the outer edge of the portion 602 of the opening of the sealing layer 300, it is possible to suppress moisture from penetrating to the organic functional layer 211.

[0030] Also, as shown in FIG. 2, in adjacent pad electrodes 30, the portion 601 provided corresponding to one pad electrode 30 and the portion 601 provided corresponding to the other pad electrode may be formed continuously. That is, adjacent pad electrodes 30 may be separated by the moisture suppression layer 301 and the defect suppression layer 302 among the insulating layer 202 and the sealing layer 300. Thereby, the step generated in the direction in which the pad electrodes 30 are continuous always has a height H, and the occurrence of bonding failure is suppressed.

[0031] Here, the organic functional layer 211 will be specifically described. As described above, the organic functional layer 211 in this embodiment contains at least an organic light-emitting material or an organic optoelectronic conversion material. When the organic functional layer 211 contains an organic light-emitting material, the organic device 100 can function as a light-emitting device. On the other hand, when the organic functional layer 211 contains an organic optoelectronic conversion material, the organic device 100 can function as an imaging device.

[0032] As the organic light-emitting material, known organic light-emitting materials can be used. It may be a light-emitting material that functions as a light-emitting layer alone, or a mixed layer of a light-emitting layer host material and a light-emitting material. Examples of the organic light-emitting material include condensed ring compounds (such as fluorene derivatives, naphthalene derivatives, pyrene derivatives, perylene derivatives, tetracene derivatives, anthracene derivatives, rubrene, etc.), quinacridone derivatives, coumarin derivatives, stilbene derivatives, organic aluminum complexes such as tris(8-quinolinolato)aluminum, iridium complexes, platinum complexes, rhenium complexes, copper complexes, europium complexes, ruthenium complexes, and polymer derivatives such as poly(phenylene vinylene) derivatives, poly(fluorene) derivatives, and poly(phenylene) derivatives.

[0033] Examples of the light-emitting layer host material include aromatic hydrocarbon compounds or their derivatives, carbazole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, organic aluminum complexes such as tris(8-quinolinolato)aluminum, and organic beryllium complexes.

[0034] The organic optoelectronic conversion material can be either a known organic material or an organic-inorganic hybrid material. As the organic optoelectronic conversion material, for example, fullerene-based materials, phthalocyanine-based materials, metal complex-based materials, squalium-based materials, amine-based materials, indane-based materials, fluorene-based materials, etc. can be used. The organic functional layer 211 may be composed of one of these organic optoelectronic conversion materials, or may be composed of a plurality of materials. Also, the organic functional layer 211 may have a structure in which layers using these materials are laminated. As the organic-inorganic hybrid material, for example, a material for forming an organic-inorganic hybrid perovskite film can be used. The material constituting the organic-inorganic hybrid perovskite film may be represented by the general formula ABX3. Here, in the general formula, A and B are cationic materials, and X is an anionic material. The organic-inorganic hybrid material can be exemplified by CH3NH3PbI3 in which any one of A, B, or X is an organic material, A = CH3NH3, B = Pb, and X = I.

[0035] An additional functional layer may be disposed between the organic functional layer 211 and the lower electrode 210, or between the organic functional layer 211 and the upper electrode 212. Examples of the additional functional layer include a charge transport layer and a charge blocking layer. As the material of the charge transport layer, a material with high hole or electron mobility can be used. Also, as the material of the hole blocking layer among the charge blocking layers, a material with a deep highest occupied molecular orbital (HOMO) (energetically far from the vacuum level) can be used. On the other hand, as the electron blocking layer among the charge blocking layers, a material with a shallow lowest unoccupied molecular orbital (LUMO) (close to the vacuum level) can be used. HOMO and LUMO can also be expressed as high or low based on the magnitude of the absolute value. Specifically, a deep HOMO can also be expressed as a high HOMO. The same applies to the others.

[0036] A charge injection layer may be formed at the interface between the lower electrode 210 and the additional functional layer, and at the interface between the upper electrode 212 and the additional functional layer. For the electron injection layer among the charge injection layers, a thin film (e.g., 0.5 to 1 nm) of an alkali (earth) metal or an alkali (earth) metal compound can be used. For example, lithium fluoride (LiF), potassium fluoride (KF), or magnesium oxide (MgO) can be used for the electron injection layer. Also, for the electron injection layer among the charge injection layers, a layer in which a metal or a metal compound that functions as a donor (electron-donating) dopant is mixed with an organic compound can be used. To improve the electron injection efficiency, a metal or its compound with a low work function may be used as the dopant. As the metal with a low work function, an alkali metal, an alkaline earth metal, or a rare earth can be used. An alkali metal compound that is relatively easy to handle in the air may be used as the electron injection layer. For example, the alkali metal compound may be a cesium compound, and cesium carbonate is stable in the air and easy to handle. The organic compound of the electron injection layer may be an electron-transporting material, and known materials such as an aluminum quinolinol complex or a phenanthroline compound can be used. Since an alkali metal easily reacts with moisture, it is necessary to suppress the intrusion of moisture as in the case of the organic functional layer 211.

[0037] Hereinafter, examples of the organic device 100 of the present embodiment will be described. In this example, the organic functional layer 211 includes an organic light-emitting material. Therefore, the organic device 100 functions as a light-emitting device.

[0038] First, a silicon substrate was prepared as the substrate 201. After forming an electronic circuit (not shown) and pad electrodes 30 on the substrate 201, an insulating layer 202 was formed on the surface of the substrate 201 where the electronic circuit (not shown) and the pad electrodes 30 made of an aluminum alloy were arranged. In this embodiment, silicon oxide was formed as the insulating layer 202 with a film thickness of 1 μm. Next, using a mask pattern having an opening on the pad electrodes 30, an etching process was performed to etch the insulating layer 202 in the opened portion of the mask pattern to expose the pad electrodes 30. First, a mask pattern having a desired opening was formed using a resist coating, exposure, and development process, and then the insulating layer 202 was etched by plasma etching using a reactive gas in a dry etching apparatus. After the etching of the insulating layer 202, the mask pattern was removed with a stripping solution.

[0039] Next, in the pixel region 10, a pixel forming process for forming a plurality of pixels was performed on the insulating layer 202. First, a lower electrode 210 in which an aluminum alloy and indium tin oxide were sequentially laminated from the side of the surface of the substrate 201 was formed on the insulating layer 202. As described above, the lower electrode 210 was connected to an electronic circuit arranged on the substrate 201 side of the insulating layer 202 by a plug electrode provided in the insulating layer 202.

[0040] After forming the lower electrode 210, an organic functional layer 211 containing an organic light-emitting material was formed on the lower electrode 210 in the pixel region 10. As a method for forming the organic functional layer 211, a vacuum evaporation method using an evaporation mask having an opening with a desired patterning can be used.

[0041] After the step of forming a plurality of pixels on the insulating layer 202, the encapsulation layer 300 and the resin layer 400 were laminated in this order. First, the encapsulation layer 300 was formed so as to cover the entire substrate 201. First, silicon nitride was formed as the moisture suppression layer 301 on the entire surface of the substrate 201 with a film thickness of 1500 nm using the CVD method. Next, aluminum oxide was formed as the defect suppression layer 302 with a film thickness of 100 nm using the ALD method so as to cover the moisture suppression layer 301 on the entire surface of the substrate 201. Further, silicon nitride was formed as the moisture suppression layer 303 with a film thickness of 500 nm using the CVD method so as to cover the defect suppression layer 302 on the entire surface of the substrate 201. Next, a resin was applied with a film thickness of 400 nm using the spin coating method as the resin layer 400 so as to cover the moisture suppression layer 303 on the entire surface of the substrate 201, and then baked at a high temperature. As described above, the resin layer 400 also functions as a planarization layer below the color filter 500.

[0042] Next, in the pixel region 10, the color filter 500 was formed. The red transmission filter 501, the green transmission filter 502, and the blue transmission filter 503 repeated the material application and exposure / development steps for each color filter.

[0043] After the formation of the color filter 500, the resin layer 400 and the encapsulation layer 300 above the pad electrode 30 were etched. First, in the orthographic projection onto the main surface 205 of the substrate 201, a mask pattern having an opening outside the outer edge of the pad electrode 30 was formed using the resist coating and exposure / development steps. Next, the moisture suppression layer 303 was etched by plasma etching using a reactive gas in a dry etching apparatus. After the etching of the moisture suppression layer 303, the mask pattern was removed with a stripping solution. Next, in the orthographic projection onto the main surface 205 of the substrate 201, a mask pattern having an opening inside the outer edge of the pad electrode 30 was formed using the resist coating and exposure / development steps. Using this mask pattern, the defect suppression layer 302 and the moisture suppression layer 301 were etched to expose the pad electrode 30. After the etching of the defect suppression layer 302 and the moisture suppression layer 301, the mask pattern was removed with a stripping solution.

[0044] After exposing the pad electrode 30, conductive particles 600 for electrically connecting to an electrode disposed outside the organic device 100 were disposed on the pad electrode 30. More specifically, an anisotropic conductive film (ACF) containing the conductive particles 600 was pressure-bonded. At this time, it was confirmed that the occurrence of bonding failure was suppressed as compared with the case where the entire opening provided in the sealing layer 300 and the resin layer 400 was disposed inside the outer edge of the pad electrode 30.

[0045] Here, application examples in which the organic device 100 of the present embodiment is applied to an image forming apparatus, a display device, a photoelectric conversion device, an electronic device, a lighting device, a moving body, and a wearable device will be described with reference to FIGS. 4 to 12(b). First, after showing the details and modifications of the above-described organic device 100, application examples will be described. Here, as the organic device 100, an organic light-emitting element using an organic light-emitting material in the organic functional layer 211 will be described as an example.

[0046] The organic light-emitting element is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the cathode. When providing a color filter, a planarization layer may be provided between the protective layer. The planarization layer can be made of an acrylic resin or the like. The same applies when providing a planarization layer between the color filter and the microlens.

[0047] Examples of the substrate include quartz, glass, a silicon wafer, resin, and metal. Further, a switching element such as a transistor and wiring may be provided on the substrate, and an insulating layer may be provided thereon. As the insulating layer, any material may be used as long as a contact hole can be formed so that wiring can be formed between the insulating layer and the first electrode and insulation from non-connected wiring can be ensured. For example, resins such as polyimide, silicon oxide, silicon nitride, etc. can be used.

[0048] A pair of electrodes can be used. The pair of electrodes can be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with the higher potential is the anode and the other is the cathode. Also, it can be said that the electrode that supplies holes to the light-emitting layer is the anode and the electrode that supplies electrons is the cathode.

[0049] As the constituent material of the anode, it is better to use a material with as large a work function as possible. For example, simple metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, tungsten, etc., mixtures containing these, alloys combined with these, metal oxides such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), indium zinc oxide, etc. can be used. Also, conductive polymers such as polyaniline, polypyrrole, polythiophene, etc. can be used.

[0050] These electrode materials can be used alone or in combination of two or more. Also, the anode may be composed of a single layer or multiple layers.

[0051] When used as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys thereof, laminated materials, etc. can be used. With the above materials, it is also possible to function as a reflective film without having the role of an electrode. Also, when used as a transparent electrode, oxide transparent conductive layers such as indium tin oxide (ITO), indium zinc oxide, etc. can be used, but it is not limited to these. For the formation of the electrode, photolithography technology can be used.

[0052] On the one hand, as the constituent material of the cathode, those with a small work function are preferable. For example, alkali metals such as lithium, alkaline earth metals such as calcium, simple metals such as aluminum, titanium, manganese, silver, lead, chromium, or mixtures containing these can be mentioned. Alternatively, alloys formed by combining these simple metals can also be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, zinc-silver, etc. can be used. The use of metal oxides such as indium tin oxide (ITO) is also possible. These electrode materials may be used alone or in combination of two or more. Also, the cathode may have a single-layer structure or a multi-layer structure. Among them, it is preferable to use silver, and in order to reduce the aggregation of silver, it is more preferable to use a silver alloy. As long as the aggregation of silver can be reduced, the ratio of the alloy does not matter. For example, silver: other metals may be 1:1, 3:1, etc.

[0053] The cathode may be a top emission device using an oxide conductive layer such as ITO, or a bottom emission device using a reflective electrode such as aluminum (Al), and is not particularly limited. As the method for forming the cathode, although not particularly limited, the use of direct current and alternating current sputtering methods, etc., is more preferable because the film coverage is good and the resistance is easily reduced.

[0054] The organic compound layer may be formed as a single layer or as a plurality of layers. When having a plurality of layers, depending on its function, it may be called a hole injection layer, a hole transport layer, an electron blocking layer, a light emitting layer, a hole blocking layer, an electron transport layer, an electron injection layer. The organic compound layer is mainly composed of an organic compound, but may contain inorganic atoms or inorganic compounds. For example, it may have copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be disposed between the first electrode and the second electrode, and may be arranged in contact with the first electrode and the second electrode.

[0055] A protective layer may be provided on the cathode. For example, by adhering a glass provided with a moisture absorbent on the cathode, the intrusion of water or the like into the organic compound layer can be reduced, and the occurrence of display defects can be reduced. Further, as another embodiment, a passivation film such as silicon nitride may be provided on the cathode to reduce the intrusion of water or the like into the organic compound layer. For example, after forming the cathode, it may be transported to another chamber without breaking the vacuum, and a silicon nitride film with a thickness of 2 μm may be formed by CVD method, which can also serve as a protective layer. A protective layer using atomic layer deposition (ALD method) may be provided after the film formation by CVD method. The material of the film by ALD method is not limited, but may be silicon nitride, silicon oxide, aluminum oxide, etc. Silicon nitride may be further formed by CVD method on the film formed by ALD method. The film by ALD method may have a smaller film thickness than the film formed by CVD method. Specifically, it may be 50% or less, and further 10% or less.

[0056] A color filter may be provided on the protective layer. For example, a color filter considering the size of the organic light-emitting element may be provided on another substrate, and it may be bonded to the substrate provided with the organic light-emitting element, or the color filter may be patterned on the above-mentioned protective layer using photolithography technology. The color filter may be composed of a polymer.

[0057] A planarization layer may be provided between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the underlying layer. Without limiting the purpose, it may sometimes be called a material resin layer. The planarization layer may be composed of an organic compound, and may be a low molecule or a high molecule, but it is preferably a high molecule.

[0058] The planarization layer may be provided above and below the color filter, and its constituent materials may be the same or different. Specifically, examples include polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicon resin, urea resin, etc.

[0059] The organic light-emitting device may have an optical member such as a microlens on its light-emitting side. The microlens can be made of an acrylic resin, an epoxy resin, or the like. The microlens may be for the purpose of increasing the amount of light extracted from the organic light-emitting device and controlling the direction of the extracted light. The microlens may have a hemispherical shape. When having a hemispherical shape, among the tangents in contact with the hemisphere, there is a tangent parallel to the insulating layer, and the contact point between the tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be determined in the same way in any cross-sectional view. That is, among the tangents in contact with the semicircle of the microlens in the cross-sectional view, there is a tangent parallel to the insulating layer, and the contact point between the tangent and the semicircle is the vertex of the microlens.

[0060] Also, the midpoint of the microlens can be defined. In the cross-section of the microlens, a line segment from the point where the arc shape ends to the point where another arc shape ends is imagined, and the midpoint of the line segment can be called the midpoint of the microlens. The cross-section for discriminating the vertex and the midpoint may be a cross-section perpendicular to the insulating layer.

[0061] A counter substrate may be provided on the planarization layer. Since the counter substrate is provided at a position corresponding to the aforementioned substrate, it is called a counter substrate. The constituent material of the counter substrate may be the same as that of the aforementioned substrate. When the aforementioned substrate is the first substrate, the counter substrate may be the second substrate.

[0062] The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light-emitting element according to an embodiment of the present invention are formed by the following method.

[0063] For the organic compound layers constituting the organic light-emitting element according to an embodiment of the present invention, dry processes such as vacuum evaporation, ionization evaporation, sputtering, and plasma can be used. Also, instead of the dry process, a wet process of dissolving in an appropriate solvent and forming a layer by a known coating method (for example, spin coating, dipping, casting method, LB method, inkjet method, etc.) can also be used.

[0064] When a layer is formed by a vacuum deposition method, a solution coating method, or the like, crystallization and the like hardly occur, and the film has excellent stability over time. When forming a film by a coating method, a film can also be formed in combination with an appropriate binder resin.

[0065] Examples of the binder resin include, but are not limited to, polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, urea resin, and the like.

[0066] These binder resins may be used alone as a homopolymer or a copolymer, or two or more of them may be mixed and used. Further, additives such as known plasticizers, antioxidants, and ultraviolet absorbers may be used in combination as necessary.

[0067] The light-emitting device may have a pixel circuit connected to the light-emitting element. The pixel circuit may be an active matrix type that independently controls the light emission of the first light-emitting element and the second light-emitting element. The active matrix type circuit may be voltage programming or current programming. The driving circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the light emission luminance of the light-emitting element, a transistor that controls the light emission timing, a capacitor that holds the gate voltage of the transistor that controls the light emission luminance, and a transistor for connecting to GND without passing through the light-emitting element.

[0068] The light-emitting device has a display area and a peripheral area disposed around the display area. The display area has a pixel circuit, and the peripheral area has a display control circuit. The mobility of the transistors constituting the pixel circuit may be smaller than the mobility of the transistors constituting the display control circuit.

[0069] The slope of the current-voltage characteristics of the transistors constituting the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistors constituting the display control circuit. The slope of the current-voltage characteristics can be measured by so-called Vg-Ig characteristics.

[0070] The transistors constituting the pixel circuit are transistors connected to a light-emitting element such as a first light-emitting element.

[0071] The organic light-emitting device has a plurality of pixels. The pixels have sub-pixels that emit different colors from each other. The sub-pixels may have, for example, light-emitting colors of RGB respectively.

[0072] In the pixel, a region also called a pixel aperture emits light. This region is the same as the first region. The pixel aperture may be 15 μm or less and may be 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0073] The distance between sub-pixels may be 10 μm or less, and specifically may be 8 μm, 7.4 μm, 6.4 μm.

[0074] In a plan view, the pixel can take a known arrangement form. For example, it may be a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the sub-pixel in the plan view may take any known shape. For example, it may be a rectangle, a square such as a rhombus, a hexagon, etc. Of course, even if it is not an exact figure but has a shape close to a rectangle, it is included in the rectangle. The shape of the sub-pixel and the pixel arrangement can be used in combination.

[0075] The organic light-emitting element according to an embodiment of the present invention can be used as a component of a display device or an illumination device. In addition, there are applications such as an exposure light source of an electrophotographic image forming device, a backlight of a liquid crystal display device, and a light-emitting device having a color filter for a white light source.

[0076] The display device may be an image information processing device that has an image input unit for inputting image information from an area CCD, a linear CCD, a memory card, etc., has an information processing unit for processing the input information, and displays the input image on a display unit.

[0077] Also, the display unit of an imaging device or an inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. Further, the display device may be used for the display unit of a multifunction printer.

[0078] Next, the display device according to this embodiment will be described with reference to the drawings.

[0079] Figs. 4(a) and 4(b) are cross-sectional schematic views showing an example of a display device having an organic light-emitting element and a transistor connected to this organic light-emitting element. The transistor is an example of an active element. The transistor may be a thin film transistor (TFT).

[0080] Fig. 4(a) is an example of a pixel which is a component of the display device according to this embodiment. The pixel has a sub-pixel 810. The sub-pixel is divided into 810R, 810G, and 810B by its light emission. The emission color may be distinguished by the wavelength emitted from the light-emitting layer, or the light emitted from the sub-pixel may be selectively transmitted or color-converted by a color filter or the like. Each sub-pixel has a reflective electrode 802 which is a first electrode, an insulating layer 803 covering the end of the reflective electrode 802, an organic compound layer 804 covering the first electrode and the insulating layer, a transparent electrode 805 which is a second electrode, a protective layer 806, and a color filter 807 on an interlayer insulating layer 801.

[0081] A transistor and a capacitor element may be arranged under or inside the interlayer insulating layer 801. The transistor and the first electrode may be electrically connected via a contact hole or the like (not shown).

[0082] The insulating layer 803 is also called a bank or a pixel isolation film. It covers the end of the first electrode and is arranged surrounding the first electrode. The portion where the insulating layer is not arranged is in contact with the organic compound layer 804 and serves as a light-emitting region.

[0083] The organic compound layer 804 includes a hole injection layer 841, a hole transport layer 842, a first light-emitting layer 843, a second light-emitting layer 844, and an electron transport layer 845.

[0084] The second electrode may be a transparent electrode, a reflective electrode, or a semi-transmissive electrode.

[0085] The protective layer 806 reduces the penetration of moisture into the organic compound layer. Although the protective layer is shown as a single layer, it may be a plurality of layers. Each layer may be an inorganic compound layer or an organic compound layer.

[0086] The color filter 807 is divided into 807R, 807G, and 807B according to its color. The color filter may be formed on a planarization film (not shown). Also, it may have a resin protective layer (not shown) on the color filter. Further, the color filter may be formed on the protective layer 806. Or it may be provided on a counter substrate such as a glass substrate and then bonded.

[0087] The display device 800 in FIG. 4(b) describes an organic light-emitting element 826 and a TFT 818 as an example of a transistor. A substrate 811 such as glass or silicon is provided with an insulating layer 812 on its upper part. Active elements such as the TFT 818 are arranged on the insulating layer, and the gate electrode 813, gate insulating film 814, and semiconductor layer 815 of the active element are arranged. The TFT 818 is further composed of a semiconductor layer 815, a drain electrode 816, and a source electrode 817. An insulating film 819 is provided on the upper part of the TFT 818. The anode 821 constituting the organic light-emitting element 826 is connected to the source electrode 817 through a contact hole 820 provided in the insulating film.

[0088] Note that the method of electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 826 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the mode shown in FIG. 4(b). That is, any one of the anode or the cathode may be electrically connected to any one of the TFT source electrode or the drain electrode. TFT refers to a thin-film transistor.

[0089] In the display device 800 of FIG. 4(b), the organic compound layer is illustrated as if it were a single layer, but the organic compound layer 822 may be a plurality of layers. On the cathode 823, a first protective layer 824 and a second protective layer 825 for reducing the deterioration of the organic light-emitting element are provided.

[0090] In the display device 800 of FIG. 4(b), a transistor is used as the switching element, but other switching elements may be used instead.

[0091] Further, the transistor used in the display device 800 of FIG. 4(b) is not limited to a transistor using a single-crystalline silicon wafer, and may also be a thin-film transistor having an active layer on an insulating surface of a substrate. Examples of the active layer include non-single-crystalline silicon such as single-crystalline silicon, amorphous silicon, and microcrystalline silicon, and non-single-crystalline oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Note that the thin-film transistor is also called a TFT element.

[0092] The transistor included in the display device 800 of FIG. 4(b) may be formed in a substrate such as an Si substrate. Here, forming in the substrate means manufacturing a transistor by processing the substrate itself such as an Si substrate. That is, having a transistor in the substrate can also be regarded as the substrate and the transistor being integrally formed.

[0093] The organic light-emitting device according to this embodiment has its emission luminance controlled by a TFT, which is an example of a switching device, and an image can be displayed according to the emission luminance of each organic light-emitting device by providing a plurality of organic light-emitting devices in a plane. Note that the switching device according to this embodiment is not limited to a TFT, and may be a transistor formed of low-temperature polysilicon or an active matrix driver formed on a substrate such as an Si substrate. "On the substrate" can also mean "inside the substrate". Whether to provide a transistor inside the substrate or use a TFT is selected according to the size of the display portion. For example, if the size is about 0.5 inches, an organic light-emitting device may be provided on the Si substrate.

[0094] Figs. 5(a) to 5(c) are schematic views showing an example of an image forming apparatus using the organic device 100 of this embodiment. The image forming apparatus 926 shown in Fig. 5(a) includes a photoreceptor 927, an exposure light source 928, a developing unit 931, a charging unit 930, a transferrer 932, a conveying unit 933 (a conveying roller in the configuration of Fig. 5(a)), and a fixing unit 935.

[0095] Light 929 is irradiated from the exposure light source 928, and an electrostatic latent image is formed on the surface of the photoreceptor 927. The organic device 100 containing an organic light-emitting material in the organic functional layer 211 can be applied to this exposure light source 928. The developing unit 931 contains toner or the like as a developer and can function as a developing device that applies the developer to the exposed photoreceptor 927. The charging unit 930 charges the photoreceptor 927. The transferrer 932 transfers the developed image onto a recording medium 934. The conveying unit 933 conveys the recording medium 934. The recording medium 934 can be, for example, paper or film. The fixing unit 935 fixes the image formed on the recording medium.

[0096] FIG. 5(b) and FIG. 6(c) are schematic diagrams showing a state in which a plurality of light-emitting portions 936 are arranged along the longitudinal direction on a long substrate in an exposure light source 928. An organic device 100 including an organic light-emitting material in an organic functional layer 211 can be applied to this light-emitting portion 936. That is, a plurality of pixels arranged in the pixel region 10 are arranged along the longitudinal direction of the substrate. A direction 937 is a direction parallel to the axis of the photoreceptor 927. This column direction is the same as the direction of the axis when the photoreceptor 927 rotates. This direction 937 can also be referred to as the major axis direction of the photoreceptor 927.

[0097] FIG. 5(b) shows a form in which the light-emitting portion 936 is arranged along the major axis direction of the photoreceptor 927. FIG. 5(c) is a modified example of the arrangement of the light-emitting portion 936 shown in FIG. 5(b), and is a form in which the light-emitting portions 936 are alternately arranged in the column direction in each of the first column and the second column. In the first column and the second column, the light-emitting portions 936 are arranged at different positions in the row direction. In the first column, a plurality of light-emitting portions 936 are arranged at intervals, and in the second column, the light-emitting portions 936 are arranged at positions corresponding to the gaps between the light-emitting portions 936 in the first column. Also, in the row direction, a plurality of light-emitting portions 936 are arranged at intervals. The arrangement of the light-emitting portions 936 shown in FIG. 5(c) can also be described as, for example, a state of being arranged in a grid pattern, a state of being arranged in a staggered grid, or a checkered pattern.

[0098] FIG. 6 is a schematic diagram showing an example of a display device using the organic device 100 of the present embodiment. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected to flexible printed circuits FPC 1002 and 1004. Active elements such as transistors are arranged on the circuit board 1007. The battery 1008 may not be provided if the display device 1000 is not a portable device, or even if it is a portable device, it does not have to be provided at this position. The organic device 100 including an organic light-emitting material in the organic functional layer 211 can be applied to the display panel 1005. The organic device 100 functioning as the display panel 1005 is connected to and operates with active elements such as transistors arranged on the circuit board 1007.

[0099] The display device 1000 shown in FIG. 6 may be used for a display unit of a photoelectric conversion device (imaging device) having an optical unit having a plurality of lenses and an imaging element that receives light passing through the optical unit and photoelectrically converts it into an electrical signal. The photoelectric conversion device may have a display unit that displays information acquired by the imaging element. Further, the display unit may be a display unit exposed to the outside of the photoelectric conversion device or a display unit disposed in the viewfinder. The photoelectric conversion device may be a digital camera or a digital video camera.

[0100] FIG. 7 is a schematic diagram showing an example of a photoelectric conversion device using the organic device 100 of the present embodiment. The photoelectric conversion device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The photoelectric conversion device 1100 may also be called an imaging device. The organic device 100 including an organic light-emitting material in the organic functional layer 211 can be applied to the viewfinder 1101 which is a display unit. In this case, the organic device 100 may display not only the image to be captured but also environmental information, imaging instructions, etc. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject is shielded by an obstacle, etc.

[0101] Since the timing suitable for imaging is often a very short time, it is better to display information as soon as possible. Therefore, the organic device 100 including an organic light-emitting material such as an organic EL element can be used for the viewfinder 1101. This is because the organic light-emitting material has a fast response speed. The organic device 100 using the organic light-emitting material is more suitable for these devices that require a display speed than a liquid crystal display device.

[0102] The photoelectric conversion device 1100 has an optical unit (not shown). The optical unit has a plurality of lenses and forms an image on a photoelectric conversion element (not shown) housed in a housing 1104 that receives the light that has passed through the optical unit. The plurality of lenses can adjust the focus by adjusting their relative positions. This operation can also be performed automatically.

[0103] The organic device 100 may be applied to the display unit of an electronic device. In that case, it may have both a display function and an operation function. Examples of the portable terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0104] FIG. 8 is a schematic diagram showing an example of an electronic device using the organic device 100 of the present embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a reaction unit of a touch panel method. The operation unit 1202 may be a biometric recognition unit that recognizes a fingerprint and performs operations such as unlocking. A portable device having a communication unit can also be called a communication device. The organic device 100 including an organic light-emitting material in the organic functional layer 211 can be applied to the display unit 1201.

[0105] Figs. 9(a) and 9(b) are schematic diagrams showing an example of a display device using the organic device 100 of the present embodiment. Fig. 9(a) shows a display device such as a TV monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The organic device 100 including an organic light-emitting material in the organic functional layer 211 can be applied to the display unit 1302. The display device 1300 may have a base 1303 that supports the frame 1301 and the display unit 1302. The base 1303 is not limited to the form shown in Fig. 9(a). For example, the lower side of the frame 1301 may also serve as the base 1303. Further, the frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0106] Fig. 9(b) is a schematic diagram showing another example of a display device using the organic device 100 of the present embodiment. The display device 1310 in Fig. 9(b) is configured to be foldable and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The organic device 100 including an organic light-emitting material in the organic functional layer 211 can be applied to the first display unit 1311 and the second display unit 1312. The first display unit 1311 and the second display unit 1312 may be a single seamless display device. The first display unit 1311 and the second display unit 1312 can be separated at the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or may display a single image together.

[0107] FIG. 10 is a schematic diagram showing an example of a lighting device using the organic device 100 of the present embodiment. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusing portion 1405. The organic device 100 including an organic light-emitting material in the organic functional layer 211 can be applied to the light source 1402. The optical film 1404 may be a filter that improves the color rendering property of the light source. The light diffusing portion 1405 can effectively diffuse the light of the light source, such as lighting up, and deliver the light to a wide range. If necessary, a cover may be provided on the outermost side. The lighting device 1400 may have both the optical film 1404 and the light diffusing portion 1405, or may have only one of them.

[0108] The lighting device 1400 is, for example, a device for lighting an interior. The lighting device 1400 may emit any color from white, warm white, to other colors from blue to red. It may have a dimming circuit for dimming them. The lighting device 1400 may have a power supply circuit connected to the organic device 100 that functions as the light source 1402. The power supply circuit is a circuit that converts an AC voltage into a DC voltage. Also, white has a color temperature of 4200K and warm white has a color temperature of 5000K. Further, the lighting device 1400 may have a color filter. Also, the lighting device 1400 may have a heat radiating portion. The heat radiating portion releases the heat inside the device to the outside of the device, and examples include metals with high specific heat and liquid silicon.

[0109] FIG. 11 is a schematic diagram of an automobile having a tail lamp, which is an example of a vehicle lamp using the organic device 100 of the present embodiment. The automobile 1500 may have a tail lamp 1501 and may be configured to turn on the tail lamp 1501 when a brake operation or the like is performed. The organic device 100 of the present embodiment may be used as a head lamp as a vehicle lamp. An automobile is an example of a moving body, and the moving body may be a ship, a drone, an aircraft, a railway vehicle, an industrial robot, or the like. The moving body may have a body and a lamp provided thereon. The lamp may notify the current position of the body.

[0110] An organic device 100 containing an organic light-emitting material in the organic functional layer 211 can be applied to the tail lamp 1501. The tail lamp 1501 may have a protective member that protects the organic device 100 functioning as the tail lamp 1501. The protective member has a certain degree of high strength and may be made of any material as long as it is transparent, and may be composed of polycarbonate or the like. Further, the protective member may be mixed with a radical carboxylic acid derivative, an acrylonitrile derivative, etc. in the polycarbonate.

[0111] The automobile 1500 may have a vehicle body 1503 and a window 1502 attached thereto. The window may be a window for checking the front and rear of the automobile, or may be a transparent display. The transparent display may use the organic device 100 containing an organic light-emitting material in the organic functional layer 211. In this case, the constituent materials such as the electrodes of the organic device 100 are made of transparent members.

[0112] Referring to FIGS. 12(a) and 12(b), further application examples of the above-described organic device 100 will be described. The organic device 100 can be applied to a system that can be worn as a wearable device such as smart glasses, a head-mounted display (HMD), or smart contact. The imaging display device used in such an application example has an imaging device capable of photoelectrically converting visible light and a light-emitting device capable of emitting visible light.

[0113] FIG. 12(a) illustrates glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or a SPAD is provided on the front surface side of the lens 1601 of the glasses 1600. Further, the above-described organic device 100 is provided on the back surface side of the lens 1601.

[0114] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the imaging device 1602 and the organic device 100 according to each embodiment. Further, the control device 1603 controls the operations of the imaging device 1602 and the organic device 100. An optical system for condensing light onto the imaging device 1602 is formed in the lens 1601.

[0115] FIG. 12(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 have a control device 1612, and an imaging device corresponding to the imaging device 1602 and the organic device 100 are mounted on the control device 1612. An optical system for the imaging device within the control device 1612 and for projecting the light emitted from the organic device 100 is formed in the lens 1611, and an image is projected onto the lens 1611. The control device 1612 functions as a power source that supplies power to the imaging device and the organic device 100, and controls the operations of the imaging device and the organic device 100. The control device 1612 may have a gaze detection unit that detects the wearer's gaze. Infrared rays may be used for gaze detection. The infrared light emitting unit emits infrared light toward the eyeball of the user who is gazing at the display image. An imaging unit having a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an imaging image of the eyeball. By having a reducing means for reducing the light from the infrared light emitting unit to the display unit in a plan view, a decrease in image quality is reduced.

[0116] The user's gaze with respect to the display image is detected from the imaging image of the eyeball obtained by imaging infrared light. Any known method can be applied to gaze detection using the imaging image of the eyeball. As an example, a gaze detection method based on a Purkinje image by reflection of irradiation light on the cornea can be used.

[0117] More specifically, gaze detection processing based on the pupil corneal reflex method is performed. Using the pupil corneal reflex method, a gaze vector representing the orientation (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image included in the imaging image of the eyeball, thereby detecting the user's gaze.

[0118] An organic device 100 according to an embodiment of the present invention includes an imaging device having a light receiving element, and may control a display image based on user's line-of-sight information from the imaging device.

[0119] Specifically, based on the line-of-sight information, the organic device 100 determines a first field-of-view region that the user is gazing at and a second field-of-view region other than the first field-of-view region. The first field-of-view region and the second field-of-view region may be determined by a control device of the organic device 100, or may be received as determined by an external control device. In the display region of the organic device 100, the display resolution of the first field-of-view region may be controlled to be higher than that of the second field-of-view region. That is, the resolution of the second field-of-view region may be made lower than that of the first field-of-view region.

[0120] Further, the display region has a first display region and a second display region different from the first display region, and based on the line-of-sight information, a region with a higher priority is determined from the first display region and the second display region. The first display region and the second display region may be determined by a control device of the organic device 100, or may be received as determined by an external control device. The resolution of the region with a higher priority may be controlled to be higher than that of the region other than the region with a higher priority. That is, the resolution of the region with a relatively lower priority may be made lower.

[0121] Note that AI may be used to determine the first field-of-view region or the region with a higher priority. AI may be a model configured to estimate the angle of the line of sight and the distance to the target at the end of the line of sight from an image of the eyeball using the image of the eyeball and the direction in which the eyeball in the image is actually looking as teacher data. The AI program may be possessed by the organic device 100, the imaging device, or an external device. When an external device possesses it, it is transmitted to the organic device 100 via communication.

[0122] When performing display control based on visual recognition detection, it is preferably applicable to smart glasses further having an imaging device for imaging the outside. The smart glasses can display the imaged external information in real time.

[0123] The invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the claims are appended to disclose the scope of the invention.

Explanation of Reference Numerals

[0124] 10: Pixel region, 20: Peripheral region, 30: Pad electrode, 100: Organic device, 201: Substrate, 205: Main surface, 211: Organic functional layer, 300: Encapsulation layer, 600: Conductive particles, 601, 602: Portions, H: Height, R: Diameter

Claims

1. An organic device including a pixel region in which a plurality of pixels including an organic functional layer are arranged on a main surface of a substrate, and a peripheral region including pad electrodes, and a sealing layer covering the pixel region and the peripheral region, wherein: In the peripheral region, an opening for exposing the pad electrode is provided in the sealing layer; The opening of the sealing layer includes a first portion extending from an upper surface of the sealing layer toward the pad electrode, and a second portion whose outer edge is arranged inside the outer edge of the first portion and the outer edge of the pad electrode in a orthographic projection onto the main surface, and which opens from a lower end of the first portion to the pad electrode; Conductive particles for electrically connecting to an electrode arranged outside the organic device are arranged on the pad electrode; The diameter of the conductive particles is larger than the height of the second portion; The sealing layer includes a first layer and a second layer arranged between the first layer and the main surface and made of a material different from that of the first layer; An organic device, wherein an outer edge of the first portion formed by an inner edge of an opening provided in the first layer is arranged outside an outer edge of the pad electrode in a orthographic projection onto the main surface.

2. The organic device according to claim 1, wherein the conductive particles are particles included in an anisotropic conductive film.

3. The organic device according to claim 1 or 2, wherein the first portion opens in the first layer and the second portion opens in the second layer.

4. The sealing layer is arranged between the second layer and the main surface, and further includes a third layer made of a material different from that of the second layer; The organic device according to claim 3, wherein the second portion opens in the second layer and the third layer.

5. The organic device according to claim 4, wherein the second layer is a layer having a lower defect density than the first layer and the third layer.

6. The organic device according to claim 4 or 5, wherein the first layer and the third layer are made of the same material.

7. An insulating layer covering the pixel region and the peripheral region is further provided, in the pixel region, the insulating layer is disposed between the organic functional layer and the main surface, in the peripheral region, the insulating layer is disposed between the encapsulation layer and the main surface, the insulating layer is provided with an opening for exposing the pad electrode, The organic device according to any one of claims 1 to 6, wherein in a front projection onto the main surface, an outer edge of the opening of the insulating layer is disposed outside an outer edge of the second portion.

8. An insulating layer covering the pixel region and the peripheral region is further provided, in the pixel region, the insulating layer is disposed between the organic functional layer and the main surface, in the peripheral region, the insulating layer is disposed between the encapsulation layer and the main surface, the insulating layer is provided with an opening for exposing the pad electrode, in a front projection onto the main surface, an outer edge of the opening of the insulating layer is disposed outside an outer edge of the second portion, The organic device according to any one of claims 4 to 6, wherein a water permeability of the third layer is lower than a water permeability of the insulating layer.

9. The pad electrode includes a first pad electrode and a second pad electrode adjacent to each other, The organic device according to any one of claims 1 to 8, wherein the first portion provided corresponding to the first pad electrode and the first portion provided corresponding to the second pad electrode are formed continuously.

10. A resin layer is further disposed on the sealing layer. In the peripheral region, an opening for exposing the pad electrode is provided in the resin layer. The organic device according to any one of claims 1 to 9, wherein in a orthographic projection onto the main surface, an outer edge of the opening of the resin layer is disposed outside an outer edge of the second portion. **Claim 11** The organic device according to claim 10, wherein in a orthographic projection onto the main surface, an outer edge of the opening of the resin layer is disposed so as to overlap an outer edge of the first portion. **Claim 12** The organic device according to any one of claims 1 to 11, further comprising a color filter disposed on the sealing layer in the pixel region. **Claim 13** The organic device according to any one of claims 1 to 12, wherein the organic functional layer contains an organic light-emitting material. **Claim 14** The organic device according to any one of claims 1 to 12, wherein the organic functional layer contains an organic optoelectronic conversion material. **Claim 15** The organic device according to any one of claims 1 to 14, wherein the plurality of pixels are arranged along the longitudinal direction of the substrate. **Claim 16** A photoreceptor, an exposure light source for exposing the photoreceptor, a developing device for applying a developer to the exposed photoreceptor, and a transfer device for transferring an image developed by the developing device to a recording medium. An image forming apparatus, wherein the exposure light source has the organic device according to any one of claims 1 to 15. **Claim 17** A display device, comprising the organic device according to any one of claims 1 to 15 and an active element connected to the organic device. **Claim 18** An optical unit having a plurality of lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image. The display unit is a display unit that displays an image captured by the image sensor, and the photoelectric conversion device is characterized by having the organic device according to any one of claims 1 to 15.

19. A housing provided with a display unit, and a communication unit provided in the housing and communicating with the outside. The display unit has the organic device according to any one of claims 1 to 15, and the electronic device is characterized by this.

20. An illumination device having a light source and at least one of a light diffusion unit and an optical film. The light source has the organic device according to any one of claims 1 to 15, and the illumination device is characterized by this.

21. A moving body having a body and a lighting fixture provided on the body. The lighting fixture has the organic device according to any one of claims 1 to 15, and the moving body is characterized by this.

22. A wearable device having a display device for displaying an image. The display device has the organic device according to any one of claims 1 to 15, and the wearable device is characterized by this.

23. A method for manufacturing an organic device including a pixel region in which a plurality of pixels including an organic functional layer are arranged and a peripheral region including pad electrodes on a main surface of a substrate. A step of forming the plurality of pixels and the pad electrodes. A step of forming a sealing layer so as to cover the plurality of pixels and the pad electrodes. A step of providing an opening in the sealing layer for exposing the pad electrode. A step of disposing conductive particles for connecting to an electrode disposed outside the organic device on the pad electrode. Including The step of providing the opening includes: etching a first portion extending from the upper surface of the sealing layer toward the pad electrode; in a front projection onto the main surface, etching a second portion whose outer edge is arranged inside the outer edge of the first portion and the outer edge of the pad electrode and which opens from the lower end of the first portion to the pad electrode; and includes the diameter of the conductive particles is larger than the height of the second portion, the sealing layer includes a first layer and a second layer arranged between the first layer and the main surface and made of a material different from that of the first layer, and a manufacturing method characterized in that an outer edge of the first portion formed by an inner edge of an opening provided in the first layer is arranged outside an outer edge of the pad electrode in a front projection onto the main surface.

24. The manufacturing method according to claim 23, characterized in that the step of arranging the conductive particles includes a step of pressing an anisotropic conductive film containing the conductive particles.

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