Bonding device

Abstract

To ensure a good bonding state across the entire bonding surface between the two workpieces. 【Solution means】The bonding device includes a support mechanism, a sealing mechanism, and an internal pressure adjustment mechanism. The support mechanism supports the first workpiece and the second workpiece in the chamber with their bonding surfaces facing each other. The sealing mechanism is capable of selectively forming a sealed state in which the first region and the second region are sealed in the chamber and a released state in which the seal between the two regions is released. The internal pressure adjustment mechanism is a mechanism for adjusting the internal pressure of the chamber and is configured to be able to individually adjust the internal pressure of the first region and the internal pressure of the second region when the sealed state is formed by the sealing mechanism. And the support mechanism and the sealing mechanism are configured to be able to support the first workpiece while exposing the back surface of the first workpiece to the second region and to form a sealed state.

Description

Technical Field

[0001] The present invention relates to a bonding technique for workpieces such as wafers and substrates.

Background Art

[0002] Patent Document 1 discloses a technique for bonding two workpieces (such as wafers and substrates) with an adhesive. Specifically, a technique is disclosed in which two workpieces are sandwiched between two holding parts (holding parts that chuck the two workpieces respectively) with an adhesive interposed therebetween, and then the two workpieces are bonded by applying pressure to the back surfaces of the two workpieces.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] On the other hand, in the above technique disclosed in Patent Document 1, pressure can be applied to the back surface of the workpiece only indirectly through the holding part. For this reason, the structure and strength of the holding part itself, and further the structure of the transmission mechanism for transmitting force to the holding part, etc. are likely to affect the way pressure is applied to the back surface of the workpiece, and due to this, there is a problem that it is difficult to apply pressure evenly to the back surface of the workpiece (the surface opposite to the bonding surface). And this problem has made it difficult to obtain a good bonding state overall between the bonding surfaces of the two workpieces.

[0005] Therefore, an object of the present invention is to obtain a good bonding state overall between the bonding surfaces of two workpieces.

Means for Solving the Problems

[0006] The bonding device according to the present invention is a bonding device that bonds a first workpiece and a second workpiece in a chamber, and includes a support mechanism, a sealing mechanism, and an internal pressure adjustment mechanism (Aspect 1). The support mechanism supports the first workpiece and the second workpiece in the chamber with their bonding surfaces facing each other. The sealing mechanism can selectively form a sealed state in which the first region including the region on the bonding surface side of the first workpiece and the second region including the region on the back side of the first workpiece are sealed in the chamber, and a released state in which the seal between these two regions is released. The internal pressure adjustment mechanism is a mechanism for adjusting the internal pressure of the chamber, and is configured to be able to individually adjust the internal pressure of the first region and the internal pressure of the second region when the sealed state is formed by the sealing mechanism. And the support mechanism and the sealing mechanism are configured to be able to support the first workpiece while exposing the back surface of the first workpiece to the second region and form a sealed state.

[0007] According to the above Aspect 1, since the back surface of the first workpiece can be exposed to the second region when the sealed state (the state in which the first region and the second region are sealed) is formed, by increasing the internal pressure of such a second region, it becomes possible to directly and evenly pressurize the back surface of the first workpiece by the gas in the second region. Further, by making the internal pressure of the second region higher than the internal pressure of the first region, it becomes possible to evenly press the first workpiece toward the second workpiece by utilizing the differential pressure generated thereby.

[0008] The bonding device according to the above-described aspect 1 may have the following configuration (Aspect 2). The support mechanism may include a ring portion that supports the peripheral edge of the first workpiece from below, and a stage portion that supports the second workpiece at a position below the first workpiece. The first workpiece may be supported by the ring portion with its bonding surface facing downward, and the second workpiece may be supported by the stage portion with its bonding surface facing upward. Further, the sealing mechanism may include an annular sealing portion. By sandwiching the peripheral edge of the first workpiece from above between the sealing portion and the ring portion, the inside of the chamber is divided into two regions, an inner region and an outer region of the sealing portion, and the regions are sealed from each other. Thereby, a second region may be formed by the region inside the sealing portion, and a first region may be formed by the region outside the sealing portion.

[0009] According to the above-described aspect 2, by supporting the peripheral edge of the first workpiece from below by the ring portion, it is possible to reliably prevent the first workpiece from falling in the chamber while exposing the portion of the bonding surface (lower surface) of the first workpiece to which the second workpiece is to be bonded without blocking it.

[0010] Further, by sandwiching the peripheral edge of the first workpiece from above between the annular sealing portion and the ring portion, it is possible to form a sealed state in two regions, an inner region and an outer region (the inner second region and the outer first region) of the sealing portion, and fix the first workpiece on the ring portion. Thereby, not only is it possible to evenly press the first workpiece toward the second workpiece using the differential pressure between the first region and the second region, but it is also possible to prevent displacement and slack of the first workpiece that may occur at that time.

[0011] The bonding device according to the above-described aspect 1 may have the following configuration (Aspect 3). The support mechanism may include a ring portion that supports the peripheral edge of the first workpiece from below, and a chuck portion that chucks the second workpiece above the first workpiece. The first workpiece may be supported by the ring portion with its bonding surface facing upward, and the second workpiece may be chucked by the chuck portion with its bonding surface facing downward. Further, the sealing mechanism may include an annular sealing portion. By sandwiching the peripheral edge of the first workpiece from above between the sealing portion and the ring portion, the inside of the chamber is divided into two regions, an inner region and an outer region of the sealing portion, and the regions are sealed from each other. Thereby, a first region may be formed by the region inside the sealing portion, and a second region may be formed by the region outside the sealing portion.

[0012] According to the above-described aspect 3, by supporting the peripheral edge of the first workpiece from below by the ring portion, the portion of the back surface (lower surface) of the first workpiece that requires pressurization (the portion that overlaps the entire second workpiece when viewed from above or below) is exposed without being blocked, and it is possible to reliably prevent the first workpiece from falling within the chamber.

[0013] Further, by sandwiching the peripheral edge of the first workpiece from above between the annular sealing portion and the ring portion, it is possible to fix the first workpiece on the ring portion while forming a sealed state in two regions, an inner region and an outer region (the inner first region and the outer second region) of the sealing portion. Thereby, not only is it possible to evenly press the first workpiece toward the second workpiece using the differential pressure between the first region and the second region, but it is also possible to prevent displacement and slack of the first workpiece that may occur at that time.

[0014] The bonding device according to the above-described aspect 2 or 3 may further include a control unit that performs the following processing (aspect 4). After supporting the first workpiece and the second workpiece by the support mechanism and before forming a sealed state by the sealing mechanism, the control unit controls the internal pressure adjustment mechanism to reduce the internal pressure of the chamber to a predetermined atmospheric pressure. Then, the control unit forms a sealed state by controlling the sealing mechanism. After that, the control unit controls the internal pressure adjustment mechanism to increase the internal pressure of the second region higher than the internal pressure of the first region.

[0015] According to the above-described aspect 4, before forming the sealed state, the internal pressure of the chamber (in other words, the internal pressures of both the first region and the second region) is reduced to a predetermined atmospheric pressure to increase the degree of vacuum, and then the first workpiece and the second workpiece are bonded to prevent bubbles that would interfere with the bonding from intervening between the first workpiece and the second workpiece.

[0016] The bonding device according to the above-described aspect 4 may have the following configuration (aspect 5). The ring portion may be configured such that a space having a predetermined width is formed between the second workpiece supported by the support mechanism and the ring portion when viewed in plan from above or below, and a first workpiece having a size that can be supported by the ring portion may be used. Then, the control unit may deflect the peripheral portion of the first workpiece toward the first region by using the space having a predetermined width by increasing the internal pressure of the second region higher than the internal pressure of the first region.

[0017] According to the above-described aspect 5, by deflecting the peripheral portion of the first workpiece toward the first region, it becomes possible to improve the poor bonding between the first workpiece and the second workpiece (a workpiece having a smaller size than the first workpiece) at the peripheral portion of the second workpiece.

[0018] In the bonding device according to any one of the above-described aspects 2 to 5, the support mechanism may include a fixing portion that temporarily fixes the first workpiece by sandwiching the peripheral portion of the first workpiece between the fixing portion and the ring portion (aspect 6).

[0019] According to the above aspect 6, the first workpiece W1 on the ring portion can be temporarily fixed even before forming the sealing state (before fixing the first workpiece on the ring portion by the annular sealing portion), thereby preventing the positional deviation and loosening of the first workpiece that may occur before forming the sealing state.

[0020] The bonding device according to any one of the above aspects 1 to 6 may include the following alignment mechanism (aspect 7). This alignment mechanism adjusts the positional relationship between the first workpiece and the second workpiece based on an image obtained by photographing with a camera from the second region side.

[0021] In the above bonding device, since the first workpiece can be supported while exposing the back surface of the first workpiece to the second region and the sealing state can be formed, the back surface of the first workpiece can be photographed with a camera through the second region. Moreover, when the first workpiece itself has light transmissivity, the second workpiece can also be photographed with a camera. When both the first workpiece and the second workpiece can be photographed with a camera in this way, according to the above aspect 7, the positional relationship between the first workpiece and the second workpiece can be grasped based on the image obtained by photographing with the camera, and they can be adjusted by the alignment mechanism so as to have a desired positional relationship.

Advantages of the Invention

[0022] According to the present invention, a good bonding state can be obtained over the entire bonding surface between the two workpieces.

Brief Description of the Drawings

[0023]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0024] [1] Embodiment [1-1] Bonding apparatus FIG. 1 is a conceptual diagram showing the bonding apparatus according to the embodiment. In this embodiment, the bonding apparatus is an apparatus for bonding two workpieces to be bonded (hereinafter, these will be distinguished and referred to as "first workpiece W1" and "second workpiece W2") with a resin such as an adhesive, and includes a chamber mechanism 1, a support mechanism 2, a seal mechanism 3, an alignment mechanism 4, an internal pressure adjustment mechanism 5, and a control unit 9. Hereinafter, the configuration of each part will be specifically described.

[0025] <Chamber mechanism 1> The chamber mechanism 1 includes a first chamber forming portion 11, a second chamber forming portion 12, and a drive portion 13.

[0026] The first chamber forming portion 11 and the second chamber forming portion 12 are portions for forming a sealed space (hereinafter, this sealed space will be referred to as "chamber 10") for the bonding process for the first workpiece W1 and the second workpiece W2, and are configured to selectively realize the formation and opening of the chamber 10.

[0027] Specifically, at least one of the first chamber forming portion 11 and the second chamber forming portion 12 is configured to move in the vertical direction by the power of the driving portion 13, approach each other and combine to form the chamber 10, and also be able to open the chamber 10 by moving away from each other.

[0028] More specifically, the first chamber forming portion 11 is composed of a first cylindrical portion 111 and a top plate 112. The first cylindrical portion 111 is arranged such that its central axis direction coincides with the vertical direction, and the upper end of the first cylindrical portion 111 arranged in such a manner is blocked by the top plate 112. The second chamber forming portion 12 is composed of a second cylindrical portion 121 and a bottom plate 122. The second cylindrical portion 121 is arranged such that its central axis direction coincides with the vertical direction, and the lower end of the second cylindrical portion 121 arranged in such a manner is blocked by the bottom plate 122. Then, when the annular lower end surface of the first cylindrical portion 111 and the annular upper end surface of the second cylindrical portion 121 are in contact without a gap, the chamber 10 is formed between the top plate 112 and the bottom plate 122.

[0029] Furthermore, in the present embodiment, in order to be able to photograph the inside of the chamber 10 by the camera 40 from the outside of the top plate 112, a part of the top plate 112 (the central part in the example of FIG. 1) is formed of a light transmissive member 140X (such as quartz).

[0030] <Support mechanism 2 and sealing mechanism 3> The support mechanism 2 is a mechanism for supporting the first workpiece W1 and the second workpiece W2 in the chamber 10 with their bonding surfaces F11 and F21 facing each other.

[0031] The sealing mechanism 3 is a mechanism that can selectively form a sealed state Qs and a released state Qt in the chamber 10. Here, the sealed state Qs is a state in which the first region R1 including the region on the bonding surface F11 side of the first workpiece W1 and the second region R2 including the region on the back surface F12 side of the first workpiece W1 are sealed. On the other hand, the released state Qt is a state in which the seal between the first region R1 and the second region R2 is released.

[0032] In this embodiment, the support mechanism 2 and the seal mechanism 3 are configured to support the first workpiece W1 while exposing the back surface F12 of the first workpiece W1 to the second region R2 and to form the sealed state Qs.

[0033] Specifically, the support mechanism 2 includes a ring portion 21 and a stage portion 22.

[0034] The ring portion 21 is a portion that supports the peripheral edge portion of the first workpiece W1 from below. The first workpiece W1 is placed on the ring portion 21 with its bonding surface F11 facing downward. According to such a ring portion 21, it is possible to reliably prevent the first workpiece W1 from falling in the chamber 10 while exposing the portion of the bonding surface F11 (lower surface) of the first workpiece W1 to which the second workpiece W2 is to be bonded without closing it.

[0035] The stage portion 22 is a portion that supports the second workpiece W2 at a position below the first workpiece W1 (the first workpiece W1 supported by the ring portion 21), and has a chuck function (such as vacuum suction or electrostatic chuck) for holding (fixing) the second workpiece W2 placed thereon. The second workpiece W2 is placed on the stage portion 22 with its bonding surface F21 facing upward.

[0036] Furthermore, the seal mechanism 3 includes an annular seal portion 31 and a drive portion 32.

[0037] The seal portion 31 is a portion that divides the inside of the chamber 10 into two regions, an inner region and an outer region thereof, and seals between these regions by sandwiching the peripheral edge portion of the first workpiece W1 from above (from the back surface F12 side) between the seal portion 31 and the ring portion 21. In the example of FIG. 1, the seal portion 31 is an annular bellows that expands and contracts by the power of the drive portion 32, and is attached to the lower surface of the top plate 112 so as to be able to sandwich the peripheral edge portion of the first workpiece W1 from above (from the back surface F12 side) between the seal portion 31 and the ring portion 21 by extending vertically downward.

[0038] According to such a support mechanism 2 and a seal mechanism 3, by sandwiching the peripheral portion of the first workpiece W1 from above by the annular seal portion 31, as a sealed state Qs, a second region R2 is formed by the region inside the seal portion 31 (the region where the back surface F12 of the first workpiece W1 is exposed), and a first region R1 can be formed by the region outside the seal portion 31 (the portion communicating with the region on the bonding surface F11 side of the first workpiece W1) (see also Fig. 4(B)). Moreover, the first workpiece W1 can be fixed on the ring portion 21.

[0039] In addition to these configurations, the support mechanism 2 further includes a fixing portion 23 and a driving portion 24.

[0040] The fixing portion 23 is a portion that temporarily fixes the first workpiece W1 by sandwiching the peripheral portion of the first workpiece W1 between it and the ring portion 21. In the example of Fig. 1, the fixing portion 23 is composed of stick-shaped members that move up and down by the power of the driving portion 24 and are provided at a plurality of locations on the top plate 112. Then, by the downward movement of the fixing portion 23, the peripheral portion of the first workpiece W1 can be sandwiched at a plurality of locations between it and the ring portion 21 to be temporarily fixed. Incidentally, the fixing portion 23 may have a chuck function (such as vacuum suction or electrostatic chuck) for lifting the first workpiece W1 from the ring portion 21.

[0041] According to the above fixing portion 23, the first workpiece W1 can be temporarily fixed on the ring portion 21 even before the sealed state Qs is formed (before the first workpiece W1 is fixed on the ring portion 21 by the annular seal portion 31), thereby making it possible to prevent the positional deviation and slack of the first workpiece W1 that may occur before the formation of the sealed state Qs.

[0042] <Alignment mechanism 4> The alignment mechanism 4 is a mechanism that enables adjustment of the positional relationship between the first workpiece W1 and the second workpiece W2. In the present embodiment, the alignment mechanism 4 is configured such that the positional relationship is adjusted by adjusting the position of the stage portion 22 in the horizontal plane. And the positional relationship is adjusted based on an image obtained by photographing with the camera 40 from the outside of the top plate 112 (in other words, on the second region R2 side). More specifically, it is as follows.

[0043] In the present embodiment, as described above, with the back surface F12 of the first workpiece W1 exposed to the second region R2, the first workpiece W1 can be supported and the sealing state Qs can be formed. In addition, a part of the top plate 112 (the central part in the example of FIG. 1) is formed of a light-transmissive member 140X (such as quartz). Therefore, the back surface F12 of the first workpiece W1 can be photographed by the camera 40 through the second region R2. Moreover, when the first workpiece W1 itself has light transmissivity, the second workpiece W2 can also be photographed by the camera 40. When both the first workpiece W1 and the second workpiece W2 can be photographed by the camera 40 in this way, based on the image obtained by photographing with the camera 40, the positional relationship (such as the position of the alignment mark) between the first workpiece W1 and the second workpiece W2 can be grasped, and based on this, it can be adjusted by the alignment mechanism 4 so that they have a desired positional relationship.

[0044] Furthermore, in the present embodiment, the alignment mechanism 4 is configured to be able to move the stage portion 22 up and down. By moving the stage portion 22 upward, the bonding surface F21 of the second workpiece W2 on the stage portion 22 can be brought close to or into contact with the bonding surface F11 of the first workpiece W1 supported by the ring portion 21.

[0045] <Internal pressure adjustment mechanism 5> The internal pressure adjustment mechanism 5 is a mechanism for adjusting the internal pressure of the chamber 10. In this embodiment, the internal pressure adjustment mechanism 5 is configured to be able to individually adjust the internal pressure of the first region R1 and the internal pressure of the second region R2 when the sealing state Qs is formed by the sealing mechanism 3.

[0046] Specifically, the internal pressure adjustment mechanism 5 includes a pressure reduction unit 51 and a pressure increase unit 52.

[0047] The pressure reduction unit 51 is a part that reduces the internal pressure of the chamber 10 to a predetermined air pressure by exhausting air from the inside of the chamber 10, such as a vacuum pump. Here, the predetermined air pressure is an air pressure lower than the atmospheric pressure, and for example, it is an air pressure corresponding to the required degree of vacuum in the chamber 10. In this embodiment, the pressure reduction unit 51 is configured to be able to maintain the internal pressure of the first region R1 at the predetermined air pressure even after the first region R1 and the second region R2 are sealed by the sealing mechanism 3 after the pressure reduction in the chamber 10.

[0048] The pressure increase unit 52 is a part that increases the internal pressure of the chamber 10 by supplying air into the chamber 10, such as a compression pump. In this embodiment, the pressure increase unit 52 is configured to be able to individually increase the internal pressure of the first region R1 and the internal pressure of the second region R2 when the first region R1 and the second region R2 are sealed by the sealing mechanism 3.

[0049] <Control unit 9> The control unit 9 is composed of a processing device (such as a CPU) and a storage device (such as a RAM or a ROM), and controls each part of the bonding device (the chamber mechanism 1, the support mechanism 2, the sealing mechanism 3, the alignment mechanism 4, the internal pressure adjustment mechanism 5, etc.). Then, when the control unit 9 executes a program, the bonding process described below is executed.

[0050] Here, the above program is installed in the control unit 9. Before installation, it may be stored in a portable storage medium (e.g., flash memory, etc.) in a readable state, or may be stored in a downloadable state in another server or the like. Note that the bonding process described below is not limited to being realized by software by executing the program, and may also be realized by hardware by a processing circuit constructed within the control unit 9.

[0051] [1-2] Bonding process Figures 2(A) to 5(B) are conceptual diagrams showing the sequential state changes of the bonding apparatus caused by the execution of the bonding process.

[0052] In a state where the chamber 10 is open, the control unit 9 controls a transfer hand (not shown) responsible for transferring the first workpiece W1 and the second workpiece W2, and places the second workpiece W2 on the stage unit 22 with its bonding surface F21 facing upward. Then, the first workpiece W1 is placed on the ring unit 21 with its bonding surface F11 facing downward (step S101. Refer to Figure 2(A)). In the present embodiment, as the second workpiece W2, one having a resin layer Yr formed on its bonding surface F21 is placed on the stage unit 22 with the resin layer Yr facing upward. Here, the resin layer Yr is a layer containing a resin (such as an adhesive) for bonding the first workpiece W1 and the second workpiece W2.

[0053] Thereby, the first workpiece W1 and the second workpiece W2 are supported by the support mechanism 2 in a state where their bonding surfaces F11 and F21 face each other (in the present embodiment, a state where the resin layer Yr on the bonding surface F21 faces the bonding surface F11).

[0054] After step S101, the control unit 9 controls the drive unit 13 of the chamber mechanism 1 to combine the first chamber forming unit 11 and the second chamber forming unit 12 without a gap, thereby forming the chamber 10 (sealed space) (step S102. Refer to Figure 2(B)).

[0055] Furthermore, in step S102, the control unit 9 controls the drive unit 24 of the support mechanism 2 to move the fixing unit 23 downward, thereby sandwiching the peripheral edge of the first workpiece W1 at a plurality of locations between the fixing unit 23 and the ring unit 21, and temporarily fixing the first workpiece W1 thereby. This makes it possible to prevent displacement or slack of the first workpiece W1 that may occur before the formation of the sealing state Qs (see FIG. 3(B)).

[0056] After step S102, the control unit 9 controls the pressure reducing unit 51 of the internal pressure adjusting mechanism 5 to reduce the pressure in the chamber 10, thereby reducing the internal pressure of the chamber 10 to a predetermined atmospheric pressure (step S103; see FIG. 3(A)).

[0057] Here, during the pressure reduction in step S103, an air flow may be generated in the chamber 10 due to the exhaust by the pressure reducing unit 51. On the other hand, in the present embodiment, the first workpiece W1 is fixed on the ring unit 21 by the fixing unit 23, and the second workpiece W2 is fixed on the stage unit 22 by the chuck function of the stage unit 22. Therefore, even if an air flow is generated in the chamber 10 during the pressure reduction, almost no displacement or slack occurs in the first workpiece W1 and the second workpiece W2.

[0058] After step S103, the control unit 9 controls the drive unit 32 of the sealing mechanism 3 to extend the annular sealing part 31 vertically downward, thereby sandwiching the peripheral edge of the first workpiece W1 from above (from the back surface F12 side) between the sealing part 31 and the ring unit 21, thereby dividing the inside of the chamber 10 into two regions, the inner and outer regions of the sealing part 31, and sealing between those regions (step S104; see FIG. 3(B)). In this way, the control unit 9 forms the second region R2 by the region inside the sealing part 31 (the region where the back surface F12 of the first workpiece W1 is exposed) as the sealing state Qs, and forms the first region R1 by the region outside the sealing part 31 (the part communicating with the region on the bonding surface F11 side of the first workpiece W1). Further, the control unit 9 fixes the first workpiece W1 on the ring unit 21.

[0059] After step S104, the control unit 9 adjusts the positional relationship between the first workpiece W1 and the second workpiece W2 by controlling the alignment mechanism 4 (step S105. FIG. 4(A)). In the present embodiment, the control unit 9 adjusts the position of the stage unit 22 in the horizontal plane based on an image obtained by photographing with the camera 40 from the outside of the top plate 112 (in other words, on the side of the second region R2), so that the position of the second workpiece W2 coincides with the correct position in relation to the first workpiece W1. As an example, while recognizing the alignment marks provided on the first workpiece W1 and the second workpiece W2 based on the image obtained by the camera 40, the control unit 9 adjusts the position of the stage unit 22 in the horizontal plane so that those marks coincide.

[0060] Furthermore, in step S105, while maintaining the adjusted position in the horizontal plane, the control unit 9 controls the alignment mechanism 4 to move the stage unit 22 upward, so that the bonding surface F21 of the second workpiece W2 on the stage unit 22 approaches the bonding surface F11 of the first workpiece W1, thereby bringing the resin layer Yr on the bonding surface F21 into contact with the bonding surface F11 (see FIG. 4(A)).

[0061] In this way, with the degree of vacuum in the first region R1 increased in step S104, by bringing the resin layer Yr on the bonding surface F21 into contact with the bonding surface F11 in step S105, even if voids Xs (closed small spaces. See FIG. 6) are generated at that time due to the unevenness on the surface of the resin layer Yr, the inside of the voids Xs will be in a state of high vacuum similar to that in the first region R1. Therefore, by pressing the first workpiece W1 toward the second workpiece W2 in step S106 described below, and by returning the inside of the chamber 10 to atmospheric pressure after step S106 (that is, by exposing the first workpiece W1 and the second workpiece W2 after the bonding process to atmospheric pressure), the voids Xs can be eliminated by the pressing force from the outside. Thus, by performing the bonding through steps S104 and S105, it is possible to prevent bubbles that would interfere with the bonding from intervening between the first workpiece W1 and the second workpiece W2.

[0062] After step S105, the control unit 9 controls the pressure increasing unit 52 of the internal pressure adjustment mechanism 5 to increase the pressure in the second region R2, thereby increasing the internal pressure of the second region R2 to be higher than the internal pressure of the first region R1 (step S106. Refer to FIG. 4(B)). Specifically, the control unit 9 controls the internal pressure adjustment mechanism 5 to increase only the internal pressure of the second region R2 while maintaining the internal pressure of the first region R1 at a predetermined atmospheric pressure.

[0063] At this time, since the back surface F12 of the first workpiece W1 is exposed in the second region R2, by increasing the internal pressure of the second region R2 in step S106, it becomes possible to directly and evenly pressurize the back surface F12 of the first workpiece W1 with the gas in the second region R2. Also, by making the internal pressure of the second region R2 higher than the internal pressure of the first region R1 in step S106, it becomes possible to evenly press the first workpiece W1 toward the second workpiece W2 using the differential pressure generated thereby. As a result, it becomes possible to obtain a good bonding state over the entire area between the bonding surfaces F11 and F21 of the two workpieces.

[0064] Also, in the present embodiment, since the first workpiece W1 is fixed on the ring portion 21 by the seal portion 31, not only can the above-described even pressing be achieved by step S106, but also displacement and slack of the first workpiece W1 that may occur at that time are prevented.

[0065] After step S106, the control unit 9 controls the pressure increasing unit 52 of the internal pressure adjustment mechanism 5 to increase the pressure in the first region R1, thereby increasing the internal pressure of the first region R1 to approximately the same level as the internal pressure of the second region R2 (step S107. Refer to FIG. 5(A)).

[0066] After step S107, the control unit 9 controls the drive unit 32 of the sealing mechanism 3 to reduce the annular sealing portion 31 vertically upward, thereby transitioning the inside of the chamber 10 from the sealed state Qs to the released state Qt (step S108. Refer to FIG. 5(B)). After that, the control unit 9 returns the inside of the chamber 10 to atmospheric pressure and then opens it, and controls a transfer hand (not shown) to take out the workpieces (the first workpiece W1 and the second workpiece W2) after the bonding process from the bonding apparatus.

[0067] [2] Modification [2-1] First modification As shown in FIG. 7(A), when the film thickness of the resin layer Yr on the bonding surface F21 is small at the peripheral portion of the second workpiece W2 (in other words, when the height of the resin layer Yr from the bonding surface F21 is low), even if the resin layer Yr on the bonding surface F21 is brought into contact with the bonding surface F11 in a state where the degree of vacuum in the first region R1 is increased in steps S104 and S105 as described above, at the peripheral portion of the second workpiece W2, it becomes difficult to form a gap Xs (a closed small space) between the bonding surface F11 of the first workpiece W1 and the resin layer Yr. In other words, at the peripheral portion of the second workpiece W2, only a gap Xt opened to the first region R1 is formed between the bonding surface F11 of the first workpiece W1 and the resin layer Yr. Since the inside of the gap Xt opened in this way also becomes atmospheric pressure when the inside of the chamber 10 is returned to atmospheric pressure, it remains as it is after the bonding process and causes a bonding failure.

[0068] Therefore, in step S106 described above, the control unit 9 increases the internal pressure of the second region R2 more than the internal pressure of the first region R1, and uses the differential pressure generated thereby and the space between the second workpiece W2 supported by the stage unit 22 and the ring unit 21 to deflect the peripheral portion of the first workpiece W1 toward the first region R1 side as shown in FIG. 7(B).

[0069] Here, the size and shape of the flexing portion vary according to the width Lz of the above-described space. Therefore, by changing the configuration (such as the size) of the ring portion 21, the width Lz of the above-described space is adjusted, and by using the first workpiece W1 having a size that can be supported by the ring portion 21, the size and shape of the flexing portion are adjusted. Then, by finding an appropriate predetermined width as the width Lz of the above-described space, the resin layer Yr and the bonding surface F11 of the first workpiece W1 can be brought into contact even on the peripheral edge portion of the second workpiece W2 (see FIG. 7(B)).

[0070] According to such a bonding process, even on the peripheral edge portion of the second workpiece W2, voids Xs (closed small spaces) caused by the unevenness on the surface of the resin layer Yr can be formed within an atmosphere with a high degree of vacuum (here, the first region R1), and moreover, the voids Xs can be eliminated by the pressing force from the outside. Therefore, it becomes possible to improve the bonding failure between the first workpiece W1 and the second workpiece W2 (a workpiece smaller in size than the first workpiece W1) at the peripheral edge portion.

[0071] [2-2] Second Modified Example FIG. 8(A) is a conceptual diagram showing a bonding apparatus according to the second modified example. Hereinafter, the portions different from the bonding apparatus of the above-described embodiment in the configuration of the bonding apparatus according to the second modified example will be described.

[0072] <Chamber mechanism 1> In this modified example, in order to enable the inside of the chamber 10 to be photographed by the camera 40 from the outside of the bottom plate 122, a part of the bottom plate 122 (the central part in the example of FIG. 1) is formed of a light-transmissive member 140X (such as quartz).

[0073] <Support mechanism 2, sealing mechanism 3, and alignment mechanism 4> In this modified example, the support mechanism 2 includes a ring portion 21 and a chuck portion 25.

[0074] The ring portion 21 is a portion that supports the peripheral edge of the first workpiece W1 from below, similar to that described in the above embodiment. In this modified example, the first workpiece W1 is placed on the ring portion 21 with its bonding surface F11 facing upward. According to such a ring portion 21, it is possible to reliably prevent the first workpiece W1 from falling in the chamber 10 while exposing the portion of the back surface F12 (lower surface) of the first workpiece W1 that requires pressurization (the portion that overlaps the entire second workpiece W2 when viewed in plan from above or below) without blocking it.

[0075] The chuck portion 25 is a portion that chucks the second workpiece W2 above the first workpiece W1 (the first workpiece W1 supported by the ring portion 21), and is provided with a chuck function (such as vacuum suction or electrostatic chuck) for enabling such chucking. Then, the second workpiece W2 is chucked by the chuck portion 25 with its bonding surface F21 facing downward.

[0076] In this modified example, the position of the chuck portion 25 in the horizontal plane is adjusted by the alignment mechanism 4, thereby adjusting the positional relationship between the first workpiece W1 and the second workpiece W2. And the positional relationship is adjusted based on the image obtained by photographing with the camera 40 from the outside of the bottom plate 122 (in other words, on the side of the second region R2).

[0077] The seal mechanism 3 includes an annular seal portion 31 and a drive portion 32, similar to that described in the above embodiment.

[0078] On the other hand, in this modified example, the seal portion 31 sandwiches the peripheral edge of the first workpiece W1 from above (from the side of the bonding surface F11) with the ring portion 21, so that as a sealed state Qs, the first region R1 is formed by the region inside the seal portion 31, and the second region R2 is formed by the region outside the seal portion 31 (the portion that communicates with the region where the back surface F12 of the first workpiece W1 is exposed) (see Fig. 8(A)). Moreover, similar to the above embodiment, the first workpiece W1 is fixed on the ring portion 21.

[0079] Also in this modified example, in step S106, the internal pressure of the second region R2 is increased to be higher than the internal pressure of the first region R1 (see FIG. 8(B)). Thereby, it becomes possible to directly and evenly pressurize the back surface F12 of the first workpiece W1 by the gas in the second region R2. Also, by utilizing the differential pressure generated at that time, it becomes possible to evenly press the first workpiece W1 toward the second workpiece W2. Therefore, it becomes possible to obtain a good bonding state overall between the bonding surfaces F11 and F21 of the two workpieces.

[0080] Also in this modified example, since the first workpiece W1 is fixed on the ring portion 21 by the seal portion 31, not only can the above-described even pressing be performed in step S106, but also the positional deviation and slack of the first workpiece W1 that may occur at that time can be prevented.

[0081] [2-3] Other Modified Examples The bonding device described above is not limited to the case where the first workpiece W1 and the second workpiece W2 are bonded with resin (resin layer Yr), and can also be applied to the case where the bonding surfaces F11 and F12 are directly bonded together, or the case where they are bonded with a material other than resin (such as metal).

[0082] The bonding device described above may be appropriately modified to a configuration in which the support mechanism 2 does not have the fixing portion 23. In this case, instead of the fixing portion 23, the ring portion 21 itself may be modified to have a chuck function (such as vacuum suction or electrostatic chuck) for temporarily holding (fixing) the first workpiece W1.

[0083] The descriptions of the above embodiments and modified examples should be considered as illustrative in all respects and not restrictive. The scope of the present invention is indicated not by the above embodiments or modified examples, but by the scope of the claims. Furthermore, it is intended that the scope of the present invention includes all modifications within the meaning and scope equivalent to the scope of the claims.

[0084] Also, from the above-described embodiments and modifications, as the subject of the invention, a part of the configuration of the bonding device may be extracted, or a part or all of the bonding process, or a program for executing them may be extracted.

Explanation of Signs

[0085] 1 Chamber mechanism 2 Support mechanism 3 Seal mechanism 4 Alignment mechanism 5 Internal pressure adjustment mechanism 9 Control unit 10 Chamber 11 First chamber forming part 12 Second chamber forming part 13 Driving part 21 Ring part 22 Stage part 23 Fixing part 24 Driving part 25 Chuck part 31 Seal part 32 Driving part 40 Camera 51 Vacuum part 52 Pressure increasing part Lz Width Qs Sealing state Qt Release state R1 First region R2 Second region W1 First workpiece W2 Second workpiece Xs Gap Xt Opened gap Yr Resin layer 111 First cylindrical part 112 Top plate 121 Second cylindrical part 122 Bottom plate 140 X-ray transmissive member F11, F21 Bonding surface F12 Back surface

Claims

1. A bonding apparatus that bonds a first workpiece and a second workpiece together in a chamber, a support mechanism that supports the first workpiece and the second workpiece in the chamber with their bonding surfaces facing each other; a sealing mechanism that selectively forms, in the chamber, a sealed state in which a first region including a region on the bonding surface side of the first workpiece and a second region including a region on the back side of the first workpiece are sealed, and a released state in which the seal between the two regions is released; an internal pressure adjustment mechanism that adjusts the internal pressure of the chamber and is configured to be able to individually adjust the internal pressure of the second region and the internal pressure of the first region when the sealed state is formed by the sealing mechanism; Equipped with The supporting mechanism and the sealing mechanism are configured to support the first workpiece while exposing the back surface of the first workpiece to the second region, and to be capable of forming the sealed state.

2. The support mechanism includes: A ring portion that supports a peripheral portion of the first work from below; a stage portion supporting the second workpiece below the first workpiece; Equipped with The first workpiece is supported by the ring portion with its bonding surface facing downward, and the second workpiece is supported by the stage portion with its bonding surface facing upward, 2. The bonding device according to claim 1, wherein the sealing mechanism includes an annular sealing portion, and the sealing portion sandwiches a peripheral portion of the first workpiece from above between the sealing portion and the ring portion, thereby dividing the inside of the chamber into two regions, an inside region and an outside region of the sealing portion, and sealing between the regions, thereby forming the second region by the inside region of the sealing portion, and forming the first region by the outside region of the sealing portion.

3. The support mechanism includes: A ring portion that supports a peripheral portion of the first work from below; a chuck portion that chucks the second workpiece at a position above the first workpiece; Equipped with The first workpiece is supported by the ring portion with its bonding surface facing upward, and the second workpiece is chucked by the chuck portion with its bonding surface facing downward, 2. The bonding device according to claim 1, wherein the sealing mechanism includes an annular sealing portion, and the sealing portion sandwiches the peripheral portion of the first workpiece from above between the sealing portion and the ring portion, thereby dividing the inside of the chamber into two regions, an inside region and an outside region of the sealing portion, and sealing between the regions, thereby forming the first region by the inside region of the sealing portion, and forming the second region by the outside region of the sealing portion.

4. A control unit is further provided, The control unit is After the first workpiece and the second workpiece are supported by the support mechanism, and before the sealing mechanism forms the sealed state, the internal pressure of the chamber is reduced to a predetermined atmospheric pressure by controlling the internal pressure adjustment mechanism; Thereafter, the sealing mechanism is controlled to form the sealed state. The bonding apparatus according to claim 2 or 3, further comprising: a step of controlling the internal pressure adjusting mechanism to increase the internal pressure in the second region to be higher than the internal pressure in the first region.

5. When viewed from above or below in a plan view, the ring portion is configured so that a space of a predetermined width is formed between the second workpiece supported by the support mechanism and the ring portion, and the first workpiece is used in a size that can be supported by the ring portion; The bonding device according to claim 4, wherein the control unit uses the space of the specified width to bend the peripheral portion of the first work toward the first region by increasing the internal pressure of the second region higher than the internal pressure of the first region.

6. The bonding device according to claim 2 or 3, wherein the support mechanism includes a fixing part that temporarily fixes the first work by clamping a peripheral portion of the first work between the fixing part and the ring part.

7. an alignment mechanism that adjusts a positional relationship between the first workpiece and the second workpiece based on an image captured by a camera from the second area side; The lamination apparatus according to claim 1 , further comprising:

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