Wiring Substrate and Method for Manufacturing the Same

Abstract

To provide a wiring substrate that has a radio wave transmission / reception function with improved conductivity and transparency, makes an antenna pattern region hard to be visually recognized, makes a current distribution in the antenna pattern region more uniform, and can improve antenna characteristics, and a method for manufacturing the same.SOLUTION: A wiring substrate 10 includes: a substrate 100 having transparency; a plurality of first wirings 200 disposed on an upper surface of the substrate, extending in a first direction D2, and having a rear face in contact with the substrate and a front face facing an opposite side to the rear face; and a second wiring 300 that is arranged on an upper surface of the substrate, extending in a second direction D3 crossing the first direction, and having a rear face in contact with the substrate and a front face facing the opposite side to the rear face. The first wiring extends in the first direction and has a pair of side surfaces 209 and 210 adjacent to the rear surface of the first wiring. The pair of side surfaces is respectively recessed inward. The second wiring extends in the second direction and has a pair of side surfaces adjacent to the rear surface of the second wiring. Each of the pair of side surfaces is recessed inward.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a wiring board and a method for manufacturing the wiring board.

Background Art

[0002] Currently, high functionality, miniaturization, thinning, and weight reduction of portable terminal devices such as smartphones and tablets are progressing. Since these portable terminal devices use a plurality of communication bands, a plurality of antennas corresponding to the communication bands are required. For example, a portable terminal device is equipped with a plurality of antennas such as a telephone antenna, a WiFi (Wireless Fidelity) antenna, a 3G (Generation) antenna, a 4G (Generation) antenna, an LTE (Long Term Evolution) antenna, a Bluetooth (registered trademark) antenna, and an NFC (Near Field Communication) antenna. However, with the miniaturization of portable terminal devices, the mounting space for antennas is limited, and the degree of freedom in antenna design is narrowing. In addition, since the antenna is built in a limited space, the radio wave sensitivity is not always satisfactory.

[0003] For this reason, a film antenna that can be mounted in the display area of a portable terminal device has been developed. This film antenna is a transparent antenna in which an antenna pattern is formed on a transparent substrate, and the antenna pattern is formed by a mesh-shaped conductor mesh layer including a conductor part as a formation part of an opaque conductor layer and a large number of openings as non-formation parts.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0005] One of the purposes of the embodiments of the present disclosure is to provide a wiring board having a radio wave transmitting and receiving function with improved conductivity and transparency, and a method for manufacturing the same.

[0006] In addition, in a conventional film antenna, one or more mesh antennas are mounted on a transparent substrate. However, both a region where an antenna pattern is formed and a region where no antenna pattern is formed exist on the transparent substrate. In this case, the existence of a region where no antenna pattern is formed makes the region where the antenna pattern is formed more visible.

[0007] One of the purposes of this embodiment is to provide a wiring board and a method for manufacturing the wiring board that can make it difficult to visually recognize the antenna pattern region.

[0008] In addition, in a conventional film antenna, one or more mesh antennas are mounted on a transparent substrate. While transmitting and receiving using this mesh antenna, the current value tends to be higher toward the edge side of the mesh antenna and lower toward the center side. For this reason, the current distribution in each mesh antenna is not uniform, and it is difficult to sufficiently improve the antenna characteristics.

[0009] This embodiment provides a wiring board and a method for manufacturing the wiring board that can make the current distribution in the antenna pattern region more uniform and improve the antenna characteristics.

Means for Solving the Problems

[0010] A wiring board according to an embodiment of the present disclosure includes a substrate having transparency, a plurality of first wirings disposed on the upper surface of the substrate, extending in a first direction, and having a back surface in contact with the substrate and a surface facing the opposite side of the back surface, and a second wiring disposed on the upper surface of the substrate, extending in a second direction intersecting the first direction, and having a back surface in contact with the substrate and a surface facing the opposite side of the back surface. The first wiring extends in the first direction and has a pair of side surfaces adjacent to the back surface of the first wiring. The pair of side surfaces of the first wiring are recessed inwardly respectively. The second wiring extends in the second direction and has a pair of side surfaces adjacent to the back surface of the second wiring. The pair of side surfaces of the second wiring are recessed inwardly respectively.

[0011] A wiring board according to an embodiment of the present disclosure includes a substrate having transparency, a plurality of first wirings disposed on the upper surface of the substrate, extending in a first direction, and having a back surface in contact with the substrate and a surface facing the opposite side of the back surface, and a second wiring disposed on the upper surface of the substrate, extending in a second direction intersecting the first direction, and having a back surface in contact with the substrate and a surface facing the opposite side of the back surface. The first wiring extends in the first direction and has a pair of side surfaces adjacent to the back surface of the first wiring. The second wiring extends in the second direction and has a pair of side surfaces adjacent to the back surface of the second wiring. One side surface of the first wiring and one side surface of the second wiring are continuously connected by a curved surface.

[0012] A wiring board according to an embodiment of the present disclosure includes a substrate having transparency, a plurality of first wirings disposed on the upper surface of the substrate, extending in a first direction, and having a back surface in contact with the substrate and a surface facing the opposite side of the back surface, and a second wiring disposed on the upper surface of the substrate, extending in a second direction intersecting the first direction, and having a back surface in contact with the substrate and a surface facing the opposite side of the back surface. The line width of the back surface of the second wiring is smaller than the line width of the back surface of the first wiring.

[0013] In a wiring board according to an embodiment of the present disclosure, the line width of the back surface of the first wiring may be larger than the line width of the front surface of the first wiring, and the line width of the back surface of the second wiring may be larger than the line width of the front surface of the second wiring.

[0014] In a wiring board according to an embodiment of the present disclosure, the second wiring extends in the second direction and has a pair of side surfaces adjacent to the back surface of the second wiring, and the angle formed by the front surface of the second wiring and each side surface may be smaller than the external angle of the angle formed by the back surface of the second wiring and each side surface.

[0015] In a wiring board according to an embodiment of the present disclosure, the first wiring extends in the first direction and has a pair of side surfaces adjacent to the back surface of the first wiring, and the angle formed by the front surface of the first wiring and each side surface may be smaller than the external angle of the angle formed by the back surface of the first wiring and each side surface.

[0016] In a wiring board according to an embodiment of the present disclosure, the intersection of the first wiring and the second wiring may include a continuous curved surface between at least one of the corners formed by the upper surface of the substrate, the surface adjacent to the back surface of the first wiring, and the surface adjacent to the back surface of the second wiring.

[0017] In a wiring board according to an embodiment of the present disclosure, it may have a radio wave transmission and reception function.

[0018] A method for manufacturing a wiring board according to an embodiment of the present disclosure includes forming a conductive layer on the upper surface of a substrate, forming an insulating layer having a first trench extending in a first direction and a second trench extending in a second direction, forming a first conductor disposed in the first trench and a second conductor disposed in the second trench, removing the insulating layer, removing the conductive layer so that the upper surface of the substrate is exposed, and forming a first wiring and a second wiring from the first conductor and the second conductor.

[0019] In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the first wiring extends in the first direction and has a pair of side surfaces adjacent to the back surface of the first wiring. The pair of side surfaces of the first wiring are each recessed inward. The second wiring extends in the second direction and has a pair of side surfaces adjacent to the back surface of the second wiring. The pair of side surfaces of the second wiring may each be recessed inward.

[0020] In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the first wiring extends in the first direction and has a pair of side surfaces adjacent to the back surface of the first wiring. The second wiring extends in the second direction and has a pair of side surfaces adjacent to the back surface of the second wiring. One side surface of the first wiring and one side surface of the second wiring may be continuously connected by a curved surface.

[0021] In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the line width of the back surface of the second wiring may be smaller than the line width of the back surface of the first wiring.

[0022] In the method for manufacturing a wiring board according to an embodiment of the present disclosure, forming the insulating layer having the first trench and the second trench may use an imprint method.

[0023] In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the method of forming the first wiring and the second wiring is to form the conductive layer by a sputtering method, form the first wiring and the second wiring by an electrolytic plating method, and the conductive layer may be removed by wet etching so that the upper surface of the substrate is exposed.

[0024] In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the surfaces of the first wiring and the second wiring may be blackened.

[0025] According to an embodiment of the present disclosure, it is possible to provide a wiring board with improved conductivity and transparency and a method for manufacturing the same.

[0026] A wiring board according to an embodiment of the present disclosure is a wiring board including a substrate having transparency, a wiring pattern region disposed on the substrate and including a plurality of wirings, and a dummy pattern region disposed around the wiring pattern region and including a plurality of dummy wirings electrically independent of the wirings. The wiring pattern region and the dummy pattern region are each composed of a repetition of a predetermined unit pattern shape, the unit pattern shape of the dummy pattern region is a shape in which a part of the unit pattern shape of the wiring pattern region is missing, and an additional pattern separated from the dummy wirings is disposed within the dummy pattern region.

[0027] In the wiring board according to an embodiment of the present disclosure, the dummy wiring has a first dummy wiring portion and a second dummy wiring portion, and the first dummy wiring portion and the second dummy wiring portion may be spaced apart from each other in a planar direction.

[0028] A wiring board according to an embodiment of the present disclosure is a wiring board including a substrate having transparency, a wiring pattern region disposed on the substrate and including a plurality of wirings, and a dummy pattern region disposed around the wiring pattern region and including a plurality of dummy wirings electrically independent of the wirings. The dummy wirings are substantially L-shaped in plan view.

[0029] In the wiring board according to an embodiment of the present disclosure, an additional pattern separated from the dummy wirings may be disposed within the dummy pattern region.

[0030] A wiring board according to an embodiment of the present disclosure is a wiring board including a substrate having transparency, a wiring pattern region disposed on the substrate and including a plurality of wirings, and a dummy pattern region disposed around the wiring pattern region and including a plurality of dummy wirings electrically independent of the wirings. The dummy wiring has a first dummy wiring portion and a second dummy wiring portion, and the first dummy wiring portion and the second dummy wiring portion are disposed obliquely with respect to the wirings.

[0031] In a wiring board according to an embodiment of the present disclosure, the aperture ratio of the dummy pattern region may be larger than the aperture ratio of the wiring pattern region.

[0032] In a wiring board according to an embodiment of the present disclosure, the aperture ratio of the dummy pattern region may be in the range of 87% or more and less than 100%.

[0033] In a wiring board according to an embodiment of the present disclosure, the difference between the aperture ratio of the dummy pattern region and the aperture ratio of the wiring pattern region may be 1% or less.

[0034] In a wiring board according to an embodiment of the present disclosure, the wiring pattern region may include a plurality of connection wirings that connect the plurality of wirings.

[0035] In a wiring board according to an embodiment of the present disclosure, it may have a radio wave transmission and reception function.

[0036] According to an embodiment of the present disclosure, it is possible to make the wiring pattern region difficult to visually recognize.

[0037] A wiring board according to an embodiment of the present disclosure is a wiring board including a substrate having transparency and an antenna pattern region disposed on the substrate and including a plurality of antenna wirings having a function as an antenna, wherein the aperture ratio at the center in the width direction of the antenna pattern region is higher than the aperture ratio at the edge in the width direction of the antenna pattern region.

[0038] In a wiring board according to an embodiment of the present disclosure, the pitch of the plurality of antenna wirings at the center in the width direction of the antenna pattern region may be wider than the pitch of the plurality of antenna wirings at the edge in the width direction of the antenna pattern region.

[0039] In a wiring board according to an embodiment of the present disclosure, a void portion where the antenna wiring is not provided may be formed at the center in the width direction of the antenna pattern region.

[0040] In a wiring board according to an embodiment of the present disclosure, a dummy pattern region including a plurality of dummy wirings electrically independent of the antenna wiring may be formed in the void portion.

[0041] In a wiring board according to an embodiment of the present disclosure, the antenna pattern region has a first pattern region and a second pattern region separated by the void portion, the first pattern region and the second pattern region are respectively disposed at both edge portions in the width direction of the antenna pattern region, and the first pattern region and the second pattern region may be electrically connected to each other by a central pattern region.

[0042] In a wiring board according to an embodiment of the present disclosure, a connection pattern region having inclined portions respectively formed obliquely with respect to the width direction of the antenna pattern region may be provided between the central pattern region and the first pattern region and the second pattern region.

[0043] In a wiring board according to an embodiment of the present disclosure, a power supply portion is electrically connected to the antenna pattern region, and the length of the power supply portion at the central portion in the width direction may be longer than the length of the power supply portion at the edge portion in the width direction.

[0044] A wiring board according to an embodiment of the present disclosure is a wiring board including a substrate having transparency, an antenna pattern region disposed on the substrate and including a plurality of antenna wirings having a function as an antenna, and a power supply portion electrically connected to the antenna pattern region, wherein the length of the power supply portion at the central portion in the width direction is longer than the length of the power supply portion at the edge portion in the width direction.

[0045] A method for manufacturing a wiring board according to an embodiment of the present disclosure is a method for manufacturing a wiring board, including a step of preparing a substrate having transparency and a step of forming an antenna pattern region including a plurality of antenna wirings having a function as an antenna on the substrate, wherein the aperture ratio at the central portion in the width direction of the antenna pattern region is higher than the aperture ratio at the edge portion in the width direction of the antenna pattern region.

[0046] A method for manufacturing a wiring board according to an embodiment of the present disclosure is a method for manufacturing a wiring board, including a step of preparing a substrate having transparency, and a step of forming, on the substrate, an antenna pattern region including a plurality of antenna wirings having a function as an antenna and a power supply unit electrically connected to the antenna pattern region. The length of the central portion in the width direction of the power supply unit is longer than the length of the edge portion in the width direction of the power supply unit.

[0047] According to an embodiment of the present disclosure, the current distribution in the antenna pattern region can be made more uniform, and the antenna characteristics can be improved.

Brief Description of the Drawings

[0048]

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Embodiments for Carrying Out the Invention

[0049] The figures shown below are schematic. Therefore, the sizes and shapes of each part are exaggerated as appropriate for ease of understanding. Also, it is possible to implement with appropriate changes within the scope that does not deviate from the technical idea. In each of the figures shown below, the same parts are denoted by the same reference numerals, and some detailed explanations may be omitted. Also, the numerical values such as the dimensions of each member described in this specification and the material names are examples as embodiments and are not limited thereto, and can be appropriately selected and used. In this specification, terms specifying shapes and geometric conditions, such as terms like parallel, orthogonal, and perpendicular, include not only the strictly meant state but also substantially the same state.

[0050] <First Embodiment> Hereinafter, with reference to the drawings, a wiring board and a manufacturing method thereof according to the first embodiment will be described. However, the wiring board and the manufacturing method thereof according to this embodiment can be implemented in many different modes and are not to be construed as being limited to the description of the embodiments shown below. In the drawings referred to in this embodiment, the same parts or parts having the same function are denoted by the same reference numerals, and repeated explanations thereof are omitted. Also, for convenience of explanation, the terms "upper" or "lower" are used for explanation, but the up and down directions may be reversed. Also, in this embodiment, the "surface" of the wiring means the surface opposite to the side on which the substrate is provided when viewed from the wiring. The "back surface" of the wiring means the surface on which the substrate is provided when viewed from the wiring. The "side surface" of the wiring is a surface located between the "surface" and the "back surface" and facing laterally with respect to the longitudinal direction of the wiring.

[0051] The configuration of the wiring board 10 according to this embodiment will be described with reference to FIG. 1 or FIG. 2.

[0052] [Configuration of Wiring Board] FIG. 1 is a top view showing an example of a wiring board according to the present embodiment. FIG. 2 is a cross-sectional view showing an example of the wiring board according to the present embodiment. FIG. 2(A) is an enlarged cross-sectional view taken along the chain line A-A' in FIG. 1. FIG. 2(B) is an enlarged cross-sectional view taken along the chain line B-B' in FIG. 1. As shown in FIG. 1, the wiring board 10 includes a substrate 100, a first wiring 200, and a second wiring 300. The first wiring 200 and the second wiring 300 are disposed on the upper surface of the substrate 100. In the present embodiment, two first wirings 200 and one second wiring 300 are arranged, but the present invention is not limited thereto. Two or more first wirings 200 and one or more second wirings 300 may be arranged.

[0053] As shown in FIG. 1, the planar shape of the first wiring 200 is exemplified by a line-and-space shape in which a plurality of lines extend independently from the first side 102 of the substrate 100 toward the second side 104 opposite to the first side 102 (the longitudinal direction of the first wiring 200, the first direction, the D2 reverse direction). The planar shape of the second wiring 300 is exemplified by a shape in which one line extends in a direction orthogonal to the direction in which the first wiring 200 extends (the longitudinal direction of the second wiring 300, the second direction, the D3 direction). That is, the second wiring 300 is orthogonal to the two first wirings 200. Also, the first wiring 200 is longer than the second wiring 300. When the wiring substrate 10 has a radio wave transmission and reception function, the first wiring 200 has a function as an antenna, and the second wiring 300 has a function of connecting the plurality of first wirings 200. Each first wiring 200 extends in a direction (D2 direction) corresponding to the frequency band of the antenna, and the second wiring 300 extends in a direction (D3 direction) orthogonal to the first wiring 200. However, it is not limited to this shape, and the planar shapes of the first wiring 200 and the second wiring 300 may be such that a plurality of lines intersect or connect. For example, the direction of the first wiring 200 and the direction of the second wiring 300 may intersect at an acute angle or an obtuse angle. When a plurality of the first wirings 200 and the second wirings 300 are arranged, their planar shapes are in this repeating shape. That is, a regular lattice or mesh shape is formed by the first wiring 200 extending in the first direction and the second wiring 300 extending in the second direction. However, it is not limited to this, and this repeating shape may not be uniform on the substrate 100. Also, in FIG. 1, the substrate 100 is square, but it is not limited to this shape.

[0054] As shown in FIG. 2(A), the first wiring 200 has a back surface (first surface) 201 in contact with the substrate 100 and a front surface (second surface) 202 facing the opposite side of the back surface 201. As shown in FIG. 2(B), the second wiring 300 has a back surface (third surface) 303 in contact with the substrate 100 and a front surface (fourth surface) 304 facing the opposite side of the back surface 303. As shown in FIGS. 1, 2(A), and 2(B), the line width of the front surface 304 of the second wiring 300 is smaller than the line width of the front surface 202 of the first wiring 200. Also, the line width of the back surface 303 of the second wiring 300 is smaller than the line width of the back surface 201 of the first wiring 200. Here, the line width means the width parallel to the upper surface of the substrate 100 in a cross-section perpendicular to the direction in which each wiring extends. That is, in the present embodiment, the line widths of the front surface 202 and the back surface 201 of the first wiring 200 indicate the lengths in the D3 direction of the front surface 202 and the back surface 201, respectively, and the line widths of the front surface 304 and the back surface 303 of the second wiring 300 indicate the lengths in the D2 direction of the front surface 304 and the back surface 303, respectively. By arranging the line widths of the front surface 304 and the back surface 303 of the second wiring 300 to be smaller than the line widths of the front surface 202 and the back surface 201 of the first wiring 200, respectively, it is possible to suppress the visibility of the spare second wiring 300 for coping with disconnection or the like of the first wiring 200 while maintaining the reliability of the first wiring 200 having a radio wave transmission and reception function. Therefore, the conductivity and transparency of the wiring board 10 can be improved. Note that, not limited to the above, the line width of the front surface 304 of the second wiring 300 may be the same as the line width of the front surface 202 of the first wiring 200. Also, the line width of the back surface 303 of the second wiring 300 may be the same as the line width of the back surface 201 of the first wiring 200.

[0055] As shown in FIG. 2(A), the line width of the back surface 201 of the first wiring 200 is larger than the line width of the front surface 202 of the first wiring 200. As shown in FIG. 2(B), the line width of the back surface 303 of the second wiring 300 is larger than the line width of the front surface 304 of the second wiring 300. In the first wiring 200 and the second wiring 300, by arranging the line width of the surface in contact with the substrate 100 to be larger than the line width of the surface facing the opposite side of the surface in contact with the substrate 100, while suppressing the visibility of the first wiring 200 and the second wiring 300 when viewed in plan in the D1 direction, the adhesion between the substrate 100 and the first wiring 200 and the second wiring 300 can be improved. Furthermore, by increasing the cross-sectional area of the first wiring 200 and the second wiring 300 that intersects perpendicularly to the direction in which each wiring extends, the wiring resistance can be suppressed. For this reason, the transparency, reliability, and conductivity of the wiring substrate 10 can be improved.

[0056] As shown in FIG. 2(A), the first wiring 200 extends in the direction of the first wiring 200 and has a pair of side surfaces (the ninth surface, the tenth surface) 209, 210 adjacent to the back surface 201. In the first wiring 200, the angle formed by the back surface 201 and one side surface 209 and the angle formed by the back surface 201 and the other side surface 210 are each acute angles. In the first wiring 200, the angle formed by the back surface 201 and one side surface 209 and the angle formed by the back surface 201 and the other side surface 210 are the same. That is, in a cross-section that intersects perpendicularly to the direction in which the first wiring 200 extends, the first wiring 200 is line-symmetric about its extension direction (D2 direction).

[0057] As shown in FIG. 2(B), the second wiring 300 extends in the direction of the second wiring 300 and has a pair of side surfaces (the fifth surface, the sixth surface) 305, 306 adjacent to the back surface 303. In the second wiring 300, the angle formed by the back surface 303 and one side surface 305 and the angle formed by the back surface 303 and the other side surface 306 are each acute angles. In the second wiring 300, the angle formed by the back surface 303 and one side surface 305 and the angle formed by the back surface 303 and the other side surface 306 are the same. That is, in a cross-section that intersects perpendicularly to the direction in which the second wiring 300 extends, the second wiring 300 is line-symmetric about its extension direction (D3 direction).

[0058] The material of the first wiring 200 and the material of the second wiring 300 may be any metal material having conductivity. In this embodiment, the material of the first wiring 200 and the material of the second wiring 300 are copper, but it is not limited thereto. As the material of the first wiring 200 and the material of the second wiring 300, for example, metal materials (including alloys) such as gold, silver, copper, platinum, tin, aluminum, iron, and nickel can be used.

[0059] In this embodiment, the line width of the first wiring 200 (the line widths of the back surface 201 and the front surface 202) is not particularly limited as long as the above conditions are satisfied, and can be appropriately selected according to the application. For example, the line width of the first wiring 200 can be selected in the range of 0.1 μm or more and 5.0 μm or less. The line width of the second wiring 300 (the line widths of the back surface 303 and the front surface 304) is not particularly limited as long as the above conditions are satisfied, and can be appropriately selected according to the application. For example, the line width of the second wiring 300 can be selected in the range of 0.1 μm or more and 5.0 μm or less. The heights of the first wiring 200 and the second wiring 300 are not particularly limited and can be appropriately selected according to the application, for example, in the range of 0.1 μm or more and 5.0 μm or less.

[0060] Although not shown in the figure, it is preferable to blacken the surfaces of the first wiring 200 and the second wiring 300 other than the surfaces in contact with the substrate 100. In particular, for each of the first wiring 200 and the second wiring 300, it is preferable to blacken the surface facing the side opposite to the surface in contact with the substrate 100. In the present embodiment, the surface 202 of the first wiring 200 and the surface 304 of the second wiring 300 each contain copper oxide, which is an oxide film of the respective wiring material. However, it is not limited thereto, and it is more preferable to further blacken the side surfaces 209 and 210 of the first wiring 200 and the side surfaces 305 and 306 of the second wiring 300. Further, as a method of the blackening treatment, it can be formed by a known blackening treatment method such as oxidation, sulfidation of the metal wiring, or nickel black plating method. The blackening treatment may be performed by forming a black resin film or the like. By blackening the surfaces of the first wiring 200 and the second wiring 300, the light reflection of the first wiring 200 and the second wiring 300 can be suppressed, and the external light absorption and contrast improvement of the wiring substrate 10 can be achieved.

[0061] Although not shown in the figure, an adhesion layer may be further disposed between the substrate 100 and the first wiring 200, and between the substrate 100 and the second wiring 300. As the material of the adhesion layer, for example, indium-zinc-oxide (IZO) or the like can be used. By disposing the adhesion layer between the substrate 100 and the first wiring 200, and between the substrate 100 and the second wiring 300, the adhesion between the substrate 100 and the first wiring 200, and between the substrate 100 and the second wiring 300 can be further improved.

[0062] The material of the substrate 100 may be any material having transparency and electrical insulation in the visible light region. In this embodiment, the material of the substrate 100 is polyethylene terephthalate, but it is not limited thereto. As the material of the substrate 100, for example, polyester resins such as polyethylene terephthalate, acrylic resins such as polymethyl methacrylate, polycarbonate resins, polyimide resins, or polyolefin resins such as cycloolefin polymers, and organic insulating materials such as cellulose resin materials such as triacetyl cellulose are preferably used. Further, as the material of the substrate 100, glass, ceramics, etc. can be appropriately selected according to the application. Although an example in which the substrate 100 is composed of a single layer is illustrated, it is not limited thereto, and a structure in which a plurality of base materials or layers are laminated may be used. Also, the substrate 100 may be in the form of a film or a plate. Therefore, the thickness of the substrate 100 is not particularly limited and can be appropriately selected according to the application.

[0063] As described above, in the wiring board 10 according to this embodiment, by arranging the line widths of the back surface 303 and the front surface 304 of the second wiring 300 on the substrate 100 to be smaller than the line widths of the back surface 201 and the front surface 202 of the first wiring 200, respectively, while maintaining the reliability of the first wiring 200 having a radio wave transmission / reception function, the visibility of the second wiring 300 when viewed in a plan view in the D1 direction can be suppressed. In the first wiring 200 and the second wiring 300, by arranging the line width of the surface in contact with the substrate 100 to be larger than the surface facing the opposite side of the surface in contact with the substrate 100, while suppressing the visibility of the first wiring 200 and the second wiring 300 when viewed in a plan view in the D1 direction, the adhesion between the substrate 100 and the first wiring 200 and the second wiring 300 can be improved. Furthermore, by increasing the cross-sectional area where each of the first wiring 200 and the second wiring 300 intersects perpendicularly to the direction in which the wiring extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10 can be improved.

[0064] The wiring board 10 according to this embodiment can be mounted on a display device as a wireless communication module by being connected to a circuit for wireless communication. By arranging the wiring board 10 on the upper surface of the display area so that the substrate 100 faces the display area of the display device, the visibility of the first wiring 200 and the second wiring 300 when viewed in plan in the D1 direction can be suppressed. Therefore, it is possible to provide a display device including a wiring board having a radio wave transmission / reception function with improved transparency, reliability, and conductivity.

[0065] When the wiring board 10 has a radio wave transmission / reception function, the wiring board 10 may have any function such as a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, an LTE antenna, a Bluetooth (registered trademark) antenna, an NFC antenna, or the like. Alternatively, the wiring board 10 may not have a radio wave transmission / reception function. In this case, the wiring board 10 may perform functions such as hovering (a function that enables operation without the user directly touching the display), fingerprint authentication, a heater, noise cut (shielding), or the like.

[0066] Next, various modifications of the wiring board according to this embodiment will be described.

[0067] <First Modification> In the form shown in FIGS. 1 and 2, in a cross section perpendicular to the direction in which the second wiring 300 extends, the second wiring 300 is line-symmetric about its longitudinal direction (D3 direction). On the other hand, in this modification, in a cross section perpendicular to the direction in which the second wiring 300a extends, the second wiring 300a is asymmetric about its longitudinal direction (D3 direction).

[0068] The configuration of the wiring board 10a according to this modification will be described with reference to FIG. 3. Here, the configuration of the wiring board 10a according to this modification is the same as the configuration of the wiring board 10 shown in FIGS. 1 and 2 except for the cross-sectional shape of the second wiring 300. Therefore, detailed description of parts that are the same as the form shown in FIGS. 1 and 2 will be omitted.

[0069] [Configuration of Wiring Board] FIG. 3 is a cross-sectional view showing an example of a wiring board according to this modified example. Similar to the form shown in FIG. 1, the wiring board 10a according to this modified example includes a substrate 100a, a first wiring 200a, and a second wiring 300a. FIG. 3(A) is an enlarged cross-sectional view taken along the chain line A-A' in FIG. 1. FIG. 3(B) is an enlarged cross-sectional view taken along the chain line B-B' in FIG. 1.

[0070] As shown in FIG. 3(A), the first wiring 200a has a back surface (first surface) 201a in contact with the substrate 100a and a front surface (second surface) 202a facing the opposite side of the back surface 201a. As shown in FIG. 3(B), the second wiring 300a has a back surface (third surface) 303a in contact with the substrate 100a and a front surface (fourth surface) 304a facing the opposite side of the back surface 303a. As shown in FIGS. 3(A) and 3(B), the line width of the front surface 304a of the second wiring 300a is smaller than the line width of the front surface 202a of the first wiring 200a. Also, the line width of the back surface 303a of the second wiring 300a is smaller than the line width of the back surface 201a of the first wiring 200a. By arranging the line widths of the front surface 304a and the back surface 303a of the second wiring 300a to be smaller than the line widths of the front surface 202a and the back surface 201a of the first wiring 200a, respectively, it is possible to suppress the visibility of the spare second wiring 300a that corresponds to disconnection or the like of the first wiring 200a while maintaining the reliability of the first wiring 200a having a radio wave transmission and reception function. Therefore, the conductivity and transparency of the wiring board 10a can be improved.

[0071] As shown in FIG. 3(A), the line width of the back surface 201a of the first wiring 200a is larger than the line width of the front surface 202a of the first wiring 200a. As shown in FIG. 3(B), the line width of the back surface 303a of the second wiring 300a is larger than the line width of the front surface 304a of the second wiring 300a. In the first wiring 200a and the second wiring 300a, by arranging the line width of the surface in contact with the substrate 100a to be larger than the line width of the surface facing the opposite side of the surface in contact with the substrate 100a, while suppressing the visibility of the first wiring 200a and the second wiring 300a when viewed in plan in the D1 direction, the adhesion between the substrate 100a and the first wiring 200a and the second wiring 300a can be improved. Furthermore, by increasing the cross-sectional area of the first wiring 200a and the second wiring 300a that intersects perpendicularly to the direction in which each wiring extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10a can be improved.

[0072] As shown in FIG. 3(A), the first wiring 200a extends in the direction of the first wiring 200a and has a pair of side surfaces (the ninth surface, the tenth surface) 209a, 210a adjacent to the back surface 201a. In the first wiring 200a, the angle formed by the back surface 201a and one side surface 209a and the angle formed by the back surface 201a and the other side surface 210a are each acute angles. In the first wiring 200a, the angle formed by the back surface 201a and the pair of side surfaces 209a and the angle formed by the back surface 201a and the other side surface 210a are the same. That is, in a cross-section that intersects perpendicularly to the direction in which the first wiring 200a extends, the first wiring 200a is line-symmetric about its extension direction (D2 direction).

[0073] As shown in FIG. 3(B), the second wiring 300a extends in the direction of the second wiring 300a and has a pair of side surfaces (the fifth surface and the sixth surface) 305a and 306a adjacent to the back surface 303a. In the second wiring 300a, the angles formed by the back surface 303a and one side surface 305a, and the back surface 303a and the other side surface 306a are each acute angles. In the second wiring 300a, the angle formed by the back surface 303a and the other side surface 306a is smaller than the angle formed by the back surface 303a and one side surface 305a. That is, in a cross-section perpendicular to the direction in which the second wiring 300a extends, the second wiring 300a is asymmetric about its extension direction (D3 direction). By arranging the angle formed by the back surface 303a and the other side surface 306a to be smaller than the angle formed by the back surface 303a and one side surface 305a in the second wiring 300a, the line width of the back surface 303a becomes larger, and while suppressing the visibility of one side surface 305a of the second wiring 300a when viewed in plan in the D1 direction, the adhesion between the substrate 100a and the second wiring 300a can be improved. Furthermore, by increasing the cross-sectional area perpendicular to the direction in which the wiring of the second wiring 300a extends, the wiring resistance can be suppressed. For this reason, the transparency, reliability, and conductivity of the wiring substrate 10a can be improved.

[0074] As described above, in the wiring board 10a according to this modified example, by arranging the line widths of the back surface 303a and the front surface 304a of the second wiring 300a on the substrate 100a to be smaller than the line widths of the back surface 201a and the front surface 202a of the first wiring 200a, respectively, while maintaining the reliability of the first wiring 200a having a radio wave transmission and reception function, the visibility of the second wiring 300a when viewed in plan in the D1 direction can be suppressed. In the first wiring 200a and the second wiring 300a, by arranging the line width of the surface in contact with the substrate 100a to be larger than the surface facing the opposite side of the surface in contact with the substrate 100a, while suppressing the visibility of the first wiring 200a and the second wiring 300a when viewed in plan in the D1 direction, the adhesion between the substrate 100a and the first wiring 200a and the second wiring 300a can be improved. In the second wiring 300a, by arranging the angle formed by the back surface 303a and the other side surface 306a to be smaller than the angle formed by the back surface 303a and the one side surface 305a, while suppressing the visibility of the one side surface 305a of the second wiring 300a when viewed in plan in the D1 direction, the adhesion between the substrate 100a and the second wiring 300a can be improved. Furthermore, by increasing the cross-sectional area where the respective wirings of the first wiring 200a and the second wiring 300a intersect perpendicularly to the direction in which the wirings extend, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10a can be improved.

[0075] The wiring board 10a according to this modified example can be mounted on a display device as a wireless communication module by being connected to a wireless communication circuit. The wiring board 10a is arranged on the upper surface of the display area so that the substrate 100a faces the display area of the display device, thereby suppressing the visibility of the first wiring 200a and the second wiring 300a when viewed in plan in the D1 direction. The wiring board 10a is arranged such that the direction of the first wiring 200a is in the vertical direction of the display area and one side surface 305a of the second wiring 300a is in the upward direction (light incident direction) of the display area, thereby suppressing the light reflection by the other side surface 306a of the second wiring 300a. Therefore, a display device including a wiring board having a radio wave transmission and reception function with improved transparency, reliability, and conductivity can be provided.

[0076] <Second Modification Example> In the forms shown in FIGS. 1 and 2, in a cross section perpendicular to the direction in which the second wiring 300 extends, the second wiring 300 is symmetric with respect to its longitudinal direction (D3 direction). On the other hand, in this modification example, in a cross section perpendicular to the direction in which the second wiring 300b extends, the second wiring 300b is asymmetric about its longitudinal direction (D3 direction).

[0077] The configuration of the wiring board 10b according to this modification example will be described with reference to FIG. 4. Here, the configuration of the wiring board 10b according to this modification example is the same as the configuration of the wiring board 10 shown in FIGS. 1 and 2 except for the cross-sectional shape of the second wiring 300. For this reason, parts that are the same as those in the forms shown in FIGS. 1 and 2 will not be described in detail.

[0078] [Configuration of Wiring Board] FIG. 4 is a cross-sectional view showing an example of the wiring board according to this modification example. Similar to the form shown in FIG. 1, the wiring board 10b according to this modification example includes a substrate 100b, a first wiring 200b, and a second wiring 300b. FIG. 4(A) is an enlarged cross-sectional view taken along the chain line A-A' in FIG. 1. FIG. 4(B) is an enlarged cross-sectional view taken along the chain line B-B' in FIG. 1.

[0079] As shown in FIG. 4(A), the first wiring 200b has a back surface (first surface) 201b in contact with the substrate 100b and a front surface (second surface) 202b facing the opposite side of the back surface 201b. As shown in FIG. 4(B), the second wiring 300b has a back surface (third surface) 303b in contact with the substrate 100b and a front surface (fourth surface) 304b facing the opposite side of the back surface 303b. As shown in FIGS. 4(A) and 4(B), the line width of the front surface 304b of the second wiring 300b is smaller than the line width of the front surface 202b of the first wiring 200b. Also, the line width of the back surface 303b of the second wiring 300b is smaller than the line width of the back surface 201b of the first wiring 200b. By arranging the line widths of the front surface 304b and the back surface 303b of the second wiring 300b to be smaller than the line widths of the front surface 202b and the back surface 201b of the first wiring 200b, respectively, while maintaining the reliability of the first wiring 200b having a radio wave transmission and reception function, the visibility of the spare second wiring 300b corresponding to disconnection or the like of the first wiring 200b can be suppressed. For this reason, the conductivity and transparency of the wiring board 10b can be improved.

[0080] As shown in FIG. 4(A), the line width of the back surface 201b of the first wiring 200b is larger than the line width of the front surface 202b of the first wiring 200b. As shown in FIG. 4(B), the line width of the back surface 303b of the second wiring 300b is larger than the line width of the front surface 304b of the second wiring 300b. In the first wiring 200b and the second wiring 300b, by arranging the line width of the surface in contact with the substrate 100b to be larger than the line width of the surface facing the opposite side of the surface in contact with the substrate 100b, the visibility of the first wiring 200b and the second wiring 300b when viewed in a plan view in the D1 direction can be suppressed, while the adhesion between the substrate 100b and the first wiring 200b and the second wiring 300b can be improved. Furthermore, by increasing the cross-sectional area of the first wiring 200b and the second wiring 300b that intersects perpendicularly to the direction in which each wiring extends, the wiring resistance can be suppressed. For this reason, the transparency, reliability, and conductivity of the wiring board 10b can be improved.

[0081] As shown in FIG. 4(A), the first wiring 200b extends in the direction of the first wiring 200b and has a pair of side surfaces (the ninth surface and the tenth surface) 209b and 210b adjacent to the back surface 201b. In the first wiring 200b, the angles formed by the back surface 201b and one side surface 209b, and the back surface 201b and the other side surface 210b are each acute angles. In the first wiring 200b, the angles formed by the back surface 201b and one side surface 209b, and the back surface 201b and the other side surface 210b are the same. That is, in a cross section perpendicular to the direction in which the first wiring 200b extends, the first wiring 200b is line-symmetric about its extension direction (the D2 direction).

[0082] As shown in FIG. 4(B), the second wiring 300b extends in the direction of the second wiring 300b and has a pair of side surfaces (the fifth surface and the sixth surface) 305b and 306b adjacent to the back surface 303b. In the second wiring 300b, the angles formed by the back surface 303b and one side surface 305b, and the back surface 303b and the other side surface 306b are each acute angles. In the second wiring 300b, the angle formed by the back surface 303b and the other side surface 306b is smaller than the angle formed by the back surface 303b and one side surface 305b. One side surface 305b of the second wiring 300b according to this modification is recessed inward (the minus side in the D2 direction). One side surface 305b includes an upper side surface (the seventh surface) 307b adjacent to the front surface 304b. In FIG. 4(B), the angle formed by the front surface 304b and the upper side surface 307b is about 90°. However, it is not limited to this, and the angle formed by the front surface 304b and the upper side surface 307b may be smaller than the outer angle of the angle formed by the back surface 303b and one side surface 305b (the angle obtained by subtracting the angle formed by the back surface 303b and one side surface 305b from 180°). The angle formed by the front surface 304b and the upper side surface 307b is preferably in the range of 60° or more and 90° or less. That is, in the second wiring 300b, one side surface 305b includes a shape (the upper side surface 307b) that connects to the front surface 304b at an angle smaller than the outer angle of the angle formed by the back surface 303b and one side surface 305b. However, it is not limited to this, and one side surface 305b may further include different surfaces, and each surface constituting one side surface 305b may form a corner (intersection line), or may be continuously connected by a curved surface. In a cross-section perpendicular to the direction in which the second wiring 300b extends, the second wiring 300b is asymmetric about its extension direction (the D3 direction). By arranging the angle formed by the back surface 303b and the other side surface 306b to be smaller than the angle formed by the back surface 303b and one side surface 305b in the second wiring 300b, the line width of the back surface 303b becomes larger, and while suppressing the visibility of one side surface 305b of the second wiring 300b when viewed in plan in the D1 direction, the adhesion between the substrate 100b and the second wiring 300b can be improved.In the second wiring 300b, since the angle formed by the front surface 304b and the upper side surface 307b is smaller than the external angle of the angle formed by the back surface 303b and one side surface 305b, the visibility of the upper side surface 307b of the second wiring 300b when viewed in a plan view in the D1 direction can be suppressed. Further, by increasing the cross-sectional area that intersects perpendicularly to the direction in which the wiring of the second wiring 300b extends, the wiring resistance can be suppressed. For this reason, the transparency, reliability, and conductivity of the wiring board 10b can be improved.

[0083] As described above, in the wiring board 10b according to this modification example, by arranging the line widths of the back surface 303b and the front surface 304b of the second wiring 300b on the substrate 100b to be smaller than the line widths of the back surface 201b and the front surface 202b of the first wiring 200b, respectively, while maintaining the reliability of the first wiring 200b having a radio wave transmission and reception function, the visibility of the second wiring 300b when viewed in a plan view in the D1 direction can be suppressed. In the first wiring 200b and the second wiring 300b, by arranging the line width of the surface in contact with the substrate 100b to be larger than the surface facing the opposite side of the surface in contact with the substrate 100b, while suppressing the visibility of the first wiring 200b and the second wiring 300b when viewed in a plan view in the D1 direction, the adhesion between the substrate 100b and the first wiring 200b and the second wiring 300b can be improved. In the second wiring 300b, by arranging the angle formed by the back surface 303b and the other side surface 306b to be smaller than the angle formed by the back surface 303b and one side surface 305b, while suppressing the visibility of one side surface 305b of the second wiring 300b when viewed in a plan view in the D1 direction, the adhesion between the substrate 100b and the second wiring 300b can be improved. In the second wiring 300b, since the angle formed by the front surface 304b and the upper side surface 307b is smaller than the external angle of the angle formed by the back surface 303b and one side surface 305b, the visibility of the upper side surface 307b of the second wiring 300b when viewed in a plan view in the D1 direction can be suppressed. Further, by increasing the cross-sectional area that intersects perpendicularly to the direction in which the respective wirings of the first wiring 200b and the second wiring 300b extend, the wiring resistance can be suppressed. For this reason, the transparency, reliability, and conductivity of the wiring board 10b can be improved.

[0084] The wiring board 10b according to this modification example can be mounted on a display device as a wireless communication module by being connected to a circuit for wireless communication. By arranging the wiring board 10b on the upper surface of the display area so that the substrate 100b faces the display area of the display device, the visibility of the first wiring 200b and the second wiring 300b when viewed in a plan view in the D1 direction can be suppressed. By arranging the wiring board 10b so that the direction of the first wiring 200b is in the vertical direction of the display area and the upper side surface 307b of the second wiring 300b is in the upward direction (the light incident direction) of the display area, the reflection of light by the other side surface 306b of the second wiring 300b can be suppressed. Therefore, a display device including a wiring board having a radio wave transmission / reception function with improved transparency, reliability, and conductivity can be provided.

[0085] <Third Modification Example> In the forms shown in FIGS. 1 and 2, in a cross section perpendicular to the direction in which the second wiring 300 extends, the second wiring 300 is symmetric with respect to its longitudinal direction (D3 direction). On the other hand, in this modification example, in a cross section perpendicular to the direction in which the second wiring 300c extends, the second wiring 300c is asymmetric about its longitudinal direction (D3 direction).

[0086] The configuration of the wiring board 10c according to this modification example will be described with reference to FIG. 5. Here, the configuration of the wiring board 10c according to this modification example is the same as the configuration of the wiring board 10 shown in FIGS. 1 and 2 except for the cross-sectional shapes of the first wiring 200 and the second wiring 300. Therefore, the detailed description of the parts that are the same as the forms shown in FIGS. 1 and 2 will be omitted.

[0087] [Configuration of Wiring Board] FIG. 5 is a cross-sectional view showing an example of the wiring board according to this modification example. Similar to the form shown in FIG. 1, the wiring board 10c according to this modification example includes a substrate 100c, a first wiring 200c, and a second wiring 300c. FIG. 5(A) is an enlarged cross-sectional view taken along the chain line A - A' in FIG. 1. FIG. 5(B) is an enlarged cross-sectional view taken along the chain line B - B' in FIG. 1.

[0088] As shown in FIG. 5(A), the first wiring 200c has a back surface (first surface) 201c in contact with the substrate 100c and a front surface (second surface) 202c facing the opposite side of the back surface 201c. As shown in FIG. 5(B), the second wiring 300c has a back surface (third surface) 303c in contact with the substrate 100c and a front surface (fourth surface) 304c facing the opposite side of the back surface 303c. As shown in FIGS. 5(A) and 5(B), the line width of the front surface 304c of the second wiring 300c is smaller than the line width of the front surface 202c of the first wiring 200c. Also, the line width of the back surface 303c of the second wiring 300c is smaller than the line width of the back surface 201c of the first wiring 200c. By arranging the line widths of the front surface 304c and the back surface 303c of the second wiring 300c to be smaller than the line widths of the front surface 202c and the back surface 201c of the first wiring 200c, respectively, while maintaining the reliability of the first wiring 200c having a radio wave transmission and reception function, the visibility of the spare second wiring 300c corresponding to disconnection or the like of the first wiring 200c can be suppressed. Therefore, the conductivity and transparency of the wiring board 10c can be improved.

[0089] As shown in FIG. 5(A), the line width of the back surface 201c of the first wiring 200c is larger than the line width of the front surface 202c of the first wiring 200c. As shown in FIG. 5(B), the line width of the back surface 303c of the second wiring 300c is larger than the line width of the front surface 304c of the second wiring 300c. In the first wiring 200c and the second wiring 300c, by arranging the line width of the surface in contact with the substrate 100c to be larger than the line width of the surface facing the opposite side of the surface in contact with the substrate 100c, the visibility of the first wiring 200c and the second wiring 300c when viewed in plan in the D1 direction can be suppressed, while improving the adhesion between the substrate 100c and the first wiring 200c and the second wiring 300c. Furthermore, by increasing the cross-sectional area of the first wiring 200c and the second wiring 300c that intersects perpendicularly to the direction in which each wiring extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10c can be improved.

[0090] As shown in FIG. 5(A), the first wiring 200c extends in the direction of the first wiring 200c and has a pair of side surfaces (the ninth surface and the tenth surface) 209c and 210c adjacent to the back surface 201c. In the first wiring 200c, the angles formed by the back surface 201c and one side surface 209c, and the back surface 201c and the other side surface 210c are each acute angles. In the first wiring 200c, the angles formed by the back surface 201c and one side surface 209c, and the back surface 201c and the other side surface 210c are the same. One side surface 209c of the first wiring 200c according to this modification is recessed inward (the plus side in the D3 direction). One side surface 209c includes an upper side surface (the eleventh surface) 211c adjacent to the front surface 202c. The other side surface 210c of the first wiring 200c is recessed inward (the minus side in the D3 direction). The other side surface 210c includes an upper side surface (the twelfth surface) 212c adjacent to the front surface 202c. In FIG. 5(A), the angles formed by the front surface 202c and the upper side surface 211c, and the front surface 202c and the upper side surface 212c are approximately 90°. However, it is not limited to this. The angle formed by the front surface 202c and the upper side surface 211c only needs to be smaller than the outer angle of the angle formed by the back surface 201c and one side surface 209c. The angle formed by the front surface 202c and the upper side surface 211c is preferably in the range of 60° or more and 90° or less. The angle formed by the front surface 202c and the upper side surface 212c only needs to be smaller than the outer angle of the angle formed by the back surface 201c and the other side surface 210c. The angle formed by the front surface 202c and the upper side surface 212c is preferably in the range of 60° or more and 90° or less. That is, in the first wiring 200c, one side surface 209c includes a shape (the upper side surface 211c) that connects to the front surface 202c at an angle smaller than the outer angle of the angle formed by the back surface 201c and one side surface 209c. In the first wiring 200c, the other side surface 210c includes a shape (the upper side surface 212c) that connects to the front surface 202c at an angle smaller than the outer angle of the angle formed by the back surface 201c and the other side surface 210c. However, it is not limited to this. The one side surface 209c and the other side surface 210c may further include different surfaces. Each surface constituting the one side surface 209c and the other side surface 210c may form a corner (intersection line), or may be continuously connected by a curved surface.That is, in a cross-section perpendicular to the direction in which the first wiring 200c extends, the first wiring 200c is line-symmetric about its extension direction (D2 direction). In the first wiring 200c, the angle formed by the surface 202c and the upper side surface 211c is smaller than the outer angle of the angle formed by the back surface 201c and one side surface 209c, and the angle formed by the surface 202c and the upper side surface 212c is smaller than the outer angle of the angle formed by the back surface 201c and the other side surface 210c. Thus, the visibility of the upper side surface 211c and the upper side surface 212c of the first wiring 200c when viewed in plan in the D1 direction can be suppressed. Furthermore, by increasing the cross-sectional area perpendicular to the direction in which the wiring of the first wiring 200c extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10c can be improved.

[0091] As shown in FIG. 5(B), the second wiring 300c extends in the direction of the second wiring 300c and has a pair of side surfaces (the fifth surface and the sixth surface) 305c and 306c adjacent to the back surface 303c. In the second wiring 300c, the angles formed by the back surface 303c and one side surface 305c, and the back surface 303c and the other side surface 306c are both acute angles. In the second wiring 300c, the angle formed by the back surface 303c and the other side surface 306c is smaller than the angle formed by the back surface 303c and one side surface 305c. One side surface 305c of the second wiring 300c according to this modification is recessed inward (the minus side in the D2 direction). One side surface 305c includes an upper side surface (the seventh surface) 307c adjacent to the front surface 304c. The other side surface 306c of the second wiring 300c is recessed inward (the plus side in the D2 direction). The other side surface 306c includes an upper side surface (the eighth surface) 308c adjacent to the front surface 304c. In FIG. 5(B), the angles formed by the front surface 304c and the upper side surface 307c, and the front surface 304c and the upper side surface 308c are approximately 90°. However, it is not limited to this. The angle formed by the front surface 304c and the upper side surface 307c only needs to be smaller than the outer angle of the angle formed by the back surface 303c and one side surface 305c. The angle formed by the front surface 304c and the upper side surface 307c is preferably in the range of 60° or more and 90° or less. The angle formed by the front surface 304c and the upper side surface 308c only needs to be smaller than the outer angle of the angle formed by the back surface 303c and the other side surface 306c. The angle formed by the front surface 304c and the upper side surface 308c is preferably in the range of 60° or more and 90° or less. That is, in the second wiring 300c, one side surface 305c includes a shape (the upper side surface 307c) that connects to the front surface 304c at an angle smaller than the outer angle of the angle formed by the back surface 303c and one side surface 305c. In the second wiring 300c, the other side surface 306c includes a shape (the upper side surface 308c) that connects to the front surface 304c at an angle smaller than the outer angle of the angle formed by the back surface 303c and the other side surface 306c. However, it is not limited to this. The one side surface 305c and the other side surface 306c may further include different surfaces. Each surface constituting the one side surface 305c and the other side surface 306c may form a corner (intersection line), or may be continuously connected by a curved surface.In a cross-section perpendicular to the direction in which the second wiring 300c extends, the second wiring 300c is asymmetric about its extension direction (D3 direction). In the second wiring 300c, by arranging the angle formed by the back surface 303c and the other side surface 306c to be smaller than the angle formed by the back surface 303c and one side surface 305c, the line width of the back surface 303c becomes larger, and while suppressing the visibility of one side surface 305c of the second wiring 300c when viewed in the D1 direction, the adhesion between the substrate 100c and the second wiring 300c can be improved. In the second wiring 300c, the angle formed by the front surface 304c and the upper side surface 307c is smaller than the outer angle of the angle formed by the back surface 303c and one side surface 305c, and the angle formed by the front surface 304c and the upper side surface 308c is smaller than the outer angle of the angle formed by the back surface 303c and the other side surface 306c, so that the visibility of the upper side surface 307c and the upper side surface 308c of the second wiring 300c when viewed in the D1 direction can be suppressed. Furthermore, by increasing the cross-sectional area perpendicular to the direction in which the wiring of the second wiring 300c extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring substrate 10c can be improved.

[0092] As described above, the wiring board 10c according to this modification example arranges the line width of the surface 304c of the second wiring 300c on the substrate 100c to be smaller than the line width of the surface 202c of the first wiring 200c, thereby suppressing the visibility of the second wiring 300c when viewed in plan in the D1 direction while maintaining the reliability of the first wiring 200c having a radio wave transmission and reception function. In the first wiring 200c and the second wiring 300c, by arranging the line width of the surface in contact with the substrate 100c to be larger than the surface facing the opposite side of the surface in contact with the substrate 100c, the visibility of the first wiring 200c and the second wiring 300c when viewed in plan in the D1 direction can be suppressed while improving the adhesion between the substrate 100c and the first wiring 200c and the second wiring 300c. In the first wiring 200c, the angle formed by the surface 202c and the upper side surface 211c is smaller than the outer angle of the angle formed by the back surface 201c and one side surface 209c, and the angle formed by the surface 202c and the upper side surface 212c is smaller than the outer angle of the angle formed by the back surface 201c and the other side surface 210c, thereby suppressing the visibility of the upper side surfaces 211c and 212c of the first wiring 200c when viewed in plan in the D1 direction. In the second wiring 300c, by arranging the angle formed by the back surface 303c and the other side surface 306c to be smaller than the angle formed by the back surface 303c and one side surface 305c, the adhesion between the substrate 100c and the second wiring 300c can be improved while suppressing the visibility of one side surface 305c of the second wiring 300c when viewed in plan in the D1 direction. In the second wiring 300c, the angle formed by the surface 304c and the upper side surface 307c is smaller than the outer angle of the angle formed by the back surface 303c and one side surface 305c, and the angle formed by the surface 304c and the upper side surface 308c is smaller than the outer angle of the angle formed by the back surface 303c and the other side surface 306c, thereby suppressing the visibility of the upper side surfaces 307c and 308c of the second wiring 300c when viewed in plan in the D1 direction. Furthermore, by increasing the cross-sectional area where each wiring of the first wiring 200c and the second wiring 300c intersects perpendicularly to the direction in which the wiring extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10c can be improved.

[0093] Also, according to this modified example, since the side surfaces 209c and 210c of the first wiring 200c are recessed inward and the side surfaces 305c and 306c of the second wiring 300c are recessed inward, the maximum width when the first wiring 200c and the second wiring 300c are viewed at an oblique viewing angle can be suppressed. As a result, for example, the first wiring 200c and the second wiring 300c can be made less visible on the surface of the display, and it can be made difficult for the user to recognize the first wiring 200c and the second wiring 300c with the naked eye. Also, generally, when an alternating current flows through a wiring, the higher the frequency, the more difficult it is for the current to flow through the central part of the wiring, and the current flows on the surface of the wiring (skin effect). In this modified example, by recessing each side surface of the first wiring 200c and the second wiring 300c, it becomes possible to flow current over a wide area of the cross-section of the first wiring 200c and the second wiring 300c. Therefore, the cross-sections of the first wiring 200c and the second wiring 300c can be utilized efficiently. Furthermore, by recessing each side surface of the first wiring 200c and the second wiring 300c, light incident obliquely with respect to the D1 direction is less likely to be reflected in the D1 direction, so it can be made difficult to recognize the first wiring 200c and the second wiring 300c with the naked eye.

[0094] The wiring board 10c according to this modified example can be mounted on a display device as a wireless communication module by being connected to a circuit for wireless communication. By disposing the wiring board 10c on the upper surface of the display area so that the substrate 100c faces the display area of the display device, the visibility of the first wiring 200c and the second wiring 300c when viewed in a plan view in the D1 direction can be suppressed. By disposing the wiring board 10c such that the direction of the first wiring 200 is in the vertical direction of the display area and the upper side surface 307c of the second wiring 300c is in the upward direction (the light incident direction) of the display area, the reflection of light by the other side surface 306c of the second wiring 300c can be suppressed. Therefore, it is possible to provide a display device including a wiring board having a radio wave transmission and reception function with improved transparency, reliability, and conductivity.

[0095] <Fourth Modified Example> In the form shown in FIGS. 1 and 2, in a cross-section perpendicular to the direction in which the second wiring 300 extends, the second wiring 300 is symmetric with respect to its longitudinal direction (D3 direction). On the other hand, in this modification, in a cross-section perpendicular to the direction in which the second wiring 300d extends, the second wiring 300d is asymmetric about its longitudinal direction (D3 direction).

[0096] The configuration of the wiring board 10d according to this modification will be described with reference to FIG. 6. Here, the configuration of the wiring board 10d according to the modification is the same as the configuration of the wiring board 10 shown in FIGS. 1 and 2 except for the cross-sectional shapes of the first wiring 200 and the second wiring 300. For this reason, detailed descriptions of the parts that are the same as those in the form shown in FIGS. 1 and 2 are omitted.

[0097] [Configuration of Wiring Board] FIG. 6 is a cross-sectional view showing an example of the wiring board according to this modification. Similar to the form shown in FIG. 1, the wiring board 10d according to this modification includes a substrate 100d, a first wiring 200d, and a second wiring 300d. FIG. 6(A) is an enlarged cross-sectional view taken along the chain line A-A' in FIG. 1. FIG. 6(B) is an enlarged cross-sectional view taken along the chain line B-B' in FIG. 1.

[0098] As shown in FIG. 6(A), the first wiring 200d has a back surface (first surface) 201d in contact with the substrate 100d and a front surface (second surface) 202d facing the opposite side of the back surface 201d. As shown in FIG. 6(B), the second wiring 300d has a back surface (third surface) 303d in contact with the substrate 100d and a front surface (fourth surface) 304d facing the opposite side of the back surface 303d. As shown in FIGS. 6(A) and 6(B), the line width of the front surface 304d of the second wiring 300d is smaller than the line width of the front surface 202d of the first wiring 200d. Also, the line width of the back surface 303d of the second wiring 300d is smaller than the line width of the back surface 201d of the first wiring 200d. By arranging the line widths of the front surface 304d and the back surface 303d of the second wiring 300d to be smaller than the line widths of the front surface 202d and the back surface 201d of the first wiring 200d, respectively, while maintaining the reliability of the first wiring 200d having a radio wave transmission and reception function, the visibility of the spare second wiring 300d corresponding to disconnection or the like of the first wiring 200d can be suppressed. For this reason, the conductivity and transparency of the wiring board 10d can be improved.

[0099] As shown in FIG. 6(A), the line width of the back surface 201d of the first wiring 200d is larger than the line width of the front surface 202d of the first wiring 200d. As shown in FIG. 6(B), the line width of the back surface 303d of the second wiring 300d is larger than the line width of the front surface 304d of the second wiring 300d. In the first wiring 200d and the second wiring 300d, by arranging the line width of the surface in contact with the substrate 100d to be larger than the line width of the surface facing the opposite side of the surface in contact with the substrate 100d, the visibility of the first wiring 200d and the second wiring 300d when viewed in plan in the D1 direction can be suppressed, while improving the adhesion between the substrate 100d and the first wiring 200d and the second wiring 300d. Furthermore, by increasing the cross-sectional area of the first wiring 200d and the second wiring 300d that intersects perpendicularly to the direction in which each wiring extends, the wiring resistance can be suppressed. For this reason, the transparency, reliability, and conductivity of the wiring board 10d can be improved.

[0100] As shown in FIG. 6(A), the first wiring 200d extends in the direction of the first wiring 200d and has a pair of side surfaces (the ninth surface and the tenth surface) 209d and 210d adjacent to the back surface 201d. In the first wiring 200d, the angles formed by the back surface 201d and one side surface 209d, and the back surface 201d and the other side surface 210d are each acute angles. In the first wiring 200d, the angles formed by the back surface 201d and one side surface 209d, and the back surface 201d and the other side surface 210d are the same. One side surface 209d of the first wiring 200d according to this modification is recessed inward (the plus side in the D3 direction). One side surface 209d includes an upper side surface (the eleventh surface) 211d adjacent to the front surface 202d. The other side surface 210d of the first wiring 200d is recessed inward (the minus side in the D3 direction). The other side surface 210d includes an upper side surface (the twelfth surface) 212d adjacent to the front surface 202d. In FIG. 6(A), the angles formed by the front surface 202d and the upper side surface 211d, and the front surface 202d and the upper side surface 212d are approximately 90°. However, it is not limited to this. The angle formed by the front surface 202d and the upper side surface 211d only needs to be smaller than the outer angle of the angle formed by the back surface 201d and one side surface 209d. The angle formed by the front surface 202d and the upper side surface 211d is preferably in the range of 60° or more and 90° or less. The angle formed by the front surface 202d and the upper side surface 212d only needs to be smaller than the outer angle of the angle formed by the back surface 201d and the other side surface 210d. The angle formed by the front surface 202d and the upper side surface 212d is preferably in the range of 60° or more and 90° or less. That is, in the first wiring 200d, one side surface 209d includes a shape (the upper side surface 211d) that connects to the front surface 202d at an angle smaller than the outer angle of the angle formed by the back surface 201d and one side surface 209d. In the first wiring 200d, the other side surface 210d includes a shape (the upper side surface 212d) that connects to the front surface 202d at an angle smaller than the outer angle of the angle formed by the back surface 201d and the other side surface 210d. However, it is not limited to this. One side surface 209d and the other side surface 210d may further include different surfaces, and each surface constituting one side surface 209d and the other side surface 210d may form a corner (intersection line), or may be continuously connected by a curved surface.The first wiring 200d according to this modification extends in a direction orthogonal to the direction of the first wiring 200d, and further has a convex portion d protruding in the surface direction of the surface between the surface 202d and the adjacent surface. That is, the first wiring 200d has a convex portion d protruding in the D3 direction between the surface 202d and the upper side surface 211d, and between the surface 202d and the upper side surface 212d. That is, in a cross section perpendicular to the direction in which the first wiring 200d extends, the first wiring 200d is line-symmetric about its extension direction (D2 direction). In the first wiring 200d, the angle formed by the surface 202d and the upper side surface 211d is smaller than the outer angle of the angle formed by the back surface 201d and one side surface 209d, and the angle formed by the surface 202d and the upper side surface 212d is smaller than the outer angle of the angle formed by the back surface 201d and the other side surface 210d, so that the visibility of the upper side surface 211d and the upper side surface 212d of the first wiring 200d in a plan view in the D1 direction can be suppressed. Further, by increasing the cross-sectional area perpendicular to the direction in which the wiring of the first wiring 200d extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10d can be improved.

[0101] As shown in FIG. 6(B), the second wiring 300d extends in the direction of the second wiring 300d and has a pair of side surfaces (the fifth surface and the sixth surface) 305d, 306d adjacent to the back surface 303d. In the second wiring 300d, the angles formed by the back surface 303d and one side surface 305d, and the back surface 303d and the other side surface 306d are both acute angles. In the second wiring 300d, the angle formed by the back surface 303d and the other side surface 306d is smaller than the angle formed by the back surface 303d and one side surface 305d. One side surface 305d of the second wiring 300d according to this modification is recessed inward (the minus side in the D2 direction). One side surface 305d includes an upper side surface (the seventh surface) 307d adjacent to the front surface 304d. The other side surface 306d of the second wiring 300d is recessed inward (the plus side in the D2 direction). The other side surface 306d includes an upper side surface (the eighth surface) 308d adjacent to the front surface 304d. In FIG. 6(B), the angles formed by the front surface 304d and the upper side surface 307d, and the front surface 304d and the upper side surface 308d are approximately 90°. However, it is not limited to this. The angle formed by the front surface 304d and the upper side surface 307d may be smaller than the outer angle of the angle formed by the back surface 303d and one side surface 305d. The angle formed by the front surface 304d and the upper side surface 307d is preferably in the range of 60° or more and 90° or less. The angle formed by the front surface 304d and the upper side surface 308d may be smaller than the outer angle of the angle formed by the back surface 303d and the other side surface 306d. The angle formed by the front surface 304d and the upper side surface 308d is preferably in the range of 60° or more and 90° or less. That is, in the second wiring 300d, one side surface 305d includes a shape (the upper side surface 307d) that connects to the front surface 304d at an angle smaller than the outer angle of the angle formed by the back surface 303d and one side surface 305d. In the second wiring 300d, the other side surface 306d includes a shape (the upper side surface 308d) that connects to the front surface 304d at an angle smaller than the outer angle of the angle formed by the back surface 303d and the other side surface 306d. However, it is not limited to this. The one side surface 305d and the other side surface 306d may further include different surfaces. Each surface constituting the one side surface 305d and the other side surface 306d may form a corner (intersection line), or may be continuously connected by a curved surface.The second wiring 300d according to this modification extends in a direction orthogonal to the direction of the second wiring 300d, and further has a convex portion d protruding in the surface direction of the surface between the surface 304d and the adjacent surface. That is, the second wiring 300d has a convex portion d protruding in the D2 direction between the surface 304d and the upper side surface 307d, and between the surface 202d and the upper side surface 308d. In a cross section perpendicular to the direction in which the second wiring 300d extends, the second wiring 300d is asymmetric about its extension direction (D3 direction). In the second wiring 300d, by arranging the angle formed by the back surface 303d and the other side surface 306d to be smaller than the angle formed by the back surface 303d and one side surface 305d, the line width of the back surface 303d becomes larger, and while suppressing the visibility of one side surface 305d of the second wiring 300d when viewed in the plane in the D1 direction, the adhesion between the substrate 100d and the second wiring 300d can be improved. In the second wiring 300d, the angle formed by the surface 304d and the upper side surface 307d is smaller than the external angle of the angle formed by the back surface 303d and one side surface 305d, and the angle formed by the surface 304d and the upper side surface 308d is smaller than the external angle of the angle formed by the back surface 303d and the other side surface 306d, so that the visibility of the upper side surface 307d and the upper side surface 308d of the second wiring 300d when viewed in the plane in the D1 direction can be suppressed. Furthermore, by increasing the cross-sectional area perpendicular to the direction in which the wiring of the second wiring 300d extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring substrate 10d can be improved.

[0102] As described above, in the wiring board 10d according to this modified example, by arranging the line width of the surface 304d of the second wiring 300d on the substrate 100d to be smaller than the line width of the surface 202d of the first wiring 200d, while maintaining the reliability of the first wiring 200d having a radio wave transmission and reception function, the visibility of the second wiring 300d when viewed in plan in the D1 direction can be suppressed. In the first wiring 200d and the second wiring 300d, by arranging the line width of the surface in contact with the substrate 100d to be larger than the surface facing the opposite side of the surface in contact with the substrate 100d, while suppressing the visibility of the first wiring 200d and the second wiring 300d when viewed in plan in the D1 direction, the adhesion between the substrate 100d and the first wiring 200d and the second wiring 300d can be improved. In the first wiring 200d, the angle formed by the surface 202d and the upper side surface 211d is smaller than the outer angle of the angle formed by the back surface 201d and one side surface 209d, and the angle formed by the surface 202d and the upper side surface 212d is smaller than the outer angle of the angle formed by the back surface 201d and the other side surface 210d, so that the visibility of the upper side surfaces 211d and 212d of the first wiring 200d when viewed in plan in the D1 direction can be suppressed. In the second wiring 300d, by arranging the angle formed by the back surface 303d and the other side surface 306d to be smaller than the angle formed by the back surface 303d and one side surface 305d, while suppressing the visibility of one side surface 305d of the second wiring 300d when viewed in plan in the D1 direction, the adhesion between the substrate 100d and the second wiring 300d can be improved. In the second wiring 300d, the angle formed by the surface 304d and the upper side surface 307d is smaller than the outer angle of the angle formed by the back surface 303d and one side surface 305d, and the angle formed by the surface 304d and the upper side surface 308d is smaller than the outer angle of the angle formed by the back surface 303d and the other side surface 306d, so that the visibility of the upper side surfaces 307d and 308d of the second wiring 300d when viewed in plan in the D1 direction can be suppressed. Furthermore, by increasing the cross-sectional area where each wiring of the first wiring 200d and the second wiring 300d intersects perpendicularly to the direction in which the wiring extends, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10d can be improved.

[0103] The wiring board 10d according to this modification example can be mounted on a display device as a wireless communication module by being connected to a circuit for wireless communication. By arranging the board 100d on the upper surface of the display area so as to face the display area of the display device, the visibility of the first wiring 200d and the second wiring 300d when viewed in a plan view in the D1 direction can be suppressed. The wiring board 10d is arranged such that the direction of the first wiring 200 is in the vertical direction of the display area and the upper side surface 307d of the second wiring 300d is in the upward direction (the light incident direction) of the display area, thereby suppressing the reflection of light by the other side surface 306d of the second wiring 300d. When the wiring board 10d is arranged on the upper surface of the display area, a protective film is arranged so as to cover the upper surface of the board 100d. Since the first wiring 200d and the second wiring 300d have convex portions d, the adhesion between the first wiring 200d and the second wiring 300d and the protective film can be improved. Therefore, a display device including a wiring board having a radio wave transmission and reception function with improved transparency, reliability, and conductivity can be provided.

[0104] <Fifth Modification Example> The wiring board 10e according to this modification example includes a board 100e similar to the wiring board 10 according to the form shown in FIGS. 1 and 2, a first wiring 200e, and a second wiring 300e. The wiring board 10e according to this modification example includes a curved surface (curved portion) e at the intersection of the first wiring 200e and the second wiring 300e.

[0105] The configuration of the wiring board 10e according to this modification example will be described with reference to FIGS. 7 and 8. Here, the configuration of the wiring board 10e according to this modification example is the same as the configuration of the wiring board 10 shown in FIGS. 1 and 2 except for the curved surface e at the intersection of the first wiring 200e and the second wiring 300e. Therefore, the detailed description of the parts that are the same as the form shown in FIGS. 1 and 2 will be omitted.

[0106] [Configuration of Wiring Board] FIG. 7 is a top view showing an example of the wiring board according to this modified example. FIG. 7 is an enlarged top view of region C in FIG. 1. FIG. 8 is a cross-sectional view showing an example of the wiring board according to this modified example. FIG. 8(A) is an enlarged cross-sectional view taken along the dashed line D-D' in FIG. 7. FIG. 8(B) is an enlarged cross-sectional view taken along the dashed line E-E' in FIG. 7.

[0107] As shown in FIG. 7, the wiring board 10e includes a substrate 100e, a first wiring 200e, and a second wiring 300e. In this modified example, the first wiring 200e and the second wiring 300e are orthogonal to each other. However, it is not limited thereto, and the planar shapes of the first wiring 200e and the second wiring 300e may intersect or be connected. As shown in FIGS. 7 and 8, the upper surface of the substrate 100e, the side surface adjacent to the back surface (first surface) 201e of the first wiring 200e, and the side surface adjacent to the back surface (third surface) 303e of the second wiring 300e form four corners in a plan view. In this modified example, at the corner formed by the upper surface of the substrate 100e, the other side surface (tenth surface) 210e of the first wiring 200e, and the other side surface (sixth surface) 306e of the second wiring 300e, a curved surface e that connects these surfaces continuously is included. That is, the curved surface e continuously connects the other side surface 210e of the first wiring 200e and the other side surface 306e of the second wiring 300e. This curved surface e has a shape curved inward in any cross section perpendicular to the direction of the first wiring 200e and any cross section perpendicular to the direction of the second wiring 300e. However, it is not limited thereto, and the curved surface e may be disposed at one or more of the four corners in a plan view formed by the upper surface of the substrate 100e, the side surface adjacent to the back surface 201e of the first wiring 200e, and the side surface adjacent to the back surface 303e of the second wiring 300e. That is, in a cross section perpendicular to the direction of the first wiring 200e at the corner including the curved surface e, the first wiring 200e is asymmetric about its longitudinal direction (D2 direction). In a cross section perpendicular to the direction of the second wiring 300e at the corner including the curved surface e, the second wiring 300e is asymmetric about its longitudinal direction (D3 direction). In a cross section perpendicular to the direction of the second wiring 300e, the radius of curvature of the curved surface e is preferably 20% or more of the height of the second wiring 300e.

[0108] At the corner formed by the upper surface of the substrate 100e, the side surface adjacent to the back surface 201e of the first wiring 200e, and the side surface adjacent to the back surface 303e of the second wiring 300e, by having the curved surface e, the line widths of the back surface 201e and the back surface 303e become larger, and the adhesion between the substrate 100e and the first wiring 200e, and between the substrate 100e and the second wiring 300e can be improved. Further, by increasing the cross-sectional area where the respective wirings of the first wiring 200e and the second wiring 300e intersect perpendicularly to the direction in which the wiring extends, while suppressing the visibility of the surface (second surface) 202e of the first wiring 200e and the surface (fourth surface) 304e of the second wiring 300e when viewed in plan in the D1 direction, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10e can be improved.

[0109] The wiring board 10e according to this modification example can be mounted on a display device as a wireless communication module by being connected to a circuit for wireless communication. The wiring board 10e is arranged on the upper surface of the display area so that the substrate 100e faces the display area of the display device, thereby suppressing the visibility of the first wiring 200e and the second wiring 300e when viewed in plan in the D1 direction. The wiring board 10e is arranged such that the direction of the first wiring 200e is in the vertical direction of the display area and the curved surface e is in the downward direction of the display area, thereby suppressing the reflection of light by the curved surface e. Therefore, a display device including a wiring board having an improved radio wave transmission and reception function with improved transparency, reliability, and conductivity can be provided.

[0110] <Sixth Modification Example> The wiring board 10f according to this modification example has a substrate 100f similar to the wiring board 10a (FIG. 3) according to the first modification example, a first wiring 200f, and a second wiring 300f. The wiring board 10f according to this modification example includes a curved surface f at the intersection of the first wiring 200f and the second wiring 300f.

[0111] The configuration of the wiring board 10f according to this modified example will be described with reference to FIGS. 9 and 10. Here, the configuration of the wiring board 10f according to this modified example is the same as the configuration of the wiring board 10a according to the first modified example shown in FIG. 3, except for the curved surface f at the intersection of the first wiring 200f and the second wiring 300f. For this reason, the parts that are the same as those in the first modified example will not be described in detail.

[0112] [Configuration of Wiring Board] FIG. 9 is a top view showing an example of the wiring board according to this modified example. FIG. 9 is an enlarged top view of the region C in FIG. 1. FIG. 10 is a cross-sectional view showing an example of the wiring board according to this modified example. FIG. 10(A) is an enlarged cross-sectional view taken along the chain line D-D' in FIG. 9. FIG. 10(B) is an enlarged cross-sectional view taken along the chain line E-E' in FIG. 9.

[0113] As shown in FIG. 9, the wiring board 10f includes a substrate 100f, a first wiring 200f, and a second wiring 300f. In this modification, the first wiring 200f and the second wiring 300f are orthogonal to each other. However, it is not limited thereto, and the planar shapes of the first wiring 200f and the second wiring 300f may intersect or be connected. As shown in FIGS. 9 and 10, the upper surface of the substrate 100f, the side surface adjacent to the back surface (first surface) 201f of the first wiring 200f, and the side surface adjacent to the back surface (third surface) 303f of the second wiring 300f form four corners in a plan view. In this modification, at the corner formed by the upper surface of the substrate 100f, one side surface (ninth surface) 209f of the first wiring 200f, and the other side surface (sixth surface) 306f of the second wiring 300f, a curved surface f that connects these surfaces continuously is included. That is, the curved surface f continuously connects one side surface 209f of the first wiring 200f and the other side surface 306f of the second wiring 300f. Further, at the corner formed by the upper surface of the substrate 100f, the other side surface (tenth surface) 210f of the first wiring 200f, and the other side surface 306f of the second wiring 300f, a curved surface f that connects these surfaces continuously is included. That is, the curved surface f continuously connects the other side surface 210f of the first wiring 200f and the other side surface 306f of the second wiring 300f. However, it is not limited thereto, and the curved surface f may be disposed at one or more of the four corners in a plan view formed by the upper surface of the substrate 100f, the side surface adjacent to the back surface 201f of the first wiring 200f, and the side surface adjacent to the back surface 303f of the second wiring 300f. It is more preferable that the curved surface f is disposed at one or more of the two corners formed by the upper surface of the substrate 100f, the side surface adjacent to the back surface 201f of the first wiring 200f, and the other side surface 306f of the second wiring 300f. That is, in a cross section perpendicular to the direction of the first wiring 200f at the corner including the curved surface f, the first wiring 200f is line-symmetric about its longitudinal direction (D2 direction). In a cross section perpendicular to the direction of the second wiring 300f at the corner including the curved surface f, the second wiring 300f is asymmetric about its longitudinal direction (D3 direction). In a cross section perpendicular to the direction of the second wiring 300e, the radius of curvature of the curved surface f is preferably 20% or more of the height of the second wiring 300e.

[0114] By having the curved surface f at the corner formed by the upper surface of the substrate 100f, the side surface adjacent to the back surface 201f of the first wiring 200f, and the other side surface 306f of the second wiring 300f, the line widths of the back surface 201f and the back surface 303f become larger, and the adhesion between the substrate 100f and the first wiring 200f, and between the substrate 100f and the second wiring 300f can be improved. Furthermore, by increasing the cross-sectional area where the respective wirings of the first wiring 200f and the second wiring 300f intersect perpendicularly to the direction in which the wirings extend, while suppressing the visibility of the surface (second surface) 202f of the first wiring 200f and the surface (fourth surface) 304f of the second wiring 300f when viewed in plan in the D1 direction, the wiring resistance can be suppressed. Therefore, the transparency, reliability, and conductivity of the wiring board 10f can be improved.

[0115] The wiring board 10f according to this modification can be mounted on a display device as a wireless communication module by being connected to a circuit for wireless communication. By arranging the substrate 100f on the upper surface of the display area so as to face the display area of the display device, the visibility of the first wiring 200f and the second wiring 300f when viewed in plan in the D1 direction can be suppressed. By arranging the wiring board 10f such that the direction of the first wiring 200f is in the vertical direction of the display area and the curved surface f is downward in the display area, the reflection of light by the curved surface f can be suppressed. Therefore, a display device including a wiring board having an improved radio wave transmission and reception function with improved transparency, reliability, and conductivity can be provided.

[0116] [Manufacturing method of wiring board 10] The manufacturing method of the wiring board according to the present embodiment and each modification will be described with reference to FIGS. 11 and 12. In FIGS. 11 and 12, the same elements as those shown in the above embodiment and each modification are denoted by the same reference numerals. Here, the parts that are the same as those shown in FIGS. 1 to 10 are not described in detail.

[0117] FIG. 11(A) is a diagram showing the step of forming a conductive layer 400 on the upper surface of a substrate 100 in the method for manufacturing a wiring board according to the present embodiment. As shown in FIG. 11(A), the conductive layer 400 is formed on substantially the entire surface of the substrate 100. In the present embodiment, the thickness of the conductive layer 400 is 200 nm. However, it is not limited thereto, and the thickness of the conductive layer 400 can be appropriately selected within the range of 10 nm or more and 1000 nm or less. In the present embodiment, the conductive layer 400 is formed by a sputtering method using copper. As a method for forming the conductive layer 400, a plasma CVD method can also be used.

[0118] FIG. 11(B) is a diagram showing the step of forming an insulating layer 500 on the upper surface of a substrate 100 in the method for manufacturing a wiring board according to the present embodiment. As shown in FIG. 11(B), the insulating layer 500 is formed on substantially the entire surface of the substrate 100. The thickness of the insulating layer 500 is 1200 nm. However, it is not limited thereto, and the thickness of the insulating layer 500 can be appropriately selected within the range of 500 nm or more and 2500 nm or less. The insulating layer 500 may be a material having electrical insulation properties.

[0119] FIG. 11(C) is a diagram showing the step of forming a first trench 510 for arranging a first wiring 200 and a second trench 520 (not shown) for arranging a second wiring 300 on the upper surface of the insulating layer 500 in the method for manufacturing a wiring board according to the present embodiment. As shown in FIG. 11(C), in the present embodiment, the first trench 510 and the second trench 520 are formed by an imprint method. The insulating layer 500 is softened, and a mold 600 having protrusions corresponding to the first trench 510 and the second trench 520 is pressed in. In that state, the insulating layer 500 is cured, and by peeling the mold 600 from the insulating layer 500, the insulating layer 500 having the cross-sectional structure shown in FIG. 11(D) can be obtained.

[0120] The first trench 510 corresponds to the first wiring 200, and the second trench 520 corresponds to the second wiring 300. Therefore, the first trench 510 extending in the first direction and the second trench 520 extending in the second direction are orthogonal to each other. Also, the first trench 510 is longer than the second trench 520, and the opening width of the first trench 510 is formed to be larger than the opening width of the second trench 520. Here, the opening width means the width in the opening parallel to the upper surface of the substrate 100 in a cross section intersecting perpendicularly to the direction in which each trench extends. The aspect ratios of the first trench 510 and the second trench 520 can be appropriately selected according to the application. Here, the aspect ratios of the first trench 510 and the second trench 520 are defined as the depth with respect to the opening width. If the aspect ratios of the first trench 510 and the second trench 520 are too small, it becomes difficult to form the fine patterns of the first wiring 200 and the second wiring 300 on the wiring substrate 10. If the aspect ratios of the first trench 510 and the second trench 520 are too large, it becomes difficult to fill the conductors into the first trench 510 and the second trench 520. Note that the opening width of the first trench 510 may be the same as the opening width of the second trench 520.

[0121] When forming the first trench 510 and the second trench 520 by the imprint method, the direction in which the mold 600 is peeled off from the insulating layer 500 is preferably the direction in which the longer first wiring 200 (the first trench 510) extends. More preferably, the direction in which the mold 600 is peeled off from the insulating layer 500 is the direction from one side surface 305 to the other side surface 306 of the second wiring 300. That is, more preferably, the direction in which the mold 600 is peeled off from the insulating layer 500 is from the first side 102 to the second side 104 of the substrate 100 (the direction of the first wiring 200, the first direction, the reverse direction of D2). By forming the insulating layer 500 in this way, the cross-sectional shapes of the first wiring 200 and the second wiring 300 according to the above-described embodiments and each modification can be formed. However, it is not limited thereto, and in the method for manufacturing the wiring board 10 according to the above-described embodiments and each modification, the insulating layer 500 may be formed by a photolithography method. In this case, a resist pattern is formed by the photolithography method so as to expose the conductive layer 400 in the region where the first wiring 200 and the second wiring 300 are formed.

[0122] As shown in FIG. 11(D), residues of the insulating material may remain at the bottoms of the first trench 510 and the second trench 520 formed in the insulating layer 500. Therefore, wet processing using a permanganate solution or N-methyl-2-pyrrolidone, or dry processing using oxygen plasma is performed to remove the residues of the insulating material. By removing the residues of the insulating material, the first trench 510 and the second trench 520 exposing the conductive layer 400 as shown in FIG. 12(A) can be formed.

[0123] FIG. 12(B) is a diagram showing a step of forming a first conductor 410 corresponding to the first wiring 200 and a second conductor 420 (not shown) corresponding to the second wiring 300 in the method for manufacturing a wiring board according to the present embodiment. The first trench 510 and the second trench 520 of the insulating layer 500 formed in FIG. 12(A) are filled with the first conductor 410 and the second conductor 420. In the present embodiment, the first trench 510 and the second trench 520 of the insulating layer 500 are filled with copper using an electrolytic plating method with the conductive layer 400 as a seed layer. Further, the first conductor 410 and the second conductor 420 are formed so as to protrude from the upper surface of the insulating layer 500 (opposite to the substrate 100). The first conductor 410 and the second conductor 420 are formed larger than the opening width of the first trench 510 and the opening width of the second trench 520 on the upper surface of the insulating layer 500. In the present embodiment, the protruding portions of the first conductor 410 and the second conductor 420 are formed in a semi-circular shape in a cross-sectional view, and the cross-sectional shapes of the first conductor 410 and the second conductor 420 are formed in a mushroom shape. However, the present invention is not limited thereto, and the first conductor 410 and the second conductor 420 may protrude in the surface direction of the insulating layer 500 and in the stacking direction from the opening width on the upper surface of the insulating layer 500. For example, the protruding portions of the first conductor 410 and the second conductor 420 may be formed in a rectangular parallelepiped shape, and the cross-sectional shapes of the first conductor 410 and the second conductor 420 may be formed in a T shape. The height in the stacking direction (D1 direction) of the first conductor 410 and the second conductor 420 on the upper surface of the insulating layer 500 is preferably 5% or more and 80% or less of the height in the stacking direction (D1 direction) of the first trench 510 and the second trench 520.

[0124] FIG. 12(C) is a diagram showing a step of removing the insulating layer 500 in the method for manufacturing a wiring board according to the present embodiment. As shown in FIG. 12(C), the insulating layer 500 on the substrate 100 is removed by performing wet treatment using a permanganate solution or N-methyl-2-pyrrolidone, or dry treatment using oxygen plasma.

[0125] FIG. 12(D) is a diagram showing a process of removing the conductive layer 400 in the method for manufacturing a wiring board according to the present embodiment. As shown in FIG. 12(D), the conductive layer 400 is etched by performing wet processing using hydrogen peroxide water so that the upper surface of the substrate 100 is exposed. At this time, the first conductor 410 and the second conductor 420 are also formed by etching. By forming the first conductor 410 and the second conductor 420 in this way, the cross-sectional shapes of the first wiring 200 and the second wiring 300 according to the above-described embodiment and each modification can be formed.

[0126] Although not shown in the figure, it is preferable to blacken the surfaces of the first wiring 200 and the second wiring 300 other than the surfaces in contact with the substrate 100. In the present embodiment, the surface (second surface) 202 of the first wiring 200 and the surface (fourth surface) 304 of the second wiring 300 are blackened by forming copper oxide, which is an oxide film of each wiring material. By blackening the surfaces of the first wiring 200 and the second wiring 300, light reflection of the first wiring 200 and the second wiring 300 can be suppressed, and external light absorption and contrast improvement of the wiring board 10 can be achieved.

[0127] As described above, according to the method for manufacturing the wiring board 10 according to the present embodiment, the first wiring 200 and the second wiring 300 according to the above-described embodiment and each modification can be formed by a simple method of forming a conductor thicker than the insulating layer in the stacking direction and forming it by wet etching. Therefore, a wiring board 10 with improved transparency, reliability, and conductivity can be manufactured.

[0128] Next, a modification of the method for manufacturing a wiring board will be described with reference to FIGS. 13(A)-(D). FIGS. 13(A)-(D) are diagrams showing a modification of the method for manufacturing a wiring board and are diagrams corresponding to FIGS. 12(A)-(D).

[0129] First, in the same manner as the steps shown in FIGS. 11(A)-(D) described above, the first trench 510 and the second trench 520 in which the conductive layer 400 is exposed are formed (FIG. 13(A)).

[0130] Next, as shown in FIG. 13(B), a first conductor 410 corresponding to the first wiring 200 and a second conductor 420 (not shown) corresponding to the second wiring 300 are formed. That is, using the conductive layer 400 as a seed layer and the electrolytic plating method, the first trench 510 and the second trench 520 of the insulating layer 500 are filled with copper. In this case, the first conductor 410 and the second conductor 420 are formed to be lower than the upper surface of the insulating layer 500 (opposite side to the substrate 100). At this time, the upper surfaces of the first conductor 410 and the second conductor 420 are formed in a semicircular shape in cross section.

[0131] Subsequently, as shown in FIG. 13(C), the insulating layer 500 on the substrate 100 is removed by performing wet processing using, for example, a permanganate solution or N-methyl-2-pyrrolidone, or dry processing using oxygen plasma.

[0132] Thereafter, as shown in FIG. 13(D), the conductive layer 400 is etched so that the upper surface of the substrate 100 is exposed by performing wet processing using, for example, hydrogen peroxide water. At this time, the first conductor 410 and the second conductor 420 are also formed by etching. Specifically, by appropriately setting etching conditions (type of etching solution, concentration, etching time, etc.), the shapes of the first conductor 410 and the second conductor 420 (such as the shape of the side surface and the shape of the curved surface) can be adjusted. In this way, the cross-sectional shapes of the first wiring 200 and the second wiring 300 according to the above-described embodiments and each modification can be formed.

[0133] Next, an example of a wireless communication module in which a wireless communication circuit is connected to the wiring board according to the above-described embodiments and each modification will be described. The configuration of the wireless communication module 20A according to the present embodiment will be described with reference to FIG. 14. Here, parts that are the same as those shown in FIGS. 1 to 13 are not described in detail.

[0134] [Configuration of Wireless Communication Module] FIG. 14 is a top view showing an example of the wireless communication module according to the present embodiment. As shown in FIG. 14, the wireless communication module 20A includes a wiring board 10g and a circuit 700g. The circuit 700g is a circuit for wireless communication and is connected to a plurality of first wirings 200g of the wiring board 10g.

[0135] The wiring board 10g includes a board 100g, a first wiring 200g, and a second wiring 300g. The first wiring 200g and the second wiring 300g are disposed on the upper surface of the board 100g. In the present embodiment, four first wirings 200g and four second wirings 300g are arranged, but the present invention is not limited thereto. Two or more first wirings 200g and one or more second wirings 300g may be arranged.

[0136] As shown in FIG. 14, the planar shape of the first wiring 200g viewed in the D1 direction is exemplified by a line-and-space shape in which a plurality of lines independently extend from the first side 102 of the substrate 100g toward the second side 104 opposite to the first side 102 (the longitudinal direction of the first wiring 200g, the first direction, the D2 reverse direction). The planar shape of the second wiring 300g viewed in the D1 direction is exemplified by a line-and-space shape in which a plurality of lines independently extend in a direction orthogonal to the direction of the first wiring 200g (the longitudinal direction of the second wiring 300g, the second direction, the D3 direction). That is, a regular lattice or mesh shape is formed by the first wiring 200g extending in the first direction and the second wiring 300g extending in the second direction. The plurality of first wirings 200g and the plurality of second wirings 300g are orthogonal to each other. The first wiring 200g is longer than the second wiring 300g. Also, the interval between the plurality of second wirings 300g is larger than the interval between the plurality of first wirings 200g. However, it is not limited to this shape, and the planar shapes of the first wiring 200g and the second wiring 300g may be such that a plurality of lines intersect or connect with each other. For example, the direction of the first wiring 200g and the direction of the second wiring 300g may intersect at an acute angle or an obtuse angle. Also, this repeating shape may not be uniform on the substrate 100g. Here, when the region where the plurality of first wirings 200g and the plurality of second wirings 300g are not arranged on the upper surface of the substrate 100g is taken as the opening of the wiring substrate 10g, the aperture ratio (visible light transmittance) is preferably 80% or more. If the aperture ratio is less than 80%, the permeability of the wiring substrate 10g deteriorates. By arranging the interval between the plurality of second wirings 300g to be larger than the interval between the plurality of first wirings 200g, it is possible to suppress the visibility of the spare second wiring 300g for coping with disconnection of the first wiring 200g while maintaining the conductivity of the first wiring 200g having a radio wave transmission and reception function. Therefore, the conductivity and transparency of the wiring substrate 10g can be improved.

[0137] FIG. 15 is a top view showing an example of a wireless communication module according to a modified example. As shown in FIG. 15, the wireless communication module 20A is, for example, a module for NFC (Near Field Communication), and includes a wiring board 10g and a circuit 700g. In this case, the wiring board 10g has a wiring area 106g formed in a spiral shape in a plan view as a whole. This wiring area 106g includes a plurality of first wirings 200g and a plurality of second wirings 300g. That is, inside the wiring area 106g, the first wiring 200g and the second wiring 300g are formed in a mesh shape or a lattice shape. In this case, since the transparency of the wiring board 10g is enhanced, it is possible to arrange, for example, the wiring board 10g for NFC on the display screen.

[0138] Note that the present disclosure is not limited to the above-described embodiments, and can be appropriately modified without departing from the gist. Each of the embodiments described above as embodiments of the present disclosure can be implemented in appropriate combination as long as they do not contradict each other. Further, based on the wiring board of each embodiment, those in which a person skilled in the art has appropriately added, deleted, or changed the design of components, or added, omitted, or changed the conditions of the process are also included in the scope of the present invention as long as they have the gist of the present invention.

[0139] Other operational effects different from those brought about by the aspects of the above-described embodiments are also naturally understood to be brought about by the present invention as long as they are apparent from the description in this specification or can be easily predicted by those skilled in the art.

[0140] [Example] The structures of the first wiring 200 and the second wiring 300 included in the wiring board according to one embodiment of the present disclosure described above will be described in more detail.

[0141] [Reference Example 1] The parameters of the first wiring 200 and the second wiring 300 in the wiring board according to Reference Example 1 are as follows. Width of the first wiring 200: 1 μm Height of the first wiring 200: 1 μm Pitch of the first wiring 200: 20 μm Width of the second wiring 300: 2 μm Height of the second wiring 300: 1 μm Pitch of the second wiring 300: 20 μm

[0142] Since the wiring board according to Reference Example 1 of the present disclosure is the same as the wiring board according to the sixth modification (Figs. 9 and 10) except for the width and pitch (pitch) of each wiring, its detailed description is omitted. Since the manufacturing process of the wiring board is the same as the form shown in Figs. 11 to 13, the description is omitted.

[0143] Using the wiring board of Reference Example 1, the intersection of the first wiring 200 and the second wiring 300 was observed with an electron microscope (SEM). Fig. 16 shows a photograph of the upper surface of the wiring board of Reference Example 1 observed using an electron microscope (SEM). Fig. 17 shows a photograph of the intersection of the first wiring 200 and the second wiring 300 of Reference Example 1 observed using an electron microscope (SEM).

[0144] Fig. 17 is an electron micrograph of the intersection of the first wiring 200 and the second wiring 300 in Reference Example 1. As shown in Figs. 17(A) and (B), the wiring board 10 according to Reference Example 1 includes two curved surfaces at the intersection of the first wiring 200 and the second wiring 300. It was observed that at the corner formed by the upper surface of the substrate 100, one side surface 209 of the first wiring 200, and the other side surface 306 of the second wiring 300, a continuous curved surface f is included on those surfaces. Furthermore, it was observed that at the corner formed by the upper surface of the substrate 100, the other side surface 210 of the first wiring 200, and the other side surface 306 of the second wiring 300, a continuous curved surface f is included on those surfaces.

[0145] <Second Embodiment> Next, the second embodiment will be described with reference to Figs. 18 to 37. Figs. 18 to 37 are diagrams showing the second embodiment.

[0146] In this embodiment, the "X direction" is a direction perpendicular to the longitudinal direction of the antenna pattern region and perpendicular to the direction of the length corresponding to the frequency band of the antenna wiring. The "Y direction" is a direction perpendicular to the X direction and parallel to the longitudinal direction of the antenna pattern region, and parallel to the direction of the length corresponding to the frequency band of the antenna wiring. The "Z direction" is a direction perpendicular to both the X direction and the Y direction and parallel to the thickness direction of the wiring substrate. Further, the "front surface" refers to the surface on the positive side in the Z direction, which is the surface on which the antenna wiring is provided with respect to the substrate. The "back surface" refers to the surface on the negative side in the Z direction, which is the surface opposite to the surface on which the antenna wiring is provided with respect to the substrate. In this embodiment, the case where the wiring pattern region 20 is the antenna pattern region 20 having a radio wave transmitting and receiving function (function as an antenna) will be described as an example, but the wiring pattern region 20 may not have a radio wave transmitting and receiving function (function as an antenna).

[0147] [Configuration of Wiring Substrate] With reference to FIGS. 18 to 22, the configuration of the wiring substrate according to this embodiment will be described. FIGS. 18 to 22 are diagrams showing the wiring substrate according to this embodiment.

[0148] As shown in FIG. 18, the wiring substrate 10 according to this embodiment is, for example, arranged on the display of an image display device. Such a wiring substrate 10 includes a substrate 11 having transparency, an antenna pattern region (wiring pattern region) 20 arranged on the substrate 11, and a dummy pattern region 30 arranged around the antenna pattern region 20 on the substrate 11. Further, a power supply unit 40 is electrically connected to the antenna pattern region 20.

[0149] Among these, the substrate 11 is substantially rectangular in plan view, with its longitudinal direction parallel to the Y direction and its short-side direction parallel to the X direction. The substrate 11 is transparent and substantially flat-plate-shaped, and its thickness is substantially uniform as a whole. The length L1 of the substrate 11 in the longitudinal direction (Y direction) can be selected, for example, in the range of 100 mm or more and 200 mm or less, and the length L2 of the substrate 11 in the short-side direction (X direction) can be selected, for example, in the range of 50 mm or more and 100 mm or less.

[0150] The material of the substrate 11 may be any material having transparency and electrical insulation in the visible light region. In this embodiment, the material of the substrate 11 is polyethylene terephthalate, but it is not limited thereto. As the material of the substrate 11, for example, polyester-based resins such as polyethylene terephthalate, acrylic-based resins such as polymethyl methacrylate, polycarbonate-based resins, polyimide-based resins, or polyolefin-based resins such as cycloolefin polymers, and organic insulating materials such as cellulose-based resin materials such as triacetyl cellulose are preferably used. Further, as the material of the substrate 11, glass, ceramics, etc. can be appropriately selected according to the application. Although an example in which the substrate 11 is composed of a single layer is illustrated, it is not limited thereto, and a structure in which a plurality of base materials or layers are laminated may be used. Also, the substrate 11 may be in the form of a film or a plate. For this reason, the thickness of the substrate 11 is not particularly limited and can be appropriately selected according to the application. As an example, the thickness T1 (see FIG. 20) of the substrate 11 in the Z direction can be, for example, in the range of 10 μm or more and 200 μm or less.

[0151] In FIG. 18, a plurality (three) of antenna pattern regions 20 are formed on the substrate 11, each corresponding to a different frequency band. That is, the plurality of antenna pattern regions 20 have lengths L a that are different from each other and have lengths corresponding to specific frequency bands. Note that the lower the corresponding frequency band, the longer the length L of the antenna pattern region 20 ais long. When the wiring board 10 is arranged on, for example, a display 91 (see FIG. 24 described later) of an image display device 90, each antenna pattern region 20 may correspond to any one of a telephone antenna, a WiFi antenna, a 3G antenna, a 4G antenna, an LTE antenna, a Bluetooth (registered trademark) antenna, an NFC antenna, etc. when it has a radio wave transmission and reception function. Alternatively, when the wiring board 10 does not have a radio wave transmission and reception function, each wiring pattern region 20 may perform functions such as hovering (a function that allows the user to operate without directly touching the display), fingerprint authentication, a heater, noise cut (shield), etc.

[0152] Each antenna pattern region 20 is substantially rectangular in plan view. The longitudinal direction of each antenna pattern region 20 is parallel to the Y direction, and the short side direction thereof is parallel to the X direction. The length L of each antenna pattern region 20 in the longitudinal direction (Y direction) a can be selected, for example, in the range of 3 mm or more and 100 mm or less, and the width W of each antenna pattern region 20 in the short side direction (X direction) a can be selected, for example, in the range of 1 mm or more and 10 mm or less.

[0153] In each antenna pattern region 20, a metal wire is formed in a lattice shape or a mesh shape and has a uniform repeating pattern in the X direction and the Y direction. That is, as shown in FIG. 19, the antenna pattern region 20 is composed of a repetition of an L-shaped unit pattern shape 20a composed of a portion extending in the X direction (a part of an antenna connection wiring 22 described later) and a portion extending in the Y direction (a part of an antenna wiring 21 described later).

[0154] As shown in FIG. 19, each antenna pattern region 20 includes a plurality of antenna wirings (wirings) 21 having a function as an antenna and a plurality of antenna connection wirings (connection wirings) 22 connecting the plurality of antenna wirings 21. Specifically, the plurality of antenna wirings 21 and the plurality of antenna connection wirings 22 are integrally formed as a whole to form a regular lattice shape or mesh shape. Each antenna wiring 21 extends in a direction (Y direction) corresponding to the frequency band of the antenna, and each antenna connection wiring 22 extends in a direction (X direction) orthogonal to the antenna wiring 21. The antenna wiring 21 has a length L a (the length of the antenna pattern region 20 described above), thereby mainly exhibiting the function as an antenna. On the other hand, the antenna connection wiring 22 plays a role of suppressing problems such as disconnection of the antenna wiring 21 or loss of electrical connection between the antenna wiring 21 and the power supply unit 40 by connecting these antenna wirings 21 to each other.

[0155] In each antenna pattern region 20, a plurality of openings 23 are formed by being surrounded by adjacent antenna wirings 21 and adjacent antenna connection wirings 22. Also, the antenna wirings 21 and the antenna connection wirings 22 are arranged at equal intervals from each other. That is, the plurality of antenna wirings 21 are arranged at equal intervals from each other, and the pitch P1 thereof can be in a range of, for example, 0.01 mm or more and 1 mm or less. Also, the plurality of antenna connection wirings 22 are arranged at equal intervals from each other, and the pitch P2 thereof can be in a range of, for example, 0.01 mm or more and 1 mm or less. Thus, since the plurality of antenna wirings 21 and the plurality of antenna connection wirings 22 are each arranged at equal intervals, the size of the openings 23 does not vary within each antenna pattern region 20, and the antenna pattern region 20 can be made difficult to visually recognize with the naked eye. Also, the pitch P1 of the antenna wirings 21 is equal to the pitch P2 of the antenna connection wirings 22. For this reason, each opening 23 is substantially square in plan view, and the transparent substrate 11 is exposed from each opening 23. For this reason, by widening the area of each opening 23, the transparency of the entire wiring substrate 10 can be enhanced. Note that the length L3 of one side of each opening 23 can be in a range of, for example, 0.01 μm or more and 1 μm or less. Note that each antenna wiring 21 and each antenna connection wiring 22 are orthogonal to each other, but are not limited thereto, and may intersect at an acute angle or an obtuse angle with each other. Also, the shape of the opening 23 is preferably the same shape and the same size throughout, but may not be uniform throughout, such as being changed depending on the location.

[0156] As shown in FIG. 20, each antenna wiring 21 has a substantially rectangular or substantially square cross section (X-direction cross section) perpendicular to its longitudinal direction. In this case, the cross-sectional shape of the antenna wiring 21 is substantially uniform along the longitudinal direction (Y direction) of the antenna wiring 21. Further, as shown in FIG. 21, the shape of the cross section (Y-direction cross section) perpendicular to the longitudinal direction of each antenna connection wiring 22 is substantially rectangular or substantially square, and is substantially the same as the cross-sectional shape (X-direction cross section) of the antenna wiring 21 described above. In this case, the cross-sectional shape of the antenna connection wiring 22 is substantially uniform along the longitudinal direction (X direction) of the antenna connection wiring 22. The cross-sectional shapes of the antenna wiring 21 and the antenna connection wiring 22 do not necessarily have to be substantially rectangular or substantially square. For example, they may have a substantially trapezoidal shape in which the front side (Z-direction plus side) is narrower than the back side (Z-direction minus side), or a shape in which the side surfaces located on both sides in the longitudinal direction are curved.

[0157] In this embodiment, the line width W1 of the antenna wiring 21 (the length in the X direction, see FIG. 20) and the line width W2 of the antenna connection wiring 22 (the length in the Y direction, see FIG. 21) are not particularly limited and can be appropriately selected according to the application. For example, the line width W1 of the antenna wiring 21 can be selected in the range of 0.1 μm or more and 5.0 μm or less, and the line width W2 of the antenna connection wiring 22 can be selected in the range of 0.1 μm or more and 5.0 μm or less. Further, the height H1 of the antenna wiring 21 (the length in the Z direction, see FIG. 20) and the height H2 of the antenna connection wiring 22 (the length in the Z direction, see FIG. 21) are not particularly limited and can be appropriately selected according to the application, and can be selected, for example, in the range of 0.1 μm or more and 5.0 μm or less.

[0158] The materials of the antenna wiring 21 and the antenna connection wiring 22 may be any conductive metal material. In this embodiment, the materials of the antenna wiring 21 and the antenna connection wiring 22 are copper, but are not limited thereto. As the materials of the antenna wiring 21 and the antenna connection wiring 22, for example, metal materials (including alloys) such as gold, silver, copper, platinum, tin, aluminum, iron, and nickel can be used.

[0159] Referring again to FIG. 18, the dummy pattern region 30 is provided so as to surround the periphery of each antenna pattern region 20, and is formed so as to surround the entire circumferential direction (the plus X direction, the minus X direction, and the plus Y direction) of each antenna pattern region 20 except for the power supply unit 40 side (the minus Y direction). In this case, the dummy pattern region 30 is on the substrate 11 and is arranged over substantially the entire area excluding the antenna pattern region 20 and the power supply unit 40. Unlike the antenna pattern region 20, this dummy pattern region 30 does not substantially function as an antenna.

[0160] As shown in FIG. 19, the dummy pattern region 30 is composed of repetitions of dummy wirings 30a having a predetermined unit pattern shape. That is, the dummy pattern region 30 includes a plurality of dummy wirings 30a having the same shape, and each dummy wiring 30a is electrically independent of the antenna pattern region 20 (antenna wiring 21 and antenna connection wiring 22). Also, the plurality of dummy wirings 30a are regularly arranged over the entire area within the dummy pattern region 30. The plurality of dummy wirings 30a are spaced apart from each other in the planar direction and are arranged in an island shape protruding from the substrate 11. That is, each dummy wiring 30a is electrically independent of the antenna pattern region 20, the power supply unit 40, and other dummy wirings 30a. Each of these dummy wirings 30a is substantially L-shaped in plan view and has a first dummy wiring portion 31 extending in the Y direction and a second dummy wiring portion 32 extending in the X direction. Among these, the first dummy wiring portion 31 has a predetermined length L4 (length in the Y direction), and the second dummy wiring portion 32 has a predetermined length L5 (length in the X direction), and these are equal to each other (L4 = L5).

[0161] A gap 33a is formed between the dummy wirings 30a adjacent to each other in the X direction, and a gap 33b is formed between the dummy wirings 30a adjacent to each other in the Y direction. In this case, the dummy wirings 30a are arranged at equal intervals from each other. That is, the dummy wirings 30a adjacent to each other in the X direction are arranged at equal intervals from each other, and the gap G1 therebetween can be in the range of, for example, 1 μm or more and 20 μm or less. Similarly, the dummy wirings 30a adjacent to each other in the Y direction are arranged at equal intervals from each other, and the gap G2 therebetween can be in the range of, for example, 1 μm or more and 20 μm or less. Note that the maximum value of the gaps G1 and G2 may be 0.8 times or less of the above-described pitches P1 and P2, respectively. In this case, the gap G1 in the X direction of the dummy wiring 30a is equal to the gap G2 in the Y direction of the dummy wiring 30a (G1 = G2).

[0162] In the present embodiment, the dummy wiring 30a has a shape in which a part of the unit pattern shape 20a of the antenna pattern region 20 described above is missing. That is, the shape of the dummy wiring 30a is a shape obtained by removing the above-described gaps 33a and 33b from the L-shaped unit pattern shape 20a of the antenna pattern region 20. That is, the shape in which the plurality of dummy wirings 30a and the plurality of gaps 33a and 33b in the dummy pattern region 30 are combined corresponds to a lattice shape or a mesh shape forming the antenna pattern region 20. Thus, by making the dummy wiring 30a in the dummy pattern region 30 have a shape in which a part of the unit pattern shape 20a of the antenna pattern region 20 is missing, it is possible to make it difficult to visually recognize the difference between the antenna pattern region 20 and the dummy pattern region 30, and it is possible to make the antenna pattern region 20 arranged on the substrate 11 less visible.

[0163] In FIG. 19, an antenna pattern region 20 and a dummy pattern region 30 are adjacent in the Y direction. In the vicinity of the boundary between the antenna pattern region 20 and the dummy pattern region 30, a first dummy wiring portion 31 is formed on the extension of the antenna wiring 21. For this reason, the difference between the antenna pattern region 20 and the dummy pattern region 30 is difficult to visually recognize. Although not shown, for the same reason, it is also preferable that a second dummy wiring portion 32 is formed on the extension of the antenna connection wiring 22 at a location where the antenna pattern region 20 and the dummy pattern region 30 are adjacent in the X direction.

[0164] As shown in FIG. 22, the first dummy wiring portion 31 of each dummy wiring 30a has a substantially rectangular shape or a substantially square shape in a cross section (X-direction cross section) perpendicular to its longitudinal direction (Y direction). Also, as shown in FIG. 21, the second dummy wiring portion 32 of each dummy wiring 30a has a substantially rectangular shape or a substantially square shape in a cross section (Y-direction cross section) perpendicular to its longitudinal direction (X direction). In this case, the cross-sectional shape of the first dummy wiring portion 31 is substantially the same as the cross-sectional shape of the antenna wiring 21, and the cross-sectional shape of the second dummy wiring portion 32 is substantially the same as the cross-sectional shape of the antenna connection wiring 22.

[0165] In the present embodiment, the line width W3 (the length in the X direction, see FIG. 22) of the first dummy wiring portion 31 is substantially the same as the line width W1 of the antenna wiring 21, and the line width W4 (the length in the Y direction, see FIG. 21) of the second dummy wiring portion 32 is substantially the same as the line width W2 of the antenna connection wiring 22. Also, regarding the height H3 (the length in the Z direction, see FIG. 22) of the first dummy wiring portion 31 and the height H4 (the length in the Z direction, see FIG. 21) of the second dummy wiring portion 32, they are also substantially the same as the height H1 of the antenna wiring 21 and the height H2 of the antenna connection wiring 22, respectively.

[0166] As the material of the dummy wiring 30a, the same metal material as the material of the antenna wiring 21 and the material of the antenna connection wiring 22 can be used.

[0167] Incidentally, in the present embodiment, the antenna pattern region 20 and the dummy pattern region 30 each have a predetermined aperture ratio A1, A2. Among these, the aperture ratio A1 of the antenna pattern region 20 can be, for example, in the range of 85% or more and 99.9% or less. Also, the aperture ratio A2 of the dummy pattern region 30 can be, for example, in the range of 87% or more and less than 100%. In this case, the aperture ratio A2 of the dummy pattern region 30 is larger than the aperture ratio A1 of the antenna pattern region 20 (A2 > A1). Thereby, the transparency of the wiring board 10 can be ensured. Note that, without being limited to this, the aperture ratio A2 of the dummy pattern region 30 may be smaller than the aperture ratio A1 of the antenna pattern region 20 (A2 < A1).

[0168] Also, the difference (|A2 - A1|) between the aperture ratio A2 of the dummy pattern region 30 and the aperture ratio A1 of the antenna pattern region 20 is preferably in the range of more than 0% and 7% or less, and more preferably in the range of more than 0% and 1% or less. In this way, by reducing the difference between the aperture ratio A2 of the dummy pattern region 30 and the aperture ratio A1 of the antenna pattern region 20, the boundary between the antenna pattern region 20 and the dummy pattern region 30 can be made less visible, and the presence of the antenna pattern region 20 can be made difficult to recognize with the naked eye.

[0169] Furthermore, the overall aperture ratio A3 (the aperture ratio when the antenna pattern region 20 and the dummy pattern region 30 are combined) of the antenna pattern region 20 and the dummy pattern region 30 can be, for example, in the range of 87% or more and less than 100%. By setting the overall aperture ratio A3 of the wiring board 10 within this range, the conductivity and transparency of the wiring board 10 can be ensured.

[0170] Note that the aperture ratio refers to the ratio (%) of the area of the opening region (the region where the substrate 11 is exposed without the presence of metal parts such as the antenna wiring 21, the antenna connection wiring 22, and the dummy wiring 30a) to the unit area of a predetermined region (the antenna pattern region 20, the dummy pattern region 30, or the antenna pattern region 20 and the dummy pattern region 30).

[0171] Referring again to FIG. 18, the power supply unit 40 is electrically connected to the antenna pattern region 20. The power supply unit 40 is composed of a conductive thin plate-like member having a substantially rectangular shape. The longitudinal direction of the power supply unit 40 is parallel to the X direction, and the short side direction of the power supply unit 40 is parallel to the Y direction. Further, the power supply unit 40 is disposed at the longitudinal end (the Y-direction minus side end) of the substrate 11. As the material of the power supply unit 40, for example, a metal material (including an alloy) such as gold, silver, copper, platinum, tin, aluminum, iron, nickel, etc. can be used. When the wiring board 10 is incorporated into the image display device 90 (see FIG. 24), the power supply unit 40 is electrically connected to the wireless communication circuit 92 of the image display device 90. Note that the power supply unit 40 is provided on the surface of the substrate 11, but is not limited thereto, and a part or all of the power supply unit 40 may be located outside the periphery of the substrate 11.

[0172] [Method for manufacturing a wiring board] Next, referring to FIGS. 23(a)-(h), a method for manufacturing a wiring board according to the present embodiment will be described. FIGS. 23(a)-(h) are cross-sectional views showing the method for manufacturing a wiring board according to the present embodiment.

[0173] First, as shown in FIG. 23(a), the substrate 11 is prepared, and a conductive layer 51 is formed over substantially the entire surface of the substrate 11. In the present embodiment, the thickness of the conductive layer 51 is 200 nm. However, it is not limited thereto, and the thickness of the conductive layer 51 can be appropriately selected in the range of 10 nm or more and 1000 nm or less. In the present embodiment, the conductive layer 51 is formed by sputtering using copper. As a method for forming the conductive layer 51, a plasma CVD method may be used.

[0174] Next, as shown in FIG. 23(b), a photocurable insulating resist 52 is supplied over substantially the entire surface of the substrate 11. Examples of the photocurable insulating resist 52 include organic resins such as epoxy resins.

[0175] Subsequently, a transparent mold 53 for imprinting having a convex portion 53a is prepared (Fig. 23(c)), the mold 53 and the substrate 11 are brought close to each other, and a photocurable insulating resist 52 is developed between the mold 53 and the substrate 11. Next, light irradiation is performed from the mold 53 side to cure the photocurable insulating resist 52, thereby forming an insulating layer 54. As a result, a trench 54a having a shape in which the convex portion 53a is transferred is formed on the surface of the insulating layer 54. The trench 54a has a planar shape pattern corresponding to the antenna wiring 21, the antenna connection wiring 22, and the dummy wiring 30a.

[0176] Thereafter, by peeling the mold 53 from the insulating layer 54, an insulating layer 54 having the cross-sectional structure shown in Fig. 23(d) is obtained. The direction in which the mold 53 is peeled from the insulating layer 54 is preferably the Y direction in which the longer antenna wiring 21 extends.

[0177] In this way, by forming the trench 54a on the surface of the insulating layer 54 by the imprint method, the shape of the trench 54a can be made fine. Note that the present invention is not limited to this, and the insulating layer 54 may be formed by photolithography. In this case, a resist pattern is formed by photolithography so as to expose a conductive layer 51 corresponding to the antenna wiring 21, the antenna connection wiring 22, and the dummy wiring 30a.

[0178] As shown in Fig. 23(d), residues of the insulating material may remain at the bottom of the trench 54a of the insulating layer 54. Therefore, wet treatment using a permanganate solution or N-methyl-2-pyrrolidone, or dry treatment using oxygen plasma is performed to remove the residues of the insulating material. By removing the residues of the insulating material in this way, a trench 54a exposing the conductive layer 51 as shown in Fig. 23(e) can be formed.

[0179] Next, as shown in Fig. 23(f), the trench 54a of the insulating layer 54 is filled with a conductor 55. In the present embodiment, using the conductive layer 51 as a seed layer, the trench 54a of the insulating layer 54 is filled with copper by an electrolytic plating method.

[0180] Subsequently, as shown in FIG. 23(g), the insulating layer 54 is removed. In this case, the insulating layer 54 on the substrate 11 is removed by performing wet processing using a permanganate solution or N-methyl-2-pyrrolidone, or dry processing using oxygen plasma.

[0181] Thereafter, as shown in FIG. 23(h), the conductive layer 51 on the surface of the substrate 11 is removed. At this time, the conductive layer 51 is etched by performing wet processing using hydrogen peroxide water so that the surface of the substrate 11 is exposed. In this way, a wiring board 10 having the substrate 11, the antenna pattern region 20 and the dummy pattern region 30 disposed on the substrate 11 is obtained. In this case, the antenna pattern region 20 includes the antenna wiring 21 and the antenna connection wiring 22, and the dummy pattern region 30 includes the dummy wiring 30a. The above-described conductor 55 includes the antenna wiring 21, the antenna connection wiring 22, and the dummy wiring 30a.

[0182] [Operation of this Embodiment] Next, the operation of the wiring board having such a configuration will be described.

[0183] As shown in FIG. 24, the wiring board 10 is incorporated into an image display device 90 having a display 91. The wiring board 10 is disposed on the display 91. Examples of such an image display device 90 include portable terminal devices such as smartphones and tablets. The antenna pattern region 20 of the wiring board 10 is electrically connected to the wireless communication circuit 92 of the image display device 90 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the antenna pattern region 20, and communication can be performed using the image display device 90. Note that the dummy pattern region 30 is separated from the antenna pattern region 20 and is electrically independent, so there is no possibility that the provision of the dummy pattern region 30 will affect the transmission and reception of radio waves.

[0184] According to the present embodiment, the wiring board 10 has a substrate 11 having transparency and an antenna pattern region 20 disposed on the substrate 11 and including a plurality of antenna wirings 21 having a function as an antenna. Therefore, the transparency of the wiring board 10 is ensured. As a result, when the wiring board 10 is disposed on the display 91, the display 91 can be visually recognized through the opening 23 of the antenna pattern region 20, so that the visibility of the display 91 is not hindered.

[0185] Further, according to the present embodiment, a dummy pattern region 30 including a plurality of dummy wirings 30a electrically independent of the antenna wiring 21 is disposed around the antenna pattern region 20. By disposing the dummy pattern region 30 around the antenna pattern region 20 in this way, the boundary between the antenna pattern region 20 and other regions can be made unclear. As a result, the antenna pattern region 20 can be made difficult to see on the surface of the display 91, and it can be made difficult for the user of the image display device 90 to recognize the antenna pattern region 20 with the naked eye.

[0186] Further, according to the present embodiment, the antenna pattern region 20 and the dummy pattern region 30 are each composed of a repetition of a predetermined unit pattern shape, and the unit pattern shape (dummy wiring 30a) of the dummy pattern region 30 is a shape in which a part of the unit pattern shape 20a of the antenna pattern region 20 is missing. Thereby, the boundary between the antenna pattern region 20 and the dummy pattern region 30 can be made unclear, and it can be made difficult for the antenna pattern region 20 to be recognized with the naked eye on the surface of the display 91.

[0187] Further, according to the present embodiment, the aperture ratio A2 of the dummy pattern region 30 is larger than the aperture ratio A1 of the antenna pattern region 20. Thereby, while making it difficult to recognize the antenna pattern region 20, the transparency of the wiring board 10 can be ensured.

[0188] Also, according to this embodiment, the antenna pattern region 20 includes a plurality of antenna connection wirings 22 that connect a plurality of antenna wirings 21. Thereby, it is possible to make the antenna wiring 21 less likely to be disconnected, and it is possible to suppress a decrease in the function of the antenna wiring 21 as an antenna.

[0189] (Modification example) Next, with reference to FIGS. 25 to 37, various modification examples of the wiring board will be described. FIGS. 25 to 37 are diagrams showing various modification examples of the wiring board. Each modification example shown in FIGS. 25 to 37 has a different configuration of the antenna pattern region 20 and / or the dummy pattern region 30, and other configurations are substantially the same as those of the above-described embodiment. In FIGS. 25 to 37, the same parts as those shown in FIGS. 18 to 24 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0190] (Modification example 1) FIG. 25 shows a wiring board 10A according to Modification example 1. In FIG. 25, the dummy pattern region 30 of the wiring board 10A includes a plurality of dummy wirings 30a having a predetermined unit pattern shape. Each dummy wiring 30a is electrically independent from the antenna pattern region 20 (antenna wiring 21 and antenna connection wiring 22). Each dummy wiring 30a has a first dummy wiring portion 31 extending in the Y direction and a second dummy wiring portion 32 extending in the X direction. In this case, the first dummy wiring portion 31 and the second dummy wiring portion 32 of each dummy wiring 30a are arranged to be spaced apart from each other in the plane direction.

[0191] A gap portion 33c is formed between the first dummy wiring portion 31 and the second dummy wiring portion 32 of each dummy wiring 30a. Also, when it is assumed that the gap portion 33c is supplemented in the dummy wiring 30a, gap portions 33a and 33b are formed between the dummy wirings 30a adjacent to each other in the X direction and between the dummy wirings 30a adjacent to each other in the Y direction, respectively. The dummy wiring 30a in the dummy pattern region 30 has a shape in which a part of the unit pattern shape 20a in the antenna pattern region 20 is missing. That is, the shape of the dummy wiring 30a is the shape obtained by removing the void portions 33a, 33b, and 33c from the L-shaped unit pattern shape 20a in the antenna pattern region 20. Note that the aperture ratio A2 of the dummy pattern region 30 can be, for example, in the range of 85% or more and less than 100%.

[0192] In this way, since the first dummy wiring portion 31 and the second dummy wiring portion 32 of each dummy wiring 30a are arranged to be spaced apart from each other in the planar direction, the aperture ratio of the dummy pattern region 30 can be further increased, and the transparency of the wiring substrate 10A can be improved.

[0193] (Modification 2) FIG. 26 shows a wiring substrate 10B according to Modification 2. In FIG. 26, the dummy pattern region 30 of the wiring substrate 10B includes a plurality of dummy wirings 30a having a predetermined unit pattern shape. Each dummy wiring 30a is electrically independent from the antenna pattern region 20 (antenna wiring 21 and antenna connection wiring 22). This dummy wiring 30a has a first dummy wiring portion 31 and a second dummy wiring portion 32 that extend obliquely with respect to the X direction and the Y direction, respectively. The first dummy wiring portion 31 and the second dummy wiring portion 32 of each dummy wiring 30a are arranged to be spaced apart from each other in the planar direction. In this case, the longitudinal direction of the first dummy wiring portion 31 is arranged to be inclined at 45° with respect to the longitudinal direction of the antenna wiring 21. Also, the longitudinal direction of the second dummy wiring portion 32 is positioned in a direction orthogonal to the longitudinal direction of the first dummy wiring portion 31. Note that the aperture ratio A2 of the dummy pattern region 30 can be, for example, in the range of 85% or more and less than 100%.

[0194] In this way, by arranging the first dummy wiring portion 31 and the second dummy wiring portion 32 of each dummy wiring 30a obliquely with respect to the antenna wiring 21, the generation of interference fringes due to the diffraction grating can be suppressed.

[0195] (Modification 3) FIG. 27 shows a wiring board 10C according to Modification 3. In FIG. 27, an antenna pattern region 20 of the wiring board 10C includes a plurality of antenna wirings 21 having a function as an antenna and a plurality of antenna connection wirings 22 connecting the plurality of antenna wirings 21. In this case, a pitch P1 of the antenna wiring 21 is smaller than a pitch P2 of the antenna connection wiring 22 (P1 < P2). For example, the pitch P1 of the antenna wiring 21 can be in a range of 0.01 mm or more and 1 mm or less, and the pitch P2 of the antenna connection wiring 22 can be in a range of 0.03 mm or more and 1 mm or less, for example. Also, each opening 23 has a substantially rectangular shape in which the Y direction is longer than the X direction in a plan view. Thus, by making the area of each opening 23 wider, the transparency of the entire wiring board 10C can be further enhanced.

[0196] Also, a dummy pattern region 30 includes a plurality of dummy wirings 30a having a predetermined unit pattern shape. Each dummy wiring 30a is electrically independent from the antenna pattern region 20 (antenna wiring 21 and antenna connection wiring 22). Each dummy wiring 30a has a pair of first dummy wiring portions 31a, 31b extending in the Y direction and a second dummy wiring portion 32 extending in the X direction. In this case, the first dummy wiring portion 31a, the first dummy wiring portion 31b, and the second dummy wiring portion 32 of each dummy wiring 30a are arranged to be spaced apart from each other in a planar direction.

[0197] A void portion 33c is formed between the first dummy wiring portion 31a and the second dummy wiring portion 32 of each dummy wiring 30a. Also, a void portion 33d is formed between the first dummy wiring portions 31a and 31b. Further, when it is assumed that the void portions 33c and 33d are supplemented in the dummy wiring 30a, void portions 33a and 33b are formed between the dummy wirings 30a adjacent to each other in the X direction and between the dummy wirings 30a adjacent to each other in the Y direction, respectively. In this case, the dummy wiring 30a in the dummy pattern region 30 has a shape in which a part of the unit pattern shape 20a of the antenna pattern region 20 is missing. That is, the shape of the dummy wiring 30a is a shape obtained by removing the void portions 33a to 33d from the L-shaped unit pattern shape 20a of the antenna pattern region 20. Note that the aperture ratio A2 of the dummy pattern region 30 can be, for example, in the range of 90% or more and less than 100%.

[0198] In this way, by widening the opening regions (regions where the substrate 11 is exposed without the presence of metal portions such as the antenna wiring 21, the antenna connection wiring 22, and the dummy wiring 30a) of the antenna pattern region 20 and the dummy pattern region 30, the transparency of the wiring substrate 10C can be improved.

[0199] (Modification 4) FIG. 28 shows a wiring board 10D according to Modification 4. In FIG. 28, the dummy pattern region 30 of the wiring board 10D includes a plurality of dummy wirings 30a having a predetermined unit pattern shape. Each dummy wiring 30a is electrically independent from the antenna pattern region 20 (antenna wiring 21 and antenna connection wiring 22). Each dummy wiring 30a has a pair of first dummy wiring portions 31a and 31b extending obliquely with respect to the X direction and the Y direction, and a second dummy wiring portion 32 extending obliquely with respect to the X direction and the Y direction. The first dummy wiring portion 31a, the first dummy wiring portion 31b, and the second dummy wiring portion 32 of each dummy wiring 30a are arranged to be spaced apart from each other in the plane direction. In this case, the longitudinal directions of the pair of first dummy wiring portions 31a and 31b are arranged to be inclined at 45° with respect to the longitudinal direction of the antenna wiring 21. Also, the longitudinal direction of the second dummy wiring portion 32 is positioned in a direction orthogonal to the longitudinal directions of the first dummy wiring portions 31a and 31b. Note that the aperture ratio A2 of the dummy pattern region 30 can be in the range of, for example, 90% or more and less than 100%.

[0200] As described above, by arranging the first dummy wiring portions 31a and 31b and the second dummy wiring portion 32 of each dummy wiring 30a obliquely with respect to the antenna wiring 21, it is possible to suppress the generation of interference fringes due to the diffraction grating.

[0201] (Modification 5) FIG. 29 shows a wiring board 10E according to Modification 5. In FIG. 29, the dummy pattern region 30 of the wiring board 10E includes a plurality of dummy wirings 30a having a predetermined unit pattern shape. Each dummy wiring 30a is electrically independent from the antenna pattern region 20 (antenna wiring 21 and antenna connection wiring 22). Each dummy wiring 30a has a plurality (four) of first dummy wiring portions 31c extending in the Y direction and a plurality (four) of second dummy wiring portions 32c extending in the X direction. In this case, the plurality of first dummy wiring portions 31c are arranged to be spaced apart from each other in the Y direction, and the plurality of second dummy wiring portions 32c are arranged to be spaced apart from each other in the X direction.

[0202] A void portion 33e is formed at the intersection between the first dummy wiring portion 31a and the second dummy wiring portion 32c of the dummy wiring 30a. Also, a void portion 33f is formed between a plurality of first dummy wiring portions 31c. Further, void portions 33g are respectively formed between a plurality of second dummy wiring portions 32c. In this case, the dummy wiring 30a in the dummy pattern region 30 has a shape in which a part of the unit pattern shape 20a of the antenna pattern region 20 is missing. That is, the shape of the dummy wiring 30a is a shape obtained by removing the void portions 33e to 33g from the L-shaped unit pattern shape 20a of the antenna pattern region 20.

[0203] In this modified example, an additional pattern 34 is disposed in the dummy pattern region 30, separated from the dummy wiring 30a of the dummy pattern region 30. In this case, the additional pattern 34 is disposed away from both the plurality of first dummy wiring portions 31c and the plurality of second dummy wiring portions 32c in both the X direction and the Y direction. In this case, each additional pattern 34 extends linearly in parallel with the Y direction. Also, a plurality (four) of additional patterns 34 are disposed with respect to one dummy wiring 30a. It is preferable that the total area of the plurality (four) of additional patterns 34 approaches the area of the void portions 33e to 33g of each dummy wiring 30a. Note that the material of the additional pattern 34 can be the same metal material as the material of the dummy wiring 30a.

[0204] Thus, by disposing the additional pattern 34 in the dummy pattern region 30, the difference (|A2 - A1|) between the aperture ratio A2 of the dummy pattern region 30 and the aperture ratio A1 of the antenna pattern region 20 can be made close to 0. Specifically, the difference between the aperture ratio A2 and the aperture ratio A1 can be in the range of 0% or more and 1% or less. Thereby, the boundary between the antenna pattern region 20 and the dummy pattern region 30 can be made unclear, and the antenna pattern region 20 can be made difficult to recognize with the naked eye.

[0205] (Modified Example 6) FIG. 30 shows a wiring board 10F according to Modification Example 6. In FIG. 30, additional patterns 34 are arranged in the dummy pattern region 30, spaced apart from the dummy wiring 30a in the dummy pattern region 30. In this case, each additional pattern 34 extends linearly while being inclined with respect to the X direction and the Y direction. Also, in FIG. 30, a plurality (four) of additional patterns 34 are arranged with respect to one dummy wiring 30a. Other configurations are substantially the same as those of the wiring board 10E (Modification Example 5) shown in FIG. 29.

[0206] (Modification Example 7) FIG. 31 shows a wiring board 10G according to Modification Example 7. In FIG. 31, the dummy wiring 30a has a plurality (two) of first dummy wiring portions 31c extending in the Y direction and a plurality (two) of second dummy wiring portions 32c extending in the X direction. Also, each additional pattern 34 extends linearly while being inclined with respect to the X direction and the Y direction. In this case, a plurality (two) of additional patterns 34 are arranged with respect to one dummy wiring 30a. Other configurations are substantially the same as those of the wiring board 10E (Modification Example 5) shown in FIG. 29.

[0207] (Modification Example 8) FIG. 32 shows a wiring board 10H according to Modification Example 8. In FIG. 32, the dummy wiring 30a has a plurality (two) of first dummy wiring portions 31c extending in the Y direction and a plurality (two) of second dummy wiring portions 32c extending in the X direction. One of the first dummy wiring portions 31c and one of the second dummy wiring portions 32c are connected to each other to form a portion having an L shape in plan view. In this case, each additional pattern 34 extends linearly while being parallel to the Y direction. Also, a plurality (two) of additional patterns 34 are arranged with respect to one dummy wiring 30a. Other configurations are substantially the same as those of the wiring board 10E (Modification Example 5) shown in FIG. 29.

[0208] (Modification Example 9) FIG. 33 shows a wiring board 10I according to Modification Example 9. In FIG. 33, each additional pattern 34 extends linearly while being inclined with respect to the X direction and the Y direction, respectively. In this case, a plurality (two) of additional patterns 34 are arranged for one dummy wiring 30a. Other configurations are substantially the same as those of the wiring board 10H (Modification Example 8) shown in FIG. 32.

[0209] (Modification Example 10) FIG. 34 shows a wiring board 10J according to Modification Example 10. In FIG. 34, each additional pattern 34 has a cross shape in plan view. In this case, one additional pattern 34 is arranged for one dummy wiring 30a. Other configurations are substantially the same as those of the wiring board 10E (Modification Example 5) shown in FIG. 29.

[0210] (Modification Example 11) FIG. 35 shows a wiring board 10K according to Modification Example 11. In FIG. 35, each additional pattern 34 has a dot shape in plan view. In this case, a plurality of dot-shaped additional patterns 34 are arranged for one dummy wiring 30a, and the plurality of additional patterns 34 are aligned along both the X direction and the Y direction. Other configurations are substantially the same as those of the wiring board 10G (Modification Example 7) shown in FIG. 31.

[0211] (Modification Example 12) FIG. 36 shows a wiring board 10L according to Modification Example 12. In FIG. 36, each additional pattern 34 has a cross shape in plan view. In this case, one additional pattern 34 is arranged for one dummy wiring 30a. Other configurations are substantially the same as those of the wiring board 10H (Modification Example 8) shown in FIG. 32.

[0212] (Modification Example 13) FIG. 36 shows the wiring board 10M according to Modification 13. In FIG. 36, each additional pattern 34 has a dot shape in plan view. In this case, a plurality of dot-shaped additional patterns 34 are arranged for one dummy wiring 30a, and the plurality of additional patterns 34 are aligned along both the X direction and the Y direction. Other configurations are substantially the same as those of the wiring board 10H (Modification 8) shown in FIG. 32.

[0213] Although not shown, additional patterns 34 may be provided in the dummy pattern regions 30 of the wiring boards 10 and 10A to 10D shown in FIGS. 18 to 28, respectively.

[0214] <Third Embodiment> Next, a third embodiment will be described with reference to FIGS. 38 to 51. FIGS. 38 to 51 are diagrams showing the third embodiment. In FIGS. 38 to 51, the same parts as those in the second embodiment shown in FIGS. 18 to 37 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0215] [Configuration of Wiring Board] With reference to FIGS. 38 to 42, the configuration of the wiring board according to the present embodiment will be described. FIGS. 38 to 42 are diagrams showing the wiring board according to the present embodiment.

[0216] As shown in FIG. 38, the wiring board 10 according to the present embodiment is arranged, for example, on the display of an image display device. Such a wiring board 10 includes a substrate 11 having transparency and an antenna pattern region 20 arranged on the substrate 11. Further, a power supply unit 40 is electrically connected to the antenna pattern region 20.

[0217] Among these, the configuration of the substrate 11 is substantially the same as that in the case of the second embodiment.

[0218] Each antenna pattern region 20 is substantially rectangular in plan view. The longitudinal direction of each antenna pattern region 20 is parallel to the Y direction, and the short side direction (width direction) thereof is parallel to the X direction. The length L of each antenna pattern region 20 in the longitudinal direction (Y direction) a can be selected, for example, in the range of 3 mm or more and 100 mm or less, and the width W of each antenna pattern region 20 in the short side direction (width direction) a can be selected, for example, in the range of 1 mm or more and 10 mm or less.

[0219] In each antenna pattern region 20, metal wires are formed in a lattice shape or a mesh shape and have a repeating pattern in the X direction and the Y direction. That is, the antenna pattern region 20 is composed of a repeating unit pattern shape 20a (see FIG. 40) in an L shape composed of a portion extending in the X direction (a part of the antenna connection wiring 22 described later) and a portion extending in the Y direction (a part of the antenna wiring 21 described later).

[0220] As shown in FIG. 39, each antenna pattern region 20 includes a plurality of antenna wirings 21 having a function as an antenna and a plurality of antenna connection wirings 22 connecting the plurality of antenna wirings 21. Specifically, the plurality of antenna wirings 21 and the plurality of antenna connection wirings 22 are integrally formed as a whole to form a lattice shape or a mesh shape. Each antenna wiring 21 extends in the direction corresponding to the frequency band of the antenna (longitudinal direction, Y direction), and each antenna connection wiring 22 extends in the direction orthogonal to the antenna wiring 21 (width direction, X direction). The antenna wiring 21 has a length L a (the length of the antenna pattern region 20 described above, see FIG. 38) and mainly exhibits the function as an antenna. On the other hand, the antenna connection wiring 22 plays a role of suppressing problems such as disconnection of the antenna wiring 21 or loss of electrical connection between the antenna wiring 21 and the power supply unit 40 by connecting these antenna wirings 21 to each other.

[0221] In each antenna pattern region 20, a plurality of openings 23 are formed by being surrounded by adjacent antenna wirings 21 and adjacent antenna connection wirings 22. The antenna pattern region 20 has a central portion 20c in the width direction (X direction) and a pair of edge portions 20e1 and 20e2 in the width direction (X direction). The central portion 20c in the width direction refers to a portion that is equidistant in the width direction (X direction) from both end edges of the antenna pattern region 20. Note that the central portion 20c in the width direction and the edge portions 20e1 and 20e2 in the width direction may each have a certain width (length in the X direction). For example, the central portion 20c in the width direction and the edge portions 20e1 and 20e2 in the width direction may be regions having a width (length in the X direction) in the range of 5% or more and 30% or less of the width W of the antenna pattern region 20. a It may be a region having a width (length in the X direction) in the range of about 5% or more and 30% or less.

[0222] As shown in FIGS. 40(a) and (b), the plurality of antenna wirings 21 are arranged at intervals (pitch P1) in the width direction (X direction) of the antenna pattern region 20. In this case, the plurality of antenna wirings 21 are arranged at different intervals in the central portion 20c in the width direction (X direction) and the edge portions 20e1 and 20e2 in the width direction (X direction) of the antenna pattern region 20. That is, the plurality of antenna wirings 21 are arranged at a wide pitch P 1A in the central portion 20c in the width direction of the antenna pattern region 20, and at a pitch P 1A narrower than P 1B in the edge portions 20e1 and 20e2 in the width direction (P 1A > P 1B ). Note that the pitch P1 of the plurality of antenna wirings 21 is the widest (pitch P 1A ) in the central portion 20c in the width direction of the antenna pattern region 20 and the narrowest in the edge portions 20e1 and 20e2 in the width direction (pitch P 1B ). Specifically, the pitch P 1A of the antenna wiring 21 in the central portion 20c in the width direction of the antenna pattern region 20 can be, for example, in the range of 0.05 mm or more and 1 mm or less. The pitch P 1BIt can be in the range of, for example, 0.01 mm or more and 0.3 mm or less.

[0223] The pitch P1 of the plurality of antenna wirings 21 can gradually change from the pitch P at each width-direction edge portion 20e1, 20e2 1B to the pitch P at the width-direction central portion 20c. 1A Alternatively, the plurality of antenna wirings 21 may be arranged at a uniform pitch P in the regions near each width-direction edge portion 20e1, 20e2 1B and may be arranged at a uniform pitch P in the region near the width-direction central portion 20c. 1A In this embodiment, the pitch P of the antenna wiring 21 at one width-direction edge portion 20e1 1B is equal to the pitch P of the antenna wiring 21 at the other width-direction edge portion 20e2. 1B However, it is not limited to this, and the pitch P of the antenna wiring 21 may be different between one width-direction edge portion 20e1 and the other width-direction edge portion 20e2. 1B

[0224] The plurality of antenna connection wirings 22 are arranged at equal intervals in the longitudinal direction (Y direction) of the antenna pattern region 20. The pitch P2 of the plurality of antenna connection wirings 22 can be in the range of, for example, 0.01 mm or more and 1 mm or less. Each opening 23 is substantially rectangular or substantially square in plan view, and the area of the opening 23 located on the width-direction central portion 20c side is larger than the opening 23 located on each width-direction edge portion 20e1, 20e2 side. Also, the transparent substrate 11 is exposed from each opening 23. Therefore, by widening the area of each opening 23, the transparency of the entire wiring substrate 10 can be enhanced. Note that each antenna wiring 21 and each antenna connection wiring 22 are orthogonal to each other, but it is not limited to this, and they may intersect at an acute angle or an obtuse angle. Also, the pitch P2 of the antenna connection wiring 22 is uniform in the longitudinal direction (Y direction) of the antenna pattern region 20, but it is not limited to this and may be non-uniform in the longitudinal direction (Y direction).

[0225] As shown in FIGS. 41 and 42, the cross-sectional shapes of each antenna wiring 21 and each antenna connection wiring 22 are substantially the same as those in the second embodiment. Also, the same materials as those in the second embodiment can be used for the antenna wiring 21 and the antenna connection wiring 22.

[0226] Incidentally, in the present embodiment, the central portion 20c in the width direction of the antenna pattern region 20 has a predetermined aperture ratio Ac, and the edge portions 20e1, 20e2 in the width direction of the antenna pattern region 20 have a predetermined aperture ratio Ae. Among these, the aperture ratio Ac in the central portion 20c in the width direction can be, for example, in the range of 87% or more and less than 100%. Also, the aperture ratio Ae in the edge portions 20e1, 20e2 in the width direction can be, for example, in the range of 85% or more and 99% or less. As described above, the plurality of antenna wirings 21 are arranged at a relatively wide pitch P in the central portion 20c in the width direction of the antenna pattern region 20 1A and are arranged at a relatively narrow pitch P at the edge portions 20e1, 20e2 in the width direction. 1B For this reason, the aperture ratio Ac in the central portion 20c in the width direction of the antenna pattern region 20 is larger than the aperture ratio Ae in the edge portions 20e1, 20e2 in the width direction of the antenna pattern region 20 (Ac > Ae). Thereby, as will be described later, the current distribution in the antenna pattern region 20 can be made more uniform, and the antenna characteristics can be improved.

[0227] Also, the difference (|Ac - Ae|) between the aperture ratio Ac in the central portion 20c in the width direction of the antenna pattern region 20 and the aperture ratio Ae in the edge portions 20e1, 20e2 in the width direction of the antenna pattern region 20 is preferably in the range of more than 0% and 15% or less. Thus, by setting the difference between the aperture ratio Ac and the aperture ratio Ae within the above range, it is possible to make the current distribution in the antenna pattern region 20 more uniform while maintaining the function as an antenna in the antenna pattern region 20.

[0228] Furthermore, the overall aperture ratio At of the antenna pattern region 20 can be in a range of, for example, 87% or more and less than 100%. By setting the overall aperture ratio At of the wiring substrate 10 within this range, the conductivity and transparency of the wiring substrate 10 can be ensured.

[0229] Note that the aperture ratio refers to the ratio (%) of the area of the opening region (the region where the substrate 11 is exposed without the presence of metal parts such as the antenna wiring 21 and the antenna connection wiring 22) to the unit area of a predetermined region (for example, a part of the antenna pattern region 20).

[0230] Also, the configuration of the power supply unit 40 is substantially the same as in the case of the second embodiment.

[0231] [Manufacturing method of wiring substrate] Next, with reference to FIGS. 43(a)-(h), the manufacturing method of the wiring substrate according to the present embodiment will be described. FIGS. 43(a)-(h) are cross-sectional views showing the manufacturing method of the wiring substrate according to the present embodiment.

[0232] First, as shown in FIG. 43(a), the substrate 11 is prepared, and a conductive layer 51 is formed over substantially the entire surface of the substrate 11. In the present embodiment, the thickness of the conductive layer 51 is 200 nm. However, it is not limited thereto, and the thickness of the conductive layer 51 can be appropriately selected within a range of 10 nm or more and 1000 nm or less. In the present embodiment, the conductive layer 51 is formed by a sputtering method using copper. As a method for forming the conductive layer 51, a plasma CVD method may also be used.

[0233] Next, as shown in FIG. 43(b), a photocurable insulating resist 52 is supplied over substantially the entire surface of the substrate 11. Examples of the photocurable insulating resist 52 include organic resins such as epoxy resins.

[0234] Subsequently, a transparent mold 53 for imprinting having a convex portion 53a is prepared (FIG. 43(c)), the mold 53 and the substrate 11 are brought close to each other, and a photocurable insulating resist 52 is developed between the mold 53 and the substrate 11. Next, light irradiation is performed from the mold 53 side to cure the photocurable insulating resist 52, thereby forming an insulating layer 54. As a result, a trench 54a having a shape in which the convex portion 53a is transferred is formed on the surface of the insulating layer 54. The trench 54a has a planar shape pattern corresponding to the antenna wiring 21 and the antenna connection wiring 22.

[0235] Thereafter, by peeling the mold 53 from the insulating layer 54, an insulating layer 54 having a cross-sectional structure shown in FIG. 43(d) is obtained. The direction in which the mold 53 is peeled from the insulating layer 54 is preferably the Y direction in which the longer antenna wiring 21 extends.

[0236] In this way, by forming the trench 54a on the surface of the insulating layer 54 by the imprint method, the shape of the trench 54a can be made fine. Note that the present invention is not limited to this, and the insulating layer 54 may be formed by photolithography. In this case, a resist pattern is formed by photolithography so as to expose the conductive layer 51 corresponding to the antenna wiring 21 and the antenna connection wiring 22.

[0237] As shown in FIG. 43(d), residues of the insulating material may remain at the bottom of the trench 54a of the insulating layer 54. Therefore, wet treatment using a permanganate solution or N-methyl-2-pyrrolidone, or dry treatment using oxygen plasma is performed to remove the residues of the insulating material. In this way, by removing the residues of the insulating material, a trench 54a exposing the conductive layer 51 as shown in FIG. 43(e) can be formed.

[0238] Next, as shown in FIG. 43(f), the trench 54a of the insulating layer 54 is filled with a conductor 55. In the present embodiment, using the conductive layer 51 as a seed layer, the trench 54a of the insulating layer 54 is filled with copper by an electrolytic plating method.

[0239] Subsequently, as shown in FIG. 43(g), the insulating layer 54 is removed. In this case, the insulating layer 54 on the substrate 11 is removed by performing wet processing using a permanganate solution or N-methyl-2-pyrrolidone, or dry processing using oxygen plasma.

[0240] Thereafter, as shown in FIG. 43(h), the conductive layer 51 on the surface of the substrate 11 is removed. At this time, the conductive layer 51 is etched by performing wet processing using hydrogen peroxide water so that the surface of the substrate 11 is exposed. In this way, a wiring board 10 having the substrate 11 and the antenna pattern region 20 disposed on the substrate 11 is obtained. In this case, the antenna pattern region 20 includes the antenna wiring 21 and the antenna connection wiring 22. The conductor 55 described above includes the antenna wiring 21 and the antenna connection wiring 22. At this time, the power supply unit 40 may be formed by a part of the conductor 55. Alternatively, a flat power supply unit 40 may be separately prepared and the power supply unit 40 may be electrically connected to the antenna pattern region 20.

[0241] [Operation of this Embodiment] Next, the operation of the wiring board having such a configuration will be described.

[0242] As shown in FIG. 44, the wiring board 10 is incorporated into an image display device 90 having a display 91. The wiring board 10 is disposed on the display 91. Examples of such an image display device 90 include portable terminal devices such as smartphones and tablets. The antenna pattern region 20 of the wiring board 10 is electrically connected to the wireless communication circuit 92 of the image display device 90 via the power supply unit 40. In this way, radio waves of a predetermined frequency can be transmitted and received via the antenna pattern region 20, and communication can be performed using the image display device 90.

[0243] Incidentally, generally, while transmitting and receiving radio waves using the antenna pattern region 20, the current value flowing through the antenna pattern region 20 does not become uniform in the width direction (X direction). Specifically, the current values flowing through the width direction edges 20e1 and 20e2 of the antenna pattern region 20 are larger than the current value flowing through the width direction center portion 20c of the antenna pattern region 20.

[0244] FIG. 51 shows, as a reference example, the calculated current values for a uniform mesh-shaped antenna pattern and a uniform plate-shaped antenna pattern. In FIG. 51, the horizontal axis indicates the position in the width direction of the antenna pattern, the left end of the horizontal axis is the width direction edge of the antenna pattern, and the right end of the horizontal axis is the width direction center portion of the antenna pattern. Also, the vertical axis indicates the current value flowing through the antenna pattern. As is clear from FIG. 51, when the antenna pattern is in a uniform mesh shape and a uniform plate shape, in both cases, the current value is larger at the width direction edge of the antenna pattern than at the width direction center portion of the antenna pattern. In this case, since the current distribution in the antenna pattern does not become uniform, it is difficult to sufficiently improve the antenna characteristics.

[0245] On the other hand, in the present embodiment, the aperture ratio Ac at the width direction center portion 20c of the antenna pattern region 20 is made higher than the aperture ratio Ae at the width direction edges 20e1 and 20e2 of the antenna pattern region 20 (Ac > Ae). That is, the density (pitch P 1A ) of the antenna wiring 21 at the width direction edges 20e1 and 20e2 where the current value is high is made higher than the density (pitch P 1B ) of the antenna wiring 21 at the width direction center portion 20c where the current value is low. As a result, compared with the case where the mesh of the antenna pattern is uniform, the current distribution is made uniform between the width direction center portion 20c and the width direction edges 20e1 and 20e2 of the antenna pattern region 20, so that the antenna characteristics can be further improved.

[0246] Also, according to this embodiment, the wiring board 10 has a substrate 11 with transparency and an antenna pattern region 20 disposed on the substrate 11 and including a plurality of antenna wirings 21 having the function of an antenna. Thus, the transparency of the wiring board 10 is ensured. Thereby, when the wiring board 10 is disposed on the display 91, the display 91 can be visually recognized through the opening 23 of the antenna pattern region 20, and the visibility of the display 91 is not hindered.

[0247] Also, according to this embodiment, the antenna pattern region 20 includes a plurality of antenna connection wirings 22 that connect the plurality of antenna wirings 21. Thereby, it is possible to make the antenna wiring 21 less likely to be disconnected, and it is possible to suppress a decrease in the function of the antenna wiring 21 as an antenna.

[0248] (Modification example) Next, with reference to FIGS. 45 to 50, various modification examples of the wiring board will be described. FIGS. 45 to 50 are diagrams showing various modification examples of the wiring board. The modification examples shown in FIGS. 45 to 50 differ in the configuration of the antenna pattern region 20 and / or the power supply unit 40, and other configurations are substantially the same as those of the embodiment shown in FIGS. 38 to 44 described above. In FIGS. 45 to 50, the same parts as those in the form shown in FIGS. 38 to 44 are denoted by the same reference numerals, and detailed description thereof is omitted.

[0249] (Modification example 1) FIG. 45 shows a wiring board 10P according to Modification example 1. In FIG. 45, a void portion 61 is formed at the central portion 20c in the width direction of the antenna pattern region 20. The void portion 61 has a substantially rectangular shape in plan view, and its longitudinal direction is parallel to the Y direction. The antenna wiring 21 and the antenna connection wiring 22 are not provided in the void portion 61, and the substrate 11 is exposed. The width W b (length in the X direction) of the void portion 61 may be in the range of, for example, 20% or more and 80% or less of the width W a of the antenna pattern region 20.

[0250] The antenna pattern region 20 has a first pattern region 20f and a second pattern region 20g separated by a gap 61. In the first pattern region 20f and the second pattern region 20g, metal wires are formed in a lattice or mesh shape. The first pattern region 20f and the second pattern region 20g each include a plurality of antenna wirings 21 and a plurality of antenna connecting wirings 22.

[0251] Both widthwise edges 20e1, 20e2 of the antenna pattern region 20 are located in the first pattern region 20f and the second pattern region 20g, respectively. That is, the widthwise edge 20e1 on the negative side in the X direction is located in the first pattern region 20f, and the widthwise edge 20e2 on the positive side in the X direction is located in the second pattern region 20g. The widths W c (length in the X direction) are the width W of the antenna pattern area 20 a In FIG. 45, the width W c and the width W of the second pattern region 20g c are equal to each other, but they may be different from each other.

[0252] The first pattern region 20f and the second pattern region 20g are electrically connected to each other by a central pattern region 20h. In the central pattern region 20h, metal wires are formed in a lattice or mesh shape. The central pattern region 20h includes a plurality of antenna wirings 21 and a plurality of antenna connecting wirings 22. The central pattern region 20h is disposed in the widthwise center portion 20c of the antenna pattern region 20. The width (length in the X direction) of the central pattern region 20h is set to be equal to or larger than the width W of the void portion 61. b In addition, the length L of the central pattern area 20h in the Y direction is equal to b can be selected, for example, in the range of 0.05 mm or more and 5.0 mm or less.

[0253] In FIG. 45, the aperture ratio Ac at the central portion 20c in the width direction of the antenna pattern region 20 is higher than the aperture ratios Ae at the widthwise edge portions 20e1 and 20e2. That is, the pitch of the antenna wiring 21 at the central portion 20c in the width direction of the antenna pattern region 20 (central pattern region 20h) is wider than the pitch of the antenna wiring 21 at the widthwise edge portions 20e1 and 20e2 of the antenna pattern region 20 (first pattern region 20f and second pattern region 20g). Thereby, the current distribution can be equalized between the central portion 20c in the width direction of the antenna pattern region 20 and the widthwise edge portions 20e1 and 20e2. Further, since the void portion 61 is formed in the central portion 20c in the width direction of the antenna pattern region 20, the transparency of the wiring substrate 10 can be improved.

[0254] (Modification 2) FIG. 46 shows a wiring substrate 10Q according to Modification 2. The wiring substrate 10Q shown in FIG. 46 is obtained by forming a dummy pattern region 30 in the void portion 61 of the wiring substrate 10P shown in FIG. 45 (Modification 1). This dummy pattern region 30 is provided between the first pattern region 20f and the second pattern region 20g. Different from the antenna pattern region 20, the dummy pattern region 30 does not substantially function as an antenna.

[0255] The dummy pattern region 30 is composed of repetitions of dummy wirings 30a having a predetermined unit pattern shape. That is, the dummy pattern region 30 includes a plurality of dummy wirings 30a of the same shape, and each dummy wiring 30a is electrically independent from the antenna pattern region 20 (antenna wiring 21 and antenna connection wiring 22). Also, the plurality of dummy wirings 30a are regularly arranged over the entire area within the dummy pattern region 30. The plurality of dummy wirings 30a are spaced apart from each other in the planar direction and are arranged in an island shape protruding on the substrate 11. That is, each dummy wiring 30a is electrically independent from the antenna pattern region 20, the power supply unit 40, and other dummy wirings 30a. Each dummy wiring 30a is substantially L-shaped in plan view. Note that the width (length in the X direction) of the dummy wiring 30a may gradually become narrower from the central portion in the width direction (X direction) of the dummy pattern region 30 toward the side edge portion in the width direction (X direction) in accordance with the pitch of the antenna wiring 21.

[0256] In this case, the dummy wiring 30a has a shape in which a part of the unit pattern shape 20a (see FIG. 40(a)) of the antenna pattern region 20 described above is missing. That is, the shape of the dummy wiring 30a is a shape excluding a part of the L-shaped unit pattern shape 20a of the antenna pattern region 20. Thereby, the difference between the antenna pattern region 20 and the dummy pattern region 30 can be made difficult to visually recognize, and the antenna pattern region 20 disposed on the substrate 11 can be made less visible.

[0257] Thus, by disposing the dummy pattern region 30, which is electrically independent from the antenna pattern region 20, in the gap portion 61, the boundary between the antenna pattern region 20 and the gap portion 61 can be made unclear. Thereby, the antenna pattern region 20 can be made less visible on the surface of the display 91, and the user of the image display device 90 can be made less likely to recognize the antenna pattern region 20 with the naked eye.

[0258] (Modification 3) FIG. 47 shows a wiring board 10R according to Modification 3. In FIG. 47, the length (length in the Y direction) L at the center 40c in the width direction of the power supply unit 40 c is longer than the lengths (lengths in the Y direction) L at the respective width direction edges 40e1 and 40e2 of the power supply unit 40. d That is, the power supply unit 40 has a triangular shape in plan view, and the length (length in the Y direction) of the power supply unit 40 gradually decreases from the center 40c in the width direction toward the respective width direction edges 40e1 and 40e2. The power supply unit 40 has a linear long side 41a electrically connected to the antenna pattern region 20, and a pair of linear short sides 41b and 41c respectively connected to the long side 41a. Note that the planar shape of the power supply unit 40 is not limited to a triangular shape. For example, the short sides 41b and 41c may be formed in a stepped shape or an arc shape such as an arc.

[0259] Thus, by making the length L at the center 40c in the width direction of the power supply unit 40 c longer than the lengths L at the respective width direction edges 40e1 and 40e2, current is likely to concentrate at the center 40c in the width direction of the power supply unit 40. As a result, the current distribution becomes more uniform between the center 20c in the width direction and the width direction edges 20e1 and 20e2 of the antenna pattern region 20, so that the antenna characteristics can be further improved. Also, by making the length L of the center 40c in the width direction of the power supply unit 40 where current is likely to concentrate d longer, the heat generated in the power supply unit 40 can be dispersed, and the temperature rise of the power supply unit 40 can be suppressed. Furthermore, since the overall area of the power supply unit 40 can be reduced, the weight of the wiring board 10 can be reduced. c

[0260] (Modification 4) FIG. 48 shows a wiring board 10S according to Modification Example 4. In FIG. 48, a void portion 61 in which an antenna wiring 21 and an antenna connection wiring 22 are not provided is formed in the central portion 20c in the width direction of the antenna pattern region 20. Further, the antenna pattern region 20 has a first pattern region 20f and a second pattern region 20g separated via the void portion 61. The configuration of this antenna pattern region 20 is substantially the same as the configuration of the antenna pattern region 20 of the wiring board 10P shown in FIG. 45 (Modification Example 1).

[0261] Further, the power supply unit 40 has a triangular shape, and the length (length in the Y direction) at the central portion 40c in the width direction of the power supply unit 40 is longer than the lengths (lengths in the Y direction) at the respective width direction edge portions 40e1 and 40e2 of the power supply unit 40. The configuration of this power supply unit 40 is substantially the same as the configuration of the power supply unit 40 of the wiring board 10R shown in FIG. 47 (Modification Example 3).

[0262] In this case, the transparency of the wiring board 10 can be improved, and the current distribution in the antenna pattern region 20 can be made more uniform.

[0263] (Modification Example 5) FIG. 49 shows a wiring board 10T according to Modification 5. In FIG. 49, connection pattern regions 20m and 20n are provided between the central pattern region 20h of the antenna pattern region 20 and the first pattern region 20f and the second pattern region 20g, respectively. One connection pattern region 20m is provided between the central pattern region 20h and the first pattern region 20f, and the other connection pattern region 20n is provided between the central pattern region 20h and the second pattern region 20g. The connection pattern regions 20m and 20n are each substantially triangular in plan view and have inclined portions 20p and 20q formed obliquely with respect to the width direction (X direction) of the antenna pattern region 20. The inclined portions 20p and 20q each extend linearly, but are not limited thereto and may extend in a curved shape or a stepped shape. Also, the connection pattern regions 20m and 20n include antenna wirings 21 and antenna connection wirings 22 formed in a lattice shape or a mesh shape, similar to the central pattern region 20h and the second pattern region 20g. The other configuration is substantially the same as the configuration of the wiring board 10S shown in FIG. 48 (Modification 4).

[0264] In this case, the transparency of the wiring board 10 can be improved, and the current distribution in the antenna pattern region 20 can be made more uniform.

[0265] (Modification 6) FIG. 50 shows a wiring board 10U according to Modification 6. In FIG. 50, each antenna pattern region 20 includes a plurality of antenna wirings 21 having the function of an antenna and a plurality of antenna connection wirings 22 connecting the plurality of antenna wirings 21. In this case, the plurality of antenna wirings 21 are arranged at equal intervals from each other. Also, the plurality of antenna connection wirings 22 are arranged at equal intervals from each other. Note that the configuration of the power feeding portion 40 is substantially the same as the configuration of the power feeding portion 40 of the wiring board 10R shown in FIG. 47 (Modification 3).

[0266] In this way, since the plurality of antenna wirings 21 and the plurality of antenna connection wirings 22 are arranged at equal intervals, respectively, the size of the opening 23 becomes uniform within each antenna pattern region 20, and the antenna pattern region 20 can be made difficult to visually recognize with the naked eye. Also, the current distribution in the antenna pattern region 20 can be made more uniform.

[0267] It is also possible to appropriately combine a plurality of components disclosed in the above embodiments and modified examples as necessary. Alternatively, some components may be deleted from all the components shown in the above embodiments and modified examples.

Claims

1. A wiring board comprising: a substrate having transparency; an antenna pattern region disposed on the substrate and including a plurality of antenna wirings having a function as an antenna; the aperture ratio at the center in the width direction of the antenna pattern region being higher than the aperture ratio at the edge in the width direction of the antenna pattern region; a void portion where no antenna wiring is provided is formed at the center in the width direction of the antenna pattern region; the antenna pattern region has a first pattern region and a second pattern region separated by the void portion, the first pattern region and the second pattern region being respectively disposed at both edges in the width direction of the antenna pattern region, and the first pattern region and the second pattern region being electrically connected to each other by a central pattern region; a connection pattern region having inclined portions formed obliquely with respect to the width direction of the antenna pattern region is provided between the central pattern region and the first pattern region and the second pattern region, respectively. A wiring board.

2. The wiring board according to claim 1, wherein the pitch of the plurality of antenna wirings at the center in the width direction of the antenna pattern region is wider than the pitch of the plurality of antenna wirings at the edge in the width direction of the antenna pattern region.

3. The wiring board according to claim 1, wherein a dummy pattern region including a plurality of dummy wirings electrically independent of the antenna wirings is formed in the void portion.

4. The wiring board according to claim 1, wherein a power supply portion is electrically connected to the antenna pattern region, and the length of the power supply portion at the center in the width direction is longer than the length of the power supply portion at the edge in the width direction.

5. The wiring board according to claim 1, wherein a metal wire including the plurality of antenna wirings is formed in a lattice shape or a mesh shape over the entire first pattern region, the second pattern region, and the central pattern region.

6. The wiring board according to claim 4, wherein the power supply unit has a long side electrically connected to the antenna pattern region and a pair of short sides respectively connected to the long side.

7. The wiring board according to claim 6, wherein the power supply unit has a triangular shape in plan view.

8. The wiring board according to claim 6, wherein the short sides are stepped or arc-shaped.

9. A method for manufacturing a wiring board, comprising: preparing a substrate having transparency; forming an antenna pattern region including a plurality of antenna wirings having an antenna function on the substrate; the aperture ratio at the center in the width direction of the antenna pattern region is higher than the aperture ratio at the edge in the width direction of the antenna pattern region; a void portion where the antenna wiring is not provided is formed at the center in the width direction of the antenna pattern region; the antenna pattern region has a first pattern region and a second pattern region separated by the void portion, the first pattern region and the second pattern region are respectively arranged at both edges in the width direction of the antenna pattern region, and the first pattern region and the second pattern region are electrically connected to each other by a central pattern region; A method for manufacturing a wiring board, wherein a connection pattern region having an inclined portion formed obliquely with respect to the width direction of the antenna pattern region is provided between the central pattern region and the first pattern region and the second pattern region.

10. The method for manufacturing a wiring board according to claim 9, further comprising the step of forming a power supply unit electrically connected to the antenna pattern region on the substrate, the length at the center in the width direction of the power supply unit is longer than the lengths at both edges in the width direction of the power supply unit; The method for manufacturing a wiring board according to claim 9, wherein the power supply unit has a long side electrically connected to the antenna pattern region and a pair of short sides respectively connected to the long side.

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