Component crimping system and component crimping method

Abstract

To provide a component crimping system capable of improving the productivity of mounting boards.SOLUTION: A component crimping system 1 includes: a component crimping unit M1 that crimps a component 5a to a first edge 3a along one side in a circuit board 3; a board relay unit 10b that receives the circuit board 3 carried out from the component crimping unit M1 and changes the orientation of the circuit board 3; and a component crimping unit M2 that receives the circuit board 3 the orientation of which has been changed via the component crimping unit M1 to the board relay unit 10b, and crimps a component 5b to a second edge 3b along a side different from the one side in the circuit board 3.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a component crimping system for crimping components onto a substrate and the like.

Background Art

[0002] Conventionally, as a component crimping system for crimping electronic components (hereinafter simply referred to as "components") onto a substrate such as a liquid crystal panel, an assembly apparatus for an FPD (Flat Panel Display) module has been proposed (see Patent Document 1). In this component crimping system, which is an assembly apparatus, components are crimped to an end portion of a substrate via an ACF (Anisotropic Conductive Film), which is an anisotropic conductive member. Thereby, a mounting substrate, which is a substrate with components crimped thereon, is produced.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the component crimping system of Patent Document 1 described above has a problem in that the productivity of the mounting substrate is not sufficiently improved.

[0005] Therefore, the present disclosure provides a component crimping system and the like that can improve the productivity of the mounting substrate.

Means for Solving the Problems

[0006] A component crimping system according to an aspect of the present disclosure includes a first component crimping device that crimps a first component to a first edge along one side of a substrate, a substrate relay device that receives the substrate carried out from the first component crimping device and changes the orientation of the substrate, and a second component crimping device that receives the substrate with the changed orientation from the first component crimping device via the substrate relay device and crimps a second component to a second edge along a side different from the one side of the substrate.

[0007] These general or specific aspects may be implemented in a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, or may be implemented in any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. The recording medium may also be a non-transitory recording medium.

Advantages of the Invention

[0008] The component crimping system of the present disclosure can improve the productivity of a mounting substrate.

[0009] Further advantages and effects in an aspect of the present disclosure will be clarified from the specification and the drawings. Such advantages and / or effects are provided by some embodiments and the features described in the specification and the drawings respectively, but not all of them are necessarily provided in order to obtain one or more identical features.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0011] (Findings on which the present disclosure is based) The inventor has found that the following problems occur with respect to the component bonding system of Patent Document 1 described in the "Background Art" section.

[0012] The assembly apparatus, which is the component bonding system of Patent Document 1, includes a plurality of processing units. Those plurality of processing units constitute an assembly line. And one or more of those plurality of processing units attach an ACF to the long side of the substrate, temporarily bond components to the substrate via the ACF, and further perform final bonding. Also, the remaining one or more of those plurality of processing units attach an ACF to the short side of the substrate, temporarily bond components to the substrate via the ACF, and further perform final bonding. Thereby, the bonding of components to the long side of the substrate and the bonding of components to the short side of the substrate of a substrate that has been fed into the assembly line earlier than that substrate can be executed in parallel, that is, like pipeline processing. Thereby, the tact time can be shortened.

[0013] Here, in the component crimping system of Patent Document 1, the gate-side composite processing unit, which is one of one or more processing units that process the short side, attaches the ACF to the substrate and temporarily crimps the component to the substrate via the ACF. Then, in order to temporarily crimp the component to the substrate, the gate-side composite processing unit not only attaches and temporarily crimps the ACF but also changes the orientation of the substrate. However, when a unit that performs such component crimping also performs the operation of changing the orientation of the substrate, the tact time cannot be sufficiently shortened, and the productivity improvement of the mounting substrate becomes insufficient.

[0014] Therefore, in order to solve such problems, a component crimping system according to one aspect of the present disclosure includes a first component crimping device that crimps a first component to a first edge along one side of a substrate, a substrate relay device that receives the substrate carried out from the first component crimping device and changes the orientation of the substrate, and a second component crimping device that receives the substrate with the changed orientation from the first component crimping device via the substrate relay device and crimps a second component to a second edge along a side different from the one side of the substrate.

[0015] As a result, the crimping of the first component to the first edge of the substrate by the first component crimping device and the crimping of the second component to the second edge of the other substrate by the second component crimping device can be executed in parallel. Therefore, the tact time can be shortened. Note that the substrate processed by the second component crimping device is, for example, a substrate that was introduced into the component crimping system earlier than the substrate processed by the first component crimping device, and the first component is already crimped to the first edge. Also, the orientation of the substrate with the first component crimped to the first edge is changed before being carried into the second component crimping device. Therefore, since the substrate with its orientation changed is carried into the second component crimping device, the second component crimping device can crimp the second component to the second edge of the substrate without changing the orientation of the substrate. As a result, even when the second component crimping device is crimping a component to the substrate, the orientation of the substrate to be carried into the second component crimping device next can be changed, so that the tact time can be further shortened. Therefore, the productivity of the mounting substrate can be further improved.

[0016] Further, the second component crimping device may execute at least one processing step for crimping the second component to the substrate without changing the orientation of the substrate.

[0017] As a result, in the second component crimping device, the at least one processing step can be executed in a short period of time, and the productivity of the mounting substrate can be improved.

[0018] Further, the at least one processing step in the second component crimping device may include a second attaching step of attaching an anisotropic conductive member to an electrode portion formed at the second edge of the substrate, a second temporary crimping step of temporarily crimping the second component to the electrode portion via the anisotropic conductive member, and a second main crimping step of main-crimping the second component.

[0019] As a result, the second component can be appropriately crimped to the second edge of the substrate.

[0020] Further, the component crimping system further includes a substrate loading device for loading the substrate into the first component crimping device, and when the first orientation of the substrate to be loaded into the first component crimping device is different from the second orientation, the substrate loading device may change the first orientation of the substrate to the second orientation.

[0021] Thereby, regardless of the orientation of the substrate prepared for component crimping, before the substrate is loaded into the first component crimping device, the orientation of the substrate can be changed to the second orientation. For example, the second orientation is the orientation necessary for the first component crimping device to crimp the first component to the first edge of the substrate. Therefore, since the substrate in the second orientation is loaded into the first component crimping device, the first component crimping device can crimp the first component to the first edge of the substrate without changing the orientation of the substrate from the second orientation. As a result, even when the first component crimping device is crimping a component to the substrate, the orientation of the substrate to be subsequently loaded into the first component crimping device can be changed to the second orientation, so that the tact time can be further shortened. Therefore, the productivity of the mounting substrate can be further improved.

[0022] Further, the first component crimping device may execute at least one processing step for crimping the first component to the substrate without changing the orientation of the substrate from the second orientation.

[0023] Thereby, the first component crimping device can execute the at least one processing step in a short period of time, and the productivity of the mounting substrate can be improved.

[0024] Further, the at least one processing step in the first component crimping device may include a first pasting step of pasting an anisotropic conductive member to an electrode portion formed on the first edge of the substrate, a first temporary crimping step of temporarily crimping the first component to the electrode portion via the anisotropic conductive member, and a first main crimping step of main-crimping the first component.

[0025] As a result, the first component can be properly pressure-bonded to the first edge of the substrate.

[0026] Hereinafter, embodiments will be specifically described with reference to the drawings.

[0027] Note that all of the embodiments described below show comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, order of steps, etc. shown in the following embodiments are merely examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, components not described in the independent claims indicating the most general concept are described as optional components. Also, each figure is a schematic diagram and is not necessarily drawn precisely. Also, in each figure, the same constituent members are denoted by the same reference numerals.

[0028] (Embodiment) [Schematic Configuration of Component Pressure-Bonding System] FIG. 1 is a diagram showing a schematic configuration of a component pressure-bonding system according to the present embodiment.

[0029] The component pressure-bonding system 1 in the present embodiment is a system for producing a mounting substrate by pressure-bonding a component 5 to a substrate 3 which is a display panel such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel.

[0030] Note that component 5 is an electronic component such as a drive circuit. Specifically, component 5 is an IC (Integrated Circuit) chip, TCP (Tape Carrier Package), COF (Chip on Film), FPC (Flexible Printed Circuit), etc. In the present embodiment, the conveyance direction of substrate 3 is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, that is, the depth direction, is referred to as the Y-axis direction. Also, the negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side in the conveyance direction of substrate 3, respectively, the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side in the vertical direction, respectively, and the negative side and the positive side in the Y-axis direction correspond to the front side and the back side, or the near side and the far side in the depth direction, respectively.

[0031] As shown in FIG. 1, such a component bonding system 1 includes a substrate loading device 10a, a component bonding device M1, a substrate relay device 10b, a component bonding device M2, a substrate unloading device 10c, and a computer 2. The component bonding devices M1 and M2 are devices for bonding component 5 to substrate 3, respectively, and have an attaching portion 20, a temporary bonding portion 30, and a main bonding portion 40. The substrate loading device 10a, the substrate relay device 10b, and the substrate unloading device 10c are devices on which substrate 3 is placed for loading substrate 3 into the component bonding devices M1 and M2 or unloading substrate 3 from the component bonding devices M1 and M2. That is, substrate 3 is temporarily placed on the substrate loading device 10a, the substrate relay device 10b, and the substrate unloading device 10c.

[0032] The substrate loading device 10a is a device for loading substrate 3 into the component bonding device M1. Such a substrate loading device 10a receives substrate 3 from an operator or another device on the upstream side. That is, substrate 3 is temporarily placed on the substrate loading device 10a. Then, that substrate 3 is loaded into the attaching portion 20 of the downstream component bonding device M1.

[0033] In the component crimping device M1, the sticking part 20, the temporary crimping part 30, and the main crimping part 40 perform the following processes. First, the sticking part 20 receives the substrate 3 from the substrate loading device 10a, and sticks the ACF to each of one or more electrode parts 4 among the plurality of electrode parts 4 on the periphery of the substrate 3 that are pre-assigned to the component crimping device M1. Then, the substrate 3 with the ACF stuck thereto is transferred to the temporary crimping part 30. Each of the plurality of electrode parts 4 is constituted by, for example, a plurality of electrodes.

[0034] The temporary crimping part 30 receives the substrate 3 from the sticking part 20, mounts the component 5 on the part of the substrate 3 where the ACF is stuck, and temporarily crimps it. Then, the substrate 3 with the component 5 temporarily crimped thereto is transferred to the main crimping part 40.

[0035] The main crimping part 40 receives the substrate 3 from the temporary crimping part 30, and performs main crimping (also referred to as thermal crimping) on the component 5 temporarily crimped to the substrate 3. Then, the substrate 3 on which the main crimping of the component 5 has been performed is transferred to the substrate relay device 10b.

[0036] The substrate relay device 10b receives the substrate 3 from the main crimping part 40 of the component crimping device M1. That is, the substrate 3 is temporarily placed on the substrate relay device 10b. Then, the substrate 3 is transferred to the sticking part 20 of the downstream component crimping device M2. In this way, the substrate relay device 10b relays the substrate 3 between the component crimping device M1 and the component crimping device M2.

[0037] The component crimping device M2 receives the substrate 3 from the component crimping device M1 via the substrate relay device 10b, and performs the same processes as those of the component crimping device M1 on the substrate 3. That is, the component crimping device M2 crimps the component 5 to each of one or more electrode parts 4 among the plurality of electrode parts 4 on the periphery of the substrate 3 that are pre-assigned to the component crimping device M2. Then, the substrate 3 on which the main crimping has been performed by the main crimping part 40 of the component crimping device M2 is transferred to the substrate unloading device 10c.

[0038] The substrate unloading device 10c receives the substrate 3 from the main crimping part 40 of the component crimping device M2. That is, the substrate 3 is temporarily placed on the substrate unloading device 10c. Then, the substrate 3 is unloaded downstream.

[0039] The computer 2 is connected to the substrate loading device 10a, the component crimping device M1, the substrate relay device 10b, the component crimping device M2, and the substrate unloading device 10c, either wired or wirelessly, and controls these devices.

[0040] In this way, the component crimping system 1 executes a component mounting operation of mounting the components 5 on each of the plurality of electrode parts 4 provided on the peripheral edge of the substrate 3, and unloads the mounted substrate, which is the substrate 3 with the components 5 mounted thereon, from the substrate unloading device 10c.

[0041] Here, in the present embodiment, the component crimping device M1 crimps the component 5a along the first edge along one side of the substrate 3. The component crimping device M2 crimps the component 5b along the second edge along the side different from the one side of the substrate 3. For example, the substrate 3 is in the shape of a rectangular plate, the first edge is the edge along the short side of the substrate 3, and the second edge is the edge along the long side of the substrate 3.

[0042] In the present embodiment, the component crimping device M1 is also called the first component crimping device, and the component crimping device M2 is also called the second component crimping device. Also, the components 5a and 5b are examples of the component 5, and are also called the first component and the second component. The component 5a and the component 5b may be the same component or different components from each other.

[0043] [Detailed Configuration of Component Crimping Device] FIG. 2 is a plan view of the substrate relay device 10b, the component crimping device M2, and the substrate unloading device 10c in the present embodiment. Specifically, FIG. 2 shows the configuration of these devices as viewed from above.

[0044] The substrate relay device 10b includes a base 1a. A stage 11 on which the substrate 3 is placed is provided on the base 1a of the substrate relay device 10b. The stage 11 moves up and down in the Z-axis direction with respect to the base 1a. Further, a plurality of suction holes 11a are provided on the upper surface of the stage 11. Such a stage 11 sucks and holds the substrate 3 carried in from an operator or another device on the upstream side and placed on the stage 11 from the suction holes 11a by a suction device such as a pump (not shown) by vacuum suction.

[0045] The sticking part 20 has a function of performing a sticking operation (in other words, a sticking process) of sticking an ACF, which is an anisotropic conductive member, to the electrode part 4 of the substrate 3. The sticking part 20 includes a substrate moving mechanism 21 and a sticking mechanism 22.

[0046] The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. On the base 1b, an X-axis table, a Y-axis table, a Z-axis table, and a stage 23 are provided in order from below.

[0047] The Y-axis table is provided extending in the Y-axis direction and moves freely in the X-axis direction on the X-axis table. The Z-axis table moves freely in the Y-axis direction on the Y-axis table, raises and lowers the stage 23 provided on the upper part in the Z-axis direction, and rotates around the Z-axis.

[0048] Further, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 sucks and holds the substrate 3 placed on its upper surface by vacuum suction. In this way, the substrate moving mechanism 21 sucks and holds the substrate 3 and moves it in the horizontal plane (specifically, in the X-axis direction and the Y-axis direction), raises and lowers it in the vertical direction (specifically, in the Z-axis direction), and rotates it around the Z-axis.

[0049] The sticking mechanism 22 includes, for example, two sticking heads arranged in the X-axis direction above the base 1b. Each sticking head includes a supply unit for supplying ACF and a sticking tool for sticking the ACF to the substrate 3. Each of the two sticking heads sticks the ACF at a position corresponding to the electrode portion 4 on the substrate 3. Also, a sticking support base is provided at a position below each of the two sticking heads.

[0050] The temporary crimping unit 30 executes a temporary crimping process of mounting the component 5 on the region where the ACF of the substrate 3 is stuck (i.e., the crimping target portion) and temporarily crimping it. The temporary crimping unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component moving unit 35.

[0051] The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the sticking unit 20. Specifically, the substrate moving mechanism 31 has a stage 37 for holding the substrate 3. A plurality of suction holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 vacuum-sucks and holds the substrate 3 placed on the stage 37 by the plurality of suction holes 37a. Also, the substrate moving mechanism 31 has a function of moving the stage 37 that sucks and holds the substrate 3 in the horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z-axis. The substrate moving mechanism 31 positions the region where the ACF of the substrate 3 held by suction is stuck above the lower receiving portion 36, which is the backup stage of the component mounting mechanism 32, by the movement and rotation of the stage 37.

[0052] The component supply unit 33 is provided so as to protrude from the rear part of the base 1b to the back side (i.e., the positive Y-axis direction) of the component mounting mechanism 32. For example, the component supply unit 33 includes a supply reel 33a around which a strip-shaped component storage body such as a TCP is wound, a punching unit 33b, a movable stage 33c, and a rail 33d. Such a component supply unit 33 sequentially supplies the component 5 from the strip-shaped component storage body by the movement of these components.

[0053] The component moving unit 35 holds the component 5 supplied from the component supply unit 33 and moves it toward the crimping tool 34 included in the component mounting mechanism 32.

[0054] The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a lower receiving portion 36.

[0055] The lower receiving portion 36 supports from below a crimping target portion which is a predetermined portion on the substrate 3 held by the stage 37. Note that this crimping target portion is a portion where the ACF is adhered at the edge of the substrate 3. That is, the lower receiving portion 36 supports the edge of the substrate 3 where the component 5 is to be crimped from the lower side of the substrate 3.

[0056] The crimping tool 34 holds the component 5 and crimps the component 5 onto the substrate 3 held by the stage 37. That is, the crimping tool 34 crimps the component 5 onto the crimping target portion at the edge of the substrate 3 supported by the lower receiving portion 36. Specifically, the crimping tool 34 moves up and down in the Z-axis direction, sucks (i.e., picks up) the component 5 moved by the component moving unit 35 from above. Then, the crimping tool 34 mounts the sucked component 5 onto the ACF and presses the entire substrate 3 against the lower receiving portion 36 to temporarily crimp the component 5 onto the substrate 3. For example, the crimping tool 34 crimps the component 5 onto the substrate 3 in a state heated to about 80°C.

[0057] Note that the temporary crimping unit 30 may include a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees. Also, in the example shown in FIG. 2, the temporary crimping unit 30 temporarily crimps the component 5 of the TCP, but may also temporarily crimp a component 5 such as an IC supplied by a tray.

[0058] The main crimping unit 40 executes a main crimping process (i.e., a thermal crimping process) for thermally crimping (i.e., main crimping) the component 5 temporarily crimped onto the substrate 3 by the temporary crimping unit 30 onto the substrate 3. By doing so, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a main crimping unit 40 includes a substrate moving mechanism 41 and a crimping mechanism 42.

[0059] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the sticking portion 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 vacuum-sucks and holds the substrate 3 placed on the stage 49 by the plurality of suction holes 49a. Further, the substrate moving mechanism 41 has a function of moving the stage 49 that sucks and holds the substrate 3 in the horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By the movement and rotation of the stage 49 of the substrate moving mechanism 41, the region where the component 5 of the substrate 3 held by suction is temporarily pressure-bonded is positioned above the lower receiving portion 46 of the pressure-bonding mechanism 42.

[0060] The pressure-bonding mechanism 42 is provided on the base 1b and includes a pressure-bonding tool 43 and a lower receiving portion 46.

[0061] The pressure-bonding tool 43 is heated and presses the component 5 of the substrate 3 supported by the lower receiving portion 46 toward the lower receiving portion 46 side. For example, the pressure-bonding tool 43 presses the component 5 in a state heated to about 200°C. Thereby, the component 5 is permanently pressure-bonded, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

[0062] The substrate unloading device 10c may have the same configuration as the substrate relay device 10b. That is, the substrate unloading device 10c includes a base 1a and a stage 11. Such a substrate unloading device 10c has a function of vacuum-sucking and holding the substrate 3 unloaded from the main pressure-bonding portion 40 on the stage 11. The substrate 3 held in the substrate unloading device 10c is unloaded to another device on the downstream side or taken out from the stage 11 by an operator.

[0063] Note that the substrate loading device 10a may also have the same configuration as the substrate relay device 10b and the substrate unloading device 10c. Further, the component pressure-bonding system 1 may include a conveying unit 60.

[0064] The transfer unit 60 is a device for transferring the substrate 3. Specifically, the transfer unit 60 has a function of delivering the substrate 3 carried into the substrate loading device 10a to the sticking unit 20, the temporary crimping unit 30, the main crimping unit 40, and the substrate unloading device 10c in this order. The transfer unit 60 is disposed in the front region (i.e., the negative side in the Y-axis direction) of the sticking unit 20, the temporary crimping unit 30, and the main crimping unit 40.

[0065] The transfer unit 60 includes a substrate transfer mechanism 62A, a substrate transfer mechanism 62B, a substrate transfer mechanism 62C, and a substrate transfer mechanism 62D, which are arranged in order from the upstream side on a moving base 61 extending in the X-axis direction across two bases 1a and 1b.

[0066] The substrate transfer mechanisms 62A to 62D each include a base portion 63 and one or more arm units 64. In the present embodiment, a case where the substrate transfer mechanisms 62A to 62D each include two arm units 64 is illustrated.

[0067] The base portion 63 is provided on the moving base 61 and is movable freely in the X-axis direction. Two arm units 64 are provided side by side in the X-axis direction on the base portion 63. The arm unit 64 vacuum-sucks the substrate 3 from above.

[0068] Each of the substrate transfer mechanisms 62A to 62D moves to a substrate transfer position where it vacuum-sucks the substrate 3 held by the stages 11, 23, 37, and 49 from above, and receives or delivers the substrate 3 from or to the elevating stages 11, 23, 37, and 49. For example, the substrate transfer mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate loading device 10a and delivers it to the stage 23 of the sticking unit 20. Also, for example, the substrate transfer mechanism 62B receives the substrate 3 from the stage 23 of the sticking unit 20 and delivers it to the stage 37 of the temporary crimping unit 30. Also, for example, the substrate transfer mechanism 62C receives the substrate 3 from the stage 37 of the temporary crimping unit 30 and delivers it to the stage 49 of the main crimping unit 40. Also, for example, the substrate transfer mechanism 62D receives the substrate 3 from the stage 49 of the main crimping unit 40 and delivers it to the stage 11 of the substrate unloading device 10c.

[0069] FIG. 3 is a diagram for explaining the operation of the substrate relay device 10b in the present embodiment. Specifically, FIG. 3(a) shows a perspective view of the substrate relay device 10b, and FIGS. 3(b) and 3(c) show top views for explaining the rotation of the substrate 3 by the substrate relay device 10b.

[0070] As shown in FIG. 3(a), the substrate relay device 10b includes the above-described stage 11 on which the substrate 3 is placed and a stage drive shaft 12.

[0071] The stage drive shaft 12 moves up and down in the Z-axis direction by driving with an actuator such as a motor, and further rotates about a rotation axis along the Z-axis direction. The stage 11 is connected to the upper end of the stage drive shaft 12. Therefore, by moving up and down and rotating, the stage drive shaft 12 moves up and down the substrate 3 placed on the stage 11 and further rotates it. That is, the substrate relay device 10b in the present embodiment receives the substrate 3 carried out from the component pressing device M1 and changes the orientation of the substrate 3.

[0072] For example, as shown in FIG. 3(b), the substrate 3 placed on the stage 11 rotates 90° counterclockwise. That is, by this rotation, the orientation of the substrate 3 placed on the stage 11 is changed from the horizontal orientation to the vertical orientation. In the present embodiment, the vertical orientation is the orientation of the substrate 3 in which the longitudinal direction of the substrate 3 is along the Y-axis direction and the first edge portion 3a along the short side of the substrate 3 is directed to the positive side of the Y-axis direction. Also, in the present embodiment, the horizontal orientation is the orientation of the substrate 3 in which the longitudinal direction of the substrate 3 is along the X-axis direction and the second edge portion 3b along the long side of the substrate 3 is directed to the positive side of the Y-axis direction.

[0073] Thus, when the orientation of the substrate 3 is changed from the horizontal orientation to the vertical orientation by the substrate relay device 10b, the component pressing device M2 can press the component 5b against the electrode portion 4 formed on the first edge portion 3a of the substrate 3 without changing the orientation of the substrate 3.

[0074] Also, for example, as shown in FIG. 3(c), the substrate 3 placed on the stage 11 rotates 90° clockwise. By this rotation, the orientation of the substrate 3 placed on the stage 11 is changed from the vertical orientation to the horizontal orientation. Thus, when the orientation of the substrate 3 is changed from the vertical orientation to the horizontal orientation by the substrate relay device 10b, the component crimping device M2 can crimp the component 5b to the electrode portion 4 formed on the second edge portion 3b of the substrate 3 without changing the orientation of the substrate 3.

[0075] Note that the substrate relay device 10b can also change the orientation of the substrate 3 as shown in FIG. 3(b). However, in the component crimping system 1 of the present embodiment, as shown in FIG. 3(c), the orientation of the substrate 3 is changed. That is, the substrate 3 unloaded from the component crimping device M1 is placed on the stage 11 of the substrate relay device 10b in the vertical orientation and is changed to the horizontal orientation by the substrate relay device 10b. Then, the component crimping device M2 crimps the component 5b to the second edge portion 3b of the substrate 3. Also, the substrate loading device 10a and the substrate unloading device 10c may each have the same configuration as the substrate relay device 10b.

[0076] FIG. 4 is a diagram showing the change in the orientation of the substrate 3 conveyed in the component crimping system 1 of the present embodiment.

[0077] For example, the component crimping device M1 crimps the component 5a to the electrode portion 4 formed on the first edge portion 3a of the substrate 3. Note that the first edge portion 3a is an edge portion along the short side of the substrate 3. Also, the component crimping device M2 crimps the component 5b to the electrode portion 4 formed on the second edge portion 3b of the substrate 3. Note that the second edge portion 3b is an edge portion along the long side of the substrate 3.

[0078] In such a case, when the horizontal substrate 3 is placed on the stage 11 of the substrate loading device 10a, the substrate loading device 10a changes the orientation of the substrate 3 from horizontal to vertical by rotating the stage drive shaft 12 and the stage 11. As a result, the first edge 3a of the substrate 3 is directed toward the positive side in the Y-axis direction. Then, the vertically oriented substrate 3 is carried into the sticking portion 20 of the component pressing device M1.

[0079] The first edge 3a of the substrate 3 carried into the component pressing device M1 is directed toward the positive side in the Y-axis direction. As a result, each of the sticking portion 20, the temporary pressing portion 30, and the main pressing portion 40 of the component pressing device M1 performs a process for pressing the component 5a against the first edge 3a of the substrate 3 without changing the orientation of the substrate 3. That is, the sticking portion 20 of the component pressing device M1 attaches the ACF to the electrode portion 4 formed on the first edge 3a of the vertically oriented substrate 3. The substrate 3 with the ACF attached is transferred from the sticking portion 20 to the temporary pressing portion 30 in the vertical state. The temporary pressing portion 30 of the component pressing device M1 temporarily presses the component 5a against the electrode portion 4 formed on the first edge 3a of the vertically oriented substrate 3 via the ACF. The substrate 3 with the first component 5a temporarily pressed is transferred from the temporary pressing portion 30 to the main pressing portion 40 in the vertical state. The main pressing portion 40 of the component pressing device M1 performs main pressing on the component 5a temporarily pressed against the first edge 3a of the vertically oriented substrate 3.

[0080] Thus, the component pressing device M1 in the present embodiment executes at least one processing step for pressing the component 5a onto the substrate 3 without changing the orientation of the substrate 3 from vertical. The at least one processing step includes a first sticking step of attaching the ACF to the electrode portion 4 formed on the first edge 3a of the substrate 3, a first temporary pressing step of temporarily pressing the component 5a against the electrode portion 4 via the ACF, and a first main pressing step of main pressing the component 5a. Thereby, in the component pressing device M1, each of these processing steps can be executed in a short period of time, and the productivity of the mounting substrate can be improved.

[0081] The substrate 3 that has been subjected to main crimping by the component crimping device M1 is transferred from the main crimping unit 40 to the substrate relay device 10b in a vertical state. That is, the vertical substrate 3 is temporarily placed on the stage 11 of the substrate relay device 10b. The substrate relay device 10b changes the orientation of the substrate 3 from vertical to horizontal by rotating the stage drive shaft 12 and the stage 11. As a result, the second edge 3b of the substrate 3 is directed toward the positive side in the Y-axis direction. Then, the horizontally oriented substrate 3 is carried into the adhering unit 20 of the component crimping device M2. That is, the component crimping device M2 receives the substrate 3 with its orientation changed from the component crimping device M1 via the substrate relay device 10b.

[0082] The second edge 3b of the substrate 3 carried into the component crimping device M2 is directed toward the positive side in the Y-axis direction. As a result, each of the adhering unit 20, the temporary crimping unit 30, and the main crimping unit 40 of the component crimping device M2 performs a process for crimping the component 5b to the second edge 3b of the substrate 3 without changing the orientation of the substrate 3. That is, the adhering unit 20 of the component crimping device M2 attaches the ACF to the electrode portion 4 formed on the second edge 3b of the horizontally oriented substrate 3. The substrate 3 to which the ACF is attached is transferred from the adhering unit 20 to the temporary crimping unit 30 in a horizontal state. The temporary crimping unit 30 of the component crimping device M2 temporarily crimps the component 5b to the electrode portion 4 formed on the second edge 3b of the horizontally oriented substrate 3 via the ACF. The substrate 3 to which the component 5b is temporarily crimped is transferred from the temporary crimping unit 30 to the main crimping unit 40 in a horizontal state. The main crimping unit 40 of the component crimping device M2 performs main crimping on the component 5b temporarily crimped to the second edge 3b of the horizontally oriented substrate 3.

[0083] Thus, the component crimping device M2 in the present embodiment executes at least one processing step for crimping the component 5b to the substrate 3 without changing the orientation of the substrate 3 from horizontal. The at least one processing step includes a second adhering step of attaching the ACF to the electrode portion 4 formed on the second edge 3b of the substrate 3, a second temporary crimping step of temporarily crimping the component 5b to the electrode portion 4 via the ACF, and a second main crimping step of performing main crimping on the component 5b. Thereby, in the component crimping device M2, each of these processing steps can be executed in a short period of time, and the productivity of the mounting substrate can be improved.

[0084] Also, in the component crimping system 1 of the present embodiment, the component crimping device M1 crimps the component 5a to the first edge 3a of the substrate 3, and the component crimping device M2 crimps the component 5b to the second edge 3b of the substrate 3. Therefore, the crimping of the component 5a to the first edge 3a of the substrate 3 by the component crimping device M1 and the crimping of the component 5b to the second edge 3b of the other substrate 3 by the component crimping device M2 can be executed in parallel. Therefore, the tact time can be shortened. The substrate 3 processed by the component crimping device M2 is, for example, a substrate 3 that has been input into the component crimping system 1 earlier than the substrate 3 processed by the component crimping device M1, and the component 5a has already been crimped to the first edge 3a. Also, the orientation of the substrate 3 with the component 5a crimped to the first edge 3a is changed before being carried into the component crimping device M2. Therefore, since the substrate 3 with its orientation changed is carried into the component crimping device M2, the component crimping device M2 can crimp the component 5b to the second edge 3b of the substrate 3 without changing the orientation of the substrate 3. As a result, even when the component crimping device M2 is crimping the component 5b to the substrate 3, the orientation of the substrate 3 to be carried into the component crimping device M2 next can be changed, so the tact time can be further shortened. Therefore, the productivity of the mounting substrate can be further improved.

[0085] FIG. 5 is a flowchart showing the processing operation for the computer 2 in the present embodiment to control the substrate loading device 10a.

[0086] First, the computer 2 identifies the orientation of the substrate 3 placed on the substrate loading device 10a (step S1). Note that the orientation of the substrate 3 identified in step S1 is hereinafter also referred to as the first orientation. Specifically, the computer 2 may identify the orientation of the substrate 3 based on the output signal from a sensor attached to the substrate loading device 10a. For example, the sensor may be a camera that images the substrate 3. Also, when the substrate 3 is placed on the substrate loading device 10a in a state oriented in a predetermined orientation, the computer 2 may identify the predetermined orientation as the orientation of the substrate 3.

[0087] Next, the computer 2 identifies the orientation of the substrate 3 to be placed in the component pressing device M1 downstream of the substrate loading device 10a (step S2). Note that the orientation of the substrate 3 identified in step S2 is hereinafter also referred to as the second orientation. In the example of FIG. 4, this second orientation is a vertical orientation.

[0088] Then, the computer 2 determines whether the first orientation and the second orientation are equal (step S3). Here, when the computer 2 determines that they are equal (Yes in step S3), it ends the process for the substrate 3. On the other hand, when the computer 2 determines that the first orientation is different from the second orientation (No in step S3), it causes the substrate loading device 10a to rotate the substrate 3 so that the orientation of the substrate 3 becomes equal to the second orientation (step S4). That is, the computer 2 causes the substrate loading device 10a to rotate the substrate 3 so that the edge of the substrate 3 (specifically, the first edge 3a) to be processed by the component pressing device M1 is directed toward the positive side in the Y-axis direction.

[0089] As described above, in the substrate loading device 10a according to the present embodiment, when the first orientation of the substrate 3 to be carried into the component pressing device M1 is different from the second orientation, the first orientation of the substrate 3 is changed to the second orientation.

[0090] As a result, regardless of the orientation of the substrate 3 prepared for crimping the component 5a, before the substrate 3 is carried into the component crimping device M1, the orientation of the substrate 3 can be changed to a second orientation. Therefore, since the substrate 3 in the second orientation is carried into the component crimping device M1, the component crimping device M1 can crimp the component 5a to the first edge 3a of the substrate 3 without changing the orientation of the substrate 3 from the second orientation. As a result, even when the component crimping device M1 is crimping the component 5a to the substrate 3, the orientation of the substrate 3 to be carried into the component crimping device M1 next can be changed to the second orientation, so that the tact time can be further shortened. Therefore, the productivity of the mounting substrate can be further improved.

[0091] As described above, in the component crimping system 1 according to the present embodiment, the component crimping device M1 crimps the component 5a to the first edge 3a of the substrate 3, and the component crimping device M2 crimps the component 5b to the second edge 3b of the substrate 3. Then, the substrate carrying device 10a, the substrate relay device 10b, etc., which are not the component crimping device M1 and the component crimping device M2, change the orientation of the substrate 3. Thereby, the tact time can be shortened and the productivity of the mounting substrate can be improved.

[0092] (Modification example) In the above embodiment, the orientation of the substrate 3 is changed by 90°, but the angle of the change is not limited to 90°. The substrate relay device 10b of the component crimping system 1 in this modification example changes the orientation of the substrate 3 by 180°.

[0093] FIG. 6 is a diagram showing the change in the orientation of the substrate 3 conveyed by the component crimping system 1 in this modification example.

[0094] In this modification example, the component crimping device M2 crimps the component 5b to the electrode portion 4 formed on the third edge portion 3c along the side facing the first edge portion 3a of the substrate 3. In this case, when the vertically oriented substrate 3 unloaded from the component crimping device M1 is placed on the stage 11 of the substrate relay device 10b, the substrate relay device 10b changes the orientation of the substrate 3 by 180° by rotating the stage drive shaft 12 and the stage 11. That is, the orientation of the substrate 3 is changed from the vertical orientation to the reverse vertical orientation. The reverse vertical orientation is the orientation of the substrate 3 in which the longitudinal direction of the substrate 3 is along the Y-axis direction, the third edge portion 3c is directed toward the positive side of the Y-axis direction, and the first edge portion 3a is directed toward the negative side of the Y-axis direction.

[0095] Then, the substrate 3 in the reverse vertical orientation is carried into the sticking portion 20 of the component crimping device M2. That is, the component crimping device M2 receives the substrate 3 with its orientation changed from the component crimping device M1 via the substrate relay device 10b. In this way, when the orientation of the substrate 3 is changed from the vertical orientation to the reverse vertical orientation, the component crimping device M2 can crimp the component 5b to the electrode portion 4 formed on the third edge portion 3c of the substrate 3 without changing the orientation of the substrate 3.

[0096] As described above, the component crimping system according to one or more aspects of the present disclosure has been described based on the embodiments and their modification examples. However, the present disclosure is not limited to those embodiments and modification examples. As long as the gist of the present disclosure is not deviated from, various modifications conceived by those skilled in the art applied to the above embodiments and modification examples may also be included in the present disclosure.

[0097] For example, in the above embodiments and modification examples, the orientation of the substrate 3 is changed by 90° or 180°. However, the orientation of the substrate 3 may be changed by an angle different from these angles.

[0098] In the above-described embodiments and modifications, each of the component crimping devices M1 and M2 does not change the orientation of the substrate 3, but may be changed as necessary. For example, when the change in the orientation of the substrate 3 by the substrate relay device 10b does not occur accidentally, the component crimping device M2 may change the orientation of the substrate 3 instead of the substrate relay device 10b. That is, when the computer 2 monitors the operation of the substrate relay device 10b and detects that the orientation of the substrate 3 has not been changed in the substrate relay device 10b, the computer 2 may cause the component crimping device M2 to change the orientation of the substrate 3.

[0099] In the above-described embodiments and modifications, the computer 2 may be configured by dedicated hardware or may be realized by executing a software program. For example, in the computer 2, a program execution unit such as a CPU (Central Processing Unit) or a processor reads and executes a software program recorded on a recording medium such as a hard disk or a semiconductor memory. Here, the software that realizes the processing of the computer 2 in the above-described embodiments and modifications is a program that causes the computer 2 to execute each step of the flowchart in FIG. 5.

[0100] Further, the computer 2 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). The IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Here, although it is called an IC or an LSI, the name may change depending on the degree of integration, and it may be called a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). Also, an FPGA (Field Programmable Gate Array) programmed after the manufacture of the LSI can be used for the same purpose.

Industrial Applicability

[0101] The present disclosure can be used, for example, in a component crimping system for crimping components to a display panel.

Explanation of Signs

[0102] 1 Component crimping system 2 Computer 3 Substrate 3a First edge 3b Second edge 4 Electrode part 5, 5a, 5b Components 10a Substrate loading device 10b Substrate relay device 10c Substrate unloading device 11 Stage 12 Stage drive shaft 20 Adhesive part 21 Substrate moving mechanism 22 Adhesive mechanism 23 Stage 30 Temporary crimping part 31 Substrate moving mechanism 32 Component mounting mechanism 33 Component supply part 34 Crimping tool 35 Component moving part 36 Lower receiving part 37 Stage 40 Final crimping part 41 Substrate moving mechanism 42 Crimping mechanism 43 Crimping tool 46 Lower receiving part 49 Stage 60 Conveyor part M1, M2 Component crimping device

Claims

1. A first component crimping device that crimps a first component to a first edge along one side of a substrate; A substrate relay device that receives the substrate carried out from the first component crimping device and changes the orientation of the substrate; A second component crimping device that receives the substrate with its orientation changed from the first component crimping device via the substrate relay device and crimps a second component to a second edge along a side different from the one side of the substrate; And a substrate loading device for loading the substrate into the first component crimping device. The substrate loading device Changes the first orientation of the substrate to the second orientation when the first orientation of the substrate to be loaded into the first component crimping device is different from the second orientation. A component crimping system.

2. The second component crimping device executes at least one processing step for crimping the second component to the substrate without changing the orientation of the substrate. The component crimping system according to claim 1.

3. The at least one processing step in the second component crimping device A second pasting step of pasting an anisotropic conductive member to an electrode portion formed on the second edge of the substrate; A second temporary crimping step of temporarily crimping the second component to the electrode portion via the anisotropic conductive member; And includes a second main crimping step of main-crimping the second component. The component crimping system according to claim 2.

4. The first component crimping device executes at least one processing step for crimping the first component to the substrate without changing the orientation of the substrate from the second orientation. The component crimping system according to any one of claims 1 to 3.

5. The at least one processing step in the first component crimping device A first attaching step of attaching an anisotropic conductive member to an electrode portion formed at a first edge of the substrate; A first temporary crimping step of temporarily crimping the first component to the electrode portion via the anisotropic conductive member; Including a first main crimping step of main-crimping the first component; The component crimping system according to claim 4.

6. A loading step in which a substrate loading device loads a substrate into a first component crimping device; A first step in which the first component crimping device crimps a first component to a first edge along one side of the loaded substrate; A second step in which a substrate relay device receives the substrate unloaded from the first component crimping device and changes the orientation of the substrate; A third step in which a second component crimping device receives the substrate whose orientation has been changed from the first component crimping device via the substrate relay device, and crimps a second component to a second edge along a side different from the one side of the substrate; Including, In the loading step, When the first orientation of the substrate loaded into the first component crimping device is different from the second orientation, changing the first orientation of the substrate to the second orientation; Component crimping method.

Images