Method for manufacturing an adhesion retention jig

Abstract

To provide a method for manufacturing adhesive holding jigs with high accuracy in the thickness direction.SOLUTION: The present invention is a method for manufacturing an adhesive holding jig 10 having a substrate 11 and an adhesive layer 12 in this order and a plurality of convex portions 12a including the substrate 11 and the adhesive layer 12, and the method comprises: a first process of forming an adhesive layer 12 with a thickness T12 of 5 μm to 20 μm or less on the substrate 11; and the second process of forming a convex portion 12a by batch processing the substrate 11 and the adhesive layer 12 by irradiating a laser beam with a pulse width of femtoseconds or less.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an adhesiveness retention jig.

Background Art

[0002] In order to mount electronic components such as ceramic capacitors, chip resistors, coils, and semiconductor wafers on a substrate provided with a circuit, a mounting apparatus is known that adhesively holds the electronic components, transports them to the substrate, and then detaches them. For example, in Patent Document 1, a transfer unit has an adhesive sheet whose adhesive force is lost or reduced at a specified temperature, and by pressing and attaching the adhesive sheet to an element, the element is picked up. After bringing the element into contact with the substrate, by heating to a temperature equal to or higher than the specified temperature, an element mounting apparatus is disclosed that peels the picked-up element from the adhesive sheet and transfers it collectively.

[0003] In recent years, from the viewpoints of high image quality and high energy efficiency, a micro LED display in which micro LEDs are mounted on a circuit board has attracted attention. Also in the manufacturing process of a micro LED display, an adhesiveness retention jig is used as a member for transporting RGB LEDs of each color to a circuit board of the display and connecting them to the circuit board. Some such adhesiveness retention jigs are provided with adhesive convex portions corresponding to each LED. As a method for manufacturing an adhesiveness retention jig having convex portions, a method of applying and curing a composition for an adhesive layer on a base material and then performing uneven processing on the surface of the adhesive layer can be mentioned. Further, Patent Document 2 discloses a method of providing unevenness on a substrate by photolithography, and then electrostatically spraying an adhesive using a fine nozzle from above to provide an adhesive on the upper surface of the convex portion.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the method of applying uneven processing to the surface of the adhesive layer, since the rubber composition for the adhesive layer is applied, for example, to a thickness of several hundred micrometers and heat-cured, the end warps upward due to the shrinkage of the rubber, and the thickness of the adhesive layer at the end becomes thick. When the convex portion is processed in such a state, the vicinity of the end becomes higher than the required convex portion height. And if the convex portion height varies in the plane, even when the adherend is pressed against the adhesion retention jig with a constant pressure, there will be an adherend that cannot be adhesively retained. The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for manufacturing an adhesion retention jig with high accuracy in the thickness direction.

Means for Solving the Problems

[0006] The present invention is a method for manufacturing an adhesion retention jig including a substrate and an adhesive layer in this order and including a plurality of convex portions including the substrate and the adhesive layer, including: a first step of forming an adhesive layer having a thickness of 5 μm or more and 20 μm or less on the substrate; and a second step of forming convex portions by irradiating laser light with a pulse width of femtoseconds or less and collectively processing the substrate and the adhesive layer.

[0007] The adhesive layer preferably contains silicone rubber.

[0008] The height of the convex portion is preferably 10 μm or more and 50 μm or less.

Effects of the Invention

[0009] According to the present invention, an adhesion retention jig with high accuracy in the thickness direction can be manufactured.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described in detail. However, the following embodiments are presented for illustrative purposes, and the present invention is not limited to the embodiments shown below.

[0012] [Method for Manufacturing an Adhesiveness Retaining Fixture] An embodiment of the present invention will be described with reference to FIG. 1. As shown in FIG. 1, this embodiment is a method for manufacturing an adhesiveness retaining fixture 10 including a substrate 11 and an adhesive layer 12 in this order, and a plurality of convex portions 12a (see FIG. 1(d)) including the substrate 11 and the adhesive layer 12. The convex portion 12a is composed of the substrate 11 and the adhesive layer 12 formed thereon, and adheres and holds the adherend on the upper surface of the adhesive layer 12. Specifically, the method for manufacturing the adhesiveness retaining fixture of the present invention includes the following first step and second step.

[0013] <First Step> The uneven adhesive pattern of this embodiment is obtained as follows. As shown in FIGS. 1(a) and (b), first, the substrate 11 is prepared, and an adhesive layer 12 having a thickness of 5 μm or more and 20 μm or less is formed on the substrate 11. In the present invention, since the thickness of the adhesive layer 12 is 5 μm or more, the adherend can be adhered and held well, and since it is 20 μm or less, warping of the adhesive layer 12 near the end portion can be prevented.

[0014] (Substrate) The substrate 11 only needs to be formed of a material capable of supporting the adhesive layer 12. For example, it can be a metal plate such as glass, stainless steel, or aluminum, a metal foil such as aluminum foil or copper foil, a resin film such as polyester, polytetrafluoroethylene, polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene, or polyvinyl chloride, or a resin plate. Furthermore, the substrate 11 can also be a laminate formed by laminating a plurality of sheet-like materials of the above materials. By using a laminate with different materials, there is also an advantage that it becomes easier to adjust the height H 11 (see FIG. 3) of the substrate 11 at the convex portion 12a during laser processing.

[0015] The substrate 11 in the present embodiment is a rectangular disk-shaped body, but the substrate 11 only needs to have a smooth surface and can have various forms based on various design changes as long as it can support the adhesive layer 12. For example, it can be rectangular, circular, elliptical, or polygonal. The size of the substrate 11 can be 2 4 cm 2 or more and 400 cm or less. 11 The thickness T of the substrate 11 is not particularly limited and is appropriately selected according to the application. The thickness T 11 of the substrate 11 is preferably, for example, 0.1 mm or more and 3 mm or less.

[0016] Before applying the pressure-sensitive silicone rubber composition, in order to improve the adhesiveness between the substrate 11 and the adhesive layer 12, a primer layer may be formed on the substrate 11 by a known method as necessary.

[0017] (Adhesive layer) The adhesive layer 12 preferably contains silicone rubber. When the adhesive layer 12 contains silicone rubber, the adhesive layer 12 can be formed by vulcanizing a pressure-sensitive silicone rubber composition containing unvulcanized silicone rubber and an adhesive. The details of the pressure-sensitive silicone rubber composition will be described below.

[0018] -Adhesive silicone rubber composition- The adhesive silicone rubber composition contains (A) unvulcanized silicone rubber and (B) an adhesive.

[0019] --(A) Unvulcanized silicone rubber-- The (A) unvulcanized silicone rubber used in the present invention is a general addition reaction type liquid silicone rubber. The addition reaction type liquid silicone rubber consists of the following components. The addition reaction type liquid silicone rubber contains, as a main component, organopolysiloxane containing a vinyl group, a filler such as silica for reinforcement purposes, a platinum-based catalyst as a catalyst, and, if necessary, organohydrogenpolysiloxane, a reaction control material, silicone oil, additives, etc. for the purpose of imparting characteristics are blended and prepared. The material viscosity is adjusted to 50 to 2000 Pa·s. Also, a two-component heat-curing type material may be used.

[0020] --(B) Adhesive-- As the (B) adhesive, a silicone resin that is added to the silicone rubber and has heat resistance because molding is performed simultaneously is preferable. The silicone resin is an organopolysiloxane containing M units (R3SiO 1 / 2 ) and Q units (SiO 4 / 2 ). R represents a hydrogen atom, a hydroxyl group, or an organic group, and is preferably a methyl group from the viewpoint of being easily soluble in an organic solvent. Also, the organopolysiloxane may contain an OH group, a vinyl group, or a phenyl group. Examples of commercially available products include KR3701 and KR3700 manufactured by Shin-Etsu Chemical Co., Ltd., and SD4580 and SD4584 manufactured by Toray Dow Corning Co., Ltd.

[0021] The viscosity of the adhesive silicone rubber composition is preferably 50 Pa·s or more and 2000 Pa·s or less. The viscosity is a value measured according to JIS K 7117-1:1999.

[0022] In addition, the pressure-sensitive silicone rubber composition may contain additives such as a catalyst, a diluent, a colorant such as a pigment or a dye, a leveling agent, and an antistatic agent.

[0023] Vulcanization is carried out at a temperature of 100°C to 150°C for 10 minutes to form the adhesive layer 12 (see Fig. 1(b)).

[0024] - Rubber hardness - From the viewpoint of facilitating the holding and detachment of parts, the rubber hardness of the adhesive layer 12 obtained as described above is a value measured with a durometer type A in accordance with JIS K 6253, and is preferably 10° or more and 60° or less, more preferably 25° or more and 50° or less. When the rubber hardness is 10° or more, sufficient adhesive force can be obtained, and when it is 60° or less, the parts can be easily removed.

[0025] - Adhesive force - From the viewpoint of sufficiently holding the adherend, the adhesive force of the adhesive layer 12 is measured by the measurement method described below, and is preferably 1 to 60 g / mm 2 and more preferably 7 to 60 g / mm. 2 With the above adhesive force, for example, electronic components such as silicon wafers, flexible printed boards, glass plates for large-screen display devices, chip capacitors, ceramic capacitors, coil filters, resistance elements, conductive circuits, capacitors, LSIs, and inductors can be easily adhered and held, and can be easily removed as necessary. The adhesive force of the adhesive layer 12 can be measured by the following method.

[0026] The adhesive force of the adhesive layer 12 can be measured by the following method. - Measurement method - The measurement of the adhesive force is carried out as follows in a flat area where at least the measurement site on the surface of the adhesive layer 12 is flat. First, the adhesive layer 12 is fixed horizontally, and the measurement environment is set to 23 ± 2°C and a humidity of 50 ± 5%. Next, a contact made of stainless steel (SUS304) in the shape of a square column with a side length of 1 mm attached to a digital force gauge is lowered at a descending speed of 10 mm / min and brought into contact with the surface of the adhesive layer. Press this contact perpendicularly to the surface with a pressing load of 2.5 g / mm 2 for 3 seconds. Then, pull the contact perpendicularly away from the surface of the adhesive layer at a rising speed of 180 mm / min. At this time, read the pulling load with a digital force gauge. Perform this operation at 9 locations on the surface of the adhesive layer 12, and take the arithmetic mean of the obtained multiple pulling loads as the adhesive force of the adhesive layer 12.

[0027] -Surface roughness Ra- The surface roughness Ra of the upper surface of the convex portion 12a, which is the adhesion region of the adhesive layer 12, is preferably 0.01 μm or more and 1.0 μm or less, and more preferably 0.01 μm or more and 0.5 μm or less, from the viewpoint of facilitating the adhesion and detachment of the adherend. The surface roughness Ra is the average value measured at 5 points using a laser microscope VK-8710 manufactured by KEYENCE CORPORATION with an eyepiece lens magnification of 20 times and an objective lens magnification of 50 times.

[0028] <The second step> As shown in Fig. 1(c), the second step is a step of forming the convex portion 12a by irradiating laser light with a pulse width of femtoseconds or less (hereinafter simply referred to as laser light L) and collectively processing the substrate 11 and the adhesive layer 12. It is preferable to use the galvanometer scanner system 20 shown in Fig. 2 for the irradiation of the laser light L. The galvanometer scanner system 20 includes a laser oscillator 21, a collector lens 22, an X-axis scanning galvanometer 25 composed of a galvanometer mirror 23 and an X-axis motor 24, a Y-axis scanning galvanometer 28 composed of a galvanometer mirror 26 and a Y-axis motor 27, a control unit 29 for controlling the X-axis scanning galvanometer 25 and the Y-axis scanning galvanometer 28, and a focus lens 30.

[0029] The laser beam L emitted from the laser oscillator 21 passes through the collector lens 22, and its traveling direction is changed by the X-axis scanning galvanometer scanner 25 and the Y-axis scanning galvanometer scanner 28, and is focused on the region corresponding to the non-adhesive region 12b of the adhesive layer 12 by the focus lens 30. The X-axis motor 24 of the X-axis scanning galvanometer scanner 25 rotates the galvanometer mirror 23 to an appropriate angle according to the signal from the control unit 29, and scans the laser beam L in the X-axis direction. Similarly, the Y-axis motor 27 rotates the galvanometer mirror 26 of the Y-axis scanning galvanometer scanner 28 to an appropriate angle according to the signal from the control unit 29, and scans the laser beam L in the Y-axis direction. By irradiating the laser beam L in this way, the adhesive layer 12 and the substrate 11 are processed together to form the convex portions 12a (see Fig. 1(d)).

[0030] By using the galvanometer scanner system 20 capable of scanning the laser beam L in the X-axis and Y-axis directions as described above, the non-adhesive region 12b can be formed in one stroke without using the XY stage for placing the object to be irradiated. As a result, when a design change or the like of the product occurs, in the formation of the adhesive pattern by the conventional lithography method, it was necessary to newly produce a mask each time, but in the present invention, this is not necessary, and the manufacturing process can be simplified.

[0031] By using a femtosecond laser, cracks and debris do not occur in the adhesive layer 12 due to heat, and stable ultrafine processing is possible. In particular, by using a femtosecond laser, the shape of the convex portions 12a can be stabilized.

[0032] As shown in Fig. 3, the height H of the convex portions 12a 12a indicates the vertical distance between the upper surface of the convex portions 12a and the surface of the non-adhesive region 12b, that is, the bottom surface of the concave portion. The height H of the convex portions 12a 12a is the average value of the values measured at five points using the laser microscope VK-8710 manufactured by Keyence Corporation. The height H of the convex portions 12a 12ais preferably 10 μm or more and 50 μm or less. By being 10 μm or more, the non-adhesive region 12b can selectively and surely adhere only the object to be held without adhering parts or the like that are not the object to be adhesively held. Further, by being 50 μm or less, when the convex portion 12a is pressed against the object to be held, the convex portion 12a can surely adhesively hold the object to be held without bending. Further, the height H of the substrate 11 in the convex portion 12a 11 is the height H of the convex portion 12a 12a and the thickness T of the adhesive layer 12 12 Considering the relationship with and the strength of the convex portion, etc., it is preferably 20 μm or more and 40 μm or less.

[0033] <Object to be adhered> The adhesive holding jig 10 can hold and peel at least parts whose surfaces are made of metal, semiconductor, or resin. Further, since the adhesive holding jig 10 has the convex portions 12a with an extremely small surface area as described above, minute parts can also be adhesively held. The area of the surface of the object to be adhered that contacts the adhesive layer 12 is about 400 μm 2 ~40000 μm 2 or so.

Example

[0034] Hereinafter, the present invention will be described in detail by way of examples. [Example 1] (Formation of primer layer) An appropriate amount of primer liquid (X-33-156-20 manufactured by Shin-Etsu Chemical Co., Ltd.) was dropped onto a glass substrate (thickness 0.8 mm, length 40 mm × width 40 mm) installed on a spin coater (trade name "Spin Coater MS-B300", manufactured by Mikasa Co., Ltd.), and then spin-coated at 1000 revolutions for 20 seconds to form a primer layer. Further, a baking treatment was performed at 150 ° C. for 10 minutes in a dryer.

[0035] (Preparation of adhesive silicone rubber composition) Next, an adhesive silicone rubber composition was prepared using the following materials. (A) Unvulcanized silicone rubber: 100 parts of KE-1950-30 (B) Adhesive: 20 parts of KR-3700

[0036] (Formation of the adhesive layer) An appropriate amount of the above pressure-sensitive silicone rubber composition was dropped onto the primer layer and spin-coated at 1000 revolutions for 20 seconds using a spin coater (trade name "Spin Coater MS-B300", manufactured by Mikasa Co., Ltd.) to form an adhesive layer. Further, it was cured at 120 °C for 10 minutes in a dryer. Next, an after-cure was performed at 200 °C for 60 minutes in a dryer. Thickness T of the adhesive layer 12 was 10 μm.

[0037] Next, a femtosecond laser (pulse width: 600 fs, pulse energy: 40 μJ) was irradiated onto the region corresponding to the non-adhesive surface of the adhesive layer using a galvanometer scanner system to process the adhesive layer and the substrate together. In this way, protrusions having an adhesive surface with a height of 40 μm and a size of 30 μm × 30 μm were formed at a pitch of 150 μm as shown in FIG. 4. Height H of the substrate in the protrusions that become the adhesive region 11 was 30 μm, the thickness T of the adhesive layer 12 was 10 μm, and the height H of the protrusion 12a was 40 μm.

[0038] Thickness T of the adhesive layer 12 was calculated from the difference between the thickness of the substrate before silicone rubber molding and the thickness after molding, measured with a laser displacement meter (trade name "LT-9030M", manufactured by Keyence Corporation). Height H of the protrusion 12a was measured using a laser microscope (trade name "VK-8710", manufactured by Keyence Corporation) with an eyepiece lens magnification of 20 times and an objective lens magnification of 50 times. Height H 11 is H 12a subtracting T 12 from it.

[0039] [Comparative Example 1] (Formation of Primer Layer) An appropriate amount of primer solution (X-33-156-20 manufactured by Shin-Etsu Chemical Co., Ltd.) was dropped onto a glass substrate (thickness 0.7 mm, length 40 mm × width 40 mm) placed on a spin coater (product name "Spin Coater MS-B300", manufactured by Mikasa Corporation). After that, spin coating was performed at 1000 revolutions for 20 seconds to form a primer layer. Further, baking treatment was carried out at 150 °C for 10 minutes using a dryer.

[0040] (Preparation of Pressure-Sensitive Silicone Rubber Composition) Next, a pressure-sensitive silicone rubber composition was prepared using the following materials. (A) Unvulcanized silicone rubber: KE-1950-30 100 parts (B) Adhesive: KR-3700 20 parts

[0041] (Formation of Adhesive Layer) An appropriate amount of the above pressure-sensitive silicone rubber composition was dropped onto the primer layer and cured at 120 °C for 10 minutes by press molding. Next, post-cure was carried out at 200 °C for 60 minutes using a dryer. The thickness T of the adhesive layer 12 was 300 μm.

[0042] Next, a femtosecond laser (pulse width: 600 fs, pulse energy: 40 μJ) was irradiated onto the region corresponding to the non-adhesive surface of the adhesive layer using a galvanometer scanner system to process the adhesive layer. In this way, convex portions having an adhesive surface with a height of 40 μm and a size of 30 μm × 30 μm were formed at a pitch of 150 μm as shown in FIG. 4.

[0043] (Evaluation) Regarding the overall thickness of the adhesive retention jigs of Example 1 and Comparative Example 1, five-point measurements were taken using a laser displacement meter (product name "LT-9030M", manufactured by Keyence Corporation). The difference between the maximum thickness and the minimum thickness of the entire adhesive retention jig of Example 1 was 4 μm. On the other hand, the difference between the maximum thickness and the minimum thickness of the entire adhesive retention jig of Comparative Example 1 was 37 μm. Thus, it can be seen that the adhesiveness retention jig of the present invention has high accuracy in the thickness direction.

Explanation of Signs

[0044] 11 Substrate 12 Adhesive layer 12a Protrusion 12b Non - adhesive region T 11 Thickness of the substrate T 12 Thickness of the adhesive layer H 11 Height of the substrate at the protrusion H 12a Height of the protrusion 20 Galvano scanner system 21 Laser oscillator 22 Collector lens 23, 26 Galvano mirror 24 X - axis motor 25 X - axis scanning galvano scanner 27 Y - axis motor 28 Y - axis scanning galvano scanner 29 Control unit 30 Focus lens

Claims

1. A method for manufacturing a sticky holding jig comprising a substrate and an adhesive layer in this order, and a plurality of convex portions including the substrate and the adhesive layer, A first step of forming the adhesive layer having a thickness of 5 μm or more and 20 μm or less on the substrate, A second step of forming the convex portion by irradiating laser light having a pulse width of femtoseconds or less and collectively processing the substrate and the adhesive layer, having, A method for manufacturing a sticky holding jig in which the height of the convex portion is 10 μm or more and 50 μm or less.

2. The method for manufacturing a sticky holding jig according to claim 1, wherein the adhesive layer contains silicone rubber.

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