System and method for cleaning contact elements and support hardware or wire bonds using a functionalized surface microfeature portion

Abstract

A cleaning material, device, and method for predictably cleaning contact elements and supporting hardware of a tester interface, such as a probe card and test socket, or wire bonders and capillary tubes, wherein the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements or capillary tubes, and the substrate has a defined functionalized surface topology and geometry that can be introduced into the test apparatus during normal test operations. The cleaning material has a predetermined topography with a plurality of functional three-dimensional (3D) microstructures that provide performance characteristics not possible on a flat, unfunctionalized surface.

Description

Technical Field

[0001] Claims of Priority This application is a continuation application and claims priority to U.S. Patent Application No. 16 / 855,841, filed on Apr. 22, 2020, and also claims priority to U.S. Patent Application No. 16 / 684,453, filed on Nov. 14, 2019, the entire contents of both of which are incorporated herein by reference.

[0002] The present disclosure generally relates to materials, devices, and methods for predictably and consistently cleaning test instrument interface contact elements and support hardware, such as probe cards and test sockets, or wire bonding apparatuses and capillary tubes.

Background Art

[0003] Individual semiconductor (integrated circuit) devices are typically produced by creating multiple devices on a semiconductor wafer using known semiconductor processing techniques that may include photolithography, deposition, and sputtering. Generally, these processes are aimed at creating fully functional integrated circuit devices (ICs) at the wafer level. Ultimately, the individual IC devices are singulated or diced from the semiconductor wafer into separate and individual dies. The singulated IC devices are assembled for encapsulation using known assembly techniques that may include die attachment to a lead frame, wire bonding, or ball bonding, for final completion within a package, or incorporation into an electronic device, and typically various molding techniques to provide a body portion to a package having external electrical connectivity.

[0004] However, in reality, physical defects in the wafer itself and / or defects in the wafer processing can inevitably result in some dies on the wafer being fully functional, some dies being non-functional, and some dies having lower performance or requiring repair. Generally, it is desirable to identify which of the dies on the wafer are fully functional before singulation from the wafer and assembly into consumer devices. Non-functional devices, devices with lower performance, and repairable devices due to specific physical defects in the wafer, defects in the IC circuit layers, and / or defects related to semiconductor processing technologies can be identified prior to singulation by a process called wafer-level testing (often referred to as "wafer sort" in the art). When product performance is determined by electrical testing, classifying or sorting IC devices at the wafer level according to the capabilities of the products can enable the manufacturer to save significant costs in subsequent manufacturing processes and provide increased profits from the sale of the highest-performance devices.

[0005] Once the devices are singulated, certain process steps during handling and assembly can potentially introduce die saw defects, handling defects, assembly, and packaging-related defects, which can simply be electrically identified as fully functional, non-functional, or potentially "repairable". In reality, assembled and packaged semiconductor devices are subject to a series of electrical test processes before their final completion or incorporation into an electronic device. The processes in package-level or final pre-shipment testing include, but are not limited to, testing of singulated devices, whether bare dies, packaged ICs (temporary or permanent), or variations therebetween.

[0006] In general, the electrical testing of IC devices at either the wafer level or the package level is accomplished using an automatic test equipment (ATE) that is mechanically and electrically configured to stimulate the semiconductor device, operate the device according to adaptive test techniques and functional routines, and inspect the output to determine proper functionality.

[0007] For wafer-level testing, the traditional interface hardware is a "probe card", to which are connected a plurality of probe elements, power, GND, and process monitoring pins that align with the placement of the device under test (DUT) input / output (I / O) pads. More specifically, in a typical wafer test process, the probe card is mounted on a prober, and the probe contact elements (simply referred to as "probes") are brought into contact with the bonding pads, solder balls, bumps, pillars, or pillar bumps formed on the die of the wafer. By applying a controlled displacement of the probe tip with respect to the bonding pads, solder balls, bumps, pillars, or pillar bumps, an electrical connection is achieved, enabling the transmission of power signals, ground signals, and test signals. The repeated scrubbing, deformation, and penetration of the probe tip against the bonding pads, solder balls, bumps, pillars, or pillar bumps generate debris and contaminants that adhere and accumulate on the probe contact surface.

[0008] In a package-level test, a test-fixture board provides an interface between an automatic test equipment (ATE), or a manual test equipment, and a DUT. The test-fixture board conventionally includes one or more contactor assemblies, sometimes referred to as "test sockets", into which the DUT is inserted. During the test process, the DUT is inserted or placed into the socket by an operator and held in place over the duration of the test. After insertion into the socket, the DUT is electrically connected to the ATE through the test-fixture board, its sub-assemblies, and other interface devices via pin elements. The contact pin elements associated with the ATE are arranged to physically and electrically contact the metallized contact surfaces of the DUT. These surfaces can include test pads, lead wires, pin connectors, bond pads, solder balls, and / or other conductive media. The functional, static, and dynamic performance tests of the DUT are evaluated through various electrical inputs, and the response to the outputs is measured. Repeated testing can cause the contact element tips to become contaminated with substances such as aluminum, copper, lead, tin, gold, by-products, organic films, or oxides resulting from the wafer and semiconductor device manufacturing and test processes.

[0009] One of the main challenges encountered in both types of IC tests (wafer-level and package-level) is to ensure optimal electrical contact between the contact pins associated with the contactor elements and the contact surfaces of the DUT. In each test procedure, repeated contact of the pin contact elements onto bonding pads, solder balls, bumps, pillars, or pillar bumps accumulates debris and other residues in the contact area of the pin elements, contaminating them. This debris can originate from the test and handling processes themselves, or can include manufacturing residues from the device fabrication and / or assembly processes, or other sources.

[0010] In addition to the presence of contaminants, repeatedly passing current through the small intermetallic "spots" of the contact pins can degrade the conductive characteristics of the contact surface, thus affecting the intermetallic material for proper electrical testing. Coupled with the degradation of the contact surface, when contaminants accumulate, the contact resistance (CRES) increases, reducing the reliability of the test. The increasing CRES and unstable CRES can affect yield and / or test time as the yield recovery test increases. Such incorrect readings can result in the incorrect rejection of otherwise good DUTs, often resulting in a dramatic yield decrease. Yield recovery may be possible through multi-pass testing, but retesting the device multiple times to verify the device or achieve yield recovery increases the overall production cost, reduces throughput, affects assembly, and creates the potential for long-term reliability degradation.

[0011] The high-performance requirements of wafer-level and package-level test contactor technologies have driven the development of uniquely shaped and customized contact elements with pre-determined and designed mechanical and electrical performance characteristics. Many of the new advanced contact technologies have unique contact element geometries and mechanical behaviors to promote consistent, repeatable, and stable electrical contact. Some of this technology is constructed using lithographic assembly techniques, some are built using MEMS-based processes, while others are fabricated using high-precision microfabrication techniques. The improved electrical characteristics of the contactors are also achieved using various materials with improved electrical performance and oxidation resistance. The contact elements are designed to promote consistent oxide penetration while reducing the applied stress on bonding pads, solder balls, bumps, pillars, or pillar bumps. However, there is still a need to physically contact the bonding pads, solder balls, bumps, pillars, or pillar bumps, which can generate debris and contaminants that can affect the results from the electrical performance test procedures.

[0012] Typically, the debris generated will cause increased contact resistance, poor conductivity, and build-up that results in artificially lower yields and subsequent increased product costs and reduced throughput, and incorrect test indications, and thus needs to be periodically removed from the contact elements to prevent this.

[0013] In response to the problem of particles adhering to contact elements and support hardware, several techniques have been developed. For example, one technique uses a cleaning material made of silicone rubber that provides a matrix for abrasive particles. Additionally, a cleaning medium mounted on a cleaning wafer, or an abrasive ceramic cleaning block that is rubbed against a probe needle, can be used, or a rubber matrix with abrasive particles and a brush cleaner made of glass fiber can also be used. In one technique, the probe needle can be sprayed with or immersed in a cleaning solution. In another technique, an open-cell foam-based cleaning device having random surface-shaped voids and variable heights can be used.

[0014] In one conventional contact element cleaning process, some combination of brushing, blowing, and water washing of the contact pins and / or the contactor body is used. This process requires stopping the test operation, manual intervention to perform the cleaning, and perhaps removing the test interface (probe card, socket, etc.) from the test environment. This method can result in inconsistent debris removal and may not result in sufficient cleaning action within the geometric features of the shaped contact element. After cleaning, the test interface must be reinstalled and the test environment must be re-established so that the test can resume. In some cases, the contact elements are removed, cleaned, and reinstalled, resulting in increased costs due to unexpected equipment downtime.

[0015] In another conventional method, a cleaning pad with a polished surface coating or a polished polyurethane foam layer is used to remove foreign matter adhering to the contact element. The adhering foreign matter is rubbed off the contact element and the support hardware by repeatedly rubbing the contact element against (and perhaps into) the cleaning pad. The cleaning process using a polishing pad abrades the contact element, but it does not necessarily remove debris. In fact, vanishing causes polishing wear on the contact element, thereby changing the shape of the contact geometry, changing the contact performance, and shortening the service life of the contactor.

[0016] Maximum cleaning efficiency is achieved when debris removal from the contact element and support hardware is consistently and regularly performed during the cleaning process without affecting the performance of the contact element. The cleaning process using a polishing pad constructed from an open-cell foam does not result in consistent cleaning. In fact, the vanishing action due to the randomly oriented and uncontrolled foam structure causes non-uniform and preferential polishing wear on the contact element, thereby unexpectedly changing the shape and mechanical properties of the contact geometry of the contact element and the support hardware, and thus unexpectedly shortening the service life of the contactor.

[0017] The industry has found that tester interface hardware consisting of multiple contact elements, as many as 150,000 test probe elements, and support hardware can cost over $1 million per ATE test cell. Early wear and damage due to inappropriate or suboptimal cleaning activities can amount to millions of US dollars per year per ATE test cell. Therefore, for the tens of thousands of ATE test cells operating worldwide, the impact on repair, maintenance, and relocation costs can be extraordinary.

[0018] As another attempt to improve the conventional probe cleaning process, the use of a sticky abrasive-filled or unfilled polymeric cleaning material to remove foreign matter can be mentioned. More specifically, the polymeric pad is brought into physical contact with the contact element. The adhered debris is loosened by the sticky polymer, adheres to the polymer surface, and is thereby removed from the contact element and other test hardware. The polymeric material is designed to maintain the overall shape of the contact element, but the interaction with the polymeric layer may not result in sufficient cleaning action within the geometric features of the formed contact element.

[0019] When cleaning with an abrasive-filled or abrasive-coated material film having a continuous uniform surface, or a surface with randomly oriented and randomly spaced surface features, preferential polishing is revealed through the "edge pin" effect (e.g., the peripheral contact elements of a test probe array are polished and worn at a different rate than the contact elements within the array), or through the "adjacent pin spacing" effect (e.g., closely spaced contact elements are worn at a different rate than widely spaced contact elements), or through the "adjacent pin orientation" effect (e.g., the spatial proximity of contact elements causes preferential and asymmetric wear of the contact elements). The non-uniform polishing and wear of the contact elements and support hardware will affect the performance consistency during IC semiconductor device testing, and may result in unexpected yield loss, equipment downtime, and repair costs.

[0020] Typical contact element cleaning processes at the wafer level and package level can be expensive for end users because the contactors can be uncontrollably worn at different rates by the polish-based contact cleaning process. When using abrasive particles, the rate of wear or dimensional reduction of critical contact element geometries can be dramatically affected by relatively small changes (on the order of 2 - 3%) in the compliance of the abrasive layer, surface features, and the compliance of the underlying layer. In the thousands of IC device test units (probers and handlers) operating worldwide, the impact on the industry from maintaining clean contact elements without premature wear during testing can be extraordinary. SUMMARY OF THE INVENTION

Problems to be Solved by the Invention

[0021] These methods, these test apparatuses, the contact elements of these test apparatuses having critical contact element geometries, wire bonding apparatuses, and their capillary tubes are not properly cleaned. Accordingly, there is a need for improved methods and apparatuses for cleaning and maintaining contact elements and wire bonding apparatus capillary tubes.

Brief Description of the Drawings

[0022]

FIG. 1A

FIG. 1B

FIG. 1C

FIG. 1D

FIG. 2A

FIG. 2B

FIG. 2C

FIG. 3A

FIG. 3B

FIG. 4A

FIG. 4B

FIG. 4C

FIG. 5

FIG. 6A

FIG. 6B

FIG. 6C

FIG. 7

FIG. 8A

FIG. 8B

FIG. 8C

FIG. 8D

FIG. 8E

FIG. 8F

FIG. 9A

FIG. 9B

FIG. 9C

FIG. 9D

FIG. 9E

FIG. 9F

FIG. 10A

FIG. 10B

FIG. 11A

FIG. 11B

FIG. 12

FIG. 13A

FIG. 13B

FIG. 14A

FIG. 14B

FIG. 15

DETAILED DESCRIPTION OF THE INVENTION

[0023] The present disclosure is particularly applicable to a cleaning pad for a capillary tube of an electrical test probe or a wire bonding apparatus having a contact element, the cleaning pad having a predetermined geometry and mechanical properties. The contact element being cleaned may be any type of test probe, such as a cantilever wire needle, a vertical probe, a cobra probe, MEMS type vertical and MEMS type microcantilever probes, a plunger probe, a spring probe, a sliding contact, a contact bump probe formed on a thin film, etc., and the associated support structure is used for a tester interface device (i.e., a probe card, a test socket, and other similar interface devices) utilized for wafer level and package level testing. Although the present disclosure is described in this context, the cleaning material, device, and method have greater utility, such as cleaning test interfaces utilized by other types of IC semiconductor device evaluation facilities, such as spring pin ring interfaces, ZIFF male / female connectors, etc. Further, the cleaning material, device, and method have greater utility since they can be used to clean any device having a capillary tube clogged with various substances over time, which can also be used to clean or re-polish other assembly devices, and the device, mechanism, and method may still be implemented using variations of the embodiments disclosed below that are within the scope of the present disclosure.

[0024] In one embodiment, a cleaning device and method incorporating a cleaning pad structure with surface functionality or surface variability are disclosed. Surface functionalization by predefined microfeatures of custom geometries effectively facilitates an adjustable behavior that modifies the mechanical properties of the cleaning surface to achieve specific performance goals such as contact surface cleaning, tip shaping, debris removal and collection, and surface texturing. Materials having a structurally functionalized regular structured surface include nanoscale features generated in a controlled manner at the microscale level by imprinting, molding, casting, coating, film deposition, spray deposition, or other surface modification for the purpose of improving material cleaning efficiency and mechanical performance. In addition, the equipment and labor for repairing and repositioning contactors worn by the abrasive contact cleaning process impose additional costs on the tasks performed.

[0025] In one embodiment, the cleaning material has a surface functionalized by three-dimensional (3D) microfeatures that have specific abrasive and debris removal effects for cleaning electrical contact elements and structures used for tester interface devices (i.e., probe cards, test sockets, and other similar interface devices) utilized in wafer-level and package-level testing, or for cleaning capillary tubes for wire bonding devices, which is not possible with a flat non-functionalized surface, and can be a compliant, semi-rigid, or rigid medium. Surface functionalization, or surface variability, with adjustable behavior is an effective way to modify the mechanical properties of the cleaning surface to achieve specific performance goals such as contact surface cleaning, tip shaping, debris removal and collection, and surface texturing, or cleaning the inner and outer surfaces of capillary tubes. Materials having a structurally functionalized surface include nanoscale features generated in a controlled manner at the microscale level by imprinting, molding, casting, coating, film deposition, spray deposition, or other surface modification for the purpose of improving material cleaning efficiency and mechanical performance.

[0026] In one embodiment, a functionalized coating having predetermined properties such as thickness, hardness, adhesion, etc. can be applied to the surface of the cleaning pad over existing structural features and over new types of cleaning materials that can be adjusted and optimized for electrical contact elements and structural applications or capillary tubes, and over micro features to implement a well-defined set of functions. The high level of cleaning effectiveness can be obtained through functionalizing the cleaning surface in combination with an adhesive or abrasive surface coating, exposed abrasive particles for variable abrasive efficiency, and also depending on the type and shape of the contact element being cleaned, the composition and amount of debris to be removed, and the affinity of the debris to the contact surface, to conform to pads, bumps, or pillars of semiconductor devices. The high level of cleaning effectiveness can also be obtained through functionalizing the cleaning surface so as to be able to clean the inner and outer surfaces of the capillary tube for wire bonding devices.

[0027] More specifically, the functionalized cleaning material can be constructed with one or more support layers each having predetermined mechanical, material, and dimensional characteristics such as abrasiveness, density, elasticity, adhesion, flatness, thickness, porosity, etc., with predetermined pad, bump, or pillar surface features or functional surface coatings. The cleaning device can have a sacrificial top protective layer of material that can be applied before, during, or after the manufacturing process to protect and isolate the cleaning material surface from contamination during the manufacturing process and manual operations. The sacrificial layer is removed upon installation into a semiconductor or other test facility and is used to ensure that there is no contamination on the working surface of the cleaning material that would impair the cleaning performance of the contact element or capillary tube by the cleaning material.

[0028] The cleaning layer and the functionalized 3D surface features can be made of solid elastomeric materials or porous open-cell or closed-cell foam materials, or other known elastomeric materials, including rubber, both synthetic and natural polymers, and polyurethanes, acrylics, etc. The functionalized surface features can have predetermined abrasive, elastic, density, and surface energy parameters that allow the contact element to deform while maintaining the integrity of the elastomeric matrix, penetrate the elastomeric material, and remove debris from the contact area without damage to the geometry of the contact element. In the case of capillary tubes, the functionalized surface features can have predetermined abrasive, elastic, density, and surface energy parameters that allow the inner and outer surfaces of the capillary tube to be effectively cleaned while maintaining the integrity of the elastomeric matrix.

[0029] The cleaning material can also have a multi-layer structure in which one or more compliant layers are arranged or laminated to obtain a predetermined overall performance such that when the pin or contact element touches and deforms on the functionalized features and pad surface, a defined counteracting force is imparted by the material into the contact area and 3D structure, increasing the efficiency of debris and contaminant removal. The cleaning material with the multi-layer structure also cleans the inner and outer surfaces of the capillary tube.

[0030] In one embodiment (examples of which are shown in FIGS. 4A-4C and 5), the cleaning material may have a surface layer with a plurality of predefined "positive" geometric microfeatures such as columns, pyramids, or other such structural microfeatures, having a predefined aspect ratio (diameter or length and width vs. height), cross-section (square, circular, triangular, etc.). In another embodiment (examples of which are shown in FIGS. 6A-6C and 7), the cleaning material may have a surface layer with a plurality of predefined "negative" or "reverse" geometric microfeatures. The "positive" and "negative" microfeatures may be made of a solid elastomeric material or a closed-cell foam material, including rubber, both synthetic and natural polymers, and other known elastomeric materials such as polyurethane, acrylic, polymers, etc. The surface layer may have abrasive particles loaded or exposed abrasives to improve debris removal and collection efficiency.

[0031] In other embodiments, the "positive" and "negative" microfeatures may have abrasive particles applied to the top surface along the length of the microfeature, within the body of the microfeature, or at the bottom of the microfeature. In particular, typical microfeatures (whether positive or negative) may have various cross-sectional widths of 15 μm or less at a height of 400 μm or less, a spacing of 250 μm or less, and an average abrasive particle size of less than 30 μm. Typical abrasives that may be incorporated within and throughout the material layer and features may include aluminum oxide, silicon carbide, tantalum oxide, and diamond, although the abrasive particles may also be other well-known abrasive materials having a Mohs hardness of 7 or greater.

[0032] In other embodiments, the microfeature is constructed, shaped, or formed in a predetermined geometry to obtain a predetermined compliance and motion such that when the pin or contact element touches the pad surface, a counteracting corrective force is imparted by the material within the contact area within the contact element tip geometry and within the support structure to increase the efficiency of debris and contaminant removal. The functional microfeatures have predetermined dimensions to provide a predictable and uniform counteracting corrective force onto each test probe within the contact element array and onto the support hardware. The functional microfeatures can have different predetermined dimensions to provide predictable cleaning of the inner and outer surfaces of the capillary tube.

[0033] In another aspect of the cleaning device, the microfeature can have a specific surface finish or a patterned texture or finish such that the prober / prober device can detect the surface of the cleaning pad. The surface texture and roughness of the cleaning material can also contribute to the cleaning efficiency of the working surface polymeric material.

[0034] In one aspect of the method, the cleaning medium is manually placed within an automated test facility such as a wafer prober or a packaged device handler at a predetermined location where the pin element and the surface periodically interact with the cleaning medium to remove debris and / or clean the contact surface of the pin or contact element without excessive wear of the test probe. In another aspect of the method, a method for cleaning probe elements on a wafer prober or a package device handler is provided, the method including loading a cleaning medium into the wafer prober or the package device handler in a similar form as the semiconductor wafer being tested, the singulated IC device, or the packaged IC device, the cleaning medium having an upper surface of functionalized microfeatures having predetermined properties such as abrasiveness, adhesiveness, hardness that clean the contact element and the support structure. The method further includes contacting the contact element with the cleaning medium during normal test operation in the wafer prober or the package device handler such that any debris is removed from the probe element during normal operation of the wafer prober or the package device handler. A similar method can be implemented for wire bonding apparatuses and capillary tubes.

[0035] When the prober / tester can detect the surface of the cleaning pad, the prober can be set to the automatic cleaning mode. In the automatic cleaning mode, the prober / tester automatically determines when to clean the test probe contact element, position the cleaning device, clean the probe tip, and then return to the test operation. After repeated grounding to the device under test (DUT), pad materials and other surface contaminants will accumulate on the test probe contact element and the test probe length. Such loose debris can substantially increase the contact resistance and result in a decrease in wafer and package yields. A high contact resistance or continuously failing device (bin out) can trigger the tester to send a command to the semiconductor device handling apparatus so that the cleaning operation is performed by an "on demand" function. Alternatively, the semiconductor device handling apparatus can be programmed to perform the cleaning operation at the start of a LOT, at the end of a LOT, or after a predetermined number of device groundings. As a result, scheduled and efficient cleaning procedures are very important for controlling the contact resistance.

[0036] In another embodiment of the cleaning device, the layer of the cleaning medium can be formed from a conductive material, an insulating material, or a resistive material so that a tester / prober or wire bonder that detects the surface using a conductance or capacitance method can detect the surface of the cleaning medium.

[0037] A typical IC semiconductor test system (schematically shown in FIGS. 1A and 1B) typically includes some type of tester 10, a test head 11, a tester interface 12 (e.g., a probe card or test socket), contact elements 13, and a wafer or device handler 16. The electrical contact elements 13 or test probes within the tester interface extend from the tester interface to enable direct contact with the DUT 15. The DUT (wafer, singulated device, packaged IC) is moved to the appropriate physical location using automated, semi-automated, or manual equipment such that the probe pads 14 and / or solder balls 16 are in alignment with the contact elements 13 of the tester interface 12. Once in place, for an electrical test, the DUT 15 is moved relative to the contact elements 13, or the contact elements 13 are moved relative to the DUT 15. Due to repeated grounding, the contact elements become contaminated. Instead of removing the test interface for cleaning, a cleaning medium of a predetermined structure will typically remove contaminants during normal test operation.

[0038] Figure 1C illustrates a known wire bonding assembly apparatus 100 having a capillary tube 102 used for wire bonding operations. The wire bonding assembly apparatus has various known elements (not shown in Figure 1C) of a wire bonding apparatus that enable the wire bonding assembly apparatus to create wire bonds for semiconductor devices and the like. The wire bonding assembly apparatus can be used to create wire bonds for any device, component, die, etc. for which it is desirable to be able to create wire bonds. Figure 1C shows a portion of the apparatus 100, and in particular, shows the capillary tube 102 with an outlet, and a wire 104 such as copper or gold passing through the capillary tube. The capillary tube 102 is typically removably attached to the wire bonding apparatus so that in a conventional cleaning process, the capillary tube can be removed, periodically cleaned, and polished. The wire bonding apparatus may have a mechanism (not shown in Figure 1C) used to heat the end of the wire extending from the capillary tube to form a free air ball of molten wire 106. The mechanism for heating the wire can be, for example, an electrode or another mechanism. The capillary tube 102 can then be lowered towards the semiconductor device 108 on the substrate 110, and the molten wire ball is compressed between the end of the capillary tube and a heated metal pad or other metal frame to effect a mechanical bond intended to form a eutectic bond between the wire ball and the bond pad or frame. The capillary tube can then be pulled up while the wire ball remains attached to the die bond pad or frame and while the wire is supplied through the capillary tube.

[0039] Figure 1D illustrates a known wire bonding assembly apparatus having a capillary tube during a cleaning operation 200 using a cleaning material 202. In particular, while the capillary tube 102 remains connected to the wire bonding apparatus (unlike the cleaning process described above), the end of the capillary tube 102 can be inserted into the cleaning material 202 such that debris inside the capillary tube and / or near the exit of the capillary tube 102 is removed from the capillary tube and confined / held within the cleaning material 202.

[0040] Figures 2A, 2B, and 2C illustrate three different typical types of cleaning devices manufactured with a cleaning medium applied to various substrate materials, substrates of different sizes, substrates of different shapes, or in some applications without a substrate. As shown in Figures 2A and 2B, the cleaning devices 20 and 21 can each include a substrate 23 and a cleaning medium or pad 24 that are fixed, adhered, or applied respectively to the surface of a wafer or to a substrate of a known geometry. The substrate 23 can be a polymer, plastic, metal, glass, silicon wafer, ceramic, or any other similar (rigid, semi-rigid, or flexible) material. Further, the substrate 25 can have a form factor or structure that approximates the geometry of the packaged IC device or DUT 22, whereby the cleaning medium 24 is mounted to the surface having the contact elements of the test probe and the support hardware.

[0041] Figures 3A and 3B illustrate an existing cleaning medium 220 made from some combination of a cleaning pad layer 202 of predetermined properties such as hardness, elastic modulus, adhesion, etc., and a compliant underlayer 203 (Fig. 3A) or a rigid underlayer 206 (Fig. 3B) that contributes to cleaning the contact elements that contact the pads. The cleaning medium 220 may also have a removable protective layer 201 that is placed prior to use for the purpose of contact element cleaning to separate the surface cleaning pad layer from non-test-related contaminants. The cleaning medium 220 may have a cleaning pad layer and one or more intermediate layers 203 and 206 mounted thereunder. The combination of layers results in material properties that are not available from the individual constituent materials, while the combination of matrix, abrasive particles, and geometry may maximize cleaning performance. Installation of the cleaning device onto a predetermined substrate material is effected by removal of a second release liner layer 205 (made of the same material as the first release liner layer) to expose the adhesive layer 204, followed by application onto the substrate surface by the adhesive layer 204. The adhesive layer 204 may then be placed against the substrate to adhere the cleaning device 220 to the substrate. The substrate may be any of a variety of different materials as described in the prior art having different purposes.

[0042] Here, a cleaning medium with functional microfeatures will be described in more detail with reference to the accompanying drawings and embodiments. As shown, for example, in FIG. 5, the cleaning medium 221 can have an abrasiveness that loosens and shears debris from the contact element or capillary tube. Using a predetermined volume and mass density of abrasive particles, the abrasiveness of the pad can be systematically affected to round or sharpen the probe tip. The typical abrasive material and particle mass percent loading within the cleaning layer can range from 0% (unloaded) to 500% mass percent. Typical abrasives that can be incorporated into the material can include aluminum oxide, silicon carbide, and diamond, although the abrasive material can also be other well-known abrasive materials. The abrasive can include spatially or preferentially distributed particles of aluminum oxide, silicon carbide, or diamond, although the abrasive particles can also be other well-known abrasive materials having a Mohs hardness of 7 or greater. The controlled surface tackiness of the cleaning layer will cause debris on the contact element to preferentially adhere to the pad and thus be removed from the contact element during the cleaning operation. The abrasive particles can be distributed to the body of each microfeature as described below.

[0043] In an embodiment of the cleaning medium 221 (shown in FIG. 5), the maximum cleaning efficiency of the cleaning material 221 can be improved using a plurality of “positive” uniform-shaped and equally-spaced geometric micro-features within the micro-feature layer 250. Examples of different embodiments of the positive micro-features are shown in FIGS. 4A-4C depicting a plurality of micropyramids 401, a plurality of microcolumns 403, or a plurality of curved micropyramids 405 of a predetermined geometry. In FIG. 5, the cleaning medium 221 is constructed from a single layer of a cleaning pad with “positive” micro-features 250 over a combination of intermediate compliant or rigid layers 207 having predetermined predetermined properties. In other embodiments, the micro-features can be variably spaced across the cleaning medium 221. The cleaning pad layers 202 and 203 described above, and the cleaning pad layers described below the cleaning material reference plane 255, can provide predetermined mechanical, material, and dimensional characteristics to the cleaning material. For example, the cleaning pad layer can provide abrasiveness (described in more detail below), a specific gravity (specific gravity is the ratio of density to the density of water at a specific temperature) in the range of, for example, 0.75 to 2.27, elasticity in the range of, for example, 40 MPa to 600 MPa, adhesiveness in the range of, for example, 20 to 800 grams, flatness, and a thickness in the range of, for example, 25 μm to 300 μm. The selection of materials and layers is determined based on the required counteracting forces necessary to facilitate effective cleaning actions. For example, a high-rigidity material will have a greater counteracting force required for the removal of firmly adhered substances. A highly compliant material is selected when cleaning fragile or small-diameter contact elements.

[0044] As an example of one type of functional "positive" microfeature structure, the microfeatures shown in FIGS. 4A, 4B, and 4C can be created using a combination of high-precision manufacturing methods such as casting or molding, whereby the cleaning pad has a mesa (upper portion 406 of each microfeature) of each microfeature having a dimension of less than 40 μm, a height of each microfeature from the base reference plane 408 of less than 500 μm, and a spacing between mesas (distance between each microfeature) of less than 250 μm. In example 401 shown in FIG. 4A, each pyramid microfeature 402 has a height of 40 μm and a 25 μm square mesa at a mesa-to-mesa spacing of 100 μm. In such a structure, the 3D features are obtained through a high-precision manufacturing process such that the cleaning pad and the functionalized microfeatures have a uniform composition. The size and geometry of the "positive" microfeatures can vary according to the configuration and material of the contact element in order to achieve a pad that removes debris but does not damage the probe element. Generally, the "positive" microfeatures can have several types of geometries, including pyramids 401, circular or square columns 404 with uniform mesas, or various curved shapes 403 with square or circular mesas of less than 40 μm. The microfeature type and "positive" geometry can be adjusted during the manufacture of the cleaning layer such that the material can be used to reshape, sharpen, or refinish the probe element tip and probe element structure. Alternatively, the microfeature type and geometry can be used to clean the inner and outer surfaces of the capillary tube.

[0045] The dimensions of the "positive" features can have a base-to-top, which can be flat or shaped, of 25 μm to 500 μm above the base reference plane 408, an upper surface region geometry having a dimension in the XY dimension from 20 μm to a maximum dimension that spans the XY dimension of the microfeature bottom surface (the sides of the positive feature can be straight or curved), and a mesa-to-mesa spacing (distance between each microfeature) of 50 μm to 250 μm.

[0046] In another embodiment of the cleaning medium 221 (shown in FIG. 7), the maximum cleaning efficiency of the cleaning material can be improved using a plurality of "negative" uniform-shaped and regularly spaced geometric microfeatures, such as a plurality of inverted micropyramids 601, a plurality of microcolumns 603, or a plurality of curved inverted micropyramids 605, having a predetermined geometry as shown in FIGS. 6A-6C. In other embodiments, the microfeatures can be variably spaced across the cleaning medium 221. In FIG. 7, the cleaning medium 221 is constructed from a single layer of a cleaning pad with "negative" microfeatures 251 on top of a combination of intermediate compliant or rigid layers 207 having predetermined predetermined properties.

[0047] As an example of one type of functional “negative” microfeature structure, the microfeatures shown in FIGS. 6A, 6B, and 6C can be created using a combination of high-precision fabrication methods such as casting or molding, whereby the cleaning pad is constructed such that the mesa has dimensions less than 40 μm, a height less than 100 μm, and a distance between the bottom surfaces less than 250 μm. In these examples, each microfeature is recessed into the base reference plane 608. In the exemplary microfeature 601 shown in FIG. 6A, each pyramid microfeature 602 has a 25 μm square base at a height of 40 μm and a bottom-to-bottom spacing of 100 μm. In such a structure, the 3D feature is obtained through a high-precision fabrication process such that the cleaning pad and the microfeatures have a uniform composition. The size and geometry of the “negative” microfeatures can vary according to the configuration and material of the contact element in order to achieve a pad that removes debris but does not damage the probe element. Generally, the “negative” microfeatures can have several types of geometries, including inverted pyramids 602, circular or square columns 604 with uniform bases, or various curved inverted shapes 406 with square or circular bases less than 40 μm. The microfeature type and “negative” geometry can be adjusted during the manufacture of the cleaning layer such that the material can be used to reshape, sharpen, or refinish the probe element tip and the probe element structure. As an example, negative microfeatures such as those shown in FIG. 6A or FIG. 6C can be used to clean high-precision microcantilever contact elements, as their physical shape and dimensions of their negative microfeatures are such that they clean all of the critical surfaces of the microcantilever contact element or the inner and outer surfaces of the capillary tube.

[0048] The dimensions of the “negative” features can be flat or shaped from the base to the top of each microfeature below the base reference plane 608, between 25 μm and 500 μm, having a bottom area geometry that in the XY dimension ranges from 20 μm to the XY dimension of the microfeature bottom surface at most (the sides of the negative feature can be straight or curved), and a bottom-to-bottom spacing between 50 μm and 250 μm (the distance between each microfeature).

[0049] Another embodiment of a cleaning pad / media / device with functionalized microfeatures is shown in FIGS. 8A - 8C, which is an enlarged cross - sectional view of a cleaning material 800 with a “positive” microfeature layer (with micropyramids 802, microcolumns 804, curved micropyramids 806) under a 10 - 100 μm thick polymer layer having predetermined properties applied across the surfaces of the “positive” features (801, 803, and 805 respectively). The polymer layer is applied across the top surface and within the spaces between the microfeatures to a predetermined thickness of less than 100 μm. The polymer can be adhesive and can be loaded with or without an abrasive. Typical abrasives that can be incorporated into the polymer can include aluminum oxide, silicon carbide, and diamond, although the abrasive particles can also be other well - known abrasive materials having a Mohs hardness of 7 or greater. The amount and size of the abrasive are varied according to the configuration of the microfeatures of the cleaning pad or based on the material and geometry of the contact element to achieve a pad that removes and collects debris without damaging the contact element or support hardware or the ends of the capillary tubes.

[0050] FIGS. 8D - 8F show examples of enlarged cross - sectional views of a cleaning material 800 with a “positive” microfeature layer (with micropyramids 802, microcolumns 804, curved micropyramids 806) under a 10 - 100 μm thick polymer layer having predetermined properties applied across the surfaces of the “positive” features (801, 803, and 805 respectively). The cleaning pad layer with microfeatures can then be constructed over one or more intermediate compliant or rigid material layers under the cleaning pad layer and protective liner of predetermined properties.

[0051] Another embodiment of a cleaning pad / media / device with functionalized microfeatures is shown in FIGS. 9A - 9C, which is an enlarged cross - sectional view of a cleaning material with "negative" microfeatures (inverted micropyramids 901, inverted microcolumns 903, curved inverted micropyramids 905) with a layer of polymer 10 - 100 μm thick having a predetermined property applied across the surfaces (901, 903, and 905 respectively) of the "negative" features. The polymer layer is applied across the upper surfaces of the "negative" microfeatures and into the recesses (cavities), thus covering the inner surfaces of each negative microfeature. The polymer can be adhesive and can be loaded with or without abrasive. Typical abrasives that can be incorporated into the polymer can include aluminum oxide, silicon carbide, and diamond, although the abrasive particles can also be other well - known abrasive materials having a Mohs hardness of 7 or greater. The amount and size of the abrasive are varied according to the configuration of the microfeatures of the cleaning pad or based on the material and geometry of the contact element in order to achieve a pad that removes and collects debris without damaging the contact element or support hardware or capillary tubes. The cleaning pad layer with microfeatures can then be constructed over one or more intermediate compliant or rigid material layers under the cleaning pad layer and protective liner with predetermined properties. The above embodiments are typically used for systems that test one or more dies on a wafer or semiconductor wafer before singulation and / or encapsulation into an assembled package.

[0052] Here, another embodiment of the cleaning device is described. The cleaning device can be used to clean the contact elements used to electrically test a DUT. Individual semiconductor devices from a wafer are encapsulated into a material 501 such as plastic, as shown in FIG. 10A. In this illustrative example, the cleaning device can also be used with an ATE and tester for handling and testing packaged integrated circuits (ICs). The IC package can have one or more conducting wires or solder balls extending out from the package that conduct electrical signals including power signals, ground, and I / O signals, etc., using the die(s) inside the package 15 (FIG. 1B). In this case, the tester interface, called a test socket 12, has a plurality of contact elements 13 (similar to the probe card tester described above) that contact the package's wires and test the electrical characteristics of the packaged DUT. Generally, the contact elements can be mounted on various spring-loaded probes or flexible contact elements and can have a geometric configuration with a single spear-like, crown-like, or other multi-tine contactor. The flexible contact elements can be held within an elastomeric silicone rubber layer held within a memory socket, logic socket, burn-in socket, or an interposer.

[0053] Similar to the probe card cleaner embodiment, the cleaning device for the encapsulated device can approximate the DUT shape using a substrate to which a cleaning pad material 503 is applied as shown in FIG. 10B so that the contact elements of the test socket can periodically contact the cleaning pad surface to remove debris from the tips of the probe elements. The size of the cleaning device can be modified to fit the size and shape of a particular socket or to approximate the dimensions of a particular device. In the embodiment with the micro features shown in FIG. 10B, the cleaning material 503 is configured to simulate the size, geometry, spacing, and exact placement of the solder balls from the DUT.

[0054] In FIG. 11A, the cleaning device 600 may have the layers described above, and the cleaning pad layer 601 having a plurality of cleaning balls 603 made of a cleaning material that matches the DUT ball grid array geometry is abrasive so that the counter-corrective pressure against the contact elements provides efficient cleaning to remove and collect debris from the contact elements. The height, diameter, and location of the cleaning balls are predetermined according to the configuration of the DUT and the material of the contact elements. The spacing, geometry, and abrasiveness of the cleaning balls are such that the counter-corrective pressure against the contact elements provides efficient cleaning to remove and collect debris from the contact elements.

[0055] In another embodiment, FIG. 11B shows a cross-sectional view of a cleaning device 600 with a cleaning pad layer 602 having a plurality of cleaning balls 603 that match the DUT ball grid array geometry as described above, further having a uniform layer 605 of a 10 - 100 μm thick cleaning polymer with predetermined properties applied across the surface. Thus, the number of pad / polymer / substrate layers and the functionalized micro-features of the cleaning surface are controlled to provide control over the overall thickness of the cleaning device as well as compliance with the thickness of the cleaning. This multi-layer embodiment with cleaning balls also provides accurate cleaning within the guide holes of the floating socket, as well as inside the socket of the probe and the contactor.

[0056] Here, a method for cleaning a plurality of probe elements and support hardware or solder balls using the disclosed cleaning device with functionalized microfeatures is described with reference to FIG. 12. Insertion of the contact elements of the tester interface or solder balls for encapsulated integrated circuits into the cleaning device must remove any organic residues that would otherwise substantially remain without leaving any, removing debris adhering from the contact elements and support hardware or DUT. Further, the overall electrical characteristics and geometry of the contact elements are unaffected, but the overall electrical performance required for high yield and low contact resistance is restored. The method achieves the goal of increasing the productivity of the tester by removing debris from the contact elements without removing the tester interface from the ATE. The cleaning device may have the same size and shape as a typical DUT tested by the tester and may be inserted into a pre-determined cleaning tray. Alternatively, a cleaning material with functionalized microfeatures may be placed within a substrate such as a wafer that can be placed within a wafer carrier, thus performing the cleaning. The cleaning material layer of the device has pre-determined physical, mechanical, and geometric characteristics according to the configuration and materials of the contact elements and support hardware of the tester interface.

[0057] As described above, this cleaning step can occur whenever the cleaning device is periodically installed from a cleaning tray positioned under the contact elements of the tester interface or from a wafer cassette each time, or when the ATE performs the cleaning operation of the contact elements using a cleaning material installed on a vanishing plate. The use of the cleaning device does not interfere with the operation of the ATE in any way since the cleaning of the contact elements is achieved during the normal operation of the test apparatus. In this manner, the cleaning device is inexpensive and allows the contact elements to be cleaned and / or shaped without removing the contact elements or the tester interface from the ATE.

[0058] The method and apparatus provide one or more advantages, including, but not limited to, maintaining a cleaning contactor and contact pins. Although the present disclosure has been described with reference to specific exemplary embodiments, what is described herein is not intended to be construed in a limiting sense. For example, variations and combinations of steps in the illustrated and described embodiments may be used in certain cases without departing from the present disclosure. Various modifications and combinations of the exemplary embodiments, as well as other advantages and embodiments of the present disclosure, will be apparent to those skilled in the art upon reference to the drawings, description, and claims. It is intended that the scope of the present disclosure be defined by the claims appended hereto and their equivalents. The foregoing refers to specific embodiments of the invention, but changes in these embodiments can be made without departing from the principles and spirit of the present disclosure, and it is to be understood by those skilled in the art that the scope of the present disclosure is defined by the appended claims.

[0059] FIG. 12 is a flowchart showing a method 1200 for cleaning a semiconductor device or tester or probe element using various embodiments of the disclosed cleaning material with functionalized microfeatures. The method of FIG. 12 is for cleaning a tester interface, although it will be understood that a similar method is used for cleaning a DUT, etc. In this method, the tester performs its test 1202. A tester (having a control system) or a separate computer system may determine whether it is time to clean the tester 1204 based on a time interval or measurement of a characteristic of the test process. If cleaning is not required, the tester continues with the test 1202. If it is determined that it is time to clean the tester, a cleaning device having functionalized microfeatures can be moved to the cleaning position by various means (1206), and the cleaning is performed using the cleaning material during the normal test procedure of the test apparatus without taking the tester offline (1208). When the cleaning is complete, the tester resumes its test function (1210).

[0060] Test results Figures 13A and 13B illustrate probe tip cleaning using a typical cleaning material. Specifically, Figure 13A shows a typical cleaning material without functionalized microfeatures contacting the probe tip, resulting in not all of the important surfaces of the probe being effectively cleaned. An example of a probe after cleaning with a typical cleaning material is shown in Figure 13B, where various debris remains attached or adhered to the probe, resulting in the problems described above.

[0061] In contrast, Figures 14A and 14B illustrate the same probe tip when Figure 13B is cleaned using a functionalized microfeature cleaning material. As shown in Figure 14A, each probe (including the inclined slide and tip, collectively the entire probe area) is in contact with the side of the functionalized microfeatures. An example of a probe after cleaning with a cleaning material having functionalized microfeatures is shown in Figure 14B, where all of the important surfaces of each probe are cleaned, and thus each probe is much cleaner.

[0062] Figure 15 is a flowchart showing a method 1500 for cleaning a wire bonding apparatus and a capillary tube using various embodiments of the disclosed cleaning material with functionalized microfeatures. In this method, the wire bonding apparatus performs its wire bonding operation 1502. A wire bonding apparatus (having a control system) or a separate computer system may determine whether it is time to clean the wire bonding apparatus based on a time interval or measurement of a characteristic of the wire bonding process (1504). If cleaning is not required, wire bonding continues (1502). If it is determined that it is time to clean the capillary tube, a cleaning device having the functionalized microfeatures described above may be moved to the cleaning position by various known means (1506), and the cleaning is performed using the cleaning material during the normal operating procedure of the wire bonding apparatus without taking the wire bonding apparatus offline (1508). When the cleaning is complete (1510), wire bonding resumes its wire bonding operation (1512).

[0063] The foregoing description has been presented for purposes of illustration and description with reference to specific embodiments. However, the above illustrative discussion is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teachings. The embodiments were chosen and described in order to best explain the principles of the disclosure and its practical application, to thereby enable others skilled in the art to best utilize the disclosure and various embodiments with various modifications as are suited to the particular use contemplated.

[0064] The systems and methods disclosed herein may be implemented via one or more components, systems, servers, appliances, other sub-components, or may be distributed among such elements. When implemented as a system, such a system may include, and / or be involved with, components such as software modules, general-purpose CPUs, RAM, etc., as typically found in a general-purpose computer. In an implementation where novelty resides on a server, such a server may include, or be involved with, components such as CPUs, RAM, etc., as typically found in a general-purpose computer.

[0065] In addition, the systems and methods within this specification, in addition to those described above, can be achieved via implementations using heterogeneous or entirely different software, hardware, and / or firmware components. With respect to such other components (e.g., software, processing components, etc.) and / or computer-readable media associated with or embodying the present invention, for example, aspects of novelty within this specification can be implemented in accordance with a number of general-purpose or special-purpose computing systems or configurations. Various exemplary computing systems, environments, and / or configurations that may be suitable for use with the novelty within this specification include, but are not limited to, personal computers, servers or server computing devices such as routing / connectivity components, handheld or laptop devices, microprocessor systems, microprocessor-based systems, set-top boxes, consumer electronic devices, network PCs, other existing computer platforms, software or other components within or embodied in a distributed computing environment including one or more of the above systems or devices, etc.

[0066] In some cases, aspects of the present systems and methods can be achieved or implemented via logic and / or logical instructions including, for example, program modules executed in association with such components or circuits. Generally, program modules can include routines, programs, objects, components, data structures, etc. that perform particular tasks or execute particular instructions within this specification. The present invention can also be practiced in the context of a circuit environment where distributed software, computers, or circuits are connected via a communication bus, circuit, or link. In a distributed environment, control / instruction can originate from both local and remote computer storage media including memory storage devices.

[0067] The software, circuits, and components within this specification may also include and / or utilize one or more types of computer-readable media. A computer-readable media may be any available media that can be present in, associated with, or accessed by such circuits and / or computing components. By way of example and not limitation, computer-readable media may comprise computer storage media and communication media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other media that can be used to store the desired information and can be accessed by a computing component. Communication media may comprise computer-readable instructions, data structures, program modules, and / or other components. Additionally, communication media may include wired networks or direct wired connections, but none of any such type of media within this specification includes transient media. Any combination of the above is also included within the scope of computer-readable media.

[0068] In this description, terms such as component, module, device, etc. may refer to any type of logical or functional software element, circuit, block, and / or process that can be implemented in various ways. For example, the functions of various circuits and / or blocks can be combined with each other and made into any other several modules. Each module may even be implemented as a software program stored in a tangible memory (e.g., random access memory, read-only memory, CD-ROM memory, hard disk, etc.) to be read by a central processing unit for implementing the novel functions within this specification. Or, the module may comprise programming instructions transmitted by a transmission carrier wave to a general-purpose computer or to processing / graphic hardware. Also, the module may be implemented as a hardware logic circuit for implementing the functions encompassed by the novelty within this specification. And the module may be implemented using special-purpose instructions (SIMD instructions), field-programmable logic arrays, or any mixture thereof that provide the desired level of performance and cost.

[0069] As disclosed herein, features consistent with the present disclosure may be implemented by computer hardware, software, and / or firmware. For example, the systems and methods disclosed herein may be embodied in various forms, including, for example, a data processor such as a computer that also includes a database, digital electronic circuits, firmware, software, or combinations thereof. Further, while some of the disclosed implementations describe specific hardware components, the systems and methods consistent with the novelty within this specification may be implemented using any combination of hardware, software, and / or firmware. Additionally, the above-described features of novelty within this specification, as well as other aspects and principles, may be implemented in various environments. Such environments and related applications may be specially constructed to perform various routines, processes, and / or operations in accordance with the present invention, or they may include general-purpose computers or computing platforms that are selectively activated or reconfigured by code to provide the necessary functionality. The processes disclosed herein are not inherently related to any particular computer, network, architecture, environment, or other device, and may be implemented by a suitable combination of hardware, software, and / or firmware. For example, various general-purpose devices may be used with programs written in accordance with the teachings of the present invention, or it may be more convenient to construct dedicated devices or systems to perform the required methods and teachings.

[0070] Aspects of the methods and systems described herein, such as logic, can also be implemented as functionality programmed into any of a variety of circuits, including programmable logic devices (“PLDs”), such as field programmable gate arrays (“FPGAs”), programmable array logic (“PAL”) devices, electrically erasable logic and memory devices, and standard cell-based devices, as well as application specific integrated circuits. Some other possibilities for implementing the aspects include memory devices, microcontrollers with memory (such as EEPROM), embedded microprocessors, firmware, software, and the like. Further, the aspects can be embodied in a microprocessor with software-based wire emulation, discrete logic (sequential and combinatorial), custom devices, fuzzy (neural) logic, quantum devices, hybrids of any of the above device types. The underlying device technology can be provided in a variety of component types, such as metal oxide semiconductor field effect transistor (“MOSFET”) technology, such as complementary metal oxide semiconductor (“CMOS”), bipolar technology, such as emitter coupled logic (“ECL”), polymer technology (e.g., silicon conjugated polymers and metal conjugated polymer-metal structures), mixed analog and digital, and the like.

[0071] Note also that the various logics and / or functions disclosed herein can be enabled using any number of combinations of hardware, firmware, and / or as data and / or instructions embodied in various device-readable or computer-readable media with respect to their behavioral characteristics, register transfer characteristics, logic component characteristics, and / or other characteristics. Computer-readable media in which such formatted data and / or instructions can be embodied include, but are not limited to, non-volatile memory media in various forms (e.g., optical, magnetic, or semiconductor memory media), where transient media are not included. Throughout this description, unless the context clearly requires otherwise, the words "comprise" and like terms are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, in the sense of "including, but not limited to". Words using the singular or plural number also include the plural or singular number respectively. Additionally, the words "within this specification", "subsequent to this specification", "above", "below", and words of similar import refer to this application as a whole and not to any particular part of this application. When the word "or" is used in reference to a list of two or more items, that word covers all of the following interpretations of the words: any of the items in the list, all of the items in the list, and any combination of the items in the list.

[0072] While specific presently preferred implementations of the invention are described in detail herein, it will be apparent to those skilled in the art that various variations and modifications of the various implementations shown and described herein can be made without departing from the spirit and scope of the invention. Accordingly, the invention is intended to be limited only to the extent required by the applicable legal order.

[0073] The foregoing refers to particular embodiments of the disclosure, but changes in these embodiments can be made without departing from the principles and spirit of the disclosure, which is to be understood by those skilled in the art to be defined by the appended claims. The present invention includes the following aspects. (1) A cleaning material with a functionalized surface for cleaning contact elements and support structures of a test interface used for wafer-level or package-level IC semiconductor device testing, wherein the cleaning material is a cleaning medium having a plurality of functionalized microfeatures, each of the plurality of functionalized microfeatures having a body portion, the body portion having a width, a height, a spacing between each body portion, and dimensional characteristics that optimize the cleaning medium such that the contact area and surrounding support hardware are cleaned without change or damage, each microfeature extending away from the upper surface of the cleaning medium, and the cleaning medium having a plurality of abrasive particles having a Mohs hardness of 7 or more that are uniformly distributed within the body portion of each microfeature, a cleaning medium; a cleaning layer applied over the upper surface of the cleaning medium and having predetermined characteristics for cleaning contaminants from the pin contact elements and support hardware; one or more intermediate rigid or compliant lower layers under the cleaning medium, each lower layer having a modulus of elasticity in the range of greater than 40 MPa to 600 MPa, each layer having a thickness of 25 μm to 300 μm, and each layer having a hardness of 30 Shore A to 90 Shore A, one or more intermediate rigid or compliant lower layers; and a cleaning material. (2) The cleaning material according to (1), wherein the plurality of functionalized microfeatures are formed in one or uniformly over the cleaning medium and are variably spaced apart over the cleaning medium. (3) The cleaning material according to (1), wherein the plurality of abrasive particles further includes one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond. (4) The cleaning material according to (1), wherein the cleaning layer further comprises a polymer layer that is 10 to 100 μm thick and has predetermined specific gravity, elasticity, adhesiveness, flatness, thickness, and porosity. (5) The cleaning material according to (1), wherein the cleaning layer further comprises a layer of abrasive polymer having a plurality of abrasive particles with a Mohs hardness of 7 or more and a thickness of 10 to 100 μm over the upper surface of the cleaning medium. (6) The cleaning material according to (1), wherein each micro feature further includes a positive micro feature extending upwardly away from the upper surface of the cleaning medium. (7) The cleaning material according to (6), wherein each positive micro feature is one of a micro pyramid, a micro column, and a curved micro pyramid. (8) The cleaning material according to (6), wherein the cleaning layer is applied to cover the main body portion of each positive micro feature, the main body portion of each positive micro feature has a front side, and the cleaning layer is applied to cover the front side of each positive micro feature. (9) The cleaning material according to (6), wherein the cleaning layer further comprises a plurality of abrasive particles having a Mohs hardness of 7 or more and a thickness of less than 10 μm, which are applied over the upper surface of each positive micro feature and along the main body portion of each positive micro feature. (10) The cleaning material according to (9), wherein the plurality of abrasive particles is a mixture of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond. (11) The cleaning material according to (1), wherein each micro feature further comprises a negative micro feature extending downwardly away from the upper surface of the cleaning medium. (12) The cleaning material according to (11), wherein each negative micro feature is one of a micro pyramid, a micro column, and a curved micro pyramid. (13) The cleaning material according to (11), wherein the cleaning layer is applied over the upper surface of the cleaning medium, into the cavity of each negative micro feature, and along the inner surface of each negative micro feature. (14) The cleaning material according to (11), wherein the cleaning layer further comprises a plurality of abrasive particles having a Mohs hardness of 7 or more and a thickness of less than 10 μm, which are applied over the upper surface of the cleaning medium, into the cavity of each negative micro feature, and along the inner surface of each negative micro feature. (15) The cleaning material according to (14), wherein the plurality of abrasive particles is a mixture of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond. (16) A method for cleaning a contact element and a support structure of a test interface used for wafer-level or package-level IC semiconductor device testing, comprising: Performing a test operation of the wafer-level or package-level IC semiconductor device, Performing a cleaning operation using a cleaning device, which includes a cleaning medium having a plurality of functionalized micro-features, each of the plurality of functionalized micro-features having a body portion, the body portion having a width, height, spacing between each body portion, and dimensional characteristics that optimize the cleaning medium such that the contact area and surrounding support hardware are cleaned without change or damage, each micro-feature extending away from the upper surface of the cleaning medium, the cleaning medium having a plurality of abrasive particles having a Mohs hardness of 7 or more uniformly distributed within the body portion of each micro-feature, a cleaning medium, a cleaning layer applied across the upper surface of the cleaning medium having predetermined characteristics for cleaning contaminants from the pin contact element and support hardware, and one or more intermediate rigid or compliant lower layers under the cleaning medium, each lower layer having a modulus of elasticity in the range of greater than 40 MPa to 600 MPa, each layer having a thickness of 25 μm to 300 μm, and each layer having a hardness of 30 Shore A to 90 Shore A, a method having one or more intermediate rigid or compliant lower layers. (17) Performing the cleaning operation using the cleaning device further includes using a polymer layer that is 10 to 100 μm thick and has a predetermined specific gravity, elasticity, adhesiveness, flatness, thickness, and porosity, the method according to (16). (18) Performing the cleaning operation using the cleaning device further includes using a plurality of positive micro-features that extend upward away from the upper surface of the cleaning medium, the method according to (16). (19) Performing the cleaning operation using the cleaning device further includes using a plurality of negative micro-features that extend downward away from the upper surface of the cleaning medium, the method according to (16). (20) A cleaning device for cleaning a pin contact element and support hardware within a semiconductor test device, A cleaning medium with a plurality of geometric surface features mimicking solder balls, pillars, copper pillar bumps, and / or gold bumps of a semiconductor device under test, wherein the cleaning balls and cleaning pillars further comprise a plurality of abrasive particles distributed within the features and having a Mohs hardness of 7 or greater for cleaning the contact elements and support structures of the test interface, the cleaning medium, A cleaning layer applied across the upper surface and along the side surfaces of each geometric surface feature, having a predetermined characteristic of cleaning contaminants from the pin contact elements and support hardware, A substrate on which the cleaning medium is mounted, having a configuration suitable for being introduced into the test device during normal test operation of the test device, the substrate comprising a surrogate semiconductor wafer or a packaged IC device, A cleaning device comprising. (21) The cleaning device according to (20), further comprising a plurality of abrasive particles applied across the upper surface and along the side surfaces of each geometric surface feature. (22) The cleaning device according to (20), wherein the cleaning layer further comprises a layer of polymer having a thickness of 10 to 100 μm and having a determined specific gravity, elasticity, adhesiveness, flatness, thickness, and porosity. (23) The cleaning device according to (20), wherein the cleaning layer further comprises a layer of abrasive polymer having a thickness of 10 μm to 100 μm and having a plurality of abrasive particles having a Mohs hardness of 7 or greater. (24) The cleaning device according to (20), wherein the cleaning layer further comprises a layer of abrasive polymer having a thickness of less than 10 μm and having a plurality of abrasive particles having a Mohs hardness of 7 or greater. (25) The cleaning device according to (24), wherein the plurality of abrasive particles further comprises a mixture of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond. (26) A method for cleaning pin contact elements and support hardware in a semiconductor test device, Performing a test on a device under test having a predetermined configuration of one of a solder ball, a pillar, a copper pillar bump, and a gold bump, Performing cleaning of the pin contact element and the support hardware using a cleaning device, the cleaning device being a cleaning medium with a plurality of geometric surface features to be mimicked, wherein the cleaning balls and cleaning pillars further comprise a plurality of abrasive particles distributed within the features and having a Mohs hardness of 7 or greater for cleaning the contact elements and support structures of the test interface, a cleaning layer applied across the upper surface and along the side surfaces of each geometric surface feature, having predetermined characteristics for cleaning contaminants from the pin contact element and the support hardware, and a substrate on which the cleaning medium is mounted, having a suitable configuration for being introduced into the test device during normal test operation of the test device, the substrate comprising a surrogate semiconductor wafer or a packaged IC device. (27) A cleaning material with a functionalized surface for cleaning the capillary tube of a wire bonding device, A cleaning medium having a plurality of functionalized microfeatures, each of the plurality of functionalized microfeatures having a body portion, the body portion having a width, height, spacing between each body portion, and dimensional characteristics that optimize the cleaning medium such that the contact area and surrounding support hardware are cleaned without alteration or damage, each microfeature extending away from the upper surface of the cleaning medium, the cleaning medium having a plurality of abrasive particles distributed uniformly within the body portion of each microfeature and having a Mohs hardness of 7 or greater. A cleaning layer applied across the upper surface of the cleaning medium, having predetermined characteristics for cleaning contaminants from one or more surfaces of the capillary tube. One or more intermediate rigid or compliant lower layers under the cleaning medium, each lower layer having a modulus of elasticity in the range of greater than 40 MPa to 600 MPa, each layer having a thickness of 25 μm to 300 μm, and each layer having a hardness of 30 Shore A to 90 Shore A. A cleaning material comprising the above. (28) The cleaning material according to (27), wherein the plurality of functionalized microfeatures are formed in one or uniformly across the cleaning medium and variably spaced across the cleaning medium. (29) The cleaning material according to (27), wherein the plurality of abrasive particles further includes one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond. (30) The cleaning material according to (27), wherein the cleaning layer further includes a polymer layer having a predetermined specific gravity, elasticity, adhesiveness, flatness, thickness, and porosity, and having a thickness of 10 to 100 μm. (31) The cleaning material according to (27), wherein the cleaning layer further includes a layer of abrasive polymer having a thickness of 10 to 100 μm and having a Mohs hardness of 7 or more, with a plurality of abrasive particles covering the upper surface of the cleaning medium. (32) The cleaning material according to (27), wherein each fine feature further includes a positive fine feature extending upward away from the upper surface of the cleaning medium. (33) The cleaning material according to (32), wherein each positive fine feature is one of a micropyramid, a microcolumn, and a curved micropyramid. (34) The cleaning material according to (32), wherein the cleaning layer is applied to cover the main body of each positive fine feature, the main body of each positive fine feature has a front side, and the cleaning layer is applied to cover the front side of each positive fine feature. (35) The cleaning material according to (32), wherein the cleaning layer further includes a plurality of abrasive particles having a thickness of less than 10 μm and a Mohs hardness of 7 or more, which are applied over the upper surface of each positive fine feature and along the main body of each positive fine feature. (36) The cleaning material according to (35), wherein the plurality of abrasive particles is a mixture of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond. (37) The cleaning material according to (27), wherein each fine feature further includes a negative fine feature extending downward away from the upper surface of the cleaning medium. (38) The cleaning material according to (37), wherein each negative fine feature is one of a micropyramid, a microcolumn, and a curved micropyramid. (39) The cleaning material according to (37), wherein the cleaning layer is applied over the upper surface of the cleaning medium, into the cavity of each negative fine feature, and along the inner surface of each negative fine feature. (40) The cleaning material according to (37), wherein the cleaning layer further includes a plurality of abrasive particles having a thickness of less than 10 μm and a Mohs hardness of 7 or more, which are applied over the upper surface of the cleaning medium, into the cavity of each negative fine feature, and along the inner surface of each negative fine feature. (41) The cleaning material according to (40), wherein the plurality of abrasive particles is a mixture of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond. (42) A method for cleaning a capillary tube of a wire bonding apparatus, comprising: performing a wire bonding operation using the capillary tube of the wire bonding apparatus; and performing a cleaning operation using a cleaning device, the cleaning device comprising: a cleaning medium having a plurality of functionalized micro features, each of the plurality of functionalized micro features having a body portion, the body portion having a width, a height, a spacing between each body portion, and dimensional characteristics that optimize the cleaning medium such that one or more surfaces of the capillary tube are cleaned without being altered or damaged; each micro feature extending away from an upper surface of the cleaning medium; the cleaning medium having a plurality of abrasive particles having a Mohs hardness of 7 or greater that are uniformly distributed within the body portion of each micro feature; a cleaning layer applied across the upper surface of the cleaning medium having a predetermined characteristic of cleaning contaminants from one or more surfaces of the capillary tube; and one or more intermediate rigid or compliant lower layers beneath the cleaning medium, each lower layer having a modulus of elasticity in the range of greater than 40 MPa to 600 MPa, each layer having a thickness in the range of 25 μm to 300 μm, and each layer having a hardness in the range of 30 Shore A to 90 Shore A. (43) The method according to (42), wherein performing the cleaning operation using the cleaning device further comprises using a polymer layer that is 10 to 100 μm thick and has a predetermined specific gravity, elasticity, adhesiveness, flatness, thickness, and porosity. (44) The method according to (42), wherein performing the cleaning operation using the cleaning device further comprises using positive micro features that extend upward away from the upper surface of the cleaning medium. (45) The method according to (42), wherein performing the cleaning operation using the cleaning device further comprises using negative micro features that extend downward away from the upper surface of the cleaning medium. (46) Performing the cleaning operation further includes performing the cleaning operation of the capillary tube without removing the capillary tube from the wire bonding apparatus, the method according to (42). (47) After the cleaning operation is completed, the method according to (46) further includes resuming the wire bonding operation. (48) Performing the cleaning operation further includes performing the cleaning operation of the capillary tube after a predetermined time period, the method according to (42).

Claims

1. A cleaning material with a functionalized surface for cleaning the contact elements and support structures of a test interface used for wafer-level or package-level IC semiconductor device testing, wherein the cleaning material is A cleaning medium having a cleaning medium-based reference plane and a plurality of functionalized micro-features arranged in an array having a plurality of rows and a plurality of columns, each of the functionalized micro-features having a body portion, the body portion having a width, a height, a spacing between each body portion, and dimensional characteristics that optimize the cleaning medium such that the contact area and the surrounding support hardware are cleaned without change or damage, each functionalized micro-feature extending on the cleaning medium-based reference plane, the cleaning medium having a plurality of abrasive particles having a Mohs hardness of 7 or more uniformly distributed within the body portion of each functionalized micro-feature, a cleaning medium, and A cleaning layer applied over the upper surface of the cleaning medium having a predetermined characteristic of cleaning contaminants from the contact elements and support hardware, the cleaning layer being applied over all upper surfaces of the functionalized micro-features and within the spacing between each respective functionalized micro-feature down to the cleaning medium-based reference plane, and One or more intermediate rigid or compliant lower layers under the cleaning medium, each lower layer having a modulus of elasticity in the range of greater than 40 MPa to 600 MPa, each layer having a thickness of 25 μm to 300 μm, each layer having a hardness of 30 Shore A to 90 Shore A, one or more intermediate rigid or compliant lower layers and A cleaning material comprising.

2. The cleaning material according to claim 1, wherein the plurality of functionalized micro-features are one of uniformly formed over the cleaning medium and variably spaced over the cleaning medium.

3. The cleaning material according to claim 1, wherein the plurality of abrasive particles further comprises one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

4. The cleaning material according to claim 1, wherein the cleaning layer further comprises a polymer layer having a thickness of 10 to 100 μm and having a predetermined specific gravity, elasticity, adhesiveness, flatness, thickness, and porosity.

5. The cleaning material according to claim 1, wherein the cleaning layer further comprises a layer of polishing polymer having a Mohs hardness of 7 or more and having a thickness of 10 to 100 μm, which extends over the upper surface of the cleaning medium.

6. The cleaning material according to claim 1, wherein each positively functionalized microfeature is one of a micropyramid, a microcolumn, and a curved micropyramid.

7. The cleaning material according to claim 1, wherein the cleaning layer is applied to cover the main body portion of each positive microfeature, the main body portion of each positively functionalized microfeature has a front side, and the cleaning layer is applied to cover the front side of each positively functionalized microfeature.

8. The cleaning material according to claim 1, wherein the cleaning layer has a flat upper surface on the opposite side of the upper surface of the cleaning medium.

9. The cleaning material according to claim 1, wherein each functionalized microfeature extends in a range of 25 μm to 500 μm on the cleaning medium base reference plane, has a farthest upper surface more than 20 μm from the cleaning medium base reference plane, and the interval between each functionalized microfeature is in a range of 50 μm to 250 μm.

10. The cleaning material according to claim 1, wherein the cleaning layer further includes a plurality of polishing particles having a thickness of less than 10 μm and a Mohs hardness of 7 or more, which are applied over the upper surface of each positively functionalized microfeature and along the main body portion of each positively functionalized microfeature.

11. The cleaning material according to claim 10, wherein the plurality of polishing particles is a mixture of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

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