Information processing apparatus and display method

Abstract

Regarding a production system which comprises a plurality of arrayed work machines and which is for producing substrates by conveying the substrates from some of the work machines disposed on the upstream side to work machines on the downstream side and by sequentially executing work by the plurality of work machines on the substrates, this information processing device causes a display device to selectively display a first screen showing the overall operation state of the production system and a second screen showing the operation the state of, among the plurality of work machines, a work machine that has the longest working hours.

Description

Technical Field

[0001] The present invention relates to an information processing apparatus and a display method for displaying a screen indicating an operating state of a production system for producing a substrate.

Background Art

[0002] The following patent document describes a production system for producing a substrate.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] This specification aims to suitably display the operating state of a production system for producing a substrate.

Means for Solving the Problems

[0005] In order to solve the above problems, this specification provides, as a screen to be displayed on a display device when a substrate is conveyed from an upstream-side one to a downstream-side one among a plurality of arranged working machines while operations by each of the plurality of working machines are sequentially performed on the substrate, a first screen indicating the overall operating state of a production system for producing a substrate, and a second screen indicating the operating state of the working machine with the longest working time among the plurality of working machines, and discloses an information processing apparatus that determines which of the first screen and the second screen should be selected by a control device provided in the production system and causes the determined first screen or second screen to be displayed.

[0006] In order to solve the above problems, this specification discloses an information processing apparatus that includes a plurality of arranged working machines, and while a substrate is conveyed from an upstream side to a downstream side of the plurality of working machines, operations by each of the plurality of working machines are sequentially performed on the substrate, and a screen indicating an operating state of a production system for producing the substrate is switched according to whether the production operation of the substrate produced by the production system is mass production of a small number of product types or small batch production of a large number of product types and is displayed on a display device.

[0007] In order to solve the above problems, this specification discloses a display method in which, as a screen to be displayed on a display device when a plurality of arranged working machines are provided, a substrate is conveyed from an upstream side to a downstream side of the plurality of working machines, and operations by each of the plurality of working machines are sequentially performed on the substrate, a control device provided in the production system determines which of a first screen indicating an overall operating state of the production system for producing the substrate and a second screen indicating an operating state of the working machine with the longest working time among the plurality of working machines should be selected, and the determined first screen or second screen is displayed.

[0008] In order to solve the above problems, this specification discloses a display method in which a screen indicating an operating state of a production system for producing a substrate is switched according to whether the production operation of the substrate produced by the production system is mass production of a small number of product types or small batch production of a large number of product types and is displayed on a display device, while a substrate is conveyed from an upstream side to a downstream side of a plurality of arranged working machines, and operations by each of the plurality of working machines are sequentially performed on the substrate.

[0009]

[0010]

Advantages of the Invention

[0011] In the present disclosure, a first screen showing the overall operating state of the production system and a second screen showing the operating state of the working machine with the longest working time among a plurality of working machines are selectively displayed. Further, the screen showing the operating state of the production system is switched and displayed according to the production operation of the substrate produced by the production system. Further, the operating state of the production line is displayed on the screen showing the operating state of the working machine with the longest working time among a plurality of working machines. Thereby, it becomes possible to suitably display the operating state of the production system.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0013] Hereinafter, as an embodiment for carrying out the present invention, examples of the present invention will be described in detail with reference to the drawings.

[0014] Figure 1 shows the substrate processing system 10. The system 10 shown in Figure 1 is a system for mounting electronic components on a circuit board. The substrate processing system 10 is composed of four electronic component mounting devices (hereinafter sometimes abbreviated as "mounting devices") 12. The four mounting devices 12 are arranged in a row adjacent to each other. In the following description, the direction in which the mounting devices 12 are arranged is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction.

[0015] The four mounting devices 12 have substantially the same configuration as each other. Therefore, one of the four mounting devices 12 will be described as a representative. As shown in Figure 2, the mounting device 12 has one system base 14 and two mounting machines 16 adjacent to each other on the system base 14. Each mounting machine 16 mainly includes a mounting machine body 20, a conveying device 22, a mounting head moving device (hereinafter sometimes abbreviated as "moving device") 24, a mounting head 26, and a supply device 28.

[0016] The mounting machine body 20 is composed of a frame 30 and a beam 32 mounted on the frame 30.

[0017] The conveying device 22 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are arranged on the frame 30 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40 and 42 conveys the circuit board supported by each conveyor device 40 and 42 in the X-axis direction by an electromagnetic motor (see Figure 3) 44. Then, the circuit board conveyed by each conveyor device 40 and 42 is held by a substrate holding device (see Figure 3) 46 at a predetermined position.

[0018] The moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (see Figure 3) 52 that slides the slider 50 in the X-axis direction and an electromagnetic motor (see Figure 3) 54 that slides it in the Y-axis direction. The mounting head 26 is attached to the slider 50, and the mounting head 26 moves to an arbitrary position on the frame 30 by the operation of the two electromagnetic motors 52 and 54.

[0019] The mounting head 26 mounts electronic components onto a circuit board. The mounting head 26 has a suction nozzle 60 provided on its lower end surface. The suction nozzle 60 communicates with a positive / negative pressure supply device (see FIG. 3) 66 via a negative pressure air and a positive pressure air passage. The suction nozzle 60 sucks and holds an electronic component by negative pressure and releases the held electronic component by positive pressure. Further, the mounting head 26 has a nozzle lifting device (see FIG. 3) 68 that raises and lowers the suction nozzle 60. By means of the nozzle lifting device 68, the mounting head 26 changes the vertical position of the electronic component it holds. Note that the suction nozzle 60 is detachable from the mounting head 26 and can be exchanged according to the size of the electronic component or the like.

[0020] The supply device 28 is a feeder type supply device and is disposed at an end of the frame 30. The supply device 28 has a plurality of tape feeders 70. The tape feeder 70 accommodates the taped component in a wound state. The taped component is one in which an electronic component is taped onto a carrier tape. Then, the tape feeder 70 feeds out the taped component by a feeding device (see FIG. 3) 76. Thereby, the feeder type supply device 28 supplies an electronic component at the supply position by feeding out the taped component. Note that the tape feeder 70 is detachable from the frame 30 and can cope with the replacement of the electronic component or the like.

[0021] Further, as shown in FIG. 3, the substrate processing system 10 includes a control device 80. The control device 80 includes a controller 82, a plurality of drive circuits 86, and a control circuit 87. The plurality of drive circuits 86 are connected to the electromagnetic motors 44, 52, 54, the substrate holding device 46, the positive and negative pressure supply device 66, the nozzle lifting device 68, and the feeding device 76. The controller 82 includes a CPU, a ROM, a RAM, etc., and is mainly a computer, and is connected to the plurality of drive circuits 86. Thereby, the operations of the transfer device 22, the moving device 24, etc. are controlled by the controller 82. Further, the controller 82 is connected to the display device 88 via the control circuit 87. Thereby, an arbitrary image is displayed on the display device 88 by the controller 82. Note that a production program 90 is stored in the controller 82, and the controller 82 produces a circuit board by controlling the operations of the transfer device 22, the moving device 24, etc. according to the production program 90.

[0022] Specifically, first, a circuit board is carried into the mounter 16 arranged at the most upstream among the eight mounters 16 constituting the substrate handling system 10. Then, in that mounter 16, the controller 82 outputs commands according to the production program 90, so that the circuit board is conveyed to the working position and held at that position by the substrate holding device 46. Also, the tape feeder 70 feeds out the taped components and supplies the electronic components at the supply position according to the commands of the controller 82 according to the production program 90. Then, the mounting head 26 moves above the supply position of the electronic components according to the commands of the controller 82 according to the production program 90, and adsorbs and holds the electronic components by the suction nozzle 60. Subsequently, the mounting head 26 moves above the circuit board and mounts the held electronic components on the circuit board. When the mounting operation of the electronic components on the circuit board is completed, the circuit board is conveyed downstream and carried into the mounter 16 arranged on the downstream side. Then, by sequentially executing the above mounting operation in each mounter 16, a circuit board with electronic components mounted thereon is produced. Since the production program 90 is a program for producing a predetermined type of circuit board, when another type of circuit board is produced, the controller 82 controls the conveying device 22, the moving device 24, etc. according to a production program different from the production program 90. Therefore, when a plurality of types of circuit boards are produced by the substrate handling system 10, a plurality of types of production programs corresponding to those plurality of types of circuit boards are stored in the controller 82.

[0023] In this way, the controller 82 controls the operations of the transfer device 22, the moving device 24, etc. according to the production program corresponding to the type of the circuit board to be produced, thereby producing the circuit board to be produced. And the controller 82 stores the production information of the circuit boards of each type produced. Note that the production information of the circuit board includes the type of the circuit board, the production date and time, the production quantity, the type of the production program used for the production of the circuit board, the status information of the substrate processing system 10 at the time of circuit board production, etc. Further, the status information of the substrate processing system 10 includes the planned production time, the actual production time, the residence time of the circuit board, the setup change time, the component supply waiting time, the error stop time, the switch pressing waiting time, the startup time, the shutdown time, the planned stop time, etc.

[0024] Incidentally, the planned production time is the production time of the planned circuit board and is preset by the operator. Also, the actual production time is the time during which the transfer device 22, the moving device 24, the mounting head 26, etc. of the substrate working system 10 are actually operating during the production of the circuit board, and is measured during the production of the circuit board. That is, the production time is the time obtained by subtracting the time during which the substrate working system 10 is stopped due to the occurrence of errors, component replenishment, setup change, etc. from the planned production time. Also, the residence time of the circuit board is the time during which the circuit board stays at the upstream mounting machine until the mounting operation on another circuit board is completed at the downstream mounting machine when the circuit substrate is being transferred from the upstream mounting machine to the downstream mounting machine in the substrate working system and the mounting operation on another circuit board is being performed at the downstream mounting machine. Note that the residence time of the circuit board is also measured during the production of the circuit board. Also, the setup change time is the time required for the setup performed when the type of the circuit board to be produced is changed, and the setup change time is also measured during the production of the circuit board. Also, the component replenishment waiting time is the time during which the operation of the mounting machine is stopped to replenish the taped components to the tape feeder during the production of the circuit board, and the component replenishment waiting time is also measured during the production of the circuit board. Also, the error stop time is the time during which the operation of the mounting machine is stopped due to the occurrence of a machine error or the like during the production of the circuit board, and the error stop time is also measured during the production of the circuit board. Also, the switch pressing waiting time is the time for waiting for the operator to press the start switch, and the switch pressing waiting time is also measured during the production of the circuit board. Also, the startup time is the time required for the operation start of the substrate working system when resuming production, and the startup time is also measured. Also, the shutdown time is the time required for the operation stop of the substrate working system when stopping production, and the shutdown time is also measured. Also, the planned stop time is the time for plannedly stopping the operation of the substrate working system during breaks or the like and is preset by the operator. Note that the planned production time, actual production time, residence time of the circuit board, setup change time, etc. included in the status information are the times of each of the plurality of mounting machines constituting the substrate working system.

[0025] In this way, the controller 82 stores the production information of the produced circuit boards, and it is possible to check the operating state of the substrate handling system 10 using the production information. Specifically, based on the production date and time and status information of the circuit boards included in the production information, the controller 82 calculates the total time of each of the planned production time, actual production time, residence time of the circuit boards, setup change time, etc. in the substrate handling system per day. That is, for example, the controller 82 extracts the planned production time of each of a plurality of mounters constituting the substrate handling system on a predetermined day, for example, December 10, from the production information, and sums up the planned production times of the plurality of mounters. Thereby, the planned production time of the entire substrate handling system per day on December 10 (hereinafter, "system planned production time") is calculated. Also, the controller 82 extracts the actual production time of the plurality of mounters constituting the substrate handling system on December 10 from the production information, and sums up the actual production times of the plurality of mounters. Thereby, the actual production time of the entire substrate handling system per day on December 10 (hereinafter, "system actual production time") is calculated. Also, regarding other times such as the residence time and setup change time of the circuit boards on December 10 included in the status information of the production information, the time of the entire substrate handling system per day is calculated. Note that the residence time, setup change time, etc. of the entire substrate handling system per day are also described as the system residence time, system setup change time, etc.

[0026] When the system planned production time, system actual production time, system residence time, system setup change time, etc. on December 10th are calculated, the operation rate, residence rate, setup change rate, etc. of the entire substrate handling work system on a daily basis for December 10th are calculated. Specifically, the operation rate of the entire substrate handling work system (hereinafter referred to as the "system operation rate") is calculated as the percentage of the system actual production time to the system planned production time. Also, the residence rate of the entire substrate handling work system (hereinafter referred to as the "system residence rate") is calculated as the percentage of the system residence time to the system planned production time. Further, the setup change rate of the entire substrate handling work system (hereinafter referred to as the "system setup change rate") is calculated as the percentage of the system setup change time to the system planned production time. Note that each of the parts replenishment waiting time, error stop time, switch pressing waiting time, startup time, shutdown time, planned stop time, etc. is similarly calculated for the total time of the entire substrate handling work system on a daily basis. And for each of the error stop time, switch pressing waiting time, startup time, shutdown time, planned stop time, etc., the percentage of the calculated total time of the entire substrate handling work system on a daily basis to the system planned production time is calculated.

[0027] In addition to the system operation rate, system residence rate, system setup change rate, etc. on December 10th, the system operation rate, system residence rate, system setup change rate, etc. on December 11th and December 12th are also calculated. Then, the system operation rate, system residence rate, system setup change rate, etc. from December 10th to 12th are displayed on the display device 88 as the system analysis screen 100 on a daily basis as shown in FIG. 4. On the system analysis screen 100 on a daily basis, the system operation rate, system residence rate, system setup change rate, etc. are displayed as bar graphs 102 on a daily basis. That is, the system operation rate, system residence rate, system setup change rate on December 10th are displayed as bar graph 102a, the system operation rate, system residence rate, system setup change rate on December 11th are displayed as bar graph 102b, and the system operation rate, system residence rate, system setup change rate on December 12th are displayed as bar graph 102c. Also, the total system operation rate, system residence rate, system setup change rate, etc. for the three days from December 10th to 12th are displayed as a pie chart 104.

[0028] Note that the area indicated by the reference numeral 106 of each graph indicates the system operation rate, the area indicated by the reference numeral 108 indicates the system residence rate, and the area indicated by the reference numeral 110 indicates the system setup change time rate. Thereby, by checking the system analysis screen 100, the operator can recognize and analyze the system operation rate, system residence rate, system setup change rate, etc. on a daily basis from December 10th to 12th or for the three days.

[0029] In addition, the system operation rate, system residence rate, system setup change rate, etc. are calculated not only on a daily basis but also on an hourly basis, and the system analysis screen on an hourly basis is also displayed on the display device 88. Specifically, on the system analysis screen 100 on a daily basis, when an arbitrary bar graph 102 out of the bar graphs 102 for each day from December 10th to 12th, for example, the bar graph 102a on December 10th is operated, the system analysis screen 120 on an hourly basis for December 10th is displayed on the display device 88 as shown in FIG. 5. On the system analysis screen 120 on an hourly basis, the system operation rate, system residence rate, system setup change rate, etc. are displayed as bar graphs 122 on an hourly basis. Also, the total system operation rate, system residence rate, system setup change rate, etc. for December 10th for the whole day are displayed as a pie chart 124. By checking the system analysis screen 120, the operator can recognize and analyze the system operation rate, system residence rate, system setup change rate, etc. for each hour or for the whole day on December 10th.

[0030] Furthermore, on the system analysis screen 120 on an hourly basis, when an arbitrary bar graph at a certain time out of the bar graphs 122 for each hour, for example, the bar graph 122 from 12:00 to 13:00 is operated, the system analysis screen 130 for that specific time, that is, from 12:00 to 13:00, is displayed on the display device 88 as shown in FIG. 6. On the system analysis screen 130 for that specific time, the system operation rate, system residence rate, system setup change rate, etc. for that specific time, that is, from 12:00 to 13:00 on December 10th, are displayed as a pie chart 132. Thus, by checking the pie chart 132 on the system analysis screen 130, the operator can recognize and analyze the system operation rate, system residence rate, system setup change rate, etc. from 12:00 to 13:00 on December 10th.

[0031] Also, when the system analysis screen 130 for a specific time is displayed, the operating rate, residence rate, changeover rate, etc. for each mounter at that specific time, i.e., from 12:00 to 13:00 on December 10th, are calculated based on the production information. That is, the controller 82 extracts the planned production time, actual production time, residence time, changeover time, etc. of a plurality of mounters constituting the substrate handling system from 12:00 to 13:00 on December 10th from the production information, and sums up the planned production time, actual production time, residence time, changeover time, etc. for each mounter. Then, the controller 82 calculates, for each mounter, the percentage of the total actual production time to the total planned production time as the operating rate, the percentage of the total residence time to the total planned production time as the residence rate, and the percentage of the total changeover time to the total planned production time as the changeover rate, etc. And on the system analysis screen 130, the operating rate, residence rate, changeover rate, etc. for each mounter from 12:00 to 13:00 on December 10th are displayed in the bar graph 134 for each mounter. Thereby, by checking the bar graph 134 on the system analysis screen 130, the operator can recognize and analyze the operating rate, residence rate, changeover rate, etc. for each mounter from 12:00 to 13:00 on December 10th.

[0032] In this way, by displaying the system analysis screens 100, 120, and 130 on the display device, the operator can mainly recognize and analyze the operating rate, residence rate, etc. of the entire substrate handling system. At this time, when the production operation of the substrates produced by the substrate handling system is mass production of a small variety of products, the production line of the substrate handling system can be appropriately analyzed based on the operating rate, residence rate, etc. of the entire substrate handling system. On the other hand, when the production operation of the substrates produced by the substrate handling system is small batch production of a large variety of products, there is a possibility that the production line of the substrate handling system cannot be appropriately analyzed based on the operating rate, residence rate, etc. of the entire substrate handling system.

[0033] Specifically, the production operation of the substrate is a production method indicated by the type of substrate produced in a substrate production operation system for a predetermined period, for example, the type of substrate produced in one day and the number of substrates of each type produced. For example, when the types of substrates produced in a predetermined period are few and the number of substrates of each type produced is large, the production operation of the substrate is mass production of a small number of varieties. On the other hand, when the types of substrates produced in a predetermined period are many and the number of substrates of each type produced is small, the production operation of the substrate is small batch production of many varieties. And when substrates are produced in mass production of a small number of varieties in the substrate production operation system, since mounting operations for a small number of types of circuit boards are performed, it is easy to equalize the working hours of a plurality of mounting machines constituting the substrate production operation system. On the other hand, when substrates are produced in small batch production of many varieties, since mounting operations for many types of circuit boards are performed, it is difficult to equalize the working hours of a plurality of mounting machines constituting the substrate production operation system. This is because, in order to improve production efficiency, it is desired to shorten the time required for changeover operations, for example, replacing the tape feeder that supplies components mounted on the substrate or changing its supply position. Therefore, by standardizing the arrangement of the tape feeders when producing each substrate type, the changeover operation time can be shortened. Due to such standardization constraints, it becomes difficult to equalize the working hours of a plurality of mounting machines, and this becomes more difficult as the number of substrate types to be standardized increases.

[0034] Thus, in multi-variety and small-batch production, it is difficult to equalize the working times of multiple mounters that make up the substrate-facing work system. As a result, variations occur in the working times of each of the multiple mounters, and the mounter with the longest working time among the multiple mounters becomes the bottleneck, reducing the efficiency of the production line of the substrate-facing work system. That is, when substrates are produced in multi-variety and small-batch production, a specific mounter among the multiple mounters, that is, the mounter that becomes the bottleneck (hereinafter referred to as the "bottleneck mounter"), is subjected to a large load, and due to this bottleneck mounter, the efficiency of the production line of the substrate-facing work system is reduced. Therefore, when substrates are produced in multi-variety and small-batch production, by analyzing the operation rate, residence rate, etc. of the bottleneck mounter instead of the operation rate, residence rate, etc. of the entire substrate-facing work system, the efficiency of the production line of the substrate-facing work system can be increased. Therefore, when substrates are produced in multi-variety and small-batch production, instead of the system analysis screens 100, 120, 130 showing the operation rate, residence rate, etc. of the entire substrate-facing work system, a screen showing the operation rate, residence rate, etc. of the bottleneck mounter is displayed on the display device.

[0035] Specifically, first, the controller 82 estimates the production operation of the substrate based on the production information. As described above, the production information includes the production date and time of the circuit board and the production program used for the production of the circuit board. Therefore, the controller 82 calculates the number of production programs executed in one day based on the production date and time of the circuit board included in the production information and the production program used for the production of the circuit board. Also, since the production program is for producing a predetermined type of circuit board, the number of production programs executed in one day is the same as the number of types of circuit boards produced in one day. That is, for example, when two production programs are executed in one day, two types of circuit boards are produced on that day. Therefore, when the number of production programs executed in one day is small, for example, three or less, the controller 82 estimates that the substrate production operation is mass production of a small number of varieties. On the other hand, when the number of production programs executed in one day is large, for example, four or more, the controller 82 estimates that the substrate production operation is multi-variety and small-batch production.

[0036] When the controller 82 estimates that the production operation of the substrate is small-lot production of multiple varieties, based on the type, production date and time, and status information of the circuit board included in the production information, it calculates the total time per day such as the planned production time, actual production time, residence time of the circuit board, and setup change time at the bottleneck mounter. That is, for each type of circuit board, the controller 82 extracts the actual production time of each mounter on a predetermined day, for example, December 17th, and identifies the mounter with the longest time among the extracted actual production times of each mounter as the bottleneck mounter. Then, the controller 82 extracts the planned production time, actual production time, residence time of the circuit board, setup change time, etc. of the bottleneck mounter for each type of circuit board from the production information on December 17th. Subsequently, the controller 82 calculates the total time of each of the extracted planned production time, actual production time, residence time of the circuit board, setup change time, etc. of the bottleneck mounter. Thereby, the planned production time, actual production time, residence time of the circuit board, setup change time, etc. of the bottleneck mounter per day on December 17th are calculated. Note that the planned production time, actual production time, residence time of the circuit board, setup change time, etc. of the bottleneck mounter per day are described as the bottleneck planned production time, bottleneck actual production time, bottleneck residence time, and bottleneck setup change time.

[0037] Then, when the bottleneck planned production time, bottleneck actual production time, bottleneck residence time, bottleneck setup change time, etc. on December 17th are calculated, the operation rate, residence rate, setup change rate, etc. of the bottleneck labeling machine on a daily basis for December 17th are calculated. Specifically, the operation rate of the bottleneck labeling machine (hereinafter referred to as the "bottleneck operation rate") is calculated as the percentage of the bottleneck actual production time to the bottleneck planned production time. Also, the residence rate of the bottleneck labeling machine (hereinafter referred to as the "bottleneck residence rate") is calculated as the percentage of the bottleneck residence time to the bottleneck planned production time. Also, the setup change rate of the bottleneck labeling machine (hereinafter referred to as the "bottleneck setup change rate") is calculated as the percentage of the bottleneck setup change time to the bottleneck planned production time. In addition, for each of the parts supply waiting time, error stop time, switch pressing waiting time, startup time, shutdown time, planned stop time, etc., the total time of the bottleneck labeling machine on a daily basis is similarly calculated. And for each of the error stop time, switch pressing waiting time, startup time, shutdown time, planned stop time, etc., the percentage of the total time of the bottleneck labeling machine on a daily basis calculated to the bottleneck planned production time is calculated.

[0038] In addition to the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. on December 17th, the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. on December 18th and December 19th are also calculated. Then, the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. from December 17th to 19th are displayed on the display device 88 as a bottleneck analysis screen 150 on a daily basis as shown in FIG. 7. On the bottleneck analysis screen 150 on a daily basis, the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. are displayed by a bar graph 152 on a daily basis. That is, the bottleneck operation rate, bottleneck residence rate, and bottleneck setup change rate on December 17th are displayed by a bar graph 152a, the bottleneck operation rate, bottleneck residence rate, and bottleneck setup change rate on December 18th are displayed by a bar graph 152b, and the bottleneck operation rate, bottleneck residence rate, and bottleneck setup change rate on December 19th are displayed by a bar graph 152c. In addition, the total bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. for the three days from December 17th to 19th are displayed by a pie chart 154.

[0039] Note that the area indicated by the reference numeral 155 of each graph indicates the bottleneck operation rate, the area indicated by the reference numeral 156 indicates the bottleneck residence rate, and the area indicated by the reference numeral 158 indicates the bottleneck setup change time rate. Thereby, by checking the bottleneck analysis screen 150, the operator can recognize and analyze the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. on a daily basis from December 17th to 19th or for the three days.

[0040] Also, on the bottleneck analysis screen 150, when a cursor or the like is moved onto any of the bar graphs 152 for each day from December 17th to 19th, the name of the production program executed on the date corresponding to the bar graph 152 and the name of the bottleneck mounting machine are displayed. Specifically, for example, on the bottleneck analysis screen 150, when the cursor or the like is moved onto the bar graph 152 for December 17th among the bar graphs 152 for each day from December 17th to 19th, as shown in FIG. 8, a pop-up screen 160 is displayed. On the pop-up screen 160, the name of the production program executed on December 17th and the name of the bottleneck mounting machine when the production program was executed are displayed in association with each other.

[0041] Also, the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. are calculated not only on a daily basis but also on an hourly basis, and the bottleneck analysis screen on an hourly basis is also displayed on the display device 88. Specifically, on the bottleneck analysis screen 150 on a daily basis, when any of the bar graphs 152 for each day from December 17th to 19th, for example, the bar graph 152a for December 17th is operated, the bottleneck analysis screen 170 on an hourly basis for December 17th is displayed on the display device 88 as shown in FIG. 9. On the bottleneck analysis screen 170 on an hourly basis, the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. are displayed in bar graphs 172 on an hourly basis. Also, the total bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. for December 17th are displayed in a pie chart 174. Therefore, by checking the bottleneck analysis screen 170, the operator can recognize and analyze the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. for each hour or for the whole day of December 17th.

[0042] Furthermore, in the bottleneck analysis screen 170 in hourly units, when an arbitrary bar graph 172 at each hour, for example, the bar graph 172 from 12:00 to 13:00, among the bar graphs 172 for each hour, is operated, the bottleneck analysis screen 180 at that specific time, that is, from 12:00 to 13:00, is displayed on the display device 88 as shown in FIG. 10. In the bottleneck analysis screen 180 at that specific time, the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. at that specific time, that is, from 12:00 to 13:00 on December 17th, are displayed in a pie chart 182. Thereby, by checking the pie chart 182 on the bottleneck analysis screen 180, the operator can recognize and analyze the bottleneck operation rate, bottleneck residence rate, bottleneck setup change rate, etc. from 12:00 to 13:00 on December 17th.

[0043] Also, when the bottleneck analysis screen 180 at a specific time is displayed, the operation rate, residence rate, setup change rate, etc. for each mounting machine at that specific time, that is, from 12:00 to 13:00 on December 17th, are calculated based on production information. Note that the calculation method for the operation rate, residence rate, setup change rate, etc. for each mounting machine at a specific time in the bottleneck analysis screen 180 is the same as the calculation method for the operation rate, residence rate, setup change rate, etc. for each mounting machine at a specific time in the system analysis screen 130. For this reason, the description of the calculation method for the operation rate, residence rate, setup change rate, etc. for each mounting machine at a specific time in the bottleneck analysis screen 180 is omitted. And when the operation rate, residence rate, setup change rate, etc. for each mounting machine are calculated, in the bottleneck analysis screen 180, the operation rate, residence rate, setup change rate, etc. for each mounting machine from 12:00 to 13:00 on December 17th are displayed in a bar graph 184 in units of mounting machines. Thereby, by checking the bar graph 184 on the bottleneck analysis screen 180, the operator can recognize and analyze the operation rate, residence rate, setup change rate, etc. for each mounting machine from 12:00 to 13:00 on December 17th.

[0044] Thus, when it is estimated that the production operation of the substrate is multi-variety and small-batch production, by displaying the bottleneck analysis screens 150, 170, and 180 on the display device, the operator can mainly recognize and analyze the operation rate, residence rate, etc. of the bottleneck mounting machine. Thereby, when the substrate is produced in multi-variety and small-batch production, by analyzing the operation rate, residence rate, etc. of the bottleneck mounting machine, the efficiency of the production line of the substrate handling system can be suitably increased. Further, on the bottleneck analysis screen 150, as shown in FIG. 8, by displaying the pop-up screen 160, the operator can recognize the bottleneck mounting machine when the circuit board is produced for each type of circuit board, and can improve the efficiency of the production line for each type of circuit board.

[0045] Further, when it is estimated that the production operation of the substrate is few-variety and large-batch production, as described above, the system analysis screens 100, 120, and 130 are displayed on the display device 88. In few-variety and large-batch production, since the variation in the working time of each of the plurality of mounting machines constituting the substrate handling system is small, by analyzing the operation rate, residence rate, etc. of the entire substrate handling system, the efficiency of the production line of the substrate handling system can be suitably increased.

[0046] Thus, in the substrate handling system, according to the production operation of the substrate, the system analysis screens 100, 120, and 130 showing the operation rate, residence rate, etc. of the entire substrate handling system and the bottleneck analysis screens 150, 170, and 180 showing the operation rate, residence rate, etc. of the bottleneck mounting machine are selectively displayed. Thereby, it becomes possible to analyze the operation rate, residence rate, etc. according to the production operation of the substrate, and the efficiency of the production line of the substrate handling system can be suitably increased.

[0047] Note that the substrate handling system 10 is an example of a production system. The mounting machine 16 is an example of a working machine. The control device 80 is an example of an information processing device. The display device 88 is an example of a display device. The system analysis screens 100, 120, and 130 are examples of the first screen. The bottleneck analysis screens 150, 170, and 180 are examples of the second screen.

[0048] Also, the present invention is not limited to the above embodiments, and can be implemented in various modes with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiments, the production operation is estimated based on the production information of the circuit board produced by the substrate processing system, that is, the information indicating the production result of the circuit board in the substrate processing system. On the other hand, the production operation may be estimated based on the information indicating the production schedule of the circuit board planned in the substrate processing system. And based on the estimated production operation, it is also possible to display the operating state of the substrate processing system according to the production schedule of the circuit board.

[0049] Also, in the above embodiments, the screen display on the display device 88 is switched according to the production operation of the substrate estimated based on the production information. However, the screen display on the display device 88 may be switched according to the production operation of the substrate obtained by another method. That is, for example, the operator may input the production operation of the substrate to the control device 80, and the screen display on the display device 88 may be switched according to the production operation. Also, for example, the control device 80 may obtain the production operation of the substrate from another device, and the screen display on the display device 88 may be switched according to the production operation.

[0050] Also, in the above embodiments, the screen display on the display device 88 is switched according to the production operation of the substrate. However, the screen display on the display device 88 may be switched according to another method. Specifically, for example, the screen display on the display device 88 may be switched by the operation of the operator. That is, for example, a first screen selection button and a second screen selection button are displayed on the display device. When the first screen selection button is operated, the system analysis screens 100, 120, 130 are displayed. When the second screen selection button is operated, the bottleneck analysis screens 150, 170, 180 may be displayed.

[0051] Also, in the above embodiment, the operation rate, residence rate, and setup change rate are displayed on the analysis screen as information indicating the operating state of the substrate handling system. However, other information indicating the operating state may be displayed on the analysis screen. For example, when a circuit board is loaded into the substrate handling system, the time the circuit board stays outside the substrate handling system, the component replenishment time, the error occurrence rate, the component holding rate by the suction nozzle, etc. may be displayed on the analysis screen as information indicating the operating state of the substrate handling system.

[0052] Also, in the above embodiment, the production operation of the substrate is estimated based on the number of production programs executed in a day. However, the production operation of the substrate may be estimated based on other information. For example, the production operation of the substrate may be estimated based on the usage rate of the component holders stored in the storage, the ratio of the supply devices that do not supply components during the production of the substrate, the number of replacements of the component holders, etc.

Explanation of Reference Numerals

[0053] 10: Substrate handling system (production system) 16: Mounter (working machine) 80: Control device (information processing device) 88: Display device 100: System analysis screen (first screen) 120: System analysis screen (first screen) 130: System analysis screen (first screen) 150: Bottleneck analysis screen (second screen) 170: Bottleneck analysis screen (second screen) 180: Bottleneck analysis screen (second screen)

Claims

1. An information processing apparatus that includes a plurality of arranged working machines, and while a substrate is conveyed from an upstream side to a downstream side of the plurality of working machines, operations by each of the plurality of working machines are sequentially performed on the substrate. The control device of the production system determines which of a first screen showing the overall operating state of the production system for producing the substrate and a second screen showing the operating state of the working machine with the longest working time among the plurality of working machines should be selected, and causes the determined first screen or second screen to be displayed.

2. The information processing apparatus according to claim 1, which estimates whether the production operation of the substrate produced by the production system is mass production of few varieties or small batch production of many varieties, and selectively causes the first screen and the second screen to be displayed on the display device according to the estimated production operation.

3. The information processing apparatus according to claim 1 or claim 2, which, when a plurality of types of substrates are produced by the production system, causes the second screen to display each of a plurality of types of production programs for producing the plurality of types of substrates and information indicating the working machine with the longest working time among the plurality of working machines when the substrate is produced according to each production program.

4. An information processing apparatus that includes a plurality of arranged working machines, and while a substrate is conveyed from an upstream side to a downstream side of the plurality of working machines, operations by each of the plurality of working machines are sequentially performed on the substrate. The screen showing the operating state of the production system for producing the substrate is switched according to whether the production operation of the substrate produced by the production system is mass production of few varieties or small batch production of many varieties, and is displayed on the display device.

5. A display method in which a control device provided in a production system determines which of a first screen showing the overall operating state of the production system for producing a substrate and a second screen showing the operating state of the working machine with the longest working time among the plurality of working machines should be selected, and the determined first screen or second screen is displayed on a display device while the substrate is being conveyed from the one arranged on the upstream side of the plurality of working machines to the one arranged on the downstream side, and operations by each of the plurality of working machines are sequentially performed on the substrate.

6. A display method in which a screen showing the operating state of a production system for producing a substrate is switched according to whether the production operation of the substrate produced by the production system is mass production of a small number of varieties or small batch production of a large number of varieties and is displayed on a display device while the substrate is being conveyed from the one arranged on the upstream side of the plurality of arranged working machines to the one arranged on the downstream side, and operations by each of the plurality of working machines are sequentially performed on the substrate.

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