Prover

Abstract

To provide a prober that is equipped with a transport unit that transports objects between an object storage unit and a measurement unit, and can improve throughput in the measurement unit.SOLUTION: In a prober 10, a transport unit 16 transports an object (for example, a wafer and a probe card) between an object storage unit 12 and a measurement unit 14. When an object is transported from either one of the object storage unit 12 and the measurement unit 14 to the other, the transport unit 16 has environment control means for controlling the transport environment of the object such that the transport environment of the object approaches the other environment.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a prober for inspecting the electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer. In particular, the present invention relates to a transfer unit that moves between a carrier storage unit and a plurality of measurement units to transfer a carrier to the carrier storage unit or each measurement unit, and a prober including the transfer unit.

Background Art

[0002] Conventionally, a prober (wafer inspection device) has been proposed that includes a carrier storage unit for storing a plurality of carriers (a cassette stock unit for storing a plurality of wafers), a plurality of measurement units (wafer inspection units), and a transfer unit (a self-propelled vehicle platform) that moves between the carrier storage unit and each measurement unit to transfer the carrier to the carrier storage unit or each measurement unit (see, for example, Patent Document 1). According to the prober described in Patent Document 1, for example, when using N measurement units, the inspection time can be shortened to 1 / N compared to the case of using one measurement unit.

[0003] Also, conventionally, in a prober, inspection of electrical characteristics at high temperature (or low temperature) of a wafer (high temperature inspection or low temperature inspection) has been carried out. This inspection is usually performed by transferring a wafer from a cassette to a wafer chuck by a transfer arm, heating (or cooling) the wafer to the inspection temperature on the wafer chuck to perform an inspection of electrical characteristics, cooling (or heating) the wafer on the wafer chuck after the inspection is completed, and returning the wafer to the cassette by the transfer arm after the temperature returns to room temperature.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the probe described in Patent Document 1, when a high-temperature inspection or a low-temperature inspection is performed in each measurement unit, the following problems occur due to the difference between the environment of the conveyance object storage unit (usually, normal temperature environment) and the environment of each measurement unit (high-temperature environment or low-temperature environment).

[0006] For example, when performing a high-temperature inspection, before the start of the inspection, a waiting time (for preheating) is required in each measurement unit to bring the wafer or probe card at room temperature close to the inspection temperature, resulting in a problem that the throughput (processing capacity per unit time) in each measurement unit decreases. In particular, when performing a high-temperature inspection again after replacing the wafer or probe card, since it takes time for the wafer chuck to become hot again, the waiting time becomes even longer until the next high-temperature inspection can be performed, and the throughput in each measurement unit further decreases. Also, when performing a high-temperature inspection, if the wafer or probe card is replaced after the inspection, a waiting time is required in each measurement unit to bring the wafer or probe card in the high-temperature state close to room temperature, which also causes a problem that the throughput in each measurement unit decreases.

[0007] Similarly, when performing a low-temperature inspection, before the start of the inspection, a waiting time is required in each measurement unit to bring the wafer or probe card at room temperature close to the inspection temperature, resulting in a problem that the throughput in each measurement unit decreases. In particular, when performing a low-temperature inspection again after replacing the wafer or probe card, since it takes time for the wafer chuck to become cold again, the waiting time becomes even longer until the next low-temperature inspection can be performed, and the throughput in each measurement unit further decreases. Also, when performing a low-temperature inspection, after the inspection is completed, a waiting time is required in each measurement unit to bring the wafer or probe card in the low-temperature state close to a temperature at which dew condensation does not occur (usually, room temperature), which also causes a problem that the throughput in each measurement unit decreases.

[0008] As described above, in the prober described in Patent Document 1, when a high-temperature inspection or a low-temperature inspection is performed in each measurement unit, due to the difference between the environment of the conveyance object storage unit (usually, normal temperature environment) and the environment of each measurement unit (high-temperature environment or low-temperature environment), there is a problem that the waiting time for bringing the conveyance object to a predetermined temperature (for example, inspection temperature or normal temperature) within each measurement unit becomes long, and the throughput in each measurement unit decreases. It is required to improve this and improve the throughput in each measurement unit.

[0009] The present invention has been made in view of such circumstances, and in a prober including a conveyance unit that moves between a conveyance object storage unit and a plurality of measurement units and conveys a conveyance object (for example, at least one of a wafer and a probe card) to the conveyance object storage unit or each measurement unit, an object of the present invention is to provide a prober and a conveyance unit capable of improving the throughput in each measurement unit.

Means for Solving the Problems

[0010] In order to achieve the above object, the prober of the present invention includes a conveyance object storage unit that stores a plurality of conveyance objects, a plurality of measurement units, a housing that stores the conveyance objects, and environment control means for controlling the environment inside the housing. A conveyance unit that moves between the conveyance object storage unit and each measurement unit and conveys the conveyance object into the conveyance object storage unit or each measurement unit, and a moving device that moves the conveyance unit between the conveyance object storage unit and each measurement unit. The environment control means controls the environment inside the housing so as to be an environment corresponding to the environment of the conveyance destination of the conveyance object.

[0011] The conveyance unit of one aspect of the prober of the present invention further includes a sensor that detects the environment inside the housing, and the environment control means controls the inside of the housing to a target environment based on the detection result of the sensor.

[0012] In one aspect of the prober of the present invention, when the conveyance destination of the conveyance unit is a measurement unit, the environment control means controls the environment inside the housing so as to be an environment corresponding to the inspection performed in the measurement unit of the conveyance destination.

[0013] In one aspect of the probe of the present invention, when the destination of the transport unit is the measurement unit where the high-temperature inspection is performed, the environment control means controls the environment inside the housing so that the transported object stored in the housing is heated.

[0014] In one aspect of the probe of the present invention, when the destination of the transport unit is the transported object storage unit, and the transport unit transports the transported object that has reached a high temperature state due to the high-temperature inspection into the transported object storage unit, the environment control means controls the environment inside the housing so that the transported object stored in the housing is cooled.

[0015] In one aspect of the probe of the present invention, when the destination of the transport unit is the measurement unit where the low-temperature inspection is performed, the environment control means controls the environment inside the housing so that the transported object stored in the housing is cooled.

[0016] In one aspect of the probe of the present invention, when the destination of the transport unit is the transported object storage unit, and the transport unit transports the transported object that has reached a low temperature state due to the low-temperature inspection into the transported object storage unit, the environment control means controls the environment inside the housing so that the transported object stored in the housing is heated.

[0017] In one aspect of the probe of the present invention, when the destination of the transport unit is the measurement unit where the inspection is performed under a predetermined gas atmosphere, the environment control means controls the environment inside the housing so that the inside of the housing becomes the predetermined gas atmosphere.

[0018] One aspect of the probe of the present invention includes a transported object holding arm provided on the transport unit for holding the transported object, which enters and exits through an opening formed in the housing and is stored in the housing together with the transported object while holding the transported object.

[0019] The conveyance object storage unit and each measurement unit of one aspect of the probe of the present invention are arranged at a certain interval with the surfaces on the side accessed by the conveyance unit facing each other, and the conveyance unit is arranged between the conveyance object storage unit and each measurement unit.

[0020] One aspect of the probe of the present invention includes a conveyance unit rotation mechanism that rotates the conveyance unit so that the opening through which the conveyance object holding arm enters and exits faces the conveyance object storage unit or each measurement unit.

[0021] Each measurement unit of one aspect of the probe of the present invention is two-dimensionally arranged in the horizontal direction and the vertical direction.

[0022] One aspect of the probe of the present invention includes a first movable body that moves in the horizontal direction, which is the arrangement direction of each measurement unit, between the conveyance object storage unit and each measurement unit; a first movable body movement mechanism that moves the first movable body in the horizontal direction; a second movable body that is movably attached to the first movable body in the vertical direction, which is the arrangement direction of each measurement unit, and rotatably supports the conveyance unit about a vertical axis; a second movable body movement mechanism that moves the second movable body in the vertical direction; and a conveyance unit rotation mechanism that is attached to the second movable body and rotates the conveyance unit about a vertical axis.

[0023] The conveyance object of one aspect of the probe of the present invention is at least one of a wafer and a probe card, and the conveyance object holding arm is at least one of a wafer arm that holds the wafer and a probe card arm that holds the probe card.

[0024] Each of the plurality of measurement units of one aspect of the probe of the present invention includes a wafer chuck that is adjusted to a target temperature and a probe card holding portion to which the probe card is detachably attached.

[0025] The environment control means of one aspect of the probe of the present invention is provided on the upper surface inside the housing.

[0026] The environmental control means of one aspect of the prober of the present invention is provided at substantially the center of the upper surface.

[0027] A transport unit according to another aspect of the present invention is a transport unit that moves between a transport object storage unit that stores a plurality of transport objects and a plurality of measurement units, and transports the transport objects into the transport object storage unit or each measurement unit. The transport unit includes a housing that stores the transport objects, and environmental control means for controlling the environment inside the housing so that the environment inside the housing becomes an environment corresponding to the environment of the transport destination of the transport objects.

Advantages of the Invention

[0028] According to the present invention, there is provided a prober including a transport unit that moves between a transport object storage unit and a plurality of measurement units and transports a transport object (for example, at least one of a wafer and a probe card) to the transport object storage unit or each measurement unit, and a prober and a transport unit capable of improving the throughput in each measurement unit can be provided.

Brief Description of the Drawings

[0029]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0030] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0031] FIG. 1 is a perspective view showing a schematic configuration of the provider 10 of the present embodiment.

[0032] As shown in FIG. 1, the provider 10 of the present embodiment includes a conveyance object storage unit 12, a plurality of measurement units 14, a conveyance unit 16 that moves between the conveyance object storage unit 12 and each measurement unit 14 to convey a conveyance object (at least one of a wafer and a probe card in the present embodiment) into the conveyance object storage unit 12 or each measurement unit 14, and a moving device (conveyance unit moving device) 22 that moves the conveyance unit 16 between the conveyance object storage unit 12 and each measurement unit 14.

[0033] The conveyance object storage unit 12 and each measurement unit 14 are arranged at regular intervals in the Y direction in a state where the surfaces on the side accessed by the conveyance unit 16 face each other (that is, in a facing state).

[0034] The conveyance unit 16 is arranged between the conveyance object storage unit 12 and each measurement unit 14.

[0035] The conveyance object storage unit 12 includes a wafer storage unit 12a that stores a plurality of wafers and a probe card storage unit 12b that stores a plurality of probe cards. The number and arrangement form of the conveyance object storage unit 12 are not particularly limited. In the present embodiment, four conveyance object storage units 12 including the wafer storage unit 12a and the probe card storage unit 12b are arranged in the horizontal direction (X-axis direction) with the surfaces on the side accessed by the conveyance unit 16 (the right side surfaces in FIG. 1) facing the same direction. Note that the side opposite to the side accessed by the conveyance unit 16 (the left side in FIG. 1) is accessed by an operator when collecting wafers or probe cards.

[0036] As shown in FIG. 1, each of the plurality of measurement units 14 is a rectangular parallelepiped-shaped measurement chamber (also referred to as a probe chamber) formed by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. Inside the measurement chamber, as shown in FIG. 7, there are a wafer chuck 18 for holding a wafer, a head stage 20, a test head (not shown) placed on the head stage 20, and a first probe card holding mechanism 36 for holding a probe card PC.

[0037] FIG. 2 is a front view of each measurement unit 14.

[0038] The number and arrangement form of the measurement units 14 are not particularly limited. In the present embodiment, as shown in FIGS. 1 and 2, a measurement unit group composed of four measurement units 14 arranged in the horizontal direction (X-axis direction) is stacked in three stages in the vertical direction (Z-axis direction), and is two-dimensionally arranged with the side surface (the left side surface in FIG. 1) accessible by the transfer unit 16 facing the same direction.

[0039] In each measurement unit 14 (the side surface accessible by the transfer unit 16), an opening 14a is formed through which the wafer holding arm (wafer arm: transfer object holding arm) 16b and the probe card holding arm (probe card arm) 16c of the transfer unit 16 enter and exit. The surfaces of each measurement unit 14 other than the surface where the opening 14a is formed may be closed or may have an opening formed.

[0040] The wafer chuck 18 is adjusted to a target temperature (inspection temperature) of high temperature or low temperature by a well-known temperature control device (for example, a heat plate or a chiller device built into the wafer chuck 18).

[0041] The environment within each measurement unit 14 is controlled as follows. For example, the temperature within each measurement unit 14 is controlled to a target temperature (inspection temperature) by the temperature of the wafer chuck 18 disposed within each measurement unit 14. Also, the humidity within each measurement unit 14 is controlled to a target humidity by purging dry air into each measurement unit 14 by a well-known mechanism. Further, the environment within each measurement unit 14 is controlled by purging a predetermined gas (e.g., nitrogen gas) into each measurement unit 14 by a well-known mechanism. In each measurement unit 14, a plurality of types of inspections such as a high-temperature inspection, a low-temperature inspection, and an inspection under a predetermined gas (e.g., nitrogen gas) atmosphere, which will be described later, are performed. The environment within each measurement unit 14 is controlled so as to be an environment corresponding to the inspection performed in each measurement unit 14. Note that the inspections performed in each measurement unit 14 may be the same among the measurement units or may be different from each other.

[0042] The first probe card holding mechanism 36 is a means for detachably holding the probe card PC, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 detachably holds the probe card PC conveyed to the first probe card holding mechanism 36 by the probe card transfer mechanism, which will be described later. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Application Laid-Open No. 2000-150596), further description thereof will be omitted.

[0043] In each measurement unit group, an alignment device 38 for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18 and a moving device (not shown) for moving the alignment device 38 mutually among the four measurement units 14 are arranged. The alignment device 38 is moved mutually among the four measurement units 14 included in the measurement unit group in which the alignment device 38 is arranged and is shared among the four measurement units 14. For the moving device for moving the alignment device 38 mutually among the four measurement units 14, for example, those described in Japanese Patent Application Laid-Open No. 2014-150168 can be applied.

[0044] The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and is composed of a moving and rotating mechanism that moves the wafer chuck 18, such as a Z-axis movable part 38a that moves up and down in the Z-axis direction, a Z-axis fixed part 38b, and an XY movable part 38c, in the X-Y-Z-θ directions. The alignment device 38 is mainly used to align the wafer W held by the wafer chuck 18 with the probes of the probe card PC held above the wafer chuck 18 by a well-known method while moving in the X-Y-Z-θ directions, bring the wafer W into electrical contact with the probes, and perform an electrical characteristic inspection of the wafer W via the test head.

[0045] The alignment device 38 moves between the probe card receiving position P1 (see FIG. 7(a)) near the opening 14a and the preheat position P2 (see FIG. 7(b)) below the first probe card holding mechanism 36 while holding the wafer chuck 18 in the measurement unit 14. This movement is realized by a well-known alignment device moving device (not shown).

[0046] The alignment device moving device moves the alignment device 38 in the state of holding the wafer chuck 18 heated to the target temperature to the probe card receiving position P1 when receiving the probe card PC, and moves the alignment device 38 in the state of holding the probe card PC and the wafer chuck 18 heated to the target temperature to the preheat position P2 when transporting the probe card PC to the first probe card holding mechanism 36.

[0047] The alignment device 38 includes a second probe card holding mechanism 40 (also referred to as a card lifter).

[0048] The second probe card holding mechanism 40 is a means for receiving the probe card PC from the probe card holding arm 16c and holding it. For example, a holding portion 40a (e.g., a ring-shaped member or a plurality of pins) attached to the Z-axis movable portion 38a while surrounding the wafer chuck 18, and a lifting mechanism (not shown) for raising and lowering the holding portion 40a in the Z-axis direction with respect to the Z-axis movable portion 38a.

[0049] The reception and holding of the probe card PC are realized by raising the holding portion 40a in the Z-axis direction with respect to the Z-axis movable portion 38a in a state where the alignment device 38 has moved to the probe card receiving position P1, bringing it into contact with the probe card PC (outer peripheral edge of the lower surface), and lifting the probe card PC from the probe card holding arm 16c with the holding portion 40a that rises in the Z-axis direction. The probe card PC is held directly above the wafer chuck 18.

[0050] The probe card transfer mechanism is a means for transferring the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36. For example, it is constituted by a Z-axis movable portion 38a provided on the alignment device 38 that moves up and down in the Z-axis direction.

[0051] The transfer of the probe card PC to the first probe card holding mechanism 36 is realized by raising the Z-axis movable portion 38a in the Z-axis direction in a state where the alignment device 38 has moved to the preheat position P2.

[0052] FIG. 3 is a perspective view of the transfer unit 16, and FIG. 4 is a longitudinal sectional view showing the schematic configuration of the transfer unit 16.

[0053] The transfer unit 16 is a means for moving in the X-axis direction and the Z-axis direction between the transfer object storage unit 12 and each measurement unit 14 to transfer the wafer W or the probe card PC into or out of the transfer object storage unit 12 or each measurement unit 14. As shown in FIGS. 3 and 4, it is a housing for storing the wafer W and the probe card PC, and includes a housing 16a in which an opening 16f through which the wafer W and the probe card PC (wafer holding arm 16b and probe card holding arm 16c) enter and exit is formed. The housing 16a has a rectangular parallelepiped shape, and inside it, there are arranged a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving each of the arms 16b and 16c, an environment control means 16d for controlling the environment inside the housing 16a, and a sensor 16e for detecting the environment inside the housing 16a. The number of transfer units 16 is not particularly limited, and in this embodiment, one transfer unit 16 is used. Although two transfer units 16 are depicted in FIG. 1, this represents the state where one transfer unit 16 is accessing the transfer object storage unit 12 (probe card storage unit 12b) (see the transfer unit 16 depicted in the lower right in FIG. 1) and the state of accessing the measurement unit 14 (see the transfer unit 16 depicted in the upper left in FIG. 1).

[0054] The wafer holding arm 16b is a means for holding the wafer W, and is arranged inside the housing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided inside the housing 16a, for example. The wafer holding arm 16b is stored inside the housing 16a together with the wafer W while holding the wafer W.

[0055] The probe card holding arm 16c is a means for holding the probe card PC, and is arranged inside the housing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided inside the housing 16a, for example. The probe card holding arm 16c is stored inside the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. In some cases, a seal ring may be included instead of the card holder CH.

[0056] The number and arrangement form of each of the arms 16b and 16c are not particularly limited. In the present embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged in three upper and lower stages.

[0057] The arm moving mechanism is a well-known mechanism, for example, composed of a drive motor (not shown) provided in the housing 16a. By rotating this drive motor forward and backward, each of the arms 16b and 16c reciprocates individually in the horizontal direction and enters and exits through the opening 16f formed in the housing 16a.

[0058] The transfer unit 16 is provided with an air curtain forming means 42.

[0059] The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the housing 16a to make the inside of the housing 16a a sealed or substantially sealed space, and is composed of, for example, a well-known air injection port.

[0060] The number, shape, and arrangement form of the air injection ports are not particularly limited. In the present embodiment, as shown in FIG. 4, a plurality of air injection ports are arranged along the upper edge of the opening 16f (in the direction orthogonal to the paper surface in FIG. 4) in a posture of injecting air downward near the upper edge of the opening 16f. Note that the arrow 44 in FIG. 4 shows an example of the flow of dry air injected from the environmental control means 16d, and the wafer chuck 18 is shown.

[0061] The environment inside the housing 16a is controlled as follows. For example, the temperature and humidity inside the housing 16a are controlled to a target temperature and humidity in a predetermined gas atmosphere by purging dry air (high-temperature or low-temperature dry air) or a predetermined gas (nitrogen gas) into each measurement unit 14. This is achieved by well-known environmental control means 16d, for example, a temperature-controlled gas supply source including a heater and a cooler, a blower, and a pipeline (not shown) connecting the blower (none of which are shown) and the housing 16a. The environmental control means 16d may include a dehumidifier. The gas (high-temperature or low-temperature dry air) whose temperature (and humidity) is adjusted by the temperature-controlled gas supply source is supplied into the housing 16a through the pipeline by the blower, and is jetted from the air jet port to form an air curtain that closes the opening 16f formed in the housing 16a. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. The supply source of the gas supplied into the housing 16a and the supply source of the gas jetted from the air jet port may be the same or different. The surfaces of the housing 16a other than the surface where the opening 16f is formed may be closed or may have openings formed therein. The environmental control means 16d may be attached to the housing 16a or may be attached to the arms 16b, 16c.

[0062] The sensor 16e is a sensor that detects the environment inside the housing 16a, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environmental control means 16d.

[0063] The environment control means 16d controls the environment inside the housing 16a to be an environment corresponding to the environment at the conveyance destination of the conveyed object. Specifically, the environment control means 16d controls the inside of the housing 16a to a target environment based on the detection result of the sensor 16e. For example, the environment control means 16d controls the temperature control gas supply source so that the temperature and humidity inside the housing 16a become the target temperature and humidity based on the detection result of the sensor 16e. The function of this environment control means 16d is realized, for example, by feedback control by a controller (not shown) to which the sensor 16e and the temperature control gas supply source (heater and cooler) are electrically connected. Note that the environment control means 16d and the air curtain forming means 42 may be integrated. That is, in one device, an air injection port may be provided downward so as to block the opening 16f, and a dry air injection port for controlling the environment inside the housing 16a may be provided. Here, the dry air injection port for controlling the environment inside the housing 16a is preferably provided in a direction such that the injected dry air circulates well inside the housing 16a. By integrating the environment control means 16d and the air curtain forming means 42, the space for providing the environment control means 16d and the air curtain forming means 42 is reduced, and the space of the housing 16a can be effectively used. Further, by integrating the environment control means 16d and the air curtain forming means 42, a heater, a temperature control gas supply source including a cooler (cooler), a blower, etc. can be made common between the environment control means 16d and the air curtain forming means 42.

[0064] FIG. 5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22.

[0065] The moving device 22 is a means for moving the transport unit 16 in the X-axis direction and the Z-axis direction between the transported object storage unit 12 and each measurement unit 14. For example, as shown in FIGS. 5 and 6, between the transported object storage unit 12 and each measurement unit 14, a first movable body 24 that moves in the horizontal direction (X-axis direction) which is the arrangement direction of each measurement unit 14, a first movable body moving mechanism (not shown) for moving the first movable body 24 in the horizontal direction (X-axis direction), the first movable body 24 is movably attached in the vertical direction (Z-axis direction) which is the arrangement direction of each measurement unit 14, and a second movable body 26 that rotatably supports the transport unit 16 about the vertical axis (Z-axis), a second movable body moving mechanism (not shown) for moving the second movable body 26 in the vertical direction (Z-axis direction), and a transport unit rotation mechanism 28 that is attached to the second movable body 26 and rotates the transport unit 16 about the vertical axis (Z-axis).

[0066] The first movable body 24 is, for example, a frame body formed by connecting the four corners of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction. The lower part thereof is movably connected to two guide rails 30 extending in the X-axis direction that are arranged in parallel with each other on the base 34 between the transported object storage unit 12 and each measurement unit 14.

[0067] The first movable body moving mechanism is composed of a well-known moving mechanism, for example, a ball screw connected to the first movable body 24 and a drive motor (both not shown) for rotating the ball screw. By rotating this drive motor forward and backward, the first movable body 24 (transport unit 16) moves in the X-axis direction along the guide rail 30. Of course, it is not limited to this. The first movable body moving mechanism may be a mechanism for self-propelling the first movable body 24, for example, wheels provided on the first movable body 24 and a drive motor for rotating the wheels.

[0068] The second movable body 26 is movably connected to two guide rails 32 extending in the Z-axis direction that are arranged in parallel with each other on the first movable body 24.

[0069] The second movable body moving mechanism is composed of a well-known moving mechanism, for example, a ball screw connected to the second movable body 26, a drive motor (both not shown) for rotating the ball screw, etc. By rotating this drive motor forward and backward, the second movable body 26 (conveying unit 16) moves in the Z-axis direction along the guide rail 32. Of course, it is not limited to this, and the second movable body moving mechanism may be a mechanism for self-propelling the second movable body 26, for example, wheels provided on the second movable body 26 and a drive motor for rotating the wheels.

[0070] The conveying unit rotating mechanism 28 is composed of a well-known rotating mechanism, for example, a rotating shaft (vertical shaft) provided on the second movable body 26, a drive motor 28a for rotating the rotating shaft, etc. The upper surface of the conveying unit 16 is fixed to the rotating shaft (vertical shaft). By rotating this drive motor 28a forward and backward, the conveying unit 16 rotates 180° around the vertical axis (Z-axis), and the opening 16f formed in the conveying unit 16 through which the respective arms 16b and 16c enter and exit faces the conveyed object storage unit 12 or each measuring unit 14.

[0071] Note that each device and mechanism such as the alignment device 38, the arm moving mechanism, the environment control means 16d, the moving device 22 (the first movable body moving mechanism, the second movable body moving mechanism, the conveying unit rotating mechanism 28) is driven by control by a control means (such as a controller) not shown.

[0072] Next, an operation example of the conveying unit 16 in the prober 10 of the present embodiment will be described.

[0073] <Example of Wafer Conveying Operation 1> First, an operation example will be described when the conveying unit 16 conveys the wafer W from the wafer storage unit 12a (for example, at room temperature of 23°C) into the measuring unit 14 where a high-temperature inspection (for example, inspection temperature of 80°C) is performed.

[0074] First, move the transfer unit 16 to a position where it can access the wafer storage unit 12a (a position where the wafer W can be taken out), and rotate the transfer unit 16 by 180° so that the opening 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit faces the wafer storage unit 12a.

[0075] Next, extend the wafer holding arm 16b into the wafer storage unit 12a, take out one wafer W from the wafer storage unit 12a, and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transfer destination (here, a high-temperature inspection at 80°C performed inside the measurement unit 14). Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 60°C) is supplied into the housing 16a, and an air curtain is formed which is ejected from the air injection port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature-controlled gas supply source is not limited to 60°C, and can be an appropriate temperature in consideration of the distance and time for which the wafer W is transferred from the wafer storage unit 12a to the measurement unit 14 at the transfer destination, the inspection temperature in the measurement unit 14 at the transfer destination, and the like.

[0076] Next, move the transfer unit 16 to a position where it can access the measurement unit 14 at the transfer destination (a position where the wafer W can be delivered), and rotate the transfer unit 16 by 180° so that the opening 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit faces the measurement unit 14 at the transfer destination. During this time, the wafer W stored in the transfer unit 16 continues to be heated by the gas supplied into the housing 16a (sealed or substantially sealed space).

[0077] Next, the wafer holding arm 16b is advanced into the measuring unit 14 through the opening 16f on the transfer unit 16 side where the air curtain is formed and the opening 14a on the measuring unit 14 side, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b advances into the measuring unit 14 while holding the wafer W through the opening 16f closed by the air curtain. At this time, the wafer W is further heated by the air curtain.

[0078] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the following effects can be achieved.

[0079] First, similar to the case of closing the opening 16f with a physical door or shutter, the inside of the housing 16a can be made into a sealed or substantially sealed space, and by supplying a temperature-adjusted gas into the sealed housing 16a, the environment inside the housing 16a can be made into an environment corresponding to the environment of the transfer destination measuring unit 14 (here, a high-temperature inspection at 80°C carried out inside the measuring unit 14).

[0080] Second, while keeping the inside of the housing 16a in a sealed state, the probe card holding arm 16c can be advanced into the measuring unit 14.

[0081] Third, compared with the case of closing the opening 16f with a physical door or shutter, since there is no need for the time to open and close the physical door or shutter, the probe card holding arm 16c can be quickly advanced into the measuring unit 14.

[0082] Fourth, when transferring the probe card PC, the probe card PC can be heated by the action of the air curtain blown onto the probe card PC.

[0083] Fifthly, when the opening 16f is closed with a physical door or shutter, the gas supplied inside the housing 16a touches the physical door or shutter and dissipates heat to the external environment through the physical door or shutter. As a result, the temperature of the gas supplied inside the housing 16a decreases. On the other hand, when the opening 16f is closed with an air curtain as in this example, since the gas supplied inside the housing 16a touches the air curtain at the same temperature, it is possible to suppress a decrease in the temperature of the gas supplied inside the housing 16a.

[0084] The loaded wafer W is held by the wafer chuck 18 by vacuum adsorption. Then, the wafer W is heated by the wafer chuck 18 and waits until it reaches the inspection temperature (here, 80°C). When the inspection temperature is reached, the alignment device 38 moves in the X - Y - Z - θ directions and aligns the wafer W held by the wafer chuck 18 with the probes of the probe card PC held above the wafer chuck 18 in a well - known method. Then, the wafer chuck 18 moves in the Z - axis direction by the action of the alignment device 38 to bring the wafer W into electrical contact with the probes, and thus, the electrical characteristic inspection of the wafer W is carried out through the test head.

[0085] In this way, by controlling the environment inside the transfer unit 16 (heating the wafer) using the time from when the wafer is transferred from the wafer storage unit 12a to the measurement unit 14 at the destination to reduce the difference from the inspection temperature at the measurement unit 14 at the destination, it is possible to shorten (or eliminate) the waiting time for bringing the wafer closer to the inspection temperature inside the measurement unit 14 at the destination compared to the prior art. Thereby, the throughput at the measurement unit 14 can be improved.

[0086] <Example of Wafer Transfer Operation 2> Next, an example of the operation when the transfer unit 16 transfers the wafer W in a high - temperature state (for example, 80°C) obtained by high - temperature inspection from the measurement unit 14 into the wafer storage unit 12a (for example, room temperature 23°C) will be described.

[0087] First, the wafer W immediately after the high-temperature inspection is completed by the wafer holding arm 16b is taken out from the measurement unit 14 and stored in the housing 16a. This is performed in a procedure reverse to that of the above-described wafer transfer operation example 1. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the wafer storage unit 12a at the transfer destination (here, room temperature of 23°C). Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 40°C) is supplied into the housing 16a, and an air curtain is formed that is ejected from the air injection port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a is made into a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature-controlled gas supply source is not limited to 40°C, and can be an appropriate temperature considering the distance and time for which the wafer W is transferred from the measurement unit 14 to the wafer storage unit 12a at the transfer destination, the temperature in the wafer storage unit 12a at the transfer destination, and the like. The wafer W immediately after the high-temperature inspection is taken out from the measurement unit 14 through the opening 16f closed by the air curtain while being held by the wafer holding arm 16b, and stored in the housing 16a. At that time, the wafer W is cooled by the air curtain blown thereon and further cooled by the gas supplied into the housing 16a.

[0088] Next, the transfer unit 16 is moved to a position where the wafer storage unit 12a at the transfer destination can be accessed (a position where the wafer W can be delivered), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit faces the wafer storage unit 12a at the transfer destination. During this time, the wafer W stored in the transfer unit 16 continues to be cooled by the gas supplied into the housing 16a (sealed or substantially sealed space).

[0089] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as those of the above-described wafer transfer operation example 1 can be achieved.

[0090] Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a to return the wafer W into the wafer storage unit 12a.

[0091] In this way, by using the time from when the wafer is transported from the measurement unit 14 into the wafer storage unit 12a at the destination to control the environment inside the transport unit 16 (cooling the wafer) to reduce the difference from the temperature of the wafer storage unit 12a at the destination, compared with the prior art, the waiting time for bringing the wafer to near room temperature in the measurement unit 14 can be eliminated (or shortened), and the wafer that has completed the high-temperature inspection can be immediately taken out from the measurement unit 14 and returned to the wafer storage unit 12a. As a result, the throughput in the measurement unit 14 can be improved. Also, the waiting time until the operator retrieves the wafer after wafer storage can be eliminated (or shortened).

[0092] <Example of Wafer Transfer Operation 3> Next, an operation example will be described when the transfer unit 16 transfers the wafer W from the wafer storage unit 12a (for example, room temperature 23°C) into the measurement unit 14 where a low-temperature inspection (for example, inspection temperature -10°C) is performed.

[0093] First, the transfer unit 16 is moved to a position accessible to the wafer storage unit 12a (a position where the wafer W can be taken out), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit faces the wafer storage unit 12a.

[0094] Next, the wafer holding arm 16b is advanced into the wafer storage section 12a to take out one wafer W from the wafer storage section 12a and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled to be an environment corresponding to the environment of the measurement section 14 at the transfer destination (here, the low-temperature inspection at -10°C performed inside the measurement section 14). Specifically, a gas whose temperature or humidity has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to -15°C) is supplied into the housing 16a, and an air curtain is formed by being ejected from the air ejection port to close the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a is made into a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature-controlled gas supply source is not limited to -15°C, and can be an appropriate temperature considering the distance and time for the wafer W to be transferred from the wafer storage section 12a to the measurement section 14 at the transfer destination, the inspection temperature in the measurement section 14 at the transfer destination, and the like.

[0095] Next, the transfer unit 16 is moved to a position where it can access the measurement section 14 at the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the arms 16b and 16c enter and exit faces the measurement section 14 at the transfer destination. During this period, the wafer W stored in the transfer unit 16 continues to be temperature-adjusted (for example, cooled) and dried by the gas supplied into the housing 16a (sealed or substantially sealed space). Thereby, it is possible to prevent dew condensation from occurring on the wafer W while the wafer W is being transferred to the measurement section 14 at the transfer destination.

[0096] Next, the wafer holding arm 16b is advanced into the measurement section 14 through the opening 16f on the transfer unit 16 side and the opening 14a on the measurement section 14 side where the air curtain is formed, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b advances into the measurement section 14 while holding the wafer W and passing through the opening 16f closed by the air curtain. At this time, the wafer W is further cooled and dried by the air curtain. Thereby, it is possible to prevent dew condensation from occurring on the wafer W when the wafer W is delivered.

[0097] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in the above-described wafer transfer operation example 1 can be achieved.

[0098] The loaded wafer W is held on the wafer chuck 18 by vacuum adsorption. Then, it waits until the wafer W is cooled by the wafer chuck 18 and reaches the inspection temperature (here, -10°C). When the inspection temperature is reached, the alignment device 38 moves in the X - Y - Z - θ directions and aligns the wafer W held on the wafer chuck 18 with the probes of the probe card PC held above the wafer chuck 18 by a well-known method. Then, the wafer chuck 18 moves in the Z - axis direction by the action of the alignment device 38 to bring the wafer W into electrical contact with the probes, and thus, the electrical characteristics inspection of the wafer W is carried out via the test head. Note that in the measurement unit 14 at the transfer destination, a gas with a dew point at which condensation does not occur at the cooling temperature of the wafer and the probe card (for example, dry air at 20°C) is supplied by a well-known means so that condensation does not occur on the wafer and the probe card during the low-temperature inspection, and the low-temperature inspection is carried out in an environment where this gas is supplied.

[0099] In this way, by controlling the environment in the transfer unit 16 (cooling the wafer) using the time from when the wafer is transferred from the wafer storage unit 12a to inside the measurement unit 14 at the transfer destination to reduce the difference from the inspection temperature of the measurement unit 14 at the transfer destination, the waiting time for bringing the wafer close to the inspection temperature in the measurement unit 14 at the transfer destination can be shortened (or eliminated) compared to the prior art. Thereby, the throughput in the measurement unit 14 can be improved.

[0100] <Wafer Transfer Operation Example 4> Next, an operation example will be described for the case where the transfer unit 16 transfers the wafer W in a low-temperature state (for example, -40°C) due to a low-temperature inspection from the measurement unit 14 into the wafer storage unit 12a (for example, room temperature 23°C).

[0101] First, the wafer W immediately after the completion of the low-temperature inspection by the wafer holding arm 16b is taken out from the measurement unit 14 and stored in the housing 16a. This is performed in a procedure reverse to the above-described wafer transfer operation example 3. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the wafer storage unit 12a at the transfer destination (here, room temperature of 23°C). Specifically, a gas (for example, dry air or nitrogen adjusted to a temperature of 15°C) whose temperature or humidity is adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and an air curtain is formed that is jetted from the air jet port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a is made into a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature-controlled gas supply source is not limited to 15°C, and can be an appropriate temperature in consideration of the distance and time for which the wafer W is transferred from the measurement unit 14 to the wafer storage unit 12a at the transfer destination, the temperature in the wafer storage unit 12a at the transfer destination, and the like. The wafer W immediately after the completion of the low-temperature inspection is held by the wafer holding arm 16b, taken out from the measurement unit 14 through the opening 16f closed by the air curtain, and stored in the housing 16a. At that time, the wafer W is heated by the air curtain blown thereon and further heated by the gas supplied into the housing 16a. Thereby, it is possible to prevent dew condensation from occurring on the wafer W during the transfer of the wafer W.

[0102] Next, the transfer unit 16 is moved to a position where it can access the wafer storage unit 12a at the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit faces the wafer storage unit 12a at the transfer destination. During this period, the wafer W stored in the transfer unit 16 continues to be heated by the gas supplied into the housing 16a (sealed or substantially sealed space). Thereby, it is possible to prevent dew condensation from occurring on the wafer W while the wafer W is being transferred to the wafer storage unit 12a.

[0103] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as those in the above-described wafer transfer operation example 1 can be achieved.

[0104] Next, the wafer holding arm 16b is advanced into the wafer storage section 12a to return the wafer W into the wafer storage section 12a.

[0105] In this way, by controlling the environment inside the transfer unit 16 (heating the wafer) using the time from when the wafer is transferred from the measurement unit 14 into the wafer storage section 12a at the transfer destination to reduce the difference from the temperature of the wafer storage section 12a at the transfer destination, it is possible to eliminate (or shorten) the waiting time for bringing the wafer to near room temperature in the measurement unit 14 compared to the prior art, and the wafer that has completed the low-temperature inspection can be immediately taken out from the measurement unit 14 and returned to the wafer storage section 12a. As a result, the throughput in the measurement unit 14 can be improved. Also, it becomes possible to adjust the temperature environment to prevent dew condensation from occurring on the wafer until the wafer is transferred into the wafer storage section 12a.

[0106] <Wafer Transfer Operation Example 5> Next, an operation example will be described when the transfer unit 16 transfers the wafer W from the wafer storage section 12a (for example, at room temperature of 23°C) into the measurement unit 14 where an inspection is performed in a predetermined gas (for example, nitrogen gas) atmosphere.

[0107] First, the transfer unit 16 is moved to a position where it can access the wafer storage section 12a (a position where the wafer can be taken out), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the arms 16b and 16c enter and exit faces the wafer storage section 12a.

[0108] Next, the wafer holding arm 16b is advanced into the wafer storage section 12a to take out one wafer W from the wafer storage section 12a and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement section 14 at the transfer destination (here, inspection under an atmosphere of a predetermined gas (for example, nitrogen gas)). Specifically, a gas for preventing oxidation of the wiring (especially copper wiring) exposed on the wafer surface and the probes of the probe card (for example, nitrogen gas) is supplied into the housing 16a, and an air curtain is formed which is ejected from the air ejection port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a is made into a sealed or substantially sealed space.

[0109] Next, the transfer unit 16 is moved to a position where it can access the measurement section 14 at the transfer destination (a position where the wafer W can be delivered), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the arms 16b and 16c enter and exit faces the measurement section 14 at the transfer destination. During this time, the gas for preventing oxidation is continuously supplied into the transfer unit 16 (sealed or substantially sealed space). Thereby, it is possible to prevent the wafer W from being oxidized while the wafer W is being transferred to the measurement section 14 at the transfer destination. Note that the gas for preventing oxidation is also supplied into the measurement section 14 at the transfer destination by well-known means.

[0110] Next, the wafer holding arm 16b is advanced into the measurement section 14 through the opening 16f on the transfer unit 16 side where the air curtain is formed and the opening 14a on the measurement section 14 side, and the wafer W is loaded onto the wafer chuck 18. The wafer holding arm 16b advances into the measurement section 14 while holding the wafer W and passing through the opening 16f closed by the air curtain. At that time, the action of the air curtain prevents the wafer W from being oxidized.

[0111] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in the above-described wafer transfer operation example 1 can be achieved.

[0112] The loaded wafer W is held by the wafer chuck 18 by vacuum suction. Then, while the alignment device 38 moves in the X - Y - Z - θ directions, the wafer W held by the wafer chuck 18 is aligned with the probes of the probe card PC held above the wafer chuck 18 by a well - known method. Next, the wafer chuck 18 moves in the Z - axis direction by the action of the alignment device 38 to bring the wafer W into electrical contact with the probes, and thus the electrical characteristics inspection of the wafer W is carried out via the test head. Note that the inspection is carried out in an environment where a gas for preventing oxidation is supplied.

[0113] In this way, even from the time when the wafer is transported from the wafer storage section 12a to the measurement section 14 at the destination, the wafer is placed in an environment similar to that of the measurement section 14 where inspection is carried out in an atmosphere of a predetermined gas (for example, nitrogen gas). Therefore, it is possible to prevent the wiring (especially copper wiring) exposed on the wafer surface from oxidizing during transportation and delivery.

[0114] Note that this operation example 5 can also be carried out in combination with the above - described wafer transfer operation examples 1 to 4.

[0115] <Probe Card Transfer Operation Example 1> Next, an operation example will be described in the case where the transfer unit 16 transports the probe card PC from the probe card storage section 12b (for example, at room temperature of 23°C) into the measurement section 14 where a high - temperature inspection (for example, inspection temperature of 80°C) is carried out.

[0116] First, the transfer unit 16 is moved to a position accessible to the probe card storage section 12b (a position where the probe card PC can be taken out), and the transfer unit 16 is rotated by 180° so that the opening 16f formed in the transfer unit 16 through which the arms 16b and 16c enter and exit faces the probe card storage section 12b.

[0117] Next, the probe card holding arm 16c is advanced into the probe card storage section 12b to take out one probe card PC from the probe card storage section 12b and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement section 14 at the conveyance destination (here, a high-temperature inspection at 80° C. performed inside the measurement section 14). Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 60° C.) is supplied into the housing 16a, and an air curtain is formed which is jetted from an air jet port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a is made into a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature-controlled gas supply source is not limited to 60° C., and can be an appropriate temperature in consideration of the distance and time for which the probe card PC is conveyed from the probe card storage section 12b to the measurement section 14 at the conveyance destination, the inspection temperature in the measurement section 14 at the conveyance destination, and the like.

[0118] Next, the conveyance unit 16 is moved to a position where it can access the measurement section 14 at the conveyance destination (a position where the probe card PC can be handed over), and the conveyance unit 16 is rotated 180° so that the opening 16f formed in the conveyance unit 16 through which the respective arms 16b and 16c enter and exit faces the measurement section 14 at the conveyance destination. During this time, the probe card PC stored in the conveyance unit 16 continues to be heated by the gas supplied into the housing 16a (sealed or substantially sealed space).

[0119] Next, the probe card holding arm 16c is advanced into the measurement section 14 through the opening 16f on the conveyance unit 16 side where the air curtain is formed and the opening 14a on the measurement section 14 side (see FIG. 7(a)). The probe card holding arm 16c advances into the measurement section 14 while holding the probe card PC and passing through the opening 16f closed by the air curtain. At that time, the probe card PC is further heated by the air curtain sprayed thereon.

[0120] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as those in the above-described wafer transfer operation example 1 can be achieved.

[0121] Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, with the alignment device 38 holding the wafer chuck 18 heated to the target temperature (here, the inspection temperature of 80°C) in a state of being moved to the probe card receiving position P1, the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a and brought into contact with the probe card PC (outer peripheral edge of the lower surface). The probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a that rises in this Z-axis direction. As a result, the probe card PC is delivered to the holding portion 40a and is held directly above the wafer chuck 18 by the holding portion 40a. During this time, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

[0122] Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature (here, the inspection temperature of 80°C) is moved to the preheat position P2 (see FIG. 7(b)). Also during this time, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

[0123] Next, the probe card PC is transported to the first probe card holding mechanism 36 (see Fig. 7(b)). Specifically, with the alignment device 38 holding the wafer chuck 18 heated to the target temperature (here, the inspection temperature of 80°C) moved to the preheat position P2, the Z-axis movable part 38a (the second probe card holding mechanism 40) is raised in the Z-axis direction, thereby transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36. The probe card PC transported to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. During this period, the probe card PC is heated by the radiant heat of the wafer chuck 18 below it.

[0124] As described above, the probe card PC is not only heated within the transfer unit 16, but also continuously heated (preheated) seamlessly by the radiant heat of the wafer chuck 18 from the time it is transferred from the probe card holding arm 16c until it is held by the first probe card holding mechanism 36.

[0125] Thus, even if it takes about 10 to several tens of seconds for the probe card PC heated within the transfer unit 16 to be transferred from the probe card holding arm 16c and held by the first probe card holding mechanism 36, the temperature of the probe card PC does not drop during the process, and the preheated probe card PC can be held by the first probe card holding mechanism 36.

[0126] In this way, by controlling the environment within the transfer unit 16 (heating the probe card) using the time from when the probe card is transported from the probe card storage section 12b to the measurement section 14 at the transfer destination to reduce the difference from the inspection temperature at the measurement section 14 at the transfer destination, it is possible to shorten (or eliminate) the waiting time for bringing the probe card closer to (preheating to) the inspection temperature within the measurement section 14 at the transfer destination compared to the prior art. As a result, the throughput at the measurement section 14 can be improved.

[0127] <Example 2 of Probe Card Transfer Operation> Next, an operation example will be described in the case where the transfer unit 16 transfers the probe card PC that has reached a high temperature state (for example, 80°C) through a high temperature inspection from the measurement unit 14 into the probe card storage unit 12b (for example, room temperature 23°C).

[0128] First, the probe card holding arm 16c takes out the probe card PC immediately after the high temperature inspection is completed from the measurement unit 14 and stores it in the housing 16a. This is carried out in the reverse procedure of the above-described Probe Card Transfer Operation Example 1. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the probe card storage unit 12b at the transfer destination (here, room temperature 23°C). Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature is adjusted to 40°C) is supplied into the housing 16a, and an air curtain is formed that is ejected from the air injection port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature-controlled gas supply source is not limited to 40°C, and can be an appropriate temperature in consideration of the distance and time for the probe card PC to be transferred from the measurement unit 14 to the probe card storage unit 12b at the transfer destination, the temperature in the probe card storage unit 12b at the transfer destination, and the like. The probe card PC immediately after the high temperature inspection is taken out from the measurement unit 14 through the opening 16f closed by the air curtain while being held by the probe card holding arm 16c and stored in the housing 16a. At that time, the probe card PC is cooled by the air curtain blown thereon and further cooled by the gas supplied into the housing 16a.

[0129] Next, the transfer unit 16 is moved to a position where it can access the probe card storage unit 12b at the transfer destination (a position where the probe card PC can be delivered), and the transfer unit 16 is rotated 180° so that the openings 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit face the probe card storage unit 12b at the transfer destination. During this time, the probe card PC stored in the transfer unit 16 continues to be cooled by the gas supplied into the housing 16a (a sealed or substantially sealed space).

[0130] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the above-described wafer transfer operation example 1 can be achieved.

[0131] Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b to return the probe card PC into the probe card storage unit 12b.

[0132] In this way, by controlling the environment inside the transfer unit 16 (cooling the probe card) using the time from when the probe card is transferred from the measurement unit 14 into the probe card storage unit 12b at the transfer destination to reduce the difference from the temperature of the probe card storage unit 12b at the transfer destination, compared with the prior art, the waiting time for bringing the probe card close to room temperature in the measurement unit 14 can be eliminated (or shortened), and after the high-temperature inspection is completed, the probe card can be immediately taken out from the measurement unit 14 and returned to the probe card storage unit 12b. Thereby, the throughput in the measurement unit 14 can be improved. Also, the waiting time until the operator collects the probe card after the probe card is stored can be eliminated (or shortened).

[0133] <Probe Card Transfer Operation Example 3> Next, an operation example will be described when the transfer unit 16 transfers the probe card PC from the probe card storage unit 12b (for example, room temperature 23°C) into the measurement unit 14 where a low-temperature inspection (for example, inspection temperature -10°C) is performed.

[0134] First, move the transfer unit 16 to a position where it can access the probe card storage unit 12b (a position where the probe card can be taken out), and rotate the transfer unit 16 by 180° so that the opening 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit faces the probe card storage unit 12b.

[0135] Next, extend the probe card holding arm 16c into the probe card storage unit 12b to take out one probe card PC from the probe card storage unit 12b and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transfer destination (here, a low-temperature inspection at -10°C performed inside the measurement unit 14). Specifically, a gas whose temperature or humidity has been adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to -15°C) is supplied into the housing 16a, and an air curtain is formed that is ejected from the air injection port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a is made into a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature-controlled gas supply source is not limited to -15°C, and can be an appropriate temperature considering the distance and time for the probe card PC to be transferred from the probe card storage unit 12b to the measurement unit 14 at the transfer destination, the inspection temperature in the measurement unit 14 at the transfer destination, etc.

[0136] Next, move the transfer unit 16 to a position where it can access the measurement unit 14 at the transfer destination (a position where the probe card PC can be delivered), and rotate the transfer unit 16 by 180° so that the opening 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit faces the measurement unit 14 at the transfer destination. During this time, the probe card PC stored in the transfer unit 16 continues to be cooled and dried by the gas supplied into the housing 16a (sealed or substantially sealed space). Thereby, it is possible to prevent dew condensation from occurring on the probe card PC while the probe card PC is being transferred to the measurement unit 14 at the transfer destination.

[0137] Next, the probe card holding arm 16c is advanced into the measuring unit 14 through the opening 16f on the conveyance unit 16 side where the air curtain is formed and the opening 14a on the measuring unit 14 side (see Fig. 7(a)). The probe card holding arm 16c advances into the measuring unit 14 while holding the probe card PC and passing through the opening 16f closed by the air curtain. At this time, the probe card PC is further cooled and dried by the air curtain blown onto it. This can prevent dew condensation from occurring on the probe card PC during the transfer of the probe card PC.

[0138] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in the wafer transfer operation example 1 can be achieved.

[0139] Next, the holding portion 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, with the alignment device 38 holding the wafer chuck 18 cooled to the target temperature (here, the inspection temperature of -10°C) moved to the probe card receiving position P1, the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a and brought into contact with the probe card PC (outer peripheral edge of the lower surface), and the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in this Z-axis direction. As a result, the probe card PC is delivered to the holding portion 40a and held directly above the wafer chuck 18 by the holding portion 40a. During this time, the probe card PC is cooled by the wafer chuck 18 below it.

[0140] Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 cooled to the target temperature (here, the inspection temperature of -10°C) is moved to the position P2 (see Fig. 7(b)). Even during this time, the probe card PC is cooled by the wafer chuck 18 below it.

[0141] Next, the probe card PC is transported to the first probe card holding mechanism 36 (see Fig. 7(b)). Specifically, with the alignment device 38 holding the wafer chuck 18 cooled to the target temperature (here, the inspection temperature of -10°C) located at position P2, the Z-axis movable part 38a (the second probe card holding mechanism 40) is raised in the Z-axis direction to transport the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36. The probe card PC transported to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. During this period, the probe card PC is also cooled by the wafer chuck 18 below it.

[0142] As described above, the probe card PC is not only cooled within the transport unit 16, but also continuously and seamlessly cooled by the wafer chuck 18 from the time it is transferred from the probe card holding arm 16c until it is held by the first probe card holding mechanism 36.

[0143] Thereby, even if it takes about 10 to several tens of seconds for the probe card PC cooled within the transport unit 16 to be transferred from the probe card holding arm 16c and held by the first probe card holding mechanism 36, the temperature of the probe card PC does not rise during the process, and the cooled probe card PC can be held by the first probe card holding mechanism 36. In the measurement unit 14 at the transport destination, a gas with a dew point at which condensation does not occur at the cooling temperature of the wafer or the probe card (for example, dry air at 20°C) is supplied by well-known means.

[0144] In this way, by controlling the environment within the transport unit 16 (cooling the wafer) using the time from when the probe card is transported from the probe card storage unit 12b to within the measurement unit 14 at the transport destination to reduce the difference from the inspection temperature of the measurement unit 14 at the transport destination, it is possible to shorten (or eliminate) the waiting time for bringing the probe card closer to the inspection temperature within the measurement unit 14 at the transport destination compared to the prior art. Thereby, the throughput at the measurement unit 14 can be improved.

[0145] <Example 4 of Probe Card Conveying Operation> Next, an operation example will be described in the case where the conveying unit 16 conveys the probe card PC that has reached a low temperature state (for example, -40°C) through a low temperature inspection from the measurement unit 14 into the probe card storage unit 12b (for example, room temperature 23°C).

[0146] First, the probe card holding arm 16c takes out the probe card PC immediately after the low temperature inspection is completed from the measurement unit 14 and stores it in the housing 16a. This is carried out in the reverse procedure of the above-described probe card conveying operation example 3. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the probe card storage unit 12b at the conveyance destination (here, room temperature 23°C). Specifically, a gas that has been temperature-adjusted or humidity-adjusted by a temperature-controlled gas supply source (for example, dry air or nitrogen whose temperature has been adjusted to 15°C) is supplied into the housing 16a, and an air curtain is formed that is ejected from an air injection port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a becomes a sealed or substantially sealed space. Note that the target temperature adjusted by the temperature-controlled gas supply source is not limited to 15°C, and can be an appropriate temperature considering the distance and time for the probe card PC to be conveyed from the measurement unit 14 to the probe card storage unit 12b at the conveyance destination, the temperature in the probe card storage unit 12b at the conveyance destination, and the like. The probe card PC immediately after the low temperature inspection is taken out from the measurement unit 14 through the opening 16f that is closed by the air curtain while being held by the probe card holding arm 16c and is stored in the housing 16a. At that time, the probe card PC is heated by the air curtain blown thereon and is further heated by the gas supplied into the housing 16a. Thereby, it is possible to prevent dew condensation from occurring on the probe card PC during the delivery of the probe card PC.

[0147] Next, the transfer unit 16 is moved to a position where it can access the probe card storage unit 12b at the transfer destination (a position where the probe card PC can be handed over), and the transfer unit 16 is rotated 180° so that the openings 16f formed in the transfer unit 16 through which the respective arms 16b and 16c enter and exit face the probe card storage unit 12b at the transfer destination. During this time, the probe card PC stored in the transfer unit 16 continues to be heated by the gas supplied into the housing 16a (a sealed or substantially sealed space). Thereby, it is possible to prevent dew condensation from occurring on the probe card PC while the probe card PC is being transferred to the probe card storage unit 12b.

[0148] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effects as in the above-described wafer transfer operation example 1 can be achieved.

[0149] Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b to return the probe card PC into the probe card storage unit 12b.

[0150] In this way, by controlling the environment inside the transfer unit 16 (heating the probe card) using the time from when the probe card is transferred from the measurement unit 14 to inside the probe card storage unit 12b at the transfer destination to reduce the difference from the temperature of the probe card storage unit 12b at the transfer destination, compared with the prior art, the waiting time for bringing the probe card close to room temperature in the measurement unit 14 can be eliminated (or shortened), and after the low-temperature inspection is completed, the probe card can be immediately taken out from the measurement unit 14 and returned to the probe card storage unit 12b. Thereby, the throughput in the measurement unit 14 can be improved. Also, it becomes possible to adjust the temperature environment to prevent dew condensation from occurring on the probe card until the probe card is transferred into the probe card storage unit 12b. temperature environment.

[0151] <Probe Card Transfer Operation Example 5> Next, an example of the operation when the transfer unit 16 transfers the probe card PC from the probe card storage unit 12b (for example, at room temperature of 23°C) into the measurement unit 14 where inspection is performed in a predetermined gas (for example, nitrogen gas) atmosphere will be described.

[0152] First, the transfer unit 16 is moved to a position where it can access the probe card storage unit 12b (a position where the probe card can be taken out), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the arms 16b and 16c enter and exit faces the probe card storage unit 12b.

[0153] Next, the probe card holding arm 16c is advanced into the probe card storage unit 12b to take out one probe card PC from the probe card storage unit 12b and store it in the housing 16a. At the same time, the environment inside the housing 16a is controlled so as to be an environment corresponding to the environment of the measurement unit 14 at the transfer destination (here, inspection in a predetermined gas (for example, nitrogen gas) atmosphere). Specifically, a gas for preventing oxidation of the wiring (especially copper wiring) exposed on the wafer surface and the probes of the probe card (for example, nitrogen gas) is supplied into the housing 16a, and an air curtain is formed that is ejected from the air ejection port and closes the opening 16f formed in the housing 16a. Thereby, the inside of the housing 16a is made into a sealed or substantially sealed space.

[0154] Next, the transfer unit 16 is moved to a position where it can access the measurement unit 14 at the transfer destination (a position where the probe card PC can be delivered), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the arms 16b and 16c enter and exit faces the measurement unit 14 at the transfer destination. During this time, the gas for preventing oxidation continues to be supplied into the transfer unit 16 (sealed or substantially sealed space). Thereby, it is possible to prevent the probe card PC from being oxidized while the probe card PC is being transferred to the measurement unit 14 at the transfer destination. Note that a gas for preventing oxidation is also supplied into the measurement unit 14 at the transfer destination by well-known means.

[0155] Next, the probe card holding arm 16c is advanced into the measurement unit 14 through the opening 16f on the conveyance unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side. The probe card holding arm 16c advances into the measurement unit 14 while holding the probe card PC, passing through the opening 16f that is closed by the air curtain. At this time, the action of the air curtain prevents the probe card PC from being oxidized.

[0156] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the same effect as in the above wafer transfer operation example 1 can be achieved.

[0157] Thereafter, the probe card PC is conveyed to the first probe card holding mechanism 36 in the same procedure as in the above probe card transfer operation examples 1 and 3 and is detachably held by the first probe card holding mechanism 36.

[0158] In this way, from when the probe card is stored in the probe card storage section 12b until it is conveyed into the measurement unit 14 at the conveyance destination, the probe card is placed in the same environment as the measurement unit 14 where inspection is carried out in an atmosphere of a predetermined gas (for example, nitrogen gas). Therefore, oxidation of the probes of the probe card during conveyance and handover is prevented.

[0159] Note that this operation example 5 can also be implemented in combination with the above probe card transfer operation examples 1 to 4.

[0160] As described above, according to the present embodiment, in the prober 10 including the conveyance unit 16 that moves between the conveyance object storage section 12 and the plurality of measurement units 14 and conveys a conveyance object (for example, at least one of a wafer and a probe card) to the conveyance object storage section 12 or each measurement unit 14, a prober capable of improving the throughput in each measurement unit 14 can be provided.

[0161] This is because the time until the conveyed object is conveyed to the destination (measurement unit 14 or conveyed object storage unit 12) is utilized to control the environment (e.g., temperature and humidity) inside the conveyance unit 16 (housing 16a), and thereby, compared with the prior art, the waiting time for bringing the conveyed object closer to a predetermined temperature (e.g., inspection temperature or normal temperature) within each measurement unit can be shortened (or eliminated).

[0162] Further, according to the present embodiment, instead of controlling the environment of the entire probe 10, the environment inside the housing 16a having a smaller size than the entire probe 10 is controlled. That is, since the environment inside the housing 16a is locally controlled, energy saving can be achieved compared with the case of controlling the environment of the entire probe 10. Also, the amount of gas (dry air or nitrogen gas) supplied into the housing 16a can be reduced.

[0163] Further, according to the present embodiment, the installation area of the probe 10 can be minimized. Also, the time for the conveyance unit 16 to access the conveyed object storage unit 12 or each measurement unit 14 can be minimized.

[0164] This is because the conveyance object storage unit 12 and each measurement unit 14 are arranged at a constant interval in the Y direction in a state where the surfaces on the side accessed by the conveyance unit 16 face each other (i.e., a facing state), and the conveyance unit 16 is arranged between the conveyance object storage unit 12 and each measurement unit 14.

[0165] Next, another embodiment of the conveyance unit 16 will be described.

[0166] FIG. 8 is a longitudinal sectional view showing a schematic configuration of the conveyance unit 16 according to another embodiment. Note that the parts already described in FIG. 4 are denoted by the same reference numerals and the description thereof is omitted.

[0167] The transport unit 16 shown in Fig. 8 has the environmental control means 16d and the air curtain forming means 42 provided separately. Thus, by providing the environmental control means 16d and the air curtain forming means 42 separately (independently), the operations of the environmental control means 16d and the air curtain forming means 42 can be performed independently. For example, the environmental control means 16d controls the environment inside the housing 16a with warm air, and the air curtain forming means 42 can independently operate the environmental control means 16d and the air curtain forming means 42 so as to block the opening 16f with cold air. Also, when the environmental control means 16d and the air curtain forming means 42 are provided separately, the environmental control means 16d is provided on the upper surface inside the housing 16a, so that the environmental control means 16d can efficiently control the environment inside the housing 16a. Further, when the environmental control means 16d and the air curtain forming means 42 are provided separately, by providing the environmental control means 16d at approximately the center of the upper surface of the housing 16a, the environmental control means 16d can more efficiently control the environment inside the housing 16a. Here, "approximately the center" means that it does not have to be the exact center, and it may be near the center or in the vicinity of the center.

[0168] Next, a modified example will be described.

[0169] In this embodiment, an example is given of a configuration in which each of the arms 16b and 16c of the transport unit 16 enters and exits through the opening 16f formed in the housing 16a. However, the present invention is not limited to this. For example, a similar opening (not shown) may be formed on the surface of the housing 16a of the transport unit 16 opposite to the side where the opening 16f is formed, and each of the arms 16b and 16c may be configured to reciprocate individually in the horizontal direction and enter and exit through the opening 16f and the opening on the opposite side. In this way, the transport unit rotation mechanism 28 can be omitted. And, even though the transport unit rotation mechanism 28 is omitted, that is, without rotating the transport unit 16, access to the transport object storage unit 12 or each measurement unit 14 by each of the arms 16b and 16c can be realized. In this case, in addition to the air curtain forming means 42 that forms an air curtain for closing the opening 16f formed in the housing 16a of the transport unit 16, a similar air curtain forming means for forming an air curtain for closing the opening formed on the opposite side of the opening 16f is provided in the transport unit 16, so that the inside of the housing 16a can be made into a sealed or substantially sealed space, and the same effect as in the above embodiment can be achieved.

[0170] Also, in this embodiment, an example is given of a configuration in which each measurement unit 14 is two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction). However, the present invention is not limited to this. Each measurement unit 14 may be arranged only in a row in the horizontal direction (X-axis direction), or may be arranged only in a row in the vertical direction (Z-axis direction). By arranging each measurement unit 14 only in a row in the horizontal direction (X-axis direction), the second movable body moving mechanism can be omitted. Also, by arranging each measurement unit 14 only in a row in the vertical direction (Z-axis direction), the first movable body moving mechanism can be omitted.

[0171] Also, in this embodiment, an example is given of a configuration using one transport unit 16 and one moving device 22. However, the present invention is not limited to this, and a plurality of transport units 16 and a plurality of moving devices 22 may be used. In this way, the throughput at each measurement unit 14 can be further improved.

[0172] In addition, in this embodiment, a configuration using the wafer holding arm 16b and the probe card holding arm 16c has been illustrated. However, the present invention is not limited to this, and only the wafer holding arm 16b or only the probe card holding arm 16c may be used.

[0173] In addition, in this embodiment, a configuration in which each arm 16b, 16c is provided on the transfer unit 16 has been illustrated. However, the present invention is not limited to this, and each arm 16b, 16c (or an arm corresponding thereto) may be provided on the side of the transfer object storage unit 12 and on the side of each measurement unit 14. Also by this, the transfer object can be taken out from the transfer object storage unit 12 or the measurement unit 14 by each arm and stored in the transfer unit 16, and the transfer object can be taken out from the transfer unit 16 and delivered to the transfer object storage unit 12 or the measurement unit 14.

[0174] In addition, in this embodiment, a configuration in which the opening 16f formed in the housing 16a is closed by an air curtain has been illustrated. However, the present invention is not limited to this, and opening / closing means such as a shutter or a door that is opened when taking out or delivering the transfer object and closed during the transfer of the transfer object may be provided in the transfer unit 16, and the opening 16f may be configured to be opened and closed by this opening / closing means. Also, the opening 14a formed in each measurement unit 14 may be configured to be closed by a similar air curtain, or may be configured to be opened and closed by similar opening / closing means.

[0175] As described above, the idea of controlling the environment inside the transfer unit (housing) so as to be an environment corresponding to the environment of the transfer destination of the transfer object by using the time until the transfer object is transferred to the transfer destination (measurement unit or transfer object storage unit) is not limited to the probe of the above embodiment, but can be applied to any type of transfer unit (for example, a self-propelled vehicle platform described in Japanese Patent Laid-Open No. 5-343497) that moves between the transfer object storage unit and a plurality of measurement units and transfers the transfer object into the transfer object storage unit or into a plurality of measurement units.

[0176] Although the probe of the present invention has been described in detail above, the present invention is not limited to the above examples, and of course, various improvements and modifications may be made without departing from the gist of the present invention.

Explanation of Signs

[0177] 10…probe, 12…carrier storage unit, 12a…wafer storage unit, 12b…probe card storage unit, 14…measurement unit, 14a…opening, 16…transport unit, 16a…housing, 16b…wafer holding arm, 16c…probe card holding arm, 16d…environment control means, 16e…sensor, 16f…opening, 18…wafer chuck, 20…head stage, 22…moving device, 24…first movable body, 26…second movable body, 28…transport unit rotation mechanism, 28a…drive motor, 30, 32…guide rail, 34…base, CH…card holder, PC…probe card, W…wafer

Claims

Claim 1 a conveyance object storage unit for storing a conveyance object; a measurement unit having an environment different from that of the conveyance object storage unit and disposed to face the conveyance object storage unit at a predetermined distance; a conveyance unit for conveying the conveyance object between the conveyance object storage unit and the measurement unit; and the conveyance unit has environment control means for controlling the conveyance environment of the conveyance object; when the environment control means conveys the conveyance object from the conveyance object storage unit to the measurement unit, the environment control means controls the conveyance environment of the conveyance object so that the conveyance environment of the conveyance object approaches the environment of the measurement unit; the conveyance unit has a housing for storing the conveyance object; the environment control means controls the environment inside the housing as the conveyance environment of the conveyance object; Prober

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