Substrate processing apparatus and substrate processing method

Abstract

To provide a configuration and a method advantageous for cost reduction and structure simplification of a wafer processing device.SOLUTION: A wafer processing unit 100 includes a suction chuck 10, a rotary drive unit 60, a spin base 21, a vertical move unit 70, a first magnet piece M1, a second magnet piece M2, and a centering pin CP. The suction chuck sucks and holds a wafer W on a wafer holding surface 14. The rotary drive unit rotates the suction chuck around a rotation axis A. The spin base is opposed to a holding plate from a lower side. The vertical move unit vertically moves the suction chuck in relative to the spin base. The first magnet piece is provided in the holding plate. The second magnet piece is movably provided in the spin base and, in accordance with a distance to the first magnet piece, driven by a magnetic force therebetween. The centering pin is provided in the spin base, actuated with the movement of the second magnet piece and abutted to a peripheral end face of the wafer or separated from the peripheral end face of the wafer.SELECTED DRAWING: Figure 2A

Description

Technical Field

[0001] The present invention relates to an apparatus and a method for processing a substrate. The substrates to be processed include, for example, semiconductor wafers, substrates for FPD (Flat Panel Display) such as liquid crystal display devices and organic EL (Electroluminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, and the like.

Background Art

[0002] Patent Document 1 discloses a substrate processing apparatus that performs bevel processing for processing the peripheral portion of a substrate. This substrate processing apparatus includes a rotating portion having a vacuum chuck portion that adsorbs and holds the substrate, a nozzle portion that supplies a processing liquid to the peripheral portion of the substrate, and a drain cup that receives the processing liquid discharged from the substrate. This substrate processing apparatus further includes a substrate positioning device disposed outside the drain cup. The substrate positioning device includes a first positioning mechanism and a second positioning mechanism that face each other with the rotating portion interposed therebetween. The first positioning mechanism includes a first driving portion that drives a first reference portion that contacts the side surface of the substrate in the radial direction of the substrate. The second positioning mechanism includes a second driving portion that drives a second reference portion that contacts the side surface of the substrate in the radial direction of the substrate. The first driving portion is composed of a position-controllable stepping motor or the like and is controlled by a control unit. The second driving portion is configured by an air cylinder or a motor that can linearly move and is controlled by a control unit. and connect The second driving portion includes a second driving portion that drives a second reference portion that contacts the side surface of the substrate in the radial direction of the substrate. The first driving portion is composed of a position-controllable stepping motor or the like and is controlled by a control unit. The second driving portion is configured by an air cylinder or a motor that can linearly move and is controlled by a control unit.

[0003] When performing bevel processing on the substrate, while the substrate is floating on the vacuum chuck portion, the first driving portion and the second driving portion are controlled to align the center of the substrate with the rotation center of the rotating portion. Thereafter, the substrate is adsorbed by the vacuum chuck portion, and the first reference portion and the second reference portion are retracted from the side surface of the substrate. Then, while the substrate is rotated by the rotating portion, the processing liquid is supplied from the nozzle portion to the substrate to perform bevel processing.

Prior Art Documents

Patent Document

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The substrate processing apparatus of Patent Document 1 requires a dedicated driving device to drive a first reference portion and a second reference portion that abut against the side surface of the substrate. Therefore, there are many driving devices to be provided in the substrate processing apparatus, and the cost is accordingly high, and the structure is complicated. Therefore, there is room for improvement, mainly from the viewpoints of cost reduction and structure simplification.

[0006] Therefore, an embodiment of the present invention provides a configuration and a method advantageous for cost reduction and structure simplification of a substrate processing apparatus having a suction chuck that sucks and holds a substrate and an opening / closing pin that abuts against the peripheral end surface of the substrate.

Means for Solving the Problems

[0007] One embodiment of the present invention has a holding plate having an upward-facing substrate holding surface, a suction chuck that sucks and holds a substrate on the substrate holding surface, a rotation drive unit that rotates the suction chuck around a rotation axis along the vertical direction, an opposing member disposed below the holding plate and facing the holding plate from below, a vertical movement unit that moves the suction chuck vertically relative to the opposing member, a first ferromagnetic body piece provided on the holding plate (for example, fixed), a second ferromagnetic body piece movably provided on the opposing member and driven by a magnetic force generated between the second ferromagnetic body piece and the first ferromagnetic body piece according to the distance between the second ferromagnetic body piece and the first ferromagnetic body piece, and an opening and closing pin (peripheral end surface contact piece) provided on the opposing member that operates as the second ferromagnetic body piece moves and contacts or separates from the peripheral end surface of the substrate when the substrate is held on the substrate holding surface of the suction chuck. A substrate processing apparatus is provided that includes these components.

[0008] With this configuration, by moving the suction chuck vertically, the magnetic force acting between the first ferromagnetic body piece and the second ferromagnetic body piece changes, thereby causing the second ferromagnetic body piece to move. Along with this movement, the opening and closing pin performs an opening and closing operation. Therefore, since the opening and closing pin can be operated using the mechanism for vertically moving the suction chuck, a dedicated drive device is not required. As a result, the structure is simple, and the cost can be reduced accordingly.

[0009] One example of the suction chuck is a vacuum chuck that adsorbs a substrate to the substrate holding surface by negative pressure due to vacuum suction. Another example of the suction chuck is a Bernoulli chuck that sucks and holds a substrate on the holding surface of the substrate by Bernoulli suction.

[0010] In one embodiment, at least one of the first ferromagnetic piece and the second ferromagnetic piece is a permanent magnet. That is, only one of the first ferromagnetic piece and the second ferromagnetic piece may be a permanent magnet, or both of them may be permanent magnets. When both are permanent magnets, in addition to a configuration that utilizes the attractive magnetic force acting between the first ferromagnetic piece and the second ferromagnetic piece, a configuration that utilizes the repulsive magnetic force acting between them can also be adopted.

[0011] In one embodiment, the opening and closing pin includes a centering pin for centering the substrate on the substrate holding surface with respect to the rotation axis. With this configuration, the substrate can be centered with respect to the rotation axis by utilizing a mechanism for moving the suction chuck up and down. Therefore, a centering function can be provided with a simple and low-cost configuration that does not require a dedicated driving device.

[0012] The centering pin preferably has a structure that moves closer to / away from the rotation axis and makes substantially point contact (for example, point contact at one point) with the peripheral end surface of the substrate. More specifically, the centering pin has a contact portion in the shape of a shaft extending in the vertical direction, and the contact portion is provided with a cylindrical surface convex toward the peripheral end surface of the substrate (for example, a cylindrical surface extending along the axis of the shaft-shaped contact portion (more specifically, a cylindrical surface)), and the cylindrical surface is configured to contact the peripheral end surface of the substrate.

[0013] In one embodiment, the opening and closing pin includes a holding pin for receiving and holding the substrate from the suction chuck. With this configuration, the substrate can be transferred from the suction chuck to the holding pin and held by the holding pin by utilizing a mechanism for moving the suction chuck up and down. Therefore, the substrate can be transferred between the suction chuck and the holding pin with a simple and low-cost configuration that does not require a dedicated driving device, and a function of being able to hold the substrate by either the suction chuck or the holding pin can be provided.

[0014] In one embodiment, the substrate processing apparatus further includes a rotation restricting link that restricts relative rotation of the holding plate and the opposing member by an uneven coupling in which the holding plate and the opposing member are engaged by approaching each other due to vertical movement of the suction chuck by the vertical movement unit.

[0015] With this configuration, the rotation restricting link can be engaged / disengaged by vertical movement of the suction chuck. In the disengaged state of the rotation restricting link, the rotational force of the rotation driving unit can be transmitted only to the suction chuck. In the engaged state of the rotation restricting link, the rotational force of the rotation driving unit is transmitted to the suction chuck and further transmitted to the opposing member.

[0016] In one embodiment, the opposing member is rotatable about the rotation axis.

[0017] When the rotation restricting link is provided, by setting the rotation restricting link in the engaged state, when the suction chuck is rotated by the rotation driving unit, the opposing member can be rotated by the rotational force. Therefore, when a holding pin is provided on the opposing member, the opposing member can be rotated about the rotation axis while holding the substrate by the holding pin, so that the substrate can be processed while being rotated.

[0018] For example, while holding and rotating the substrate by the suction chuck, processing (bevel processing) of the peripheral edge portion of the substrate can be performed. Then, while holding the substrate by the holding pin and rotating the opposing member (and thus rotating the substrate), processing of the lower surface of the substrate can be performed.

[0019] In one embodiment, the substrate processing apparatus includes a plurality of the opening / closing pins respectively arranged to be able to contact different positions of the peripheral end surface of the substrate. The substrate processing apparatus further includes a link mechanism provided on the opposing member that commonly transmits movement of the second ferromagnetic body piece to the plurality of the opening / closing pins.

[0020] According to this configuration, a plurality of opening and closing pins can be synchronously operated by a link mechanism. Thereby, the opening and closing pins can be precisely operated.

[0021] One embodiment of the present invention includes a holding plate having an upward-facing substrate holding surface, a suction chuck that sucks and holds a substrate on the substrate holding surface, a rotation drive unit that rotates the suction chuck about a rotation axis along the vertical direction, an opposing member disposed below the holding plate and facing the holding plate from below, a vertical movement unit that moves the suction chuck relatively up and down with respect to the opposing member, a first ferromagnetic body piece provided on the holding plate (for example, fixed), a second ferromagnetic body piece movably provided on the opposing member and driven by a magnetic force generated between the second ferromagnetic body piece and the first ferromagnetic body piece according to the distance between the second ferromagnetic body piece and the first ferromagnetic body piece, a first opening and closing pin (a first circumferential end surface abutting piece) provided on the opposing member and operating in conjunction with the movement of the second ferromagnetic body piece to abut against and separate from the circumferential end surface of the substrate when the substrate is held on the substrate holding surface of the suction chuck, and a second opening and closing pin (a second circumferential end surface abutting piece) provided on the opposing member and operating in conjunction with the vertical movement of the suction chuck by the vertical movement unit to abut against and separate from the circumferential end surface of the substrate when the substrate is held on the substrate holding surface of the suction chuck.

[0022] With this configuration, by moving the suction chuck up and down, the magnetic force acting between the first ferromagnetic body piece and the second ferromagnetic body piece changes, whereby the second ferromagnetic body piece moves. Along with this movement, the first opening and closing pin opens and closes. Also, along with the vertical movement of the suction chuck, the second opening and closing pin opens and closes. Therefore, since the first opening and closing pin and the second opening and closing pin can be operated using the mechanism for moving the suction chuck up and down, a dedicated drive device is not required. Therefore, the structure is simple and the cost can be reduced accordingly.

[0023] One example of the suction chuck is a vacuum chuck that adsorbs a substrate to the substrate holding surface by negative pressure due to vacuum suction. Another example of the suction chuck is a Bernoulli chuck that sucks and holds a substrate to the holding surface of the substrate by Bernoulli suction.

[0024] In one embodiment, when the suction chuck approaches the opposing member in a state where the suction chuck is in a first relative rotational position with respect to the opposing member, the second ferromagnetic piece moves and the first opening / closing pin approaches the peripheral end surface of the substrate. On the other hand, when the suction chuck approaches the opposing member in a state where the suction chuck is in a second relative rotational position different from the first relative rotational position with respect to the opposing member, the second opening / closing pin operates and approaches the peripheral end surface of the substrate.

[0025] With this configuration, by moving the suction chuck up and down in the first relative rotational position, the first opening / closing pin can be opened and closed. Also, by moving the suction chuck up and down in the second relative rotational position, the second opening / closing pin can be operated. Therefore, by moving the suction chuck up and down, the first opening / closing pin and the second opening / closing pin can be selectively operated. For example, when the first opening / closing pin and the second opening / closing pin have different functions, those functions can be selectively used.

[0026] In one embodiment, at least one of the first ferromagnetic piece and the second ferromagnetic piece is a permanent magnet. That is, only one of the first ferromagnetic piece and the second ferromagnetic piece may be a permanent magnet, or both of them may be permanent magnets. When both are permanent magnets, in addition to a configuration that utilizes the attractive magnetic force acting between the first ferromagnetic piece and the second ferromagnetic piece, a configuration that utilizes the repulsive magnetic force acting between them can also be adopted.

[0027] In one embodiment, the substrate processing apparatus further includes a third ferromagnetic body piece that is arranged at a distance from the second ferromagnetic body piece in the circumferential direction around the rotation axis, is movably provided on the opposing member, and is driven by a magnetic force generated between the third ferromagnetic body piece and the first ferromagnetic body piece according to the distance therebetween. The second opening / closing pin operates in accordance with the movement of the third ferromagnetic body piece.

[0028] With this configuration, by moving the suction chuck up and down, the magnetic force acting between the first ferromagnetic body piece and the third ferromagnetic body piece changes, whereby the third ferromagnetic body piece moves. Along with the movement, the second opening / closing pin performs an opening / closing operation. Since the third ferromagnetic body piece is arranged at a circumferential distance from the second ferromagnetic body piece, for example, by appropriately selecting the relative rotational positions of the suction chuck and the opposing member, a state in which an effective magnetic force (a magnetic force capable of moving the second ferromagnetic body piece) acts between the first ferromagnetic body piece and the second ferromagnetic body piece and a state in which an effective magnetic force (a magnetic force capable of moving the third ferromagnetic body piece) acts between the first ferromagnetic body piece and the third ferromagnetic body piece can be switched. Thereby, the first opening / closing pin and the second opening / closing pin can be selectively operated.

[0029] In one embodiment, at least one of the first ferromagnetic body piece and the third ferromagnetic body piece is a permanent magnet. That is, only one of the first ferromagnetic body piece and the third ferromagnetic body piece may be a permanent magnet, or both of them may be permanent magnets. When both are permanent magnets, in addition to a configuration that utilizes the attractive magnetic force acting between the first ferromagnetic body piece and the third ferromagnetic body piece, a configuration that utilizes the repulsive magnetic force acting between them can also be adopted.

[0030] In one embodiment, the first opening / closing pin includes a centering pin for centering the substrate on the substrate holding surface with respect to the rotation axis. With this configuration, the substrate can be centered with respect to the rotation axis by using a mechanism for moving the suction chuck up and down. Therefore, a centering function can be provided with a simple and low-cost configuration that does not require a dedicated driving device.

[0031] The centering pin preferably has a structure that moves toward and away from the rotation axis and makes substantially point contact (e.g., point contact at one point) with the peripheral end surface of the substrate. More specifically, the centering pin has an abutting portion in the shape of a shaft extending in the vertical direction, and the abutting portion is provided with a convex cylindrical surface (e.g., a cylindrical surface extending along the axis of the shaft shape (more specifically, a cylindrical surface)) facing the peripheral end surface of the substrate, and it is preferably configured such that the cylindrical surface abuts against the peripheral end surface of the substrate.

[0032] In one embodiment, the second opening / closing pin includes a holding pin that receives and holds the substrate from the suction chuck. With this configuration, by using the mechanism for moving the suction chuck up and down, the substrate can be transferred from the suction chuck to the holding pin and held by the holding pin. Therefore, it is possible to transfer the substrate between the suction chuck and the holding pin with a simple and low-cost configuration that does not require a dedicated drive device, and to have a function of holding the substrate by either the suction chuck or the holding pin.

[0033] In one embodiment, the substrate processing apparatus further includes a rotation restricting link that restricts relative rotation of the holding plate and the opposing member by an uneven engagement in which the holding plate and the opposing member approach and engage with each other due to the up and down movement of the suction chuck by the up and down movement unit.

[0034] With this configuration, the rotation restricting link can be engaged / disengaged by the up and down movement of the suction chuck. In the disengaged state of the rotation restricting link, the rotational force of the rotation drive unit can be transmitted only to the suction chuck. In the engaged state of the rotation restricting link, the rotational force of the rotation drive unit is transmitted to the suction chuck and further to the opposing member.

[0035] In one embodiment, the rotation restricting link restricts the relative rotation of the holding plate and the opposing member at at least one of the first relative rotation position and the second relative rotation position. With this configuration, at one or both of the first relative rotation position and the second relative rotation position, the suction chuck and the opposing member can be integrally rotated.

[0036] When the second opening and closing pin is a holding pin, it is preferable that the rotation restricting link is in an engaged state at least at the second relative rotation position to restrict the relative rotation of the holding plate and the opposing member. Further, in a state where the substrate is held by the holding pin, the substrate can be rotated around the rotation axis by the rotational force of the rotation driving unit.

[0037] In one embodiment, the opposing member is rotatable around the rotation axis.

[0038] When a rotation restricting link is provided, by bringing the rotation restricting link into an engaged state, when the suction chuck is rotated by the rotation driving unit, the opposing member can be rotated by the rotational force. Therefore, for example, when a holding pin is provided on the opposing member, the opposing member can be rotated around the rotation axis while the substrate is held by the holding pin, so that the substrate can be processed while being rotated.

[0039] For example, while holding and rotating the substrate by the suction chuck, processing (bevel processing) of the peripheral edge of the substrate can be performed. And while rotating the opposing member (and thus rotating the substrate) in a state where the substrate is held by the holding pin, processing of the lower surface of the substrate can be performed.

[0040] In one embodiment, the substrate processing apparatus further includes peripheral edge processing means for processing the peripheral edge of the substrate when the substrate is held by the suction chuck.

[0041] With this configuration, while holding the substrate by the suction chuck, the peripheral portion of the substrate can be processed. Since the suction chuck sucks and holds the substrate, the substrate can be held without contacting the peripheral portion of the substrate. Therefore, by performing the peripheral portion processing (bevel processing) while holding the substrate by the suction chuck, the peripheral portion of the substrate can be processed without any gaps.

[0042] The peripheral processing means may include a processing fluid nozzle that supplies a processing fluid (for example, a processing liquid such as an etching liquid or a rinsing liquid) toward the peripheral portion of the substrate. The processing fluid nozzle may be an upper surface nozzle that supplies the processing fluid to the upper surface of the peripheral portion of the substrate.

[0043] In one embodiment, the second opening / closing pin is a holding pin that receives and holds the substrate from the suction chuck. The substrate processing apparatus further includes a lower surface processing means for processing the lower surface of the substrate when the substrate is held by the holding pin.

[0044] With this configuration, while holding the substrate by the holding pin (second opening / closing pin), the lower surface of the substrate can be processed. Since the holding pin holds the substrate in contact with the peripheral end surface of the substrate, it does not hinder the processing of the lower surface of the substrate. Therefore, good processing of the lower surface of the substrate is possible.

[0045] The lower surface processing means may include a processing fluid nozzle (lower surface nozzle) that supplies a processing fluid (for example, a processing liquid such as an etching liquid or a rinsing liquid) toward the lower surface of the substrate.

[0046] One embodiment of the present invention provides a method for processing a substrate by a substrate processing apparatus including a suction chuck having an upward-facing substrate holding surface and a mechanical chuck disposed below the suction chuck and having holding pins actuated by vertical movement of the suction chuck. The substrate processing method includes a step of placing the substrate on the suction chuck, a step of centering the substrate on the substrate holding surface, a step of suction-holding the substrate with the suction chuck after the centering, a peripheral processing step of processing a peripheral portion of the substrate while rotating the suction chuck around a vertical axis of rotation in a state where the substrate is suction-held by the suction chuck, a step of releasing the suction-holding of the substrate by the suction chuck, lowering the suction chuck to actuate the holding pins, transferring the substrate from the suction chuck to the holding pins, bringing the holding pins into contact with a peripheral end surface of the substrate in a state where a lower surface of the substrate is spaced above the suction chuck, and holding the substrate by the mechanical chuck, and a lower surface processing step of processing a lower surface of the substrate held by the mechanical chuck while rotating the mechanical chuck holding the substrate around the axis of rotation.

[0047] According to this method, after centering the substrate on the substrate holding surface of the suction chuck, the substrate is sucked and held by the suction chuck. Therefore, the substrate is held by the suction chuck in a centered state with respect to the rotation axis. In this state, by processing the peripheral portion of the substrate while rotating the suction chuck around the rotation axis, the peripheral portion of the substrate can be accurately processed. More specifically, the processing width of the peripheral portion of the substrate can be precisely controlled. Since the suction chuck can hold the substrate without contacting the peripheral portion of the substrate, the peripheral portion of the substrate can be processed without any limitation. On the other hand, after processing the peripheral portion of the substrate, the suction holding of the suction chuck is released, and the substrate is transferred to a mechanical chuck disposed below the suction chuck. The mechanical chuck holds the substrate by bringing the substrate holding pins into contact with the peripheral end surface of the substrate in a state where the lower surface of the substrate is spaced above the suction chuck. Then, while rotating the mechanical chuck around the rotation axis, the lower surface of the substrate is processed. Since the mechanical chuck can hold the substrate without contacting the lower surface of the substrate, it does not hinder the processing of the lower surface of the substrate. Thus, by transferring the substrate from the suction chuck sharing the rotation axis to the mechanical chuck, the processing of the peripheral portion (bevel processing) of the substrate and the processing of the lower surface of the substrate can be continuously performed (more specifically, within the same chamber). Thereby, the productivity of substrate processing can be improved.

[0048] Since the holding pins of the mechanical chuck can be operated using a mechanism for moving the suction chuck up and down, a dedicated driving device is not required. Therefore, the structure is simple, and the cost can be reduced accordingly.

[0049] One embodiment of the present invention provides a method for processing a substrate by a substrate processing apparatus including a suction chuck having a holding plate with an upward-facing substrate holding surface, a first ferromagnetic body piece provided on the holding plate, a facing member disposed below the suction chuck and facing the holding plate from below, a mechanical chuck having a holding pin that operates by vertical movement of the suction chuck, and a third ferromagnetic body piece movably provided on the facing member and driven by a magnetic force generated between the third ferromagnetic body piece and the first ferromagnetic body piece according to the distance therebetween to operate the holding pin. The substrate processing method includes placing a substrate on the substrate holding surface of the suction chuck, centering the substrate on the substrate holding surface, after centering, sucking and holding the substrate with the suction chuck, while rotating the suction chuck around a vertical axis of rotation with the substrate sucked and held by the suction chuck, a peripheral processing step of processing a peripheral portion of the substrate, releasing the suction holding of the substrate by the suction chuck, lowering the suction chuck to operate the holding pin, transferring the substrate from the suction chuck to the holding pin, bringing the holding pin into contact with a peripheral end surface of the substrate with the lower surface of the substrate spaced above the suction chuck, and holding the substrate by the mechanical chuck, and a lower surface processing step of processing the lower surface of the substrate held by the mechanical chuck while rotating the mechanical chuck holding the substrate around the axis of rotation. This these substrate processing method can also have various features described above with respect to the substrate processing apparatus.

Brief Description of the Drawings

[0050]

FIG. 1

FIG. 2A

FIG. 2B

FIG. 2C

FIGS. 3A-3C

FIGS. 4A-4C

FIG. 5

FIG. 6

FIGS. 7A-7B

FIG. 8

FIG. 9

FIG. 10

FIGS. 11A-11B

Embodiment for Carrying Out the Invention

[0051] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0052] FIG. 1 is a side view schematically showing an internal configuration of a substrate processing apparatus according to an embodiment of the present invention. A general substrate processing system includes a plurality of substrate processing units and a substrate transfer robot that transfers substrates to the plurality of substrate processing units. FIG. 1 shows a configuration of a substrate processing unit provided in such a substrate processing system, and hereinafter, the configuration of the substrate processing unit will be mainly described. The substrate processing unit is an example of a substrate processing apparatus according to an embodiment of the present invention.

[0053] The substrate processing unit 100 is of a single-wafer type that processes the substrate W one by one. In this embodiment, the substrate W is a circular substrate such as a semiconductor wafer. The substrate processing unit 100 is configured to perform processing on the substrate W using a processing fluid. Examples of the processing fluid include a processing liquid and a processing gas. Examples of the processing liquid include a chemical solution and a rinse liquid. The chemical solution is a chemical that reacts with the material of the substrate W. The material of the substrate W includes, in addition to the semiconductor material, film materials such as an oxide film, a nitride film, and a resist formed on the surface of the substrate W. The rinse liquid is mainly a liquid for washing away the chemical solution on the substrate W. Examples of the chemical solution include dilute hydrofluoric acid (DHF), hydrofluoric acid, fluonitric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, aqueous ammonia, hydrogen peroxide water, organic acids (such as citric acid and oxalic acid), organic alkalis (such as TMAH (tetramethylammonium hydroxide)), sulfuric acid hydrogen peroxide water mixture (SPM), ammonia hydrogen peroxide water mixture (SC1), hydrochloric acid hydrogen peroxide water mixture (SC2), alcohols (such as isopropyl alcohol (IPA)), surfactants, corrosion inhibitors, and hydrophobizing agents. Examples of the rinse liquid include deionized water (DIW), carbonated water, electrolyzed ion water, hydrogen water, ozone water, and hydrochloric acid water with a dilution concentration (for example, 10 ppm to 100 ppm). Examples of the processing gas include a reactive gas that reacts with the substrate W (such as ozone gas, fluorine gas, a gas containing hydrogen fluoride, a gas containing IPA, etc.), and an inert gas that is chemically inert to the substrate W (such as nitrogen gas).

[0054] The substrate processing unit 100 includes a chamber 1, a suction chuck 10, a mechanical chuck 20, a housing 2, an upper surface nozzle 5, and a lower surface nozzle 6. The substrate processing unit 100 further includes a first processing fluid supply mechanism 80, a second processing fluid supply mechanism 85, a nozzle movement mechanism 90, a guard 94, and a rotation drive unit 60 that rotates the suction chuck 10 around a vertical rotation axis A. The substrate processing unit 100 further includes a vertical movement unit 70 that moves the suction chuck 10 vertically relative to the mechanical chuck 20. The rotation drive unit 60 and the vertical movement unit 70 are housed in the housing 2.

[0055] Each part of the substrate processing unit 100 is controlled by a control device 120. Specifically, the control device 120 controls the first processing fluid supply mechanism 80, the second processing fluid supply mechanism 85, the nozzle movement mechanism 90, the rotation drive unit 60, the vertical movement unit 70, and the like. The control device 120 is typically a computer, includes a processor and a memory, and is configured to execute various functions by the processor executing a program stored in the memory.

[0056] The suction chuck 10 and the mechanical chuck 20 are housed in the chamber 1 and are configured to hold the substrate W in the chamber 1.

[0057] The suction chuck 10 is configured to hold the substrate W in a horizontal posture and be rotatable around a vertical rotation axis A. The suction chuck 10 has a holding plate 11 having an upward-facing substrate holding surface 14, and is configured to suck and hold the substrate W on the substrate holding surface 14. The holding plate 11 is smaller than the substrate W to be held in plan view, and the substrate holding surface 14 is configured to face the central region of the lower surface of the substrate W. The holding plate 11 is made of a non-magnetic material such as a ceramic material or a resin material.

[0058] The mechanical chuck 20 is configured to hold the substrate W in a horizontal posture and be rotatable about a common rotation axis A with the suction chuck 10. The mechanical chuck 20 is disposed below the holding plate 11 and includes a spin base 21 which is an example of a facing member facing the holding plate 11 from below. The spin base 21 is made of a non-magnetic material such as a ceramic material or a resin material. The spin base 21 is configured to form a circle centered on the rotation axis A in a plan view.

[0059] The spin base 21 is provided with a centering pin CP (an example of a first opening / closing pin or a second opening / closing pin) that centers the substrate W by contacting the peripheral end surface of the substrate W. The spin base 21 is further provided with holding pins HP (an example of a first opening / closing pin or a second opening / closing pin) that hold the substrate W horizontally by holding the peripheral edge of the substrate W.

[0060] A plurality of holding pins HP are arranged at intervals in the circumferential direction around the rotation axis A, and each holding pin HP projects upward from the peripheral edge of the spin base 21. The centering pin CP is arranged at a position shifted in the circumferential direction around the rotation axis A with respect to the holding pin HP. A plurality of centering pins CP are arranged at intervals in the circumferential direction, and each centering pin CP projects upward from the peripheral edge of the spin base 21.

[0061] It is preferable that three or more centering pins CP are provided. Similarly, it is preferable that three or more holding pins HP are provided. The centering pins CP and the holding pins HP are made of a non-magnetic material such as a resin material.

[0062] The first processing fluid supply mechanism 80 supplies the first processing fluid FL1 to the upper surface nozzle 5. The first processing fluid supply mechanism 80 includes a first pipe 81 through which the first processing fluid FL1 flows, and a first valve 82 that opens and closes the flow path of the first pipe 81. By opening and closing the first valve 82, the discharge / stop of the first processing fluid FL1 from the upper surface nozzle 5 can be switched. The upper surface nozzle 5 discharges the first processing fluid FL1 toward the upper surface of the substrate W. The opening and closing of the first valve 82 are controlled by the control device 120.

[0063] The nozzle moving mechanism 90 moves the upper surface nozzle 5 in the vertical and horizontal directions. The nozzle moving mechanism 90 includes an arm 91 to which the upper surface nozzle 5 is coupled at the tip, and an arm driving mechanism 92 that moves the upper surface nozzle 5 by driving the arm 91. The arm driving mechanism 92 includes, for example, an electric motor. The nozzle moving mechanism 90 arranges the liquid application position of the upper surface nozzle 5 on the upper surface of the peripheral portion of the substrate W held by the suction chuck 10 by moving the upper surface nozzle 5, for example. In this state, by discharging the first processing fluid FL1 from the upper surface nozzle 5, it is possible to perform processing on the peripheral portion of the substrate W, so-called bevel processing.

[0064] The second processing fluid supply mechanism 85 supplies the second processing fluid FL2 to the lower surface nozzle 6. The lower surface nozzle 6 is arranged so as to insert the inner rotation shaft 15, which is a rotation shaft coupled to the lower surface of the suction chuck 10. The upper end of the lower surface nozzle 6 is a discharge port, and this discharge port discharges the second processing fluid FL2 toward the lower surface of the substrate W when the substrate W is held by the mechanical chuck 20. The second processing fluid supply mechanism 85 includes a second pipe 86 through which the second processing fluid FL2 flows, and a second valve 87 that opens and closes the flow path of the second pipe 86. By opening and closing the second valve 87, the discharge / stop of the second processing fluid FL2 from the lower surface nozzle 6 can be switched. The opening and closing of the second valve 87 are controlled by the control device 120.

[0065] The guard 94 receives the processing fluid that is supplied to the substrate W and discharged outward by centrifugal force as it rotates. The guard 94 includes a first guard portion 95 and a second guard portion 96. The second guard portion 96 is disposed inside the first guard portion 95. The second guard portion 96 is configured to receive the processing fluid below the first guard portion 95. In this embodiment, the processing fluid discharged when the substrate W is held by the suction chuck 10 is received by the first guard portion 95, and the processing fluid discharged when the substrate W is held by the mechanical chuck 20 is received by the second guard portion 96.

[0066] FIGS. 2A, 2B, and 2C are longitudinal sectional views showing more detailed configuration examples regarding the suction chuck 10 and the mechanical chuck 20, respectively showing states where the suction chuck 10 is disposed at different heights.

[0067] The guard 94 is supported by a holding portion 3 formed on the upper wall of the housing 2. The guard 94 includes a bottom portion 97 that connects the cylindrical first guard portion 95 and the second guard portion 96, and the bottom portion 97 is supported by the housing 2. The bottom portion 97 forms a first groove 98 and a second groove 99 that receive the processing fluid (mainly the processing liquid) received by the first guard portion 95 and the second guard portion 96, respectively.

[0068] The mechanical chuck 20 is disposed so as to be surrounded by the guard 94. The mechanical chuck 20 includes a disk-shaped spin base 21 and an outer rotating shaft 22 that is a hollow rotating shaft coupled to the lower surface of the spin base 21. The outer rotating shaft 22 is supported by the holding portion 3 of the housing 2 via an outer bearing 23 disposed on the outer peripheral surface and a bearing support portion 24 that supports the outer bearing 23. Thereby, the mechanical chuck 20 is rotatable about the rotation axis A.

[0069] The holding plate 11 of the suction chuck 10 is provided with a suction head 12 near the center, and is configured to suck and hold the lower surface of the substrate W on the substrate holding surface 14 which is the upper surface of the suction head 12. The holding plate 11 is larger than the suction head 12 and smaller than the substrate W to be held in a plan view. In this embodiment, the holding plate 11 is further smaller than the spin base 21 in a plan view. More specifically, with the substrate W held on the substrate holding surface 14 which is the upper surface of the suction head 12, the entire holding plate 11 is positioned inside the periphery of the substrate W.

[0070] An inner rotating shaft 15 which is a hollow rotating shaft is coupled to the lower surface of the holding plate 11 and extends downward along the vertical direction. The outer peripheral surface of the inner rotating shaft 15 is held by a slide bearing 16 such as a ball spline. The slide bearing 16 guides the vertical movement of the inner rotating shaft 15 while being configured to rotate about the rotation axis A together with the inner rotating shaft 15. That is, the inner rotating shaft 15 is vertically movable with respect to the slide bearing 16 while being unable to rotate circumferentially with respect to the slide bearing 16, and rotates together with the slide bearing 16 when the slide bearing 16 rotates about the rotation axis A.

[0071] The rotational force of the electric motor 61 is transmitted to the slide bearing 16 by a motor pulley 62, a belt 63, and a pulley 64. The electric motor 61 is held by the holding portion 3 of the housing 2. A rotation drive unit 60 for rotating the suction chuck 10 about the rotation axis A is constituted by the electric motor 61, the belt 63, the pulley 64, and the like.

[0072] The slide bearing 16 is supported by the inner peripheral surface of an outer rotating shaft 22 which is the rotating shaft of the mechanical chuck 20 via an inner bearing 17 disposed on its outer peripheral surface. That is, the inner bearing 17 is disposed between the slide bearing 16 and the inner peripheral surface of the outer rotating shaft 22. Thereby, the slide bearing 16 is capable of relative rotation about the rotation axis A with respect to the mechanical chuck 20, and accordingly, the suction chuck 10 is capable of relative rotation about the rotation axis A with respect to the mechanical chuck 20.

[0073] The inner rotation shaft 15, which is the rotation shaft of the suction chuck 10, is coupled to the vertical movement unit 70. The vertical movement unit 70 includes a support bracket 71 that supports the lower end of the inner rotation shaft 15, and a ball screw mechanism 72 that is a lifting mechanism for vertically moving the support bracket 71. The support bracket 71 rotatably supports the inner rotation shaft 15 via a lower bearing 76. The ball screw mechanism 72 includes a ball nut 73 coupled to the support bracket 71, a screw shaft 74 that is screwed into the ball nut 73 and extends in the vertical direction, and a drive unit 75 that rotates the screw shaft 74. The drive unit 75 typically includes an electric motor and a power transmission mechanism that transmits the rotational force of the electric motor to the screw shaft 74. The upper end of the screw shaft 74 is rotatably supported by the holding portion 3 of the housing 2, and the lower end of the screw shaft 74 is rotatably supported by a fixed base 4 fixed to the bottom 1B of the chamber 1.

[0074] The electric motor provided in the drive unit 75 is an electric motor capable of position control, such as a stepping motor or a pulse motor. By controlling the position of the electric motor, the height of the suction chuck 10 can be controlled. The drive unit 75 (more specifically, its electric motor) is controlled by a control device 120 (see FIG. 1).

[0075] An opening 71a that aligns with the inner peripheral surface of the inner rotation shaft 15 is formed in the support bracket 71. The lower surface nozzle 6 is disposed so as to pass through this opening 71a and insert the inner rotation shaft 15. The lower surface nozzle 6 is fixed to the bottom 1B of the chamber 1. A second pipe 86 of the second processing fluid supply mechanism 85 is connected to the lower surface nozzle 6.

[0076] A bellows 78 is disposed between the lower surface of the support bracket 71 and the bottom surface of the chamber 1. The bellows 78 is disposed so as to surround the lower surface nozzle 6, expands and contracts following the vertical movement of the support bracket 71, and ensures the airtightness of the inner space thereof.

[0077] The space between the lower nozzle 6 and the inner peripheral surface of the inner rotating shaft 15 provides a gas flow path 18. The gas flow path 18 communicates with the space between the lower nozzle 6 and the inner surface of the bellows 78. The upper end of the gas flow path 18 opens at the central part of the suction head 12, forming a suction port 13. The lower end of the gas flow path 18 communicates with a communication pipe 101 that penetrates the bottom 1B of the chamber 1. A gas pipe 102 is connected to the communication pipe 101. A suction mechanism 105 and a gas supply mechanism 110 are connected to the gas pipe 102.

[0078] The suction mechanism 105 includes a suction part 106 including a compressor or the like, a suction pipe 107 connecting the suction part 106 and the gas pipe 102, and a suction valve 108 interposed in the suction pipe 107. By opening the suction valve 108, the gas in the gas flow path 18 is sucked and the inside of the gas flow path 18 becomes a negative pressure, so that the substrate W can be adsorbed (vacuum adsorbed) and held on the suction head 12.

[0079] The gas supply mechanism 110 supplies the gas supplied from the gas supply source to the gas pipe 102 via the gas supply pipe 111. A gas supply valve 112 is interposed in the gas supply pipe 111. The gas to be supplied may be an inert gas (such as nitrogen gas) or air. By opening the gas supply valve 112, gas can be supplied to the gas flow path 18. Thereby, the adsorption of the substrate W on the suction head 12 can be released, an inert gas or the like can be supplied toward the lower surface of the substrate W, or the substrate W can be lifted on the substrate holding surface 14 by the supply of an inert gas or the like.

[0080] A seal member 77 that contacts the lower end of the inner rotating shaft 15 is disposed on the support bracket 71 below the lower bearing 76. When the inner rotating shaft 15 rotates, the seal member 77 is in sliding contact with the inner rotating shaft 15 and maintains the airtightness therebetween.

[0081] In order to restrict the relative rotation between the spin base 21 and the holding plate 11, a rotation restricting link 27 is provided. The rotation restricting link 27 restricts the relative rotation between the spin base 21 and the holding plate 11 by an uneven coupling that engages by approaching the holding plate 11 to the spin base 21 by the vertical movement of the vertical movement unit 70. In this embodiment, the holding plate 11 is provided with a connecting pin P protruding downward, and the spin base 21 is provided with connecting recesses R1, R2 that are unevenly coupled with the connecting pin P, and these constitute the rotation restricting link 27.

[0082] When the suction chuck 10 is disposed at an appropriate relative rotational position with respect to the mechanical chuck 20, when the holding plate 11 descends and approaches the spin base 21, the connecting pin P engages with the connecting recess R1 or R2. Thereby, the relative rotation between the holding plate 11 and the spin base 21 is restricted. Therefore, when the suction chuck 10 is rotated about the rotation axis A by the rotation drive unit 60, the rotation is transmitted to the spin base 21, and the mechanical chuck 20 rotates about the rotation axis A together with the suction chuck 10.

[0083] When the holding plate 11 is raised and separated from the spin base 21, the connecting pin P disengages from the connecting recesses R1, R2, and the holding plate 11 and the spin base 21 become relatively rotatable. Therefore, even when the suction chuck 10 is rotated about the rotation axis A by the rotation drive unit 60, the rotation is not transmitted to the mechanical chuck 20.

[0084] The holding plate 11 is provided with a first magnet piece M1 (permanent magnet piece) as a first ferromagnetic body piece. In this embodiment, a plurality of first magnet pieces M1 are provided at intervals in the circumferential direction. Further, the spin base 21 is provided with a second magnet piece M2 (permanent magnet piece) as a second ferromagnetic body piece. In this embodiment, a plurality of second magnet pieces M2 are provided at intervals in the circumferential direction. Furthermore, the spin base 21 is provided with a third magnet piece M3 (permanent magnet piece) as a second ferromagnetic body piece or a third ferromagnetic body piece. In this embodiment, a plurality of third magnet pieces M3 are provided at intervals in the circumferential direction.

[0085] The plurality of first magnet pieces M1, the plurality of second magnet pieces M2, and the plurality of third magnet pieces M3 are respectively arranged at equal angular intervals when viewed from the rotation axis A. The position of the first magnet piece M1 with respect to the holding plate 11 is substantially fixed. The second magnet piece M2 and the third magnet piece M3 are attached to the spin base 21 so as to be movable within a predetermined operating range with respect to the spin base 21. In this embodiment, the numbers of the first magnet pieces M1, the second magnet pieces M2, and the third magnet pieces M3 are the same, specifically three. Of course, this number is only an example.

[0086] When the circumferential positions of the first magnet piece M1 and the second magnet piece M2 are aligned in a plan view, if the suction chuck 10 is moved up and down to vary the distance between the first magnet piece M1 and the second magnet piece M2, the second magnet piece M2 moves due to the magnetic force generated according to the distance (see FIG. 2A). At this time, the magnetic force acting between the first magnet piece M1 and the third magnet piece M3 is negligible, and the position of the third magnet piece M3 hardly changes.

[0087] Similarly, when the circumferential positions of the first magnet piece M1 and the third magnet piece M3 are aligned in a plan view, if the suction chuck 10 is moved up and down to vary the distance between the first magnet piece M1 and the third magnet piece M3, the third magnet piece M3 moves due to the magnetic force generated according to the distance (see FIG. 2C). At this time, the magnetic force acting between the first magnet piece M1 and the second magnet piece M2 is negligible, and the position of the second magnet piece M2 hardly changes. Therefore, by appropriately selecting the relative rotational position between the suction chuck 10 and the mechanical chuck 20, one of the second magnet piece M2 and the third magnet piece M3 can be selectively moved by moving the suction chuck 10 up and down.

[0088] The spin base 21 is provided with a centering pin drive mechanism 30 that transmits the movement of the second magnet piece M2 to the centering pin CP. In this embodiment, the centering pin drive mechanism 30 includes a link mechanism for synchronizing the operations of a plurality of centering pins CP. Similarly, the spin base 21 is provided with a holding pin drive mechanism 40 that transmits the movement of the third magnet piece M3 to the holding pin HP.

[0089] In this embodiment, the holding pin drive mechanism 40 includes a slider 41 that is coupled to the lower end of the holding pin HP and held by the spin base 21 so as to be slidable in the radial direction (rotational radius direction) with respect to the rotation axis A, and a spring 42 that biases the slider 41 in the opening direction away from the rotation axis A. The third magnet piece M3 is fixed to the slider 41.

[0090] When the suction head 12 is lowered, the first magnet piece M1 is disposed at a position closer to the rotation axis A than the third magnet piece M3 (see FIG. 2C), and due to the suction magnetic force therebetween, the slider 41 moves closer to the rotation axis A against the force of the spring 42. Thereby, the holding pin HP moves closer to the rotation axis A, comes into contact with the peripheral end surface of the substrate W, and enters a closed state in which the peripheral edge portion of the substrate W is held. When the suction head 12 is raised, the magnetic force between the first magnet piece M1 and the third magnet piece M3 weakens, so that the slider 41 moves in a direction away from the rotation axis A by the force of the spring 42, the holding pin HP enters an open state, and the holding of the peripheral edge portion of the substrate W is released.

[0091] The holding pin HP includes a shaft portion 55 that stands substantially vertically from the spin base 21, and a contact portion 56 that is disposed at the head of the shaft portion 55. The contact portion 56 is provided with a holding groove 57 that opens in a V shape toward the rotation axis A in a side view. The holding groove 57 is configured to receive and hold the peripheral edge portion of the substrate W. The peripheral end surface of the substrate W typically forms a convex curved surface having an arc shape that bulges outward in a vertical cut surface including the rotation axis A. The holding groove 57 has two inclined surfaces that respectively contact such a peripheral end surface from above and below.

[0092] FIG. 3A and FIG. 4A are schematic cross-sectional views for explaining a configuration example of the centering pin drive mechanism 30, and show a configuration in a cross-section passing through two centering pins CP and the rotation axis A. FIG. 3A shows the configuration when the centering pin CP is in the open state, and FIG. 4A shows the configuration when the centering pin CP is in the closed state. FIGS. 3B and 4B respectively show schematic cross-sections viewed from the cutting plane line B of FIGS. 3A and 4A. FIGS. 3C and 4C show the configuration in the vicinity of the centering pin CP when viewed in plan along the arrow C in FIGS. 3A and 4A with illustration of the spin base 21 and the like omitted.

[0093] The centering pin CP includes a shaft portion 51 erected along the vertical direction and a contact portion 52 fixed to the upper end of the shaft portion 51. The shaft portion 51 is attached to the spin base 21 so as to be rotatable about its axis. Specifically, the lower end portion of the shaft portion 51 is coupled to the spin base 21 via a bearing 54. The contact portion 52 is attached to the upper end of the shaft portion 51 at a position eccentric from the axis of the shaft portion 51, that is, the rotation axis 53. Therefore, when the shaft portion 51 is rotated about the rotation axis 53, the contact portion 52 moves in a direction approaching / separating from the rotation axis A.

[0094] In this embodiment, the contact portion 52 has a straight shaft shape thinner than the shaft portion 51 and is erected at the upper end of the shaft portion 51 along the vertical direction. More specifically, the contact portion 52 includes an outer peripheral surface formed of a cylindrical surface extending along its shaft shape, and is configured such that the outer peripheral surface contacts the peripheral end surface of the substrate W by substantially point contact (for example, point contact at one point).

[0095] The centering pin drive mechanism 30 includes a lever 31 coupled to the shaft portion 51 of the centering pin CP and protruding in the radial direction orthogonal to the rotation axis 53, a cam follower 32 provided at the tip of the lever 31, a cam guide 33 engaged with the cam follower 32, and a vertical guide 34 for guiding the cam guide 33 in the vertical direction. These constitute a link mechanism for operating a plurality of centering pins CP synchronously. A second magnet piece M2 is fixed to the cam guide 33.

[0096] The cam guide 33 has a cam hole 33a having a cam surface inclined in the circumferential direction around the rotation axis A with respect to the vertical direction, and a cam follower 32 is engaged with the cam hole 33a. The cam guide 33 is configured in an annular shape surrounding the rotation axis A and has a plurality of cam holes 33a corresponding to a plurality of centering pins CP. A plurality of cam followers 32 at the tips of a lever 31 coupled to the plurality of centering pins CP are respectively engaged with the plurality of cam holes 33a.

[0097] When the suction chuck 10 is lowered and the first magnet piece M1 is brought closer to the second magnet piece M2 as shown in FIGS. 4A, 4B, and 4C from the states shown in FIGS. 3A, 3B, and 3C, the second magnet piece M2 is lifted by the suction magnetic force between them. Accordingly, the cam guide 33 rises against the gravity acting thereon. Then, the cam follower 32 is guided by the cam surface and moves in the circumferential direction, and accordingly, the lever 31 rotates. Thereby, the shaft portion 51 of the centering pin CP rotates around the rotation axis 53 together with the lever 31. Since the contact portion 52 of the centering pin CP is eccentric with respect to the rotation axis 53, the distance from the rotation axis A varies due to the rotation of the centering pin CP.

[0098] Specifically, when the second magnet piece M2 is lifted, the contact portion 52 approaches the rotation axis A and enters a closed state in which it can contact the peripheral end surface of the substrate W (see FIGS. 4A, 4B, and 4C). On the other hand, when the suction chuck 10 is raised and the first magnet piece M1 is moved away from the second magnet piece M2, the magnetic suction force between them weakens, and accordingly, the cam guide 33 descends due to gravity. As a result, the lever 31 rotates in the circumferential direction, so that the centering pin CP rotates, and its contact portion 52 moves away from the rotation axis A and enters an open state in which it is separated from the peripheral end surface of the substrate W (see FIGS. 3A, 3B, and 3C).

[0099] Due to the action of the centering pin drive mechanism 30 composed of a link mechanism, the plurality of centering pins CP synchronously open and close with the up and down movement of the suction chuck 10. Therefore, when the suction chuck 10 is lowered, the contact portions 52 of the plurality of centering pins CP move toward the rotation axis A all at once. Thus, if the suction chuck 10 is in a non-suction state, the center of the substrate W can be accurately centered on the rotation axis A while sliding the substrate W horizontally on the suction chuck 10.

[0100] FIG. 5 is a plan view for explaining an arrangement example of the first magnet pieces M1 on the holding plate 11 of the suction chuck 10. The suction head 12 has a circular substrate holding surface 14 (substrate suction surface) centered on the rotation axis A in a plan view. The holding plate 11 has a circular upper surface centered on the rotation axis A in a plan view. Its diameter is larger than the diameter of the suction head 12 and smaller than the diameter of the substrate W to be held. A plurality (three in this embodiment) of first magnet pieces M1 are arranged at intervals in the circumferential direction at the peripheral portion of the holding plate 11. In this embodiment, the plurality of first magnet pieces M1 are arranged at equal intervals along the circumferential direction and at equal angular intervals centered on the rotation axis A. In this embodiment, the connecting pins P are arranged at positions different from any of the first magnet pieces M1 in the circumferential direction.

[0101] FIG. 6 is a plan view for explaining the arrangement of the holding pins HP, centering pins CP, second magnet pieces M2, and third magnet pieces M3 of the mechanical chuck 20. The spin base 21 of the mechanical chuck 20 is circular centered on the rotation axis A, and an opening 21a for inserting the inner rotation shaft 15 coupled to the suction chuck 10 is formed at the center. The outer diameter of the spin base 21 is larger than that of the holding plate 11. Further, in this embodiment, the spin base 21 has an outer diameter larger than the diameter of the substrate W to be held.

[0102] A plurality of holding pins HP (three in this embodiment) are arranged at intervals along the circumferential direction on the peripheral edge of the spin base 21. In this embodiment, the plurality of holding pins HP are arranged at equal intervals along the circumferential direction and at equal angular intervals around the rotation axis A. Further, a plurality of centering pins CP (three in this embodiment) are arranged at intervals along the circumferential direction on the peripheral edge of the spin base 21. In this embodiment, the plurality of centering pins CP are arranged at equal intervals along the circumferential direction and at equal angular intervals around the rotation axis A.

[0103] In this embodiment, the same number of centering pins CP as the holding pins HP are provided, and the holding pins HP and the centering pins CP are arranged alternately at intervals along the circumferential direction. The holding pins HP and the centering pins CP are arranged at equal intervals along the circumferential direction and at equal angular intervals around the rotation axis A. That is, one centering pin CP is arranged at an intermediate position in the circumferential direction between a pair of adjacent holding pins HP in the circumferential direction.

[0104] A plurality of second magnet pieces M2 corresponding to the plurality of centering pins CP are arranged on the spin base 21. In this embodiment, the circumferential arrangement of the plurality of second magnet pieces M2 is the same as that of the corresponding centering pins CP. That is, the centering pins CP and the second magnet pieces M2 corresponding to each other have the same angular position around the rotation axis A. The radial position of the second magnet piece M2 from the rotation axis A is different from the radial position of the centering pin CP. That is, the second magnet piece M2 is arranged at a position closer to the rotation axis A than the centering pin CP. Corresponding to this arrangement of the second magnet piece M2, an annular (circular in this embodiment) cam guide 33 is arranged.

[0105] Further, a plurality of third magnet pieces M3 respectively corresponding to the plurality of holding pins HP are arranged on the spin base 21. In this embodiment, as described above, the third magnet piece M3 is fixed to the slider 41 coupled to the holding pin HP. Therefore, the circumferential arrangement of the plurality of third magnet pieces M3 is the same as that of the corresponding holding pins HP. That is, the corresponding holding pin HP and the third magnet piece M3 have the same angular position around the rotation axis A. The radial position of the third magnet piece M3 from the rotation axis A is different from the radial position of the holding pin HP. That is, the third magnet piece M3 is arranged at a position closer to the rotation axis A than the holding pin HP.

[0106] The circumferential positions of the second magnet piece M2 and the third magnet piece M3 are different. In this embodiment, the same number of third magnet pieces M3 as the second magnet piece M2 are provided, and the second magnet piece M2 and the third magnet piece M3 are alternately arranged at intervals along the circumferential direction. The second magnet piece M2 and the third magnet piece M3 are arranged at equal angular intervals around the rotation axis A. That is, one third magnet piece M3 is arranged at an intermediate position in the circumferential direction between a pair of adjacent second magnet pieces M2 in the circumferential direction.

[0107] The radial positions of the second magnet piece M2 and the third magnet piece M3 in the rotational radius direction may be the same or different. Specifically, the radial positions of the second magnet piece M2 and the third magnet piece M3 in the rotational radius direction may be determined so that the operations of the cam guide 33 and the slider 41 do not interfere with each other and an appropriate magnetic force can be obtained between the first magnet piece M1.

[0108] The spin base 21 is provided with connecting recesses R1, R2 (connecting holes) that engage with the connecting pins P of the holding plate 11. The connecting recesses R1, R2 are arranged at radial positions that match the connecting pins P. In this embodiment, the two connecting recesses R1, R2 are arranged at intervals in the circumferential direction. The angular interval between the two connecting recesses R1, R2 as viewed from the rotation axis A is equal to the angular interval between the second magnet piece M2 and the third magnet piece M3 adjacent to each other in the circumferential direction as viewed from the rotation axis A.

[0109] By adjusting the relative rotational positions of the suction chuck 10 and the mechanical chuck 20 so that the connecting pin P overlaps with either of the connecting recesses R1, R2 in a plan view, when the suction chuck 10 is lowered, the connecting pin P and the connecting recesses R1, R2 can be engaged, and the rotation restricting link 27 can be brought into an engaged state (relative rotation restricting state).

[0110] A chuck stop mechanism 28 is provided to stop the mechanical chuck 20 at a predetermined angular position (predetermined rotational position). The chuck stop mechanism 28 includes, for example, a rotating magnet piece 28a fixed to the spin base 21 and a fixed magnet piece 28b that attracts the magnet piece. The rotating magnet piece 28a rotates together with the spin base 21, and the fixed magnet piece 28b is disposed in the chamber 1 in a non-rotating state. When the rotation restricting link 27 is in a disengaged state and the mechanical chuck 20 can freely rotate about the rotation axis A, the mechanical chuck 20 is guided to the predetermined angular position by the magnetic attraction force between the rotating magnet piece 28a and the fixed magnet piece 28b.

[0111] The electric motor 61 (see FIG. 2B etc.) of the rotation drive unit 60 is an electric motor capable of position control, such as a pulse motor for example. Therefore, by controlling the position of the electric motor 61, the rotation angle of the suction chuck 10 about the rotation axis A can be controlled. When the rotation restricting link 27 is in a released state, since the mechanical chuck 20 is stopped at the predetermined angular position, by controlling the rotation angle of the suction chuck 10, the relative rotational position (relative angular position) of the suction chuck 10 with respect to the mechanical chuck 20 can be controlled.

[0112] More specifically, when stopping the rotation of the suction chuck 10, the control device 120 (see FIG. 1) performs position control of the electric motor 61. Thereby, the control device 120 controls the relative rotational position of the suction chuck 10 with respect to the mechanical chuck 20 to either the first relative rotational position or the second relative rotational position to stop the rotation of the suction chuck 10.

[0113] The first relative rotational position is a position where the angular positions of the first magnet piece M1 and the second magnet piece M2 around the rotation axis A are aligned, and is a position where the connecting pin P and the first connecting recess R1 are aligned in a plan view. The second relative rotational position is a position where the angular positions of the first magnet piece M1 and the third magnet piece M3 around the rotation axis A are aligned, and is a position where the connecting pin P and the second connecting recess R2 are aligned in a plan view.

[0114] FIG. 7A is a plan view of a state in which the connecting pin P is engaged with the first connecting recess R1, which is one of the two connecting recesses. At this time, the suction chuck 10 is in the first relative rotational position with respect to the mechanical chuck 20. That is, the circumferential positions of the first magnet piece M1 fixed to the holding plate 11 and the second magnet piece M2 (centering pin CP) are aligned, and the third magnet piece M3 is arranged at the circumferential position intermediate between a pair of adjacent first magnet pieces M1. Therefore, due to the magnetic force acting between the first magnet piece M1 and the second magnet piece M2, the second magnet piece M2 moves, and accordingly, the centering pin CP operates. That is, the contact portion 52 of the centering pin CP moves closer to the rotation axis A to be in a closed state (see FIGS. 2A, 4A, 4B, and 4C). Thereby, the substrate W can be centered on the suction chuck 10. Since the distance between the first magnet piece M1 and the third magnet piece M3 is sufficiently large, the third magnet piece M3 does not substantially move. Therefore, the holding pin HP is kept in an open state.

[0115] FIG. 7B is a plan view of a state in which the connecting pin P is engaged with the second connecting recess R2, which is the other of the two connecting recesses. At this time, the suction chuck 10 is in the second relative rotational position with respect to the mechanical chuck 20. That is, the circumferential positions of the first magnet piece M1 and the third magnet piece M3 (holding pin HP) fixed to the holding plate 11 are aligned, and the second magnet piece M2 is disposed at a circumferential position intermediate between a pair of adjacent first magnet pieces M1. Therefore, due to the magnetic force acting between the first magnet piece M1 and the third magnet piece M3, the third magnet piece M3 moves, and accordingly, the holding pin HP operates. That is, the contact portion 56 of the holding pin HP moves so as to approach the rotation axis A and enters a closed state (see FIG. 2C). Thereby, the edge of the substrate W can be held by the holding pin HP, and the substrate W can be held by the mechanical chuck 20. Since the distance between the first magnet piece M1 and the second magnet piece M2 is sufficiently large, the second magnet piece M2 does not substantially move. Therefore, the centering pin CP is kept in an open state.

[0116] FIG. 8 is a flowchart for explaining an example of substrate processing by the substrate processing unit 100. This process is executed by the control device 120 controlling each part of the substrate processing unit 100.

[0117] The control device 120 controls the relative rotational position of the suction chuck 10 with respect to the mechanical chuck 20 to the above-described first relative rotational position (see FIG. 7A) by controlling the rotational position of the suction chuck 10 (step S1). If the suction chuck 10 is already arranged at the first relative rotational position, this process may be omitted.

[0118] The unprocessed substrate W is carried into the substrate processing unit 100 by a substrate transfer robot (not shown) and placed on the substrate holding surface 14 of the suction chuck 10 (step S2). At this time, the suction chuck 10 is arranged at a substrate transfer position where the substrate holding surface 14 is located above the upper end of the guard 94. The hand of the substrate transfer robot enters the chamber 1, places the substrate W on the substrate holding surface 14 of the suction chuck 10, and then retreats outside the chamber 1.

[0119] The vertical movement unit 70 lowers the suction chuck 10 to the centering height (see Fig. 2A). The centering height is the height at which the second magnet piece M2 moves due to the magnetic force acting between the first magnet piece M1 and the second magnet piece M2, thereby switching the centering pin CP from the open state to the closed state. At this time, the suction head 12 is not adsorbing the substrate W. More specifically, the control device 120 holds the suction valve 108 interposed in the suction pipe 107 in the closed state. At this time, the control device 120 may supply nitrogen gas or the like to the suction port 13 by keeping the gas supply valve 112 interposed in the gas supply pipe 111 in the open state. More specifically, the substrate W may be in a floating state on the substrate holding surface 14 due to nitrogen gas or the like blown out from the suction port 13. Therefore, when the peripheral end surface of the substrate W is pushed by the centering pin CP toward the rotation axis A from a plurality of directions (three directions in this embodiment), the substrate W horizontally moves on the substrate holding surface 14, and the center of the substrate W coincides with the rotation axis A. Thus, the centering of the substrate W is achieved (step S3).

[0120] Next, the control device 120 closes the gas supply valve 112 and opens the suction valve 108. Thereby, the suction head 12 sucks and holds the substrate W on the substrate holding surface 14 (step S4). In that state, the vertical movement unit 70 raises the suction chuck 10 to the bevel processing height (see Fig. 2B) (step S5). At the bevel processing height, the engagement of the rotation restricting link 27 is released, and the rotation of the suction chuck 10 is not transmitted to the mechanical chuck 20. Further, when the suction chuck 10 rises to the bevel processing height, the distance between the first magnet piece M1 and the second magnet piece M2 increases, whereby the magnetic force acting between them decreases. Thereby, the cam guide 33 descends by its own weight, so the centering pin CP transitions to the open state.

[0121] Then, the control device 120 rotates the suction chuck 10 around the rotation axis A by the rotation drive unit 60. As a result, the substrate W centered and held by the suction chuck 10 is rotated around the rotation axis A (step S6). In this state, bevel processing is executed (step S7. Peripheral processing step, peripheral processing means). In the bevel processing, the first processing fluid FL1 is supplied from the upper surface nozzle 5 toward the peripheral portion of the surface of the rotating substrate W, whereby the peripheral portion of the substrate W is processed (see FIG. 1). Since the substrate W is centered, the processing width can be precisely controlled. For example, a chemical solution (for example, an etching solution) is supplied from the upper surface nozzle 5 to perform chemical solution processing, and then a rinse solution is supplied from the upper surface nozzle 5 to perform rinse processing. After the rinse processing, spin drying may be performed to rotate the substrate W without discharging the rinse solution to shake off the liquid components on the substrate W.

[0122] When the bevel processing is completed, the control device 120 controls the rotation drive unit 60 to stop the rotation of the suction chuck 10. At this time, the control device 120 controls the rotation position of the suction chuck 10 and stops the rotation of the suction chuck 10 at the rotation position where the connecting pin P is located directly above the second connecting recess R2 (substrate holding rotation position) (step S8). That is, the relative rotation position of the suction chuck 10 with respect to the mechanical chuck 20 becomes the aforementioned second relative rotation position (see FIG. 7B). Thereafter, the vertical movement unit 70 lowers the suction chuck 10 to the substrate holding height (a height slightly higher than the position of the suction chuck 10 in FIG. 2C) (step S9). Thereby, the connecting pin P is coupled to the second connecting recess R2.

[0123] The substrate holding height is such that the connecting pin P is connected to the second connecting recess R2 and the rotation restricting link 27 is in an engaged state, and the third magnet piece M3 is moved by the magnetic force acting between the first magnet piece M1 and the third magnet piece M3, enabling the holding pin HP to be actuated to the closed state. Thus, the holding pin HP moves toward and abuts against the peripheral end surface of the substrate W. A plurality of holding pins HP move toward and abut against the peripheral end surface of the substrate W from a plurality of directions (three directions in this embodiment) toward the rotation axis A, holding the peripheral edge portion of the substrate W. Thereby, the substrate W is held by the mechanical chuck 20. Before and after this holding, the control device 120 closes the suction valve 108 to release the suction of the substrate W by the suction head 12 (step S10). Thereby, the substrate W is transferred from the suction chuck 10 to the mechanical chuck 20. The height of the suction chuck 10 is further controlled by the control device 120 so that the substrate holding surface 14 of the suction head 12 is at a position spaced downward from the lower surface of the substrate W (lower surface processing height, see FIG. 2C) (step S11).

[0124] Next, the rotation drive unit 60 rotates the suction chuck 10 about the rotation axis A. Since this rotation is transmitted to the mechanical chuck 20 by the rotation restricting link 27, the mechanical chuck 20 rotates about the rotation axis A, thereby rotating the substrate W about the rotation axis A (step S12). In that state, the lower surface processing is executed (step S13, lower surface processing means). In the lower surface processing, the second processing fluid FL2 is discharged from the lower surface nozzle 6 toward the lower surface of the substrate W, thereby processing the lower surface of the substrate W. For example, a chemical solution is discharged from the lower surface nozzle 6 to perform a chemical solution treatment on the lower surface of the substrate W, and then a rinse solution is discharged from the lower surface nozzle 6 to perform a rinse treatment on the lower surface of the substrate W. During this lower surface processing, the substrate holding surface 14 of the suction head 12 is simultaneously washed by the chemical solution and the rinse solution. Thereafter, the discharge of the rinse solution is stopped, the rotation of the substrate W is accelerated, and spin drying to shake off the liquid on the substrate W is performed (step S14).

[0125] Thereafter, the rotation drive unit 60 stops the rotation of the substrate W (step S15). At this time, the control device 120 may control the rotation stop position of the suction chuck 10. Specifically, the control device 120 may control the rotation stop position of the suction chuck 10 so that the suction chuck 10 is at a rotation position corresponding to the aforementioned first relative rotation position. Since both the mechanical chuck 20 and the suction chuck 10 rotate or stop together by the rotation restricting link 27, by controlling the rotation stop position of the suction chuck 10, the mechanical chuck 20 is guided to its predetermined angular position and stops. Thereby, when the substrate W is carried out next, even if the control of the rotation position of the suction chuck 10 (step S1) is omitted, when the suction chuck 10 descends to the centering height (step S3), the centering pin CP can be operated.

[0126] Next, the vertical movement unit 70 raises the suction chuck 10 (step S16). Due to the raising of the suction chuck 10, the magnetic force acting between the first magnet piece M1 and the third magnet piece M3 weakens, whereby the holding pin HP switches to the open state. In that state, as the suction chuck 10 further rises, the substrate W is lifted by the suction chuck 10, and the substrate W is transferred from the mechanical chuck 20 to the suction chuck 10. The suction chuck 10 further rises to the substrate transfer position. In that state, the hand of the substrate transfer robot enters the chamber 1, scoops up the processed substrate W from the suction chuck 10, and carries it out of the chamber 1 (step S17).

[0127] As described above, according to this embodiment, the first magnet piece M1 is fixed to the holding plate 11 of the suction chuck 10, and the spinning base 21 of the mechanical chuck 20 is provided with a centering pin CP that is actuated by the movement of the second magnet piece M2. When the first magnet piece M1 is brought closer to the second magnet piece M2 by the vertical movement of the suction chuck 10, the second magnet piece M2 moves due to the magnetic force between them, and accordingly, the centering pin CP operates from the open state to the closed state. Thereby, the centering pin CP abuts against the peripheral end surface of the substrate W, and the center of the substrate W is aligned with the rotation axis A. In this way, since the centering pin CP can be actuated by utilizing the configuration of vertically moving the suction chuck 10, a dedicated driving device is not required. Therefore, the structure is simple, and accordingly, the cost of the substrate processing unit 100 can be reduced.

[0128] Further, the spinning base 21 of the mechanical chuck 20 is provided with a holding pin HP that is actuated by the movement of the third magnet piece M3. When the first magnet piece M1 is brought closer to the third magnet piece M3 by the vertical movement of the suction chuck 10, the third magnet piece M3 moves due to the magnetic force between them, and accordingly, the holding pin HP operates from the open state to the closed state. Thereby, the holding pin HP abuts against the peripheral end surface of the substrate W, and holds the peripheral edge portion of the substrate W. In this way, since the holding pin HP can be actuated by utilizing the configuration of vertically moving the suction chuck 10, a dedicated driving device is not required. Therefore, the structure is simple, and accordingly, the cost of the substrate processing unit 100 can be reduced.

[0129] Further, in this embodiment, when the suction chuck 10 approaches the spin base 21 in a state where the suction chuck 10 is at the first relative rotational position with respect to the spin base 21, the second magnet piece M2 moves, and thereby the centering pin CP approaches the peripheral end surface of the substrate W. On the other hand, when the suction chuck 10 approaches the spin base 21 in a state where the suction chuck 10 is at a second relative rotational position different from the first relative rotational position with respect to the spin base 21, the third magnet piece M3 moves, and thereby the holding pin HP operates to approach the peripheral end surface of the substrate W. Therefore, by the vertical movement of the suction chuck 10, the centering pin CP and the holding pin HP can be selectively operated.

[0130] The second magnet piece M2 and the third magnet piece M3 are arranged at intervals in the circumferential direction around the rotation axis A. Therefore, at the first relative rotational position, an effective magnetic force (a magnetic force capable of moving the second magnet piece M2) is generated between the first magnet piece M1 and the second magnet piece M2, and no effective magnetic force (a magnetic force capable of moving the third magnet piece M3) is generated between the first magnet piece M1 and the third magnet piece M3. Similarly, at the second relative rotational position, no effective magnetic force is generated between the first magnet piece M1 and the second magnet piece M2, and an effective magnetic force is generated between the first magnet piece M1 and the third magnet piece M3. Thereby, the centering pin CP and the holding pin HP can be selectively operated.

[0131] By providing the centering pin CP and the holding pin HP individually, the centering pin CP can have a configuration suitable for centering the substrate W, and the holding pin HP can have a configuration suitable for holding the substrate W. Thereby, both the centering of the substrate W and the holding of the substrate W can be performed with high accuracy.

[0132] In this embodiment, a rotation restricting link 27 is provided to restrict relative rotation between the holding plate 11 and the spin base 21 by an uneven coupling in which the holding plate 11 and the spin base 21 approach each other due to the vertical movement of the suction chuck 10 by the vertical movement unit 70. By the vertical movement of the suction chuck 10, the rotation restricting link 27 can be engaged / disengaged. In the released state of the rotation restricting link 27, the rotational force of the rotation drive unit 60 can be transmitted only to the suction chuck 10. In the engaged state of the rotation restricting link 27, the rotational force of the rotation drive unit 60 is transmitted to the suction chuck 10 and further transmitted to the spin base 21. Therefore, the rotation drive unit 60 can be used as a common drive source for the rotation of the suction chuck 10 and the mechanical chuck 20.

[0133] In this embodiment, when the substrate W is held by the suction chuck 10, processing (bevel processing) of the peripheral edge of the substrate W is performed. Since the suction chuck 10 sucks and holds the substrate W, the substrate W can be held without contacting the peripheral edge of the substrate W. Therefore, by performing bevel processing while holding the substrate W with the suction chuck 10, the peripheral edge of the substrate W can be processed without any gaps.

[0134] In this embodiment, when the substrate W is held by the holding pins HP of the mechanical chuck 20, processing of the lower surface of the substrate W is performed. Since the holding pins HP contact the peripheral end surface of the substrate W to hold the substrate W, the processing of the lower surface of the substrate W is not hindered. Therefore, good processing of the lower surface of the substrate W is possible.

[0135] Further, the substrate processing unit 100 of this embodiment executes a substrate processing method including: a step of placing a substrate W on a suction chuck 10 having an upward-facing substrate holding surface 14 (step S2); a step of centering the substrate W on the substrate holding surface 14 (step S3); after the centering, a step of sucking and holding the substrate W with the suction chuck 10 (step S4); a peripheral processing step of processing the peripheral edge portion of the substrate W while rotating the suction chuck 10 around a vertical rotation axis A with the substrate W sucked and held by the suction chuck 10 (steps S6, S7); releasing the suction holding of the substrate W by the suction chuck 10, passing the substrate W from the suction chuck 10 to a holding pin HP of a mechanical chuck 20 disposed below the suction chuck 10, and holding the substrate W by bringing the holding pin HP of the mechanical chuck 20 into contact with the peripheral end surface of the substrate W in a state where the lower surface of the substrate W is separated above the suction chuck 10 (steps S9, S10, S11); and a lower surface processing step of processing the lower surface of the substrate W held by the mechanical chuck 20 while rotating the mechanical chuck 20 holding the substrate W around the rotation axis A (steps S12, S13).

[0136] According to this method, after centering the substrate W on the substrate holding surface 14 of the suction chuck 10, the substrate W is sucked and held by the suction chuck 10. Therefore, the substrate W is sucked by the suction chuck 10 in a state centered with respect to the rotation axis A. In that state, by rotating the suction chuck 10 around the rotation axis A while processing the peripheral portion of the substrate W, the peripheral portion of the substrate W can be accurately processed. More specifically, the processing width of the peripheral portion of the substrate can be precisely controlled. Since the suction chuck 10 can hold the substrate W without contacting the peripheral portion of the substrate W, the peripheral portion of the substrate W can be processed without any limitation. On the other hand, after the processing of the peripheral portion of the substrate W, the suction holding of the suction chuck 10 is released, and the substrate W is transferred to the mechanical chuck 20 disposed below the suction chuck 10. The mechanical chuck 20 holds the substrate W by bringing the holding pins HP into contact with the peripheral end surface of the substrate W in a state where the lower surface of the substrate W is spaced above the suction chuck 10. Then, while rotating the mechanical chuck 20 around the rotation axis A, the lower surface of the substrate W is processed. Since the mechanical chuck 20 can hold the substrate W without contacting the lower surface of the substrate W, it does not inhibit the processing of the lower surface of the substrate W. Thus, by transferring the substrate W from the suction chuck 10 sharing the rotation axis A to the mechanical chuck 20, the processing of the peripheral portion (bevel processing) of the substrate W and the processing of the lower surface of the substrate W can be continuously performed (more specifically, within the same chamber 1). Thereby, the productivity of substrate processing can be improved.

[0137] FIG. 9 is a cross-sectional view for explaining a configuration example of a substrate processing unit 100 according to a second embodiment of the present invention. In this embodiment, the centering pin driving mechanism 30 includes a slide-type driving mechanism similar to the holding pin driving mechanism 40. That is, the centering pin driving mechanism 30 is coupled to the lower end of the centering pin CP and includes a slider 35 held by the spin base 21 so as to be slidable in the radial direction (rotational radius direction) with respect to the rotation axis A, and a spring 36 that biases the slider 35 in the opening direction away from the rotation axis A. The second magnet piece M2 is fixed to the slider 35. When the suction head 12 is lowered, the first magnet piece M1 is disposed at a position closer to the rotation axis A than the second magnet piece M2, and due to the suction magnetic force therebetween, the slider 35 moves closer to the rotation axis A against the force of the spring 36. Thereby, the centering pin CP moves closer to the rotation axis A and enters a closed state in which it contacts the peripheral end surface of the substrate W. When the suction head 12 rises, the magnetic force between the first magnet piece M1 and the second magnet piece M2 weakens, so that the slider 35 moves in a direction away from the rotation axis A by the force of the spring 36, and the centering pin CP enters an open state and separates from the peripheral surface of the substrate W.

[0138] Other configurations are substantially the same as those of the first embodiment.

[0139] FIG. 10 is a cross-sectional view for explaining a configuration example of a substrate processing unit 100 according to a third embodiment of the present invention. In this embodiment, the holding pin driving mechanism 40 does not include the third magnet piece M3 and is configured to open and close the holding pin HP without using magnetic force. A lever 43 is coupled to the lower end of the holding pin HP, and the lever 43 is coupled to the spin base 21 so as to be swingable about a swing axis 43b extending in the circumferential direction (tangential direction). The operation end 43a of the lever 43 is arranged to be pushed downward by the pressing portion 44 of the holding plate 11 when the suction chuck 10 descends. When the operation end 43a of the lever 43 is pushed downward, the lever 43 swings, and the tip of the holding pin HP is displaced toward the rotation axis A. Thereby, the holding pin HP is in a closed state, and the holding groove 57 at the head of the holding pin HP holds the peripheral portion of the substrate W. When the suction chuck 10 ascends, the downward pressing force on the operation end 43a of the lever 43 is removed. Thereby, the holding pin HP and the lever 43 return to their initial positions by gravity, and accordingly, the holding pin HP is in an open state. A spring for biasing the holding pin HP to the open state may be provided.

[0140] Regarding other configurations, they are substantially the same as those in the first embodiment or the second embodiment.

[0141] FIG. 11A and FIG. 11B are diagrams for explaining a fourth embodiment of the present invention, and show a configuration example for driving a holding pin HP by magnetic repulsive force. The holding pin HP has a shaft portion 45 coupled to a spin base 21 rotatably about a rotation axis 47 along the vertical direction, and a contact portion 46 provided eccentrically with respect to the rotation axis 47 at the tip of the shaft portion 45. Therefore, when the shaft portion 45 rotates about the rotation axis 47, it switches between a closed state (see FIG. 11B) in which the contact portion 46 contacts the peripheral end surface of the substrate W and an open state (see FIG. 11A) in which the contact portion 46 retreats from the peripheral end surface of the substrate W. A first lever 48 and a second lever 49 are coupled to the shaft portion 45. One end of a spring 50 that biases the shaft portion 45 in the open direction is coupled to the first lever 48, and the other end of the spring 50 is coupled to the spin base 21. A third magnet piece M3 is fixed to the second lever 49. When the suction chuck 10 is brought close to the mechanical chuck 20, the shaft portion 45 rotates in the closing direction against the biasing force of the spring 50 due to the repulsive magnetic force acting between the first magnet piece M1 and the third magnet piece M3. Thereby, the contact portion 46 can be moved toward the peripheral end surface of the substrate W, and the holding pin HP can be set in the closed state (see FIG. 11B).

[0142] This configuration can also be applied to the drive mechanism of the centering pin CP.

[0143] As described above, the embodiments of the present invention have been described, but the present invention can also be implemented in other forms.

[0144] For example, in the above-described embodiment, the mechanical chuck 20 includes the centering pin CP and the holding pin HP, and has both a centering function and a substrate holding function. However, it may be configured to omit the holding pin HP and have only the centering function. Alternatively, it may be configured to omit the centering pin CP and have only the substrate holding function.

[0145] Further, in the above-described embodiment, both the first magnet piece M1 and the second magnet piece M2 are permanent magnets, but one of them may be a ferromagnetic material other than a permanent magnet, that is, a ferromagnetic material with a small coercive force or residual magnetic flux density. Similarly, one of the first magnet piece M1 and the third magnet piece M3 may be a ferromagnetic material other than a permanent magnet, that is, a ferromagnetic material with a small coercive force or residual magnetic flux density.

[0146] Also, in the above-described embodiment, a plurality of first magnet pieces M1 and a plurality of second magnet pieces M2 having the same number and arrangement as the first magnet pieces M1 are provided, but the present invention is not limited to this. For example, two of the three centering pins CP may be fixed pins and one may be a movable pin, and one first magnet piece M1 and one second magnet piece M2 arranged to match the first magnet piece M1 may be provided. Further, one of the three centering pins CP may be a fixed pin and two may be movable pins, and two first magnet pieces M1 and two second magnet pieces M2 arranged to match the first magnet pieces M1 may be provided. Of course, when providing four or more movable centering pins CP, correspondingly, four or more first magnet pieces M1 and four or more second magnet pieces M2 having the same number and arrangement as the first magnet pieces M1 may be provided.

[0147] The same applies to the holding pins HP. That is, in the above-described embodiment, a plurality of first magnet pieces M1 and a plurality of third magnet pieces M3 having the same number and arrangement as the first magnet pieces M1 are provided, but the present invention is not limited to this. For example, two of the three holding pins HP may be fixed pins and one may be a movable pin, and one first magnet piece M1 and one third magnet piece M3 arranged to match the first magnet piece M1 may be provided. Further, one of the three holding pins HP may be a fixed pin and two may be movable pins, and two first magnet pieces M1 and two third magnet pieces M3 arranged to match the first magnet pieces M1 may be provided. Of course, when providing four or more movable holding pins HP, correspondingly, four or more first magnet pieces M1 and four or more third magnet pieces M3 having the same number and arrangement as the first magnet pieces M1 may be provided.

[0148] In the above-described embodiment, the suction chuck 10 has the form of a vacuum chuck having a suction port 13 in the suction head 12. However, the suction chuck 10 may have the form of a Bernoulli chuck that blows compressed gas from a nozzle provided on the substrate holding surface 14 and sucks and holds the substrate W by utilizing the Bernoulli effect.

[0149] In the above-described embodiment, the rotation restricting link 27 is configured such that the connecting pin P provided on the holding plate 11 of the suction chuck 10 engages with the connecting recesses R1, R2 provided on the spin base 21 of the mechanical chuck 20. However, the connecting pin P may be provided on the spin base 21, and the corresponding connecting recesses R1, R2 may be provided on the holding plate 11.

[0150] In the above-described embodiment, the rotation restricting link 27 is in an engaged state at both the first relative rotation position and the second relative rotation position. However, for example, it may be configured to be in an engaged state only at the second relative rotation position where the mechanical chuck 20 is rotated together with the suction chuck 10. Further, while configuring the rotation restricting link 27 to be in an engaged state only at the first relative rotation position for centering, another rotation driving device for rotationally driving the mechanical chuck 20 may be provided.

[0151] In addition, various design changes can be made within the scope of the matters described in the claims.

Explanation of Reference Numerals

[0152] 5: Upper nozzle 6: Lower nozzle 10: Suction chuck 11: Holding plate 12: Suction head 14: Substrate holding surface 15: Inner rotation shaft 20: Mechanical chuck 21: Spin base 22: Outer rotation shaft 27: Rotation restricting link 28: Chuck stop mechanism 30: Centering Pin Driving Mechanism 40: Holding Pin Driving Mechanism 57: Holding Groove 60: Rotary Driving Unit 70: Vertical Movement Unit 80: First Processing Fluid Supply Mechanism 85: Second Processing Fluid Supply Mechanism 90: Nozzle Movement Mechanism 100: Substrate Processing Unit 105: Suction Mechanism 110: Gas Supply Mechanism 120: Control Device A: Rotation Axis CP: Centering Pin HP: Holding Pin M1: First Magnet Piece M2: Second Magnet Piece M3: Third Magnet Piece P: Connecting Pin R1: First Connecting Recess R2: Second Connecting Recess W: Substrate

Claims

1. A suction chuck having a holding plate with an upward-facing substrate holding surface, for sucking and holding a substrate on the substrate holding surface, a rotation drive unit for rotating the suction chuck about a rotation axis along the vertical direction, a facing member disposed below the holding plate and facing the holding plate from below, a vertical movement unit for moving the suction chuck relatively up and down with respect to the facing member, a first ferromagnetic piece provided on the holding plate, a second ferromagnetic piece movably provided on the facing member and driven by a magnetic force generated between the second ferromagnetic piece and the first ferromagnetic piece according to the distance from the first ferromagnetic piece, an opening and closing pin provided on the facing member, operating as the second ferromagnetic piece moves, and coming into contact with or separating from the peripheral end surface of the substrate when the substrate is held on the substrate holding surface of the suction chuck, A substrate processing apparatus comprising the above.

2. The substrate processing apparatus according to claim 1, wherein at least one of the first ferromagnetic piece and the second ferromagnetic piece is a permanent magnet.

3. The substrate processing apparatus according to claim 1 or 2, wherein the opening and closing pin includes a centering pin for centering the substrate on the substrate holding surface with respect to the rotation axis.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the opening and closing pin includes a holding pin for receiving and holding the substrate from the suction chuck.

5. The substrate processing apparatus according to any one of claims 1 to 4, further comprising a rotation restricting link for restricting relative rotation of the holding plate and the facing member by an uneven engagement in which the holding plate and the facing member approach and engage with each other by vertical movement of the suction chuck by the vertical movement unit.

6. The substrate processing apparatus according to any one of claims 1 to 5, wherein the facing member is rotatable about the rotation axis.

7. Including a plurality of the opening and closing pins respectively arranged to be able to contact different positions of the peripheral end surface of the substrate, The substrate processing apparatus according to any one of claims 1 to 6, further comprising a link mechanism provided on the facing member for commonly transmitting the movement of the second ferromagnetic piece to the plurality of the opening and closing pins.

8. A suction chuck having a holding plate with an upward-facing substrate holding surface, for sucking and holding a substrate on the substrate holding surface, a rotation drive unit for rotating the suction chuck about a rotation axis along the vertical direction, An opposing member disposed below the holding plate and facing the holding plate from below, A vertical movement unit that vertically moves the suction chuck relative to the opposing member, A first ferromagnetic body piece provided on the holding plate, A second ferromagnetic body piece movably provided on the opposing member and driven by a magnetic force generated between the second ferromagnetic body piece and the first ferromagnetic body piece according to the distance from the first ferromagnetic body piece, A first opening and closing pin provided on the opposing member, operating as the second ferromagnetic body piece moves, and coming into contact with and separating from the peripheral end surface of the substrate when the substrate is held on the substrate holding surface of the suction chuck, A second opening and closing pin provided on the opposing member, operating as the suction chuck moves vertically by the vertical movement unit, and coming into contact with and separating from the peripheral end surface of the substrate when the substrate is held on the substrate holding surface of the suction chuck, A substrate processing apparatus including the above.

9. When the suction chuck approaches the opposing member in a state where the suction chuck is at a first relative rotational position with respect to the opposing member, the second ferromagnetic body piece moves and the first opening and closing pin approaches the peripheral end surface of the substrate. The substrate processing apparatus according to claim 8, wherein when the suction chuck approaches the opposing member in a state where the suction chuck is at a second relative rotational position different from the first relative rotational position with respect to the opposing member, the second opening and closing pin operates to approach the peripheral end surface of the substrate.

10. The substrate processing apparatus according to claim 8 or 9, wherein at least one of the first ferromagnetic body piece and the second ferromagnetic body piece is a permanent magnet.

11. Further including a third ferromagnetic body piece disposed at a distance from the second ferromagnetic body piece in the circumferential direction around the rotation axis, movably provided on the opposing member, and driven by a magnetic force generated between the third ferromagnetic body piece and the first ferromagnetic body piece according to the distance from the first ferromagnetic body piece. The substrate processing apparatus according to any one of claims 8 to 10, wherein the second opening and closing pin operates as the third ferromagnetic body piece moves.

12. The substrate processing apparatus according to claim 11, wherein at least one of the first ferromagnetic body piece and the third ferromagnetic body piece is a permanent magnet.

13. The substrate processing apparatus according to any one of claims 8 to 12, wherein the first opening and closing pin includes a centering pin for centering the substrate on the substrate holding surface with respect to the rotation axis.

14. The substrate processing apparatus according to any one of claims 8 to 13, wherein the second opening and closing pin includes a holding pin that receives and holds a substrate from the suction chuck.

15. The substrate processing apparatus according to any one of claims 8 to 14, further comprising a rotation restricting link that restricts relative rotation of the holding plate and the opposing member by an uneven engagement in which the holding plate and the opposing member approach and engage with each other by vertical movement of the suction chuck by the vertical movement unit.

16. The substrate processing apparatus according to claim 9, further comprising a rotation restricting link that restricts relative rotation of the holding plate and the opposing member by an uneven engagement in which the holding plate and the opposing member approach and engage with each other by vertical movement of the suction chuck by the vertical movement unit, wherein the rotation restricting link restricts relative rotation of the holding plate and the opposing member at at least one of the first relative rotation position and the second relative rotation position.

17. The substrate processing apparatus according to any one of claims 8 to 16, wherein the opposing member is rotatable about the rotation axis.

18. The substrate processing apparatus according to any one of claims 8 to 17, further comprising peripheral processing means for processing a peripheral portion of the substrate when the substrate is held by the suction chuck.

19. The second opening and closing pin is a holding pin that receives and holds a substrate from the suction chuck, The substrate processing apparatus according to any one of claims 8 to 18, further comprising lower surface processing means for processing a lower surface of the substrate when the substrate is held by the holding pin.

20. A method of processing a substrate by a substrate processing apparatus including a suction chuck having a holding plate with an upward-facing substrate holding surface, a first ferromagnetic piece provided on the holding plate, an opposing member disposed below the suction chuck and facing the holding plate from below, a mechanical chuck having a holding pin that operates by vertical movement of the suction chuck, and a third ferromagnetic piece movably provided on the opposing member and driven by a magnetic force generated between the third ferromagnetic piece and the first ferromagnetic piece according to a distance from the first ferromagnetic piece to operate the holding pin, the method comprising: placing a substrate on the substrate holding surface of the suction chuck; centering the substrate on the substrate holding surface; after the centering, sucking and holding the substrate with the suction chuck; While the substrate is sucked and held by the suction chuck, a peripheral edge processing step of processing the peripheral edge of the substrate while rotating the suction chuck around a vertical rotation axis; Releasing the suction holding of the substrate by the suction chuck, lowering the suction chuck and operating the holding pins to transfer the substrate from the suction chuck to the holding pins, and bringing the holding pins into contact with the peripheral end surface of the substrate in a state where the lower surface of the substrate is separated above the suction chuck, and holding the substrate by the mechanical chuck; A lower surface processing step of processing the lower surface of the substrate held by the mechanical chuck while rotating the mechanical chuck holding the substrate around the rotation axis; A substrate processing method including the above steps.

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