Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Abstract

To provide a semiconductor manufacturing apparatus capable of manufacturing a high-performance semiconductor device.SOLUTION: A semiconductor manufacturing apparatus comprises: a first roller; and a second roller. The first roller performs a first peeling of a peeling tape from a first end part to a substrate that includes a first substrate surface and a second substrate surface that is opposite to the first substrate surface and is provided onto the first substrate surface, and includes a protection tape adhered to the second substrate surface and a band-like shape, includes a first end part and a second end part, and includes the peeling tape that is adhered to the protection tape on the second substrate surface, while performing a first movement parallel to the second substrate surface toward an upper side of the peeling tape provided onto the center or the neighbor of the second substrate surface from the upper side of the first end part of the peeling tape; and a second roller that performs a second peeling of the peeling tape from the second end part toward the upper side of the peeling tape provided onto the center or the neighbor of the second substrate surface from the upper side of the second end part of the peeling tape while performing a second movement in a direction opposite the direction of the first movement and in parallel to the second substrate surface.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device.

Background Art

[0002] Semiconductor devices such as MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) are used in applications such as power conversion.

[0003] In the manufacture of such semiconductor devices, a protective tape such as a back grind tape (BG tape) is attached to the substrate surface of a wafer (substrate). When peeling this protective tape, a peeling tape is used. Specifically, the peeling tape is attached on the protective tape, and by peeling the peeling tape, the protective tape is peeled from the substrate surface together with the peeling tape.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem to be solved by the present invention is to provide a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device capable of manufacturing a high-performance semiconductor device.

Means for Solving the Problems

[0006] The semiconductor manufacturing apparatus according to the embodiment includes a substrate having a first substrate surface and a second substrate surface provided on the first substrate surface facing the first substrate surface, a protective tape attached to the second substrate surface, and a strip-shaped tape having a first end and a second end. The substrate has a peeling tape attached over the second substrate surface. With respect to the substrate, a first roller performs a first peeling of the peeling tape from the first end while performing a first movement parallel to the second substrate surface from above the first end of the peeling tape toward the peeling tape provided above the center or near the center of the second substrate surface, and a second roller performs a second peeling of the peeling tape from the second end while performing a second movement parallel to the second substrate surface and in the opposite direction of the first movement from above the second end of the peeling tape toward the peeling tape provided above the center or near the center of the second substrate surface.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

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Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same members and the like are denoted by the same reference numerals, and the description of the members and the like that have been described once will be omitted as appropriate.

[0009] In this specification, in order to indicate the positional relationship of components and the like, the upward direction of the drawing is described as "up" and the downward direction of the drawing is described as "down". In this specification, the concepts of "up" and "down" are not necessarily terms indicating the relationship with the direction of gravity.

[0010] (First Embodiment) The semiconductor manufacturing apparatus of the present embodiment is a substrate having a first substrate surface and a second substrate surface facing the first substrate surface and provided on the first substrate surface, a protective tape attached to the second substrate surface, and a strip-shaped shape, having a first end portion and a second end portion, and having a peeling tape attached over the second substrate surface to the protective tape. With respect to the substrate, while performing a first movement parallel to the second substrate surface from above the first end portion of the peeling tape toward the peeling tape provided above the center of the second substrate surface or in the vicinity thereof, a first roller that performs a first peeling of the peeling tape from the first end portion, and while performing a second movement parallel to the second substrate surface and in the opposite direction of the first movement from above the second end portion of the peeling tape toward the peeling tape provided above the center of the second substrate surface or in the vicinity thereof, a second roller that performs a second peeling of the peeling tape from the second end portion.

[0011] The manufacturing method of the semiconductor device according to the present embodiment is a substrate having a first substrate surface and a second substrate surface facing the first substrate surface and provided on the first substrate surface, the protective tape attached to the second substrate surface, and a strip-shaped shape having a first end and a second end. The substrate having the peeling tape attached over the second substrate surface is provided with a first roller from above the first end of the peeling tape toward the peeling tape provided above the center or near the center of the second substrate surface, and the first peeling of the peeling tape is performed from the first end while performing a first movement parallel to the second substrate surface. And a step of performing a second peeling of the peeling tape from the second end while performing a second movement parallel to the second substrate surface and in the opposite direction of the first movement from above the second end of the peeling tape toward the peeling tape provided above the center or near the center of the second substrate surface.

[0012] FIG. 1 is a schematic diagram showing the substrate 2, the protective tape 10, and the peeling tape 20 according to the present embodiment. FIG. 1(a) is a schematic top view of the substrate 2, the protective tape 10, and the peeling tape 20 according to the present embodiment. FIG. 1(b) is a schematic cross-sectional view of a part of the substrate 2, the protective tape 10, and the peeling tape 20 according to the present embodiment.

[0013] The substrate 2 contains a semiconductor material. Here, the semiconductor material is, for example, Si (silicon), SiC (silicon carbide), GaAs (gallium arsenide), or GaN (gallium nitride), etc., but is not limited thereto. The substrate 2 is a substrate on which semiconductor devices such as MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) and IGBTs (Insulated Gate Bipolar Transistors) are formed, for example. The semiconductor manufacturing apparatus according to the present embodiment is used in the step of singulating the substrate 2 by dicing or the like to manufacture a semiconductor device (semiconductor chip) having the above semiconductor device.

[0014] The substrate 2 has a diameter d1. The substrate 2 has a first substrate surface 2a and a second substrate surface 2b that faces the first substrate surface 2a and is provided on the first substrate surface 2a. In FIG. 1(a), the center O of the second substrate surface 2b is also shown.

[0015] Here, an X direction, a Y direction that intersects perpendicularly to the X direction, and a Z direction that intersects perpendicularly to the X direction and the Y direction are defined. It is assumed that the first substrate surface 2a and the second substrate surface 2b are provided parallel to the XY plane.

[0016] The protective tape 10 is provided on the second substrate surface 2b. The protective tape 10 has a first adhesive layer 12. And due to the first adhesive layer 12, the protective tape 10 is attached to the second substrate surface 2b. When a semiconductor device such as a MOSFET or an IGBT is formed on the substrate 2, in order to reduce the on-resistance, the thickness of the substrate 2 is reduced by grinding the first substrate surface 2a to reduce the on-resistance. The protective tape 10 is used to protect circuit patterns such as MOSFETs and IGBTs formed on the second substrate surface 2b at this time. The protective tape 10 is, for example, a back grinding tape. Also, the protective tape 10 is used to protect the substrate 2 during the subsequent process flow. The semiconductor manufacturing apparatus and the method for manufacturing a semiconductor device of the present embodiment are used for peeling such a protective tape 10.

[0017] Note that the protective tape 10 may be attached to the ground substrate surface. For example, consider a substrate 2 in which a circuit pattern of a MOSFET or an IGBT is formed on the first substrate surface 2a and the second substrate surface 2b is ground to reduce the thickness. In such a case, the protective tape 10 may be attached to the second substrate surface 2b. The semiconductor manufacturing apparatus and the method for manufacturing a semiconductor device of the present embodiment are preferably also used for peeling the protective tape 10 attached to the ground second substrate surface 2b.

[0018] In addition, the protective tape 10 may be attached to a substrate surface that does not have circuit patterns of MOSFETs or IGBTs and is not ground. For example, consider a substrate 2 in which circuit patterns of MOSFETs or IGBTs are formed on the first substrate surface 2a and the second substrate surface 2b is not ground. In such a case, the protective tape 10 may be attached to the second substrate surface 2b. The semiconductor manufacturing apparatus and the method of manufacturing a semiconductor device according to the present embodiment are preferably used also for peeling the protective tape 10 attached to the second substrate surface 2b that does not have circuit patterns of MOSFETs or IGBTs and is not ground.

[0019] Hereinafter, description will be made on the assumption that the first substrate surface 2a is ground and circuit patterns such as MOSFETs and IGBTs are formed on the second substrate surface 2b.

[0020] The semiconductor manufacturing apparatus and the method of manufacturing a semiconductor device according to the present embodiment are particularly preferably used when the diameter d2 of the protective tape 10 is shorter than the diameter d1 of the substrate 2.

[0021] The peeling tape 20 is provided on the protective tape 10. The peeling tape 20 has, for example, a strip shape with a width d3 that is shorter than the diameter d1 of the substrate 2 and shorter than the diameter d2 of the protective tape 10. Note that the width d3 of the peeling tape may be longer than the diameter d1 of the substrate 2. The peeling tape 20 is provided across the second substrate surface 2b over the second substrate surface 2b. The peeling tape 20 has a second adhesive layer 22. Then, the peeling tape 20 is attached to the protective tape 10 by the second adhesive layer 22. The peeling tape 20 has a first end 20a and a second end 20b. Note that the peeling tape 20 may each have a further extended portion from the first end 20a and the second end 20b. The peeling tape 20 is used to peel the protective tape 10 from the second substrate surface 2b.

[0022] Note that the protective tape 10 may further have an adhesive layer (not shown) that adheres to the second adhesive layer 22, for example.

[0023] The notch 2c of the substrate 2 is provided, for example, on the lower side of the drawing in FIG. 1(a). However, the notch 2c may be provided, for example, on the upper side, left side, or right side of the drawing in FIG. 1(a). Further, the notch 2c may not be provided. Furthermore, instead of the notch 2c, an orientation flat may be provided.

[0024] FIG. 2 is a schematic diagram of the semiconductor manufacturing apparatus 100 of the present embodiment.

[0025] Note that the illustration of the first adhesive layer 12 and the second adhesive layer 22 is omitted.

[0026] Here, a case where the protective tape 10 attached to the second substrate surface 2b of the substrate 2 thinned by back grinding is peeled off using the peeling tape 20 will be described. On the first substrate surface 2a of the substrate 2, convex portions 2d are provided to maintain the strength of the substrate 2 even when the substrate 2 is thinned. Note that the semiconductor manufacturing apparatus 100 of the present embodiment can be preferably applied to a substrate 2 that is not thinned and does not have the convex portions 2d.

[0027] The stage 4 is a stage on which the substrate 2 is placed. The stage 4 is movable in the Y direction while holding the substrate 2, for example, by a vacuum suction mechanism (not shown).

[0028] Here, the Z direction is, for example, the opposite direction of the vertical direction. The stage 4 holds the first substrate surface 2a and the second substrate surface 2b horizontally.

[0029] The first peeling roller 40 (an example of the first roller) is provided above the substrate 2. The first peeling roller 40 is a roller for folding and peeling the peeling tape 20 when peeling the peeling tape 20 from the first end portion 20a. The first peeling roller 40 is rotatable within the YZ plane. The first peeling roller 40 is movable in the vertical direction, for example, by a cylinder 44 connected to the first peeling roller 40. Further, for example, the cylinder 44 is movable in the Y direction on the substrate 2 using a slider 42 provided in a rail 46. Thereby, the first peeling roller 40 is movable in the Y direction on the substrate 2. Note that the means for making the first peeling roller 40 movable in the vertical direction and the Y direction is not limited to the above.

[0030] The first pasting roller 36 is provided above the substrate 2. The first pasting roller 36 is for pressing and pasting the peeling tape 20 onto the protective tape 10. Note that the first pasting roller 36 is movable in the vertical direction and the Y direction, for example, by a cylinder 39 connected to the first pasting roller 36 and a slider 38 connected to the cylinder 39.

[0031] The first heater 32 is provided above the substrate 2. The first heater 32 is provided for more firmly pasting the peeling tape 20 to the protective tape 10 by heating the first end portion 20a of the peeling tape 20 pasted on the protective tape 10. Further, the first heater 32 is provided for reducing the adhesive force of the first adhesive layer 12 by heating the first end portion 20a of the peeling tape 20 pasted on the protective tape 10. Note that the first heater 32 is movable in the vertical direction and the Y direction, for example, by a cylinder 35 connected to the first heater 32 and a slider 34 connected to the cylinder 35.

[0032] The second peeling roller 60 (an example of the second roller) is provided above the substrate 2. The second peeling roller 60 is a roller for folding back and peeling the peeling tape 20 when peeling the peeling tape 20 from the second end portion 20b. The second peeling roller 60 is rotatable in the YZ plane. The second peeling roller 60 is movable in the vertical direction, for example, by a cylinder 64 connected to the second peeling roller 60. Further, for example, the cylinder 64 is movable in the Y direction on the substrate 2 using a slider 62 provided in a rail 46. Thereby, the second peeling roller 60 is movable in the Y direction on the substrate 2. Note that the means for making the second peeling roller 60 movable in the vertical direction and the Y direction is not limited to the above.

[0033] The second pasting roller 56 is provided above the substrate 2. The second pasting roller 56 is for pressing and pasting the peeling tape 20 onto the protective tape 10. Note that the second pasting roller 56 is movable in the vertical direction and the Y direction, for example, by a cylinder 59 connected to the second pasting roller 56 and a slider 58 connected to the cylinder 59.

[0034] The second heater 52 is provided above the substrate 2. The second heater 52 is provided to more firmly attach the peeling tape 20 to the protective tape 10 by heating the second end portion 20b of the peeling tape 20 pasted on the protective tape 10. Further, the second heater 52 is provided to reduce the adhesive force of the first adhesive layer 12 by heating the second end portion 20b of the peeling tape 20 pasted on the protective tape 10. Note that the second heater 52 is movable in the vertical direction and the Y direction, for example, by a cylinder 55 connected to the second heater 52 and a slider 54 connected to the cylinder 55.

[0035] Note that the peeling tape 20 and the protective tape 10 peeled off by the first peeling roller 40 and the second peeling roller 60 are wound up using, for example, a winding roller (not shown).

[0036] FIG. 3 is a schematic diagram of a main part of a semiconductor manufacturing apparatus according to another aspect of the present embodiment. The peeling tape 20 peeled off by the first peeling roller 40 may be folded upward by the folding roller 47. For example, such a folding roller 47 is movable in the vertical direction and the Y direction by a cylinder 48 connected to the folding roller 47 and a slider 49 connected to the cylinder 48. Also, the peeling tape 20 peeled off by the second peeling roller 60 may be similarly folded upward by a folding roller (not shown).

[0037] FIGS. 4 to 6 are schematic diagrams for explaining a method of manufacturing a semiconductor device according to the present embodiment. In FIGS. 4 to 6, illustration of the first heater 32, the slider 34, the cylinder 35, the first sticking roller 36, the cylinder 39, the slider 38, the second heater 52, the slider 54, the cylinder 55, the second sticking roller 56, the slider 58, and the cylinder 59 is omitted.

[0038] First, using the first sticking roller 36, the first end portion 20a of the peeling tape 20 is pressed against and stuck onto the protective tape 10. Also, using the second sticking roller 56, the second end portion 20b of the peeling tape 20 is pressed against and stuck onto the protective tape 10. Similarly, the peeling tape 20 is stuck onto the protective tape 10 over the second substrate surface 2b.

[0039] Next, using the first heater 32, the first end portion 20a of the peeling tape 20 is heated. Also, using the second heater 52, the second end portion 20b of the peeling tape 20 is heated. Similarly, the peeling tape 20 is heated over the second substrate surface 2b.

[0040] Next, the first peeling roller 40 is moved in the Y direction parallel to the second substrate surface 2b (an example of the first movement) from above the first end portion 20a toward the peeling tape 20 provided above the center O or in the vicinity thereof on the second substrate surface 2b using the slider 42. Thereby, the first peeling of the peeling tape 20 from the first end portion 20a is performed. Here, it is preferable that the shape of the folding of the peeling tape 20 by the first peeling roller 40 is as constant as possible. In other words, the movement of the first peeling roller 40 in the Y direction is performed so that the shape of the folding of the peeling tape 20 by the first peeling roller 40 is as constant as possible.

[0041] Further, the second peeling roller 60 is moved in the Y direction parallel to the second substrate surface 2b (an example of the second movement) from above the second end portion 20b toward the peeling tape 20 provided above the center O or in the vicinity thereof on the second substrate surface 2b using the slider 62. Thereby, the second peeling of the peeling tape 20 from the second end portion 20b is performed. Here, it is preferable that the shape of the folding of the peeling tape 20 by the second peeling roller 60 is as constant as possible. In other words, the movement of the second peeling roller 60 in the -Y direction is performed so that the shape of the folding of the peeling tape 20 by the second peeling roller 60 is as constant as possible (FIGS. 4 and 5).

[0042] In this way, the protective tape 10 is peeled off (FIG. 6).

[0043] Here, the step of performing the first peeling and the step of performing the second peeling are preferably performed simultaneously. Also, the first distance of the first movement and the second distance of the second movement are preferably equal.

[0044] Further, if there is no slippage or the like between the first peeling roller 40 and the peeling tape 20, the first distance of the first movement is equal to the first peeling amount of the first peeling of the peeling tape 20. Also, if there is no slippage or the like between the second peeling roller 60 and the peeling tape 20, the second distance of the second movement is equal to the second peeling amount of the second peeling of the peeling tape 20.

[0045] Next, the effects of the semiconductor manufacturing apparatus and the method of manufacturing a semiconductor device according to the present embodiment will be described.

[0046] When attaching the protective tape 10 to the substrate 2, there are two cases to consider: attaching a protective tape 10 having a diameter larger than the diameter d1 of the substrate 2 and attaching a protective tape 10 having a diameter smaller than the diameter d1 of the substrate 2. Here, when attaching a protective tape 10 having a diameter larger than the diameter d1 of the substrate 2, when inserting the substrate 2 with the protective tape 10 attached into a substrate cassette or the like, the first adhesive layer 12 of the protective tape 10 protruding from the substrate 2 adheres to the inside of the substrate cassette, and there is a problem that the substrate cassette is contaminated. Further, when flowing the substrate 2 in a subsequent process, there is a problem that the first adhesive layer 12 of the protective tape 10 protruding from the substrate 2 adheres to another semiconductor manufacturing apparatus, and the other semiconductor manufacturing apparatus is contaminated. Therefore, from the above viewpoints, it is preferable to attach a protective tape 10 having a diameter smaller than the diameter d1 of the substrate 2.

[0047] FIG. 7 is a schematic cross-sectional view for explaining the stress applied to the first adhesive layer 12 when peeling the protective tape 10 using the peeling tape 20 in the semiconductor manufacturing apparatus of the comparative form of the present embodiment. In the semiconductor manufacturing apparatus of the comparative form, the protective tape 10 is peeled in one direction using the peeling tape 20. In FIG. 7, the explanation will be made assuming that the protective tape 10 is peeled in the Y direction. In the vicinity of the peeling start point shown in FIG. 7(a), since a strong bending stress is not applied to the first adhesive layer 12, it is considered that the first adhesive layer 12 is not brittlely fractured. However, in the vicinity of the peeling end point shown in FIG. 7(b), a strong bending stress is applied to the first adhesive layer 12, and it is considered that the first adhesive layer 12 is brittlely fractured. The remaining first adhesive layer 12 may contaminate other semiconductor manufacturing apparatuses used in subsequent processes or may have an adverse effect on the characteristics of the semiconductor device formed on the substrate 2.

[0048] FIG. 8 is a diagram schematically showing the first adhesive layer 12 remaining on the second substrate surface 2b when the protective tape 10 is peeled off using the semiconductor manufacturing apparatus of the comparative form of the present embodiment. As described above, the first adhesive layer 12 remains near the peeling end point of the protective tape 10. Here, the length d4 of the portion where the first adhesive layer 12 remains in the direction parallel to the peeling direction of the protective tape 10 is about 30% of the diameter d1 of the substrate 2.

[0049] In addition, the amount of the remaining first adhesive layer 12 was particularly large when the protective tape 10 having a diameter smaller than the diameter d1 of the substrate 2 was attached.

[0050] In order to remove such a remaining first adhesive layer 12, for example, it is conceivable to clean the substrate 2 using an organic solvent. However, there is a problem that the manufacturing process increases and the semiconductor device becomes more expensive.

[0051] Therefore, the semiconductor manufacturing apparatus of the present embodiment performs a first movement parallel to the second substrate surface from above the first end portion toward the center of the second substrate surface while performing a first peeling of the peeling tape from the first end portion, A first roller that performs a second peeling of the peeling tape from the second end portion while performing a second movement in a direction opposite to the first movement and parallel to the second substrate surface from above the second end portion toward the center.

[0052] By performing the first peeling while performing the first movement with the first peeling roller 40 and performing the second peeling while performing the second movement in the direction opposite to the first movement with the second peeling roller 60, the shape of the peeling tape 20 folded by the first peeling roller 40 and the second peeling roller 60 can be made as constant as possible. Therefore, it is possible to prevent a strong stress from being applied to the first adhesive layer 12 at and near the portion where the peeling of the protective tape 10 ends. As a result, the remaining of the first adhesive layer 12 on the second substrate surface 2b is suppressed, and thus the adverse effect on the characteristics of the formed semiconductor device is suppressed. Therefore, it is possible to provide a high-performance semiconductor device.

[0053] The step of performing the first peeling and the step of performing the second peeling are preferably performed simultaneously. Also, the first distance of the first movement and the second distance of the second movement are preferably equal. The substrate 2 is fixed to the stage 4 by vacuum suction or the like. Here, when the step of performing the first peeling and the step of performing the second peeling are performed simultaneously, the force applied to the substrate 2 by the first peeling and the force applied to the substrate 2 by the second peeling cancel each other out. Therefore, it is less likely that the substrate 2 will shift from the stage 4. However, when the first peeling and the second peeling are not performed simultaneously, the force applied to the substrate 2 by the first peeling and the force applied to the substrate 2 by the second peeling do not cancel each other out, so the substrate 2 is likely to shift from the stage 4. Also, when the first distance of the first movement and the second distance of the second movement are not equal, the substrate 2 is likely to shift from the stage 4.

[0054] According to the semiconductor manufacturing apparatus of the present embodiment, it is possible to provide a semiconductor manufacturing apparatus capable of manufacturing a high-performance semiconductor device. According to the method of manufacturing a semiconductor device of the present embodiment, it is possible to provide a manufacturing method capable of manufacturing a high-performance semiconductor device.

[0055] (Second Embodiment) The semiconductor manufacturing apparatus of the present embodiment includes a substrate having a first substrate surface and a second substrate surface provided on the first substrate surface facing the first substrate surface, a protective tape attached to the second substrate surface, and a peeling tape having a strip shape and attached to the protective tape on the second substrate surface at the first substrate end of the substrate. A cutting mechanism for cutting the peeling tape, a roller for peeling the peeling tape by moving parallel to the second substrate surface from above the first substrate end toward the center of the second substrate surface or the vicinity thereof, and a rotation mechanism for rotating the substrate in a plane parallel to the second substrate surface.

[0056] The manufacturing method of the semiconductor device of the present embodiment is a substrate having a first substrate surface and a second substrate surface provided on the first substrate surface facing the first substrate surface, and with respect to the substrate having a protective tape attached to the second substrate surface, a first peeling tape having a strip shape is attached to the protective tape on the second substrate surface at the first substrate end of the substrate, and while performing a first movement of a roller parallel to the second substrate surface from above the first substrate end toward the center of the second substrate surface or its vicinity, the first peeling of the first peeling tape is performed to peel the protective tape from the second substrate surface, the first peeling tape is cut, a first peeling tape residue is formed on the protective tape, the substrate is rotated in a plane parallel to the second substrate surface, and a second peeling tape having a strip shape with a width shorter than the diameter of the substrate is attached to the protective tape on the second substrate surface at the second substrate end of the substrate, and while performing a second movement of a roller parallel to the second substrate surface from above the second substrate end toward the center of the second substrate surface or its vicinity, the second peeling of the second peeling tape is performed to peel the protective tape from the second substrate surface.

[0057] Here, the description of the content overlapping with the first embodiment is omitted.

[0058] FIG. 9 is a schematic diagram of the semiconductor manufacturing apparatus 110 of the present embodiment.

[0059] The stage 4 has a rotation mechanism 6 for rotating in a plane parallel to the XY plane. The rotation mechanism 6 is, for example, a motor. Thereby, the substrate 2 is rotatable in a plane parallel to the second substrate surface 2b.

[0060] The cutting mechanism 74 is provided for cutting the peeling tape 20. The cutting mechanism 74 is, for example, a tape cutter. Note that the cutting mechanism 74 is movable in the vertical direction and the Y direction by, for example, a cylinder 73 connected to the cutting mechanism 74 and a slider 72 connected to the cylinder 73.

[0061] In the semiconductor manufacturing apparatus 110, for example, the second heater 52, slider 54, cylinder 55, second sticking roller 56, slider 58, cylinder 59, second peeling roller 60, slider 62, and cylinder 64 may not be provided.

[0062] FIGS. 10 to 12 are schematic diagrams for explaining the method of manufacturing a semiconductor device according to the present embodiment. Note that the illustration of the first heater 32, slider 34, cylinder 35, first sticking roller 36, slider 38, and cylinder 39 is omitted.

[0063] First, using the first sticking roller 36, the first peeling tape 20c is pressed against and stuck onto the protective tape 10 on the second substrate surface 2b of the first substrate end 2e. Next, the first peeling tape 20c is heated using the first heater 32.

[0064] Next, using the slider 42, the first peeling roller 40 is moved in the Y direction parallel to the second substrate surface 2b from above the first substrate end 2e toward the center O or the vicinity thereof on the second substrate surface 2b. Thereby, the first peeling of the first peeling tape 20c is performed (FIG. 10).

[0065] By the above-described first peeling, the protective tape 10 on the first substrate end 2e is peeled off from the substrate 2. Next, a part of the first peeling tape 20c is cut using the cutting mechanism 74. Thereby, a first peeling tape remainder 21a is formed from a part of the first peeling tape 20c on the protective tape 10 on the first substrate end 2e (FIG. 11).

[0066] Next, using the rotation mechanism 6 of the stage 4, for example, the substrate 2 is rotated 180 degrees in a horizontal plane (a plane parallel to the first substrate surface 2a and the second substrate surface 2b).

[0067] Next, using the first sticking roller 36, the second peeling tape 20d is pressed against and stuck onto the protective tape 10 on the second substrate surface 2b of the second substrate end 2f. Next, the second peeling tape 20d is heated using the first heater 32.

[0068] Next, the first peeling roller 40 is moved in the second moving direction in the Y direction parallel to the second substrate surface 2b from above the second substrate end 2f toward the center O of the second substrate surface 2b or its vicinity using the slider 42. Thereby, the second peeling of the second peeling tape 20d is performed. Thereby, the entire protective tape 10 is peeled from the substrate 2 (FIG. 12).

[0069] FIG. 13 is a schematic diagram for explaining a method of manufacturing a semiconductor device according to the present embodiment. FIG. 13 is a diagram schematically showing the position where the second peeling tape 20d is attached.

[0070] In FIGS. 10 to 12, the case where the substrate 2 is rotated 180 degrees in the horizontal plane (in a plane parallel to the first substrate surface 2a and the second substrate surface 2b) has been described as an example. In this case, the first substrate end 2e and the second substrate end 2f are provided to face each other with the center O of the second substrate surface 2b interposed therebetween. Therefore, the first peeling tape 20c and the second peeling tape 20d are provided to face each other with the center O of the second substrate surface 2b interposed therebetween.

[0071] However, for example, a peeling tape 20e may be attached near a location provided at a location where the substrate 2 is rotated 90 degrees from the first substrate end 2e, such as the substrate end 2g.

[0072] However, it is preferable that the first peeling tape 20c and the second peeling tape 20d are provided facing each other with the center O of the second substrate surface 2b therebetween. For example, consider a case where the peeling tape 20c is attached to the substrate end 2e to peel off a part of the protective tape 10, and then the peeling tape 20e is attached to the substrate end 2g to peel off a part of the protective tape 10. In this case, for example, it is considered that the first adhesive layer 12 remains near the substrate end 2h provided opposite to the center O of the second substrate surface 2b across the substrate end 2g. In order to suppress this, it is considered that the peeling tape 20 is attached near the substrate end 2h to peel off the protective tape 10. In other words, it is considered that the protective tape 10 is peeled off using the three peeling tapes 20, namely, the peeling tape 20c, the peeling tape 20e, and the peeling tape 20 near the substrate end 2h. However, if this is done, the number of locations where the peeling tape 20 is attached increases, and the number of steps for peeling the protective tape 10 increases.

[0073] On the other hand, when the first peeling tape 20c and the second peeling tape 20d are provided facing each other with the center O of the second substrate surface 2b therebetween, the entire protective tape 10 can be peeled off while suppressing the residue of the first adhesive layer 12.

[0074] It is preferable to peel the protective tape 10 from the second substrate surface 2b by 30% or more of the diameter d1 of the substrate 2 by the first peeling and the second peeling. When the protective tape 10 is peeled in one direction, in the direction parallel to the peeling direction of the protective tape 10, the length d4 of the portion where the first adhesive layer 12 remains near the peeling end point is about 30% of the diameter d1 of the substrate 2. This is illustrated in FIG. 8.

[0075] Therefore, in both the first peeling and the second peeling, the protective tape 10 is peeled by 30% or more of the diameter d1 of the substrate 2. This means that the protective tape 10 is peeled by 30% or more of the diameter d1 of the substrate 2 near the peeling start point.

[0076] As a result, in the subsequent peeling, since the protective tape 10 has already been peeled at a distance of about 30% of the diameter d1 of the substrate 2 near the peeling end point, a strong stress is not applied to the first adhesive layer 12. Therefore, the residue of the first adhesive layer 12 can be suppressed.

[0077] According to the semiconductor manufacturing apparatus of the present embodiment, it is possible to provide a semiconductor manufacturing apparatus capable of manufacturing a high-performance semiconductor device. According to the method of manufacturing a semiconductor device of the present embodiment, it is possible to provide a manufacturing method capable of manufacturing a high-performance semiconductor device.

[0078] Although some embodiments and examples of the present invention have been described, these embodiments and examples are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and its equivalent scope.

Explanation of Reference Numerals

[0079] 2: Substrate 2a: First substrate surface 2b: Second substrate surface 2e: First substrate end 2f: Second substrate end 6: Rotation mechanism 10: Protective tape 20: Peeling tape 20a: First end 20b: Second end 20c: First peeling tape 20d: Second peeling tape 21a: Remaining part of the first peeling tape 40: First peeling roller (first roller, roller) 60: Second peeling roller (second roller) 74: Cutting mechanism 100: Semiconductor manufacturing apparatus 110: Semiconductor manufacturing apparatus O: Center

Claims

1. A substrate having a first substrate surface and a second substrate surface provided on the first substrate surface facing the first substrate surface, a protective tape attached to the second substrate surface, a peeling tape having a strip shape and having a first end portion and a second end portion, and being attached to the protective tape over the second substrate surface, with respect to the substrate, a first roller that performs a first peeling of the peeling tape from the first end portion while performing a first movement parallel to the second substrate surface from above the first end portion of the peeling tape toward the peeling tape provided above the center or near the center of the second substrate surface, a second roller that performs a second peeling of the peeling tape from the second end portion while performing a second movement parallel to the second substrate surface and in the opposite direction of the first movement from above the second end portion of the peeling tape toward the peeling tape provided above the center or near the center of the second substrate surface, A semiconductor manufacturing apparatus comprising the above.

2. By the first peeling and the second peeling, the protective tape is peeled from the second substrate surface, The semiconductor manufacturing apparatus according to Claim 1.

3. A substrate having a first substrate surface and a second substrate surface provided on the first substrate surface facing the first substrate surface, a protective tape attached to the second substrate surface, a peeling tape having a strip shape and having a first end portion and a second end portion, and being attached to the protective tape over the second substrate surface, with respect to the substrate, a step of performing a first peeling of the peeling tape from the first end portion by moving a first roller from above the first end portion of the peeling tape toward the peeling tape provided above the center or near the center of the second substrate surface while performing a first movement parallel to the second substrate surface, a step of performing a second peeling of the peeling tape from the second end portion by moving a second roller from above the second end portion of the peeling tape toward the peeling tape provided above the center or near the center of the second substrate surface while performing a second movement parallel to the second substrate surface and in the opposite direction of the first movement, A method for manufacturing a semiconductor device comprising the above.

4. The step of performing the first peeling and the step of performing the second peeling are performed simultaneously, The method for manufacturing a semiconductor device according to Claim 3.

5. By the first peeling and the second peeling, the protective tape is peeled from the second substrate surface, The method for manufacturing a semiconductor device according to Claim 3 or Claim 4.

6. The diameter of the protective tape is shorter than the diameter of the substrate. The method for manufacturing a semiconductor device according to any one of claims 3 to 5.

7. A substrate having a first substrate surface and a second substrate surface provided on the first substrate surface and facing the first substrate surface, With respect to the substrate having the protective tape attached to the second substrate surface, A first peeling tape having a strip shape is attached to the protective tape on the second substrate surface at the first substrate end of the substrate, While performing a first movement of the roller parallel to the second substrate surface from above the first substrate end toward the center or the vicinity thereof on the second substrate surface, the first peeling of the first peeling tape is performed, thereby peeling the protective tape from the second substrate surface. The first peeling tape is cut to form a first peeling tape residue on the protective tape. The substrate is rotated in a plane parallel to the second substrate surface. A second peeling tape having a strip shape with a width shorter than the diameter of the substrate is attached to the protective tape on the second substrate surface at the second substrate end of the substrate. While performing a second movement of the roller parallel to the second substrate surface from above the second substrate end toward the center or the vicinity thereof on the second substrate surface, the second peeling of the second peeling tape is performed, thereby peeling the protective tape from the second substrate surface. The method for manufacturing a semiconductor device.

8. The diameter of the protective tape is shorter than the diameter of the substrate. The method for manufacturing a semiconductor device according to claim 7.

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