Transfer device, resin molding device, and method for manufacturing a resin molded product

Abstract

To enable positioning of a molding object with respect to a pot block having an overhanging portion.SOLUTION: A transport device 13 that transports a molding object W1 to a lower mold 15 provided with a pot block 141 having an overhanging portion 141b includes a substrate holding portion 3 that holds the molding object W1, and a holding portion moving mechanism 4 that moves the substrate holding portion 3, the holding portion moving mechanism 4 moves the substrate holding portion 3 toward the pot block 141 in a state where the molding object W1 is separated from the lower mold 15, and brings the molding object W1 into contact with the side surface 141c below the overhanging portion 141b of the pot block 141, and the substrate holding portion 3 releases the holding of the molding object W1 after the molding object W1 comes into contact with the side surface 141c by the holding portion moving mechanism 4.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a conveying device, a resin molding device, and a method for manufacturing a resin molded product.

Background Art

[0002] Conventionally, as a conveying device for conveying a molding object to a lower mold provided with a cal block having an overhanging portion, the one shown in Patent Document 1 has been considered.

[0003] Specifically, this conveying device is configured to move the molding object toward the cal block by the first contact portion (pushing pin) of the first moving mechanism after placing the molding object on the upper surface of the lower mold, and to position the pot-side end surface of the molding object in contact with the end surface of the cal block.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, for example, when a pilot pin for alignment is provided on the lower mold, the molding object may interfere with the pilot pin, and it may not be possible to bring the pot-side end surface of the molding object into contact with the end surface of the cal block. Further, for example, when a release film is provided on the lower mold, there is a risk that the first contact portion (pushing pin) may contact the release film and cause a molding defect. Here, although it is conceivable to form a relief groove or the like in the release film, the cost increases. Furthermore, for example, when an electronic component is fixed to the lower surface of the molding object, if the molding object is moved while being placed on the lower mold, the electronic component fixed to the lower surface of the molding object may be damaged.

[0006] Therefore, the present invention has been made to solve the above problems, and for example, even when a pilot pin or a release film is provided on the lower mold, or when an electronic component is fixed to the lower surface of the object to be molded, the main object is to enable the transfer device to position the object to be molded with respect to the lower mold.

Means for Solving the Problems

[0007] That is, the transfer device according to the present invention is a transfer device that transfers an object to be molded to a lower mold provided with a pot block having an overhanging portion, and includes a substrate holding portion that holds the object to be molded, and a holding portion moving mechanism that moves the substrate holding portion, and the holding portion moving mechanism moves the substrate holding portion toward the pot block in a state where the object to be molded is separated from the lower mold, and brings the object to be molded into contact with the side surface below the overhanging portion in the pot block, and the substrate holding portion releases the holding of the object to be molded after the object to be molded comes into contact with the side surface by the holding portion moving mechanism.

Advantages of the Invention

[0008] According to the present invention configured as described above, even when a pilot pin or a release film is provided on the lower mold, or when an electronic component is fixed to the lower surface of the object to be molded, etc., the transfer device can position the object to be molded with respect to the lower mold.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Embodiments for Carrying Out the Invention

[0010] Next, the technology according to the present invention will be described in more detail with examples. However, the present invention is not limited by the following technology.

[0011] The transfer device of Technology 1 according to the present invention is a transfer device that transfers a molding object to a lower mold provided with a pot block having an overhanging portion, and includes a substrate holding portion that holds the molding object and a holding portion moving mechanism that moves the substrate holding portion. The holding portion moving mechanism moves the substrate holding portion toward the pot block in a state where the molding object is separated from the lower mold, and brings the molding object into contact with the side surface below the overhanging portion in the pot block. After the molding object contacts the side surface by the holding portion moving mechanism, the substrate holding portion releases the holding of the molding object. With this transfer device, in a state where the molding object is separated from the lower mold, the molding object is brought into contact with the side surface below the overhanging portion in the pot block, and then the holding of the molding object is released. Therefore, for example, when a pilot pin or a release film is provided on the lower mold, or when an electronic component is fixed to the lower surface of the molding object, the molding object can be positioned and carried into the lower mold. And since the molding object positioned by the transfer device can be resin-sealed, the generation of resin burrs can be reduced, and a high-quality resin molded product can be manufactured.

[0012] The transfer device of Technology 2 according to the present invention, in addition to the configuration of Technology 1 above, is characterized in that the holding portion moving mechanism horizontally moves the substrate holding portion toward the pot block in a state where the molding object is at a height position between the upper surface of the lower mold and the overhanging portion, and brings the molding object into contact with the side surface. With this configuration, since the molding object is horizontally moved, the side surface below the overhanging portion of the pot block and the pot-side end surface of the molding object can be surely brought into contact.

[0013] As a specific embodiment of the substrate holding portion, the following can be considered. That is, the transfer device of Technology 3 according to the present invention, in addition to the configuration of Technology 1 or 2 above, is characterized in that the substrate holding portion includes holding claws that hook and hold the molding object and a holding claw driving mechanism that releases the holding by the holding claws.

[0014] In addition to the configuration of the above-described Technique 3, the transfer device of Technique 4 according to the present invention further includes a base member provided such that the holding claws are at least movable up and down. It is conceivable that the holding claws receive the object to be molded from the outside at a position where they are raised with respect to the base member, and release the holding of the object to be molded at a position where they are lowered with respect to the base member. And, in the transfer device of Technique 4 according to the present invention, in order for the holding claws to receive the object to be molded at a position where they are raised with respect to the base member and release the holding of the object to be molded at a position where they are lowered with respect to the base member, the holding claw drive mechanism includes a holding claw drive portion provided on the base member, a first transmission portion that transmits the driving force from the holding claw drive portion to the holding claws at a position where the holding claws are raised with respect to the base member, and a second transmission portion that transmits the driving force from the holding claw drive portion to the holding claws at a position where the holding claws are lowered with respect to the base member.

[0015] In the present invention, in order to move the substrate holding portion holding the object to be molded toward the pot block, there is a risk that the holding claws of the substrate holding portion may interfere with the pot block. For this reason, the transfer device of Technique 5 according to the present invention is characterized in that, in addition to the configuration of the above-described Technique 3 or 4, a recess for avoiding interference with the holding claws is formed in the pot block.

[0016] The transfer device of Technique 6 according to the present invention is characterized in that, in addition to any one of the configurations of the above-described Techniques 1 to 5, the substrate holding portion includes a guide member that guides the object to be molded, the holding of which has been released, to the upper surface of the lower mold. With this configuration, since the object to be molded, the holding of which has been released, is guided by the guide member when it falls onto the upper surface of the lower mold, it is possible to maintain a state in which the pot-side end face of the object to be molded is in contact with the side surface of the pot block. As a result, the object to be molded is placed on the lower mold in a positioned state.

[0017] The transfer device of Technology 7 according to the present invention, in addition to any one of the configurations of the above-mentioned Technologies 1 to 6, is characterized in that the substrate holding portion includes a pressing member that presses the object to be molded placed on the lower mold, and an elevating mechanism that moves the pressing member up and down with respect to the object to be molded. With this configuration, by pressing the object to be molded placed on the lower mold with the pressing member, warping of the object to be molded can be suppressed.

[0018] The transfer device of Technology 8 according to the present invention, in addition to the configuration of the above-mentioned Technology 1 or 2, is characterized in that the substrate holding portion includes a pressing member that presses the object to be molded placed on the lower mold, an elevating mechanism that moves the pressing member up and down with respect to the object to be molded, holding claws that are provided movably in the vertical direction on the pressing member and hook and hold the object to be molded, and a stopper mechanism that holds the holding claws at a predetermined height position so that the holding claws do not contact the lower mold when the pressing member descends. With this configuration, since holding claws are provided on the pressing member, it is possible to reduce the size compared to a configuration in which the pressing member and the holding claws are provided separately. And in such a configuration in which holding claws are provided on the pressing member, when the pressing member is lowered to press the object to be molded placed on the lower mold, the holding claws provided movably in the vertical direction on the pressing member are held at a predetermined height position by the stopper mechanism, so that it is possible to prevent the holding claws from contacting the lower mold or the release film provided on the lower mold.

[0019] The transfer device of Technology 9 according to the present invention, in addition to the configuration of the above-mentioned Technology 8, is characterized in that the substrate holding portion further includes a guide member that is provided movably in the vertical direction on the pressing member and guides the object to be molded whose holding has been released to the upper surface of the lower mold, and the stopper mechanism holds the guide member at a predetermined height position so that the guide member does not contact the lower mold when the pressing member descends. With this configuration, since the pressing member is provided with the guide member, it is possible to reduce the size compared to a configuration in which the pressing member and the guide member are provided separately. And, in the configuration in which the guide member is provided on the pressing member in this way, when the pressing member is lowered to press the object to be molded placed on the lower mold, the guide member provided movably in the vertical direction on the pressing member is held at a predetermined height position by the stopper mechanism, so that it is possible to prevent the guide member from contacting the lower mold or the release film provided on the lower mold.

[0020] In addition to the configuration of the above-described technique 9, the conveying device of technique 10 according to the present invention is characterized in that the guide member is provided so as to be movable between a guide position for guiding the object to be molded to the upper surface of the lower mold and a retracted position retracted from the guide position, and is configured to be in the guide position by receiving the elastic force of an elastic member and to be movable to the retracted position as the pressing member moves. With this configuration, it is possible to configure a structure in which the guide member does not interfere when the object to be molded is transferred to the holding claws or when the pressing member presses the object to be molded.

[0021] Moreover, a resin molding apparatus having any one of the conveying devices of the above-described techniques 1 to 10 is also an aspect of the present invention.

[0022] Furthermore, a method for conveying an object to be molded using any one of the conveying devices of the above-described techniques 1 to 10, the method comprising moving the object to be molded toward the pot block in a state where the object to be molded is separated from the lower mold, bringing the object to be molded into contact with a side surface below the overhanging portion of the pot block, and releasing the holding of the object to be molded after the object to be molded has come into contact with the side surface is also an aspect of the present invention.

[0023] Moreover, a method for manufacturing a resin molded product obtained by resin molding an object to be molded, the method comprising a positioning step of positioning the object to be molded with respect to the pot block by any one of the conveying devices of the above-described techniques 1 to 10, and a molding step of performing resin molding in a state where the object to be molded is positioned, is also an aspect of the present invention.

[0024] <One Embodiment of the Present Invention> Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. Note that, for the sake of clarity, all the figures shown below are schematically drawn with appropriate omissions or exaggerations. The same reference numerals are given to the same components, and the description thereof will be omitted as appropriate.

[0025] <Overall Configuration of the Resin Molding Apparatus> The resin molding apparatus 100 of the present embodiment resin-molds a molding object W1 to which an electronic component Wx is fixed by transfer molding using a resin material J. Note that the molding object W1 has a rectangular shape in plan view.

[0026] Here, examples of the molding object W1 include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc., regardless of the presence or absence of wiring. Further, the resin material J for resin molding is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is granular, powdery, liquid, sheet-like, tablet-like, or the like. Examples of the electronic component Wx include electronic elements such as semiconductor chips, resistor elements, capacitor elements, or electronic components in which at least one of these electronic elements is resin-sealed.

[0027] Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes, as components, a supply module 100A that supplies the molding object W1 and the resin material J before molding, a molding module 100B that performs resin molding, and a storage module 100C that stores the molding object W2 (hereinafter, the resin molded product W2) after molding. Note that the supply module 100A, the molding module 100B, and the storage module 100C can be detachably attached to and exchanged with respect to each other and other components.

[0028] The supply module 100A is provided with a molding object supply unit 11 that supplies the molding object W1, a resin material supply unit 12 that supplies the resin material J, and a transfer device 13 (hereinafter referred to as loader 13) that receives the molding object W1 from the molding object supply unit 11 and conveys it to the molding module 100B, and receives the resin material J from the resin material supply unit 12 and conveys it to the molding module 100B.

[0029] The loader 13 travels back and forth between the supply module 100A and the molding module 100B, and moves along a rail (not shown) provided across the supply module 100A and the molding module 100B. The details of the loader 13 will be described later.

[0030] As shown in FIG. 2, the molding module 100B is provided with a resin injection part 14, a lower mold 15 in which a cavity 15a into which the resin material J is injected is formed, an upper mold 16 provided opposite to the lower mold 15 and in which a cavity 16a into which the resin material J is injected is formed, and a mold clamping mechanism 17 that clamps the lower mold 15 and the upper mold 16. The lower mold 15 is provided on a movable platen 101 that moves up and down by the mold clamping mechanism 17 via a lower platen 102. The upper mold 16 is provided on an upper fixed platen (not shown) via an upper platen 103. Note that FIG. 2 shows only one side (left side) of the resin injection part 14 and omits the other side (right side), but the configuration on the other side in FIG. 2 is the same as that on one side.

[0031] The resin injection part 14 of the present embodiment includes a pot block 141 in which a pot 141a for accommodating the resin material J is formed, and a transfer mechanism 142 having a plunger 142a provided in the pot 141a. Here, the transfer mechanism 142 has a plunger 142a for pressure-feeding the resin material J accommodated in the pot 141a, and a plunger drive part 142b that drives the plunger 142a. Note that the plunger 142a pressure-feeds the resin material J that has been heated and melted in the pot 141a.

[0032] The pot block 141 is provided on the lower mold 15 and is elastically supported by an elastic member 144 so as to be movable up and down with respect to the lower mold 15. Further, a projecting portion 141b that projects onto the mold surface, which is the upper surface of the lower mold 15, is formed at the upper end portion of the pot block 141. In a state where the upper mold 16 and the lower mold 15 are clamped, the upper surface of the projecting portion 141b contacts the upper mold 16, and the lower surface thereof sandwiches the object to be molded W1 between the mold surface of the lower mold 15 (see Fig. 2(b)). Further, the projecting portion 141b becomes a portion that projects above the resin molded product W2 in a state where the upper mold 16 and the lower mold 15 are opened after resin molding (see Fig. 2(c)). Furthermore, a runner portion and a gate portion (both not shown), which serve as resin flow paths for introducing the resin material J injected from the pot 141a into the cavities 15a and 16a, may be formed on the upper surface of the pot block 141.

[0033] The cavity 15a of the lower mold 15 is for resin-sealing the lower surface of the object to be molded W1, and the cavity 16a of the upper mold 16 is for resin-sealing the upper surface of the object to be molded W1. Here, at least one of the cavity 15a of the lower mold 15 or the cavity 16a of the upper mold 16 houses the electronic component Wx of the object to be molded W1.

[0034] Further, a recess 16b is formed in a portion of the upper mold 16 that faces the projecting portion 141b of the pot block 141, and a runner portion 16c that connects the runner portion, the gate portion, and the cavities 15a and 16a is formed. Note that a runner portion that connects the runner portion, the gate portion, and the cavities 15a and 16a may be formed on the lower mold 15. Although not shown, an air vent is formed on the lower mold 15 or the upper mold 16 on the side opposite to the pot block 141. The runner portion, the runner portion, and the gate portion serve as resin flow paths, and the molten resin material J is supplied from the pot to the cavity.

[0035] Then, as shown in Fig. 2(b), when the lower mold 15 and the upper mold 16 are clamped by the clamping mechanism 17, the pot block 141 descends, and the pot-side end portion of the object to be molded W1 is clamped between the lower surface of the protruding portion 141b of the pot block 141 and the upper surface of the lower mold 15. When the molten resin material J is injected into the cavities 15a and 16a by the plunger 142a in this state, the electronic component Wx of the object to be molded W1 is resin-sealed.

[0036] The storage module 100C is provided with a storage portion 18 for storing the resin molded product W2, and a transfer device 19 (hereinafter referred to as the unloader 19) that receives the resin molded product W2 from the molding module 100B and transfers it to the storage portion 18.

[0037] The unloader 19 travels between the molding module 100B and the storage module 100C, and moves along a rail (not shown) provided across the molding module 100B and the storage module 100C.

[0038] The basic operation of this resin molding apparatus 100 will be briefly described with reference to Fig. 2. The following operations are performed, for example, by a control unit (not shown) provided in the supply module 100A controlling each part.

[0039] With the lower mold 15 and the upper mold 16 in the open mold state, the object to be molded W1 is conveyed by the loader 13 and placed on the lower mold 15 as shown in Fig. 2(a). At this time, the upper mold 16 and the lower mold 15 are heated to a temperature at which the resin material J can be melted and cured. Also, the resin material J is conveyed by the loader 13 and accommodated in the pot 141a of the pot block 141.

[0040] In this state, when the lower mold 15 is raised by the mold clamping mechanism 17, as shown in FIG. 2(b), the pot block 141 hits the upper mold 16 and descends with respect to the lower mold 15, and the lower surface of the protruding portion 141b comes into contact with the pot-side end portion of the object to be molded W1. Further, the lower surface of the upper mold 16 comes into contact with the object to be molded W1 except for the cavity 16a and the vent portions. As a result, the lower mold 15 and the upper mold 16 are clamped. When the plunger 142a is raised by the plunger driving unit 142b after this clamping, the molten resin material J in the pot 141a is injected into the cavities 15a and 16a through the resin flow path. After the resin material J has hardened in the cavities 15a and 16a, the mold is opened by the mold clamping mechanism 17 as shown in FIG. 2(c). By this mold opening, the pot block 141 rises with respect to the lower mold 15, and the unnecessary resin K on the pot block 141 is separated from the resin molded product W2 (gate break). Thereafter, the resin molded product W2 is carried out by the unloader 19 and conveyed to the storage unit 18.

[0041] <Specific configuration of the loader 13> Next, the specific configuration of the loader 13 in the present embodiment will be described with reference to FIGS. 3 to 14. In FIGS. 3, 4, 7 to 14, the illustration of the electronic component Wx is omitted. Further, FIGS. 4, 6 to 12 show only the other side (right side) of the resin injection unit 14, and the one side (left side) is omitted, but the configuration of the one side in FIGS. 4, 6 to 12 is the same as that of the other side. Furthermore, in FIGS. 4, 7 to 12, the illustration of the upper mold 16 is omitted.

[0042] As shown in FIGS. 3, 4, 7 to 13, the loader 13 includes a base member 2 provided so as to be movable along a rail (not shown), a substrate holding unit 3 provided on the base member 2 for holding the object to be molded W1, and a holding unit moving mechanism 4 for moving the substrate holding unit 3 toward the pot block 141 with respect to the base member 2. The base member 2 is provided with a resin holding unit (not shown) for holding the resin material J.

[0043] As shown in FIGS. 3, 4, 6 to 13, the substrate holding unit 3 includes a holding mechanism 5 that holds the object to be molded W1, a pressing member 6 that presses the object to be molded W1 placed on the lower mold 15, and a lifting mechanism 7 that moves the pressing member 6 up and down.

[0044] As shown in FIGS. 3, 4, 6 to 13, the holding mechanism 5 has a pair of holding claws 51 that hook and hold both ends of the object to be molded W1, and a holding claw driving mechanism 52 that expands or contracts the distance between the holding claws 51. By reducing the distance between the holding claws 51 by the holding claw driving mechanism 52, at least a part of the lower surface of the object to be molded W1 is supported and held, and by expanding the distance between the holding claws 51, the holding of the object to be molded W1 is released.

[0045] The holding claws 51 of the present embodiment are configured to hook and hold the pot-side end of the object to be molded W1 and the end opposite to the pot-side end. In this configuration, in order to avoid interference between the holding claws 51 and the pot block 141, as shown in FIGS. 4 and 5, etc., the pot block 141 is formed with recesses 141K that avoid interference with the holding claws 51 at locations corresponding to the holding claws 51.

[0046] Further, the holding claws 51 are provided on the pressing member 6 so as to be movable in the vertical direction. Specifically, the holding claws 51 are provided on a shaft member 53 that is provided on the pressing member 6 so as to be movable in the vertical direction, whereby the holding claws 51 are movable in the vertical direction on the pressing member 6.

[0047] Here, as shown in FIGS. 3, 4, 7 to 13, the shaft member 53 is provided at both ends of the pressing member 6 so as to correspond to both ends of the object W1 to be formed. Further, the shaft member 53 is rotatably supported around the central axis of the shaft member 53 by a support block 55 in order to expand or contract the distance between the holding claws 51. Further, a guide mechanism 54 for guiding the vertical movement of the support block 55 (shaft member 53) with respect to the pressing member 6 is provided between the support block 55 and the pressing member 6. The guide mechanism 54 has, for example, a rail member provided along the vertical direction on the pressing member 6 and a slide member provided on the support block 55 and sliding on the rail member.

[0048] As shown in FIGS. 3, 4, 6 to 13, the holding claw drive mechanism 52 includes a holding claw drive unit 521 provided in a housing portion (not shown) of the loader 13 and a transmission mechanism 522 that transmits the driving force from the holding claw drive unit 521 to the holding claws 51. Here, the holding claw drive unit 521 is configured using, for example, an air cylinder.

[0049] The transmission mechanism 522 transmits the driving force from the holding claw drive unit 521 to the shaft member 53 provided with the holding claws 51 to rotate the shaft member 53. When the shaft member 53 rotates, the distance between the holding claws 51 is expanded or contracted.

[0050] Specifically, the transmission mechanism 522 includes a link portion 522a that rotates the shaft member 53 by the driving force from the holding claw drive unit 521, a first transmission portion 522b and a second transmission portion 522c interposed between the link portion 522a and the holding claw drive unit 521, and a guide mechanism 522d that contacts the holding claw drive unit 521 and transmits the driving force to the link portion 522a.

[0051] The link portion 522a connects the two shaft members 53 provided on the base member 2, and is for switching between the holding state in which the holding claws 51 hold the object to be molded W1 and the release state in which the holding claws 51 release the holding of the object to be molded W1. Specifically, the link portion 522a has a connecting link portion 522a1 that connects the two shaft members 53, and an operating lever portion 522a2 that is connected to the connecting link portion 522a1 and to which the driving force from the holding claw driving portion 521 acts.

[0052] In this embodiment, since the pressing member 6 moves up and down with respect to the base member 2, the shaft member 53 (holding claw 51) provided on the pressing member 6 also moves up and down with respect to the base member 2. That is, the operating lever portion 522a2 of the link portion 522a connected to the shaft member 53 also moves up and down with respect to the base member 2.

[0053] Here, the first transmission portion 522b transmits the driving force from the holding claw driving portion 521 to the holding claw 51 at the position where the operating lever portion 522a2 has risen with respect to the base member 2 (see FIGS. 4, 12, and 13). Specifically, the first transmission portion 522b has a contact portion such as a contact roller that moves by the holding claw driving portion 521 and acts on the risen operating lever portion 522a2. Note that the position where the operating lever portion 522a2 has risen with respect to the base member 2 is the position in a state where the pressing member 6 is at a second height position R described later.

[0054] Also, the second transmission portion 522c transmits the driving force from the holding claw driving portion 521 to the holding claw 51 at the position where the operating lever portion 522a2 has descended with respect to the base member 2 (see FIGS. 7 to 11). Specifically, the second transmission portion 522c has a contact portion such as a contact roller that moves by the holding claw driving portion 521 and acts on the descended operating lever portion 522a2. Note that the position where the operating lever portion 522a2 has descended with respect to the base member 2 is the position in a state where the pressing member 6 is at a first height position P described later.

[0055] Here, when a driving force is applied to the operating lever portion 522a2 (pressing member 6) by the first transmission portion 522b at a position where the operating lever portion 522a2 has risen with respect to the base member 2 (second height position R), the distance between the holding claws 51 increases, and the object to be molded W1 can be received (see FIG. 13). That is, the position where this operating lever portion 522a2 (pressing member 6) has risen with respect to the base member 2 (second height position R) is the receiving position where the holding claws 51 of the substrate holding portion 3 receive the object to be molded W1.

[0056] Further, when a driving force is applied to the operating lever portion 522a2 by the second transmission portion 522c at a position where the operating lever portion 522a2 (pressing member 6) has descended with respect to the base member 2 (first height position P), the distance between the holding claws 51 increases, and the holding of the object to be molded W1 can be released. That is, the position where this operating lever portion 522a2 (pressing member 6) has descended with respect to the base member 2 (first height position P) is the transfer height position where the holding claws 51 of the substrate holding portion 3 release the holding of the object to be molded W1.

[0057] As shown in FIGS. 3 and 6, the above-described first transmission portion 522b and second transmission portion 522c are configured such that their movements are guided by a guide mechanism 522d. The guide mechanism 522d has a guide rail provided on the base member 2 and a slide member slidably provided on the guide rail. The guide rail is provided along the direction in which the first transmission portion 522b and the second transmission portion 522c operate the operating lever portion 522a2.

[0058] As shown in FIGS. 3, 4, 7 to 13, the pressing member 6 suppresses the warping of the object to be molded W1 by pressing the outer peripheral edge of the object to be molded W1. A pressing portion (not shown) that contacts, for example, the outer peripheral edge of the object to be molded W1 is provided on the lower surface of the pressing member 6, and a recess (not shown) for accommodating the electronic component Wx mounted on the object to be molded W1 is formed. The pressing member 6 is provided so as to be movable in the vertical direction with respect to the base member 2 by, for example, two connecting shafts 60. Note that the connecting shaft 60 of the present embodiment penetrates the base member 2 and is connected to each other by a connecting bar 61 above the base member 2.

[0059] As shown in FIGS. 3, 4, 6 to 13, the lifting mechanism 7 is provided on the base member 2 and adjusts the height position of the pressing member 6 with respect to the lower mold 15 or the object to be molded W1 placed on the lower mold 15.

[0060] Specifically, the lifting mechanism 7 has a first lifting part 71 that moves up and down between a first height position P (see FIGS. 7 to 10) where the pressing member 6 approaches the object to be molded W1 and a pressing position Q (see FIG. 11) where the pressing member 6 presses the object to be molded W1. The lifting mechanism 7 also has a second lifting part 72 that moves the pressing member 6 up and down to a second height position R (see FIGS. 4, 12, 13) located above the first height position P. The first lifting part 71 and the second lifting part 72 are configured using, for example, air cylinders. The first lifting part 71 and the second lifting part 72 of the present embodiment adjust the height position of the pressing member 6 by moving the connecting bar 61 up and down.

[0061] Here, when the pressing member 6 is in the first height position P, the object to be molded W1 held by the holding claws 51 is in a height position between the upper surface of the lower mold 15 and the protruding portion 141b. The first height position P of the pressing member 6 is the transfer height position at which the holding claws 51 of the substrate holding part 3 release the holding of the object to be molded W1. The second height position R of the pressing member 6 is the receiving position at which the holding claws 51 of the substrate holding part 3 on the pressing member 6 receive the object to be molded W1.

[0062] As shown in FIGS. 3, 4, 6 to 13, the holding part moving mechanism 4 horizontally moves the substrate holding part 3 holding the object to be molded W1 toward the pot block 141 so that the object to be molded W1 contacts the side surface 141c below the protruding part 141b of the pot block 141. At this time, the object to be molded W1 held by the substrate holding part 3 is in a state of being separated from the lower mold 15 with a space therebetween (a state of floating from the upper surface of the lower mold 15). Further, the object to be molded W1 before being moved toward the pot block 141 by the holding part moving mechanism 4 is located outside the protruding part 141b.

[0063] The holding part moving mechanism 4 of the present embodiment horizontally moves the pressing member 6 to horizontally move the object to be molded W1 held by the holding claws 51.

[0064] Specifically, the holding part moving mechanism 4 has a guide mechanism 41 for horizontally moving the pressing member 6 with respect to the base member 2, and a horizontal drive part 42 for moving the pressing member 6 along the guide mechanism 41.

[0065] The guide mechanism 41 has a rail 411 provided along a first direction toward the pot block 141 side on the base member 2, and a slide member 412 that slides on the rail 411. The pressing member 6 is provided on the slide member 412 so as to be slidable in the vertical direction. Further, the horizontal drive part 42 is configured by using, for example, an air cylinder.

[0066] Note that a movement restricting part 2s that contacts the slide member 412 and restricts further movement toward the pot block 141 side is provided on the base member 2 of the present embodiment (see FIG. 6). This movement restricting part 2s hits the slide member 412 moved by the horizontal drive part 42 at the timing when the object to be molded W1 is in contact with the side surface 141c of the pot block 141 located below the protruding part 141b, so as not to move further. Thereby, excessive force is prevented from being applied to the object to be molded W1 in contact with the side surface 141c.

[0067] Furthermore, as shown in FIGS. 3, 4, 7 to 13, the substrate holding portion 3 of the present embodiment includes a first guide member 81 that guides the molded object W1 whose holding has been released to the upper surface of the lower mold 15. The first guide member 81 contacts or approaches the end of the molded object W1 opposite to the pot side end, and guides the molded object W1 to the upper surface of the lower mold 15.

[0068] Specifically, the first guide member 81 is rotatably provided on a shaft member 53 to which the holding claw 51 is connected. The first guide member 81 is movable between a guide position G1 (see FIGS. 3, 7 to 11) for guiding the molded object W1 to the upper surface of the lower mold 15 and a retracted position H1 (see FIGS. 4, 12, 13) retracted from the guide position G1. This retracted position H1 is a position rotated outward from the guide position G1 and does not interfere with the reception of the molded object W1 by the holding claw 51.

[0069] The first guide member 81 of the present embodiment is elastically biased by an elastic member 81a to be in the guide position G1. In a state where the pressing member 6 is at the first height position P and the pressing position Q (see FIGS. 3, 7 to 11), the first guide member 81 is in the guide position G1. On the other hand, when the pressing member 6 rises from the first height position P to the second height position R (see FIGS. 4, 12, 13), a cam portion 81b provided on the first guide member 81 contacts the lower surface 2a of the base member 2. Then, as the pressing member 6 moves, the first guide member 81 rotates about the shaft member 53 as the center of rotation and moves to the retracted position H1. A cam mechanism 81K for moving the first guide member 81 to the retracted position H1 is constituted by the cam portion 81b and the lower surface 2a of the base member 2.

[0070] Furthermore, as shown in FIGS. 3, 4, 7 to 13, the substrate holding portion 3 of the present embodiment serves as a guide when holding the molded object W1 in contact with or close to the end surfaces of the molded object W2 excluding the end surface that contacts the side surface 141c of the pot block 141, and also serves as a guide when dropping the molded object W1 onto the lower mold 15. It has a second guide member 82.

[0071] This second guide member 82 is housed via an elastic member 82a in a recess formed in the lower surface of the pressing member 6. And the second guide member 82 projects from the lower surface of the pressing member 6 and is provided so as to be movable between a guide position G2 (see FIGS. 3, 4, 7 to 10, 12, 13) for guiding the object W1 to be molded and a retracted position H2 (see FIG. 11) where it is buried in the lower surface of the pressing member 6 and retracted from the guide position G2. With this configuration, when the pressing member 6 is in the first height position P and the second height position R (see FIGS. 3, 4, 7 to 10, 12, 13), the second guide member 82 projects from the lower surface to become the guide position G2 and guides the object W1 to be molded. Also, when the pressing member 6 descends from the first height position P to the pressing position Q (see FIG. 11), the second guide member 82 contacts and is buried in the upper surface of the lower mold 15 (or the release film if there is a release film) along with the movement of the pressing member 6 to become the retracted position H2. By the second guide member 82 being buried to become the retracted position H2, it does not interfere when the pressing member 6 presses the object W1 to be molded.

[0072] Furthermore, as shown in FIGS. 3 and 14, the loader 13 of the present embodiment includes a stopper mechanism 9 that holds the holding claws 51 and the first guide member 81 at a predetermined height position so that the holding claws 51 and the first guide member 81 do not contact the lower mold 15 when the pressing member 6 descends.

[0073] This stopper mechanism 9 is composed of a catching portion 91 provided on a support block 55 that rotatably supports a shaft member 53 and a stopper portion 92 provided on the base member 2 and caught by the catching portion 91. With this stopper mechanism 9, as shown in FIG. 14, when the pressing member 6 descends from the first height position P to the pressing position Q, the catching portion 91 of the support block 55 is caught by the stopper portion 92. As a result, the holding claws 51 and the first guide member 81 stay at a predetermined height position without following the descent of the pressing member 6, and the holding claws 51 and the first guide member 81 do not contact the upper surface of the lower mold 15 (or the release film if there is a release film).

[0074] <Operation of the loader 13> Next, the conveyance operation and positioning operation of the loader 13 will be described with reference to FIGS. 4, 6 to 14.

[0075] In the supply module 100A, the loader 13 is made to hold the object W1 to be molded. Thereafter, the loader 13 is moved to the molding module 100B, and as shown in FIG. 4, the loader 13 holding the object W1 to be molded is moved above the lower mold 15. At this time, the pressing member 6 is at the second height position R. Thereafter, the second elevating part 72 of the elevating mechanism 7 lowers the pressing member 6 from the second height position R to the first height position P (see FIG. 7). At this time, the connecting bar 61 connected to the pressing member 6 comes into contact with the first elevating part 71 of the elevating mechanism 7, and the pressing member 6 reaches the first height position P. As a result, the height position of the object W1 to be molded held by the holding claws 51 becomes the height position (transfer height position) between the upper surface of the lower mold 15 and the protruding part 141b.

[0076] In this state, as shown in FIGS. 6 and 8, the holding part moving mechanism 4 horizontally moves the pressing member 6 together with the slide member 412 toward the pot side. Then, the holding part moving mechanism 4 brings the pot-side end of the object W1 to be molded held by the holding claws 51 into contact with the side surface 141c under the protruding part 141b of the pot block 141. Thereby, the object W1 to be molded is positioned with respect to the pot block 141 in a plan view. Note that the first elevating part 71 of the elevating mechanism 7 is provided on the slide member 412, and the first elevating part 71 of the elevating mechanism 7 also moves toward the pot side as the slide member 412 moves toward the pot side.

[0077] Next, as shown in FIG. 9, the holding claw driving mechanism 52 expands the interval between the holding claws 51. At this time, the contact portion of the second transmission portion 522c pushes the action lever portion 522a2 of the link portion 522a, thereby expanding the interval between the holding claws 51. Since the pot block 141 is formed with a recess 141K, the holding claws 51 and the pot block 141 do not interfere with each other. As a result, the holding of the object to be molded W1 is released, and the object to be molded W1 drops and is placed on the lower mold 15 (see FIG. 10). When the object to be molded W1 drops, the object to be molded W1 is guided by the first guide member 81 and the second guide member 82.

[0078] Thereafter, as shown in FIG. 11, the first elevating portion 71 of the elevating mechanism 7 moves the pressing member 6 from the first height position P to the pressing position Q, and contacts and presses the outer peripheral edge portion of the object to be molded W1 where the pressing member 6 is positioned. During the descent of the pressing member 6 from the first height position P to the pressing position Q, the engaging portion 91 is caught by the stopper portion 92 of the stopper mechanism 9, and the holding claws 51 and the first guide member 81 do not descend following the descent of the pressing member 6 and remain at a predetermined height position (see FIGS. 11 and 14(b)). As a result, the holding claws 51 and the first guide member 81 do not contact the upper surface (release film) of the lower mold 15.

[0079] Also, in a state where the pressing member 6 is in contact with and pressed by the object to be molded W1, the object to be molded W1 is adsorbed and held on the lower mold 15 by an adsorption mechanism (not shown) provided on the lower mold 15. In the present embodiment, even when the object to be molded W1 is deformed, the pressing member 6 presses the object to be molded W1, so that adsorption and holding are possible. When a release film is provided on the lower mold 15, for example, a through hole corresponding to the substrate adsorption hole of the lower mold 15 is formed in the release film.

[0080] After being adsorbed and held, the first elevating portion 71 of the elevating mechanism 7 raises the pressing member 6 from the pressing position Q to the first height position P. At this time, the engaging portion 91 of the stopper mechanism 9 separates from the stopper portion 92, and the holding claws 51, the first guide member 81, etc. are placed on the pressing member 6 and follow the ascent of the pressing member 6.

[0081] Also, the holding member moving mechanism 4 moves the pressing member 6 in a direction away from the pot block 141. Then, the second elevating part 72 of the elevating mechanism 7 raises the pressing member 6 from the first height position P to the second height position R. At this time, the cam part 81b provided at the upper end of the first guide member 81 contacts the lower surface 2a of the base member 2, and the first guide member 81 rotates about the shaft member 53 as the center of rotation and moves to the retracted position H1 (see FIG. 12). By moving the first guide member 81 to the retracted position H1 in this way, as shown in FIG. 13, when holding the next object to be molded W1 by the holding claws 51, the first guide member 81 does not get in the way.

[0082] After this series of positioning operations (loading operations), when the supply module 100A causes the loader 13 to hold the object to be molded W1, the resin material J held by the resin holding part (not shown) is accommodated in the pot 141a of the pot block 141. At this time, the second elevating part 72 of the elevating mechanism 7 raises the pressing member 6 to the second height position R above the first height position P. Thereby, in the operation of supplying the resin material J from the resin holding part to the pot block 141, the pressing member 6 is prevented from contacting the object to be molded W1 or the like.

[0083] <Effects of the present embodiment> According to the resin molding apparatus 100 of the present embodiment, the object to be molded W1 is brought into contact with the side surface 141c below the overhanging part 141b in the pot block 141 in a state where the object to be molded W1 is separated from the lower mold 15, and then the holding of the object to be molded W1 is released. Therefore, for example, when a pilot pin or a release film is provided on the lower mold 15, or when electronic components are fixed to the lower surface of the object to be molded W1, etc., the loader 13 can position and carry the object to be molded W1 with respect to the lower mold 15. And since the object to be molded W1 positioned by the loader 13 can be resin-sealed, the generation of resin burrs can be reduced and a resin molded product W2 of good quality can be manufactured.

[0084] In addition, in this embodiment, since the holding part moving mechanism 4 horizontally moves the object W1 to be molded, the lower side surface 141c under the protruding part 141b of the pot block 141 and the pot-side end surface of the object W1 to be molded can be surely brought into contact with each other.

[0085] Furthermore, since the substrate holding part 3 has the first guide member 81 and the second guide member 82, when the object W1 to be molded whose holding is released drops onto the upper surface of the lower mold 15, the pot-side end surface of the object W1 to be molded can be maintained in a state of being in contact with the side surface 141c of the pot block 141. As a result, the object W1 to be molded can be placed on the lower mold 15 in a positioned state.

[0086] Moreover, since the substrate holding part 3 has the pressing member 6, the warping of the object W1 to be molded can be suppressed. Here, since the holding claws 51 and the guide members 81 and 82 are provided on the pressing member 6, the size can be reduced as compared with a configuration in which the pressing member 6 and the holding claws or the guide members 81 and 82 are provided separately. And in the configuration in which the holding claws 51 and the guide members 81 and 82 are provided on the pressing member 6, when the pressing member 6 is lowered to press the object W1 to be molded, the holding claws 51 and the guide members 81 and 82 that are movably provided in the vertical direction on the pressing member 6 are retained at a predetermined height position by the stopper mechanism 9, so that the holding claws 51 and the guide members 81 and 82 can be prevented from contacting the lower mold 15 or the release film provided on the lower mold 15.

[0087] <Other Modification Embodiments> Note that the present invention is not limited to the above-described embodiment.

[0088] For example, in the above-described embodiment, the configuration is such that the holding claw 51 or the first guide member 81 is provided on the pressing member 6, but the holding claw 51 or the first guide member 81 may be provided on a member different from the pressing member 6 (for example, the base member 2). Here, when the holding claw 51 or the first guide member 81 is provided on a member different from the pressing member 6, the pressing member 6 may be configured not to move horizontally.

[0089] Further, the holding mechanism 5 of the above embodiment is configured to hook and hold the object to be molded by the holding claws 51, but it may also be configured to adsorb and hold the object by an adsorption pad.

[0090] Furthermore, in the above embodiment, the lifting mechanism 7 of the pressing member 6 is constituted by the first lifting portion 71 and the second lifting portion 72, but it may be configured to move between the first height position P, the pressing position Q, and the second height position R by one lifting portion.

[0091] Moreover, in the above embodiment, the configuration of the first guide member 81 and the configuration of the second guide member 82 are different from each other, but the configuration of the first guide member 81 and the configuration of the second guide member 82 may be the same. For example, the first guide member 81 and the second guide member 82 may be configured to be accommodated in the recess formed in the lower surface of the pressing member 6 via an elastic member and to be able to take a state of protruding from the lower surface of the pressing member 6 and a state of being buried.

[0092] Also, in the above embodiment, the cavity is formed in the lower mold, but it may not have a cavity. Also, a positioning pilot pin may be provided on the upper surface of the lower mold.

[0093] Needless to say, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit thereof.

Explanation of Reference Numerals

[0094] 100 ··· Resin molding apparatus W1 ··· Object to be molded before molding W2 ··· Object to be molded after molding (resin molded product) 13 ··· Loader (transport device) 141 ··· Pot block 141b ··· Protruding portion 141c ··· Side surface below the protruding portion 141K ··· Recess 15 ··· Lower mold 2 ··· Base member 3 ··· Substrate holding part 4 ··· Holding part moving mechanism 51 ··· Holding claw 52 ··· Holding claw driving mechanism 521 ··· Holding claw driving part 522b ··· First transmission part 522c ··· Second transmission part 6 ··· Pressing member 7 ··· Lifting and lowering movement mechanism 81 ··· First guide member 81a ··· Elastic member G1 ··· Guide position H1 ··· Retracted position 82 ··· Second guide member 82a ··· Elastic member G2 ··· Guide position H2 ··· Retracted position 9 ··· Stopper mechanism

Claims

1. A conveying device for conveying a molding object to a lower mold provided with a pot block having an overhanging portion, comprising a substrate holding portion for holding the molding object, and a holding portion moving mechanism for moving the substrate holding portion, wherein the holding portion moving mechanism moves the substrate holding portion toward the pot block in a state where the molding object is separated from the lower mold, and brings the molding object into contact with a side surface below the overhanging portion in the pot block, and the substrate holding portion releases the holding of the molding object after the molding object is brought into contact with the side surface by the holding portion moving mechanism.

2. The conveying device according to claim 1, wherein the holding portion moving mechanism horizontally moves the substrate holding portion toward the pot block in a state where the molding object is at a height position between the upper surface of the lower mold and the overhanging portion, and brings the molding object into contact with the side surface.

3. The substrate holding portion, comprises holding claws for holding the molding object, and a holding claw driving mechanism for releasing the holding by the holding claws, and is the conveying device according to claim 1.

4. further comprises a base member provided with the holding claws at least capable of moving up and down, the holding claws receive the molding object from the outside at a position where the holding claws are raised with respect to the base member, and release the holding of the molding object at a position where the holding claws are lowered with respect to the base member, and the holding claw driving mechanism, comprises a holding claw driving portion provided on the base member, a first transmission portion for transmitting the driving force from the holding claw driving portion to the holding claws at a position where the holding claws are raised with respect to the base member, and a second transmission portion for transmitting the driving force from the holding claw driving portion to the holding claws at a position where the holding claws are lowered with respect to the base member, and is the conveying device according to claim 3.

5. The conveying device according to claim 3, wherein a recess for avoiding interference with the holding claws is formed in the pot block.

6. The conveying device according to claim 1, wherein the substrate holding portion comprises a guide member for guiding the molding object whose holding has been released to the upper surface of the lower mold.

7. The substrate holding portion, comprises a pressing member for pressing the molding object placed on the lower mold, and a lifting mechanism for moving the pressing member up and down with respect to the molding object, and is the conveying device according to claim 1.

8. The substrate holding portion, comprises a pressing member for pressing the molding object placed on the lower mold, A lifting mechanism for moving the pressing member up and down with respect to the object to be molded; A holding claw provided movably in the vertical direction on the pressing member for hooking and holding the object to be molded; The transfer device according to claim 1, further comprising a stopper mechanism for keeping the holding claw at a predetermined height position so that the holding claw does not contact the lower mold when the pressing member descends.

9. The substrate holding portion is provided movably in the vertical direction on the pressing member, and further includes a guide member for guiding the object to be molded, the holding of which has been released, to the upper surface of the lower mold. The stopper mechanism according to claim 8 for keeping the guide member at a predetermined height position so that the guide member does not contact the lower mold when the pressing member descends.

10. The guide member is provided movably between a guide position for guiding the object to be molded to the upper surface of the lower mold and a retracted position retracted from the guide position, and is configured to be movable to the guide position by receiving the elastic force of an elastic member and to the retracted position as the pressing member moves. The transfer device according to claim 9.

11. A resin molding apparatus having the transfer device according to any one of claims 1 to 10.

12. A method for manufacturing a resin molded product by resin molding an object to be molded, comprising: A positioning step of positioning the object to be molded with respect to the pot block by the transfer device according to any one of claims 1 to 10; A molding step of performing resin molding in a state where the object to be molded is positioned. A method for manufacturing a resin molded product.

Images