Fixture for strength evaluation

Abstract

To simply evaluate flexural strength of a semiconductor chip.SOLUTION: A strength evaluation tool for evaluating strength of a semiconductor chip includes a supporting body for supporting the semiconductor chip, and a pressing body for pressing the semiconductor chip being supported by the supporting body. The supporting body includes a pair of supporting sections each supporting the semiconductor chip, and a recessed section being between the pair of supporting sections. The strength of the semiconductor chip can be evaluated on the basis of an entering depth of the semiconductor chip when the semiconductor chip supported by the pair of supporting sections is pressed and bent by the pressing body and enters into the recessed part of the supporting body, and absence or presence of a crack of the semiconductor chip having entered into the recessed section.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a strength evaluation jig that can be used when evaluating the flexural strength of a semiconductor chip.

Background Art

[0002] On the surface of a semiconductor wafer, a plurality of planned division lines are set to be arranged in a grid pattern, and devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed in each region partitioned by the planned division lines. Then, when the semiconductor wafer is divided along the planned division lines, individual semiconductor chips having the devices are formed.

[0003] When a large impact is applied to a semiconductor chip, damage such as cracks and fractures may occur, and the function of the device may be lost. Therefore, in order to develop a semiconductor chip having a predetermined level of flexural strength, the flexural strength of a prototyped semiconductor chip is measured. As a method for evaluating the flexural strength, for example, there is a three-point bending method defined in SEMI (Semiconductor Equipment and Materials International) standard G86-0303.

[0004] For example, when measuring the flexural strength of a semiconductor chip by the three-point bending method, two cylindrical supports are laid down and arranged parallel to each other, and the semiconductor chip to be measured is placed on the side surfaces of the supports without being fixed to the supports. Then, a cylindrical indenter is arranged above the semiconductor chip between the two supports and parallel to the two supports. Then, the semiconductor chip is pressed and broken from above by the indenter, and the load applied to the semiconductor chip at that time is measured as the strength (see Patent Document 1).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] In order to accurately measure the flexural strength of a semiconductor chip by the three-point bending method according to the correct procedure, a large and expensive measuring instrument must be prepared. However, for example, when various types of semiconductor chips are successively prototyped under various conditions at the semiconductor chip manufacturing site and their flexural strengths are to be simply compared, it is troublesome and time-consuming to carry the manufactured semiconductor chips to the measuring instrument for precise measurement.

[0007] In particular, in recent years, there has been a remarkable trend towards miniaturization of electronic devices on which semiconductor chips are mounted, and miniaturization is also required for semiconductor chips. Semiconductor chips with sizes of 1 cm square to 2 cm square or less are also being manufactured. However, conventional flexural strength measuring instruments using the three-point bending method may not be configured to measure the flexural strength of such small semiconductor chips, and it is not easy to measure the flexural strength of small semiconductor chips.

[0008] The present invention has been made in view of such problems, and an object thereof is to provide a strength evaluation jig capable of easily evaluating the flexural strength of a semiconductor chip.

MEANS FOR SOLVING THE PROBLEMS

[0009] According to one aspect of the present invention, there is provided a jig for evaluating the strength of a semiconductor chip, including a support for supporting the semiconductor chip, and a pressing body for pressing the semiconductor chip supported by the support. A plate-shaped depth adjusting body, The support includes a pair of support portions for respectively supporting the semiconductor chips, and a concave portion between the pair of support portions. A pair of inclined portions inclined outwardly from each of the pair of support portions, It has. The depth adjusting body has a pair of openings inserted into each of the pair of support portions of the support body. When each of the pair of support portions of the support body is inserted into each of the pair of openings until the outer ends of each of the pair of openings of the depth adjusting body reach each of the pair of inclined portions of the support body, the bridge portion between the pair of openings of the depth adjusting body enters the concave portion of the support body to a predetermined depth, and the upper end of the bridge portion defines the depth of the concave portion. A strength evaluation jig for a semiconductor chip is provided that can evaluate the strength of the semiconductor chip based on the penetration depth of the semiconductor chip when the semiconductor chip supported by a pair of the support portions is pressed and curved by the pressing body and enters the concave portion of the support body, and the presence or absence of cracking of the semiconductor chip that has entered the concave portion.

Advantages of the Invention

[0012] A strength evaluation jig for a semiconductor chip according to one aspect of the present invention includes a support body that supports a semiconductor chip and a pressing body that presses the semiconductor chip supported by the support body. When the semiconductor chip is supported by a pair of support portions of the support body, passed over the concave portion, and pressed from above by the pressing body, the semiconductor chip enters the concave portion while bending. The semiconductor chip does not crack until the degree of bending exceeds the limit of the flexural strength, and cracking occurs in the semiconductor chip when the degree of bending exceeds the limit of the flexural strength.

[0013] The degree of bending of the semiconductor chip is determined by the penetration depth of the semiconductor chip that has entered the concave portion of the support body. Therefore, the strength of the semiconductor chip can be evaluated based on the penetration depth when the semiconductor chip is pressed by the pressing body to bend and enter the concave portion, and the presence or absence of cracking of the semiconductor chip that has entered the concave portion.

[0014] For example, when comparing the magnitudes of the flexural strengths of two semiconductor chips, each semiconductor chip is pressed by the pressing body to bend and enter the concave portion to a predetermined penetration depth. At this time, if cracking occurs only in one of the semiconductor chips, it is understood that the flexural strength of the cracked semiconductor chip is relatively small. Thus, when using the strength evaluation jig for a semiconductor chip according to one aspect of the present invention, the flexural strength of the semiconductor chip can be easily evaluated.

[0015] Therefore, according to the present invention, a strength evaluation jig is provided that can easily evaluate the flexural strength of a semiconductor chip.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, a semiconductor chip whose flexural strength is evaluated using the strength evaluation jig according to this embodiment will be described. FIG. 1 includes a perspective view schematically showing a semiconductor chip 1.

[0018] The semiconductor chip 1 is, for example, a chip cut out from a disk-shaped semiconductor wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. The surface of the semiconductor wafer is partitioned by a plurality of streets (planned processing lines) that intersect each other. Also, devices such as ICs and LSIs are formed in each region partitioned by the streets on the surface of the wafer.

[0019] Then, when the semiconductor wafer is divided along the streets, individual semiconductor chips 1 each having a device are formed. In recent years, there has been a remarkable trend towards miniaturization of electronic devices on which the semiconductor chip 1 is mounted, and in order to cope with this, semiconductor chips 1 with a size of 1 cm to 2 cm square or less are being manufactured.

[0020] At the development site of the semiconductor chip 1, the semiconductor chip 1 is prototyped under various conditions, and as one evaluation item, the flexural strength of the semiconductor chip 1 is measured. Conventionally, the measurement of the flexural strength of samples such as the semiconductor chip 1 has been carried out by the three-point bending method, but it is not easy to measure the flexural strength of a small semiconductor chip 1, and it is also troublesome to transport the semiconductor chips 1 that are prototyped one after another to the measuring instrument and measure the flexural strength in an appropriate procedure. Also, when it is desired to compare the magnitude relationship of the flexural strengths of a plurality of semiconductor chips 1, precise measured values of the flexural strength are not required.

[0021] Therefore, it is preferable to use the strength evaluation jig according to this embodiment that can easily evaluate the flexural strength of the semiconductor chip 1. FIG. 1 includes a perspective view schematically showing the strength evaluation jig 2 according to this embodiment. Hereinafter, the configuration and usage method of the strength evaluation jig 2 will be described.

[0022] The fixture 2 for strength evaluation according to this embodiment includes three separate members: a support 12 that supports the semiconductor chip 1, a pressing body 4 that presses the semiconductor chip 1 supported by the support 12, and a depth adjusting body 24 that adjusts the depth of a recess 18 (to be described later) of the support 12. The support 12, the pressing body 4, and the depth adjusting body 24 are formed of materials such as stainless steel or resin, for example. However, the materials of the respective members are not limited to this. Next, the structures and functions of the respective members will be described.

[0023] The pressing body 4 is a substantially triangular prism-shaped member, and is used in a state where the upper surface 6 corresponding to one side surface of the triangular prism is a horizontal plane. At this time, the two outer surfaces 8a and 8b corresponding to the other side surfaces of the triangular prism are inclined at the same angle in opposite directions so as to be symmetric with respect to a vertical plane that intersects the upper surface 6 perpendicularly. And the lower end side connecting the two outer surfaces 8a and 8b of the pressing body 4 is rounded to form a linear pressing portion 10. By lowering the pressing body 4 in a state where the pressing portion 10 is in contact with the upper surface of the semiconductor chip 1, the semiconductor chip 1 can be pressed by the pressing body 4.

[0024] The support 12 has a main body 14 provided with a pair of linear support portions 16a and 16b at the upper end for supporting the semiconductor chips 1 respectively, and a recess 18 is formed between the pair of support portions 16a and 16b of the main body 14. The bottom surface 22 of the main body 14 is a plane. When the support 12 is placed on the horizontal table surface with the bottom surface 22 facing downward, the pair of support portions 16a and 16b sandwiching the recess 18 are at the same height and parallel to each other.

[0025] The upper surface of the main body 14 is inclined downward from the pair of support portions 16a and 16b toward the outside respectively. That is, the support 12 has a pair of inclined portions 20a and 20b that are inclined downward toward the outside of the pair of support portions 16a and 16b respectively. The pair of inclined portions 20a and 20b are inclined at the same angle in opposite directions so as to be symmetric with respect to a vertical plane.

[0026] The plate-shaped depth adjusting body 24 has a pair of openings 26a and 26b arranged with the bridge portion 28 therebetween. The pair of openings 26a and 26b penetrate vertically, and the bridge portion 28 separates the pair of openings 26a and 26b. The width of this bridge portion 28, that is, the distance between the pair of openings 26a and 26b, is set to be equal to or less than the width of the concave portion 18 of the support body 12.

[0027] The depth adjusting body 24 is used integrally with the support body 12 with the respective pair of support portions 16a and 16b of the support body 12 inserted into the pair of openings 26a and 26b. That is, the pair of support portions 16a and 16b are inserted into the pair of openings 26a and 26b until the outer ends of the respective pair of openings 26a and 26b reach the respective pair of inclined portions 20a and 20b of the support body 12.

[0028] Here, the outer end reaching the inclined portions 20a and 20b means that the outer end hits the inclined portions 20a and 20b, indicating a state in which the depth adjusting body 24 is stably supported by the support body 12. In this state, the depth adjusting body 24 can no longer move downward any further, and the height position of the depth adjusting body 24 is determined. This state is a state in which the distance between the outer end of one opening 26a and the outer end of the other opening 26b is equal to the distance between the contact point of the depth adjusting body 24 with one inclined portion 20a and the contact point of the depth adjusting body 24 with the other inclined portion 20b.

[0029] At this time, the bridge portion 28 enters the concave portion 18 of the support body 12 and partially fills the concave portion 18. FIGS. 2(A) and 2(B) are perspective views schematically showing the depth adjusting body 24 integrated with the support body 12. The bottom of the concave portion 18 of the support body 12 integrated with the depth adjusting body 24 is defined by the upper end 30 of the bridge portion 28. That is, the depth of the concave portion 18 changes due to the depth adjusting body 24.

[0030] The depth of the concave portion 18 defined by the upper end 30 of the bridge portion 28 changes with the height of the depth adjusting body 24 integrated with the support body 12. In other words, by changing the height of the depth adjusting body 24 integrated with the support body 12, the depth of the concave portion 18 can be adjusted to a predetermined depth. The adjustment of the height of this depth adjusting body 24 can be realized by the shape of the openings 26a and 26b.

[0031] Next, the shape characteristics of a pair of openings 26a and 26b that contribute to the adjustment of the height of the depth adjusting body 24 integrated with the support 12 will be described. When viewed from the far side in the penetration direction of the openings 26a and 26b, the inner ends 32a and 32b of the pair of openings 26a and 26b are formed in straight lines parallel to each other, and the outer ends facing the inner ends 32a and 32b are formed in a stepped shape.

[0032] In the example shown in FIG. 1 and the like, the outer ends of the openings 26a and 26b are divided into five regions. However, the number of divided regions constituting the outer ends of the openings 26a and 26b is not limited to five. The distance from the inner ends 32a and 32b of each region is different. Further, each region has a length equal to or greater than the thickness of the support 12. Furthermore, the shapes of the two openings 26a and 26b are preferably symmetric with respect to a line.

[0033] The region farthest from the inner ends 32a and 32b of the openings 26a and 26b is defined as the first outer ends 34a and 34b, and the region adjacent to the first outer ends 34a and 34b via a step is defined as the second outer ends 36a and 36b. Similarly, the adjacent region is defined as the third outer ends 38a and 38b, and the further adjacent region is defined as the fourth outer ends 40a and 40b. The region that is further adjacent and has the shortest distance from the inner ends 32a and 32b is defined as the fifth outer ends 42a and 42b.

[0034] When the openings 26a and 26b are configured in this way, when integrating the depth adjusting body 24 and the support 12, the height of the depth adjusting body 24 can be adjusted by which region of the outer ends of the openings 26a and 26b is applied to the inclined portions 20a and 20b of the support 12. This is because the length between the contact point of the support 12 hitting the depth adjusting body 24 of one inclined portion 20a and the contact point of the support 12 hitting the depth adjusting body 24 of the other inclined portion 20b becomes longer as it goes downward.

[0035] For example, FIG. 2(A) is a perspective view schematically showing a depth adjusting body 24 integrated with a support body 12 in a state where the third outer ends 38a, 38b of the openings 26a, 26b are applied to the inclined portions 20a, 20b of the support body 12. Further, FIG. 2(B) is a perspective view schematically showing a depth adjusting body 24 integrated with a support body 12 in a state where the first outer ends 34a, 34b of the openings 26a, 26b are applied to the inclined portions 20a, 20b of the support body 12.

[0036] When the depth adjusting body 24 is lowered and the third outer ends 38a, 38b of the openings 26a, 26b are applied to the inclined portions 20a, 20b of the support body 12, the depth adjusting body 24 is supported by the support body 12 as shown in FIG. 2(A). FIG. 3(A) is a cross-sectional view schematically showing the support body 12 and the depth adjusting body 24 at this time.

[0037] Further, when the depth adjusting body 24 is moved laterally and further lowered and the first outer ends 34a, 34b of the openings 26a, 26b are applied to the inclined portions 20a, 20b of the support body 12, the depth adjusting body 24 is supported by the support body 12 again as shown in FIG. 2(B). FIG. 3(B) is a cross-sectional view schematically showing the support body 12 and the depth adjusting body 24 at this time.

[0038] Here, the distance between one of the third outer ends 38a of the depth adjusting body 24 and the other third outer end 38b is shorter than the distance between one of the first outer ends 34a and the other first outer end 34b. Therefore, the height of the depth adjusting body 24 when the third outer ends 38a, 38b are applied to the inclined portions 20a, 20b is higher than the height of the depth adjusting body 24 when the first outer ends 34a, 34b are applied to the inclined portions 20a, 20b.

[0039] That is, as shown in FIG. 3(A), when the third outer ends 38a and 38b are applied to the inclined portions 20a and 20b, the depth 44 of the recess 18 is smaller than the depth 46 of the recess 18 when the first outer ends 34a and 34b are applied to the inclined portions 20a and 20b as shown in FIG. 3(B). Thus, the height of the upper end 30 of the bridge portion 28 in the recess 18 changes according to the height of the depth adjusting body 24 when it is integrated with the support body 12, and since the height of this upper end 30 defines the depth of the recess 18, the depth of the recess 18 in the support body 12 can be adjusted by the depth adjusting body 24.

[0040] For example, when it is desired to evaluate the strength of a semiconductor chip 1 having a size of 20.0 mm square, the distance between the pair of support portions 16a and 16b, that is, the width of the recess 18, may be set to 5 mm or more and 10 mm or less. Further, the inclined portions 20a and 20b of the support body 12 may be inclined at 45 degrees with respect to the bottom surface 22. Further, the depth of the recess 18 in the support body 12 when not integrated with the depth adjusting body 24 may be set to 15 mm or less.

[0041] Then, when the first outer ends 34a and 34b of the openings 26a and 26b of the depth adjusting body 24 are applied to the inclined portions 20a and 20b, the upper end 30 of the bridge portion 28 of the depth adjusting body 24 may be at a position 10 mm deep from the upper end of the recess 18. Similarly, when the second outer ends 36a and 36b are applied to the inclined portions 20a and 20b, the depth of the recess 18 is 8 mm, at the third outer ends 38a and 38b it is 6 mm, at the fourth outer ends 40a and 40b it is 8 mm, and at the fifth outer ends 42a and 42b it is 2 mm. However, the adjustable depth of the recess 18 is not limited to this.

[0042] When evaluating the flexural strength of the semiconductor chip 1 using the strength evaluation jig 2, the depth adjusting body 24 is previously integrated with the support body 12 at a predetermined height. Then, the semiconductor chip 1 is placed on the support portions 16a and 16b so as to span between the pair of support portions 16a and 16b. Then, the pressing body 4 is moved above the recess 18, and the semiconductor chip 1 supported by the pair of support portions 16a and 16b is pressed by the pressing body 4 from above. Then, the semiconductor chip 1 pressed by the pressing body 4 bends toward the recess 18.

[0043] FIG. 4(A) and FIG. 4(B) are cross-sectional views schematically showing the semiconductor chip 1 pressed and bent by the pressing body 4. For example, the semiconductor chip 1 that has curved and entered the concave portion 18 is pressed by the pressing body 4 until it contacts the bottom of the concave portion 18, that is, the upper end 30 of the bridge portion 28 of the depth adjusting body 24.

[0044] In this process, it is detected whether or not a crack has occurred in the semiconductor chip 1. For example, the detection of the occurrence of a crack in the semiconductor chip 1 is carried out by detecting the breaking sound generated from the semiconductor chip 1. Alternatively, after pressing the semiconductor chip 1 with the pressing body 4 until it contacts the upper end 30 of the depth adjusting body 24, the pressing by the pressing body 4 is released, and the semiconductor chip 1 is observed with a microscope or the like to detect the occurrence of a crack. The method of detecting the crack and the timing at which the crack is detected are not particularly limited.

[0045] For example, when comparing the flexural strengths of two semiconductor chips 1, the fifth outer ends 42a, 42b of the openings 26a, 26b of the depth adjusting body 24 are placed on the inclined portions 20a, 20b of the support 12 to integrate the support 12 and the depth adjusting body 24. Then, one semiconductor chip 1 is placed on the pair of support portions 16a, 16b, and this semiconductor chip 1 is pressed with the pressing body 4 to contact the upper end 30 of the bridge portion 28 of the depth adjusting body 24, and the presence or absence of a crack in the semiconductor chip 1 at this time is detected. Similarly, the other semiconductor chip 1 is pressed with the pressing body 4, and the presence or absence of a crack is detected.

[0046] As a result, when it is detected that a crack has occurred in one semiconductor chip 1 and it is not detected that a crack has occurred in the other semiconductor chip 1, it is understood that the flexural strength of the one semiconductor chip 1 is relatively small. Also, when it is not detected that a crack has occurred in both semiconductor chips 1, the height of the depth adjusting body 24 is changed so that the depth of the concave portion 18 becomes larger, and the pressing test of each semiconductor chip 1 is similarly carried out.

[0047] In the strength evaluation jig 2 according to this embodiment, the depth of the recess 18 can be adjusted by changing the integrated form of the support 12 and the depth adjusting body 24. Then, since each of the plurality of semiconductor chips 1 is pressed by the pressing body 4 and each semiconductor chip 1 can be bent to the same degree, the flexural strength of each semiconductor chip 1 can be easily compared based on the presence or absence of cracking at this time. If only comparing the flexural strength of each semiconductor chip 1, it is not necessary to precisely measure the flexural strength according to standards such as the three-point bending method, and the purpose can be sufficiently achieved.

[0048] Next, a first modification of the strength evaluation jig according to this embodiment will be described. Fig. 5(A) is a perspective view schematically showing the usage mode of the support 12 and the depth adjusting body 24a of the strength evaluation jig according to the first modification. Fig. 5(B) is a cross-sectional view schematically showing the usage mode of the strength evaluation jig 2a according to the first modification.

[0049] There is no change in the support 12 and the pressing body 4 of the strength evaluation jig 2a according to the first modification, and the change is only made to the depth adjusting body 24a. The only change point of the depth adjusting body 24a is the configuration of a pair of openings 48a, 48b. Therefore, for other configurations, the above description can be referred to as appropriate.

[0050] In the depth adjusting body 24a of the strength evaluation jig 2a according to the first modification, the inner walls of the pair of openings 48a, 48b are inclined walls 50a, 50b corresponding to the inclined portions 20a, 20b of the support 12 respectively. In this case, as shown in Fig. 5(B), when the pair of support portions 16a, 16b are respectively passed through the pair of openings 48a, 48b and the inclined portions 20a, 20b of the support 12 are clamped by the inclined walls 50a, 50b, the support 12 and the depth adjusting body 24a can be integrated.

[0051] At this time, since the inclined portions 20a and 20b of the support 12 and the inclined walls 50a and 50b of the depth adjusting body 24a are in surface contact, the depth adjusting body 24a is more firmly and stably supported by the support 12. And when the depth adjusting body 24a is supported by the support 12 in surface contact, the depth adjusting body 24a is positioned at a predetermined height with higher precision. In other words, the variation in the fixed height of the depth adjusting body 24a is reduced. Therefore, the evaluation and comparison of the flexural strength of the semiconductor chip 1 can be carried out more precisely.

[0052] Next, a second modification of the strength evaluation jig according to the present embodiment will be described. FIG. 6(A) is a perspective view schematically showing the support 12a and the depth adjusting body 24b of the strength evaluation jig according to the second modification.

[0053] In the strength evaluation jig according to the second modification, rail-shaped convex portions 56a and 56b along the inclined portions 54a and 54b are respectively formed on the inclined portions 54a and 54b of the support 12a. And on the lower inner walls of the outer ends 62a and 62b of the pair of openings 60a and 60b of the depth adjusting body 24b, recesses 58a having a shape into which the convex portions 56a and 56b can be fitted are formed. There are no other changes, and for other configurations, the above description can be appropriately referred to.

[0054] When integrating the depth adjusting body 24b with the support 12a, the predetermined outer ends 62a and 62b are brought into contact with the inclined portions 54a and 54b of the support 12a. At this time, the convex portions 56a and 56b provided on the inclined portions 54a and 54b are fitted into the recesses 58a of the depth adjusting body 24b. When the depth adjusting body 24b can be integrated with the support 12a at a plurality of different heights, the recesses 58a are provided on the inner walls of the openings 60a and 60b in such a number and at such positions that they can be fitted into the convex portions 56a and 56b when the depth adjusting body 24b is integrated with the support 12a at each height.

[0055] While the semiconductor chip 1 is being pressed from above by the pressing body 4, for some reason, a force having a component in the lateral direction (horizontal direction, parallel to the bottom surface 22) may be inadvertently applied to the depth adjusting body 24b. However, when the convex portions 56a, 56b and the concave portion 58a are engaged with each other, the depth adjusting body 24b does not shift with respect to the support body 12a and the height of the depth adjusting body 24b does not change.

[0056] Next, a third modification of the strength evaluation jig according to the present embodiment will be described. FIG. 6(B) is a cross-sectional view schematically showing the support body 12b and the pressing body 4 of the strength evaluation jig 2b according to the third modification, and the semiconductor chip 1 being pressed. The strength evaluation jig 2b according to the third modification does not have a depth adjusting body.

[0057] On both sides of the recess 18 on the side surface of the support body 12b, scale marks 64a, 64b arranged in the vertical direction at equal intervals are provided, respectively. On both sides of the recess 18, a plurality of lines constituting the scale marks 64a, 64b are provided at the same height, respectively. The strength evaluation jig 2b according to the third modification has no other changes. For other configurations, the above description can be referred to as appropriate.

[0058] When evaluating the flexural strength of the semiconductor chip 1 with the strength evaluation jig 2b, the operator places the semiconductor chip 1 on the pair of support portions 16a, 16b of the support body 12b, lowers the pressing body 4, presses the semiconductor chip 1 to bend it, and makes it enter the recess 18. At this time, the semiconductor chip 1 is monitored, and if a crack occurs, it is immediately detected.

[0059] When a crack in the semiconductor chip 1 is detected, the lowering of the pressing body 4 is stopped, and the height position of the lowest point of the semiconductor chip 1 in the recess 18 at this time is read with reference to the scale marks 64a, 64b. In the example shown in FIG. 6(B), it can be understood that the lowermost end of the semiconductor chip 1 has reached the height of the fourth scale line from the top. The position of this lowermost end becomes an index indicating the flexural strength of the semiconductor chip 1.

[0060] Each semiconductor chip 1 to be measured is similarly successively supported by the supports 12a and 12b, pressed from above by the pressing body 4, and the position of the lowermost end of the semiconductor chip 1 when the semiconductor chip 1 cracks is read with reference to the scales 64a and 64b. By comparing the height positions of the lowermost ends when each semiconductor chip 1 cracks, the magnitude relationship of the flexural strength of each semiconductor chip 1 can be specified. In the strength evaluation jig 2b according to the third modification, a depth adjusting body is unnecessary, and the flexural strength of the semiconductor chip 1 can be evaluated quickly with a simpler configuration.

[0061] Note that, in the strength evaluation jig 2b according to the third modification, the inclined portions 20a and 20b of the support 12b are not used, and the support 12b may not have the inclined portions 20a and 20b. However, when the support 12b has the inclined portions 20a and 20b, the depth adjusting body 24 can be integrated with the support 12b for use. In this case, the strength evaluation jig 2b can be used in various usage modes according to the purpose.

[0062] Next, a fourth modification of the strength evaluation jig according to the present embodiment will be described. FIG. 7(A) is a side view schematically showing the semiconductor chip 1 and the first strength evaluation jig 2c according to the fourth modification, and FIG. 7(B) is a side view schematically showing the semiconductor chip 1 and the second strength evaluation jig 2d according to the fourth modification. FIG. 8(A) is a side view schematically showing the usage mode of the first strength evaluation jig 2c according to the fourth modification, and FIG. 8(B) is a side view schematically showing the usage mode of the second strength evaluation jig 2d according to the fourth modification.

[0063] The flexural strength of the semiconductor chip 1 is evaluated, for example, by a set of a plurality of strength evaluation jigs 2c and 2d having different configurations from each other. However, a simple evaluation of the flexural strength of the semiconductor chip 1 is also possible by using only one of the strength evaluation jigs 2c and 2d. The first strength evaluation jig 2c according to the fourth modification includes a support 12c and a pressing body 4c, and the second strength evaluation jig 2d according to the fourth modification includes a support 12d and a pressing body 4d. Hereinafter, the first strength evaluation jig 2c will be described as an example.

[0064] The support 12c of the first strength evaluation jig 2c has a pair of plate-like portions 70a and 70b each including a pair of support portions 68a and 68b. Here, in the first strength evaluation jig 2c, the pair of support portions 68a and 68b are not linear but planar, and constitute the inner surfaces of the pair of plate-like portions 70a and 70b. And in the support 12c, one ends of the pair of plate-like portions 70a and 70b are connected to each other, so that the pair of plate-like portions 70a and 70b are arranged in a V shape, and a concave portion 74a is formed by the inner surfaces of the pair of plate-like portions 70a and 70b respectively.

[0065] Also, the pressing body 4c has a pair of outer surfaces 76a and 76b. And the angle formed by the inner surfaces of the pair of plate-like portions 70a and 70b of the support 12c is the same as the angle formed by the pair of outer surfaces 76a and 76b of the pressing body 4c.

[0066] When evaluating the flexural strength of the semiconductor chip 1 with the first strength evaluation jig 2c, first, as shown in FIG. 7(A), the semiconductor chip 1 is supported by the pair of support portions 66a and 66b of the support 12c. Then, the pressing portion 80a at the lower end of the pressing body 4c is brought into contact with the semiconductor chip 1 to bend the pressing body 4c, and the semiconductor chip 1 is made to enter downward of the concave portion 74a. Then, finally, as shown in FIG. 8(A), the outer surfaces 76a and 76b of the pressing body 4c face the inner surface of the support 12c, and the semiconductor chip 1 is sandwiched between the support 12c and the pressing body 4c.

[0067] The degree of bending of the semiconductor chip 1 at this time is determined by the angle formed by the inner surfaces of the pair of plate-like portions 70a and 70b of the support 12c (the angle formed by the pair of outer surfaces 76a and 76b of the pressing body 4c). That is, when using the first strength evaluation jig 2c, each semiconductor chip 1 to be evaluated for flexural strength can be bent to the same degree. And by determining whether or not cracks have occurred in the bent semiconductor chip 1, it can be determined whether or not each semiconductor chip 1 has a predetermined flexural strength.

[0068] Here, the degree of bending of the semiconductor chip 1 during the evaluation of the flexural strength is determined by the angle formed by the inner surfaces of the pair of plate-like portions 70a and 70b of the support 12c. Therefore, if other strength evaluation jigs with different angles formed by the inner surfaces are used, the flexural strength of the semiconductor chip 1 can be evaluated in more detail.

[0069] The second strength evaluation jig 2d according to the fourth modification example shown in FIG. 7(B) includes a support 12d having a pair of plate-like portions 72a and 72b each having support portions 68a and 68b on the inner surface, and a pressing body 4d having a pair of outer surfaces 78a and 78b. The support 12d has a concave portion 74b between the support portions 68a and 68b. The pressing body 4d contacts the semiconductor chip 1 with the pressing portion 80b at the lower end and presses the semiconductor chip 1 from above.

[0070] And, in the second strength evaluation jig 2d, the angle formed by the inner surfaces of the pair of plate-like portions 72a and 72b is different from that of the first strength evaluation jig 2c. In this case, as shown in FIGS. 8(A) and 8(B), the degree of bending of the semiconductor chip 1 during the evaluation of the flexural strength by the second strength evaluation jig 2d is different from the degree of bending of the semiconductor chip 1 during the evaluation of the flexural strength by the first strength evaluation jig 2c.

[0071] For example, a plurality of semiconductor chips 1 to be evaluated for flexural strength are bent by the second strength evaluation jig 2d, and the semiconductor chips 1 that did not crack are bent by the first strength evaluation jig 2c. Then, the semiconductor chips 1 to be evaluated can be classified into a group that cracked when the second strength evaluation jig 2d was used, a group that cracked when the first strength evaluation jig 2c was used, and a group that did not crack even when the first strength evaluation jig 2c was used. That is, the semiconductor chips 1 can be classified by flexural strength.

[0072] That is, when using a plurality of strength evaluation jigs according to a fourth modification example in which the angles formed by the inner surfaces of the pair of plate-like portions of the support are different, the semiconductor chip 1 can be finely classified by flexural strength according to the number of the strength evaluation jigs. And in the strength evaluation jig according to the fourth modification example, since the semiconductor chip 1 can be curved to a predetermined degree without using a depth adjusting body, the flexural strengths of a plurality of semiconductor chips 1 can be easily evaluated and compared.

[0073] However, when evaluating the flexural strength of the semiconductor chip 1, only one strength evaluation jig according to a fourth modification example may be used. For example, when using only a strength evaluation jig that curves the semiconductor chip 1 to an extent corresponding to the flexural strength required in a specific application of the semiconductor chip 1, it is possible to easily evaluate whether each semiconductor chip 1 to be evaluated has a flexural strength that can withstand the application.

[0074] Note that the present invention is not limited to the description of the above embodiments and can be implemented with various modifications. For example, in the above embodiment, as shown in FIG. 2(A) and the like, the strength evaluation jig 2 including the depth adjusting body 24 in which the outer ends of the openings 26a and 26b are divided into a plurality of regions has been described, but one aspect of the present invention is not limited to this.

[0075] That is, the outer ends of the pair of openings 26a and 26b of the depth adjusting body 24 may not be divided into a plurality of regions. In this case, by preparing a plurality of depth adjusting bodies 24 having different distances between the outer ends of the pair of openings 26a and 26b and properly using these depth adjusting bodies 24, it is possible to adjust the depth of the recess 18 of the support 12.

[0076] For example, when integrating a depth adjusting body 24 having a relatively short distance between the outer ends of the pair of openings 26a and 26b with the support 12, the depth adjusting body 24 is positioned at a relatively high position and the recess 18 becomes relatively shallow. Also, when integrating a depth adjusting body 24 having a relatively long distance between the outer ends of the pair of openings 26a and 26b with the support 12, the depth adjusting body 24 is positioned at a relatively low position and the recess 18 becomes relatively deep.

[0077] That is, the fixture 2 for strength evaluation according to one aspect of the present invention may be composed of a plurality of depth adjusting bodies 24 in which the distances between the outer ends of the pair of openings 26a and 26b are different from each other, one support body 12, and one pressing body 4. Even in this case, the flexural strength of the semiconductor chip 1 can be evaluated while switching the depth of the recess 18 with the depth adjusting body 24.

[0078] In addition, the structures, methods, etc. according to the above embodiments can be appropriately changed and implemented without departing from the scope of the object of the present invention.

Explanation of Reference Numerals

[0079] 1 Semiconductor chip 2, 2a, 2b, 2c, 2d Fixture for strength evaluation 4, 4c, 4d Pressing body 6 Upper surface 8a, 8b, 76a, 76b, 78a, 78b Outer surface 10, 80a, 80b Pressing portion 12, 12a, 12b, 12c, 12d Support body 14 Main body 16a, 16b, 66a, 66b, 68a, 68b Support portion 18, 74a, 74b Recess 20a, 20b, 54a, 54b Inclined portion 22 Bottom surface 24, 24a, 24b Depth adjusting body 26a, 26b, 48a, 48b, 60a, 60b Opening 28 Bridge portion 30 Upper end 32a, 32b, 52a, 52b Inner end 34a, 34b, 36a, 36b, 38a, 38b, 40a, 40b, 42a, 42b, 62a, 62b Outer end 44, 46 Depth 50a, 50b Inclined wall 56a, 56b Protrusion 58a Recess 64a, 64b Scale 70a, 70b, 72a, 72b Plate-like portion

Claims

【Claim 1】 A jig for evaluating the strength of a semiconductor chip, comprising: a support for supporting the semiconductor chip; a pressing body for pressing the semiconductor chip supported by the support; a plate-shaped depth adjusting body; The support has: a pair of support portions for respectively supporting the semiconductor chips; a concave portion between the pair of support portions; a pair of inclined portions inclined outwardly from each of the pair of support portions; The depth adjusting body has a pair of openings respectively inserted into each of the pair of support portions of the support. When each of the pair of support portions of the support is inserted into each of the pair of openings of the depth adjusting body until the outer ends of each of the pair of openings of the depth adjusting body reach each of the pair of inclined portions of the support, a bridge portion between the pair of openings of the depth adjusting body enters the concave portion of the support to a predetermined depth, and the upper end of the bridge portion defines the depth of the concave portion. The strength of the semiconductor chip can be evaluated based on the penetration depth of the semiconductor chip when the semiconductor chip supported by the pair of support portions is pressed by the pressing body and bends and enters the concave portion of the support, and the presence or absence of cracks in the semiconductor chip that has entered the concave portion. A jig for strength evaluation, characterized in that.

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