Power module especially for vehicle power electronics

Abstract

The invention relates to a power module (11), in particular for vehicle power electronics, comprising two DC busbars (12, 14), three phase busbars (16) arranged between the two DC busbars (12, 14) and a number of power semiconductors (18) arranged respectively between one of the DC busbars (12, 14) and one of the phase busbars (16), as well as to power electronics comprising at least one such power module (11) and a vehicle comprising such power electronics. In this case, the DC busbars (12, 14) and the phase busbars (16) are electrically insulated from one another and each have at least one cooling passage (13, 15, 17) through which a dielectric fluid flows, and the DC busbars (12, 14) and the phase busbars (16) each have at least one pluggable electrical contact terminal (12.1, 14.1, 16.1) and at least one pluggable fluid connection (13.1, 15.1, 17.1) at both open ends, the pluggable electrical contact terminal (12.1, 14.1, 16.1) and the pluggable fluid connection (13.1, 15.1, 17.1) each forming a combined plug-in connection terminal, so that a number of power modules (11) can be connected to one another in a fluid-tight manner via the plug-in connections.

Description

Technical Field

[0001] The present invention starts particularly from a power module for vehicle power electronics. The subject of the present invention is also vehicle power electronics equipped with such a power module and vehicles equipped with such power electronics.

Background Art

[0002] Power semiconductors in power electronics for vehicles equipped with an electric drive or a hybrid drive conduct high currents. The loss heat that must be dissipated through a very small area due to transmission losses and connection losses generates a heat flux density of up to 1000 W / cm 2 . For efficient cooling, the power substrate that supports the power semiconductor is generally cooled by a cooler that guides a liquid coolant. In this case, the heat between the semiconductor to be cooled and the heat transfer surface (the contact surface of the cooler and the coolant) is transmitted solely by heat conduction. In this case, since the maximum allowable semiconductor temperature is important for failures, it is advantageous to minimize the thermal resistance between the semiconductor and the coolant. This is achieved in particular by the loss heat generated in the semiconductor being dispersed over a relatively large area by heat conduction. The part of the layer structure through which heat is conducted, the so-called heat stack, is a dielectric (for example, ceramic or polymer) for electrically isolating the coolant from the components that guide the voltage (power semiconductors and conductive parts).

[0003] From German Patent Application Publication No. 102019203399, an electrical busbar unit is known that includes first, second, and third busbars that are each electrically energizable and electrically insulated from each other. Since these three busbars are each formed as a fluid passage through which fluid can flow, the three busbars form first, second, and third fluid passages. In this case, the busbar unit includes a diversion distributor that disperses the fluid into the second and third fluid passages after the fluid has flowed through the first fluid passage. An alternating current flows through the first busbar, and direct currents flow through the second and third busbars. The first busbar is divided into a first busbar section and at least one second busbar section by at least one electrical insulation section, whereby at least two busbar sections are electrically insulated from each other. Furthermore, the electrical busbar unit has at least one electronic circuit unit that includes a plurality of semiconductor switches and is electrically connected to the first, second, and third busbars. Such a circuit unit can be, for example, an electrical inverter or rectifier.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Disclosure of the Invention A power module having the features according to independent claim 1, a power electronics having the features according to independent claim 12, and a vehicle having the features according to independent claim 14 each have the advantage that the use of a dielectric fluid can significantly improve the thermal resistance of individual power modules. When using a dielectric fluid, it is possible to omit the ceramic layer for electrically insulating between the charge carriers and the cooling medium. Thereby, the structure can be reduced, and the thermal resistance can be significantly reduced, particularly with regard to the insufficient heat conduction characteristics of this layer. As the dielectric fluid, for example, a special coolant or transmission oil can be used.

[0006] Embodiments of the present invention make it possible to realize a power module with a significantly high output density and a compact configuration volume. This is made possible by a significant reduction of up to 50% in thermal resistance compared to a conventional coolant-cooled structure with an insulating ceramic layer. Thereby, the chip area (35% - 40%) of individual power semiconductors and the associated costs can be reduced, or the operating temperature can be lowered to reduce losses. Furthermore, embodiments of the present invention enable the modularization of power electronics structures. In this case, individual power modules form independent individual segments of the power electronics. Due to the pluggable fluid connections combined with pluggable electrical contact terminals, individual power modules can be easily connected to each other by plugging, enabling scaling of the output class. When using the power electronics as an inverter, since individual power modules each form an independent inverter segment, the achievable rectifier cells can be flexibly arranged within a power inverter (DC / AC converter) based on the compact configuration of the power modules and the cooler.

[0007] Furthermore, by combining power electronics cooled by a dielectric fluid with an electric drive device and / or a transmission cooled by the dielectric fluid, it is possible to eliminate a coolant such as water / glycol on an electric drive shaft. The recooling of the dielectric fluid is performed, for example, by an air-cooled heat exchanger. Furthermore, based on the extremely small configuration and modular structure of the power electronics, miniaturization and output scaling are possible.

Means for Solving the Problem

[0008] Embodiments of the present invention provide a power module for vehicle power electronics in particular, the power module having two DC bus bars, three phase bus bars arranged between the two DC bus bars, and a plurality of power semiconductors arranged between one of the DC bus bars and one of the phase bus bars, respectively. The DC bus bar and the phase bus bar are electrically insulated from each other and each have at least one cooling passage through which a dielectric fluid flows. In this case, the DC bus bar and the phase bus bar each have at least one pluggable electrical contact terminal and at least one pluggable fluid connection at both open ends, and the pluggable electrical contact terminal and the pluggable fluid connection form a combined plug connection terminal, whereby a plurality of power modules can be fluid-tightly connected to each other via the combined plug connection part.

[0009] With the combined plug connection terminal, when connecting a plurality of power modules, a fluid connection between corresponding cooling passages and an electrical connection between corresponding DC bus bars and phase bus bars can be realized in one working step. Based on the configuration as a fluid-tight plug connection part, a significant cross-sectional narrowing of the cooling passage, which may cause a large pressure loss, can be avoided. Furthermore, an electrical connection part having a sufficiently large contact surface can be realized.

[0010] Furthermore, a vehicle power electronics including an evaluation and control unit and at least one such power module is proposed. In this case, the control signal terminals of the power semiconductors are electrically connected to the evaluation and control unit.

[0011] Furthermore, a vehicle including such power electronics and a cooling circuit in which a dielectric fluid is guided internally to cool the vehicle unit is proposed. In this case, the power electronics are fluid-connected to the cooling circuit via a corresponding interface unit.

[0012] In the present invention, the evaluation and control unit may mean an electrical device such as a control device, particularly a control device for a drive device, which processes or evaluates the detected sensor signal in order to set or adjust the corresponding phase current. The evaluation and control unit may advantageously have at least one interface, and the interface may be formed either hardware-wise and / or software-wise. When formed hardware-wise, the interface may be, for example, part of a so-called system ASIC having various functions of the evaluation and control unit. However, the interface may also be a dedicated integrated circuit or may at least partly consist of a plurality of discrete components. When formed software-wise, the interface may be, for example, a software module provided in a microcontroller adjacent to another software module. A computer program product stored on a machine-readable carrier such as a semiconductor memory, a hard disk memory or an optical memory and comprising program code which is used to perform the evaluation when the program is executed by the evaluation and control unit is also advantageous.

[0013] Advantageous improvements of the power module according to independent claim 1 and the power electronics according to independent claim 12 are possible by means of and improvements according to the dependent claims.

[0014] In an advantageous configuration of the power module, each individual power semiconductor may be formed as a semiconductor switch. In this case, each first output terminal of the power semiconductor may be directly connected to one corresponding DC bus bar, and the second output terminal of the power semiconductor may be connected to one corresponding phase bus bar via a spacer. This good thermal connection between the power semiconductor and the cooling passage can reduce the chip area of the power semiconductor or lower the operating temperature.

[0015] In another advantageous configuration of the power module, the DC bus bars may each have three cooling passages, and these cooling passages may extend parallel to the cooling passages of the three phase bus bars respectively. Particularly advantageously, the first power semiconductor may be arranged between the first cooling passage of the first DC bus bar and the cooling passage of the first phase bus bar. The second power semiconductor may be arranged between the first cooling passage of the second DC bus bar and the cooling passage of the first phase bus bar. The third power semiconductor may be arranged between the second cooling passage of the first DC bus bar and the cooling passage of the second phase bus bar. The fourth power semiconductor may be arranged between the second cooling passage of the second DC bus bar and the cooling passage of the second phase bus bar. The fifth power semiconductor may be arranged between the third cooling passage of the first DC bus bar and the cooling passage of the third phase bus bar. The sixth power semiconductor may be arranged between the third cooling passage of the second DC bus bar and the cooling passage of the third phase bus bar. The cooling passages of the phase bus bars conduct the loss heat of the power semiconductors to both sides of the phase bus bars, and since the cooling passages of the DC bus bars have heat load parts only on one side, the height of the cooling passages of the phase bus bars may be higher than the height of the cooling passages of the DC bus bars. Preferably, the height of the cooling passages of the phase bus bars may be twice the height of the passages of the DC bus bars. In this way, a temperature distribution that is as uniform as possible can be achieved.

[0016] In other advantageous configurations of the power module, the individual cooling channels may each have one cooling geometry in the area of the power semiconductors. The cooling geometry may include, for example, a plurality of cooling pins or turbulators or protrusions or ribs. With the cooling geometry, a uniform distribution of the dielectric fluid with respect to the channel height can be achieved, whereby better heat transfer can be achieved. In this case, the dimensions and spacings of the cooling pins or turbulators or protrusions or ribs can be formed identically in all channels, whereby identical pressure loss characteristics are achieved.

[0017] In other advantageous configurations of the power module, the DC bus bar and the phase bus bar may be surrounded by a cover with the insertable fluid connection and the insertable electrical contact terminals exposed. The power module can be cast, for example, in one transfer molding process by transfer molding. In order to prevent the molding material from flowing into the cooling channels, the fluid connection may be closed before the transfer molding process. After the transfer molding process, the cover layer can be removed, for example, by milling.

[0018] In another advantageous configuration of the power module, the capacitor terminals may be arranged laterally to the DC bus bar and led out from the cover, and the capacitor terminals are in contact connection with the capacitors, whereby the individual capacitors are electrically arranged between two DC bus bars respectively. Further, the control signal terminals of the power semiconductors may be led out laterally from the cover, and the control signal terminals can be in contact connection with the evaluation and control unit. The control signal terminals may be formed, for example, as a punched grid. In order to simplify the transfer molding process, the laterally arranged capacitor terminals and the laterally arranged control signal terminals may be arranged in a common connection plane, whereby the mold can be closed. Further, the capacitors can be cast separately together with the cover and connected to the capacitor terminals of the power module after opening the cooling channels after transfer molding. With this process sequence, each component can be inspected separately in the manufacturing process. The capacitors are cooled together by heat conduction through the integrated cooling channels of the DC bus bar via the capacitor terminals.

[0019] In another advantageous configuration of the power module, the DC bus bar and the phase bus bar may be formed as 3D printed components or punched and bent components. For the DC bus bar and the phase bus bar, printable metals such as copper (Cu) or copper graphite (Cu-C) are used, for example. The connection between the power semiconductor and the surface of the DC bus bar or the surface of the spacer may be formed, for example, by sintering or soldering. The connection between the surface of the phase bus bar and the spacer may be formed, for example, by sintering. The spacer is preferably made of copper. The 3D printing method means a method including a deposition process and a curing process, for example, selective laser sintering, selective electron beam melting or stereolithography.

[0020] In an advantageous configuration of the power electronics, a plurality of power modules forming each inverter segment are interconnected by plug-in connections and may form an entire inverter having a higher output density. In this case, each inverter segment can form a complete B6 bridge and, together with the evaluation / control unit and the capacitor, can constitute one complete inverter. In this case, each phase busbar of the individual inverter segments respectively has a semiconductor switch formed as a field-effect transistor for the "high side" and a semiconductor switch formed as a field-effect transistor for the "low side". The evaluation / control unit may be attached to the cover of the assembled power electronics.

[0021] Embodiments of the present invention are illustrated and described in more detail in the following description. In the drawings, the same reference numerals represent components or members that perform the same or similar functions.

Brief Description of the Drawings

[0022]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Best Mode for Carrying Out the Invention

[0023] Embodiment of the Invention As can be seen from FIGS. 1 to 6, an illustrated example of the power modules 11, 11A, 11B, 11C according to the present invention, particularly for the power electronics 10 of the vehicle 1, has two DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C, three phase bus bars 16, 16A, 16B, 16C arranged between the two DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C, and a plurality of power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18F arranged between one of the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C and one of the phase bus bars 16, 16A, 16B, 16C. The DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C and the phase bus bars 16, 16A, 16B, 16C are electrically insulated from each other and each have at least one cooling passage 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, 17 through which a dielectric fluid flows. In this case, the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C and the phase bus bars 16, 16A, 16B, 16C each have at least one pluggable electrical contact terminal 12.1, 14.1, 16.1 and at least one pluggable fluid connection portion 13.1, 15.1, 17.1 at both open ends. The pluggable electrical contact terminals 12.1, 14.1, 16.1 and the pluggable fluid connection portions 13.1, 15.1, 17.1 form one combined plug connection terminal each, whereby a plurality of power modules 11, 11A, 11B, 11C can be fluid-tightly connected to each other via the plug connection portions.

[0024] In the illustrated embodiment, the power modules 11, 11A, 11B, 11C are formed as a complete B6 bridge and have six power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18F formed as semiconductor switches or field effect transistors. In this case, each first output terminal of one of the power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18F is directly connected to one corresponding DC bus bar 12, 12A, 12B, 12C, 14, 14A, 14B, 14C, and the second output terminals of the power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18F are connected to one corresponding phase bus bar 16, 16A, 16B, 16C via spacers. The spacers are made of copper in the illustrated embodiment. The connection of the power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18E, 18F to the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C or the spacers is made by sintering in the illustrated embodiment. In one alternative embodiment (not shown), the power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18E, 18F are soldered to the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C or the spacers. The connection of the phase bus bars 16, 16A, 16B, 16C to the copper spacers on both sides is formed by sintering.

[0025] As can be further understood from FIGS. 1 to 5, the two DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C each have three cooling passages 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, and these cooling passages 13, 13A, 13B, 13C, 15, 15A, 15B, 15C each extend parallel to the cooling passage 17 of the three-phase bus bars 16, 16A, 16B, 16C. As can be particularly understood from FIG. 2, in the illustrated embodiment of the power modules 11, 11A, 11B, 11C, the first power semiconductor 18A is disposed between the first cooling passage 13A of the first DC bus bar 12 and the cooling passage 17 of the first-phase bus bar 16A. The second power semiconductor 18B is disposed between the first cooling passage 15A of the second DC bus bar 14 and the cooling passage 17 of the first-phase bus bar 16A. The third power semiconductor 18C is disposed between the second cooling passage 13B of the first DC bus bar 12 and the cooling passage 17 of the second-phase bus bar 16B. The fourth power semiconductor 18D is disposed between the second cooling passage 15B of the second DC bus bar 14 and the cooling passage 17 of the second-phase bus bar 16B. The fifth power semiconductor 18E is disposed between the third cooling passage 13C of the first DC bus bar 12 and the cooling passage 17 of the third-phase bus bar 16C. The sixth power semiconductor 18F is disposed between the third cooling passage 15C of the second DC bus bar 14 and the cooling passage 17 of the third-phase bus bar 16C.

[0026] As can be seen in particular from FIGS. 2, 3 and 5, the individual cooling channels 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, 17 each have a cooling geometry 17.1 in the region of the power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18F. In the illustrated embodiment, the cooling geometry 17.1 has a plurality of cooling pins 17.1A, also referred to as "pin fins". In an alternative embodiment (not shown) of the cooling channels 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, 17, the cooling geometry 17.1 may have a turbulator or protrusions or ribs. As can further be seen from FIGS. 1 to 5, the height of the cooling channel 17 of the phase busbars 16, 16A, 16B, 16C is twice the height of the cooling channels 13, 13A, 13B, 13C, 15, 15A, 15B, 15C of the DC busbars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C. This is because the heat loss of the power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18F is dissipated on both sides of the cooling channel 17 of the phase busbars 16, 16A, 16B, 16C. The cooling channels 13, 13A, 13B, 13C, 15, 15A, 15B, 15C of the DC busbars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C have a heat load only on one side. The diameter and spacing of the cooling pins 17.1A are the same in all the cooling channels 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, 17.

[0027] As can be further understood from FIG. 1, the DC bus bars 12, 12A, 14, 14A and the phase bus bars 16, 16A, 16B, 16C are surrounded by the cover UH1 with the pluggable fluid connection parts 13.1, 15.1, 17.1 and the pluggable electrical contact terminals 12.1, 14.1, 16.1 exposed. As can be further understood from FIG. 1, on the illustrated front surfaces of the power modules 11, 11A, the pluggable fluid connection parts 13.1, 15.1, 17.1 are formed as plug contacts 13.1A, 15.1A, 17.1A. Similarly, the pluggable electrical contact terminals 12.1, 14.1, 16.1 are also formed as plug contacts 12.1A, 14.1A, 16.1A. On the back surfaces of the power modules 11, 11A, 11B, 11C, the pluggable fluid connection parts 13.1, 15.1, 17.1 are formed as plug receiving parts 13.1B, 15.1B, 17.1B. The plug receiving parts 13.1B, 15.1B, 17.1B of the pluggable fluid connection parts 13.1, 15.1, 17.1 on the back surface of the power modules 11, 11A and the plug contacts 13.1A, 15.1A, 17.1A of the pluggable fluid connection parts 13.1, 15.1, 17.1 on the front surface of the power modules 11, 11A are formed such that a fluid-tight plug connection part is formed between the plug contacts 13.1A, 15.1A, 17.1A and the plug receiving parts 13.1B, 15.1B, 17.1B of the cooling passages 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, 17 between two interconnected power modules 11, 11A, 11B, 11C, and are mutually adjusted. Similarly, the pluggable electrical contact terminals 12.1, 14.1, 16.1 on the back surface of the power modules 11, 11A are also formed as plug receiving parts 12.1B, 14.1B, 16.1B.The insertion receiving portions 12.1B, 14.1B, 16.1B of the insertable electrical contact terminals 12.1, 14.1, 16.1 on the back surface of the power modules 11, 11A and the insertion contacts 12.1A, 14.1A, 16.1A of the insertable electrical contact terminals 12.1, 14.1, 16.1 on the front surface of the power modules 11, 11A are formed and adjusted with each other so that a minimum ohmic contact resistance is formed between the insertion contacts 12.1A, 14.1A, 16.1A and the insertion receiving portions 12.1B, 14.1B, 16.1B of the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C and the phase bus bars 16, 16A, 16B, 16C between two mutually connected power modules 11, 11A, 11B, 11C.

[0028] As can be further seen from FIGS. 1 to 3, capacitor terminals KA are arranged on the sides of the DC bus bars 12, 12A, 14, 14A and are led out from the cover UH1. These capacitor terminals KA are in contact connection with the capacitors 26, 26A, 26B, whereby the individual capacitors 26, 26A, 26B are arranged between both DC bus bars 12, 12A, 14, 14A, respectively. Further, the control signal terminals 19 of the power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18F are led out laterally from the cover UH1, and these control signal terminals 19 can be in contact connection with an evaluation and control unit 20 (shown in FIG. 4). The laterally arranged capacitor terminals KA and the laterally arranged control signal terminals 19 are arranged in a common connection plane. The cover UH1 is cast in one transfer molding process by transfer molding. The fluid connection parts 13.1, 15.1, 17.1 are closed before the transfer molding process, whereby there is no risk of the molding material flowing into the corresponding cooling passages 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, 17. After the transfer molding process, the cover layer is removed. The capacitors 26, 26A, 26B, which are cast with a separate dedicated cover UH2, are connected to the capacitor terminals KA after the transfer molding and after the opening of the cooling passages 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, 17. Based on heat conduction, the capacitors 26, 26A, 26B are cooled together via the capacitor terminals KA and the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C. In the illustrated embodiment of the power modules 11, 11A, the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C and the phase bus bars 16, 16A, 16B, 16C are each formed as copper 3D printed components. Of course, other printable thermally conductive and electrically conductive materials can also be used to manufacture the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C and the phase bus bars 16, 16A, 16B, 16C.Furthermore, the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C and the phase bus bars 16, 16A, 16B, 16C can also be manufactured from a thin metal plate as a punched and bent member.

[0029] As can be further seen from FIGS. 4 and 5, the illustrated embodiment of the power electronics 10 according to the present invention for the vehicle 1 has an evaluation / control unit 20 and the above-described three power modules 11A, 11B, 11C that are fluidly and electrically connected to each other via a combined plug-in connection part. The evaluation / control unit 20 is attached to the power electronics 10 that has been molded and assembled.

[0030] As can be further seen from FIGS. 4 and 5, the pluggable electrical contact terminals 12.1, 14.1, 16.1 provided on the front surface of the first power module 11A and the pluggable electrical contact terminals 12.1, 14.1, 16.1 are connected to an interface unit 28 formed as an input interface 28A. The pluggable electrical contact terminals 12.1, 14.1, 16.1 provided on the back surface of the first power module 11A and the pluggable electrical contact terminals 12.1, 14.1, 16.1 are connected to the pluggable electrical contact terminals 12.1, 14.1, 16.1 provided on the front surface of the second power module 11B. The pluggable electrical contact terminals 12.1, 14.1, 16.1 provided on the back surface of the second power module 11B and the pluggable electrical contact terminals 12.1, 14.1, 16.1 are connected to the pluggable electrical contact terminals 12.1, 14.1, 16.1 provided on the front surface of the third power module 11C. The pluggable electrical contact terminals 12.1, 14.1, 16.1 provided on the back surface of the third power module 11C and the pluggable electrical contact terminals 12.1, 14.1, 16.1 are connected to the interface unit 28 formed as an output interface 28B.

[0031] The input interface 28A and / or the output interface 28B have a DC connection part (not shown in detail) of the DC bus bars 12, 12A, 12B, 12C, 14, 14A, 14B, 14C, and means (not shown in detail) for connecting the cooling passages 13, 13A, 13B, 13C, 15, 15A, 15B, 15C, 17 to the cooling circuit 1A (shown in FIG. 6) of the vehicle 1 in which the dielectric fluid flows in the flow direction SR (suggested by the arrow). In this case, the first DC bus bar 12A of the first power module 11A and / or the first DC bus bar 12C of the third power module 11C are connected to the positive pole of a DC power source (not shown). The second DC bus bar 14A of the first power module 11A and / or the second DC bus bar 14C of the third power module are connected to the negative pole of the DC power source. Further, the switching signals of the three phase bus bars 16A, 16B, 16C can be taken out via the input interface. Further, the first DC bus bar 12A of the first power module 11A is connected to the first DC bus bar 12B of the second power module 11B via a pluggable electrical contact terminal 12.1 and a pluggable fluid connection part 13.1. The first DC bus bar 12B of the second power module 11B is connected to the first DC bus bar 12C of the third power module 11C via a pluggable electrical contact terminal 12.1 and a pluggable fluid connection part 13.1. The second DC bus bar 14A of the first power module 11A is connected to the second DC bus bar 14B of the second power module 11B via a pluggable electrical contact terminal 14.1 and a pluggable fluid connection part 15.1. The second DC bus bar 14B of the second power module 11B is connected to the second DC bus bar 14C of the third power module 11C via a pluggable electrical contact terminal 14.1 and a pluggable fluid connection part 15.1. The first phase bus bar 16A of the first power module 11A is connected to the first phase bus bar 16A of the second power module 11B via a pluggable electrical contact terminal 16.1 and a pluggable fluid connection part 17.1.The first phase bus bar 16A of the second power module 11B is connected to the first phase bus bar 16A of the third power module 11C via a pluggable electrical contact terminal 16.1 and a pluggable fluid connection part 17.1. The second phase bus bar 16B of the first power module 11A is connected to the second phase bus bar 16B of the second power module 11B via a pluggable electrical contact terminal 16.1 and a pluggable fluid connection part 17.1. The second phase bus bar 16B of the second power module 11B is connected to the second phase bus bar 16B of the third power module 11C via a pluggable electrical contact terminal 16.1 and a pluggable fluid connection part 17.1. The third phase bus bar 16C of the first power module 11A is connected to the third phase bus bar 16C of the second power module 11B via a pluggable electrical contact terminal 16.1 and a pluggable fluid connection part 17.1. The third phase bus bar 16C of the second power module 11B is connected to the third phase bus bar 16C of the third power module 11C via a pluggable electrical contact terminal 16.1 and a pluggable fluid connection part 17.1.

[0032] As can be further seen from FIG. 4, the control signal terminals 19 of the power semiconductors 18, 18A, 18B, 18C, 18D, 18E, 18F are electrically connected to the evaluation and control unit 20. The three power modules 11A, 11B, 11C each form one complete B6 bridge or inverter segment, and together with the evaluation and control unit 20 and the capacitors 26, 26A, 26B, form one complete inverter. The three power modules 11A, 11B, 11C each form one inverter segment with a power consumption of 40 kW. Thus, the entire inverter has a power consumption of 120 kW. As can be further seen from FIG. 4, the evaluation and control unit 20 has a circuit carrier 22 with three integrated circuits 24 each formed as application-specific integrated circuits 24A, 24B, 24C. The circuit carrier 22 provides additional means for arranging an EMV filter (not shown) at the DC current inlet. The number of integrated circuits 24 is variable depending on the number of plug-in power modules 11A, 11B, 11C or inverter segments.

[0033] As can be seen from FIG. 6, the illustrated embodiment of the vehicle 1 has a power electronics 10 corresponding to the power electronics 10 with three power modules 11, 11A, 11B, 11C described above, and a cooling circuit 1A in which a dielectric fluid is guided internally to cool the vehicle unit. The power electronics 10 is fluid-connected to the cooling circuit 1A via a corresponding interface unit 28. In order to realize an electric drive shaft that is completely cooled by the dielectric fluid, an electric drive 2 and a transmission 3 are fluid-connected to the cooling circuit 1A in parallel with the power electronics 10. Downstream of the component to be cooled, the dielectric fluid is collected in the fluid recovery container 7, then passes through the fluid filter 8 and is sucked in by the fluid pump 9. Downstream of the fluid pump 9, the dielectric fluid is cooled in the heat exchanger 4, for example, by a water / glycol mixture. In order to accurately control the temperature of the dielectric fluid, a bypass circuit 7 (shown in dotted lines) or a bypass to the heat exchanger 4 is also possible.

Claims

1. A power module (11) for the power electronics (10) of a vehicle (1), comprising two DC busbars (12, 14), three phase busbars (16) arranged between the two DC busbars (12, 14), and a plurality of power semiconductors (18) arranged between one of the DC busbars (12, 14) and one of the phase busbars (16) respectively. The DC busbars (12, 14) and the phase busbars (16) are electrically insulated from each other. The DC busbars (12, 14) and the phase busbars (16) each have at least one cooling passage (13, 15, 17) through which a dielectric fluid flows. The DC busbars (12, 14) and the phase busbars (16) each have at least one pluggable electrical contact terminal (12.1, 14.1, 16.1) and at least one pluggable fluid connection part (13.1, 15.1, 17.1) at both open ends. The pluggable electrical contact terminal (12.1, 14.1, 16.1) and the pluggable fluid connection part (13.1, 15.1, 17.1) form a combined plug connection part, whereby a plurality of power modules (11) can be fluid-tightly connected to each other via the plug connection part.

2. Each of the individual power semiconductors (18) is formed as a semiconductor switch. Each first output terminal of the power semiconductor (18) is directly connected to one corresponding DC busbar (12, 14), and the second output terminal of the power semiconductor (18) is connected to one corresponding phase busbar (16) via a spacer. The power module (11) according to Claim 1.

3. The DC busbars (12, 14) each have three cooling passages (13, 15), and the cooling passages (13, 15) extend parallel to the cooling passages (17) of the three phase busbars (16) respectively. The power module (11) according to Claim 2.

4. The first said power semiconductor (18A) is disposed between the first said cooling passage (13A) of the first said DC bus bar (12) and the cooling passage (17) of the first said phase bus bar (16A), and the second said power semiconductor (18B) is disposed between the first said cooling passage (15A) of the second said DC bus bar (14) and the cooling passage (17) of the first said phase bus bar (16A), and the third said power semiconductor (18C) is disposed between the second said cooling passage (13B) of the first said DC bus bar (12) and the cooling passage (17) of the second said phase bus bar (16B), and the fourth said power semiconductor (18D) is disposed between the second said cooling passage (15B) of the second said DC bus bar (14) and the cooling passage (17) of the second said phase bus bar (16B), and the fifth said power semiconductor (18E) is disposed between the third said cooling passage (13C) of the first said DC bus bar (12) and the cooling passage (17) of the third said phase bus bar (16C), and the sixth said power semiconductor (18F) is disposed between the third said cooling passage (15C) of the second said DC bus bar (14) and the cooling passage (17) of the third said phase bus bar (16C). The power module (11) according to claim 3.

5. Each of the said cooling passages (13, 15, 17) has one cooling geometry (17.1) in the region of the said power semiconductor (18). The power module (11) according to claim 1.

6. The said cooling geometry (17.1) includes a plurality of cooling pins (17.1A) or a turbulator or a protrusion or a rib. The power module (11) according to claim 5.

7. The said DC bus bars (12, 14) and the said phase bus bar (16) are surrounded by a cover (UH1) with the said pluggable fluid connection parts (13.1, 15.1, 17.1) and the said pluggable electrical contact terminals (12.1, 14.1, 16.1) exposed. The power module (11) according to claim 1.

8. A capacitor terminal (KA) is arranged laterally to the DC bus bars (12, 14) and is led out from the cover (UH1), and the capacitor terminal (KA) is in contact connection with a capacitor (26), whereby each of the capacitors (26) is electrically arranged between two of the DC bus bars (12, 14) respectively. The power module (11) according to claim 7.

9. A control signal terminal (19) of the power semiconductor (18) is led out laterally from the cover (UH1), and the control signal terminal (19) can be in contact connection with an evaluation / control unit (20). The power module (11) according to claim 8.

10. The capacitor terminal (KA) arranged laterally and the control signal terminal (19) arranged laterally are arranged in a common connection plane. The power module (11) according to claim 9.

11. The DC bus bars (12, 14) and the phase bus bars (16) are formed as 3D printed components or punched and bent components. The power module (11) according to claim 1.

12. Power electronics (10) for a vehicle (1), comprising an evaluation / control unit (20) and at least one power module (11) according to claim 1, wherein a control signal terminal (19) of the power semiconductor (18) is electrically connected to the evaluation / control unit (20). Power electronics (10).

13. A plurality of the power modules (11) forming each inverter segment are interconnected by plug-in connection, forming an entire inverter having a higher output density. The power electronics (10) according to claim 12.

14. A vehicle (1) comprising the power electronics (10) according to claim 12 and a cooling circuit (1A) in which a dielectric fluid is guided internally to cool a vehicle unit, wherein the power electronics (10) is fluid-connected to the cooling circuit (1A) via a corresponding interface unit (28). Vehicle (1).

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