Imprinting apparatus, imprinting method, and method for manufacturing an article

Abstract

To provide an imprint device that can increase the uniformity of the thickness of a residual film in a pattern area of an imprint material.SOLUTION: An imprint device transfers a pattern of a mold to an imprint material on a substrate, and has: the mold that has a pattern area in which the pattern is formed; a substrate holding unit that has a substrate placement surface on which the substrate is placed; a driving unit that drives the mold to press the substrate to which the imprint material is applied at three or more positions; a deformation mechanism that can deform a facing side face of at least one of the mold and the substrate into a convex shape; a mold measuring unit that measures the position of the pattern area in a direction perpendicular to the substrate placement surface; a substrate measuring unit that measures the position of the substrate in a Z direction; and a control unit that controls the pressing force of the driving unit based on the distance in an XY plane parallel to the substrate placement surface between the driving unit and the apex of the convex shape of at least one of the mold and the substrate.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an imprint apparatus, an imprint method, and a method for manufacturing an article.

Background Art

[0002] As a lithography technique for manufacturing semiconductor devices and the like, an imprint technique for molding an imprint material on a substrate using a mold is known. In the imprint technique, the imprint material is cured in a state where the mold and the imprint material on the substrate are in contact with each other, and by peeling the mold from the cured imprint material, an uneven pattern composed of the imprint material can be formed on the substrate.

[0003] In the imprint technique, if bubbles remain in the uneven pattern of the mold when the mold and the imprint material on the substrate are brought into contact with each other, defects may occur in the uneven pattern formed in the imprint material.

[0004] Patent Document 1 discloses a method of reducing the remaining bubbles of the imprint material by deforming at least one of the mold and the substrate into a convex shape and bringing the mold and the substrate into contact with each other.

[0005] Patent Document 2 discloses a method of adjusting the coating amount of the imprint material based on the remaining film thickness of the imprint material in order to improve the uniformity of the pattern dimensions after etching the uneven pattern formed in the imprint material, and improving the uniformity of the remaining film thickness of the uneven pattern.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0007] In order to make the pattern area easily deformable, a cavity (recess) can be formed on the side opposite to the surface having the pattern area so that the thickness of the pattern area and its periphery becomes thinner on at least one of the mold and the substrate. However, the cavity may be formed with the center of the cavity deviated from the center of the pattern area due to, for example, manufacturing errors. As one method for adjusting the uniformity of the remaining film thickness of the imprint material, there is a method of adjusting with the imprinting force when the imprint material on the mold and the substrate comes into contact. However, there is a problem that the remaining film thickness when the imprinting force is applied is affected by the deviation of the center of the cavity from the center of the pattern area, and the uniformity of the remaining film thickness decreases.

[0008] Therefore, an object of the present invention is to provide an imprint apparatus advantageous for improving the uniformity of the remaining film thickness of the pattern area of the imprint material.

Means for Solving the Problems

[0009] In order to achieve the above object, an imprint apparatus according to one aspect of the present invention is an imprint apparatus that transfers a pattern of a mold to an imprint material on a substrate, and includes a mold having a pattern area on which a pattern is formed, a substrate holding portion having a substrate placement surface on which the substrate is placed, a driving portion that drives the mold and presses the substrate coated with the imprint material at three or more positions, a deformation mechanism that can deform the opposing surface of at least one of the mold and the substrate into a convex shape, a mold measurement portion that measures the position of the pattern area of the mold in the Z direction perpendicular to the substrate placement surface, a substrate measurement portion that measures the position of the substrate in the Z direction, and a control portion that controls the pressing force of the driving portion based on the distance in the XY plane parallel to the substrate placement surface between the convex top of at least one of the mold and the substrate deformed by the deformation mechanism and the driving portion.

Effects of the Invention

[0010] According to the present invention, it is possible to provide an imprint apparatus capable of improving the uniformity of the remaining film thickness in the pattern region of the imprint material.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0012] Hereinafter, preferred embodiments of the present invention will be described in detail based on the accompanying drawings. In each figure, the same members or elements are denoted by the same reference numerals, and duplicate explanations are omitted. Note that the drawings shown below may be drawn at a scale different from the actual one in order to facilitate understanding of the present embodiment.

[0013] <First Embodiment> FIG. 1 is a view of the imprint apparatus of the first embodiment. The imprinting apparatus is a device that brings an imprinting material supplied onto a substrate into contact with a mold, applies energy for curing to the imprinting material to cure it, peels the mold from the imprinting material, and forms an uneven pattern of the mold on the imprinting material.

[0014] The imprinting apparatus will be described with reference to FIG. 1. Here, the X direction and the Y direction are respectively the directions parallel to the substrate placement surface on which the substrate 5 is placed and perpendicular to each other, the XY plane is the plane parallel to the substrate placement surface, and the direction perpendicular thereto (the height direction of the imprinting apparatus 1) is the Z direction. As shown in FIG. 1, each axis is determined.

[0015] Here, the imprinting apparatus 1 that employs a photocuring method of curing the imprinting material by irradiating light among imprinting techniques will be described.

[0016] The light source 2 is an illumination means that irradiates light 16 (for example, ultraviolet rays) for curing the imprinting material 14 during the imprinting process. The light 16 emitted from the light source 2 is irradiated onto the imprinting material after being adjusted by the optical element 15.

[0017] The mold 3 is a mold having a predetermined pattern formed on the surface facing the substrate 5 and held by the mold holding portion 4. The mold 3 is usually made of a material such as quartz that can transmit ultraviolet rays, and on the surface on the substrate side (pattern surface), it has a pattern region in which an uneven pattern to be transferred to the substrate 5 as a device pattern is formed. Further, in order to make the pattern region easily deformable, a cavity (recess) is formed on the side opposite to the pattern surface on which the pattern is formed so that the thickness of the pattern region and its periphery becomes thin. This cavity becomes a substantially sealed space when the mold 3 is held by the mold holding portion 4. The cavity is connected to a pressure adjusting portion that adjusts the pressure of the fluid (gas) in the cavity. The mold holding portion 4, the mold 3 having the cavity (recess), and the pressure adjusting portion that adjusts the pressure in the cavity constitute a deformation mechanism capable of deforming the pattern surface of the mold 3 into a convex shape.

[0018] By changing the pressure inside the cavity of the mold 3, the pattern area of the mold 3 is deformed into a convex shape protruding toward the substrate 5. For example, when bringing the mold 3 and the substrate 5 closer to contact the imprint material on the mold 3 and the substrate 5, the pressure adjustment unit increases the pressure inside the cavity higher than the external pressure, for example, by supplying compressed air into the cavity. As a result, the pressure adjustment unit can deform the pattern area of the mold 3 into a convex shape protruding toward the substrate 5, and gradually expand the contact area between the mold 3 and the imprint material during the contact process. Consequently, it is possible to reduce the remaining bubbles in the concave-convex pattern (recess) of the mold 3 that has contacted the imprint material, and reduce the occurrence of defects in the pattern formed on the imprint material by the imprint process.

[0019] In a state where the mold holding unit 4 holds the mold 3, there are a drive mechanism for moving the mold 3 in the Z direction by the actuator 17 (drive unit), and a drive mechanism for tilting the mold 3 according to the tilt of the mold 3 and the substrate 5. Further, the mold holding unit 4 may have a drive mechanism for moving the mold holding unit 4 within the XY plane. Also, the mold holding unit 4 has a mechanism for applying pressure to the mold 3 to deform the shape of the mold 3.

[0020] The substrate holding unit 6 has a substrate mounting surface for holding the substrate 5 by vacuum adsorption or electrostatic adsorption, and is a holding means movable within the XY plane. The substrate holding unit 6 is driven within the XY plane along the mounting surface of the stage base plate 12 of the imprint apparatus 1. In this case, the reference for the position and tilt in the Z direction when the substrate holding unit 6 is driven within the XY plane is the stage base plate 12. The stage base plate 12 is configured on the mount 13, and the imprint apparatus 1 has a structure that is less affected by vibrations from the floor. Further, the substrate holding unit 6 may have a drive mechanism for moving the substrate 5 in the Z direction, and a rotation mechanism for rotating the substrate 5 about the X axis and the Y axis. Also, the substrate holding unit 6 has a mechanism for applying pressure to the substrate 5 to deform the shape of the substrate 5, and the mold measurement unit 8.

[0021] The mold measurement unit 8 is a distance measuring instrument capable of measuring the distance in the Z-axis direction between each position within the surface of the mold and the mold measurement unit 8 (the position in the Z-axis direction of each position within the surface of the mold). By moving the substrate holding unit 6 along the XY plane, the mold measurement unit 8 can measure each position (the entire surface) within the surface of the mold 3. Further, the mold measurement unit 8 does not necessarily have to be mounted on the substrate holding unit 6 and may be provided in a mechanism different from the substrate holding unit 6. Also in that case, by moving the mold measurement unit 8 along the XY plane, each position on the surface of the mold 3 can be measured.

[0022] The imprint apparatus 1 is provided with a substrate measurement unit 9 capable of measuring the position in the Z-axis direction at each position within the surface of the substrate 5. The substrate measurement unit 9 is a distance measuring instrument capable of measuring the distance in the Z-axis direction between each position within the surface of the substrate 5 and the substrate measurement unit 9. By moving the substrate holding unit 6 along the XY plane, the substrate measurement unit 9 can measure each position (the entire surface) within the surface of the substrate 5. Even without the substrate holding unit 6 moving along the XY plane, the surface of each position of the substrate 5 may be measured by the substrate measurement unit 9 moving along the XY plane.

[0023] The imprint material supply unit 7 is a supply means for supplying the imprint material 14 onto the substrate 5. As the imprint material 14, a curable composition (sometimes also referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, etc. are used. As the electromagnetic waves, for example, light such as infrared rays, visible light, ultraviolet rays, etc., whose wavelength is selected from the range of 10 nm or more and 1 mm or less, is used.

[0024] The curable composition is a composition that cures by irradiation with light or by heating. Among these, the photocurable composition that cures by light contains at least a polymerizable compound and a photoinitiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, etc.

[0025] The imprinting material 14 is applied onto the substrate in a film form by a spin coater or a slit coater. Alternatively, it may be applied onto the substrate 5 in a droplet form or in an island or film form formed by connecting a plurality of droplets by a liquid injection head. The viscosity of the imprinting material (viscosity at 25 degrees Celsius) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0026] As the substrate 5, glass, ceramics, metal, semiconductor, resin, etc. are used, and if necessary, a member made of a material different from that of the substrate 5 may be formed on its surface. Specifically, as the substrate 5, a silicon wafer, a compound semiconductor wafer, quartz glass, etc. are used.

[0027] The mold transfer device 10 is a transfer means for carrying the mold 3 into the mold holding portion 4 or out of the imprinting device 1. Further, the substrate transfer device 11 is a transfer means for carrying the substrate 5 into the substrate holding portion 6 or out of the imprinting device 1.

[0028] In the conventional imprinting process, the Z-direction position of the surface of the mold 3 is measured at a plurality of points in the pattern transfer region by the mold measurement unit 8. Also, the Z-direction position of the surface of the substrate 5 is measured at a plurality of points in the pattern transfer region by the substrate measurement unit 9. Then, the inclination of the mold 3 is adjusted by the actuator 17 so that the inclinations of the mold 3 and the substrate 5 become relatively parallel. Next, the imprinting material 14 is applied from the imprinting material supply unit 7 to the substrate 5. Then, the pressure (cavity pressure) in the cavity of the mold 3 is increased, and the surface of the mold 3 on which the concavo-convex pattern is formed is deformed into a convex shape. In this state, the mold 3 and the imprinting material 14 on the substrate 5 are brought into contact with each other, the cavity pressure is decreased, and while the convex shape of the formation surface of the concavo-convex pattern of the mold 3 is restored, the entire surface of the pattern region is brought into contact for imprinting. Also, when the mold 3 and the imprinting material 14 are brought into contact with each other, an imprinting force can be applied by the actuator 17 to adjust the uniformity of the residual film thickness of the imprinting material 14.

[0029] However, as shown in FIG. 2, if the center of the cavity of the mold 3 is displaced from the center of the pattern area due to manufacturing errors or the like of the cavity of the mold 3, the deformation center (Om) of the mold 3 may be displaced from the center of the pattern area. As a result, the uniformity of the remaining film thickness of the imprint material when the imprint force is applied at the pressing positions P1, P2, and P3 may decrease. The actuator 17 that applies the imprint force presses the mold 3 in the direction (Z direction) toward the substrate 5 at three or more positions (pressing positions).

[0030] In the case of adjusting the uniformity of the remaining film thickness of the imprint material with the imprint force applied at three locations, a method for reducing the influence of the deviation between the cavity center and the pattern area center on the remaining film thickness and improving the uniformity of the remaining film thickness will be described.

[0031] In the imprint process, with the mold 3 in a flat state (a state in which no cavity pressure is applied), the position of the surface of the mold 3 in the Z direction is measured at a plurality of points in the pattern area by the mold measurement unit 8. Also, the position of the surface of the substrate 5 in the Z direction is measured at a plurality of points in the pattern transfer area by the substrate measurement unit 9, and the inclination of the mold 3 is adjusted by the actuator 17 so that the inclinations of the mold 3 and the substrate 5 are relatively parallel. Here, the adjustment of the inclination will be described as a form in which the mold 3 is moved by the actuator 17. However, the present invention is not limited to this, and the substrate holding unit 6 may be moved to adjust the parallelism.

[0032] Subsequently, a cavity pressure is applied to the mold 3 to deform the surface of the pattern area of the mold 3 into a convex shape with respect to the substrate 5. In this state, the position of the surface of the mold 3 in the Z direction is measured at a plurality of points in the pattern area by the mold measurement unit 8, and the coordinates of the deformation center of the mold 3 are obtained. Here, the deformation center is the position where the Z direction position at each position on the surface (XY plane) of the mold 3 on the substrate 5 side is the most substrate side (the Z position is the smallest), and the coordinates of the deformation center are the XY coordinates of that position.

[0033] Next, an imprint material 14 supplied from the imprint material supply unit 7 is applied to the substrate 5. Then, with the mold 3 deformed into a convex shape by applying a cavity pressure, after bringing the mold 3 into contact with the imprint material 14 on the substrate 5, while reducing the cavity pressure, the entire surface of the pattern region is brought into contact and imprinted.

[0034] The imprinting force when the mold 3 is brought into contact with the imprint material 14 is set as follows. The sum of the product of the vector in the XY plane from the deformation center of the mold 3 to the position of each actuator 17 and the distribution ratio of the pressing force of the actuator 17 is set to be zero for the distribution ratio of the pressing force of each actuator 17. Here, the deformation center of the mold 3 is the position of the top of the convex shape. For example, when the imprinting force is applied by the actuators 17 arranged at three locations, when the vector in the XY plane from the deformation center of the mold 3 to the position of the nth actuator 17 is Vn(=(Xn,Yn)) and the distribution ratio of the pressing force of the nth actuator is Rn,

Equation

Equation

Equation

Equation

[0035] In this way, based on the relationship between the deformation center of the mold 3 and the positions of the respective actuators 17, the distribution ratio of the pressing force of each actuator 17 is set. Thereby, the influence of the deviation between the deformation center of the mold 3 and the pattern region center on the residual film thickness can be reduced, and the uniformity of the residual film thickness can be improved.

[0036] Here, when the angles between the three lines connecting the three actuators 17 and the deformation center of the mold 3 can be approximated to 120 degrees, the distribution ratio can be obtained simply as follows. When the distances in a plane parallel to the substrate mounting surface between the deformation center of the mold 3 and the positions of the three actuators 17 are respectively denoted as Ln (n = 1, 2, 3), the distribution ratio Rn (n = 1, 2, 3) of the pressing force of the n-th actuator 17 is

Equation

[0037] Note that the approximation that the angles between the three lines connecting the three actuators 17 and the deformation center of the mold 3 can be 120 degrees refers to the case where the angle range is 110 to 130 degrees. Further, this angle range is preferably 115 to 125 degrees, more preferably 118 to 122 degrees, and even more preferably 119 to 121 degrees.

Embodiment

[0038] The imprinting method by the imprinting apparatus according to the first embodiment will be described with reference to FIG. 3. The imprinting method of the present invention is controlled and executed by a control device (control unit) (not shown) according to the processing flow shown in the flowchart of FIG. 3. Here, the imprinting apparatus of the first embodiment is configured such that the center of the cavity of the mold 3 is located within the triangle formed by the three actuators 17 in the XY plane.

[0039] First, in S101, with the pattern surface of the mold 3 flattened (i.e., no pressure is applied in the cavity), while moving the mold holding part 4 or the substrate holding part 6 within the XY plane, the mold measuring part 8 measures the Z-direction position of the mold 3 at multiple points in the pattern region. Also, the substrate measuring part 9 measures the Z-direction position of the substrate 5 at multiple points in the pattern transfer region.

[0040] In S102, the actuator 17 adjusts the inclination of the mold 3 so that the inclinations of the mutually facing surfaces of the mold 3 and the substrate 5 become relatively parallel.

[0041] In S103, cavity pressure is applied to the mold 3 to deform the pattern surface facing the substrate 5 into a convex shape.

[0042] In S104, with the pattern surface of the mold 3 deformed into a convex shape, the mold measuring part 8 measures the distance between the mold measuring part 8 and the mold 3 (the Z-direction position of the surface of the mold 3 facing the substrate 5) at multiple points in the pattern region, and obtains the coordinates of the deformation center (top) of the mold 3.

[0043] In S105, the imprint material 14 supplied from the imprint material supply part 7 is applied to the substrate 5.

[0044] In S106, with the mold 3 deformed into a convex shape, the mold 3 is brought into contact with the imprint material 14 on the substrate 5, and the entire surface of the pattern region is brought into contact while reducing the cavity pressure.

[0045] Next, in S107, the imprinting force for bringing the mold 3 into contact with the imprinting material 14 and pressing is an imprinting force based on the inverse ratio of the distance between the deformation center of the mold and each actuator, and each of the three actuators 17 is controlled. Lm1, Lm2, and Lm3 in formulas (6), (7), and (8) are distances in a plane parallel to the substrate placement surface between the deformation center of the mold 3 and the pressing positions of each of the three actuators, as shown in FIG. 4. Also, let the total value of the imprinting forces of the three actuators 17 be F, and the imprinting forces of the three actuators be F1, F2, and F3, respectively.

Number

Number

Number

[0046] Next, in S108, the light 16 (for example, ultraviolet light) from the light source 2 is irradiated onto the imprinting material 14 to cure it.

[0047] Thereafter, in S109, the mold 3 is peeled off from the imprinting material 14, and an uneven pattern of the mold is formed on the imprinting material 14.

[0048] In this way, by controlling the distribution ratio of the pressing force based on the distance (inverse ratio) from the deformation center of the mold 3 to the position of each actuator 17, the influence of the deviation between the deformation center of the mold 3 and the pattern region center on the residual film thickness can be reduced, and the uniformity of the residual film thickness can be improved.

[0049] In this embodiment, the cavity pressure was applied to the mold 3 to deform it into a convex shape, and the imprint material 14 on the mold 3 and the substrate 5 was brought into contact. However, the present invention is not limited to this. Instead of the mold 3, the substrate 5 may have a mechanism for deforming the surface on the mold 3 side into a convex shape, and the mold 3 may be in contact with the imprint material 14 on the substrate 5 whose surface on the side facing the mold 3 is deformed into a convex shape. That is, either the mold 3 or the substrate 5 may have a mechanism for deforming the opposing surface into a convex shape.

[0050] In the first embodiment, the three actuators 17 are configured such that the center of the cavity of the mold 3 is located within the triangle formed in the XY plane. However, the three line segments connecting the three actuators 17 and the deformation center of the mold 3 form angles within the range of 110 to 130 degrees with each other. The said angle is preferably 115 to 125 degrees, more preferably 118 to 122 degrees, and even more preferably 119 to 121 degrees, so that the effects of the present invention can be more preferably enjoyed.

[0051] <Second Embodiment> The second embodiment of the present invention in which cavity pressure is applied to both the mold 3 and the substrate 5 to deform and imprint will be described with reference to FIG. 1.

[0052] In the second embodiment, in addition to the configuration of the first embodiment, the difference is that not only the mold 3 but also the substrate 5 has a mechanism for deforming the surface on the mold 3 side into a convex shape. That is, a pressure adjustment unit (not shown) also adjusts the pressure of the fluid (gas) in a substantially sealed space (cavity (recess)) formed between the substrate holding portion 6 and the substrate 5 adsorbed to the substrate holding portion 6 so as to deform the surface of the substrate 5 on the mold 3 side into a convex shape. The mold holding portion 4, the mold 3, the substrate holding portion 6, and the pressure adjustment unit for adjusting the pressure in the cavity constitute a deformation mechanism for deforming the pattern surface of the mold 3 and the substrate 5 into a convex shape.

[0053] In the conventional imprint process, the mold measurement unit 8 measures the Z-direction position of the surface of the mold 3 at multiple points in the pattern transfer region. Also, the substrate measurement unit 9 measures the Z-direction position of the surface of the substrate 5 at multiple points in the pattern transfer region. Then, the actuator 17 adjusts the inclination of the mold 3 so that the inclinations of the mold 3 and the substrate 5 become relatively parallel. Next, the imprint material 14 is applied from the imprint material supply unit 7 to the substrate 5. Then, with a cavity pressure applied to both the mold 3 and the substrate 5 to deform them into a convex shape, the imprint material 14 on the mold 3 and the substrate 5 is brought into contact, and while reducing the cavity pressure, the entire surface of the pattern region is brought into contact for imprinting. Also, when the mold 3 comes into contact with the imprint material 14, an imprinting force can be applied by the three actuators 17 to adjust the uniformity of the residual film thickness of the imprint material 14.

[0054] However, as shown in FIG. 5, when the cavity center is formed offset from the center of the pattern region due to a manufacturing error of the cavity or the like, there is a possibility that the deformation center (Om) of the mold 3 and the deformation center (Os) of the substrate 5 are formed offset from the center of the pattern region. As a result, the uniformity of the residual film thickness of the imprint material 14 when an imprinting force is applied may decrease. The actuator 17 that applies the imprinting force presses the mold 3 in the direction of the substrate 5 (Z direction) at at least three positions.

[0055] In the case of adjusting the uniformity of the residual film thickness of the imprint material 14 with an imprinting force applied at three locations, a method for reducing the influence of the deviation between the cavity center and the pattern region center on the residual film thickness and improving the uniformity of the residual film thickness will be described.

[0056] In the imprinting process, in a state where the mold 3 is flattened (a state where no cavity pressure is applied to the mold 3), the mold measuring unit 8 measures the position in the Z direction of the surface of the mold 3 at a plurality of points in the pattern region. Also, in a state where the substrate 5 is flattened (a state where no cavity pressure is applied to the substrate holding unit 6), the substrate measuring unit 9 measures the position in the Z direction of the surface of the substrate 5 at a plurality of points in the pattern transfer region. Based on the measurement results, the actuator 17 adjusts the inclination of the mold 3 so that the inclinations of the mold 3 and the substrate 5 are relatively parallel. Here, the adjustment of the inclination will be described as a form in which the mold 3 is moved by the actuator 17, but the present invention is not limited to this, and the substrate holding unit 6 may be moved to adjust the parallelism.

[0057] Subsequently, a cavity pressure is applied to the mold 3, and the surface of the pattern region of the mold 3 is deformed into a convex shape with respect to the substrate 5. In this state, the mold measuring unit 8 measures the distance from the mold 3 (the position in the Z direction of the surface of the mold 3) at a plurality of points in the pattern region, and obtains the coordinates of the deformation center of the mold 3. Here, the deformation center is the position of the XY coordinates where the position in the Z direction of the surface (XY plane) of the mold 3 on the substrate 5 side is closest to the substrate side (the Z position is the smallest).

[0058] Furthermore, a cavity pressure is also applied to the substrate 5 side, and in a state where the surface of the substrate 5 on the mold 3 side is deformed into a convex shape, the substrate measuring unit 9 measures the distance from the substrate 5 (the position in the Z direction of the surface of the substrate 5) at a plurality of points in the pattern transfer region, and obtains the coordinates of the deformation center of the substrate 5. Here, the deformation center is the position of the XY coordinates where the position in the Z direction of the surface (XY plane) of the substrate 5 on the mold 3 side is closest to the mold 3 side (the Z position is the largest).

[0059] Next, the imprinting material 14 is applied from the imprinting material supply unit 7 to the substrate 5. Then, in a state where both the mold 3 and the substrate 5 are given a cavity pressure and deformed into a convex shape, after bringing the imprinting material 14 on the mold 3 and the substrate 5 into contact, while reducing the cavity pressure of the mold 3 and the substrate 5, the entire surface of the pattern region is brought into contact and imprinted.

[0060] When the mold 3 and the imprinting material 14 are brought into contact with each other, the imprinting force is set as follows. The first distribution ratio of the pressing force of each actuator 17 is set so that the sum of the product of the vector in the XY plane from the deformation center of the mold 3 to the position of each actuator 17 and the first distribution ratio of the pressing force of the actuator 17 becomes zero. For example, when the imprinting force is applied by the actuators 17 arranged at three locations, if the vector in the XY plane from the deformation center of the mold 3 to the position of the n-th actuator 17 is Vmn (= (Xmn, Ymn)) (n = 1, 2, 3), and the first distribution ratio of the pressing force of the n-th actuator is Rmn (n = 1, 2, 3),

Equation

Equation

Equation

Equation

[0061] Similarly, the second distribution ratio of the pressing force of each actuator 17 is set so that the sum of the product of the vector in the XY plane from the deformation center of the substrate 5 to the position of each actuator 17 and the second distribution ratio of the pressing force of the actuator 17 becomes zero. When the imprinting force is applied by the three actuators 17, if the vector in the XY plane from the deformation center of the substrate 5 to the position of the n-th actuator 17 is Vsn (= (Xsn, Ysn)) (n = 1, 2, 3), and the second distribution ratio of the pressing force of the n-th actuator is Rsn (n = 1, 2, 3),

Equation

Equation

Number

Number

[0062] From the above, the imprinting force F applied by the three actuators 17 is controlled to be distributed with the distribution ratio Rn = Rmn + Rsn for the n-th actuator 17 (n = 1, 2, 3).

[0063] In this way, based on the relationship between the deformation center of the mold 3 and the positions of the respective actuators 17, and the relationship between the deformation center of the substrate 5 and the positions of the respective actuators 17, the distribution ratio of the pressing force of each actuator 17 is set. Thereby, the influence of the deviation between the cavity center and the pattern region center of the mold 3 on the remaining film thickness can be reduced, and the uniformity of the remaining film thickness can be improved.

[0064] Here, when the angles between the three line segments connecting the three actuators 17 and the deformation center of the mold 3 and the angles between the three line segments connecting the three actuators 17 and the deformation center of the substrate 5 can be approximated by 120 degrees, the distribution ratio can be obtained simply as follows. Let the distances between the deformation center of the mold 3 and the positions of the three actuators 17 be Lmn (n = 1, 2, 3) respectively, and the distances in the plane parallel to the substrate mounting surface between the deformation center of the substrate 5 and the respective pressing positions of the three actuators 17 be Lsn (n = 1, 2, 3) respectively. Then, the distribution ratio Rn (n = 1, 2, 3) of the pressing force of the n-th actuator 17 is

Number

[0065] Note that the approximation that the angle between the three lines connecting the three actuators 17 and the deformation centers of the mold 3 and the substrate 5 can be 120 degrees refers to the case where the angle range is 110 to 130 degrees. Further, this angle range is preferably 115 to 125 degrees, more preferably 118 to 122 degrees, and even more preferably 119 to 121 degrees.

Example

[0066] With reference to FIGS. 6 and 7, an imprint method by an imprint apparatus according to a second embodiment will be described. The imprint method of the present invention is controlled and executed by a control device (control unit) not shown according to the processing flow shown in the flowchart of FIG. 6. Here, the imprint apparatus of the second embodiment is configured such that the center of the cavity of the mold 3 and the center of the cavity of the substrate 5 are located within the triangle formed by the three actuators 17 in the XY plane.

[0067] First, in S201, with the pattern surface of the mold 3 being flat (a state where no pressure is applied to the cavity), while moving the mold holding unit 4 or the substrate holding unit 6 in the XY plane, the Z-direction position of the mold 3 is measured at a plurality of points in the pattern region by the mold measurement unit 8.

[0068] In S202, with the substrate 5 being flat (a state where no pressure is applied to the cavity), the distance between the substrate measurement unit 9 and the substrate 5 (the Z-direction position of the substrate 5) is measured at a plurality of points in the pattern transfer region by the substrate measurement unit 9.

[0069] In S203, the inclination of the mold 3 is adjusted by the actuator 17 so that the inclinations of the mutually facing surfaces of the mold 3 and the substrate 5 become relatively parallel.

[0070] In S204, cavity pressure is applied to the mold 3 to deform the pattern surface facing the substrate 5 into a convex shape.

[0071] In S205, cavity pressure is also applied to the substrate 5 side to deform the surface of the substrate 5 facing the mold 3 into a convex shape.

[0072] In S206, with the surface of the mold 3 facing the substrate 5 deformed into a convex shape, the mold measurement unit 8 measures the distance between the mold measurement unit 8 and the mold 3 (the Z-direction position of the mold 3) at a plurality of points in the pattern region, and acquires the coordinates of the deformation center (top) of the mold.

[0073] In S207, with the surface of the substrate 5 facing the mold 3 deformed into a convex shape, the substrate measurement unit 9 measures the distance between the substrate measurement unit 9 and the substrate 5 (the Z-direction position of the surface of the substrate 5) at a plurality of points in the pattern transfer region, and obtains the coordinates of the deformation center of the substrate 5.

[0074] In S208, the imprint material 14 is applied to the substrate 5 from the imprint material supply unit 7.

[0075] In S209, with cavity pressure applied to both the mold 3 and the substrate 5 to deform them into convex shapes, after bringing the imprint material 14 on the mold 3 and the substrate 5 into contact, the entire surface of the pattern region is brought into contact while gradually reducing the cavity pressure on both sides.

[0076] In S210, when the imprinting force when the mold 3 and the imprinting material 14 are in contact is the imprinting force based on the inverse ratio of the distances between the respective deformation centers of the mold 3 and the substrate 5 and the respective actuators 17, each of the three actuators 17 is controlled. Lm1, Lm2, Lm3, Ls1, Ls2, Ls3 in formulas (19), (20), and (21) are the distances in the XY plane parallel to the substrate mounting surface between the respective deformation centers of the mold 3 (Fig. 7(a)) and the substrate 5 (Fig. 7(b)) and the pressing positions of the respective actuators 17, as shown in Fig. 7. Also, let the total value of the imprinting forces of the three actuators 17 be F, and the imprinting forces of the respective actuators 17 be (F1, F2, F3).

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[0077] Next, in S211, light 16 (for example, ultraviolet light) from the light source 2 is irradiated onto the imprinting material 14 to cure it.

[0078] Thereafter, in S212, the mold 3 is peeled from the imprinting material 14, and an uneven pattern of the mold is formed on the imprinting material 14.

[0079] In this way, the distribution ratio of the pressing forces of the respective actuators 17 is set and controlled based on the inverse ratio of the distances from the deformation center of the mold 3 to the positions of the respective actuators 17 and the inverse ratio of the distances from the deformation center of the substrate 5 to the positions of the respective actuators 17. Thereby, the influence of the deviation between the cavity center and the pattern region center of the mold 3 on the residual film thickness can be reduced, and the uniformity of the residual film thickness can be improved.

[0080] The imprint apparatus of the second embodiment is configured such that the centers of the cavities of the mold 3 and the substrate 5 are located within the triangle formed by the three actuators 17 in the XY plane. Also, the three line segments connecting the three actuators 17 and the deformation center of the mold 3 form angles within the range of 110 to 130 degrees with each other, and the three line segments connecting the three actuators 17 and the deformation center of the substrate 5 form angles within the range of 110 to 130 degrees with each other. The angle range of 110 to 130 degrees is preferably 115 to 125 degrees, more preferably 118 to 122 degrees, and even more preferably 119 to 121 degrees, so that the effects of the present invention can be more preferably enjoyed.

[0081] <Embodiment of a method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The pattern of the cured product formed using the imprint apparatus is permanently used for at least a part of various articles, or temporarily used when manufacturing various articles.

[0082] The article is an electric circuit element, an optical element, MEMS, a recording element, a sensor, or a mold or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold and the like. The pattern of the cured product is used as it is as at least a part of the constituent members of the above article, or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

[0083] The manufacturing method of the article of the present embodiment includes a step of forming a pattern on the resin coated on the substrate using the above imprint apparatus (a step of performing an imprint process on the substrate), and a step of processing the substrate on which the pattern has been formed in such a step. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The manufacturing method of the article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0084] <Other embodiments> The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiment to a system or apparatus via a network or a storage medium, and having one or more processors in the computer of the system or apparatus read and execute the program. Further, it can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

[0085] As described above, the preferred embodiments of the present invention have been described, but it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof.

Description of reference numerals

[0086] 1 Imprint apparatus 3 Mold 6 Substrate holding part 8 Mold measurement part 9 Substrate measurement part 14 Imprint material 17 Actuator (drive part)

Claims

1. An imprinting apparatus for transferring a pattern of a mold to an imprint material on a substrate, comprising: a mold having a pattern region where a pattern is formed; a substrate holding part having a substrate placement surface on which the substrate is placed; a driving part that drives the mold and presses the substrate coated with the imprint material at three or more positions; a deformation mechanism capable of deforming at least one of the opposing surfaces of the mold and the substrate into a convex shape; a mold measurement part that measures the position of the pattern region of the mold in the Z direction perpendicular to the substrate placement surface; a substrate measurement part that measures the position of the substrate in the Z direction; a control part that controls the pressing force of the driving part based on the distance in the XY plane parallel to the substrate placement surface between at least one convex top of the mold and the substrate deformed by the deformation mechanism and the driving part. The imprinting apparatus is characterized by having the above components.

2. The deformation mechanism is capable of deforming the surface of the mold facing the substrate into a convex shape, and the control part controls the pressing force of the driving part based on the distance in the XY plane between the convex top of the mold deformed by the deformation mechanism and the driving part. The imprinting apparatus according to claim 1, characterized by the above.

3. The deformation mechanism is capable of deforming the surface of the substrate facing the mold into a convex shape, and the control part controls the pressing force of the driving part based on the distance in the XY plane between the convex top of the substrate held by the substrate holding part deformed by the deformation mechanism and the driving part. The imprinting apparatus according to claim 1 or 2, characterized by the above.

4. The driving part includes a plurality of actuators arranged at different positions, and the control part controls the pressing force of each of the plurality of actuators based on the distance in the XY plane between at least one convex top of the mold and the substrate deformed by the deformation mechanism and each of the plurality of actuators. The imprinting apparatus according to any one of claims 1 to 3, characterized by the above.

5. The imprinting apparatus according to claim 4, characterized in that the driving part has three actuators.

6. The top of the convex shape of the mold is obtained based on the Z-direction position measured by the mold measurement unit at a plurality of positions in the region where the pattern of the surface of the mold deformed into a convex shape by the deformation mechanism is formed. The imprint apparatus according to claim 3, characterized in that.

7. The top of the convex shape of the substrate is obtained based on the Z-direction position measured by the substrate measurement unit at a plurality of positions in the transfer region of the pattern on the surface of the substrate deformed into a convex shape by the deformation mechanism. The imprint apparatus according to claim 4, characterized in that.

8. The control unit controls the pressing force of the driving unit based on the inverse ratio of the distance in the XY plane between the top of the convex shape of at least one of the mold and the substrate deformed by the deformation mechanism and the driving unit. The imprint apparatus according to claim 2, characterized in that.

9. An imprint method for transferring a pattern of a mold to an imprint material on a substrate, using an imprint apparatus capable of deforming the surface on at least one opposing side of the mold and the substrate into a convex shape, Adjust the parallelism of the opposing surfaces of the mold and the substrate in which at least one of the opposing surfaces of the mold and the substrate has not been deformed into a convex shape, Deform at least one of the opposing surfaces of the mold and the substrate into a convex shape, Obtain the position of the top of the convex shape of at least one of the opposing surfaces of the mold and the substrate deformed into a convex shape, Press a mold having a pattern region where a pattern is formed against a substrate coated with an imprint material at three or more pressing positions, Based on the distance in a plane parallel to the surface on which the substrate is placed between the top of the convex shape of at least one of the mold and the substrate deformed into a convex shape and the three or more pressing positions, control the pressing force at the three or more pressing positions, An imprint method characterized by that.

10. The pressing force at the three or more pressing positions is controlled based on the inverse ratio of the distance in a plane parallel to the surface on which the substrate is placed between the top of the convex shape of at least one of the mold and the substrate deformed into a convex shape and the three or more pressing positions. The imprint method according to claim 9, characterized in that.

11. A step of forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 8, A step of processing the substrate on which the pattern has been formed in the previous step; A method for manufacturing an article, characterized by comprising the above.

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