Method and apparatus for transferring a component

Abstract

To provide an improved method and device for transferring components from a sender substrate to a receiver substrate.SOLUTION: A method for the transfer of components 2 from a sender substrate to a receiver substrate 8 at least includes provision and / or production of the components 2 on the sender substrate, transfer of the components 2 on the sender substrate to a transfer substrate 4, and transfer of the components 2 from the transfer substrate to the receiver substrate 8, in the stated order. The components 2 can be transferred selectively by means of bonding means 6 and / or debonding means 7.SELECTED DRAWING: Figure 1e

Description

Technical Field

[0001] The present invention relates in particular to a method for transferring electronic components from a sending substrate to a receiving substrate.

[0002] The prior art shows a very diverse range of methods for transporting product substrates from one support substrate to another. Such a support exchange process is described in detail, for example, in the publication WO 2011 / 120537. In recent years, it has increasingly become the case that functional individual components are stacked on top of one another or arranged adjacent to one another. Of particular importance here is that only components that have passed a preceding, in particular electrical, inspection are transported. This eliminates the risk of defective components being transported.

[0003] Accordingly, the object of the present invention is to provide a method and an apparatus which at least partially eliminate, in particular completely eliminate, the disadvantages described in the prior art. In particular, the object of the present invention is to provide an improved method and apparatus for transporting components from a sending substrate to a receiving substrate. Another object of the present invention is to provide an improved method and apparatus for manufacturing light-emitting diodes, in which individual components are transported from a sending substrate to a receiving substrate. A further object of the present invention is to provide a method and an apparatus in which defective components are not transported to the receiving substrate or only components having specific properties are transported to the receiving substrate.

[0004] The above problems are solved by the features of each independent claim. Advantageous developments of the present invention are described in each dependent claim. All combinations of at least two features shown in the description, the claims and / or the drawings are also included within the scope of the present invention. In the ranges of values described, values within the recited boundaries should also be regarded as being disclosed as boundary values and can be claimed in any combination. In the following text, a component is understood to mean an object to be transported. A component does not necessarily have to have functionality by itself.

[0005] Accordingly, the present invention relates, in particular, to a method for transferring, in particular electronic components, from a feed-side substrate to a receiving-side substrate, the method having, in particular, in the order given above: i) providing and / or manufacturing a component on a feed-side substrate; ii) transferring the component of the feed-side substrate to a transfer substrate; iii) transferring the component from the transfer substrate to a receiving-side substrate, wherein these components can be selectively transferred using joining means and / or peeling means.

[0006] During the transfer, the component may be placed or fixed on the feed-side substrate. It is also conceivable that the component is manufactured on the feed-side substrate and, after its manufacture, is arranged on the feed-side substrate. In particular, electronic components are very small components used, in particular, in the semiconductor industry.

[0007] The transfer in step ii) can in particular be understood as the taking over of the component by the transfer substrate. The transfer in step iii) can in particular be understood as the handover of the component to the receiving-side substrate. During the transfer in step ii), the component arranged on the feed-side substrate can be brought into contact with the transfer substrate.

[0008] When a component is fixed to the feed-side substrate, this fixing may be released, particularly selectively for each individual component, during transfer to the transport substrate. Similarly, the component may be fixed to the transport substrate for transfer, particularly selectively for each individual component.

[0009] During transfer of the component to the receiving-side substrate, similarly, the component or the transport substrate may come into contact with the receiving-side substrate and / or other components arranged on the receiving-side substrate. Other components arranged on the receiving-side substrate are, in particular, components transferred from this feed-side substrate and / or other feed-side substrates to this receiving-side substrate in a method performed previously.

[0010] The fixing on the transport substrate is particularly selectively releasable. The component is joined, particularly using joining means and particularly by laser, to the receiving-side substrate and / or to other components arranged on the receiving-side substrate during transfer.

[0011] During individual method steps, in particular, alignment of the substrates with each other or, in particular, alignment of the component with the corresponding position of another component is performed, particularly using alignment marks on the substrate. In this method, it is extremely important that selective transfer of components takes place between the feed-side substrate and the receiving-side substrate. In this way, advantageously, only specific or selected components can be transferred. In particular, defective components cannot be transferred or only components having specific characteristics can be transferred. Here, all components may be selected, but the possibility of selection is given at each transfer by joining means and / or separation means. Furthermore, the selection of the components to be transferred may advantageously be performed in two steps by the transport substrate.

[0012] Furthermore, the present invention relates to an apparatus for transporting a component, by the above-described method for transporting a component, where a component can be fabricated and / or provided on a feed-side substrate, the component on the feed-side substrate can be transferred to a transport substrate, the component can be transferred from the transport substrate to a receiving-side substrate, and the transfer of the component to the support substrate and / or the receiving-side substrate can be selectively performed by joining means and / or peeling means.

[0013] Furthermore, the present invention relates to a light-emitting diode (LED) manufactured using the above-described method for transporting a component.

[0014] In one embodiment of the present invention, it is intended that individual components or a plurality of components are locally limited and fixed by joining means, particularly by laser radiation, during transfer in step ii) and / or step iii). In this method, it is extremely important that the components can be individually fixed or released during transfer, so that selective transfer of the components can be performed in this way. Here, it is similarly conceivable that the joining means acts locally limited to two or more components. However, it is possible to fix, particularly join, each component individually to the transport substrate or the receiving-side substrate. In this way, advantageously, selection during transfer becomes possible.

[0015] In another advantageous embodiment of the present invention, it is intended that individual components or a plurality of components are locally limited and released by peeling means during transfer in step ii) and / or step iii). Here, it is extremely important that the components can be individually released by the peeling means during transfer of the components, so that only the selected components are released or transferred. Therefore, similarly, defective components can be excluded from transfer by preventing transfer. Locally limited release of two or more components is also conceivable. In this way, advantageously, selection during transfer becomes possible.

[0016] Furthermore, preferably, the fixing of individual components or a plurality of locally adjacent components by the joining means or the separating means and the release of the fixing of the individual components or the plurality of locally adjacent components are carried out simultaneously and / or are carried out with a time and space shift. For example, first, the component to be transferred is fixed to the transfer substrate, and then the fixing on the feed side substrate is released. As a result, the component does not slip during the transfer. The same applies when transferring the component from the transfer substrate to the receiving side substrate.

[0017] In another advantageous embodiment of the present invention, for the sake of selection, the components are intended to be inspected for functionality by means of at least one inspection, in particular an electrical inspection. In this way, in particular, functional components that do not have defects can be identified. A functional component can perform the function intended for itself. By identifying functional components, the functional components can be selectively transferred from the feed side substrate to the receiving side substrate. However, it is also conceivable that a component is functional but is not transferred. This is because these components perform functions other than the functions required at the corresponding position of the receiving side substrate, for example, in the manufacturing process. It is also conceivable that corresponding, in particular functional, components having the required functions already exist at the corresponding positions on the receiving side substrate.

[0018] In principle, an electrical inspection can be carried out before, during or after the transfer. If the components are manufactured on the feed side substrate, it is preferable to carry out an inspection before transferring them to the transfer substrate in order not to transfer defective components to the transfer substrate. It is also conceivable to carry out a second inspection after transferring to the transfer substrate. In particular, it is also possible to inspect whether the components are arranged at the intended positions. If the components are slipping or are arranged at the wrong positions, in such cases too, the transfer may be blocked and thus a selection is made.

[0019] In another advantageous embodiment of the present invention, during the transfer in step ii), the transfer substrate contacts and / or applies pressure to the component provided on the feed-side substrate, whereby the component is intended to be maintained at a specific position between the feed-side substrate and the transfer substrate. In this way, slippage can be prevented, especially when the component is not fixed or no longer fixed to the feed-side substrate, and the corresponding position can be maintained when the component is fixed and / or unfixed. Furthermore, by bringing the component into contact with the transfer substrate in this way, for example, a bonding process to the transfer substrate becomes possible.

[0020] In another advantageous embodiment of the present invention, during the transfer in step iii), the component arranged on the transfer substrate contacts and / or applies pressure to the receiving-side substrate, whereby the component is intended to be maintained between the transfer substrate and the receiving-side substrate. In this way, slippage of the component can be prevented, especially when the component is not fixed or no longer fixed to the transfer substrate, and the corresponding position can be maintained when the component is fixed and / or unfixed. Furthermore, by bringing the component into contact with the receiving-side substrate in this way, for example, a bonding process to the receiving-side substrate becomes possible.

[0021] In another advantageous embodiment of the invention, a release layer and / or an adhesion layer is applied to the feed-side substrate and / or the transport substrate and / or the receiving-side substrate and / or the component, and the release layer and / or the adhesion layer is intended to change its own adhesion characteristics with respect to the component in the fixing region, in particular by the action of the release means and / or the joining means. The release layer and the adhesion layer react in particular to the joining means and / or the release means. Thus, for example, a component fixed on the release layer can be released by release means, in particular a laser, which is done by the release layer being melted by the laser, thereby making it possible to peel off the component. By the action of the joining means, in particular a laser, the component can be kept fixed to the adhesion layer or fixed. Thus, in combination with a substrate that transmits radiation or a corresponding hole provided in the substrate, it is advantageously possible to selectively fix and / or release individual components.

[0022] In another advantageous embodiment of the invention, the feed-side substrate and / or the transport substrate and / or the receiving-side substrate are intended to be formed to be transmissive to laser radiation. Thereby, the introduction of the laser radiation can advantageously be carried out from the side of each substrate facing away from the component. For example, the feed-side substrate can be glass having a release layer on the side facing the component. This release layer fixes the component on the feed-side substrate. Then, by the laser radiation, the release layer is particularly melted or the adhesion characteristics of the release layer in the fixing region of each component are reduced, thereby making it possible to peel off each component. Such a process is also applicable mutatis mutandis to the transport substrate and the receiving-side substrate. Such a process is also possible in the case of an adhesion layer, in which case the adhesion characteristics are increased or each component is joined temporarily or permanently. The substrate may, for example, have holes, which makes it possible to advantageously introduce the laser radiation without presupposing the transmissivity of the substrate to the laser radiation.

[0023] In another advantageous embodiment of the present invention, the transfer substrate has fixing elements, which are intended to fix the components, especially by surface adhesion, during transfer. In such a case, the fixing elements contact and / or apply pressure to the components provided on the feed-side substrate. Thereby, the components are fixed to the transfer substrate or the fixing elements of the transfer substrate. The fixing elements may be configured to be individually drive-controlled, which enables selective handover of the fixing elements themselves. In such a case, only the components to be transferred are fixed to the fixing elements. In another case, first, all components are fixed to the transfer substrate, and then, during transfer to the receiving-side substrate, only the components to be transferred or the selected components are transferred to the receiving-side substrate by the drive-controlled fixing elements. In this way, the selection during transfer can be advantageously performed while protecting the components.

[0024] In another advantageous embodiment of the present invention, it is intended that the fixing elements are formed from a polymer material and / or are formed in a suction cup shape. The fixing elements are preferably formed from plastic and are regularly arranged on the side of the transfer substrate facing the components. In particular, the transfer substrate has suitable fixing elements for each component. The fixing elements are preferably elastic, whereby it is possible to compensate for a slight height difference between the components, especially during fixing. It is also conceivable that the flexible and elastic transfer substrate assists or enables compensation for the height difference. Furthermore, the suction cup shape is advantageous because it can thereby generate a surface adhesion effect that can fix the components without additional auxiliary means.

[0025] In another advantageous embodiment of the invention, the transport substrate is deformed during transfer, in particular by mechanical means and / or pneumatic means, such that in particular the components are spatially and / or temporally offset and are intended to be detached from the fixing elements and / or fixed by the fixing elements. In such a case, the transport substrate is preferably arranged or mounted in a transfer type. By means of this deformation, in particular a concave or convex curvature, it is possible to adjust the point in time or location of contact of the components with the transport substrate or the fixing elements during transfer. Furthermore, by means of the deformation of the transport substrate, it is advantageously possible to adjust the contact between the components fixed to the transport substrate and the receiving substrate and / or other components arranged on the receiving substrate. Advantageously, the release of the components after transfer to the receiving substrate can also be adjusted. In this sense, the transport substrate can also be understood as joining means and / or peeling means. It is also conceivable that the feed substrate and / or the receiving substrate are configured to be controllably deformable.

[0026] In another advantageous embodiment of the invention, the transport substrate is intended to be in particular an elastic film. If the transport substrate is formed as an elastic film, in particular a gentle contact or pressure can be applied to the components. Furthermore, in such a case, the film is more easily deformable. Preferably, the film is arranged in a transfer type in which it is possible to controllably deform the film, in particular by mechanical means and / or pneumatic means.

[0027] In another advantageous embodiment of the invention, the light-emitting diodes are intended to be formed from a plurality of components arranged one above the other and / or a plurality of components arranged adjacent to one another, provided in particular by different feed-side substrates. Thus, a plurality of different components can be transferred onto the receiving-side substrate and / or onto other components arranged on the receiving-side substrate. Thus, in particular, if only the same electronic components having the same function are produced or provided on each feed-side substrate, the manufacturing process can be designed more flexibly.

[0028] In another advantageous embodiment of the invention, it is intended that the positions of the components be stored in an electronic data processing unit (EDP). Thus, the EDP can determine in which order which components are transferred. It is also conceivable that the EDP takes into account the current arrangement of the components already transferred on the receiving-side substrate. Furthermore, the EDP can analyze the positions of the components and, based thereon, drive and control the joining means or peeling means so that the fixing or release of the individual components is carried out more efficiently. In particular, the joining means or peeling means can act simultaneously on a plurality of adjacent components. However, in this case, in principle, it remains possible to affect the individual components.

[0029] The invention particularly describes a method for transporting functional components, in particular selectively, from a feed-side substrate to a receiving-side substrate. Here, the transfer is carried out using a transfer substrate. The components are in particular microchips, memory modules, LEDs, MEMS, etc. Components that bring about the original functional components are also conceivable, in particular in an aligned, arranged or stacked orientation with one another. In a broad sense, a component is understood to mean a part that is smaller than the substrates described in the disclosed document, in particular the feed-side substrate, the transfer substrate and the receiving-side substrate. In particular, a component can simply be a layer of a special material, in particular an oxide layer or a nitride layer.

[0030] In another advantageous embodiment of the present invention, it is intended that only functional and undamaged components are transferred to the receiving substrate. In this context, a functional and undamaged component is a component that passes an electrical inspection and thus functions. Therefore, selective transfer can ensure that only functional components are transferred from the sending substrate to the receiving substrate. In this way, in particular, the number of products manufactured defectively can be reduced, and more efficient manufacturing can be carried out.

[0031] In another advantageous embodiment of the present invention, the joining means and / or the peeling means are intended to be lasers. The laser radiation emitted by the laser can act on the substrate or the component in a large area and / or extremely punctiformly. In this case, the fixing characteristics of the surface, in particular the partial area of the substrate surface on which the component is fixed or placed and / or is to be fixed or placed, can be changed by the laser radiation. Since the laser can act extremely position-specifically, the laser is particularly advantageous for fixing or releasing individual components. Furthermore, the introduction of the laser radiation can be carried out quickly, in particular by means of a plurality of lasers. Furthermore, it is conceivable that a plurality of adjacent components that have passed the inspection are fixed together or that the fixing is simultaneously released, in particular by a laser acting in a planar manner. In this way, the transfer can be carried out more quickly and more efficiently. If a laser is used, the substrate may be formed to be transparent to the laser radiation. Here, materials transparent to the laser radiation as well as holes in the substrate are conceivable. The laser radiation may also be introduced laterally from the component, in particular onto the substrate. However, in principle, other physically and / or chemically and / or mechanically acting joining means and peeling means can also be used. The laser radiation of the laser used as the joining means and / or the peeling means has a wavelength in the wavelength range of 10 nm to 100 μm, preferably 100 nm to 50 μm, and extremely preferably 200 nm to 6 μm. The preferred wavelength cannot be indicated more precisely. This is because the joining means and the peeling means generally need to be adapted to the corresponding fixing area as well.

[0032] The components can be selectively transported. The same technology is preferably used for joining and peeling the components.

[0033] Component Therefore, the component may be, for example, the following object: 1. Layers, especially 1.1 Oxide layer 1.2 Nitride layer 1.3 Metal layer, especially 1.3.1 Metal layer composed of Cu, Ag, Au, Al, Fe, Ni, Co, Pt, W, Cr, Pb, Ti, Ta, Zn, Sn 1.4 Semiconductor layer, especially 1.4.1 Semiconductor layer composed of Ge, Si, α-Sn, fullerene, B, Se, Te 1.5 Compound semiconductor layer, especially 1.5.1 Compound semiconductor layer composed of GaAs, GaN, InP, InxGal-xN, InSb, InAs, GaSb, AlN, InN, Gap, BeTe, ZnO, CuInGaSe2, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, Hg(1-x)Cd(x)Te, BeSe, HgS, AlxGal-xAs, GaS, GaSe, GaTe, InS, InSe, InTe, CuInSe2, CuInS2, CuInGaS2, SiC, SiGe 1.6 Glass, especially 1.6.1 Sapphire glass 2. Functional components 2.1 Mechanical components, especially 2.1.1 MEMS 2.2 Electronic components, especially 2.2.1 LED 2.2.2 Chips, especially 2.2.2.1 Microchip 2.2.2.2 Memory chip

[0034] The thickness of the component is 0 μm to 1000 μm, preferably 0 μm to 800 μm, more preferably 0 μm to 500 μm, most preferably 0 μm to 250 μm, and extremely preferably 0 μm to 100 μm. For miniaturization, the component will probably be thinner than 10 μm in the future.

[0035] Bonding means and peeling means The essential feature of the present invention is that joining means and peeling means, which are also collectively referred to as means hereinafter in the document, are used to join a component to a substrate or to peel a component from a substrate. These means can generally act over the entire area of the substrate or extremely position-specifically. Means acting over a large area are, for example, electromagnetic radiation from a planar radiator, in particular thermal radiation. At this time, the planar radiator preferably has a radiation area at least as large as the area of the substrate. By applying such electromagnetic radiation acting over a large area to one side of a substrate, it becomes possible to apply heat to one side of the substrate. The use of a laser whose width is widened by an optical system and which can act over a large area on the surface to be acted upon is also conceivable.

[0036] It is also conceivable to heat a chamber in which a substrate is disposed to a certain temperature. However, in such a case, the substrate would be heated on both sides.

[0037] The temperature used should of course be in a range that does not damage the component and / or the substrate. Therefore, it is preferable that such a temperature is as low as possible. The temperature at which the effect according to the present invention is obtained is less than 1000 °C, preferably less than 500 °C, more preferably less than 250 °C, extremely preferably less than 100 °C, and most preferably less than 50 °C.

[0038] In a particularly preferred embodiment, this means is a particularly movable, locally limited-acting electromagnetic radiator, in particular a laser. Relative movement between the surface to be irradiated and the laser enables locally adjustable joining and / or peeling as desired. Preferably, these means themselves do not move, while on the other hand, the substrate holder on which one or more substrates are fixed moves.

[0039] Feed-side substrate A substrate having a plurality of components is referred to as a feed-side substrate. This substrate exists at the start of the transport process and provides the components to be transported to the receiving-side substrate.

[0040] In one embodiment, the components may be manufactured on or from the feed-side substrate. In particular, if the component is a mere layer, the component may be directly fabricated on the feed-side substrate by special physical and / or chemical processes and may in some cases be structured by further process steps.

[0041] In another embodiment, the components are manufactured elsewhere and positioned on the feed-side substrate, thereby being received by the transport substrate in a subsequent transport process. Here, the component is preferably coupled to the feed-side substrate via an attachment mechanism. The feed-side substrate is preferably constructed as follows. That is, it is constructed such that the attachment mechanism for fixing the component to the feed-side substrate can be weakened from the underside of the feed-side substrate. Preferably by a laser, the attachment mechanism is weakened. By weakening the attachment mechanism, the component can be easily removed from the feed-side substrate after being joined to the transport substrate in a subsequent transport process onto the transport substrate. Weakening the attachment mechanism and then removing the component is also referred to as peeling. In particular, the peeling process can be selectively performed. Thus, it is conceivable that only the previously functioning, particularly electrically inspected components are peeled off from the feed-side substrate. This prevents the transport of damaged components.

[0042] It is also conceivable that the component is only placed on the feed-side substrate and no special fixing mechanism acts between the feed-side substrate and the component.

[0043] In a particularly preferred embodiment, the feed-side substrate is a glass substrate.

[0044] In another embodiment, the feed-side substrate is a wafer, particularly a silicon wafer.

[0045] In another embodiment, the feed substrate is a film. The film is preferably stretched over a frame to hold the film in place and stabilize it. However, it is also conceivable to use an apparatus having a continuous film for carrying out this process.

[0046] In a very general embodiment, the feed substrate can be any kind of surface, especially a flat surface, from which the component can be removed. For example, the surface of a kind of table, the surface of a machine or the surface of a granite slab could be considered. Therefore, the term "feed substrate" should be interpreted in a very broad sense in contrast to the other two mentioned substrate types, namely the transport substrate and the receiving substrate.

[0047] Transport substrate The transport substrate is used to transport the component from the feed substrate to the receiving substrate.

[0048] In a particularly preferred embodiment, the transport substrate is a film. The film is preferably stretched over a frame to hold the film in place and stabilize it. However, it is also conceivable to use an apparatus having a continuous film for carrying out this process. The film has the advantage that it is elastic and flexible, so that it is particularly easy to bring the component into contact with the underlying surface even if there is a height difference of a few micrometers or nanometers.

[0049] In a less preferred embodiment, the transport substrate is made of glass.

[0050] In a very less preferred embodiment, the transport substrate is a wafer, especially a silicon wafer.

[0051] In one embodiment, the transport substrate is a substrate provided with a plurality of fixing elements.

[0052] The fixing element functions to hold the component in a fixed state. The fixing element 1. Mechanical fixtures, in particular 1.1. Clamps 2. Vacuum fixtures, in particular, 2.1. Individually controllable vacuum tracks 2.2. Vacuum tracks coupled to each other having a vacuum fixture 3. Electrical fixtures, in particular 3.1. Electrostatic fixtures 4. Magnetic fixtures 5. Adhesive fixtures, in particular 6. Gel pack fixtures 7. Fixtures with an adhesive, in particular drive-controllable surface may be. These fixing elements are particularly electronically drive-controllable. The vacuum fixture preferably consists of a plurality of vacuum tracks appearing on the surface of the transfer substrate. These vacuum tracks are preferably individually controllable.

[0053] The fixing element has a size approximately equal to the size of the component to be transported and is preferably mounted symmetrically on the surface of the transfer substrate. The fixing element is preferably constructed in the form of a suction cup. This type of transfer substrate is used in connection with the transfer type described in detail in the disclosure of the present invention.

[0054] Receiving-side substrate The receiving-side substrate is understood to mean, in particular, a product substrate to which all components of a plurality of transfer substrates and / or all components of the same transfer substrate used repeatedly are fixed.

[0055] A plurality of components can be transported from various different supply substrates to the same receiving substrate via one or more transfer substrates. This enables particularly efficient transfer, especially of diverse components. A plurality of components having different functions may be joined onto the same receiving substrate from a plurality of supply substrates or a plurality of transfer substrate sources. In this case, transporting or transferring to the receiving substrate also means that these components can follow components already arranged on the receiving substrate, particularly components joined to the receiving substrate.

[0056] The disclosed substrates can be coated with various different coatings. In particular, the layer is a functional layer, and the adhesion characteristics of the functional layer can change due to external influences. This enables components to be transported from one substrate to another. Here, in particular, it is intended to locally influence, i.e., act on individual components. Such a feature is decidedly different from the prior art where heat is used to globally affect the entire wafer area to cause a change in the adhesion characteristics.

[0057] Type of bonding Preferably, at least one of the following types of bonding is used to join a component to a support via an adhesion area: · Bonding by adhesion, · Metal-metal bonding, · Eutectic bonding, · Anodic bonding or · Fusion bonding

[0058] Next, these individually listed types of bonding will be described in more detail with regard to their mode of function.

[0059] In the case of joining by adhesion, it is conceivable that the joining means acting, in particular the laser, at least improves the adhesion properties of the adhesive used. For example, the mixing of two components of the adhesive may be carried out by the introduction of heat, and it is conceivable that the adhesion properties only occur as a result of this mixing. In another embodiment, the joining means for joining by adhesion is a cooling device that acts particularly locally and reduces the temperature. It is conceivable that the adhesive has molecular side chains that are a decisive cause of the adhesion properties. Cooling can reduce the heat transfer, and the molecular chains are more significantly aligned parallel to each other, particularly by self-assembly, which results in an improvement in the adhesion properties.

[0060] In the case of metal-metal joining, the joining principle is that two metals, particularly metals that are completely mutually miscible, come into contact with each other and are heated by the action of the joining means, particularly the laser, to the extent that they are joined to each other by compression and / or diffusion. The joint thus formed is often difficult to separate, particularly when an intermetallic compound phase is formed. Therefore, this joint should be used particularly for joints in the final state, i.e., for joining components to a surface where no further peeling is required.

[0061] In eutectic joining, the joining principle is that at least two metals capable of forming a eutectic are heated above the eutectic temperature. Preferably, a combination of metals with the lowest possible eutectic temperature is used. As a result, the required temperature increase is small. The advantage of such a eutectic alloy is that the eutectic mixture can be melted at any frequency. Therefore, in contrast to metal-metal joints with a relatively high melting point, eutectic joints are also suitable for the peeling process. However, the disadvantage is that the peeling process must be carried out at a temperature higher than the eutectic temperature, and at such a temperature, there is a non-negligible amount of melt that can contaminate a part of the substrate.

[0062] In the case of anodic bonding, the movement of ions is promoted by applying an electric field. Anodic bonding is mainly used for glass substrates. This bonding process will not be described in more detail here. This bonding process is known to those skilled in the art.

[0063] One of the bonding methods that is extremely important for the method of the present invention is fusion bonding. In the case of fusion bonding, the surfaces to be joined, which are particularly cleaned and treated with plasma, come into direct contact with each other directly, especially at room temperature. Thereby, a preliminary bond is formed. The preliminary bond preferably transitions to a permanent bond by a temperature increase. Such a mechanism is also well known to those skilled in the art. Fusion bonding is particularly preferred for the method of the present invention because the preliminary bond between the component surface and the support substrate is a rapid and efficient technique for temporarily fixing the component to the support substrate in such a way that the component can be easily peeled off from the support substrate. In such a case, the support substrate, of course, must be suitable for fusion bonding or preliminary bonding. A further advantage is that fusion bonding is required in the semiconductor industry for directly joining a plurality of components to each other, preferably by means of so-called hybrid bonding. Such a particularly preferred embodiment will be described in more detail in this document.

[0064] When transporting the component from the feed-side substrate to the transport substrate, a bonding method must be selected that can fix the component to the transport substrate well enough. However, such a bond formed must be able to be peeled off again easily enough by the peeling means when transporting the component from the transport substrate to the receiving-side substrate. Therefore, in order to enable the smooth transport of the component, particularly without error, the correct combination of the type of bond and the bonding means or peeling means is important.

[0065] The transport substrate is particularly preferably a film or a rigid substrate having an adhesive layer. In such a case, the adhesive of the adhesive layer may be self-adhesive, i.e., it does not need to be activated by the bonding means of the present invention, such as an adhesive. However, it is advantageous if the adhesive strength of the adhesive layer is at least improved by the action of a suitable bonding means.

[0066] In certain embodiments, a multi-layer system is used to bond the component to the support. For example, a layer system consisting of a release layer and an adhesive layer can be considered. The release layer can also be referred to as a reaction layer. This is because the action of the release means causes a reaction, which results in a decrease in the adhesion between the support and the component, thus making it possible to peel the component from the support. The order of the release layer and the adhesive layer is arbitrary, but preferably the release layer is adhered to the support. Publication WO 2017 / 076682 discloses, for example, a multi-layer system in which the release layer is adhered to the product substrate rather than the support substrate. In the disclosure of the present invention, the use of such multi-layer systems is grouped under the more general concept of the adhesion region.

[0067] The layer system can be deposited over a large area on one of the plurality of substrates and / or on the component. Technically, it is relatively easy to deposit the layer system over a large area on the substrate since known coating techniques such as spin coating and / or spray coating can be used. It is possible to deposit the layer system partially on the substrate, but this is less preferred in terms of cost. Of course, a large-area deposition of the layer system with subsequent structuring is conceivable. When the layer system is to be deposited on the component, the layer system preferably completely covers the surface of the component.

[0068] Transport process In the first process step of the first exemplary method of the present invention, the component is fabricated on or placed on the feed-side substrate. It is possible to provide the component on the feed-side substrate or to manufacture the component directly on the feed-side substrate. The component is coupled to the feed-side substrate surface, in particular via its first component surface, such that it can be easily peeled off from the feed-side substrate surface, in particular when controlled as desired. For example, if the component is merely placed on the feed-side substrate and no coupling has occurred between the feed-side substrate and the component, the component can be removed more easily from the feed-side substrate.

[0069] In an optional second step of the first process, each individual component can be inspected with respect to its functionality. The positions of defective components or components that do not meet the criteria can be stored by a computer program in order to prevent the subsequent transport process of the components. In particular, such a process step can also be performed individually for each component even before the first process step. However, technically, it may be advantageous to first position the components and then quickly inspect them with an automated measuring probe.

[0070] In the third process step of the first process, alignment of the transport substrate with respect to the feed-side substrate is performed. This alignment is performed mechanically and / or optically. The alignment is preferably performed by alignment marks provided on the feed-side substrate and the transport substrate. Preferably, an optical alignment system is used for alignment.

[0071] In the fourth process step of the first process, the surface of the component of the second process located on the feed-side substrate, particularly on the side opposite to the surface of the first component, is brought into contact with the surface of the transfer substrate or at least brought closer to the surface of the transfer substrate so that the component can be transferred from the feed-side substrate to the transfer substrate. In particular, it may be necessary for the transfer substrate and / or the feed-side substrate to be locally deformed to such an extent that the surface of the second component contacts the surface of the transfer substrate. When the transfer substrate is a film, this step can be carried out particularly easily because the film can be locally deformed extremely easily. For example, deformation by a small mold from the back surface of the film can be considered. This mold is particularly combined with a laser or a laser component.

[0072] In the fifth process step of the first process, bonding occurs between the surface of the second component of the component on the feed-side substrate and the surface of the transfer substrate. This bonding is preferably a temporary bond. In a particularly preferred embodiment, the bonding between the surface of the second component of each individual component and the surface of the transfer substrate is carried out individually, i.e., selectively. Therefore, in such a process step, a decision may already have been made regarding which components are to be transferred. In a particularly preferred embodiment, this bonding is carried out using a laser. Various methods of forming the bond are described in detail elsewhere in the published literature.

[0073] In the sixth process step of the first process, peeling is carried out between the surface of the first component of the component on the feed-side substrate and the surface of the feed-side substrate.

[0074] It is also conceivable that Process Step 5 and Process Step 6 are exchanged with each other, that is, the peeling process between the first component surfaces of the components on the feeding-side substrate is first performed, and only then is the bonding process between the second component surface of the component and the transfer substrate performed. This exchange between process steps is made possible by the forces acting on the components that hold the components in place, especially on both sides. However, when exchanging process steps, there is a risk that the components will slip. It is also conceivable to perform the bonding process and the peeling process simultaneously.

[0075] In another embodiment, it is conceivable that the bonding process and the peeling process are performed simultaneously.

[0076] In the seventh process step of the first process, alignment of the transfer substrate and the receiving-side substrate, which were previously installed, is performed. This alignment is performed mechanically and / or optically. Preferably, the alignment is performed by alignment marks provided on the transfer substrate and the receiving-side substrate. For alignment, an optical alignment system is preferably used.

[0077] In the eighth process step of the first process, the first component surface of the component on the transfer substrate is brought into contact with the receiving-side substrate surface or the second surface of another component already provided on the receiving-side substrate. In particular, it may be necessary to locally deform the transfer substrate and / or the receiving-side substrate to such an extent that the first component surface contacts the receiving-side substrate surface or the surface of a component fixed thereto previously. All the advantages and disadvantages of the deformation have already been explained in the fourth step when the component is received on the transfer substrate, and correspondingly, they can be applied mutatis mutandis to the eighth step.

[0078] In the ninth process step, the peeling process and the bonding process are carried out again. This time, the peeling process is performed between the component on the carrier substrate and the carrier substrate, and the component is bonded, in particular simultaneously, to the receiving-side substrate surface or to the second surface of another component already provided on the receiving-side substrate. The bonding process or peeling process applied at this time is described in the present disclosure and is selected according to each required situation. In particular, when a plurality of components are stacked on top of each other, these components are fusion bonded, preferably hybrid bonded, as long as they have a hybrid surface. By hybrid bonding, advantageously, the necessary conductive connection between the components is formed.

[0079] In the second exemplary transport process of the present invention, the carrier substrate particularly has individual fixing elements that can fix the components by surface adhesion. These fixing elements are preferably extremely elastic and are objects made of a polymer material that can bend and stretch. The fixing elements can clearly be considered a kind of suction cup. When using such a support, particularly completely different bonding and peeling means are used.

[0080] In such a case, the bonding means is understood to particularly mean the contact of the fixing element with the component on the feed-side substrate in combination with the application of force. The application of force may be performed by a pressing element, such as a roller.

[0081] The acting force is in the range of 0 MPa to 1000 MPa, preferably 0 MPa to 750 MPa, more preferably 0 MPa to 500 MPa, most preferably 0 MPa to 250 MPa, and most preferably 0 MPa to 100 MPa.

[0082] It is also conceivable to increase the pressure in the chamber where the fixing element contacts the component inside. Thereby, the fixing element is pressed more strongly by the component.

[0083] In such a case, the peeling means is understood, among other things, as the bending of the transfer substrate in such a form that the fixing elements are gradually peeled off from the component, especially from the outside to the inside, after the component has been fixed on the receiving substrate, especially after being permanently joined. Such a joining process can be carried out very well, for example, using the joining means of the first process, for example using a laser.

[0084] In a second exemplary method of the present invention, a transfer mold having a transfer substrate with a plurality of fixing elements on its lower surface is used. This process is different, among other things, in that the transfer mold is constructed somewhat more complexly than a simple transfer substrate. This is because, in addition to the transfer substrate, preferably further control means are provided, which can, among other things, influence the bending of the transfer substrate and, in particular, can control the bending of the transfer substrate. Furthermore, this transfer substrate has fixing elements that do not exist in the transfer substrate described above. The use of a transfer substrate with each fixing element having no mold located behind it could also be considered. However, in this case, the bending for joining and peeling would have to be carried out by other mechanical means and / or pneumatic means and / or hydraulic means, and these means should be considered independently of the transfer substrate. Next, the second process will be described in detail.

[0085] In the first process step of the second process, the component is fabricated on or placed on the feed-side substrate. It is possible to attach the component to the feed-side substrate or to manufacture the component directly on the feed-side substrate. The component must be coupled to the feed-side substrate surface via its first component surface in such a way that it can be easily detached from the feed-side substrate surface, particularly as desired. For example, if the component is merely placed on the feed-side substrate and no bond has occurred between the feed-side substrate and the component, the component can be removed from the feed-side substrate more easily. Unfortunately, however, this may cause the component to slip in such cases. This slip occurs in another process step before and / or during the contact of these components with the transfer substrate.

[0086] In an optional second step of the second process, each individual component can be inspected for its functionality. The positions of defective or non-conforming components can be stored by a computer program to prevent the subsequent transfer process of the components. In particular, such a step can also be performed individually for each component already before the first step. Technically, however, it may be advantageous to first position the components and then quickly inspect them with an automated measuring probe.

[0087] In the third process step of the second process, alignment of the feed-side substrate with respect to the transfer substrate is performed. The transfer substrate is preferably part of a transfer type, but can also be used alone. In contrast to the transfer substrate of the first process, the transfer substrate has a plurality of fixing elements. This alignment is performed mechanically and / or optically. The alignment is preferably performed by alignment marks provided on the feed-side substrate and the transfer substrate. Preferably, an optical alignment system is used for alignment. In particular, the transfer substrate is positioned such that the fixing elements of the transfer substrate are located on top of the component to be transferred. Such an embodiment is different from the first process.

[0088] In the fourth process step of the second process, the second component surface of the component on the feed-side substrate is brought into contact with the fixing element surface of the fixing element. In particular, it may be necessary for the transfer substrate and / or the feed-side substrate to be locally deformed to such an extent that the second component surface contacts the fixing element surface. When the transfer substrate is a film, this step can be particularly easily carried out because the film is locally very easily deformable. However, the combination of the fixing element and the film can be technically disadvantageous because the film may have an excessively low stability with respect to the fixing element. Therefore, the fixing element is preferably manufactured or fixed on a transfer substrate having the required stability, in particular a certain degree of rigidity. Since the fixing element is preferably a polymer fixing element, in particular a suction cup-shaped fixing element, it is conceivable to deform the transfer substrate by generating an excessive pressure. When the component is to be transferred from the feed-side substrate to the transfer substrate in a vacuum, it is conceivable to use mechanical auxiliary means, in particular rollers, to apply pressure. However, in a particularly simple embodiment, the transfer substrate is simply moved in the direction of the feed-side substrate to such an extent that a sufficient pressure is formed by this movement to cause complete contact between the fixing element and the component.

[0089] In the fifth process step of the second process, bonding occurs between the second component surface of the component on the feed-side substrate and the transfer substrate surface. This bonding is preferably a temporary bond. In a particularly preferred embodiment, the bonding between the second component surface of each individual component and the transfer substrate surface is performed individually, i.e., selectively. Thus, in such a process step, a determination may already have been made as to which components are to be transferred in the first place. However, in the second process, since a fixing element is used, selective selection of the components to be transferred can only be made if the fixing element itself is switchable or adjustable. A switchable adhesion fixing element that can change its adhesion characteristics by means of an electric current could be considered. If the fixing element is formed in the shape of a suction cup, it could be considered to cause a selective bonding process by the action of the desired local force. However, for this purpose, the means of applying force from the back surface must itself be capable of acting locally selectively, i.e., it must have a limited diameter. For example, the use of pins could be considered. In particular, when a transfer type is used, such pins would probably have to be located inside the transfer type. Correspondingly, the design of the transfer type would become complicated. However, it could be considered to provide a small x-y translation unit behind the transfer type surface that can move the pins in the z direction. If the transfer type is omitted, the means of applying force should be part of the system in which the components are transferred.

[0090] In the sixth process step of the second process, separation is performed between the first component surface of the component on the feed-side substrate and the feed-side substrate surface.

[0091] It is also conceivable that process step 5 and process step 6 are exchanged with each other, that is, the peeling process between the first component surfaces of the components on the feed-side substrate is first performed, and only then is the bonding process performed between the second component surface of the component and the transfer substrate. This exchange between process steps is made possible by the forces acting on the components that hold the components in place, especially on both sides. However, when exchanging process steps, there is a risk that the components will slip.

[0092] In another embodiment, it may be conceivable that the bonding process and the peeling process are performed simultaneously.

[0093] In the seventh process step of the second process, alignment of the transfer substrate and the receiving-side substrate that were previously installed is performed. This alignment is performed mechanically and / or optically. Preferably, the alignment is performed by alignment marks provided on the transfer substrate and the receiving-side substrate. For alignment, an optical alignment system is preferably used.

[0094] In the eighth process step of the second process, the first component surface of the component on the transfer substrate is brought into contact with the receiving-side substrate surface or the second surface of another component already provided on the receiving-side substrate. In particular, it may be necessary to locally or globally deform the transfer substrate and / or the receiving-side substrate to such an extent that the first component surface contacts the receiving-side substrate surface. In particular, global bending of the transfer substrate by a pressing device arranged behind the transfer substrate is conceivable.

[0095] The ninth process step includes, among other things, the detachment of the component from the fixing element of the transport substrate, which corresponds in particular to the detachment step. The bonding step between the component and the receiving substrate surface or the second surface of another component already provided on the receiving substrate is also carried out here in the same manner as already mentioned in the present disclosure. Again, this is a fusion bond, preferably a hybrid bond.

[0096] All the advantages and disadvantages of this variant have already been explained in the fourth step when the component is received on the transport substrate and can accordingly be applied mutatis mutandis to the eighth step.

[0097] That is, the difference between the first process and the second process is, among other things, that in the second process the fixing element is used as an important technical component.

[0098] The positioning or arrangement of the components is an important issue. In a particular development of the invention, the position of each component is determined by the self-assembly process itself. For this purpose, the surface on which the component is to be positioned must be specially prepared.

[0099] One embodiment of self-assembly is to coat the surface with an anti-sticking layer (ASL, anti sticking layer in English), which covers only the areas of the surface where the components should not be positioned. Such areas will hereinafter be referred to as ASL areas. The areas of the surface where the components are to be positioned should not be covered by the anti-sticking layer and thus have a particularly high adhesion to the anti-sticking layer. Such areas will hereinafter be referred to as adhesion areas. Here, when the component is positioned on the adhesion area, the component moves due to the adhesion gradient present in the adhesion area, so that positioning errors in the micrometer or nanometer range are automatically corrected. The adhesion area itself is preferably symmetric, in particular at least rectangular. The higher the symmetry of the adhesion area, the more efficient the self-assembly process becomes.

[0100] A further embodiment of the self-assembly is that the region where the component is to be positioned is coated with a fluid. The remaining surrounding regions where the component is not to be positioned remain untreated. When the component is placed in one of these regions, the component is drawn into the center of the fluid by the resulting adhesion process and energy minimization process and is positioned symmetrically with respect to the fluid by the self-assembly process. That is, when the fluid deposits and positions extremely accurately, especially with micrometer or nanometer accuracy, and the contact surface of the component to be positioned has the same shape as the fluid, the component is preferably aligned so that the component is symmetrically stationary with respect to the fluid. So to speak, the component floats on the fluid. Such self-assembly according to the present invention makes sense, of course, only if the fluid is allowed to exist permanently between the surface and the component, or at least until the component is further removed to another substrate.

[0101] Multi-layer LED In a particularly preferred embodiment, this method is used to fabricate light-emitting diodes (LEDs), preferably white light LEDs (wLEDs). wLEDs can be manufactured in various ways.

[0102] There are several types of white light produced in the semiconductor industry. One approach is the use of a phosphor layer, which is irradiated with excitation radiation to emit a broader band of light spectrum (WO 2013 / 041136).

[0103] Another approach for generating white light is to manufacture a wLED consisting of three individual LEDs, each of these three individual LEDs emitting light in a specific wavelength range, particularly in the wavelength ranges of red (rLED), green (gLED), and blue (bLED). White light can be generated by mixing these three color components. The three individual LEDs are generally produced by various different materials and manufacturing processes, etc. Each of the individual LEDs can be regarded as a component that can be combined on the receiving substrate to form a fully functional wLED with the help of a process.

[0104] In a first exemplary embodiment of the present invention, the wLED to be fabricated consists of three LEDs (rLED, gLED, and bLED) arranged side by side with each other.

[0105] In a second preferred embodiment, the wLED to be fabricated consists of three LEDs (rLED, gLED, and bLED) stacked on top of each other. To ensure that the light of the bottom LED and / or the middle LED is not overly strongly absorbed by one or more LEDs located above it, the size of the LEDs may continuously decrease from the bottom to the top. In an improved second embodiment, the bottom LED has a large area, the middle LED joined thereon is annular, and the top LED is also annular, which has an inner radius larger than that of the middle LED. The shape of the annular LED may be rectangular or circular.

[0106] The LEDs are preferably stacked such that absorption by the LEDs located above them is minimized. The correct order generally needs to be determined by experience, which is particularly related to the materials of the individual LEDs.

[0107] Further advantages, features, and details of the present invention will become apparent from the description after the preferred embodiments, based on the drawings.

Brief Description of the Drawings

[0108]

Figure 1a

Figure 1b

Figure 1c

Figure 1d

Figure 1e

Figure 1f

Figure 2

Figure 3a

Figure 3b

Figure 3c

Figure 4

Figure 5

[0109] In the drawings, the same components or components having the same function are denoted by the same reference numerals.

[0110] The figures are not drawn to scale. In particular, the fixing region 3 is represented extremely thickly for better visibility. The exaggerated representation of the fixing region 3 is because the use of the joining means 6 and the peeling means 7 that cause or decompose again the fixing region 3 is an essential feature of the present invention. When the fixing region 3 is represented so as to be visible, in particular, the fixing occurs between the constituent members in contact with the fixing region 3. When the fixing region 3 is not represented, such fixing does not occur or occurs only to a negligible extent technically. The fact that the fixing region 3 is not shown at a specific position does not mean that an adhesive, for example, an adhesive, does not have to be arranged at this position. This simply means that, in particular, the fixing action is changed, particularly reduced, or completely removed by the peeling means 7, so that the adhesive, particularly the adhesive, does not have a fixing action or has only a fixing action to a negligible extent at least.

[0111] Figure 1a shows a first process step in which a plurality of components 2 are provided on the feed-side substrate 1. The components 2 are preferably already fixedly connected to the feed-side substrate 1 via the fixing region 3 in such a process step, so that slippage of the components 2 is prevented. The fixed connection between the component 2 and the feed-side substrate 1 is formed by a chemical fixing region 3 and / or a physical fixing region 3. The fixing region 3 may be, for example, an adhesive that acts as an adhesive between the feed-side substrate 1 and the component 2. It is also conceivable that the fixing region is a region of micrometer or nanometer size where a direct adhesive force, in particular van der Waals force, acts between the surface of the feed-side substrate 1 and the component 2. It is also conceivable that the fixing region 3 is a metal alloy, in particular solder. It is also conceivable that the fixing region 3 is an adhesive film. Generally speaking, all chemical actions and / or physical actions and / or materials and / or objects that can fix the component 2 to the feed-side substrate 1 correspond to the fixing region 3. In Figure 1, the fixing region 3 is always shown only at the boundary between the component 2 and the feed-side substrate 1. However, it is also conceivable that the fixing region 3 extends over the entire surface 1o of the transport substrate. In particular, the fixing region 3 is a layer deposited by a coating process, in particular a centrifugal coating process. It is also conceivable that the component 2 is a layer, in particular an oxide layer or a nitride layer, which is first deposited over a large area by a corresponding coating process and structured accordingly by other process steps. In such a case, the fixing region 3 simply corresponds to only the interface, the interface between the layer and the feed-side substrate 1. That is, in such a case, the layer is directly connected to the feed-side substrate 1. Of course, it is also conceivable that the component 2 is simply a correspondingly deposited and structured layer system. The feed-side substrate 1 is shown exemplarily as a wafer in all figures, but in principle it may be any type of substrate, in particular a glass substrate or a film.

[0112] Figure 1b shows a second process step, in which the transport substrate 4, in particular the film stretched over the frame 5, is positioned and fixed on the component 2 of the feed-side substrate 1. In particular, only a slight pressure application from the back side of the transport substrate 4 is required. It is also conceivable that the frame 5 over which the transport substrate 4 formed as a film is stretched is moved in the direction of the feed-side substrate 1 such that the transport substrate 4 is preloaded and presses against the component 2. In particular, the transport substrate 4 may be aligned relative to the feed-side substrate 1 before contact. This alignment is preferably carried out using alignment marks (not shown) and optical auxiliary means, in particular an alignment system (aligner in English, not shown).

[0113] Figure 1c shows a third process step, in which the joining process of the component 2 using the joining means 6, in particular using a laser, is carried out such that a fixing region 3 is formed between the component 2 and the transport substrate 4 over the surface 2o of the component. The peeling process using the peeling means 7, preferably also using a laser, is carried out, in particular simultaneously, more preferably with a slight time offset and / or a distance offset. Such a peeling process is preferably carried out through the feed-side substrate 1. Peeling from the side of the transport substrate 4 is also conceivable. However, in this case, the peeling means 7 for peeling must not have an interaction with the fixing region 3 between the transport substrate 4 and the component 2. In a particularly preferred embodiment, the joining process and the peeling process will be carried out simultaneously. For example, the use of a laser is also conceivable. This laser acts on the one hand as a joining means 6 to carry out the joining process between the component 2 and the transport substrate 4, and on the other hand as a peeling means 7 to carry out the peeling process between the component 2 and the feed-side substrate 1. Correspondingly, the fixing region 3 must show different reactions to the photons of the laser 6 on each different side of the component 2. In the figure, only the joining or peeling process of four components 2 (see also Figure 1d in this regard) is shown as an example, which shows that the transport process can already be selectively carried out in such a process step. The reason for the selective transport process could be that a part of the component 2 is defective and therefore must not be transported. Of course, it is also possible to transport all the components 2. In particular, initially, there should be no defective components 2 on the feed-side substrate at all. However, if the components are manufactured on the feed-side substrate 1, there is a possibility that a part of the component 2 becomes defective during the manufacturing process. In such a case, the selective selection would be technically meaningful and necessary.

[0114] Figure 1d shows the fourth process step, in which the carrier substrate 4 is positioned on the receiving substrate 8 and in particular aligned with the receiving substrate 8. The alignment is preferably performed using alignment marks (not shown) and an optical alignment system (not shown).

[0115] Figure 1e shows the fifth process step, in which after the component 2 of the carrier substrate 4 is brought into contact with the component 2 of the receiving substrate 8, the peeling means 7, in particular a laser, preferably performs a peeling process between the component 2 of the carrier substrate 4 and the carrier substrate 4 through the back surface of the carrier substrate 4. In particular, the formation of the adhesion region 3 between the components 2 is simultaneously performed using the joining means 6. In the figure, only the peeling process of the three components 2 is shown as an example to show that the transfer process can also be selectively performed in such a process step.

[0116] In a very preferred embodiment, the component 2 is peeled only from the carrier substrate 4 by the selectively acting peeling means 7. On the other hand, the joining means 6 is not a selective joining means but a joining means acting over the surface. For example, heating of the surrounding area could be considered. This could be particularly meaningful when the components 2 are to be permanently joined to each other by a metal physical joining process or a fusion joining process.

[0117] Figure 1f shows the sixth process step, in which the carrier substrate 4 having only the last remaining component 2 is removed. It can be seen that a total of three components 2 have been transferred. The joining process using the joining means 6 shown in Figure 1e may in particular be performed for the first time in such a step. Here, the carrier substrate 4 may still have components 2 that can be transferred to, for example, another receiving substrate 8.

[0118] Of course, it is preferable that the same number of constituent members 2 are always conveyed from the feed-side substrate 1 to the receiving-side substrate 8. Generally, each constituent member layer of the constituent members 2 is always completely installed on the receiving-side substrate 8 first. Only then can other constituent members 2, which may have particularly different functions, be constructed and should be constructed in other constituent member layers.

[0119] Therefore, the process steps of FIGS. 1a to 1f always show only the conveyance of a large number of constituent members 2 of one constituent member layer. Thereafter, the process steps of FIGS. 1a to 1f can be repeated any number of times, thereby constructing other constituent member layers, generally any number of constituent member layers.

[0120] The second process is not explicitly shown. This has, among other things, the characteristic that the transfer type 11 shown and described in FIGS. 3a to 3c is used for the conveyance of the constituent members 2. The transfer type 11 may be used together with other joining means and peeling means for the conveyance of the constituent members 2. In particular, the conveyance of the constituent members 2 is facilitated by the fact that the fixing element 10 of the conveyance substrate 4' can fix the constituent members 2 without the need to use other joining means. In this case, the peeling of the constituent members 2 from the fixing element 10 of the conveyance substrate 4' is preferably effected by the bending of the conveyance substrate 4' according to either FIG. 3b or FIG. 3c. However, here, the peeling step from the feed-side substrate 1 or the joining step to the receiving-side substrate 8 can likewise be effected by the above-described joining means and / or peeling means (6, 7). That is, the bendable conveyance substrate 4' and / or the entire transfer type represent the joining means and peeling means (6, 7) at the same time.

[0121] Figure 2 shows the finished receiving-side substrate 8 on which a plurality of component groups, in particular white light LEDs 9, have been manufactured by this method. The white light LED 9 here consists of three different components 2, 2', 2''. Each component 2, 2', 2'' is a specific single-color LED, i.e., a light-emitting diode for a very specific wavelength range. For example, component 2 is a red light LED (rLED), component 2' is a green light LED (gLED), and component 2'' is a blue light LED (bLED). Thus, the white light LED 9 can be easily manufactured by combining single-color LEDs. Further embodiments of the white light LED 9 are described in other drawings and the description of the drawings.

[0122] In a further figure, a special embodiment of the white light LED 9 is represented. By this process, such a white light LED 9 is manufactured. The various different semiconductor regions of the diodes for the single-color LEDs 2, 2', 2'' are not represented as contacts. The white light LED 9 is represented only for the purpose of showing the embodiment.

[0123] Figure 3a shows the transfer mold 11 in the first position. The transfer mold 11 consists of a carrier substrate 4' having a plurality of fixing elements 10. The fixing elements 10 fix the corresponding component 2 (not shown) via the fixing element surface. The transfer mold 11 can have a deforming element 12 that can deform the carrier substrate 4'. The deforming element 12 can be a pin that can move in the x-y-z directions inside the transfer mold 11, and thus locally bend the carrier substrate 4', particularly by means of a corresponding mechanism. In such a case, the deforming element 12 is represented as a supply line and can guide a fluid, in particular a gas or a gas mixture, into the chamber.

[0124] Figure 3b shows the transfer mold 11 in the second position. By means of the deforming element 12, the carrier substrate 4' is bent into a concave shape. If the deforming element 12 is a supply line, this bending is particularly effected by evacuating the internal space.

[0125] Figure 3c shows the transfer mold 11 in the second position. By the deformation element 12, the transport substrate 4' is curved convexly. If the deformation element 12 is a supply line, this curvature is performed, in particular, by generating an overpressure in the internal space.

[0126] Figure 4 shows a first white light LED 9 composed of monochromatic LEDs 2, 2', 2''. The monochromatic LEDs 2' and 2'' are manufactured annularly here. The lowermost LED 2 is formed with a large area. The annular openings of the LEDs 2' and 2'' allow the one or more lower LEDs to emit photons. By emitting photons in the three wavelength ranges of red, green, and blue, the white light LED 9 can be easily manufactured. In particular, this process can be used to stack the LEDs 2, 2', 2''. The annular shape of the monochromatic LEDs 2, 2', 2'' may be arbitrary, preferably rectangular, and more preferably circular.

[0127] Figure 5 shows a second white light LED 9', where the individual LEDs 2, 2', 2'' differ in size and relative position.

Description of the reference numerals

[0128] 1 Feed-side substrate 1o Feed-side substrate surface 2, 2', 2'' Components 3 Fixing area 4, 4' Transport substrate 5 Frame 6 Joining means 7 Peeling means 8 Receiving-side substrate 9 LED 10 Fixing element 10o Fixing element surface 11 Fixing mold 12 Deformation element

Claims

1. A method for transferring a component (2, 2', 2'') from a feeding substrate (1) to a receiving substrate (8), comprising: i) providing and / or fabricating the component (2, 2', 2'') on the feeding substrate (1); ii) transferring the component (2, 2', 2'') on the feeding substrate (1) to a transfer substrate (4, 4'); iii) transferring the component (2, 2', 2'') from the transfer substrate (4, 4') to the receiving substrate (8). The method is characterized in that: the component (2, 2', 2'') can be selectively transferred by using a joining means (6) and / or a peeling means (7); the transfer substrate (4, 4') has an electrostatic fixture; the transfer substrate (4, 4') is a film. A method.

2. The method according to claim 1, wherein the individual component (2, 2', 2'') or a plurality of components (2, 2', 2'') are locally limited and fixed by the joining means (6) during the transfer in step ii) and / or step iii).

3. The method according to claim 1 or 2, wherein the individual component (2, 2', 2'') or a plurality of components (2, 2', 2'') are locally limited and released by the peeling means (7) during the transfer in step ii) and / or step iii).

4. The method according to any one of claims 1 to 3, wherein the component (2, 2', 2'') is inspected at least once for functionality for the selection.

5. During the transfer in step ii), the transfer substrate (4, 4') contacts and / or applies pressure to the component (2, 2', 2'') provided on the feeding substrate (1), thereby maintaining the component (2, 2', 2'') at a specific position between the feeding substrate (1) and the transfer substrate (4, 4'). The method according to any one of claims 1 to 4.

6. During the transfer in step iii), the component (2, 2', 2'') disposed on the transfer substrate (4, 4') contacts and / or applies pressure to the receiving substrate (8), thereby maintaining the component (2, 2', 2'') between the transfer substrate (4, 4') and the receiving substrate (8). The method according to any one of claims 1 to 5.

7. On each of the feed-side substrate (1) and / or the transfer substrate (4, 4') and / or the receiving-side substrate (8) and / or the constituent member (2, 2', 2''), a release layer and / or an adhesion layer is applied, and the release layer and / or the adhesion layer changes its own adhesion characteristics with respect to the constituent member (2, 2', 2'') in the fixing region (3), the method according to any one of claims 1 to 6.

8. The joining means (6) is laser radiation, The feed-side substrate (1) and / or the transfer substrate (4, 4') and / or the receiving-side substrate (8) is formed to be transparent to the laser radiation, the method according to any one of claims 1 to 7.

9. The transfer substrate (4, 4') has a fixing element (10), and the fixing element (10) fixes the constituent member (2, 2', 2'') during the transfer, the method according to any one of claims 1 to 8.

10. The fixing element (10) is formed of a polymer material and / or is formed in a suction cup shape, the method according to claim 9.

11. Deform the transfer substrate (4, 4') during the transfer, thereby peeling off from the fixing element (10) and / or fixing by the fixing element (10), the method according to claim 10.

12. An apparatus for transferring a constituent member (2, 2', 2'') by the method according to any one of claims 1 to 11, A constituent member (2, 2', 2'') can be fabricated and / or provided on the feed-side substrate (1), The constituent member (2, 2', 2'') on the feed-side substrate (1) can be transferred to the transfer substrate (4, 4'), The constituent member (2, 2', 2'') can be transferred from the transfer substrate (4, 4') to the receiving-side substrate (8), The transfer of the constituent member (2, 2', 2'') to the support substrate and / or the receiving-side substrate can be selectively performed by the joining means (6) and / or the peeling means (7), Apparatus.

13. A light-emitting diode (LED) (9) manufactured by the method according to any one of claims 1 to 11.

14. 14. The light-emitting diode (9) according to claim 13, wherein the light-emitting diode (9) is formed from a plurality of components (2, 2', 2'') arranged one above the other and / or a plurality of components (2, 2', 2'') arranged adjacent to one another.

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