Radiator and lighting device

Abstract

Disclosed is a heat sink and a lighting device including the heat sink. The heat sink includes a first substrate (1) and a plurality of first heat dissipating fins (31), the plurality of first heat dissipating fins (31) are arranged on the first substrate (1) at intervals along a first predetermined direction, and the heat sink satisfies the constraints of the following Relational Formula 1 and Relational Formula 2, where L is the length of the first substrate (1) in the first predetermined direction, formula (aa) is the weighted average thickness of the plurality of first heat dissipating fins (31), N is the distribution number of the first heat dissipating fins (31), and δ is the weighted average thickness of the plurality of first heat dissipating fins (31). 1 is the maximum thickness of the first heat dissipation fin (31), and δ 2 is the minimum value of the thickness of the first heat dissipating fin (31), θ is the draft angle of the first heat dissipating fin (31), and H is the distribution height of the first heat dissipating fin (31).

Description

Technical Field

[0001] (Cross - reference to related applications) This application claims priority to Chinese Patent Application No. 202111644188.X, titled "Radiator and Lighting Device", filed with the China National Intellectual Property Administration on December 29, 2021, the entire content of which is incorporated herein by reference.

[0002] This disclosure relates to the technical field of heat dissipation components, and specifically to radiators and lighting devices.

Background Art

[0003] Heat dissipation and control of the junction temperature are one of the most important issues in the design and manufacturing process of vehicle lighting devices. The light attenuation or lifespan of a vehicle lighting device is directly related to its junction temperature. Poor heat dissipation directly causes an increase in the junction temperature and a shortening of the lifespan. Also, the shapes of vehicle lighting devices are becoming increasingly diverse and complex. A vehicle lighting device with a radiator that has better heat dissipation performance and a smaller size has market superiority, can have a longer cruising range, and can promote the lightweight process of automobiles. The radiators of conventional vehicle lighting devices cannot meet the increasingly improving performance requirements for heat dissipation.

[0004] Conventional radiators have bottlenecks in the technical development of improving space utilization and heat dissipation efficiency. The space for installing vehicle lighting devices is limited. It is difficult for the heat dissipation power of conventional radiators to reach 60W or more. Radiators with high heat dissipation efficiency have the problem of large size, making it difficult to meet the installation needs of actual vehicles. The main problem of conventional radiators is that due to the unreasonable design of the radiator structure and fins, heat is difficult to be quickly conducted and dispersed. Therefore, in this technical field, there is a need for a radiator with a compact structure, high space utilization, and that is more conveniently manufactured and used.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Regarding the problem that the heat sink of the lighting device of a conventional vehicle has insufficient space utilization rate and heat dissipation efficiency, the present disclosure provides a heat sink and a lighting device.

Means for Solving the Problem

[0006] In order to solve the above technical problems, the present disclosure uses the following technical solutions.

[0007] In one aspect, the present disclosure provides a heat sink, the heat sink includes a first substrate and a plurality of first heat dissipation fins, the plurality of the first heat dissipation fins are arranged on the first substrate at intervals along a first predetermined direction, and the heat sink satisfies the limitations of the following relational expressions 1 and 2.

Number

Number

[0008] In some embodiments, the radiator further includes a second substrate and a plurality of second heat dissipation fins. The plurality of first heat dissipation fins are arranged on the surface of one side of the first substrate at intervals along the first predetermined direction. The second substrate is provided on the surface of the other side of the first substrate. The plurality of second heat dissipation fins are arranged on the surface of one side of the second substrate at intervals along the second predetermined direction. The radiator satisfies the limitations of the following relational expressions 3 and 4:

Number

Number

[0009] In some embodiments, a plurality of first heat dissipation holes and a plurality of second heat dissipation holes are formed in the first substrate. A single first heat dissipation hole is provided between two adjacent first heat dissipation fins. A single second heat dissipation hole is provided between two adjacent first heat dissipation fins and between two adjacent second heat dissipation fins.

[0010] In some embodiments, on the surface of the other side of the first substrate, a first heat dissipation region, a heat conduction contact region, and a second heat dissipation region are sequentially formed along a direction perpendicular to the first predetermined direction. The intersection line between the first substrate and the second substrate is parallel to the first predetermined direction and the second predetermined direction. The plurality of first heat dissipation holes are provided in the first heat dissipation region. The heat conduction contact region is used for mounting a light source. The second substrate is provided between the heat conduction contact region and the second heat dissipation region. The plurality of second heat dissipation fins are located on the side surface of the second substrate away from the heat conduction contact region. The second heat dissipation fins are connected to the second heat dissipation region. The plurality of second heat dissipation holes are provided in the second heat dissipation region.

[0011] In some embodiments, on both sides of the second substrate along the second predetermined direction, a first connection wing plate and a second connection wing plate are respectively provided. A first connection hole is formed in the first connection wing plate. A second connection hole is formed in the second connection wing plate. On both sides of the first heat dissipation region, a first positioning hook and a second positioning hook are respectively provided. Both the first positioning hook and the second positioning hook are perpendicular to the first substrate. A first engaging groove is formed on the side of the first positioning hook away from the second substrate. A second engaging groove is formed on the side of the second positioning hook away from the second substrate.

[0012] In some embodiments, the first connection wing plate, the second connection wing plate, and the second substrate are located in the same plane.

[0013] In some embodiments, the first positioning hook and the second positioning hook are used for positioning the front end of the radiator, and the first connection wing plate and the second connection wing plate are used for positioning and mounting the rear end of the radiator.

[0014] In some embodiments, a plurality of positioning posts are provided in the heat conduction contact region.

[0015] In some embodiments, a plurality of ejector pins are fitted into the first heat dissipation fin at intervals, the ejector pins are perpendicular to the first substrate, and an outer diameter thereof is larger than a thickness of the first heat dissipation fin.

[0016] In some embodiments, the radiator is a magnesium alloy material integrally die-cast.

[0017] In some embodiments, the magnesium alloy material, by mass percentage, comprises components including Al with a content of 1% to 5%, Zn with a content of 0 to 0.2%, Mn with a content of 0 to 1%, RE with a content of 3% to 6%, Mg with a content of 87.7% to 96%, and other elements with a total amount of less than 0.1%.

[0018] In some embodiments, the magnesium alloy material, by mass percentage, comprises components including Al with a content of 1% to 5%, Zn with a content of 0 to 0.2%, Mn with a content of 0 to 1%, Ce with a content of 0 to 4.0%, Nd with a content of 0 to 0.5%, Mg with a content of 83.2% to 96%, and other elements with a total amount of less than 0.1%.

[0019] In some embodiments, the magnesium alloy material, by mass percentage, comprises components including Al with a content of 1% to 5%, Zn with a content of 0 to 0.2%, Mn with a content of 0.8% to 1%, Ce with a content of 0.8% to 2.5%, Nd with a content of 0 to 0.5%, Mg with a content of 83.2% to 94.4%, and other elements with a total amount of less than 0.1%.

[0020] In another aspect, the present disclosure provides a lighting device including the radiator as described above.

[0021] In the radiator according to the present disclosure, the distribution relationship of the base plate of the heat dissipation fins in the radiator, such as the number, arrangement interval, height design, etc., all have a great influence on the heat dissipation effect of the radiator. Therefore, if the distribution relationship of the heat dissipation fins is different, there will be a great difference in the overall heat dissipation effect of the radiator. The inventor of the present disclosure has, through a large number of studies, obtained the length L of the first base plate of the radiator, the weighted average thickness of the first heat dissipation fin

Number

Number

Brief Description of the Drawings

[0022]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0023] To more clearly illustrate the technical problems, technical means, and beneficial effects to be solved by the present disclosure, the present disclosure will be described in more detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only for interpreting the present disclosure and do not limit the present disclosure.

[0024] As shown in FIGS. 1 to 3, the radiator according to some embodiments of the present disclosure includes a first substrate 1 and a plurality of first heat dissipation fins 3. The plurality of first heat dissipation fins 3 are arranged on the first substrate 1 at intervals along a first predetermined direction, and the radiator satisfies the limitations of the following relational expressions 1 and 2.

Number

Number

[0025] Since the distribution relationship of the heat dissipation fins on the substrate in the radiator, such as the number, arrangement interval, height design, etc., all have a great influence on the heat dissipation effect of the radiator, if the distribution relationship of the heat dissipation fins is different, there will be a great difference in the overall heat dissipation effect of the radiator. Through a large number of studies, the inventor has found that the length L of the first substrate of the radiator, the weighted average thickness of the first heat dissipation fins

Number

Number

[0026] Note that in different embodiments, the shapes of the plurality of the first heat dissipation fins 3 may be the same or different. When there are multiple shapes for the plurality of the first heat dissipation fins 3, each should satisfy the limitation of the relational expression 2. In some embodiments, for the sake of easy processing and manufacturing, the plurality of the first heat dissipation fins 3 located on the first substrate 1 have the same shape.

[0027] As shown in FIGS. 1 and 2, in some embodiments, the radiator further includes a second substrate 2 and a plurality of second heat dissipation fins 4. The plurality of the first heat dissipation fins 3 are arranged at intervals along the first predetermined direction on one surface of the first substrate 1. The second substrate 2 is provided on the other surface of the first substrate 1. Specifically, the second substrate 2 is perpendicular to the first substrate 1. The plurality of the second heat dissipation fins 4 are arranged at intervals along the second predetermined direction on one surface of the second substrate 2. The radiator satisfies the limitations of the following relational expression 3 and relational expression 4.

Number

Number

[0028] The first substrate 1 is used for mounting a light source, and the second substrate 2 is used for auxiliary heat dissipation of the first substrate 1.

[0029] Note that in some embodiments, the shapes of the plurality of second heat dissipation fins 4 may be the same or different. When there are multiple shapes among the plurality of second heat dissipation fins 4, each should satisfy the limitation of the relational expression 4. In some embodiments, for the convenience of processing and manufacturing, the plurality of second heat dissipation fins 4 located on the second substrate 2 have the same shape.

[0030] In the description of the present disclosure, the terms "draft angle θ" and "draft angle θ’" are angles designed to facilitate removal when the workpiece is demolded. Specifically, as shown in FIG. 4, the draft angle θ’ is the inclination angle between the side surface of the second heat dissipation fin and the central axis.

[0031] In some embodiments, a plurality of first heat dissipation holes 14 and a plurality of second heat dissipation holes 15 are formed in the first substrate 1. A single first heat dissipation hole 14 is provided between two adjacent first heat dissipation fins 3, and a single second heat dissipation hole 15 is provided between two adjacent first heat dissipation fins 3 and between two adjacent second heat dissipation fins 4.

[0032] The first heat dissipation hole 14 is used for the auxiliary heat dissipation of the first heat dissipation fin 3, and the second heat dissipation hole 15 is used for the auxiliary heat dissipation of the first heat dissipation fin 3 and the second heat dissipation fin 4. In the heat dissipation process of the radiator, mainly, the first substrate 1 conducts heat by directly contacting the light source. Next, after heat dispersion is performed by heat conduction among the first substrate 1, the second substrate 2, the first heat dissipation fin 3, and the second heat dissipation fin 4, the first substrate 1, the second substrate 2, the first heat dissipation fin 3, and the second heat dissipation fin 4 respectively contact the air for heat exchange. In the process of the first heat dissipation fin 3 and the second heat dissipation fin 4 exchanging heat with the air, the air on their outer peripheries is heated, and the heated air tends to rise. The first substrate 1 is horizontally placed horizontally in the mounted state, and has a blocking effect on the rising hot air. By forming the first heat dissipation hole 14 and the second heat dissipation hole 15 in the first substrate 1, the blocking effect of the first substrate 1 on the hot air can be reduced, the efficiency of air flow can be improved, and it can further help improve the heat exchange efficiency.

[0033] In some embodiments, on the surface of the other side of the first substrate 1, a first heat dissipation region 11, a heat conduction contact region 12, and a second heat dissipation region 13 are sequentially formed along a direction perpendicular to the first predetermined direction. The intersection line between the first substrate 1 and the second substrate 2 is parallel to the first predetermined direction and the second predetermined direction. The plurality of first heat dissipation holes 14 are provided in the first heat dissipation region 11. The heat conduction contact region 12 is used for mounting the light source. The second substrate 2 is provided between the heat conduction contact region 12 and the second heat dissipation region 13. The plurality of second heat dissipation fins 4 are located on the side surface of the second substrate 2 away from the heat conduction contact region 12. The second heat dissipation fin 4 is connected to the second heat dissipation region 13. The plurality of second heat dissipation holes 15 are provided in the second heat dissipation region 13.

[0034] In the description of the present disclosure, the "direction perpendicular to the first predetermined direction" should be understood in a broad sense. In some embodiments, a direction forming an angle of 80° to 100° with the first predetermined direction may be substantially the same as perpendicular and may be understood as the "direction perpendicular to the first predetermined direction".

[0035] While the heat conduction contact area 12 is used for mounting the light source, it is also used for heat conduction between the first heat dissipation area 11, the second heat dissipation area 13 and the second substrate 2. Therefore, the heat conduction contact area 12 should have an area that is in sufficient contact with the light source and a larger connection cross-section with the first heat dissipation area 11, the second heat dissipation area 13 and the second substrate 2. When the radiator is in a mounted state, the first heat dissipation fins 3 are provided vertically, and the hot air after heat exchange through the first heat dissipation fins 3 rises along the side walls of the first heat dissipation fins 3. The plurality of first heat dissipation holes 14 and the plurality of second heat dissipation holes 15 formed in the first heat dissipation area 11 and the second heat dissipation area 13 facilitate the flow of hot air between the lower and upper sides of the first substrate 1, further promoting the convection of the air above the first substrate 1, improving the heat dissipation efficiency for the space where the light source is located. Also, the second heat dissipation holes 15 are effective for the convection of the lower air after the hot air on the side walls of the second heat dissipation fins 4 rises, improving the heat dissipation efficiency of the second heat dissipation fins 4.

[0036] In some embodiments, on both sides of the second substrate 2 along the second predetermined direction, a first connection wing plate 21 and a second connection wing plate 22 are respectively provided. A first connection hole 211 is formed in the first connection wing plate 21, and a second connection hole 221 is formed in the second connection wing plate 22. In some embodiments, the first connection wing plate 21 and the second connection wing plate 22 are located in the same plane as the second substrate 2. On both sides of the first heat dissipation region 11, a first positioning hook 16 and a second positioning hook 17 are respectively provided. The first positioning hook 16 and the second positioning hook 17 are located on both sides of the end of the first substrate 1. Both the first positioning hook 16 and the second positioning hook 17 are perpendicular to the first substrate 1. On the side of the first positioning hook 16 away from the second substrate 2, a first engaging groove 161 is formed. On the side of the second positioning hook 17 away from the second substrate 2, a second engaging groove 171 is formed.

[0037] The first positioning hook 16 and the second positioning hook 17 are used for positioning the front end of the radiator. The first connection wing plate 21 and the second connection wing plate 22 are used for positioning and mounting the rear end of the radiator. When mounting, the first engaging groove 161 and the second engaging groove 171 are respectively fitted into the positioning structure of the lighting device, and screws are provided to pass through the first connection hole 211 and the second connection hole 221 for fixing.

[0038] As shown in FIG. 1, in some embodiments, in order to facilitate the mounting and positioning of the light source, a plurality of positioning posts 18 are provided in the heat conduction contact region 12.

[0039] In some embodiments, a plurality of ejector pins 31 are fitted into the first heat dissipation fins 3 at intervals. The ejector pins 31 are perpendicular to the first substrate 1, and their outer diameter is larger than the thickness of the first heat dissipation fins 3.

[0040] The ejector pin 31 can cause a turbulent flow effect on the flow of hot air between the first heat dissipation fins 3, has a higher strength than the first heat dissipation fins 3, and can be used as a support point for mold release during die casting.

[0041] In some embodiments, the radiator is a magnesium alloy material integrally die-cast.

[0042] Integrally die-casting the radiator is effective in reducing the assembly process, integrating the first substrate 1, the second substrate 2, the first heat dissipation fins 3, and the second heat dissipation fins 4, improving the heat conduction efficiency between each part, and ensuring the tight connection and heat conduction at the connection points, so there is no need to separately provide a heat-conducting silica gel. By integrally forming the first connection wing plate 21, the second connection wing plate 22, the first positioning hook 16, and the second positioning hook 17 with the first substrate 1, the heat conduction is improved, and the mounting accuracy between the light source and the lamp group lens is improved.

[0043] When using magnesium alloy as the material of the radiator, high thermal conductivity can be obtained, mechanical properties can be obtained, and it can be effectively used under conditions and environments where high requirements are placed on heat conduction performance and weight reduction is required.

[0044] In some embodiments, the magnesium alloy material has, by mass percentage, Al with a content of 1% - 5%, Zn with a content of 0 - 0.2%, Mn with a content of 0 - 1%, RE with a content of 3% - 6%, Mg with a content of 87.7% - 96%, and other elements with a total amount of less than 0.1%.

[0045] In the above components, Al can improve the strength and corrosion resistance of the magnesium alloy, Mn can improve the elongation and toughness of the magnesium alloy, Zn can exert a solid solution strengthening effect to form a strengthening phase and improve the mechanical strength of the magnesium alloy, and RE refers to rare earth elements and can refine the crystal grains.

[0046] In some embodiments, the magnesium alloy material, by mass percentage, contains components including Al with a content of 1% - 5%, Zn with a content of 0 - 0.2%, Mn with a content of 0.8% - 1%, RE with a content of 3% - 6%, Mg with a content of 87.7% - 95.2%, and other elements with a total amount less than 0.1%.

[0047] By selecting elements, the magnesium alloy can achieve both very high thermal conductivity and excellent mechanical properties. The magnesium alloy is not only used in scenarios with high requirements for thermal conduction performance and structural mechanics requirements, but also can meet the design requirements of weight reduction and low cost, and is particularly applicable to the manufacture of radiators for automotive lighting devices. The lightweight design of the radiator is an important technology to improve the cruising range and meet the requirements of the cruising range.

[0048] In some embodiments, by performing sandblasting treatment and anodizing treatment on the surface of the radiator, the contact area with air is further increased, and the heat release ability to the surrounding air is enhanced.

[0049] As shown in FIG. 5, another aspect of the present disclosure provides a lighting device including a radiator as described above.

[0050] By using the radiator, the heat dissipation efficiency of the lighting device can be effectively improved, the occupied space required for mounting the lighting device on a vehicle can be reduced, and the design requirements of weight reduction and low cost can be achieved.

[0051] Hereinafter, the present disclosure will be further described by examples.

Examples

[0052] This embodiment is for explaining the radiator disclosed in the present disclosure. The above radiator includes a first substrate, a second substrate, a plurality of first heat dissipation fins, and a plurality of second heat dissipation fins. The plurality of the first heat dissipation fins are arranged on one surface of the first substrate at intervals along the first predetermined direction. The second substrate is provided perpendicular to the other surface of the first substrate. The plurality of the second heat dissipation fins are arranged on one surface of the second substrate at intervals along the second predetermined direction.

[0053] A plurality of first heat dissipation holes and a plurality of second heat dissipation holes are formed in the first substrate. A single first heat dissipation hole is provided between two adjacent first heat dissipation fins. A single second heat dissipation hole is provided between two adjacent first heat dissipation fins and between two adjacent second heat dissipation fins.

[0054] On the other surface of the first substrate, a first heat dissipation region, a heat conduction contact region, and a second heat dissipation region are sequentially formed along the first predetermined direction. The intersection line of the first substrate and the second substrate is parallel to the first predetermined direction and the second predetermined direction. The plurality of first heat dissipation holes are provided in the first heat dissipation region. The heat conduction contact region is used for mounting a light source. The second substrate is provided between the heat conduction contact region and the second heat dissipation region. The plurality of second heat dissipation fins are located on the side surface of the second substrate away from the heat conduction contact region. The second heat dissipation fins are connected to the second heat dissipation region. The plurality of second heat dissipation holes are provided in the second heat dissipation region.

[0055] The radiator satisfies the following conditions. JPEG0007714778000013.jpg137170

Example

[0056] This embodiment is for explaining the radiator disclosed in the present disclosure, includes most of the structures in Embodiment 1, and the differences are as follows. JPEG0007714778000014.jpg137170

Example

[0057] This example is for explaining the radiator disclosed in the present disclosure, includes most of the structures in Example 1, and the differences are as follows. JPEG0007714778000015.jpg137170

Example

[0058] This example is for explaining the radiator disclosed in the present disclosure, includes most of the structures in Example 1, and the differences are as follows.

[0059] The first heat dissipation holes and the second heat dissipation holes are not provided on the first substrate. Comparative Example 1

[0060] This comparative example is for explaining the radiator disclosed in the present disclosure by comparison, includes most of the structures in Example 1, and the differences are as follows. JPEG0007714778000016.jpg137170Comparative Example 2

[0061] This comparative example is for explaining the radiator disclosed in the present disclosure by comparison, includes most of the structures in Example 1, and the differences are as follows. JPEG0007714778000017.jpg137170

[0062] Performance Test The following performance tests were conducted on the radiators according to the above examples and comparative examples.

[0063] After weighing the radiators obtained in the examples and comparative examples, LED chips with the same power were respectively attached to the radiators obtained in the examples and comparative examples. After starting the LED chips and operating them for 2H, the central temperature of the LED chips was detected. The obtained test results are shown in Table 1.

[0064]

Table 1

[0065] As can be seen from the test results in Table 1, the heat sink that satisfies the limitations of Relational Expression 1 and Relational Expression 2 according to the present disclosure has significantly improved heat dissipation efficiency, can effectively reduce the central temperature of the LED chip, has a relatively low weight, and is advantageous for weight reduction of the vehicle lighting device. Specifically, for example, the central temperature of the LED chip in Example 1 is the lowest and its weight is the lightest. Example 1 differs from Comparative Example 1 only in that the number of first heat dissipation fins and second heat dissipation fins in Example 1 is larger. That is, in Example 1, more heat dissipation fins are attached in the same space compared to Comparative Example 1. In this case, in Example 1, the central temperature of the LED chip is also lower. Therefore, on the premise of satisfying the limitations of Relational Expression 1 and Relational Expression 2 according to the present disclosure, in Example 1, by attaching more heat dissipation fins in the same space, not only the space utilization rate of the heat sink is improved, but also the heat dissipation efficiency of the heat sink is improved. Also, for example, compared with Comparative Example 2, in Example 4, the first heat dissipation holes and the second heat dissipation holes are not provided in the first substrate, but the length of the first substrate in the first predetermined direction is shorter, the weighted average thickness of the plurality of first heat dissipation fins is thinner, and the distribution number of the first heat dissipation fins is smaller. Therefore, the volume is smaller and the weight is also lighter. As can be seen from the test results in Table 1, in Example 4, the central temperature of the LED chip is also lower compared to Comparative Example 2. Therefore, on the premise of satisfying the limitations of Relational Expression 1 and Relational Expression 2 according to the present disclosure, the heat sink of Example 4 has a smaller volume, a lighter weight, and a higher heat dissipation efficiency. From the above, the heat sink disclosed in the present disclosure solves the problem of insufficient space utilization rate and heat dissipation efficiency.

[0066] The above are only preferred embodiments of the present disclosure and do not limit the present disclosure. All modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present disclosure should be included within the protection scope of the present disclosure.

Description of Reference Numerals

[0067] 1 First substrate 11 First heat dissipation region 12 Heat conduction contact area 13 Second heat dissipation area 14 First heat dissipation hole 15 Second heat dissipation hole 16 First positioning hook 161 First engagement groove 17 Second positioning hook 171 Second engagement groove 18 Positioning post 2 Second substrate 21 First connection wing plate 211 First connection hole 22 Second connection wing plate 221 Second connection hole 3 First heat dissipation fin 31 Ejector pin 4 Second heat dissipation fin

Claims

1. A heat sink, comprising: a first substrate (1); a plurality of first heat dissipation fins (3); wherein the plurality of first heat dissipation fins (3) are arranged on the first substrate (1) at intervals along a first predetermined direction; the heat sink satisfies the limitations of the following relational expressions 1 and 2, 【Number 1】 where L is the length of the first substrate (1) in the first predetermined direction, with the unit of mm; 【Number 2】 is the weighted average thickness of the plurality of first heat dissipation fins (3), with the unit of mm; N is the distribution number of the first heat dissipation fins (3), which is a positive integer; H ∈ {[((δ １ + δ ２ )) / 2 - 1.2] / tan 2θ, [((δ １ + δ ２ )) / 2 + 1.2] / tan 2θ} Equation 2 Here, δ １ is the maximum value of the thickness of the first heat dissipation fin (3), and the unit is mm, δ ２ is the minimum value of the thickness of the first heat dissipation fin (3), and the unit is mm, θ is the extraction gradient of the first heat dissipation fins (3), with the unit of degrees; H is the distribution height of the first heat dissipation fins (3), with the unit of mm; a second substrate (2); a plurality of second heat dissipation fins (4); further comprising the plurality of first heat dissipation fins (3) are arranged on one surface of the first substrate (1) at intervals along the first predetermined direction; the second substrate (2) is provided on the other surface of the first substrate (1), and the plurality of second heat dissipation fins (4) are arranged on one surface of the second substrate (2) at intervals along a second predetermined direction; the heat sink satisfies the limitations of the following relational expressions 3 and 4, [Number 3] where L' is the length of the second substrate (2) in the second predetermined direction, with the unit of mm; 【Number 4】 is the weighted average thickness of the plurality of second heat dissipation fins (4), with the unit of mm; N' is the distribution number of the second heat dissipation fins (4), which is a positive integer; H' ∈ {[(δ1' + δ2') / 2 - 1.2] / tan2θ', [(δ1' + δ2') / 2 + 1.2] / tan2θ'} Relational Expression 4 where δ1' is the maximum value of the thickness of the second heat dissipation fins (4), with the unit of mm; δ2' is the minimum value of the thickness of the second heat dissipation fins (4), with the unit of mm; θ' is the extraction gradient of the second heat dissipation fins (4), with the unit of degrees; H' is the distribution height of the second heat dissipation fins (4), with the unit of mm; a plurality of first heat dissipation holes (14) and a plurality of second heat dissipation holes (15) are formed in the first substrate (1); a single first heat dissipation hole (14) is provided between two adjacent first heat dissipation fins (3); The single second heat dissipation hole (15) is provided between two adjacent first heat dissipation fins (3) and between two adjacent second heat dissipation fins (4). Heat sink. **Claim 2** On the surface of the other side of the first substrate (1), a first heat dissipation region (11), a heat conduction contact region (12), and a second heat dissipation region (13) are sequentially formed along a direction perpendicular to the first predetermined direction. The intersection line of the first substrate (1) and the second substrate (2) is parallel to the first predetermined direction and the second predetermined direction. A plurality of the first heat dissipation holes (14) are provided in the first heat dissipation region (11). The heat conduction contact region (12) is used for mounting a light source. The second substrate (2) is provided between the heat conduction contact region (12) and the second heat dissipation region (13). A plurality of the second heat dissipation fins (4) are located on the side surface of the second substrate (2) away from the heat conduction contact region (12). The second heat dissipation fin (4) is connected to the second heat dissipation region (13). A plurality of the second heat dissipation holes (15) are provided in the second heat dissipation region (13). The heat sink according to claim 1. **Claim 3** On both sides of the second substrate (2) along the second predetermined direction, a first connection wing plate (21) and a second connection wing plate (22) are respectively provided. A first connection hole (211) is formed in the first connection wing plate (21). A second connection hole (221) is formed in the second connection wing plate (22). On both sides of the first heat dissipation region (11), a first positioning hook (16) and a second positioning hook (17) are respectively provided. Both the first positioning hook (16) and the second positioning hook (17) are perpendicular to the first substrate (1). A first engagement groove (161) is formed on the side of the first positioning hook (16) away from the second substrate (2). A second engagement groove (171) is formed on the side of the second positioning hook (17) away from the second substrate (2). The heat sink according to claim 2. **Claim 4** The first connection wing plate (21), the second connection wing plate (22), and the second substrate (2) are located in the same plane. The heat sink according to claim 3. **Claim 5** The first positioning hook (16) and the second positioning hook (17) are used for positioning the front end of the heat sink. The first connecting wing plate (21) and the second connecting wing plate (22) are used for positioning and attaching the rear end of the radiator. This is the feature. The radiator according to claim 3.

6. A plurality of positioning posts (18) are provided in the heat conduction contact area (12). This is the feature. The radiator according to claim 2.

7. A plurality of ejector pins (31) are fitted into the first heat radiation fins (3) at intervals. The ejector pins (31) are perpendicular to the first substrate (1). The outer diameter of the ejector pins (31) is larger than the thickness of the first heat radiation fins (3). This is the feature. The radiator according to claim 1.

8. The radiator is made of a magnesium alloy material integrally die-cast. This is the feature. The radiator according to claim 1.

9. The magnesium alloy material contains, by mass percentage, Al with a content of 1% to 5%, Zn with a content of 0% to 0.2%, Mn with a content of 0% to 1%, RE with a content of 3% to 6%, Mg with a content of 87.7% to 96%, and other elements with a total amount of less than 0.1%. This is the feature. The radiator according to claim 8.

10. The magnesium alloy material contains, by mass percentage, Al with a content of 1% to 5%, Zn with a content of 0% to 0.2%, Mn with a content of 0% to 1%, Ce with a content of 0% to 4.0%, Nd with a content of 0% to 0.5%, Mg with a content of 83.2% to 96%, and other elements with a total amount of less than 0.1%. This is the feature. The radiator according to claim 8.

11. The magnesium alloy material contains, by mass percentage, Al with a content of 1% to 5%, Zn with a content of 0% to 0.2%, Mn with a content of 0.8% to 1%, Ce with a content of 0.8% to 2.5%, Nd with a content of 0% to 0.5%, Mg with a content of 83.2% to 94.4%, and other elements with a total amount of less than 0.1%. This is the feature. The radiator according to claim 8.

12. Including the radiator according to claim 1. This is the feature. Lighting device.

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